KR20230028984A - Display module and electronic device including the same - Google Patents

Abstract

An electronic device, which includes a display module for securing a gap between patterns without increasing a width of a connecting member, may comprise: a display panel; a first connection member which includes a plurality of wires electrically connected to the display panel and on which a display driver IC (DDI) that controls the display panel is disposed; a first contact portion which is electrically connected to a part of the wires included in the first connection member, includes a plurality of first pads arranged in a first direction, and is disposed on the first connection member; a second contact portion which is electrically connected to another part of the wires included in the first connection member, includes a plurality of second pads arranged in the first direction, is spaced apart from the first contact portion in a second direction perpendicular to the first direction, and is disposed on the first connection member; a second connection member which includes a second layer stacked on the first layer and a plurality of wires disposed in each layer, and is disposed adjacent to the first connection member; a third contact portion which is electrically connected to a part of the wires included in the second connection member, includes a plurality of third pads arranged in the first direction, is disposed on the first layer of the second connection member, and is connected to the first contact portion; and a fourth contact portion which is electrically connected to another part of the wires included in the second connection member, includes a plurality of fourth pads arranged in the first direction, is disposed on the second layer of the second connection member, and is connected to the second contact portion.

Description

Display module and electronic device including the same {DISPLAY MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME}

Various embodiments disclosed in this document relate to a display module and an electronic device including the display module.

The display module may be a device for displaying visual information. The display module may be a device that converts an electrical signal processed by an electronic device into visual information. The display module may be electrically connected to a printed circuit board disposed inside the electronic device.

As the size of electronic devices gradually decreases and new form factors (eg, foldable and rollable electronic devices) emerge, the space in which components can be mounted inside electronic devices is gradually narrowing.

Accordingly, space occupied by the display module and components connected to the display module is gradually reduced.

Various methods may exist for connecting a display module to a printed circuit board of an electronic device. For example, the display module may be connected to the printed circuit board of the electronic device using a flexible connecting member.

When using a plurality of connecting members, the connecting members may be electrically connected. Since the plurality of conductive patterns formed on the connecting member are electrically connected to each other, the plurality of connecting members are electrically connected to electrically connect the display module and the printed circuit board.

Meanwhile, materials constituting the pattern formed on the connecting member may be eluted due to various factors. When the spacing between the patterns is narrow, a short may occur between the patterns due to elution. Such a short may result in poor connection between the display module and the printed circuit board.

Since the internal mounting space of the electronic device is narrow, there is a limit to increasing the width of the connecting member in order to increase the interval between patterns.

Various embodiments disclosed in this document may provide a display module capable of securing a gap between patterns without increasing the width of a connecting member and an electronic device including the display module.

An electronic device according to various embodiments disclosed in this document includes a display panel, a plurality of wires electrically connected to the display panel, and a display driver IC (DDI) for controlling the display panel is disposed. 1 connecting member, a first contact portion disposed on the first connecting member, including a plurality of first pads electrically connected to a portion of the wiring included in the first connecting member and arranged in a first direction; It is electrically connected to another part of the wiring included in the connecting member and includes a plurality of second pads arranged in the first direction, spaced apart from the first contact portion in a second direction perpendicular to the first direction, and A second connecting member including a second contact portion disposed on the first connecting member, a second layer stacked on the first layer, and a plurality of wires disposed on each layer and disposed adjacent to the first connecting member; A plurality of third pads electrically connected to a part of the wiring included in the second connection member and arranged in the first direction and disposed on a first layer of the second connection member to be connected to the first contact portion. It includes a plurality of fourth pads electrically connected to a third contact portion and another part of the wiring included in the second connection member and arranged in the first direction, and is disposed on the second layer of the second connection member to It may include a fourth contact portion connected to the second contact portion.

A display module according to various embodiments disclosed in this document includes a display panel, a plurality of wires electrically connected to the display panel, and a display driver IC (DDI) for controlling the display panel is disposed. 1 connecting member, a first contact portion disposed on the first connecting member, including a plurality of first pads electrically connected to a portion of the wiring included in the first connecting member and arranged in a first direction; It is electrically connected to another part of the wiring included in the connecting member and includes a plurality of second pads arranged in the first direction, spaced apart from the first contact portion in a second direction perpendicular to the first direction, and A second contact portion disposed on the first connecting member, a first layer, a second layer stacked on the first layer, and a plurality of wires disposed on each layer and disposed adjacent to the first connecting member. 2 connecting members, and a plurality of third pads electrically connected to a portion of the wiring included in the second connecting members and arranged in the first direction, and disposed on the first layer of the second connecting members to provide the first pads. A third contact portion connected to the contact portion and a plurality of fourth pads electrically connected to another part of the wire included in the second connection member and arranged in the first direction, It may include a fourth contact portion arranged on a layer and connected to the second contact portion.

An electronic device according to various embodiments disclosed in this document includes a display panel, a plurality of wires electrically connected to the display panel, and a display driver IC (DDI) for controlling the display panel is disposed. It may include a first connecting member, a second layer stacked on the first layer, and a second connecting member including a plurality of wires disposed on each layer and disposed adjacent to the first connecting member. The member may include a first contact portion disposed on the first connection member, including a plurality of first pads electrically connected to a portion of the wiring included in the first connection member and arranged in a first direction; and It is electrically connected to another part of the wiring included in the connecting member and includes a plurality of second pads arranged in the first direction, spaced apart from the first contact portion in a second direction perpendicular to the first direction, and It may include a second contact portion disposed on the first connection member, wherein the second connection member is electrically connected to a portion of a wire included in the second connection member and is arranged in the first direction. A third contact part including a pad and disposed on the first layer of the second connection member to be connected to the first contact part and electrically connected to another part of a wire included in the second connection member and electrically connected to the first direction It may include a plurality of fourth pads arranged in a fourth contact portion disposed on the second layer of the second connection member and connected to the second contact portion.

According to various embodiments disclosed in this document, durability of the connecting member that connects the display module to the printed circuit board of the electronic device may be improved without increasing the width of the connecting member.

According to various embodiments, by increasing the distance between the plurality of patterns included in the connecting member, it is possible to reduce the phenomenon of short circuit between the patterns due to the dissolution of the material constituting the pattern.

In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar elements.
1 is a block diagram of an electronic device in a network environment, according to various embodiments.
2 is an exploded perspective view of a display module according to various embodiments disclosed in this document.
3 is an exploded perspective view of a first connection member and a second connection member of a display module according to various embodiments disclosed herein.
4 is a schematic cross-sectional view of a second connection member according to various embodiments disclosed herein.
5 is a cross-sectional view of a display panel, a first connection member, and a second connection member according to various embodiments disclosed herein.
6 is a cross-sectional view of a display panel, a first connection member, and a second connection member according to another exemplary embodiment disclosed in this document.
7 is a diagram for explaining effects of a display module according to various embodiments disclosed in this document.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the embodiments.

In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise.

In this document, "A or B", "at least one of A and B", "or at least one of B," "A, B or C," "at least one of A, B and C," and "B, or at least one of C” may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited. A (e.g. first) component is said to be “coupled” or “connected” to another (e.g. second) component, with or without the terms “functionally” or “communicatively”. When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

1 is a block diagram of an electronic device 101 within a network environment 100, according to various embodiments. Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to one embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 180 or communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor set to detect a touch or a pressure sensor set to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

In the following description, the same or similar components will be described using the same member numbers unless otherwise specified.

2 is an exploded perspective view of a display module according to various embodiments disclosed in this document.

In the following description, the display module 210 may be an example of the display module 160 described in FIG. 1 . The display module 210 may mean a device for visually displaying information. The display module 210 may be understood as a set of components for visually displaying information. Components of the display module 210 shown in FIG. 2 are just one example of the components included in the display module 210, and some of the components shown in FIG. 2 are omitted to configure the display module 210. The display module 210 may be configured by adding components other than the components shown in FIG. 2 .

The display module 210 may include an on cell touch active matrix organic light-emitting diode (AMOLED) (OCTA) flat type display panel 213 . In addition, the display module 210 may include an unbreakable (UB) type OLED display (eg, curved display) panel 213 . In addition, the light emitting element constituting the display panel 213 may be implemented as an inorganic light emitting element manufactured using an inorganic material, different from an organic light emitting diode (OLED) manufactured using an organic material. According to various embodiments, the light emitting device may be a micro light emitting diode (LED) (u-LED). A micro LED may refer to a subminiature inorganic light emitting device having a size of 100 micrometers (μm) or less that emits light by itself without a backlight or color filter.

Referring to FIG. 2 , the display module 210 includes a window layer 211, a polarization layer 212 (polarizer (POL)) (eg, a polarizing film) sequentially disposed on the rear surface of the window layer 211, and a display It may include a panel 213 , a polymer layer 214 and a metal sheet layer 215 . In some embodiments, the display panel 213 may include a digitizer panel 216 disposed between the polymer layer 214 and the metal sheet layer 215 or on the back side of the metal sheet layer 215 .

According to various embodiments, the window layer 211 may include a glass layer. According to one embodiment, the window layer 211 may include ultra thin glass (UTG). In some embodiments, window layer 211 may include a polymer. In this case, the window layer 211 may include polyethylene terephthalate (PET) or polyimide (PI). In some embodiments, the window layer 211 may be arranged in multiple layers to include a glass layer and a polymer.

According to one embodiment, the window layer 211, the polarization layer 212, the display panel 213, the polymer layer 214, and the metal sheet layer 215 are adhesives (P1, P2, P3, P4) (or adhesives). ) through which they can be attached to each other. For example, the adhesives P1 , P2 , P3 , and P4 may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or a double-sided tape.

According to various embodiments, the display panel 213 may include a plurality of pixels and a wiring structure (eg, an electrode pattern). According to one embodiment, the polarization layer 212 may selectively pass light generated from a light source of the display panel 213 and vibrating in a certain direction. According to one embodiment, the display panel 213 and the polarization layer 212 may be integrally formed. According to one embodiment, the display panel 213 may include a touch panel (not shown). Components included in the display panel 213 may be disposed on a substrate of the display panel 213 (eg, the substrate 213-2 of FIG. 5). The substrate of the display panel may be formed of a rigid material such as glass. In some embodiments, the substrate of the display panel may be formed of a flexible material. For example, it may be formed of a flexible material such as polyimide (PI), polyethylene terephthalate (PET), or ultra-thin-glass (UTG).

According to various embodiments, the polymer layer 214 is disposed under the display panel 213 to provide a dark background for securing visibility of the display panel 213 and to be used as a buffering material (eg, cushion) for a buffering action. can be formed For example, the polymer layer 214 is opaque to remove air bubbles that may occur between the display panel 213 and its lower attachments and to block light generated from the display panel 213 or light incident from the outside. A metal layer (eg, a black layer including a rough pattern) and/or a buffer layer (eg, a sponge layer) disposed to mitigate impact may be included. In some embodiments, to waterproof the display module 210 , the polymer layer 214 may be removed or placed under the metal sheet layer 215 .

According to one embodiment, the metal sheet layer 215 is SUS (steel use stainless) (eg, STS (stainless steel)), Cu, Al, or metal CLAD (eg, a laminated member in which SUS and Al are alternately disposed). may contain at least one. In some embodiments, the metal sheet layer 215 may include other alloy materials. In some embodiments, the metal sheet layer 215 may help reinforce the rigidity of the electronic device 200, shield ambient noise, and may be used to dissipate heat emitted from nearby heat dissipating components. 2 shows that the metal sheet layer 215 is formed in the same area as the display panel 213, but in some embodiments, the metal sheet layer 215 may be disposed on a portion of the display panel 213. In some cases, the metal sheet layer 215 may be omitted.

According to an embodiment, the electronic device may be a foldable electronic device in which at least a portion of the display module 210 is folded. For example, when the electronic device is a foldable electronic device, the metal sheet layer 215 may provide bending (eg, flexible) characteristics to the display module 210 . According to one embodiment, at least a portion of the metal sheet layer 215 may include a bendable portion (not shown), and the bendable portion (not shown) includes a plurality of openings formed at predetermined intervals, thereby displaying the module. (210) can contribute to the flexural properties. In some embodiments, the bendable portion (not shown) may include a plurality of recesses formed at predetermined intervals. For example, the bending characteristics of the display module 210 may be determined and/or changed according to the number, arrangement density, and/or shape of a plurality of openings.

According to various embodiments, the digitizer panel 216 may be disposed between the metal sheet layer 215 and the polymer layer 214 . In some cases, the digitizer panel 216 may be disposed under the metal sheet layer 215 . The digitizer panel 216 may be a detection member that receives an input from a pen input device (eg, a stylus). In one embodiment, the digitizer panel 216 may include a plurality of conductive patterns (not shown). For example, the digitizer panel 216 may include a plurality of conductive loops. Current flowing through the plurality of conductive loops may form a magnetic field. When an external electronic device (eg, a stylus) including a coil approaches a magnetic field formed by the digitizer panel 216 , a resonant frequency may be generated. A resonance frequency may be determined according to inductance and capacitance of an external electronic device. The digitizer circuit that controls the operation of the digitizer panel 216 may use a plurality of conductive loops included in the digitizer panel 216 to recognize a specific frequency and a location where the specific frequency is recognized. For example, when the pen input device is close to the digitizer panel 216, the digitizer circuit may check the occurrence and occurrence position of the resonant frequency of the pen input device. Through this, the pen input of the pen input device may be recognized.

According to various embodiments, the display module 210 may include at least one functional member (not shown) disposed between the polymer layer 214 and the metal sheet layer 215 or under the metal sheet layer 215. may be According to an embodiment, the functional member may include a graphite sheet for heat dissipation, a touch sensor supporting the touch function of the display module 210, a force touch FPCB, a fingerprint sensor FPCB, an antenna radiator for communication, or a conductive/non-conductive tape. there is.

According to various embodiments, the display module 210 includes a first connecting member 310 disposed in a folding manner (eg, bending) from the display panel 213 to at least a portion of the rear surface of the display module 210 can include According to one embodiment, the first connection member 310 may be electrically connected to the display panel 213 . The first connection member 310 may include a display driver IC (DDI) 301 . The second connection member (eg, the second connection member 320 of FIG. 3 ) connected to the first connection member 310 may include a touch display driver IC (TDDI) (not shown). In some embodiments, the first connection member 310 connected to the display panel 213 may include both the DDI 301 and the TDDI.

In one embodiment, the first connection member 310 may be integrally formed with the substrate of the display panel 213 . The first connecting member 310 may be a part of a substrate on which a light emitting device of the display panel 213 is disposed. The first connecting member 310 may include a portion extending from the substrate of the display panel 213 and extending to the rear surface of the display panel 213 after at least a portion thereof is deformed. In one embodiment, the display module 210 may include a chip on panel (COP) structure in which the DDI 301 is disposed on the first connecting member 310 integrally formed with the substrate of the display panel 213 .

In one embodiment, the first connection member 310 may be formed separately from the substrate of the display panel 213 and electrically connected to the display panel 213 . In this case, the first connection member 310 may be a printed circuit board (eg, a flexible printed circuit board (FPCB)) made of a flexible material. A portion of the first connecting member 310 connected to the display panel 213 may be deformed and extended to the rear surface of the display panel 213 . In one embodiment, the display module 210 may include a COF (chip on film) structure in which the DDI 301 is disposed on the first connecting member 310 electrically connected to the display panel 213 .

According to various embodiments, various elements related to driving the display module 210 may be disposed on the first connection member 310 . For example, a flash memory for a display, a diode for preventing electrostatic discharge (ESD), a pressure sensor, and/or a passive element such as a decap may be disposed on the first connection member 310 .

3 is an exploded perspective view of a first connection member and a second connection member of a display module according to various embodiments disclosed herein.

According to various embodiments, the first connection member 310 electrically connects a display panel (eg, the display panel 213 of FIG. 5 ) on which a plurality of pixels (eg, the active layer 213-1 of FIG. 5 ) are disposed. can be connected to The first connection member 310 may include a plurality of wires 311 . The plurality of wires included in the first connection member may be conductive materials disposed on the first connection member 310 in various ways. Various electrical signals for driving a display module (eg, the display module 210 of FIG. 2 ) may be transmitted through a plurality of wires. In addition, power for the operation of the display module 210 and the DDI 301 may be transmitted through wires included in the first connection member 310 . Some of the plurality of wires may lead in or out of the DDI 301 . According to an embodiment, among the plurality of wires, wires leading in or out of the DDI 301 may deliver power related to driving the plurality of pixels of the display module 210 and the DDI 301, and other Information related to image data to be displayed on the display module 210 may be transmitted through the wires.

Referring to FIG. 3 , the first connection member 310 may include a plurality of pads. The first connection member 310 may include a first pad 331 and a second pad 332 .

In one embodiment, the first pad 331 may be a pad arranged in a first direction (eg, the Y-axis direction of FIG. 3 ). The first pad 331 may be electrically connected to a portion of the plurality of wires 311 included in the first connection member 310 . In one embodiment, the first pad 331 may be at least a part of a portion of the plurality of wires 311 included in the first connection member 310 exposed to the outside. For example, the first pad 331 may be a portion exposed by removing a portion of a protective layer (not shown) surrounding the first connection member 310 in order to contact other electrical objects. The first pad 331 may also be understood as a contact pad for electrical contact with other instruments. In FIG. 3 , the first pad 331 is illustrated as having a relatively large width compared to the plurality of wires 311 included in the first connecting member 310, but the first pad 331 is the first connecting member ( It may be formed to have substantially the same width as the wiring 311 included in 310). Also, the first pad 331 may be formed separately from the plurality of wires 311 and disposed on the first connecting member 310 . For example, the first pad 331 may be formed to have a wider width than the wire 311 included in the first connection member 310 to contact other electrical objects. The first pads 331 arranged in the first direction may constitute a first contact portion 333 for electrical connection of the first connection member 310 .

In one embodiment, the second pad 332 may be a pad arranged in the first direction similarly to the first pad 331 . The second pad 332 may be electrically connected to a portion of the plurality of wires 311 included in the first connection member 310 . A wire connected to the second pad 332 may be different from a wire connected to the first pad 331 . Similar to the first pad 331 , the second pad 332 may be at least a portion of an externally exposed portion of the plurality of wires 311 included in the first connecting member 310 . For example, the second pad 332 may be an exposed portion by removing a portion of the protective layer surrounding the first connection member 310 in order to contact other electrical materials. The second pad 332 may also be understood as a contact pad for electrical contact with other instruments. The second pad 332 may be spaced apart from the first pad 331 in a second direction (eg, the +X axis direction of FIG. 3 ). The second direction may be substantially perpendicular to the first direction. In FIG. 3 , the second pad 332 is illustrated as having a relatively large width compared to the plurality of wires 311 included in the first connecting member 310, but the second pad 332 is the first connecting member ( It may be formed to have substantially the same width as the wiring 311 included in 310). In addition, the second pad 332 may be formed separately from the plurality of wires 311 and disposed on the first connecting member 310 . For example, the second pad 332 may be formed to have a wider width than the wiring 311 included in the first connection member 310 to contact other electrical objects. The second pads 332 arranged in the first direction may configure the second contact portion 334 for electrical connection of the first connection member 310 .

Referring to FIG. 3 , a first contact portion 333 composed of a first pad 331 and a second contact portion 334 composed of a second pad 332 may be spaced apart from each other in a second direction. In the first connecting member 310 , it may be understood that the first contact portion 333 and the second contact portion 334 are arranged in different columns. In one embodiment, the first pad 331 of the first contact portion 333 and the second pad 332 of the second contact portion 334 may be formed on the same layer in the first connection member 310. .

According to various embodiments, the second connection member 320 may electrically connect the first connection member 310 to a printed circuit board (not shown) of an electronic device (eg, the electronic device 101 of FIG. 1 ). there is. Here, the printed circuit board of the electronic device may be a printed circuit board on which a processor (eg, the processor 120 of FIG. 1 ) of the electronic device is disposed or connected to the processor. The second connection member 320 may be electrically connected to the first connection member 310 . The second connection member 320 may be formed of a flexible material. The second connection member 320 may be composed of a plurality of layers. For example, the second connection member 320 may include a first layer 320-1 and a second layer 320-2 stacked on the first layer 320-1. Referring to FIG. 3 , the second layer 320-2 may be stacked in the +Z direction with respect to the first layer 320-1. The second connection member 320 may include a plurality of wires 321 . In one embodiment, the plurality of wires 321 included in the second connection member 320 may be disposed in a plurality of layers of the second connection member 320 . For example, some of the plurality of wires 321 may be disposed on the first layer 320-1 and some may be disposed on the second layer 320-2. A plurality of wires 321 disposed on different layers may be electrically connected through a VIA structure penetrating the layers (eg, VIAs 410 , 420 , and 430 of FIG. 4 ).

In one embodiment, the second connection member 320 may include a plurality of pads. For example, the second connection member 320 may include a third pad 341 and a fourth pad 342 . In one embodiment, the third pad 341 and the fourth pad 342 may be disposed on different layers. For example, the third pad 341 may be disposed on the first layer 320-1 and the fourth pad 342 may be disposed on the second layer 320-2.

In one embodiment, the third pad 341 disposed on the first layer 320-1 of the second connection member 320 may be a pad arranged in the first direction. The third pad 341 may be electrically connected to a portion of the plurality of wires 321 included in the second connection member 320 . The third pad 341 may be at least a part of an externally exposed portion of the plurality of wires 321 included in the second connection member 320 . For example, the third pad 341 may be an exposed portion by partially removing a protective layer surrounding the second connecting member 320 in order to contact other electrical materials. The third pad 341 may also be understood as a contact pad for electrical contact with other instruments. In FIG. 3 , the third pad 341 is shown as having a relatively large width compared to the plurality of wires 321 included in the second connecting member 320, but the third pad 341 is the second connecting member ( It may be formed to have substantially the same width as the wire 321 included in 320). In addition, the third pad 341 may be formed separately from the plurality of wires 321 and disposed on the second connection member 320 . For example, the third pad 341 may be formed to have a wider width than the wire 321 included in the second connection member 320 to contact other electrical objects. The third pads 341 arranged in the first direction may constitute a third contact portion 343 for electrical connection of the second connection member 320 .

In one embodiment, the fourth pad 342 disposed on the second layer 320 - 2 of the second connection member 320 may be a pad arranged in the first direction. The fourth pad 342 may be electrically connected to a portion of the plurality of wires 321 included in the second connection member 320 . A wire connected to the fourth pad 342 and a wire connected to the third pad 343 may be different. The fourth pad 342 may be at least a portion of a portion where the plurality of wires 321 included in the second connection member 320 are exposed to the outside. For example, the fourth pad 342 may be a portion exposed by removing a portion of the protective layer surrounding the second connection member 320 in order to contact other electrical materials. The fourth pad 342 may also be understood as a contact pad for electrical contact with other instruments. In FIG. 3 , the fourth pad 342 is shown as having a relatively large width compared to the plurality of wires 321 included in the second connecting member 320, but the fourth pad 342 is the second connecting member ( It may be formed to have substantially the same width as the wire 321 included in 320). In addition, the fourth pad 342 may be formed separately from the plurality of wires 321 and disposed on the second connection member 320 . For example, the fourth pad 342 may be formed to have a wider width than the wire 321 included in the second connection member 320 to contact other electrical objects. The fourth pads 342 arranged in the first direction may constitute a fourth contact portion 344 for electrical connection of the second connecting member 320 .

As shown in FIG. 3 , the third contact portion 343 and the fourth contact portion 344 of the second connection member 320 may be formed on different layers. It may be understood that the third contact portion 343 and the fourth contact portion 344 are spaced apart in the Z-axis direction based on FIG. 3 . Also, the fourth contact portion 344 may be spaced apart from the third contact portion 343 in the second direction.

According to various embodiments, the process of forming the wiring 311 on the first connecting member 310 may be a finer process than the process of forming the wiring 321 on the second connecting member 320 . The widths of the plurality of wires 311, the first pad 331, and the second pad 332 included in the first connecting member 310 are the plurality of wires 321 included in the second connecting member 320, It may be smaller than the widths of the third pad 341 and the fourth pad 342 . For example, the width of the plurality of wires 311 may be formed to be approximately 10 μm, and the width of the plurality of wires 321 may be formed to be approximately 50 μm.

4 is a schematic cross-sectional view of a second connection member according to various embodiments disclosed herein. 5 is a cross-sectional view of a display panel, a first connection member, and a second connection member according to various embodiments disclosed herein.

In one embodiment, the display panel 213 includes an active layer including a light emitting device (eg, the active layer 213-1 of FIG. 5) and a substrate on which the active layer 213-1 is disposed (eg, the substrate 213 of FIG. 5). -2)) may be included. The active layer 213-1 may include components for displaying visual information (eg, a wiring structure, a light emitting device, and a thin film transistor (TFT)). The substrate 213-2 of the display panel 213 may be formed of a flexible material. For example, it may be formed of a flexible material such as polyimide (PI), polyethylene terephthalate (PET), or ultra-thin-glass (UTG). As shown in FIG. 5 , a portion of the substrate 213 - 2 may be deformed and extended to the rear surface of the display panel 213 (eg, a surface facing the -Z axis direction with reference to FIG. 5 ).

According to various embodiments, the second connection member 320 may be disposed to face the rear surface of the display panel 213 . The first connection member 310 extending to the rear surface of the display panel 213 may be electrically connected to the second connection member 320 .

According to various embodiments, the second connection member 320 includes a plurality of layers (eg, a first layer 320-1, a second layer 320-2, a third layer 320-3, a fourth layer ( 320-4)). The second connection member 320 may include a conductive layer 361 , a protective layer 381 , a film layer 371 , and an adhesive layer 391 .

According to various embodiments, the film layer 371 may be a base layer on which the conductive layer 361 included in the second connecting member 320 is disposed. The conductive layer 361 may be disposed on the film layer 371 in various ways.

According to various embodiments, the adhesive layer 391 may be a component for bonding a plurality of layers included in the second connecting member 320 . In one embodiment, the adhesive layer 391 may include an insulating and adhesive material disposed between a plurality of layers. For example, it may include a plurality of preimpregnated materials (PPG) layers (eg, insulating resin layer, epoxy).

According to various embodiments, the protective layer 381 may be a layer disposed to at least partially surround the outside of the second connection member 320 . The protective layer 381 may be a component that protects the second connection member 320 from external foreign substances. The protective layer 381 may be, for example, a layer formed through a photo solder resist (PSR) process.

According to various embodiments, the conductive layer 361 may constitute a plurality of wires included in the second connecting member 320 (eg, the plurality of wires 321 of FIG. 3 ).

As used in this document, “layers (eg, first layer 320-1, second layer 320-2)” refers to a conductive layer 361 that implements an electrical connection in the second connecting member 320. can be distinguished. As shown in FIG. 4 , the second connecting member 320 may include a plurality of conductive layers 361 . For example, the second connecting member 320 includes the first conductive layer 361-1, the second conductive layer 361-2, the third conductive layer 361-3, and the fourth conductive layer 361-4. ) may be included. It can be understood that the first conductive layer 361-1 is disposed on the first layer 320-1, and the second conductive layer 361-2 is understood to be disposed on the second layer 320-2. It can be understood that the third conductive layer 361-3 is disposed on the third layer 360-3, and the fourth conductive layer 361-4 is disposed on the fourth layer 360-4. It can be understood as being placed.

In one embodiment, conductive layers 361 disposed on different layers may be electrically connected by a via (VIA) structure 400 . The VIA structure 400 may include a structure in which a conductive material is filled in a hole formed to pass through the adhesive layer 391 and/or the film layer 371 disposed between the conductive layers 361 .

In one embodiment, the first conductive layer 361-1 may be connected to the second conductive layer 361-2 through the first VIA 410. The second conductive layer 361-2 may be connected to the third conductive layer 361-3 through the second VIA 420 or the third VIA 430. The third conductive layer 361 - 3 may be electrically connected to the printed circuit board of the electronic device. The first conductive layer 361-1 is a connection path between the printed circuit board and the first VIA 410 - the second conductive layer 361-2 - the second VIA 420 - the third conductive layer 361-3. can be connected with The second conductive layer 361-2 may be connected through a connection path between the printed circuit board and the third VIA 430 and the third conductive layer 361-3. A connection path between the first conductive layer 361-1 and the printed circuit board and a connection path between the second conductive layer 361-2 and the printed circuit board may be separated from each other. The connection path described above is only an example, and the connection path between the first conductive layer 361-1 and the printed circuit board and the connection path between the second conductive layer 361-2 and the printed circuit board may be set in various ways.

In one embodiment, the third pad 341 of the second connection member 320 is electrically connected to the first conductive layer 361-1 disposed on the first layer 320-1 or the first conductive layer 361-1. A portion of (361-1) may include a portion exposed to the outside of the second connecting member 320. The fourth pad 342 of the second connection member 320 is electrically connected to the second conductive layer 361-2 disposed on the second layer 320-2 stacked on the first layer 320-1. Alternatively, a portion of the second conductive layer 361 - 2 may include a portion exposed to the outside of the second connecting member 320 . Here, the meaning of being exposed to the outside may include, for example, exposure to the outside of the second connection member 320 without being surrounded by the protective layer 381 .

In one embodiment, the first conductive member 351 may be disposed on the third pad 341 and the second conductive member 352 may be disposed on the fourth pad 342 . The conductive member 350 will be described in more detail below.

Referring to FIGS. 3 and 5 , components of the first connection member 310 and the second connection member 320 may overlap at least partially in the z-axis direction and/or the x-axis direction. For example, when viewed in the z-axis direction, the first pad 331 and the second pad 332 may overlap at least partially in the x-axis direction. Also, the third pad 341 and the fourth pad 342 may overlap at least partially in the x-axis direction. For another example, when viewed in the x-axis direction, the first pad 331 and the second pad 332 may overlap at least partially in the z-axis direction. Also, the third pad 341 and the fourth pad 342 may overlap at least partially in the z-axis direction.

As shown in FIG. 5 , the first connection member 310 and the second connection member 320 may be electrically connected. The electrical connection between the first connection member 310 and the second connection member 320 is the connection between the first contact portion 333 and the third contact portion 343, and the second contact portion 334 and the fourth contact point. It can be implemented with the connection of unit 344. By connecting the first pad 331 included in the first contact portion 333 and the third pad 341 included in the third contact portion 343, the first connecting member 310 and the second connecting member ( 320) may be electrically connected. By connecting the second pad 332 included in the second contact portion 334 and the fourth pad 342 included in the fourth contact portion 344, the first connection member 310 and the second connection member ( 320) may be electrically connected. When the first connection member 310 electrically connected to the display panel 213 is electrically connected to the second connection member 320, the printed circuit board and the display panel of the electronic device electrically connected to the second connection member 320 (213) can be electrically connected.

Referring to FIG. 5 , a conductive member 350 may be disposed between the first contact portion 333 and the third contact portion 343 and between the second contact portion 334 and the fourth contact portion 344. . The conductive member 350 may be, for example, a conductive adhesive member having adhesiveness (eg, anisotropic conductive film; ACF). The first conductive member 351 disposed between the first contact portion 333 and the third contact portion 343 is a contact between the first pad 331 of the first contact portion 333 and the third contact portion 343. The third pad 341 may be electrically connected. In one embodiment, the first conductive member 351 may include a first conductive ball 351A. The first conductive ball 351A may include a ball-shaped material made of a conductive material. The second conductive member 352 disposed between the second contact portion 334 and the fourth contact portion 344 is a contact between the second pad 332 of the second contact portion 334 and the fourth contact portion 344. The fourth pad 342 may be electrically connected. In one embodiment, the second conductive member 352 may include a second conductive ball 352A. The second conductive ball 352A may include a ball-shaped material made of a conductive material.

As shown in FIG. 5 , since the third contact portion 343 and the fourth contact portion 344 of the second connection member 320 are disposed on different layers, the third contact point for the first connection member 310 A distance H1 of the unit 343 and a distance H2 of the fourth contact unit 344 may be different from each other. Referring to FIG. 5 , the distance H1 between the third contact portion 343 disposed on the first layer 320-1 and the first connecting member 310 is stacked on the first layer 320-1. It may be greater than the distance H2 between the fourth contact portion 344 disposed on the second layer 320-2 and the first connecting member 310. The thickness of the first conductive member 351 disposed between the first contact portion 333 and the third contact portion 343 is equal to the thickness of the second conductive member 351 disposed between the second contact portion 334 and the fourth contact portion 344. It may be thicker than the thickness of the conductive member 352 . The diameter (or size) of the first conductive balls 351A included in the first conductive member 351 may be greater than the diameter (or size) of the second conductive balls 352A included in the second conductive member 352. there is. Since the size of the first conductive ball 351A included in the first conductive member 351 is relatively larger than the size of the second conductive ball 352A, even if the first conductive member 351 is formed thick, the first conductive member Contact between the first conductive balls 351A included in the 351 may be made more smoothly. Accordingly, the thick first conductive member 351 may stably maintain electrical connection between the first contact portion 333 and the third contact portion 343 .

In an embodiment, the diameters (or sizes) of the first conductive balls 351A included in the first conductive member 351 may be different from each other. For example, the first conductive ball 351A may include a 1-1 conductive ball (not shown) having a first size and a 1-2 conductive ball having a second size smaller than the first size (not shown). can In one embodiment, the first to second conductive balls (not shown) may have substantially the same diameter (or size) as the second conductive balls 352A of the second conductive member 352 .

6 is a cross-sectional view of a display panel, a first connection member, and a second connection member according to another exemplary embodiment disclosed in this document.

In the description of FIG. 6, components identical or similar to those described above will be described using the same member numbers, and detailed descriptions will be omitted.

According to various embodiments, the first connection member 310 may include a plurality of layers. For example, the first connection member 310 may include a third layer 310-1 and a fourth layer 310-2. The first pad 331 and the second pad 332 included in the first connection member 310 may be disposed on different layers. For example, the first pad 331 may be disposed on the third layer 310-1, and the second pad 332 may be disposed on the fourth layer 310-2. The second pad 332 may be spaced apart from the first pad 331 in the Z-axis direction based on FIG. 6 by being disposed on a different layer. In addition, the second pad 332 may be spaced apart from the first pad 331 in a second direction (eg, the +X axis direction of FIG. 6 ). The first pad 331 may constitute the first contact portion 333 , and the second pad 332 may constitute the second contact portion 334 . The first contact portion 333 may be formed on the third layer 310-1, and the second contact portion 334 may be formed on the fourth layer 310-2.

Referring to FIG. 6 , the third contact portion 343 formed on the first layer 320-1 of the second connection member 320 and the third layer 310-1 of the first connection member 310 The first contact portion 333 may be electrically connected. The first contact portion 333 and the third contact portion 343 may be electrically connected by the first conductive member 351 disposed between the first contact portion 333 and the third contact portion 343 . The fourth contact portion 344 formed on the second layer 320-2 of the second connecting member 320 and the second contact portion 334 formed on the fourth layer 310-2 of the first connecting member 310. ) can be electrically connected. The second contact portion 334 and the fourth contact portion 344 may be electrically connected by the second conductive member 352 disposed between the second contact portion 334 and the fourth contact portion 344 .

When the substrate of the display panel 213 and the first connection member 310 are integrally formed (eg, COP structure), the first contact portion 333 and the second contact portion 334 of the first connection member 310 ) may be formed on the same layer (eg, the structure of FIG. 5). When the first connection member 310 is formed separately from the substrate of the display panel 213 (eg, COF structure), the first contact portion 333 and the second contact portion 334 of the first connection member 310 may be formed on different layers (eg, the structure of FIG. 6). For example, whether to form the first contact portion 333 and the second contact portion 334 on the same layer may be determined in consideration of the width of the wire 311 formed on the first connecting member 310 .

In one embodiment, the third contact portion 343 disposed on the first layer 320-1 of the second connection member 320 and the third layer 310-1 of the first connection member 310 The distance H1 between the first contact portion 333 is the fourth contact portion 344 disposed on the second layer 320-2 of the second connection member 320 and the first connection member 310. may be greater than the distance H2 between the second contact portions 334 disposed on the fourth layer 310 - 2 of . For example, the thickness of the first conductive member 351 disposed between the first contact portion 333 and the third contact portion 343 is between the second contact portion 334 and the fourth contact portion 344. It may be thicker than the thickness of the disposed second conductive member 352 .

In one embodiment, in preparation for a case where the substrate of the display panel 213 and the first connection member 310 are integrally formed (eg, the structure of FIG. 5 ), the first connection member 310 is the display panel 213 ) When formed separately from the substrate (eg, the structure of FIG. 6 ), the thickness of the first conductive member 351 may be small. For example, among the plurality of layers of the first connection member 310, the thickness of the first conductive member 351 may be changed according to the thickness of the layer where the first contact portion 333 is located. For example, the conductive layer (eg, the conductive layer 361 of FIG. 4 ) of the first connecting member 310 may be formed to have a thickness of approximately 10 to 12 μm, and the adhesive layer (eg, the adhesive layer 391 of FIG. 4 ) It may be approximately 100 μm.

In another embodiment, the thickness of the first conductive member 351 and the thickness of the second conductive member 352 may be substantially the same. For example, when the first connection member 310 and the second connection member 320 are formed of a plurality of layers and connected, and the number of each layer is the same, the thickness of the first conductive member 351 and the second connection member 351 are the same. The conductive member 352 may have substantially the same thickness. In an embodiment, even though the thickness of the first conductive member 351 and the thickness of the second conductive member 352 are the same, the diameter (or size) of the first conductive ball 351A included in the first conductive member 351 ) and the diameter (or size) of the second conductive ball 352A included in the second conductive member 352 may be different from each other.

In the above description, the first connecting member 310 includes two contact parts (eg, the first contact part 333 and the second contact part 334), and the second connecting member 320 includes two contact parts. Although it has been described as including parts (eg, the third contact part 343 and the fourth contact part 344), the first connection member 310 and the second connection member 320 may be connected by three or more contact parts. there is. The plurality of contact parts may be spaced apart in the X-axis direction based on FIG. 5 or 6 . Also, the plurality of contact parts may be formed on the same layer or different layers.

7 is a diagram for explaining effects of a display module according to various embodiments disclosed in this document.

7(a) and 7(b) are diagrams schematically illustrating that the same number of pads 710A and 710B are disposed on a connecting member 700 having the same width W. Referring to FIG.

7(a) shows a case in which pads 710A are formed in one column, and FIG. 7(b) shows a case in which pads 710B are formed in a plurality of columns like various embodiments of the present document. The distance D1 between the pads 710A in (a) of FIG. 7 is smaller than the distance D2 between the pads 710B in (b) of FIG. 7 . Materials constituting the pads 710A and 710B may be eluted (S) for various reasons. For example, materials constituting the pads 710A and 710B may be eluted (S) due to factors such as external impact and corrosion.

In the case of (a) of FIG. 7 , since the distance D1 between the pads 710A is relatively small, the elution S may cause a short circuit between the pads 710A. Due to the short circuit between the pads 710A, the shorted portion may turn black or, in some cases, a signal flow may be defective, resulting in a problem in the operation of the display module 210 . To solve this problem, the width W of the connecting member 700 may be increased. In this case, a problem in which the mounting efficiency of the electronic device is lowered may occur.

In the case of (b) of FIG. 7 as presented in this document, since the distance D2 between the pads 710B is relatively large, short circuit of the pads 710B may not easily occur even if elution (S) occurs. . Therefore, the structure presented in this document can be improved in durability. In addition, it is possible to solve the short circuit problem caused by elution without increasing the width of the connecting member 700 .

An electronic device (eg, the electronic device 101 of FIG. 1 ) according to various embodiments disclosed in this document includes a display panel (eg, the display panel 211 of FIG. 2 ) and a plurality of devices electrically connected to the display panel. A first connection in which a display driver IC (DDI) (eg, the display driving circuit 301 of FIG. 3) is disposed including a wiring (eg, the wiring 311 of FIG. 3) and controlling the display panel. member (eg, the first connecting member 310 of FIG. 3), a plurality of first pads (eg, the first connecting member 310 of FIG. 1 pad 331) and a first contact portion disposed on the first connection member (eg, the first contact portion 333 of FIG. 3 ), electrically connected to another part of the wiring included in the first connection member. and includes a plurality of second pads (eg, the second pads 332 of FIG. 3) arranged in the first direction and spaced apart from the first contact portion in a second direction perpendicular to the first direction. and a second contact portion disposed on the first connecting member (eg, the second contact unit 334 of FIG. 3), a first layer (eg, the first layer 320-1 of FIG. 3), and the first A second layer (eg, the second layer 320-2 of FIG. 3) stacked on the layer and a plurality of wires (eg, the wiring 321 of FIG. 3) disposed on each layer, and the first connecting member A second connecting member disposed adjacent to (for example, the second connecting member 320 of FIG. 3 ), electrically connected to a part of the wiring included in the second connecting member, and a plurality of first connecting members arranged in the first direction. A third contact portion including three pads (eg, the third pad 341 of FIG. 3 ) and disposed on the first layer of the second connection member to be connected to the first contact portion (eg, third pad 341 of FIG. 3 ). A plurality of fourth pads (eg, fourth pads 342 of FIG. 3 ) electrically connected to other parts of wires included in the contact portion 343 and the second connection member and arranged in the first direction. including and the second A fourth contact portion (eg, the fourth contact portion 344 of FIG. 3 ) disposed on the second layer of the connecting member and connected to the second contact portion may be included.

In addition, the first connecting member may be integrally formed with the substrate of the display panel.

Widths of the first pad and the second pad formed on the first connection member may be smaller than widths of the third pad and the fourth pad formed on the second connection member.

In addition, a first conductive member (eg, the first conductive member 351 of FIG. 4) disposed between the first contact portion and the third contact portion to electrically connect the first pad and the third pad, and A second conductive member (eg, the second conductive member 352 of FIG. 4 ) disposed between the second contact portion and the fourth contact portion to electrically connect the second pad and the fourth pad. A conductive member (eg, the conductive member 350 of FIG. 4 ) may be further included.

In addition, the first conductive member of the conductive member may include a first conductive ball (eg, the first conductive ball 351A of FIG. 5 ), and the second conductive member of the conductive member may include a second conductive ball (eg, the first conductive ball 351A of FIG. 5 ). : The second conductive ball 352A of FIG. 5) may be included, and the diameter of the first conductive ball may be larger than that of the second conductive ball.

In addition, the first connecting member may be formed separately from the substrate of the display panel and electrically connected to the substrate of the display panel.

In addition, the first connection member may include a plurality of stacked layers, and the first pad and the second pad may be respectively disposed on different layers among the plurality of layers of the first connection member.

In addition, the first pad and the second pad may be portions of the plurality of wires included in the first connection member exposed, and the third pad and the fourth pad may include the second connection member. Some of the plurality of wires included in may be exposed portions.

In addition, the first connection member and the second connection member may be formed of a flexible material.

In addition, at least a portion of the first connecting member may be bent to extend toward the rear surface of the display panel.

A display module (eg, the display module 210 of FIG. 2 ) according to various embodiments disclosed in this document includes a display panel (eg, the display panel 211 of FIG. 2 ) and a plurality of electrically connected to the display panel. A first display driver IC (DDI) including wiring (eg, wiring 311 of FIG. 3) and controlling the display panel (eg, display driving circuit 301 of FIG. 3) is disposed. A connecting member (eg, the first connecting member 310 of FIG. 3 ), a plurality of first pads (eg, the first connecting member 310 of FIG. A first contact portion including a first pad 331) and disposed on the first connection member (eg, the first contact portion 333 of FIG. 3 ), and another part of the wiring included in the first connection member It includes a plurality of second pads (eg, the second pads 332 of FIG. 3) electrically connected and arranged in the first direction, and in a second direction perpendicular to the first contact portion and the first direction. A second contact portion (eg, the second contact portion 334 of FIG. 3 ), a first layer (eg, the first layer 320-1 of FIG. 3 ) spaced apart and disposed on the first connection member, It includes a second layer (eg, the second layer 320-2 of FIG. 3) stacked on one layer and a plurality of wires (eg, the wiring 321 of FIG. 3) disposed on each layer, and the first layer A second connection member disposed adjacent to the connection member (eg, the second connection member 320 of FIG. 3 ), a plurality of wires electrically connected to a part of the wiring included in the second connection member and arranged in the first direction. A third contact portion (eg, the third pad 341 of FIG. 3) disposed on the first layer of the second connection member and connected to the first contact portion (eg, the third pad 341 of FIG. 3). A plurality of fourth pads electrically connected to the third contact portion 343) and another part of the wiring included in the second connection member and arranged in the first direction (eg, the fourth pad 342 of FIG. 3 ) ) including and a fourth contact portion (eg, the fourth contact portion 344 of FIG. 3 ) disposed on the second layer of the second connection member and connected to the second contact portion.

In addition, the first connecting member may be integrally formed with the substrate of the display panel.

Widths of the first pad and the second pad formed on the first connection member may be smaller than widths of the third pad and the fourth pad formed on the second connection member.

In addition, a first conductive member (eg, the first conductive member 351 of FIG. 4) disposed between the first contact portion and the third contact portion to electrically connect the first pad and the third pad, and A second conductive member (eg, the second conductive member 352 of FIG. 4 ) disposed between the second contact portion and the fourth contact portion to electrically connect the second pad and the fourth pad. A conductive member (eg, the conductive member 350 of FIG. 4 ) may be further included.

In addition, the first conductive member of the conductive member may include a first conductive ball (eg, the first conductive ball 351A of FIG. 5 ), and the second conductive member of the conductive member may include a second conductive ball (eg, the first conductive ball 351A of FIG. 5 ). : The second conductive ball 352A of FIG. 5) may be included, and the diameter of the first conductive ball may be larger than that of the second conductive ball.

In addition, the first connecting member may be formed separately from the substrate of the display panel and electrically connected to the substrate of the display panel.

In addition, the first connection member may include a plurality of stacked layers, and the first pad and the second pad may be respectively disposed on different layers among the plurality of layers of the first connection member.

In addition, the first pad and the second pad may be portions of the plurality of wires included in the first connection member exposed, and the third pad and the fourth pad may include the second connection member. Some of the plurality of wires included in may be exposed portions.

In addition, at least a portion of the first connecting member may be bent to extend toward the rear surface of the display panel.

An electronic device (eg, the electronic device 101 of FIG. 1 ) according to various embodiments disclosed in this document includes a display panel (eg, the display panel 211 of FIG. 2 ) and a plurality of devices electrically connected to the display panel. A first display driver IC (DDI) including wiring (eg, wiring 311 of FIG. 3) and controlling the display panel (eg, display driving circuit 301 of FIG. 3) is disposed. A connecting member (eg, the first connecting member 310 of FIG. 3 ) and a first layer (eg, the first layer 320-1 of FIG. 3 ), and a second layer stacked on the first layer (eg, the first layer 320-1 of FIG. 3 ). 3 second layer 320-2) and a plurality of wirings (eg, wiring 321 of FIG. 3) disposed on each layer and disposed adjacent to the first connecting member (eg, a second connecting member) : It may include a second connecting member 320 of FIG. 3), wherein the first connecting member is electrically connected to a part of the wiring included in the first connecting member and is arranged in a first direction. A first contact portion (eg, first contact portion 333 of FIG. 3) including a pad (eg, first pad 331 of FIG. 3) disposed on the first connection member, and the first connection A plurality of second pads (eg, the second pad 332 of FIG. 3 ) electrically connected to another part of the wiring included in the member and arranged in the first direction, and the first contact portion and the first It may include a second contact portion (eg, the second contact portion 334 of FIG. 3) disposed on the first connection member and spaced apart in a second direction perpendicular to the direction, the second connection member, A plurality of third pads (for example, the third pad 341 of FIG. 3 ) electrically connected to a portion of the wiring included in the second connection member and arranged in the first direction, and Disposed on the first layer and electrically connected to another part of the wiring included in the third contact part (eg, the third contact part 343 of FIG. 3) connected to the first contact part and the second connection member, the above A fourth contact portion that includes a plurality of fourth pads (eg, the fourth pads 342 of FIG. 3 ) arranged in one direction and is disposed on the second layer of the second connection member and is connected to the second contact portion. (eg, the fourth contact portion 344 of FIG. 3).

In addition, the embodiments disclosed in this document disclosed in the specification and drawings are only presented as specific examples to easily explain the technical content according to the embodiment disclosed in this document and help understanding of the embodiment disclosed in this document. It is not intended to limit the scope of the examples. Therefore, the scope of various embodiments disclosed in this document is that all changes or modified forms derived based on the technical ideas of various embodiments disclosed in this document, in addition to the embodiments disclosed herein, are included in the scope of various embodiments disclosed in this document. should be interpreted

210: display module 310: first connection member
320: second connecting member

Claims (20)

In electronic devices,
display panel;
a first connection member including a plurality of wires electrically connected to the display panel and having a display driver IC (DDI) disposed thereon to control the display panel;
a first contact portion electrically connected to a portion of the wiring included in the first connection member, including a plurality of first pads arranged in a first direction, and disposed on the first connection member;
A plurality of second pads electrically connected to another part of the wiring included in the first connection member and arranged in the first direction, and in a second direction perpendicular to the first contact portion and the first direction a second contact portion spaced apart from the first connecting member;
a second connecting member including a first layer, a second layer stacked on the first layer, and a plurality of wires disposed on each layer and disposed adjacent to the first connecting member;
A plurality of third pads electrically connected to a portion of the wiring included in the second connection member and arranged in the first direction are disposed on the first layer of the second connection member and connected to the first contact unit. a third contact portion; and
A plurality of fourth pads electrically connected to another part of the wiring included in the second connection member and arranged in the first direction are disposed on the second layer of the second connection member and are connected to the second contact portion. An electronic device including a fourth contact unit connected thereto. According to claim 1,
The first connecting member,
An electronic device integrally formed with the substrate of the display panel. According to claim 1,
Widths of the first pad and the second pad formed on the first connection member are smaller than widths of the third pad and the fourth pad formed on the second connection member. According to claim 1,
A first conductive member disposed between the first contact portion and the third contact portion to electrically connect the first pad and the third pad, and disposed between the second contact portion and the fourth contact portion to The electronic device further comprising: a conductive member including a second conductive member electrically connecting the second pad and the fourth pad. According to claim 4,
The first conductive member of the conductive member includes a first conductive ball,
The second conductive member of the conductive member includes a second conductive ball,
The electronic device of claim 1 , wherein a diameter of the first conductive ball is greater than a diameter of the second conductive ball. According to claim 1,
The first connecting member,
An electronic device formed separately from the substrate of the display panel and electrically connected to the substrate of the display panel. According to claim 6,
The first connecting member,
Including a plurality of stacked layers,
The first pad and the second pad are respectively disposed on different layers among the plurality of layers of the first connecting member. According to claim 1,
The first pad and the second pad,
A portion of a plurality of wires included in the first connecting member is exposed;
The third pad and the fourth pad,
An electronic device in which a portion of a plurality of wires included in the second connection member is exposed. According to claim 1,
The first connecting member and the second connecting member,
Electronic devices formed from flexible materials. According to claim 1,
The first connecting member,
An electronic device having at least a portion thereof bent and extended to a rear surface of the display panel. In the display module,
display panel;
a first connection member including a plurality of wires electrically connected to the display panel and having a display driver IC (DDI) disposed thereon to control the display panel;
a first contact portion electrically connected to a portion of the wiring included in the first connection member, including a plurality of first pads arranged in a first direction, and disposed on the first connection member;
A plurality of second pads electrically connected to another part of the wiring included in the first connection member and arranged in the first direction, and in a second direction perpendicular to the first contact portion and the first direction a second contact portion spaced apart from the first connecting member;
a second connection member including a first layer, a second layer stacked on the first layer, and a plurality of wires disposed on each layer and disposed adjacent to the first connection member;
A plurality of third pads electrically connected to a part of the wiring included in the second connection member and arranged in the first direction are disposed on the first layer of the second connection member and connected to the first contact unit. a third contact portion; and
A plurality of fourth pads electrically connected to another part of the wiring included in the second connection member and arranged in the first direction are disposed on the second layer of the second connection member and are connected to the second contact portion. A display module including a; connected fourth contact unit. According to claim 11,
The first connecting member,
A display module integrally formed with the substrate of the display panel. According to claim 11,
Widths of the first pad and the second pad formed on the first connection member are smaller than widths of the third pad and the fourth pad formed on the second connection member. According to claim 11,
A first conductive member disposed between the first contact portion and the third contact portion to electrically connect the first pad and the third pad, and disposed between the second contact portion and the fourth contact portion to The display module further comprising: a conductive member including a second conductive member electrically connecting the second pad and the fourth pad. According to claim 14,
The first conductive member of the conductive member includes a first conductive ball,
The second conductive member of the conductive member includes a second conductive ball,
A diameter of the first conductive ball is greater than a diameter of the second conductive ball display module. According to claim 11,
The first connecting member,
A display module formed separately from the substrate of the display panel and electrically connected to the substrate of the display panel. According to claim 16,
The first connecting member,
Including a plurality of stacked layers,
The first pad and the second pad are respectively disposed on different layers among the plurality of layers of the first connecting member. According to claim 11,
The first pad and the second pad,
A portion of a plurality of wires included in the first connecting member is exposed;
The third pad and the fourth pad,
A display module in which a portion of the plurality of wires included in the second connection member is exposed. According to claim 11,
The first connecting member,
A display module having at least a portion thereof bent and extended to a rear surface of the display panel. In electronic devices,
display panel;
a first connection member including a plurality of wires electrically connected to the display panel and having a display driver IC (DDI) disposed thereon to control the display panel; and
A second connection member including a first layer, a second layer stacked on the first layer, and a plurality of wires disposed on each layer and disposed adjacent to the first connection member,
The first connecting member,
A first contact portion electrically connected to a portion of the wiring included in the first connection member and including a plurality of first pads arranged in a first direction and disposed on the first connection member; and
A plurality of second pads electrically connected to another part of the wiring included in the first connection member and arranged in the first direction, and in a second direction perpendicular to the first contact portion and the first direction And a second contact portion spaced apart and disposed on the first connecting member,
The second connecting member,
A plurality of third pads electrically connected to a part of the wiring included in the second connection member and arranged in the first direction are disposed on the first layer of the second connection member and connected to the first contact unit. A third contact portion to be, and
A plurality of fourth pads electrically connected to another part of the wiring included in the second connection member and arranged in the first direction are disposed on the second layer of the second connection member and are connected to the second contact portion. An electronic device including a fourth contact unit to be connected.

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