KR20230038987A - Apparatus for injecting gas - Google Patents

Abstract

The present invention relates to a gas injection device, and more particularly, to the gas injection device for injecting a gas onto a substrate carried into an internal space of a chamber. The gas injection device according to an embodiment of the present invention is the gas injection device for supplying gas to a chamber, comprising: a cover part to which RF power is supplied; an injection part disposed below the cover part to inject gas; an insulating part disposed between the cover part and the injection part so that the cover part and the injection part are spaced apart from each other; a connection part connecting the cover part and the injection part so that RF power is transmitted to the injection part; and a coupling part that sequentially penetrates the injection part and the insulating part to connect the cover part and the injection part.

Description

Gas injection device {APPARATUS FOR INJECTING GAS}

The present invention relates to a gas injection device, and more particularly, to a gas injection device for injecting a gas onto a substrate carried into an internal space of a chamber.

Semiconductor devices, solar cells, and display devices are manufactured by depositing and patterning various materials in the form of thin films on a substrate. To this end, several different thin film processing processes such as a deposition process and an etching process are performed.

A thin film processing process is performed in a substrate processing apparatus including a chamber having a sealed inner space, and a gas spraying device for spraying gas to a loaded substrate is installed in a lid of the chamber. Recently, a Plasma Enhanced Chemical Vapor Deposition (PECVD) method in which a deposition process is performed by forming plasma in an internal space using a radio frequency (RF) power source has been widely used. In this plasma-enhanced chemical vapor deposition method, the gas injection device serves as an upper electrode for generating plasma by generating a voltage difference in addition to a role of injecting gas onto the substrate.

The gas injection device includes a diffuser cover to which high-frequency power is applied to form plasma in the inner space of the chamber, and a shower head installed below the diffuser cover and having a plurality of injection holes for injecting gas to a substrate ( showerhead).

In general, in a thin film processing process, an internal space of a chamber is maintained at a high temperature to thermally decompose a gas. The gas injection device is provided by coupling a showerhead to a diffuser cover to which high-frequency power is applied. The diffuser cover and the showerhead have different degrees of thermal expansion due to differences in structure or material. Due to this difference in the degree of thermal expansion, micro arcing occurs between the diffuser cover and the showerhead due to friction, and foreign substances such as particles generated by the micro arcing deteriorate the quality of the thin film produced. There was a problem that caused

KR 10-2003-0066118 A

The present invention provides a gas injection device capable of minimizing the generation of foreign substances due to friction between parts.

A gas injection device according to an embodiment of the present invention is a gas injection device for supplying gas to a chamber, comprising: a cover portion to which RF power is supplied; a spraying unit disposed below the cover unit to spray gas; an insulating part disposed between the cover part and the spraying part so that the cover part and the spraying part are spaced apart from each other; a connection unit connecting the cover unit and the dispensing unit so that RF power is transmitted to the dispensing unit; and a coupling part connecting the cover part and the spraying part by sequentially penetrating the spraying part and the insulating part.

The insulating part may be formed of a synthetic resin material including polytetrafluoroethylene (PTFE).

The insulating part may extend along an edge area of the cover part.

One end of the connection part may be disposed between the edge region of the cover part and the insulating part, and the other end may extend downward of the injection part.

The coupling part may be coupled to the cover part by penetrating one end and the other end of the connection part.

The cover part may include a protrusion formed to protrude downward from an inside of the edge area.

Further, a gas injection device according to an embodiment of the present invention is a gas injection device for supplying gas to a chamber, comprising: a cover portion provided with a gas inlet for introducing gas; an injection unit spaced apart from the lower side of the cover unit and injecting gas introduced through the gas inlet; and an insulating part extending along an edge region of the cover part between the cover part and the spraying part and having a plurality of insulating members.

The plurality of insulating members may contact each other and be arranged in an extension direction.

The plurality of insulating members may be arranged to partially overlap each other in a direction crossing the extending direction.

At least some of the contact surfaces of the plurality of insulating members may be provided to face a separation space between the cover part and the injection part.

According to an embodiment of the present invention, by disposing an insulating part having a low friction coefficient between the cover part and the spraying part, it is possible to suppress the occurrence of foreign substances due to friction between the cover part and the spraying part.

In addition, by arranging a plurality of insulating members to form the insulating part, manufacturing can be facilitated and costs can be reduced, and even when the size of the gas injection device increases according to the large area of the substrate, it can effectively cope with this.

1 is a view schematically showing a substrate processing apparatus including a gas injection apparatus according to an embodiment of the present invention.
2 is an enlarged view of part A of FIG. 1;
3 is a schematic view of an insulating unit according to an embodiment of the present invention;
4 is a view schematically showing how plasma is formed according to the connection position of the connection part according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention will not be limited to the embodiments disclosed below, but will be implemented in various different forms, only the embodiments of the present invention will make the disclosure of the present invention complete, and will make the scope of the invention clear to those skilled in the art. It is provided to fully inform you. In order to explain the invention in detail, the drawings may be exaggerated, and like reference numerals refer to like elements in the drawings.

1 is a diagram schematically illustrating a substrate processing apparatus including a gas injection apparatus according to an embodiment of the present invention. In addition, FIG. 2 is an enlarged view of portion A of FIG. 1 , and FIG. 3 is a schematic view of an insulation unit according to an embodiment of the present invention.

1 to 3, a substrate processing apparatus according to an embodiment of the present invention is an apparatus for performing various thin film processing processes such as depositing and patterning a thin film, and includes a chamber 10, the chamber 10 A substrate support device 20 for supporting a substrate provided in the chamber 10, provided in the chamber 10 so as to face the substrate support device 20, and the substrate support device 20 ) and a gas supply pipe 40 for supplying gas to the gas injection device 30 and the gas injection device 30 for injecting gas. In addition, the substrate processing apparatus may further include an RF power source (not shown) for applying power to generate plasma in the chamber 10 and a controller (not shown) for controlling the RF power source.

The chamber 10 provides a predetermined reaction space and keeps it airtight. The chamber 10 includes a body 120 having a predetermined reaction space including a substantially circular or quadrangular plane portion and a side wall portion extending upward from the planar portion, and a substantially circular or quadrangular shape positioned on the body 120 to provide a reaction space. It may include a cover 110 to keep the airtight. However, the chamber 10 is not limited thereto and may be manufactured in various shapes corresponding to the shape of the substrate.

An exhaust port (not shown) may be formed in a predetermined area of the lower surface of the chamber 10 , and an exhaust pipe (not shown) connected to the exhaust port may be provided outside the chamber 10 . Also, the exhaust pipe may be connected to an exhaust device (not shown). As an exhaust device, a vacuum pump such as a turbo molecular pump may be used. Therefore, the inside of the chamber 10 can be vacuumed up to a predetermined reduced pressure atmosphere, for example, a predetermined pressure of 0.1 mTorr or less by the exhaust device. The exhaust pipe may be installed not only on the lower surface of the chamber 10 but also on the side surface of the chamber 10 below the substrate support device 20 to be described later. In addition, it goes without saying that a plurality of exhaust pipes and corresponding exhaust devices may be further installed to reduce the exhausting time.

Meanwhile, a substrate provided into the chamber 10 may be placed on the substrate support device 20 for a thin film forming process. Here, the substrate may be, for example, a silicon substrate, a glass substrate, or a plastic substrate (PE, PES, PET, PEN, etc.) in the case of implementing a flexible display. In addition, a reflective substrate may be used as the substrate 100, and in this case, a metal substrate may be used. The substrate support device 20 may be provided with, for example, an electrostatic chuck so that such a substrate may be seated and supported, and may adsorb and hold the substrate by electrostatic force, or may support the substrate by vacuum adsorption or mechanical force. .

The substrate support device 20 may be provided in a shape corresponding to the shape of the substrate, for example, a circular shape or a rectangular shape. The substrate support device 20 may include a substrate support part 210 on which a substrate is seated and an elevation part 220 disposed below the substrate support part 210 to move the substrate support part 210 up and down. Here, the substrate supporter 210 may be manufactured to be larger than the substrate, and the elevation part 220 is provided to support at least one region of the substrate supporter 210, for example, the center, and the substrate is placed on the substrate supporter 210. When the substrate support 210 is seated, the substrate support 210 may be moved closer to the gas injection device 30 . In addition, a heater (not shown) may be installed inside the substrate support 210 . The heater generates heat to a predetermined temperature to heat the substrate support 210 and the substrate seated on the substrate support 210 so that a thin film is uniformly deposited on the substrate.

The gas supply pipe 40 is installed to pass through the cover 110 of the chamber 10 to supply gas to the gas injection device 30 installed in the chamber 10 . An RF power source may be connected to the gas supply pipe 40 , and RF power applied from the RF power source may be provided to the cover part 310 and the injection part 320 connected to the gas supply pipe 40 . In this case, the substrate support device 20 may be grounded, and thus plasma may be formed in a process space between the substrate support device 20 and the gas injection device 30 . Detailed configurations of the gas injection device 30 according to the embodiment of the present invention including the cover part 310 and the injection part 320 will be described in detail below.

Gas injection device 30 according to an embodiment of the present invention is a gas injection device 30 for supplying gas to the chamber 10, the cover portion 310 to which RF power is supplied, the cover portion 310 A spraying part 320 disposed on the lower side and spraying gas, and an insulating part 330 disposed between the cover part 310 and the spraying part 320 so that the cover part 310 and the spraying part 320 are spaced apart. , By sequentially passing through the connection part 340 connecting the cover part 310 and the injection part 320, the injection part 320, and the insulation part 330 so that the RF power is transmitted to the injection part 330. A coupling part 360 connecting the cover part 310 and the injection part 320 is included.

On the other hand, the gas injection device 30 according to an embodiment of the present invention is a gas injection device 30 for supplying gas to the chamber 10, the cover portion 310 provided with a gas inlet for introducing the gas, the A dispensing unit 320 spaced apart from the lower side of the cover unit 310 and injecting gas introduced through the gas inlet, and between the cover unit 310 and the dispensing unit 320, the cover unit 310 It may also include an insulating portion 330 extending along the edge region and having a plurality of insulating members 332 . Hereinafter, each configuration of the gas injection device 30 according to an embodiment of the present invention will be described in detail.

The process space of the chamber 10 is isolated from the outside by the cover 110, and a cover part 310 provided with a gas inlet for introducing gas is disposed inside the cover 110. Here, the cover unit 310 may refer to a diffuser cover or a backing plate, and RF power may be supplied to the cover unit 310 from the RF power source described above.

The cover part 310 may be provided in a plate shape having a predetermined thickness traversing the process space in the transverse direction, that is, along the X-Y plane, and the outermost part of the cover part 310 is covered by the cover 110 of the chamber 10. It may have a supported structure. Such a cover part 310 is generally formed of a metal material including aluminum (Al).

The cover part 310 has a central portion through which a gas inlet is formed, and a gas supply pipe 40 may be connected to the gas inlet. The injection unit 320 is disposed on the lower side of the cover unit 310 at a predetermined interval. The gas supplied from the gas supply pipe 40 flows into the lower side of the cover unit 310, and the cover unit 310 and the spray unit It can diffuse in the spaced space (D) between (320).

The injection unit 320 is spaced apart from the cover unit 310 by a predetermined distance to the lower side of the cover unit 310 to form a separation space D between them. The spraying unit 320 is disposed below the central region of the cover unit 310 and is configured to spray a gas flowing in from a gas inlet provided in the cover unit 310 and diffused in the separation space D to the substrate. It may include a body 322 having a spray hole H of the body 322 and a support 324 extending outward from an outer circumferential surface of the body 322 and coupled to an edge region of the cover part 310 . The main body 322 and the support 324 may be integrally formed or provided separately and coupled to each other, and may be formed of a metal material generally containing aluminum (Al).

On the other hand, at least a portion of the support 324 is overlapped in the vertical direction, that is, in the Z-axis direction, with the edge area of the cover part 310 described above, that is, the area extending inward from the outer circumferential surface of the cover part 310 by a predetermined distance. provided At this time, when the outermost side of the cover part 310 has a structure supported by the lid 110 of the chamber 10, the edge area of the cover part 310 is a predetermined distance from the outer circumferential surface of the cover part 310 to the inside. Among the extended areas, it may be an area excluding the outermost side of the cover part 310 supported by the cover 110 .

Conventionally, the above-described edge area of the cover part 310 and the support 324 of the injection part 320 are directly coupled through a coupling part 360 such as a bolt. However, when the edge area of the cover part 310 and the support 324 of the spraying part 320 are directly coupled through the coupling part 360 as described above, thermal expansion between the cover part 310 and the spraying part 320 occurs. Due to the difference in degree, friction is generated between the cover part 310 and the injection part 320, and the grinding foreign matter generated by the friction flows into the separation space D between the cover part 310 and the injection part 320. There was a problem of deteriorating the quality of the thin film to be manufactured.

Therefore, in the embodiment of the present invention, the insulating part 330 extending along the edge area of the cover part 310 is disposed on the lower side of the cover part 310, that is, between the cover part 310 and the spraying part 320. , It is possible to prevent direct contact between the cover part 310 and the injection part 320 and to minimize the occurrence of foreign substances.

The insulation unit 330 can withstand high temperatures in the chamber 10 and may be formed of a heat-resistant synthetic resin material having a low coefficient of friction. Such a heat-resistant synthetic resin may include polytetrafluoroethylene (PTFE; Polytetrafluoroethylene), that is, Teflon ^TM .

Here, the insulating unit 330 may be integrally formed, but may also be formed by including a plurality of insulating members 332 arranged along the extension direction.

When the insulating part 330 is disposed between the cover part 310 and the injection part 320 , the insulating part 330 has a shape extending along the edge area of the cover part 310 . However, when the size of the gas injection device increases with the increase in the area of the substrate, the size of the insulating unit 330 also needs to increase accordingly. In order to elaborately manufacture the insulating part 330 having an increased size and extending along the edge area of the cover part 310, a lot of time and money are consumed. In the embodiment of the present invention, a plurality of insulating parts Forming the insulating portion 330 with the member 332 not only facilitates manufacturing and reduces cost, but also effectively responds to the case where the gas injection device is enlarged according to the large area of the substrate.

In more detail, the insulating member 332 according to the embodiment of the present invention is formed of a synthetic resin material including polytetrafluoroethylene (PTFE) and extends along the edge area of the cover part 310. It has a shape obtained by cutting the insulating portion 330 into a cross section crossing the extension direction. For example, the insulating member 332 may have a bar shape extending in one direction or may have a bar shape bent at an angle of 90°. However, it goes without saying that the shape of the insulating member 332 is not limited thereto and may be configured in various ways.

As such, the insulating member 332 may be arranged along the edge area of the cover part 310, and the gas diffused in the spaced space D due to the gap between the insulating members 332 is discharged from the gas injection device 30. In order to prevent leakage to the outside of the plurality of insulating members 332 may be arranged in contact with each other.

3 is a view showing an embodiment in which a plurality of insulating members 332 are arranged in contact with each other. In FIG. 3, it is shown that a plurality of insulating members 332 are provided on the injection unit 320, and the injection hole H formed in the main body 322 is omitted.

As shown in FIG. 3 , the plurality of insulating members 332 may contact each other and be disposed along the edge area of the cover unit 310 without gaps. In this case, the plurality of insulating members 332 may be arranged to partially overlap each other in a direction crossing the extending direction, that is, in a direction toward the outside of the cover part 310 . This means that even when the insulating members 332 adjacent to each other are placed in contact with each other, a predetermined gap may occur between them. This is to prevent gas leakage as much as possible. In addition, as shown in FIG. 3 , the plurality of insulating members 332 are arranged so that at least a portion of the contact surface 332a in contact with each other faces the separation space D between the cover part 310 and the injection part 320. may be provided. This is also to prevent gas from leaking into gaps between adjacent insulating members 332, and at least a portion 332a of the contact surfaces that come into contact with each other in this way is a gap between the cover part 310 and the injection part 320. When the plurality of insulating members 332 are disposed so as to face the separation space D, adjacent insulating members 332 can be coupled to each other through contact surfaces, thereby improving fixing force.

As described above, the insulator 330 is made of a synthetic resin material including polytetrafluoroethylene (PTFE) having a low coefficient of friction. In this case, since the insulator 330 has electrical insulation, a problem arises in that RF power supplied from the RF power source to the cover unit 310 cannot be transmitted to the injection unit 320 .

Accordingly, the gas injection device 30 according to an embodiment of the present invention may include a connection part 340 electrically connecting the cover part 310 and the injection part 320 so that RF power is transmitted to the injection part 320. can The connection part 340 may be formed of a metal material having conductivity, and has a band shape extending from one end to the other end, so that the RF power supplied to the cover part 310 can be transmitted to the injection part 320. (strap) may be included.

Here, the connection part 340 may be provided in various positions connecting the cover part 310 and the injection part 320 . That is, the connection part 340 has one end connected to one surface of the cover part 310, for example, the left surface of the cover part 310 in FIG. 2, and the other end connected to one surface of the spraying part 320, for example In FIG. 2 , it may be provided to be connected to the left side or lower surface of the injection unit 320 .

On the other hand, in the embodiment of the present invention, one end of the connection part 340 is disposed between the edge area of the cover part 310 and the insulating part 330, and the other end of the connection part 340 is at the lower side of the injection part 320. It may be provided to extend to . As such, one end of the connection part 340 is disposed between the edge area of the cover part 310 and the insulating part 330, and the other end of the connection part 340 is disposed to extend downward from the injection part 320. In this case, the coupling part 360 for coupling the cover part 310 and the injection part 320 may be coupled at the lower side of the injection part 320 so as to pass through one end and the other end of the connection part 340, so that the connection part (340) can be installed more firmly. At this time, in order to improve the bonding force of the coupling unit 360, as shown in FIG. 2, a separate clamping unit 350 is provided below the injection unit 320, and the coupling unit 360 is the clamping unit 350. ), the other end of the connection part 340, the support 324 of the spraying part 320, the insulation part 330, and one end of the connection part 340 may be sequentially passed through and coupled to the cover part 310. Of course.

In this way, when one end of the connection part 340 is disposed between the edge region of the cover part 310 and the insulating part 330, as described above, the cover part 310 is made of a material containing aluminum (Al). And, since the connection part 340 is formed of a metal material, grinding foreign matter may occur from the interface I between the cover part 310 and the connection part 340 . Therefore, in the embodiment of the present invention, the protruding portion 312 is formed on the cover portion 310 so that the interface between the edge area of the cover portion 310 and one end of the connection portion 340 is not exposed to the separation space D. can do. Here, the protrusion 312 may be formed to protrude downward from the inside of the edge region of the cover part 310 to a height lower than the interface between the edge region of the cover part 310 and one end of the connection part 340, Accordingly, even when grinding foreign substances are generated from the interface (I) between the cover part 310 and the connection part 340, it is possible to prevent the generated foreign substances from flowing into the separation space (D).

Meanwhile, the connection unit 340 may be detachably installed, and at this time, the connection unit 340 electrically connects the cover unit 310 and the injection unit 320 at a plurality of positions along the edge area of the cover unit 310 . It may be provided in plurality to connect. As described above, the connection unit 340 serves to transfer the RF power supplied to the cover unit 310 to the injection unit 320, depending on the location where the connection unit 340 is connected to the injection unit 320 and A shape of plasma generated between the substrate supporters 210 may be controlled.

4 is a diagram schematically showing how plasma is formed depending on the connection position of the connection part according to an embodiment of the present invention. In FIG. 4 , a plurality of connecting parts 340 are provided on the spraying part 320, and the spraying hole H formed in the main body 322 is omitted.

For example, as shown in FIG. 4(a) , when the connection part 340 is formed only along the long side and the short side of the edge region of the cover part 310, the injection part 320 and the substrate support part 210 When viewed from above, the plasma P1 generated therebetween may be formed in a substantially rectangular shape with rounded corners. On the other hand, as shown in FIG. 4( b ), when the connection part 340 is formed only in the corner of the edge area of the cover part 310, it occurs between the injection part 320 and the substrate support part 210. The plasma P2 to be may be formed in an elliptical shape when viewed from the top. Therefore, in the embodiment of the present invention, the density of the plasma is adjusted by controlling the position where the plurality of connection parts 340 connect the cover part 310 and the spray part 320 according to the desired shape of the plasma, and accordingly, the thickness of the thin film Characteristics and uniformity can be easily adjusted.

As described above, according to an embodiment of the present invention, the insulating part 330 having a low friction coefficient is disposed between the cover part 310 and the spraying part 320 to cause friction between the cover part 310 and the spraying part 320. The generation of foreign matter can be suppressed.

In addition, by arranging a plurality of insulating members 332 to form the insulating portion 330, not only can manufacturing be facilitated and cost reduced, but also when the gas injection device 30 is enlarged according to the large area of the substrate. can also be effectively dealt with.

In the above, although preferred embodiments of the present invention have been described and illustrated using specific terms, such terms are only intended to clearly explain the present invention, and the embodiments and described terms of the present invention are the technical spirit of the following claims. And it is obvious that various changes and changes can be made without departing from the scope. Such modified embodiments should not be individually understood from the spirit and scope of the present invention, and should be said to fall within the scope of the claims of the present invention.

10: chamber 20: substrate support device
30: gas injection device 40: gas supply pipe
310: cover part 320: injection part
330: insulation part 340: connection part
350: clamping part 360: coupling part

Claims (10)

A gas injection device for supplying gas to the chamber,
a cover portion to which RF power is supplied;
a spraying unit disposed below the cover unit to spray gas;
an insulating part disposed between the cover part and the spraying part so that the cover part and the spraying part are spaced apart from each other;
a connection unit connecting the cover unit and the dispensing unit so that RF power is transmitted to the dispensing unit; and
and a coupling part connecting the cover part and the spraying part by sequentially penetrating the spraying part and the insulating part. The method of claim 1,
The gas injection device of claim 1, wherein the insulating portion is formed of a synthetic resin material including polytetrafluoroethylene (PTFE). The method of claim 1,
The gas injection device of claim 1, wherein the insulating portion extends along an edge region of the cover portion. The method of claim 3,
The gas injection device of claim 1 , wherein one end of the connection part is disposed between the edge region of the cover part and the insulating part, and the other end part extends below the injection part. The method of claim 4,
The coupling part passes through one end and the other end of the connection part and is coupled to the cover part. The method of claim 4,
The gas injection device of claim 1, wherein the cover part includes a protrusion formed to protrude downward from an inside of an edge region. A gas injection device for supplying gas to the chamber,
a cover portion provided with a gas inlet for introducing gas;
an injection unit spaced apart from the lower side of the cover unit and injecting gas introduced through the gas inlet; and
and an insulating part extending along an edge region of the cover part between the cover part and the spraying part and having a plurality of insulating members. The method of claim 7,
The plurality of insulating members are in contact with each other and arranged in an extension direction. The method of claim 7,
The plurality of insulating members are arranged to partially overlap each other in a direction crossing the extending direction. The method of claim 8,
The gas injection device of claim 1, wherein at least a portion of contact surfaces of the plurality of insulating members are in contact with each other to face a separation space between the cover part and the spray part.

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