KR20230026691A - Electronic device including antenna - Google Patents

Abstract

According to an embodiment of the present document, an electronic device may comprise: a front plate forming a front surface of the electronic device; a rear plate forming a rear surface of the electronic device; a first structure including a first side portion forming a first side area closer to the front surface than the rear surface in side surfaces of the electronic device, and a first support portion extending between the front plate and the rear plate from the first side portion; a second structure including a second side portion forming a second side area closer to the rear surface than the front surface in the side surfaces, and a second support portion extending between the first support portion and the rear plate from the second side portion; a display located between the first support portion and the front plate, and at least partially visible through the front surface; a first conductive pattern at least partially located between the first side portion and the second side portion; and a communication circuit configured to transmit and/or receive a signal in a selected or designated frequency band through the first conductive pattern. In addition, various other embodiments may be possible. Accordingly, an antenna can be easily located in a limited space within the electronic device while ensuring antenna radiation performance.

Description

Electronic device including an antenna {ELECTRONIC DEVICE INCLUDING ANTENNA}

Various embodiments of this document relate to an electronic device including an antenna.

With the development of wireless communication technology, electronic devices are commonly used in daily life, and thus the use of content is increasing. As the range of usable applications widens, the number of antennas included in electronic devices increases.

While electronic devices are becoming slimmer, parts for various functions are being added, making it difficult to design an antenna in a limited space to secure radiation performance for a desired frequency band while reducing electrical influence with various other elements in the electronic device. can

Various embodiments of the present document may provide an electronic device including an antenna for easily locating an antenna in a limited space in an electronic device while securing antenna radiation performance.

The technical problem to be achieved in this document is not limited to the technical problem mentioned above, and other technical problems not mentioned will be understood by those skilled in the art from the description below. .

According to an embodiment of the present document, in an electronic device, a front plate forming a front surface of the electronic device, a rear plate forming a rear surface of the electronic device, and a side surface closer to the front surface than the rear surface of the electronic device. A first structure including a first side portion forming a first side area, and a first support portion extending from the first side portion between the front plate and the back plate, a second side area of the side surface closer to the rear surface than the front surface A second structure including a second side portion forming a second side portion, and a second support portion extending from the second side portion between the first support portion and the back plate, positioned between the first support portion and the front plate, and covering the front surface A display configured to be at least partially visible through, a first conductive pattern positioned at least partially between the first side portion and the second side portion, and communication configured to transmit and/or receive signals of a selected or specified frequency band through the first conductive pattern. circuitry may be included.

According to an embodiment of the present document, an electronic device may include a front plate forming a front surface of the electronic device, a rear plate forming a rear surface of the electronic device, and a first side surface closer to the front surface than the rear surface of the electronic device. A first structure including a first side portion forming a side area, and a first support portion extending from the first side portion between the front plate and the back plate, a second side area closer to the rear surface than the front surface of the side surface A second structure comprising a second side portion forming a second side portion and a second support portion extending from the second side portion between the first support portion and the back plate, positioned between the first support portion and the front plate, and extending through the front surface. At least a partially visible display, a conductive pattern positioned at least partially between the first side portion and the second side portion, and a communication circuit configured to transmit and/or receive signals of a selected or specified frequency band through the conductive pattern, The first side part includes a first part forming the first side area, and a second part connecting the first part and the first support part and coupled to the front plate using a first adhesive member; , The second side part connects a third part forming the second side surface area, and the third part and the second support part, and is coupled to the rear plate using a second adhesive member, and the second part and a fourth portion facing, and the conductive pattern may be at least partially positioned between the second portion and the third portion.

An electronic device including an antenna according to various embodiments of the present document may dispose the antenna with increased space efficiency.

In addition, effects that can be obtained or predicted due to various embodiments of this document may be directly or implicitly disclosed in the detailed description of the embodiments of this document.

1 is a block diagram of an electronic device in a networked environment, in one embodiment.
2 is a perspective view of the front of an electronic device according to an embodiment.
3 is a perspective view of the back of the electronic device of FIG. 2 according to an embodiment.
4 is an exploded view of an electronic device according to an exemplary embodiment.
5 shows a first structure and a second structure of a case, in one embodiment.
FIG. 6 shows a cross-sectional structure in a yz plane of a portion of an electronic device for line AA' in FIG. 3, in one embodiment.
FIG. 7 shows a cross-sectional structure in the yz plane of a portion of an electronic device for line BB' in FIG. 3, in one embodiment.
8 is a partial cross-sectional view of a portion of an electronic device for line BB' in FIG. 3, in one embodiment.
FIG. 9 shows a state in which the first structure, the first printed circuit board, and the first antenna structure are coupled in relation to the embodiment of FIG. 7 .
FIG. 10 shows a cross-sectional structure in the yz plane of a portion of an electronic device for line BB' in FIG. 3 in another embodiment.
FIG. 11 illustrates a state in which the first structure, the first printed circuit board, and the first antenna structure are coupled in relation to the embodiment of FIG. 10 .

Hereinafter, various embodiments of this document will be described with reference to the accompanying drawings.

1 is a block diagram of an electronic device 101 in a networked environment 100, in one embodiment.

Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, processor 120 transfers instructions or data received from other components (eg, sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to an embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, an image signal processor or a communication processor) may be implemented as part of other functionally related components (eg, the camera module 180 or the communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but the foregoing example not limited to The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks, or a combination of two or more of the above, but is not limited to the above examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used in a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or movement) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 may be a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, a : A local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (full dimensional MIMO (FD-MIMO)), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 may be used to realize peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency (for realizing URLLC). Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numerals may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish that component from other corresponding components, and may refer to that component in other respects (eg, importance or order) is not limited. A (e.g. first) component is said to be "coupled" or "connected" to another (e.g. second) component, with or without the terms "functionally" or "communicatively". When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeably interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits. can be used as A module may be an integral part or the smallest unit of a part or part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document provide one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them. For example, a processor (eg, the processor 120) of a device (eg, the electronic device 101) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used when data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided by being included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) online, directly between smart phones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the above-described components may include a single object or a plurality of objects, and some of the plurality of objects may be separately disposed in other components. there is. According to various embodiments, one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as performed by a corresponding component among the plurality of components before the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numerals may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B," "A, B or C," "at least one of A, B and C," and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish that component from other corresponding components, and may refer to that component in other respects (eg, importance or order) is not limited.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

2 is a perspective view of the front of the electronic device 200 according to an embodiment. 3 is a perspective view of the back of the electronic device 200 of FIG. 2 according to an embodiment.

Referring to FIGS. 2 and 3 , an electronic device 200 (eg, the electronic device 101 of FIG. 1 ) may include a housing 210 . The housing 210 may form, for example, a front surface 210A of the electronic device 200, a rear surface 210B of the electronic device 200, and a side surface 210C of the electronic device 200. In some embodiments, the housing 210 may refer to a structure that forms at least a portion of a front surface 210A, a rear surface 210B, and a side surface 210C. In various embodiments of this document, for convenience of description, the direction in which the display 301 included in the electronic device 3 is visually exposed is the front surface 210A of the electronic device 200, and the opposite direction is the electronic device. It is defined and used as the back side (210B) of (200). In one embodiment, the housing 210 may include a front plate (or first plate) 201 , a back plate (or second plate) 202 , and a case 203 . The front surface 210A of the electronic device 200 may be formed by the front plate 201 . The front plate 201 may be substantially transparent at least in part, and may include, for example, a glass plate including various coating layers, or a polymer plate. The back side 210B of the electronic device 200 may be formed by the back plate 202 . The back plate 202 may be substantially opaque, for example coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or at least two of the foregoing materials. It can be formed by a combination of The case 203 may be combined with the front plate 201 and the rear plate 202 and may form the side surface 210C of the electronic device 200 . Case 203 may include metal and/or polymer.

According to an embodiment, the electronic device 200 includes a display 301, a first audio module 302, a second audio module 303, a third audio module 304, a sensor module 305, and a front camera. module 306, a plurality of rear camera modules (eg, a first rear camera module 3071, a second rear camera module 3072, a third rear camera module 3073, and a fourth rear camera module 3074) ), a light emitting module 308, an input module 309, and a connection terminal module 310. In some embodiments, the electronic device 200 may omit at least one of the above components or may additionally include other components.

A display area (eg, a screen display area or an active area) of the display 301 may be visually exposed through, for example, the front plate 201 . In one embodiment, the electronic device 200 may be implemented so that the display area seen through the front plate 201 is as large as possible (eg, a large screen or a full screen). For example, the display 301 may be implemented to have an outer shape substantially identical to that of the front plate 201 . For another example, the distance between the outer edge of the display 301 and the outer edge of the front plate 201 may be substantially the same. In one embodiment, display 301 may include touch sensing circuitry. In some embodiments, the display 301 may include a pressure sensor capable of measuring the intensity (pressure) of a touch. In some embodiments, the display 301 may be coupled to or positioned adjacent to a digitizer (eg, an electromagnetic induction panel) that detects a magnetic pen (eg, a stylus pen).

The first audio module 302 may include, for example, a microphone located inside the electronic device 200 and a microphone hole formed on the side surface 210C of the electronic device 200 corresponding to the microphone. The position or number of audio modules relative to the microphone is not limited to the illustrated example and may vary. For another example, the electronic device 200 may include a microphone hole formed on the rear surface 210B of the electronic device 200 and a microphone located inside the electronic device 200 corresponding to the microphone hole. In some embodiments, the electronic device 200 may include a plurality of microphones used to detect the direction of sound.

The second audio module 303 includes, for example, a first speaker located inside the electronic device 200 and a first speaker hole formed on the side surface 210C of the electronic device 200 corresponding to the first speaker. can include The third audio module 304 includes, for example, a second speaker located inside the electronic device 200 and a second speaker hole formed on the front surface 210A of the electronic device 200 corresponding to the second speaker. can include In one embodiment, the first speaker may include an external speaker. In one embodiment, the second speaker may include a receiver for a call, and the second speaker hole may be referred to as a receiver hole. The location or number of the second audio module 303 or the third audio module 304 is not limited to the illustrated example and may vary. In some embodiments, the microphone hole and speaker hole may be implemented as one hole. In some embodiments, the second audio module 303 or the third audio module 304 may include a piezo speaker without a speaker hole.

The sensor module 305 may generate, for example, an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state. In one embodiment, the sensor module 305 may include an optical sensor located inside the electronic device 200 corresponding to the front surface 210A of the electronic device 200 . The optical sensor may include, for example, a proximity sensor or an illuminance sensor. An optical sensor may be aligned with an opening formed in the display 301 . External light can reach the optical sensor through openings in the front plate 201 and display 301 . In some embodiments, the optical sensor may be located on the back side of the display 301 or below or beneath the display 301, and the position of the optical sensor may not be visually distinguished (or exposed) and a related function may be located. can do. In some embodiments, an optical sensor may be positioned aligned with a recess formed in the back of display 301 . The optical sensor may be disposed to overlap at least a portion of the screen (or display area) to perform a sensing function without being exposed to the outside. In this case, some areas of the display 301 overlapping at least partially with the optical sensor may include a different pixel structure and/or wiring structure than other areas. For example, some areas of the display 301 overlapping at least partially with the optical sensor may have different pixel densities than other areas. In some embodiments, a plurality of pixels may not be disposed in a portion of the display 301 that at least partially overlaps the optical sensor. In some embodiments, the electronic device 200 may include a biometric sensor (eg, a fingerprint sensor) located on the back of the display 301 or below the display 301 . The biometric sensor may be implemented in an optical method, an electrostatic method, or an ultrasonic method, and the location or number thereof may vary. The electronic device 200 includes various other sensor modules, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a temperature sensor, or a humidity sensor. At least one of them may be further included.

For example, the front camera module 306 may be located inside the electronic device 200 corresponding to the front surface 210A of the electronic device 200 . The plurality of rear camera modules 3071 , 3072 , 3073 , and 3074 may be located inside the electronic device 200 to correspond to the rear surface 210B of the electronic device 200 , for example. The front camera module 306 and/or the rear camera module 3071, 3072, 3073, or 3074 may include one or more lenses, an image sensor, and/or an image signal processor. The location or number of camera modules is not limited to the illustrated example and may vary.

According to one embodiment, the display 301 may include an opening aligned with the front camera module 306 . External light may reach the front camera module 306 through the front plate 201 and the opening of the display 301 . The opening of the display 301 aligned with or overlapping the front Carrera module 306 may be formed in the form of a notch. In some embodiments, the opening of the display 301 aligned with or overlapping the front Carrera module 306 may be formed in the form of a hole. In some embodiments, the front camera module 306 can be positioned behind or below the display 301, and the location of the front camera module 306 is visually distinct. (or exposure) and can perform related functions (e.g. image taking). The front camera module 306 may include, for example, a hidden display rear camera (eg, an under display camera (UDC)). In some embodiments, the front camera module 306 may be positioned aligned with a recess formed in the back of the display 301 . The front camera module 306 may be disposed to overlap at least a portion of the screen (or display area) to acquire an image of an external subject without being visually exposed to the outside. In this case, a portion of the display 301 overlapping at least partially with the front camera module 306 may include a different pixel structure and/or wiring structure than other areas. For example, some areas of the display 301 overlapping at least partially with the front camera module 306 may have different pixel densities than other areas. A pixel structure and/or a wiring structure formed in a portion of the display 301 overlapping at least partially with the front camera module 306 may reduce loss of light between the exterior and the front camera module 306 . In some embodiments, pixels may not be disposed in a portion of the display 301 that at least partially overlaps the front camera module 306 . In some embodiments, the electronic device 200 may further include a light emitting module (eg, a light source) located inside the electronic device 200 corresponding to the front surface 210A of the electronic device 200 . The light emitting module may provide, for example, state information of the electronic device 200 in the form of light. In some embodiments, the light emitting module may provide a light source that is interlocked with the operation of the front camera module 306 . The light emitting module may include, for example, an LED, an IR LED or a xenon lamp.

According to an embodiment, the plurality of rear camera modules 3071, 3072, 3073, and 3074 may have different properties (eg, angles of view) or functions, and may include, for example, dual cameras or triple cameras. there is. The plurality of rear camera modules 3071, 3072, 3073, and 3074 may include a plurality of camera modules including lenses having different angles of view, and the electronic device 200, based on the user's selection, The device 200 may control to change the angle of view of the camera module. The plurality of rear camera modules 3071, 3072, 3073, and 3074 may include a wide-angle camera, a telephoto camera, a color camera, a monochrome camera, or an IR (infrared) camera (eg, a time of flight (TOF) camera, a structured light camera) may include at least one of them. In some embodiments, an IR camera may operate as at least part of a sensor module. The light emitting module 308 (eg, flash) may include a light source for the plurality of rear camera modules 3071 , 3072 , 3073 , and 3074 . The light emitting module 308 may include, for example, an LED or a xenon lamp.

Input module 309 may include, for example, one or more key input devices. One or more key input devices may be located, for example, in an opening formed on a side surface 210C of the electronic device 200 . In some embodiments, the electronic device 200 may not include some or all of the key input devices, and the key input devices not included may be implemented as soft keys using the display 301 . The location or number of input modules 309 may vary, and in some embodiments, input module 309 may include at least one sensor module.

The connection terminal module (eg, a connector module or an interface terminal module) 310 is, for example, a connector (or interface terminal) located inside the electronic device 200, and Corresponding to the connector, a connector hole formed on the side surface 210C of the electronic device 200 may be included. The electronic device 200 may transmit and/or receive power and/or data with an external electronic device electrically connected to the connector. In one embodiment, the connector may include a universal serial bus (USB) connector or a high definition multimedia interface (HDMI) connector. In some embodiments, the electronic device 200 may further include another connection terminal module including an audio connector (eg, a headphone connector or an earphone connector). The location or number of connection terminal modules is not limited to the illustrated example and may vary.

4 is an exploded view of an electronic device 200 according to an exemplary embodiment. 5 shows a first structure 5 and a second structure 6 of case 203 in one embodiment. FIG. 6 illustrates, in one embodiment, a cross-sectional structure 600 in the y-z plane of a portion of the electronic device 200 for line A-A' in FIG. 3 .

4, 5, and 6, the electronic device 200 includes a front plate 201, a rear plate 202, a case 203, a display 301, a first substrate assembly 410, and a second substrate. The assembly 420 , the battery 430 , the antenna structure 440 , the first adhesive member 450 , and/or the second adhesive member 460 may be included. In some embodiments, the electronic device 200 may omit some of the above components or additionally include other components.

According to one embodiment, the case 203 may include a first structure 5 and a second structure 6 . The first structure 5 may include a first side portion 51 and a first support portion 52 . The first side part 51 may form part of the side surface 210C of the electronic device 200 . In one embodiment, the first side portion 51 is the front plate 201 (or the electronic device 200) than the back plate 202 (or the back surface 210B of the electronic device 200) among the side surfaces 201C of the electronic device 200. A first side area (or first area) S1 close to the front surface 210A of the device 200 may be formed. For example, the first side area S1 may be formed in an annular shape along the edge of the front plate 201 . The first support part 52 may extend from the first side part 51 and be positioned at least partially between the front plate 201 and the back plate 202 . The second structure 6 may include a second side portion 61 and a second support portion 62 . The second side part 61 may form part of the side surface 210C of the electronic device 200 . In one embodiment, the second side portion 61 is the rear plate 202 (or electronic device 200) than the front plate 201 (or the front surface 210A of the electronic device 200) among the side surfaces 201C of the electronic device 200. A second side area (or second area) S2 close to the rear surface 210B of the device 200 may be formed. For example, the second side area S2 may be formed in an annular shape along the edge of the back plate 201 . The first side area S1 and the second side area S2 may be smoothly connected without a substantial height difference. The second support part 62 may extend from the second side part 61 and be positioned at least partially between the front plate 201 and the back plate 202 . The second support portion 62 may be positioned at least partially between the first support portion 52 and the back plate 202 . When viewed from above the front plate 201 (eg, when viewed in the -z-axis direction), the first support part 52 and the second support part 62 may overlap. The first support part 52 of the first structure 5 and/or the second support part 62 of the second structure 6 is a part where components located inside the electronic device 200 are disposed, and the electronic device ( 200) can contribute to durability or stiffness (eg, torsional stiffness). In some embodiments, the first support 52 and/or the second support 62 may be referred to as a 'bracket', a 'mounting plate', or a 'support structure'. The first support part 52 may include a first surface 52A facing the front plate 201 and a second surface 52B facing the rear plate 202 . The second support part 62 may include a third surface 62A facing the front plate 201 and a fourth surface 62B facing the rear plate 202 . The second surface 52B may face the third surface 62A. The various components are disposed on the first side 52A, the second side 52B, the third side 62A, or the fourth side 62B, or the first side 52A, the second side 52B, It may be supported by the third surface 62A or the fourth surface 62B. In some embodiments, the first structure 5 is an element located on the side of the front plate 201 relative to the second structure 6 of the case 203 and may be referred to as a 'front case', and the second structure 6 Structure 6 is an element located on the side of the rear plate 202 relative to the first structure 5 of the case 203 and may be referred to as a 'rear case'.

According to one embodiment, the first structure 5 and the second structure 6 can be joined using screw fastening. For example, the first support part 52 includes a plurality of screw holes (or a plurality of screw fastening holes) used to couple the first support part 52 to the second support part 62 using screws (or bolts). can include For example, the second support part 62 may include a plurality of screw holes used to couple the second support part 62 to the first support part 52 using screws (or bolts). For example, the first support part 52 may include at least one screw fastening part (eg, a boss) formed to correspond to at least one screw hole included in the second support part 62 . For example, the second support part 62 may include at least one screw fastening part formed to correspond to the at least one screw hole included in the first support part 52 . The screw fastening part may include, for example, a hole structure including male threads of the screw and female threads engageable therewith. According to some embodiments, the first structure 5 and the second structure 6 may be joined using a snap-fit fastening. For example, the first side portion 51 or the first support portion 52 of the first structure 5 may include at least one hook structure, and the second structure 6 may include at least one hook structure. Possible hook fastening structures may be included. For example, the second side portion 61 or the second support portion 62 of the second structure 6 may include at least one hook structure, and the first structure 5 may include at least one hook structure fastened. Possible hook fastening structures may be included. A coupling method such as screw fastening or snap fit fastening may enable replacement of the first structure 5 or the second structure 6 due to, for example, breakage, if necessary.

According to some embodiments, the first structure 5 and the second structure 6 may be joined using bonding. For example, a polymeric adhesive material or sealant may be interposed between the first structure 5 and the second structure 6 .

According to one embodiment, the display 301 may be positioned between the front plate 210 and the first support 52 of the first structure 5 . The display 301 may be disposed on, for example, the first surface 52A of the first support 52 .

According to one embodiment, the first substrate assembly 410 may be positioned between the first support 52 of the first structure 5 and the second support 62 of the second structure 6 . The first substrate assembly 410 may be disposed on the second surface 52B of the first support 52 or the third surface 62A of the second support 62 . The first substrate assembly 410 may be coupled to the first support 52 using, for example, screw fastening. The first board assembly 410 may include a first printed circuit board 411 (eg, a printed circuit board (PCB) or a printed circuit board assembly (PBA)). The first board assembly 410 may include various electronic components electrically connected to the first printed circuit board 411 . The electronic components may be disposed on the first printed circuit board 411 or electrically connected to the first printed circuit board 441 through an electrical path such as a cable or a flexible printed circuit board (FPCB). 2 and 3, the electronic components include, for example, a second speaker included in the third audio module 304, a sensor module 305, a front camera module 306, and a plurality of rear camera modules. (3071, 3072, 3073, 3074), a light emitting module 308, or an input module 309. In one embodiment, the first support part 52 may include an opening 521 formed to correspond to the front camera module 307 . When viewed from the top of the front plate 201 (eg, when viewed in the -z-axis direction), the opening 3011 of the display 301 and the opening 521 of the first support 52 may be aligned or overlap each other. External light may reach the front camera module 306 through the front plate 201 , the opening 3011 of the display 301 and the opening 521 of the first support 52 . In some embodiments, the front camera module 306 may be inserted and positioned in the opening 521 of the first support 52 . In one embodiment, the second support part 62 includes a plurality of openings 621, 622, 623, and 624 formed in a one-to-one correspondence with the plurality of rear camera modules 3071, 3072, 3073, and 3074 (see FIG. 3). ) may be included. The back plate 202 is one to one with the plurality of openings 621 , 622 , 623 , and 624 of the second support part 62 when viewed from the top of the back plate 202 (eg, when viewed in the +z-axis direction). It may include a plurality of openings 2021, 2022, 2023, and 2024 aligned or overlapped. The plurality of rear camera modules 3071, 3072, 3073, and 3074 include the plurality of openings 621, 622, 623, and 624 of the second support 62 and the plurality of openings 2021 and 2021 of the rear plate 202, respectively. 2022, 2023, 2024). In some embodiments, back plate 202 is substantially transparent, replacing plurality of openings 2021 , 2022 , 2023 , 2024 corresponding to plurality of rear camera modules 3071 , 3072 , 3073 , 3074 . It may be implemented by including light transmission areas. In one embodiment, the second support portion 62 may include an opening 625 formed to correspond to the light emitting module 308 (see FIG. 3). The back plate 202 may include an opening 2025 aligned with or overlapping the opening 625 of the second support 62 when viewed from above the back plate 20 . The light emitting module 308 may be positioned through the opening 625 of the second support 62 and the opening 2025 of the rear plate 202 . In some embodiments, the back plate 202 may be implemented to include substantially transparent light transmitting regions, replacing openings 2025 corresponding to the light emitting module 308 . In one embodiment, the sensor module 305 may be positioned between the front plate 210 and the first support 52 of the first structure 5, and positioned through an opening formed in the first support 52. It may be electrically connected to the first printed circuit board 411 through an electrical path such as a flexible printed circuit board (FPCB). The sensor module 305 may be disposed, for example, on the first surface 52A of the first support 52, located below the display 301, or through an opening formed in the display 301 (not shown). ) can be positioned aligned with. In some embodiments, the sensor module 305 can be disposed on the first printed circuit board 411 and the first support 52 is aligned with the sensor module 305 or has an opening into which the sensor module 305 is inserted. can include

According to one embodiment, the second substrate assembly 420 may be positioned between the first support 52 and the second support 62 . The second substrate assembly 420 may be disposed on the second surface 52B of the first support 52 or the third surface 62A of the second support 62 . The second substrate assembly 410 may be coupled to the first support 52 using, for example, screw fastening. When viewed from the top of the front plate 201 (eg, when viewed in the -z-axis direction), the second substrate assembly 420 may be disposed spaced apart from the first substrate assembly 410, and the battery 430 is It may be positioned between the first substrate assembly 410 and the second substrate assembly 420 . The second board assembly 420 may include a second printed circuit board 421 electrically connected to the first printed circuit board 411 of the first board assembly 410 . The second board assembly 420 may include various electronic components electrically connected to the second printed circuit board 421 . The electronic components may be disposed on the second printed circuit board 421 or electrically connected to the second printed circuit board 421 through an electrical path such as a cable or FPCB. 2 and 3, the electronic components may include, for example, a microphone included in the first audio module 302, a first speaker included in the second audio module 303, or a connection terminal module 310 A connector included in may be included. In one embodiment, the first support part 52 may include an opening 522 formed to correspond to a biometric sensor (eg, a fingerprint sensor) located below the display 301 . A biosensor disposed on the second printed circuit board 421 may be located in the opening 522 .

According to some embodiments, the first board assembly 410 or the second board assembly 420 is a primary PCB (or main PCB or master PCB), a secondary PCB (or slave PCB) partially overlapping the primary PCB, and/or an interposer substrate between the primary PCB and the secondary PCB.

According to some embodiments, an integral substrate assembly including the first substrate assembly 410 and the second substrate assembly 420 may be implemented. For example, when viewed from above the back plate 202 (eg, in the direction of the +z axis), the substrate assembly includes a first portion and a second portion positioned spaced apart from each other with the battery 430 therebetween; and It may include a third part extending between the battery 430 and the side surface 210C of the electronic device 200 and connecting the first part and the second part. The third part may be implemented substantially rigidly. In some embodiments, the third portion may be implemented substantially flexibly.

The battery 430 is a device for supplying power to at least one component of the electronic device 200, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . In one embodiment, the battery 430 may be positioned between the first support 52 of the first structure 5 and the back plate 202 and the second support 62 of the second structure 6 It may include an opening 626 in which the battery 430 is positioned. A seating structure 523 in the form of a recess for stably positioning the battery 430 on the first support part 52 may be formed on the second surface 52B of the first support part 52 .

The first structure 5 may be formed of, for example, a metal material and/or a non-metal material (eg, polymer). In one embodiment, the first structure 5 may include a non-conductive structure 501 formed of a non-metal material and a conductive structure 502 formed of a metal material. The conductive structure 502 may be formed using various processing methods such as, for example, computer numerical control (CNC), die casting, or pressing. The non-conductive structure 501 may be molded into a form coupled to the conductive structure 502 using, for example, insert molding. For example, after placing the conductive structure 5022 in the mold, injecting molten resin into the mold, cooling and taking it out, a first structure in which the non-conductive structure 501 and the conductive structure 502 are combined ( 5) can be formed. In one embodiment, a part of the non-conductive structure 501 may form the first side surface portion 51, and the first side surface area ( S1) may be formed of a non-conductive surface. For example, the first side portion 51 may be an integral quadrangular annular shape without segmentation (or not divided into a plurality of parts). In some embodiments, a portion of the conductive structure 502 may form at least a portion of the first side portion 51, and at least a portion of the first side portion S1 may be formed as a conductive surface. In one embodiment, a portion of the non-conductive structure 501 and a portion of the conductive structure 502 may form the first support portion 52 . In some embodiments, at least a portion of the conductive structure 502 included in the first support 52 is for a component such as the first substrate assembly 410, the second substrate assembly 420, or the display 301. It can play the role of electromagnetic shielding. The conductive structure 502 may be electrically connected to a ground (eg, a ground plane or a ground layer) included in the first printed circuit board 411 . For example, between the conductive structure 502 and the first printed circuit board 411, a flexible conductive member (eg, a conductive clip, a pogo pin, a spring, a conductive pole, a conductive rubber, a conductive tape, or a conductive connector) or a conductive material may be formed. An adhesive material may be placed. At least a portion of the conductive structure 502 electrically connected to the ground is an electromagnetic shielding structure for reducing electromagnetic influence (e.g., electromagnetic interference (EMI)) on components included in the electronic device 200 (or, Ground structure) At least a portion of the conductive structure 502 is, for example, electromagnetic noise generated inside the electronic device 200 or introduced from the outside of the electronic device 200 (eg, EMI) on the first printed circuit board 411, the second printed circuit board 421, and/or the display 301 can be reduced. At least a portion of the conductive structure 502 is, for example, 1 Electromagnetic interference between the printed circuit board 411 and the display 301 can be reduced.

According to an embodiment, the non-conductive structure 501 included in the first structure 5 may include various polymers such as engineering plastic (eg, polycarbonate (PC) or polymethyl methacrylate (PMMA)). there is. The non-conductive structure 501 may be, for example, polyether ether ketone, polyphenylene sulfide, polybutylene terephthalate, polyimide, or polycarbonate. It may include a polymer resin such as (polycarbonate). In some embodiments, the non-conductive structure 501 may include a material obtained by mixing engineering plastic with various reinforcing substrates such as glass fiber or carbon fiber (eg, fiber reinforced plastic (FRP)).

According to an embodiment, the conductive structure 502 included in the first structure 5 may include titanium, an amorphous alloy, a metal-ceramic composite material (eg, cermet), or stainless steel. In some embodiments, conductive structure 502 may include magnesium, a magnesium alloy, aluminum, an aluminum alloy, a zinc alloy, or a copper alloy. Conductive structure 502 may include a variety of other metallic materials.

According to one embodiment, the second structure 6 may comprise a non-metallic material. In some embodiments, the second structure 6 may include the same non-metallic material as the non-metallic structure 501 of the first structure 5 . In some embodiments, the second structure 6 may include a different non-metallic material than the non-metallic structure 501 of the first structure 5 .

According to some embodiments, the second structure 6 may be formed of a metallic material. For example, the second structure 6 may include the same metal material as the metal structure 502 of the first structure 5 . For another example, the second structure 6 may include a different metal material than the metal structure 502 of the first structure 5 .

According to some embodiments, the second structure 6 may include a portion including a non-metal material (eg, a non-conductive structure) and a portion including a metal material (eg, a conductive structure). For example, at least a portion of the second side portion 61 may include a non-metallic material, and at least a portion of the second support portion 62 may include a metal material.

According to one embodiment, the antenna structure 440 may be positioned between the back plate 202 and the second support 62 of the second structure 6 . In some embodiments, antenna structure 440 may be positioned between battery 430 and back plate 202 . The antenna structure 440 may be implemented in the form of a film such as FPCB. The antenna structure 440 may include at least one conductive pattern utilized as a loop-type radiator. For example, the at least one conductive pattern may include a planar spiral conductive pattern (eg, a planar coil or a pattern coil). In one embodiment, at least one conductive pattern included in the antenna structure 440 may be electrically connected to a wireless communication circuit (or wireless communication module) included in the first substrate assembly 410 . For example, at least one conductive pattern may be utilized for short-range wireless communication such as near field communication (NFC). As another example, at least one conductive pattern may be used for magnetic secure transmission (MST) for transmitting and/or receiving a magnetic signal. In some embodiments, at least one conductive pattern included in the antenna structure 440 may be electrically connected to a power transmission/reception circuit included in the first substrate assembly 410 . The power transmission/reception circuit may wirelessly receive power from an external electronic device or wirelessly transmit power to an external electronic device using at least one conductive pattern. The power transmission/reception circuit may include a power management module, and may include, for example, a power management integrated circuit (PMIC) or a charger integrated circuit (IC). The power transmission/reception circuit may charge the battery 430 using power wirelessly received using the conductive pattern.

According to one embodiment, the front plate 201 may be coupled to the first structure 5 using the first adhesive member 450 . For example, the first adhesive member 450 may be positioned between the front plate 201 and the first side part 51 . For example, the first adhesive member 450 may be disposed in an annular shape adjacent to an edge (or border) of the front plate 201 . The first adhesive member 450 may be formed in various other shapes that are not limited to the illustrated example. In some embodiments, the first adhesive member 450 may include a plurality of adhesive members separated from each other. In this case, there may be a separate adhesive member or a filling member connecting the two separated adhesive members.

According to one embodiment, the rear plate 202 may be coupled to the second structure 6 using the second adhesive member 460 . The second adhesive member 460 may be positioned between the rear plate 202 and the second side part 61 , for example. For example, the second adhesive member 460 may be disposed in an annular shape adjacent to an edge (or border) of the back plate 202 . The second adhesive member 460 may be formed in various other shapes that are not limited to the illustrated example. In some embodiments, the second adhesive member 460 may include a plurality of adhesive members separated from each other. In this case, there may be a separate adhesive member or a filling member connecting the two separated adhesive members.

According to an embodiment, the first adhesive member 450 or the second adhesive member 460 may include a heat-reactive adhesive material, a photo-reactive adhesive material, a general adhesive, or double-sided tape.

According to an embodiment, the electronic device 200 may include at least one antenna structure (or conductive pattern) (not shown) extending between the first structure 5 and the second structure 6 . For example, at least one antenna structure may extend between the first side part 51 and the second side part 61 . A communication circuit included in the electronic device 200 (eg, the wireless communication module 192 of FIG. 1 ) may be configured to transmit and/or receive signals in a selected or designated frequency band through an antenna structure. A conductive pattern used as an antenna radiator will be described with reference to the following drawings.

The electronic device 200 may further include various elements according to its provision form. These components have various variations according to the convergence trend of the electronic device 200, so it is not possible to enumerate them all, but components equivalent to the above-mentioned components are added to the electronic device 200. can be included In various embodiments, certain components may be excluded from the above components or replaced with other components according to the form of provision.

FIG. 7 shows a cross-sectional structure 700 in the y-z plane of a portion of electronic device 200 for line B-B' in FIG. 3, in one embodiment. FIG. 8 is a partial cross-sectional view 800 of a portion of the electronic device 200 for line B-B' in FIG. 3, in one embodiment. FIG. 9 shows a state in which the first structure 5 , the first printed circuit board 411 , and the first antenna structure 71 are combined in relation to the embodiment of FIG. 7 .

7, 8, and 9, the electronic device 200 includes a front plate 201, a rear plate 202, a case 203, a display 301, a first printed circuit board 411, a first The antenna structure 71 , the second antenna structure 72 , the first flexible conductive member 81 , and/or the second flexible conductive member 82 may be included.

According to one embodiment, the first structure 5 may include a first part (①) and a second part (②), and the second structure 6 may include a third part (③) and a fourth part ( ④) can be included. The first portion ① may form the first side area S1. The third portion ③ may form the second side area S2. At least a portion of the second portion ② may extend from the first portion ① and face the third portion ③. The second part (②) may be, for example, a part that connects at least a part of the first part (①) and the first support part 52 of the first structure (5). The fourth portion ④ may be, for example, a portion connecting at least a part of the third portion ③ and the second support part 62 of the second structure 6 . The first adhesive member 450 may be positioned between the second portion ② and the front plate 201 . The fourth part ④ may extend between the rear plate 202 and the second part ② from the third part ③. The second adhesive member 460 may be positioned between the fourth portion ④ and the back plate 202 .

According to an embodiment, the first part ① of the first side part 51 is the front plate 201 and/or the display 301 against an external impact (eg, an impact caused by a fall of the electronic device 200). It can contribute to reducing the damage of the front plate 201 and/or the display 301 by reducing the stress effect on the surface. The first part (①) reduces the damage of the coupling structure by reducing the stress effect on the coupling structure using the first adhesive member 450 between the first side portion 51 and the front plate 201 in relation to external impact. And it can contribute to securing waterproof performance thereby.

According to some embodiments, a fastening structure may be included between the second portion ② of the first side portion 51 and the third portion ③ of the second side portion 61 . The fastening structure may include a hook fastening structure (not shown). The hook fastening structure may include, for example, a plurality of hooks formed in the third part ③ and a plurality of hook joints formed in the second part ②. The plurality of hook fastening parts may include an under-cut structure (or hooking structure) in the form of a recess or a groove corresponding to the plurality of hooks. When the second structure 6 is coupled with the first structure 5 by moving it in a direction from the rear plate 202 toward the front plate 201 (eg, the +z-axis direction), a plurality of The hooks may be fastened to a plurality of hook fasteners. The fastening structure may include an insert fastening structure (not shown). The insert fastening structure may include, for example, a plurality of inserts formed on the third part ③ and a plurality of insert fastening parts formed on the second part ②. The plurality of insert fastening parts may include a fitting structure (or fitting structure) in the form of a recess or groove corresponding to the plurality of inserts. When the second structure 6 is coupled with the first structure 5 by moving it in a direction from the back plate 202 toward the front plate 201 (e.g., the +z-axis direction), the plurality of inserts It can be inserted into fastening parts. A fastening structure including a plurality of inserts and a plurality of insert fastening parts may guide a position or direction where the second structure 6 is coupled to the first structure 5 .

According to an embodiment (not shown), a buffer member (or buffer material) capable of mitigating an external shock may be interposed between the first side part 51 and the second side part 61 . The buffer member may reduce damage to the first side portion 51 and/or the second side portion 61 in response to an external impact. In some embodiments, a waterproof member such as rubber or an adhesive member may be interposed between the first side portion 51 and the second side portion 61 .

According to one embodiment, the first antenna structure 71 may be located in the case 203 . The first antenna structure 71 may include, for example, a first region 711 , a second region 712 , or a third region 713 . The first area 711 may be located between the second part (②) of the first side part 51 and the third part (③) of the second side part 61. The first area 711 may be disposed on the second portion ② of the first side portion 51 . In one embodiment, the second portion ② of the first side portion 51 may include a recess 514 (see FIG. 9 ), and the first region 711 may be located in the recess 514. can The second area 712 may extend between the first printed circuit board 411 and the first support part 52 from the first area 711 . In one embodiment, the second portion (②) of the first side portion 51 may include a first opening 513, and the second region 712 may be positioned through the first opening 513. there is. The first opening 513 may be formed in the recess 514 . The second area 712 may be disposed on the second surface 52B of the first support part 52 . The third area 713 may extend from the first area 711 between the second portion ② of the first side portion 51 and the fourth portion ④ of the second side portion 61 . The third region 713 may be disposed on the second portion ② of the first side portion 51 . In one embodiment, the first antenna structure 71 may be coupled to the first structure 5 using an adhesive material.

According to one embodiment, the first antenna structure 71 may be implemented in the form of a film such as a flexible printed circuit board. The first antenna structure 71 may include a first conductive pattern 714 (see FIG. 9 ). The first conductive pattern 714 is electrically connected to a communication circuit (or wireless communication circuit) (eg, the wireless communication module 192 of FIG. 1 ) disposed on the first printed circuit board 411 to be an antenna radiator (or antenna). radiating part). In one embodiment, the first flexible conductive member 81 may be disposed on one surface of the first printed circuit board 411 facing the second surface 52B of the first support part 52 . The first flexible conductive member 81 may elastically contact the second region 712 of the first antenna structure 71 and be electrically connected to the second region 712 . The first conductive pattern 714 included in the first antenna structure 71 may be electrically connected to the communication circuit through the first flexible conductive member 81 . The first flexible conductive member 81 may include, for example, a conductive clip (eg, a conductive member including an elastic structure). In some embodiments, the first flexible conductive member 81 may be implemented in various other forms such as a pogo pin, a spring, a conductive foam, a conductive rubber, a conductive tape, a conductive connector, or a conductive adhesive member. The first conductive pattern 714 may be electrically connected to a communication circuit to form an electromagnetic field capable of transmitting and/or receiving signals of at least one frequency in a selected or designated frequency band. The communication circuit may process a transmission signal or a reception signal in at least one designated frequency band through the first antenna structure 71 . The designated frequency band is, for example, low band (LB) (about 600 MHz to about 1 GHz), middle band (MB) (about 1 GHz to about 2.3 GHz), high band (HB) (about 2.3 GHz to about 2.7 GHz). , or ultra high band (UHB) (about 2.7 GHz to about 6 GHz). The designated frequency band may include various other frequency bands.

According to one embodiment, the first conductive pattern 714 may be included in the first region 711 of the first antenna structure 71 . The second region 712 of the first antenna structure 71 includes an electrical path (eg, wiring) extending from the first conductive pattern 714 and a conductive terminal for electrical connection with the first flexible conductive member 81 can include The second region 712 may operate as a first feeding part (or first feeding structure) for supplying radiation current to the first conductive pattern 714 used as an antenna radiator (or antenna radiating part). The communication circuit may provide a radiation current (or electromagnetic signal) to the first conductive pattern 714 through the second region 712, and the first conductive pattern 714 may radiate the supplied electromagnetic signal to the outside or to the outside. Electromagnetic signals can be received from In one embodiment, the first conductive pattern 714 used as the antenna radiation portion covers the side surface 210C (see FIG. 2 ), the second side area S2 , or the second side portion 61 of the electronic device 200. A frequency signal (or radio frequency (RF) signal) passing through may be transmitted and/or received. In some embodiments, the coverage (eg, communication range) of the first antenna structure 71 is not limited thereto and may vary.

According to one embodiment, the structure in which the third region 713 of the first antenna structure 71 is disposed in the second part ② of the first side part 51 is such that the first antenna structure 71 stably 1 can contribute to being located on the side portion 51. In some embodiments, the first conductive pattern 714 may extend into the third region 713 . In some embodiments, the third region 713 may be omitted.

According to some embodiments, the first conductive pattern 714 used as the antenna radiation portion may extend into the second region 712 of the first antenna structure 71 .

According to an embodiment, a structure in which at least a portion of the first conductive pattern 714 is positioned between the first side portion 51 and the second side portion 62 is the outer edge of the electronic device 200 (see FIG. 2 ). may contribute to electromagnetic isolation from other conductive parts (or metal parts) of the electronic device 200, which may affect antenna radiation performance. In one embodiment, at least a portion of the case 203 may include a non-metallic material to reduce electromagnetic effects on the first antenna structure 71 . For example, at least a part of the first antenna structure 71 of the case 203 corresponding to or facing the antenna radiating portion (eg, the first conductive pattern 714) includes a non-metallic material, so that the first antenna structure 71 ) can reduce the degradation of antenna radiation performance.

According to some embodiments, the first conductive pattern 714 may be electrically connected to a ground (eg, a ground plane or a ground layer) included in the first printed circuit board 411 . For example, the third region 713 of the first antenna structure 71 may be electrically connected to the ground of the first printed circuit board 411 using another flexible conductive member (not shown). When the communication circuit (eg, the wireless communication module 192 of FIG. 1) supplies radiation current to the first conductive pattern 714, the first conductive pattern 714 forms a signal path between the first power supply and the ground. path) can be formed.

According to some embodiments, at least a portion of the first antenna structure 71 may be implemented in various other ways, such as a laser direct structuring (LDS) type, or a plating or printing type, without being limited to the FPCB type. there is. For example, the antenna radiation unit (eg, the first conductive pattern 714) may be disposed on the second part (②) of the first side part 51 using LDS, and the antenna radiation unit and the first printed circuit There may be a separate electrical path (eg, FPCB or cable) electrically connecting the board 411 . For another example, the first conductive part used as the antenna radiation part (eg, the first conductive pattern 714) may be disposed on the second part (②) of the first side part 51 by using LDS. The second conductive part for electrical connection with the first flexible conductive member 81 may be disposed on the second surface 52B of the first support part 52 by using LDS. The first conductive part and the second conductive part may be electrically connected using an electrical path such as an FPCB or a cable.

According to one embodiment, the second antenna structure 72 may be disposed on the second support 62 of the second structure 6 . The second antenna structure 72 may include, for example, a fourth region 721 and a fifth region 722 . The fourth area 721 may be located between the second support part 62 and the back plate 202 . The fourth area 721 may be disposed on the fourth surface 62B of the second support part 62 . The fifth region 722 may extend between the first printed circuit board 411 and the second support part 62 from the fourth region 721 . The fifth area 722 may be disposed on the third surface 62A of the second support part 62 . The second structure 6 may include a second opening 611 , and the fifth region 722 may be positioned through the second opening 611 . In one embodiment, the second opening 611 may be positioned adjacent to the fourth portion ④ of the second side portion 61 included in the second structure 6 . For example, the fourth part ④ may form a part of the surface of the second opening 611 . The second antenna structure 72 may be coupled to the second structure 6 using an adhesive material. The second antenna structure 72 may be implemented in the form of a film such as a flexible printed circuit board. The second antenna structure 72 may include a second conductive pattern (not shown). The second conductive pattern is electrically connected to a communication circuit (or wireless communication circuit) (eg, the wireless communication module 192 of FIG. 1) disposed on the first printed circuit board 411 to form an antenna radiator (or antenna radiator). can work as In one embodiment, the second flexible conductive member 82 may be disposed on one surface of the first printed circuit board 411 facing the third surface 62A of the second support part 62 . The second flexible conductive member 82 may elastically contact the fifth region 722 of the second antenna structure 72 and be electrically connected to the fifth region 722 . The second conductive pattern may be electrically connected to the communication circuit through the second flexible conductive member 82 . The second flexible conductive member 82 may include, for example, a conductive clip (eg, a conductive member including an elastic structure). The second flexible conductive member 82 may be implemented in various other forms, such as a pogo pin, spring, conductive foam, conductive rubber, conductive tape, conductive connector, or conductive adhesive member, in some embodiments. The second conductive pattern may be electrically connected to the communication circuit to form an electromagnetic field capable of transmitting and/or receiving signals of at least one frequency in a selected or designated frequency band. The communication circuit may process a transmission signal or a reception signal in at least one designated frequency band (eg, LB, MB, HB, UHB, or other various frequency bands) through the second antenna structure 72 .

According to one embodiment, the second conductive pattern (not shown) included in the second antenna structure 72 may be positioned at least partially between the second support part 62 and the back plate 202 . For example, the second conductive pattern may be included in the fourth region 721 of the second antenna structure 72 . The fifth region 722 of the second antenna structure 72 may include an electrical path (eg, wiring) extending from the second conductive pattern and a conductive terminal for electrical connection with the second flexible conductive member 82. can The fifth region 722 may operate as a second power supply unit (or second power supply structure) for supplying radiation current to the second conductive pattern 721 used as an antenna radiator (or antenna radiation unit). The communication circuit may provide radiation current (or an electromagnetic signal) to the second conductive pattern through the fifth region 722, and the second conductive pattern may radiate a powered electromagnetic signal to the outside or receive an electromagnetic signal from the outside. can In one embodiment, the second conductive pattern used as the antenna radiating portion transmits and/or transmits a frequency signal (or radio frequency (RF) signal) passing through the rear surface 210B or the rear plate 202 of the electronic device 200. can receive In some embodiments, the second antenna structure 72 may be implemented and disposed on the second structure 6 using methods such as LDS, plating, or printing, without being limited to a FPCB type.

According to one embodiment, communication circuitry (e.g., wireless communication module 192 of FIG. 1) transmits and/or receives signals in a first frequency band using a first antenna structure 71 and a second antenna. Structure 72 may be configured to transmit and/or receive signals in a second frequency band different from the first frequency band. In some embodiments, the communication circuitry may be configured to transmit and/or receive signals in at least some of the same frequency bands using the first antenna structure 71 and the second antenna structure 72 .

According to one embodiment, the first antenna structure 71 (or the first radiation part included in the first antenna structure 71) and the second antenna structure 72 (or the second antenna structure 72) The second radiating unit) may be spaced apart from each other to have an isolation of a value equal to or greater than a specified value capable of securing antenna radiation performance. If the degree of isolation between the first antenna structure 71 and the second antenna structure 72 is secured, for example, when radiation current is provided to the second antenna structure 72, the second antenna structure 72 The electromagnetic influence on the one-antenna structure 71 may be weak enough to ensure antenna radiation performance. If the degree of isolation between the first antenna structure 71 and the second antenna structure 72 is ensured, for example, when radiation current is provided to the first antenna structure 71, the first antenna structure 71 The electromagnetic influence on the two-antenna structure 72 may be weak enough to ensure antenna radiation performance. In some embodiments, a ground structure or shielding structure may be added to reduce electromagnetic influence between the first antenna structure 71 and the second antenna structure 72 . The ground structure or shield structure is transmitted between the first antenna structure 71 and the second antenna structure 72 due to the electromagnetic coupling between the first antenna structure 71 and the second antenna structure 72 (or here Isolation between the first antenna structure 71 and the second antenna structure 72 may be improved by reducing energy (or electromagnetic wave energy).

According to some embodiments, the first antenna structure 71 or the second antenna structure 72 is implemented at various other positions of the case 203, not limited to the position corresponding to the line B-B' shown in FIG. It can be. Although an example in which the first antenna structure 71 and the second antenna structure 72 are positioned next to each other is shown, but is not limited thereto, the mutual positional relationship between the first antenna structure 71 and the second antenna structure 72 ( or relative position) may be formed in various ways. In some embodiments, the number of conductive patterns included in the first antenna structure 71 or the second antenna structure 72 and utilized as an antenna radiation unit may vary. In various embodiments, the number of antenna structures implemented in substantially the same manner as the first antenna structure 71 or the second antenna structure 72 may vary.

According to some embodiments, replacing the second antenna structure 72, the first antenna structure 71 extends through the second opening 611 of the second structure 6 to form a back plate 202 and a second antenna structure 71. It may be implemented by further including a fourth region located between the support parts 62 . The antenna radiation unit included in the first antenna structure 71 may be positioned to extend into the fourth region.

FIG. 10 shows a cross-sectional structure 1000 in the y-z plane of a portion of the electronic device 200 for line B-B' in FIG. 3, in another embodiment. FIG. 11 shows a state in which the first structure 5 , the first printed circuit board 411 , and the first antenna structure 1010 are combined in relation to the embodiment of FIG. 10 .

10 and 11, the electronic device 200 includes a front plate 201, a rear plate 202, a case 203, a display 301, a first printed circuit board 411, a first antenna structure ( 1010), the second antenna structure 72, the first flexible conductive member 1030, and/or the second flexible conductive member 82. FIG. 10 may be an example in which parts of the embodiment shown in FIG. 8 (eg, the first structure 5 and the first antenna structure 1010) are modified.

According to one embodiment, the second portion ② of the first side portion 51 of the first structure 5 may be formed without the first opening 513 compared to the second portion ② of FIG. 8 . . The first antenna structure 1010 may include a first region 1011 , a second region 1012 , and a third region 1013 . The first region 1011 may be located between the second part (②) of the first side part 51 and the third part (③) of the second side part 61. The first area 1011 may be disposed on the second portion ② of the first side portion 51 . In one embodiment, the second portion ② of the first side portion 51 may include a recess 514 (see FIG. 11 ), and the first region 1010 may be located in the recess 514. can The second part (②) of the first side portion 51 includes a fifth face 1001 including a recess 514 and a sixth face 1002 located opposite to the fifth face 1001. can do. The sixth surface 1002 may be connected to, for example, the second surface 52B of the first support part 52 on which the first printed circuit board 411 is disposed, and side 4111 may be encountered. The second region 1012 of the first antenna structure 1010 may be disposed on the sixth surface 1002 . The third region 1013 of the first antenna structure 1010 may connect the first region 1011 and the second region 1012 . The third region 1013 may extend between the second part ② of the first side part 51 and the fourth part ④ of the second side part 61 . The third region 1013 may be disposed on the second part ② of the first side part 51 . The first antenna structure 1010 may be coupled to the first structure 5 using an adhesive material. The first flexible conductive member 1030 disposed on the first printed circuit board 411 may elastically contact the second region 1012 and be electrically connected to the second region 1012 . As shown, the first flexible conductive member 1030 may include a conductive clip, but is not limited thereto and may be implemented as a pogo pin, a spring, a conductive foam, a conductive rubber, a conductive tape, or a conductive connector. The first antenna structure 1010 may be electrically connected to a communication circuit (eg, the wireless communication module 192 of FIG. 1 ) disposed on the first printed circuit board 411 through the first flexible conductive member 1030. there is. The first antenna structure 1010 may include a first conductive pattern 1014 (see FIG. 11 ). The first conductive pattern 1014 may be electrically connected to a communication circuit disposed on the first printed circuit board 411 to operate as an antenna radiator (or antenna radiator).

According to one embodiment, the first antenna structure 1010 may be implemented in the form of a film such as a flexible printed circuit board. The first conductive pattern 1014 may be included in the first region 1011 of the first antenna structure 1010 . The second region 1012 and the third region 1013 of the first antenna structure 1010 operate as a first power supply unit (or first power supply structure) for supplying radiation current to the first conductive pattern 1014. can The first feeding part including the second region 1012 and the third region 1013 is electrically connected to an electrical path (eg, wiring) extending from the first conductive pattern 1014 and the first flexible conductive member 1030. A conductive terminal for connection may be included. The communication circuit may provide radiation current (or an electromagnetic signal) to the first conductive pattern 1014 through the first power supply unit, and the first conductive pattern 1014 may radiate the supplied electromagnetic signal to the outside or generate electromagnetic signals from the outside. signal can be received. In one embodiment, the first conductive pattern 1014 used as an antenna radiation unit transmits and/or transmits a frequency signal (or radio frequency (RF) signal) passing through the second side area S2 or the second side portion 61. or receive.

According to some embodiments, the first conductive pattern 1014 used as the antenna radiation portion may extend to the third region 1013 of the first antenna structure 71 . In some embodiments, the first conductive pattern 1014 used as the antenna radiation portion may further extend to the second region 1012 of the first antenna structure 71 .

According to an embodiment of the present document, an electronic device (eg, the electronic device 200 of FIG. 2 ) and a front plate (eg, the electronic device 200 of FIG. 2 ) forming a front surface (eg, the front surface 210A of FIG. 2 ) of the electronic device. The front plate 201) may be included. The electronic device may include a rear plate (eg, rear plate 202 of FIG. 3 ) forming a rear surface (eg, rear surface 210B of FIG. 3 ) of the electronic device. The electronic device may include a first structure (eg, first structure 5 of FIG. 4 ) and a second structure (eg, second structure 6 of FIG. 4 ). The first structure may include a first side portion (eg, the first side portion 51 of FIG. 4 ) and a first support portion (eg, the first support portion 52 of FIG. 4 ). The first side part forms a first side area (eg, first side area S1 in FIG. 4 ) closer to the front surface than the rear surface among the side surfaces (eg, side surface 210C of FIG. 2 ) of the electronic device. can The first support part may extend between the front plate and the rear plate from the first side part. The second structure may include a second side portion (eg, the second side portion 61 of FIG. 4 ) and a second support portion (eg, the second support portion 62 of FIG. 4 ). The second side part may form a second side area (eg, the second side area S2 of FIG. 4 ) that is closer to the rear surface than the front surface among the side surfaces. The second support part may extend between the first support part and the rear plate from the second side part. The electronic device may include a display (eg, the display 301 of FIG. 4 ). The display may be positioned between the first support part and the front plate, and at least partially visible through the front surface. The electronic device includes a first conductive pattern (eg, the first conductive pattern 714 of FIG. 9 or the first conductive pattern 1014 of FIG. 11) positioned at least partially between the first side surface and the second side surface. can do. The electronic device may include a communication circuit (eg, the wireless communication module 192 of FIG. 1 ). The communication circuit may be configured to transmit and/or receive signals of a selected or specified frequency band through the first conductive pattern.

According to an embodiment of the present document, the first side part (eg, the first side part 51 in FIG. 7) may include a first part (eg, the first part (①) in FIG. 7) and a second part (eg, the first part (①) in FIG. 7). The second part (②) of FIG. 7 may be included. The first portion may form the first side area. The second part may connect the first part and the first support part, and may be coupled to the front plate using a first adhesive member. The second side part (eg, the second side part 61 of FIG. 7) is a third part (eg, the third part (③) of FIG. 7) and a fourth part (eg, the fourth part (④) of FIG. 7) ) may be included. The third portion may form the second side area. The fourth portion may connect the third portion and the second support portion, and may be coupled to the back plate using a second adhesive member. The fourth part may face the second part.

According to an embodiment of the present document, the first conductive pattern (eg, the first conductive pattern 714 of FIG. 9) is the second part (eg, the second part (②) of FIG. 7) and the third It may be located at least partially between parts (eg, the third part (③) of FIG. 7 ).

According to an embodiment of the present document, the electronic device includes the first conductive pattern (eg, the first conductive pattern 714 of FIG. 9 ) and the communication circuit (eg, the wireless communication module 192 of FIG. 1 ). A power supply unit (eg, the second region 712 of FIG. 7 ) electrically connected may be further included. The power supply unit may be positioned through an opening (eg, the first opening 513 of FIG. 7 ) formed in the second part (eg, the second part (②) of FIG. 7 ).

According to one embodiment of the present document, the electronic device may further include a printed circuit board (eg, the first printed circuit board 411 of FIG. 7 ). The printed circuit board may be positioned between the first support portion (eg, first support portion 52 of FIG. 7 ) and the second support portion (eg, second support portion 62 of FIG. 7 ). The communication circuit (eg, the wireless communication module 192 of FIG. 1 ) may be disposed on the printed circuit board. The power supply unit (eg, the second region 712 of FIG. 7 ) may be electrically connected to the printed circuit board through a flexible conductive member (eg, the first flexible conductive member 81 of FIG. 7 ).

According to an embodiment of the present document, the electronic device includes the first conductive pattern (eg, the first conductive pattern 1014 of FIG. 10 ) and the communication circuit (eg, the wireless communication module 192 of FIG. 1 ). Electrically connected power supply units (eg, the second region 1012 and the third region 1013 of FIG. 10 ) may be further included. The power feeding unit may extend between the second part (eg, the second part (②) of FIG. 10) and the fourth part (eg, the fourth part (④) of FIG. 10).

According to one embodiment of the present document, the electronic device may further include a printed circuit board (eg, the first printed circuit board 411 of FIG. 10 ). The printed circuit board may be positioned between the first support part (eg, first support part 52 of FIG. 10 ) and the second support part (eg, second support part 62 of FIG. 10 ). The communication circuit (eg, the wireless communication module 192 of FIG. 1 ) may be disposed on the printed circuit board. The power supply unit (eg, the second region 1012 and the third region 1013 of FIG. 10 ) is connected to the printed circuit board through a flexible conductive member (eg, the first flexible conductive member 1030 of FIG. 10 ). can be electrically connected to

According to an embodiment of the present document, the first conductive pattern (eg, the first conductive pattern 714 of FIG. 9 or the first conductive pattern 1014 of FIG. 11 ) is the first side portion (eg, the first conductive pattern 714 of FIG. 7 or 11). The flexible printed circuit board (eg, the first antenna structure 71 of FIG. 7 or It may be included in the first antenna structure 1010 of FIG. 10 .

According to an embodiment of the present document, the first conductive pattern (eg, the first conductive pattern 714 of FIG. 9 or the first conductive pattern 1014 of FIG. 11 ) is the first side portion (eg, the first conductive pattern 714 of FIG. 7 or 11). It can be arranged using LDS on the first side part 51 of 10.

According to an embodiment of the present document, the first side portion (eg, the first side portion 51 of FIG. 7 or 10) and the second side portion (eg, the second side portion 61 of FIG. 7 or 10) are non-metallic material can be formed.

According to one embodiment of the present document, the first side portion (eg, the first side portion 51 of FIG. 7 or 10) and the second side portion (eg, the second side portion 61 of FIG. 7 or 10) are hooks. It can be coupled using a fastening structure.

According to an embodiment of the present document, the communication circuit (eg, the wireless communication module 192 of FIG. 1 ) may include the first conductive pattern (eg, the first conductive pattern 714 of FIG. 9 or the first conductive pattern 714 of FIG. 11 ). The signal passing through the side surface (eg, the side surface 210C of FIG. 2 ) may be transmitted and/or received through the conductive pattern 1014 .

According to an embodiment of the present document, the electronic device may include at least a portion between the second support part (eg, the second support part 62 of FIG. 7 ) and the rear plate (eg, the rear plate 202 of FIG. 7 ). A positioned second conductive pattern (eg, the second conductive pattern included in the second antenna structure 72 of FIG. 7) may be further included. The communication circuit (eg, the wireless communication module 192 of FIG. 1 ) is configured through the first conductive pattern (eg, the first conductive pattern 714 of FIG. 9 or the first conductive pattern 1014 of FIG. 11 ). It may be configured to transmit and/or receive a first signal of one frequency band. The communication circuit may be configured to transmit and/or receive a second signal in a second frequency band different from the first frequency band through the second conductive pattern.

According to an embodiment of the present document, the communication circuit (eg, the wireless communication module 192 of FIG. 1 ) may include the second conductive pattern (eg, the second conductive pattern included in the second antenna structure 72 of FIG. 7 ). pattern), the second signal passing through the rear surface (eg, the rear surface 210B of FIG. 3) may be transmitted and/or received.

According to an embodiment of the present document, the electronic device includes a printed circuit board (eg, the first printed circuit board 411 of FIGS. 7 or 10) on which the communication circuit (eg, the wireless communication module 192 of FIG. 1) is disposed. )) may be further included. The printed circuit board may be positioned between the first support (eg, first support 52 of FIGS. 7 or 10 ) and the second support (eg, second support 62 of FIG. 7 or 10 ). . The electronic device may include a first power supply (eg, the first conductive pattern 714 of FIG. 9 or the first conductive pattern 1014 of FIG. 11 ) and the printed circuit board electrically connected to each other. : The second area 712 of FIG. 7) or the second area 1012 and the third area 1013 of FIG. 10 may be further included. The electronic device may include a second power supply part electrically connecting the second conductive pattern (eg, the second conductive pattern included in the second antenna structure 72 of FIG. 7 or 10) and the printed circuit board (eg, FIG. 7 or 10 fifth regions 722) may be further included. The first side part (eg, the first side part 51 in FIG. 7 ) includes a first part (eg, the first part (①) in FIG. 7 ) and a second part (eg, the second part (②) in FIG. 7 ). ) may be included. The first portion may form the first side area. The second part may connect the first part and the first support part, and may be coupled to the front plate using a first adhesive member. The second side part (eg, the second side part 61 of FIG. 7) is a third part (eg, the third part (③) of FIG. 7) and a fourth part (eg, the fourth part (④) of FIG. 7). ) may be included. The third portion may form the second side area. The fourth part may connect the third part and the second support part, and may be coupled to the back plate using a second adhesive member. The fourth part may face the second part. The first power feeding part (eg, the second region 712 of FIG. 7 or the second region 1012 and the third region 1013 of FIG. 10 ) may include a first opening (eg, FIG. It may be located through the first opening 513 of 7) or may extend between the second part and the fourth part. The second power feeding part (eg, the fifth region 722 of FIG. 7 ) may be positioned through a second opening (eg, the second opening 611 of FIG. 7 or 10 ) formed in the second support part. .

According to an embodiment of the present document, an electronic device (eg, the electronic device 200 of FIG. 2 ) and a front plate (eg, the electronic device 200 of FIG. 2 ) forming a front surface (eg, the front surface 210A of FIG. 2 ) of the electronic device. The front plate 201) may be included. The electronic device may include a rear plate (eg, rear plate 202 of FIG. 3 ) forming a rear surface (eg, rear surface 210B of FIG. 3 ) of the electronic device. The electronic device may include a first structure (eg, first structure 5 of FIG. 4 ) and a second structure (eg, second structure 6 of FIG. 4 ). The first structure may include a first side portion (eg, the first side portion 51 of FIG. 4 ) and a first support portion (eg, the first support portion 52 of FIG. 4 ). The first side part forms a first side area (eg, first side area S1 in FIG. 4 ) closer to the front surface than the rear surface among the side surfaces (eg, side surface 210C of FIG. 2 ) of the electronic device. can The first support part may extend between the front plate and the rear plate from the first side part. The second structure may include a second side portion (eg, the second side portion 61 of FIG. 4 ) and a second support portion (eg, the second support portion 62 of FIG. 4 ). The second side part may form a second side area (eg, the second side area S2 of FIG. 4 ) that is closer to the rear surface than the front surface among the side surfaces. The second support part may extend between the first support part and the back plate from the second side part. The electronic device may include a display (eg, the display 301 of FIG. 4 ). The display may be positioned between the first support part and the front plate, and at least partially visible through the front surface. The electronic device may include a conductive pattern (eg, the first conductive pattern 714 of FIG. 9 or the first conductive pattern 1014 of FIG. 11 ) positioned at least partially between the first side surface and the second side surface. there is. The electronic device may include a communication circuit (eg, the wireless communication module 192 of FIG. 1 ). The communication circuit may be configured to transmit and/or receive signals of a selected or specified frequency band through the conductive pattern. The first side part may include a first part (eg, the first part ① in FIG. 7 ) and a second part (eg, the second part ② in FIG. 7 ). The first portion may form the first side area. The second part may connect the first part and the first support part, and may be coupled to the front plate using a first adhesive member. The second side part may include a third part (eg, the third part (③) in FIG. 7) and a fourth part (eg, the fourth part (④) in FIG. 7). The third portion may form the second side area. The fourth part may connect the third part and the second support part, and may be coupled to the back plate using a second adhesive member. The fourth part may face the second part. At least a portion of the conductive pattern may be positioned between the second portion and the third portion.

According to an embodiment of the present document, the electronic device electrically connects the conductive pattern (eg, the first conductive pattern 714 of FIG. 9 ) and the communication circuit (eg, the wireless communication module 192 of FIG. 1 ). A power supply unit (eg, the second region 712 of FIG. 7 ) to be connected may be further included. The power feeding unit may be positioned through an opening (eg, the first opening 513 of FIG. 7 ) formed in the second part (eg, the second part (②) of FIG. 7 ).

According to one embodiment of the present document, the electronic device may further include a printed circuit board (eg, the first printed circuit board 411 of FIG. 7 ). The printed circuit board may be positioned between the first support portion (eg, first support portion 52 of FIG. 7 ) and the second support portion (eg, second support portion 62 of FIG. 7 ). The communication circuit (eg, the wireless communication module 192 of FIG. 1 ) may be disposed on the printed circuit board. The power supply unit (eg, the second region 712 of FIG. 7 ) may be electrically connected to the printed circuit board through a flexible conductive member (eg, the first flexible conductive member 81 of FIG. 7 ).

According to an embodiment of the present document, the electronic device electrically connects the conductive pattern (eg, the first conductive pattern 1014 of FIG. 10 ) and the communication circuit (eg, the wireless communication module 192 of FIG. 1 ). A power supply unit (eg, the second region 1012 and the third region 1013 of FIG. 10 ) may be further included. The power supply unit may extend between the second part (eg, the second part (②) in FIG. 10) and the fourth part (eg, the fourth part (④) in FIG. 10).

According to one embodiment of the present document, the electronic device may further include a printed circuit board (eg, the first printed circuit board 411 of FIG. 10 ). The printed circuit board may be positioned between the first support part (eg, first support part 52 of FIG. 10 ) and the second support part (eg, second support part 62 of FIG. 10 ). The communication circuit (eg, the wireless communication module 192 of FIG. 1 ) may be disposed on the printed circuit board. The power supply unit (eg, the second region 1012 and the third region 1013 of FIG. 10 ) is connected to the printed circuit board through a flexible conductive member (eg, the first flexible conductive member 1030 of FIG. 10 ). can be electrically connected to

Embodiments disclosed in this document and drawings are only presented as specific examples to easily explain technical content and help understanding of the embodiments, and are not intended to limit the scope of the embodiments. Therefore, the scope of various embodiments of this document should be construed as including changes or modifications other than the embodiments disclosed herein within the scope of various embodiments of this document.

700: cross-sectional structure
201: front plate
202: rear plate
203: case
450: first adhesive member
460: second adhesive member
5: first structure
6: Second structure
51: first side part
52: first support
61: second side part
62: second support
71: first antenna structure
72: second antenna structure
81: first flexible conducting member
82: second flexible conducting member

Claims (20)

In electronic devices,
a front plate forming a front surface of the electronic device;
a rear plate forming a rear surface of the electronic device;
a first structure including a first side part forming a first side area closer to the front surface than the rear surface of the side surface of the electronic device, and a first support part extending from the first side part between the front plate and the rear plate;
a second structure including a second side part forming a second side area of the side surface closer to the rear surface than the front surface, and a second support part extending between the first support part and the back plate from the second side part;
a display positioned between the first support and the front plate and at least partially visible through the front surface;
a first conductive pattern positioned at least partially between the first side surface and the second side surface; and
and a communication circuit configured to transmit and/or receive a signal of a selected or specified frequency band through the first conductive pattern.
According to claim 1,
The first side part,
a first portion forming the first side area; and
A second part connecting the first part and the first support part and coupled to the front plate using a first adhesive member;
The second side part,
a third portion forming the second side area; and
and a fourth portion connecting the third portion and the second support portion, coupled to the back plate using a second adhesive member, and facing the second portion.
According to claim 2,
The electronic device of claim 1 , wherein at least a portion of the first conductive pattern is positioned between the second portion and the third portion.
According to claim 3,
Further comprising a power supply unit electrically connecting the first conductive pattern and the communication circuit,
The electronic device of claim 1 , wherein the power supply unit is positioned through an opening formed in the second portion.
According to claim 4,
a printed circuit board positioned between the first support and the second support and having the communication circuit disposed thereon;
The power supply unit is electrically connected to the printed circuit board through a flexible conductive member.
According to claim 3,
Further comprising a power supply unit electrically connecting the first conductive pattern and the communication circuit,
The power supply part extends between the second part and the fourth part.
According to claim 6,
a printed circuit board positioned between the first support and the second support and having the communication circuit disposed thereon;
The power supply unit is electrically connected to the printed circuit board through a flexible conductive member.
According to claim 1,
The electronic device of claim 1 , wherein the first conductive pattern is included in a flexible printed circuit board extending between the first side portion and the second side portion.
According to claim 1,
The first conductive pattern is disposed on the first side surface using laser direct structuring (LDS).
According to claim 1,
The first side part and the second side part are formed of a non-metallic material.
According to claim 1,
The electronic device wherein the first side part and the second side part are coupled using a hook fastening structure.
According to claim 1,
The communication circuit transmits and/or receives the signal passing through the side surface through the first conductive pattern.
According to claim 1,
Further comprising a second conductive pattern positioned at least partially between the second support and the rear plate,
The communication circuit,
configured to transmit and/or receive a first signal in a first frequency band through the first conductive pattern;
An electronic device configured to transmit and/or receive a second signal in a second frequency band different from the first frequency band through the second conductive pattern.
According to claim 13,
The communication circuit transmits and/or receives the second signal passing through the rear surface through the second conductive pattern.
According to claim 13,
a printed circuit board positioned between the first support part and the second support part and having the communication circuit disposed thereon;
a first feeding part electrically connecting the first conductive pattern and the printed circuit board; and
A second power supply unit electrically connecting the second conductive pattern and the printed circuit board;
The first side part,
a first portion forming the first side area; and
A second part connecting the first part and the first support part and coupled to the front plate using a first adhesive member;
The second side part,
a third portion forming the second side area; and
A fourth part connecting the third part and the second support part, coupled to the back plate using a second adhesive member, and facing the second part;
The first feeding part is positioned through a first opening formed in the second part or extends between the second part and the fourth part,
The electronic device of claim 1 , wherein the second power supply unit is positioned through a second opening formed in the second support unit.
In electronic devices,
a front plate forming a front surface of the electronic device;
a rear plate forming a rear surface of the electronic device;
a first structure including a first side part forming a first side area closer to the front surface than the rear surface of the side surface of the electronic device, and a first support part extending from the first side part between the front plate and the rear plate;
a second structure including a second side part forming a second side area of the side surface closer to the rear surface than the front surface, and a second support part extending between the first support part and the back plate from the second side part;
a display positioned between the first support and the front plate and at least partially visible through the front surface;
a conductive pattern positioned at least partially between the first side portion and the second side portion; and
And a communication circuit configured to transmit and / or receive a signal of a selected or designated frequency band through the conductive pattern,
The first side part,
a first portion forming the first side area; and
A second part connecting the first part and the first support part and coupled to the front plate using a first adhesive member;
The second side part,
a third portion forming the second side area; and
A fourth part connecting the third part and the second support part, coupled to the back plate using a second adhesive member, and facing the second part;
The conductive pattern is at least partially positioned between the second portion and the third portion.
17. The method of claim 16,
Further comprising a power supply unit electrically connecting the conductive pattern and the communication circuit,
The electronic device of claim 1 , wherein the power supply unit is positioned through an opening formed in the second portion.
18. The method of claim 17,
a printed circuit board positioned between the first support and the second support and having the communication circuit disposed thereon;
The power supply unit is electrically connected to the printed circuit board through a flexible conductive member.
17. The method of claim 16,
Further comprising a power supply unit electrically connecting the conductive pattern and the communication circuit,
The power supply part extends between the second part and the fourth part.
According to claim 19,
a printed circuit board positioned between the first support and the second support and having the communication circuit disposed thereon;
The power supply unit is electrically connected to the printed circuit board through a flexible conductive member.

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