KR20230012415A - Film forming apparatus, film forming method and evaporation source unit - Google Patents

Abstract

The purpose of the present invention is to facilitate the acquisition of an evaporation source from a cover. A film forming apparatus vaporizes a deposition material to form a film on a substrate. A container forms an internal space including an accommodation space for accommodating the deposition material and a diffusion space for diffusing the vaporized deposition material. A cover member covers at least a portion of the container. The container forms an internal space on an upper surface of the accommodation space so that the diffusion space has a smaller width in the first direction than that of the accommodation space. The cover member includes a first cover that covers at least a first side wall defining a side surface of the accommodation space in the container, and a second cover that is rotatably supported by the first cover and covers a contact wall in contact with a second side wall defining at least the first side wall and a side surface of the diffusion space in the container.

Description

Film formation apparatus, film formation method and evaporation source unit {FILM FORMING APPARATUS, FILM FORMING METHOD AND EVAPORATION SOURCE UNIT}

The present invention relates to a film forming apparatus, a film forming method, and an evaporation source unit.

In the manufacture of an organic EL display or the like, a thin film is formed on a substrate by adhering the evaporation material released to the evaporation source to the substrate. Patent Literature 1 discloses that, as a configuration of an evaporation source, an accommodating portion accommodating a deposition material and a diffusion portion in which the vaporized deposition material diffuses are provided. Further, Patent Literature 1 discloses that the width of the diffusion section is narrower than the width of the accommodating section.

Patent Document 1: Japanese Unexamined Patent Publication No. 2018-003122

By the way, in a film forming apparatus, the deposition source may be covered with a cover or the like. It is preferable that the deposition source can be easily taken out from the cover or the like from the viewpoint of replenishment of deposition materials or ease of maintenance. In this respect, in the case of the evaporation source having different widths of the diffusion section and the accommodating section as in the prior art, there is room for improvement in the structure of the cover covering the evaporation source.

The present invention provides a technique for facilitating extraction of an evaporation source from a cover.

According to one aspect of the present invention,

A film forming apparatus for vaporizing a deposition material to form a film on a substrate, comprising:

A vessel forming an internal space including a receiving space for accommodating a deposition material and a diffusion space in which the vaporized deposition material is diffused;

A cover member covering at least a portion of the container,

The container forms the inner space so that the diffusion space, which is narrower in a first direction than the accommodation space, is provided on an upper surface of the accommodation space;

The cover member,

In the container, a first cover covering a first side wall defining at least a side surface of the accommodation space;

characterized in that it includes a second cover that is rotatably supported by the first cover and covers, in the container, a connection wall connecting at least the first sidewall and a second sidewall defining a side surface of the diffusion space. A film forming apparatus is provided.

ADVANTAGE OF THE INVENTION According to this invention, taking out from the cover of an evaporation source can be made easy.

1 is a plan view schematically showing the configuration of a film forming apparatus according to an embodiment.
FIG. 2 is a front view schematically showing the configuration of the film forming apparatus of FIG. 1 .
3 is a perspective view schematically showing the configuration of a film formation unit.
4 is a cross-sectional view showing the internal structure of the evaporation source.
5 is an exploded view of a space forming portion and a plate-like member.
6 is a perspective view showing the configuration of an evaporation source and a cover member.
7 is a perspective view showing the configuration of an evaporation source and a cover member.
Fig. 8(A) is an overall view of the organic EL display device, and Fig. 8(B) is a diagram showing a cross-sectional structure of one pixel.
9 is a cross-sectional view for explaining the internal structure of an evaporation source according to an embodiment.
Fig. 10 is a plan view for explaining the structure of the division part of the evaporation source.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. On the other hand, the following embodiments do not limit the invention related to the claims. Although a plurality of features are described in the embodiment, not all of these plurality of features are essential to the invention, and a plurality of features may be combined arbitrarily. In addition, in the accompanying drawings, the same reference numerals are given to the same or similar structures, and redundant explanations are omitted.

<First Embodiment>

<Overview of Film Formation Equipment>

1 is a plan view schematically showing the configuration of a film forming apparatus 1 according to an embodiment. FIG. 2 is a front view schematically showing the configuration of the film forming apparatus 1 of FIG. 1 . Meanwhile, in each figure, arrows X and Y indicate horizontal directions orthogonal to each other, and arrow Z indicates a vertical direction (vertical direction). In addition, in each drawing, in order to make drawing easy to see, some codes may be abbreviate|omitted.

The film forming apparatus 1 performs film formation by adhering the vaporized deposition material to a substrate. In this embodiment, the film forming apparatus 1 deposits while moving the evaporation source. The film forming apparatus 1 is used, for example, for manufacture of a display panel of an organic EL display device for smartphones, and a plurality of units are arranged side by side to constitute the production line. As the material of the substrate on which vapor deposition is performed in the film forming apparatus 1, glass, resin, metal, or the like can be appropriately selected, and a resin layer formed on glass such as polyimide is preferably used. As the deposition material, organic materials, inorganic materials (metals, metal oxides, etc.) and the like are used. The film forming apparatus 1 can be applied to, for example, electronic devices such as display devices (flat panel displays, etc.), thin-film solar cells, organic photoelectric conversion elements (organic thin-film imaging elements), manufacturing apparatuses for manufacturing optical members, etc. And, in particular, it is applicable to a manufacturing apparatus for manufacturing an organic EL panel. Further, in the present embodiment, the film forming apparatus 1 forms a film on a glass substrate (1100 mm x 2500 mm, 1250 mm x 2200 mm) of G8H size, but the size of the substrate on which the film forming apparatus 1 performs film formation can be set appropriately. .

The film formation apparatus 1 includes a film formation unit 10 (evaporation source unit), a moving unit 20, and a plurality of support units 30A and 30B (hereafter referred to as the support unit 30 when these are collectively referred to as The same applies to these components, etc.) are provided. The film formation unit 10, the moving unit 20, and the support unit 30 are disposed inside the chamber 45 maintained in a vacuum during use. In this embodiment, a plurality of support units 30A and 30B are installed at an upper part in the chamber 45 at a distance in the Y direction, and a film forming unit 10 and a moving unit 20 are installed below them. Further, the chamber 45 is provided with a plurality of substrate loading inlets 44A and 44B for loading and unloading the substrates 100 . On the other hand, in the present embodiment, "vacuum" refers to a state filled with gas at a pressure lower than atmospheric pressure, in other words, a reduced pressure state.

Further, the film forming apparatus 1 includes a power source 41 that supplies power to the film forming unit 10 and an electrical connector 42 that electrically connects the film forming unit 10 and the power source 41 . The electrical connector 42 is configured by passing electric wires through the inside of the arm moving in the horizontal direction, and as will be described later, power from the power source 41 can be supplied to the film formation unit 10 moving in the XY direction. is supposed to

In addition, the film forming apparatus 1 includes a control unit 43 that controls the operation of each component. For example, the controller 43 may include a processor represented by a CPU, memory such as RAM and ROM, and various interfaces. For example, the control unit 43 realizes various processes by the film forming apparatus 1 by reading programs stored in ROM into RAM and executing them.

<support unit>

The support unit 30 supports the substrate 100 and the mask 101 and adjusts their positions. The support unit 30 includes a substrate support unit 32 , a position adjusting unit 34 , and a mask support unit 36 .

The substrate support part 32 supports the substrate 100 . In this embodiment, the substrate support portion 32 supports the substrate 100 so that the longitudinal direction of the substrate 100 is the X direction and the short longitudinal direction of the substrate 100 is the Y direction. For example, the substrate support portion 32 may support the substrate 100 by holding the edge of the substrate 100 at a plurality of positions or the like, or adsorb the substrate 100 with an electrostatic chuck or the like to hold the substrate 100 together. ) may be supported.

The position adjusting unit 34 adjusts the positional relationship between the substrate 100 and the mask 101 . In this embodiment, the position adjusting unit 34 adjusts the positional relationship between the substrate 100 and the mask 101 by moving the substrate support unit 32 in a state in which the substrate 100 is supported. However, the positional relationship between the substrate 100 and the mask 101 may be adjusted by moving the mask 101 . The positioning unit 34 includes a fixed unit 341 fixed to the chamber 45 and a movable unit 342 that supports the substrate support unit 32 and moves with respect to the fixed unit 341 . The movable part 342 moves the substrate 100 supported by the substrate support part 32 in the X direction by moving in the X direction with respect to the fixed part 341, thereby moving the substrate 100 and the mask 101 in the X direction. Adjust the approximate positional relationship of Furthermore, the movable part 342 includes a mechanism for moving the supported substrate support part 32 in the XY direction in order to precisely position the substrate 100 and the mask 101 (alignment). As for the specific method of alignment, since a well-known technique can be adopted, detailed description is abbreviate|omitted. Further, the movable part 342 moves the substrate support part 32 in the Z direction to adjust the positional relationship between the substrate 100 and the mask 101 in the Z direction. For the movable part 342, a known technique such as a rack and pinion mechanism or a ball screw mechanism can be appropriately applied.

The mask support 36 is , supports the mask 101. In this embodiment, the mask support part 36 supports the mask 101 so that the mask 101 may be located in the center of the X direction within the chamber 45 . For example, the mask support portion 36 may support the mask 101 by holding the edges of the mask 101 at a plurality of positions.

The film forming apparatus 1 of the present embodiment is a so-called dual stage film forming apparatus 1 capable of supporting a plurality of substrates 100A and 100B by a plurality of supporting units 30A and 30B. For example, while deposition is being performed on the substrate 100A supported by the support unit 30A, alignment of the substrate 100 supported by the support unit 30B and the mask 101 can be performed, and the film formation process can run efficiently. Hereinafter, a stage on the side of the support unit 30A may be referred to as a stage A, and a stage on the side of the support unit 30B may be referred to as a stage B.

In the present embodiment, during film formation, approximately half of the substrate 100 is overlapped with the mask 101 by the support unit 30 . Therefore, a suppression plate (not shown) for suppressing deposition material from adhering to a portion of the substrate 100 that does not overlap with the mask 101 during film formation is properly installed inside the chamber 45 .

<mobile unit>

The moving unit 20 includes an X-direction moving unit 22 that moves the film forming unit 10 in the X direction and a Y-direction moving unit 24 that moves the film forming unit 10 in the Y direction.

The X-direction moving unit 22 is a component installed in the film forming unit 10, and includes a motor 221, a pinion 222 attached to a shaft member rotated by the motor 221, and a guide member 223. ). Further, the X-direction moving unit 22 includes a frame member 224 supporting the film forming unit 10, a rack 225 formed on an upper surface of the frame member 224 and engaged with the pinion 222; The guide member 223 includes a guide rail 226 that slides. The film forming unit 10 moves in the X direction along the guide rail 226 when the pinion 222 rotating by driving the motor 221 engages with the rack 225 .

The Y-direction moving part 24 includes two support members 241A and 241B extending in the Y-direction and spaced apart in the X-direction. The two support members 241A and 241B support the short side of the frame member 224 of the X-direction moving part 22 . The Y-direction moving unit 24 includes a drive mechanism such as a motor and rack and pinion mechanism (not shown), and moves the frame member 224 in the Y-direction with respect to the two support members 241A and 241B to form a film. The unit 10 is moved in the Y direction. The Y-direction moving unit 24 moves the film formation unit 10 to a position below the substrate 100A supported by the support unit 30A and to a position below the substrate 100B supported by the support unit 30B. between them in the Y direction.

<The Tabernacle Unit>

FIG. 3 is a perspective view schematically illustrating the configuration of the film forming unit 10. As shown in FIG. The film formation unit 10 has evaporation sources 12a to 12c (hereafter referred to as evaporation sources 12 when they are collectively referred to as the evaporation sources 12) arranged in the X direction with the Y direction as the longitudinal direction, do the same). Although the configuration of the evaporation source 12 will be described later, in the present embodiment, a plurality of evaporation sources 12 are installed so that a plurality of deposition materials can be vaporized and discharged with one film formation unit 10 . Further, the film forming unit 10 includes a cover member 15 and a cover member 16 covering the evaporation source 12 . In this embodiment, the cover member 15 is fixed to the support 19 of the film forming unit 10 . Details of the cover member 15 will be described later.

In addition, the film formation unit 10 includes monitoring devices 14a to 14f installed outside both sides of the evaporation sources 12a to 12c in the Y direction (hereafter referred to as monitoring devices 14 when they are collectively referred to, and their configurations). elements, etc.). The monitoring device 14 monitors the emission state of the deposition material from the evaporation source 12 . In this embodiment, the monitoring devices 14a and 14d monitor the release state of the deposition material from the evaporation source 12a, and the monitoring devices 14b and 14e monitor the release state of the deposition material from the evaporation source 12b. , monitoring devices 14c and 14f monitor the emission state of the deposition material from the evaporation source 12c. In addition, the monitoring devices 14a to 14c are housed in the case 145a, and the monitoring devices 14d to 14f are housed in the case 145b, respectively. In the cases 145a and 145b, openings are appropriately provided to allow deposition materials to enter the inside so that the deposition materials discharged from each evaporation source 12 to be monitored can reach each monitoring device 14.

The monitoring device 14 of the present embodiment includes a crystal oscillator (not shown) as a film thickness sensor inside the case 141 . The crystal vibrator is adhered with the deposition material discharged from the evaporation source 12 through an introduction portion (not shown) such as an opening formed in the case 141 . The oscillation frequency of the crystal oscillator fluctuates depending on the deposition amount of the deposition material. Therefore, the controller 43 can calculate the film thickness of the deposition material deposited on the substrate 100 by monitoring the frequency of the crystal oscillator. Since the amount of deposition material attached to the crystal oscillator per unit time has a correlation with the emission amount of deposition material from the evaporation source 12, as a result, the emission state of the deposition material from the plurality of evaporation sources 12 can be monitored.

On the other hand, in this embodiment, although two monitoring devices 14 are provided with respect to one evaporation source 12, one monitoring device 14 may be provided with respect to one evaporation source 12. In addition, the number of evaporation sources 12 and monitoring apparatus 14 can be changed suitably.

In addition, the film formation unit 10 may have a shutter (not shown) that blocks scattering of the deposition material emitted from the evaporation source 12 onto the substrate 100 . For example, the film formation unit 10 includes a shutter that blocks scattering of the deposition material discharged from the evaporation sources 12a and 12b to the substrate 100, and the substrate 100 of the deposition material discharged from the evaporation source 12c. You may have a shutter that blocks scattering to. Then, for example, after deposition is performed by the evaporation sources 12a and 12b in a state in which scattering of the deposition material from the evaporation source 12c to the substrate 100 is blocked by a shutter (not shown), a shutter (not shown) Evaporation may be performed by the evaporation source 12c in a state in which scattering of the deposition material from the evaporation sources 12a and 12b to the substrate 100 is blocked. Accordingly, when the evaporation materials emitted by the evaporation sources 12a and 12b and the evaporation materials emitted by the evaporation source 12c are different, two layers of thin films can be formed on the substrate by one film formation unit 10. In addition, when different deposition materials are discharged to the evaporation sources 12a and 12b, co-evaporation to form a mixed film on the substrate 100 becomes possible.

In this embodiment, the film formation unit 10 discharges the deposition material from the evaporation source 12 while moving in the X direction (movement direction) by the moving unit 20 to form a film on the substrate 100 . However, employment in which film formation is performed by an evaporation source fixedly disposed with respect to the substrate 100 to be conveyed is also possible.

<Evaporation source>

Next, the structure of the evaporation source 12 is demonstrated. 4 is a cross-sectional view for explaining the internal structure of the evaporation source 12. As shown in FIG. Meanwhile, in FIG. 4 , the cover member 16 is omitted and the upper cover 152 is closed.

The evaporation source 12 includes a container 121 having a space inside and a plate-shaped member 124 . The container 121 defines an internal space including an accommodation space SP1, which is a space for accommodating a deposition material, and a diffusion space SP2, which is a space in which the vaporized deposition material is diffused. Meanwhile, the space referred to here means an area partitioned by the container 121 . Even if the region is filled with a substance different from the constituent members of the container 121, such as gas or liquid, it is referred to as a space.

The container 121 includes a pair of side walls 1211 and a pair of side walls 1212 . A pair of side walls 1211 define the side surface in the Y direction of accommodation space SP1. The pair of side walls 1212 define the side of the diffusion space SP2 in the Y direction. In addition, the container 121 includes a pair of connection walls 1213. The pair of connection walls 1213 connect the pair of side walls 1211 and the pair of side walls 1212 . In detail, one of the pair of connection walls 1213 connects the pair of side walls 1211 and the pair of side walls 1212 on the +Y side. The other of the pair of connection walls 1213 connects the pair of side walls 1211 and the pair of side walls 1212 on the -Y side. Further, the pair of connection walls 1213 connect the upper ends of the pair of side walls 1211 and the lower ends of the pair of side walls 1212 . In this embodiment, since the pair of side walls 1212 are provided between the pair of side walls 1211 in the Y direction, the pair of connection walls 1213 extend from the pair of side walls 1211 in the Y direction. It is installed so as to extend to the inside of the container 121 in.

With this configuration, the container 121 forms an internal space so that a diffusion space SP2 narrower in the Y direction than the accommodation space SP1 is provided on the upper surface of the accommodation space SP1. Here, if the width of the accommodating space SP1 is widened, the accommodating capacity of the deposition material can be increased. On the other hand, if the width of the diffusion space SP2 is widened, the nozzle 122 is disposed outside in the Y direction (width direction of the substrate 100), and the nozzle 122 is disposed outside the normal direction of the deposition surface of the substrate 100. The deposition material is scattered toward the substrate 100 at an angle. In this case, there is a possibility that deposition materials may enter between the substrate 100 and the mask 101 . In the present embodiment, the deposition material is formed on the substrate 100 and the mask 101 while increasing the storage capacity of the deposition material by configuring the accommodation space SP1 to be relatively wide and the diffusion space SP2 to be relatively narrow. ) is inhibited from entering between them.

In addition, the container 121 has a bottom wall 1214 defining the bottom surface of the accommodation space SP1, an upper wall 1215 defining the upper surface of the diffusion space SP2, and a space in the X direction of the accommodation space SP1. A pair of side walls 1216 defining side surfaces and a pair of side walls 1217 defining side surfaces in the X direction of the diffusion space SP2 are included. With the structure described above, it has an inverted T-shape as a whole in the direction shown in FIG. 4 .

In the accommodation space SP1, a plurality of partition members 126 are spaced apart in the Y direction and are provided. Each boundary member 126 is installed so as to be connected to the bottom wall 1214 and the side wall 1216 . Further, each portion divided by the plurality of boundary members 126 is configured to function as a receiving portion for accommodating the deposition material, respectively. In this embodiment, five accommodating parts are formed in accommodation space SP1 by the four partition members 126 . Since the plurality of accommodating portions are installed in the accommodating space SP1, there is uneven heating of the deposition material by the heater 129 described later, and even when there is a variation in the shrinking method of the deposition material in the Y direction, the substrate 100 It is possible to suppress non-uniformity of the film formation for the . On the other hand, in this embodiment, although the some accommodating part formed in accommodating space SP1 is formed so that the size may become equal, the size of each accommodating part may differ.

In addition, a plurality of nozzles 122 are formed on the upper wall 1215 . The deposition material diffused in the diffusion space SP2 is discharged from the plurality of nozzles 122 to the substrate 100 . A plurality of nozzles 122 are provided apart from each other in the Y direction. In addition, among the plurality of nozzles 122, nozzles disposed outside the Y direction are installed such that their axial directions are inclined outward in the Y direction with respect to the Z direction. With this configuration, the deposition material can be deposited over the entire width direction of the substrate 100 .

The plate-like member 124 is a member that partitions the accommodation space SP1 and the diffusion space SP2 inside the container 121 . In this embodiment, the plate-like member 124 partitions the internal space formed by the container 121 vertically. That is, by means of the plate-like member 124, the lower space of the internal space of the container 121 serves as the accommodating space SP1, and the upper space serves as the diffusion space SP2.

Further, an opening 1241 through which the vaporized deposition material passes is formed in the plate-like member 124 . In this embodiment, when the deposition material accommodated in the accommodating space SP1 is vaporized, it passes through the opening 1241 and enters the diffusion space SP2. That is, the plate-like member 124 is configured to divide the internal space of the container 121 into a plurality of spaces, while allowing the vaporized deposition material to move between the respective spaces. In this embodiment, the plate-like member 124 is composed of one flat plate, but the shape of the plate-like member 124 and the like can be changed as appropriate.

Further, the plate-like member 124 is provided with an extension portion 125 extending from the plate-like member 124 and surrounding the opening 1241 . In this embodiment, the extension part 125 extends from the plate-shaped member 124 to the accommodating space SP1. The vaporized deposition material moving from the accommodating space SP1 to the diffusion space SP2 is rectified by the directing unit 125 . This makes it easy for the vaporized deposition material to diffuse homogeneously in the diffusion space SP2. In addition, since the extension portion 125 is provided on the plate-like member 124 that divides the inside of the container 121, it is possible to suppress the container 121 from increasing in size in the vertical direction. Specifically, in this embodiment, the upper surface of the accommodating space SP1 and the lower surface of the diffusion space SP2 are in contact with each other via the plate-like member 124 . Therefore, compared to the configuration in which the accommodation space SP1 and the diffusion space SP2 are installed at intervals, while compactly arranging the accommodation space SP1 and the diffusion space SP2 in the vertical direction, The rectified deposition material may be introduced into the diffusion space SP2.

In this embodiment, the extension part 125 has a cylindrical shape. Although the shape of the extension part 125 can be changed suitably, the extension part 125 may have, for example, a cylindrical shape with a circular shape, an elliptical shape, or a polygonal cross section of a plane perpendicular to the axial direction. Further, in the present embodiment, the directing portion 125 extends downward from the plate-like member 124, that is, toward the accommodation space SP1, but the directing portion 125 extends upward from the plate-like member 124, that is, to the diffusion space SP2. ) side may be extended. Further, the extension portion 125 may extend from the plate-like member 124 in both directions up and down. Further, in this embodiment, the portion of the edge of the plate-like member 124 forming the opening 1241 and the extended portion 125 are continuous. That is, it is configured so that the inner diameter of the opening 1241 and the hollow portion of the extension portion 125 are the same. However, a configuration in which the opening 1241 is smaller than the inner diameter of the rendering portion 125 can also be adopted. That is, the edge portion forming the opening 1241 of the plate-like member 124 may overlap the hollow portion of the extension portion 125 .

Also, the length extending from the plate-shaped member 124 of the extension portion 125 can be appropriately set. For example, the length of the extended portion 125 may be 5 to 120 mm, 10 mm to 100 mm, 15 mm to 35 mm, 20 to 30 mm, or the like. Incidentally, the length of the extension part 125 may be 25 mm. Further, for example, the length of the extension portion 125 may be set based on the positional relationship with the boundary member 126 . For example, the length of the extension section 125 may be set within a range in which the extension section 125 and the boundary member 126 do not overlap in the Z direction.

Also, the shape of the opening 1241 can be appropriately changed as in the case of the rendering portion 125, and may be a circular shape, an elliptical shape, or a polygonal shape. Further, the shape of the opening 1241 may be set based on the relationship between the lengths of the X direction (moving direction of the substrate 100) and the Y direction (the width direction of the substrate 100). For example, when the length of the opening 1241 in the X direction is a and the length in the Y direction is b, the shape of the opening 1241 may be set such that length a<length b. That is, the shape of the opening 1241 may be set to be long in the Y direction. In this case, the amount of the deposition material moving from the accommodation space SP1 to the diffusion space SP2 can be stabilized. On the other hand, the shape of the opening 1241 may be set such that length a > length b. That is, the shape of the opening 1241 may be set to be long in the X direction. In this case, nonuniformity in film formation in the Y direction can be suppressed.

In this embodiment, the opening 1241 is provided between the plurality of partition members 126 in the Y direction. That is, the boundary member 126 is installed avoiding the direct lower part of the opening 1241 . As a result, the uniformity of film formation on the substrate 100 can be improved. Incidentally, with the opening 1241 as the center, the internal configuration of the container 121 may be configured symmetrically in the direction shown in FIG. 4 . As a result, the uniformity of film formation on the substrate 100 can be improved.

As described above, the container 121 is covered with the cover member 15 . Although the cover member 15 will be described later, in this embodiment, between the cover member 15 composed of the lower cover 151 and the upper cover 152 and the container 121, a heater for heating the deposition material (129) is installed. In detail, a heater 129 is installed between the lower cover 151 and the side wall 1211 , the bottom wall 1214 , and the side wall 1216 . A heater 129 is also installed between the upper cover 152 and the side wall 1212 . As the heater 129, a known technique can be employed as appropriate, but, for example, the heater 129 may be configured by embedding a heating wire in a metal plate. In this embodiment, the heaters 129 are attached to respective wall portions of the vessel 121, respectively. On the other hand, about the arrangement|positioning of the heater 129, it can change suitably. As in the present embodiment, a heater 129 may be provided so as to be able to heat both the wall portion forming the accommodating space SP1 and the wall portion forming the diffusion space SP2, and the heater 129 capable of heating one of these wall portions. ) may be installed.

Moreover, in this embodiment, the cooling piping 154 which cools the cover member 15 is provided in the inside of the cover member 15. The piping 154 for cooling is a piping through which cooling water can pass, and is connected to the heat radiation part not shown. Cooling water circulates between the piping 154 for cooling and a heat radiation part, absorbs heat of the cover member 15 when passing through the piping 154 for cooling, and dissipates the heat absorbed by the heat radiation part. The evaporation material emitted from the evaporation source 12, in other words, the organic material, is affected by heat, and there is a possibility that the luminescence characteristics may change. Therefore, by suppressing the heat dissipation of the heater 129 to the outside of the cover member 15 by the cooling pipe 154, the effect of the heat of the evaporation source 12 on the properties of the deposition material can be reduced. there is. Meanwhile, in FIG. 4 , the cooling pipe 154 is installed only inside the lower cover 151, but the cooling pipe 154 may be installed inside the upper cover 152 as well.

5 is an exploded view for explaining the structure of the container 121 and the plate-like member 124. As shown in FIG. In this embodiment, the container 121 is comprised so that it is separable into the lower part 121a and the upper part 121b. Further, the plate-like member 124 is installed separately from the lower part 121a and the upper part 121b. The lower part 121a, the upper part 12lb, and the plate-shaped member 124 can be assembled and disassembled by fastening members such as bolts.

The lower part 121a includes a side wall 1211 , a bottom wall 1214 and a side wall 1216 . Further, the upper part 12lb includes a side wall 1212 , an upper wall 1215 and a side wall 1217 . Therefore, in this embodiment, the side wall 1211 and the side wall 1216 as the circumferential wall portion defining the outer circumferential surface of the accommodation space SP1, and the side wall 1212 and the side wall as the circumferential wall portion defining the outer circumferential surface of the diffusion space SP2 1217 is configured to be separable. For this reason, both of the accommodating space SP1 and the diffusion space SP2 can be easily accessed during replenishment of deposition materials or maintenance.

Further, in the present embodiment, the plate-like member 124 defines the peripheral wall portion (side wall 1211 and side wall 1216) defining the outer circumferential surface of the accommodating space SP1, and the outer circumferential surface of the diffusion space SP2. It is provided as a separate body from the circumferential wall portion (side wall 1212 and side wall 1217) to do. Accordingly, internal maintenance of the container 121 can be easily performed. On the other hand, being installed as a separate body here may mean that they are installed so that they can be separated from each other by, for example, a worker releasing the fastening of bolts or the like at the time of maintenance or the like.

On the other hand, the plate-like member 124 may be integrally formed with the peripheral wall portions (side walls 1212 and 1217) defining the outer circumferential surface of the diffusion space SP2. When these are integrally formed, the thermal conductivity of the container 121 and the plate-like member 124 is improved, and heating efficiency by the heater 129 can be improved.

On the other hand, in this embodiment, the side wall 1212 and the connection wall 1213 are connected and provided in the upper part 121b, but the connection wall 1213 may be omitted in the upper part 121b. In this case, a portion outside the side wall 1212 of the plate-like member 124 in the Y direction may function as a connection wall connecting the side wall 1211 and the side wall 1212 .

<Cover member>

FIG. 6 is a perspective view showing the configuration of the evaporation source 12, cover member 15, and cover member 16. As shown in FIG. 7 is a perspective view showing the configuration of the evaporation source 12 and the cover member 15 . In FIG. 7, the state in which the cover member 16 is removed from the state of FIG. 6 and the cover member 15 is open is shown.

In this embodiment, it is comprised so that substantially all of the three containers 121 may be covered by the cover member 15 and the cover member 16. Specifically, the lower cover 151 covers the side wall 1211, the bottom wall 1214, the side wall 1216 and the side wall 1217, and the upper cover 152 covers the side wall 1212 and the connecting wall 1213. cover, and the cover member 16 covers the upper wall 1215.

Moreover, with respect to the lower cover 151, the upper cover 152 is supported by the rotation part 153 so that rotation is possible. For example, the rotation part 153 is connected to the upper cover 152 and includes the shaft member which makes the X direction an axial direction, and the bearing member which supports this shaft member so that rotation is possible. With this configuration, the upper cover 152 can be opened and closed between a closed position ( FIG. 6 ) covering at least the connection wall 1213 and an open position ( FIG. 7 ) where the connection wall 1213 is exposed. Incidentally, in this embodiment, the open position of the upper cover 152 is set so that the container 121 can be taken out from the lower cover 151 in the Z direction. That is, the open position is set so that the upper cover 152 in the open position and the container 121 partially covered by the lower cover 151 do not overlap each other when viewed from above. Thereby, the container 121 can be easily taken out from the cover member 15 in the Z direction.

Meanwhile, in the present embodiment, as the upper cover 152 is opened and closed relative to the lower cover 151, the heater 129 attached to the upper cover 152 is also opened and closed together with the upper cover 152. Accordingly, the heater 129 can be installed on more surfaces of the container 121 while the cover member 15 is configured to be openable and openable.

On the other hand, the upper cover 152 only needs to cover at least the connection wall 1213, and the side wall 1212 may be covered by the cover member 16 instead of the upper cover 152. Also in this case, the container 121 can be taken out of the cover member 15 by removing the lid member 16 and opening the upper cover 152 . In addition, the top cover 152 may cover at least a part of the top wall 1215 or the side wall 1217, and the cover member 16 may be omitted. In addition, each member of the lower cover 151, the upper cover 152, and the cover member 16 may be divided suitably.

<Method of manufacturing electronic device>

Next, an example of a manufacturing method of an electronic device will be described. Hereinafter, the configuration and manufacturing method of an organic EL display device as an example of an electronic device will be illustrated. In this example, a plurality of film forming apparatuses 1 illustrated in FIG. 1 are installed on the production line.

First, an organic EL display device to be manufactured will be described. Fig. 8(A) is an overall view of the organic EL display device 50, and Fig. 8(B) is a diagram showing a cross-sectional structure of one pixel.

As shown in FIG. 8(A), in the display area 51 of the organic EL display device 50, a plurality of pixels 52 having a plurality of light emitting elements are arranged in a matrix form. Details will be described later, but each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

Incidentally, the term "pixel" here refers to a minimum unit enabling display of a desired color in the display area 51 . In the case of a color organic EL display device, a pixel 52 is constituted by a combination of a plurality of subpixels of the first light emitting element 52R, the second light emitting element 52G, and the third light emitting element 52B emitting different light. has been The pixel 52 is often composed of a combination of three types of sub-pixels: a red (R) light emitting element, a green (G) light emitting element, and a blue (B) light emitting element, but is not limited thereto. The pixel 52 only needs to include at least one type of subpixel, preferably includes two or more types of subpixels, and more preferably includes three or more types of subpixels. As the subpixels constituting the pixel 52, for example, a combination of four types of subpixels: a red (R) light emitting element, a green (G) light emitting element, a blue (B) light emitting element, and a yellow (Y) light emitting element. may be continued

Fig. 8(B) is a partial cross-sectional schematic diagram taken along line A-B of Fig. 8(A). The pixel 52 includes, on the substrate 53, the first electrode (anode) 54, the hole transport layer 55, and any one of the red layer 56R, the green layer 56G, and the blue layer 56B. It has a plurality of sub-pixels composed of one organic EL element including an electron transport layer 57 and a second electrode (cathode) 58. Among these, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in patterns corresponding to light-emitting elements (sometimes described as organic EL elements) emitting red, green, and blue, respectively.

Moreover, the 1st electrode 54 is formed separately for each light emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed commonly over a plurality of light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. That is, as shown in FIG. 8B, the red layer 56R, the green layer 56G, and the blue layer 56B are formed on the hole transport layer 55 as a common layer over a plurality of sub-pixel regions. It may be formed separately for each region, and furthermore, the electron transport layer 57 and the second electrode 58 may be formed as a common layer over a plurality of sub-pixel regions.

On the other hand, in order to prevent a short between adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. Furthermore, since the organic EL layer is degraded by moisture or oxygen, a protective layer 60 is provided to protect the organic EL element from moisture or oxygen.

Although the hole transport layer 55 and the electron transport layer 57 are shown as one layer in FIG. 8B, depending on the structure of the organic EL display element, it may be formed of a plurality of layers having a hole blocking layer or an electron blocking layer. do. In addition, a hole injection layer having an energy band structure capable of smoothly injecting holes from the first electrode 54 to the hole transport layer 55 is formed between the first electrode 54 and the hole transport layer 55. can form Similarly, an electron injection layer may also be formed between the second electrode 58 and the electron transport layer 57 .

Each of the red layer 56R, the green layer 56G, and the blue layer 56B may be formed as a single light emitting layer or may be formed by laminating a plurality of layers. For example, the red layer 56R may be composed of two layers, the upper layer may be formed of a red light emitting layer, and the lower layer may be formed of a hole transport layer or an electron blocking layer. Alternatively, the lower layer may be formed of a red light emitting layer, and the upper layer may be formed of an electron transport layer or a hole blocking layer. By providing the layer below or above the light emitting layer in this way, there is an effect of improving the color purity of the light emitting element by adjusting the light emitting position in the light emitting layer and adjusting the optical path length.

In addition, although the example of the red layer 56R has been shown here, the same structure may be employed also in the green layer 56G or the blue layer 56B. In addition, the number of layers may be two or more. Furthermore, layers of different materials such as a light emitting layer and an electron blocking layer may be laminated, or layers of the same material may be laminated, for example, two or more light emitting layers are laminated.

Next, an example of a method for manufacturing an organic EL display device will be described in detail. Here, it is assumed that the red layer 56R is composed of two layers, the lower layer 56R1 and the upper layer 56R2, and the green layer 56G and the blue layer 56B are composed of a single light emitting layer.

First, a circuit (not shown) for driving an organic EL display device and a substrate 53 on which a first electrode 54 is formed are prepared. Meanwhile, the material of the substrate 53 is not particularly limited, and may be made of glass, plastic, metal, or the like. In this embodiment, as the board|substrate 53, the board|substrate in which the film of polyimide was laminated|stacked on the glass substrate is used.

On the substrate 53 on which the first electrode 54 is formed, a resin layer such as acrylic or polyimide is coated with a bar coat or spin coat, and the resin layer is applied to the portion where the first electrode 54 is formed by a lithography method. An insulating layer 59 is formed by patterning to form an opening. This opening corresponds to a light emitting region in which the light emitting element actually emits light. On the other hand, in the present embodiment, processing is performed on a large-sized substrate until the formation of the insulating layer 59, and a dividing step of dividing the substrate 53 is executed after the formation of the insulating layer 59.

The board|substrate 53 on which the insulating layer 59 was patterned is carried into the 1st film-forming apparatus 1, and the hole transport layer 55 is formed as a layer common to the 1st electrode 54 of a display area. The hole transport layer 55 is formed using a mask having openings for each display area 51 that will ultimately become a panel portion of each organic EL display device.

Next, the substrate 53 on which up to the hole transport layer 55 is formed is carried into the second film forming apparatus 1 . Align the substrate 53 with the mask, place the substrate on the mask, and place the substrate 53 on the hole transport layer 55 in a portion of the substrate 53 where a red-emitting element is disposed (a region where red sub-pixels are formed). , the red layer 56R is formed. Here, the mask used in the second film formation chamber is a high-precision mask in which openings are formed only in a plurality of regions serving as red subpixels among a plurality of regions on the substrate 53 serving as subpixels of the organic EL display device. . As a result, the red layer 56R including the red light emitting layer is formed only in the region to be the red sub-pixel among the regions to be the plurality of sub-pixels on the substrate 53 . In other words, the red layer 56R is not formed in the area to be a blue sub-pixel or the area to be a green sub-pixel among the areas to be a plurality of sub-pixels on the substrate 53, but in the area to be a red sub-pixel. It is formed selectively.

Similar to the film formation of the red layer 56R, the green layer 56G is formed by the third film forming apparatus 1, and the blue layer 56B is further formed by the fourth film forming apparatus 1. After film formation of the red layer 56R, the green layer 56G, and the blue layer 56B is completed, the electron transport layer 57 is formed as a film in the entire display region 51 in the fifth film forming apparatus 1 . The electron transport layer 57 is formed as a layer common to the three color layers 56R, 56G, and 56B.

The substrate on which up to the electron transport layer 57 is formed is moved to the sixth film forming apparatus 1, and the second electrode 58 is formed. In the present embodiment, in the first film forming apparatus 1 to the sixth film forming apparatus 1, each layer is formed by vacuum deposition. However, the present invention is not limited to this, and for example, the film formation of the second electrode 58 in the sixth film forming apparatus 1 may be performed by sputtering. Thereafter, the substrate on which up to the second electrode 58 is formed is moved to a sealing device, and a protective layer 60 is formed by plasma CVD (sealing step), and the organic EL display device 50 is completed. On the other hand, although the protective layer 60 is formed here by the CVD method, it is not limited thereto, and may be formed by the ALD method or the inkjet method.

<Other Embodiments>

9 is a cross-sectional view for explaining the internal structure of the evaporation source 92 according to one embodiment. In addition, FIG. 10 is a plan view for explaining the structure of the partitioning part 924 of the evaporation source 92. As shown in FIG. Hereinafter, the same code|symbol is attached|subjected about the structure similar to the said embodiment, and description is abbreviate|omitted.

The evaporation source 92 includes a container 121 forming a space therein and a partition 924 . The partition 924 divides the internal space of the container 121 into an accommodation space SP1, a diffusion space SP21, and a diffusion space SP22. That is, in the above embodiment, the inner space of the container 121 is divided into two spaces, the accommodation space SP1 and the diffusion space SP2, but in this embodiment, the inner space of the container 121 is divided into three spaces. are compartmentalized. The partition 924 includes a lower plate 9241 , an upper plate 9242 , an intermediate plate 9243 , and a plurality of pillars 9244 .

The lower layer plate 9241 is a plate-shaped member that divides the accommodating space SP1 and the diffusion space SP21. Here, the lower layer plate 9241 is installed at a position corresponding to the plate member 124 in the evaporation source 12 of FIG. 4 . Further, an opening 9241a through which the vaporized deposition material passes is formed in the lower layer plate 9241 . The lower layer plate 9241 is configured to divide the inner space of the container 121 into a plurality of spaces, while allowing the vaporized deposition material to move between the spaces. In this embodiment, the lower layer plate 9241 is composed of one flat plate, but the shape of the lower layer plate 9241 can be changed as appropriate. In this embodiment, the lower plate 9241 extends from one side of the pair of side walls 1211 to the other in the Y direction, but extends from one side of the pair of side walls 1212 to the other side. can also

The upper layer plate 9242 is a plate-shaped member that partitions the diffusion space SP21 and the diffusion space SP22. That is, the upper plate 9242 extends from one side of the pair of side walls 1212 to the other in the Y direction, and extends from one side of the pair of side walls 1217 to the other in the X direction. . An opening 9242a through which vaporized deposition material passes is formed in the upper layer plate 9242 . The upper layer plate 9242 is configured to divide the inner space of the container 121 into a plurality of spaces, while permitting movement of the vaporized deposition material between the spaces. In this embodiment, although the opening 9242a of the upper layer plate 9241 and the opening 9241a of the lower layer plate 9241 have substantially the same size, even if the size of these openings, illustratively, the width in the X direction or the Y direction, is different. do. In a plan view, the location where the opening 9241a is provided may be different from the location where the opening 9242a is provided. In this embodiment, the upper layer board 9242 is composed of one flat plate, but the shape of the upper layer board 9242 can be changed as appropriate.

The middle plate 9243 is a plate-shaped member provided between the lower plate 9241 and the upper plate 9242 . That is, the intermediate plate 9243 is installed in the diffusion space SP21. In this embodiment, the width of the middle plate 9243 in the XY direction is provided so as to be larger than the width of the opening 9241a and the opening 9242a in the XY direction. Viewed from the other side, the middle plate 9243 is provided so as to overlap the whole of the opening 9241a of the lower layer plate 9241 and the opening 9242a of the upper layer plate 9242 in plan view. However, the intermediate plate 9243 may be provided overlapping at least a part of the openings 9241a and 9242a in plan view.

The plurality of pillars 9244 are members connecting the lower layer plate 9241 , the middle plate 9243 , and the upper layer plate 9242 . A lower layer plate 9241, an intermediate plate 9243, and an upper layer plate 9242 are spaced apart from each other in the Z direction by the plurality of pillars 9244.

On the other hand, in the example of FIG. 9, the position of the lower layer plate 9241 is provided corresponding to the position of the plate-like member 124 in FIG. 4, but the position of the upper layer plate 9242 is the position of the plate-like member 124 ) may be installed so as to correspond to the position of A configuration in which either of the lower layer plate 9241 and the upper layer plate 9242 is omitted is also employable.

The invention is not limited to the above embodiment, and various modifications and changes are possible within the scope of the gist of the invention.

1: Tabernacle device
10: tabernacle unit
12: evaporation source
121: Courage
124: plate-shaped member
125: directing department
15: cover member
151: lower cover
152: upper cover
100: substrate
101: mask
SP1: Accommodation space
SP2: diffuse space

Claims (12)

A film forming apparatus for vaporizing a deposition material to form a film on a substrate, comprising:
A vessel having an inner space including a receiving space for accommodating a solid or liquid deposition material and a diffusion space in which the vaporized deposition material is diffused;
A cover member covering at least a portion of the container,
The diffusion space is disposed on the accommodation space,
A width of the diffusion space in a first direction is narrower than a width of the accommodating space in the first direction;
the container,
a first sidewall defining a side surface of the accommodation space;
a second sidewall defining a side of the diffusion space;
a connection wall connecting the first sidewall and the second sidewall;
The cover member,
a first cover covering at least the first sidewall;
and a second cover rotatably supported by the first cover and covering at least the connection wall. According to claim 1,
The film forming apparatus according to claim 1, further comprising a plate-like member inside the container, which partitions the accommodation space and the diffusion space, and is formed with an opening through which vaporized deposition material passes. According to claim 2,
The film forming apparatus according to claim 1, further comprising an extension portion that surrounds the opening and protrudes and extends from the plate-like member. According to any one of claims 1 to 3,
The film forming apparatus performs film formation while relatively moving an evaporation source including at least the container in a moving direction with respect to the substrate;
The film forming apparatus according to claim 1, wherein the first direction is a direction crossing the moving direction. According to any one of claims 1 to 3,
and a heater installed between the container and the cover member to heat a deposition material. According to claim 5,
At least a part of the heater is attached to the second cover. According to any one of claims 1 to 3,
A film forming apparatus characterized in that a cooling pipe for cooling the cover member is installed inside the cover member. According to any one of claims 1 to 3,
The film forming apparatus according to claim 1, further comprising a boundary member dividing the accommodating space into a plurality of accommodating portions each accommodating a deposition material. According to any one of claims 1 to 3,
The film forming apparatus according to claim 1 , wherein a plurality of nozzles arranged along the first direction and discharging the deposition material diffused in the diffusion space are installed in the container. According to claim 2 or 3,
The film forming apparatus characterized in that the accommodating space and the diffusion space are in contact with each other via the plate-shaped member. A film forming method comprising a film forming step of forming a film on a substrate using the film forming apparatus according to any one of claims 1 to 3. An evaporation source unit for vaporizing a deposition material to form a film on a substrate,
A vessel forming an internal space including a receiving space for accommodating a deposition material and a diffusion space in which the vaporized deposition material is diffused;
A cover member covering at least a portion of the container,
The container forms the inner space so that the diffusion space, which is narrower in a first direction than the accommodation space, is provided on an upper surface of the accommodation space;
The cover member,
In the container, a first cover covering a first side wall defining at least a side surface of the accommodation space;
characterized in that it includes a second cover that is rotatably supported by the first cover and covers, in the container, a connection wall connecting at least the first sidewall and a second sidewall defining a side surface of the diffusion space. evaporation unit.

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