KR20230000897A - Apparatus and method of manufacturing nano-copper plane heater element with positive temperature coefficient - Google Patents

Abstract

The present invention relates to an apparatus and a method for manufacturing a nano-copper planar heating element, capable of manufacturing a planar heating element by mixing a high-molecular polymer (for example, PE, PP, EVA, EEA or the like) having a constant temperature property, a conductive polymer and reducing metallic salts, electrospinning the mixture to a front side or a pattern, and electroplating the mixture in a nano-copper solution. A spinning solution production unit produces a spinning solution by mixing a high-molecular polymer, a conductive polymer, and metallic salts with a PET film. A nanofiber forming unit forms nanofibers by electrospinning the spinning solution produced by in the spinning solution production unit. An electroless plating unit electrolessly plates a film to which the nanofibers formed in the nanofiber forming unit are attached, in a nano-copper solution. A thermal compression unit dries the film electrolessly plated by the electroless plating unit and passes copper foil and a laminate film through a thermal compression roller at the same time to thermally compress the components to attach the copper foil while performing insulation at the same time.

Description

Apparatus and method of manufacturing nano-copper plane heater element with positive temperature coefficient}

The technical field of the present invention relates to an apparatus and method for manufacturing a nano-copper planar heating element, in particular, a high-molecular polymer having constant temperature characteristics (eg, PE, PP, EVA, EEA, etc.), a conductive polymer, and a reducing metal salt are mixed to form a full surface or pattern. It relates to an apparatus and method for manufacturing a nano-copper planar heating element in which a planar heating element is manufactured by electrospinning and electroplating in a nano-copper solution.

Korean Patent Registration No. 10-1180037 (registered on August 30, 2012) discloses a heating film that controls temperature by independent cells. In a planar heating film using carbon, a first quadrangular plate shape reputation; A plurality of carbon yarns installed at regular intervals on the upper surface of the first flat plate in a long rectangular strip shape; A first vertical silver paste installed at a predetermined distance from the first carbon yarn among the plurality of carbon yarns in the direction of one end of the first plate, and spaced apart from the last carbon yarn among the plurality of carbon yarns by a predetermined distance in the direction of the other end of the first plate It is installed in a direction perpendicular to the longitudinal direction of the second vertical silver paste and the carbon yarns and the first vertical silver paste, one end is coupled to the first vertical silver paste and the other end passes through a plurality of carbon yarns to the last carbon yarn. It is installed in a direction perpendicular to the longitudinal direction of the first horizontal silver paste and the carbon yarn and the second vertical silver paste to be combined, one end being coupled to the second vertical silver paste and the other end passing through a plurality of carbon yarns to the first carbon yarn Silver paste consisting of a second horizontal silver paste coupled to; copper plates installed on the first vertical silver paste and the second vertical silver paste so as to overlap each other with the same length; And it is characterized in that it consists of a second flat plate, which is a flat plate of the same size as the first flat plate, and is installed so that the lower surface is coupled to the upper surface of the first flat plate and has carbon yarn, silver paste and copper plate inside. According to the disclosed technology, the heating film by collecting heat is not damaged by the heating film generating heat in an independent cell method, so there is no risk of fire, and the carbon circuit is a circuit using a positive temperature coefficient (PTC) material. By automatically adjusting the temperature according to the ambient temperature, it is economical to reduce unnecessary power consumption. However, a large amount of silver paste installed in the horizontal direction is consumed to configure the independent cell, and the manufacturing cost is increased, so there are still many disadvantages in commercialization.

Korean Patent Publication No. 10-2000-0028327 (published on May 25, 2000) completely removes electromagnetic waves harmful to the human body by preventing the formation of a magnetic field generated by the flow of current at the heating wire and input end of a plane heating element A planar heating element from which electromagnetic waves are removed and a method for manufacturing the same are disclosed. According to the disclosed technology, an upper input end and a lower input end separated from each other at regular intervals in the upper and lower parts and inputting currents in opposite directions to each other; a first heating wire connected to the upper input terminal at regular intervals and having a current flow in the same direction as the upper input terminal; It is characterized in that it includes a second heating wire connected to the lower input terminal at regular intervals and having a current flow in the opposite direction to the first heating wire at regular intervals, thereby completely removing electromagnetic waves harmful to the human body. Therefore, harm caused by electromagnetic waves can be prevented in advance, and restrictions on electromagnetic waves can be circumvented.

In the prior art as described above, the case of a flexible carbon heating element having a vinyl chloride sheath has been known for a long time, and this kind of heating element is used, for example, for keeping bedding warm or melting snow on a roof, and other nichrome Bedding wired in an S shape, floor heating panels with built-in nichrome wire, etc. are also used in various fields, and heating elements printed with metal foil as a heat source are also used. However, the heating element having a metal structure has disadvantages such as high energy consumption and safety and durability not being guaranteed.

In the prior art as described above, in the case of a heating element in which a film plate is formed of a silicon resin containing carbon particles, since there is a disadvantage that the distribution of carbon particles and the temperature distribution generated through the temperature control device are not uniform, the surface heating element It is not only difficult to keep the in-plane temperature uniform, but there is a risk of fire because there is no PTC function, and it is inappropriate to use a DC power source that does not generate electromagnetic waves due to its high resistance.

In the prior art as described above, in the case of a planar heating element made by weaving the warp of the synthetic resin weft and the heating weft obtained by mixing carbon particles and rubber-based resin and applying a carbon liquid to the synthetic resin weft, and covering with a vinyl chloride sheath, Since the heating yarn using the synthetic fiber weft yarn adheres the carbon solution in the form of a film around the yarn, the planar heating element using the heating yarn coated with such a mixture of carbon particles and resin is not bent, ) has the disadvantage of being damaged when received.

In the prior art as described above, neither the surface heating element nor the surface heating element has a function to prevent a local abnormal temperature rise on the surface heating element, and a short circuit to the power supply for heating together with deterioration due to the abnormal temperature rise There is a case where a circuit is generated, causing burns to the user, and also has a disadvantage in that there is a risk of causing a fire in some cases.

Korean Patent Registration No. 10-1180037 Korean Patent Publication No. 10-2000-0028327

The problem to be solved by the present invention is to solve the above-mentioned disadvantages, by mixing a high-molecular polymer (eg, PE, PP, EVA, EEA, etc.) with constant temperature characteristics, a conductive polymer and a reducing metal salt to form a front surface or pattern. It is to provide an apparatus and method for manufacturing a nano-copper planar heating element by electrospinning and electroplating in a nano-copper solution to prepare a planar heating element.

As a means for solving the above problems, according to one feature of the present invention, a spinning solution production unit for preparing a spinning solution by mixing a polymer and a conductive polymer and a metal salt in a PET film; Nanofiber forming unit for forming nanofibers by electrospinning the spinning solution prepared in the spinning solution production unit; an electroless plating unit for electrolessly plating the nanofiber-attached film formed in the nanofiber forming unit in a nano-copper solution; And drying the electroless plated film in the electroless plating unit to pass the copper foil and the laminate film through a thermal compression roller at the same time to thermally compress the copper foil while attaching the nano-copper planar heating element manufacturing device including a thermal compression bonding unit that simultaneously performs insulation to provide.

In one embodiment, the spinning solution production unit is characterized in that one of PE, PP, EVA, EEA is used as the high-molecular polymer.

In one embodiment, the spinning solution production unit is characterized in that using a reducing metal salt of silver as the metal salt.

In one embodiment, the spinning solution production unit is characterized in that for preparing a spinning solution by mixing an organic reducing solvent, a metal salt and a carbon fiber precursor.

In one embodiment, the spinning solution production unit is characterized in that the carbon fiber precursor is produced by mixing a high-molecular polymer with polyacrylonitrile.

In one embodiment, the spinning solution production unit is characterized in that the carbon fiber precursor is produced by mixing 75 to 95% of polyacrylonitrile and 5 to 25% of PE.

In one embodiment, the spinning solution production unit is characterized by using 5 to 30% by weight of the carbon fiber precursor with respect to 100% by weight of the spinning solution.

In one embodiment, the spinning solution production unit is characterized by using a metal salt of 1 to 75% by weight relative to 100% by weight of the spinning solution.

In one embodiment, the spinning solution production unit is characterized by giving aging by preparing a spinning solution by mixing a high-molecular polymer, a conductive polymer, an organic reducing solvent, and a metal salt.

In one embodiment, the spinning solution production unit is characterized in that the aging temperature at the time of aging of the spinning solution is equal to or higher than the melting point of the organic reducing solvent.

In one embodiment, the nanofiber forming unit is characterized in that it has a pattern by electrospinning using a film with a pattern attached or using a screen with a pattern.

In one embodiment, the nanofiber-forming unit is characterized in that, during electrospinning, the metal by the metal salt is deposited on the surface of the nanofiber by the reducing effect of the solvent.

In one embodiment, the nanofiber forming unit, in order to impart a certain pattern to the PET film, the patterned screen and the film are in close contact with the patterned screen during electrospinning, along the compression roller in the form of a belt. It is characterized in that electrospinning is performed while being repeatedly circulated according to, or electrospinning is performed on a PET film to which a film with a pattern is attached, and only the pattern portion is attached to the spinning solution.

In one embodiment, the electroless plating unit is characterized in that a nano copper ion solution is used during copper plating.

In one embodiment, the electroless plating unit is characterized by passing a film coated with nanofibers in an electroless copper plating solution into a nanocopper solution.

In one embodiment, the electroless plating unit supplies the film coated with the resin along the guide roller to an electroless electroplating device filled with a nano-copper solution to plate copper on the film.

In one embodiment, the thermal compression bonding unit is characterized in that the drying temperature is 10 to 100 degrees (℃) when drying the electroless plated film in the electroless plating unit.

In one embodiment, the thermal compression unit is characterized in that the copper foil and the laminate film are simultaneously attached to the copper foil while insulating while simultaneously passing the thermal compression roller without using silver paste.

In one embodiment, the thermal compression bonding unit is characterized in that the resin is aged while being dried when passing the electroless plated film in the electroless plating unit through a drying furnace.

In one embodiment, the thermal compression unit supplies a copper foil film to both ends of the electroless plated film in the electroless plating unit, and passes a thermal compression roller while supplying a laminate film thereon to heat the copper foil film and the planar heating element. It is characterized in that it is bonded while being compressed.

In one embodiment, the spinning solution production unit is characterized in that for preparing a spinning solution by mixing an organic reducing solvent, a metal salt, a carbon fiber precursor and a polymer.

In one embodiment, the thermal compression unit places copper foil on both ends of the planar heating element, thermally compresses the copper foil and the laminate film, compresses them in the form of a hose kiss to form an electrode, and an electrode attached to the electrode. The configuration of the terminal is characterized in that it is formed so that two flat plates are provided together with the lead wire insertion hole.

In one embodiment, the thermal compression unit is characterized in that one flat plate is formed as a positive plate, and the flat plate on the other side is formed to include protrusions as well.

In one embodiment, the thermocompression bonding part, in the case of the protrusion, penetrates the copper foil film, passes through the protrusion insertion hole provided on the surface of the transfer plate, and bends and fixes the tip of the protrusion to form an electrode terminal structure. characterized by the formation of

In one embodiment, the electroless plating unit is characterized in that a polymer constituting a conductive nano copper wire for blocking current is formed by plating copper on the film electrospun in the nanofiber forming unit.

As a means for solving the above problems, according to another feature of the present invention, preparing a spinning solution by mixing a polymer and a conductive polymer and a metal salt in the spinning solution manufacturing unit PET film; Forming nanofibers by electrospinning the spinning solution prepared by the nanofiber forming unit in the spinning solution production unit; electrolessly plating the film to which the nanofibers formed in the nanofiber forming unit by the electroless plating unit are electrolessly plated in a nano-copper solution; And a step of drying the electroless plated film in the electroless plating unit by the thermal compression bonding unit, passing the copper foil and the laminate film through a thermal compression roller at the same time, thermally compressing the copper foil, and simultaneously performing insulation while attaching the copper foil. provides a way

As an effect of the present invention, a high-molecular polymer having constant temperature characteristics (eg, PE, PP, EVA, EEA, etc.), a conductive polymer and a reducing metal salt are mixed and electrospun in a full surface or pattern, and electroplated in a nano copper solution to form a surface By providing a nano-copper planar heating element manufacturing apparatus and method for manufacturing a heating element, the temperature of the heating element is controlled to a safe temperature or less by performing a PTC (positive temperature coefficient) function without a temperature control device, so that there is no risk of fire. In other words, it is possible to eliminate electromagnetic waves by using DC power.

1 is a view illustrating an apparatus for manufacturing a nano-copper planar heating element according to an embodiment of the present invention.
FIG. 2 is a view illustrating a nanofiber forming unit, an electroless plating unit, and a thermal compression bonding unit in FIG. 1 .
Figure 3 is a view explaining the PTC principle of the polymer used in the spinning solution manufacturing unit in Figure 1.
FIG. 4 is a view illustrating the nanofiber forming unit and the electroless plating unit in FIG. 1 .
5 is a view explaining a cross section of a planar heating element formed by thermal compression bonding in the thermal compression bonding unit in FIG. 1 .
6 is a view illustrating a method for manufacturing a nano-copper planar heating element according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. However, since the description of the present invention is only an embodiment for structural or functional description, the scope of the present invention should not be construed as being limited by the embodiments described in the text. That is, since the embodiment can be changed in various ways and can have various forms, it should be understood that the scope of the present invention includes equivalents capable of realizing the technical idea. In addition, since the object or effect presented in the present invention does not mean that a specific embodiment should include all of them or only such effects, the scope of the present invention should not be construed as being limited thereto.

The meaning of terms described in the present invention should be understood as follows.

Terms such as "first" and "second" are used to distinguish one component from another, and the scope of rights should not be limited by these terms. For example, a first element may be termed a second element, and similarly, a second element may be termed a first element. It should be understood that when an element is referred to as “connected” to another element, it may be directly connected to the other element, but other elements may exist in the middle. On the other hand, when an element is referred to as being “directly connected” to another element, it should be understood that no intervening elements exist. Meanwhile, other expressions describing the relationship between components, such as “between” and “immediately between” or “adjacent to” and “directly adjacent to” should be interpreted similarly.

Singular expressions should be understood to include plural expressions unless the context clearly dictates otherwise, and terms such as “comprise” or “having” refer to a described feature, number, step, operation, component, part, or It should be understood that it is intended to indicate that a combination exists, and does not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

All terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs, unless defined otherwise. Terms defined in commonly used dictionaries should be interpreted as consistent with meanings in the context of related art, and cannot be interpreted as having ideal or excessively formal meanings unless explicitly defined in the present invention.

Now, with reference to the drawings, a nano-copper planar heating element manufacturing apparatus and method according to an embodiment of the present invention will be described in detail.

1 is a view illustrating a nano-copper planar heating element manufacturing apparatus according to an embodiment of the present invention, FIG. 2 is a view illustrating a nanofiber forming unit, an electroless plating unit, and a thermal compression bonding unit in FIG. 1, and FIG. It is a view explaining the PTC principle of the polymer used in the spinning solution manufacturing unit in 1, Figure 4 is a view explaining the nanofiber forming unit and the electroless plating unit in FIG. 1, Figure 5 is a thermal compression bonding in FIG. It is a drawing explaining the cross section of the planar heating element formed by thermal compression at the part.

1 to 5, the nano-copper planar heating element manufacturing apparatus 10 includes a spinning solution manufacturing unit 11, a nanofiber forming unit 12, an electroless plating unit 13, and a thermal compression bonding unit 14. do.

The spinning solution preparation unit 11 prepares a spinning solution by mixing a polymer, a conductive polymer, and a metal salt on a polyethylene terephthalate (PET) film.

In one embodiment, the spinning solution preparation unit 11 is a polymer having a constant temperature, and one of polyethylene (PE), polypropylene (PP), ethylene-vinyl acetate (EVA), and ethylene ethyl acrylate (EEA) may be used. can

In one embodiment, the spinning solution production unit 11, a high-molecular polymer having a thermal melting function (eg, PE, PP, EVA, EEA, etc.) and a conductive polymer and a reducing metal salt (eg, silver) to mix the spinning solution can manufacture

In one embodiment, the spinning solution preparation unit 11 may prepare a spinning solution by mixing an organic reducing solvent, a metal salt (ie, a metal salt), and a carbon fiber precursor.

In one embodiment, the spinning solution production unit 11, PE, PP, EVA, EEA and the like can be mixed with polyacrylonitrile (polyacrylonitrile; PAN) to create a carbon fiber precursor.

In one embodiment, the spinning solution preparation unit 11, in the case of using a high-molecular polymer as PE, polyacrylonitrile may be mixed with 75 to 95% and PE with 5-25%.

In one embodiment, the spinning solution preparation unit 11 may use 5 to 30% by weight of the carbon fiber precursor with respect to 100% by weight of the spinning solution.

In one embodiment, the spinning solution preparation unit 11 may use 1 to 75% by weight of a metal salt based on 100% by weight of the spinning solution.

In one embodiment, the spinning solution preparation unit 11 is a mixture of a polymer (eg, PE, PP, EVA, EEA, etc.), a conductive polymer, an organic reducing solvent, and a metal salt for imparting a PTC (positive temperature coefficient) function. Thus, the electrospinning solution 210 shown in FIG. 2 may be prepared and aged.

In one embodiment, the spinning solution preparation unit 11, when aging the electrospinning solution 210, the aging temperature may be equal to or higher than the melting point of the organic reducing solvent.

In one embodiment, the spinning solution production unit 11, the PTC principle of the polymer polymer, as shown in Figure 3, when the temperature rises, the polymer can be thermally expanded and the contactability of the copper particles to be lowered.

The nanofiber forming unit 12 electrospins the spinning solution prepared in the spinning solution production unit 11 to form nanofibers.

In one embodiment, the nanofiber-forming unit 12 may have a pattern by electrospinning using a patterned film or a patterned screen.

In one embodiment, the nanofiber forming unit 12, in the case of planar heating element electrospinning, can be carried out on the entire surface or a part according to the purpose, it is manufactured by attaching a film with a pattern to the supplied film, or the pattern is It can be formed while supplying the existing film like a screen.

In one embodiment, the nanofiber-forming unit 12, during electrospinning, the metal by the metal salt may be deposited on the surface of the nanofiber by the reducing effect of the solvent.

In one embodiment, the nanofiber forming unit 12, as shown in Figure 2 for explaining the production process of the flexible surface heating element, preparing a PET film roll 100, the fabric electrospinning device 200 However, at this time, the fabric is supplied along the guide rollers 220 and 230, and a plurality of nozzles 240 for spraying the electrospinning solution 210 prepared in the spinning solution manufacturing unit 11 are provided at a production speed. By placing the nozzle 240 cross-coating by moving the nozzle 240 left and right, it can be evenly coated on the entire surface and applied like the electrospun film model 250.

In one embodiment, the nanofiber forming unit 12, when controlling the amount of the electrospinning solution 210 applied to the PET film, by controlling the movement speed of the PET film, or by adjusting the concentration of the electrospinning solution to generate electricity By adjusting the amount of application of the spinning solution 210, the resistance can be freely adjusted and the entire surface or pattern can be spun.

In one embodiment, the nanofiber forming unit 12, in the case of a pattern heating element such as a partial circuit rather than the front, as shown in FIG. 4, in order to impart a certain pattern to the PET film, during electrospinning Electrospinning is performed while the patterned screen is repeatedly circulated along the compression roller 260 in the form of a belt along the compression roller 260 so that the film with the pattern is in close contact, or the patterned film is attached. After electrospinning on the PET film, only the pattern portion may be attached to the spinning solution.

The electroless plating unit 13 electroless-plates the nanofiber-attached film formed in the nanofiber forming unit 12 in a nano-copper solution.

In one embodiment, the electroless plating unit 13 may use a nano-copper ion solution having a characteristic of self-dispersing even without stirring in the case of a copper solution used for plating with copper.

In one embodiment, the electroless plating unit 13 may perform electroless plating by passing a nanofiber-coated film through the electroless copper plating solution through the nanocopper solution.

In one embodiment, the electroless plating unit 13 transfers the film electrospun from the nanofiber forming unit 12 to the electroless electroplating apparatus 300 shown in FIG. 2 for copper plating. In this case, although the dispersing power decreases and the adsorption power decreases, the nano copper solution 320 having excellent dispersion and adsorption power is used, and the film coated with the resin along the guide roller 310 is electroless filled with the nano copper solution 320. It is supplied to the electroplating device 300, whereby copper can be evenly plated on the film in the nanocopper solution finely dispersed.

In one embodiment, as shown in FIG. 4 , the electroless plating unit 13 may plate the film electrospun from the nanofiber forming unit 12 in the electroless electroplating bath 300 .

The thermal compression unit 14 dries the electroless plated film in the electroless plating unit 13 and simultaneously passes the copper foil and the laminate film through a thermal compression roller to perform thermal compression bonding while attaching the copper foil and simultaneously insulates the copper foil.

In one embodiment, the thermal compression bonding unit 14 may set a drying temperature of 10 to 100 degrees (° C.) when drying the electroless plated film in the electroless plating unit 13.

In one embodiment, the thermal compression unit 14 can insulate and simultaneously attach the copper foil while passing the copper foil and the laminate film through the thermal compression roller at the same time without using silver paste. It is possible to manufacture a planar heating element that does not generate electromagnetic waves.

In one embodiment, as shown in FIG. 2, the thermal compression unit 14 allows the electroless plated film in the electroless plating unit 13 to pass through the drying furnace 400, and the drying furnace 400 As the resin dries and ages as it passes, it can improve the adhesive adhesion evenly.

In one embodiment, as shown in FIG. 2, the thermal compression unit 14 is not insulated and does not have a structure capable of supplying power in the case of a fabric that has passed through the drying furnace 400, Supply the copper foil film 510 to both ends of the film, and pass the thermal compression roller 500 while supplying the laminate film 520 thereon, so that the copper foil film and the planar heater are evenly bonded while being thermally compressed, and laminated thereon The film 520 presses and fuses the surface of the copper-adsorbed planar heating element and the copper foil to firmly attach and insulate the film 520, thereby smoothing the flow of power and finishing the winding in the finished winding machine 600.

In one embodiment, the thermal compression bonding unit 14 may dry the electroless plated film in the electroless plating unit 13 to manufacture a planar heating element having a pattern suitable for the demand.

In the nano-copper planar heating element manufacturing apparatus 10 having the configuration as described above, in the case of the nanofiber electroless plating method using the metal salt reduction effect on the PET film, the spinning solution preparation unit 11 is an organic reducing solvent, a metal salt , A carbon fiber precursor and a polymer having a PTC function (eg, PE, PP, EVA, EEA, etc.) are mixed to prepare a spinning solution, and then the prepared spinning solution is aged at an aging temperature; The nanofiber forming unit 12 electrospins the spinning solution to form nanofibers; The electroless plating unit 13 injects the PET film coated by electrospinning of the nanofiber forming unit 12 into an electroless nanocopper plating solution to perform copper plating on the nanofibers; Then, the thermal compression bonding unit 14 dries the nanofibers plated in the electroless plating unit 13 to produce a planar heating element.

The thermal compression unit 14 is a copper foil placed at both ends of the prepared planar heating element, thermally compressed and coated with the copper foil and laminate film, and compressed like a hose kiss to form an electrode group, and an electrode terminal attached to the electrode group As shown in Figure 5, the configuration of can be provided with two flat plates together with the lead wire insertion hole.

As shown in FIG. 5, in the thermal compression bonding portion 14, one flat plate is used as a double plate, and the flat plate on the other side is formed so as to include projections. At this time, as shown in FIG. 5, the protrusion penetrates the copper foil film and passes through the protrusion insertion hole provided on the surface of the positive plate to form an electrode terminal structure that is installed by bending and fixing the tip of the protrusion. can

In the nano-copper planar heating element manufacturing apparatus 10 having the configuration described above, the electroless plating unit 13 plates copper on the electrospun film from the nanofiber forming unit 12 to block the current. By forming the polymer constituting the copper wire, the resistance increases as the polymer melts at the ideal temperature at which the initially set resistance of the carbon-based polymer changes (that is, the temperature within 80 ° C to 110 ° C), and the current decreases. while the temperature rise stops, and when the temperature drops below a certain temperature, the polymer crystallizes again, the gap decreases, and the resistance decreases while allowing conduction; Accordingly, as shown in FIG. 3, even if the temperature rises, it is always kept below a certain temperature even without a thermostat, so that not only does not cause a fire, but the manufacturing cost is very low, the front surface is evenly heated, and heat is generated even under 5V. This can happen, and it can be miniaturized, so even with a small battery, it can generate heat of 100 ℃ or more, so it can be applied to home appliances, mountaineering products, and medical supplies.

Nanocopper planar heating element manufacturing apparatus 10 having the configuration as described above, in the case of a carbon-based planar heating element having constant temperature characteristics, in order to fully control, considering the drawback that uneven coating is likely to occur, the carbon-based resistor The threshold of the ideal temperature can be set as the ideal temperature at which the initially set resistance changes (that is, a temperature within 80 ° C to 110 ° C).

Nanocopper planar heating element manufacturing apparatus 10 having the configuration as described above, when preparing the electrospinning solution, a high polymer having a PTC function (eg, PE, PP, EVA, EEA, etc.) and a conductive polymer are mixed and a metal Salt is added to induce a reducing effect in the electrospinning solution, and nanoparticles are formed in the electrospinning solution through an aging process so that the catalytic treatment is continuously and uniformly performed simultaneously with the electrospinning, and then self-dispersion and adhesion are improved. Electroless electroplating is performed in a nano-copper solution, metal coating is performed, and drying is performed to heat-seal the copper foil and the laminate film to prepare a planar heating element.

The nano-copper planar heating element manufacturing apparatus 10 having the configuration as described above is a mixture of a high-molecular polymer having constant temperature characteristics (eg, PE, PP, EVA, EEA, etc.), a conductive polymer, and a reducing metal salt to form an electrical surface or pattern. By spinning and electroplating in a nano-copper solution to produce a planar heating element, the temperature of the heating element is controlled to below a safe temperature by performing the PTC function without a temperature control device, providing a function without the risk of fire and using DC power. Thus, electromagnetic waves can be eliminated.

Nano-copper planar heating element manufacturing apparatus 10 having the configuration as described above, a conductive polymer, silver excellent in reducibility, and a high molecular polymer having constant temperature characteristics (eg, PE, PP, EVA, EEA, etc.) on a PET film After mixing and aging, electrospinning is performed in a full-surface or patterned manner, and electroless electroplating is performed in a plating bath 300 filled with a nano-copper plating solution that is characterized in that the electrospun product is naturally dispersed without stirring to obtain copper. Plated, the plated film is dried in a dryer 400, and in the case of the dried film, in order to complete the surface heating element, copper foil is supplied to both ends and the front surface is laminated and insulated to insulate the surface heating element, such as fire due to high temperature It is possible to manufacture a flexible planar heating element equipped with an ignition prevention function without the drawback of.

The nano-copper planar heating element manufacturing apparatus 10 having the configuration as described above does not introduce two processes in the horizontal direction and the vertical direction in order to have an independent cell structure, and even without printing of silver paste applied to form an independent cell. , it is possible to produce a heating film with excellent economic feasibility while exhibiting the PTC function.

In the case of a general carbon-based planar heating element, the resistance is as high as several KΩ or more, but the nano-copper planar heating element manufacturing apparatus 10 having the configuration described above has a very low resistance of less than 10 ohms in the case of a planar heating element using electrospinning. It can generate high heat even at low voltage, and the resistance does not change even when placed under heavy furniture such as a table or piano. It is a planar heating element in which the temperature is evenly distributed and the resistance rises above a certain temperature and does not generate heat. It is possible to manufacture a heating element for a house or a plane heating element with a PTC function that can safely adapt to the warmth of bedding. In order to suppress the generation of harmful electromagnetic waves, it is possible to prevent the generation of electromagnetic waves by using a low DC power supply.

6 is a view illustrating a method for manufacturing a nano-copper planar heating element according to an embodiment of the present invention.

Referring to FIG. 6, in the spinning solution preparation unit 11, a high molecular weight polymer, a conductive polymer, and a metal salt are mixed with a PET film to prepare a spinning solution (S100).

In preparing the spinning solution in the above-described step S100, in the spinning solution preparation unit 11, as a high-molecular polymer having constant temperature characteristics, one of PE, PP, EVA, and EEA may be used.

In preparing the spinning solution in the above-described step S100, in the spinning solution preparation unit 11, a high molecular weight polymer having a thermal melting function (eg, PE, PP, EVA, EEA, etc.), a conductive polymer, and a reducing metal salt (eg, silver ) can be mixed to prepare a spinning solution.

In preparing the spinning solution in step S100 described above, in the spinning solution preparation unit 11, the spinning solution may be prepared by mixing an organic reducing solvent, a metal salt, and a carbon fiber precursor.

In preparing the spinning solution in the above-described step S100, in the spinning solution preparation unit 11, a high polymer such as PE, PP, EVA, EEA may be mixed with polyacrylonitrile to produce a carbon fiber precursor.

In preparing the spinning solution in the above-described step S100, in the spinning solution preparation unit 11, when the polymer is used as PE, 75 to 95% of polyacrylonitrile and 5 to 25% of PE are mixed. can

In preparing the spinning solution in step S100 described above, in the spinning solution preparation unit 11, 5 to 30% by weight of the carbon fiber precursor may be used with respect to 100% by weight of the spinning solution.

In preparing the spinning solution in step S100 described above, in the spinning solution preparation unit 11, with respect to 100% by weight of the spinning solution, 1 to 75% by weight of the metal salt may be used.

In preparing the spinning solution in the above-described step S100, in the spinning solution preparation unit 11, a polymer (eg, PE, PP, EVA, EEA, etc.), a conductive polymer, an organic reducing solvent, and a metal salt for imparting a PTC function. The electrospinning solution 210 shown in FIG. 2 may be prepared and aged by mixing.

In preparing the spinning solution in the above-described step S100, in the spinning solution preparation unit 11, when the electrospinning solution 210 is aged, the aging temperature may be equal to or higher than the melting point of the organic reducing solvent.

In preparing the spinning solution in the above-described step S100, in the spinning solution preparation unit 11, the PTC principle of the polymer polymer, as shown in FIG. 3, the polymer thermally expands when the temperature rises and the contact of the copper particles can make it lower.

In preparing the spinning solution in step S100 described above, in the case of the nanofiber electroless plating method using the metal salt reduction effect on the PET film, in the spinning solution preparation unit 11, an organic reducing solvent, a metal salt, a carbon fiber precursor and After preparing a spinning solution by mixing a polymer having a PTC function (eg, PE, PP, EVA, EEA, etc.), the prepared spinning solution may be aged at an aging temperature.

After preparing the spinning solution in step S100 described above, in the nanofiber forming unit 12, the spinning solution prepared in the spinning solution producing unit 11 is electrospun to form nanofibers (S200).

In forming the nanofibers in step S200 described above, in the nanofiber forming unit 12, a patterned film may be used or a patterned screen may be electrospun to have a pattern.

In forming the nanofibers in the above-described step S200, in the nanofiber forming unit 12, in the case of planar heating element electrospinning, it can be carried out on the entire surface or a part according to the purpose, a film with a pattern on the supplied film It can be manufactured by attaching it, or it can be formed while supplying a film with a pattern like a screen.

In forming the nanofibers in step S200 described above, in the nanofiber forming unit 12, during electrospinning, the metal by the metal salt may be deposited on the surface of the nanofibers by the reducing effect of the solvent.

In forming the nanofibers in the above-described step S200, in the nanofiber forming unit 12, as shown in FIG. 2 illustrating the production process of the flexible surface heating element, the PET film roll 100 is prepared, and the fabric is supplied to the electrospinning device 200, but at this time, the fabric is supplied along the guide rollers 220 and 230, and a plurality of nozzles for spraying the electrospinning solution 210 prepared in the spinning solution preparation unit 11 By arranging the 240 according to the production speed and cross-coating the nozzle 240 by moving left and right, it is possible to coat the entire surface evenly and apply like the electrospun film model 250.

In forming the nanofibers in the above-described step S200, in the nanofiber forming unit 12, when adjusting the amount of the electrospinning solution 210 applied to the PET film, the movement speed of the PET film is controlled, or the electrospinning By adjusting the concentration of the used solution to control the amount of application of the electrospinning solution 210, the resistance can be freely adjusted and the entire surface or pattern can be spun.

In forming the nanofibers in the above-described step S200, in the nanofiber forming unit 12, in the case of a pattern heating element such as a partial circuit rather than the entire surface, as shown in FIG. 4, a certain pattern is given to the PET film. In order to do so, electrospinning is performed while the patterned screen is repeatedly circulated along the compression roller 260 in the form of a belt along the compression roller 260 so that the patterned screen and the film adhere to each other during electrospinning, After electrospinning on the PET film to which the patterned film is attached, the spinning solution may be attached only to the patterned portion.

In forming the nanofibers in step S200 described above, in the case of the nanofiber electroless plating method using the metal salt reduction effect on the PET film, in the nanofiber forming unit 12, the spinning solution is electrospun to form nanofibers can give

After forming the nanofibers in step S200 described above, in the electroless plating unit 13, the nanofiber-adhered film formed in the nanofiber forming unit 12 is electrolessly plated in a nano copper solution ( S300).

In the electroless plating in the above-described step S300, in the electroless plating unit 13, in the case of a copper solution used for plating using copper, nano copper ions having a characteristic of being dispersed by themselves even without stirring solution can be used.

In the electroless plating in step S300 described above, in the electroless plating unit 13, the nanofiber-coated film is passed through the nanocopper solution in the electroless copper plating solution to perform electroless plating.

In the electroless plating in step S300 described above, in the electroless plating unit 13, the electrospun film from the nanofiber forming unit 12 is transferred to the electroless electroplating apparatus 300 shown in FIG. Copper plating is performed. In the case of general copper, the dispersing power is low and the adsorption power is low, but the nano copper solution 320, which has excellent dispersion and adsorption power, is used, and the film coated with the resin along the guide roller 310 is coated with the nano copper. It is supplied to the electroless electroplating apparatus 300 filled with the solution 320, whereby copper can be evenly plated on the film in the nano-copper solution finely dispersed.

In the electroless plating in step S300 described above, in the electroless plating unit 13, as shown in FIG. 4, the electrospun film in the nanofiber forming unit 12 is electroless in the electroless plating bath can be plated in

In the electroless plating in step S300 described above, in the case of the nanofiber electroless plating method using the metal salt reduction effect on the PET film, in the electroless plating unit 13, the electrospinning of the nanofiber forming unit 12 Copper plating on the nanofibers may be performed by injecting the coated PET film into an electroless nanocopper plating solution.

In the electroless plating in step S300 described above, in the electroless plating unit 13, copper is plated on the electrospun film in the nanofiber forming unit 12 to form a conductive nano copper wire for blocking current By forming a polymer, the resistance increases while the polymer melts at an ideal temperature at which the initially set resistance of the carbon-based polymer changes (that is, a temperature within 80 ° C to 110 ° C), and the current decreases and the temperature rises. stopped, and when the temperature drops below a certain temperature, the polymer crystallizes again, the gap decreases, and the resistance decreases while allowing conduction; Accordingly, as shown in FIG. 3, even if the temperature rises, it is always kept below a certain temperature even without a thermostat, so that not only does not cause a fire, but the manufacturing cost is very low, the front surface is evenly heated, and heat is generated even under 5V. This can happen, and it can be miniaturized, so even if there is only a small battery wirelessly, heat of 100 ℃ or more is possible, so it can be applied to home appliances, mountaineering products, and medical supplies.

In the electroless plating in step S300 described above, in the case of a carbon-based planar heating element having constant temperature characteristics, in the electroless plating unit 13, in consideration of the drawback that uneven coating is likely to occur, in order to completely control the carbon The threshold of the ideal temperature of the system resistor can be determined as the ideal temperature at which the initially set resistance changes (that is, a temperature within 80 ° C to 110 ° C).

After electroless plating in step S300 described above, in the thermal compression bonding unit 14, the electroless plating film in the electroless plating unit 13 is dried, and the copper foil and the laminate film are simultaneously passed through a thermal compression roller and thermally compressed. Insulation is simultaneously performed while attaching the copper foil (S400).

In the thermocompression bonding in step S400 described above, in the thermocompression bonding unit 14, when drying the electroless plated film in the electroless plating unit 13, the drying temperature may be set to 10 to 100 degrees (° C.) .

In the thermal compression bonding in step S400 described above, in the thermal compression bonding unit 14, the copper foil and the laminate film can be insulated and attached at the same time while passing the copper foil and the laminate film through the thermal compression roller at the same time without using silver paste, whereby the DC power supply of 24V or less It is possible to manufacture a planar heating element without generating electromagnetic waves while being capable of generating heat by using.

In the thermal compression bonding in step S400 described above, in the thermal compression bonding unit 14, the electroless plated film in the electroless plating unit 13 is passed through the drying furnace 400, and when passing through the drying furnace 400, the resin Aging while drying can evenly improve adhesive adhesion.

In the thermal compression bonding in the above-described step S400, in the thermal compression bonding unit 14, in the case of the fabric that has passed through the drying furnace 400, it is not insulated and does not have a structure capable of supplying power, so both ends of the film Supply the copper foil film 510, and pass the thermal compression roller 500 while supplying the laminate film 520 thereon, so that the copper foil film and the planar heating element are evenly bonded while being thermally compressed, and the laminate film 520 thereon. ) is pressed and welded to the surface of the copper-adsorbed planar heating element and the copper foil so that they are firmly attached and insulated, thereby smoothing the flow of power, and then finishing the winding in the finished winding machine 600.

In the thermal compression bonding in step S400 described above, in the thermal compression bonding unit 14, the electroless plating film in the electroless plating unit 13 is dried to produce a planar heating element, but a planar heating element with a pattern suitable for the demand is manufactured. can make it

In the thermal compression bonding in the above-described step S400, in the thermal compression bonding unit 14, the copper copper foil is placed at both ends on the planar heating element dried in the dryer 400, and the copper foil and the laminate film are thermally compressed and coated, and compressed like a hose kiss. As shown in FIG. 5 for the configuration of the electrode terminal attached to the electrode bar after forming the electrode bar, it is possible to provide two flat plates together with a lead wire insertion hole.

In the thermal compression bonding in step S400 described above, in the thermal compression bonding unit 14, as shown in FIG. 5, one flat plate may be used as a double plate, and the flat plate on the other side may be formed to include protrusions.

In the thermal compression bonding in the above-described step S400, in the case of the projections, in the thermal compression bonding portion 14, as shown in FIG. 5, through the copper foil film, pass through the projection insertion holes provided on the surface of the positive plate By doing so, it is possible to form an electrode terminal structure that is installed by bending and fixing the tip of the protrusion.

As described above, the embodiments of the present invention are not implemented only through the above-described device and/or operating method, but through a program for realizing functions corresponding to the configuration of the embodiment of the present invention and a recording medium on which the program is recorded. It may be implemented, and such an implementation can be easily implemented by an expert in the technical field to which the present invention belongs based on the description of the above-described embodiment. Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention defined in the following claims are also included in the scope of the present invention. that fall within the scope of the right.

10: nano-copper planar heating element manufacturing device
11: spinning solution production unit
12: nanofiber forming unit
13: electroless plating unit
14: thermocompression bonding
100: PET film roll
200: electrospinning equipment
210: electrospinning solution
220, 230: guide roller
240: nozzle
250: electrospun film model
260: screen roller
270: electrospun patterned film model
300: electroless electroplating
310: guide roller
320: nano copper solution
330: copper plated film model
340: planar heating element with pattern
400: dryer
500: hot pressing roller
510: copper foil film
520: laminate film
530: laminated film model
600: finished product winding machine
S100: Spinning solution manufacturing step
S200: nanofiber formation step
S300: electroless plating step
S400: Thermal compression step

Claims (5)

A spinning solution preparation unit for preparing a spinning solution by mixing a high molecular weight polymer, a conductive polymer, and a metal salt on a PET film;
Nanofiber forming unit for forming nanofibers by electrospinning the spinning solution prepared in the spinning solution production unit;
an electroless plating unit for electrolessly plating the nanofiber-attached film formed in the nanofiber forming unit in a nano-copper solution; and
Drying the electroless plated film in the electroless plating unit to pass the copper foil and the laminate film through a thermal compression roller at the same time and thermally compressing the nanocopper planar heating element manufacturing device including a thermal compression bonding unit that simultaneously performs insulation while attaching the copper foil.
According to claim 1, wherein the spinning solution production unit,
Nanocopper planar heating element manufacturing apparatus, characterized in that using one of PE, PP, EVA, EEA as the polymer.
According to claim 1, wherein the spinning solution production unit,
Nano-copper planar heating element manufacturing apparatus, characterized in that using silver, which is a reducing metal salt, as the metal salt.
According to claim 1, wherein the spinning solution production unit,
An apparatus for producing a nano-copper planar heating element, characterized in that for preparing a spinning solution by mixing an organic reducing solvent, a metal salt and a carbon fiber precursor.
Preparing a spinning solution by mixing a high-molecular polymer and a conductive polymer and a metal salt on the PET film by the spinning solution production unit;
Forming nanofibers by electrospinning the spinning solution prepared by the nanofiber forming unit in the spinning solution production unit;
electrolessly plating the film to which the nanofibers formed in the nanofiber forming unit by the electroless plating unit are electrolessly plated in a nano-copper solution; and
Nano-copper planar heating element manufacturing method comprising the step of drying the electroless plated film in the electroless plating unit by the thermal compression bonding unit, passing the copper foil and the laminate film through a thermal compression roller at the same time, thermally compressing the film, and simultaneously performing insulation while attaching the copper foil. .

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