KR20230000354A - A camera module and optical apparatus having the same - Google Patents

Abstract

According to an embodiment of the present invention, a camera module comprises: a circuit board; an image sensor arranged on the circuit board. The circuit board includes: an insulation layer; a pad arranged on the insulation layer; a terminal arranged on the insulation layer and apart from the pad; a protection layer arranged on the insulation layer and including an opening exposing the pad and the terminal; a wire unit arranged on the pad and apart from the pad; and a connection wire connecting the image sensor and the terminal. The pad is overlapped with the image sensor in the direction of an optical axis. The terminal is not overlapped with the image sensor in the direction of an optical axis. Therefore, the flatness of an image sensor can be improved.

Description

Camera module and optical device including the same {A CAMERA MODULE AND OPTICAL APPARATUS HAVING THE SAME}

The embodiment relates to a camera module and an optical device including the same.

Recently, a subminiature camera module has been developed, and the subminiature camera module is widely used in small electronic products such as smart phones, laptop computers, and game consoles.

That is, most mobile electronic devices, including smart phones, are equipped with camera devices for acquiring images from objects, and mobile electronic devices tend to be miniaturized for easy portability.

Such a camera device generally includes a lens through which light is incident, an image sensor through which light incident through the lens is captured, and a number of components for transmitting and receiving electrical signals for an image obtained from the image sensor to an electronic device equipped with the camera device. included In addition, these image sensors and components are generally mounted on a printed circuit board and connected to external electronic devices.

Meanwhile, a conventional camera device uses a printed circuit board to increase the position of an image sensor. However, when the image sensor is directly mounted on the printed circuit board in this way, there is a problem in that heat generated from the image sensor cannot be emitted, and thus there is a reliability problem due to heat generation. Recently, pixels or sizes of image sensors are increasing for high resolution, and thus heat generation of the image sensor further affects the performance of the camera device.

Further, in a conventional camera device, a printed circuit board is disposed on a reinforcing plate such as a stiffener, and an image sensor is disposed on the reinforcing plate and connected to the printed circuit board through wire bonding. At this time, a cavity exposing the surface of the reinforcing plate is formed in the printed circuit board. In this case, in the case of using the cavity-type printed circuit board and the reinforcing plate, it is possible to solve the problem of heat dissipation while increasing the height of the image sensor. In such a camera device, epoxy for bonding an image sensor is applied on a reinforcing plate, and the image sensor is disposed on the applied epoxy. However, the camera device as described above has a problem in that warpage occurs due to a difference between a thermal expansion coefficient of an image sensor, a thermal expansion coefficient of a printed circuit board, and a thermal expansion coefficient of the epoxy. For example, thermal curing proceeds with an image sensor disposed on the epoxy. After the thermal curing proceeds, the configuration including the reinforcing plate, the epoxy, and the image sensor is heated and expanded, and then contraction proceeds, As a result, there is a problem in that a warpage phenomenon occurs severely in a shape like '∩'. Also, when the bending of the image sensor occurs, resolution performance of the camera device deteriorates, resulting in a decrease in yield of the camera device.

Accordingly, there is a need for a method capable of minimizing the warping of the image sensor.

In an embodiment, it is intended to provide a camera module capable of minimizing the bending of an image sensor and an optical device including the same.

In addition, in the embodiment, it is intended to provide a camera module in which a support portion for supporting an image sensor is formed using a wire, and an optical device including the same.

Technical problems to be solved in the embodiments are not limited to the above-mentioned technical problems, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below. You will be able to.

A camera module according to an embodiment includes a circuit board; and an image sensor disposed on the circuit board, wherein the circuit board includes: an insulating layer; a pad disposed on the insulating layer; a terminal disposed on the insulating layer and spaced apart from the pad; a protective layer disposed on the insulating layer and including an opening exposing the pad and the terminal; Wire parts disposed on the pad and spaced apart from each other; and a connecting wire connecting the image sensor and the terminal, wherein the pad overlaps the image sensor in an optical axis direction, and the terminal does not overlap the image sensor in an optical axis direction.

In addition, the wire part directly contacts the lower surface of the image sensor.

In addition, a plurality of wire parts are spaced apart from each other and disposed on the pad, and the plurality of wire parts overlap different corner parts of a lower surface of the image sensor in an optical axis direction.

In addition, each of the plurality of wire parts may include a first sub-wire part; and a second sub wire part connected to the first sub wire part.

In addition, the pads include a plurality of pads spaced apart from each other, the plurality of pads overlap different corner portions of a lower surface of the image sensor in an optical axis direction, and the first and second sub-wire portions are Each is placed on a pad.

In addition, the circuit board includes a first adhesive member disposed between the passivation layer and the image sensor.

In addition, the first adhesive member is spaced apart from the wire part.

Also, an area of a lower surface of the image sensor is larger than an area of an upper surface of the first adhesive member.

In addition, an area of an upper surface of the first adhesive member is 50% or less of an area of a lower surface of the image sensor.

The image sensor includes a pixel area and a passivation area around the pixel area, and the wire part overlaps a lower surface of the pixel area of the image sensor in an optical axis direction.

The pixel area of the image sensor includes an active pixel area and a dummy pixel area between the active pixel area and the passivation area, and the wire part overlaps a corner area of the active pixel area in an optical axis direction.

In addition, each of the first and second sub-wire parts may include a bump portion bonded on the pad, a first extension portion extending in an optical axis direction from the bump portion, and a vertical direction from the first extension portion to the optical axis direction. and a second extension portion extending in the direction and directly contacting a lower surface of the image sensor, and a third extension portion extending from the second extension portion and bonded to the pad.

In addition, the width of the bump part has a range between 80um and 100um, and the height of the bump part has a range between 10um and 30um.

In addition, the height from the lower surface of the bump part to the uppermost end of the second extension part has a range of 30 um to 50 um.

In addition, the length of the second extension has a range between 10um and 30um.

In addition, one end and the other end of each of the first and second sub-wire parts contact the pad, at least a part of a region between the one end and the other end contacts the lower surface of the image sensor, and one end of the connection wire A terminal of the image sensor is contacted, and the other end of the connection wire is in contact with a terminal of the circuit board.

Meanwhile, an optical device according to an embodiment includes a main body, a camera module disposed on the main body and capturing an image of a subject, and a display unit disposed on the main body and outputting an image captured by the camera module, and the camera module is disposed on the main body. The module may include a circuit board; and an image sensor disposed on the circuit board, wherein the circuit board includes: an insulating layer; a pad disposed on the insulating layer; a terminal disposed on the insulating layer and spaced apart from the pad; a protective layer disposed on the insulating layer and including an opening exposing the pad and the terminal; Wire parts disposed on the pad and spaced apart from each other; and a connection wire connecting the image sensor and the terminal, wherein the pad overlaps the image sensor in an optical axis direction, the terminal does not overlap the image sensor in an optical axis direction, and the wire part is mutually connected to each other. It includes first to fourth wire parts spaced apart from each other, and each of the first to fourth wire parts includes: a first sub-wire part; and a second sub-wire portion connected to the first sub-wire portion, wherein each of the first and second sub-wire portions includes a bump portion bonded to the pad and a first portion extending from the bump portion in an optical axis direction. an extension portion, a second extension portion extending from the first extension portion in a direction perpendicular to the optical axis direction, and directly contacting a lower surface of the image sensor; and a second extension portion extending from the second extension portion and bonded to the pad. It includes a third extension.

An embodiment includes a circuit board including a wire portion. The circuit board is a board on which an image sensor is mounted. In this case, the wire part includes a pad disposed in a first area overlapping the image sensor in an optical axis direction, and a terminal disposed in a second area not overlapping the image sensor in an optical axis direction. And, the wire part is bonded on the pad. Also, the first area includes an area where an adhesive member for attaching or fixing the image sensor is disposed. That is, the adhesive member may be selectively disposed on an area of the first area of the circuit board where the wire part is not formed. Also, in an embodiment, at least a part of the lower surface of the image sensor may be attached or fixed on the circuit board by the adhesive member in a state in which at least a part of the lower surface of the image sensor is in direct contact with and supported by the wire part. At this time, the wire part is not electrically connected to (or insulated from) the image sensor. That is, the wire part is not a wire that functions to transmit electrical signals, but a wire that functions to support the image sensor. Accordingly, in the embodiment, at least a portion of the image sensor directly contacts and supports the wire portion, thereby minimizing the bending of the image sensor. Also, in the embodiment, heat generated from the image sensor may be efficiently transferred to the outside by directly contacting at least a portion of the image sensor with the wire part.

Also, in the embodiment, the area of the adhesive member disposed on the lower surface of the image sensor is smaller than the area of the lower surface of the image sensor. According to this, in the embodiment, the area of the adhesive member is reduced compared to the area of the image sensor, thereby minimizing the bending of the image sensor, which increases in proportion to the area of the adhesive member.

Also, in the embodiment, a corner region of a lower surface of an active pixel region of an image sensor and the wire part are directly contacted with each other. Accordingly, in the embodiment, it is possible to solve the problem of warping of the active pixel area of the image sensor.

In addition, in the embodiment, first to fourth wire parts overlapping four corner parts of the lower surface of the image sensor in an optical axis direction are included, and the first to fourth wire parts are first to second sub-wires connected to each other. includes wealth Accordingly, in the embodiment, by using the first and second sub-wire parts, it is possible to minimize the change in height of the wire part due to the pressure applied when the image sensor is attached, and thereby further improve the flatness of the image sensor. can

1 is a view for explaining a bending phenomenon of a camera module of a comparative example.
2 is an exploded perspective view of a camera module according to an embodiment.
3 is a cross-sectional view of the camera module of FIG. 1 according to an embodiment.
Figure 4 is an enlarged view of the dotted line portion of Figure 3;
5 is a plan view of a circuit board according to an embodiment.
6 is a view showing a modified example of the wire part of FIG. 5;
7 is a diagram for explaining a detailed structure of a wire unit according to an embodiment.
8 is a view showing a modified example of the wire part of FIG. 7 .
9 is a plan view of a circuit board according to another embodiment.
10 is a view showing various embodiments of the arrangement shape of the first adhesive member.
11 is a view showing the degree of warpage according to the arrangement area of the first adhesive member.
12 and 13 are diagrams for explaining a disposition relationship between a wire part and the image sensor according to the first embodiment.
14 is a diagram for explaining a disposition relationship between a wire part and the image sensor according to the second embodiment.
15 is a graph illustrating a degree of warping of an image sensor according to a comparative example.
16 is a graph illustrating a degree of bending of an image sensor including a wire part according to an exemplary embodiment.
17 is a perspective view of a portable terminal according to an embodiment.
FIG. 18 shows a configuration diagram of the portable terminal shown in FIG. 17 .

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical idea of the present invention is not limited to some of the described embodiments, but may be implemented in a variety of different forms, and if it is within the scope of the technical idea of the present invention, one or more of the components among the embodiments can be selectively implemented. can be used by combining and substituting.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless explicitly specifically defined and described, can be generally understood by those of ordinary skill in the art to which the present invention belongs. It can be interpreted as meaning, and commonly used terms, such as terms defined in a dictionary, can be interpreted in consideration of contextual meanings of related technologies.

Also, terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In this specification, the singular form may also include the plural form unless otherwise specified in the phrase, and when described as "at least one (or more than one) of A and (and) B and C", A, B, and C are combined. may include one or more of all possible combinations.

Also, terms such as first, second, A, B, (a), and (b) may be used to describe components of an embodiment of the present invention. These terms are only used to distinguish the component from other components, and the term is not limited to the nature, order, or order of the corresponding component. And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected to, combined with, or connected to the other component, but also with the component. It may also include the case of being 'connected', 'combined', or 'connected' due to another component between the other components.

In addition, when it is described as being formed or disposed on the "top (above) or bottom (bottom)" of each component, the top (top) or bottom (bottom) is not only a case where two components are in direct contact with each other, but also one A case in which another component above is formed or disposed between two components is also included. In addition, when expressed as "up (up) or down (down)", it may include the meaning of not only the upward direction but also the downward direction based on one component.

An optical axis direction used below may be defined as an optical axis direction of a lens coupled to a camera actuator and a camera module, and a vertical direction may be defined as a direction perpendicular to the optical axis.

The autofocus function used below is a function that automatically focuses on a subject by adjusting the distance to the image sensor by moving the lens in the direction of the optical axis according to the distance of the subject so that a clear image of the subject can be obtained on the image sensor. can be defined

Meanwhile, auto focus may correspond to auto focus (AF). In addition, CLAF (closed-loop auto focus) control is defined as real-time feedback control of the lens position by detecting the distance between the image sensor and the lens to improve the accuracy of focus adjustment. can do.

In addition, prior to the description of the embodiment of the invention, the first direction may mean the x-axis direction shown in the drawing, and the second direction may be a direction different from the first direction. For example, the second direction may mean a y-axis direction shown in the drawing as a direction perpendicular to the first direction. Also, the third direction may be a direction different from the first and second directions. For example, the third direction may refer to a z-axis direction shown in the drawing as a direction perpendicular to the first and second directions. Here, the third direction may mean an optical axis direction.

Hereinafter, prior to description of the embodiments of the present disclosure, a structure and problems thereof in a comparative example will be reviewed.

1 is a view for explaining a bending phenomenon of a camera module of a comparative example.

Referring to FIG. 1 , the camera module of the comparative example has a structure including a reinforcing plate 10 , an adhesive member 20 and an image sensor 30 . The image sensor 30 is a sensor die constituting a sensor chip, and may generally be a silicon (Si) die.

At this time, the reinforcing plate 10, the adhesive member 20, and the image sensor 30 (specifically, a silicon die) have different coefficients of thermal expansion (CTE). Here, the coefficient of thermal expansion means the change in length by unit * temperature change for unit * length.

In the camera module of the comparative example as described above, the adhesive member 20 is disposed on the reinforcing plate 10, and the thermal curing process is performed in a state in which the image sensor 30 is disposed on the adhesive member 20. And, the image sensor 30 is attached on the reinforcing plate 10 by the thermal curing process.

At this time, as shown in the top drawing of FIG. 1, in a state in which the reinforcing plate 10, the adhesive member 20, and the image sensor 30 are sequentially stacked before the heat is applied (before heating) , it can be confirmed that warpage does not occur.

And, as in the middle drawing of FIG. 1, when heat is applied to proceed with the thermal curing (heating), both ends of each of the reinforcing plate 10, the adhesive member 20 and the image sensor 30 expands in the longitudinal direction away from each other.

And, as shown in the bottom drawing of FIG. 1, when the thermal curing process is finished and the cooling process proceeds (after cool down), the expanded reinforcing plate 10, the adhesive member 20 and the image sensor 30 ) will contract to the state before expansion, respectively.

At this time, the reinforcing plate 10, the adhesive member 20, and the image sensor 30 each have different coefficients of thermal expansion. The thermal expansion coefficients of each of the above configurations are shown in Table 1 below.

matter CTE(((10-6 m/(m℃)) silicon (image sensor die) 3 to 5 Epoxy (adhesive member) 45 to 65 Copper Alloys (reinforcing plate) 17.6

As described above, the reinforcing plate 10, the adhesive member 20, and the image sensor 30 have different coefficients of thermal expansion. Accordingly, when the expansion and contraction according to the thermal curing proceed, a difference occurs in the degree of contraction due to the difference in the thermal expansion coefficient, and accordingly, warpage occurs in a shape like '∩'.

Also, when the bending of the image sensor occurs, resolution performance of the camera device deteriorates, resulting in a decrease in yield of the camera device.

Accordingly, in the embodiment, the bending phenomenon caused by the difference in thermal expansion coefficient between the reinforcing plate 10, the image sensor 30, and the adhesive member 20 is minimized, thereby improving the performance of the camera device. .

Figure 2 is an exploded perspective view of a camera module according to an embodiment, Figure 3 is a cross-sectional view of the camera module of Figure 1 according to an embodiment, Figure 4 is an enlarged view of the dotted line portion of Figure 3, Figure 5 is an embodiment FIG. 6 is a plan view of a circuit board according to FIG. 5 , and FIG. 6 is a view showing a modified example of the wire part of FIG. 5 .

2 to 6, the camera module 200 includes a lens or lens barrel 400, a lens driving device 100, a filter 610, a holder 600, a circuit board 800, and a reinforcing plate 900. ) and an image sensor 810. Here, the “camera module” may be expressed as “photographer” or “camera”, and the holder 600 may be expressed as a sensor base.

In addition, the camera module 200 may further include a blocking member 1500 disposed on the filter 610 .

In addition, the camera module 300 may further include a third adhesive member 612 .

In addition, the camera module 300 may further include a motion sensor 820, a controller 830, and a connector 840.

A lens or lens barrel 400 may be mounted on the bobbin 110 of the lens driving device 100 .

The lens driving device 100 may drive the lens or the lens barrel 400.

The camera module 200 may be any one of an auto focus (AF) camera module and an optical image stabilizer (OIS) camera module. A camera module for AF refers to one capable of performing only an auto focus function, and a camera module for OIS refers to one capable of performing an auto focus function and an OIS (Optical Image Stabilizer) function.

For example, the lens driving device 100 may be a lens driving device for AF or a lens driving device for OIS, where the meanings of "for AF" and "for OIS" are as described in the camera module for AF and the camera module for OIS. can be the same

For example, the lens driving device 100 of the camera module 200 may be a lens driving device for OIS.

The lens driving device 100 includes a housing 140, a bobbin 110 disposed in the housing 140 and for mounting a lens or lens barrel 400, a first coil 120 disposed in the bobbin 110, a housing The magnet 130 disposed on the 140 and facing the first coil 120, at least one upper elastic member (not shown) coupled to the upper part of the bobbin 110 and the upper part of the housing 140, the bobbin 110 ) and at least one lower elastic member (not shown) coupled to the lower part of the housing 140, the second coil 230 disposed under the bobbin 110 (or/and the housing 140), the second A driving substrate 250 disposed below the coil 230 and a base 210 disposed below the driving substrate 250 may be included.

In addition, the lens driving device 100 may further include a cover member 300 coupled to the base 210 and providing a space for accommodating elements of the lens driving device 100 together with the base 210. .

In addition, the lens driving apparatus 100 may further include a support member (not shown) electrically connecting the driving substrate 250 and the upper elastic member and supporting the housing 140 with respect to the base 210 . Each of the first coil 120 and the second coil 230 may be electrically connected to the driving substrate 250 and may receive a driving signal (driving current) from the driving substrate 250 .

For example, the upper elastic member may include a plurality of upper springs, the support member may include support members connected to the upper springs, and the first coil 120 is driven by the driving substrate through the upper springs and the support member. (250) and can be electrically connected. The driving substrate 250 may include a plurality of terminals, and some of the plurality of terminals may be electrically connected to each of the first coil 120 and/or the second coil 230 .

The bobbin 110 and the lens or lens barrel 400 coupled thereto may be moved in the direction of the optical axis by the electromagnetic force generated by the interaction between the first coil 120 and the magnet 130, and thereby the bobbin 110 As the displacement in the optical axis direction is controlled, AF driving can be implemented.

In addition, the housing 140 may be moved in a direction perpendicular to the optical axis by the electromagnetic force generated by the interaction between the second coil 230 and the magnet 130, and thus hand shake correction or OIS driving may be implemented.

In addition, for AF feedback driving, the lens driving device 100 of the camera module 200 includes a sensing magnet (not shown) disposed on the bobbin 110 and an AF position sensor (eg, disposed on the housing 140). , a hall sensor (not shown) may be further included. In addition, the lens driving apparatus 100 may further include a circuit board (not shown) disposed on the housing or/and the base and on which the AF position sensor is disposed or mounted. In another embodiment, the AF position sensor may be disposed on the bobbin, and the sensing magnet may be disposed on the housing. In addition, the lens driving device 100 may further include a balancing magnet disposed on the bobbin 110 to correspond to the sensing magnet.

The AF position sensor may output an output signal according to a result of sensing the strength of the magnetic field of the sensing magnet according to the movement of the bobbin 100 . The AF position sensor may be electrically connected to the driving substrate 250 through the upper elastic member (or lower elastic member) or/and the support member. The driving substrate 250 may provide a driving signal to the AF position sensor, and an output of the AF position sensor may be transmitted to the driving substrate 250 .

In another embodiment, the lens driving device 100 may be a lens driving device for AF, and the lens driving device for AF includes a housing, a bobbin disposed inside the housing, a coil disposed in the bobbin, and a magnet disposed in the housing. , at least one elastic member coupled to the bobbin and the housing, and a base disposed below the bobbin (or/and housing).

For example, the elastic member may include the above-described upper elastic member and lower elastic member.

A driving signal (eg, driving current) may be provided to the coil, and the bobbin may be moved in an optical axis direction by electromagnetic force generated by an interaction between the coil and the magnet.

In another embodiment, the coil may be disposed in the housing and the magnet may be disposed in the bobbin.

In addition, for AF feedback driving, the AF lens driving device includes a sensing magnet disposed on the bobbin, an AF position sensor (eg, a hall sensor) disposed on the housing, and an AF position sensor disposed on the housing or And/or may further include a circuit board disposed or mounted on the base In another embodiment, the AF position sensor may be disposed on the bobbin and the sensing magnet may be disposed on the housing.

A camera module according to another embodiment may include a housing coupled to the lens or lens barrel 400 instead of the lens driving device 100 of FIG. 2 and fixed to the lens or lens barrel 400, and the housing may include a holder. It can be coupled or attached to the upper surface of (600). The housing attached or fixed to the holder 600 may not be moved, and the position of the housing may be fixed while attached to the holder 600 .

The circuit board may be electrically connected to the coil and the AF position sensor, a driving signal may be provided to each of the coil and the AF position sensor through the circuit board, and an output of the AF position sensor may be transmitted to the circuit board.

The holder 600 may be disposed below the base 210 of the lens driving device 100 .

The filter 610 is mounted on the holder 600, and the holder 600 may include a seating portion 500 on which the filter 610 is seated.

The adhesive member 612 may couple or attach the base 210 of the lens driving device 100 to the holder 600 . For example, the third adhesive member 612 may be disposed between the lower surface of the base 210 and the upper surface of the holder 600, and may adhere both to each other.

The third adhesive member 612 may serve to prevent foreign matter from entering the lens driving device 100 in addition to the above-described adhesive function. For example, the third adhesive member 612 may be an epoxy, a thermosetting adhesive, or an ultraviolet curable adhesive.

The filter 610 may be disposed within the seating portion 500 of the holder 600 .

The seating portion 500 of the holder 600 may include a protrusion (not shown) protruding from the upper surface of the holder 600, but is not limited thereto. In another embodiment, the seating portion may be in the form of a recess, cavity, or hole recessed from the upper surface of the holder 600 .

The protruding portion of the mounting portion 500 may serve to prevent contact or collision of the lower end of the lens or lens barrel 400 with the filter 610 (or/and the blocking member 1500).

The protruding portion of the seating portion 500 may protrude along the side of the filter 610 in the optical axis direction. For example, the protrusions may be disposed around the side of the filter 610 to wrap around the side of the filter 610 .

The inner side of the protrusion may be provided to face the side of the filter 610, and both may be spaced apart from each other. This is to secure a processing tolerance for easily mounting the filter 610 inside the mounting portion 500 of the holder 600 .

In addition, an upper surface of the protruding part of the seating part 500 may be located higher than the upper surface of the filter 610 in the optical axis direction. This means that when the lens or lens barrel 400 is mounted on the lens driving device 100 and moves in the direction of the optical axis or moves toward the filter 610 by an external impact, the lower end of the lens or lens barrel 400 This is to prevent direct collision with the filter 610.

The shape of the protruding portion of the seating portion 500 viewed from above may match the shape of the filter 610, but is not limited thereto. In another embodiment, the shape of the protruding portion of the seating portion 500 may be similar to or different from that of the filter 610 .

The holder 600 may have an opening 501 formed at a portion where the filter 610 is mounted or disposed so that light passing through the filter 610 may be incident to the image sensor 810 .

For example, the opening 501 may pass through the holder 600 in the optical axis direction, and may be expressed as a “through hole” instead.

For example, the opening 501 may pass through the center of the holder 600 and may be provided in the seating portion 500 , and the area of the opening 501 may be smaller than that of the filter 610 .

The holder 600 is disposed on the circuit board 800 and may accommodate the filter 610 therein. The holder 600 may support the lens driving device 100 located on the upper side. A lower surface of the base 210 of the lens driving apparatus 100 may be disposed on an upper surface of the holder 600 .

For example, the lower surface of the base 210 of the lens driving apparatus 100 may contact the upper surface of the holder 600 and may be supported by the upper surface of the holder 600 .

For example, the filter 610 may be disposed within the seating portion 500 of the holder 600 .

The filter 610 may serve to block light of a specific frequency band from light passing through the lens barrel 400 from being incident to the image sensor 810 .

For example, the filter 610 may be an infrared cut filter, but is not limited thereto. For example, the filter 610 may be disposed parallel to an x-y plane perpendicular to the optical axis OA.

The filter 610 may be attached to the mounting portion 500 of the holder 600 by an adhesive (not shown) such as UV epoxy.

The circuit board 800 may be disposed under the holder 600 , and the holder 600 may be disposed on the upper surface of the circuit board 800 .

The holder 600 may be attached or fixed to the upper surface of the circuit board 800 by an adhesive member such as epoxy, thermosetting adhesive, or UV curable adhesive. In this case, the adhesive member may be disposed between the lower surface of the holder 600 and the upper surface of the circuit board 800 .

An image sensor 810 may be disposed in a region of the circuit board 800 corresponding to the opening 501 of the holder 600 . For example, the image sensor 810 may be attached or fixed on the circuit board 800 overlapping the opening 501 of the holder 600 in the optical axis direction.

The reinforcing plate 900 is disposed below the circuit board 800 .

In this case, the circuit board 800 may include a wire part 805 . Specifically, the circuit board 800 may include a wire part 805 disposed in a region corresponding to the opening 501 of the holder 600 . Also, the wire part 805 may overlap an area of the upper surface of the circuit board 800 where the image sensor 810 is disposed in an optical axis direction. In this case, the wire portion 805 may also be referred to as a “wire bump” formed to support the image sensor 810 .

The wire part 805 may be attached to the circuit board 800 through a thermal compression method or an ultrasonic compression method. Specifically, the wire part 805 may be a wire bonded to the first pad 802 of the circuit board 800 . The wire part 805 is not electrically connected to the image sensor 810 . That is, the wire part 805 is not for a signal transmission function between the circuit board 800 and the image sensor 810, but is used to transmit the image sensor 810 when the image sensor 810 is attached. can function as support.

That is, in the embodiment, a wire portion 805 having a certain thickness and a certain height is formed by bonding a wire on the pad 802 of the circuit board 800, and the image sensor is placed on the formed wire portion 805. In a state where 810 is positioned, an attachment process of the image sensor 810 is performed. At this time, in the attaching process of the image sensor 810 , a specific area of the lower surface of the image sensor 810 may be supported by the wire part 805 . Accordingly, in the embodiment, warping of the image sensor 810 can be minimized, and thus reliability can be improved.

The wire part 805 may protrude from the circuit board 800 in an optical axis direction. For example, in the multi-layer structure of the circuit board 800, the wire part 805 may be located higher than the top surface of the uppermost layer.

Meanwhile, the image sensor 810 supported and attached by the wire part 805 may be electrically connected to the circuit board 800 through the connection wire 21 . For example, the connection wire 21 may connect the terminal 813 of the image sensor 810 and the terminal 803 of the circuit board 800 to each other.

That is, the lower surface of the image sensor 810 in the embodiment contacts the wire unit 805, and the terminal 813 on the upper surface is connected to the connection wire 21. In this case, the wire part 805 and the connection wire 21 may be formed using wires of the same material. Alternatively, the wire part 805 and the connection wire 21 may be formed using wires of different materials. That is, the wire part 805 is used for simple support of the image sensor 810 rather than performing an electrical signal transmission function. Accordingly, the wire part 805 may include a metal material that can be bonded to the pad 802 of the circuit board 800 through bonding while having a certain strength regardless of signal transmission performance. For example, the wire part 805 may include a wire made of at least one of gold (Au), copper (Cu), aluminum (Al), and silver (Ag). Meanwhile, the connection wire 21 serves as a wire electrically connecting the circuit board 800 and the image sensor 810 . Accordingly, the connection wire 21 may include a metal wire made of a material capable of minimizing transmission loss while enabling signal transmission.

The reinforcing plate 900 is a plate-like member having a predetermined thickness and hardness, and can stably support the circuit board 800 and furthermore the image sensor 810, and is capable of stably supporting the circuit board 800 by external impact or contact. ) or damage to the image sensor 810 can be suppressed.

In addition, the reinforcing plate 900 may improve a heat dissipation effect of dissipating heat generated from the image sensor 810 and the circuit board 800 to the outside.

For example, the reinforcing plate 900 may be formed of a metal material having high thermal conductivity, such as SUS or aluminum, but is not limited thereto. In another embodiment, the reinforcing plate 900 may be formed of glass epoxy, plastic, or synthetic resin.

In addition, the reinforcing plate 900 may serve as a ground for protecting the camera module from electrostatic discharge protection (ESD) by being electrically connected to the ground terminal of the circuit board 800 .

The pad 802 of the circuit board 800 may include a surface treatment layer (not shown) on an upper surface. For example, the pad 802 may include a surface treatment layer containing nickel (Ni) on its surface. At this time, the wire part 805 is bonded on the pad 802 . Accordingly, the surface treatment layer of the pad 802 may include a metal layer having good bonding properties with the wire part 805 . For example, when the wire portion 805 is a copper wire, the surface treatment layer of the pad 802 may include a nickel layer. For example, when the wire portion 805 is a gold (Au) wire, the surface treatment layer of the pad 802 includes a first surface treatment layer containing nickel (Ni) and palladium (Pd). A second surface treatment layer may be included. The surface treatment layer of the pad 802 may be a metal layer capable of improving bonding properties with the wire part 805 while preventing oxidation of the pad 802 .

The image sensor 810 may be a part where light passing through the filter 610 is incident and an image including the light is formed.

The circuit board 800 may include various circuits, elements, and controllers to convert an image formed by the image sensor 810 into an electrical signal and transmit the converted electrical signal to an external device. A circuit pattern electrically connected to the image sensor and various elements may be formed on the circuit board 800 .

The holder 600 may be replaced with the first holder, and the circuit board 800 may be replaced with the second holder.

The image sensor 810 may receive an image included in light incident through the lens driving device 100 and convert the received image into an electrical signal.

The filter 610 and the image sensor 810 may be spaced apart from each other so as to face each other in the optical axis OA direction or in the first direction.

Also, the protrusion of the holder 600 may be disposed to face the filter 610 in the optical axis direction.

The blocking member 1500 may be disposed on an upper surface of the filter 610 . The blocking member 1500 may be expressed as a “masking unit” instead.

For example, the blocking member 1500 may be disposed on an edge area of the upper surface of the filter 610, and at least a portion of the light incident toward the edge area of the filter 610 passes through the lens or lens barrel 400. It may serve to block passage through the filter 610. For example, the blocking member 1500 may be coupled or attached to an upper surface of the filter 1610 .

For example, the filter 610 may be formed in a quadrangular shape when viewed in the optical axis direction, and the blocking member 1500 may be formed symmetrically with respect to the filter 610 along each side of the upper surface of the filter 610 .

In this case, the blocking member 1500 may be formed to have a constant width on each side of the upper surface of the filter 1610 .

The blocking member 1500 may be formed of an opaque material. For example, the blocking member 1500 may be provided with an opaque adhesive material applied to the filter 610 or may be provided in the form of a film attached to the filter 610 .

The filter 610 and the image sensor 810 may be disposed to face each other in the optical axis direction, and the blocking member 1500 may include a terminal 803 and/or a connection wire 21 disposed on the circuit board 800 in the optical axis direction. ) and at least partially overlap.

The connection wire 21 and the terminal 803 may be formed of a conductive material such as gold (Au), silver (Ag), copper (Cu), or a copper alloy, and such a conductive material may have a property of reflecting light. can The light passing through the filter 610 may be reflected by the terminal 803 of the circuit board 800 and the connection wire 21, and an instantaneous flash, that is, a flare phenomenon may occur due to the reflected light. In addition, such a flare phenomenon may distort an image formed on the image sensor 810 or deteriorate image quality.

Since the blocking member 1500 is disposed to overlap at least a portion of the terminal 803 and/or the connecting wire 21 in the optical axis direction, among the light passing through the lens or lens barrel 400, the terminal of the circuit board 800 ( 803), or/and the light directed to the connection wire 21 may be blocked to prevent the above-described flare phenomenon from occurring, and accordingly, an image formed on the image sensor 810 may be prevented from being distorted or deteriorating in image quality. there is.

The motion sensor 820 may be mounted or disposed on the circuit board 800 and electrically connected to the controller 830 through a circuit pattern provided on the circuit board 800 .

The motion sensor 820 outputs rotational angular velocity information caused by the movement of the camera module 200 . The motion sensor 820 may be implemented as a 2-axis or 3-axis gyro sensor or an angular velocity sensor.

The controller 830 is mounted or disposed on the circuit board 800 .

The circuit board 800 may be electrically connected to the lens driving device 100 . For example, the circuit board 800 may be electrically connected to the driving board 250 of the lens driving device 100 .

For example, a driving signal may be provided to each of the first coil 120 and the second coil 230 of the lens driving device 100 through the circuit board 800, and the AF position sensor (or OIS position sensor) A driving signal may be provided. Also, the output of the AF position sensor (or OIS position sensor) may be transmitted to the circuit board 800 .

The connector 840 is electrically connected to the circuit board 800 and may include a port to be electrically connected to an external device.

A first adhesive member 1750 may be disposed between the circuit board 800 and the image sensor 810, and the image sensor 810 may be attached or attached to the circuit board 800 by the first adhesive member 1750. can be fixed

In addition, a second adhesive member 1700 may be disposed between the reinforcing plate 900 and the circuit board 800 . The reinforcing plate 900 may be attached or fixed to the lower surface of the circuit board 800 through the second adhesive member 1700, and thus may be connected to the ground of the circuit board 800.

Meanwhile, the circuit board 800 may include a first area overlapping the image sensor 810 in an optical axis direction and a second area other than the first area.

Also, the image sensor 810 may be supported or fixed to the wire part 805 formed in the first area of the circuit board 800 . For example, at least a part of the lower surface of the image sensor 810 may directly contact the wire part 805 . That is, the first adhesive member 1750 in the embodiment may be selectively formed in an area where the wire part 805 is not disposed in the first area. Accordingly, at least a first portion of the lower surface of the image sensor 810 may directly contact the wire portion 805 and at least a second portion may directly contact the first adhesive member 1750 . That is, the second part of the image sensor 810 may be attached or fixed to the first adhesive member 1750 while the first part is supported by the wire part 805 . Accordingly, in the embodiment, at least the first portion of the image sensor 810 directly contacts the wire portion 805, thereby minimizing the bending of the image sensor 810. Also, in the embodiment, heat generated from the image sensor 810 may be efficiently transferred to the outside by directly contacting at least a first portion of the image sensor 810 with the wire portion 805 .

Meanwhile, in the embodiment, an area of the image sensor 810 may be larger than an area of the first adhesive member 1750 . That is, only a part of the entire lower surface of the image sensor 810 may contact the first adhesive member 1750 . For example, only the central region of the lower surface of the image sensor 810 may selectively contact the first adhesive member 1750 .

In this case, the first adhesive member 1750 may be disposed spaced apart from the wire part 805 on the circuit board 800 . For example, a predetermined separation space may be formed between the wire part 805 and the first adhesive member 1750 on the upper surface of the circuit board 800 .

Meanwhile, the first adhesive member 1750 may be an epoxy, a thermosetting adhesive, an ultraviolet curable adhesive, or an adhesive film, but is not limited thereto. In addition, the second adhesive member 1700 may be an epoxy, a thermosetting adhesive, an ultraviolet curable adhesive, or an adhesive film, but is not limited thereto.

A more detailed description of the circuit board 800 is as follows.

The circuit board 800 includes an insulating layer 801 , a pad 802 , a terminal 803 , a protective layer 804 and a wire portion 805 . The wire portion 805 may also be referred to as a wire bump.

The circuit board 800 includes an insulating layer 801 . The insulating layer 801 may include a plurality of layers within the circuit board 800 . However, in the drawings, a plurality of insulating layers are outlined as one layer for convenience of description.

The insulating layer 801 may be a rigid insulating layer. For example, the circuit board 800 may include a rigid region including a hard insulating layer and a flexible region including a flexible insulating layer. Also, in the circuit board 800, the region where the image sensor 810 is disposed is a rigid region having a certain strength, and accordingly, the insulating layer 801 may also be a rigid insulating layer. For example, the insulating layer 801 may include a hard insulating layer having greater strength or greater hardness than a soft insulating layer, such as prepreg. The insulating layer 801 may be replaced with an insulating film or an insulating film.

A pattern layer may be formed on an upper surface of the insulating layer 801 . The pattern layer may include a pad 802 and a terminal 803 disposed on an upper surface of the insulating layer 801 . The terminal 803 is electrically connected to the image sensor 810, and thus can transmit a signal to the image sensor 810 or receive a signal transmitted from the image sensor 810. Accordingly, the terminal 803 may be referred to as an effective pattern.

In addition, the pattern layer may include a pad 802 disposed on an upper surface of the insulating layer 801 . The pad 802 does not function to transmit electrical signals, and allows the wire unit 805 to be attached through bonding. That is, the wire part 805 may be attached to a metal material having good bonding properties through bonding. Accordingly, a pad 802 may be selectively formed on an upper surface of the insulating layer 801 in a region where the wire portion 805 is to be disposed. The pad 802 is not electrically connected to the image sensor 810, and thus may be referred to as a dummy pattern. Here, not being electrically connected may mean that a substantially valid signal is not transferred through the corresponding pattern.

The pad 802 may be formed in an area overlapping the image sensor 810 disposed thereon in an optical axis direction.

Also, the terminal 803 may be spaced apart from the pad 802 and formed in an area that does not overlap with the image sensor 810 in an optical axis direction. This means that the terminal 803 is electrically connected to the terminal of the image sensor 810 through wire bonding, and thus the image sensor 810 and the optical axis can be smoothly bonded to the connection wire 21 . It may be formed in an area that does not overlap in the direction.

The pad 802 and the terminal 803 are at least one selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). It can be formed of a metal material of. In addition, the pad and terminal 803 are selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn), which have excellent bonding strength. It may be formed of a paste or solder paste containing at least one metal material. In addition, the pad 802 and the terminal 803 may include at least one surface treatment layer formed of a metal material having high wire bonding properties.

The terminals 803 and the pads 802 are formed by additive process, subtractive process, MSAP (Modified Semi Additive Process) and SAP (Semi Additive Process), which are typical printed circuit board manufacturing processes. ) method, etc., and detailed descriptions are omitted here.

Preferably, the pad 802 may function as a ground in the circuit board 800 . For example, the pad 802 may be connected to a ground terminal. For example, the pad 802 may be a ground pattern.

Also, the wire part 805 is connected to the pad 802 that is the ground pattern, and thus, the image sensor 810 may perform a heat dissipation function. For example, the wire part 805 is connected to the pad 802, and thus heat generated through the image sensor 810 can be radiated through a ground pattern. Accordingly, in the embodiment, heat dissipation characteristics of the image sensor 810 may be improved, and thus operation reliability of the image sensor 810 may be improved.

A protective layer 804 is disposed on the insulating layer 801 . The protective layer 804 may cover and protect a pattern layer disposed on the insulating layer 801 that should not be exposed to the outside while protecting the surface of the insulating layer 801 . The protective layer 804 may include solder resist. That is, the protective layer 804 may be a solder resist layer.

The protective layer 804 has an opening exposing the upper surface of the pad 802 and the terminal 803 disposed on the upper surface of the insulating layer 801 . Accordingly, at least a portion of the upper surface of the pad 802 and the terminal may be exposed through the opening of the protective layer 804 .

Meanwhile, an upper surface of the pad 802 exposed through the opening of the protective layer 804 may be an area where the wire part 805 is bonded. Also, an upper surface of the terminal 803 exposed through the opening of the protective layer 804 may be an area where the connection wire 21 is bonded.

In addition, the connection wire 21 serves to electrically connect different components to each other, and thus both ends are connected to different components. For example, one end of the connection wire 21 is connected to the terminal 803 of the circuit board 800 and the other end is connected to the terminal 813 of the image sensor 810 .

Alternatively, the wire part 805 functions to support the image sensor 810, and thus both ends may be connected to one pad 802. That is, both one end and the other end of the wire part 805 are connected to the pad 802 (eg, the bump part 805-1 and the fourth extension part 805-5 in FIGS. 7 and 8) It has a height corresponding to the length between the one end and the other end, and may be disposed protruding on the pad 802.

Meanwhile, an opening of the protective layer 804 may not be formed in an area where the first adhesive member 1750 is to be disposed. Accordingly, the first adhesive member 1750 may be formed on the protective layer 804 to fix or attach the image sensor 810 .

An uppermost end of the wire portion 805 may be positioned higher than a top surface of the protective layer 804 . That is, the lowermost end of the wire portion 805 may be located higher than the lower surface of the protective layer 804 .

Meanwhile, the pad 802 may be formed on the insulating layer 801 to have a certain area. For example, a plane area of the pad 802 in the first embodiment may be greater than or equal to a plane area of the image sensor 810 . For example, a plane area of the pad 802 may be the same as that of the image sensor 810 . For example, a plane area of the pad 802 may be greater than a plane area of the image sensor 810 .

A plurality of wire parts 805 may be formed on the pad 802 and spaced apart from each other. For example, the wire part 805 may include first to fourth wire parts. For example, the wire part 805 may include at least four wire parts overlapping the image sensor 810 in an optical axis direction. For example, the wire part 805 may include a plurality of wire parts overlapping each corner part (corner area or edge area) of the lower surface of the image sensor 810 .

For example, the wire part 805 may include a first wire part 805a overlapping a first corner part of a lower surface of the image sensor 810 . For example, the wire portion 805 may include a second wire portion 805b overlapping a second corner portion of a lower surface of the image sensor 810 . For example, the wire part 805 may include a third wire part 805c overlapping a third corner part of the lower surface of the image sensor 810 . For example, the wire part 805 may include a fourth wire part 805d overlapping the fourth corner part of the lower surface of the image sensor 810 .

The embodiment includes first to fourth wire parts 805a, 805b, 805c, and 805d overlapping four corner parts of the lower surface of the image sensor 810, respectively. Accordingly, in the embodiment, the image sensor 810 can be supported in regions corresponding to the four corners of the lower surface of the image sensor 810 by using at least four wire parts. Accordingly, in the embodiment, the flatness of the image sensor 810 can be further improved by supporting the image sensor 810 at each of the four corner portions, and thus the operational reliability of the image sensor 810. can improve

Meanwhile, each of the four wire parts may include a plurality of sub wire parts.

For example, each of the first to fourth wire parts 805a, 805b, 805c, and 805d may include a first sub-wire part 805a1 and a second sub-wire part 805a2.

The first sub wire part 805a1 and the second sub wire part 805a2 may be connected to each other. For example, one end of the first sub wire part 805a1 may directly contact one end of the second sub wire part 805a2.

In the embodiment, at least two sub-wire parts are included for one wire part as described above. That is, in the embodiment, a wire portion having a certain height is formed by bonding wires, and the image sensor 810 is supported by using the wire portion.

At this time, when each of the first to fourth wire parts 805a, 805b, 805c, and 805d includes only one sub-wire part, the pressure applied in the attaching process of the image sensor 810 increases a certain height. It is difficult to maintain, and accordingly, it may be difficult to stably support the image sensor 810 .

Accordingly, in the embodiment, the first to fourth wire parts 805a, 805b, 805c, and 805d are spaced apart from each other in a direction perpendicular to the respective optical axis, and the first sub-wire part 805a1 and the second sub-wire part 805a1 and the second sub-wire are connected to each other. to include part 805a2. Accordingly, in the embodiment, in the process of attaching the image sensor 810, the first sub wire part 805a1 and the second sub wire part 805a2 are mutually supported, and accordingly, the first sub wire part 805a1 and the second sub wire part 805a2 are mutually supported. A height change of the wire part 805a1 and the second sub wire part 805a2 is minimized. For example, the first sub wire part 805a1 and the second sub wire part 805a2 may have a first height before the image sensor 810 is attached thereto. In addition, it has a second height lower than the first height due to the pressure applied during the attaching process of the image sensor 810 . In this case, when each of the first to fourth wire parts 805a, 805b, 805c, and 805d includes only one sub-wire part, a difference between the first height and the second height increases, and accordingly, the image sensor ( 810) can be difficult to provide stable support. Accordingly, in the embodiment, each of the first to fourth wire parts 805a, 805b, 805c, and 805d includes a first sub-wire part 805a1 and a second sub-wire part 805a2, and thus the The difference between the first height and the second height can be minimized. Accordingly, in the embodiment, the support of the image sensor 810 by the wire part 805 can be stably achieved, and accordingly, operation reliability of the image sensor 810 can be further improved.

Meanwhile, the wire part 805 may be additionally disposed between four corner parts of the lower surface of the image sensor 810 .

For example, as described above, the wire unit 805 may include the first to fourth wire units 805a, 805b, 805c, and 805d.

Also, the wire part 805 may include a fifth wire part 805e disposed between the first wire part 805a and the second wire part 805b. Also, the wire part 805 may include a sixth wire part 805f disposed between the second wire part 805b and the third wire part 805c. Also, the wire part 805 may include a seventh wire part 805g disposed between the third wire part 805c and the fourth wire part 805d. Also, the wire part 805 may include an eighth wire part 805h disposed between the first wire part 805a and the fourth wire part 805d.

According to the embodiment, the wire portion 805 is arranged to overlap not only the four corner portions of the lower surface of the image sensor 810 but also the area between the four corner portions as described above, and thus the image sensor ( 810) can be supported more stably.

7 is a view for explaining a detailed structure of a wire part according to an embodiment, and FIG. 8 is a view showing a modified example of the wire part of FIG. 7 .

Hereinafter, the wire unit according to the embodiment will be described in detail with reference to FIGS. 7 and 8 . Specifically, FIGS. 7 and 8 are diagrams showing structures of the first sub wire part 805a1 and the second sub wire part 805a2 in detail.

Referring to FIG. 7 , each of the sub wire parts constituting the wire part 805 may include only the bump part 805 - 1 described below.

Different from this, each of the sub wire parts constituting the wire part 805 in the embodiment includes a bump part 805-1, a first extension part 805-2, a second extension part 805-3, It may include a third extension part 805-4 and a fourth extension part 805-5. As such, the sub wire part may be formed using a metal wire having a specific thickness.

The bump portion 805 - 1 may be bonded to the pad 802 of the circuit board 800 . The bump part 805 - 1 may be a part initially formed in the process of forming each sub wire part constituting the wire part 805 on the upper surface of the pad 802 . That is, the bump part 805-1 is pressurized while the wire is placed on the upper surface of the pad 802, and has a certain width W1 and a certain height H2 as bonding proceeds in the pressed state. It may be a part formed to The bump part 805-1 may also be referred to as a body part of the sub wire part. Specifically, the bump portion 805 - 1 may be a portion where the metal wire is united as bonding proceeds while pressing the metal wire on the pad 802 .

In the first embodiment, the bump portion 805-1 may have a rectangular cross section. The bump portion 805-1 may have a first width W1. The first width W1 of the bump portion 805-1 may be 80 um to 100 um. When the first width of the bump portion 805-1 is smaller than 80 μm, the contact area between the wire portion 805 and the pad 802 is reduced, and thus the wire portion 805 and the pad 802 are reduced. ) may decrease the bonding strength between them. In addition, when the first width W1 of the bump part 805-1 is greater than 100um, the overall volume of the wire part 805 increases, and thus the manufacturing cost increases as the length of the wire used increases. can

The bump portion 805-1 may have a second height H2. For example, the bump portion 805 - 1 may have a second height H2 between 10 um and 30 um. When the height of the bump portion 805-1 is lower than 10um, the height of the first extension portion 805-2 must be increased to have the sub-wire portion have a certain height, and thus the strength of the sub-wire portion increases. may be lowered overall. Accordingly, the supporting force of the image sensor 810 by the sub wire part may be reduced. In addition, when the height of the bump portion 805-1 is greater than 30 μm, the overall height of the sub-wire portion increases, and accordingly, the overall height of the camera module may increase. In addition, when the length of the first extension part 805-2 is reduced in a state where the bump part 805-1 is larger than 30um, the height that can be pressed in the attaching process of the image sensor 810 is increased. decrease, and thus the bonding strength of the image sensor 810 may decrease.

The first extension part 805-2 may extend in the optical axis direction from the upper surface of the bump part 805-1. The first extension part 805-2 may have a thickness and shape corresponding to the metal wire forming the sub-wire part. However, a portion of the first extension part 805-2 that contacts the bump part 805-1 may have a certain width. A width W2 of a contact portion between the first extension part 805-2 and the bump part 805-1 may range from 25 μm to 45 μm. The width W2 may refer to a width of one end of the first extension part 805-2 contacting the bump part 805-1.

Also, the width of the upper end of the first extension part 805-2 may correspond to the thickness of the metal wire. Accordingly, the first extension 805-2 may have a trapezoidal shape in which the width gradually decreases from one end to the other end.

The second extension part 805-3 is bent at the other end of the first extension part 805-2 and may extend in a direction different from the extension direction of the first extension part 805-2. For example, the second extension part 805-3 may extend in a direction perpendicular to the optical axis direction. For example, the second extension part 805 - 3 may extend in a direction corresponding to the disposition direction of the image sensor 810 . The second extension part 805-3 may be flat. For example, the second extension part 805-3 is pressed by the pressing force provided in the attaching process of the image sensor 810 and extends in a direction parallel to the lower surface of the image sensor 810. can have The second extension part 805-3 may have a first length L1. The first length L1 of the second extension part 805-3 may have a range of 10 um to 30 um. When the length of the second extension part 805 - 3 is less than 10 μm, as the contact portion with the image sensor decreases, the degree of warpage of the image sensor may be reduced insignificantly. Also, if the length of the second extension part 805-3 exceeds 30 um, strength of the wire part may not be secured.

In this case, the height H1 of the sub wire part may mean a height from the lowermost end of the bump part 805-1 to the uppermost end of the second extension part 805-3. At this time, the height H1 of the wire portion 805 may be 30 um to 50 um. When the height H1 of the sub-wire part is less than 30 μm, the supporting force of the image sensor 810 by the sub-wire part may decrease. In addition, when the height H1 of the sub-wire part is smaller than 30um, the separation distance between the terminals between the image sensor 810 and the circuit board 800 increases, and thus the length of the connecting wire 21 increases and reliability may deteriorate. In addition, when the height H1 of the sub wire part is greater than 50um, the overall height of the camera module may increase.

The third extension 805-4 may extend in the optical axis direction from the other end of the second extension 805-3. For example, the third extension 805 - 4 has a predetermined inclination angle with respect to the optical axis direction, and may extend from the other end of the second extension 805 - 3 to the upper surface of the pad 802 .

The fourth extension 805 - 5 may be a portion extending from the other end of the third extension 805 - 4 and bonded to the upper surface of the pad 802 . The fourth extension portion 805-5 may be an end portion of a sub-wire portion formed in a process of completing bonding of metal wires. Meanwhile, the third extension part 805-4 and the fourth extension part 805-5 can be viewed as a single structure, and accordingly, from the second extension part 805-3 to the pad 802 direction. It may also be referred to as the other end of the metal wire extended and bonded to the pad 802 .

That is, the bump portion 805-1 may be a start portion where bonding of metal wires to form a sub-wire portion starts, and the fourth extension portion 805-5 may be an end portion where bonding of metal wires ends. can be

Meanwhile, referring to FIG. 8 , the sub-wire unit includes a bump portion 805-1a, a first extension portion 805-2, a second extension portion 805-3, a third extension portion 805-4, and A fourth extension 805-5 may be included. At this time, there is a difference in the shape of the bump portion 805-1a of the sub wire portion of the second embodiment of FIG. 8 compared to FIG. 7 . That is, in the sub wire part of the second embodiment, the first extension part 805-2, the second extension part 805-3, the third extension part 805-4 and the fourth extension part 805-5 may be substantially the same as the sub wire portion of the first embodiment. However, the bump portion 805-1a in the second embodiment may have a convex top surface. That is, the top surface of the portion where the metal wires are agglomerated at the beginning of bonding may have a convex circular shape, and accordingly, the top surface of the bump portion 805 - 1a may be a curved surface having a certain curvature. However, the embodiment is not limited thereto, and the shape of the bump portion may change according to the bonding method of the metal wire.

9 is a plan view of a circuit board according to another embodiment.

Referring to FIG. 9 , a plurality of pads 802 of the embodiment may be formed to correspond to the wire part 805 . Also, the first to fourth wire parts 805a, 805b, 805c, and 805d constituting the wire part 805 may be disposed on different pads, respectively.

For example, the pad 802 may include a first pad 802-1, a second pad 802-2, a third pad 802-3, and a fourth pad 802-4.

In addition, the wire part 805 includes the first to fourth wire parts 805a, 805b, 805c, 805d). For example, the wire part 805 may include a first wire part 805a disposed on the first pad 802-1, a second wire part 805b disposed on the second pad 802-2, A third wire portion 805c disposed on the third pad 802-3 and a fourth wire portion 805d disposed on the fourth pad 802-4 may be included.

Therefore, in the embodiment, the image sensor is provided through the first wire part 805a, the second wire part 805b, the third wire part 805c, and the fourth wire part 805d disposed on pads separated from each other. Support for each corner of the lower surface of (810) can be made.

Accordingly, in the embodiment, the image sensor 810 can be supported more stably, and thus, a bending phenomenon can be minimized. In addition, in the embodiment, the heat generated from the image sensor 810 may be branched and provided to different paths by using a plurality of wire parts having heat transfer paths separated from each other as they are disposed on different pads. Heat dissipation performance can be improved.

An embodiment includes a circuit board including a wire portion. The circuit board is a board on which an image sensor is mounted. In this case, the wire part includes a pad disposed in a first area overlapping the image sensor in an optical axis direction, and a terminal disposed in a second area not overlapping the image sensor in an optical axis direction. And, the wire part is bonded on the pad. Also, the first area includes an area where an adhesive member for attaching or fixing the image sensor is disposed. That is, the adhesive member may be selectively disposed on an area of the first area of the circuit board where the wire part is not formed. Also, in an embodiment, at least a part of the lower surface of the image sensor may be attached or fixed on the circuit board by the adhesive member in a state in which at least a part of the lower surface of the image sensor is in direct contact with and supported by the wire part. At this time, the wire part is not electrically connected to (or insulated from) the image sensor. That is, the wire part is not a wire that functions to transmit electrical signals, but a wire that functions to support the image sensor. Accordingly, in the embodiment, at least a portion of the image sensor directly contacts and supports the wire portion, thereby minimizing the bending of the image sensor. Also, in the embodiment, heat generated from the image sensor may be efficiently transferred to the outside by directly contacting at least a portion of the image sensor with the wire part.

Also, in the embodiment, the area of the adhesive member disposed on the lower surface of the image sensor is smaller than the area of the lower surface of the image sensor. According to this, in the embodiment, the area of the adhesive member is reduced compared to the area of the image sensor, thereby minimizing the bending of the image sensor, which increases in proportion to the area of the adhesive member.

Also, in the embodiment, a corner region of a lower surface of an active pixel region of an image sensor and the wire part are directly contacted with each other. Accordingly, in the embodiment, it is possible to solve the problem of warping of the active pixel area of the image sensor.

In addition, in the embodiment, first to fourth wire parts overlapping four corner parts of the lower surface of the image sensor in an optical axis direction are included, and the first to fourth wire parts are first to second sub-wires connected to each other. includes wealth Accordingly, in the embodiment, by using the first and second sub-wire parts, it is possible to minimize the change in height of the wire part due to the pressure applied when the image sensor is attached, and thereby further improve the flatness of the image sensor. can

Hereinafter, structures and arrangement relationships of the circuit board 800, the wire unit 805, the first adhesive member 1750, and the image sensor 810 according to an embodiment will be described in detail.

10 is a view showing various embodiments of the arrangement shape of the first adhesive member, FIG. 11 is a view showing the degree of warpage according to the arrangement area of the first adhesive member, and FIGS. 12 and 13 are views of the first embodiment FIG. 14 is a diagram for explaining the arrangement relationship between the wire part and the image sensor according to the second embodiment.

Referring to FIGS. 10 to 14 , the circuit board 800 includes a first region and a second region. Also, the first area may be an area overlapping the image sensor 810 in the optical axis direction.

Also, the first area may be divided into an area where the wire part 805 is disposed and an area where the first adhesive member 1750 is disposed.

In the first region of the circuit board 800, a pad 802 and a first wire portion 805a, a second wire portion 805b, a third wire portion 805c bonded on the pad 802, and A fourth wire portion 805d may be formed. In this case, one pad 802 may be formed in a first area overlapping the image sensor 810, and the first to fourth wire parts 805a, 805b, 805c, and 805d may be formed on the one pad. can be commonly placed in Alternatively, the pad 802 may include first to fourth pads 802-1, 802-2, 802-3, and 802-4 spaced apart from each other, and the first to fourth wire parts ( 805a, 805b, 805c, 805d) may be disposed on the first to fourth pads, respectively.

Also, the first to fourth wire parts 805a, 805b, 805c, and 805d may overlap each corner region of the lower surface of the image sensor 810 in the optical axis direction.

In the embodiment, the first adhesive member 1750 is applied in a state in which the corner area of the lower surface of the image sensor 810 is supported through the first to fourth wire parts 805a, 805b, 805c, and 805d as described above. The image sensor 810 is attached or fixed on the circuit board 800 through

For example, in the comparative example, the first adhesive member was formed on the circuit board, and thus the image sensor was attached to the first adhesive member. At this time, there is a problem in that the degree of warping of the image sensor increases as the amount of application of the first adhesive member increases. In addition, when the first adhesive member is applied only to a part of the lower region of the image sensor 810, the lower surface of the image sensor 810 is not coated with the first adhesive member. , there is a problem that warpage occurs accordingly.

Unlike this, in the embodiment, the first adhesive member 1750 is formed only on a partial area of the lower surface of the image sensor 810, and accordingly, the wire part ( 805) to be placed.

In an embodiment, the area of the lower surface of the image sensor 810 may be larger than the area of the upper surface of the first adhesive member 1750 . For example, the area of the upper surface of the first adhesive member 1750 may be less than 80% of the area of the lower surface of the image sensor 810 . For example, an area of an upper surface of the first adhesive member 1750 may be 70% or less of an area of a lower surface of the image sensor 810 . For example, the area of the upper surface of the first adhesive member 1750 may be 60% or less of the area of the lower surface of the image sensor 810 . For example, the area of the upper surface of the first adhesive member 1750 may be 50% or less of the area of the lower surface of the image sensor 810 .

Preferably, the area of the upper surface of the first adhesive member 1750 is less than 50% of the area of the lower surface of the image sensor 810 . According to this, in the embodiment, the area of the first adhesive member 1750 is reduced compared to the area of the image sensor 810, and thus the warping phenomenon that increases in proportion to the area of the first adhesive member 1750 is reduced. make it possible to minimize

Referring to FIG. 10 , as shown in (a), (b) and (c), the first adhesive member 1750 may have various shapes and be applied on the protective layer 804 of the circuit board 800. there is. However, the first adhesive member 1750 in the embodiment has a snowflake shape as shown in FIG. 10(c). That is, it was confirmed that a change in the degree of warpage occurs depending on the application shape of the first adhesive member 1750, and when the first adhesive member 1750 is applied in the shape shown in (c) of FIG. 10, As a result, it was confirmed that the degree of warpage occurred at the lowest level.

Further, referring to FIG. 11 , when the degree of curvature of the image sensor 810 when the area of the first adhesive member 1750 is 75% or more of the area of the lower surface of the image sensor 810 is 100%, When the area of the first adhesive member 1750 is 50% of the area of the lower surface of the image sensor 810, the degree of bending of the image sensor 810 is 88%. That is, it was confirmed that the degree of warpage decreased as the mutually overlapping area of the first adhesive member 1750 and the image sensor 810 decreased. However, when the area of the first adhesive member 1750 is reduced without any reference, the adhesiveness or fixing force of the image sensor 810 is reduced thereby causing a reliability problem.

In other words, it can be seen that as the area of the first adhesive member 1750 in contact with the image sensor 810 decreases, the effect of the coefficient of thermal expansion decreases and thus the degree of warpage decreases. Accordingly, in the embodiment, the area of the portion in contact with the first adhesive member 1750 is less than 50% of the total area of the lower surface of the image sensor 810, thereby minimizing the occurrence of bending of the image sensor 810 let it do

As described above, in the embodiment, only a portion of the lower surface of the image sensor 810 is brought into contact with the first adhesive member 1750, thereby minimizing the bending of the image sensor 810, thereby improving the performance of the image sensor. can improve

Meanwhile, the first adhesive member 1750 may be formed in the first area of the circuit board 800 except for the corner area. For example, the first adhesive member 1750 may be formed in various shapes (preferably snowflake shapes) on the first area of the circuit board 800 except for corner areas.

The wire unit 805 may be disposed in an area overlapping a corner area of the lower surface of the image sensor 810 in an optical axis direction.

For example, the wire part 805 may include a first wire part 805a formed in an area overlapping a first corner area of the lower surface of the image sensor 810 in an optical axis direction. The wire part 805 may include a second wire part 805b formed in an area overlapping the second corner area of the lower surface of the image sensor 810 in the optical axis direction. The wire part 805 may include a third wire part 805c formed in an area overlapping the third corner area of the lower surface of the image sensor 810 in the optical axis direction. The wire part 805 may include a fourth wire part 805d formed in an area overlapping the fourth corner area of the lower surface of the image sensor 810 in the optical axis direction. Also, each of the first to fourth wire parts 805a, 805b, 805c, and 805d may include a first sub-wire part 805a1 and a second sub-wire part 805a2. However, although the first to fourth wire portions 805a, 805b, 805c, and 805d each include two sub-wire portions, the embodiment is not limited thereto. For example, each of the first to fourth wire parts 805a, 805b, 805c, and 805d may include at least three or more sub-wire parts connected to each other.

Each of the wire parts constituting the wire part 805 may be spaced apart from the first adhesive member 1750 . For example, the first adhesive member 1750 may not contact the wire part 805 . Accordingly, in the embodiment, heat generated through the image sensor 810 may be radiated to the outside through a plurality of branched paths, thereby improving heat dissipation performance.

As described above, the wire part 805 may overlap a specific area of the image sensor 810 in an optical axis direction. Preferably, in each of the sub-wire parts constituting the wire part 805, the second extension part 805-3 supporting the image sensor 810 has a specific area of the image sensor 810 and an optical axis direction. can be overlapped with

For example, the image sensor 810 may include a pixel area 811 composed of a plurality of pixels for detecting a light image (image information) incident through a lens and a passivation area 812 other than the pixel area. can

In this case, the wire part 805 may be formed to overlap at least a portion of the pixel area 810 in a corner area of the image sensor 810 . For example, the wire part 805 may be formed in an area overlapping the pixel area 811 of the image sensor 810 and the optical axis direction OA on the circuit board 800 .

Specifically, the pixel area of the image sensor 810 includes an active pixel area 811-1 used to detect actual image information and a dummy pixel area 811-2 other than the active pixel area 811-1. can include The active pixel region 811-1 may be used to generate image information using incident light. The dummy pixel area 811-2 is not used to generate image information, but may have the same structure as the active pixel area 811-1. That is, in the image sensor 810, in order to increase reliability in generating image information, the dummy pixel region ( 811-2).

Also, in the embodiment, the wire part 805 may overlap a corner region of the active pixel region 811-1 of the image sensor in the optical axis direction. That is, the most important area of the image sensor 810 is the active pixel area 811 - 1 , and the flatness of the active pixel area 811 - 1 substantially determines the performance and operational reliability of the image sensor 810 . do. Accordingly, in the embodiment, at least a portion of the active pixel region 811-1 can be supported by the wire portion 805.

In addition, the wire portion 805 in the embodiment overlaps at least a portion of a corner region of the active pixel region 811-1 in the optical axis direction. Accordingly, in the embodiment, the lower surface corresponding to the active pixel region 811-1 among the lower surfaces of the image sensor 810 can be supported by the wire part 805, so that the image sensor 810 can It is possible to minimize warping of the active pixel region 811-1.

That is, when the wire part 805 overlaps the active pixel region 811-1 in the optical axis direction, the overall flatness of the active pixel region 811-1 can be maintained, and thus the image sensor ( 810) can be minimized.

The second extension part 805 - 3 of each sub wire part of the wire part 805 may extend in a direction crossing corners of different regions of the image sensor 810 . For example, the second extension portion 805-3 may extend in a direction connecting the corner of the active pixel region 811-1 of the image sensor 810 and the corner of the passivation region 812 adjacent thereto. can For example, the second extension portion 805 - 3 of the wire portion 805 may extend on the circuit board 800 in a diagonal direction between them rather than in a longitudinal direction or a width direction.

Accordingly, in the embodiment, it is possible to optimize the supporting force of the image sensor 810 by the wire part 805 and to minimize the occurrence of warping.

Referring to FIG. 14 , the first to fourth wire portions 805a, 805b, 805c, and 805d constituting the wire portion 805 connect adjacent corner regions among a plurality of corner regions of the image sensor 810. can be placed in any direction. In this case, the sub wire parts of the first to fourth wire parts 805a, 805b, 805c, and 805d may extend in different directions. For example, the plurality of sub wire parts 805a1 constituting the first wire part 805a may extend in a direction connecting the first corner area and the second corner area of the image sensor 810 . For example, the plurality of sub wire parts 805b1 constituting the second wire part 805b may extend in a direction connecting the second corner area and the third corner area of the image sensor 810 . For example, the plurality of sub wire parts 805c constituting the third wire part 805c may extend in a direction connecting the third corner area and the fourth corner area of the image sensor 810 . For example, the plurality of sub wire parts 805d constituting the fourth wire part 805d may extend in a direction connecting the first corner area and the fourth corner area of the image sensor 810 .

15 is a graph showing a degree of bending of an image sensor according to a comparative example, and FIG. 16 is a graph showing a degree of bending of an image sensor including a wire part according to an embodiment.

15 (a) shows values of the degree of warping by position of the image sensor of the comparative example, and (b) shows the degree of warping by position of the image sensor of the comparative example in a pattern. Referring to FIG. 15 , in the comparative example, it can be confirmed that the image sensor has an average warpage of about 7.04 μm.

16 (a) shows values of the degree of warpage by position of the image sensor according to the embodiment, and (b) shows the degree of warpage by position of the image sensor according to the embodiment in a pattern. Referring to FIG. 16, when the wire unit 805 is applied while minimizing the application area of the first adhesive member according to the embodiment, it can be confirmed that the bending of the image sensor has occurred by an average of about 4.42um, which is improved compared to the comparative example. could

An embodiment includes a circuit board including a wire portion. The circuit board is a board on which an image sensor is mounted. In this case, the wire part includes a pad disposed in a first area overlapping the image sensor in an optical axis direction, and a terminal disposed in a second area not overlapping the image sensor in an optical axis direction. And, the wire part is bonded on the pad. Also, the first area includes an area where an adhesive member for attaching or fixing the image sensor is disposed. That is, the adhesive member may be selectively disposed on an area of the first area of the circuit board where the wire part is not formed. Also, in an embodiment, at least a part of the lower surface of the image sensor may be attached or fixed on the circuit board by the adhesive member in a state in which at least a part of the lower surface of the image sensor is in direct contact with and supported by the wire part. At this time, the wire part is not electrically connected to (or insulated from) the image sensor. That is, the wire part is not a wire that functions to transmit electrical signals, but a wire that functions to support the image sensor. Accordingly, in the embodiment, at least a portion of the image sensor directly contacts and supports the wire portion, thereby minimizing the bending of the image sensor. In addition, in the embodiment, heat generated from the image sensor may be efficiently transferred to the outside by allowing at least a portion of the image sensor to directly contact the wire part.

Also, in the embodiment, the area of the adhesive member disposed on the lower surface of the image sensor is smaller than the area of the lower surface of the image sensor. According to this, in the embodiment, the area of the adhesive member is reduced compared to the area of the image sensor, thereby minimizing the bending of the image sensor, which increases in proportion to the area of the adhesive member.

Also, in the embodiment, a corner region of a lower surface of an active pixel region of an image sensor and the wire part are directly contacted with each other. Accordingly, in the embodiment, it is possible to solve the problem of warping of the active pixel area of the image sensor.

In addition, in the embodiment, first to fourth wire parts overlapping four corner parts of the lower surface of the image sensor in an optical axis direction are included, and the first to fourth wire parts are first to second sub-wires connected to each other. includes wealth Accordingly, in the embodiment, by using the first and second sub-wire parts, it is possible to minimize the change in height of the wire part due to the pressure applied when the image sensor is attached, and thereby further improve the flatness of the image sensor. can

17 is a perspective view of a portable terminal 200A according to an embodiment, and FIG. 18 is a configuration diagram of the portable terminal shown in FIG. 17

17 and 18, a portable terminal (200A, hereinafter referred to as a "terminal") includes a body 850, a wireless communication unit 710, an A/V input unit 720, a sensing unit 740, an input/output unit, It may include an output unit 750, a memory unit 760, an interface unit 770, a control unit 780, and a power supply unit 790.

The body 850 shown in FIG. 17 has a bar shape, but is not limited thereto, and is a slide type, folder type, or swing type in which two or more sub-bodies are coupled to be relatively movable. , and may have various structures such as a swivel type.

The body 850 may include a case (casing, housing, cover, etc.) constituting an external appearance. For example, the body 850 may be divided into a front case 851 and a rear case 852 . Various electronic components of the terminal may be embedded in the space formed between the front case 851 and the rear case 852 .

The wireless communication unit 710 may include one or more modules enabling wireless communication between the terminal 200A and a wireless communication system or between the terminal 200A and a network in which the terminal 200A is located. For example, the wireless communication unit 710 may include a broadcast reception module 711, a mobile communication module 712, a wireless Internet module 713, a short-distance communication module 714, and a location information module 715. there is.

An audio/video (A/V) input unit 720 is for inputting an audio signal or a video signal, and may include a camera 721 and a microphone 722.

The camera 721 may include a camera module according to the embodiment shown in FIG. 2 .

The sensing unit 740 detects the current state of the terminal 200A, such as the open/closed state of the terminal 200A, the location of the terminal 200A, whether or not there is a user contact, the direction of the terminal 200A, and the acceleration/deceleration of the terminal 200A. By sensing, a sensing signal for controlling the operation of the terminal 200A may be generated. For example, when the terminal 200A is in the form of a slide phone, whether the slide phone is opened or closed may be sensed. In addition, it is responsible for sensing functions related to whether or not the power supply unit 790 supplies power and whether or not the interface unit 770 is connected to an external device.

The input/output unit 750 is for generating input or output related to sight, hearing, or touch. The input/output unit 750 may generate input data for controlling the operation of the terminal 200A, and may also display information processed by the terminal 200A.

The input/output unit 750 may include a keypad unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keypad unit 730 may generate input data by keypad input.

The display module 751 may include a plurality of pixels whose colors change according to electrical signals. For example, the display module 751 may be a liquid crystal display, a thin film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, a 3D At least one of 3D displays may be included.

The audio output module 752 outputs audio data received from the wireless communication unit 710 in a call signal reception mode, a call mode, a recording mode, a voice recognition mode, or a broadcast reception mode, or stored in the memory unit 760. Audio data can be output.

The touch screen panel 753 may convert a change in capacitance caused by a user's touch to a specific area of the touch screen into an electrical input signal.

The memory unit 760 may store programs for processing and control of the control unit 780, and may store input/output data (eg, phone book, messages, audio, still images, photos, videos, etc.) can be temporarily stored. For example, the memory unit 760 may store an image captured by the camera 721, for example, a photo or video.

The interface unit 770 serves as a passage through which an external device connected to the terminal 200A is connected. The interface unit 770 receives data from an external device or receives power and transmits it to each component inside the terminal 200A, or transmits data inside the terminal 200A to an external device. For example, the interface unit 770 may include a wired/wireless headset port, an external charger port, a wired/wireless data port, a memory card port, a port connecting a device having an identification module, an audio I/O (Input/ output) port, video input/output (I/O) port, and earphone port.

The controller 780 may control overall operations of the terminal 200A. For example, the controller 780 may perform related control and processing for voice calls, data communications, video calls, and the like.

The controller 780 may include a multimedia module 781 for playing multimedia. The multimedia module 781 may be implemented within the control unit 180 or may be implemented separately from the control unit 780.

The controller 780 may perform a pattern recognition process capable of recognizing handwriting input or drawing input performed on the touch screen as characters and images, respectively.

The power supply unit 790 may receive external power or internal power under the control of the control unit 780 to supply power necessary for the operation of each component.

Features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified with respect to other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to these combinations and variations should be construed as being included in the scope of the present invention.

Claims (12)

circuit board; and
An image sensor disposed on the circuit board;
The circuit board,
insulating layer;
a pad disposed on the insulating layer;
a terminal disposed on the insulating layer and spaced apart from the pad;
a protective layer disposed on the insulating layer and including an opening exposing the pad and the terminal;
Wire parts disposed on the pad and spaced apart from each other; and
Including a connection wire connecting between the image sensor and the terminal,
the pad,
overlapped with the image sensor in the optical axis direction;
The terminal is
Does not overlap with the image sensor in the optical axis direction,
camera module. According to claim 1,
The wire part,
In direct contact with the lower surface of the image sensor,
camera module. According to claim 1,
The wire part is spaced apart from each other on the pad and is disposed in plurality,
The plurality of wire parts,
overlapped with different corner portions of the lower surface of the image sensor in the optical axis direction,
camera module. According to claim 3,
Each of the plurality of wire parts,
a first sub wire part; and
Including a second sub-wire portion connected to the first sub-wire portion,
camera module. According to claim 4,
The pad includes a plurality of pads spaced apart from each other,
The plurality of pads
It overlaps with different corner portions of the lower surface of the image sensor in the optical axis direction,
The first and second sub wire parts,
disposed on each of the plurality of pads,
camera module. According to claim 1,
And a first adhesive member disposed between the protective layer and the image sensor,
The first adhesive member is spaced apart from the wire part,
camera module. According to claim 6,
The area of the lower surface of the image sensor is
greater than the area of the upper surface of the first adhesive member,
The area of the upper surface of the first adhesive member is
50% or less of the area of the lower surface of the image sensor,
camera module. According to any one of claims 1 to 7,
The image sensor includes a pixel area and a passivation area around the pixel area,
The pixel area of the image sensor is
an active pixel area;
a dummy pixel region between the active pixel region and the passivation region;
The wire part,
overlapping a corner region of the active pixel region in an optical axis direction;
camera module. According to claim 4,
Each of the first and second sub-wire parts,
a bump portion bonded on the pad;
a first extension portion extending in an optical axis direction from the bump portion;
a second extension portion extending in a direction perpendicular to the optical axis direction from the first extension portion and directly contacting a lower surface of the image sensor;
A third extension extending from the second extension and bonded to the pad,
camera module. According to claim 9,
The bump portion has a width ranging from 80um to 100um,
The bump portion has a height in the range of 10 um to 30 um,
The height from the lower surface of the bump to the uppermost end of the second extension has a range of 30 um to 50 um,
The length of the second extension has a range between 10um and 30um,
camera module. According to claim 4,
One end and the other end of each of the first and second sub-wire parts contact the pad, and at least a part of a region between the one end and the other end contacts a lower surface of the image sensor,
One end of the connection wire is in contact with a terminal of the image sensor, and the other end of the connection wire is in contact with a terminal of the circuit board.
camera module. A body, a camera module disposed on the body and capturing an image of a subject, and a display unit disposed on the body and outputting an image captured by the camera module,
The camera module,
circuit board; and an image sensor disposed on the circuit board;
The circuit board,
insulating layer; a pad disposed on the insulating layer; a terminal disposed on the insulating layer and spaced apart from the pad; a protective layer disposed on the insulating layer and including an opening exposing the pad and the terminal; Wire parts disposed on the pad and spaced apart from each other; And a connection wire connecting between the image sensor and the terminal,
The pad overlaps the image sensor in an optical axis direction,
The terminal does not overlap with the image sensor in the optical axis direction,
The wire part includes first to fourth wire parts spaced apart from each other,
Each of the first to fourth wire parts,
a first sub wire unit; and
A second sub-wire portion connected to the first sub-wire portion;
Each of the first and second sub-wire parts,
a bump portion bonded on the pad;
a first extension portion extending in an optical axis direction from the bump portion;
a second extension portion extending in a direction perpendicular to the optical axis direction from the first extension portion and directly contacting a lower surface of the image sensor;
A third extension extending from the second extension and bonded to the pad,
optical instrument.

Images