KR20230000359A - Printed circuit board, camera module and optical apparatus having the same - Google Patents

Abstract

The circuit board according to the embodiment comprises: a terminal pad connected to an image sensor; a connector connected to an external device; and a signal line connecting between the pad and the connector. The terminal pad includes a first terminal pad connected to a mobile industry processor interface (MIPI) terminal of the image sensor and a second terminal pad other than the first terminal pad. The signal line includes a first signal line connecting between the first terminal pad and the connector and formed of a first metal material and a second signal line connecting between the second terminal pad and the connector and including a second metal material different from the first metal material. Accordingly, the present invention can further improve the transmission speed of the image signal of the camera module.

Description

Circuit board, camera module and optical device including the same

The embodiment relates to a circuit board, and relates to a circuit board capable of improving a data transmission speed of a data signal line connected to an image sensor, a camera module, and an optical device including the same.

Recently, a subminiature camera module has been developed, and the subminiature camera module is widely used in small electronic products such as smart phones, laptop computers, and game consoles.

That is, most mobile electronic devices, including smart phones, are equipped with camera devices for acquiring images from objects, and mobile electronic devices tend to be miniaturized for easy portability.

Such a camera device generally includes a lens through which light is incident, an image sensor through which light incident through the lens is captured, and a number of components for transmitting and receiving electrical signals for an image obtained from the image sensor to an electronic device equipped with the camera device. included In addition, these image sensors and components are generally mounted on a printed circuit board and connected to external electronic devices.

The image sensor is a semiconductor-based sensor that receives light and generates an electrical signal, and may include a pixel array having a plurality of pixels and a logic circuit for driving the pixel array and generating an image. The plurality of pixels may include a photodiode generating charge in response to light and a pixel circuit outputting a pixel signal using the charge generated by the photodiode. The image sensor may generate image data from pixel signals and transmit the image data to an external processor through a predetermined interface.

At this time, the image sensor may exchange data with an external device based on MIPI (Mobile Industry Processor Interface). For example, the MIPI (Mobile Industry Processor Interface) includes a D-phy interface, and data can be exchanged with an external device through the D-phy interface. As another example, the MIPI includes a C-phy interface, and data can be exchanged with an external device through the C-phy interface.

On the other hand, recently, the resolution of an image sensor is gradually increasing from 32M to 64M and from 64M to 108M. Also, as the resolution of an image sensor increases, the number of bits to be transmitted per second increases exponentially.

Accordingly, a camera module capable of minimizing the effect of noise while improving the data transmission speed of the MIPI signal transmission line as the image sensor becomes increasingly high-resolution is required.

In an embodiment, a circuit board capable of improving the data transmission speed of a MIPI signal transmission line, a camera module, and an optical device including the same are provided.

In addition, in the embodiment, a circuit board, a camera module, and an optical device including the same are provided to minimize the effect of noise by lowering the specific resistance of the MIPI signal transmission line.

In addition, in the embodiment, a circuit board capable of minimizing signal interference between a clock line and a plurality of data lines constituting a MIPI signal transmission line, a camera module, and an optical device including the same are provided.

In addition, the embodiment provides a circuit board, a camera module, and an optical device including the same that can minimize signal interference between a MIPI signal transmission line and a signal line (eg, a power line or a communication line) other than the MIPI signal transmission line. .

Technical problems to be solved in the embodiments are not limited to the above-mentioned technical problems, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below. You will be able to.

A circuit board according to an embodiment includes a terminal pad connected to an image sensor; Connectors connected to external devices; and a signal line connecting between the pad and the connector, wherein the terminal pad includes a first terminal pad connected to a Mobile Industry Processor Interface (MIPI) terminal of the image sensor, and a first terminal pad other than the first terminal pad. two terminal pads, wherein the signal line connects between the first terminal pad and the connector, and connects a first signal line formed of a first metal material and between the second terminal pad and the connector; and a second signal line including a second metal material different from the first metal material.

Also, the first metal material includes silver (Ag).

Also, the line width of the first signal line is smaller than the line width of the second signal line.

In addition, in the first signal line, the MIPI terminal is a D-PHY interface terminal for outputting an image signal and a clock signal in a differential signal method, and the first signal line includes a first group outputting a differential image signal. 1-1 differential signal lines, 1-2 differential signal lines outputting differential image signals of the second group, 1-3 differential signal lines outputting differential image signals of the third group, and It includes first to fourth differential signal lines for outputting differential image signals and first to fifth differential signal lines for outputting differential clock signals.

In addition, the second signal line includes a ground line connected to the ground terminal, a communication line connected to the communication terminal, and a power line connected to the power terminal.

In addition, the ground line includes a first ground line disposed between the 1-1 differential signal line and the 1-2 differential signal line, the 1-2 differential signal line and the 1-3 differential signal line A second ground line disposed between lines, a third ground line disposed between the 1-3 differential signal lines and the 1-4 differential signal lines, and the 1-4 differential signal lines and the first -5 includes a fourth ground line disposed between the differential signal lines.

In addition, the 1-1st to 1-5th differential signal lines are disposed not adjacent to the communication line and the power supply line.

Further, the ground line includes a fifth ground line disposed between at least one of the 1-1 to 1-5 differential signal lines and the communication line or the power supply line.

In addition, in the first signal line, the MIPI terminal is a C-PHY interface terminal outputting an image signal in a single-ended manner, and the first signal line includes a 1-1 signal outputting a first group of image signals. line, 1-2 signal lines for outputting the second group of image signals, and 1-3 signal lines for outputting the third group of image signals.

In addition, the second signal line includes a ground line connected to a ground terminal, a communication line connected to a communication terminal, and a power supply line connected to a power terminal, and the ground line includes the 1-1 signal line and a first ground line disposed between the 1-2 signal lines and a second ground line disposed between the 1-2 signal lines and the 1-3 signal lines.

In addition, the 1-1 to 1-3 signal lines are disposed not adjacent to the communication line and the power line.

Further, the ground line includes a third ground line disposed between at least one of the 1-1 to 1-3 signal lines and the communication line or the power supply line.

In addition, the camera module of the embodiment includes an image sensor mounted on the circuit board; and a first connection wire part connecting a terminal of the image sensor and the first terminal pad of the circuit board. and a second connection wire portion connecting a terminal of the image sensor and the second terminal pad of the circuit board, wherein the first connection wire portion includes a metal material different from that of the second connection wire portion.

In addition, the first connection wire part includes a silver (Ag) nanowire, and the second connection wire part includes a copper wire.

A circuit board according to an embodiment includes a terminal pad connected to an image sensor or a lens driving device. The terminal pad includes a first terminal pad connected to a terminal of the image sensor from which an image signal is output and a second terminal pad other than the first terminal pad. For example, the first terminal pad may be connected to a differential terminal and a clock terminal for outputting an image signal of an image sensor using a D-PHY interface of MIPI (Mobile Industry Processor Interface). Alternatively, the first terminal pad may be connected to an image signal output terminal of an image sensor using a C-PHY interface of MIPI (Mobile Industry Processor Interface). Also, the second terminal pad may be connected to a communication terminal, a ground terminal, and a power terminal of the image sensor, or connected to the sensor driving device.

And, in an embodiment, the circuit board includes a connector for data communication by being connected to an external device. At this time, the circuit board includes a first signal line connecting between the connector and the first terminal pad, and a second signal line connecting between the second terminal pad and the connector. In this case, in an embodiment, the first signal line and the second signal line may be formed of different metal materials. For example, the first signal line is an image signal output line connected to a C-PHY interface or a D-PHY interface of MIPI (Mobile Industry Processor Interface). Accordingly, the first signal line may be formed of a metal material including silver (Ag) to increase signal transmission speed and minimize noise effects. And, the second signal line is a line for connecting power, communication signal or ground. As described above, in the embodiment, by forming the first signal line with a metal material including silver, it is possible to improve the transmission speed of the image signal according to MIPI (Mobile Industry Processor Interface). In addition, in the embodiment, the effect of noise on the image signal of the MIPI (Mobile Industry Processor Interface) can be minimized, and image quality can be improved accordingly. In addition, in the embodiment, copper is included in the second signal line, so that power transfer characteristics and communication performance can be improved, and manufacturing cost can be reduced.

In addition, in the embodiment, since the first signal line is formed of a metal material including silver, an etching factor may be improved during an etching process of the pattern layer, and thus the width of the first signal line may be reduced. . For example, the first signal line formed of a metallic material including silver may have a smaller line width than that of the second signal line including copper. Accordingly, in the embodiment, as the line width of the first signal line is reduced, the volume of the circuit board may be reduced, and thus the volume of the camera module may be reduced.

In addition, the first signal line in the embodiment is divided into a plurality of groups. In this case, the first signal lines of the plurality of groups are arranged not to be adjacent to each other and not to be adjacent to the communication line or the power supply line of the second signal line. Preferably, a ground line of the second signal line is disposed between the first signal lines of the plurality of groups. Accordingly, in the embodiment, interference between the first signal lines of the plurality of groups or interference caused by the communication line or power supply line of the second signal line can be minimized, thereby improving signal quality. .

In addition, in the embodiment, a connecting wire unit for connecting a terminal of the image sensor and a terminal pad of the circuit board is included. In this case, the connection wire part connects a first connection wire part connecting between the terminal of the image sensor and the first terminal pad of the circuit board, and between the terminal of the image sensor and the second terminal pad of the circuit board. It includes a second connecting wire portion to. In this case, the first connection wire part is formed of a wire containing silver, and the second connection wire part is formed of a wire containing copper. Accordingly, in the embodiment, the transmission speed of the image signal of the camera module can be further improved, and furthermore, the signal quality can be further improved by minimizing the effect of noise.

1 is an exploded perspective view of a camera module according to an embodiment.
2 is a cross-sectional view of the camera module of FIG. 1 according to an embodiment.
3 is an enlarged view of a dotted line portion of FIG. 2 .
4 is a view for explaining a metal material constituting a part of a pattern layer or a part of a connection wire according to an embodiment.
5 is a plan view for explaining the arrangement structure of the pattern layer of the circuit board according to the first embodiment.
6 is a diagram for explaining a disposition structure of a pattern layer of a circuit board according to a second embodiment.
7 is a perspective view of a portable terminal according to an embodiment.
FIG. 8 is a configuration diagram of the portable terminal shown in FIG. 7 .

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical idea of the present invention is not limited to some of the described embodiments, but may be implemented in a variety of different forms, and if it is within the scope of the technical idea of the present invention, one or more of the components among the embodiments can be selectively implemented. can be used by combining and substituting.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless explicitly specifically defined and described, can be generally understood by those of ordinary skill in the art to which the present invention belongs. It can be interpreted as meaning, and commonly used terms, such as terms defined in a dictionary, can be interpreted in consideration of contextual meanings of related technologies.

Also, terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In this specification, the singular form may also include the plural form unless otherwise specified in the phrase, and when described as "at least one (or more than one) of A and (and) B and C", A, B, and C are combined. may include one or more of all possible combinations.

Also, terms such as first, second, A, B, (a), and (b) may be used to describe components of an embodiment of the present invention. These terms are only used to distinguish the component from other components, and the term is not limited to the nature, order, or order of the corresponding component. And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected to, combined with, or connected to the other component, but also with the component. It may also include the case of being 'connected', 'combined', or 'connected' due to another component between the other components.

In addition, when it is described as being formed or disposed on the "top (above) or bottom (bottom)" of each component, the top (top) or bottom (bottom) is not only a case where two components are in direct contact with each other, but also one A case in which another component above is formed or disposed between two components is also included. In addition, when expressed as "up (up) or down (down)", it may include the meaning of not only the upward direction but also the downward direction based on one component.

An optical axis direction used below may be defined as an optical axis direction of a lens coupled to a camera actuator and a camera module, and a vertical direction may be defined as a direction perpendicular to the optical axis.

The autofocus function used below is a function that automatically focuses on a subject by adjusting the distance to the image sensor by moving the lens in the direction of the optical axis according to the distance of the subject so that a clear image of the subject can be obtained on the image sensor. can be defined

Meanwhile, auto focus may correspond to auto focus (AF). In addition, CLAF (closed-loop auto focus) control is defined as real-time feedback control of the lens position by detecting the distance between the image sensor and the lens to improve the accuracy of focus adjustment. can do.

In addition, prior to the description of the embodiment of the invention, the first direction may mean the x-axis direction shown in the drawing, and the second direction may be a direction different from the first direction. For example, the second direction may mean a y-axis direction shown in the drawing as a direction perpendicular to the first direction. Also, the third direction may be a direction different from the first and second directions. For example, the third direction may refer to a z-axis direction shown in the drawing as a direction perpendicular to the first and second directions. Here, the third direction may mean an optical axis direction.

1 is an exploded perspective view of a camera module according to an embodiment, FIG. 2 is a cross-sectional view of the camera module of FIG. 1 according to an embodiment, and FIG. 3 is an enlarged view of a dotted line portion in FIG. 2 .

1 to 3, the camera module 200 includes a lens or lens barrel 400, a lens driving device 100, a filter 610, a holder 600, a circuit board 800, and a reinforcing plate 900. ) and an image sensor 810. Here, the “camera module” may be expressed as “photographer” or “camera”, and the holder 600 may be expressed as a sensor base. In addition, the camera module 200 may further include a blocking member 1500 disposed on the filter 610 . In addition, the camera module 300 may further include a third adhesive member 612 .

In addition, the camera module 300 may further include a motion sensor 820, a controller 830, and a connector 840.

A lens or lens barrel 400 may be mounted on the bobbin 110 of the lens driving device 100 .

The lens driving device 100 may drive the lens or the lens barrel 400.

The camera module 200 may be any one of an auto focus (AF) camera module and an optical image stabilizer (OIS) camera module. A camera module for AF refers to one capable of performing only an auto focus function, and a camera module for OIS refers to one capable of performing an auto focus function and an OIS (Optical Image Stabilizer) function.

For example, the lens driving device 100 may be a lens driving device for AF or a lens driving device for OIS, where the meanings of "for AF" and "for OIS" are as described in the camera module for AF and the camera module for OIS. can be the same

For example, the lens driving device 100 of the camera module 200 may be a lens driving device for OIS.

The lens driving device 100 includes a housing 140, a bobbin 110 disposed in the housing 140 and for mounting a lens or lens barrel 400, a first coil 120 disposed in the bobbin 110, a housing The magnet 130 disposed on the 140 and facing the first coil 120, at least one upper elastic member (not shown) coupled to the upper part of the bobbin 110 and the upper part of the housing 140, the bobbin 110 ) and at least one lower elastic member (not shown) coupled to the lower part of the housing 140, the second coil 230 disposed under the bobbin 110 (or/and the housing 140), the second A driving substrate 250 disposed below the coil 230 and a base 210 disposed below the driving substrate 250 may be included.

In addition, the lens driving device 100 may further include a cover member 300 coupled to the base 210 and providing a space for accommodating elements of the lens driving device 100 together with the base 210. .

In addition, the lens driving apparatus 100 may further include a support member (not shown) electrically connecting the driving substrate 250 and the upper elastic member and supporting the housing 140 with respect to the base 210 . Each of the first coil 120 and the second coil 230 may be electrically connected to the driving substrate 250 and may receive a driving signal (driving current) from the driving substrate 250 .

For example, the upper elastic member may include a plurality of upper springs, the support member may include support members connected to the upper springs, and the first coil 120 is driven by the driving substrate through the upper springs and the support member. (250) and can be electrically connected. The driving substrate 250 may include a plurality of terminals, and some of the plurality of terminals may be electrically connected to each of the first coil 120 and/or the second coil 230 .

The bobbin 110 and the lens or lens barrel 400 coupled thereto may be moved in the direction of the optical axis by the electromagnetic force generated by the interaction between the first coil 120 and the magnet 130, and thereby the bobbin 110 As the displacement in the optical axis direction is controlled, AF driving can be implemented.

In addition, the housing 140 may be moved in a direction perpendicular to the optical axis by the electromagnetic force generated by the interaction between the second coil 230 and the magnet 130, and thus hand shake correction or OIS driving may be implemented.

In addition, for AF feedback driving, the lens driving device 100 of the camera module 200 includes a sensing magnet (not shown) disposed on the bobbin 110 and an AF position sensor (eg, disposed on the housing 140). , a hall sensor (not shown) may be further included. In addition, the lens driving apparatus 100 may further include a circuit board (not shown) disposed on the housing or/and the base and on which the AF position sensor is disposed or mounted. In another embodiment, the AF position sensor may be disposed on the bobbin, and the sensing magnet may be disposed on the housing. In addition, the lens driving device 100 may further include a balancing magnet disposed on the bobbin 110 to correspond to the sensing magnet.

The AF position sensor may output an output signal according to a result of sensing the strength of the magnetic field of the sensing magnet according to the movement of the bobbin 100 . The AF position sensor may be electrically connected to the driving substrate 250 through the upper elastic member (or lower elastic member) or/and the support member. The driving substrate 250 may provide a driving signal to the AF position sensor, and an output of the AF position sensor may be transmitted to the driving substrate 250 .

In another embodiment, the lens driving device 100 may be a lens driving device for AF, and the lens driving device for AF includes a housing, a bobbin disposed inside the housing, a coil disposed in the bobbin, and a magnet disposed in the housing. , at least one elastic member coupled to the bobbin and the housing, and a base disposed below the bobbin (or/and housing).

For example, the elastic member may include the above-described upper elastic member and lower elastic member.

A driving signal (eg, driving current) may be provided to the coil, and the bobbin may be moved in an optical axis direction by electromagnetic force generated by an interaction between the coil and the magnet.

In another embodiment, the coil may be disposed in the housing and the magnet may be disposed in the bobbin.

In addition, for AF feedback driving, the AF lens driving device includes a sensing magnet disposed on the bobbin, an AF position sensor (eg, a hall sensor) disposed on the housing, and an AF position sensor disposed on the housing or And/or may further include a driving substrate disposed or mounted on the base In another embodiment, the AF position sensor may be disposed on the bobbin and the sensing magnet may be disposed on the housing.

The camera module according to another embodiment may include a housing coupled to the lens or lens barrel 400 instead of the lens driving device 100 of FIG. 3 and fixed to the lens or lens barrel 400, and the housing may include a holder. It can be coupled or attached to the upper surface of (600). The housing attached or fixed to the holder 600 may not be moved, and the position of the housing may be fixed while attached to the holder 600 .

The driving board may be electrically connected to the coil and the AF position sensor, a driving signal may be provided to each of the coil and the AF position sensor through the driving board, and an output of the AF position sensor may be transmitted to the circuit board.

Meanwhile, the driving board 250 may be electrically connected to the circuit board 800 to be described below and receive an electrical signal from the circuit board 800 . For example, the driving board 250 receives power through a power line (not shown) connected to the circuit board 800, and through this, the first coil 120 and/or the second coil 230 are supplied with power. current can be provided.

In addition, a communication line may be further included between the driving board 250 and the circuit board 800 . Also, the driving board 280 may receive a communication signal provided from the circuit board 800 through the communication line. Here, the communication signal is information on current to be provided to the first coil 120 and/or the second coil 230 (eg, current intensity and current direction) or a control signal for driving. can include

The holder 600 may be disposed below the base 210 of the lens driving device 100 .

The filter 610 is mounted on the holder 600, and the holder 600 may include a seating portion 500 on which the filter 610 is seated.

The adhesive member 612 may couple or attach the base 210 of the lens driving device 100 to the holder 600 . For example, the third adhesive member 612 may be disposed between the lower surface of the base 210 and the upper surface of the holder 600, and may adhere both to each other.

The third adhesive member 612 may serve to prevent foreign matter from entering the lens driving device 100 in addition to the above-described adhesive function. For example, the third adhesive member 612 may be an epoxy, a thermosetting adhesive, or an ultraviolet curable adhesive.

The filter 610 may be disposed within the seating portion 500 of the holder 600 .

The seating portion 500 of the holder 600 may include a protrusion (not shown) protruding from the upper surface of the holder 600, but is not limited thereto. In another embodiment, the seating portion may be in the form of a recess, cavity, or hole recessed from the upper surface of the holder 600 .

The protruding portion of the mounting portion 500 may serve to prevent contact or collision of the lower end of the lens or lens barrel 400 with the filter 610 (or/and the blocking member 1500).

The protruding portion of the seating portion 500 may protrude along the side of the filter 610 in the optical axis direction. For example, the protrusions may be disposed around the side of the filter 610 to wrap around the side of the filter 610 .

The inner side of the protrusion may be provided to face the side of the filter 610, and both may be spaced apart from each other. This is to secure a processing tolerance for easily mounting the filter 610 inside the mounting portion 500 of the holder 600 .

In addition, an upper surface of the protruding part of the seating part 500 may be located higher than the upper surface of the filter 610 in the optical axis direction. This means that when the lens or lens barrel 400 is mounted on the lens driving device 100 and moves in the direction of the optical axis or moves toward the filter 610 by an external impact, the lower end of the lens or lens barrel 400 This is to prevent direct collision with the filter 610.

The shape of the protruding portion of the seating portion 500 viewed from above may match the shape of the filter 610, but is not limited thereto. In another embodiment, the shape of the protruding portion of the seating portion 500 may be similar to or different from that of the filter 610 .

The holder 600 may have an opening 501 formed at a portion where the filter 610 is mounted or disposed so that light passing through the filter 610 may be incident to the image sensor 810 .

For example, the opening 501 may pass through the holder 600 in the optical axis direction, and may be expressed as a “through hole” instead.

For example, the opening 501 may pass through the center of the holder 600 and may be provided in the seating portion 500 , and the area of the opening 501 may be smaller than that of the filter 610 .

The holder 600 is disposed on the circuit board 800 and may accommodate the filter 610 therein. The holder 600 may support the lens driving device 100 located on the upper side. A lower surface of the base 210 of the lens driving apparatus 100 may be disposed on an upper surface of the holder 600 .

For example, the lower surface of the base 210 of the lens driving apparatus 100 may contact the upper surface of the holder 600 and may be supported by the upper surface of the holder 600 .

For example, the filter 610 may be disposed within the seating portion 500 of the holder 600 .

The filter 610 may serve to block light of a specific frequency band from light passing through the lens barrel 400 from being incident to the image sensor 810 .

For example, the filter 610 may be an infrared cut filter, but is not limited thereto. For example, the filter 610 may be disposed parallel to an x-y plane perpendicular to the optical axis OA.

The filter 610 may be attached to the mounting portion 500 of the holder 600 by an adhesive (not shown) such as UV epoxy.

The circuit board 800 may be disposed under the holder 600 , and the holder 600 may be disposed on the upper surface of the circuit board 800 .

The holder 600 may be attached or fixed to the upper surface of the circuit board 800 by an adhesive member such as epoxy, thermosetting adhesive, or UV curable adhesive. In this case, the adhesive member may be disposed between the lower surface of the holder 600 and the upper surface of the circuit board 800 .

An image sensor 810 may be disposed in a region of the circuit board 800 corresponding to the opening 501 of the holder 600 . For example, the image sensor 810 may be attached or fixed on the circuit board 800 overlapping the opening 501 of the holder 600 in the optical axis direction.

The reinforcing plate 900 is disposed below the circuit board 800 .

In this case, the circuit board 800 may include a wire part 805 . Specifically, the circuit board 800 may include a wire part 805 disposed in a region corresponding to the opening 501 of the holder 600 . Also, the wire part 805 may overlap an area of the upper surface of the circuit board 800 where the image sensor 810 is disposed in an optical axis direction.

The wire part 805 may be attached to the circuit board 800 through a thermal compression method or an ultrasonic compression method. Specifically, the wire part 805 may be a wire bonded to the bonding pad 802 of the circuit board 800 . The wire part 805 is not electrically connected to the image sensor 810 . That is, the wire part 805 is not for a signal transmission function between the circuit board 800 and the image sensor 810, but is used to transmit the image sensor 810 when the image sensor 810 is attached. can serve as a support.

That is, in the embodiment, a wire portion 805 is formed by bonding wires on the bonding pad 802 of the circuit board 800, and the image sensor 810 is placed on the formed wire portion 805. In , an attachment process of the image sensor 810 is performed. At this time, in the attaching process of the image sensor 810 , a specific area of the lower surface of the image sensor 810 may be supported by the wire part 805 . Accordingly, in the embodiment, warping of the image sensor 810 can be minimized, and thus reliability can be improved.

The wire part 805 may protrude from the circuit board 800 in an optical axis direction. For example, in the multi-layer structure of the circuit board 800, the wire part 805 may be located higher than the top surface of the uppermost layer.

Meanwhile, the image sensor 810 supported and attached by the wire part 805 may be electrically connected to the circuit board 800 through the connection wire 21 . For example, the connection wire 21 may connect the terminal 813 of the image sensor 810 and the terminal pad 803 of the circuit board 800 to each other.

That is, the lower surface of the image sensor 810 in the embodiment contacts the wire unit 805, and the terminal 813 on the upper surface is connected to the connection wire 21. In this case, the wire part 805 and the connection wire 21 may be formed using wires of the same material. Alternatively, the wire part 805 and the connection wire 21 may be formed using wires of different materials. That is, the wire part 805 is used for simple support of the image sensor 810 rather than performing an electrical signal transmission function. Accordingly, the wire part 805 may include a metal material that can be bonded to the bonding pad 802 of the circuit board 800 through bonding while having a certain strength regardless of signal transmission performance. For example, the wire part 805 may include a wire made of at least one of gold (Au), copper (Cu), aluminum (Al), and silver (Ag). Meanwhile, the connection wire 21 serves as a wire electrically connecting the circuit board 800 and the image sensor 810 . Accordingly, the connection wire 21 may include a metal wire made of a material capable of minimizing transmission loss while enabling signal transmission.

Meanwhile, in the embodiment, the connection wire 21 electrically connects a terminal pad 803 disposed on the circuit board 800 and a terminal 813 of the image sensor 810 . At this time, the connection wire 21 includes a first connection wire portion (not shown) including a first metal material and a second connection wire portion (not shown) including a second metal material. In this case, the first metal material and the second metal material may be different from each other. For example, the first metal material may include silver (Ag) having a relatively low resistivity value. In addition, the second metal material may include copper (Cu), which has a higher specific resistance value than the silver (Ag) and is relatively inexpensive.

In this case, the first connection wire part may be connected to the first terminal pad 803a corresponding to the MIPI line among the terminal pads 803 . Also, the second connection wire part may be connected to a second terminal pad 803b corresponding to a line other than the MIPI line among the terminal pads 803 .

That is, the image sensor 810 includes a plurality of terminals, and among the terminals, a first terminal for transmitting data according to the MIPI standard and a second terminal excluding the first terminal are included.

For example, the second terminal may include a ground terminal, a communication terminal, and a power terminal.

In an embodiment, the first connection wire portion connecting the first terminal corresponding to the MIPI line of the image sensor 810 and the first terminal pad 803a is formed of a wire containing silver (Ag). . And, in an embodiment, a second connection wire portion connecting a second terminal including a ground terminal, a communication terminal, and a power terminal of the image sensor 810 and the second terminal pad 803b includes copper (Cu) It is formed from a wire that

Accordingly, in the embodiment, the first connection wire portion includes silver having a relatively low resistivity value, thereby increasing the transmission speed of data transmitted through the MIPI line and minimizing the influence of noise. In addition, in the embodiment, the image quality can be improved by minimizing the effect of noise on data transmitted through the MIPI line. This will be described in more detail below.

The reinforcing plate 900 is a plate-like member having a predetermined thickness and hardness, and can stably support the circuit board 800 and furthermore the image sensor 810, and is capable of stably supporting the circuit board 800 by external impact or contact. ) or damage to the image sensor 810 can be suppressed.

In addition, the reinforcing plate 900 may improve a heat dissipation effect of dissipating heat generated from the image sensor 810 and the circuit board 800 to the outside.

For example, the reinforcing plate 900 may be formed of a metal material having high thermal conductivity, such as SUS or aluminum, but is not limited thereto. In another embodiment, the reinforcing plate 900 may be formed of glass epoxy, plastic, or synthetic resin.

In addition, the reinforcing plate 900 may serve as a ground for protecting the camera module from electrostatic discharge protection (ESD) by being electrically connected to the ground terminal of the circuit board 800 .

The bonding pad 802 of the circuit board 800 may include a surface treatment layer (not shown) on an upper surface. For example, the bonding pad 802 may include a surface treatment layer containing nickel (Ni) on its surface. At this time, the wire part 805 is bonded on the bonding pad 802 . Accordingly, the surface treatment layer of the bonding pad 802 may include a metal layer having good bonding properties with the wire part 805 . For example, when the wire portion 805 is a copper wire, the surface treatment layer of the bonding pad 802 may include a nickel layer. For example, when the wire part 805 is a gold (Au) wire, the surface treatment layer of the bonding pad 802 includes a first surface treatment layer containing nickel (Ni) and palladium (Pd). It may include a second surface treatment layer to. The surface treatment layer of the bonding pad 802 may be a metal layer capable of improving bonding properties with the wire portion 805 while preventing oxidation of the bonding pad 802 .

The image sensor 810 may be a part where light passing through the filter 610 is incident and an image including the light is formed.

The circuit board 800 may include various circuits, elements, and controllers to convert an image formed by the image sensor 810 into an electrical signal and transmit the converted electrical signal to an external device. A circuit pattern electrically connected to the image sensor and various elements may be formed on the circuit board 800 .

The holder 600 may be replaced with the first holder, and the circuit board 800 may be replaced with the second holder.

The image sensor 810 may receive an image included in light incident through the lens driving device 100 and convert the received image into an electrical signal.

The filter 610 and the image sensor 810 may be spaced apart from each other so as to face each other in the optical axis OA direction or in the first direction.

Also, the protrusion 500a of the holder 600 may be disposed to face the filter 610 in the optical axis direction.

The blocking member 1500 may be disposed on an upper surface of the filter 610 . The blocking member 1500 may be expressed as a “masking unit” instead.

For example, the blocking member 1500 may be disposed on an edge area of the upper surface of the filter 610, and at least a portion of the light incident toward the edge area of the filter 610 passes through the lens or lens barrel 400. It may serve to block passage through the filter 610. For example, the blocking member 1500 may be coupled or attached to an upper surface of the filter 1610 .

For example, the filter 610 may be formed in a quadrangular shape when viewed in the optical axis direction, and the blocking member 1500 may be formed symmetrically with respect to the filter 610 along each side of the upper surface of the filter 610 .

In this case, the blocking member 1500 may be formed to have a constant width on each side of the upper surface of the filter 1610 .

The blocking member 1500 may be formed of an opaque material. For example, the blocking member 1500 may be provided with an opaque adhesive material applied to the filter 610 or may be provided in the form of a film attached to the filter 610 .

The filter 610 and the image sensor 810 may be disposed to face each other in the optical axis direction, and the blocking member 1500 may include a terminal pad 803 disposed on the circuit board 800 in the optical axis direction and/or a connecting wire ( 21) may overlap at least in part.

The connecting wire 21 and the terminal pad 803 may be formed of a conductive material such as gold (Au), silver (Ag), copper (Cu), or a copper alloy, and such a conductive material has a property of reflecting light. can have Light passing through the filter 610 may be reflected by the terminal pad 803 of the circuit board 800 and the connection wire 21, and an instantaneous flash, that is, a flare phenomenon may occur due to the reflected light. This flare phenomenon may distort an image formed on the image sensor 810 or deteriorate image quality.

Since the blocking member 1500 is disposed so as to overlap at least a portion of the terminal pad 803 and/or the connection wire 21 in the optical axis direction, among the light passing through the lens or lens barrel 400, the terminal of the circuit board 800 By blocking the light directed to the pad 803 or/and the connection wire 21, the above-described flare phenomenon can be prevented, and accordingly, an image formed on the image sensor 810 is not distorted or the image quality is degraded. can do.

The motion sensor 820 may be mounted or disposed on the circuit board 800 and electrically connected to the controller 830 through a circuit pattern provided on the circuit board 800 .

The motion sensor 820 outputs rotational angular velocity information caused by the movement of the camera module 200 . The motion sensor 820 may be implemented as a 2-axis or 3-axis gyro sensor or an angular velocity sensor.

The controller 830 is mounted or disposed on the circuit board 800 .

The circuit board 800 may be electrically connected to the lens driving device 100 . For example, the circuit board 800 may be electrically connected to the driving board 250 of the lens driving device 100 .

For example, a driving signal may be provided to each of the first coil 120 and the second coil 230 of the lens driving device 100 through the circuit board 800, and the AF position sensor (or OIS position sensor) A driving signal may be provided. Also, the output of the AF position sensor (or OIS position sensor) may be transmitted to the circuit board 800 .

The connector 840 is electrically connected to the circuit board 800 and may include a port to be electrically connected to an external device.

A first adhesive member 1750 may be disposed between the circuit board 800 and the image sensor 810, and the image sensor 810 may be attached or attached to the circuit board 800 by the first adhesive member 1750. can be fixed

In addition, a second adhesive member 1700 may be disposed between the reinforcing plate 900 and the circuit board 800 . The reinforcing plate 900 may be attached or fixed to the lower surface of the circuit board 800 through the second adhesive member 1700, and thus may be connected to the ground of the circuit board 800.

Meanwhile, the circuit board 800 may include a first area overlapping the image sensor 810 in an optical axis direction and a second area other than the first area.

Also, the image sensor 810 may be supported or fixed to the wire part 805 formed in the first area of the circuit board 800 . For example, at least a part of the lower surface of the image sensor 810 may directly contact the wire part 805 . That is, the first adhesive member 1750 in the embodiment may be selectively formed in an area where the wire part 805 is not disposed in the first area. Accordingly, at least a first portion of the lower surface of the image sensor 810 may directly contact the wire portion 805 and at least a second portion may directly contact the first adhesive member 1750 . That is, the second part of the image sensor 810 may be attached or fixed to the first adhesive member 1750 while the first part is supported by the wire part 805 . Accordingly, in the embodiment, at least the first portion of the image sensor 810 directly contacts the wire portion 805, thereby minimizing the bending of the image sensor 810. Also, in the embodiment, heat generated from the image sensor 810 may be efficiently transferred to the outside by directly contacting at least a first portion of the image sensor 810 with the wire portion 805 .

Meanwhile, in the embodiment, an area of the image sensor 810 may be larger than an area of the first adhesive member 1750 . That is, only a part of the entire lower surface of the image sensor 810 may contact the first adhesive member 1750 . For example, only the central region of the lower surface of the image sensor 810 may selectively contact the first adhesive member 1750 .

In this case, the first adhesive member 1750 may be disposed spaced apart from the wire part 805 on the circuit board 800 . For example, a predetermined separation space may be formed between the wire part 805 and the first adhesive member 1750 on the upper surface of the circuit board 800 .

Meanwhile, the first adhesive member 1750 may be an epoxy, a thermosetting adhesive, an ultraviolet curable adhesive, or an adhesive film, but is not limited thereto.

In addition, the second adhesive member 1700 may be an epoxy, a thermosetting adhesive, an ultraviolet curable adhesive, or an adhesive film, but is not limited thereto.

A more detailed description of the basic layer structure of the circuit board 800 is as follows.

The circuit board 800 includes an insulating layer 801 , a bonding pad 802 , a terminal pad 803 , a protective layer 804 and a wire part 805 .

The circuit board 800 includes an insulating layer 801 . The insulating layer 801 may include a plurality of layers within the circuit board 800 . However, in the drawings, a plurality of insulating layers are outlined as one layer for convenience of description.

The insulating layer 801 may be a rigid insulating layer. For example, the circuit board 800 may include a rigid region including a hard insulating layer and a flexible region including a flexible insulating layer. Also, in the circuit board 800, the region where the image sensor 810 is disposed is a rigid region having a certain strength, and accordingly, the insulating layer 801 may also be a rigid insulating layer. For example, the insulating layer 801 may include a hard insulating layer having greater strength or greater hardness than a soft insulating layer, such as prepreg. The insulating layer 801 may be replaced with an insulating film or an insulating film.

A pattern layer may be formed on an upper surface of the insulating layer 801 . The pattern layer may include a bonding pad 802 and a terminal pad 803 disposed on an upper surface of the insulating layer 801 . The terminal pad 803 is electrically connected to the image sensor 810, and thus can transmit a signal to the image sensor 810 or receive a signal transmitted from the image sensor 810. Accordingly, the terminal pad 803 can be said to be an effective pattern.

In addition, the pattern layer may include a bonding pad 802 disposed on an upper surface of the insulating layer 801 . The bonding pad 802 does not function to transmit electrical signals, and allows the wire unit 805 to be attached through bonding. That is, the wire part 805 may be attached to a metal material having good bonding properties through bonding. Accordingly, bonding pads 802 may be selectively formed on the upper surface of the insulating layer 801 in regions where the wire parts 805 are to be disposed. The bonding pad 802 is not electrically connected to the image sensor 810, and thus may be referred to as a dummy pattern. Here, not being electrically connected may mean that a substantially valid signal is not transferred through the corresponding pattern.

The bonding pad 802 may be formed in an area overlapping the image sensor 810 disposed thereon in an optical axis direction.

Also, the terminal pad 803 may be spaced apart from the bonding pad 802 and may be formed in an area that does not overlap with the image sensor 810 in an optical axis direction. This means that the terminal pad 803 is electrically connected to the terminal of the image sensor 810 through wire bonding, so that the bonding operation of the connection wire 21 can be smoothly performed, and the image sensor 810 and It may be formed in an area that does not overlap in the optical axis direction.

The bonding pad 802 and the terminal pad 803 are selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). It may be formed of at least one metal material. In addition, the pad and the terminal pad 803 are selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn), which have excellent bonding strength It may be formed of a paste or solder paste containing at least one metal material. In addition, the bonding pad 802 and the terminal pad 803 may include at least one surface treatment layer formed of a metal material having high wire bonding properties.

The terminal pad 803 and the bonding pad 802 are formed using an additive process, a subtractive process, a modified semi additive process (MSAP), and a semi additive process (SAP), which are conventional manufacturing processes of printed circuit boards. Additive Process) method, etc., and a detailed description is omitted here.

A protective layer 804 is disposed on the insulating layer 801 . The protective layer 804 may cover and protect a pattern layer disposed on the insulating layer 801 that should not be exposed to the outside while protecting the surface of the insulating layer 801 . The protective layer 804 may include solder resist. That is, the protective layer 804 may be a solder resist layer.

The protective layer 804 has an opening exposing upper surfaces of the bonding pad 802 and the terminal pad 803 disposed on the upper surface of the insulating layer 801 . Accordingly, at least a portion of the upper surface of the bonding pad 802 and the terminal may be exposed through the opening of the protective layer 804 .

Meanwhile, an upper surface of the bonding pad 802 exposed through the opening of the protective layer 804 may be an area where the wire part 805 is bonded. Also, an upper surface of the terminal pad 803 exposed through the opening of the protective layer 804 may be an area where the connection wire 21 is bonded.

In addition, the connection wire 21 serves to electrically connect different components to each other, and thus both ends are connected to different components. For example, one end of the connection wire 21 is connected to the terminal pad 803 of the circuit board 800 and the other end is connected to the terminal 813 of the image sensor 810 .

Alternatively, the wire part 805 functions to support the image sensor 810, and thus both ends may be connected to one bonding pad 802. That is, the wire part 805 has one end and the other end connected to the bonding pad 802, has a height corresponding to the length between the one end and the other end, and may be disposed protruding above the bonding pad 802. .

Meanwhile, an opening of the protective layer 804 may not be formed in an area where the first adhesive member 1750 is to be disposed. Accordingly, the first adhesive member 1750 may be formed on the protective layer 804 to fix or attach the image sensor 810 .

An uppermost end of the wire portion 805 may be positioned higher than a top surface of the protective layer 804 . That is, the lowermost end of the wire portion 805 may be located higher than the lower surface of the protective layer 804 .

Meanwhile, a plurality of wire parts 805 may be formed to overlap the image sensor 810 and different corner parts of the lower surface in the optical axis direction. Accordingly, in the embodiment, the image sensor 810 can be stably supported by the wire part 805, and thus the flatness of the image sensor can be improved.

Hereinafter, the structure of the pattern layer of the circuit board 800 according to the embodiment will be described in detail.

4 is a view for explaining a metal material constituting a part of a pattern layer or a part of a connection wire 21 (eg, a first connection wire part) according to an embodiment, and FIG. 5 is a view for explaining the first embodiment. FIG. 6 is a plan view for explaining the arrangement structure of the pattern layer of the circuit board 800 according to the second embodiment.

Hereinafter, the structure of the pattern layer of the circuit board 800 according to the embodiment will be described with reference to FIGS. 4 to 6 .

Referring to FIG. 4 , a metal material constituting the first connection wire part and the first signal transmission line (L1a, L1b, L1c, L1d, and L1e in FIG. 5 and L3a, L3b, and L3c in FIG. 6) according to an embodiment. Silver may be a silver (Ag) nano wire. Silver nanowire refers to a metal material in which nanoscale silver (Ag) threads are layered and fixed with a polymer compound. Also, the silver nanowire is a metal material that can be patterned. Accordingly, in the embodiment, some signal lines constituting the pattern layer are formed of the silver nanowires.

At this time, the silver nanowire has a resistivity value relatively lower than that of other metal materials.

metal material Resistivity value (unit: 10 ^-8 Ω m) silver 1.59 Copper 1.68 aluminum 2.65 tungsten 5.6 steel 9.71 platinum 10.6 lead 22

Referring to Table 1, silver (Ag) has a resistivity value of 1.59*10 ^-8 Ω·m. This is characterized in that it is lower than the respective resistivity values of copper, aluminum, tungsten, iron, platinum and lead.

At this time, a general pattern layer or connection wire is formed of copper (Cu), which has a resistivity lower than that of aluminum, tungsten, iron, platinum, and lead and is relatively inexpensive.

However, as the resolution of the image sensor 810 increases, when a signal line of a connection wire or pattern layer is formed with a metal material containing copper (Cu), the signal transmission speed is low or reliability is low in terms of noise influence. do. Accordingly, in the embodiment, the specific connection wire and the signal line of the pattern layer include silver (Ag) instead of the copper, thereby increasing the signal transmission speed and minimizing the effect of noise.

Referring to FIG. 5 , the circuit board 800 according to the first embodiment may include a plurality of substrate areas.

For example, the circuit board 800 may include a first substrate area 800a, a second substrate area 800b, and a third substrate area 800c based on a direction perpendicular to the optical axis. The first substrate area 800a may be referred to as a hard area (rigid area). The first substrate area 800a has a certain level of strength, and thus may have an image sensor disposition area R1 where the image sensor 810 is disposed. In addition, the first substrate area 800a may have a certain level of strength or more to support a lens driving device or a lens barrel constituting the camera module.

Also, the second substrate region 800b may be a hard region like the first substrate region 800a. That is, a connector 840, which is a port electrically connecting the circuit board 800 and an external device, is disposed in the second substrate area 800b. Accordingly, the second substrate area 800b may have a certain level of strength or higher to support the connector 840 .

The third substrate area 800c may connect the first substrate area 800a and the second substrate area 800b. The third substrate area 800c may be a flexible area (flexible area).

The circuit board 800 in the embodiment includes a pattern layer (not shown).

The pattern layer may include the terminal pad 803 . Also, the pattern layer may include the bonding pad 802 . Also, the pattern layer may include a signal line connecting between the terminal pad 803 and the connector 840 or connecting between the circuit board 800 and the driving board 250 . The signal line may also be referred to as a trace.

At this time, the circuit board 800 of the first embodiment may exchange data with an external device through a predetermined interface. For example, the circuit board 800 may exchange data with an external device through MIPI (Mobile Industry Processor Interface). Preferably, the circuit board 800 may exchange data with an external device through a D-PHY interface of MIPI (Mobile Industry Processor Interface).

Accordingly, the terminal pad 803 of the circuit board 800 includes first terminal pads 803a1, 803a2, 803a3, 803a4, and 803a5 corresponding to a D-PHY interface of MIPI (Mobile Industry Processor Interface).

That is, the terminal pad 803 of the circuit board 800 is connected to a terminal corresponding to a D-PHY interface of MIPI (Mobile Industry Processor Interface) among terminals of the image sensor 810 through a first connection wire. 1 terminal pads 803a1, 803a2, 803a3, 803a4, and 803a5.

Also, the circuit board 800 includes second terminal pads 803b1 , 803b2 , 803b3 , 803b4 , and 803b5 other than the first terminal pads 803a1 , 803a2 , 803a3 , 803a4 , and 803a5 . For example, the second terminal pads 803b1 , 803b2 , 803b3 , 803b4 , and 803b5 may be connected to at least one of a communication terminal, a ground terminal, and a power terminal among terminals of the image sensor 810 .

For example, an example of the terminal 813 of the image sensor 810 may be shown in Table 2 below.

NO Symbol function One VDDH 1st analog power supply pin (2.8V) 2 VDDM 2nd analog power supply pin (1.8V) 3 VSSL Digital ground (for power) 4 VDDL 1st digital power supply pin (1.05V) 5 GND Digital ground (for MIPI lines) 6 D3P 3-1 Image signal output pin 7 D3N 3-2 Image signal output pin 8 GND Digital ground (for MIPI lines) 9 GND Digital ground (for MIPI lines) 10 D1P 1-1 image signal output pin 11 D1N 1-2 image signal output pin 12 GND Digital ground (for MIPI lines) 13 GND Digital ground (for MIPI lines) 14 CKP 1-1 clock signal output pin 15 CKN 1-2 clock signal output pin 16 GND Digital ground (for MIPI lines) 17 GND Digital ground (for MIPI lines) 18 D2P 2-1 Image signal output pin 19 D2N 2-2 Image signal output pin 20 GND Digital ground (for MIPI lines) 21 GND Digital ground (for MIPI lines) 22 D4P 4-1 Image signal output pin 23 D4N 4-2 Image signal output pin 24 GND Digital ground (for MIPI lines) 25 VSSH Analog ground (for power supply) 26 XCLR Digital input pin (CHIP CLEAR) 27 SDA Digital I/O (I2C pins) 28 SCL Digital I/O (I2C pins) 29 INCK Digital input pin (CLOCK INPUT) 30 GPO MONITOR SIGNAL OUT pin 31 SLASEL I2C slave address change pin 32 TENABLE TEST ENABLE pin 33 TESTOUT MONITOR SIGNAL OUT pin 34 FSTROBE Digital Output Pin (FLASH STROBE) 35 XVS Digital I/O (DUAL SYNC) 36 AGND analog ground

As shown in Table 2, the image sensor 810 using the D-PHY interface of MIPI (Mobile Industry Processor Interface) may include a total of 36 terminals.

Among the 36 terminals, a first terminal for exchanging signals through an actual MIPI (Mobile Industry Processor Interface) D-PHY interface and a second terminal other than the first terminal are included.

As the first terminal, in Table 2, terminal 6, terminal 7, terminal 10, terminal 11, terminal 14, terminal 15, terminal 18, terminal 19, terminal 22, terminal 23 can include Among the first terminals, terminals 6, 7, 10, 11, 18, 19, 22, and 23 are MIPI (Mobile Industry Processor Interface) D-PHY interfaces. A terminal for outputting an image signal through , and terminals 14 and 15 are terminals for outputting a clock signal corresponding to the image signal.

That is, the D-PHY interface of MIPI (Mobile Industry Processor Interface) can provide an image signal and a clock signal in a differential signal method. At this time, the image signal may be provided through four channels. Accordingly, in the case of the image sensor 810 using the D-PHY interface of MIPI (Mobile Industry Processor Interface), it includes eight image signal output terminals including positive terminals and negative terminals respectively corresponding to the four channels. In addition, in the case of the image sensor 810 using the D-PHY interface of MIPI (Mobile Industry Processor Interface), it includes two clock signal output terminals including positive and negative terminals for outputting a clock signal in a differential signal method.

The first terminal pads 803a1, 803a2, 803a3, 803a4, and 803a5 included in the circuit board 800 are terminals of the image sensor 810 using the D-PHY interface of MIPI (Mobile Industry Processor Interface), and image signals and a terminal through which a clock signal is output. Accordingly, the first terminal pads 803a1, 803a2, 803a3, 803a4, and 803a5 may include ten terminal pads.

The first terminal pads 803a1, 803a2, 803a3, 803a4, and 803a5 include the 1-1 terminal pad 803a1 corresponding to the image signal output line of the first channel and the second terminal pad 803a1 corresponding to the image signal output line of the second channel. 1-2 terminal pad 803a2, 1-3 terminal pad 803a3 corresponding to the image signal output line of the third channel, and 1-4 terminal pad 803a4 corresponding to the image signal output line of the fourth channel ), and 1-5 terminal pads 803a5 corresponding to the clock signal output line.

The 1-1st terminal pad 803a1 includes a 1-1st positive terminal pad 803a1-1 and a 1-1st negative terminal pad 803a1-2 for outputting the image signal of the first channel in a differential manner. includes

The 1-2nd terminal pad 803a2 includes a 1-2nd positive terminal pad 803a2-1 and a 1-2nd negative terminal pad 803a2-2 for outputting the image signal of the second channel in a differential manner. includes

The 1-3 terminal pad 803a3 includes a 1-3 positive terminal pad 803a3-1 and a 1-3 negative terminal pad 803a3-2 for outputting an image signal of a third channel in a differential manner. includes

The 1-4th terminal pad 803a4 includes a 1-4th positive terminal pad 803a5-1 and a 1-4th negative terminal pad 803a5-2 for outputting the image signal of the fourth channel in a differential manner. includes

The 1-5th terminal pad 803a5 includes a 1-5th positive terminal pad 803a5-1 and a 1-5th negative terminal pad 803a5-2 for outputting a clock signal in a differential manner.

Meanwhile, in Table 2, the second terminal pads 803b1, 803b2, 803b3, 803b4, and 803b5 are pads connected to terminals of the image sensor 810 other than the terminal through which the image signal or clock signal is output. For example, the second terminal pads 803b1 , 803b2 , 803b3 , 803b4 , and 803b5 are pads connected to a ground terminal, a communication terminal, and a power terminal among terminals of the image sensor 810 .

At this time, in the embodiment, the second terminal pads 803b1 , 803b2 , 803b3 , 803b4 , and 803b5 shown in FIG. 5 represent pads connected to the ground terminal among the terminals of the image sensor 810 .

For example, the second terminal pad includes a first ground pad 803b1, a second ground pad 803b2, a third ground pad 803b3, a fourth ground pad 803b4, and a fifth ground pad 803b5. can include Also, the second terminal pad further includes a communication pad or a power supply pad in addition to the ground pads.

Meanwhile, in the circuit board 800 of the embodiment, the terminal pad 803 includes a pad connected to the lens driving device in addition to a pad connected to the image sensor 810 . For example, the terminal pad 803 includes a pad connected to the driving substrate 250 constituting the lens driving device. And, in the terminal pad 803, a pad connected to the lens driving device may belong to the second terminal pad.

As described above, the terminal pad 803 included in the circuit board 800 of the embodiment includes a first terminal pad corresponding to a D-PHY interface of MIPI (Mobile Industry Processor Interface) and a second terminal pad other than the first terminal pad. Includes terminal pads.

Also, the circuit board 800 according to the embodiment includes a signal line connecting between the terminal pad 803 and the connector 840 .

For example, the signal line includes a first signal line connecting between the first terminal pad and the connector 840 and a second signal line connecting between the second terminal pad and the connector.

In this case, in an embodiment, the first signal line and the second signal line may be formed of different metal materials.

For example, the first signal line is a line outputting an image signal and a clock signal according to a D-PHY interface of MIPI (Mobile Industry Processor Interface). Accordingly, the first signal line may be formed of a metal material including silver (Ag) to increase signal transmission speed and minimize noise effects.

And, the second signal line is a line for connecting power, communication signal or ground. Accordingly, the second signal line may be formed of a metal material containing copper (Cu) different from that of the first signal line.

At this time, in the embodiment, since the first signal line is formed of a metal material including silver, during the etching process of the pattern layer, an etching factor can be improved, and accordingly, the width of the first signal line can be reduced. . For example, the first signal line formed of a metallic material including silver may have a smaller line width than that of the second signal line including copper. Accordingly, in the embodiment, as the line width of the first signal line is reduced, the volume of the circuit board 800 may be reduced, and thus the volume of the camera module may be reduced.

The first signal line includes a 1-1 signal line L1a connected to a 1-1 terminal pad 803a1 corresponding to the image signal output line of the first channel and an image signal output of the second channel. Connected to the 1-2 signal line L1b connected to the 1-2 terminal pad 803a2 corresponding to the line and to the 1-3 terminal pad 803a3 corresponding to the image signal output line of the third channel 1-3 signal lines L1c, 1-4 signal lines L1d connected to 1-4 terminal pads 803a4 corresponding to the image signal output lines of the fourth channel, and the clock signal and 1-5th signal lines L1e connected to 1-5th terminal pads 803a5 corresponding to output lines.

And, the 1-1st signal line (L1a), the 1-2nd signal line (L1b), the 1-3rd signal line (L1c), the 1-4th signal line (L1d), the 1-5th signal line ( As described above, L1e) may be formed of a first metal material including silver.

The 1-1 signal line L1a is connected to the 1-1 positive terminal pad 803a1-1 and the 1-1 negative terminal pad 803a1-2 outputting the image signal of the first channel in a differential manner. and two 1-1 differential signal lines L1a1 and L1a2.

In addition, the 1-2nd signal line L1b includes the 1-2nd positive terminal pad 803a2-1 and the 1-2nd negative terminal pad 803a2-2 outputting the image signal of the second channel in a differential manner. It includes two first-second differential signal lines L1b1 and L1b2 connected thereto.

In addition, the 1-3 signal line L1c includes the 1-3 positive terminal pad 803a3-1 and the 1-3 negative terminal pad 803a3-2 outputting the image signal of the third channel in a differential manner. It includes two 1st-3rd differential signal lines L1c1 and L1c2 connected thereto.

In addition, the 1-4th signal line L1d includes the 1-4th positive terminal pad 803a5-1 and the 1-4th negative terminal pad 803a5-2 outputting the image signal of the 4th channel in a differential manner. It includes 1st to 4th differential signal lines L1d1 and L1d2 connected thereto.

In addition, the 1-5th signal line L1e is a first connected to the 1-5th positive terminal pad 803a5-1 and the 1-5th negative terminal pad 803a5-2 outputting a clock signal in a differential manner. -5 includes differential signal lines L1e1 and L1e2.

At this time, each of the differential signal lines may generate noise due to mutual interference in the process of outputting a signal, and thus signal quality may be degraded.

Accordingly, in the embodiment, each differential signal line is designated as a group.

For example, in the embodiment, two 1-1 differential signal lines L1a1 and L1a2 are designated as a first group, and two 1-2 differential signal lines L1b1 and L1b2 are designated as a second group, , two 1st-3rd differential signal lines L1c1 and L1c2 are designated as a third group, two 1st-4th differential signal lines L1d1 and L1d2 are designated as a fourth group, and two 1st-4th differential signal lines L1d1 and L1d2 are designated as a fourth group. 5 differential signal lines L1e1 and L1e2 are designated as a fifth group.

And, in the embodiment, the signal lines of the first to fifth groups are not adjacent to each other. At this time, the signal lines of the first to fifth groups are important lines for transmitting an image signal or a clock signal. In addition, when the signal lines of the first to fifth groups are adjacent to a communication line or a power line among the second signal lines, the effect of noise may increase due to interference caused therefrom.

Accordingly, in the embodiment, the signal lines of the first to fifth groups are not adjacent to each other and are not adjacent to the communication line or the power supply line among the second signal lines.

To this end, in an embodiment, a ground line may be disposed between the signal lines of the first to fifth groups. And, the ground line prevents mutual interference between the signal lines of the first to fifth groups and prevents noise from being generated in the signal lines of the first to fifth groups by the communication line or the power line. It can be prevented.

Specifically, the second signal line includes a first ground signal line L2a connected to the first ground pad 803b1, a second ground signal line L2b connected to the second ground pad 803b2, 3 The third ground signal line L2c connected to the ground pad 803b3, the fourth ground signal line L2d connected to the fourth ground pad 803b4, and the fifth ground signal line L2d connected to the fifth ground pad 803b5. It includes 5 ground signal lines (L2e).

The first ground signal line L2a is disposed between the 1-1 differential signal lines L1a1 and L1a2 of the first group and the 1-2 differential signal lines L1b1 and L1b2 of the second group. It can be.

In addition, the second ground signal line L2b may be disposed on the 1-2 differential signal lines L1b1 and L1b2 of the second group and the 1-3 differential signal lines L1c1 and L1c2 of the third group. can

In addition, the third ground signal line L2c may be disposed between the 1-3 differential signal lines L1c1 and L1c2 of the third group and the 1-4 differential signal lines L1d1 and L1d2 of the fourth group. can

In addition, the fourth ground signal line L2d is disposed between the 1-4 differential signal lines L1d1 and L1d2 of the fourth group and the 1-5 differential signal lines L1e1 and L1e2 of the fifth group. It can be.

Also, the fifth ground signal line L2e may be disposed between the first to fifth differential signal lines L1e1 and L1e2 of the fifth group and a second signal line such as a communication line or a power supply line.

In addition, although FIG. 5 illustrates that the 1-1st differential signal lines L1a1 and L1a2 of the first group are disposed on the edge area of the second substrate area 800c, it is not limited thereto. For example, a second signal line such as a communication line or a power supply line may be disposed in an area adjacent to the 1-1st differential signal lines L1a1 and L1a2 of the first group. In this case, an additional ground signal line may be disposed between the 1-1 differential signal lines L1a1 and L1a2 of the first group and a second signal line such as the communication line or power line.

Meanwhile, referring to FIG. 6 , the circuit board 800 according to the second embodiment may exchange data with an external device through a predetermined interface. For example, the circuit board 800 may exchange data with an external device through MIPI (Mobile Industry Processor Interface). Preferably, the circuit board 800 may exchange data with an external device through a C-PHY interface of MIPI (Mobile Industry Processor Interface).

Accordingly, the terminal pad 803 of the circuit board 800 includes first terminal pads 803c1 , 803c2 , and 803c3 corresponding to a C-PHY interface of MIPI (Mobile Industry Processor Interface).

That is, the terminal pad 803 of the circuit board 800 is connected to a terminal corresponding to a C-PHY interface of MIPI (Mobile Industry Processor Interface) among terminals of the image sensor 810 through a first connection wire part. 1 terminal pads 803c1, 803c2, and 803c3 are included.

Also, the circuit board 800 includes second terminal pads 803d1 , 803d2 , and 803d3 other than the first terminal pads 803c1 , 803c2 , and 803c3 . For example, the second terminal pads 803d1 , 803d2 , and 803d3 may be connected to at least one of a communication terminal, a ground terminal, and a power terminal among terminals of the image sensor 810 .

Here, the structure of the circuit board of FIG. 5 differs from the structure of FIG. 4 in that MIPI (Mobile Industry Processor Interface) uses a C-PHY instead of a D-PHY. For example, the image sensor 810 using a C-PHY of MIPI (Mobile Industry Processor Interface) outputs an image signal in a single-ended signal method. Accordingly, the image sensor 810 using the MIPI (Mobile Industry Processor Interface) C-PHY does not have a separate terminal for outputting a clock signal. For example, the image signal output terminal of the image sensor 810 using C-PHY of MIPI (Mobile Industry Processor Interface) may be as shown in Table 3 below.

number C-PHY One 0A 2 0B 3 0C 4 1A 5 1B 6 1C 7 2A 8 2B 9 2C

That is, the image sensor 810 using the C-PHY of MIPI (Mobile Industry Processor Interface) as described above includes 9 terminals for outputting image signals.

Also, the image sensor 810 using the C-PHY of MIPI (Mobile Industry Processor Interface) includes a communication terminal, a power terminal, and a ground terminal as shown in FIG. 5 .

Accordingly, the first terminal pads 803c1 , 803c2 , and 803c3 included in the circuit board 800 are terminals of the image sensor 810 using the MIPI (Mobile Industry Processor Interface) C-PHY interface, and the image signal connected to the output terminal. Accordingly, the first terminal pads 803c1, 803c2, and 803c3 may include a total of nine terminal pads.

For example, the first terminal pad includes a 1-1 terminal pad 803c1 connected to a first group of image signal output terminals (eg, 0A, 0B, and 0C in Table 3). The 1-1 terminal pad 803c1 includes three terminal pads 803c1-1 and 803c1- respectively connected to the first group of image signal output terminals (eg, 0A, 0B, and 0C in Table 3). 2, 803c1-3).

For example, the first terminal pad includes 1-2 terminal pads 803c2 connected to the second group of image signal output terminals (eg, 1A, 1B, and 1C in Table 3). The 1-2 terminal pad 803c2 includes three terminal pads 803c2-1 and 803c2- respectively connected to the second group of image signal output terminals (eg, 1A, 1B, and 1C in Table 3). 2, 803c2-3).

For example, the first terminal pad includes 1-3 terminal pads 803c3 connected to the third group of image signal output terminals (eg, 2A, 2B, and 2C in Table 3). The 1-3 terminal pads 803c3 include three terminal pads 803c3-1 and 803c3- respectively connected to the third group of image signal output terminals (eg, 2A, 2B, and 2C in Table 3). 2, 803c3-3).

At this time, in the embodiment, the second terminal pads 803d1 , 803d2 , and 803d3 shown in FIG. 6 represent pads connected to the ground terminal among the terminals of the image sensor 810 .

For example, the second terminal pad may include a first ground pad 803d1, a second ground pad 803d2, and a third ground pad 803d3. Also, the second terminal pad further includes a communication pad or a power supply pad in addition to the ground pads.

Meanwhile, in the circuit board 800 of the embodiment, the terminal pad 803 includes a pad connected to the lens driving device in addition to a pad connected to the image sensor 810 . For example, the terminal pad 803 includes a pad connected to the driving substrate 250 constituting the lens driving device. And, in the terminal pad 803, a pad connected to the lens driving device may belong to the second terminal pad.

As described above, the terminal pad 803 included in the circuit board 800 of the embodiment includes a first terminal pad corresponding to a C-PHY interface of MIPI (Mobile Industry Processor Interface) and a second terminal pad other than the first terminal pad. Includes terminal pads.

Also, the circuit board 800 according to the embodiment includes a signal line connecting between the terminal pad 803 and the connector 840 .

For example, the signal line includes a first signal line connecting between the first terminal pad and the connector 840 and a second signal line connecting between the second terminal pad and the connector.

In this case, in an embodiment, the first signal line and the second signal line may be formed of different metal materials.

For example, the first signal line is a line through which an image signal according to a C-PHY interface of MIPI (Mobile Industry Processor Interface) is output. Accordingly, the first signal line may be formed of a metal material including silver (Ag) to increase signal transmission speed and minimize noise effects.

And, the second signal line is a line for connecting power, communication signal or ground. Accordingly, the second signal line may be formed of a metal material containing copper (Cu) different from that of the first signal line.

At this time, in the embodiment, since the first signal line is formed of a metal material including silver, during the etching process of the pattern layer, an etching factor can be improved, and accordingly, the width of the first signal line can be reduced. . For example, the first signal line formed of a metallic material including silver may have a smaller line width than that of the second signal line including copper. Accordingly, in the embodiment, as the line width of the first signal line is reduced, the volume of the circuit board 800 may be reduced, and thus the volume of the camera module may be reduced.

The first signal line includes the 1-1 signal line L3a connected to the 1-1 terminal pad 803c1 corresponding to the first group of image signal output lines, and the second group of image signal outputs. The 1-2 signal line L3b connected to the 1-2 terminal pad 803c2 corresponding to the line and the 1-3 terminal pad 803c3 corresponding to the image signal output line of the third group are connected. It includes the 1-3 signal lines (L3c) to be.

Also, the 1-1 signal line L3a, the 1-2 signal line L3b, and the 1-3 signal line L3c may be formed of a first metal material including silver as described above. .

The 1-1 signal line L3a is single-ended and includes three signal lines L3a1, L3a2, and L3a3 outputting a first group of image signals.

The 1-2 signal line L3b is single-ended and includes three signal lines L3b1, L3b2, and L3b3 outputting a second group of image signals.

The 1-3 signal lines L3c are single-ended and include three signal lines L3c1, L3c2, and L3c3 outputting a third group of image signals.

Signal lines according to the respective single-ended signal schemes may generate noise due to mutual interference in the process of outputting image signals, and thus signal quality may be degraded. Accordingly, in the embodiment, the first signal lines of each group are arranged so as not to be adjacent to each other.

In addition, the signal lines of each group are not adjacent to communication lines or power lines among the second signal lines.

To this end, in an embodiment, a ground line may be disposed between the first signal lines of the first to third groups. And, the ground line prevents mutual interference between the signal lines of the first to third groups and prevents noise from being generated in the signal lines of the first to third groups by the communication line or the power line. It can be prevented.

Specifically, the second signal line includes a first ground signal line L4a connected to the first ground pad 803d1, a second ground signal line L4b connected to the second ground pad 803d2, and and a third ground signal line L4c connected to the third ground pad 803d3.

Also, the first ground signal line L4a may be disposed between the 1-1 signal lines L3a of the first group and the 1-2 signal lines L3b of the second group.

Also, the second ground signal line L4b may be disposed in the 1-2 signal lines L3b of the second group and the 1-3 signal lines L3c of the third group.

Also, the third ground signal line L2c may be disposed between the first to third signal lines L3c of the third group and a second signal line such as a communication line or a power supply line.

A circuit board according to an embodiment includes a terminal pad connected to an image sensor or a lens driving device. The terminal pad includes a first terminal pad connected to a terminal of the image sensor from which an image signal is output and a second terminal pad other than the first terminal pad. For example, the first terminal pad may be connected to a differential terminal and a clock terminal for outputting an image signal of an image sensor using a D-PHY interface of MIPI (Mobile Industry Processor Interface). Alternatively, the first terminal pad may be connected to an image signal output terminal of an image sensor using a C-PHY interface of MIPI (Mobile Industry Processor Interface). Also, the second terminal pad may be connected to a communication terminal, a ground terminal, and a power terminal of the image sensor, or connected to the sensor driving device.

And, in an embodiment, the circuit board includes a connector for data communication by being connected to an external device. At this time, the circuit board includes a first signal line connecting between the connector and the first terminal pad, and a second signal line connecting between the second terminal pad and the connector. In this case, in an embodiment, the first signal line and the second signal line may be formed of different metal materials. For example, the first signal line is an image signal output line connected to a C-PHY interface or a D-PHY interface of MIPI (Mobile Industry Processor Interface). Accordingly, the first signal line may be formed of a metal material including silver (Ag) to increase signal transmission speed and minimize noise effects. And, the second signal line is a line for connecting power, communication signal or ground. As described above, in the embodiment, by forming the first signal line with a metal material including silver, it is possible to improve the transmission speed of the image signal according to MIPI (Mobile Industry Processor Interface). In addition, in the embodiment, the effect of noise on the image signal of the MIPI (Mobile Industry Processor Interface) can be minimized, and image quality can be improved accordingly. In addition, in the embodiment, copper is included in the second signal line, so that power transfer characteristics and communication performance can be improved, and manufacturing cost can be reduced.

In addition, in the embodiment, since the first signal line is formed of a metal material including silver, an etching factor may be improved during an etching process of the pattern layer, and thus the width of the first signal line may be reduced. . For example, the first signal line formed of a metallic material including silver may have a smaller line width than that of the second signal line including copper. Accordingly, in the embodiment, as the line width of the first signal line is reduced, the volume of the circuit board may be reduced, and thus the volume of the camera module may be reduced.

In addition, the first signal line in the embodiment is divided into a plurality of groups. In this case, the first signal lines of the plurality of groups are arranged not to be adjacent to each other and not to be adjacent to the communication line or the power supply line of the second signal line. Preferably, a ground line of the second signal line is disposed between the first signal lines of the plurality of groups. Accordingly, in the embodiment, interference between the first signal lines of the plurality of groups or interference caused by the communication line or power supply line of the second signal line can be minimized, thereby improving signal quality. .

In addition, in the embodiment, a connecting wire unit for connecting a terminal of the image sensor and a terminal pad of the circuit board is included. In this case, the connection wire part connects a first connection wire part connecting between the terminal of the image sensor and the first terminal pad of the circuit board, and between the terminal of the image sensor and the second terminal pad of the circuit board. It includes a second connecting wire portion to. In this case, the first connection wire part is formed of a wire containing silver, and the second connection wire part is formed of a wire containing copper. Accordingly, in the embodiment, the transmission speed of the image signal of the camera module can be further improved, and furthermore, the signal quality can be further improved by minimizing the effect of noise.

7 shows a perspective view of a portable terminal 200A according to an embodiment, and FIG. 8 shows a configuration diagram of the portable terminal shown in FIG. 7 .

7 and 8, a portable terminal (200A, hereinafter referred to as a “terminal”) includes a body 850, a wireless communication unit 710, an A/V input unit 720, a sensing unit 740, an input/output unit, It may include an output unit 750, a memory unit 760, an interface unit 770, a control unit 780, and a power supply unit 790.

The body 850 shown in FIG. 16 has a bar shape, but is not limited thereto, and is a slide type, folder type, or swing type in which two or more sub-bodies are coupled to be relatively movable. , and may have various structures such as a swivel type.

The body 850 may include a case (casing, housing, cover, etc.) constituting an external appearance. For example, the body 850 may be divided into a front case 851 and a rear case 852 . Various electronic components of the terminal may be embedded in the space formed between the front case 851 and the rear case 852 .

The wireless communication unit 710 may include one or more modules enabling wireless communication between the terminal 200A and a wireless communication system or between the terminal 200A and a network in which the terminal 200A is located. For example, the wireless communication unit 710 may include a broadcast reception module 711, a mobile communication module 712, a wireless Internet module 713, a short-distance communication module 714, and a location information module 715. there is.

An audio/video (A/V) input unit 720 is for inputting an audio signal or a video signal, and may include a camera 721 and a microphone 722.

The camera 721 may include a camera module according to the embodiment shown in FIG. 1 .

The sensing unit 740 detects the current state of the terminal 200A, such as the open/closed state of the terminal 200A, the location of the terminal 200A, whether or not there is a user contact, the direction of the terminal 200A, and the acceleration/deceleration of the terminal 200A. By sensing, a sensing signal for controlling the operation of the terminal 200A may be generated. For example, when the terminal 200A is in the form of a slide phone, whether the slide phone is opened or closed may be sensed. In addition, it is responsible for sensing functions related to whether or not the power supply unit 790 supplies power and whether or not the interface unit 770 is connected to an external device.

The input/output unit 750 is for generating input or output related to sight, hearing, or touch. The input/output unit 750 may generate input data for controlling the operation of the terminal 200A, and may also display information processed by the terminal 200A.

The input/output unit 750 may include a keypad unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keypad unit 730 may generate input data by keypad input.

The display module 751 may include a plurality of pixels whose colors change according to electrical signals. For example, the display module 751 may be a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, a 3D At least one of 3D displays may be included.

The audio output module 752 outputs audio data received from the wireless communication unit 710 in a call signal reception mode, a call mode, a recording mode, a voice recognition mode, or a broadcast reception mode, or stored in the memory unit 760. Audio data can be output.

The touch screen panel 753 may convert a change in capacitance caused by a user's touch to a specific area of the touch screen into an electrical input signal.

The memory unit 760 may store programs for processing and control of the control unit 780, and may store input/output data (eg, phone book, messages, audio, still images, photos, videos, etc.) can be temporarily stored. For example, the memory unit 760 may store an image captured by the camera 721, for example, a photo or video.

The interface unit 770 serves as a passage through which an external device connected to the terminal 200A is connected. The interface unit 770 receives data from an external device or receives power and transmits it to each component inside the terminal 200A, or transmits data inside the terminal 200A to an external device. For example, the interface unit 770 may include a wired/wireless headset port, an external charger port, a wired/wireless data port, a memory card port, a port connecting a device having an identification module, an audio I/O (Input/ Output) port, video I/O (Input/Output) port, and earphone port.

The controller 780 may control overall operations of the terminal 200A. For example, the controller 780 may perform related control and processing for voice calls, data communications, video calls, and the like.

The controller 780 may include a multimedia module 781 for playing multimedia. The multimedia module 781 may be implemented within the control unit 180 or may be implemented separately from the control unit 780.

The controller 780 may perform a pattern recognition process capable of recognizing handwriting input or drawing input performed on the touch screen as characters and images, respectively.

The power supply unit 790 may receive external power or internal power under the control of the control unit 780 to supply power necessary for the operation of each component.

A circuit board according to an embodiment includes a terminal pad connected to an image sensor or a lens driving device. The terminal pad includes a first terminal pad connected to a terminal of the image sensor from which an image signal is output and a second terminal pad other than the first terminal pad. For example, the first terminal pad may be connected to a differential terminal and a clock terminal for outputting an image signal of an image sensor using a D-PHY interface of MIPI (Mobile Industry Processor Interface). Alternatively, the first terminal pad may be connected to an image signal output terminal of an image sensor using a C-PHY interface of MIPI (Mobile Industry Processor Interface). Also, the second terminal pad may be connected to a communication terminal, a ground terminal, and a power terminal of the image sensor, or connected to the sensor driving device.

And, in an embodiment, the circuit board includes a connector for data communication by being connected to an external device. At this time, the circuit board includes a first signal line connecting between the connector and the first terminal pad, and a second signal line connecting between the second terminal pad and the connector. In this case, in an embodiment, the first signal line and the second signal line may be formed of different metal materials. For example, the first signal line is an image signal output line connected to a C-PHY interface or a D-PHY interface of MIPI (Mobile Industry Processor Interface). Accordingly, the first signal line may be formed of a metal material including silver (Ag) to increase signal transmission speed and minimize noise effects. And, the second signal line is a line for connecting power, communication signal or ground. As described above, in the embodiment, by forming the first signal line with a metal material including silver, it is possible to improve the transmission speed of the image signal according to MIPI (Mobile Industry Processor Interface). In addition, in the embodiment, the effect of noise on the image signal of the MIPI (Mobile Industry Processor Interface) can be minimized, and image quality can be improved accordingly. In addition, in the embodiment, copper is included in the second signal line, so that power transfer characteristics and communication performance can be improved, and manufacturing cost can be reduced.

In addition, in the embodiment, since the first signal line is formed of a metal material including silver, an etching factor may be improved during an etching process of the pattern layer, and thus the width of the first signal line may be reduced. . For example, the first signal line formed of a metallic material including silver may have a smaller line width than that of the second signal line including copper. Accordingly, in the embodiment, as the line width of the first signal line is reduced, the volume of the circuit board may be reduced, and thus the volume of the camera module may be reduced.

In addition, the first signal line in the embodiment is divided into a plurality of groups. In this case, the first signal lines of the plurality of groups are arranged not to be adjacent to each other and not to be adjacent to the communication line or the power supply line of the second signal line. Preferably, a ground line of the second signal line is disposed between the first signal lines of the plurality of groups. Accordingly, in the embodiment, interference between the first signal lines of the plurality of groups or interference caused by the communication line or power supply line of the second signal line can be minimized, thereby improving signal quality. .

In addition, in the embodiment, a connecting wire unit for connecting a terminal of the image sensor and a terminal pad of the circuit board is included. In this case, the connection wire part connects a first connection wire part connecting between the terminal of the image sensor and the first terminal pad of the circuit board, and between the terminal of the image sensor and the second terminal pad of the circuit board. It includes a second connecting wire portion to. In this case, the first connection wire part is formed of a wire containing silver, and the second connection wire part is formed of a wire containing copper. Accordingly, in the embodiment, the transmission speed of the image signal of the camera module can be further improved, and furthermore, the signal quality can be further improved by minimizing the effect of noise.

Features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified with respect to other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to these combinations and variations should be construed as being included in the scope of the present invention.

Claims (14)

A terminal pad connected to the image sensor;
Connectors connected to external devices; and
A signal line connecting between the pad and the connector;
The terminal pad,
A first terminal pad connected to a Mobile Industry Processor Interface (MIPI) terminal of the image sensor;
a second terminal pad other than the first terminal pad;
The signal line is
a first signal line connected between the first terminal pad and the connector and formed of a first metal material;
A second signal line connecting between the second terminal pad and the connector and including a second metal material different from the first metal material,
circuit board. According to claim 1,
The first metal material includes silver (Ag),
The resistivity value of the first metal material is
Lower than the resistivity value of the second metal material,
circuit board. According to claim 1,
The line width of the first signal line is
smaller than the line width of the second signal line,
circuit board. According to claim 1,
The first signal line,
The MIPI terminal is a D-PHY interface terminal that outputs an image signal and a clock signal in a differential signal method,
The first signal line,
a 1-1st differential signal line outputting differential image signals of a first group;
1-2 differential signal lines outputting differential image signals of a second group;
1-3 differential signal lines outputting differential image signals of a third group;
1-4 differential signal lines outputting differential image signals of a fourth group;
Including 1-5 differential signal lines outputting differential clock signals,
circuit board. According to claim 4,
The second signal line,
A ground line connected to the ground terminal;
A communication line connected to the communication terminal;
Including a power line connected to the power terminal,
circuit board. According to claim 5,
The ground line is
a first ground line disposed between the 1-1st differential signal line and the 1-2nd differential signal line;
a second ground line disposed between the 1-2nd differential signal line and the 1-3th differential signal line;
a third ground line disposed between the 1-3 differential signal lines and the 1-4 differential signal lines;
A fourth ground line disposed between the 1-4th differential signal lines and the 1-5th differential signal lines,
circuit board. According to claim 6,
The 1-1 to 1-5 differential signal lines,
Arranged not adjacent to the communication line and the power line,
circuit board. According to claim 6,
The ground line is
A fifth ground line disposed between at least one of the 1-1 to 1-5 differential signal lines and the communication line or the power supply line,
circuit board. According to claim 1,
The first signal line,
The MIPI terminal is a C-PHY interface terminal that outputs an image signal in a single-ended manner,
The first signal line,
a 1-1 signal line outputting a first group of image signals;
1-2 signal lines outputting a second group of image signals;
Including 1-3 signal lines outputting a third group of image signals,
circuit board. According to claim 9,
The second signal line,
A ground line connected to the ground terminal;
A communication line connected to the communication terminal;
Including a power line connected to the power terminal,
The ground line is
A first ground line disposed between the 1-1 signal line and the 1-2 signal line;
Including a second ground line disposed between the 1-2 signal lines and the 1-3 signal lines,
circuit board. According to claim 10,
The 1-1 to 1-3 signal lines,
Arranged not adjacent to the communication line and the power line,
circuit board. According to claim 6,
The ground line is
A third ground line disposed between at least one of the 1-1 to 1-3 signal lines and the communication line or the power line,
circuit board. a circuit board disposed in any one of claims 1 to 12;
an image sensor mounted on the circuit board; and
a first connection wire part connecting a terminal of the image sensor and the first terminal pad of the circuit board; and
A second connection wire part connecting a terminal of the image sensor and the second terminal pad of the circuit board;
The first connection wire portion includes a metal material different from that of the second connection wire portion,
The first connection wire part includes a silver (Ag) nano wire,
The second connection wire portion comprises a copper wire,
camera module. main body,
The camera module of claim 13 disposed on the main body and capturing an image of a subject, and
A display unit disposed on the main body and outputting an image captured by the camera module,
optical instrument.

Images