KR20230038679A - Copper foil capable of manufacturing high capacity secondary battery, electrode comprisng the same, secondary battery comprising the same and method for manufacturing the same - Google Patents

Abstract

One embodiment of the present invention provides a copper foil and a method for manufacturing the copper foil. The copper foil includes a copper layer having a matte surface and a shiny surface, and a rust-prevention film disposed on the copper layer, and has a tensile strength at room temperature (25 ± 15℃) of 40 to 60kgf/mm^2 and a high-temperature tensile strength of 36 to 55kgf/mm^2 after heat treatment for 1 hour at 190℃. The copper layer has crystalline particles. After heat treatment for 1 hour at room temperature and 190℃, the crystalline particles have an average particle size of 0.7 to 1.5㎛.

Description

Copper foil enabling the production of high-capacity secondary batteries, an electrode including the same, a secondary battery including the same, and a manufacturing method thereof MANUFACTURING THE SAME}

The present invention relates to a copper foil capable of manufacturing a high-capacity secondary battery, an electrode including the same, a secondary battery including the same, and a manufacturing method thereof.

A secondary battery is a type of energy conversion device that generates electricity by converting electrical energy into chemical energy and storing it, and then converting chemical energy back into electrical energy when electricity is needed. Secondary batteries are also referred to as rechargeable batteries in that they can be recharged.

Among these secondary batteries, lithium secondary batteries have high operating voltage, high energy density, and excellent lifespan characteristics. A secondary battery includes a negative current collector made of copper foil, and among copper foils, an electrolytic copper foil is widely used as a negative current collector of a secondary battery.

An electrodeposited copper foil used as an anode current collector typically has a tensile strength of about 30 to 40 kgf/mm ² . Recently, in order to manufacture a high-capacity lithium secondary battery, a metal-based or composite-based active material having high-capacity characteristics has been in the spotlight, and the metal-based or composite-based active material has severe volume expansion during charging and discharging processes. Therefore, the copper foil must be able to cope with the volume expansion of the active material so that the copper foil is not torn and the active material is not detached from the copper foil even when the active material expands in volume. In order to cope with the volume expansion of the active material, the copper foil must have high-strength characteristics, and the tensile strength of the copper foil must be maintained even through a high-temperature process such as active material coating and drying.

On the other hand, in order to manufacture a high-strength copper foil having a tensile strength of 40 kgf/mm ² or more, for example, electroplating is performed using a sulfuric acid-based electrolyte solution to which a multi-component additive or a thiourea-based organic additive is added. There is a way to do it.

However, when the tensile strength of the copper foil increases, the stress inside the copper foil increases and the frequency of occurrence of curl in the copper foil increases. When curl occurs in copper foil, in the process of manufacturing copper foil by the Roll to Roll (RTR) process or in the process of manufacturing electrodes for secondary batteries using copper foil, wrinkles occur in the copper foil or the copper foil is torn. defects may occur.

In order to increase the capacity of secondary batteries, copper foil in a very thin and ultra-thin form is used to manufacture secondary battery electrodes. For example, ultra-thin copper foil having a thickness of 10 μm or less is used. However, such a thin copper foil has low handling, and due to the low handling, it may be impossible to manufacture a secondary battery electrode using the copper foil.

Therefore, in order to improve handling and workability in the secondary battery manufacturing process and to use a metal-based active material, it is necessary to develop a copper foil capable of maintaining high tensile strength even when subjected to a high-temperature process.

The present invention relates to a copper foil capable of satisfying the above requirements, an electrode including the same, a secondary battery including the same, and a method for manufacturing the copper foil.

One embodiment of the present invention is to provide a copper foil having a high tensile strength even after heat treatment at a high temperature.

Another embodiment of the present invention controls the crystal structure of the copper foil so that the copper foil has high tensile strength even after heat treatment at a high temperature.

Another embodiment of the present invention is to provide a copper foil having densely arranged crystalline particles by properly selecting an organic additive and adjusting the content thereof.

Another embodiment of the present invention is to provide a secondary battery electrode including such a copper foil, and a secondary battery including such a secondary battery electrode.

Another embodiment of the present invention is a copper foil having densely arranged crystalline particles by properly selecting an organic additive included in an electrolyte solution used for manufacturing a copper foil and adjusting the content thereof to control the crystal structure of the copper foil. It is intended to provide a manufacturing method.

In addition to the aspects of the present invention mentioned above, other features and advantages of the present invention will be described below, or will be clearly understood by those skilled in the art from such description.

One embodiment of the present invention provides a copper foil having excellent tensile strength even after heat treatment by controlling the crystallinity of the copper foil.

To this end, one embodiment of the present invention is a copper layer having a matte surface and a shiny surface; and a rust-preventive film disposed on the copper layer; including, room temperature (25±15° C.) tensile strength of 40 to 60 kgf/mm ² ; And after heat treatment at 190 ° C. for 1 hour, high temperature tensile strength of 36 to 55 kgf / mm ² , wherein the copper layer has crystalline particles, and after heat treatment at room temperature and 190 ° C. for 1 hour, the crystalline particles provides a copper foil having an average particle size of 0.7 to 1.5 μm.

The copper foil has a maximum curl height of 15 mm or less.

The copper foil has a first surface in the mat surface direction and a second surface in the shiny surface direction, and the first surface and the second surface each have a surface roughness (Rz JIS) of 0.5 to 2.0 μm.

The copper foil has a thickness of 4 to 35 μm.

The anti-rust film includes at least one of chromium, a silane compound and a nitrogen compound.

Another embodiment of the present invention provides a secondary battery electrode including the copper foil and an active material layer disposed on at least one surface of the copper foil.

Another embodiment of the present invention, the anode (cathode); a cathode disposed opposite to the anode; an electrolyte disposed between the positive electrode and the negative electrode to provide an environment in which lithium ions can move; and a separator that electrically insulates the positive electrode from the negative electrode, wherein the negative electrode includes the copper foil and an active material layer disposed on the copper foil.

Another embodiment of the present invention, forming a copper layer by conducting a current density of 30 to 80 ASD (A / dm ² ) to a cathode plate and a rotating cathode drum disposed spaced apart from each other in an electrolyte solution containing copper ions; It includes, wherein the electrolyte solution is 60 to 120 g / L of copper ions; 80 to 150 g/L sulfuric acid; Chlorine (Cl) less than 50 ppm; and an organic additive, wherein the organic additive is at least one selected from a brightener (component A) and a moderator (component B); and a leveling agent (component C), wherein the brightening agent (component A) includes sulfonic acid or a metal salt thereof, the moderator (component B) includes a nonionic water-soluble polymer, and the leveling agent (component C) Provides a method for manufacturing a copper foil containing at least one of nitrogen (N) and sulfur (S).

In the step of forming the copper layer, the temperature of the electrolyte solution is maintained in the range of 40 to 60 °C.

The brightener has a concentration of 5 to 100 ppm.

The brightener is bis-(3-sulfopropyl)-disulfide disodium salt [bis-(3-Sulfopropyl)-disulfide disodium salt] (SPS), 3-mercapto-1-propanesulfonic acid, 3-(N,N -Dimethylthiocarbamoyl)-thiopropanesulfonate sodium salt, 3-[(amino-iminomethyl)thio]-1-propanesulfonate sodium salt, o-ethyldithiocarbonate-S-(3-sulfopropyl )-ester sodium salt, 3-(benzothiazolyl-2-mercapto)-propyl-sulfonic acid sodium salt, and ethylenedithiodipropylsulfonic acid sodium salt.

The moderator has a concentration of 5 to 50 ppm.

The moderator is polyethylene glycol (PEG), polypropylene glycol, polyethylene polypropylene copolymer, polyglycerin, polyethylene glycol dimethyl ether, hydroxyethylene cellulose, polyvinyl alcohol, stearic acid polyglycol ether and stearyl alcohol polyglycol It includes at least one nonionic water-soluble polymer selected from ether.

The nonionic water-soluble polymer has a number average molecular weight of 500 to 25,000.

The leveling agent has a concentration of 1 to 50 ppm.

The leveling agent is diallyldimethylammonium chloride (DDAC), thiourea, N, N'-dimethylthiourea, N, N'-diethylthiourea, tetramethylthiourea, ethylenethiourea, 2-mercapto- 5-benzimidazolesulfonic acid, 3(5-mercapto-1H-tetrazole)benzenesulfonate, 2-mercaptobenzothiazole, 5-mercapto-1-methyltetrazole (5-MM) and polyethyleneimine ( It includes at least one selected from PEI).

The organic additive may include two or more different leveling agents (component C).

The organic additive may include at least one leveling agent (component C) containing nitrogen (N) and at least one leveling agent (component C) containing sulfur (S).

The manufacturing method of the copper foil further includes forming a rust-preventive film on the copper layer.

The general description of the present invention as above is only for exemplifying or explaining the present invention, and does not limit the scope of the present invention.

According to one embodiment of the present invention, the crystallinity and tensile strength of the copper foil are controlled to reduce the curl of the copper foil. Accordingly, the occurrence of wrinkles or tears in the copper foil is prevented during the manufacturing process of the copper foil or the manufacturing process of secondary battery electrodes or secondary batteries using the copper foil. In addition, a secondary battery manufactured using such a copper foil has an excellent capacity retention rate, so that high capacity of the secondary battery can be realized.

The accompanying drawings are intended to aid understanding of the present invention and constitute a part of this specification, illustrate embodiments of the present invention, and explain the principles of the present invention together with the detailed description of the invention.
1 is a schematic cross-sectional view of a copper foil according to an embodiment of the present invention.
2 is a schematic cross-sectional view of a copper foil according to another embodiment of the present invention.
3 is a schematic cross-sectional view of an electrode for a secondary battery according to another embodiment of the present invention.
4 is a schematic cross-sectional view of an electrode for a secondary battery according to another embodiment of the present invention.
5 is a schematic cross-sectional view of a secondary battery according to another embodiment of the present invention.
Figure 6 is a schematic diagram of the manufacturing process of the copper foil shown in Figure 2.
7 is a schematic diagram illustrating the measurement of the curl height of copper foil.
8a and 8b show cross-sections of the copper foil according to Preparation Example 3 before and after heat treatment, respectively.
9a and 9b show cross-sections of the copper foil according to Comparative Example 3 before and after heat treatment, respectively.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

It will be apparent to those skilled in the art that various changes and modifications of the present invention are possible without departing from the spirit and scope of the present invention. Accordingly, the present invention includes all modifications and variations within the scope of the invention described in the claims and equivalents thereof.

The shape, size, ratio, angle, number, etc. disclosed in the drawings to describe the embodiments of the present invention are exemplary, and the present invention is not limited by the details shown in the drawings. Like elements may be referred to by like reference numerals throughout the specification.

When 'includes', 'has', 'consists of', etc. mentioned in this specification is used, other parts may be added unless the expression 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise. In addition, in interpreting the components, even if there is no separate explicit description, it is interpreted as including the error range.

In the case of a description of a positional relationship, for example, 'on top of', 'on top of', 'at the bottom of', 'next to', etc. Or, unless the word 'directly' is used, one or more other parts may be located between the two parts.

In the case of a description of a temporal relationship, for example, 'immediately' or 'directly' when a temporal precedence relationship is described in terms of 'after', 'following', 'next to', 'before', etc. Unless the expression is used, non-continuous cases may be included.

Expressions such as 'first', 'second', etc. are used to describe various components, but these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, the first component mentioned below may also be the second component within the technical spirit of the present invention.

The term “at least one” should be understood to include all possible combinations from one or more related items.

Each feature of the various embodiments of the present invention can be partially or entirely combined or combined with each other, technically various interlocking and driving are possible, and each embodiment can be implemented independently of each other or can be implemented together in a related relationship. may be

1 is a schematic cross-sectional view of a copper foil 101 according to an embodiment of the present invention.

Copper foil 101 according to an embodiment of the present invention includes a copper layer 110. The copper layer 110 has a matte surface MS and an opposite shiny surface SS.

The copper layer 110 may be formed on the rotating cathode drum through, for example, electroplating (see FIG. 6). At this time, the shiny surface (SS) refers to the surface that is in contact with the rotating cathode drum during the electroplating process, and the matte surface (MS) refers to the surface opposite to the shiny surface (SS).

In general, the shiny surface (SS) has a lower surface roughness than the matte surface (MS). However, one embodiment of the present invention is not limited thereto, and the surface roughness of the shiny surface SS may be equal to or higher than that of the matte surface MS. For example, depending on the degree of polishing of the rotating cathode drum 12 (see FIG. 6) used in the manufacture of the copper layer 110, the surface roughness of the shiny surface SS may be lower than that of the matte surface MS. may or may not be high. The surface of the rotating cathode drum 12 may be polished with a polishing brush having a grit of #800 to #3000.

Referring to FIG. 1 , the copper foil 101 includes a rust-prevention film 211 disposed on the copper layer 110 . The anti-rust film 211 may be omitted.

The anti-rust film 211 may be disposed on at least one of the matte surface MS and the shiny surface SS of the copper layer 110 . Referring to FIG. 1 , an anti-rust film 211 is disposed on the mat surface MS. However, one embodiment of the present invention is not limited thereto, and the anti-rust film 211 may be disposed only on the shiny surface SS, or may be disposed on both the matte surface MS and the shiny surface SS.

The anti-rust film 211 may protect the copper layer 110 and prevent the copper layer 110 from being oxidized or deteriorated. Therefore, the anti-rust film 211 is also referred to as a protective layer.

According to an embodiment of the present invention, the anti-rust film 211 may include at least one of chromium (Cr), a silane compound, and a nitrogen compound. For example, the rust-preventive film 211 may be formed by a rust-preventive solution containing chromium (Cr), that is, a rust-preventive solution containing a chromic acid compound.

According to one embodiment of the present invention, the copper foil 101 has a first surface S1 that is a surface in the direction of the mat surface (MS) and a second surface that is a surface in the direction of the shiny surface (SS) with respect to the copper layer 110. (S2). Referring to FIG. 1 , the first surface S1 of the copper foil 101 is the surface of the anti-rust film 211, and the second surface S2 is the shiny surface SS. When the anti-rust film 211 is omitted, the matte surface MS of the copper layer 110 becomes the first surface S1 of the copper foil 101 .

According to one embodiment of the present invention, the first surface (S1) and the second surface (S2) of the copper foil 100 each have a surface roughness (Rz JIS) of 0.5 to 2.0㎛.

The surface roughness (Rz JIS) according to an embodiment of the present invention is also referred to as 10-point average roughness, and can be measured by a surface roughness measuring instrument (M300, Mahr) according to the JIS B 0601-2001 standard.

When the surface roughness (Rz JIS) of the first surface S1 and the second surface S2 of the copper foil 101 is less than 0.5 μm, respectively, when the copper foil 101 is used as a current collector for a secondary battery electrode, the copper foil ( 101) and the active material are low in peel strength, and accordingly, the active material may be separated from the copper foil 101 during charging and discharging of the secondary battery. On the other hand, when the surface roughness (Rz JIS) of the first surface S1 and the second surface S2 exceeds 2.0 μm, when the copper foil 101 is used as a current collector for a secondary battery electrode, the active material is copper foil 101 ) is not uniformly coated, so current is locally concentrated during charging and discharging of the secondary battery, and thus the charge/discharge cycle characteristics may be deteriorated, and the capacity retention rate of the secondary battery may be deteriorated.

Meanwhile, according to one embodiment of the present invention, the difference in surface roughness (Rz JIS) between the first surface S1 and the second surface S2 of the copper foil 101 may be adjusted to 0.5 μm or less.

When the difference in surface roughness (Rz JIS) between the first surface S1 and the second surface S2 of the copper foil 101 exceeds 0.5 μm, when the copper foil 101 is used as a current collector for a secondary battery electrode, Due to the difference in surface roughness (Rz JIS) between the first and second surfaces S1 and S2, the active material may not be evenly coated on both surfaces of the first and second surfaces S1 and S2. Accordingly, during charging and discharging of the secondary battery, a difference in electrical and physical characteristics between the two surfaces S1 and S2 may occur, and as a result, the lifespan of the secondary battery may rapidly decrease.

On the other hand, when the difference in surface roughness (Rz JIS) between the first surface S1 and the second surface S2 of the copper foil 101 is 0.5 μm or less, when the copper foil 101 is used as a current collector for a secondary battery electrode, the copper foil Since the coating of the active material is similar on both sides of (101), the stability and capacity retention rate of the secondary battery are excellent during charging and discharging, and thus the lifespan of the secondary battery can be increased.

According to one embodiment of the present invention, the copper foil 101 has a room temperature (25 ± 15 ℃) tensile strength of 40 to 60 kgf / mm ² . Tensile strength at room temperature (25±15℃) is called room temperature tensile strength.

Tensile strength can be measured by a universal testing machine (UTM) according to the provisions of the IPC-TM-650 Test Method Manual. According to one embodiment of the present invention, the tensile strength is measured by an Instron universal testing machine. The width of the sample for measuring tensile strength was 12.7 mm, the distance between grips was 50 mm, and the measurement speed was 50 mm/min.

When the tensile strength of the copper foil 101 at room temperature is less than 40 kgf / mm ² , when the copper foil 101 is used as a current collector for a secondary battery electrode, the copper foil 101 may be broken due to volume expansion of the active material there is. For example, a metal-based active material containing tin (Sn) or silicon (Si) has a very large volume expansion during charging and discharging, and the copper foil attached to the active material may be broken due to such large volume expansion. To prevent this, the copper foil 101 according to an embodiment of the present invention has a tensile strength of 40 kgf/mm ² or more.

In addition, when the tensile strength of the copper foil 101 at room temperature is less than 40 kgf / mm ² , the copper foil 101 curls in the roll-to-roll process for manufacturing the copper foil 101 or the secondary battery. Or wrinkles may occur.

On the other hand, when the tensile strength of the copper foil 101 at room temperature exceeds 60 kgf / mm ² , brittleness increases, so during the manufacturing process of the copper foil 101 or the manufacturing process of a secondary battery using the copper foil 101, the copper foil 101 ) may break.

Further, according to one embodiment of the present invention, the copper foil 101 has a high-temperature tensile strength of 36 to 55 kgf/mm ² after heat treatment at 190° C. for 1 hour. Here, the high-temperature tensile strength means the tensile strength measured after heat treatment of the copper foil 101 at 190 ° C. for 1 hour. Considering measurement conditions, etc., tensile strength measured after heat treatment at a temperature of 190 ± 5 ° C for 1 hour ± 5 minutes may be referred to as high temperature tensile strength.

When the high-temperature tensile strength after heat treatment at 190° C. for 1 hour is less than 36 kgf/mm ² , softening occurs in the copper foil 101 under harsh processing conditions at high temperatures, and wrinkles may occur.

On the other hand, when the high-temperature tensile strength after heat treatment exceeds 55 kgf/mm ² , brittleness of the copper foil 101 increases under harsh conditions such as active material coating or high-temperature drying, which may cause breakage of the copper foil 101.

According to one embodiment of the present invention, the copper layer 110 of the copper foil 101 has crystallinity and may include crystalline grains (see FIGS. 8a, 8b, 9a, and 9b). Physical and mechanical properties of the copper foil 101 including the copper layer 110 may vary depending on the crystallinity of the copper layer 110 .

In one embodiment of the present invention, crystalline particles have a specific polyhedral appearance, or even if they do not have a specific polyhedral appearance, the X-ray diffraction phenomenon can be confirmed by a crystal lattice consisting of a periodic arrangement of atoms Includes all possible particles.

The crystalline particles included in the copper layer 110 have an average particle size of 0.7 to 1.5 μm before and after heat treatment at 190° C. for 1 hour. More specifically, across the cross section of the copper layer 110 obtained by cutting the copper layer 110 in the thickness direction, the average particle size of the crystalline particles is 0.7 to 0.7 to 190 ° C. for 1 hour before heat treatment and after heat treatment. It is 1.5 μm.

The average particle size of crystalline particles included in the copper layer 110 may be measured by an electron back scattering diffraction (EBSD) method. More specifically, after analyzing the first surface (S1) and the second surface (S2) of the copper foil 101 by the EBSD method before or after heat treatment, the average particle size of the crystalline particles is calculated using the analysis result can For example, equipment equipped with an EBSD (Electron Backscatter Diffraction) detector (e.g. EDAX EBSD camera) in a FE-SEM (Field Emission - Scanning Electron Microscope) device (Hitachi, model name S-4300SE) Using, the average particle size of the crystalline particles included in the copper layer 110 can be measured by observing the cross section of the copper foil 101 under the measurement conditions of a voltage of 15 kV, a current of 50 mA, and a magnification of 2000 times.

Before and after heat treatment at 190 ° C. for 1 hour, when the average particle size of the crystalline particles included in the copper layer 110 is 0.7 to 1.5 μm, the copper foil 101 is 40 to 60 kgf / mm ² at room temperature (25 ± 15 ° C. ) tensile strength and high temperature tensile strength of 36 to 55 kgf/mm ² . On the other hand, when the average particle size of the crystalline particles included in the copper layer 110 is out of the range of 0.7 to 1.5 μm, the room temperature (25 ± 15 ° C.) tensile strength of the copper foil 101 is in the range of 40 to 60 kgf / mm ² , or the high-temperature tensile strength may be out of the range of 36 to 55 kgf/mm ² .

More specifically, the copper foil 101 can have high strength only when the average particle size of the crystalline particles included in the copper layer 110 is fine and small. In this regard, nitrogen (N) or sulfur (S) components derived from organic additives added to the electrolyte are co-located in the crystal grain structure of the copper layer 110, and the average number of crystalline particles included in the copper layer 110 even after heat treatment It shows a pin effect that prevents the particle size from increasing. When the average particle size of the crystalline particles included in the copper layer 110 at room temperature is 0.7 μm or less, the crystalline particles are too fine and the strength of the copper foil 101 is excessively high, resulting in increased brittleness of the copper foil 101. Accordingly, The possibility of tearing increases in the manufacturing process using a rotating cathode drum. On the other hand, when the average particle size of the crystalline particles included in the copper layer 110 exceeds 1.5 μm, it is difficult to implement high strength of the copper foil 101 .

According to one embodiment of the present invention, the size of the crystalline particles included in the copper layer 110 may not significantly increase and may be maintained even after heat treatment. Accordingly, even after heat treatment, the copper foil 101 may have excellent tensile strength.

According to one embodiment of the present invention, the maximum curl height of the copper foil 101 is 15 mm or less.

In order to measure the maximum curl height of the copper foil 101, the copper foil 101 is cut into 60 mm X 60 mm, and the copper foil 101 is placed on a support so that the first surface S1 faces upward, and then , a glass plate is placed on the copper foil 101. At this time, after setting the copper foil 101 so that only half of the copper foil 101 is positioned between the support and the glass plate by overlapping the glass plate by the length of 30 mm of the cut copper foil, the height of the copper foil exposed to the outside of the glass plate is measured, and the maximum height of the copper foil is determined. It is defined as the maximum curl height of (101) (see FIG. 7).

When the maximum curl height of the copper foil 101 exceeds 15 mm, the copper foil 101 is torn or wrinkled during winding of the copper foil 101 or during the manufacturing process of a secondary battery using the copper foil 101 ( defects such as wrinkles may occur. In addition, when a curl occurs in the copper foil 101, it may be difficult to separate the copper foil 101 from the winder WR after manufacturing the copper foil 101.

According to one embodiment of the present invention, the copper foil 101 may have a thickness of 4 μm to 35 μm. When the copper foil 101 is used as a current collector of a secondary battery electrode, the thinner the copper foil 101 is, the more current collectors can be accommodated in the same space, which is advantageous for higher capacity of the secondary battery. However, when the thickness of the copper foil 101 is less than 4 μm, workability is deteriorated during the manufacturing process of secondary battery electrodes or secondary batteries using the copper foil 101 .

On the other hand, when the thickness of the copper foil 101 exceeds 35 μm, the thickness of the secondary battery electrode using the copper foil 101 increases, and this large thickness may cause difficulties in implementing a high capacity secondary battery.

According to one embodiment of the present invention, the copper foil 100 may have an elongation of 2 to 20% after heat treatment at room temperature of 25 ± 15 ° C. or 190 ° C. for 1 hour. Elongation can be measured by a universal testing machine (UTM) according to the method specified in the IPC-TM-650 Test Method Manual. According to one embodiment of the present invention, Instron's facilities may be used. At this time, the width of the sample for elongation measurement is 12.7 mm, the distance between grips is 50 mm, and the measurement speed is 50 mm/min.

If the elongation of the copper foil 100 is less than 2%, the copper foil 101 cannot be sufficiently stretched in response to the large volume expansion of the active material used in the high-capacity secondary battery, and there is a risk of tearing. On the other hand, if the elongation is excessively large, exceeding 20%, the copper foil 101 is easily stretched in the manufacturing process of the electrode for a secondary battery, and deformation of the electrode may occur.

2 is a schematic cross-sectional view of a copper foil 102 according to another embodiment of the present invention. Hereinafter, descriptions of components already described are omitted to avoid redundancy.

Referring to FIG. 2 , the copper foil 102 according to another embodiment of the present invention includes a copper layer 110 and two anti-rust surfaces disposed on the matte surface MS and the shiny surface SS of the copper layer 110, respectively. It includes membranes 211 and 212. Compared to the copper foil 101 shown in FIG. 1 , the copper foil 102 shown in FIG. 2 further includes an anti-rust film 212 disposed on the shiny surface SS of the copper layer 110 .

For convenience of description, among the two anti-rust films 211 and 212, the anti-rust film 211 disposed on the matte surface MS of the copper layer 110 is referred to as a first protective layer and disposed on the shiny surface SS. The anti-rust film 212 is also referred to as a second protective layer.

In addition, the copper foil 102 shown in FIG. 2 has a first surface S1, which is a surface in the direction of the matte surface (MS), and a second surface, which is a surface in the direction of the shiny surface (SS), based on the copper layer 110. (S2). Here, the first surface S1 of the copper foil 102 is the surface of the anti-rust film 211 disposed on the mat surface MS, and the second surface S2 is the surface of the anti-rust film 212 disposed on the shiny surface SS. ) is the surface of

According to another embodiment of the present invention, each of the two anti-rust films 211 and 212 may include at least one of chromium (Cr), a silane compound, and a nitrogen compound.

Copper foil 102 according to another embodiment of the present invention has a room temperature (25 ± 15 ° C.) tensile strength of 40 to 60 kgf / mm ² and a high-temperature tensile strength of 36 to 55 kgf / mm ² after heat treatment at 190 ° C. for 1 hour. . In addition, the copper layer 110 of the copper foil 102 has crystalline particles, and before and after heat treatment at 190 ° C. for 1 hour, the crystalline particles of the copper layer 110 have an average particle size of 0.7 to 1.5 μm. have a size

In addition, the copper foil 102 has a maximum curl height of 15 mm or less, and the first surface S1 and the second surface S2 of the copper foil 102 each have a surface roughness (Rz JIS) of 0.5 to 2.0 μm. have In addition, the copper foil 102 has a thickness of 4 to 35 μm.

3 is a schematic cross-sectional view of an electrode 103 for a secondary battery according to another embodiment of the present invention. The secondary battery electrode 103 shown in FIG. 3 may be applied to, for example, the secondary battery 105 shown in FIG. 5 .

Referring to FIG. 3 , an electrode 103 for a secondary battery according to another embodiment of the present invention includes a copper foil 101 and an active material layer 310 disposed on the copper foil 101 . Here, the copper foil 101 includes a copper layer 110 and an anti-rust film 211 disposed on the copper layer 110, and is used as a current collector.

Specifically, the copper foil 101 has a first surface S1 and a second surface S2, and the active material layer 310 has at least one of the first surface S1 and the second surface S2 of the copper foil 101. placed in one The active material layer 310 may be disposed on the anti-rust film 211 .

3 shows an example in which the copper foil 101 of FIG. 1 is used as a current collector. However, another embodiment of the present invention is not limited thereto, and the copper foil 102 shown in FIG. 2 may be used as a current collector of the electrode 103 for a secondary battery.

In addition, although a structure in which the active material layer 310 is disposed only on the first surface S1 of the copper foil 101 is shown in FIG. 3, another embodiment of the present invention is not limited thereto, and the Active material layers 310 may be respectively disposed on both the first surface S1 and the second surface S2 . In addition, the active material layer 310 may be disposed only on the second surface S2 of the copper foil 101 .

The active material layer 310 shown in FIG. 3 includes an electrode active material, and in particular, may include an anode active material. That is, the secondary battery electrode 103 shown in FIG. 3 may be used as a negative electrode.

The active material layer 310 may include at least one of carbon, a metal, an oxide of a metal, and a composite of metal and carbon. As the metal, at least one of Ge, Sn, Li, Zn, Mg, Cd, Ce, Ni and Fe may be used. Also, in order to increase the charge/discharge capacity of the secondary battery, the active material layer 310 may include silicon (Si).

As charging and discharging of the secondary battery is repeated, contraction and expansion of the active material layer 310 occur alternately, which causes separation between the active material layer 310 and the copper foil 101, thereby reducing the charging and discharging efficiency of the secondary battery. In particular, the active material 310 including silicon (Si) has a high degree of expansion and contraction.

According to another embodiment of the present invention, since the copper foil 101 used as the current collector can contract and expand in response to the contraction and expansion of the active material layer 310, the active material layer 310 contracts and expands. The copper foil 101 is not deformed or torn by the rusting. Accordingly, separation does not occur between the copper foil 101 and the active material layer 310 . Therefore, the secondary battery including the secondary battery electrode 103 has excellent charge/discharge efficiency and excellent capacity retention rate.

4 is a schematic cross-sectional view of an electrode 104 for a secondary battery according to another embodiment of the present invention.

An electrode 104 for a secondary battery according to another embodiment of the present invention includes a copper foil 102 and active material layers 310 and 320 disposed on the copper foil 102 . The copper foil 102 includes a copper layer 110 and anti-rust films 211 and 212 disposed on both sides of the copper layer 110 .

Specifically, the secondary battery electrode 104 shown in FIG. 4 includes two active material layers 310 and 320 respectively disposed on the first surface S1 and the second surface S2 of the copper foil 102 . Here, the active material layer 310 disposed on the first surface S1 of the copper foil 102 is referred to as the first active material layer, and the active material layer 320 disposed on the second surface S2 of the copper foil 102 Also referred to as the second active material layer.

The two active material layers 310 and 320 may be made of the same material using the same method, or may be made of different materials or methods.

5 is a schematic cross-sectional view of a secondary battery 105 according to another embodiment of the present invention. The secondary battery 105 shown in FIG. 5 is, for example, a lithium secondary battery.

Referring to FIG. 5, the secondary battery 105 is disposed between a cathode 370, an anode 340 opposite to the cathode 370, and a cathode 370 and a cathode 340. An electrolyte 350 providing an environment in which ions can move, and a separator 360 electrically insulating the anode 370 and the cathode 340 are included. Here, ions moving between the positive electrode 370 and the negative electrode 340 are, for example, lithium ions. The separator 360 separates the positive electrode 370 and the negative electrode 340 in order to prevent the charge generated at one electrode from being unprofitably consumed by moving to the other electrode through the inside of the secondary battery 105 . Referring to FIG. 5 , a separator 360 is disposed within an electrolyte 350 .

The cathode 370 includes a cathode current collector 371 and a cathode active material layer 372 . Aluminum foil may be used as the positive current collector 371 .

The negative electrode 340 includes a negative electrode current collector 341 and an active material layer 342 . The active material layer 342 of the anode 340 includes an anode active material.

As the negative current collector 341, the copper foils 101 and 102 disclosed in FIG. 1 or 2 may be used. In addition, the secondary battery electrodes 103 and 104 shown in FIG. 3 or 4 may be used as the negative electrode 340 of the secondary battery 105 shown in FIG. 5 .

Hereinafter, with reference to FIG. 6, a manufacturing method of copper foil 102 according to another embodiment of the present invention will be described in detail.

FIG. 6 is a schematic diagram of a manufacturing process of the copper foil 102 shown in FIG. 2 .

In order to manufacture the copper foil 102, the electrolytic solution 11 containing copper ions is first prepared. The electrolyte solution 11 is accommodated in the electrolytic cell 10 .

Next, the positive electrode plate 13 and the rotating cathode drum 12 spaced apart from each other in the electrolyte solution 11 containing copper ions are energized at a current density of 30 to 80 ASD (A/dm ² ), and the copper layer 110 is formed The copper layer 110 is formed by the principle of electroplating. The gap between the positive electrode plate 13 and the rotating cathode drum 12 can be adjusted in the range of 8 to 13 mm.

When the current density applied between the positive electrode plate 13 and the rotating cathode drum 12 is less than 30 ASD, generation of crystalline particles in the copper layer 110 increases, and when it exceeds 80 ASD, miniaturization of the crystalline particles is accelerated. The current density can be tuned above 40 ASD.

The surface characteristics of the shiny surface SS of the copper layer 110 may vary depending on the degree of buffing or polishing of the surface of the rotating cathode drum 12 . To adjust the surface properties in the direction of the shiny surface (SS), the surface of the rotating cathode drum 12 may be polished with a polishing brush having a grit of #800 to #3000, for example.

In the process of forming the copper layer 110, the electrolyte solution 11 is maintained at a temperature of 40 to 60°C. More specifically, the temperature of the electrolyte 11 may be maintained at 50 °C or higher.

According to one embodiment of the present invention, the physical, chemical and electrical properties of the copper layer 110 can be controlled by adjusting the composition of the electrolyte solution 11 .

According to one embodiment of the present invention, the electrolyte solution 11 includes 60 to 120 g/L of copper ions, 80 to 150 g/L of sulfuric acid, less than 50 ppm of chlorine (Cl) and organic additives.

In order to smoothly form the copper layer 110 by electrodeposition of copper, the concentration of copper ions and the concentration of sulfuric acid in the electrolyte solution 11 are adjusted to 60 to 120 g/L and 80 to 150 g/L, respectively.

Chlorine (Cl) includes both chlorine ions (Cl-) and chlorine atoms present in the molecule. Chlorine (Cl) may be used, for example, to remove silver (Ag) ions introduced into the electrolyte solution 11 during the formation of the copper layer 110 . Chlorine (Cl) can precipitate silver (Ag) ions in the form of silver chloride (AgCl). This silver chloride (AgCl) can be removed by filtration.

When the concentration of chlorine (Cl) is 50 ppm or more, an unnecessary reaction may occur due to excessive chlorine (Cl). Therefore, the concentration of chlorine (Cl) in the electrolyte solution 11 is managed to 50 ppm or less. More specifically, the concentration of chlorine (Cl) may be managed to 25 ppm or less, for example, it may be managed in the range of 5 to 25 ppm.

The electrolyte solution 11 contains organic additives.

The organic additive includes at least one of a brightening agent (component A) and a moderator (component B) and a leveling agent (component C). That is, the organic additive may include any one of a brightener (component A) and a moderator (component B), or may include both a brightener (component A) and a moderator (component B). In addition, the organic additive includes a leveling agent (component C).

The brightening agent (component A) contains sulfonic acid or a metal salt thereof. The brightener (component A) may increase the amount of charge in the electrolyte 11 to increase the rate of copper electrodeposition, improve the curl characteristics of the copper foil, and enhance the gloss of the copper foil 102 .

The brightener (component A) may have a concentration of 5 to 100 ppm in the electrolyte solution 11 .

If the concentration of the brightener (component A) is less than 10 ppm, the gloss of the copper foil 102 is reduced, and if it exceeds 100 ppm, the roughness of the copper foil 102 may be increased and the strength may be reduced.

More specifically, the brightener (component A) may have a concentration of 5 to 30 ppm in the electrolyte solution 11 .

Brighteners include, for example, bis-(3-sulfopropyl)-disulfide disodium salt (SPS), 3-mercapto-1-propanesulfonic acid, 3-( N,N-dimethylthiocarbamoyl)-thiopropanesulfonate sodium salt, 3-[(amino-iminomethyl)thio]-1-propanesulfonate sodium salt, o-ethyldithiocarbonate-S-(3 -sulfopropyl) -ester sodium salt, 3- (benzothiazolyl-2-mercapto) -propyl-sulfonic acid sodium salt and ethylenedithiodipropylsulfonic acid sodium salt (ethylenedithiodipropylsulfonic acid sodium salt) may include at least one selected from .

The moderator (component B) contains a nonionic water-soluble polymer. The moderator (component B) reduces the electrodeposition rate of copper to prevent rapid increase in roughness and decrease in strength of the copper foil 102 . These moderators (component B) are also called inhibitors or suppressors.

The moderator (component B) may have a concentration of 5 to 50 ppm in the electrolyte solution 11 .

If the concentration of the moderator (component B) is less than 5 ppm, the roughness of the copper foil 102 increases rapidly, and the strength of the copper foil 102 may decrease. On the other hand, even if the concentration of the moderator (component B) exceeds 50 ppm, there is little change in physical properties such as appearance, gloss, roughness, strength, and elongation of the copper foil 102 . Therefore, the concentration of the moderator (component B) can be adjusted in the range of 5 to 50 ppm without the need to unnecessarily increase the concentration of the moderator (component B) to increase the manufacturing cost and waste raw materials.

The moderator (component B) is, for example, polyethylene glycol (PEG), polypropylene glycol, polyethylene polypropylene copolymer, polyglycerin, polyethylene glycol dimethyl ether, hydroxyethylene cellulose, polyvinyl alcohol, polyglycol stearic acid It may include at least one nonionic water-soluble polymer selected from ether and stearyl alcohol polyglycol ether. However, the type of moderator is not limited thereto, and other nonionic water-soluble polymers that can be used in the manufacture of the high-strength copper foil 102 may be used as the moderator.

The nonionic water-soluble polymer used as the moderator (component B) may have a number average molecular weight of 500 to 25,000. If the number average molecular weight of the moderator (component B) is less than 500, the effect of preventing the increase in roughness and strength of the copper foil 102 by the moderator (component B) is insignificant, and if it exceeds 25,000, the moderator (component B) Due to the large molecular weight of the copper layer 110 may not be easily formed.

More specifically, the nonionic water-soluble polymer used as the moderator (component B) may have a molecular weight of 1,000 to 10,000

The leveling agent (component C) contains at least one of nitrogen (N) and sulfur (S). That is, the leveling agent (component C) may include one or more nitrogen atoms (N) or one or more sulfur atoms (S) in one molecule, and one or more nitrogen atoms (N) and one or more sulfur atoms (S) may include all of them. For example, there is a chain type, heterocyclic or aromatic organic compound containing nitrogen (N) or sulfur (S) as a leveling agent (component C).

The leveling agent (component C) prevents excessively high peaks or excessively large protrusions from being generated in the copper layer 110, making the copper layer 110 macroscopically flat.

The leveling agent (component C) may have a concentration of 1 to 50 ppm in the electrolyte solution 11 .

When the concentration of the leveling agent (component C) is less than 1 ppm, the strength of the copper foil 102 is lowered, resulting in difficulty in manufacturing the high-strength copper foil 102. On the other hand, if the concentration of the leveling agent (component C) exceeds 50 ppm, the surface roughness of the copper foil 102 may increase excessively and the strength may decrease, and the surface of the copper foil 102 may be stained and the copper foil 102 This may be crumbly and easily crumble, and the elongation of the copper foil 102 may be reduced.

More specifically, the leveling agent (component C) may have a concentration of 5 to 30 ppm in the electrolyte solution 11 .

The leveling agent (component C) is, for example, diallyldimethylammonium chloride (DDAC), thiourea, N,N'-dimethylthiourea, N,N'-diethylthiourea, tetramethylthiourea, ethylenethiourea, Urea, 2-mercapto-5-benzimidazolesulfonic acid, 3(5-mercapto-1H-tetrazole)benzenesulfonate, 2-mercaptobenzothiazole, 5-mercapto-1-methyltetrazole (5MM ) and polyethyleneimine (PEI).

The organic additive may include two or more different types of leveling agents (component C).

In addition, the organic additive may include at least one leveling agent (component C) containing nitrogen (N) and at least one leveling agent (component C) containing sulfur (S). Nitrogen (N) and sulfur (S) included in the leveling agent are co-located in the crystal grain structure of the copper layer 110, so that the average particle size of the crystalline particles included in the copper layer 110 does not increase even after heat treatment. ) shows the effect. Accordingly, even after heat treatment, the copper foil 102 may have excellent tensile strength.

Forming the copper layer 110 may include filtering the electrolyte solution 11 . For filtering the electrolyte solution 11, for example, the electrolyte solution 11 can be circulated at a flow rate of 35 to 45 m ³ /hour. In addition, for the cleanliness of the electrolyte 11, a copper wire serving as a raw material of the electrolyte 11 may be heat-treated and cleaned.

The copper layer 110 manufactured in this way may be cleaned in the cleaning bath 20 .

For example, acid cleaning for removing impurities on the surface of the copper layer 110, for example, resin components or natural oxides, and water cleaning for removing an acidic solution used for pickling. ) can be performed sequentially. A cleaning process may be omitted.

Next, antirust films 211 and 212 are formed on the copper layer 110 .

Referring to FIG. 6 , the copper layer 110 may be immersed in the anti-rust liquid 31 contained in the anti-rust bath 30 to form anti-rust films 211 and 212 on the copper layer 110 . The anti-rust liquid 31 may contain chromium. Chromium (Cr) may exist in an ionic state in the anti-rust solution 31 .

The anti-rust liquid 31 may contain 1 to 10 g/L of chromium. To form the anti-rust films 211 and 212, the temperature of the anti-rust solution 31 may be maintained at 20 to 40°C. The copper layer 110 may be immersed in the anti-rust liquid 31 for about 1 to 30 seconds.

The anti-rust films 211 and 212 may contain a silane compound by silane treatment or a nitrogen compound by nitrogen treatment.

The copper foil 102 is made by forming the anti-rust films 211 and 212 .

Next, the copper foil 102 is cleaned in the cleaning tank 40. This cleaning process can be omitted.

Next, after a drying process is performed, the copper foil 102 is wound around the winder WR.

Hereinafter, the present invention will be described in detail through Preparation Examples and Comparative Examples. However, the following Preparation Examples and Comparative Examples are only for helping understanding of the present invention, and the scope of the present invention is not limited by the Preparation Examples or Comparative Examples.

manufacturing example 1-4 and comparative example 1-4

Copper foil was manufactured using a stripping machine including an electrolytic bath 10, a rotating cathode drum 12 disposed in the electrolytic bath 10, and a positive electrode plate 13 disposed spaced apart from the rotating cathode drum 12. The electrolyte solution 11 is a copper sulfate solution. The copper ion concentration in the electrolyte solution 11 was 80 g/L, the sulfuric acid concentration was 100 g/L, and the chlorine concentration was 20 ppm.

The electrolyte solution contains organic additives. Among the organic additives, bis-(3-sulfopropyl)-disulfide disodium salt (SPS) was used as a brightening agent (component A), polyethylene glycol (PEG) was used as a moderator (component B), and a leveling agent (C Component), diallyldimethylammonium chloride (DDAC), 5-Mercapto-1-methyltetrazole (5MM), and polyethyleneimine (PEI) were used. Their content (concentration) is shown in Table 1 below.

While maintaining the temperature of the electrolyte at 55° C., a current was applied between the rotating cathode drum 12 and the positive electrode plate 13 at a current density of 50 ASD to form the copper layer 110. Next, the copper layer 110 was immersed in an anti-rust solution containing chromium for about 2 seconds, and chromate treatment was performed on the surface of the copper layer 110 to form anti-rust films 211 and 212 . As a result, copper foils of Production Example 1-4 and Comparative Example 1-4 having a thickness of 6 μm were manufactured.

Organic additive concentration (ppm) SPS
(Component A) PEG
(component B) DDAC
(component C) 5MM
(component C) PEI
(component C) Preparation Example 1 20 30 30 - - Preparation Example 2 20 30 - 30 - Preparation Example 3 20 30 20 20 - Production Example 4 20 30 20 - 20 Comparative Example 1 20 - - - - Comparative Example 2 - 30 - - - Comparative Example 3 20 30 - - - Comparative Example 4 - - - - 20

SPS: Bis(3-Sulfo-Propyl)di-Sulfide

PEG: Polyethylene Glycol

DDAC: Diallyldimethylammonium chloride

5MM: 5-Mercapto-1-methyltetrazole

PEI: Polyethyleneimine

For the copper foils of Preparation Examples 1-4 and Comparative Examples 1-4 prepared as described above, (i) tensile strength after heat treatment at room temperature and 190 ° C. for 1 hour (ii) average of crystalline particles after heat treatment at room temperature and 190 ° C. for 1 hour Particle size, (iii) curl, (iv) surface roughness and (v) elongation were measured.

In addition, a secondary battery was manufactured using copper foil, and the secondary battery was charged and discharged to (vi) evaluate the capacity retention rate, and (vii) the secondary battery was dismantled to observe whether or not the copper foil was broken.

(i) Tensile strength measurement

The room temperature tensile strength of the copper foil was measured at room temperature (25±15° C.), and the high temperature tensile strength of the copper foil was measured after heat treatment at 190° C. for 1 hour.

Specifically, according to the regulations of the IPC-TM-650 Test Method Manual, the tensile strength was measured using an Instron universal testing machine (UTM). The width of the sample for measuring tensile strength was 12.7 mm, the distance between grips was 50 mm, and the measurement speed was 50 mm/min.

(ii) Average particle size of crystalline particles

The average particle size of crystalline particles included in the copper layer constituting the copper foil is measured at room temperature (25±15°C), and the average particle size of the crystalline particles included in the copper layer is measured after heat treatment of the copper foil at 190°C for 1 hour. did

After analyzing the first surface (S1) and the second surface (S2) of the copper foil according to the electron back scattering diffraction (EBSD) method, the average particle size of the crystalline particles was calculated using the analysis result. Specifically, FE-SEM (Field Emission - Scanning Electron Microscope) device (Hitachi, model name: S-4300SE) is equipped with an EBSD (Electron Backscatter Diffraction) detector (e.g., EDAX's EBSD camera). Thus, the average particle size of crystalline particles included in the copper layer 110 was measured by observing the cross section of the copper foil 101 under the measurement conditions of a voltage of 15 kV, a current of 50 mA, and a magnification of 2000 times.

(iii) measurement of curl

To measure the curl of the copper foil 101, a copper foil specimen 510 was prepared by cutting the copper foils of Preparation Example 1-4 and Comparative Example 1-4 into 60 mm X 60 mm. 7 is a schematic diagram illustrating the measurement of curl of copper foil.

Referring to FIG. 7 , after the specimen 510 is placed on the support 520 so that the first surface S1 of the specimen 510 faces upward, a glass plate 530 is placed on the specimen 510 . At this time, only half of the specimen 510 was overlapped with the glass plate by 30 mm in length, so that only half of the specimen 510 was positioned between the support 520 and the glass plate 530, and the other half was exposed from the glass plate 530. The height of the specimen 510 exposed to the outside of the glass plate 530 was measured using the measuring means 540 (meter ruler), and the maximum height was defined as the curl height value of the copper foil.

Four specimens 510 were prepared for each of the copper foils of Preparation Example 1-4 and Comparative Example 1-4, and the curl height was measured, and then the average value was calculated to calculate the curl height value of the copper foil.

(iv) Measurement of surface roughness (Rz JIS)

According to JIS B 0601-2001 standard, using a surface roughness meter (M300, Mahr), the first surface (S1) and the second surface (S2) of the copper foil prepared in Preparation Example 1-4 and Comparative Example 1-4 Surface roughness (Ra) was measured respectively.

(v) elongation measurement

Elongation was measured by a universal testing machine (UTM) according to the provisions of the IPC-TM-650 Test Method Manual. Specifically, the elongation was measured using an Instron universal testing machine. The width of the sample for elongation measurement was 12.7 mm, the distance between grips was 50 mm, and the measurement speed was 50 mm/min.

(vi) Evaluation of capacity retention rate

1) Cathode manufacturing

Commercially available silicon/carbon composite negative electrode material for negative active material Mix 2 parts by weight of styrene butadiene rubber (SBR) and 2 parts by weight of carboxymethyl cellulose (CMC) with 100 parts by weight of a negative active material slurry for negative active material using distilled water as a solvent was prepared. Using a doctor blade, the slurry for negative electrode active material was applied to a thickness of 20 to 60 μm on the copper foils of Preparation Example 1-4 and Comparative Example 1-4 having a width of 10 cm, dried at 120 ° C, and 1 ton / cm A negative electrode for a secondary battery was prepared by applying a pressure of ² .

2) Manufacture of electrolyte solution

A basic electrolyte solution was prepared by dissolving LiPF ₆ as a solute at a concentration of 1 M in a non-aqueous organic solvent in which ethylene carbonate (EC) and ethyl methyl carbonate (EMC) were mixed at a ratio of 1:2. A nonaqueous electrolyte was prepared by mixing 99.5% by weight of the basic electrolyte and 0.5% by weight of succinic anhydride.

3) Anode manufacturing

A cathode active material was prepared by mixing Li _1.1 Mn _1.85 Al _0.05 O ₄ lithium manganese oxide and o-LiMnO ₂ lithium manganese oxide having an orthorhombic crystal structure in a ratio of 90:10 (weight ratio). A slurry was prepared by mixing a cathode active material, carbon black, and PVDF [Poly(vinylidenefluoride)] as a binder in a weight ratio of 85:10:5 (weight ratio) and mixing them with NMP, an organic solvent. The prepared slurry was applied to both surfaces of an Al foil having a thickness of 20 μm and then dried to prepare a positive electrode.

4) Production of lithium secondary battery for testing

Inside the aluminum can, a positive electrode and a negative electrode are disposed so as to be insulated from the aluminum can, and a non-aqueous electrolyte and a separator are disposed therebetween to prepare a coin-type lithium secondary battery. The separator used was polypropylene (Celgard 2325; thickness 25 μm, average pore size φ28 nm, porosity 40%).

5) Evaluation of capacity retention rate

Using the lithium secondary battery prepared as described above, the battery was driven at a charging voltage of 4.3V and a discharging voltage of 3.4V, and the capacity per gram of the positive electrode was measured. Next, in order to evaluate the high-temperature lifespan, a capacity retention rate was calculated by performing a charge/discharge experiment 50 times at a high temperature of 50° C. at a current rate (C-rate) of 0.2 C. The capacity retention rate can be calculated by Equation 1 below.

[Equation 1]

Capacity retention rate (%) = [(Capacity after 50 charge/discharge cycles)/(Capacity after charge/discharge cycle once)] x 100

The capacity retention rate was measured three times and the average value was adopted. When the capacity retention rate was less than 90%, it was determined that the copper foil was unsuitable for a negative electrode current collector for a lithium ion battery.

(vii) Observe whether the copper foil is broken

After 50 charge/discharge cycles, the secondary battery was disassembled to observe whether breakage occurred in the copper foil. The case where fracture occurred in the copper foil was marked as "O", and the case where it did not occur was marked as "X".

The above test results are shown in Table 2. However, since the copper foils of Preparation Example 1-4 and Comparative Example 1-4 were measured to have an elongation of 2% or more, the elongation was excluded from Table 2.

tensile strength
(kgf/mm ² ) average particle size
(μm) surface roughness
(Rz JIS) warp (curl)
(mm) capacity retention rate
(%) Whether fracture occurs or not room temperature High temperature normal temperature High temperature page 1 page 2 difference Preparation Example 1 41 37 1.1 1.4 1.1 0.9 0.2 8 91 x Preparation Example 2 43 40 1.2 1.5 1.0 0.9 0.2 14 90 x Preparation Example 3 50 48 0.9 1.1 1.1 1.0 0.1 11 92 x Production Example 4 52 49 0.8 0.9 1.3 0.9 0.4 9 91 x Comparative Example 1 33 29 3.2 4.7 1.2 1.0 0.2 17 79 o Comparative Example 2 55 35 1.7 3.3 1.7 0.9 0.8 25 73 o Comparative Example 3 33 27 3.4 4.5 1.5 0.9 0.6 19 82 o Comparative Example 4 45 30 1.9 3.7 1.6 1.0 0.6 32 75 o

Referring to Tables 1 and 2, the following results can be confirmed.

In the copper foil of Comparative Example 1 made of an electrolyte containing only a brightening agent (component A) among organic additives and not containing a moderator (component B) and a leveling agent (component C), a curl exceeding 15 mm occurred, Comparative The secondary battery manufactured using the copper foil of Example 1 had a capacity retention rate of less than 90%, and fracture occurred in the copper foil.

In the copper foil of Comparative Example 2 made of an electrolyte solution containing only a moderator (component B) among organic additives and no brightener (component A) and leveling agent (component C), a curl exceeding 15 mm occurred, Comparative The secondary battery manufactured using the copper foil of Example 2 had a capacity retention rate of less than 90%, and fracture occurred in the copper foil.

In the copper foil of Comparative Example 3 made of an electrolyte solution containing a brightening agent (component A) and a moderator (component B) among organic additives and no leveling agent (component C), a curl exceeding 15 mm occurred, Comparative The secondary battery manufactured using the copper foil of Example 3 had a capacity retention rate of less than 90%, and fracture occurred in the copper foil.

In the copper foil of Comparative Example 4 made of an electrolyte solution containing only a leveling agent (component C) among organic additives and no brightener (component A) and moderator (component B), a curl exceeding 15 mm occurred, Comparative The secondary battery manufactured using the copper foil of Example 4 had a capacity retention rate of less than 90%, and fracture occurred in the copper foil.

On the other hand, according to an embodiment of the present invention, Preparation Examples 1 to 4 made of an electrolyte containing at least one of a brightening agent (component A) and a moderator (component B) as organic additives and also a leveling agent (component C) The height of the curl in the copper foil is 15 mm or less, and the secondary battery manufactured using this copper foil has a capacity retention rate of 90% or more, and no breakage occurs in the copper foil.

In addition, in the case of Comparative Examples 2 to 4, the difference in surface roughness (Rz JIS) on both sides of the copper foil is 0.5 μm or more.

8A and 8B respectively show a cross section of the copper foil according to Preparation Example 3 before and after heat treatment, and FIGS. 9A and 9B respectively show a cross section of the copper foil according to Comparative Example 3 before and after heat treatment. In FIGS. 8A, 8B, 9A and 9B, the upward direction in the drawing is the mat surface (MS) direction, and the downward direction in the drawing is the shiny surface (SS) direction.

Referring to FIG. 8A, in the copper foil according to Preparation Example 3, the average particle size of the crystalline particles of the copper layer before heat treatment is 0.9 μm based on the particle diameter, and referring to FIG. 8B, the crystalline quality of the copper layer after heat treatment at 190 ° C. for 1 hour The average particle size of the particles is 1.1 μm based on the particle diameter. As described above, in the copper foil according to Preparation Example 3, the average particle size of the crystalline particles of the copper layer before and after heat treatment is in the range of 0.7 to 1.5 μm based on the particle diameter.

On the other hand, referring to FIG. 9A, in the copper foil according to Comparative Example 3, the average particle size of the crystalline particles of the copper layer before heat treatment is 3.4 μm based on the particle diameter, and referring to FIG. 9B, the copper layer after heat treatment at 190 ° C. for 1 hour The average particle size of the crystalline particles of is 4.5 μm based on the particle diameter. In the copper foil according to Comparative Example 3, the average particle size of the crystalline particles in the copper layer before and after heat treatment exceeds 1.5 μm based on the particle diameter.

In particular, in Comparative Example 3 as well as Comparative Examples 1, 2, and 4, it can be confirmed that the average particle size of the crystal grains of the copper layer after heat treatment is increased by 1 μm or more compared to before heat treatment.

The present invention described above is not limited by the foregoing embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope of the technical details of the present invention. will be clear to those skilled in the art. Therefore, the scope of the present invention is expressed by the following claims, and all changes or modifications derived from the meaning, scope and equivalent concepts of the claims should be construed as being included in the scope of the present invention.

101, 102: copper foil
211, 212: anti-rust film
310, 320: active material layer
103, 104: electrode for secondary battery
MS: matte side
SS: if it's shiny

Claims (11)

Forming a copper layer by conducting a current density of 30 to 80 ASD (A / dm ² ) to a cathode plate and a rotating cathode drum disposed spaced apart from each other in an electrolyte solution containing copper ions; including,
The electrolyte is
60 to 120 g/L copper ions;
80 to 150 g/L sulfuric acid;
Chlorine (Cl) less than 50 ppm; and
Including; organic additives,
The organic additive,
at least one selected from brightening agents (component A) and moderators (component B); and
Leveling agent (component C); contains,
The brightening agent (component A) includes sulfonic acid or a metal salt thereof,
The moderator (component B) includes a nonionic water-soluble polymer,
The leveling agent (component C) includes at least one of nitrogen (N) and sulfur (S),
The leveling agent (component C),
diallyldimethylammonium chloride (DDAC); and
5-mercapto-1-methyltetrazole (5MM) and any one of polyethyleneimine (PEI); containing, a method for producing a copper foil. According to claim 1,
In the step of forming the copper layer, the temperature of the electrolyte solution is maintained in the range of 40 to 60 ℃, copper foil manufacturing method. According to claim 1,
The brightener has a concentration of 5 to 100 ppm, a method for producing copper foil. According to claim 1,
The brightener is bis-(3-sulfopropyl)-disulfide disodium salt [bis-(3-Sulfopropyl)-disulfide disodium salt] (SPS), 3-mercapto-1-propanesulfonic acid, 3-(N,N -Dimethylthiocarbamoyl)-thiopropanesulfonate sodium salt, 3-[(amino-iminomethyl)thio]-1-propanesulfonate sodium salt, o-ethyldithiocarbonate-S-(3-sulfopropyl )-Ester sodium salt, 3-(benzothiazolyl-2-mercapto)-propyl-sulfonic acid sodium salt and ethylenedithiodipropylsulfonic acid sodium salt (ethylenedithiodipropylsulfonic acid sodium salt), including at least one selected from the manufacturing method of copper foil . According to claim 1,
The moderator has a concentration of 5 to 50 ppm, a method for producing copper foil. According to claim 1,
The moderator is polyethylene glycol (PEG), polypropylene glycol, polyethylene polypropylene copolymer, polyglycerin, polyethylene glycol dimethyl ether, hydroxyethylene cellulose, polyvinyl alcohol, stearic acid polyglycol ether and stearyl alcohol polyglycol A method for producing a copper foil comprising at least one nonionic water-soluble polymer selected from ether. According to claim 6,
The nonionic water-soluble polymer has a number average molecular weight of 500 to 25,000, copper foil manufacturing method. According to claim 1,
The leveling agent, having a concentration of 1 to 50ppm, manufacturing method of copper foil. According to claim 1,
The leveling agent is thiourea, N, N'-dimethylthiourea, N, N'-diethylthiourea, tetramethylthiourea, ethylenethiourea, 2-mercapto-5-benzimidazolesulfonic acid, 3 ( 5-mercapto-1H-tetrazole) benzenesulfonate and 2-mercaptobenzothiazole further comprising at least one selected from, the manufacturing method of the copper foil. According to claim 1,
The organic additive comprises at least one leveling agent (component C) containing nitrogen (N) and at least one leveling agent (component C) containing sulfur (S), copper foil manufacturing method. According to claim 1,
Further comprising the step of forming a rust-preventive film on the copper layer, the manufacturing method of the copper foil.

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