KR20230039261A - Electronic device for reducing fluid in connector - Google Patents

Abstract

According to various embodiments of the present invention, an electronic device includes: a vibration generating unit configured to generate vibration; a connection terminal configured to be physically connected to a counterpart component; and a vibration transmission structure which extends between a first part connected to the vibration generating unit, a second part connected to a connecting terminal, and an extension part extending between the first part and the second part and configured to transmit vibration generated by the vibration generating part to the connection terminal.

Description

Electronic device for reducing the fluid in the connection terminal {ELECTRONIC DEVICE FOR REDUCING FLUID IN CONNECTOR}

The following various embodiments relate to an electronic device for reducing fluid in a connection terminal, for example, an electronic device for removing moisture in a connection terminal.

In order to increase user convenience, a waterproof function is provided to electronic devices. The waterproof function given to the electronic device can remove restrictions on the use of the electronic device even in an environment where moisture may flow into the electronic device.

According to various embodiments, an electronic device that reduces fluid in a connection terminal may be provided.

An electronic device according to various embodiments includes a vibration generator configured to generate vibration, a connection terminal configured to be physically connected to a counterpart component, a first part connected to the vibration generator, a second part connected to the connection terminal, and a vibration transmission structure including an extension part extending between the first part and the second part and configured to transfer the vibration generated by the vibration generating part to the connection terminal.

An electronic device according to various embodiments includes an audio output module configured to generate vibration in an ultrasonic band, a connection terminal configured to be physically connected to a counterpart component, a first part connected to the audio output module, and a first connected to the connection terminal. and a vibration transmission structure including two parts and an extension part extending between the first part and the second part and configured to transmit vibration generated in the sound output module to the connection terminal.

An electronic device according to various embodiments includes a vibrator configured to generate vibration, a connection terminal configured to be physically connected to a counterpart component, a first part connected to the vibrator, a second part connected to the connection terminal, and the first part connected to the vibrator. and a vibration transmission structure including an extension portion extending between the second portion and configured to transfer vibration generated from the vibrator to the connection terminal.

According to various embodiments, fluid in the connection terminal may be reduced. According to some embodiments, the fluid in the connection terminal may be reduced without a user's knowledge. Effects of according to various embodiments are not limited to those mentioned above, and other effects not mentioned above will be clearly understood by those skilled in the art from the description below.

1 is a block diagram of an electronic device in a network environment according to various embodiments.
2A is a perspective view of an electronic device viewed in one direction according to an exemplary embodiment;
2B is a perspective view of an electronic device viewed in another direction according to an exemplary embodiment;
2C is an exploded perspective view of an electronic device according to an exemplary embodiment.
3A is a partially exploded perspective view of an electronic device including a vibration generating unit, a connection terminal, and a vibration transmitting structure according to an exemplary embodiment;
FIG. 3B is a perspective view illustrating a housing, a vibration generating unit, and a vibration transmission structure in the electronic device of FIG. 3A.
Figure 3c is a plan view of the housing, the vibration generating unit and the vibration transmitting structure of Figure 3b.
Figure 3d is an exploded perspective view of the housing, the vibration generating unit and the vibration transmitting structure of Figure 3c.
3E is a cross-sectional view of the vibration generator of FIG. 3B viewed along line 3E-3E.
Figure 3f is a cross-sectional view of the vibration transmission structure of Figure 3d along the line 3F-3F.
4 is a partial perspective view of an electronic device including a vibration transmission structure according to another embodiment.
5 is a diagram illustrating a vibration generating unit according to another embodiment.
6 is a diagram illustrating a vibration generating unit according to another embodiment.
7 is an exploded perspective view illustrating an example of a connection structure of a connection terminal and a vibration transmission structure in an electronic device according to an exemplary embodiment.
8 is an exploded perspective view illustrating another example of a connection structure of a connection terminal and a vibration transmission structure in an electronic device according to an exemplary embodiment.
9 is a diagram of an electronic device including a vibration generating unit and a vibration transmission structure according to another embodiment.
10 is a flowchart of an operation of reducing fluid in a connection terminal using an electronic device according to an embodiment.
11 is a flowchart of an operation of reducing fluid in a connection terminal using an electronic device according to an embodiment.

Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into one component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers commands or data received from other components (eg, sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to an embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, an image signal processor or a communication processor) may be implemented as part of other functionally related components (eg, the camera module 180 or the communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of this document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited. A (e.g., first) component is said to be "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively." When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeably interchangeable with terms such as, for example, logic, logic blocks, components, or circuits. can be used A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document describe one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them. For example, a processor (eg, the processor 120 ) of a device (eg, the electronic device 101 ) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the components described above may include a single object or a plurality of objects, and some of the multiple objects may be separately disposed in other components. . According to various embodiments, one or more components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by modules, programs, or other components are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

Referring to FIGS. 2A to 2C , an electronic device 201 (eg, the electronic device 101 of FIG. 1 ) according to an embodiment has a first surface 210a (eg, a front surface) and a second surface 210b. ) (eg, a rear surface), and a third surface 210c (eg, a side surface) surrounding a space between the first surface 210a and the second surface 210b.

In one embodiment, the first surface 210a may be formed by a first plate 211a, at least a portion of which is substantially transparent. For example, the first plate 211a may include a glass plate or a polymer plate including at least one coating layer. The second surface 210b may be formed by a substantially opaque second plate 211b. For example, the second plate 211b may be formed of coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination thereof. The third surface 210c may be formed by a frame 211c coupled to the first plate 211a and the second plate 211b and including metal and/or polymer. In one embodiment, the second plate 211b and the frame 211c may be integrally and seamlessly formed. In one embodiment, the second plate 211b and the frame 211c may be formed of substantially the same material (eg, aluminum).

In one embodiment, the first plate 211a is rounded from at least a portion of the first surface 210a toward the second plate 211b and extends in one direction (eg, +/-Y direction). It may include a plurality of first edge regions 212a. In one embodiment, the second plate 211b is rounded in a direction from at least a portion of the second surface 210b toward the first plate 211a and extends in one direction (eg, +/-Y direction). It may include a plurality of second edge regions 212b.

The electronic device 201 may include a display 261 (eg, the display module 160). In one embodiment, the display 261 may be positioned on the first surface 210a. In one embodiment, the display 261 may be exposed through at least a portion of the first plate 211a. In one embodiment, the display 261 may have substantially the same shape as the shape of the outer rim of the first plate 211a. In some embodiments, an edge of the display 261 may substantially coincide with an outer edge of the first plate 211a.

In an embodiment, the display 261 includes a first area 261a and a pair of second areas 261b respectively located in a plurality of first edge areas 212a based on the first area 261a. ) may be included. In one embodiment, the first region 261a may be substantially flat. In one embodiment, the pair of second regions 261b may be curved with respect to the first region 261a. In an embodiment, the first region 261a and/or the pair of second regions 261b may be visually exposed and display content through pixels or voxels.

In an embodiment, the first area 261a may include a sensing area 261a-1 and a camera area 261a-2. The sensing region 261a-1 may overlap at least a portion of the first region 261a. The sensing region 261a - 1 may allow transmission of an input signal related to a sensor module (eg, the sensor module 176 ). The sensing area 261a-1 may display content similarly to the first area 261a that does not overlap with the sensing area 261a-1. For example, the sensing area 261a - 1 may display content while the sensor module is not operating. The camera area 261a-2 may overlap at least a portion of the first area 261a. The camera area 261a - 2 may allow an optical signal related to the first camera module 280a (eg, the camera module 180 ) to pass through. The camera area 261a-2 may display content similarly to the first area 261a that does not overlap with the camera area 261a-2. For example, the camera area 261a-2 may display content while the first camera module 280a is not operating.

In one embodiment, the display 261 may include a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic stylus pen.

The electronic device 201 may include a first camera module 280a, a second camera module 280b (eg, the camera module 180), and a flash 280c. In one embodiment, the first camera module 280a may be positioned on the first surface 210a, and the second camera module 280b and flash 280c may be positioned on the second surface 210b. In one embodiment, at least a portion of the first camera module 280a may be positioned below the display 261 . In an embodiment, the first camera module 280a may receive an optical signal passing through the camera area 261a-2. In one embodiment, the second camera module 280b may include a plurality of camera modules (eg, a dual camera, a triple camera, or a quad camera). In one embodiment, the flash 280c may include a light emitting diode or a xenon lamp.

The electronic device 201 may include an audio output module 255 (eg, the audio output module 155). In one embodiment, the sound output module 255 may be located on the third side 210c. In one embodiment, the sound output module 255 may include one or more holes.

The electronic device 201 may include an input module 250 (eg, the input module 150). In one embodiment, the input module 250 may be located on the third side 210c. In one embodiment, the input module 250 may include at least one key input device.

The electronic device 201 may include a support 240 , a first circuit board 251 , a second circuit board 252 , and a battery 289 (eg, the battery 189 ). At least a portion of the support 240 may form the housing 210 together with the first plate 211a and the second plate 211b. In one embodiment, the support 240 may include a frame structure 241 and a plate structure 242 . The frame structure 241 may be formed surrounding an edge of the plate structure 242 . The frame structure 241 connects the edge of the first plate 211a and the edge of the second plate 211b, surrounds the space between the first plate 211a and the second plate 211b, and the electronic device 201 ) may form the third surface 210c. The plate structure 242 may accommodate the first circuit board 251 and the second circuit board 252 . The first circuit board 251 and the second circuit board 252 may be located on opposite sides of the battery 289 . A connection terminal 278 may be connected to the second circuit board 252 . The display 261 is positioned on one surface (eg, upper surface) of the plate structure 242, and the connection terminal 278, the battery 289, and the circuit board (eg, the lower surface) are positioned on the other surface (eg, lower surface) of the plate structure 242. 251) may be located.

The electronic device 201 may include connection terminals 278 and 279 (eg, connection terminal 178). In one embodiment, the connection terminals 278 and 279 may be located on the third surface 210c. For example, when viewing the electronic device 201 in one direction (eg, +Y direction), the first connection terminal 278 is located at the center of the third surface 210c, and the second connection terminal 279 is located on one side (eg, the left side) of the third surface 210c with respect to the first connection terminal 278, and the sound output module 255 is located on the third surface with respect to the first connection terminal 278 ( 310c) may be located on the other side (eg, the right side).

In one embodiment, the first connection terminal 278 is configured to be physically connected to a counterpart component (eg, the external electronic device 102 of FIG. 1 ) and a connector for transmitting and receiving power and/or data with the counterpart component ( eg USB connector). In one embodiment, the second connection terminal 279 is configured to be physically connected to another counterpart component (eg, the external electronic device 102 of FIG. 1) and a connector for transmitting and receiving audio signals with the counterpart component (eg, the external electronic device 102). earphone jack). In one embodiment, the first connection terminal 278 and the second connection terminal 279 may have a hole shape. In one embodiment, the first connection terminal 278 and the second connection terminal 279 may be electrically connected to the second circuit board 252 .

Referring to FIGS. 3A to 3F , an electronic device 301 (eg, the electronic device 201 of FIGS. 2A to 2C ) according to an embodiment includes a plate 311 (eg, a second plate 211b) A housing 310 (eg housing 210) including a circuit board 352 (eg second circuit board 252), a vibration generator 355 (eg sound output module 255), First connection terminal 378 (eg, first connection terminal 278), second connection terminal 379 (eg, second connection terminal 279), battery 389 (eg, battery 289) , and a vibration transmission structure 381 configured to transmit the vibration generated by the vibration generating unit 355 to the first connection terminal 378 .

In one embodiment, the vibration generator 355 may include a sound output module configured to output sound signals to the outside of the electronic device 301 . The sound output module may include, for example, a speaker.

In one embodiment, the vibration generating unit 355 may be separated from the circuit board 352 . In some embodiments, the vibration generator 355 may be electrically connected to the circuit board 352 while being physically separated from the circuit board 352 . The separation structure of the vibration generating unit 355 and the circuit board 352 is such that the vibration generated by the vibration generating unit 355 passes through the circuit board 352 to other components (eg, the housing 210 of FIGS. 2A and 2B). diffusion to the third surface 210c) may be prevented or reduced, and the generated vibration may be substantially transferred to the vibration transmission structure 381.

In one embodiment, the vibration generating unit 355 may be at least partially accommodated in the housing 310 . In one embodiment, the plate 311 may include a first accommodating portion 313 that at least partially accommodates the vibration generating portion 355 . The first accommodating part 313 may have a shape that at least partially corresponds to the external shape of the vibration generating part 355 . In one embodiment, the vibration generating unit 355 and the plate 311 may be disposed on substantially the same plane.

In one embodiment, the vibration generator 355 may include an enclosure 356 and an acoustic component 357 at least partially surrounded by the enclosure 356 . In another embodiment, the vibration generator 355 may include an acoustic component 357 without the enclosure 356.

In one embodiment, the enclosure 356 may include a cover enclosure 358 and a base enclosure 359. The cover enclosure 358 includes a cover portion 358a having an outer cover surface 358a-1 and an inner cover surface 358a-2, and an outer cover side surface 358b-1 and an inner cover side surface 358b-2. 2) with a cover wall portion 358b. The cover wall portion 358b is provided with a radiation duct RD formed at least partially between the outer cover side surface 358b-1 and the inner cover side surface 358b-2, and on the outer cover side surface 358b-1. It may include a radiating opening (RO) formed in. The base enclosure 359 includes a base portion 359a having an outer base face 359a-1 and an inner base face 359a-2, and an outer base side face 359b-1 and an inner base side face 359b-2. 2) with a base wall portion 359b. The inner cover face 358a-2, the inner cover side face 358b-2, the inner base face 359a-2, and the inner base side face 359b-2 may form an interior space of the enclosure 356. .

In some embodiments, at least some of the outer cover faces 358a-1 are configured to open a space defined between the inner cover face 358-2 and the inner cover side faces 358b-2 to the outside of the enclosure 356. It may also include a configured lid.

In some embodiments, the cover wall portion 358b can have a second outer cover side face 358b-3 that is inclined with respect to the outer cover face 358a-1. For example, the radiation duct RD may be formed at least partially toward the second outer cover side surface 358b-3, and the radiation opening RO may be formed in the second outer cover side surface 358b-3. there is.

In one embodiment, cover enclosure 358 and base enclosure 359 may be coupled to each other. In another embodiment, the cover enclosure 358 and the base enclosure 359 may form one enclosure 356 formed substantially integrally and seamlessly.

In one embodiment, the acoustic component 357 can include a radiation plate 357a configured to radiate sound, and a support 357b supporting the radiation plate 357a. The radiation plate 357a may be positioned between the inner cover face 358a-2 and the inner base face 359a-2. The radiation plate 357a may be connected or bonded to the inner cover side surface 358b-2. The radiation plate 357a may be electrically connected to a circuit board (eg, the first circuit board 251 or the second circuit board 252 of FIG. 2C ) in the electronic device 301 . The support 357b may be positioned between the radiating plate 357a and the inner base surface 359a-2. The support 357b may be positioned on the inner base surface 359a-2. In another embodiment, the radiation plate 357a is connected or coupled to the inner base side face 359b-2 or between the inner cover side face 358b-2 and the inner base side face 359b-2. It could be.

In one embodiment, the enclosure 356 is on the radiation side relative to the radiation plate 357a (eg, the top of the radiation plate 357a in FIG. 3E ) and on the opposite side (eg, the radiation plate 357a in FIG. 3E ). lower portion of) may have a resonance space. The resonant space can be at least partially defined by, for example, the inner base face 359a-2, the inner base side face 359b-2, and the radiating plate 357a. In another embodiment, the radiating plate 357a may be positioned within the enclosure 356 such that the enclosure 356 does not have a resonant space.

In one embodiment, the acoustic component 357 may be configured to generate vibration in the audible frequency band and/or vibration in the non-audible frequency band via the radiation plate 357a. In some embodiments, the acoustic component 357, for example, under the control of a processor (e.g., processor 120 of FIG. 1), selectively controls vibration in the audible frequency band and vibration in the non-audible frequency band or both. combinations can occur. In one example, the vibration of the inaudible frequency band may be the vibration of the ultrasonic band. In one example, the ultrasound band may be about 20 kHz or greater. In some instances, the ultrasound band may be greater than about 1.6 MHz. In some embodiments, the acoustic component 357 may generate vibration in an inaudible frequency band with a set duty cycle.

In one embodiment, the vibration transmission structure 381 includes a first part 382 connected to the vibration generating unit 355, a second part 383 connected to the first connection terminal 378, and a first part 382 ) and the second portion 383 and may include an extension portion 384 configured to transfer vibration generated by the vibration generating unit 355 to the first connection terminal 378 .

In one embodiment, the first part 382 of the vibration transmission structure 381 may be located at a hot spot where vibration occurs the most in the vibration generator 355 . For example, the first part 382 of the vibration transmission structure 381 may be connected to the radiation plate 357a.

In some embodiments, the first portion 382 of the vibration transmission structure 381 may be located in an area adjacent to the radiation opening RO. For example, the first part 382 of the vibration transmission structure 381 may be located in a region adjacent to the radiation opening RO of the radiation plate 357a. As another example, the first portion 382 of the vibration transmission structure 381 is not connected to the radiation plate 357a and is adjacent to the radiation opening RO in the enclosure 356 (eg, the outer cover side surface 358b-). 1) and the area between the inner cover side surface 358b-2).

In one embodiment, the second part 383 of the vibration transmission structure 381 is located on the first base part 383a connected to the extension part 384, and the first base part 383a, and the first A second base part 383b having a surface 383b-1 connected to, connected to, or coupled to one surface of the connection terminal 383b may be included. In some embodiments, the first base part 383a and the second base part 383b may form a step. In some embodiments, the first base part 383a may be substantially coplanar with the extension 384 . In one embodiment, the plate 311 may include a second accommodating portion 314 that at least partially accommodates the second portion 383 of the vibration transmission structure 381 . The second accommodating part 314 may have a shape at least partially corresponding to each shape of the first base part 383a and the second base part 383b, for example.

In one embodiment, the extension 384 of the vibration transmission structure 381 may include a substantially linear portion. In one embodiment, the extension 384 of the vibration transfer structure 381 may be at least partially embedded in the plate 311 .

In one embodiment, the extension 384 of the vibration transmission structure 381 may include a filling structure 384a filled with at least one medium 384b. The filling structure 384a may include, for example, a medium 384b substantially filled so that no hollow portion exists therein. The filling structure 384a may reduce resistance (eg, acoustic impedance) to vibration through the extension 384 and increase transmission efficiency of vibration through the extension 384 . The medium 384b may include, for example, metal or high-density plastic. Here, high density may mean a plastic having high hardness. In one embodiment, the medium 384b may be a combination of polycarbonate (PC) and glass fiber (GF). In some embodiments, glass fibers may be greater than about 30% by weight. In one embodiment, medium 384b may have an average density greater than 1.40 g/cm3. In one embodiment, the filling structure 384a may have a cross section of substantially polygonal, circular, elliptical, and other shapes suitable for transmitting vibration.

In another embodiment, the vibration transfer structure 381 may be configured to transmit vibration generated by the vibration generator 355 to the second connection terminal 379 . In another embodiment, the vibration transmission structure 381 may be configured to transfer the vibration generated by the vibration generating unit 355 to the first connection terminal 378 and the second connection terminal 379 .

Referring to FIG. 4 , an electronic device 401 (eg, the electronic device 301 of FIGS. 3A to 3D ) according to an embodiment includes a housing including a plate 411 (eg, the plate 311). 410) (eg, the housing 310), a vibration generating unit 455 (eg, the vibration generating unit 355), and a vibration transmission structure 481 (eg, the vibration transmission structure 381). . The vibration transmission structure 481 is connected to the first part (eg, the first part 382 of FIG. 3E) connected to the vibration generating unit 455 and to the connection terminal (eg, the first connection terminal 378 of FIG. 3A). It may include a connected second part 483 (eg, the second part 383), and an extension part 484 extending between the first part and the second part 483.

In one embodiment, the extension part 484 may include a plurality of linear parts 484c and at least one bent part 484d formed between a pair of adjacent linear parts 484c. An extension direction of any one of the plurality of linear parts 484c may be different from an extension direction of another linear part 484c. In some embodiments, there may be at least one linear portion 484c that is substantially the same or at least partially the same as the extending direction of any one of the plurality of linear portions 484c. The bent portion 484d may form a corner between a pair of adjacent linear portions 484c. In another embodiment, the curved portion 484d may form a curved surface between a pair of adjacent linear portions 484c.

Referring to FIG. 5 , a vibration generating unit 555 (eg, the vibration generating unit 355 of FIG. 3D ) according to an embodiment includes an enclosure 556 (eg, the enclosure 356 of FIG. 3D ) and an acoustic component. 557 (eg, acoustic component 357).

The enclosure 556 may include a cover enclosure 558 (eg, the cover enclosure 358) and a base enclosure 559 (eg, the base enclosure 359). The cover enclosure 558 can include a cover portion 558a (eg, cover portion 358a) and a cover wall portion 558b (eg, cover wall portion 358b). Cover portion 558a may have an outer cover surface 558a-1 (eg, outer cover surface 358a-1) and an inner cover surface 558b-2 (eg, inner cover surface 358b-2). there is. The cover wall portion 558b includes an outer cover side surface 558b-1 (eg, outer cover side surface 358b-1) and an inner cover side surface 558b-2 (eg, inner cover side surface 358b-2). )) can have. The base enclosure 559 may include a base portion 559a (eg, base portion 359a) and a base wall portion 559b (eg, base wall portion 359b). Base portion 559a may have an outer base surface 559a-1 (eg, outer base surface 359a-1) and an inner base surface 559a-2 (eg, inner base surface 359a-2). there is. The base wall portion 559b includes an outer base side surface 559b-1 (eg, outer base side surface 359b-1) and an inner base side surface 559b-2 (eg, inner base side surface 359b-2). )) can have. The inner cover face 558a-2, the inner cover side face 558b-2, the inner base face 559a-2, and the inner base side face 559b-2 may form an interior space of the enclosure 556. .

In one embodiment, the cover portion 558a may include a radiating aperture RO formed on the outer cover surface 558a-1 and/or the inner cover surface 558a-2.

In one embodiment, acoustic component 557 may include a radiation plate 557a (eg, radiation plate 357a) and a support 557b (eg, support 357b). A radiation plate 557a may be positioned over the inner cover surface 558b-2 adjacent to the radiation aperture RO. The support 557b may support at least a portion of the radiation plate 557a and extend from the inner base surface 559a-2.

In one embodiment, the radiation plate 557a may form a resonance space BV with the support 557b and the inner base surface 559a-2. In another embodiment, the support 557b may be formed in the enclosure 556 so that the resonance space BV is not formed. For example, the support 557b may be positioned below one surface (eg, the lower surface of FIG. 5 ) of the radiation plate 557a while supporting the radiation plate 557a.

In one embodiment, the radiation plate 557a includes a first portion 582 (eg, the first portion 382 of FIG. 3E) of a vibration transfer structure (eg, the vibration transfer structure 381 of FIGS. 3A to 3D). this can be connected. In some embodiments, the first portion 582 may be located in an area adjacent to the radiating aperture RO. For example, the first portion 582 can be positioned between the radiation plate 557a and the inner cover surface 558a-2. As another example, the first portion 582 may be positioned at least partially within the radiating aperture RO. As another example, the first portion 582 may be positioned adjacent to the radiating aperture RO and outside the enclosure 556, such as over the outer cover surface 558a-1.

In some embodiments, the support 557b may also be understood as a component of the base enclosure 559 rather than a component of the acoustic component 557 . The support 557b may be seamlessly formed substantially integrally with the base portion 559a, for example.

Referring to FIG. 6 , a vibration generating unit 655 (eg, the vibration generating unit 355 of FIG. 3D ) according to an embodiment includes an enclosure 656 (eg, the enclosure 356 of FIG. 3D ) and an acoustic component. 657 (eg, acoustic component 357).

Enclosure 656 may include a cover enclosure 658 (eg, cover enclosure 358 ) and a base enclosure 659 (eg, base enclosure 359 ). The cover enclosure 658 can include a cover portion 658a (eg, cover portion 358a) and a cover wall portion 658b (eg, cover wall portion 358b). Cover portion 658a may have an outer cover surface 658a-1 (eg, outer cover surface 358a-1) and an inner cover surface 658b-2 (eg, inner cover surface 358b-2). there is. The cover wall portion 658b includes an outer cover side surface 658b-1 (eg, outer cover side surface 358b-1) and an inner cover side surface 658b-2 (eg, inner cover side surface 358b-2). )) can have. The base enclosure 659 may include a base portion 659a (eg, base portion 359a) and a base wall portion 659b (eg, base wall portion 359b). Base portion 659a may have an outer base surface 659a-1 (eg, outer base surface 359a-1) and an inner base surface 659a-2 (eg, inner base surface 359a-2). there is. The base wall portion 659b includes an outer base side surface 659b-1 (eg, outer base side surface 359b-1) and an inner base side surface 659b-2 (eg, inner base side surface 359b-2). )) can have. The inner cover face 658a-2, the inner cover side face 658b-2, the inner base face 659a-2, and the inner base side face 659b-2 may form an interior space of the enclosure 656. .

In one embodiment, the cover portion 658a may include a radiating opening RO formed on the outer base surface 659a-1 and/or the inner base surface 659a-2.

In one embodiment, the acoustic component 657 may include a radiation plate 657a (eg, radiation plate 357a). The radiation plate 557a may be positioned on or above the inner base surface 659a-2 adjacent to the radiation aperture RO.

In one embodiment, the radiation plate 657a includes an inner cover surface 658a-2, an inner cover side surface 658b-2, an inner base surface 659a-2, and an inner base side surface 659b-2. Together, they can form a resonance space (BV).

In one embodiment, the radiation plate 657a includes a first part 682 (eg, the first part 682 of FIG. 3E ) of the vibration transmission structure 681 (eg, the vibration transmission structure 381 of FIGS. 3A to 3D ). 382)) can be connected. The extension 684 of the vibration transmission structure 681 (eg, the extension 384 in FIG. 3D ) extends from the first portion 682 to the inner base side surface 659b-2 and the outer base side surface 659b-1. ) through which it can extend to the outside of the enclosure 656.

In some embodiments, the first portion 682 may be located in an area adjacent to the radiating aperture RO. For example, the first portion 682 may be located on one side (eg, side) of the radiation plate 657a. As another example, the first portion 682 may be located in one area of the radiation plate 657a adjacent to the radiation opening RO. As another example, the first portion 682 may be positioned at least partially within the radiating aperture RO. As another example, the first portion 682 may be positioned adjacent to the radiating aperture RO and external to the enclosure 656, eg, above the outer base surface 659a-1.

Referring to FIG. 7 , in an electronic device 701 (eg, the electronic device 301 of FIGS. 3A to 3D) according to an embodiment, a connection terminal 778 (eg, a first connection terminal 378) and vibration A connection structure between transmission structures 781 (eg, vibration transmission structure 381) is shown.

The vibration transmission structure 781 is connected to a first part (eg, the first part 382 of FIG. 3E ) connected to the vibration generating unit (eg, the vibration generating unit 355 of FIG. 3A ) and to a connection terminal 778 . a second portion 783 configured to be (eg, the second portion 383 of FIG. 3A ), and an extension portion 784 extending between the first portion and the second portion 783 (eg, the extension portion 784 of FIG. 3B ) (384)).

The connection terminal 778 includes a first terminal surface 778a (eg, an upper terminal surface), a second terminal surface 778b opposite to the first terminal surface 778a (eg, a lower terminal surface), and a first terminal surface 778b (eg, a lower terminal surface). A plurality of third terminals positioned between the terminal face 778a and the second terminal face 778b and forming an inner space of the connection terminal 778 together with the first terminal face 778a and the second terminal face 778b. It may include faces 778c. In one embodiment, the first terminal face 778a and the second terminal face 778b may have at least partially substantially flat faces, and the plurality of third terminal faces 778c may be at least partially substantially curved. May have a curved surface.

In one embodiment, the second part 783 of the vibration transmission structure 781 and the connection terminal 778 may be bonded to each other. For example, the electronic device 701 has one surface of the second part 783 (eg, a surface facing the second terminal surface 778b of the connection terminal 778 or a surface 383b-1 in FIG. 3D). The junction 391 may be interposed between the second terminal surfaces 778b of the connection terminal 778 . The bonding portion 791 may be bonded to at least a partial area (eg, the bonding area BA) of the second terminal surface 778b. The bonding portion 791 may include, for example, double-sided tape.

In one embodiment, the bonding portion 791 may be formed of a rigid material. For example, the material may be plastic or metal having high hardness. In one embodiment, the plastic may include a combination of polycarbonate (PC) and glass fibers (GF). In some embodiments, glass fibers may be greater than about 30% by weight. In one embodiment, junction 791 may have an average density of 1.4 g/cm3 or greater.

Referring to FIG. 8 , in an electronic device 801 (eg, the electronic device 301 of FIGS. 3A to 3D ) according to an embodiment, a connection terminal 878 (eg, a first connection terminal 378) and vibration A connection structure between transmission structures 881 (eg, vibration transmission structure 381) is shown.

The vibration transmission structure 781 is connected to a first part (eg, the first part 382 of FIG. 3E ) connected to the vibration generating unit (eg, the vibration generating unit 355 of FIG. 3A ) and to a connection terminal 878 . a second portion 883 configured to be (eg, the second portion 383 of FIG. 3A ), and an extension portion 884 extending between the first portion and the second portion 883 (eg, the extension portion 884 of FIG. 3B ) (384)).

The connection terminal 878 includes a first terminal surface 878a (eg, an upper terminal surface), a second terminal surface 878b opposite to the first terminal surface 878a (eg, a lower terminal surface), and a first terminal surface 878b (eg, a lower terminal surface). A plurality of third terminals positioned between the terminal face 878a and the second terminal face 878b and forming an inner space of the connection terminal 878 together with the first terminal face 878a and the second terminal face 878b. It may include faces 878c. In one embodiment, the first terminal face 878a and the second terminal face 878b may have at least partially substantially flat faces, and the plurality of third terminal faces 878c may be at least partially substantially curved. May have a curved surface.

In one embodiment, the second part 883 of the vibration transmission structure 881 and the connection terminal 878 may be fastened to each other. For example, at least one hole H may be formed in at least a portion of the second terminal surface 878b (eg, the fastening area CA), and the electronic device 801 may include at least one hole ( H) may include at least one fastening part RV fastening the second terminal surface 878b and the second part 883 together. In one embodiment, a plurality of (eg, two) holes H may be formed in the fastening area CA of the second terminal surface 878b, and the electronic device 801 may determine the number of holes H. It may include a number (eg, two) of fastening parts (RVs) corresponding to .

In one embodiment, the fastening portion RV may be riveted onto the second terminal surface 878b and/or onto the second portion 883 . In another embodiment, the fastening part RV may be screwed to the second terminal surface 878b and/or the second portion 883.

Referring to FIG. 9 , an electronic device 901 (eg, the electronic device 301 of FIGS. 3A to 3D ) according to an embodiment includes a housing including a plate 911 (eg, the plate 311). 910) (eg housing 310), sound output module 955 (eg sound output module 155 of FIG. 1), vibration generator 965 (eg haptic module 179 of FIG. 1), and a vibration transmission structure 981 (eg, the vibration transmission structure of FIGS. 3A to 3D ) configured to transmit the vibration generated by the vibration generating unit 965 to a connection terminal (eg, the first connection terminal 378 of FIG. 3A ). (381)).

In one embodiment, the vibration generating unit 965 may convert an electrical signal into a mechanical stimulus (eg, vibration or motion) that a user can perceive through a tactile or kinesthetic sense. The vibration generating unit 965 may include, for example, a motor, a piezoelectric element, and other vibration generating elements.

In one embodiment, the vibration transmission structure 981 includes a first part 982 connected to the vibration generating unit 965 and a second part connected to a connection terminal (eg, the first connection terminal 378 of FIG. 3A ). 983) (eg, the second portion 383 of FIGS. 3A to 3D), and an extension 984 extending between the first portion 982 and the second portion 983 (eg, FIGS. 3B to 3D). extension 384 of FIGS. 3D and 3F).

Referring to FIG. 10 , an operation of reducing fluid in a connection terminal (eg, the first connection terminal 378 of FIG. 3A ) using an electronic device (eg, the electronic device 301 of FIG. 3A ) according to an embodiment. An example is described.

In operation 1010, the electronic device may detect fluid in the connection terminal. In one embodiment, the electronic device may include a sensor that detects fluid in the connection terminal. The sensor may include, for example, a humidity sensor, a voltage sensor capable of sensing a voltage according to the formation of electrical impedance of the fluid in the connection terminal, and other fluid detection sensors. The sensor may, for example, detect the amount of fluid or the presence or absence of fluid in the connection terminal, and generate an electrical signal or data value corresponding to the detected fluid.

In operation 1020, the electronic device may determine whether the amount of fluid in the connection terminal is greater than or equal to a set first threshold value. For example, the electronic device may include a processor that compares an electrical signal or data value corresponding to the amount of fluid with a first threshold value. If the amount of fluid is less than the first threshold value, the electronic device may perform operation 1010 of detecting fluid in the connection terminal again. In another embodiment, when the amount of fluid is less than the first threshold value, the electronic device may end its operation. In an embodiment, in operation 1020, the electronic device may detect the amount of fluid or the existence of the fluid for a predetermined duration, and perform the next operation 1030. In an embodiment, the electronic device may detect the amount of fluid or the presence of fluid by a predetermined count, and perform the next operation 1030 when the detected count exceeds the predetermined count. For example, when fluid is continuously recognized for 3 seconds and continuously recognized 3 times at intervals of 3 seconds, the electronic device may perform the next operation 1030 . Meanwhile, the above operation of the electronic device is exemplary, and the sensing period and/or period may be variously varied.

In operation 1030, the electronic device generates vibration (eg, ultrasonic vibration) in the vibration generating unit (eg, the vibration generating unit 355 of FIG. 3A) when the amount of fluid in the connection terminal is equal to or greater than the first threshold value. can For example, if the amount of fluid is greater than or equal to the first threshold, the processor may generate an electrical signal or data value corresponding to the amount of fluid.

In operation 1040, the electronic device may determine whether the operating time for generating the vibration of the vibration generating unit is greater than or equal to a set second threshold value. For example, the processor may generate an electrical signal or data value for stopping the operation of the vibration generating unit when the operation time is equal to or greater than the second threshold. Meanwhile, if the operating time is less than the second threshold value, the processor may generate an electrical signal or data value corresponding to the vibration generating unit to continuously generate vibration.

Referring to FIG. 11 , an operation of reducing fluid in a connection terminal (eg, the first connection terminal 378 of FIG. 3A ) using an electronic device (eg, the electronic device 301 of FIG. 3A ) according to an embodiment. Another example of is described.

In operation 1110, the electronic device may receive a user's input regarding a vibration generating mode. For example, the electronic device may include an input unit (eg, the input module 150 of FIG. 1 ) that receives a command or data for generating vibration in the vibration generating unit from a user.

In operation 1120, upon receiving a user's input, the electronic device may cause the vibration generating unit (eg, the vibration generating unit 355 of FIG. 3A) to generate vibration (eg, ultrasonic vibration). For example, the processor may generate an electrical signal or data value corresponding to the operation time of the vibration generator.

In operation 1130, the electronic device may compare an operating time for generating vibration of the vibration generating unit with a set threshold value. For example, if the operating time is greater than or equal to a threshold value, the processor may generate an electrical signal or data value for stopping vibration generation of the vibration generating unit. On the other hand, if the operating time is less than the threshold value, the processor may generate an electrical signal or data value corresponding thereto so that the vibration generating unit continues to vibrate.

Experimental Example 1

An experiment for a difference in operating frequency of ultrasonic waves transmitted to a connection terminal using an electronic device according to an embodiment was performed. The immersion release time of the connection terminal according to the frequency change was measured by repeating 15 times for each frequency. was set to about 30 kHz.

As a result of the experiment, the immersion release time of the connection terminal was about 35.91 minutes in a natural state without any frequency applied, about 24.17 minutes at a frequency of about 15 kHz, about 24.64 minutes at a frequency of about 20 kHz, and about 25 kHz at a frequency. It took about 28.49 minutes, about 34.13 minutes at a frequency of about 30 kHz.

According to the above experimental example, it was confirmed that the lower the operating frequency, the greater the immersion release effect, and that it is possible to generate ultrasonic waves at about 20 kHz, which is the lower limit of the ultrasonic frequency.

Experimental Example 2

An experiment for a difference between ultrasonic operation intervals transmitted to a connection terminal using an electronic device according to an embodiment was performed. In the ultrasonic frequency band for each frequency, the immersion release time according to the interval change was measured, and the interval period was about 5 seconds of operation followed by about 3 seconds of stop, about 5 seconds of operation followed by about 5 seconds of stop, and about 10 seconds of operation followed by about 3 seconds. stop, and about 10 seconds of operation followed by about 5 seconds of pause.

As a result of the experiment, the immersion release time of the connection terminal is about 36.35 minutes in the natural state where no interval is set, about 28.92 minutes in the interval of about 5 seconds of operation and about 3 seconds of stop, about 5 seconds of operation and about 5 seconds of stop It took about 30.21 minutes in the interval, about 25.67 minutes in the interval of about 10 seconds of operation and about 3 seconds of stop, and about 37.30 minutes of about 10 seconds of operation and about 5 seconds of pause in the interval.

According to the above experimental example, the shorter the interval of ultrasonic generation operation and the longer the operation time, the greater the effect of releasing the immersion, and the effect of stopping the operation for 3 seconds after operating for about 10 seconds was found to be greater.

Experimental Example 3

A material difference test of a vibration transmitting structure between a vibration generating unit and a connection terminal was performed using the electronic device according to an embodiment. The immersion release time according to the material change of the vibration transmission structure was measured, and the vibration generator was set to continuously generate vibration at about 20 kHz. The material of the vibration transmission structure was set to polycarbonate and 20% by weight of glass fiber, polycarbonate and 30% by weight of glass fiber, and polycarbonate and 40% by weight of glass fiber.

As a result of the experiment, the immersion release time of the connection terminal was about 36.35 minutes when using polycarbonate and 20% by weight of glass fiber, about 28.92 minutes when using polycarbonate and 30% by weight of glass fiber, and about 28.92 minutes when using polycarbonate and 40% by weight of glass fiber. In the case of using glass fiber, it took about 30.21 minutes.

According to the above experimental example, the higher the density of the medium for transmitting vibration, the greater the effect, and when polycarbonate and 40% by weight of glass fiber were used, it was found that the flood release effect was greater.

An electronic device 301 according to various embodiments includes a vibration generating unit 355 configured to generate vibration, a connection terminal 378 configured to be physically connected to a counterpart component, and a first connected to the vibration generating unit 355. The first part 382, the second part 383 connected to the connection terminal 378, and extending between the first part 382 and the second part 383 and generated by the vibration generating part 355 It may include a vibration transmission structure 381 including an extension portion 384 configured to transfer the generated vibration to the connection terminal 378 .

In one embodiment, a circuit board 352 connected to the connection terminal 378 may be further included, and the vibration generating unit 355 and the circuit board 352 may be separated.

In one embodiment, the electronic device 301 includes a first accommodating part 313 configured to accommodate the first part 382 of the vibration transmission structure 381 and a second part of the vibration transmission structure 381 ( A plate 311 including a second accommodating portion 314 configured to accommodate 383 may be further included.

In one embodiment, the extension part 384 may be buried in the plate 311 .

In an embodiment, the electronic device 301 includes a first surface 210a, a second surface 210b opposite to the first surface 210a, and the first surface 210a and the second surface ( 210b) further comprising housings 210 and 310 including a third surface 210c surrounding the space, and the vibration generating unit 355 has a fourth surface facing the first surface 210a ( 358a-1, 358a-2), a fifth surface 359a-1, 359a-2 opposite to the fourth surface 358a-1, 358a-2 and facing the second surface 210b, and a sixth face 358b-1, 358b- at least partially enclosing a space between the fourth face 358a-1, 358a-2 and the fifth face 359a-1, 359a-2 and having a radiating opening RO; 2, 358b-3, and inside the enclosure 356 and the fourth face 358a-1, 358a-2 and the fifth face 359a-1, 359a-2 A radiation plate 357a positioned therebetween may be included, and the first part 382 of the vibration transmission structure 381 may be connected to the radiation plate 357a.

In an embodiment, the electronic device 301 includes a first surface 210a, a second surface 210b opposite to the first surface 210a, and the first surface 210a and the second surface ( 210b) further comprising housings 210 and 310 including a third surface 210c surrounding the space, and the vibration generating unit 355 has a fourth surface facing the first surface 210a ( 358a-1, 358a-2), a fifth surface 359a-1, 359a-2 opposite to the fourth surface 358a-1, 358a-2 and facing the second surface 210b, and a sixth face 358b-1, 358b- at least partially enclosing a space between the fourth face 358a-1, 358a-2 and the fifth face 359a-1, 359a-2 and having a radiating opening RO; 2, 358b-3, 359b-1, 359b-2, and inside the enclosure 356 and the fourth face 358a-1, 358a-2 and the fifth face ( A radiation plate 357a positioned between 359a-1 and 359a-2 may be included, and the first portion 382 of the vibration transmission structure 381 may be positioned adjacent to the radiation opening RO.

In an embodiment, the electronic device 301 includes a first surface 210a, a second surface 210b opposite to the first surface 210a, and the first surface 210a and the second surface ( 210b) further comprising a housing (210, 310) including a third surface (210c) surrounding the space between the first surface (210a), the fourth surface (658a-1, 658a-2) facing the first surface (210a), a fifth face 659a-1, 659a-2 opposite to the fourth face 658a-1, 658a-2 and facing the second face 210b and having a radiating opening RO; and (658a-1, 658a-2) and the sixth surface (658b-1, 658b-2, 659b-1, 659b-) at least partially surrounding the space between the fifth surface (659a-1, 659a-2). 2), and a radiation plate 657a positioned inside the enclosure 656 and on the fifth surfaces 659a-1 and 659a-2, wherein the vibration transmission structure ( The first part 682 of 681) may be connected to the radiation plate 657a.

In an embodiment, the electronic device 301 includes a first surface 210a, a second surface 210b opposite to the first surface 210a, and the first surface 210a and the second surface ( 210b) including a third face 210c surrounding the space between the housings 210 and 310, the fourth face 558a- facing the first face 210a and having a radiating opening RO. 1, 558a-2), a fifth surface 559a-1, 559a-2 opposite to the fourth surface 558a-1, 558a-2 and facing the second surface 210b, and the fourth surface (558a-1, 558a-2) and the sixth surface (558b-1, 558b-2, 559b-1, 559b-) at least partially enclosing the space between the fifth surface (559a-1, 559a-2). 2), and a radiation plate 557a positioned inside the enclosure 556 and on the fourth surfaces 558a-1 and 558a-2, of the vibration transmission structure The first part 582 may be connected to the radiation plate 557a.

In one embodiment, the extension part 484 may include a plurality of linear parts 484c and at least one bent part 484d formed between a pair of adjacent linear parts 484c.

In one embodiment, the extension portion 384 may include a filling structure 384a filled with a medium 384b without a substantially hollow portion.

In one embodiment, the electronic device 701 may further include a bonding portion 791 bonding the second portion 783 of the vibration transmission structure 781 and the connection terminal 778 to each other.

In one embodiment, the electronic device 801 may further include a fastening part RV fastening the second part 883 of the vibration transmitting structure 881 and the connecting terminal 878 to each other.

In one embodiment, the vibration generating unit 355 may be configured to generate vibration of an ultrasonic band.

In one embodiment, the vibration generating unit 355 may include a sound output module.

In one embodiment, the vibration generating unit 965 may include a vibrator.

In one embodiment, the connection terminal 378 may include a USB connector.

In one embodiment, the electronic device (101, 301), the sensor 176 configured to detect the fluid in the connection terminal 378, and the vibration generating unit 355 when the sensor 176 detects the fluid may further include a processor 120 generating a signal causing vibration.

In an embodiment, the electronic device 101 or 301 includes an input unit 150 configured to receive a user's input regarding a vibration generating mode in which the vibration generating unit 355 generates the vibration, and the input unit 150 ) may further include a processor 120 that generates a signal that causes the vibration generator 355 to generate the vibration when the input is received.

An electronic device 301 according to various embodiments includes an audio output module 355 configured to generate vibration in an ultrasonic band, a connection terminal 378 configured to be physically connected to a counterpart component, and the audio output module 355 A first part 382 connected to, a second part 383 connected to the connection terminal 378, and extending between the first part 382 and the second part 383 and the sound output module 355 ) may include a vibration transmission structure 381 including an extension portion 384 configured to transmit vibration generated in the connection terminal 378 .

An electronic device 901 according to various embodiments includes a vibrator 965 configured to generate vibration, a connection terminal configured to be physically connected to a counterpart component, and a first part 982 connected to the vibrator 965, the A second part 983 connected to the connection terminal, and an extension part extending between the first part 982 and the second part 983 and configured to transmit vibration generated by the vibrator 965 to the connection terminal. A vibration transmission structure 981 including 984 may be included.

Claims (20)

a vibration generating unit configured to generate vibration;
a connection terminal configured to be physically connected to a counterpart component; and
A first part connected to the vibration generating unit, a second part connected to the connecting terminal, and an extension extending between the first part and the second part and configured to transmit vibration generated by the vibration generating unit to the connecting terminal. A vibration transmission structure including a part;
An electronic device comprising a. According to claim 1,
The electronic device further includes a circuit board connected to the connection terminal, wherein the vibration generating unit and the circuit board are separated from each other. According to claim 1,
The electronic device further includes a plate including a first accommodating portion configured to accommodate the first portion of the vibration transmission structure and a second accommodating portion configured to accommodate the second portion of the vibration transmission structure. According to claim 3,
The extension part is an electronic device embedded in the plate. According to claim 1,
A housing including a first surface, a second surface opposite to the first surface, and a third surface surrounding a space between the first surface and the second surface,
The vibration generator,
a fourth surface facing the first surface, a fifth surface opposite the fourth surface and facing the second surface, and a radiating aperture at least partially enclosing a space between the fourth surface and the fifth surface. An enclosure comprising six sides; and
a radiation plate positioned inside the enclosure and between the fourth and fifth faces;
including,
The first part of the vibration transmission structure is connected to the radiation plate. According to claim 1,
A housing including a first surface, a second surface opposite to the first surface, and a third surface surrounding a space between the first surface and the second surface,
The vibration generator,
a fourth surface facing the first surface, a fifth surface opposite the fourth surface and facing the second surface, and a radiating aperture at least partially enclosing a space between the fourth surface and the fifth surface. An enclosure comprising six sides; and
a radiation plate positioned inside the enclosure and between the fourth and fifth faces;
including,
The electronic device of claim 1 , wherein the first portion of the vibration transmission structure is positioned adjacent to the radiating opening. According to claim 1,
A housing including a first surface, a second surface opposite to the first surface, and a third surface surrounding a space between the first surface and the second surface,
a fourth surface facing the first surface, a fifth surface opposite the fourth surface and facing the second surface and having a radiating aperture, and at least partially enclosing a space between the fourth and fifth surfaces. an enclosure comprising a sixth face; and
a radiation plate located inside the enclosure and on the fifth side;
including,
The first part of the vibration transmission structure is connected to the radiation plate. According to claim 1,
A housing including a first surface, a second surface opposite to the first surface, and a third surface surrounding a space between the first surface and the second surface,
a fourth surface facing the first surface and having a radiating aperture, a fifth surface opposite the fourth surface and facing the second surface, and at least partially enclosing a space between the fourth and fifth surfaces; an enclosure comprising a sixth face; and
a radiation plate located inside the enclosure and on the fourth side;
including,
The first part of the vibration transmission structure is connected to the radiation plate. According to claim 1,
the extension,
a plurality of linear segments; and
at least one bent portion formed between a pair of adjacent linear portions;
An electronic device comprising a. According to claim 1,
The electronic device of claim 1 , wherein the extension portion includes a filling structure substantially filled with a medium without a hollow portion. According to claim 1,
The electronic device further includes a bonding portion for bonding the second portion of the vibration transmission structure and the connecting terminal. According to claim 1,
The electronic device further includes a fastening part fastening the second part of the vibration transmission structure and the connecting terminal. According to claim 1,
The electronic device configured to generate vibration of the ultrasonic band. According to claim 1,
The electronic device of claim 1 , wherein the vibration generating unit includes a sound output module. According to claim 1,
The electronic device of claim 1, wherein the vibration generating unit includes a vibrator. According to claim 1,
The electronic device of claim 1, wherein the connection terminal includes a USB connector. According to claim 1,
a sensor configured to sense fluid in the connection terminal; and
a processor generating a signal to cause the vibration generator to vibrate when the sensor detects the fluid;
An electronic device further comprising a. According to claim 1,
an input unit configured to receive a user's input regarding a vibration generating mode in which the vibration generating unit generates the vibration; and
a processor for generating a signal to cause the vibration generating unit to generate the vibration when the input unit receives the input;
An electronic device further comprising a. a sound output module configured to generate vibrations in an ultrasonic band;
a connection terminal configured to be physically connected to a counterpart component; and
A first part connected to the sound output module, a second part connected to the connection terminal, and an extension extending between the first part and the second part and configured to transmit vibration generated in the sound output module to the connection terminal. A vibration transmission structure including a part;
An electronic device comprising a. a vibrator configured to generate vibration;
a connection terminal configured to be physically connected to a counterpart component; and
A vibration comprising a first part connected to the vibrator, a second part connected to the connection terminal, and an extension part extending between the first part and the second part and configured to transmit vibration generated in the vibrator to the connection terminal. delivery structure;
An electronic device comprising a.

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