KR20230040768A - Memory module test device and memory module test method using the same - Google Patents

Abstract

A memory module test device according to an embodiment of the present technology may comprise: a test board unit capable of mounting a plurality of memory modules; a plurality of test box units including a peltier portion forming a test space in which at least one memory module among the plurality of memory modules is disposed and adjusting the temperature of the test space; and a control unit individually controlling the temperature of the plurality of test box units.

Description

Memory module test device and memory module test method using the same {MEMORY MODULE TEST DEVICE AND MEMORY MODULE TEST METHOD USING THE SAME}

The present technology relates to a memory module test apparatus and a memory module test method using the same, and more particularly, to a memory module test apparatus capable of individually controlling the temperature in a plurality of test box units to proceed with a test of a memory module, and It relates to a test method of a memory module using the same.

In general, a typical server computer uses relatively more memory than a desktop computer or a notebook computer, and mainly uses memory such as R-DIMM (Registered Dual In-line Memory Module).

In particular, the server computer has a memory zone including a plurality of memory slots into which a plurality of memories are mounted, and includes a memory and a temperature sensing element (eg, a thermal diode) in the memory zone. memory modules are installed.

The memory modules perform data processing operations of reading, writing, and storing data under the control of a CPU installed on the main board of the server computer.

In addition, recently, a memory module used in a PC (Personal Computer) or a server requires a high level of reliability because it handles complex and important data. Therefore, in order to satisfy this, burn-in (burn-in) performed at a certain high temperature is required to check in advance defects of all chips including the memory used in the memory module and defects that may occur during the module assembly process. ) must be tested.

This technology can miniaturize the temperature control device and simultaneously perform different test conditions of the memory modules. A memory module test apparatus capable of forming an independent space with a plurality of test box parts, arranging memory modules in each test box part, and individually controlling the temperature in each test box part, and using the same, more efficiently It is a test under various conditions.

A memory module test apparatus according to an embodiment of the present technology includes a test board unit capable of mounting a plurality of memory modules; a plurality of test box units including a peltier unit forming a test space in which at least one memory module among the plurality of memory modules is disposed and adjusting a temperature of the test space; and a control unit individually controlling temperatures of the plurality of test box units.

A memory module test method according to an embodiment of the present technology includes a plurality of test box units including a peltier unit for forming a test space for testing at least one memory module and adjusting a temperature of the test space; and a control unit for individually controlling temperatures of the plurality of test box units. providing each; testing the plurality of memory module groups under one or more test conditions; checking whether there is a memory module group whose test has been completed among the memory module groups; and performing the test for a memory module group whose test is not completed among the memory module groups until the test is finished, and proceeding with a subsequent process for a memory module group whose test is completed among the memory module groups. can do.

The present technology includes a plurality of test box units, which are independent test spaces in which memory modules are mounted, and includes a peltier unit to control the temperature in the test box unit. Since the control unit can individually set the test temperature in the test box unit using the Peltier unit, separate equipment such as a heater or chiller is not included, and the size of the device for testing the memory module can be miniaturized. In addition, setting the temperature through the peltier unit can shorten the time compared to the existing test device, and thus increase the efficiency of the test device.

1 is an overall perspective view of memory module test apparatuses according to an embodiment of the present technology.
2 is a configuration diagram of a test box unit in a memory module test apparatus according to an embodiment of the present technology.
3 is a side view of a test box unit in a test device for a memory module according to an embodiment of the present technology.
4 is a diagram briefly showing the configuration of a test box unit according to an embodiment of the present technology.
5 is a top perspective view of the inside of a water block according to an embodiment of the present technology.
6 is a flowchart of a method for testing a memory module using a test apparatus for a memory module according to an embodiment of the present technology.

Advantages and features of the present technology, and methods of achieving them, will become clear with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present technology is not limited to the embodiments disclosed below and will be implemented in various different forms, but only the present embodiments make the disclosure of the present technology complete, and the common knowledge in the art to which the present technology belongs It is provided to fully inform the possessor of the scope of the technology, and the technology is only defined by the scope of the claims. The sizes and relative sizes of layers and regions in the drawings may be exaggerated for clarity of explanation. Like reference numbers designate like elements throughout the specification.

1 is an overall perspective view of memory module test apparatuses according to an embodiment of the present technology, and FIG. 2 is a configuration diagram of a test box unit in a memory module test apparatus according to an embodiment of the present technology. 3 is a side view of a test box unit in a memory module test apparatus according to an embodiment of the present technology. 4 is a diagram briefly showing the configuration of a test box unit according to an embodiment of the present technology. 5 is a top perspective view of the inside of a water block according to an embodiment of the present technology.

Referring to FIGS. 1 to 5 , a memory module test apparatus according to an embodiment of the present technology can be described.

The memory module test apparatus 10 according to an embodiment of the present technology may be used for a reliability test for detecting defects that may occur in a memory module in advance, for example, a burn-in test.

Referring to FIG. 1 , a memory module test apparatus 10 includes a test board unit 100 into which a plurality of memory modules can be mounted, and a test box unit 200 in which a test space for at least one memory module is formed. can do. The memory module test apparatus 10 may include a plurality of test box units 200 and may include a control unit 300 capable of individually controlling temperatures of the plurality of test box units 200 . The control unit 300 may be located inside the test box unit 200 or located outside the test box unit 200 .

The memory module test apparatus 10 may include a plurality of test box units 200, which is for memory modules to perform tests under one or more test conditions. An independent space is required to individually adjust the test conditions of the memory module, and a plurality of test box units 200 are included to form each test space.

A plurality of memory modules may be mounted on the test board unit 100 . The test board unit 100 may include a slit into which a memory module may be mounted. The slit of the test board unit 100 may be arranged to correspond to the position and size of the test box unit 200 .

Referring to FIG. 1 , first, second, and third test box parts 201 , 202 , and 203 are positioned above the test board part 100 . The test board unit 100 may include a slit at a position corresponding to the position where the test box units 201 , 202 , and 203 are located.

As shown in FIG. 1 , the first and third test box units 201 and 203 each form a space capable of testing three memory modules. Accordingly, three slots are included in the test board unit 100 corresponding to the first and third test box units 201 and 203 . The second test box unit 202 forms a space for testing six memory modules, and includes six slots in the test board unit 100 at a position corresponding to the second test box unit 202. showing what However, the number of memory modules that can be tested in the first to third test box units 201 , 202 , and 203 is not limited thereto. Therefore, the number of slots that can be disposed on the test board unit 100 is not limited thereto either.

The test box unit 200 may be located on top of the test board unit 100 . The test box unit 200 may be configured in a box shape to form a test space for a memory module. The test box unit 200 may be divided into a lower surface 210 including a through part 211 and a side surface and an upper surface surrounding the remaining surface to form a test space. The lower surface 210 of the test box unit 200 may include a through portion 211 . The through part 211 may be formed so that the memory module mounted on the test board part 100 is positioned into the test box part 200 .

Referring to FIG. 1 , first to third test box units 201 , 202 , and 203 may be positioned on top of the test board unit 100 . At this time, the first to third test box parts 201 , 202 , 203 may be in contact with one lower surface 210 .

As such, a plurality of test box parts 200 may be formed by attaching four side surfaces to one lower surface 210 and an upper surface attached to an upper portion of the side surfaces to create an independent space. When a plurality of test box parts 200 are formed on one lower surface 210, the through part 211 will be formed on the lower surface 210 to correspond to the number and position of slots disposed on the test board part 100. can

Although not shown in FIG. 1 , the plurality of test box parts 200 may be formed without sharing one lower surface 210 . Each of the plurality of test box units 200 may form a test space with one lower surface, four side surfaces, and one upper surface.

The test box unit 200 may provide a space in which one or more memory modules can be tested. Each of the plurality of test box units 200 forms an independent test space, and the temperature may be individually controlled. The test box unit 200 may include a component capable of setting a test temperature required for a memory module.

2 to 4, the test box unit 200 includes a water block 2100, a peltier unit 2200, a heat sink 2300, a blowing fan 2400, and a control unit 300. and a locking device 2500. Here, the control unit 300 may be located inside the test box unit 200 or outside the test box unit 200 .

The water block 2100 is to prevent the peltier unit 2200 to be described later from overheating, and may serve to lower the temperature. The water block 2100 may be provided on one side of the test box unit 200 . Referring to FIG. 2 , a water block 2100 may be positioned on top of the test box unit 200 . As shown in FIG. 5 , the water block 2100 may include a passage through which fluid may flow. An inlet through which fluid may enter and an outlet through which fluid may exit may be formed, and a refrigerant may be used as the fluid. The passage through which the refrigerant flows in the water block 2100 may be U-shaped as shown in FIG. 5, but is not limited thereto.

The peltier unit 2200 may serve to adjust the temperature for testing the memory module. The peltier unit 2200 may be positioned between the water block 2100 and the heat sink 2300 . The Peltier unit 2200 may be composed of a Peltier element or a thermoelectric element. The Peltier unit 2200 is a device using a phenomenon in which a temperature difference persists at both ends of a conductive material when a current flows therethrough. The Peltier effect is an effect in which heat from a low-temperature portion is transferred to a high-temperature side when a high-temperature portion opposite to the side requiring cooling is forcibly cooled. When the Peltier element is used, a conventional large test temperature control device including a separate heater and chiller can be miniaturized and used.

The heat sink 2300 may serve to dissipate heat generated from the peltier unit 2200 to the outside. The heat sink 2300 may be positioned between the peltier unit 2200 and the blowing fan 2400 . The heat sinks 2300 may be arranged adjacently at regular intervals in one or more rows in order to dissipate heat generated from the peltier unit 2200 more efficiently, but are not limited thereto. The heat sink 2300 can efficiently dissipate heat generated from the peltier unit 2200 and can be made of an aluminum material to quickly transfer heat. However, it is not limited to aluminum materials.

The blowing fan 2400 may serve to circulate hot or cold air generated in the peltier unit 2200 within the test box unit 200 . The blowing fan 2400 may be positioned between the heat sink 2300 and the memory module mounted on the test board unit 100 . The blowing fan 2400 circulates air inside the test box unit 200 and transfers heat or cool air generated from the peltier unit 2200 so that the temperature required for testing the memory module can be set more quickly.

Referring to FIG. 3 , the locking device 2500 may serve to fix the memory module mounted on the test board unit 100 to prevent it from being detached. The locking device 2500 may be positioned at the top of the lower surface 210 to fix the memory module that has passed through the through portion 211 of the lower surface 210 .

The control unit 300 may control overall operation commands for adjusting the test temperature of the memory module within the test box unit 200 . Although the position of the controller 300 is shown in FIG. 3, it is not limited thereto. The control unit 300 may be connected to the water block 2100, the peltier unit 2200, and the blowing fan 2400 within the test box unit 200 to transmit and receive commands. The control unit 300 may be located inside the test box unit 200 or outside the test box unit 200 . The memory module test apparatus 10 may include at least one control unit 300 . A plurality of control units 300 may be individually positioned corresponding to the plurality of test box units 200, or individual commands may be transmitted to the plurality of test box units 200 through one control unit 300. That is, the temperature of the plurality of test box units 200 may be independently controlled through at least one control unit 300 . Since the control unit 300 can individually control the temperatures in the plurality of test box units 200, different temperatures can be set according to the test progress and test type of the memory module. Depending on the type of test of the memory module, the duration and temperature of the test may vary. Since it is separated into an independent space and the test temperature of the memory module can be set individually, the test can be conducted more efficiently.

Referring to FIGS. 3 and 4 , the test box unit 200 may further include a sensor unit 2600 capable of sensing temperature therein. The sensor unit 2600 may sense the temperature of the memory module undergoing the test in real time. The sensor unit 2600 is connected to the controller 300 and can sense the temperature of the memory module in real time and transmit information to the controller 300 . The control unit 300 controls the water block 2100, the peltier unit 2200, and the blowing fan 2400 in the test box unit 200 through the temperature information received from the sensor unit 2600, so as to test the memory module. It can raise, lower or maintain the required temperature. Although the location of the sensor unit 2600 is shown in FIG. 3, it is not limited thereto.

6 is a flowchart of a method for testing a memory module using a memory module testing apparatus according to an embodiment of the present technology.

Referring to FIG. 6 , at least one memory module group is provided to a plurality of test box units 200 according to an embodiment of the present technology (S101). A memory module group includes at least one memory module. The first memory module group may be mounted on the test board unit 100 at a position corresponding to the first test box unit 201 . The second memory module group is mounted on the test board unit 100 at a position corresponding to the second test box unit 202, and the third memory module group is a test board located at a position corresponding to the third test box unit 203. It is mounted on the part 100. The first to third memory module groups mounted on the test board unit 100 at locations corresponding to the first to third test box units 201 , 202 , and 203 pass through the through portion 211 of the lower surface 210 and are positioned at respective positions. It is disposed in the corresponding first to third test box units 201 , 202 , and 203 .

A plurality of memory module groups disposed in the plurality of test box units 200 are tested under at least one condition (S103). Here, the test may proceed with a reliability test such as a burn-in test, but is not limited thereto.

The first memory module group located in the first test box unit 201 performs a first test. The second memory module group located in the second test box unit 202 performs the second test. A third memory module group located in the third test box unit 203 performs a third test.

At this time, the first to third tests may be performed simultaneously or sequentially. Also, the first to third tests may have the same or different conditions for testing the memory module. Conditions for conducting the test may include, but are not limited to, temperature and time.

It is checked whether there is a group in which the test has been completed among the plurality of memory module groups (S105).

If there is a memory module group whose test has been completed among a plurality of memory module groups (S105:Y), the corresponding memory module group proceeds with a subsequent process (S107).

When an empty slot is generated in the test board unit 100 due to detachment of the memory module group for which the test has been completed, the test method starts again from step S101, which is the first step.

If there is a group in which the test has not been completed among the plurality of memory module groups (S105: N), the test is performed until the test is completed.

For example, the first memory module group may be tested under the first test condition at 100 degrees for a time a. The second and third memory module groups may be tested under the second test condition at 200 degrees for 2a hours. At this time, the test time of the second and third memory module groups undergoing the second test is twice as long as the test time of the first memory module group undergoing the first test. Therefore, if the first test and the second test are simultaneously started, the first test of the first memory module group having a short test time will be finished first. After the first test is completed, the first memory module group may be detached from the test board unit 100 and proceed to the next process. Thereafter, another memory module requiring a test may be mounted on the test board unit 100 where the empty slot is generated, and the test may be performed again as described above.

Since tests of the memory modules located in the first to third test box units 201 , 202 , and 203 can be individually controlled and performed, the process of testing the memory modules can be used more efficiently.

The first to third tests may have the same conditions or various conditions. At this time, one or more control units 300 may be connected to each of the first to third test box units 201 , 202 , and 203 to transmit/receive commands capable of controlling the test box unit 200 . One or more control units 300 may be located within each test box unit 200 or may be located outside the test box unit 200 and connected to a plurality of test box units 200 . The number and location of the controller 300 is not limited.

If conventional equipment for controlling the temperature of a memory module includes both a heater and a chiller and occupies a large volume in the facility, the memory module test apparatus according to an embodiment of the present technology can control the test temperature of the memory module through the peltier unit Because of this, the temperature control equipment can be miniaturized.

In addition, in the memory module test apparatus according to an embodiment of the present technology, the test box unit individually surrounds several areas in which a plurality of memory modules are mounted. Therefore, the temperature can be controlled within each test box part and can be independently set to different temperatures. Since the temperature of various memory modules can be set according to conditions through this test device, an efficient test can be performed.

As such, those skilled in the art to which the present invention pertains will be able to understand that the present invention may be embodied in other specific forms without changing its technical spirit or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting. The scope of the present invention is indicated by the following claims rather than the detailed description above, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention. do.

10: memory module test device 100: test board unit
200: test box unit 201: first test box unit
202: second test box unit 203: third test box unit
210: bottom 220: side
230: top surface 2100: water block
2200: Peltier part 2300: Heat sink
2400: blowing fan 2500: locking device
2600: sensor unit 300: control unit

Claims (12)

a test board unit capable of mounting a plurality of memory modules;
a plurality of test box units including a peltier unit forming a test space in which at least one memory module among the plurality of memory modules is disposed and adjusting a temperature of the test space; and
Memory module test apparatus comprising a; control unit for individually controlling the temperature of the plurality of test box units. According to claim 1,
Each of the plurality of test box units,
a water block supplying cooling water to an upper end of the peltier unit;
a heat sink dissipating heat at a lower end of the peltier unit; and
a blowing fan positioned between the memory module and the heat sink;
Memory module test apparatus further comprising a. According to claim 1,
Each of the plurality of test box units,
a locking device to prevent separation of the memory module mounted on the test board;
Memory module test device further comprising a. According to claim 1,
Each of the plurality of test box units,
a sensor unit capable of sensing an internal temperature of the test box unit;
Memory module test device further comprising a. According to claim 1,
The memory module test apparatus, characterized in that the control unit is located inside the test box unit. According to claim 1,
The memory module test apparatus, characterized in that the control unit is located outside the test box unit. a plurality of test box units including a peltier unit for forming a test space for testing at least one memory module and adjusting a temperature of the test space; And a control unit for individually controlling the temperature of the plurality of test box units; As a memory module test method using a memory module test apparatus comprising a,
providing a memory module group including at least one or more memory modules to the plurality of test box units, respectively;
testing the plurality of memory module groups under one or more test conditions;
checking whether there is a memory module group whose test has been completed among the memory module groups; and
Among the memory module groups, a memory module group whose test has not been completed is tested until the test is completed;
performing a subsequent process on a memory module group whose test has been completed among the memory module groups;
A test method of a memory module including a. According to claim 7,
Each of the plurality of test box units,
a water block supplying cooling water to an upper end of the peltier unit;
a heat sink dissipating heat at a lower end of the peltier unit; and
a blowing fan positioned between the memory module and the heat sink;
A test method of a memory module using a memory module test apparatus further comprising a. According to claim 7,
Each of the plurality of test box units,
a locking device to prevent separation of the memory module mounted on the test board;
A test method of a memory module using a memory module test apparatus further comprising a. According to claim 7,
Each of the plurality of test box units,
a sensor unit capable of sensing an internal temperature of the test box unit;
A test method of a memory module using a memory module test apparatus further comprising a. According to claim 7,
The control unit is a memory module test method using a memory module test apparatus, characterized in that located inside the test box unit. According to claim 7,
The control unit is a memory module test method using a memory module test apparatus, characterized in that located inside the test box unit.

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