KR20230050233A - Multilayer electronic component - Google Patents

Abstract

A stacked electronic part, according to one embodiment of the present invention, may comprise: a body which contains a dielectric layer and first and second internal electrodes alternately placed with the dielectric layer therebetween, and further comprises first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction; a first basic electrode layer which is placed on the third surface to contain a first connection unit connected to the first internal electrode; a second basic electrode layer which is placed on the fourth surface to contain a second connection unit connected to the second internal electrode; a first electrode layer which is placed on a region containing the third surface, the first surface and the second surface, and is formed to expose at least part of the first basic electrode layer; and a second electrode layer which is placed on a region containing the fourth surface, the first surface and the second surface, and is formed to expose at least part of the second basic electrode layer. The first and second basic electrode layers may contain copper (Cu) and the first and second electrode layers may contain silver (Ag). The present invention inhibits Ag ion migration from generating by minimizing a region where an electrode layer containing AG is placed.

Description

Multilayer electronic component {MULTILAYER ELECTRONIC COMPONENT}

The present invention relates to multilayer electronic components.

Multilayer Ceramic Capacitor (MLCC), one of the multilayer electronic components, is an important chip component used in industries such as communications, computers, home appliances, and automobiles due to its small size and high capacity guarantee. It is a key passive element used in various electric, electronic, and information communication devices such as , digital TV, etc. In addition, as multilayer ceramic capacitors are used in automobiles or infotainment systems, demands for high reliability, high strength, and miniaturization are increasing.

In order to mount a conventional multilayer ceramic capacitor on a substrate or the like, an external electrode of the multilayer ceramic capacitor includes a plating layer formed on a base electrode layer. However, when such a multilayer ceramic capacitor is mounted on a board in a high-temperature, high-vibration environment, solder cracks may be formed due to the difference in thermal expansion coefficient between tin (Sn) solder, external electrodes, and the board, and oxidation due to high temperature may occur. As a result, contact resistance may increase.

To solve this problem, an external electrode structure including a base electrode layer containing copper (Cu) and an electrode layer containing silver (Ag) is used. If these external electrodes are used, the multilayer ceramic capacitor can be mounted on the board by using a conductive glue such as Ag epoxy instead of tin soldering, which is a typical multilayer mounting on the board through tin (Sn) soldering. Compared to ceramic capacitors, reliability is excellent in high-temperature, high-pressure, and high-vibration environments.

However, Ag ion migration may occur along the surface of the multilayer ceramic capacitor when an external electrode including Ag is exposed to moisture in a state where a voltage is applied. Such Ag ion migration causes leakage of current from the surface of the multilayer ceramic capacitor, thereby deteriorating the insulation resistance of the multilayer ceramic capacitor or causing short-circuit failure.

Therefore, even when the external electrode includes Ag, there is a need to improve the structure of the external electrode capable of suppressing degradation of insulation resistance and short circuit failure of the multilayer ceramic capacitor by effectively suppressing migration of Ag ions.

One of the various objects of the present invention is to solve problems in which Ag ion migration occurs when external electrodes include Ag, resulting in deterioration of insulation resistance or occurrence of short-circuit defects in multilayer electronic components.

One of the various objects of the present invention is to solve the problem of Ag ion migration, when adjusting the arrangement area of the electrode layer containing Ag, the base electrode layer containing Cu is exposed to the outside, and the moisture resistance of the multilayer electronic component deteriorates. is to solve the problem of

However, the object of the present invention is not limited to the above, and will be more easily understood in the process of describing specific embodiments of the present invention.

A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and includes first and second surfaces facing in a first direction, the first and third and fourth surfaces connected to the second surface and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction; a first base electrode layer disposed on the third surface and including a first connector connected to the first internal electrode; a second base electrode layer disposed on the fourth surface and including a second connector connected to the second internal electrode; a first electrode layer disposed on a region including the third surface, the first surface, and the second surface, and exposing at least a portion of the first base electrode layer; and a second electrode layer disposed on a region including the fourth surface, the first surface, and the second surface, and exposing at least a portion of the second base electrode layer. The first and second base electrode layers may include Cu, and the first and second electrode layers may include Ag.

One of the various effects of the present invention is to suppress the occurrence of Ag ion migration by minimizing the area where the electrode layer containing Ag is disposed.

One of the various effects of the present invention is to suppress Ag ion migration by arranging the Ag-containing electrode layer to be biased toward the mounting surface of the multilayer electronic component.

One of the various effects of the present invention is to suppress the occurrence of Ag ion migration by disposing the electrode layer including Ag so as not to come into contact with the body.

However, the various advantageous advantages and effects of the present invention are not limited to the above description, and will be more easily understood in the process of describing specific embodiments of the present invention.

1 is a perspective view illustrating a multilayer electronic component according to an exemplary embodiment of the present invention.
FIG. 2 is a bottom perspective view of the multilayer electronic component according to FIG. 1 .
3 is a II′ cross-sectional view of FIG. 1 .
FIG. 4 is a II-II′ cross-sectional view of FIG. 1 .
5 is an exploded perspective view illustrating an exploded body of a multilayer electronic component according to an exemplary embodiment of the present invention.
6 schematically illustrates a cross-sectional view of a board on which a multilayer electronic component according to an embodiment of the present invention is mounted.
7 is a cross-sectional view illustrating a multilayer electronic component according to an exemplary embodiment.
8 is a cross-sectional view illustrating a multilayer electronic component according to an exemplary embodiment.
9 is a cross-sectional view illustrating a multilayer electronic component according to an exemplary embodiment.
10 is a cross-sectional view illustrating a multilayer electronic component according to an exemplary embodiment.
11 is a perspective view illustrating a multilayer electronic component according to an exemplary embodiment.
FIG. 12 is a bottom perspective view of the multilayer electronic component according to FIG. 11 .
13 is a III-III′ cross-sectional view of FIG. 11 .
14 is a schematic cross-sectional view of a board on which a multilayer electronic component according to an embodiment of the present invention is mounted.
15 is a cross-sectional view illustrating a multilayer electronic component according to an exemplary embodiment.
16 is a cross-sectional view illustrating a multilayer electronic component according to an exemplary embodiment.
17 is a cross-sectional view illustrating a multilayer electronic component according to an exemplary embodiment.
18 is a cross-sectional view of a multilayer electronic component according to an exemplary embodiment.
19 is an exploded perspective view illustrating a multilayer electronic component according to an exemplary embodiment of the present invention.
20 is a sectional view IV-IV′ of FIG. 19 .
21 is a cross-sectional view of a multilayer electronic component according to an exemplary embodiment.
22 schematically illustrates a cross-sectional view of a substrate on which a multilayer electronic component according to an embodiment of the present invention is mounted.

Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and accompanying drawings. However, the embodiments of the present invention can be modified in many different forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shape and size of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

In addition, in order to clearly describe the present invention in the drawings, parts irrelevant to the description are omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of description, so the present invention is not necessarily limited to those shown. Also, components having the same function within the scope of the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a certain component is said to "include", it means that it may further include other components without excluding other components unless otherwise stated.

In the drawing, a first direction may be defined as a thickness (T) direction, a second direction may be defined as a length (L) direction, and a third direction may be defined as a width (W) direction.

1 is a perspective view illustrating a multilayer electronic component 100 according to an embodiment of the present invention.

FIG. 2 is a bottom perspective view of the multilayer electronic component according to FIG. 1 .

FIG. 3 is a II′ cross-sectional view of FIG. 1 .

FIG. 4 is a II-II′ cross-sectional view of FIG. 1 .

5 is an exploded perspective view illustrating an exploded body of a multilayer electronic component according to an exemplary embodiment of the present invention.

6 is a schematic cross-sectional view of a board 1000 on which stacked electronic components are mounted according to an embodiment of the present invention.

Hereinafter, a multilayer electronic component 100 according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 to 6 .

A multilayer electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 alternately disposed with the dielectric layer interposed therebetween, and face each other in a first direction. First and second surfaces 1 and 2 that are visible, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in the second direction, connected to the first to fourth surfaces a body 110 including fifth and sixth surfaces 5 and 6 facing in a third direction; a first base electrode layer 131 disposed on the third surface 3 and including a first connector 131a connected to the first internal electrode 121; a second base electrode layer 132 disposed on the fourth surface 4 and including a second connector 132a connected to the second internal electrode 121; The first electrode layer is disposed on a region including the third surface 3, the first surface 1, and the second surface 2, and is formed to expose at least a portion of the first base electrode layer 131. (141); and a second electrode layer disposed on a region including the fourth surface 4, the first surface 1, and the second surface 92 and formed to expose at least a portion of the second base electrode layer 132. (142); Including, the first and second base electrode layers 131 and 132 may include Cu, and the first and second electrode layers 141 and 142 may include Ag.

In the body 110, dielectric layers 111 and internal electrodes 121 and 122 are alternately stacked.

Although the specific shape of the body 110 is not particularly limited, as shown, the body 110 may have a hexahedral shape or a shape similar thereto. Due to shrinkage of the ceramic powder included in the body 110 during firing, the body 110 may have a substantially hexahedral shape, although it does not have a perfectly straight hexahedral shape.

The body 110 includes first and second surfaces 1 and 2 facing each other in a first direction, and third and third surfaces connected to the first and second surfaces 1 and 2 and facing each other in a second direction. The fifth and sixth faces (4 faces 3 and 4), connected to the first and second faces 1 and 2, connected to the third and fourth faces 3 and 4, and facing each other in the third direction ( 5, 6).

In one embodiment, the body 110 includes 1-3 corners connecting the first and third surfaces, 1-4 corners connecting the first and fourth surfaces, and the second and third corners. A 2-3 corner connecting the surfaces and a 2-4 corner connecting the second surface and the fourth surface, wherein the 1-3 corner and the 2-3 corner are close to the third surface. The 1-4 corner and the 2-4 corner may have a shape contracted toward the center of the body in the first direction as they get closer to the fourth surface. there is.

As the margin area where the internal electrodes 121 and 122 are not disposed overlaps on the dielectric layer 111, a step difference is generated due to the thickness of the internal electrodes 121 and 122 to connect the first surface and the third to fifth surfaces. The corner and/or the corner connecting the second surface and the third to fifth surfaces may have a shape contracted toward the center of the body 110 in the first direction when viewed from the first surface or the second surface. Alternatively, a corner connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, and 6 and/or the second surface 2 and the third Corners connecting the to sixth surfaces 3, 4, 5, and 6 may have a shape contracted toward the center of the body 110 in the first direction when viewed from the first or second surface. Alternatively, in order to prevent chipping defects, the corners connecting each side of the body 110 are rounded by performing a separate process, and the corners connecting the first side and the third to sixth sides and/or the second A corner connecting the surface and the third to sixth surfaces may have a round shape.

The corners include a 1-3 corner connecting the first surface and the third surface, a 1-4 corner connecting the first surface and the fourth surface, and a 2-3 corner connecting the second surface and the third surface. , may include a 2-4 corner connecting the second surface and the fourth surface. In addition, the corner is a 1-5 corner connecting the first surface and the fifth surface, a 1-6 corner connecting the first surface and the sixth surface, and a 2-5 corner connecting the second surface and the fifth surface. A corner, and 2-6 corners connecting the second surface and the sixth surface may be included. The first to sixth surfaces of the body 110 may be generally flat surfaces, and non-flat areas may be regarded as corners. Hereinafter, the extension line of each surface may mean a line extended based on a flat part of each surface.

At this time, among the base electrode layers 131 and 132, regions disposed on the corners of the body 110 are corner portions, regions disposed on the third and fourth surfaces of the body 110 are connection portions, and first and second electrode layers of the body A region disposed on the two surfaces may be referred to as a band portion.

On the other hand, in order to suppress the step difference caused by the internal electrodes 121 and 122, after stacking, the internal electrodes are cut to expose the fifth and sixth surfaces 5 and 6 of the body, and then a single dielectric layer or two or more dielectric layers are formed. When the margin parts 114 and 115 are formed by stacking both sides of the capacitance forming part Ac in the third direction (width direction), the portion connecting the first surface to the fifth and sixth surfaces and the second surface A portion connecting the fifth and sixth surfaces may not have a contracted shape.

The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated to the extent that it is difficult to confirm without using a scanning electron microscope (SEM). there is.

According to one embodiment of the present invention, a material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material may be used. The barium titanate-based material may include BaTiO ₃ -based ceramic powder, and as an example of the ceramic powder, BaTiO ₃ , BaTiO ₃ in which Ca (calcium), Zr (zirconium), etc. are partially dissolved (Ba _1-x Ca _x )TiO ₃ (0<x<1), Ba(Ti _1-y Ca _y )O ₃ (0<y<1), (Ba _1-x Ca _x )(Ti _1-y Zr _y )O ₃ ( 0<x<1, 0<y<1) or Ba(Ti _1-y Zr _y )O ₃ (0<y<1).

In addition, various ceramic additives, organic solvents, binders, dispersants, etc. may be added to powder such as barium titanate (BaTiO ₃ ) as a raw material forming the dielectric layer 111 according to the purpose of the present invention.

The body 110 is disposed inside the body 110 and includes first internal electrodes 121 and second internal electrodes 122 disposed to face each other with the dielectric layer 111 interposed therebetween to form capacitance. It may include a capacitance forming part Ac and cover parts 112 and 113 formed above and below the capacitance forming part Ac in the first direction.

In addition, the capacitance forming portion (Ac) is a portion that contributes to forming the capacitance of the capacitor, and may be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with a dielectric layer 111 interposed therebetween. there is.

The cover parts 112 and 113 include an upper cover part 112 disposed above the capacitance forming part Ac in the first direction and a lower cover part 113 disposed below the capacitance forming part Ac in the first direction. ) may be included.

The upper cover portion 112 and the lower cover portion 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitance forming portion Ac in the thickness direction, respectively, and are basically resistant to physical or chemical stress. It can play a role in preventing damage to the internal electrode caused by

The upper cover part 112 and the lower cover part 113 may not include internal electrodes and may include the same material as the dielectric layer 111 .

That is, the upper cover part 112 and the lower cover part 113 may include a ceramic material, for example, a barium titanate (BaTiO ₃ )-based ceramic material.

In addition, margin parts 114 and 115 may be disposed on side surfaces of the capacitance forming part Ac.

The marginal parts 114 and 115 may include a first marginal part 114 disposed on the fifth surface 5 of the body 110 and a second marginal part 115 disposed on the sixth surface 6 of the body 110. there is. That is, the margin parts 114 and 115 may be disposed on both end surfaces of the body 110 in the width direction.

As shown in FIG. 4 , the margin portions 114 and 115 are the first and second internal electrodes 121 and 122 in a cross-section of the body 110 cut in the width-thickness (W-T) direction. It may refer to the area between both ends of and the boundary surface of the body 110.

The margin portions 114 and 115 may basically serve to prevent damage to the internal electrode due to physical or chemical stress.

The margin portions 114 and 115 may be formed by forming internal electrodes by applying a conductive paste on the ceramic green sheet except where the margin portion is to be formed.

In addition, in order to suppress the step difference caused by the internal electrodes 121 and 122, after stacking, the internal electrodes are cut to expose the fifth and sixth surfaces 5 and 6 of the body, and then a single dielectric layer or two or more dielectric layers are formed. Margin parts 114 and 115 may be formed by stacking on both side surfaces of the capacitance forming part Ac in the third direction (width direction).

The internal electrodes 121 and 122 are alternately stacked with the dielectric layer 111 .

The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122 . The first and second internal electrodes 121 and 122 are alternately disposed to face each other with the dielectric layer 111 constituting the body 110 interposed therebetween, and the third and fourth surfaces 3 and 4 of the body 110 ), respectively, can be exposed.

Referring to FIG. 3 , the first internal electrode 121 is spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 is spaced apart from the third surface 3. and can be exposed through the fourth surface (4). A first base electrode layer 131 is disposed on the third surface 3 of the body and connected to the first internal electrode 121, and a second base electrode layer 132 is disposed on the fourth surface 4 of the body to make the first base electrode layer 131 connected to the first internal electrode 121. 2 may be connected to the internal electrode 122 .

That is, the first internal electrode 121 is not connected to the second base electrode layer 132 but connected to the first base electrode layer 131, and the second internal electrode 122 is not connected to the first base electrode layer 131. It is connected to the second base electrode layer 132 without being connected. Accordingly, the first internal electrode 121 may be formed to be spaced apart from the fourth surface 4 by a predetermined distance, and the second internal electrode 122 may be formed to be spaced apart from the third surface 3 by a predetermined distance.

In this case, the first and second internal electrodes 121 and 122 may be electrically separated from each other by the dielectric layer 111 disposed in the middle.

The body 110 may be formed by alternately stacking ceramic green sheets on which the first internal electrodes 121 are printed and ceramic green sheets on which the second internal electrodes 122 are printed, and then firing them.

Materials forming the internal electrodes 121 and 122 are not particularly limited, and materials having excellent electrical conductivity may be used. For example, the internal electrodes 121 and 122 may include nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), or tungsten (W ), titanium (Ti), and alloys thereof.

In addition, the internal electrodes 121 and 122 include nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), It may be formed by printing a conductive paste for internal electrodes containing at least one of titanium (Ti) and alloys thereof on a ceramic green sheet. A screen printing method or a gravure printing method may be used as a method of printing the conductive paste for the internal electrode, but the present invention is not limited thereto.

The first and second base electrode layers 131 and 132 may be disposed outside the body 110 . In this embodiment, a structure having two base electrode layers 131 and 132 is described, but the number and shape of the base electrode layers 131 and 132 may change depending on the shape of the internal electrodes 121 and 122 or other purposes. You will be able to.

The first base electrode layer 131 is disposed on the third surface 3 and includes a first connection portion 131a connected to the first internal electrode 121, and the second base electrode layer 132 includes the first connection portion 131a. A second connector 132a disposed on the fourth surface 4 and connected to the second internal electrode 122 is included.

However, in the present invention, the first and second base electrode layers are disposed only on the third and fourth surfaces 3 and 4 and disposed on the other surfaces 1, 2, 5, and 6 of the body 110. It is not limited to a structure that does not become.

That is, the first base electrode layer 131 includes a first band portion 131b extending from the first connection portion 131a to a portion of the first surface 1 and extending from the first connection portion to the second surface 2 ) may further include a third band portion 131c extending to a portion of the disposition, and the second base electrode layer 132 extends from the second connection portion 132a to a portion of the first surface 1. It may further include a second band portion 132b and a fourth band portion 132c disposed to extend from the second connection portion to a portion of the second surface 2 .

In addition, the first base electrode layer 131 may include a first side band portion extending from the first connection portion 131a to portions of the fifth and sixth surfaces 5 and 6, and the second base electrode layer 132 may further include a second side band portion extending from the second connection portion 132a to portions of the fifth and sixth surfaces.

However, the third band unit, the fourth band unit, the first side band unit, and the second side band unit may not be essential elements in the present invention. That is, the first base electrode layer 131 includes the first connection portion 131a and the first band portion 131b, and the second base electrode layer 132 includes the second connection portion 132a and the second band portion 132b. , and the first and second base electrode layers 131 and 132 may not be disposed on the second surface 2, nor may they be disposed on the fifth surface 5 and the sixth surface 6. there is.

The first and second base electrode layers 131 and 132 may include Cu. Cu has an advantage of excellent electrical connectivity with metals included in the internal electrodes 121 and 122 .

Meanwhile, the first and second base electrode layers 131 and 132 may include Cu as a main component and other metals having excellent electrical conductivity as other materials. For example, at least one of Ni, Pd, Ag, Sn, Cr, and alloys thereof may be further included.

The first and second base electrode layers 131 and 132 may be firing electrodes including Cu and glass or resin-based electrodes including Cu and resin.

In addition, the first and second base electrode layers 131 and 132 may have a form in which a plastic electrode and a resin-based electrode are sequentially formed on the body. In addition, the first and second base electrode layers 131 and 132 may be formed by transferring a sheet containing Cu onto the body or by transferring a sheet containing Cu onto a fired electrode.

According to an embodiment of the present invention, the first and second base electrode layers 131 and 132 may include Cu to improve electrical connectivity with the internal electrodes 121 and 122 . Meanwhile, in order to improve adhesion to the body 110 and improve density, the first and second base electrode layers 131 and 132 may further include glass.

The first electrode layer 141 is disposed on a region including the third surface 3, the first surface 1, and the second surface 2, and at least a portion of the first base electrode layer 131 , and the second electrode layer 142 is disposed on a region including the fourth surface 4, the first surface 1, and the second surface 2, and the second base electrode layer It may be formed to expose at least a portion of (132).

That is, the first electrode layer 141 is disposed on a region including the third surface 3, the first surface 1, and the second surface 2, and includes at least one of the first base electrode layer 131. It may be disposed so as not to cover a portion thereof, and is disposed on an area including the fourth surface 4, the first surface 1, and the second surface 2, and the second electrode layer 142 is formed on the second foundation. It may be disposed not to cover at least a portion of the electrode layer 132 .

There may be various methods of forming the first and second electrode layers 141 and 142 to expose at least a portion of the first and second base electrode layers 131 and 132 .

For example, the first electrode layer 141 is disposed on the first band portion 131b and the second electrode layer 142 is disposed on the second band portion 132b, so that the first and second electrode layers 141 and 142 are formed. At least a portion of the undisposed first and second base electrode layers 131 and 132 may be exposed.

As another example, like the multilayer electronic components 200, 201, 202, 203, and 204 according to an embodiment to be described later, the first base electrode layer 131 disposed on the third surface 3 is used as the first connection electrode. (231a), the second base electrode layer 132 disposed on the fourth surface 4 is referred to as the second connection electrode 232, and disposed on the first surface 1 to form the first connection electrode 231 and The first band electrode 241 is formed by disposing the first electrode layer 141 to be connected, and the second electrode layer 142 is disposed on the first surface 1 to be connected to the second connection electrode 232. By forming the second band electrode 242, at least a portion of the first and second connection electrodes 231 and 132 not covered by the first and second band electrodes 241 and 242 may be exposed.

As another example, like the multilayer electronic components 300 and 301 according to an embodiment to be described later, the first base electrode layer 331 extends from the first connector 331a to a portion of the first surface 1 and is disposed. It further includes a third band portion 331c extending from the first band portion 331b and the first connection portion 331a to a portion of the second surface 2, and the second base electrode layer 332 includes the second connection portion ( 332a) and a fourth band portion 332c extending from the second band portion 332b to a portion of the first surface 1 and extending from the second connection portion 332a to a portion of the second surface 2. Further, the first electrode layer 341 is disposed on the first connection portion 331a, and the second electrode layer 342 is disposed on the second connection portion 332a, thereby forming the first and second electrode layers 341 and 342. At least a portion of the undisposed first and second base electrode layers 331 and 332 may be exposed.

The first and second electrode layers 141 and 142 may include silver (Ag). Accordingly, the first electrode layer 141 is connected to the first base electrode layer 131 and the second electrode layer 142 is connected to the second base electrode layer 132, and is connected to the electrode pads 191 and 192 disposed on the substrate. Conductive adhesives 171 and 172 containing conductive metal and resin are applied and the first and second electrode layers 141 and 142 of the multilayer electronic component 100 are bonded on the conductive adhesive to be mounted on the substrate 180. can

The first and second electrode layers 141 and 142 may include Ag. The first and second electrode layers 141 and 142 may be firing electrodes including Ag and glass or Ag plating layers formed by plating.

Since the first and second electrode layers 141 and 142 include Ag having a higher standard reduction potential than Cu included in the first and second base electrode layers, oxidation of the first and second base electrode layers is prevented and penetration of moisture is prevented. role can be fulfilled.

In addition, since the multilayer electronic component 100 can be mounted on the board 180 by a conductive adhesive containing a conductive metal and a resin, solder cracks occur due to a difference in thermal expansion coefficient between the external electrode and the solder in a high-low temperature cycle. can solve the problem.

However, when the first and second electrode layers 141 and 142 containing silver (Ag) are formed on the first and second base electrode layers 131 and 132, Ag ions migrate along the surface of the body 110 this can happen This may cause deterioration of insulation resistance due to current leakage of the multilayer electronic component 100 and a short circuit between the base electrode layers 131 and 132 having different polarities or between the electrode layers 141 and 142 .

In a high-temperature and high-humidity environment, the possibility of moisture or contaminants present on the surface of the multilayer electronic component 100 increases. When voltage is applied in this state, metal ions dissolved in the anode move to the cathode, and precipitation occurs at the cathode. As this reaction continues, metal dendrites grow along the surface of the body 110 from the cathode to the anode, and this phenomenon is called ion migration.

In particular, it is known that Ag is the metal conductor in which such ion migration occurs most easily. Ag ion migration may more easily occur on the surface of the body 110 when the external electrode includes Ag or Ag alone is used. .

Since Ag ion migration occurs on the surface of the body 110 between the external electrodes of the multilayer electronic component, the insulation layer on the surface of the body 110 is destroyed due to current leakage, thereby increasing the insulation resistance of the multilayer electronic component 100. This may cause deterioration and cause a short between electrodes, thereby having a fatal effect on the reliability of the multilayer electronic component 100 .

Meanwhile, it is known that the main factors controlling the growth rate of Ag ion migration are voltage and humidity. As the multilayer electronic component 100 is farther away from the mounting surface, the possibility of being exposed to the external environment increases, and since the area in contact with air may increase, it may be more affected by moisture. Accordingly, Ag ion migration tends to occur more strongly in the multilayer electronic component in a direction away from the mounting surface.

Therefore, in the present invention, the position and area of the first and second electrode layers 141 and 142 containing Ag are adjusted to minimize the occurrence of Ag ion migration while securing reliability in a high temperature and high humidity environment of a multilayer electronic component. want to do

According to an embodiment of the present invention, first and second electrode layers 141 and 142 containing silver (Ag) may be disposed on the first and second band portions.

As the first electrode layer 141 is disposed on the first band portion 131b and the second electrode layer 142 is disposed on the second band portion 132b, the first and second electrode layers 141 and 142 are formed on the first band portion 131b. And Ag ion migration that may occur when disposed on the entire surfaces of the second base electrode layers 131 and 132 can be effectively suppressed. In addition, since the area where the first and second electrode layers 141 and 142 are disposed can be reduced, the amount of paste containing Ag can be reduced, thereby reducing the manufacturing cost of the multilayer electronic component 100 .

As described above, since Ag ion migration tends to occur more strongly in the opposite direction to the mounting surface of the multilayer electronic component 100, the electrode layer containing Ag is formed in the first and second band portions 131b and 132b close to the mounting surface. In the case of an embodiment of the present invention, the effect of suppressing Ag ion migration can be more remarkable.

Accordingly, it is possible to mount the electrode layers 141 and 142 including Ag on the substrate 180 by using the conductive adhesives 171 and 172 containing a conductive metal and a resin while minimizing the area where the electrode layers 141 and 142 are disposed. Therefore, Ag ion migration can be suppressed to prevent deterioration of insulation resistance and short circuit, and oxidation in the mounting area of the first and second base electrode layers 131 and 132 containing Cu can be prevented, and conductive metal and It is possible to prevent a decrease in adhesion strength by enabling mounting through a conductive adhesive containing a resin.

One of the other factors that control the growth rate of Ag ion migration can be the components of the first and second electrode layers. Ag is known as the metal in which ion migration most easily occurs, and when the first and second electrode layers 141 and 142 are composed of only Ag, when Ag is partially condensed in the electrode layer, or when the content of Ag is If excessive, Ag ion migration may occur more strongly.

In one embodiment, the first and second base electrode layers 131 and 132 may further include glass, and the first and second electrode layers 141 and 142 may further include glass and palladium (Pd).

Since the first and second electrode layers 141 and 142 include glass, adhesion to the base electrode layers 131 and 132 including glass may be improved.

When the first and second electrode layers 141 and 142 further contain palladium (Pd), since Ag and Pd form an isomorphous, migration of Ag ions can be effectively suppressed. In addition, since the standard reduction potential of Pd (+0.915V) is higher than that of Ag (0.80V), oxidation of the first and second base electrode layers 131 and 132 can be more effectively prevented.

In this case, the content of Pd included in the first and second electrode layers 141 and 142 may be 1 mole or more and 5 moles or less relative to 100 moles of Ag.

When the content of Pd is less than 1 mol with respect to 100 mol of Ag, it is difficult to form a full solid solution with Ag sufficiently, and the effect of suppressing Ag ion migration may be insufficient.

On the other hand, when the content of Pd is greater than 5 moles relative to 100 moles of Ag, since the sintering driving force of Pd is generally higher than that of Ag, there is a concern that blisters and radiation cracks may occur due to the difference in sintering driving force, and manufacturing cost this may increase

Meanwhile, the components of the first and second base electrode layers 131 and 132 and the first and second electrode layers 141 and 142 are images observed using SEM-EDS (Scanning Electron Microscope-Energy Dispersive X-ray Spectroscopy). may be derived from Specifically, areas in which the base electrode layer and the electrode layer are divided into 5 equal parts in the thickness or length direction after exposing the cross section (L-T cross section) in the longitudinal direction and thickness direction by polishing the multilayer electronic component to a central position in the width direction (third direction) The type of each element included in the base electrode layer and the electrode layer and the content relative to 100 at% of all elements can be measured in the area disposed in the center of the base electrode layer using EDS.

Meanwhile, when the multilayer electronic component 100 is mounted using the conductive adhesives 171 and 172 containing conductive metal and resin, the conductive adhesives 171 and 172 and the first and second electrode layers are used to secure adhesion strength. It is necessary to sufficiently secure the contact area between (141, 142).

In one embodiment, the first electrode layer 141 extends from the first band portion 131b to a portion of the first connection portion 131a, and the second electrode layer 142 extends from the second band portion 132b. ) to a part of the second connection part 132a to ensure sufficient contact area between the conductive adhesives 171 and 172 and the first and second electrode layers 141 and 142, thereby increasing the bonding strength of the multilayer electronic component 100. can improve

In one embodiment, the first direction average size TB1 from the lowest point in the first direction to the highest point in the first direction of the first and second electrode layers 141 and 142 may be greater than or equal to 10 μm and less than or equal to 40 μm. When the TB1 is less than 10 μm, the first and second electrode layers 141 and 142 may not sufficiently cover the first and second band portions 131b and 132b, making it difficult to secure sufficient bonding strength. If the thickness exceeds 40 μm, the first and second electrode layers 141 and 142 are excessively formed on the first and second connectors 131a and 132a, and it may be difficult to suppress Ag ion migration.

From a similar point of view, in one embodiment, the average size in the first direction from the first surface 1 to the internal electrode disposed closest to the first surface among the first and second internal electrodes 121 and 122 H1, when the average size in the first direction from the extension line of the first surface to the ends of the first and second electrode layers disposed on the first and second connection portions 131a and 132a is H2, H1≥H2 can be satisfied. That is, by disposing the first and second electrode layers 141 and 142 in an area below the first and second internal electrodes 121 and 122 disposed at the lowermost end, Ag ion migration can be effectively suppressed while securing sufficient bonding strength. can

On the other hand, the average size TB1 in the first direction from the lowest point in the first direction to the highest point in the first direction of the first and second electrode layers 141 and 142 moves the body 110 from the center in the third direction to the first And it may be an average value of values measured from the side of the first electrode layer 141 and values measured from the side of the second electrode layer 142 in the cross section (L-T cross section) cut in the second direction.

Referring to FIG. 6 , the board 1000 on which the multilayer electronic component 100 according to an embodiment of the present invention is mounted includes the first and second electrode layers 141 and 142 of the multilayer electronic component 100. ) may be bonded to the electrode pads 191 and 192 disposed on the conductive adhesives 171 and 172.

Since the first and second electrode layers 141 and 142 according to an embodiment of the present invention contain silver (Ag), electrical conduction can be secured between the electrode layers 141 and 142 and the conductive adhesives 171 and 172, , The resin included in the conductive adhesives 171 and 172 is cured to secure adhesive strength with the substrate 180 .

In addition, when conventional multilayer electronic components are mounted on a board, unlike the case of using solder containing tin (Sn), the electrode layers 141 and 142 and the conductive adhesives 171 and 172 are applied even in a high-low temperature cycle. By alleviating the thermal shock, the bonding strength of the multilayer electronic component 100 can be improved.

The type of conductive metal included in the conductive adhesives 171 and 172 is not particularly limited, and may include, for example, metals such as Ag and Au.

In one embodiment, the resin included in the conductive adhesives 171 and 172 may be an epoxy resin. Epoxy resin has a smaller coefficient of thermal expansion than solder, and accordingly, it is possible to suppress generation of cracks due to thermal expansion and contraction due to temperature change in a high-temperature environment. In the conventional case of mounting multilayer electronic components on a board through solder containing tin (Sn), solder cracks are likely to occur due to stress caused by a difference in thermal expansion coefficient between an external electrode and a solder in a high-low temperature cycle. According to one embodiment of the present invention, since the conductive adhesives 171 and 172 contain resin, a difference in coefficient of thermal expansion between the first and second electrode layers 141 and 142 and the conductive adhesive can be reduced, thereby preventing cracks in the conductive adhesive. problems that arise can be resolved. In addition, by including an epoxy resin, it is easy to cure at room temperature and heat curing depending on the content thereof, and excellent adhesiveness can be secured.

In one embodiment, the type of resin included in the conductive adhesives 171 and 172 is exemplified as an epoxy resin, but is not limited thereto, and polyurethane, silicone, polyimide, phenol, and polyester-based thermosetting resins may be used. .

7 is a cross-sectional view illustrating a multilayer electronic component 101 according to an exemplary embodiment.

Referring to FIG. 7 , in the multilayer electronic component 101 according to an exemplary embodiment, an inner part of the first and second internal electrodes 121 and 122 disposed closest to the first surface 1 is disposed closest to the first surface 1 . The average size in the first direction up to the electrode is H1, and the average size in the first direction from the extension line of the first surface to the ends of the first and second electrode layers disposed on the first and second connectors 131a and 132a is When H2, it is possible to satisfy H1<H2.

Among the first and second base electrode layers 131 and 132 containing Cu, portions not covered with the first and second electrode layers 141 and 142 containing Ag may be vulnerable to external moisture penetration when exposed to the outside. there is. In particular, when the first and second base electrode layers 131 and 132 are firing electrodes formed of conductive paste, the thickness (in the second direction) of the first and second connection portions 131a and 132a increases in the first direction. When oxidation of Cu occurs in a region where the size) is reduced, the first and second connectors 131a and 132a may become main penetration paths of external moisture.

According to the multilayer electronic component 101 according to an exemplary embodiment, by satisfying H1<H2, the first and second electrode layers extend to a region where the thickness (size in the second direction) of the first and second connectors 131a and 132a is thin. (141, 142) is disposed so as to extend to block the main penetration path of external moisture, so that the moisture resistance reliability of the multilayer electronic component 101 can be improved.

On the other hand, as described above, Ag ion migration tends to occur more strongly from the mounting surface of the multilayer electronic component 101 toward the opposite direction to the mounting surface. Therefore, when the first and second electrode layers 141 and 142 including Ag are formed to extend further in the first direction of the body 110, the first and second electrode layers 141 and 142 are formed in the first and second electrode layers 141 and 142. Forming on the band portions 131b and 132b may not have sufficient effect of suppressing Ag ion migration. At this time, when T is the size of the body in the first direction, H2<T/2 is satisfied so that the first and second electrode layers 141 and 142 including Ag are not excessively formed in the first direction. Thus, the effect of suppressing Ag ion migration can be sufficiently secured. That is, H1, H2, and T may satisfy H1<H2<T/2.

H1 and H2 may be average values of values measured in cross sections (L-T cross sections) obtained by cutting the body 110 in the first and second directions from the central portion in the third direction. H1 may be an average of values measured at arbitrary points in the second direction between the internal electrode disposed closest to the first surface 1 and the first surface 1 in the cross section, and H2 may be an average value at the connection It may be a value measured based on the end of the disposed electrode layer, and may be an average value of a value measured at the side of the first band part 141 and a value measured at the side of the second band part 142. In this case, the extension line E1 of the first surface serving as a reference when measuring H1 and H2 may be the same.

In addition, the size T of the body 110 in the first direction is similarly measured by the extension line E1 of the first surface and the second cross section (L-T cross section) obtained by cutting the body 110 in the first and second directions from the central portion in the third direction. It may be a value obtained by measuring the size of the extension line E2 of the surface in the first direction.

A method of adjusting the area where the first and second electrode layers 141 and 142 are disposed is not particularly limited. After forming the first and second base electrode layers 131 and 132 on the first and second electrode layers 141 and 142, the first band portion 131b and the second band portion 132b are coated with a conductive paste containing Ag. It can be formed by alternately immersing, drying, and firing at a temperature of about 600°C. At this time, the area where the first and second electrode layers 141 and 142 are disposed may be adjusted by adjusting the depth at which the body 110 is immersed, but is not limited thereto.

8 is a cross-sectional view illustrating a multilayer electronic component 102 according to an exemplary embodiment.

Referring to FIG. 8 , the multilayer electronic component 102 according to an exemplary embodiment includes a first insulating layer 151 disposed on the first connection part 131a and a second insulating layer 151 disposed on the second connection part 132a. An insulating layer 152 may be included.

The first and second insulating layers 151 and 152 are disposed on the first and second connection portions 131a and 132a to prevent oxidation of Cu included in the first and second base electrode layers 131 and 132 and to form a stacked structure. It can serve to improve the bending strength of the electronic component 102 .

The first insulating layer 151 may be disposed on the first connection part 131a and extend onto the third band part 131c, and the second insulating layer 152 may be disposed on the second connection part 132a. It may be disposed on the fourth band portion 132c and extended onto the fourth band portion 132c. Accordingly, the bending strength and sealing characteristics of the multilayer electronic component 102 may be further improved. In order to significantly improve the sealing characteristics of the multilayer electronic component 102, the first insulating layer 151 is disposed to cover the end of the third band portion 131c, and the second insulating layer 152 is disposed to cover the fourth band portion. It is preferably arranged to cover the end of (132c), but is not limited thereto.

The first and second insulating layers 151 and 152 can improve sealing characteristics and flexural strength of the multilayer electronic component 102 to protect the multilayer electronic component 102 from tensile stress caused by external heat or vibration. It can be made of a material with sufficient strength. For example, the first and second insulating layers 151 and 152 may include at least one material selected from materials such as epoxy resin, acrylic resin, and ethyl cellulose, or may further include glass.

In addition, the first and second insulating layers 151 and 152 may include a single component or a plurality of components, and preferably have a bonding force with the body 110 or the first and second base electrode layers 131 and 132. At least one selected from TiO ₂ , BaTiO ₃ , Al ₂ O ₃ , SiO ₂ , BaO, and the like may be included as an additive to improve performance.

Methods of forming the first and second insulating layers 151 and 152 may vary depending on components and purposes. For example, after forming a coating film using an insulating paste using a squeegee, the first and second base electrode layers 131 and 132 are disposed on the body 110, each section is sequentially immersed, and then dried. can In addition, it may be formed by sol-gel processing, chemical vapor deposition (CVD), atomic layer deposition (ALD), etc., but is not limited thereto, and a thin and uniform insulating layer It can also be formed in other ways that can be formed.

Meanwhile, components of the first and second insulating layers 151 and 152 may be calculated from an image observed using a scanning electron microscope (SEM-EDS)-energy dispersive X-ray spectroscopy (SEM-EDS). Specifically, after polishing the multilayer electronic component to a central position in the width direction (third direction) to expose longitudinal and thickness direction cross sections (L-T cross sections), the first and second insulating layers 151 and 152 are formed in thickness or The type of each element included in the first and second insulating layers 151 and 152 and the content relative to 100 at% of the total elements can be measured using EDS in the area disposed in the center among the areas divided into 5 parts in the longitudinal direction. there is. In addition, the type of resin included in the insulating layer can be distinguished using a gas chromatograph-mass spectrometer (GC-MS) analysis.

In an exemplary embodiment, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 may satisfy td > 2*te. That is, according to an embodiment, the average thickness td of the dielectric layer 111 may be greater than twice the average thickness te of the internal electrodes 121 and 122 .

In general, a reliability problem caused by a decrease in dielectric breakdown voltage under a high voltage environment is a major issue in high voltage electronic components. In the multilayer electronic component according to an embodiment, the average thickness td of the dielectric layer 111 is greater than twice the average thickness te of the internal electrodes 121 and 122 in order to prevent a decrease in dielectric breakdown voltage under a high voltage environment. Further, by increasing the thickness of the dielectric layer, which is the distance between the internal electrodes, it is possible to improve the breakdown voltage characteristics. When the average thickness (td) of the dielectric layer 111 is less than twice the average thickness (te) of the internal electrodes 121 and 122, the thickness of the dielectric layer, which is the distance between the internal electrodes, is thin and the breakdown voltage may be reduced. .

An average thickness te of the internal electrode may be less than 1 μm, and an average thickness td of the dielectric layer may be less than 2.8 μm, but are not necessarily limited thereto.

The average thickness (td) of the dielectric layer 111 and the average thickness (te) of the internal electrodes are obtained from images of cross sections in the length and thickness directions (L-T) of the body 110 with a scanning electron microscope (SEM) at a magnification of 10,000. can be measured by scanning. More specifically, an average value may be measured by measuring the thickness of an electrode inside one dielectric layer in the scanned image at 30 equally spaced points in the longitudinal direction. The 30 equally spaced points may be designated in the capacitance forming unit Ac. In addition, if the average value is measured by extending the average value measurement to 10 dielectric layers and internal electrodes, the average thickness of the dielectric layer and the average thickness of the internal electrode can be further generalized.

9 is a cross-sectional view illustrating a multilayer electronic component 103 according to an exemplary embodiment.

Referring to FIG. 9 , in the multilayer electronic component 103 according to an exemplary embodiment, the size of the body 110 in the second direction is L, and the first band portion 131b′ is formed from the extension line E3 of the third surface. When the average size in the second direction up to the end of is B1 and the average size in the second direction from the extension line E4 of the fourth surface to the end of the second band portion 132b' is B2, 0.2≤B1 /L≤0.4 and 0.2≤B2/L≤0.4 may be satisfied.

When B1/L and B2/L are less than 0.2, it may be difficult to secure sufficient bonding strength. On the other hand, when B2/L is greater than 0.4, there is a concern that leakage current may occur between the first electrode layer 141 and the second electrode layer 142 under a high voltage, and the first electrode layer may be spread due to conductive adhesive during mounting. 141 and the second electrode layer 142 may be electrically connected.

B1, B2, and L may be values measured in cross sections (L-T cross sections) obtained by cutting the body 110 in the first and second directions from the central portion in the third direction. In particular, the size L of the body 110 in the second direction may correspond to the size between the extension line E3 of the third surface and the extension line E4 of the fourth surface in the second direction.

Referring to FIG. 9 , a multilayer electronic component 103 according to an embodiment is disposed on the first surface 1, and additionally disposed between the first electrode layer 141 and the second electrode layer 142. An insulating layer 160 may be further included. Accordingly, leakage current that may occur between the first electrode layer 141 and the second electrode layer 142 under a high-voltage current may be prevented.

The type of the additional insulating layer 160 is not particularly limited. For example, the additional insulating layer 160 may include an epoxy resin like the first and second insulating layers 151 and 152 . However, the material of the additional insulating layer 160 is not necessarily limited to the same material as the first and second insulating layers 151 and 152, and may be formed of a different material.

Referring to FIG. 9 , the first base electrode layer 131' of the multilayer electronic component 103 according to an exemplary embodiment includes a first connection portion 131a', a first band portion 131b', and a third band portion 131c'. ), and the second base electrode layer 132′ may include a second connection portion 132a′, a second band portion 132b′, and a fourth band portion 132c′. In this case, the first and second band portions 131b′ and 132b′ may be longer in the second direction than the third and fourth band portions 131c′ and 132c′. Accordingly, it is possible to improve the capacity per unit volume by reducing the specific gravity occupied by the base electrode layers 131′ and 132′ in the multilayer electronic component 103 while improving the bonding strength of the multilayer electronic component 103 by securing a mounting area. .

10 is a cross-sectional view of a multilayer electronic component 104 according to an exemplary embodiment.

Referring to FIG. 10 , the first base electrode layer 131″ of the multilayer electronic component 104 according to an embodiment includes a first connection part 131a and a first band part 131b, and a second base electrode layer ( 132``) may include a second connection part 132a and a second band part 132b. That is, unlike the multilayer electronic component 100, it may have an L shape not including the third and fourth band portions 131c and 132c. Accordingly, the capacity per unit volume of the multilayer electronic component 104 can be further improved by minimizing the specific gravity occupied by the first and second base electrode layers 131 ″ and 132 ″.

11 is a perspective view illustrating a multilayer electronic component 200 according to an exemplary embodiment.

FIG. 12 is a bottom perspective view of the multilayer electronic component according to FIG. 11 .

13 is a III-III′ cross-sectional view of FIG. 11 .

14 is a schematic cross-sectional view of a substrate 2000 on which stacked electronic components are mounted according to an embodiment of the present invention.

Hereinafter, a multilayer electronic component 200 according to an exemplary embodiment of the present invention will be described with reference to FIGS. 11 to 14 . However, content overlapping with the stacked electronic components 100, 101, 102, 103, and 104 according to an embodiment and various embodiments of the present invention may be omitted to avoid redundant description.

The multilayer electronic component 200 according to an embodiment of the present invention includes a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and includes first and second surfaces facing in a first direction; A body including third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction ( 110); a first connection electrode 231 disposed on the third surface; a second connection electrode 232 disposed on the fourth surface; a first band electrode 241 disposed on the first surface and connected to the first connection electrode; and a second band electrode 242 disposed on the first surface and connected to the second connection electrode. Including, the first and second connection electrodes may include Cu, the first and second band electrodes may include Ag.

The first connection electrode 231 is disposed on the third surface 3 and connected to the first internal electrode 121, and the second connection electrode 232 is disposed on the fourth surface 4 to provide a second internal electrode 231. It may be connected to the electrode 122 .

The first connection electrode 231 includes a first connection part 231a disposed on the third surface 3 and a corner connecting the first surface 1 and the third surface 3 from the first connection part ( C1), the second connection electrode 232 includes a second connection part 232a disposed on the fourth surface, and a second connection part 232a extending from the second connection part to the first surface. (1) and the fourth surface (4) may include a second corner portion (232b) disposed at the corner (C2) connecting.

Conventionally, when forming external electrodes, a method of dipping the surface of the body where internal electrodes are exposed using a paste containing a conductive metal has been mainly used. However, the thickness of the external electrode formed by the dipping method may be too thick at the central portion in the thickness direction. In addition, even if the thickness imbalance of the external electrodes according to the dipping method is not a problem, since the internal electrodes are exposed through the third and fourth surfaces of the body, in order to suppress penetration of moisture and plating solution through the external electrodes, the third and fourth electrodes are exposed. The external electrodes disposed on the four surfaces were formed to have a certain thickness or more.

The connection electrodes 231 and 232 according to an embodiment of the present invention may have a uniform and thinner thickness than external electrodes formed by a conventional dipping method.

The connection electrodes 231 and 232 may be formed, for example, by transferring a sheet containing a conductive metal or an organic material such as a binder to the third and fourth surfaces, but is not limited thereto, and the conductive metal It can be formed by plating on the third and fourth surfaces. That is, the connection electrodes 231 and 232 may be a fired layer obtained by firing a conductive metal or a plated layer.

The thickness of the connection electrodes 231 and 232 is not particularly limited, but may be, for example, 2 μm to 7 μm. Here, the thickness of the connection electrodes 231 and 232 may mean the maximum thickness and may mean the size of the connection electrodes 231 and 232 in the second direction.

The first and second connection electrodes 231 and 232 may include Cu. Cu has an advantage of excellent electrical connectivity with the metal included in the internal electrodes 121 and 122.

Meanwhile, the first and second connection electrodes 231 and 232 may include another metal having Cu as a main component and excellent electrical conductivity as another material. For example, at least one of Ni, Pd, Ag, Sn, Cr, and alloys thereof may be further included.

Meanwhile, in order to improve adhesion to the body 110 and improve density, the first and second connection electrodes 231 and 232 may further include glass.

The first and second band electrodes 241 and 242 may be disposed on the first surface 1 of the body 110 . The first and second band electrodes 241 and 242 may be electrically connected to the first and second internal electrodes 121 and 122 by contacting the first and second connection electrodes 231 and 232 , respectively.

External electrodes formed by the conventional dipping method are formed thickly on the third and fourth surfaces and partially extended to the first, second, fifth, and sixth surfaces, so it is difficult to secure a high effective volume ratio. There was a problem.

On the other hand, according to an embodiment of the present invention, the first and second connection electrodes 231 and 232 are disposed on the exposed surface of the internal electrode, and the first and second band electrodes 241 are disposed on the surface mounted on the substrate. , 242), it is possible to secure a high effective volume ratio.

Meanwhile, when the internal electrodes 121 and 122 are stacked in the first direction, the stacked electronic component 200 may be horizontally mounted on the substrate so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to the case of horizontal mounting, and when the internal electrodes 121 and 122 are stacked in the third direction, the internal electrodes 121 and 122 are perpendicular to the mounting surface. can be installed

The first and second band electrodes 241 and 242 may include Ag. For example, the first and second band electrodes 241 and 242 may be firing electrodes containing Ag and glass, and a method of applying a paste containing Ag and glass to the first surface of the body is used. However, it is not limited thereto, and may be an Ag plating layer in which Ag is plated on the first surface of the body.

In one embodiment of the present invention, by making the first and second band electrodes 241 and 242 contain Ag, bonding force with the conductive adhesives 271 and 272 containing a conductive metal and resin is improved and the substrate 280 and Adhesion strength between the stacked electronic components 200 may be improved.

Since the first and second band electrodes 241 and 242 include Ag having a higher standard reduction potential than Cu included in the first and second connection electrodes 231 and 232, the first and second connection electrodes 231 , 232) and can play a role in preventing the penetration of moisture.

In addition, since the multilayer electronic component 200 can be mounted on the board 280 by a conductive adhesive containing a conductive metal and resin, solder cracks occur due to a difference in thermal expansion coefficient between the external electrode and the solder in the high-low temperature cycle. can solve the problem.

However, when the first and second band electrodes 241 and 242 containing Ag are formed on the first and second connection electrodes 231 and 232, Ag ion migration occurs along the surface of the body 110. can This may cause deterioration of insulation resistance due to current leakage of the multilayer electronic component 200 and a short circuit between the connection electrodes 231 and 232 having different polarities.

Since Ag ion migration occurs on the surface of the body 110 between the external electrodes of the multilayer electronic component, the insulation layer on the surface of the body 110 is destroyed due to current leakage, thereby increasing the insulation resistance of the multilayer electronic component 200. This may cause deterioration and may cause a short between electrodes, thereby having a fatal effect on the reliability of the multilayer electronic component 200 .

As described above, Ag ion migration tends to occur more strongly as the distance from the mounting surface of the multilayer electronic component 200 increases.

Therefore, in one embodiment, the first and second band electrodes 241 and 242 including Ag are disposed on the first surface of the body 110 and the area is controlled to minimize the occurrence of Ag ion migration while forming a stacked structure. Reliability of the electronic component 200 in a high temperature and high humidity environment is to be secured.

According to one embodiment of the present invention, the first and second connection electrodes 231 and 232 containing Cu are disposed on the third surface 3 and the fourth surface 4 of the body 110, respectively, to conduct electrical conduction. , and the first and second band electrodes 241 and 242 containing Ag are disposed on the first surface to be mounted on the substrate 280 through conductive adhesives 271 and 272 containing conductive metal and resin. possible.

In addition, since the first and second band electrodes 241 and 242 containing Ag are disposed on the first surface, Ag ion migration on the surface of the body 110 of the multilayer electronic component 200 can be suppressed. there is.

As described above, since Ag ion migration tends to occur more strongly from the mounting surface of the multilayer electronic component 200 to the opposite direction to the mounting surface, the effect of suppressing the Ag ion migration is the first and second band electrodes. It can be made more pronounced by placing (241, 242) on the first side.

On the other hand, as described above, when the first and second band electrodes 241 and 242 are made of only Ag, when Ag is partially condensed in the band electrode, or when the content of Ag is excessive, Ag ion migration This can happen more strongly.

In one embodiment, the first and second connection electrodes 231 and 232 may further include glass, and the first and second band electrodes 241 and 242 may further include glass and palladium (Pd). .

Accordingly, both the connection electrodes 231 and 232 and the band electrodes 241 and 242 include glass to improve adhesion, and the first and second band electrodes 241 and 242 further contain palladium (Pd). In this case, since Ag and Pd form an isomorphous form, migration of Ag ions can be effectively suppressed. In addition, since the standard reduction potential of Pd (+0.915V) is higher than that of Ag (0.80V), oxidation of the first and second connection electrodes 231 and 232 can be more effectively prevented.

In this case, the content of Pd included in the first and second band electrodes 241 and 242 may be 1 mole or more and 5 moles or less relative to 100 moles of Ag.

When the content of Pd is less than 1 mol with respect to 100 mol of Ag, it is difficult to form a full solid solution with Ag sufficiently, and the effect of suppressing Ag ion migration may be insufficient.

On the other hand, when the content of Pd is greater than 5 moles relative to 100 moles of Ag, since the sintering driving force of Pd is generally higher than that of Ag, there is a concern that blisters and radiation cracks may occur due to the difference in sintering driving force, and manufacturing cost this may increase

In one embodiment, the first connection electrode 231 is disposed on the third surface 3 and includes a first connection part 231a connected to the first internal electrode 121 and the first connection part 231a from the first connection part. and a first corner portion 231b extending from the corner C1 connecting the first and third surfaces, and the second connection electrode 232 is disposed on the fourth surface and connects the first internal electrode and It includes a second connecting portion 232a connected and a second corner portion 232b extending from the second connecting portion to a corner C2 connecting the first and fourth surfaces, and the first band electrode 241 may be disposed to extend to cover at least a portion of the first corner portion, and the second band electrode 242 may be disposed to extend to cover at least a portion of the second corner portion. Accordingly, electrical conduction may be secured by connecting the first and second connection electrodes 231 and 232 connected to the internal electrodes 121 and 122 to the first and second band electrodes 241 and 242, respectively. Since the area where the first and second band electrodes 241 and 242 are disposed can be minimized, the occurrence of migration of Ag ions can be effectively suppressed.

Referring to FIG. 14 , in a substrate 2000 on which a multilayer electronic component 200 is mounted according to an embodiment of the present invention, the first and second band electrodes 241 and 242 of the multilayer electronic component 200 are provided on the substrate ( 280) may be bonded to the electrode pads 291 and 292 disposed on the conductive adhesives 271 and 272.

Since the first and second band electrodes 241 and 242 contain Ag, electrical conduction can be secured between the band electrodes 241 and 242 and the conductive adhesives 271 and 272, and the conductive adhesives 271 and 272 The included resin is cured to secure adhesion with the substrate 280 .

In addition, unlike the conventional case of mounting multilayer electronic components on a board using solder containing tin (Sn), the first and second band electrodes 241 and 242 and the conductive adhesives 271 and 272 are removed even in a high-low temperature cycle. ), it is possible to improve the bonding strength of the multilayer electronic component 200 by mitigating the thermal shock applied to the layered electronic component 200 .

Components and effects of the conductive adhesives 271 and 272 of the substrate 2000 on which the multilayer electronic component 200 according to an embodiment of the present invention is mounted are the components and effects of the multilayer electronic component 100 according to an embodiment of the present invention. It may be the same as the conductive adhesives 171 and 172 used for the mounted substrate 1000 .

15 is a cross-sectional view illustrating a multilayer electronic component 201 according to an exemplary embodiment.

When the multilayer electronic component 201 is mounted using the conductive adhesives 271 and 272 containing conductive metal and resin, the conductive adhesives 271 and 272 and the first and second band electrodes ( 241, 242) needs to secure a sufficient contact area.

Referring to FIG. 15 , the first band electrode 241 of the multilayer electronic component 201 according to an exemplary embodiment extends and covers at least a portion of the first connector 231a, and the second band electrode 242 may extend and cover at least a portion of the second connection portion 232a. Accordingly, by sufficiently securing a contact area between the conductive adhesives 271 and 272 and the first and second band electrodes 241 and 242, the bonding strength of the multilayer electronic component 201 may be improved.

In an embodiment, the first direction average size TB2 from the lowest point in the first direction to the highest point in the first direction of the first and second band electrodes 241 and 242 may be greater than or equal to 10 μm and less than or equal to 40 μm. When the TB2 is less than 10 μm, the first and second band electrodes 241 and 242 may not sufficiently cover the first and second corner portions 231b and 232b, making it difficult to secure sufficient electrical connectivity. When TB2 exceeds 40 μm, the first and second band electrodes 241 and 242 are excessively formed on the first and second connectors 231a and 232a, making it difficult to suppress Ag ion migration.

From a similar point of view, in one embodiment, the average size in the first direction from the first surface 1 to the internal electrode disposed closest to the first surface among the first and second internal electrodes 121 and 122 H1, the average size in the first direction from the extension line E1 of the first surface to the ends of the first and second band electrodes 241 and 242 disposed on the first and second connectors 231a and 232a. When H2, H1≥H2 can be satisfied. That is, by disposing the first and second band electrodes 241 and 242 in an area below the first and second internal electrodes 121 and 122 disposed at the lowermost end, Ag ion migration is effectively suppressed while securing sufficient electrical connectivity. can do.

On the other hand, the average size TB2 in the first direction from the lowest point in the first direction to the highest point in the first direction of the first and second band electrodes 241 and 242 is the body 110 at the center in the third direction. It may be an average value of values measured from the side of the first band electrode 241 and values measured from the side of the second band electrode 242 in the cross section (L-T cross section) cut in the first and second directions.

16 is a cross-sectional view of a multilayer electronic component 202 according to an exemplary embodiment.

Referring to FIG. 16 , in the multilayer electronic component 202 according to an exemplary embodiment, an inner portion of the first and second internal electrodes 121 and 122 disposed closest to the first surface 1 is disposed closest to the first surface 1 . The first and second band electrodes 241 and 242 disposed on the first and second connectors 231a and 232a from H1, the average size in the first direction up to the electrode, from the extension line E1 of the first surface Assuming that the average size in the first direction to the end is H2, H1<H2 may be satisfied.

As described above, since the corner of the body 110 is a region where shrinkage occurs during the firing process, the dielectric microstructure is not dense and may be a main path for moisture penetration. According to the multilayer electronic component 202 according to an exemplary embodiment, by disposing the first and second band electrodes 241 and 242 above the lowermost internal electrode among the first and second internal electrodes 121 and 122, Moisture permeation through the corner of the body can be prevented more reliably, so that the moisture resistance reliability of the multilayer electronic component 202 can be improved.

On the other hand, as described above, Ag ion migration tends to occur more strongly from the mounting surface of the multilayer electronic component 202 toward the opposite direction to the mounting surface. Therefore, when the first and second band electrodes 241 and 242 including Ag are formed to extend further in the first direction of the body 110, the first and second band electrodes 241 and 242 are formed on the body 110 ), the effect of suppressing the occurrence of Ag ion migration may not be sufficient. At this time, when T is the size of the body in the first direction, by satisfying H2<T/2, the first and second band electrodes 241 and 242 containing Ag are not excessively formed in the first direction. It is possible to sufficiently secure the effect of suppressing the occurrence of Ag ion migration. That is, H1, H2, and T may satisfy H1<H2<T/2.

H1 and H2 may be average values of values measured in cross sections (L-T cross sections) obtained by cutting the body 110 in the first and second directions from the central portion in the third direction. H1 may be an average value of values measured at arbitrary points in the second direction between the first surface 1 and the internal electrode disposed closest to the first surface 1 in the cross section, and H2 is a value obtained at the connection It may be a value measured based on the end of the disposed band electrode, and may be an average value of a value measured at the first band electrode 241 side and a value measured at the second band portion 242 side. In this case, the extension line E1 of the first surface serving as a reference when measuring H1 and H2 may be the same.

17 is a cross-sectional view of a multilayer electronic component 203 according to an exemplary embodiment.

Referring to FIG. 17 , the multilayer electronic component 203 according to an exemplary embodiment may include a first insulating layer disposed on the first connection electrode and a second insulating layer disposed on the second connection electrode. .

The first and second insulating layers 251 and 252 are disposed on the first and second connection electrodes 231 and 232 to prevent oxidation of Cu included in the first and second connection electrodes 231 and 232, and It may serve to improve the bending strength of the multilayer electronic component 203 .

The first insulating layer 251 is disposed on the first connection part 231a to contact the first band electrode 241, and the second insulating layer 252 is disposed on the second connection part 232a. It can be in contact with the second band electrode 242. Accordingly, the bending strength and sealing characteristics of the multilayer electronic component 203 may be further improved. In order to significantly improve the sealing characteristics of the multilayer electronic component 203, it is preferable that the first and second insulating layers 251 and 252 extend to a portion of the first surface 1, but are not limited thereto.

Meanwhile, components and forming methods of the first and second insulating layers 251 and 252 may be the same as those of the first and second insulating layers 151 and 152 of the multilayer electronic component 102 according to the above-described embodiment. can

18 is a cross-sectional view of a multilayer electronic component 204 according to an exemplary embodiment.

Referring to FIG. 18 , in the multilayer electronic component 204 according to an embodiment, the size of the body in the second direction is L, and the average in the second direction from the extension line of the third surface to the end of the first band electrode When the size is B1 and the average size in the second direction from the extension line of the fourth surface to the end of the second band electrode is B2, 0.2≤B1/L≤0.4 and 0.2≤B2/L≤0.4 may be satisfied. there is.

When B1/L and B2/L are less than 0.2, it may be difficult to secure sufficient bonding strength. On the other hand, when B2/L is greater than 0.4, there is a concern that leakage current may occur between the first band electrode 241 and the second band electrode 242 under a high voltage, and it is prevented by spreading of the conductive adhesive during mounting. There is a possibility that the first band electrode 241 and the second band electrode 242 are electrically connected.

B1, B2, and L may be values measured in cross sections (L-T cross sections) obtained by cutting the body 110 in the first and second directions from the central portion in the third direction. In particular, the size L of the body 110 in the second direction may correspond to the size between the extension line E3 of the third surface and the extension line E4 of the fourth surface in the second direction.

Referring to FIG. 18 , in one embodiment, the multilayer electronic component 204 is disposed on the first surface, and additional insulation disposed between the first band electrode 241 and the second band electrode 242 A layer 260 may be further included. Accordingly, leakage current that may occur between the first band electrode 241 and the second band electrode 242 under a high-voltage current may be prevented.

19 is an exploded perspective view illustrating a multilayer electronic component 300 according to an exemplary embodiment.

FIG. 20 is a sectional view IV-IV′ of FIG. 19 .

21 is a cross-sectional view of a multilayer electronic component 301 according to an exemplary embodiment.

22 schematically illustrates a cross-sectional view of a board 3000 on which stacked electronic components according to an exemplary embodiment are mounted.

Hereinafter, a multilayer electronic component 300 according to an exemplary embodiment and a multilayer electronic component 301 according to an exemplary embodiment will be described with reference to FIGS. 19 to 22 . However, contents overlapping with the stacked electronic components 100, 101, 102, 103, and 104 according to an embodiment and various embodiments of the present invention may be omitted to avoid redundant description.

19 and 20, the multilayer electronic component 300 according to an embodiment of the present invention includes a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, and face each other in a first direction. first and second surfaces to see, third and fourth surfaces connected to the first and second surfaces and facing in the second direction, fifth and fourth surfaces connected to the first to fourth surfaces and facing in the third direction; A body 110 including a sixth face; A first connection part 331a disposed on the third surface and connected to the first internal electrode, a first band part 331b disposed extending from the first connection part to a part of the first surface, and the first connection part a first base electrode layer 331 including a third band portion 331c extending from the second surface to a portion of the second surface; A second connector 332a disposed on the fourth surface and connected to the second internal electrode, a second band portion 332b disposed to extend from the second connector to a part of the first surface, and a second base electrode layer 332 including a fourth band portion 332c extending to a portion of the second surface; a first electrode layer 341 disposed on the first connection portion; a second electrode layer 342 disposed on the second connection portion; a first metal frame 361 disposed on the first electrode layer; a second metal frame 362 disposed on the second electrode layer; and conductive connection portions 351 and 352 disposed between the first electrode layer and the first metal frame and between the second electrode layer and the second metal frame, respectively, and including Ag and resin; Including, the first and second base electrode layers may include Cu, the first and second electrode layers may include Ag.

The first base electrode layer 331 is disposed on the third surface 3 and includes a first connection portion 331a connected to the first internal electrode 121, and a first connection portion 331a connected to the first surface 1 from the first connection portion. It may include a first band portion 331b extending to a portion and a third band portion 331c extending to a portion of the second surface 2 from the first connection portion, and the second base electrode layer 332 ) is a second connector 332a disposed on the fourth surface 4 and connected to the second internal electrode 122, extending from the second connector to a portion of the first surface 1 It may include a second band part 332b and a fourth band part 332c disposed to extend from the second connection part to a part of the second surface 2 .

In addition, the first base electrode layer 331 may include a first side band portion extending from the first connection portion 331a to portions of the fifth and sixth surfaces 5 and 6, and the second base electrode layer 332 may include a second side band portion extending from the second connection portion 332a to portions of the fifth and sixth surfaces.

However, the third band unit, the fourth band unit, the first side band unit, and the second side band unit may not be essential elements in the present invention. That is, the first base electrode layer 331 includes the first connection part 331a and the first band part 131b, and the second base electrode layer 332 includes the second connection part 332a and the second band part 332b. , and the first and second base electrode layers 331 and 132 may not be disposed on the second surface 2, nor may they be disposed on the fifth surface 5 and the sixth surface 6. there is.

The first and second base electrode layers 331 and 332 may include Cu. Cu has an excellent electrical connection with the metal included in the internal electrodes 121 and 122 .

Meanwhile, the first and second base electrode layers 331 and 332 may include Cu as a main component and other metals having excellent electrical conductivity as other materials. For example, at least one of Ni, Pd, Ag, Sn, Cr, and alloys thereof may be further included.

The first and second base electrode layers 331 and 332 may be firing electrodes containing Cu and glass or resin-based electrodes containing Cu and resin.

In addition, the first and second base electrode layers 331 and 332 may have a form in which a fired electrode and a resin-based electrode are sequentially formed on the body. In addition, the first and second base electrode layers 331 and 332 may be formed by transferring a sheet containing Cu onto the body or by transferring a sheet containing Cu onto a fired electrode.

According to an embodiment of the present invention, the first and second base electrode layers 331 and 332 may include Cu to improve electrical connectivity with the internal electrodes 121 and 122 . Meanwhile, in order to improve adhesion to the body 110 and improve density, the first and second base electrode layers 331 and 332 may further include glass.

The first and second electrode layers 341 and 342 are respectively disposed on the first and second connection portions 331a and 332a. The first electrode layer 341 is disposed on the first connection portion 331a and the second electrode layer 342 is disposed on the second connection portion 332a and may include silver (Ag). Accordingly, even if the first and second base electrode layers contain Cu, oxidation of Cu may be prevented by blocking external exposure of the first and second connectors 331a and 332a.

In the prior art, an attempt has been made to form an electrode layer containing Ag on a base electrode layer containing Cu in order to secure reliability of a multilayer electronic component at high temperature and high pressure. In this case, migration of Ag ions may occur along the surface of the body 110 due to external moisture, and deterioration of insulation resistance and short circuit between external electrodes may occur due to current leakage.

In particular, such Ag ion migration mainly occurs in a region adjacent to the end of the band portion of the external electrode where the electrode layer containing Ag contacts the surface of the body 110 . In addition, since the multilayer electronic component 300 is mounted on the board 380 through the metal frames 361 and 362, unlike the case where the multilayer electronic component is mounted on the board without a metal frame, the mounting surface of the body is not exposed to the external environment. As it is easy, Ag ion migration can easily occur even on the mounting surface of the body.

Therefore, in one embodiment of the present invention, the arrangement area of the first and second electrode layers 341 and 342 disposed on the connection parts 331a and 332a is adjusted and an appropriate distance from the band parts 331b, 331c, 332b and 332c is maintained. Therefore, it is intended to suppress the occurrence of Ag ion migration.

According to one embodiment of the present invention, the first and second electrode layers 341 and 342 containing Ag are disposed on the first and second connection parts 331a and 332a of the base electrode layer containing Cu, respectively, so that the connection part Ag ion migration can be effectively suppressed while oxidation of the layers 331a and 332a is prevented, so that deterioration of the insulation resistance of the multilayer electronic component 300 and occurrence of a short circuit can be suppressed.

When the first and second electrode layers 341 and 342 including Ag are disposed on the connection parts 331a and 332a, and a conductive adhesive is formed on the band parts 331b, 331c, 332b and 332c for mounting on a substrate, Due to oxidation of Cu included in the regions of the band portions 331b, 331c, 332b, and 332c that are not covered by the first and second electrode layers 341 and 342, adhesion strength may decrease during mounting.

In one embodiment of the present invention, the first metal frame 361 is disposed on the first electrode layer 341 and the second metal frame 362 is disposed on the second electrode layer 342, so that the metal frame 361 , 362) may be adhered to the electrode pads 391 and 392 of the substrate through the conductive adhesives 371 and 372 to prevent a decrease in bonding strength due to oxidation of the band portion.

In one embodiment, the first and second electrode layers 341 and 342 may further include one or more of palladium (Pd), platinum (Pt), and gold (Au). Accordingly, the occurrence of Ag ion migration can be more suppressed than when the first and second electrode layers 341 and 342 contain only silver (Ag).

In one embodiment, the first and second base electrode layers 331 and 332 may further include glass, and the first and second electrode layers 341 and 342 may further include glass and palladium (Pd).

Accordingly, when both the base electrode layers 331 and 332 and the electrode layers 341 and 342 include glass, adhesion may be improved, and the first and second electrode layers 341 and 342 further include palladium (Pd). , Since Ag and Pd form an isomorphous, Ag ion migration can be effectively suppressed. In addition, since the standard reduction potential of Pd (+0.915V) is higher than that of Ag (0.80V), oxidation of the first and second base electrode layers 331 and 332 can be more effectively prevented.

In this case, the content of Pd included in the first and second electrode layers 341 and 342 may be 1 mole or more and 5 moles or less relative to 100 moles of Ag.

When the content of Pd is less than 1 mol with respect to 100 mol of Ag, it is difficult to form a full solid solution with Ag sufficiently, and the effect of suppressing Ag ion migration may be insufficient.

On the other hand, when the content of Pd is greater than 5 moles relative to 100 moles of Ag, since the sintering driving force of Pd is generally higher than that of Ag, there is a concern that blisters and radiation cracks may occur due to the difference in sintering driving force, and manufacturing cost this may increase

The metal frames 361 and 362 may serve to prevent thermal and mechanical stress from the board from being directly transmitted to the multilayer ceramic capacitor by securing a gap between the multilayer electronic component 300 and the mounting board 380 . In particular, in the case of the multilayer electronic component 300 including an electrode layer including Ag, as in one embodiment of the present invention, since it can be used in a high-temperature, high-pressure, and high-vibration environment, its effect can be more remarkable.

The first metal frame 361 may be disposed on the first electrode layer 341 , and the second metal frame 362 may be disposed on the second electrode layer 342 . In the multilayer electronic component 300 according to an embodiment of the present invention, first and second metal frames 361 and 362 are disposed on a substrate 380 through conductive adhesives 371 and 372, and electrode pads 391, 392) to form a substrate 3000 on which the multilayer electronic component 300 is mounted.

A material forming the metal frames 361 and 362 is not particularly limited as long as it can absorb external impact and strongly support the multilayer electronic component 300 . In one embodiment, the first and second metal frames may include one or more of Ni, Fe, Cu, Ag, Cr, and alloys thereof.

The conductive connection parts 351 and 352 may be disposed between the first electrode layer 341 and the first metal frame 361 and between the second electrode layer 342 and the second metal frame 362, and may provide adhesive strength between the electrode layer and the metal frame. can play a role in improving

The conductive connection parts 351 and 352 may include a conductive material to secure electrical connectivity, absorb vibration transmitted from the outside and secure adhesive strength between the electrode layers 341 and 342 and the metal frames 361 and 362. resin may be included.

More preferably, Ag may be included as a conductive material to further improve electrical connectivity with the electrode layers 341 and 342 including Ag, and resistance to thermal shock may be improved by including epoxy resin as a resin.

In one embodiment, the first electrode layer 341 extends from the first connection portion 331a to a portion of the first and third band portions 331b and 331c, and the second electrode layer 342 is It may be disposed to extend from the second connection portion 332a to a portion of the second and fourth band portions 332b and 332c. Accordingly, the electrode layer including Ag may be disposed to cover the corner of the body vulnerable to external moisture permeation, thereby improving the moisture resistance reliability of the multilayer electronic component 300 .

Meanwhile, when the first and second electrode layers 341 and 342 include side band portions extending from the first and second connection portions 341a and 342a to portions on the fifth and sixth surfaces, the first and second electrode layers 341 and 342 include the first And the second electrode layers 341 and 242 extend to a portion of the side band portion, thereby further improving moisture resistance reliability of the multilayer electronic component 300 .

Meanwhile, when the first and second electrode layers 341 and 342 are disposed to cover the band portions 331b, 331c, 332b, and 332c of the base electrode layers 331 and 332, the first and second electrode layers 341 and 342 may contact the surface of the silver body 110 . When the multilayer electronic component 300 is operated in a high temperature and high humidity state, the possibility of condensation on the surface of the body 110 increases, so the first and second electrode layers 341 and 342 containing Ag are When in contact with the surface, there is a concern of accelerating the occurrence of Ag ion migration.

Therefore, in one embodiment, the first electrode layer 341 is disposed so as not to cover the ends of the first and third band portions 331b and 331c, and the second electrode layer 341 is the second and fourth band portions. By disposing not to cover the ends of (332b, 332c), the acceleration of Ag ion migration can be suppressed.

In one embodiment, the second direction average size LB from the end where the first electrode layer 341 and the conductive connection part 351 meet to the end of the first and third band parts 331b and 331c and the first An average size LB in the second direction from the end where the second electrode layer 342 and the conductive connection part 252 meet to the end of the second and fourth band parts 332b and 332c may be 0.1 μm or more and 0.58 μm or less. If the LB is less than 0.1 μm, it may not be possible to sufficiently cover the corner of the body vulnerable to external moisture penetration, making it difficult to secure sufficient moisture resistance reliability. If the LB exceeds 0.58 μm, the body 110 and the first and second electrode layers ( 341 and 342), it may be difficult to suppress a phenomenon in which Ag ion migration is accelerated due to the close distance. According to an exemplary embodiment, the average length between the band portions 331b, 331c, 332b, and 332c of the base electrode layer from the end where the electrode layers 341 and 342 and the conductive connection portions 351 and 352 meet is appropriately adjusted in the second direction so that the multilayer electronic component (300), it is possible to suppress a phenomenon in which Ag ion migration is accelerated while ensuring sufficient moisture resistance reliability.

The second direction average size LB from the end where the first electrode layer 341 and the conductive connection part 351 meet to the end of the first and third band parts 331b and 331c and the second electrode layer 342 and the second direction average size LB from the end where the conductive connection part 252 meets to the end of the second and fourth band parts 332b and 332c is the body 110 at the center in the third direction in the first and fourth direction. It may be a value measured from a cross section (L-T cross section) cut in the second direction, and may be an average value of values measured from the side of the first base electrode layer 331 and values measured from the side of the second base electrode layer 332.

Referring to FIG. 21 , the first electrode layer 341′ of the multilayer electronic component 301 according to an exemplary embodiment may be disposed between the extension line E1 of the first surface and the extension line E2 of the second surface. can Accordingly, by not disposing the first and second electrode layers 341′ and 342′ including Ag on the band portions 331b, 331c, 332b, and 332c of the base electrode layers 331 and 332, the first and second electrode layers ( 341', 342') and the body 110, the occurrence of Ag ion migration can be more effectively suppressed by securing a sufficient distance.

At this time, the conductive adhesives 351' and 352' disposed between the first electrode layer 341' and the first metal frame 261 and between the second electrode layer 342' and the second metal frame 262 are also It may be disposed between the extension line E1 of the first surface and the extension line E2 of the second surface. Accordingly, since the conductive adhesives 351' and 352' can be applied to a minimum, Ag migration can be more reliably suppressed, and manufacturing costs can be reduced.

Referring to FIG. 22 , a substrate 3000 on which a multilayer electronic component 300 according to an embodiment of the present invention is mounted includes first and second metal frames 361 and 362 of the multilayer electronic component 300 and a substrate ( 380) may be bonded to the electrode pads 391 and 392 disposed on the conductive adhesives 371 and 372.

Since the first and second metal frames and the conductive adhesives 371 and 372 contain conductive metal, electrical conduction can be secured, and the resin included in the conductive adhesives 371 and 372 is cured to form electrode pads 391 and 392. ) to ensure adhesion.

In addition, unlike the conventional case of mounting multilayer electronic components on a board using solder containing tin (Sn), the first and second metal frames 361 and 362 and the conductive adhesives 371 and 372 are removed even in a high-low temperature cycle. ), it is possible to improve the bonding strength of the multilayer electronic component 300 by mitigating the thermal shock applied to the layered electronic component 300 .

Although the embodiments of the present invention have been described in detail above, the present invention is not limited by the above-described embodiments and the accompanying drawings, and is intended to be limited by the appended claims. Therefore, various forms of substitution, modification, and change will be possible by those skilled in the art within the scope of the technical spirit of the present invention described in the claims, which also falls within the scope of the present invention. something to do.

In addition, the expression 'one embodiment' used in the present disclosure does not mean the same embodiment, and is provided to emphasize and describe different unique characteristics. However, one embodiment presented above is not excluded from being implemented in combination with features of another embodiment. For example, even if a matter described in one specific embodiment is not described in another embodiment, it can be understood as a description related to another embodiment, unless there is a description contradicting or contradicting the matter in the other embodiment. can

Terms used in this disclosure are only used to describe one embodiment, and are not intended to limit the disclosure. In this case, singular expressions include plural expressions unless the context clearly indicates otherwise.

Stacked electronic components: 100, 101, 102, 103, 104, 200, 201, 202, 203, 204, 300, 301
Body: 110
111: dielectric layer
112, 113: cover part
114, 115: margin part
First and second internal electrodes: 121, 122
First and second base electrode layers: 131, 132, 331, 332
First and second connectors: 131a, 132a, 231a, 232a, 331a, 332a
First and second band parts: 131b, 132b, 331b, 332b
Third and fourth band parts: 131c, 132c, 331c, 332c
First and second connection electrodes: 231, 232
First and second corner portions: 231b, 232b
First and second electrode layers: 141, 142, 341, 342
First and second band electrodes: 241, 242
First and second insulating layers: 151, 152, 251, 252
Additional insulation layer: 160, 260
Conductive connections: 351, 352
First and second metal frames: 361, 362
Conductive adhesive: 171, 172, 271, 272, 371, 372
Electrode Pads: 191, 192, 291, 292, 391, 392
Substrate: 180, 280, 380
Boards with stacked electronic components mounted: 1000, 2000, 3000

Claims (32)

It includes a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, first and second surfaces facing in a first direction, connected to the first and second surfaces and facing in a second direction. a body including third and fourth surfaces for viewing, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction;
a first base electrode layer disposed on the third surface and including a first connector connected to the first internal electrode;
a second base electrode layer disposed on the fourth surface and including a second connector connected to the second internal electrode;
a first electrode layer disposed on a region including the third surface, the first surface, and the second surface, and exposing at least a portion of the first base electrode layer; and
a second electrode layer disposed on a region including the fourth surface, the first surface, and the second surface, and exposing at least a portion of the second base electrode layer; Including,
The first and second base electrode layers include Cu, and the first and second electrode layers include Ag.
Stacked electronic components.
According to claim 1,
The first base electrode layer further includes a first band portion extending from the first connection portion to a portion of the first surface and a third band portion extending from the first connection portion to a portion of the second surface,
The second base electrode layer further includes a second band portion extending from the second connection portion to a portion of the first surface and a fourth band portion extending from the second connection portion to a portion of the second surface,
The first electrode layer is disposed on the first band portion,
The second electrode layer is disposed on the second band portion
Stacked electronic components.
According to claim 2,
The first electrode layer is disposed extending from the first band portion to a portion of the first connection portion,
The second electrode layer is disposed extending from the second band portion to a portion of the second connection portion
Stacked electronic components.
According to claim 3,
The first direction average size from the lowest point in the first direction to the highest point in the first direction of the first and second electrode layers is 10 μm or more and 40 μm or less
Stacked electronic components.
According to claim 3,
An average magnitude in a first direction from the first surface to an internal electrode disposed closest to the first surface among the first and second internal electrodes is H1;
When the average size in the first direction from the extension line of the first surface to the ends of the first and second electrode layers disposed on the first and second connectors is H2,
Satisfying H1≥H2
Stacked electronic components.
According to claim 3,
An average magnitude in a first direction from the first surface to an internal electrode disposed closest to the first surface among the first and second internal electrodes is H1;
When the average size in the first direction from the extension line of the first surface to the ends of the first and second electrode layers disposed on the first and second connectors is H2,
Satisfying H1<H2
Stacked electronic components.
According to claim 6,
When the size of the body in the first direction is T,
Satisfying H2<T/2
Stacked electronic components.
According to claim 2,
The first and second base electrode layers further include glass,
The first and second electrode layers further include glass and Pd.
Stacked electronic components.
According to claim 2,
The size of the body in the second direction L, the average size in the second direction from the extension line of the third surface to the end of the first band portion B1,
When the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2,
Satisfying 0.2≤B1/L≤0.4 and 0.2≤B2/L≤0.4
Stacked electronic components.
According to claim 9,
Disposed on the first surface, further comprising an additional insulating layer disposed between the first electrode layer and the second electrode layer
Stacked electronic components.
According to claim 2,
Further comprising a first insulating layer disposed on the first connection portion and a second insulating layer disposed on the second connection portion
Stacked electronic components.
According to claim 11,
The insulating layer includes an epoxy resin
Stacked electronic components.
According to claim 1,
The first base electrode layer disposed on the third surface is a first connection electrode, the second base electrode layer disposed on the fourth surface is a second connection electrode, and disposed on the first surface is the first connection electrode. When the first electrode layer connected to the electrode is referred to as a first band electrode, and the second electrode layer disposed on the first surface and connected to the second connection electrode is referred to as a second band electrode,
The first and second connection electrodes include Cu,
The first and second band electrodes include Ag
Stacked electronic components.
According to claim 13,
The first connection electrode includes a first connection portion disposed on the third surface and connected to the first internal electrode, and a first corner portion extending from the first connection portion to a corner connecting the first and third surfaces. include,
The second connection electrode is disposed on the fourth surface and is connected to a first internal electrode, and a second corner extending from the second connection part to a corner connecting the first and fourth surfaces. including wealth,
The first band electrode extends and is disposed to cover at least a portion of the first corner portion,
The second band electrode is disposed extending to cover at least a portion of the second corner portion
Stacked electronic components.
According to claim 13,
The first connection electrode includes a first connection portion disposed on the third surface and connected to the first internal electrode, and a first corner portion extending from the first connection portion to a corner connecting the first and third surfaces. include,
The second connection electrode may include a second connection portion disposed on the fourth surface and connected to the first internal electrode, and a second corner extending from the second connection portion to a corner connecting the first and fourth surfaces. including wealth,
The first band electrode is disposed to extend to cover at least a portion of the first connection portion,
The second band electrode is disposed extending to cover at least a portion of the second connection portion
Stacked electronic components.
According to claim 14,
The average size of the first and second band electrodes in the first direction from the lowest point in the first direction to the highest point in the first direction is 10 μm or more and 40 μm or less
Stacked electronic components.
According to claim 15,
An average magnitude in a first direction from the first surface to an internal electrode disposed closest to the first surface among the first and second internal electrodes is H1;
When the average size in the first direction from the extension line of the first surface to the ends of the first and second band electrodes disposed on the first and second connectors is H2,
Satisfying H1≥H2
Stacked electronic components.
According to claim 15,
An average magnitude in a first direction from the first surface to an internal electrode disposed closest to the first surface among the first and second internal electrodes is H1;
When the average size in the first direction from the extension line of the first surface to the ends of the first and second band electrodes disposed on the first and second connectors is H2,
Satisfying H1<H2
Stacked electronic components.
According to claim 18,
When the size of the body in the first direction is T,
Satisfying H2<T/2
Stacked electronic components.
According to claim 13,
The first and second connection electrodes include glass,
The first and second band electrodes include glass and Pd.
Stacked electronic components.
According to claim 13,
The size of the body in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band electrode is B1,
When the average size in the second direction from the extension line of the fourth surface to the end of the second band electrode is B2,
Satisfying 0.2≤B1/L≤0.4 and 0.2≤B2/L≤0.4
Stacked electronic components.
According to claim 21,
Disposed on the first surface, further comprising an additional insulating layer disposed between the first band electrode and the second band electrode
Stacked electronic components.
According to claim 13,
Further comprising a first insulating layer disposed on the first connection electrode and a second insulating layer disposed on the second connection electrode
Stacked electronic components.
According to claim 23,
The insulating layer includes an epoxy resin
Stacked electronic components.
According to claim 1,
The first base electrode layer further includes a first band portion extending from the first connection portion to a portion of the first surface and a third band portion extending from the first connection portion to a portion of the second surface,
The second base electrode layer further includes a second band portion extending from the second connection portion to a portion of the first surface and a fourth band portion extending from the second connection portion to a portion of the second surface,
The first electrode layer is disposed on the first connection portion,
The second electrode layer is disposed on the second connection portion,
A first metal frame is disposed on the first electrode layer,
A second metal frame is disposed on the second electrode layer,
A conductive connection portion is disposed between the first electrode layer and the first metal frame and between the second electrode layer and the second metal frame, respectively.
Stacked electronic components.
According to claim 25,
The first electrode layer extends from the first connection portion to portions on the first and third band portions, and the second electrode layer extends from the second connection portion to portions on the second and fourth band portions.
Stacked electronic components.
According to claim 25,
The first electrode layer is disposed so as not to cover the ends of the first and third band parts,
The second electrode layer is disposed so as not to cover the ends of the second and fourth band parts.
Stacked electronic components.
The method of claim 26,
An average size in a second direction from an end where the first electrode layer and the conductive connection part meet to an end of the first and third band parts, and an average size in a second direction from an end where the second electrode layer and the conductive connection part meet to ends of the second and fourth band parts The average size in the second direction up to is 0.1 μm or more and 0.58 μm or less
Stacked electronic components.
According to claim 25,
The first and second electrode layers are disposed between the extension line of the first surface and the extension line of the second surface.
Stacked electronic components.
According to claim 25,
The conductive connection part includes Ag and an epoxy resin.
Stacked electronic components.
According to claim 25,
The first and second metal frames include at least one of Ni, Fe, Cu, Ag, Cr, and alloys thereof.
Stacked electronic components.
According to claim 25,
The first and second base electrode layers further include glass,
The first and second electrode layers further include glass and Pd.
Stacked electronic components.

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