KR20230054045A - Dielectric layer material for flexible copper clad laminate and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a dielectric layer material for a flexible copper clad laminate and a manufacturing method thereof. According to one aspect of the present invention, the provided dielectric layer material for the flexible copper clad laminate comprises: a low dielectric constant film; an adhesive layer laminated on the low dielectric constant film; and a polyimide film laminated on the adhesive layer. An objective of the present invention is to provide the dielectric layer material for the flexible copper clad laminate, which can improve conductor loss by ensuring plating workability, and the manufacturing method thereof.

Description

Dielectric layer material for flexible copper clad laminated board and manufacturing method thereof

The present invention relates to a dielectric layer material for a flexible copper clad laminated board and a manufacturing method thereof.

BACKGROUND OF THE INVENTION [0002] As a result of the need to process a large amount of information at high speed along with the progress of a high-level information society, the frequency band of signals used in communication electronic devices is shifting from MHz to the high-frequency region of GHz. However, as the frequency increases, transmission loss of electrical signals increases and communication performance deteriorates. Therefore, demand for electrical insulating materials having low dielectric properties in a high frequency region is also increasing.

Currently, conventional polymer materials such as polyolefin resins, epoxy resins, fluorine-based thermoplastic resins, and polyimide resins have been proposed as electrical insulating materials for implementing these characteristics.

Among them, polyimide (PI) has a rigid aromatic main chain and an imide ring with excellent chemical stability, so it is a polymer with the highest level of heat resistance, chemical resistance, electrical insulation, chemical resistance and weather resistance among organic materials. As a material, it is widely used as an electronic material such as FPCB (Flexible Printed Circuit Board), TAB (Tape Automated Bonding), and COF (Chip on Film). In particular, polyimide has excellent plating workability and has properties suitable for use as an FCCL dielectric layer material.

FCCL (Flexible Copper Clad Laminate), which is generally used as a communication antenna of a terminal, is composed of a laminated structure of copper foil and a dielectric layer, which is a conductor, and uses lamination, casting, deposition-plating, and direct plating methods. is being manufactured. Transmission loss consists of the sum of conductor loss and dielectric loss. In order to reduce conductor loss, the deposition-plating method or direct plating method with low interface roughness between copper foil and dielectric layer is advantageous, so the excellent plating workability of polyimide is advantageous in reducing transmission loss. It is a feature that can work.

However, despite the advantages of polyimide, normal polyimide has a dielectric constant of about 3.4 to 3.6, which is not good enough to maintain sufficient insulation in high-frequency communication, so it is not suitable for use as a high-frequency antenna material. . For example, there is a possibility that polyimide partially or entirely loses insulation properties in a thin circuit board in which high-frequency communication of 2 GHz or more proceeds.

In addition, a liquid crystal polymer film (LCP film) and a modified polyimide film (Modified Polyimide Film) have been proposed as polymer materials having low dielectric loss characteristics, but have limitations in that the synthesis process is difficult and the film production cost is high.

Therefore, it is necessary to develop a new dielectric layer material capable of securing excellent plating workability as well as having low dielectric loss characteristics in a high frequency region.

The above background art is possessed or acquired by the inventor in the process of deriving the disclosure of the present application, and cannot necessarily be said to be known art disclosed to the general public prior to the present application.

The present invention is to solve the above-described problems, and an object of the present invention is a dielectric layer material for a flexible copper clad laminate board, which can improve conductor loss by securing plating workability as well as having low dielectric loss characteristics in a high frequency region. And to provide a manufacturing method thereof.

Another object of the present invention is to provide a flexible copper clad laminate for a communication antenna using a dielectric layer material for a flexible copper clad laminate having low transmission loss at a high frequency.

However, the problem to be solved by the present invention is not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

One aspect of the present invention, a low dielectric constant film; an adhesive layer laminated on the low dielectric constant film; And a polyimide film laminated on the adhesive layer; it provides a dielectric layer material for a flexible copper clad laminated board comprising a.

According to one embodiment, the low dielectric constant film may include perfluoroalkoxyalkane (PFA), polyetherketone (PEK), syndiotactic polystyrene (SPS), polysulfone (PSU), polyethersulfone (PES), polyether It may include at least one selected from the group consisting of relate (PAr), polyetherimide (PEI), polyphenylene sulfide (PPS), and polyetheretherketone (PEEK).

According to one embodiment, the adhesive layer may include one or more selected from the group consisting of an epoxy-based adhesive, an acrylic-based adhesive, a polyimide-based adhesive, and a fluorine-based resin.

According to one embodiment, a plurality of the low-k films may be laminated and melt-bonded.

According to one embodiment, the thickness of the low dielectric constant film may be 20 μm to 250 μm.

According to one embodiment, the adhesive layer may have a thickness of 0.5 μm to 50 μm.

According to one embodiment, the polyimide film may have a surface roughness (Ra) of 1 μm or less on a surface not bonded to the adhesive layer.

According to one embodiment, the thickness of the polyimide film may be 5 μm to 50 μm.

According to one embodiment, the thickness ratio of the polyimide film and the low dielectric constant film may be 1:1 to 1:10.

According to one embodiment, the dielectric layer material for the flexible copper clad laminated board may have a thickness of 40 μm to 450 μm.

According to one embodiment, at a frequency of 1 GHz, the dielectric constant (Dk) may be 3.3 Dk or less, and the dielectric loss tangent (Df) may be 0.015 or less.

Another aspect of the present invention is to prepare a polyimide film coated with an adhesive layer by applying an adhesive to one surface of the polyimide film; And laminating and bonding a low dielectric constant film on the adhesive layer; it provides a method for manufacturing a dielectric layer material for a flexible copper clad laminate substrate, including.

Another aspect of the present invention is to prepare a polyimide film coated with an adhesive layer by applying an adhesive to one surface of the polyimide film; disposing the two polyimide films coated with the adhesive layer so that the respective adhesive layers face each other; and inserting and bonding a low dielectric constant film between the adhesive layers disposed to face each other.

According to one embodiment, the bonding may be performed by hot pressing at a temperature of 200 °C to 500 °C and a pressure of 3 MPa to 5 MPa.

Another aspect of the present invention, a dielectric layer comprising a dielectric layer material for the flexible copper clad laminated board; and a copper layer laminated on the dielectric layer.

According to one embodiment, the copper layer may be laminated on the dielectric layer by a direct plating method.

The dielectric layer material for a flexible copper clad laminate board according to the present invention not only has low dielectric loss characteristics in the high frequency region, but also can reduce conductor loss at the interface by using a direct plating method when copper foil is laminated by securing plating workability. There is an effect.

Specifically, the dielectric layer material for a flexible copper clad laminate substrate according to the present invention can secure dimensional stability, thermal conductivity, heat resistance, electroless direct plating of a copper layer by placing a polyimide film on the surface layer (skin layer), By disposing the low dielectric film on the inner layer (core layer), low dielectric loss characteristics can be secured even in a high frequency region.

The method for manufacturing a dielectric layer material for a flexible copper clad laminate substrate according to the present invention secures adhesion between a polyimide film and a low dielectric film in a relatively simple manner by bonding a polyimide film coated with an adhesive layer and a low dielectric film by hot pressing. can do.

The dielectric copper-clad laminate according to the present invention has an effect of reducing transmission loss by exhibiting low dielectric loss and conductor loss characteristics in a high frequency region, and has an effect applicable as a material for a communication antenna in a high frequency region.

1 is a schematic diagram of a dielectric layer material that is a polyimide-based laminated film manufactured according to an embodiment of the present invention.
2 is a schematic diagram of a dielectric layer material that is a polyimide-based laminated film manufactured according to another embodiment of the present invention.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, since various changes can be made to the embodiments, the scope of the patent application is not limited or limited by these embodiments. It should be understood that all changes, equivalents or substitutes to the embodiments are included within the scope of rights.

Terms used in the examples are used only for descriptive purposes and should not be construed as limiting. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "include" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the embodiment belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the present application, they should not be interpreted in an ideal or excessively formal meaning. don't

In addition, in the description with reference to the accompanying drawings, the same reference numerals are given to the same components regardless of reference numerals, and overlapping descriptions thereof will be omitted. In describing the embodiment, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the embodiment, the detailed description will be omitted.

In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, order, or order of the corresponding component is not limited by the term. When an element is described as being “connected,” “coupled to,” or “connected” to another element, that element may be directly connected or connected to the other element, but there may be another element between the elements. It should be understood that may be "connected", "coupled" or "connected".

Components included in one embodiment and components having common functions will be described using the same names in other embodiments. Unless stated to the contrary, descriptions described in one embodiment may be applied to other embodiments, and detailed descriptions will be omitted to the extent of overlap.

One aspect of the present invention, a low dielectric constant film; an adhesive layer laminated on the low dielectric constant film; And a polyimide film laminated on the adhesive layer; it provides a dielectric layer material for a flexible copper clad laminated board comprising a.

The dielectric layer material for a flexible copper clad laminate substrate according to the present invention can secure dimensional stability, thermal conductivity, heat resistance, electroless direct plating of a copper layer by placing a polyimide film on the surface layer (skin layer), and a low dielectric film. By being disposed in this inner layer (core layer), low dielectric loss characteristics can be secured even in a high frequency region.

In addition, by using a general polyimide film rather than a liquid crystal polymer film (LCP Film) or a modified polyimide film as a material for the dielectric layer, there is an advantage in that the production cost can be reduced by significantly reducing material and process costs. there is.

According to one embodiment, the low dielectric constant film may include perfluoroalkoxyalkane (PFA), polyetherketone (PEK), syndiotactic polystyrene (SPS), polysulfone (PSU), polyethersulfone (PES), polyether It may include at least one selected from the group consisting of relate (PAr), polyetherimide (PEI), polyphenylene sulfide (PPS), and polyetheretherketone (PEEK).

The low dielectric constant film, by including a polymer material having a low dielectric constant, performs a function of reducing the dielectric constant of the dielectric layer material, and in particular, it is possible to secure low dielectric constant characteristics in a high frequency region.

In addition, the polymer materials included in the low dielectric constant film are commercially available and can secure the ease of manufacture of dielectric layer materials.

However, the polymer components included in the low dielectric constant film have poor plating workability, and when used alone, there is a limit in that a direct plating method capable of securing interfacial stability during copper layer lamination cannot be used.

In order to overcome the above limitations, the dielectric layer material according to the present invention secures both low dielectric constant characteristics and plating workability at the same time by inserting a low dielectric constant film into the inside and laminating a polyimide film on the surface layer or surface layer on which the copper layer is laminated. There is one feature.

According to one embodiment, the low dielectric constant film may include at least one selected from the group consisting of perfluoroalkoxyalkane (PFA), polyetherketone (PEK), and syndiotactic polystyrene (SPS).

The perfluoroalkoxyalkane (PFA), polyetherketone (PEK), and syndiotactic polystyrene (SPS) have superior dielectric characteristics, Dk and Df values.

According to one embodiment, the adhesive layer may include one or more selected from the group consisting of an epoxy-based adhesive, an acrylic-based adhesive, a polyimide-based adhesive, and a fluorine-based resin.

The adhesive layer may include a curable adhesive component.

As the epoxy-based adhesive, acrylic adhesive, polyimide-based adhesive, and fluorine-based resin, adhesives used in the art may be used without limitation.

For example, as the fluorine-based resin, polytetrafluoroethylene (PTFE), perfluoroalkoxy (PFA), fluorinated ethylene propylene (FEP), ethylenetetrafluoroethylene (ETFE), or a mixture thereof can be used

According to one embodiment, a plurality of the low-k films may be laminated and melt-bonded.

A plurality of low dielectric constant films may be laminated to form a multilayer, thereby improving low dielectric constant characteristics and mechanical properties.

For the low dielectric constant film to be laminated, identical component films may be used, or different component films may be combined and stacked in multiple layers.

The number of laminated low dielectric constant films may be adjusted according to a target dielectric constant.

That is, the permittivity can be adjusted by adjusting the combination of components and the number of the laminated low-k films.

According to one embodiment, the thickness of the low dielectric constant film may be 20 μm to 250 μm.

Preferably, it may be 20 μm to 100 μm, more preferably, it may be 20 μm to 50 μm.

When the thickness of the low dielectric constant film is less than the above range, it may be difficult to implement low dielectric constant characteristics.

On the other hand, when the thickness of the low dielectric constant film exceeds the above range, mechanical properties and heat resistance may deteriorate.

According to one embodiment, the adhesive layer may have a thickness of 0.5 μm to 50 μm.

Preferably, it may be 0.8 μm to 30 μm, more preferably, it may be 1 μm to 20 μm.

When the thickness of the adhesive layer is less than the above range, the low dielectric constant film and the polyimide film may be separated.

On the other hand, when the thickness of the adhesive layer exceeds the above range, it may be difficult to implement low dielectric constant characteristics.

According to one embodiment, the polyimide film may have a surface roughness (Ra) of 1 μm or less on a surface not bonded to the adhesive layer.

In the present invention, the surface roughness (Ra) may be measured through atomic force microscope (AFM) analysis. As an example, the surface roughness (Ra) may be confirmed through AFM (Multimode IVa, Veeco) analysis.

In the polyimide film, when the surface roughness (Ra) of a surface not bonded to the adhesive layer has a value exceeding the above range, conductor loss may increase in a high frequency region.

In the polyide film, the surface not bonded to the adhesive layer may mean a surface layer or a skin layer on which a copper layer is laminated when manufacturing a flexible copper clad laminated board (FCCL).

In general, a copper layer is laminated on a dielectric layer in a flexible copper clad laminate board (FCCL), and conductor loss occurs at an interface between the dielectric layer and the copper layer.

As the frequency increases due to the skin effect, the property of current or charge flowing along the conductor surface increases, and at this time, the conductor surface roughness becomes a factor influencing conductor loss. For example, it has been reported that current flows in a region within 0.4 μm from the dielectric layer surface in a high frequency region (28 GHz).

Therefore, the surface roughness (Ra) of the polyimide film may be a key factor for reducing conductor loss.

In addition, in order to improve the surface roughness, it is preferable to use a deposition plating method or a direct plating method when depositing a copper layer on the surface of the polyimide film.

According to one embodiment, the thickness of the polyimide film may be 5 μm to 50 μm.

Preferably, it may be 8 μm to 40 μm, more preferably, it may be 10 μm to 30 μm.

When the thickness of the polyimide film is less than the above range, heat resistance, chemical resistance, dimensional stability, and mechanical strength of the laminated film may be deteriorated.

On the other hand, when the thickness of the polyimide film exceeds the above range, the dielectric constant increases, and it may be difficult to implement low dielectric constant characteristics, particularly in a high frequency region.

According to one embodiment, the thickness ratio of the polyimide film and the low dielectric constant film may be 1:1 to 1:10.

Preferably, it may be 1:1 to 1:5, and more preferably, it may be 1:1 to 1:3.

When the thickness of the polyimide film is out of the above range and becomes relatively thick, it may be difficult to implement a low dielectric constant due to an increase in dielectric constant.

On the other hand, when the thickness of the low dielectric constant film is out of the above range and becomes relatively thick, heat resistance, chemical resistance, and mechanical properties of the dielectric layer material may be deteriorated.

That is, the ratio may be in an optimal range capable of simultaneously securing low dielectric constant characteristics, heat resistance, and mechanical properties of the dielectric layer material.

According to one embodiment, the dielectric layer material for the flexible copper clad laminated board may have a thickness of 40 μm to 450 μm.

Preferably, it may be 45 μm to 300 μm, more preferably, it may be 50 μm to 200 μm.

When the thickness of the dielectric layer material for the flexible copper clad laminate substrate is less than the above range, mechanical properties may be deteriorated, and when it exceeds the above range, flexibility may be reduced.

According to one embodiment, the dielectric layer material for the flexible copper clad laminate substrate may have a dielectric constant (Dk) of 3.3 Dk or less and a dielectric loss tangent (Df) of 0.015 or less at a frequency of 1 GHz.

The dielectric layer material for a flexible copper clad laminate substrate according to the present invention has an advantage of excellent dielectric properties at high frequencies.

In particular, it has characteristics of excellent heat resistance, chemical resistance, and mechanical properties while having low permittivity characteristics in a high frequency region.

Another aspect of the present invention is to prepare a polyimide film coated with an adhesive layer by applying an adhesive to one surface of the polyimide film; And laminating and bonding a low dielectric constant film on the adhesive layer; it provides a method for manufacturing a dielectric layer material for a flexible copper clad laminate substrate, including.

Another aspect of the present invention is to prepare a polyimide film coated with an adhesive layer by applying an adhesive to one surface of the polyimide film; disposing the two polyimide films coated with the adhesive layer so that the respective adhesive layers face each other; and inserting and bonding a low dielectric constant film between the adhesive layers disposed to face each other.

Each characteristic of the polyimide film, adhesive layer, and low dielectric constant film is the same as described above.

The method for manufacturing a dielectric layer material for a flexible copper clad laminate substrate according to the present invention is a dielectric layer material to which a polyimide film and a low dielectric film are bonded in a relatively simple manner by bonding a polyimide film and a low dielectric film to which an adhesive layer is applied by hot pressing. There is an effect that can manufacture.

According to one embodiment, the bonding may be performed by hot pressing at a temperature of 200 °C to 500 °C and a pressure of 3 MPa to 5 MPa.

The temperature condition during the bonding may be adjusted within the above range in consideration of the melting point of the adhesive.

When hot pressing is performed under conditions below the above temperature and pressure ranges, bonding between the polyimide film and the low dielectric constant film is not sufficiently performed, and peeling may occur.

On the other hand, if hot pressing is performed under conditions exceeding the above temperature and pressure ranges, process efficiency may be reduced and defects may occur in the dielectric layer material.

Another aspect of the present invention, a dielectric layer comprising a dielectric layer material for the flexible copper clad laminated board; and a copper layer laminated on the dielectric layer.

According to one embodiment, the copper layer may be laminated on the dielectric layer by a direct plating method.

Here, in the direct plating method, electroless copper plating or electroless nickel plating is performed on the surface of the dielectric layer to impart conductivity to the surface of the dielectric layer, and then electrolytic copper plating or electroless copper plating is performed thereon to form a copper layer. can mean the way

At this time, on the surface of the dielectric layer, a physical surface roughening process for bonding the copper layer is not performed, so that fine irregularities do not occur at the interface between the surface of the dielectric layer and the copper layer, and thus the conductor skin effect during high frequency signal transmission. is suppressed and signal loss can be reduced.

That is, in the flexible copper clad laminate substrate according to the present invention, by laminating a copper layer on a dielectric layer using a direct plating method, the surface roughness of the junction surface of the dielectric layer contacting the copper layer can be improved, thereby reducing conductor loss. can reduce

The flexible copper clad laminate substrate has low dielectric loss and conductor loss, so transmission loss can be reduced, and in particular, communication performance can be improved by reducing transmission loss in a high frequency region.

The flexible copper clad laminate substrate can be applied to a 5G communication antenna and can secure excellent communication performance in a high frequency region (3.5 GHz, 28 GHz).

According to one embodiment, the dielectric layer may be surface modified before copper plating for forming the copper layer.

Hereinafter, the present invention will be described in more detail by examples and comparative examples.

However, the following examples are only for illustrating the present invention, and the content of the present invention is not limited to the following examples.

<Example 1>

Put a PFA film (PFA-23) as a low dielectric constant film between the polyimide film (PI-EP-23) coated on one side with an epoxy adhesive, and apply a pressure of 3 MPa at a temperature of 160 ° C for 1 hour. The polyimide film layer and the low dielectric PFA film layer were bonded by pressing.

Then, in order to prevent shrinkage and wrinkles while rapidly cooling the laminated film, it was gradually cooled to room temperature to prepare a polyimide-based laminated film having a skin layer (PI) / core layer (PFA) / skin layer (PI) structure. .

1 is a schematic diagram of a dielectric layer material, which is a polyimide-based laminated film manufactured according to an embodiment of the present invention.

Referring to FIG. 1 , it can be confirmed that the dielectric layer material according to an embodiment of the present invention has a low dielectric constant film disposed inside the core layer and a polyimide film disposed on the surface, which is the skin layer.

2 is a schematic diagram of a dielectric layer material, which is a polyimide-based laminated film manufactured according to another embodiment of the present invention.

Referring to FIG. 2 , it can be confirmed that the dielectric layer material according to an embodiment of the present invention has a form in which an adhesive layer is laminated on a low dielectric constant film and a polyimide film is disposed on the adhesive layer.

<Example 2>

A polyimide-based laminated film was prepared in the same manner as in Example 1, except that PFA-50 was used as the low dielectric constant film.

<Example 3>

A polyimide-based laminated film was prepared in the same manner as in Example 1, except that SPS-35 was used as the low dielectric constant film.

<Example 4>

A polyimide-based laminated film was prepared in the same manner as in Example 1, except that PEEK-26 was used as the low dielectric constant film.

<Example 5>

A polyimide-based laminated film was prepared in the same manner as in Example 1, except that PI-EP-28 was used as the polyimide film and PFA-25 was used as the low dielectric constant film.

<Example 6>

A polyimide-based laminated film was prepared in the same manner as in Example 1, except that PI-EP-28 was used as the polyimide film and PFA-50 was used as the low dielectric constant film.

<Example 7>

A polyimide-based laminated film was prepared in the same manner as in Example 1, except that PI-EP-28 was used as the polyimide film and SPS-35 was used as the low dielectric constant film.

<Example 8>

A polyimide-based laminated film was prepared in the same manner as in Example 1, except that PI-EP-28 was used as the polyimide film and PEEK-26 was used as the low dielectric constant film.

<Example 9>

Two sheets of low dielectric constant film PFA-25 were laminated between polyimide films (PI-TPI-25), and hot-pressed for 35 minutes at a temperature of 300 ° C. by applying a pressure of 5 MPa to obtain a polyimide film layer and a low dielectric constant film. A polyimide-based laminated film was prepared in the same manner as in Example 1, except that the layers were bonded.

In the case of using PI-TPI-25 as a polyimide film, bonding was performed at a high temperature of 300 ° C for bonding of the polyimide-based adhesive (TPI). A polyimide film was successfully fabricated.

<Example 10>

16 sheets of low dielectric constant film PFA-25 were laminated between polyimide films (PI-TPI-25), and hot-pressed for 35 minutes by applying a pressure of 5 MPa at a temperature of 300 ° C. A polyimide-based laminated film was prepared in the same manner as in Example 1, except that the layers were bonded.

<Example 11>

One sheet of low dielectric constant film PFA-50 was placed between the polyimide films (PI-TPI-25), and hot-pressing for 35 minutes at a temperature of 300 ° C. and applying a pressure of 5 MPa to form a polyimide film layer and a low dielectric constant film layer. Except for bonding, a polyimide-based laminated film was prepared in the same manner as in Example 1.

<Example 12>

8 sheets of low dielectric constant film PFA-50 were laminated between polyimide films (PI-TPI-25), and hot-pressed for 35 minutes at a temperature of 300 ° C. by applying a pressure of 5 MPa to obtain a polyimide film layer and a low dielectric constant film. A polyimide-based laminated film was prepared in the same manner as in Example 1, except that the layers were bonded.

<Comparative Examples 1 to 7>

PI-TPI-25, PI-EP-23, PI-EP-28, PFA-25, PFA-50, SPS-35 and PEEK-26 was used in each comparative example.

<Experimental Example 1> Measurement of permittivity and dielectric loss tangent

The dielectric constant and dielectric loss tangent of each film (Examples 1 to 12 and Comparative Examples 1 to 7) were measured in the frequency range of 1 MHz to 1 GHz using an impedance analyzer (Agilent E4991A).

<Experimental Example 2> Film thickness measurement

The thickness of the films prepared in Examples and Comparative Examples was measured using a micrometer (mircometer) equipment.

Table 1 below shows specific laminated film configurations, dielectric constant, dielectric loss tangent, and final thickness measurement results of Examples and Comparative Examples.

Here, the number at the end of the sample name means the thickness of the film.

polyimide film low dielectric film
(melting point, ℃) low dielectric film
number of layers
(page) Final Laminated Film Thickness
(um) permittivity
(1GHz) dielectric loss tangent
(1GHz) Example 1 PI-EP-23 PFA-25 One 66.0 2.72 0.00845 Example 2 PI-EP-23 PFA-50 One 90.0 2.68 0.00555 Example 3 PI-EP-23 SPS-35 One 60.0 3.10 0.00901 Example 4 PI-EP-23 PEEK-26 One 60.0 3.16 0.00964 Example 5 PI-EP-28 PFA-25 One 80.0 2.85 0.00912 Example 6 PI-EP-28 PFA-50 One 102.0 2.77 0.00723 Example 7 PI-EP-28 SPS-35 One 79.0 3.15 0.00904 Example 8 PI-EP-28 PEEK-26 One 78.0 3.30 0.01120 Example 9 PI-TPI-25 PFA-25 2 98.0 2.57 0.00205 Example 10 PI-TPI-25 PFA-25 16 411.0 2.27 0.00048 Example 11 PI-TPI-25 PFA-50 One 99.0 2.62 0.00176 Example 12 PI-TPI-25 PFA-50 8 391.0 2.25 0.00008 Comparative Example 1 PI-TPI-25 - - 25 3.03 0.00372 Comparative Example 2 PI-EP-23 - - 23 3.29 0.01160 Comparative Example 3 PI-EP-28 - - 28 3.34 0.01630 Comparative Example 4 - PFA-25
(295℃) - 25 1.96 0.00025 Comparative Example 5 - PFA-50
(295℃) - 50 2.20 0.00031 Comparative Example 6 - SPS-35
(271 ℃) - 35.2 2.49 0.00038 Comparative Example 7 - PEEK-26
(343 ℃) - 25.6 2.70 0.00133

Referring to Table 1, the dielectric constant and dielectric loss tangent of the multilayer film in which the polyimide film layer and one PFA low dielectric constant film layer are bonded are the dielectric constant, dielectric loss tangent of the polyimide film and the dielectric constant, dielectric constant of the PFA low dielectric constant film. It can be confirmed that it has a value between the tangent values.

In addition, as the number of layers of PFA increases, it can be confirmed that the permittivity and dielectric loss tangent values approach the PFA default value.

The dielectric constant (Dk) at 1 GH of the examples was found to be in the range of 2 to 3.3 at 1 GH, and the dielectric loss tangent (Df) was measured to be in the range of 0.00008 to 0.012.

Referring to the results of Table 1, in the case of examples using PFA as a low dielectric constant film, although the dielectric constant slightly increased compared to the low dielectric constant film (Comparative Examples 5 and 6), when a polyimide film was used alone (comparison Compared to Example 1-3), it can be seen that the permittivity is remarkably lowered.

That is, in the case of the embodiments, by disposing the polyimide film layer on the surface layer or the skin layer, it is possible to form a copper layer through electroless direct plating while securing excellent dimensional stability, thermal stability, and soldering heat resistance of the final laminated film, , it can be seen that the low dielectric constant property of the final laminated film can also be secured by disposing the low dielectric constant film on the inner layer or the core layer.

As described above, although the embodiments have been described with limited drawings, those skilled in the art can apply various technical modifications and variations based on the above. For example, the described techniques may be performed in an order different from the method described, and/or components of the described system, structure, device, circuit, etc. may be combined or combined in a different form than the method described, or other components may be used. Or even if it is replaced or substituted by equivalents, appropriate results can be achieved.

Therefore, other implementations, other embodiments, and equivalents of the claims are within the scope of the following claims.

Claims (16)

low dielectric constant film;
an adhesive layer laminated on the low dielectric constant film; and
a polyimide film laminated on the adhesive layer;
including,
Dielectric layer material for flexible copper clad laminated boards.
According to claim 1,
The low dielectric constant film,
Perfluoroalkoxyalkane (PFA), polyetherketone (PEK), syndiotactic polystyrene (SPS), polysulfone (PSU), polyethersulfone (PES), polyarylate (PAr), polyetherimide (PEI) , To include at least one selected from the group consisting of polyphenylene sulfide (PPS) and polyether ether ketone (PEEK),
Dielectric layer material for flexible copper clad laminated boards.
According to claim 1,
The adhesive layer is
To include at least one selected from the group consisting of epoxy-based adhesives, acrylic adhesives, polyimide-based adhesives and fluorine-based resins,
Dielectric layer material for flexible copper clad laminated boards.
According to claim 1,
The low dielectric constant film,
A plurality of layers are laminated and melt-bonded,
Dielectric layer material for flexible copper clad laminated boards.
According to claim 1,
The thickness of the low dielectric constant film is,
20 μm to 250 μm,
Dielectric layer material for flexible copper clad laminated boards.
According to claim 1,
The thickness of the adhesive layer is
0.5 μm to 50 μm,
Dielectric layer material for flexible copper clad laminated boards.
According to claim 1,
The polyimide film,
The surface roughness (Ra) of the surface not bonded with the adhesive layer is 1 μm or less,
Dielectric layer material for flexible copper clad laminated boards.
According to claim 1,
The thickness of the polyimide film,
5 μm to 50 μm,
Dielectric layer material for flexible copper clad laminated boards.
According to claim 1,
The thickness ratio of the polyimide film and the low dielectric constant film,
1: 1 to 1: 10,
Dielectric layer material for flexible copper clad laminated boards.
According to claim 1,
The thickness is 40 μm to 450 μm,
Dielectric layer material for flexible copper clad laminated boards.
According to claim 1,
At a frequency of 1 GHz,
The dielectric constant (Dk) is 3.3 Dk or less, and the dielectric loss tangent (Df) is 0.015 or less,
Dielectric layer material for flexible copper clad laminated boards.
preparing an adhesive layer-coated polyimide film by applying an adhesive to one surface of the polyimide film; and
laminating and bonding a low dielectric constant film on the adhesive layer;
including,
Manufacturing method of dielectric layer material for flexible copper clad laminated board.
preparing an adhesive layer-coated polyimide film by applying an adhesive to one surface of the polyimide film;
disposing the two polyimide films coated with the adhesive layer so that the respective adhesive layers face each other; and
inserting and bonding a low dielectric constant film between the adhesive layers arranged to face each other;
including,
Manufacturing method of dielectric layer material for flexible copper clad laminated board.
According to claim 13,
The junction is
At a temperature of 200 ℃ to 500 ℃, carried out by hot pressing at a pressure of 3 MPa to 5 MPa,
Manufacturing method of dielectric layer material for flexible copper clad laminated board.
A dielectric layer comprising the dielectric layer material for a flexible copper clad laminated board of claim 1; and
a copper layer laminated on the dielectric layer;
including,
Flexible copper clad laminated board.
According to claim 15,
The copper layer is laminated on the dielectric layer by a direct plating method,
Flexible copper clad laminated board.

Images