KR20230054816A - Dual camera module and Optical apparatus - Google Patents

Abstract

The present embodiment relates to a dual camera module that includes: a first camera module; a second camera module having a wider angle of view than the first camera module; and a substrate on which the first image sensor of the first camera module and the second image sensor of the second camera module are mounted. The first image sensor is located lower than the second image sensor. The present embodiment is advantageous in terms of design because the exposure of the internal structure of a wide-angle camera module is minimized.

Description

Dual camera module and optical apparatus {Dual camera module and optical apparatus}

This embodiment relates to a dual camera module and optics.

As the distribution of various portable terminals is widely generalized and wireless Internet services are commercialized, consumers' demands related to portable terminals are also diversifying, and various types of additional devices are being installed in portable terminals.

Among them, a typical example is a camera module that takes a picture or video of a subject.

Recently, as a type of camera module, a dual camera module capable of obtaining high-quality pictures or images of a near subject as well as a long distance subject through digital zoom has been developed.

However, in the conventional dual camera module, the internal structure of the wide-angle camera module is exposed through a wide window required to secure an angle of view of the wide-angle camera module, resulting in design damage.

(Patent Document 1) JP 2007-306282 A

In order to solve the above problem, the present embodiment is intended to provide a dual camera module in which exposure of the internal structure of the wide-angle camera module is minimized.

In addition, it is intended to provide an optical device including the dual camera module.

A dual camera module according to an embodiment of the present invention includes a first camera module; a second camera module having a wider field of view than the first camera module; and a substrate on which the first image sensor of the first camera module and the second image sensor of the second camera module are mounted, and the thickness of the substrate is such that a portion on which the first image sensor is mounted is the second image sensor. It may be thinner than the part where the sensor is mounted.

Heights of an upper end of the housing of the first camera module and an upper end of the housing of the second camera module may correspond to each other.

The substrate includes a first circuit layer and a second circuit layer positioned above the first circuit layer, the first image sensor is mounted on the first circuit layer, and the second image sensor is mounted on the first circuit layer. It may be mounted on the second circuit layer.

Thicknesses of the first circuit layer and the second circuit layer may be 0.2 to 0.3 mm.

In the second circuit layer, a portion corresponding to a portion where the first image sensor is mounted on the first circuit layer may be omitted.

The second image sensor may be mounted on an upper surface of the substrate, and the first image sensor may be mounted on a lower surface of the substrate in a flip chip method.

The first camera module includes a lens module located in an inner space of the housing, the lens module moves in an optical axis direction, up and down, to perform an auto focus function, and an upper end of the lens module is the lens module. It may protrude beyond the top of the housing according to the movement of.

The first camera module and the second camera module may be spaced apart from each other.

The second camera module may have a shorter effective focal length (EFL) or total track length (TTL) than the first camera module.

An optical device according to an embodiment of the present invention includes a main body, a display unit disposed on one surface of the main body to display information, and a dual camera module installed in the main body to take an image or a photo, wherein the dual camera module is installed on the main body. The camera module may include a first camera module; a second camera module having a wider field of view than the first camera module; and a substrate on which the first image sensor of the first camera module and the second image sensor of the second camera module are mounted, wherein the first image sensor may be positioned below the second image sensor.

It further includes a cover member positioned above the first camera module and above the second camera module, wherein the distance between the first image sensor and the cover member is the distance between the second image sensor and the cover member. can be longer

A distance between an upper end of the housing of the first camera module and the cover member may correspond to a distance between an upper end of the housing of the second camera module and the cover member.

The first camera module includes a lens module positioned in an inner space of a housing of the first camera module, and the lens module moves in an optical axis direction in a vertical direction to perform an auto focus function, and the upper end of the lens module may protrude beyond the upper end of the housing according to the movement of the lens module.

A connecting portion fixing the first housing to the cover member may be positioned between the first housing and the cover member.

The connecting part may include a poron.

a first window unit positioned on the cover member and through which transmitted light proceeds to the first camera module; and a second window portion positioned on the cover member and through which the transmitted light proceeds to the second camera module, wherein the second window portion is wider than the first window portion to secure a wider angle of view than the first window portion. It can have a large area.

This embodiment is advantageous in terms of design because exposure of the internal structure of the wide-angle camera module is minimized.

In addition, through the present embodiment, it is possible to facilitate attachment of a poron that performs a function of preventing the introduction of foreign matter and a function of fixing the camera module to the cover member.

1 and 2 are conceptual diagrams of a dual camera module according to an embodiment of the present invention.
3 is a conceptual diagram of a dual camera module according to a modified example of the present invention.

Hereinafter, some embodiments of the present invention will be described in detail through exemplary drawings. In adding reference numerals to components of each drawing, it should be noted that the same components have the same numerals as much as possible even if they are displayed on different drawings. In addition, in describing an embodiment of the present invention, if it is determined that a detailed description of a related known configuration or function hinders understanding of the embodiment of the present invention, the detailed description will be omitted.

Also, terms such as first, second, A, B, (a), and (b) may be used to describe components of an embodiment of the present invention. These terms are only used to distinguish the component from other components, and the nature, order, or order of the corresponding component is not limited by the term. When an element is described as being “connected,” “coupled to,” or “connected” to another element, that element may be directly connected or connected to the other element, but there may be another element between the elements. It should be understood that may be "connected", "coupled" or "connected".

Hereinafter, a configuration of an optical device according to an embodiment of the present invention will be described.

An optical device according to an embodiment of the present invention includes a mobile phone, a mobile phone, a smart phone, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, a PDA (Personal Digital Assistants), a PMP ( Portable Multimedia Player), navigation, etc., but is not limited thereto, and any device for capturing images or photos is possible.

An optical device according to an embodiment of the present invention includes a main body (not shown), a display unit (not shown) disposed on one surface of the main body to display information, and a dual display unit installed on the main body to take a video or photo. It may include a camera (not shown) having a camera module (not shown).

Hereinafter, the configuration of a dual camera module according to an embodiment of the present invention will be described with reference to the drawings.

1 and 2 are conceptual diagrams of a dual camera module according to an embodiment of the present invention.

Referring to FIGS. 1 and 2 , a dual camera module according to an embodiment of the present invention may include a first camera module 100 and a second camera module 200 . Meanwhile, a first cover member 500 covering the first camera module 100 may be further included. In addition, a second cover member 600 covering the second camera module 200 may be further included. Furthermore, in the dual camera module according to an embodiment of the present invention, a substrate on which the first image sensor 110 of the first camera module 100 and the second image sensor 210 of the second camera module 200 are mounted. (300) may be further included. Here, the first cover member 500 and the substrate 300 may be provided as one component of the first camera module 100 or may be provided as a separate member from the first camera module 100 . In addition, the second cover member 600 and the substrate 300 may be provided as one component of the second camera module 200 or may be provided as a separate member from the second camera module 200 .

The first camera module 100 may be a narrow angle camera module. In other words, the angle of view of the first camera module 100 may be narrower than that of the second camera module 200 . That is, the angle of view θ1 of the first camera module 100 may be smaller than the angle of view θ2 of the second camera module 200 . An equivalent focal length (EFL) (B1) of the first camera module 100 may be longer than an effective focal length (B2) of the second camera module 200. Also, the total track length (TTL) (C1) of the first camera module 100 may be longer than the TTL (C2) of the second camera module 200.

The first camera module 100 may include a first image sensor 110 , a first housing 120 , a first inner space 130 , and a first lens module 140 .

The first image sensor 110 may acquire light incident through the first lens module 140 of the first camera module 100 . The first image sensor 110 may be mounted on the board 300 . In more detail, the first image sensor 110 may be mounted on the first circuit layer 310 of the substrate 300 . The first image sensor 110 may be positioned such that an optical axis coincides with the first lens module 140 . Through this, the first image sensor 110 may acquire light passing through the first lens module 140 and output it as an image. The first image sensor 110 may be, for example, a charge coupled device (CCD), a metal oxide semi-conductor (MOS), a CPD, or a CID. However, the type of image sensor is not limited thereto.

The first housing 120 may be positioned between the substrate 300 and the first cover member 500 . The first housing 120 may accommodate the first lens module 140 by forming a first inner space 130 therein.

The first inner space 130 may be formed inside the first housing 120 . The first inner space 130 may be located between the substrate 300 and the first cover member 500 . The first lens module 140 may be positioned in the first inner space 130 . The first inner space 130 may be formed to secure a movement space D of the first lens module 140 for performing an auto focus (AF) function. The movement space D of the first lens module 140 may be formed by the connection portion 700 positioned between the first cover member 500 and the first housing 120 .

The first lens module 140 may be located in the first inner space 130 . The first lens module 140 may move in an optical axis direction (vertical direction) (A) to perform an auto focus function. At this time, the movement of the first lens module 140 may be based on an electromagnetic interaction. As an example, in the movement control of the first lens module 140, a magnet (not shown) is provided in the first lens module 140 and a coil (not shown) is provided in the first housing 120 so as to control the movement of the coil. It can be performed through power application control. In addition, a coil may be provided in the first lens module 140 and a magnet may be provided in the first housing 120 . An optical axis of the first lens module 140 may coincide with the first image sensor 110 . An optical axis of the first lens module 140 may be parallel to an optical axis of the second lens module 240 .

The first lens module 140 may move in an optical axis direction, up and down, to perform an auto focus function. Also, the top of the first lens module 140 may protrude beyond the top of the first housing 120 according to the movement of the first lens module 140 . Also, the first lens module 140 may protrude beyond the upper end of the first housing 120 in an initial state (a state in which current is not supplied to the first camera module 100). In an example of the present invention, the connection unit 700 may be positioned between the cover members 500 and 600 and the first housing 120 to secure a moving space for the first lens module 140 . That is, the connection unit 700 may enlarge the movable space of the first lens module 140 .

The second camera module 200 may be a wide angle camera module. In other words, the angle of view of the second camera module 200 may be wider than that of the first camera module 100 . That is, the angle of view θ2 of the second camera module 200 may be greater than the angle of view θ1 of the first camera module 100 . The effective focal length B2 of the second camera module 200 may be shorter than the effective focal length B1 of the first camera module 100 . Also, the TTL(C2) of the second camera module 200 may be shorter than the TTL(C1) of the first camera module 100.

The second camera module 200 may be disposed parallel to the first camera module 100 . An optical axis of the second camera module 200 may be aligned with an optical axis of the first camera module 100 . An optical axis of the second camera module 200 may be parallel to an optical axis of the first camera module 100 . The second camera module 200 may be positioned apart from the first camera module 100 . Also, the second camera module 200 may be placed in contact with the first camera module.

The second camera module 200 may include a second image sensor 210 , a second housing 220 , a second inner space 230 , and a second lens module 240 .

The second image sensor 210 may acquire light incident through the second lens module 240 of the second camera module 200 . The second image sensor 210 may be mounted on the substrate 300 . In more detail, the second image sensor 210 may be mounted on the second circuit layer 320 of the board 300 . The second image sensor 210 may be positioned such that its optical axis coincides with the second lens module 240 . Through this, the second image sensor 210 may acquire light passing through the second lens module 240 and output it as an image. The second image sensor 210 may be, for example, a charge coupled device (CCD), a metal oxide semi-conductor (MOS), a CPD, or a CID. However, the type of image sensor is not limited thereto.

The second image sensor 210 may be located above the first image sensor 110 in the optical axis direction. That is, the first image sensor 110 may be located lower than the second image sensor 210 in the optical axis direction. In other words, the second image sensor 210 may be located closer to the cover member 500 or 600 than the first image sensor 110 . Also, the first image sensor 110 may be located farther from the cover members 500 and 600 than the second image sensor 110 . More specifically, the first image sensor 110 is mounted on the first circuit layer 310, and the second image sensor 210 is mounted on the second circuit layer 320 positioned above the first circuit layer 310. can be mounted.

The second housing 220 may be positioned between the substrate 300 and the second cover member 600 . The second housing 220 may accommodate the second lens module 240 by forming a second inner space 230 therein.

The second inner space 230 may be formed inside the second housing 220 . The second inner space 230 may be located between the substrate 300 and the second cover member 600 . The second lens module 240 may be positioned in the second inner space 230 . The second inner space 230 may be formed to secure a movement space for the second lens module 240 to perform an auto focus (AF) function.

The second lens module 240 may be located in the second inner space 230 . The second lens module 240 may move in an optical axis direction (up and down direction) to perform an auto focus function. At this time, the movement of the second lens module 240 may be based on an electromagnetic interaction. As an example, in controlling the movement of the second lens module 240, a magnet (not shown) is provided in the second lens module 240 and a coil (not shown) is provided in the second housing 220 so as to control the movement of the coil. It can be performed through power application control. In addition, a coil may be provided in the second lens module 240 and a magnet may be provided in the second housing 220 . An optical axis of the second lens module 240 may coincide with the second image sensor 210 . An optical axis of the second lens module 240 may be parallel to an optical axis of the first lens module 140 .

The first image sensor 110 of the first camera module 100 may be mounted on the substrate 300 . In addition, the second image sensor 210 of the second camera module 200 may be mounted on the substrate 300 . In more detail, the first image sensor 110 may be mounted on the first circuit layer 310 of the substrate 300 . In addition, the second image sensor 210 may be mounted on the second circuit layer 320 of the substrate 300 . The substrate 300 may output an image obtained through the first image sensor 110 and/or the second image sensor 210 as an image and transmit the image to the outside.

The substrate 300 may supply power to the camera modules 100 and 200 . Meanwhile, a controller (not shown) for controlling the camera modules 100 and 200 may be located on the board 300 . The control unit may be mounted on the board 300 . Meanwhile, the controller may be located inside the housings 120 and 220 . The controller may control the direction, strength, and amplitude of the current supplied to each of the components constituting the camera modules 100 and 200 . The controller may control the camera modules 100 and 200 to perform at least one of an auto focus function and a hand shake correction function of the camera module. That is, the controller may control the camera modules 100 and 200 to move the lens module in the direction of the optical axis, or to move or tilt the lens module in a direction perpendicular to the direction of the optical axis. Furthermore, the controller may perform feedback control of the auto focus function and hand shake correction function with respect to the camera modules 100 and 200 .

The substrate 300 may include a first circuit layer 310 and a second circuit layer 320 positioned above the first circuit layer 310 .

The first image sensor 110 of the first camera module 100 may be mounted on the first circuit layer 310 . That is, the first image sensor 110 may be positioned on the upper surface 311 of the first circuit layer 310 . A second circuit layer 320 may be positioned on the upper surface 311 of the first circuit layer 310 . Through this structure, the second image sensor 210 mounted on the second circuit layer 320 may be positioned higher than the first image sensor 110 mounted on the first circuit layer 310 .

The second circuit layer 320 may mount the second image sensor 210 of the second camera module 200 . That is, the second image sensor 210 may be positioned on the upper surface 321 of the second circuit layer 320 . The lower surface 322 of the second circuit layer 320 may be positioned on the upper surface 311 of the first circuit layer 310 .

In the second circuit layer 320 , a portion corresponding to a portion where the first image sensor 110 is mounted on the first circuit layer 310 may be omitted. That is, the first image sensor 110 is mounted on a portion of the substrate 300 in which the first circuit layer 310 and the second circuit layer 320 are stacked and a portion of the second circuit layer 320 is removed. It can be.

The first cover member 500 may be positioned above the first camera module 100 . The first cover member 500 may protect the first camera module 100 from the outside. Meanwhile, the first cover member 500 may form the exterior of the dual camera module. A first window unit 510 may be positioned in the first cover member 500 .

The first window unit 510 may be located on the first cover member 500 . The first window portion 510 may have a smaller area than the second window portion 610 . This is because the first window unit 510 only needs to secure a narrower angle of view compared to the second window unit 610 . The first window unit 510 may be made of a material capable of transmitting light. That is, light passing through the first window unit 510 may be acquired by the first image sensor 110 through the first lens module 140 .

The second cover member 600 may be positioned above the second camera module 200 . The second cover member 600 may protect the second camera module 200 from the outside. Meanwhile, the second cover member 600 may form the exterior of the dual camera module. The second cover member 600 may be formed to have the same height as the first cover member 500 . The first cover member 500 and the second cover member 600 may be integrally formed. A first window unit 510 may be positioned in the first cover member 500 . A second window unit 610 may be positioned in the second cover member 600 .

The second window unit 610 may be located on the second cover member 600 . The second window portion 610 may have a larger area than the first window portion 510 . That is, the width W2 of the second window 610 may be longer than the width W1 of the first window 510 . The second window portion 610 may have a larger area than the first window portion 510 in order to secure a wider angle of view than the first window portion 510 . The second window unit 610 may be made of a material capable of transmitting light. That is, light passing through the second window unit 610 may be acquired by the second image sensor 210 through the second lens module 240 .

Although the first cover member 500 and the second cover member 600 have been separately described above, the first cover member 500 and the second cover member 600 may be integrally formed. In this case, the first cover member 500 and the second cover member 600 may be referred to as cover members 500 and 600 . Meanwhile, the cover members 500 and 600 have been described as a component of the dual camera module, but may be described as a component separate from the dual camera module. As an example, the cover members 500 and 600 may form the appearance of the optical device as a component of the optical device.

The dual camera module according to an embodiment of the present invention may further include a connection part 700 connecting the camera modules 100 and 200 and the cover members 500 and 600 .

The connection unit 700 may be positioned between the housings 120 and 220 of the camera modules 100 and 200 and the cover members 500 and 600 . The connection part 700 may fix the housings 120 and 220 to the cover members 500 and 600 . Meanwhile, the connection part 700 may fix the cover members 500 and 600 to the housings 120 and 220 . The connection unit 700 may be Poron as an example. In this case, the connecting portion 700 provided as a pore can provide a fixing force between the housings 120 and 220 and the cover members 500 and 600, as well as perform a light blocking effect, a buffering effect, and an effect of preventing the inflow of foreign substances. .

The connection part 700 may include a first connection part 710 and a second connection part 720 .

The first connection part 710 may be located between the first housing 120 and the first cover member 500 . The first connection part 710 may fix the first housing 120 to the first cover member 500 . Meanwhile, the first connection portion 710 may fix the first cover member 500 to the first housing 120 .

The second connection part 720 may be located between the second housing 220 and the second cover member 600 . The second connection part 720 may fix the second housing 220 to the second cover member 600 . Meanwhile, the second connection portion 720 may fix the second cover member 600 to the second housing 220 .

Hereinafter, operations and effects of the dual camera module according to an embodiment of the present invention will be described with reference to the drawings.

1 and 2 are conceptual diagrams of a dual camera module according to an embodiment of the present invention.

Since the first camera module 100 has a narrower angle of view compared to the second camera module 200, it is called a narrow-angle camera module 100, and the second camera module 200 is compared to the first camera module 100. Since it has a wide angle of view, it may be called a wide-angle camera module 200. The lens module 140 of the narrow-angle camera module 100 may function as a telephoto lens, and the lens module 240 of the wide-angle camera module 200 may function as a wide-angle lens.

First, the dual camera module can function in a state in which the optical axis of the first camera module 100 and the optical axis of the second camera module 200 are aligned. The dual camera module according to the present embodiment outputs an image acquired by the second camera module 200 when a user photographs a short-distance object, and outputs an image obtained by the second camera module 200 when a user photographs a distant object. The image acquired by (100) can be output. In addition, the dual camera module according to the present embodiment may combine and output an image obtained by the first camera module 100 and an image obtained by the second camera module 200 based on the distance to the subject. . That is, the dual camera module 100 according to the present embodiment can obtain clear images of all subjects located at a distance or a short distance. In other words, the dual camera module 100 according to this embodiment can provide functions corresponding to those of a zoom lens without using a zoom lens.

Furthermore, in the dual camera module according to the present embodiment, the first image sensor 110 of the first camera module 100 is mounted on the first circuit layer 310 of the substrate 300, and the second camera module 200 The second image sensor 210 of is mounted on the second circuit layer 320 of the substrate 300, and since the second circuit layer 320 is adhered to the top surface of the first circuit layer 310, as a result, the first The image sensor 110 is located closer to the cover members 500 and 600 than the second image sensor 210 . In this case, the width W2 of the second window portion 610 to secure the wide angle of view of the second camera module 200 may be narrowed. That is, since the area of the second window unit 610 may be reduced, a phenomenon in which internal components of the second camera module 200 are exposed through the second window unit 610 may be prevented.

In addition, if the first image sensor 110 is mounted on the second circuit layer 320 of the substrate 300, the height of the first housing 120 is lowered and the heights of the cover members 500 and 600 are also increased. In this case, a separate additional member for fixing the poron between the second housing 220 and the second cover member 600 may be required. However, in the dual camera module according to this embodiment, since the distance between the upper end of the second housing 200 and the second cover member 600 is shorter than in the previous comparative example, the second housing 220 and the second cover member 600 ) has the advantage of being able to fix the phorons without a separate member between them.

Hereinafter, a configuration of a dual camera module according to a modified example of the present invention will be described with reference to the drawings.

3 is a conceptual diagram of a dual camera module according to a modified example of the present invention.

Referring to FIG. 3 , a dual camera module according to a modified example of the present invention includes a first camera module 100, a second camera module 200, a substrate 300, a first cover member 500, and a second cover. It may include the member 600 and the connection part 700 . However, in the dual camera module according to the modified example of the present invention, the first camera module 100, the second camera module 200, the substrate 300, the first cover member 500, and the second cover member 600 And any one or more components of the connection unit 700 may be omitted. The dual camera module according to the modified example of the present invention is different from the dual camera module according to the embodiment of the present invention described above in the mounting method of the first image sensor 110 . Meanwhile, among the configurations of the dual camera module according to the modified example of the present invention, the description of the dual camera module according to one embodiment of the present invention may be inferred for configurations not described below.

In the dual camera module according to the modified example of the present invention, the first image sensor 110 of the first camera module 100 may be mounted on the board 300 in a flip chip method. As an example, the second image sensor 210 is mounted on the upper surface 321 of the second circuit layer 320 of the board 300, and the first image sensor 110 is the second circuit layer of the board 300 ( 320) may be mounted on the lower surface 322. In this case, a portion of the first circuit layer 310 corresponding to a portion where the first image sensor 110 is mounted on the second circuit layer 320 may be omitted. Meanwhile, a through hole 325 is formed in the second circuit layer 320 so that light passing through the first lens module 140 can be obtained in the first image sensor 110 flip-chip bonded to the second circuit layer 320 . ) can be formed. That is, light passing through the first lens module 140 through the through hole 325 of the second circuit layer 320 may reach the first image sensor 110 .

In the dual camera module according to the modified example of the present invention, the first image sensor 110 is positioned lower than the second image sensor 210 as in the dual camera module according to the embodiment of the present invention. Therefore, even in the dual camera module according to the modified example of the present invention, exposure of the internal structure of the wide-angle camera module, which is a related effect, can be minimized and the pore attachment can be easily attached.

In the above, even though all the components constituting the embodiment of the present invention have been described as being combined or operated as one, the present invention is not necessarily limited to these embodiments. That is, within the scope of the object of the present invention, all of the components may be selectively combined with one or more to operate. In addition, terms such as "comprise", "comprise" or "having" described above mean that the corresponding component may be present unless otherwise stated, and thus exclude other components. It should be construed as being able to further include other components. All terms, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs, unless defined otherwise. Commonly used terms, such as terms defined in a dictionary, should be interpreted as being consistent with the contextual meaning of the related art, and unless explicitly defined in the present invention, they are not interpreted in an ideal or excessively formal meaning.

The above description is merely an example of the technical idea of the present invention, and various modifications and variations can be made to those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100: first camera module 200: second camera module
300: substrate
500: first cover member 600: second cover member
700: connection part

Claims (1)

a first camera module; and
A second camera module having a wider angle of view than the first camera module;
The first camera module includes a first substrate, a first image sensor disposed on the first substrate, and a first lens disposed on the first image sensor,
The second camera module includes a second substrate, a second image sensor disposed on the second substrate, and a second lens disposed on the second image sensor,
The camera module of claim 1 , wherein the first substrate includes a groove concavely formed on an upper surface of the first substrate.

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