KR20220102536A - Electronic device including antenna - Google Patents

Abstract

An electronic device according to an embodiment of the present document comprises: a housing including a front plate, a rear plate positioned on the opposite side of the front plate, and a side member at least partially surrounding a space between the front plate and the rear plate; a first support member disposed in the space, connected to the side member, and including a conductive region electrically connected to a ground included in the electronic device; a display positioned between the first support member and the front plate and at least partially visually exposed through the front plate; and a conductive pattern positioned between the first support member and the rear plate and electrically connected to a wireless communication circuit configured to transmit and/or receive signals of a selected or designated frequency band, wherein the conductive pattern may face the conductive region at a distance from each other and may be electromagnetically coupled to the conductive region. Various other embodiments are possible. Accordingly, antenna radiation performance can be improved or secured, or coverage can be secured.

Description

ELECTRONIC DEVICE INCLUDING ANTENNA

Various embodiments of the present document relate to an electronic device including an antenna.

BACKGROUND With the development of wireless communication technology, electronic devices such as smart phones are commonly used in daily life, and the use of content is increasing accordingly. The electronic device may include a plurality of antennas for supporting various communication technologies.

As the range of usable applications expands, the number of antennas included in electronic devices is continuously increasing. While electronic devices are becoming slimmer, parts for various functions are being added, thereby reducing the electrical influence with various elements in the electronic device while securing radiation performance for a desired frequency band or increasing coverage (communication range). It is becoming more difficult to design an antenna for securing in a limited space.

Various embodiments of the present document may provide an electronic device including an antenna for improving or securing antenna radiation performance or securing coverage.

The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned will be understood by those of ordinary skill in the art to which the present invention belongs from the description below. .

According to an embodiment of the present document, an electronic device includes a housing including a front plate, a rear plate positioned opposite to the front plate, and a side member that at least partially surrounds a space between the front plate and the rear plate. , a first support member positioned in the space, connected to the side member, and including a conductive region electrically connected to a ground included in the electronic device, and positioned between the first support member and the front plate; a display at least partially exposed through the front plate, and conductively electrically coupled to wireless communication circuitry positioned between the first support member and the back plate and configured to transmit and/or receive signals in a selected or specified frequency band. a pattern, wherein the conductive pattern faces the conductive region spaced apart and may be electromagnetically coupled to the conductive region.

An electronic device including an antenna according to various embodiments of the present document may improve or secure antenna radiation performance or secure coverage by reducing electromagnetic effects on the antenna.

In addition, effects obtainable or predicted by various embodiments of the present document may be directly or implicitly disclosed in the detailed description of the embodiments of this document.

1 is a block diagram of an electronic device in a network environment, in one embodiment.
2 is a perspective view of a front surface of an electronic device according to an exemplary embodiment;
3 is a perspective view of a rear surface of the electronic device of FIG. 2 according to an exemplary embodiment;
4 is an exploded view of the electronic device of FIG. 2 according to an exemplary embodiment.
5 is an exploded view of an electronic device according to an exemplary embodiment.
6 is an xy plan view of the front case, in one embodiment.
7 is an xy plan view of a second support member, in one embodiment.
8 shows an xy plan view of a portion of a second support member, and an antenna, in one embodiment.
9 is an xy plan view of an outer conductive structure, an inner conductive structure, and a second support member, in one embodiment.
10 is a yz plan view of a portion of a second support member, in one embodiment.
11 is, for example, a graph showing antenna radiation performance of an antenna according to an embodiment and antenna radiation performance of an antenna according to a comparative example.
12 is, for example, a graph showing antenna radiation performance of an antenna according to an embodiment and antenna radiation performance of antennas according to a comparative example.

Hereinafter, various embodiments of the present document will be described with reference to the accompanying drawings.

1 is a block diagram of an electronic device 101 in a network environment 100, in one embodiment.

Referring to FIG. 1 , in a network environment 100 , the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphics processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, image signal processor or communication processor) may be implemented as part of another functionally related component (eg, camera module 180 or communication module 190). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but the above-described example is not limited to The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks, or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used for the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : LAN (local area network) communication module, or a power line communication module) may be included. A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology is a high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) in order to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as input/output (full dimensional MIMO (FD-MIMO)), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) may support 0.5 ms or less, or 1 ms or less round trip respectively).

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving a signal of the designated high frequency band. can

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( eg commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to the component in another aspect (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, the internal memory 136 or the external memory 138) readable by a machine (eg, the electronic device 101). may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of one or more instructions stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term refers to the case where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product). Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a memory of a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B," "A, B or C," "at least one of A, B and C," and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to the component in another aspect (e.g., importance or order) is not limited.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

2 is a perspective view of a front surface of an electronic device 200 according to an exemplary embodiment. 3 is a perspective view of a rear surface of the electronic device 200 of FIG. 2 according to an exemplary embodiment.

2 and 3 , in an embodiment, the electronic device 200 (eg, the electronic device 101 of FIG. 1 ) may include a housing 300 that forms an exterior of the electronic device 200 , , the housing 300 is, for example, a front surface 300A of the electronic device 200 , a rear surface 300B of the electronic device 200 , and an electron enclosing space between the front surface 300A and the rear surface 300B. Side 300C of device 200 may be formed. In some embodiments, the housing 300 may refer to a structure forming at least a portion of the front surface 300A, the rear surface 300B, and the side surface 300C0.

According to an embodiment, the housing 300 may include a front plate 310 , a rear plate 320 , and/or a bezel structure 330 . The front surface 300A of the electronic device 200 may be formed at least in part by the front plate 310 . The front plate 310 may be substantially transparent and may include, for example, a glass plate or a polymer plate including various coating layers. The rear surface 300B of the electronic device 200 may be formed at least in part by the rear plate 320 . In one embodiment, the back plate 320 may include a first back plate 321 forming a portion of the back surface 300B, and a second back plate 322 forming another portion of the back surface 300B. have. The first back plate 321 and the second back plate 322 may be substantially unknown. The first back plate 321 and/or the second back plate 322 may be formed by, for example, coated or tinted glass, ceramic, polymer, metal, or a combination of at least two of the foregoing. . As another example, the first back plate 321 and/or the second back plate 322 may include aluminum, an aluminum alloy, magnesium, a magnesium alloy, or an alloy including iron (eg, stainless steel). . The bezel structure 330 may surround at least a portion of the space between the front plate 310 and the rear plate 320 . The side surface 300C of the electronic device 200 may be formed at least in part by the bezel structure 330 . In some embodiments, the bezel structure 330 is an element substantially forming the side surface 300C of the electronic device 200 and may be referred to as a 'side bezel structure' or a 'side member'. The bezel structure 330 may include, for example, a metal and/or a polymer.

According to one embodiment, the front plate 310 may include a first curved portion 3001 and a second curved portion 3002 that are bent from the front surface 300A toward the rear surface 300B and extend seamlessly. . The first curved portion 3001 and the second curved portion 3002 may be formed adjacent to both edges of the front plate 310 positioned opposite to each other. The first curved portion 3001 and the second curved portion 3002 may be disposed symmetrically with a flat portion (not shown) of the front plate 310 interposed therebetween.

According to an embodiment, the first rear plate 321 may include a third curved portion 3003 and a fourth curved portion 3004 that are bent from the rear surface 300B toward the front surface 300A and extend seamlessly. The third curved portion 3003 may be formed adjacent to one edge of the first rear plate 321 to correspond to the first curved portion 3001 of the front plate 310 . The fourth curved portion 3004 may be formed adjacent to the other edge of the first back plate 321 to correspond to the second curved portion 3002 of the front plate 310 . In one embodiment, the portion 331 of the bezel structure 330 is smoothly connected with the fourth curved portion 3004 of the first back plate 321 corresponding to the second curved portion 3002 of the front plate 310 . A fifth curved portion 3005 may be included. For example, one curved portion including the fourth curved portion 3004 and the fifth curved portion 3005 may be disposed to be symmetrical with the third curved portion 3003 on the other side. In one embodiment, the second back plate 322 may be positioned to correspond to the fifth curved portion 3005 . For example, the portion 331 of the bezel structure 330 forming the fifth curved portion 3005 is the second rear plate (or edge or border) of the rear plate 320 ( 322 ) may extend along some edges (edges along the dotted line indicated by reference numeral 'E') and come into contact with the second rear plate 320 . In some embodiments, the fifth curved portion 3005 may be formed by a first back plate 321 or a second back plate 322 . In some embodiments, the first back plate 321 and the second back plate 322 may be integrally formed. In some embodiments, the first back plate 321 and/or the second back plate 322 may be integrally formed with the bezel structure 330 and may be formed of the same material as the bezel structure 330 (eg, such as aluminum). metal material).

According to some embodiments, a first curved portion 3001 , a second curved portion 3002 , a third curved portion 3003 , or a curved portion comprising a fourth region 3004 and a fifth curved portion 3005 , according to some embodiments. The housing 300 may be implemented without at least one of them.

According to an embodiment, the electronic device 200 includes a display 201 , a first audio module 202 , a second audio module 203 , a third audio module 204 , a fourth audio module 205 , A sensor module 206 , a first camera module 207 , a plurality of second camera modules 208 , a light emitting module 209 , an input module 210 , a first connection terminal module 211 , or a second connection At least one of the terminal modules 212 may be included. In some embodiments, the electronic device 200 may omit at least one of the above components or additionally include other components.

A display area (eg, a screen display area or an active area) of the display 201 may be visually exposed through, for example, the front plate 310 . In an embodiment, the electronic device 200 may be implemented to maximize the display area visible through the front plate 310 (eg, a large screen or a full screen). For example, the display 201 may be implemented to have an outer shape substantially the same as the outer shape of the front plate 310 . As another example, the distance between the outer edge of the display 201 and the outer edge of the front plate 310 may be substantially the same. In one embodiment, the display 201 may include touch sensing circuitry. In some embodiments, the display 201 may include a pressure sensor capable of measuring the intensity (pressure) of the touch. In some embodiments, the display 201 may be coupled to or positioned adjacent to a digitizer (eg, an electromagnetic induction panel) that detects a magnetic field type electronic pen (eg, a stylus pen).

The first audio module 202 may include, for example, a first microphone positioned inside the electronic device 200 and a first microphone hole formed in the side surface 200C corresponding to the first microphone. The second audio module 203 may include, for example, a second microphone positioned inside the electronic device 200 and a second microphone hole formed in the rear surface 300B corresponding to the second microphone. The second microphone hole may be formed in, for example, the first rear plate 321 . In some embodiments, the second microphone hole may be formed in the second back plate 322 . The position or number of the audio module with respect to the microphone is not limited to the illustrated example and may vary. In some embodiments, the electronic device 200 may include a plurality of microphones used to detect the direction of sound.

The third audio module 204 may include, for example, a first speaker positioned inside the electronic device 200 , and a first speaker hole formed in a side surface 300C corresponding to the first speaker. The fourth audio module 205 may include, for example, a second speaker positioned inside the electronic device 200 and a second speaker hole formed in the front surface 300A corresponding to the second speaker. In one embodiment, the first speaker may include an external speaker. In one embodiment, the second speaker may include a receiver for a call, and the second speaker hole may be referred to as a receiver hole. The location or number of the third audio module 204 or the fourth audio module 205 is not limited to the illustrated example and may vary. In some embodiments, the microphone hole and the speaker hole may be implemented as one hole. In some embodiments, the third audio module 204 or the fourth audio module 205 may include a piezo speaker in which a speaker hole is omitted.

The sensor module 206 may generate, for example, an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state. In an embodiment, the sensor module 206 may include an optical sensor positioned inside the electronic device 200 corresponding to the front surface 300A. The optical sensor may include, for example, a proximity sensor or an illuminance sensor. The optical sensor may be aligned with an opening formed in the display 201 . External light may be introduced into the optical sensor through the openings of the front plate 310 and the display 201 . In some embodiments, the optical sensor may be disposed at the bottom of the display 201 , and the location of the optical sensor may perform a related function without being visually differentiated (or exposed). For example, the optical sensor may be located on the back of the display 201 , or below or beneath the display 201 . In some embodiments, the optical sensor may be positioned aligned with a recess formed in the back surface of the display 201 . The optical sensor may be disposed to overlap at least a portion of the screen, and may perform a sensing function without being exposed to the outside. In this case, a portion of the display 201 that is at least partially overlapped with the optical sensor may include a pixel structure and/or a wiring structure different from other areas. For example, some regions of the display 201 that are at least partially overlapped with the optical sensor may have different pixel densities compared to other regions. In some embodiments, the plurality of pixels may not be disposed in a portion of the display 201 that at least partially overlaps the optical sensor. In some embodiments, the electronic device 200 may include a biometric sensor (eg, a fingerprint sensor) positioned below the display 201 . The biosensor may be implemented by an optical method, an electrostatic method, or an ultrasonic method, and the position or number thereof may vary. The electronic device 200 includes various other sensor modules, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a temperature sensor, or a humidity sensor. It may further include at least one of.

The first camera module 207 (eg, a front camera module) may be located inside the electronic device 200 corresponding to the front surface 300A, for example. The plurality of second camera modules 208 (eg, rear camera modules) may be located inside the electronic device 200 to correspond to the rear surface 300B, for example. In one embodiment, the plurality of second camera modules 208 may be positioned to correspond to the second back plate 322 . The first camera module 207 and/or the plurality of second camera modules 208 may include one or more lenses, an image sensor, and/or an image signal processor. The position or number of the first camera module or the second camera module is not limited to the illustrated example and may vary.

According to an embodiment, the display 201 may include an opening aligned with the first camera module 207 . External light may reach the first camera module 207 through the opening of the front plate 310 and the display 201 . In some embodiments, the opening of the display 201 may be formed in a notch shape according to the position of the first camera module 207 . In some embodiments, the first camera module 207 may be disposed at the bottom of the display 201 , and the position of the first camera module 207 is not visually differentiated (or exposed) and related functions (eg, images) shooting) can be performed. For example, the first camera module 207 may be located on the rear surface of the display 201 , or beneath or beneath the display 201 , and a hidden display rear camera (eg, under display camera (UDC)). )) may be included. In some embodiments, the first camera module 207 may be positioned aligned with a recess formed in the rear surface of the display 201 . The first camera module 207 may be disposed to overlap at least a portion of the screen, and may acquire an image of an external subject without being visually exposed to the outside. In this case, a portion of the display 201 overlapping at least partially with the first camera module 207 may include a pixel structure and/or a wiring structure different from other areas. For example, a portion of the display 201 that is at least partially overlapped with the first camera module 207 may have a different pixel density than other areas. A pixel structure and/or a wiring structure formed in a partial area of the display 201 that is at least partially overlapped with the first camera module 207 may reduce light loss between the outside and the first camera module 207 . In some embodiments, pixels may not be disposed in a portion of the display 201 that at least partially overlaps the first camera module 207 . In some embodiments, the electronic device 200 may further include a light emitting module (eg, a light source) positioned inside the electronic device 200 to correspond to the front surface 300A. The light emitting module may provide, for example, state information of the electronic device 200 in the form of light. In some embodiments, the light emitting module may provide a light source that is interlocked with the operation of the first camera module 207 . The light emitting module may include, for example, an LED, an IR LED, or a xenon lamp.

According to an embodiment, the plurality of second camera modules 208 may have different properties (eg, angle of view) or functions, and may include, for example, a dual camera or a triple camera. The plurality of second camera modules 208 may include a plurality of camera modules including lenses having different angles of view, and the electronic device 200 may It can be controlled to change the angle of view of the performed camera module. The plurality of second camera modules 208 is at least one of a wide-angle camera, a telephoto camera, a color camera, a monochrome camera, or an IR (infrared) camera (eg, a time of flight (TOF) camera, a structured light camera). may include. In some embodiments, the IR camera may be operated as at least part of a sensor module. The light emitting module 209 (eg, a flash) may include a light source for the plurality of second camera modules 208 . The light emitting module 209 may include, for example, an LED or a xenon lamp.

The input module 210 may include, for example, one or more key input devices. One or more key input devices may be located, for example, in an opening formed in side 300C. In some embodiments, the electronic device 200 may not include some or all of the key input devices, and the not included key input devices may be implemented as soft keys using the display 201 . The location or number of input modules 210 may vary, and in some embodiments, the input module 210 may include at least one sensor module.

The first connection terminal module (eg, a first connector module or a first interface terminal module) 211 is, for example, a first connector located inside the electronic device 200 . (or a first interface terminal), and a first connector hole formed in the side surface 300C corresponding to the first connector. The second connection terminal module (eg, a second connector module or a second interface terminal module) 212 may include, for example, a second connector (or a second interface terminal) located inside the electronic device 200 ; and a second connector hole formed in the side surface 300C corresponding to the second connector. The electronic device 200 may transmit and/or receive power and/or data with an external electronic device electrically connected to the first connector or the second connector. In an embodiment, the first connector may include a universal serial bus (USB) connector or a high definition multimedia interface (HDMI) connector. In one embodiment, the second connector may include a connector for a memory card (eg, a secure digital memory (SD) card or a subscriber identity module (SIM) card). In some embodiments, the second connector may include an audio connector (eg, a headphone connector or an earphone connector). The location or number of connection terminal modules is not limited to the illustrated example and may vary.

4 is an exploded view of the electronic device 200 of FIG. 2 according to an exemplary embodiment.

Referring to FIG. 4 , in an embodiment, the electronic device 200 includes a front plate 310 , a rear plate 320 , a bezel structure 330 , a first support member 410 , and a second support member 420 . , a third support member 430 , a display 201 , a first substrate assembly 440 , a second substrate assembly 450 , a battery 460 , or an antenna structure 470 . In some embodiments, the electronic device 200 may omit at least one of the above components or additionally include other components.

According to an embodiment, the first support member 410 may be located inside the electronic device 200 and connected to the bezel structure 330 , or may be formed integrally with the bezel structure 330 . The first support member 410 may be formed of, for example, a metal material and/or a non-metal material (eg, a polymer). In one embodiment, the conductive portion included in the first support member 410 may serve as electromagnetic shielding for the display 201 , the first substrate assembly 440 , and/or the second substrate assembly 450 . . The first support member 410 and the bezel structure 330 may be referred to as a front case 400 . The first support member 410 is a portion of the front case 400 in which components such as the display 201 , the first substrate assembly 440 , the second substrate assembly 450 , or the battery 460 are disposed. may contribute to the durability or stiffness (eg, torsional stiffness) of the device 200 . In some embodiments, the first support member 410 may be referred to as a 'bracket', a 'mounting plate', or a 'support structure'. In some embodiments, the first support member 410 may be defined as a part of the housing 300 (see FIG. 2 ).

The display 201 may be positioned between, for example, the first support member 410 and the front plate 310 , and may be disposed on one surface of the first support member 410 . The first substrate assembly 440 and the second substrate assembly 450 may be positioned between the first support member 410 and the back plate 320 , for example, the other surface of the first support member 410 . can be placed in The battery 460 may be positioned between, for example, the first support member 410 and the rear plate 320 , and may be disposed on the first support member 410 . In some embodiments, the front plate 310 and the display 201 may be integrally formed.

According to an embodiment, the first substrate assembly 440 may include a first printed circuit board 441 (eg, a printed circuit board (PCB), or a printed circuit board assembly (PBA)). The first substrate assembly 440 may include various electronic components electrically connected to the first printed circuit board 441 . The electronic components may be disposed on the first printed circuit board 441 or may be electrically connected to the first printed circuit board 441 through an electrical path such as a cable or a flexible printed circuit board (FPCB). 2 and 3 , the electronic components include, for example, a second microphone included in the second audio module 203 , a second speaker included in the fourth audio module 205 , a sensor module 206 , It may include a first camera module 207 , a plurality of second camera modules 208 , a light emitting module 209 , or an input module 210 .

According to an embodiment, the second substrate assembly 450 may include the first substrate assembly 440 with the battery 460 interposed therebetween when viewed from above the front plate 310 (eg, viewed in the -z axis direction). ) and may be spaced apart from each other. The second substrate assembly 450 may include a second printed circuit board 451 electrically connected to the first printed circuit board 441 of the first substrate assembly 440 . The second board assembly 450 may include various electronic components electrically connected to the second printed circuit board 451 . The electronic components may be disposed on the second printed circuit board 451 or may be electrically connected to the second printed circuit board 451 through an electrical path such as a cable or FPCB. 2 and 3 , the electronic components include, for example, a first microphone included in the first audio module 202 , a first speaker included in the third audio module 204 , and a first connection terminal module It may include a first connector included in the 211 or a second connector included in the second connection terminal module 212 .

According to some embodiments, the first substrate assembly 440 or the second substrate assembly 450 is a primary PCB (or main PCB or master PCB), a second PCB (or slave PCB) disposed partially overlapping the primary PCB, and/or an interposer substrate between the primary PCB and the secondary PCB.

The battery 460 is a device for supplying power to at least one component of the electronic device 200 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . The battery 460 may be integrally disposed inside the electronic device 200 , or may be disposed detachably from the electronic device 200 .

According to an embodiment, the second support member 420 may be positioned between the first support member 410 and the rear plate 320 , and may be connected to the first support member 410 using a fastening element such as a bolt. can be combined. At least a portion of the first substrate assembly 440 may be positioned between the first support member 410 and the second support member 420 , and the second support member 420 covers the first substrate assembly 440 . can be protected by The third support member 430 is at least partially spaced apart from the second support member 420 with the battery 460 interposed therebetween when viewed from above the rear plate 320 (eg, viewed in the +z-axis direction). can be located. The third support member 430 may be positioned between the first support member 410 and the rear plate 320 , and may be coupled to the first support member 410 using a fastening element such as a bolt. At least a portion of the second substrate assembly 450 may be positioned between the first support member 410 and the third support member 430 , and the third support member 430 covers the second substrate assembly 450 . can be protected by The second support member 420 and/or the third support member 430 may be formed of a metal material and/or a non-metal material (eg, polymer). In some embodiments, the second support member 420 serves as an electromagnetic shield for the first substrate assembly 440 , and the third support member 430 serves as an electromagnetic shield for the second substrate assembly 450 . can do. In some embodiments, the second support member 420 and/or the third support member 430 may be referred to as a rear case. In some embodiments, the second support member 420 and/or the third support member 430 may be defined as part of the housing 300 (see FIG. 2 ).

According to some embodiments, a single substrate assembly including the first substrate assembly 440 and the second substrate assembly 450 may be implemented. For example, when viewed from above the back plate 320 (eg, viewed in the +z-axis direction), the substrate assembly includes a first portion, a second portion, and A third portion extending between the battery 460 and the bezel structure 330 and connecting the first portion and the second portion may be included. The third part may be implemented to be substantially rigid. In some embodiments, the third portion may be implemented to be substantially flexible. In some embodiments, a single support member including the second support member 420 and the third support member 430 may be implemented.

According to an embodiment, the antenna structure 470 may be positioned between the second support member 420 and the rear plate 320 . In some embodiments, the antenna structure 470 may be positioned between the battery 460 and the back plate 320 . The antenna structure 470 may be implemented in the form of a film such as, for example, an FPCB. The antenna structure 470 may include at least one conductive pattern used as a loop-type radiator. For example, the at least one conductive pattern may include a planar spiral conductive pattern (eg, a planar coil or a pattern coil). In an embodiment, at least one conductive pattern included in the antenna structure 470 may be electrically connected to a wireless communication circuit (or wireless communication module) included in the first substrate assembly 440 . For example, the at least one conductive pattern may be utilized for short-range wireless communication such as near field communication (NFC). As another example, the at least one conductive pattern may be utilized for magnetic secure transmission (MST) for transmitting and/or receiving a magnetic signal. In some embodiments, at least one conductive pattern included in the antenna structure 470 may be electrically connected to a power transmission/reception circuit included in the first substrate assembly 440 . The power transmission/reception circuit may wirelessly receive power from an external electronic device or wirelessly transmit power to the external electronic device using at least one conductive pattern. The power transmission/reception circuit may include a power management module, for example, a power management integrated circuit (PMIC) or a charger integrated circuit (IC). The power transmission/reception circuit may charge the battery 460 using power wirelessly received using a conductive pattern.

The electronic device 200 may further include various components according to its provision form. Although it is not possible to enumerate all of these components due to various variations according to the convergence trend of the electronic device 200 , components equivalent to the above-mentioned components are additionally added to the electronic device 200 . may be included. In various embodiments, specific components may be excluded from the above components or replaced with other components according to the form of provision thereof.

5 is an exploded view of the electronic device 200 according to an embodiment. 6 is an x-y plan view of the front case 400 , in one embodiment. 7 is an x-y plan view of the second support member 420 , in one embodiment. 8 shows an x-y plan view of a portion of the second support member 420 , and the antenna 800 , in one embodiment.

5 and 6 , the front case 400 , the second support member 420 , the first printed circuit board 441 , the second printed circuit board 451 , the battery 460 , and a plurality of second cameras Fields 208 are shown. In one embodiment, the bezel structure (or side member) 330 of the front case 400 includes a first bezel part (or a first side part) 511, a second bezel part (or a second side part) 512, It may include a third bezel part (or a third side part) 513 or a fourth bezel part (or a fourth side part) 514 . The first bezel part 511 and the third bezel part 513 may be spaced apart from each other and extend in parallel. The second bezel part 512 may connect one end of the first bezel part 511 and one end of the third bezel part 513 . The fourth bezel part 514 may connect the other end of the first bezel part 511 and the other end of the third bezel part 513 , and may be spaced apart from the second bezel part 512 and extend in parallel. . a first corner part C1 to which the first bezel part 511 and the second bezel part 512 are connected, a second corner part C2 to which the second bezel part 512 and the third bezel part 513 are connected; A third corner part C3 to which the third bezel part 513 and the fourth bezel part 514 are connected, and/or a fourth corner part to which the first bezel part 511 and the fourth bezel part 514 are connected ( C4) may be formed in a round shape. The first bezel part 511 and the third bezel part 513 may have a first length extending in the y-axis direction, and the second bezel part 512 and the fourth bezel part 514 may extend in the x-axis direction. It may have a second length that is less than the first extended length. In some embodiments, the first length and the second length may be formed to be substantially the same.

According to an embodiment, the front case 400 may include a conductive structure 601 and a non-conductive structure 602 . The conductive structure 601 may include an outer conductive structure (or an outer metal structure, or a first metal structure) 610 and an inner conductive structure (or an inner metal structure, or a second metal structure) 620 . . The outer conductive structure 610 may form a portion of the side surface 300C (see FIG. 2 ). The inner conductive structure 620 may be positioned in a space between the front plate 310 and the rear plate 320 . In an embodiment, the outer conductive structure 610 and the inner conductive structure 620 may be integrally formed and may include the same metal material. The outer conductive structure 610 and the inner conductive structure 620 are, for example, titanium, amorphous alloy, metal-ceramic composite material (eg, cermet), stainless steel, magnesium, magnesium alloy, aluminum, aluminum alloy. , a zinc alloy, or a copper alloy. In some embodiments, the outer conductive structure 610 may include a first metal material, and the inner conductive structure 620 may include a second metal material different from the first metal material. The first metal material may include, for example, titanium, an amorphous alloy, a metal-ceramic composite material (eg, cermet), or stainless steel. The second metal material may include, for example, magnesium, a magnesium alloy, aluminum, an aluminum alloy, a zinc alloy, or a copper alloy. In some embodiments, the first metallic material is a different metallic material than the second metallic material, and may include, for example, magnesium, a magnesium alloy, aluminum, an aluminum alloy, a zinc alloy, or a copper alloy. The first metal material or the second metal material may be various in addition. The non-conductive structure 602 may include a polymer and may be connected to the outer conductive structure 610 and the inner conductive structure 620 . In some embodiments (not shown), various polymeric adhesive materials or sealants ( sealant) may be placed. The non-conductive structure 602 may include, for example, various polymers such as engineering plastics (eg, polycarbonate (PC) or polymethyl methacrylate (PMMA)). As another example, the non-conductive structure 602 may include an engineering plastic mixed with various reinforcing substrates such as glass fiber or carbon fiber (eg, fiber reinforced plastic (FRP)). In an embodiment, the non-conductive structure 602 may include polyether ether ketone, polyphenylene sulfide, polybutylene terephthalate, polyimide, or polycarbonate (polyether ether ketone). polycarbonate) The non-conductive structure 602 may be formed to be bonded to the conductive structure 601 using, for example, insert molding.

According to an embodiment, the outer conductive structure 610 includes a first conductive part 611 , a second conductive part 612 , a third conductive part 613 , a fourth conductive part 614 , and a fifth conductive part. (615). The non-conductive structure 602 includes a first insulating portion 631 , a second conductive portion 612 , and a third conductive portion 613 extending as a segment between the first conductive portion 611 and the second conductive portion 612 . ), the second insulating portion 632 extending as a segment between ) and a fourth insulating part 634 extending as a segment between the fifth conductive part 615, and a fifth insulating part extending as a segment between the fifth conductive part 615 and the first conductive part 611 ( 635) may be included. The first insulating part 631 , the second insulating part 632 , the third insulating part 633 , the fourth insulating part 634 , and the fifth insulating part 635 are the side surfaces 300C (see FIG. 2 ). may form part of it. The bezel structure 330 may include an outer conductive structure 610 and a plurality of insulating portions 631 , 632 , 633 , 634 , and 635 . The shape or number of the conductive parts included in the outer conductive structure 610 is not limited to the illustrated example and may vary. In an embodiment, at least a portion of the outer conductive structure 610 may be electrically connected to a wireless communication circuit (eg, the wireless communication module 192 of FIG. 1 ) to operate as an antenna radiator. In some embodiments, an outer non-conductive structure may be formed to replace the outer conductive structure 610, and the outer non-conductive structure may be formed of, for example, an engineering plastic (eg, polycarbonate (PC) or PMMA (PC)). polymethyl methacrylate)). As another example, the outer non-conductive structure may include an engineered plastic blended with various reinforcing substrates such as glass fiber or carbon fiber, such as fiber reinforced plastic (FRP). In , the outer non-conductive structure may comprise ceramic. The outer non-conductive structure may comprise, for example, zirconia ceramic. In some embodiments, the outer non-conductive structure comprises: It may be implemented as a ceramic structure including aluminum oxide (Al ₂ O ₃ ), silicon carbide (SIC), or silicon nitride (Si ₃ N ₄ ) In some embodiments, the outer non-conductive structure includes the segmental portion. It can be implemented in the form of a rectangular ring without.

According to an embodiment, referring to FIGS. 5 and 7 , the second support member 420 may be positioned between the first support member 410 and the rear plate 320 , and the first support member 410 and It may be coupled to the first printed circuit board 441 . The second support member 420 may include a plurality of bolt fastening holes 423 . At least a portion of the first printed circuit board 441 may be positioned between the first support member 410 and the second support member 420 , and the second support member 420 may include the first printed circuit board 441 . can be covered and protected. The third support member 430 may be positioned between the first support member 410 and the rear plate 320 , and may be coupled to the first support member 410 and the second printed circuit board 451 . The third support member 430 may include a plurality of bolt fastening holes 433 . At least a portion of the second printed circuit board 451 may be positioned between the first support member 410 and the second support member 420 , and the third support member 430 may include the second printed circuit board 451 . can be covered and protected.

7 and 8 , in an embodiment, the second support member 420 (eg, a rear case) may include a non-conductive member 700 formed of a non-metal material (eg, a polymer). The non-conductive member 700 may include a structure formed of, for example, a resin such as polycarbonate. In an embodiment, the second support member 420 may include a first conductive pattern 710 , a second conductive pattern 720 , a third conductive pattern 730 , or a fourth conductive pattern disposed on the non-conductive member 700 . A pattern 740 may be included. The first conductive pattern 710 , the second conductive pattern 720 , the third conductive pattern 730 , or the fourth conductive pattern 740 are wirelessly disposed on the first printed circuit board 441 (see FIG. 5 ). It may be electrically connected to a communication circuit (eg, the wireless communication module 192 of FIG. 1 ) to operate as an antenna radiator. In one embodiment, the wireless communication circuit transmits signals of different frequencies through the first conductive pattern 710 , the second conductive pattern 720 , the third conductive pattern 730 , and the fourth conductive pattern 740 . and/or receive. The wireless communication circuit may process a transmission signal or a reception signal in at least one selected or designated frequency band through the at least one radiator. The selected or designated frequency band is, for example, LB (low band) (about 600 MHz to about 1 GHz), MB (middle band) (about 1 GHz to about 2.3 GHz), HB (high band) (about 2.3 GHz to about 2.7 GHz) GHz), or an ultra-high band (UHB) (about 2.7 GHz to about 6 GHz). The designated frequency band may include various other frequency bands.

According to an embodiment, the wireless communication circuit (eg, the wireless communication module 192 of FIG. 1 ) transmits and/or transmits a signal in a frequency band regarding ultra wide band (UWB) using the first conductive pattern 710 . can receive The wireless communication circuit may transmit and/or receive a signal in a frequency band related to WiFi using the second conductive pattern 720 . The wireless communication circuit transmits and/or receives a signal in a frequency band different from that of the first conductive pattern 710 or the second conductive pattern 720 by using the third conductive pattern 730 or the fourth conductive pattern 740 . can do.

According to an embodiment, the first conductive pattern 710 , the second conductive pattern 720 , the third conductive pattern 730 , or the fourth conductive pattern 740 may be implemented by laser direct structuring (LDS). . The LDS may be, for example, a method in which a pattern is drawn (or designed) on the non-conductive member 700 using a laser, and a conductive material such as copper or nickel is plated thereon to form a conductive pattern. In some embodiments, the first conductive pattern 710 , the second conductive pattern 720 , the third conductive pattern 730 , or the fourth conductive pattern 740 may be implemented in a variety of other ways, such as plating or printing. have. In some embodiments, the first conductive pattern 710 , the second conductive pattern 720 , the third conductive pattern 730 , or the fourth conductive pattern 740 is implemented as a structure including a metal material such as stainless steel. and may be disposed on the non-conductive member 700 . In some embodiments, the first conductive pattern 710 , the second conductive pattern 720 , the third conductive pattern 730 , or the fourth conductive pattern 740 is implemented in the form of an FPCB to form the second support member 410 . can be placed in The number or positions of the conductive patterns are not limited to the illustrated examples and may vary.

According to an embodiment, the non-conductive member 700 is disposed on the opposite side to the first side 700A and the first side 700A facing the rear plate 320 and is disposed on the first printed circuit board 441 or the first side plate 320 . It may include a second surface 700B facing the first support member 410 . The non-conductive member 700 may include a side surface 700C connecting the first surface 700A and the second surface 700B. Side 700C can include, for example, a first side 7001 , a second side 7002 , a third side 7003 , or a fourth side 7004 . For example, the first side surface 7001 may be positioned to correspond to the first bezel part 511 . The second side 7002 may be positioned to correspond to the second bezel portion 512 . The third side surface 7003 may be positioned to correspond to the third bezel part 513 on the opposite side to the first side surface 7001 . The fourth side 7004 may be located on the side opposite the second side 7002 to the battery 460 (see FIG. 5 ). In an embodiment, the first conductive pattern 710 includes a first portion 711 disposed on the first surface 700A and a second portion extending from the first portion 711 and disposed on the second surface 700B. (712). In an embodiment, a portion (not shown) connecting the first portion 711 and the second portion 712 of the first conductive pattern 710 may be located in a through hole formed in the non-conductive member 700 . . In one embodiment, the second portion 712 may be located closer to the fourth side 7004 than the first side 7001 . In some embodiments, a portion (not shown) connecting the first portion 711 and the second portion 712 of the first conductive pattern 710 is disposed on the fourth side surface 7004 of the non-conductive member 700 . can be In an embodiment, the second part 712 may be a feeding part (or feeding structure), and may be electrically connected to a wireless communication circuit (eg, the wireless communication module 192 of FIG. 1 ). The wireless communication circuitry may provide a radiation current (or electromagnetic signal) to the second portion 712 , and the first conductive pattern 710 may emit radio waves. The first part 711 may be referred to as a 'radiation part' that radiates the electromagnetic signal fed to the second part 712 to the outside or receives the electromagnetic signal from the outside. In one embodiment, a flexible conductive member may be positioned between the first printed circuit board 441 and the second portion 712 , wherein the wireless communication circuit disposed on the first printed circuit board 441 is a flexible conductive member It may be electrically connected to the first conductive pattern 710 through the member. The flexible conductive member may include, for example, a conductive clip (eg, a conductive member comprising a resilient structure), a pogo-pin, a spring, a conductive poron, conductive rubber, conductive tape, or a conductive connector. may include The second conductive pattern 720 , the third conductive pattern 730 , or the fourth conductive pattern 740 may be implemented in at least part of the same manner as the first conductive pattern 710 , for example, the first surface a first portion disposed on 700A and a second portion extending from the first portion and disposed on a second side 700B. The first conductive pattern 710 , the second conductive pattern 720 , the third conductive pattern 730 , and the fourth conductive pattern 740 are the back plate 320 (refer to FIG. 4 ) when viewed from above (eg: When viewed in the +z-axis direction), they may be arranged so as not to overlap each other. For example, the first conductive pattern 710 may be formed in the first bezel part 511 than other conductive patterns (eg, the second conductive pattern 720 , the third conductive pattern 720 , and the conductive pattern 740 ). (See FIG. 6) may be located close to. In some embodiments, as an antenna structure including a radiating part and a feeding part, the first conductive pattern 710 , the second conductive pattern 720 , the third conductive pattern 730 , and the fourth conductive pattern 740 include: They may be referred to as a first antenna structure, a second antenna structure, a third antenna structure, and a fourth antenna structure, respectively.

According to an exemplary embodiment, a feeding part of the first conductive pattern 710 , a feeding part of the second conductive pattern 720 , a feeding part of the third conductive pattern 730 , and a feeding part of the fourth conductive pattern 740 . Some of them may be arranged close to each other. For example, the feeding portion of the first conductive pattern 710 (eg, the second portion 712 ) and the feeding portion of the second conductive pattern 720 are connected to each other on the first printed circuit board 441 (see FIG. 5 ). The first conductive terminal and the second conductive terminal disposed adjacent to each other may be electrically connected to each other.

In one embodiment, referring to FIG. 8 , the antenna (or antenna device or antenna system) 800 includes a first conductive pattern 710 , a wireless communication circuit 801 (eg, the wireless communication module 192 of FIG. 1 ). )), a transmission line 802 , a coupling conductive region 803 , and a ground G. The transmission line 802 may connect the second portion 712 (eg, a power feeding unit) of the first conductive pattern 710 and the wireless communication circuit 801 , and through the transmission line 802 , RF (radio frequency) of signals (voltage, current) can be transmitted. In some embodiments (not shown), the antenna 800 may include a frequency adjustment circuit (eg, a matching circuit) coupled to the transmission line 802 . The frequency adjustment circuit may include, for example, electrical elements having components such as inductance, capacitance, or conductance acting on the transmission line 802 . In an embodiment, the first conductive pattern 710 may include a third portion 713 extending from the first portion 711 and disposed on at least a portion of the first side surface 7001 of the non-conductive member 700 . can In an embodiment, the third portion 713 of the first conductive pattern 710 may be electromagnetically coupled to the front case 400 (eg, capacitive coupling). For example, the third portion 713 of the first conductive pattern 710 may be a portion of the first conductive pattern 710 in which electromagnetic coupling with the front case 400 substantially occurs. For example, the third portion 713 of the first conductive pattern 710 has a substantially large change in frequency characteristics such as an increase in bandwidth due to electromagnetic coupling with the front case 400 among the first conductive patterns 710 . It could be part of what's happening. In one embodiment, the coupling conductive region 803 may include a surface at least partially facing and spaced apart from the third portion 713 of the front case 400 , or a conductive structure forming a surface thereof, and the first conductivity It may be electromagnetically coupled with the third portion 713 of the pattern 710 . An air gap may be formed between the third portion 713 of the first conductive pattern 710 and the coupling conductive region 803 of the front case 400 . The coupling conductive region 803 may be positioned to be spaced apart from the third part 713 by a corresponding distance to be electromagnetically coupled to the third part 713 based on the wavelength of the antenna 800 . In one embodiment, the electromagnetic coupling between the third portion 713 and the coupling conductive region 803 may result in at least one selected or designated resonant frequency. For example, the coupling conductive region 803 may shift the resonance frequency of the first conductive pattern 710 to a specified frequency or may shift the resonance frequency of the first conductive pattern 710 by a specified amount. In one embodiment, the bandwidth is extended due to electromagnetic coupling between the third portion 713 of the first conductive pattern 710 and the coupling conductive region 803 of the front case 400 , and the antenna radiation performance is improved. can be secured.

According to an embodiment, the coupling conductive region 803 may be electrically connected to a ground (or antenna ground) G. The ground G may include, for example, a ground plane or a ground layer included in the first printed circuit board 441 . In an embodiment, the inner conductive structure 620 (refer to FIG. 6 ) of the front case 400 may be electrically connected to the ground G included in the first printed circuit board 441 . For example, a flexible conductive member (eg, a conductive clip, pogo pin, spring, conductive poron, conductive rubber, conductive tape, or conductive connector) positioned between the inner conductive structure 620 and the first printed circuit board 441 . ) (not shown), the inner conductive structure 620 may be electrically connected to the ground G of the first printed circuit board 441 . As another example, through a conductive material (eg, a conductive adhesive material) (not shown) positioned at least in part between the inner conductive structure 620 and the first printed circuit board 441 , the inner conductive structure 620 may be formed by the first It may be electrically connected to the ground G of the printed circuit board 441 .

According to some embodiments, the third portion 713 included in the first conductive pattern 710 electrically connected to the wireless communication circuit 801 indirectly feeds the coupling conductive region 803 by an electromagnetic coupling method. As an element that causes the signal, it may be referred to by various other terms such as a 'feeding pattern' or a 'feeding conductive region'. In some embodiments, the coupling conductive region 803 electrically connected to the ground G is an element that receives indirect power from the third portion 713 , and includes a 'ground coupling pattern' or a 'ground coupling conductive region' and may be referred to by various other terms such as In some embodiments, the third portion 713 and the coupling conductive region 803 may be referred to as a portion of the radiating portion of the antenna 800 that radiates an electromagnetic signal to the outside or receives an electromagnetic signal from the outside.

According to an embodiment, the wireless communication circuit 800 may support UWB using the antenna 800 . UWB is, for example, a technology according to the international standard of IEEE 802.15.4, and may refer to a technology for communicating with a wide bandwidth.

According to an embodiment, the coupling conductive region 803 may be included in the conductive structure 601 (refer to FIG. 6 ) of the front case 400 . For example, the coupling conductive region 803 may be included in the inner conductive structure 620 (see FIG. 6 ) of the conductive structure 601 . In some embodiments (not shown), the coupling conductive region 803 may be included in the outer conductive structure 610 (see FIG. 6 ) of the conductive structure 601 , and a third portion of the first conductive pattern 710 . 713 may face the coupling conductive region 803 included in the outer conductive structure 610 with an air gap interposed therebetween.

According to some embodiments, a dielectric having a dielectric constant different from that of air may be positioned between the third portion 713 of the first conductive pattern 710 and the coupling conductive region 803 of the front case 400 . The dielectric may have a permittivity that does not degrade the antenna radiation performance of the antenna 800 below a threshold level. The dielectric is implemented as a separate non-conductive structure and disposed between the third portion 713 and the coupling conductive region 803 , or, in some embodiments, as part of the non-conductive structure 602 included in the front case 400 . can be implemented.

According to some embodiments, the electronic device 200 (see FIG. 2 ) uses a plurality of antenna radiators 804 to perform a positioning function (eg, angle of AOA (AOA) for a signal source (eg, a transmitter or a Tx device)). arrival)) can be implemented. The electronic device 200 may identify an angle at which a signal is received using, for example, a time difference between signals received through the plurality of antenna radiators 804 and a phase difference resulting therefrom. The wireless communication circuit 800 may support a positioning function using a broadband bandwidth (eg, UWB). Although not shown, the plurality of antenna radiators 804 may be disposed on the first printed circuit board 441 (see FIG. 4 ), the second support member 420 , or the rear plate 320 (see FIG. 4 ). have. The plurality of antenna radiators 804 may include, for example, a patch antenna.

9 is an x-y plan view of the outer conductive structure 610 , the inner conductive structure 620 , and the second support member 420 , in one embodiment. 10 is a y-z plan view of a portion of the second support member 420 , in one embodiment.

9 and 10 , in an embodiment, at least a portion of the third portion 713 extending from the first portion 711 of the first conductive pattern 710 is included in the second support member 420 . It may be disposed on the first side surface 7001 of the non-conductive member 700 . For example, the first portion 711 may have a form extending from the connecting portion 7111 connected to the portion (not shown) connecting the first portion 711 and the second portion 712 to the end 7112, and , the third portion 713 may extend from one position between the connecting portion 7111 and the end 7112 of the first portion 711 to the first side surface 7001 .

According to an embodiment, the bolt fastening hole 423 may be positioned to correspond to the third portion 713 of the first conductive pattern 710 . For example, a portion of the third portion 713 may be disposed on an outer surface of a portion (not shown) forming the bolt fastening hole 423 of the non-conductive member 900 . In some embodiments, the bolt fastening hole 423 may be formed at a position different from the example shown in FIG. 9 .

According to an embodiment, at least a portion of the third portion 713 included in the first conductive pattern 710 may face the coupling conductive region 803 included in the inner conductive structure 620 while being spaced apart from each other. For example, when viewed in the +x axis direction (eg, referring to FIG. 6 , the direction from the first bezel part 511 to the second bezel part 512 ), the coupling conductive region 803 is the third The portion 713 may at least partially overlap. In one embodiment, the first planar portion (not shown) at least partially included in the third portion 713 faces and spaced apart from the second planar portion (not shown) at least partially included in the coupling conductive region 803 , may be substantially parallel. In some embodiments, the first planar portion at least partially included in the third portion 713 faces away from the second planar portion at least partially included in the coupling conductive region 803 and faces an acute angle (eg, from about 0 degrees to about 0 degrees). one of 10 degrees) can be achieved. In some embodiments, the third portion 713 may include a curved portion facing away from the coupling conductive region 803 . In some embodiments, the coupling conductive region 803 may include a curved portion facing away from the third portion 713 . In some embodiments, a portion of the third portion 713 and a portion of the coupling conductive region 803 may face each other spaced apart a first distance, and another portion of the third portion 713 and the coupling conductive region 803 ( 803) may be spaced apart from each other by a second distance different from the first distance to face each other.

According to an embodiment, the coupling conductive region 803 may include a conductive surface 8031 at least partially facing the third portion 713 of the first conductive pattern 710 . For example, the conductive surface 8031 may include a plane, and the plane included in the conductive surface 803 is a third from the first bezel part 511 in the +x axis direction (eg, referring to FIG. 6 ). direction toward the bezel portion 513).

According to an exemplary embodiment, the third portion 713 includes a first area (a region extending along a dotted line indicated by reference numeral '1001') and a second area extending from the first area 1001 (reference numeral '1002'). area extending along the dotted line indicated by ). The first region 1001 may refer to, for example, a region extending from the first portion 711 to the first side surface 7001 . The second region 1002 may refer to, for example, a region extending from the first portion 711 on the first side 7001 . The shape of the third part 713 is not limited to the illustrated example and may vary.

According to some embodiments (not shown), the third portion 713 electromagnetically coupled to the coupling conductive region 803 of the front case 400 among the first conductive patterns 710 is the non-conductive member 700 . ) may be located at least partially inside the.

According to an embodiment, the coupling conductive region 803 may be formed by a seating structure 902 in which the antenna module 900 is disposed among the first support members 410 (refer to FIG. 5 ). The seating structure 902 may include a recess 903 to receive the antenna module 900 . The seating structure 902 may be positioned adjacent to a portion corresponding to the first bezel part 511 (refer to FIG. 6 ) among the second conductive parts 612 of the outer conductive structure 610 . In one embodiment, the coupling conductive region 803 may include a sidewall of the seating structure 902 positioned to be spaced apart from the first bezel part 511 (see FIG. 6 ) with the antenna module 900 interposed therebetween. have. In one embodiment, a portion of the second conductive portion 612 corresponding to the first bezel portion 511 (see FIG. 6 ) is part of the seating structure 902 , and includes the coupling conductive region 803 and the recess 903 . ) to form a sidewall (or sidewall structure). The recess 903 may be formed between, for example, a portion of the second conductive portion 612 corresponding to the first bezel portion 511 (refer to FIG. 6 ) and the coupling conductive region 803 . The antenna module 900 is, for example, one surface (hereinafter, referred to as a 'third surface') facing the first bezel part 511 (see FIG. 6) (eg, directed in the -x axis direction) (900A) and a printed circuit board 901 including the other surface 900B (hereinafter referred to as a 'fourth surface') facing opposite to the one surface 900A. In one embodiment, the coupling conductive region 803 (or the sidewall of the seating structure 902 ) may face the fourth face 900B of the antenna module 900 . The antenna module 900 includes a plurality of antenna elements located inside the printed circuit board 901 closer to the third side 900A than the third side 900A, or the fourth side 900B. It may include an antenna array (not shown) having an antenna. The plurality of antenna elements, for example, may have substantially the same shape and may be disposed at regular intervals. The printed circuit board 901 may include a plurality of conductive layers (eg, a plurality of conductive pattern layers) and a plurality of non-conductive layers (eg, insulating layers) alternately stacked with the plurality of conductive layers. The plurality of antenna elements may be implemented, for example, with at least some of the plurality of conductive layers. In one embodiment, the plurality of antenna elements may include a patch antenna. In some embodiments, the plurality of antenna elements may include a dipole antenna. The antenna module 900 may include a communication circuit (not shown) electrically connected to the antenna array. The communication circuit may include, for example, a radio frequency integrate circuit (RFIC), and may be disposed on the fourth side 900B. In an embodiment, the communication circuit of the antenna module 900 may transmit and/or receive a signal of at least a partial frequency band from about 3 GHz to about 100 GHz through the antenna array. For example, the communication circuit of the antenna module 900 may up-convert or down-convert a frequency for a transmitted or received signal. The communication circuit of the antenna module 900 receives the IF (intermediate frequency) signal from the wireless communication circuit (eg, the first wireless communication module 192) disposed on the first printed circuit board 441 (see FIG. 5) and , it is possible to up-convert the received IF signal into a radio frequency (RF) signal (eg, millimeter wave). For example, the communication circuit of the antenna module 900 down-converts an RF signal received through the antenna array into an IF signal, and the IF signal is a wireless communication disposed on the first printed circuit board 441 (see FIG. 5 ). It may be provided as a circuit (eg, the first wireless communication module 192). In an embodiment, the second conductive portion 612 of the outer conductive structure 610 may not be substantially used as an antenna radiator. In some embodiments, a portion of the second conductive portion 612 of the outer conductive structure 610 facing the third surface 900A may be replaced with a non-conductive material. In some embodiments, the third side 900A faces the back plate 320 (see FIG. 5 ) and the fourth side 900B faces the first support member 410 (see FIG. 5 ), the antenna module 900 . ) may be disposed in the recess 903 of the seating structure 902 .

According to an embodiment, the end 7112 of the first portion 711 of the first conductive pattern 710 may be viewed from above (eg, in the +x-axis direction) of the first bezel portion 511 (refer to FIG. 6 ). ), may be aligned or overlapped with the segmented portion 640 between the first conductive portion 611 and the second conductive portion 612 of the outer conductive structure 610 . In an embodiment, the end 7112 may indicate an open point located close to the segment 640 in correspondence with the segment 640 of the first portion 711 . In some embodiments, the end 7112 (or off point) of the first portion 711 may point to the point at which the electric field E (electric)-field is maximum. The end 7112 (or open point) of the first portion 710 corresponds to the segment 640 between the first conductive portion 611 and the second conductive portion 612 and is close to the segmented portion 640 . The positioned structure may contribute to securing antenna radiation performance and/or extending bandwidth of the antenna 800 (see FIG. 8 ).

According to some embodiments, the third portion 713 of the first conductive pattern 710 is disposed on the first surface 700A of the non-conductive member 700 included in the second support member 420 , and the front case The coupling conductive region 803 of 400 may be embodied to face the third portion 713 while being spaced apart from each other. In this case, when viewed from above (eg, viewed in the +z-axis direction) of the rear plate 320 (refer to FIG. 4 ), the coupling conductive region 803 and the third portion 713 may overlap.

According to some embodiments, the first conductive pattern 710 may be disposed on the first printed circuit board 441 (refer to FIG. 4 ). In this case, the first portion 711 of the first conductive pattern 710 is disposed on one side of the first printed circuit board 441 facing the rear plate 320 (see FIG. 4 ) to provide a wireless communication circuit (eg, FIG. 4 ). 1, the wireless communication module 192) is electrically connected, and the third portion 713 of the first conductive pattern 710 is disposed on the side surface of the first printed circuit board 441 to couple the front case 400. The ring conductive region 803 may be spaced apart and face each other. In some embodiments, the first conductive pattern 710 may be positioned on a separate support structure (eg, an antenna carrier) disposed on the first printed circuit board 441 .

11 is, for example, a graph showing antenna radiation performance of the antenna 800 (refer to FIG. 8 ) according to an embodiment and antenna radiation performance of an antenna according to a comparative example.

Referring to FIGS. 8 and 11 , reference numeral '1101' is a graph indicating antenna radiation performance of the antenna 800 according to an exemplary embodiment. Reference numeral '1102' denotes, as a comparative example, an antenna in which the coupling conductive region is disposed on the non-conductive member 700 of the first support member 410 in place of the coupling conductive region 803 of FIG. 8 . It is a graph showing the radiation performance. The antenna 800 according to an embodiment may have improved antenna radiation performance in a frequency band used (refer to reference numeral '1103'), compared to the antenna according to the comparative example. In the antenna according to the comparative example, since the coupling conductive region has to be disposed in a limited area of the second support member 420 , the antenna 800 according to the embodiment reduces the length of the transmission line 802 compared to the comparative example to reduce the length of the line. It can contribute to reducing losses (eg line loss).

12 is, for example, a graph showing antenna radiation performance of the antenna 800 (see FIG. 8 ) according to an embodiment and antenna radiation performance of antennas according to a comparative example.

Referring to FIGS. 8 and 12 , reference numeral '1201' is a graph indicating antenna radiation performance of the antenna 800 according to an exemplary embodiment. Reference numeral '1202' denotes, as a comparative example, an end 7112 (see FIG. 9 ) of the first portion 711 positioned out of alignment with the segmental portion 640 (eg, by about 5 mm in the example of FIG. 9 ). It is a graph showing the antenna radiation performance related to the position) by moving it in the y-axis direction. Reference numeral '1203' is a comparative example, and is a graph showing the antenna radiation performance of the antenna in which the coupling conductive region 803 is omitted. The antenna 800 according to an embodiment may contribute to securing antenna radiation performance compared to the antennas according to the comparative example.

According to an embodiment of this document, the electronic device (eg, the electronic device 200 of FIG. 2 ) may include a housing (eg, the housing 300 of FIG. 2 ). The housing includes a front plate (eg, the front plate 310 of FIG. 5 ), a rear plate positioned opposite the front plate (eg, the rear plate 320 of FIG. 5 ), and the front plate and the rear plate It may include a side member (eg, the bezel structure 330 of FIG. 2 ) that at least partially surrounds the space therebetween. The electronic device may include a first support member (eg, the first support member 410 of FIG. 4 ). The first supporting member may be positioned in the space and connected to the side member. The first support member may include a conductive region (eg, the coupling conductive region 803 of FIG. 9 ) electrically connected to a ground (eg, the ground G of FIG. 8 ) included in the electronic device. The electronic device may include a display (eg, the display 201 of FIG. 4 ). The display may be positioned between the front plates, and at least partially visually exposed through the front plates. The electronic device may include a wireless communication circuit configured to transmit and/or receive a signal of a selected or specified frequency band (eg, the wireless communication circuit 801 of FIG. 8 ). The electronic device may include a conductive pattern (eg, the first conductive pattern 710 of FIG. 8 ). The conductive pattern may be positioned between the first supporting member and the rear plate, and may be electrically connected to the wireless communication circuit. The conductive pattern may be spaced apart from the conductive region to face it, and may be electromagnetically coupled to the conductive region.

According to an embodiment of the present document, a portion of the conductive pattern (eg, the third portion 713 of FIG. 8 ) is in a direction perpendicular to a direction from the front plate to the rear plate (eg, x in FIG. 8 ) axial direction) may overlap the conductive region (eg, the coupling conductive region 803 of FIG. 8 ).

According to an embodiment of the present document, the electronic device may further include a second support member (eg, the second support member 420 of FIG. 8 ) positioned between the rear plate and the first support member. . The conductive pattern (eg, the first conductive pattern 710 of FIG. 8 ) may be disposed on the second support member.

According to an embodiment of the present document, the second support member (eg, the second support member 420 of FIG. 7 or 8 ) includes a non-conductive member (eg, the non-conductive member 700 of FIG. 7 or 8 ). may include The non-conductive member has a first surface (eg, the first surface 700A of FIG. 7 ) facing the rear plate, and a second surface (eg, the second surface of FIG. 8 ) opposite to the first surface. 700B), and a side surface connecting the first surface and the second surface (eg, the first side surface 7001 of FIG. 10 ). The conductive pattern may include a first portion (eg, the first portion 711 of FIG. 7 ) disposed on the first surface. The conductive pattern may include a second portion extending from the first portion and disposed on the second surface (eg, the second portion 712 of FIG. 8 ). The second part may be electrically connected to the wireless communication circuit (eg, the wireless communication circuit 801 of FIG. 8 ). The conductive pattern may include a third portion extending from the first portion and disposed on the side surface (eg, the third portion 713 of FIG. 8 ). The third portion may face the conductive region (eg, the coupling conductive region 803 of FIG. 8 ) to be spaced apart from each other, and may be electromagnetically coupled to the conductive region.

According to an embodiment of the present document, the side member includes a first conductive part (eg, the first conductive part 611 of FIG. 9 ) disposed with the segmented part (eg, the segmented part 640 of FIG. 9 ) therebetween. ) and a second conductive part (eg, the second conductive part 612 of FIG. 9 ). An end of the first portion (eg, an end 7112 of FIG. 9 ) may be positioned to correspond to the segmented portion.

According to an embodiment of the present document, the second support member may include a bolt fastening hole (eg, the bolt fastening hole 423 of FIG. 9 ) positioned to correspond to the third part.

According to an embodiment of the present document, the third portion (eg, the third portion 713 of FIG. 8 or 9 ) and the conductive region (eg, the coupling conductive region 803 of FIG. 8 or 9 ) are at least Some may extend in parallel.

According to an embodiment of the present document, a dielectric may be positioned between the third portion (eg, third portion 713 in FIG. 9 ) and the conductive region (eg, coupling conductive region 803 in FIG. 9 ). can

According to an embodiment of the present document, the dielectric may be a part of a non-conductive structure (eg, the non-conductive structure 602 of FIG. 6 ) included in the first supporting member.

According to an embodiment of the present document, the electronic device includes an antenna module (eg, the antenna of FIG. 9 ) including a printed circuit board (eg, the printed circuit board 901 of FIG. 9 ) on which an antenna array is located. module 900). The first supporting member may include a seating structure (eg, the seating structure 902 of FIG. 9 ) including a recess (eg, the recess 903 of FIG. 9 ) in which the antenna module is disposed. The conductive region (eg, the coupling conductive region 803 of FIG. 9 ) may include a sidewall of the seating structure.

According to one embodiment of the present document, the side member extends parallel to each other and extends apart from each other and includes two bezel parts (eg, the first bezel part 511 and the third bezel part ( 513)) may be included. The recess (eg, the recess 903 of FIG. 9 ) may include a space defined by one of the two bezel parts (eg, the first bezel part 511 of FIG. 6 ) and the sidewall.

According to some embodiments of the present document, the second support member (eg, the second support member 420 of FIG. 7 or 8 ) includes a non-conductive member (eg, the non-conductive member 700 of FIG. 7 or 8 ). may include The non-conductive member has a first surface (eg, the first surface 700A of FIG. 7 ) facing the rear plate, and a second surface (eg, the second surface of FIG. 8 ) opposite to the first surface. 700B), and a side surface connecting the first surface and the second surface (eg, the first side surface 7001 of FIG. 10 ). The conductive pattern may be disposed on the first surface. A portion of the conductive pattern may overlap the conductive region when viewed from above the rear plate.

According to some embodiments of this document, the electronic device may further include a printed circuit board (eg, the first printed circuit board 441 of FIG. 5 ) positioned between the rear plate and the first support member. . The wireless communication circuit (eg, the wireless communication circuit 801 of FIG. 8 ) may be disposed on the printed circuit board. The conductive pattern may be disposed on the printed circuit board.

According to an embodiment of the present document, the selected or designated frequency band may include a frequency band related to UWB.

According to an embodiment of this document, the electronic device may further include a plurality of antennas (eg, a plurality of antennas 804 of FIG. 8 ) related to a positioning function. The wireless communication circuit may be electrically connected to the plurality of antennas.

According to an embodiment of this document, the electronic device (eg, the electronic device 200 of FIG. 2 ) may include a housing (eg, the housing 300 of FIG. 2 ). The housing includes a front plate (eg, the front plate 310 of FIG. 5 ), a rear plate positioned opposite the front plate (eg, the rear plate 320 of FIG. 5 ), and the front plate and the rear plate It may include a side member (eg, the bezel structure 330 of FIG. 2 ) that at least partially surrounds the space therebetween. The electronic device may include a first support member (eg, the first support member 410 of FIG. 4 ). The first supporting member may be positioned in the space and connected to the side member. The first support member may include a conductive region (eg, the coupling conductive region 803 of FIG. 9 ) electrically connected to a ground (eg, the ground G of FIG. 8 ) included in the electronic device. The electronic device may include a second support member (eg, the second support member 420 of FIG. 5 ) positioned between the rear plate and the first support member. The electronic device may include a display (eg, the display 201 of FIG. 4 ). The display may be positioned between the front plates, and at least partially visually exposed through the front plates. The electronic device may include a conductive pattern (eg, the first conductive pattern 710 of FIG. 8 ). The conductive pattern may be positioned on the second support member. The conductive pattern may be electrically connected to a wireless communication circuit configured to transmit and/or receive a signal of a selected or specified frequency band (eg, the wireless communication circuit 801 of FIG. 8 ). The second support member may include a non-conductive member (eg, the non-conductive member 700 of FIGS. 7 or 8 ). The non-conductive member has a first surface (eg, the first surface 700A of FIG. 7 ) facing the rear plate, and a second surface (eg, the second surface of FIG. 8 ) opposite to the first surface. 700B), and a side surface connecting the first surface and the second surface (eg, the first side surface 7001 of FIG. 10 ). The conductive pattern may include a first portion (eg, the first portion 711 of FIG. 7 ) disposed on the first surface. The conductive pattern may include a second portion extending from the first portion and disposed on the second surface (eg, the second portion 712 of FIG. 8 ). The second part may be electrically connected to the wireless communication circuit (eg, the wireless communication circuit 801 of FIG. 8 ). The conductive pattern may include a third portion extending from the first portion and disposed on the side surface (eg, the third portion 713 of FIG. 8 ). The third portion may face the conductive region (eg, the coupling conductive region 803 of FIG. 8 ) to be spaced apart from each other, and may be electromagnetically coupled to the conductive region.

According to an embodiment of the present document, the side member includes a first conductive part (eg, the first conductive part 611 of FIG. 9 ) disposed with the segmented part (eg, the segmented part 640 of FIG. 9 ) therebetween. ) and a second conductive part (eg, the second conductive part 612 of FIG. 9 ). An end of the first portion (eg, an end 7112 of FIG. 9 ) may be positioned to correspond to the segmented portion.

According to an embodiment of the present document, the electronic device includes an antenna module (eg, the antenna of FIG. 9 ) including a printed circuit board (eg, the printed circuit board 901 of FIG. 9 ) on which an antenna array is located. module 900). The first support member may include a seating structure (eg, the seating structure 902 of FIG. 9 ) including a recess (eg, the recess 903 of FIG. 9 ) in which the antenna module is disposed. The conductive region (eg, the coupling conductive region 803 of FIG. 9 ) may include a sidewall of the seating structure.

According to one embodiment of the present document, the side member extends parallel to each other and extends apart from each other and includes two bezel parts (eg, the first bezel part 511 and the third bezel part ( 513)) may be included. The recess (eg, the recess 903 of FIG. 9 ) may include a space defined by one of the two bezel parts (eg, the first bezel part 511 of FIG. 6 ) and the sidewall.

According to an embodiment of the present document, the selected or designated frequency band may include a frequency band related to UWB.

Embodiments disclosed in this document and drawings are merely presented as specific examples to easily explain technical content and help understanding of the embodiments, and are not intended to limit the scope of the embodiments. Therefore, the scope of the various embodiments of this document should be interpreted as including all changes or modifications derived based on the technical idea in addition to the embodiments disclosed herein are included in the scope of the various embodiments of the present document.

420: second support member
700: non-conductive member
700C: side
800: antenna
710: first conductive pattern
713: third part
803: coupling conductive region
801: wireless communication circuit
802: transmission line
G: Ground

Claims (20)

In an electronic device,
a housing including a front plate, a rear plate positioned opposite to the front plate, and side members at least partially enclosing a space between the front plate and the rear plate;
a first support member positioned in the space, connected to the side member, and including a conductive region electrically connected to a ground included in the electronic device;
a display positioned between the first support member and the front plate and at least partially visually exposed through the front plate; and
a conductive pattern positioned between the first support member and the back plate and electrically connected to a wireless communication circuit configured to transmit and/or receive signals in a selected or specified frequency band;
The conductive pattern faces the conductive region spaced apart and is electromagnetically coupled to the conductive region.
The method of claim 1,
A portion of the conductive pattern,
The electronic device overlaps the conductive region in a direction perpendicular to a direction from the front plate to the back plate.
The method of claim 1,
a second support member positioned between the back plate and the first support member;
The conductive pattern is disposed on the second support member.
4. The method of claim 3,
The second support member is a non-conductive member including a first surface facing the rear plate, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface. including,
The conductive pattern is
a first portion disposed on the first surface;
a second portion extending from the first portion and disposed on the second surface, the second portion being electrically connected to the wireless communication circuit; and
and a third portion extending from the first portion, disposed on the side surface, facing the conductive region spaced apart, and electromagnetically coupled to the conductive region.
5. The method of claim 4,
The side member includes a first conductive portion and a second conductive portion disposed with the segmented portion therebetween,
An end of the first portion is positioned corresponding to the segmented portion.
5. The method of claim 4,
and the second support member includes a bolt fastening hole positioned to correspond to the third portion.
5. The method of claim 4,
The third portion and the conductive region extend at least partially in parallel.
5. The method of claim 4,
and a dielectric positioned between the third portion and the conductive region.
9. The method of claim 8,
The dielectric is a part of a non-conductive structure included in the first support member.
The method of claim 1,
Further comprising an antenna module comprising a printed circuit board on which an antenna array is located,
The first support member includes a seating structure including a recess in which the antenna module is disposed,
and the conductive region includes a sidewall of the seating structure.
11. The method of claim 10,
The side member includes two bezel portions extending parallel to each other and forming an exterior of the electronic device,
and the recess includes a space defined by one of the two bezel parts and the sidewall.
4. The method of claim 3,
The second support member is a non-conductive member including a first surface facing the rear plate, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface. including,
The conductive pattern is disposed on the first surface,
A portion of the conductive pattern overlaps the conductive region when viewed from above the rear plate.
The method of claim 1,
a printed circuit board positioned between the back plate and the first support member, the printed circuit board on which the wireless communication circuit is disposed;
The conductive pattern is disposed on the printed circuit board.
The method of claim 1,
The selected or designated frequency band includes an ultra wide band (UWB) frequency band.
The method of claim 1,
Further comprising a plurality of antennas for the positioning function,
The wireless communication circuit is an electronic device electrically connected to the plurality of antennas.
In an electronic device,
a housing including a front plate, a rear plate positioned opposite to the front plate, and side members at least partially enclosing a space between the front plate and the rear plate;
a first support member positioned in the space, connected to the side member, and including a conductive region electrically connected to a ground included in the electronic device;
a second support member positioned between the back plate and the first support member;
a display positioned between the first support member and the front plate and at least partially visually exposed through the front plate; and
a conductive pattern positioned on the second support member and electrically connected to a wireless communication circuit configured to transmit and/or receive signals in a selected or specified frequency band;
The second support member is a non-conductive member including a first surface facing the rear plate, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface. including,
The conductive pattern is
a first portion disposed on the first surface;
a second portion extending from the first portion and disposed on the second surface, the second portion being electrically connected to the wireless communication circuit; and
and a third portion extending from the first portion, disposed on the side surface, facing the conductive region spaced apart, and electromagnetically coupled to the conductive region.
17. The method of claim 16,
The side member includes a first conductive portion and a second conductive portion disposed with the segmented portion therebetween,
An end of the first portion is positioned corresponding to the segmented portion.
17. The method of claim 16,
Further comprising an antenna module comprising a printed circuit board on which the antenna array is located;
The first support member includes a seating structure including a recess in which the antenna module is disposed,
and the conductive region includes a sidewall of the seating structure.
19. The method of claim 18,
The side member includes two bezel portions extending parallel to each other and forming an exterior of the electronic device,
and the recess includes a space defined by one of the two bezel parts and the sidewall.
17. The method of claim 16,
The selected or designated frequency band includes an ultra wide band (UWB) frequency band.

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