KR20230020660A - Super soft moisture-curable water-resistant coating agent composition and super soft moisture-curable water-resistant coating agent comprising the same - Google Patents
Super soft moisture-curable water-resistant coating agent composition and super soft moisture-curable water-resistant coating agent comprising the same Download PDFInfo
- Publication number
- KR20230020660A KR20230020660A KR1020210102309A KR20210102309A KR20230020660A KR 20230020660 A KR20230020660 A KR 20230020660A KR 1020210102309 A KR1020210102309 A KR 1020210102309A KR 20210102309 A KR20210102309 A KR 20210102309A KR 20230020660 A KR20230020660 A KR 20230020660A
- Authority
- KR
- South Korea
- Prior art keywords
- composition
- weight
- polydimethylsiloxane
- resistant coating
- moisture
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 68
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 50
- 239000011248 coating agent Substances 0.000 title claims abstract description 49
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 60
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 59
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 59
- 238000013008 moisture curing Methods 0.000 claims abstract description 33
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 32
- 239000004014 plasticizer Substances 0.000 claims abstract description 30
- 239000003054 catalyst Substances 0.000 claims abstract description 24
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 19
- 239000008199 coating composition Substances 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 15
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 8
- 230000000052 comparative effect Effects 0.000 description 49
- 239000000126 substance Substances 0.000 description 13
- 238000004132 cross linking Methods 0.000 description 9
- 239000000047 product Substances 0.000 description 7
- 238000001723 curing Methods 0.000 description 6
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 5
- 239000012975 dibutyltin dilaurate Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- OHVLMTFVQDZYHP-UHFFFAOYSA-N 1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-2-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound N1N=NC=2CN(CCC=21)C(CN1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)=O OHVLMTFVQDZYHP-UHFFFAOYSA-N 0.000 description 3
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 3
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 3
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 3
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 3
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 238000010828 elution Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- KUQVFOOAIOMQOT-UHFFFAOYSA-N 2-methylpropyltin Chemical compound CC(C)C[Sn] KUQVFOOAIOMQOT-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 2
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 2
- HGQSXVKHVMGQRG-UHFFFAOYSA-N dioctyltin Chemical compound CCCCCCCC[Sn]CCCCCCCC HGQSXVKHVMGQRG-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- BRUFYILNWNCKJT-UHFFFAOYSA-N 3-acetylpentane-2,4-dione;dibutyltin Chemical compound CCCC[Sn]CCCC.CC(=O)C(C(C)=O)C(C)=O BRUFYILNWNCKJT-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910002808 Si–O–Si Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- FGPCETMNRYMFJR-UHFFFAOYSA-L [7,7-dimethyloctanoyloxy(dimethyl)stannyl] 7,7-dimethyloctanoate Chemical compound CC(C)(C)CCCCCC(=O)O[Sn](C)(C)OC(=O)CCCCCC(C)(C)C FGPCETMNRYMFJR-UHFFFAOYSA-L 0.000 description 1
- LHFURYICKMKJHJ-UHFFFAOYSA-L [benzoyloxy(dibutyl)stannyl] benzoate Chemical compound CCCC[Sn+2]CCCC.[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 LHFURYICKMKJHJ-UHFFFAOYSA-L 0.000 description 1
- HAAANJSJNWKVMX-UHFFFAOYSA-L [butanoyloxy(dimethyl)stannyl] butanoate Chemical compound CCCC(=O)O[Sn](C)(C)OC(=O)CCC HAAANJSJNWKVMX-UHFFFAOYSA-L 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- ZXDVQYBUEVYUCG-UHFFFAOYSA-N dibutyltin(2+);methanolate Chemical compound CCCC[Sn](OC)(OC)CCCC ZXDVQYBUEVYUCG-UHFFFAOYSA-N 0.000 description 1
- HZFCYILHRCIPJG-UHFFFAOYSA-N dioctyltin;tripropoxysilicon Chemical compound CCCO[Si](OCCC)OCCC.CCCO[Si](OCCC)OCCC.CCCCCCCC[Sn]CCCCCCCC HZFCYILHRCIPJG-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003863 metallic catalyst Substances 0.000 description 1
- GCHSKZYGFZYKBO-UHFFFAOYSA-N methoxycarbonyl(phenyl)tin Chemical compound COC(=O)[Sn]C1=CC=CC=C1 GCHSKZYGFZYKBO-UHFFFAOYSA-N 0.000 description 1
- 125000005609 naphthenate group Chemical group 0.000 description 1
- 229940049964 oleate Drugs 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- CPRPKIMXLHBUGA-UHFFFAOYSA-N triethyltin Chemical compound CC[Sn](CC)CC CPRPKIMXLHBUGA-UHFFFAOYSA-N 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/16—Antifouling paints; Underwater paints
- C09D5/1656—Antifouling paints; Underwater paints characterised by the film-forming substance
- C09D5/1662—Synthetic film-forming substance
- C09D5/1675—Polyorganosiloxane-containing compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/011—Crosslinking or vulcanising agents, e.g. accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Paints Or Removers (AREA)
Abstract
Description
본 발명은 초연질 습기경화형 내수코팅제 조성물 및 이를 포함하는 초연질 습기경화형 내수코팅제, 보다 상세하게는, 수지의 초연질 특성에 의해 인쇄회로기판 어셈블리에 도포 후에도 커넥터 체결이 가능한 초연질 습기경화형 내수코팅제 조성물 및 이를 포함하는 초연질 습기경화형 내수코팅제에 관한 것이다.The present invention relates to an ultra-soft moisture-curable water-resistant coating composition and a super-soft moisture-curable water-resistant coating agent containing the same, and more particularly, a super-soft moisture-curable water-resistant coating agent capable of being connected to a connector even after being applied to a printed circuit board assembly due to the ultra-soft characteristics of the resin. It relates to a composition and an ultra-soft moisture-curing water-resistant coating comprising the same.
인쇄회로기판 어셈블리에서 기판 상에 장착된 디바이스 사이의 간격 또는 리드부 등이 조밀해짐에 따라, 이물질, 오염, 습기 등의 외부 환경적인 요인에 의해 리드부 사이에서 이온의 이동, 휘스커 등에 의한 단락 발생이 큰 문제가 되고 있으며, 이에 대한 대책으로 리드부를 대기 환경으로부터 완전 차단하고자 수분에 강한 수지로 코팅하는 컨포멀 코팅 등이 행하여지고 있다.As the gaps between devices mounted on the board in the printed circuit board assembly or lead parts become denser, external environmental factors such as foreign substances, contamination, and moisture cause short circuits due to movement of ions between lead parts and whiskers, etc. This has become a big problem, and as a countermeasure against this, conformal coating, etc., which is coated with a resin resistant to moisture, is being performed to completely block the lead part from the atmospheric environment.
대부분의 전자기기 내부 디바이스들에 방수 방진 기능을 부여하기 위해서는 고무 패킹과 실리콘 등을 이용해 구조적으로 밀봉하는 방법을 사용하고 있다. 이러한 방법은 직접적으로 전자기기 내부에 물이나 오염물이 들어오지 않게 하지만, 어떠한 경우로라도 전자기기 내부에 물이 침투 할 경우 인쇄회로기판 어셈블리의 반도체 디바이스간 통전에 의해 기기가 고장나는 것을 막을 수 없다.In order to give waterproof and dustproof functions to the internal devices of most electronic devices, a method of structurally sealing using rubber packing and silicon is used. This method directly prevents water or contaminants from entering the inside of the electronic device, but in any case, when water penetrates into the inside of the electronic device, it cannot prevent the device from being broken by energization between semiconductor devices of the printed circuit board assembly.
이러한 문제점들을 해소하기 위해서는 내수코팅제를 도입하여야 하는데, 종래의 컨포멀 코팅제들은 수지의 모듈러스가 높고, 코팅 후 커넥터를 체결해야 하는 특수한 상황을 고려하지 않아 커넥터 부착 용이성의 미흡으로 체결 후 통전되지 않는 문제가 발생한다.In order to solve these problems, it is necessary to introduce a water-resistant coating agent. Conventional conformal coating agents have a high modulus of resin and do not take into account the special situation in which a connector needs to be fastened after coating. occurs.
현재 인쇄회로기판용 컨포멀 코팅제의 경우, 커넥터와 반도체 디바이스의 체결 후에 주변을 도포하는 방식이거나, 커넥터부 주위에 미리 코팅제로 댐을 만든 후 반도체 디바이스를 체결하는 방식을 채용하고 있다. 그러나, 컨포멀 코팅제의 접착불량, 기공을 통한 수분 침투 등의 사유로 수분이 유입되었을 경우, 반도체 디바이스에 결함이 발생할 가능성이 여전히 있다. 또한, 현재 모바일 기기들이 폴더블, 플렉서블, 롤러블화 됨에 따라 수분 침투에 취약한 힌지부위에 방수성을 보완할 필요성이 있다.In the case of the current conformal coating agent for printed circuit boards, a method of applying the periphery after fastening a connector and a semiconductor device or a method of fastening a semiconductor device after making a dam with a coating agent around the connector portion in advance is adopted. However, when moisture is introduced due to poor adhesion of the conformal coating agent, moisture permeation through pores, etc., there is still a possibility that defects may occur in the semiconductor device. In addition, as current mobile devices become foldable, flexible, and rollable, there is a need to supplement the waterproofness of the hinge, which is vulnerable to moisture penetration.
본 발명은 아주 작은 힘(20gf)에서도 수지의 변형(밀림 현상 및 뚫림 현상)이 쉽게 발생할 수 있어 인쇄회로기판의 커넥터부에 코팅 후에도 반도체 디바이스들의 체결이 가능한 초연질 습기경화형 내수코팅제 조성물을 제공하기 위한 것이다.The present invention is to provide an ultra-soft moisture-curing water-resistant coating composition capable of fastening semiconductor devices even after coating the connector part of a printed circuit board because resin deformation (pushing phenomenon and puncture phenomenon) can easily occur even with a very small force (20 gf). it is for
또한, 본 발명은 아주 작은 힘(20gf)에서도 수지의 변형이 쉽게 발생하면서도, 내수코팅제로 사용할 수 있는 내오염성과 내수성을 유지할 수 있는 초연질 습기경화형 내수코팅제 조성물을 제공하기 위한 것이다.In addition, the present invention is to provide an ultra-soft moisture-curing water-resistant coating composition capable of maintaining stain resistance and water resistance that can be used as a water-resistant coating agent while easily deforming the resin even with a very small force (20 gf).
또한, 본 발명은 상기 조성물을 포함하는 초연질 습기경화형 내수코팅제, 특히 전자기기가 수중에 침수 시, 인쇄회로기판 어셈블리에서 물에 의한 이온의 이동, 통전을 방지하기 위해 도포되는 초연질 습기경화형 내수코팅제를 제공하기 위한 것이다.In addition, the present invention is a super-soft moisture-curing water-resistant coating agent containing the above composition, especially a super-soft moisture-curing water-resistant coating applied to prevent the movement of ions and electricity in a printed circuit board assembly when an electronic device is immersed in water. It is for providing a coating agent.
또한, 본 발명은 상기 초연질 습기경화형 내수코팅제로 코팅된 인쇄회로기판 어셈블리를 제공하기 위한 것이다.In addition, the present invention is to provide a printed circuit board assembly coated with the ultra-soft moisture-curing water-resistant coating agent.
본 발명은 양 말단에 히드록실기를 포함하는 폴리디메틸실록산; 가소제로서 폴리디메틸실록산; 가교제: 및 촉매를 포함하는 습기경화형 내수코팅제 조성물을 제공한다.The present invention is a polydimethylsiloxane containing a hydroxyl group at both ends; polydimethylsiloxane as a plasticizer; A moisture-curable water-resistant coating composition comprising a crosslinking agent and a catalyst is provided.
본 발명의 일 실시예에서, 상기 양 말단에 히드록실기를 포함하는 폴리디메틸실록산은 조성물의 총 중량에 대하여 10 중량% 이상 50 중량% 미만으로 포함될 수 있다.In one embodiment of the present invention, the polydimethylsiloxane containing hydroxyl groups at both ends may be included in an amount of 10% by weight or more and less than 50% by weight based on the total weight of the composition.
본 발명의 일 실시예에서, 상기 양 말단에 히드록실기를 포함하는 폴리디메틸실록산은 평균분자량이 3,000 내지 140,000g/mol일 수 있다.In one embodiment of the present invention, the polydimethylsiloxane containing hydroxyl groups at both ends may have an average molecular weight of 3,000 to 140,000 g/mol.
본 발명의 일 실시예에서, 상기 가소제로서 폴리디메틸실록산은 조성물의 총 중량에 대하여 30 중량% 초과 90 중량% 미만으로 포함될 수 있다In one embodiment of the present invention, polydimethylsiloxane as the plasticizer may be included in more than 30% by weight and less than 90% by weight based on the total weight of the composition.
본 발명의 일 실시예에서, 상기 가소제로서 폴리디메틸실록산은 평균분자량이 1,000 내지 140,000g/mol일 수 있다.In one embodiment of the present invention, the polydimethylsiloxane as the plasticizer may have an average molecular weight of 1,000 to 140,000 g/mol.
본 발명의 일 실시예에서, 상기 가교제는 옥심형, 알코올형 실란커플링제 등일 수 있다.In one embodiment of the present invention, the crosslinking agent may be an oxime-type or alcohol-type silane coupling agent.
본 발명의 일 실시예에서, 상기 가교제는 조성물의 총 중량에 대하여 1 내지 10 중량% 이하로 포함될 수 있다.In one embodiment of the present invention, the crosslinking agent may be included in an amount of 1 to 10% by weight or less based on the total weight of the composition.
본 발명의 일 실시예에서, 상기 촉매는 유기주석계 촉매일 수 있다.In one embodiment of the present invention, the catalyst may be an organotin-based catalyst.
본 발명의 일 실시예에서, 상기 촉매의 함량은 조성물의 총 중량에 대하여 0.01 내지 1 중량% 이하로 포함될 수 있다.In one embodiment of the present invention, the content of the catalyst may be included in 0.01 to 1% by weight or less based on the total weight of the composition.
본 발명의 일 실시예에서, 상기 조성물의 경화물은 20gf의 외부 힘에 의해 변형, 바람직하게는 관통 당할 수 있다.In one embodiment of the present invention, the cured product of the composition may be deformed, preferably penetrated, by an external force of 20 gf.
본 발명의 일 실시예에서, 상기 조성물의 경화물은 복합 모듈러스(Complex shear modulus)가 3 내지 20kPa일 수 있다.In one embodiment of the present invention, the cured product of the composition may have a complex shear modulus of 3 to 20 kPa.
본 발명은 상기 조성물을 포함하는 초연질 습기경화형 내수코팅제를 제공한다.The present invention provides an ultra-soft moisture-curing water-resistant coating agent comprising the above composition.
본 발명은 상기 초연질 습기경화형 내수코팅제로 코팅된 인쇄회로기판 어셈블리를 제공한다.The present invention provides a printed circuit board assembly coated with the ultra-soft moisture-curing water-resistant coating agent.
본 발명의 습기경화형 내수코팅제 조성물은 기존 컨포멀코팅 수지들과는 다르게 초연질 특성을 가지고 있기에 외부의 약한 물리적인 힘(20gf)에 의해 쉽게 변형이 발생하는 특성을 가짐으로써, 인쇄회로기판 어셈블리에 코팅 후에도 커넥터체결이 가능하도록 해주며 더불어 우수한 내수성과 빠르고 안정적인 습기경화특성을 가지고 있다. 따라서, 본 발명의 습기경화형 내수코팅제를 사용하면 인쇄회로기판의 조립에 관해서 어떠한 제약없이 커넥터에 미리 코팅제를 도포하고 사용할 수 있다.Unlike conventional conformal coating resins, the moisture-curable water-resistant coating composition of the present invention has a super-soft property, so it is easily deformed by a weak external physical force (20 gf), so that even after coating on a printed circuit board assembly It enables connector fastening and has excellent water resistance and fast and stable moisture curing characteristics. Therefore, when the moisture-curing water-resistant coating agent of the present invention is used, the coating agent can be applied to the connector in advance and used without any restrictions regarding the assembly of the printed circuit board.
도 1은 본 발명에 따른 초연질 습기경화형 내수코팅제를 인쇄회로기판에 코팅한 후 반도체 디바이스 체결 시 코팅제에 변형이 이루어져 반도체 디바이스와 인쇄회로기판 간의 통전이 가능하게 됨을 도시한 것이다.FIG. 1 shows that after coating a printed circuit board with an ultra-soft moisture-curing water-resistant coating agent according to the present invention, the coating agent is deformed when a semiconductor device is fastened to enable current to flow between the semiconductor device and the printed circuit board.
본 발명에서 "습기경화"라는 용어는 수분 경화 촉매의 존재 하에 물 또는 공기 중 수분에 의해 야기되는 중합체 사슬 말단 관능기의 축합 가교결합 반응에 의한 재료 또는 중합체의 경화성인 부분의 경화 또는 가황을 지칭한다.In the present invention, the term "moisture curing" refers to curing or vulcanization of a curable part of a material or polymer by a condensation crosslinking reaction of polymer chain end functional groups caused by water or moisture in the air in the presence of a moisture curing catalyst. .
본 발명에서 "내수코팅"이라는 용어는 내수성(방수성)을 강화한 컨포멀 코팅을 의미하기 위해 사용된다.In the present invention, the term "water-resistant coating" is used to mean a conformal coating having enhanced water resistance (water resistance).
본 발명에서 "인쇄회로기판(Printed Circuit Board, PCB)"은 배선이 집적되어 다양한 소자들이 실장 되거나 소자 간의 전기적 연결이 가능하도록 구성되는 부품이다. 인쇄회로기판에 전자 소자(예를 들어 전자칩)들이 실장되어 인쇄회로기판 어셈블리를 구성하며, 기술의 발전에 따라 다양한 형태와 다양한 기능을 갖는 인쇄회로기판 어셈블리가 제조되고 있으며, 이들의 일 예로서 램(Ram), 메인보드, 랜 카드 등을 들 수 있다.In the present invention, a "Printed Circuit Board (PCB)" is a component configured to enable wiring to be integrated and various elements to be mounted or electrically connected between elements. Electronic elements (e.g., electronic chips) are mounted on a printed circuit board to form a printed circuit board assembly, and with the development of technology, printed circuit board assemblies having various shapes and functions are being manufactured. RAM, a main board, and a LAN card may be mentioned.
본 발명의 일 실시예는, 폴리실록산을 주성분으로 한 코팅제로서 일액형 초연질 습기경화형 조성물이다.One embodiment of the present invention is a one-component ultra-soft moisture-curing composition as a coating agent containing polysiloxane as a main component.
본 발명의 초연질 습기경화형 내수코팅제 조성물은 양 말단에 히드록실기를 포함하는 폴리디메틸실록산; 가소제로서 폴리디메틸실록산; 가교제: 및 촉매를 포함한다.The ultra-soft moisture-curing water-resistant coating composition of the present invention includes polydimethylsiloxane containing hydroxyl groups at both ends; polydimethylsiloxane as a plasticizer; cross-linking agent: and a catalyst.
본 발명의 습기경화형 내수코팅제 조성물은 기존 컨포멀코팅 수지들과는 다르게 초연질 특성을 가지고 있기에 코팅 및 경화 후에 외부의 약한 물리적인 힘, 예를 들어 20gf에 의해 쉽게 밀림현상, 뚫림현상 등의 변형이 발생하므로, 반도체 디바이스 체결 시 커넥터와 반도체 디바이스 간의 체결 내지 접지가 가능하다.Unlike conventional conformal coating resins, the moisture-curable water-resistant coating composition of the present invention has super-soft properties, so after coating and curing, deformation such as slipping and piercing easily occurs due to a weak external physical force, for example, 20 gf. Therefore, when the semiconductor device is coupled, coupling or grounding between the connector and the semiconductor device is possible.
(A) 양 말단에 히드록실기를 포함하는 폴리디메틸실록산(A) polydimethylsiloxane containing hydroxyl groups at both ends
본 발명의 일 실시예에서, 상기 양 말단에 히드록실기를 포함하는 폴리디메틸실록산은 조성물의 총 중량에 대하여 10 중량% 이상 50 중량% 미만으로 포함될 수 있다. In one embodiment of the present invention, the polydimethylsiloxane containing hydroxyl groups at both ends may be included in an amount of 10% by weight or more and less than 50% by weight based on the total weight of the composition.
상기 양 말단에 히드록실기를 포함하는 폴리디메틸실록산이 50 중량% 이상 함유될 경우 가교밀도가 너무 높아져서 초연질 특성을 부여할 수 없으며, 10 중량% 미만일 경우 가교 정도가 미흡하고 가소제가 용출되어 주변 디바이스들에 심각한 결함을 유발 할 수 있다.When 50% by weight or more of polydimethylsiloxane containing a hydroxyl group is contained at both ends, the crosslinking density becomes too high to impart ultra-soft properties, and when it is less than 10% by weight, the degree of crosslinking is insufficient and the plasticizer is eluted to It can cause serious defects in devices.
본 발명의 일 실시예에서, 상기 양 말단에 히드록실기를 포함하는 폴리디메틸실록산은 평균분자량이 3,000g/mol 내지 140,000g/mol일 수 있다.In one embodiment of the present invention, the polydimethylsiloxane containing hydroxyl groups at both ends may have an average molecular weight of 3,000 g/mol to 140,000 g/mol.
상기 양 말단에 히드록실기를 포함하는 폴리디메틸실록산의 평균분자량이 3,000g/mol 미만일 경우 중합에 참여하는 중합체의 사슬 길이가 너무 짧아 가교 정도가 미흡하거나 가소제의 용출이 유발되고 모듈러스가 상승할 수 있으며, 140,000g/mol을 초과할 경우 양 말단에 히드록실기를 포함하는 폴리디메틸실록산을 전체 조성의 50 중량% 이상으로 함유하여도 초연질 특성을 나타낼 수 있으나 코팅액의 점도가 너무 높아져서 도포 시 취급이 힘들어 컨포멀 코팅제로서 사용하기 어렵다.When the average molecular weight of the polydimethylsiloxane containing hydroxyl groups at both ends is less than 3,000 g/mol, the chain length of the polymer participating in the polymerization is too short and the degree of crosslinking is insufficient or Elution of the plasticizer may be induced and the modulus may increase, and when it exceeds 140,000 g/mol, even when polydimethylsiloxane containing hydroxyl groups at both ends is contained at 50% by weight or more of the total composition, super-soft properties are exhibited. However, since the viscosity of the coating solution is too high, handling is difficult during application, making it difficult to use as a conformal coating agent.
일례로, 상기 양 말단에 히드록실기를 포함하는 폴리디메틸실록산은 약 300,000cSt 이하, 구체적으로 약 200,000 cSt 이하, 보다 구체적으로 약 150,000cSt 이하, 가장 구체적으로 약 100,000 cSt 이하의 점도를 가질 수 있으며, 여기서 각 범위의 하한은 1 cSt 또는 5 cSt 처럼 0 보다 크다.For example, the polydimethylsiloxane containing hydroxyl groups at both ends may have a viscosity of about 300,000 cSt or less, specifically about 200,000 cSt or less, more specifically about 150,000 cSt or less, and most specifically about 100,000 cSt or less, , where the lower limit of each range is greater than zero, such as 1 cSt or 5 cSt.
(B) 가소제로서 폴리디메틸실록산(B) polydimethylsiloxane as plasticizer
본 발명의 조성물은 초연질 특성을 원활하게 부여하기 위하여 가소제로서 폴리디메틸실록산을 포함한다. 가소제로서 폴리디메틸실록산을 포함시키는 이유는 경화 반응에 참여하는 타 원료와의 상용성을 위함이나, 가교반응에 참여하지 않는 모든 화학물질들은 전부 사용이 가능하다.The composition of the present invention includes polydimethylsiloxane as a plasticizer to smoothly impart ultra-soft properties. The reason for including polydimethylsiloxane as a plasticizer is for compatibility with other raw materials participating in the curing reaction, but all chemicals that do not participate in the crosslinking reaction can be used.
상기 폴리디메틸실록산의 평균분자량이 1,000g/mol 미만일 경우 원료의 휘발분에 의해 코팅 후 주변 디바이스들에 악영향을 줄 수 있으며, 140,000g/mol을 초과할 경우 코팅액의 점도가 너무 높아져서 도포 시 취급이 힘들고 토출성이 좋지 않아 코팅제로서 사용할 수 없다.If the average molecular weight of the polydimethylsiloxane is less than 1,000 g / mol, volatile matter of the raw material may adversely affect peripheral devices after coating, and if it exceeds 140,000 g / mol, the viscosity of the coating solution becomes too high, making it difficult to handle during application It cannot be used as a coating agent due to poor ejection properties.
본 발명의 일 실시예에서, 상기 가소제로서 폴리디메틸실록산은 조성물의 총 중량에 대하여 30 중량% 초과 90 중량% 미만으로 포함될 수 있다.In one embodiment of the present invention, polydimethylsiloxane as the plasticizer may be included in more than 30% by weight and less than 90% by weight based on the total weight of the composition.
가소제로서 폴리디메틸실록산이 조성물의 총 중량에 대하여 30 중량% 이하로 포함될 경우 가교밀도가 너무 높아져 초연질 특성을 가질 수 없으며, 90 중량% 이상으로 포함될 경우 경화 후 가소제의 용출 및 반액상 상태로 인해 코팅제 역할을 할 수 없는 문제가 발생할 수 있다.When the polydimethylsiloxane as a plasticizer is included in an amount of 30% by weight or less based on the total weight of the composition, the crosslinking density is too high to have super-soft properties, and when it is included in an amount of 90% by weight or more, the plasticizer is dissolved after curing and in a semi-liquid state. A problem that cannot function as a coating agent may occur.
가소제로서 함유되는 폴리디메틸실록산의 평균분자량은 코팅제에 적합한 점도를 부여하게 하는 한도 내에서 조절된다. 평균분자량이 적을수록 경화 후 태키(Tacky)가 감소되어 매끄러운 표면상태를 얻을 수 있다.The average molecular weight of the polydimethylsiloxane contained as a plasticizer is controlled within the limit to impart suitable viscosity to the coating agent. The smaller the average molecular weight, the less tacky after curing, resulting in a smooth surface state.
(C) 가교제(C) crosslinking agent
본 발명의 일 실시예에서, 상기 가교제는 옥심형, 알코올형, 초산형, 아세톤형 실란커플링제 등일 수 있다.In one embodiment of the present invention, the crosslinking agent may be an oxime type, alcohol type, acetic acid type, or acetone type silane coupling agent.
바람직하게는, 상기 가교제는 메틸트리스메틸에틸케톡심실란, 바이닐트리스메틸에틸케톡심실란 및 테트라메틸에틸케톡심실란으로 이루어진 군으로부터 선택되는 1종 또는 2종 이상의 혼합물일 수 있으나, 이에 제한되지 않고 모든 실란커플링제들을 사용할 수 있다. Preferably, the crosslinking agent may be one or a mixture of two or more selected from the group consisting of methyltrismethylethylketoximsilane, vinyltrismethylethylketoximsilane, and tetramethylethylketoximsilane, but is not limited thereto, and all silane couples Ring agents may be used.
상기 가교제는 조성물의 총 중량에 대하여 1 내지 10 중량% 이하로 포함될 수 있다.The crosslinking agent may be included in an amount of 1 to 10% by weight or less based on the total weight of the composition.
가교제의 함량이 10 중량%를 초과할 경우 기존 실록산베이스의 폴리머들과의 상용성 차이로 인해 백탁현상이 발생할 수 있고, 가교밀도가 너무 높아져서 모듈러스가 너무 높아질 수 있으며, 1 중량% 미만일 경우 가교밀도가 너무 낮아 반액상 혹은 겔(Gel) 상이 되어 형태를 유지할 수 없거나 경화 후 오랜 시간이 경과되었을 시 가소제가 용출 될 수 있다.If the content of the crosslinking agent exceeds 10% by weight, cloudiness may occur due to differences in compatibility with existing siloxane-based polymers, and the crosslinking density may become too high, resulting in too high modulus. The plasticizer may be eluted when the shape cannot be maintained due to too low a semi-liquid or gel state, or when a long time has elapsed after curing.
(D) 촉매(D) Catalyst
본 발명의 초연질 습기경화형 내수코팅제 조성물은 촉매와 수분에 의한 가수분해 축합반응에 의해 경화된다.The ultra-soft moisture-curable water-resistant coating composition of the present invention is cured by a hydrolytic condensation reaction between a catalyst and moisture.
따라서, 본 발명의 조성물은 실리콘 중합체, 가소제, 가교제 및 수분의 존재 하에 조성물의 습기경화를 개시하는 습기경화 촉매를 포함한다.Accordingly, the composition of the present invention includes a silicone polymer, a plasticizer, a crosslinking agent, and a moisture cure catalyst that initiates moisture cure of the composition in the presence of moisture.
가교결합 반응은 축합 반응으로써, 수분 반응성 성분들 간의 Si-O-Si 공유 결합을 통하여 가교결합된 네트워크의 생성물로 이어진다.The cross-linking reaction is a condensation reaction, leading to the product of a cross-linked network through Si-O-Si covalent bonds between water-reactive components.
본 발명의 습기경화형 내수코팅제 조성물에 사용되는 습기경화 촉매에는 습기경화를 촉매 촉진하여 용이하게 하는 데에 유용한 것으로 관련 기술분야 통상의 기술자에게 알려져 있는 것들이 포함된다. 촉매는 금속 및 비-금속 촉매일 수 있다. 본 발명에 유용한 금속 촉매의 예에는 주석, 티타늄, 아연, 지르코늄, 납, 철, 코발트, 안티모니, 망가니즈 및 비스무트 유기금속 화합물들이 포함된다. 바람직하게는 유기주석계 촉매를 사용할 수 있으나 실리콘 가수분해 축합반응을 유도하는 것이기만 하면 이에 제한되지 않고 사용가능하다.Moisture-curing catalysts used in the moisture-curing water-resistant coating composition of the present invention include those known to those skilled in the art as being useful for catalytically promoting and facilitating moisture-curing. Catalysts can be metal and non-metallic catalysts. Examples of metal catalysts useful in the present invention include organometallic compounds of tin, titanium, zinc, zirconium, lead, iron, cobalt, antimony, manganese and bismuth. Preferably, an organotin-based catalyst can be used, but it is not limited thereto and can be used as long as it induces a silicon hydrolysis condensation reaction.
일 실시양태에서, 실리콘 조성물의 습기경화를 촉진하는 데에 유용한 습기경화 촉매는 디부틸주석 디라우레이트, 디메틸디네오데카노에이트주석, 디옥틸주석 디데실메르캅티드, 디부틸주석디아세테이트, 디부틸주석디메톡시드, 주석옥토에이트, 이소부틸주석트리세로에이트, 디부틸주석옥시드, 가용화된 디부틸 주석 옥시드, 디부틸주석 비스디이소옥틸프탈레이트, 비스-트리프로폭시실릴 디옥틸주석, 디부틸주석 비스-아세틸아세톤, 실릴화 디부틸주석 디옥시드, 카르보메톡시페닐주석 트리스-우베레이트, 이소부틸주석 트리세로에이트, 디메틸주석 디부티레이트, 디메틸주석 디네오데카노에이트, 트리에틸주석 타르타레이트, 디부틸주석 디벤조에이트, 주석 올레에이트, 주석 나프테네이트, 부틸주석트리-2-에틸헥실헥소에이트, 주석부티레이트 또는 디옥틸주석 디데실메르캅티드일 수 있으나, 이에 제한되는 것은 아니다.In one embodiment, moisture cure catalysts useful for accelerating moisture cure of silicone compositions include dibutyltin dilaurate, dimethyldineodecanoate stannous, dioctyltin didecylmercaptide, dibutyltin diacetate, Dibutyltin dimethoxide, stannous octoate, isobutyltin triseroate, dibutyltin oxide, solubilized dibutyltin oxide, dibutyltin bisdiisooctylphthalate, bis-tripropoxysilyl dioctyltin, Dibutyltin Bis-acetylacetone, Silylated Dibutyltin Dioxide, Carbomethoxyphenyltin Tris-Uberate, Isobutyltin Triseroate, Dimethyltin Dibutyrate, Dimethyltin Dineodecanoate, Triethyltin Tar tarate, dibutyltin dibenzoate, stannous oleate, stannous naphthenate, butyltintri-2-ethylhexylhexoate, stannous butyrate, or dioctyltin didecylmercaptide, but is not limited thereto. .
바람직하게 습기경화 촉매는 디부틸주석디라우레이트일 수 있다.Preferably, the moisture curing catalyst may be dibutyltin dilaurate.
본 발명의 일 실시예에서, 상기 촉매는 조성물의 총 중량에 대하여 0.01 내지 1 중량% 이하로 포함될 수 있다. In one embodiment of the present invention, the catalyst may be included in an amount of 0.01 to 1% by weight or less based on the total weight of the composition.
본 발명의 습기경화형 내수코팅제 조성물은 점도가 300 내지 500,000 cSt 일 수 있다. 바람직하게는 300 내지 100,000 cSt일 수 있다. 보다 바람직하게는 300 내지 50,000cSt일 수 있다. The moisture-curing water-resistant coating composition of the present invention may have a viscosity of 300 to 500,000 cSt. Preferably it may be 300 to 100,000 cSt. More preferably, it may be 300 to 50,000 cSt.
본 발명의 습기경화형 내수코팅제 조성물은 상기와 같은 범위의 점도를 가짐으로써 우수한 토출성을 확보하여 원활한 공정성을 가질 수 있다.The moisture-curable water-resistant coating composition of the present invention has a viscosity within the above range, thereby securing excellent ejection properties and having smooth processability.
상기 습기경화형 내수코팅제 조성물은 우수한 내수성과 빠르고 안정적인 습기경화특성을 가지고 있다.The moisture-curing water-resistant coating composition has excellent water resistance and fast and stable moisture-curing characteristics.
본 발명의 일 실시예에 따르면, 상기 초연질 습기경화형 내수코팅제 조성물은 15㎛ 도포 기준, 3 내지 15 분 내에 끈적임이 없는 경화시간(Tack free time)을 가질 수 있다.According to one embodiment of the present invention, the ultra-soft moisture-curing water-resistant coating composition may have a tack free time within 3 to 15 minutes based on 15 μm application.
본 발명의 조성물의 경화물은 20 내지 100gf의 외부 힘에 의해서도 변형이 발생할 수 있다. 보다 바람직하게는 20gf의 외부 힘에 의해서 변형이 발생해야 한다.The cured product of the composition of the present invention may be deformed even by an external force of 20 to 100 gf. More preferably, deformation should occur by an external force of 20 gf.
본 발명의 조성물의 경화물은 복합 모듈러스(Complex shear modulus)가 3 내지 50kPa일 수 있다. 보다 바람직하게는 3 내지 20kPa일 수 있다.The cured product of the composition of the present invention may have a complex shear modulus of 3 to 50 kPa. More preferably, it may be 3 to 20 kPa.
1mm 두께로 경화시킨 본 발명의 조성물의 복합 모듈러스(Complex Shear Modulus)가 20kPa 이하가 되어야만, 20gf의 매우 낮은 압력으로도 관통되어 커넥터와 반도체 디바이스 간에 접지가 이루어질 수 있다. 복합 모듈러스(Complex Shear Modulus)가 20kPa 이상일 경우, 코팅제의 경화 형태에 변형을 가하기 위해서는 더욱 큰 힘을 필요로 하므로 커넥터와 반도체 디바이스간에 접지가 용이하지 않고, 더욱 나아가서는 접지불량을 초래할 수 있다. 또한 복합 모듈러스가 3kPa 이하 일 경우, 고상의 형태가 아닌 겔상에 가까워 용출의 우려가 높다.of the composition of the present invention cured to a thickness of 1 mm. When the complex shear modulus is 20 kPa or less, it can be penetrated even with a very low pressure of 20 gf and grounded between the connector and the semiconductor device. If the complex shear modulus is 20 kPa or more, a larger force is required to deform the cured form of the coating agent, so grounding between the connector and the semiconductor device is not easy, and furthermore, grounding failure may occur. In addition, when the complex modulus is 3 kPa or less, there is a high risk of dissolution because it is close to a gel phase rather than a solid phase.
복합 모듈러스는 본 발명의 조성물에 포함되는 양 말단에 히드록실기를 포함하는 폴리디메틸실록산에서 히드록실기의 비율을 조절하거나 가소제로서 폴리디메틸실록산의 비율을 조절하는 방식으로 조절할 수 있다. 만약, 양 말단에 히드록실기를 포함하는 폴리디메틸실록산에서 히드록실기의 비율이 높거나 가소제로서 폴리디메틸실록산의 비율이 적을 경우, 경화물의 복합 모듈러스가 높아지기 때문에 경화된 조성물에 변형을 발생시키기 위해 보다 더 큰 힘을 필요로 한다.The composite modulus can be adjusted by adjusting the ratio of hydroxyl groups in the polydimethylsiloxane containing hydroxyl groups at both ends included in the composition of the present invention or by adjusting the ratio of polydimethylsiloxane as a plasticizer. If the ratio of hydroxyl groups in polydimethylsiloxane containing hydroxyl groups at both ends is high or the ratio of polydimethylsiloxane as a plasticizer is low, the complex modulus of the cured product increases, so that the cured composition is deformed. requires more power than
또한, 본 발명은 상기 조성물을 포함하는 초연질 습기경화형 내수코팅제를 제공한다.In addition, the present invention provides an ultra-soft moisture-curing water-resistant coating agent comprising the composition.
상기 초연질 습기경화형 내수코팅제에 칙소성을 부여하기 위해서는 무기필러를 더 포함할 수 있다.An inorganic filler may be further included to impart thixotropic properties to the ultra-soft moisture-curable water-resistant coating agent.
또한, 코팅 후 도포상태를 용이하게 확인하기 위해 염료, 안료 및 형광체를 포함 할 수 있으며, 접착력부여제로서 기재와의 분자간 인력 혹은 화학적 결합을 유도 할 수 있는 실란커플링제를 사용할 수 있다.In addition, dyes, pigments, and phosphors may be included to easily check the application state after coating, and a silane coupling agent capable of inducing intermolecular attraction or chemical bonding with the substrate may be used as an adhesive force imparting agent.
또한, 본 발명은 상기 초연질 습기경화형 내수코팅제로 코팅된 인쇄회로기판 어셈블리를 제공한다.In addition, the present invention provides a printed circuit board assembly coated with the ultra-soft moisture-curing water-resistant coating agent.
일례로, 상기 인쇄회로기판 어셈블리(printed circuit board assembly)는 복수의 전자 부품;과, 상기 복수의 전자 부품이 실장되는 인쇄회로기판;과, 상기 인쇄회로기판 전체를 덮는 보호체;와, 일단이 상기 보호체의 외부로 노출되어, 상기 인쇄회로기판이 서브 기판과 전기적으로 연결될 수 있도록 구성된 연결 유닛;을 포함하는 것일 수 있다.For example, the printed circuit board assembly includes a plurality of electronic components; a printed circuit board on which the plurality of electronic components are mounted; and a protective body covering the entire printed circuit board; and one end It may include a connection unit exposed to the outside of the protective body and configured to electrically connect the printed circuit board to the sub-board.
상기 인쇄회로기판 어셈블리는 반도체 디바이스 체결 시 20 내지 100gf의 외부 힘에 의해 커넥터가 체결되어 반도체 디바이스와 인쇄회로기판 간의 통전이 이루어질 수 있다.When the semiconductor device is coupled to the printed circuit board assembly, the connector is coupled by an external force of 20 gf to 100 gf, so that the semiconductor device and the printed circuit board can be energized.
이하, 본 발명의 실시예와 비교예를 통하여 더욱 상세하게 설명한다. 이들 실시예는 오로지 본 발명을 보다 구체적으로 설명하기 위해 예시적으로 제시한 것일 뿐, 본 발명의 범위가 이들 실시예에 의해 제한되지 않는다는 것은 당 업계에서 통상의 지식을 가지는 자에 있어서 자명할 것이다.Hereinafter, it will be described in more detail through Examples and Comparative Examples of the present invention. These examples are only presented as an example to explain the present invention in more detail, and it will be apparent to those skilled in the art that the scope of the present invention is not limited by these examples. .
<실시예 1><Example 1>
반응기에 양 말단에 히드록실기를 포함하는 폴리디메틸실록산(평균분자량 100,000g/mol, 45,000g/mol, 5,000g/mol의 혼합물, 구입처: 루미넥스) 20 중량%, 가소제로서 폴리디메틸실록산(평균분자량 15,000g/mol, 30,000g/mol의 혼합물)(구입처: 루미넥스) 70 중량%, 가교제로서 메틸트리스메틸에틸케톡심실란(구입처: 서광케미칼), 바이닐트리스메틸에틸케톡심실란(구입처: 서광케미칼), 테트라메틸에틸케톡심실란(구입처: 서광케미칼)의 혼합물 4 중량%, 촉매로서 디부틸틴디라우레이트(구입처:Tokyo Chemical Industry Co., Ltd.) 0.1 중량%, 기타 첨가제 5.9 중량%를 넣고 교반하여 조성물을 제조하였다.In the reactor, 20% by weight of polydimethylsiloxane containing hydroxyl groups at both ends (a mixture of average molecular weights of 100,000 g/mol, 45,000 g/mol, and 5,000 g/mol, from Luminex), polydimethylsiloxane as a plasticizer (average A mixture of molecular weights of 15,000 g/mol and 30,000 g/mol) (Purchased by Luminex) 70% by weight, methyltrismethylethylketoximsilane as a cross-linking agent (Purchased by Seokwang Chemical), vinyltrismethylethylketoximsilane (Purchased by Seokwang Chemical) , 4% by weight of a mixture of tetramethylethylketoximsilane (purchased by Seokwang Chemical), 0.1% by weight of dibutyltin dilaurate (purchased by: Tokyo Chemical Industry Co., Ltd.) as a catalyst, and 5.9% by weight of other additives were added and stirred. A composition was prepared.
<실시예 2><Example 2>
반응기에 양 말단에 히드록실기를 포함하는 폴리디메틸실록산(평균분자량: 120,000g/mol)(구입처: 루미넥스) 15 중량%, 가소제로서 폴리디메틸실록산(평균분자량: 1,500g/mol)(구입처: 루미넥스) 75 중량%, 가교제로서 메틸트리스메틸에틸케톡심실란, 바이닐트리스메틸에틸케톡심실란, 테트라메틸에틸케톡심실란의 혼합물(구입처: 서광케미칼) 4 중량%, 촉매로서 디부틸틴디라우레이트(구입처:Tokyo Chemical Industry Co., Ltd.) 0.1 중량%, 기타 첨가제 5.9 중량%를 넣고 교반하여 조성물을 제조하였다.Polydimethylsiloxane (average molecular weight: 120,000 g/mol) containing hydroxyl groups at both ends of the reactor (purchase: Luminex) 15% by weight, polydimethylsiloxane (average molecular weight: 1,500 g/mol) (purchase: Luminex) as a plasticizer Luminex) 75% by weight, 4% by weight of a mixture of methyltrismethylethylketoximsilane, vinyltrismethylethylketoximsilane, and tetramethylethylketoximsilane as a crosslinking agent (Purchased by Seokwang Chemical), and dibutyltindilaurate as a catalyst (Purchased by: Tokyo Chemical Industry Co., Ltd.) 0.1% by weight and 5.9% by weight of other additives were added and stirred to prepare a composition.
<실시예 3><Example 3>
반응기에 양 말단에 히드록실기를 포함하는 폴리디메틸실록산(평균분자량: 6,000g/mol)(구입처: 루미넥스) 30 중량%, 가소제로서 폴리디메틸실록산(평균분자량: 30,000g/mol)(구입처: 루미넥스) 60 중량%, 가교제로서 메틸트리스메틸에틸케톡심실란(구입처: 서광케미칼), 바이닐트리스메틸에틸케톡심실란(구입처: 서광케미칼), 테트라메틸에틸케톡심실란(구입처: 서광케미칼)의 혼합물 4 중량%, 촉매로서 디부틸틴디라우레이트(구입처:Tokyo Chemical Industry Co., Ltd.) 0.1 중량%, 기타 첨가제 5.9 중량%를 넣고 교반하여 조성물을 제조하였다.Polydimethylsiloxane (average molecular weight: 6,000 g/mol) containing hydroxyl groups at both ends of the reactor (purchase: Luminex) 30% by weight, polydimethylsiloxane (average molecular weight: 30,000 g/mol) (purchase: Luminex) as a plasticizer Luminex) 60% by weight, 4 weight mixture of methyltrismethylethylketoximsilane (purchase: Seokwang Chemical), vinyltrismethylethylketoximsilane (purchase: Seokwang Chemical), tetramethylethylketoximsilane (purchase: Seokwang Chemical) as a crosslinking agent %, 0.1% by weight of dibutyltin dilaurate (purchased from: Tokyo Chemical Industry Co., Ltd.) as a catalyst, and 5.9% by weight of other additives were added and stirred to prepare a composition.
<비교예 1><Comparative Example 1>
평균분자량이 2,000g/mol인 양 말단에 히드록실기를 포함하는 폴리디메틸실록산을 사용한 것을 제외하고는 실시예 1과 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 1, except that polydimethylsiloxane containing hydroxyl groups at both ends having an average molecular weight of 2,000 g/mol was used.
<비교예 1-1><Comparative Example 1-1>
평균분자량이 3,500g/mol인 양 말단에 히드록실기를 포함하는 폴리디메틸실록산을 55 중량%로 사용하고, 가소제의 함량이 35 중량%인 것을 제외하고는 실시예 1과 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 1 except that 55% by weight of polydimethylsiloxane having an average molecular weight of 3,500 g / mol and having hydroxyl groups at both ends was used, and the content of the plasticizer was 35% by weight. .
<비교예 1-2><Comparative Example 1-2>
평균분자량이 3,500g/mol인 양 말단에 히드록실기를 포함하는 폴리디메틸실록산을 5 중량%로 사용하고, 가소제의 함량이 85 중량%인 것을 제외하고는 실시예 1과 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 1, except that 5% by weight of polydimethylsiloxane having an average molecular weight of 3,500 g / mol and having hydroxyl groups at both ends was used, and the content of the plasticizer was 85% by weight. .
<비교예 2><Comparative Example 2>
평균분자량이 150,000g/mol인 양 말단에 히드록실기를 포함하는 폴리디메틸실록산을 사용한 것을 제외하고는 실시예 1과 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 1, except that polydimethylsiloxane containing hydroxyl groups at both ends having an average molecular weight of 150,000 g/mol was used.
<비교예 2-1><Comparative Example 2-1>
평균분자량이 150,000g/mol인 양 말단에 히드록실기를 포함하는 폴리디메틸실록산을 55 중량%로 사용하고, 가소제의 함량이 35 중량%인 것을 제외하고는 실시예 1과 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 1, except that 55% by weight of polydimethylsiloxane having an average molecular weight of 150,000 g/mol and having hydroxyl groups at both ends was used, and the content of the plasticizer was 35% by weight. .
<비교예 2-2><Comparative Example 2-2>
평균분자량이 150,000g/mol인 양 말단에 히드록실기를 포함하는 폴리디메틸실록산을 5 중량%로 사용하고, 가소제의 함량이 85 중량%인 것을 제외하고는 실시예 1과 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 1, except that 5% by weight of polydimethylsiloxane having an average molecular weight of 150,000 g/mol and having hydroxyl groups at both ends was used, and the content of the plasticizer was 85% by weight. .
<비교예 3><Comparative Example 3>
평균분자량 700g/mol인 폴리디메틸실록산을 사용한 것을 제외하고는 실시예 1과 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 1, except that polydimethylsiloxane having an average molecular weight of 700 g/mol was used.
<비교예 3-1><Comparative Example 3-1>
평균분자량이 1,250g/mol인 폴리디메틸실록산을 93 중량%로 사용하고, 양 말단에 히드록실기를 포함하는 폴리디메틸실록산을 3 중량%로 사용한 것을 제외하고는 실시예 1과 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 1, except that 93% by weight of polydimethylsiloxane having an average molecular weight of 1,250 g / mol and 3% by weight of polydimethylsiloxane containing hydroxyl groups at both ends was used. did
<비교예 3-2><Comparative Example 3-2>
평균분자량이 1,250g/mol인 폴리디메틸실록산을 25 중량%로 사용하고, 양 말단에 히드록실기를 포함하는 폴리디메틸실록산을 65 중량%로 사용한 것을 제외하고는 실시예 1과 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 1, except that 25% by weight of polydimethylsiloxane having an average molecular weight of 1,250 g / mol and 65% by weight of polydimethylsiloxane containing hydroxyl groups at both ends were used. did
<비교예 4><Comparative Example 4>
평균분자량이 150,000g/mol인 폴리디메틸실록산을 사용한 것을 제외하고는 실시예 1과 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 1, except that polydimethylsiloxane having an average molecular weight of 150,000 g/mol was used.
<비교예 4-1><Comparative Example 4-1>
평균분자량이 150,000g/mol인 폴리디메틸실록산을 93 중량%로 사용하고, 양 말단에 히드록실기를 포함하는 폴리디메틸실록산을 3 중량%로 사용한 것을 제외하고는 실시예 1과 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 1, except that 93% by weight of polydimethylsiloxane having an average molecular weight of 150,000 g / mol and 3% by weight of polydimethylsiloxane containing hydroxyl groups at both ends was used. did
<비교예 4-2><Comparative Example 4-2>
평균분자량이 150,000g/mol인 폴리디메틸실록산을 25 중량%로 사용하고, 양 말단에 히드록실기를 포함하는 폴리디메틸실록산을 65 중량%로 사용한 것을 제외하고는 실시예 1과 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 1, except that 25% by weight of polydimethylsiloxane having an average molecular weight of 150,000 g / mol and 65% by weight of polydimethylsiloxane containing hydroxyl groups at both ends was used. did
<비교예 5><Comparative Example 5>
가교제를 15 중량%로 사용하고, 가소제로서 폴리디메틸실록산을 59 중량%로 사용한 것을 제외하고는 실시예 1과 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 1, except that 15% by weight of the crosslinking agent and 59% by weight of polydimethylsiloxane were used as the plasticizer.
<비교예 6><Comparative Example 6>
가교제를 0.5 중량%로 사용하고, 가소제로서 폴리디메틸실록산을 73.5 중량%로 사용한 것을 제외하고는 실시예 1과 동일하게 조성물을 제조하였다.A composition was prepared in the same manner as in Example 1, except that 0.5% by weight of the crosslinking agent and 73.5% by weight of polydimethylsiloxane were used as the plasticizer.
실시예 1 내지 3, 및 비교예 1 내지 6의 조성을 요약하여 하기 표 1에 나타내었다.The compositions of Examples 1 to 3 and Comparative Examples 1 to 6 are summarized in Table 1 below.
(B)
30,00015,000;
30,000
30,00015,000;
30,000
30,00015,000;
30,000
30,00015,000;
30,000
30,00015,000;
30,000
30,00015,000;
30,000
<실험예 1> : 통전테스트<Experimental Example 1>: energization test
실시예 1 내지 3, 및 비교예 1 내지 6의 시료를 상대온도 25℃, 상대습도 50%에서 500um의 두께로 24시간 동안 경화시킨 후 20 gf의 pin 압력으로 통전테스트(SEMI 테스트)를 진행하였다. 그 결과를 하기 표 2에 나타내었다.The samples of Examples 1 to 3 and Comparative Examples 1 to 6 were cured for 24 hours at a relative temperature of 25° C. and a relative humidity of 50% to a thickness of 500 μm, and then a conduction test (SEMI test) was conducted with a pin pressure of 20 gf. . The results are shown in Table 2 below.
<실험예 2> : 모듈러스 측정<Experimental Example 2>: Modulus measurement
실시예 1 내지 3, 및 비교예 1 내지 6의 시료를 두께 1mm로 경화시켜, 취득한 경화물에 대해 모듈러스 측정(측정기기: 안톤파사 MCR-702 레오미터)을 시험규격 : ISO-6721-10로 진행하여 최대값을 확인하였다. 그 결과를 하기 표 2에 나타내었다.The samples of Examples 1 to 3 and Comparative Examples 1 to 6 were cured to a thickness of 1 mm, and the obtained cured products were measured for modulus (measuring device: Antonfasa MCR-702 rheometer) according to the test standard: ISO-6721-10. Proceed to confirm the maximum value. The results are shown in Table 2 below.
<실험예 3> : 내수성 측정<Experimental Example 3>: Measurement of water resistance
실시예 1 내지 3, 및 비교예 1 내지 6의 시료를 0.318mm 간격으로 동도금된 인쇄회로기판에 15um 두께로 코팅 및 경화 시킨 후, 내수성을 측정하기 위해 물에 담가 1시간동안 누설전류 테스트(측정기기:DC power supply & Multimeter)를 진행하였다. 그 결과를 하기 표 2에 나타내었다.Samples of Examples 1 to 3 and Comparative Examples 1 to 6 were coated and cured to a thickness of 15 μm on copper-plated printed circuit boards at intervals of 0.318 mm, and then immersed in water to measure water resistance and tested for leakage current for 1 hour (measurement Device: DC power supply & Multimeter) was performed. The results are shown in Table 2 below.
(누설전류 없음)water resistance
(No leakage current)
(cSt)viscosity
(cSt)
상기 표 2에 나타낸 바와 같이, 본 발명에 따른 실시예 1 내지 실시예 3의 시료의 경우 모듈러스가 낮아 체결성이 우수하여 통전성 및 내수성이 우수하고, 용출이 일어나지 않았다.As shown in Table 2, in the case of the samples of Examples 1 to 3 according to the present invention, the modulus was low, and the fastening property was excellent, so the conductivity and water resistance were excellent, and elution did not occur.
그러나, 비교예 1 내지 비교예 6의 경우 모듈러스가 높아 체결성이 낮아 통전성 또는 내수성이 불량하거나, 가교밀도가 너무 낮아 용출이 일어나는 문제가 발생하였다.However, in the case of Comparative Examples 1 to 6, the modulus was high and the fastening property was low, and the conductivity or water resistance was poor, or the crosslinking density was too low, causing dissolution.
또한, 평균분자량이 150,000g/mol인 폴리디메틸실록산을 사용한 비교예 4의 경우 조성물의 점도가 너무 높아 토출성(공정성)이 좋지 않아 코팅제로서 사용하기 어렵다.In addition, in the case of Comparative Example 4 using polydimethylsiloxane having an average molecular weight of 150,000 g/mol, the viscosity of the composition is too high and the ejectability (processability) is not good, making it difficult to use as a coating agent.
Claims (16)
가소제로서 폴리디메틸실록산;
가교제: 및
촉매를 포함하는 초연질 습기경화형 내수코팅제 조성물.polydimethylsiloxane containing hydroxyl groups at both ends;
polydimethylsiloxane as a plasticizer;
cross-linking agent: and
An ultra-soft moisture-curing water-resistant coating composition comprising a catalyst.
상기 양 말단에 히드록실기를 포함하는 폴리디메틸실록산은 조성물의 총 중량에 대하여 10 중량% 이상 50 중량% 미만으로 포함되는 것인 조성물.According to claim 1,
The polydimethylsiloxane containing hydroxyl groups at both ends is a composition that is included in 10% by weight or more and less than 50% by weight based on the total weight of the composition.
상기 양 말단에 히드록실기를 포함하는 폴리디메틸실록산은 평균분자량이 3,000 내지 140,000g/mol인 것인 조성물.According to claim 1,
Polydimethylsiloxane containing a hydroxyl group at both ends of the composition of the average molecular weight of 3,000 to 140,000g / mol.
상기 가소제로서 폴리디메틸실록산은 조성물의 총 중량에 대하여 30 중량% 초과 90 중량% 미만으로 포함되는 것인 조성물.According to claim 1,
Polydimethylsiloxane as the plasticizer is a composition that is contained in less than 90% by weight of more than 30% by weight based on the total weight of the composition.
상기 가소제로서 폴리디메틸실록산은 평균분자량이 1,000 내지 140,000g/mol인 것인 조성물.According to claim 1,
Polydimethylsiloxane as the plasticizer is a composition that the average molecular weight of 1,000 to 140,000g / mol.
상기 가교제는 옥심형, 알코올형, 초산형 또는 아세톤형 실란커플링제인 것인 조성물.According to claim 1,
Wherein the crosslinking agent is an oxime-type, alcohol-type, acetic acid-type or acetone-type silane coupling agent.
상기 가교제는 조성물의 총 중량에 대하여 1 내지 10 중량% 이하로 포함되는 것인 조성물.According to claim 1,
Wherein the crosslinking agent is contained in an amount of 1 to 10% by weight or less based on the total weight of the composition.
상기 촉매는 유기주석계 촉매인 것인 조성물.According to claim 1,
Wherein the catalyst is an organotin-based catalyst.
상기 촉매는 조성물의 총 중량에 대하여 0.01 내지 1 중량% 이하로 포함되는 것인 조성물.According to claim 1,
The catalyst is a composition that is contained in 0.01 to 1% by weight or less relative to the total weight of the composition.
상기 조성물은 점도가 300 내지 50,000 cSt인 것인 조성물.According to claim 1,
Wherein the composition has a viscosity of 300 to 50,000 cSt.
상기 조성물의 경화물은 20 gf의 외부 힘에 의해 변형이 발생하는 조성물.According to claim 1,
A composition in which the cured product of the composition is deformed by an external force of 20 gf.
상기 조성물의 경화물의 복합 모듈러스는 3 내지 20kPa인 조성물.According to claim 1,
The composite modulus of the cured product of the composition is 3 to 20 kPa.
상기 조성물은 15㎛ 도포 기준으로 3 내지 15 분 내에 끈적임이 없는 경화시간(Tack free time)을 가지는 조성물.According to claim 1,
The composition has a tack free time within 3 to 15 minutes based on 15㎛ application.
상기 인쇄회로기판 어셈블리는 반도체 디바이스 체결 시 20gf의 외부 힘에 의해 변형되어 반도체 디바이스와 인쇄회로기판 간의 통전이 이루어지는 인쇄회로기판 어셈블리.According to claim 15,
The printed circuit board assembly is deformed by an external force of 20 gf when the semiconductor device is fastened so that conduction between the semiconductor device and the printed circuit board is achieved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210102309A KR20230020660A (en) | 2021-08-04 | 2021-08-04 | Super soft moisture-curable water-resistant coating agent composition and super soft moisture-curable water-resistant coating agent comprising the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210102309A KR20230020660A (en) | 2021-08-04 | 2021-08-04 | Super soft moisture-curable water-resistant coating agent composition and super soft moisture-curable water-resistant coating agent comprising the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230020660A true KR20230020660A (en) | 2023-02-13 |
Family
ID=85202626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020210102309A KR20230020660A (en) | 2021-08-04 | 2021-08-04 | Super soft moisture-curable water-resistant coating agent composition and super soft moisture-curable water-resistant coating agent comprising the same |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20230020660A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100193014B1 (en) | 1990-10-18 | 1999-06-15 | Bayer Ag | A moisture-curing one-component polysiloxane composition |
-
2021
- 2021-08-04 KR KR1020210102309A patent/KR20230020660A/en active IP Right Grant
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100193014B1 (en) | 1990-10-18 | 1999-06-15 | Bayer Ag | A moisture-curing one-component polysiloxane composition |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6908682B2 (en) | Photocured silicone sealant having improved adhesion to plastic | |
| KR100863148B1 (en) | Addition-curable silicone gel composition | |
| KR20090106401A (en) | Silicone-based pressure-sensitive adhesive composition and adhesive tape | |
| CN111763469B (en) | High-strength self-leveling silane modified waterproof coating and preparation method thereof | |
| EP2878632B1 (en) | Room-temperature-curable polyorganosiloxane composition and electric/electronic apparatus | |
| CN105120643A (en) | Thermoplastic electromagnetic wave shielding film used for rapid processing | |
| CN113583626B (en) | Organic silicon gel and preparation method thereof | |
| CN112961609A (en) | Sealant capable of being cured by ultraviolet light and moisture as well as preparation method and application thereof | |
| CN101143964A (en) | Room temperature-curable organopolysiloxane composition | |
| CN103003892A (en) | Anisotropic conductive material and method for manufacturing same | |
| CN1334303A (en) | Adhesive tape for electronic component | |
| KR19990023528A (en) | Curable Resin Composition for Flexible Circuit Overcoating | |
| CN113736089A (en) | Room temperature curable silicone rubber composition and use thereof | |
| KR20230020660A (en) | Super soft moisture-curable water-resistant coating agent composition and super soft moisture-curable water-resistant coating agent comprising the same | |
| CN112251165B (en) | Special prime coat-free platinum vulcanizing agent for combination of metal substrate and silica gel and preparation method thereof | |
| KR20190018279A (en) | Silicone composite for pcb coating | |
| US20190144668A1 (en) | Curable polyurethane type resin composition and electrical device using the same | |
| KR101857308B1 (en) | Anisotropic conductive material and method for producing same | |
| KR100822730B1 (en) | Epoxy Zinc Coating Composition Having High Friction Coefficient | |
| KR20150013174A (en) | Curable resin composition and primer composition | |
| CN111154452A (en) | Optical cement | |
| KR102177260B1 (en) | Silicone adhesive composition | |
| US20140350185A1 (en) | Adhesive Composition | |
| CN102766431B (en) | High-adhesion silicone sealant | |
| JP3962940B2 (en) | Resin composition for flexible circuit overcoat |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E902 | Notification of reason for refusal | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right |