KR20230000314A - Substrate flattening device and method for flattening substrate - Google Patents

Abstract

According to one aspect of the present invention, provided is a substrate flattening device, which comprises: a pressing plate which presses a solder resist layer disposed on a surface of a substrate; an outer plate which is disposed outside the pressing plate to fix the substrate, and which is capable of moving independently of a movement of the pressing plate; a pressing plate driving part which drives the pressing plate; and an outer plate driving part which drives the outer plate, wherein the pressing plate may press the substrate while the outer plate fixes the substrate. Therefore, the present invention is capable of effectively performing the flattening of a solder resister layer of a substrate.

Description

Substrate flattening device and method for flattening substrate

The present invention relates to a substrate planarization apparatus and a substrate planarization method.

The substrate is typically manufactured by printing a circuit pattern with an electrically conductive material on a resin base member and forming a solder resist layer on the surface thereof.

The solder resist layer formed on the surface of the substrate not only physically protects the circuit pattern, but also serves to prevent oxidation of the circuit pattern.

A planarization process is important for the solder resist layer formed on the surface of the substrate, because if the planarization is not performed well, the thickness of the substrate becomes non-uniform, and mounting of devices such as semiconductor chips may be difficult.

Therefore, a device and method for flattening a substrate have been developed, and Patent Registration No. 10-0862008 discloses a technique for flattening a solder resist layer using a cover film and a vacuum press.

According to one aspect of the present invention, it is a primary object to provide an improved substrate planarization apparatus and substrate planarization method.

According to one aspect of the present invention, a pressurizing plate for pressurizing a solder resist layer disposed on a surface of a substrate; and disposed outside the pressurizing plate to fix the substrate and movable separately from the movement of the pressurizing plate. An outer plate; and a pressure plate driving part driving the pressure plate; and an outer plate driving part driving the outer plate, wherein the pressure plate may press the substrate while the outer plate fixes the substrate. A substrate flattening device is provided.

Here, the pressure plate may include an upper pressure plate and a lower pressure plate disposed below the upper pressure plate.

Here, the outer plate may include an upper outer plate and a lower outer plate disposed below the upper outer plate.

Here, a portion of the outer plate that contacts the substrate may have a ring shape.

Here, the pressure plate may include at least one heater unit.

Here, the substrate flattening apparatus may further include a control unit for controlling the pressing plate driving unit and the outer plate driving unit.

In addition, according to another aspect of the present invention, the portion to be flattened on which the solder resist layer is disposed among the portions of the substrate is disposed between the upper pressing plate and the lower pressing plate, and the portion of the substrate located outside the portion to be flattened disposing the silver between the upper outer plate and the lower outer plate; and moving the upper outer plate and the lower outer plate in a direction to come closer to each other so that they come into contact with a portion positioned outside the portion to be flattened, and outside the portion to be flattened. fixing the portion located on the side; and moving the upper pressure plate and the lower pressure plate in a direction to come closer to each other to bring them into contact with the portion to be flattened, and pressing the portion to be flattened while applying heat to the portion to be flattened flattening the flattening target portion; and moving the upper pressing plate and the lower pressing plate in a direction away from each other to release contact with the flattening target portion; and, the upper outer plate and the lower outer outer plate. A method for flattening a substrate is provided, comprising the step of releasing the fixation of a portion located outside the portion to be planarized by moving the plates in a direction away from each other.

Here, a shape of a portion of the upper outer plate and the lower outer plate contacting the substrate may be an annular shape.

A substrate flattening apparatus according to an aspect of the present invention can effectively planarize a solder resist layer of a substrate.

1 is a schematic view of a substrate flattening device according to an embodiment of the present invention.
2 is a schematic cross-sectional view showing a substrate to be flattened by a substrate flattening apparatus according to an embodiment of the present invention.
3 is a schematic view of one embodiment of the present invention, looking toward the bottom side of the upper pressure plate and the bottom side of the upper outer plate.
FIG. 4 is a schematic view of one embodiment of the present invention, viewed from the upper surface side of the lower pressurizing plate and the upper surface side of the lower outer plate with a substrate therebetween.
5 to 9 are schematic diagrams sequentially illustrating a planarization process using a substrate planarization apparatus according to an embodiment of the present invention.
10 is a schematic flow chart illustrating a method for planarizing a substrate according to an embodiment of the present invention.

Hereinafter, the present invention according to a preferred embodiment will be described in detail with reference to the accompanying drawings. In addition, in the present specification and drawings, redundant descriptions are omitted by using the same reference numerals for components having substantially the same configuration, and exaggerated portions in size, length ratio, etc. may exist in the drawings to aid understanding.

The present invention will become clear with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, only these embodiments make the disclosure of the present invention complete, and common knowledge in the art to which the present invention belongs. It is provided to fully inform the holder of the scope of the invention, and the present invention is only defined by the scope of the claims.

Meanwhile, terms used in this specification are for describing the embodiments and are not intended to limit the present invention. In this specification, singular forms also include plural forms unless specifically stated otherwise in a phrase. As used herein, "comprises" and/or "comprising" means that a stated component, step, operation, and/or element is present in the presence of one or more other components, steps, operations, and/or elements. or do not rule out additions. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. Terms are only used to distinguish one component from another.

1 is a schematic view of a substrate flattening apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view showing a substrate to be flattened by the substrate flattening apparatus according to an embodiment of the present invention. to be. In addition, FIG. 3 is a schematic view of an embodiment of the present invention, looking at the bottom side of the upper pressurizing plate and the bottom side of the upper outer plate, and FIG. 4 is a view showing the upper side of the lower pressing plate with the substrate therebetween. It is a schematic view looking toward the top side of the and lower outer plate.

As shown in FIG. 1, a substrate flattening apparatus 100 according to an embodiment of the present invention is a device for flattening a substrate P transferred in a roll-to-roll process, and includes a pressing plate 110, It includes an outer plate 120, a pressure plate driving unit 130, an outer plate driving unit 140, a heater unit 150, and a control unit 160.

The substrate P, as a flexible substrate, is released from the supply roll R1 and moved to the recovery roll R2, and the substrate flattening device 100 is disposed between the supply roll R1 and the recovery roll R2. In this embodiment, only the substrate flattening device 100 is disposed between the supply roll R1 and the recovery roll R2, but the present invention is not limited thereto. That is, according to the present invention, various other devices such as a solder resist printing device, an exposure device, and a developing device may be disposed between the supply roll R1 and the recovery roll R2 in this embodiment.

The substrate P according to the present embodiment is continuously transferred between the supply roll R1 and the recovery roll R2 in a roll-to-roll process, but the present invention is not limited thereto. That is, according to the present invention, the substrate P may have a plate shape and be discontinuously transferred.

As shown in FIG. 2, in the substrate P, circuit patterns C are disposed on both sides of an electrically insulating base member B, and solder resist layers S are disposed on both sides of the base member B, there is.

According to this embodiment, the circuit pattern (C) and the solder resist layer (S) are disposed on both sides of the substrate (P), but the present invention is not limited thereto. That is, according to the present invention, the circuit pattern (C) and the solder resist layer (S) may be disposed on only one surface of the substrate (P).

The solder resist layer (S) is not disposed on the entire surface of the base member (B), but is disposed at predetermined intervals (D) along the transfer direction of the substrate (P).

According to this embodiment, the solder resist layer (S) is not disposed on the entire surface of the base member (B), but is disposed at predetermined intervals (D) along the transport direction of the substrate (P), but the present invention is thus Not limited. That is, according to the present invention, the solder resist layer (S) may be disposed on the entire surface of the base member (B).

The solder resist layer (S) is formed by applying solder resist ink before the substrate flattening process. As a method of applying the solder resist ink, screen coating, roll coating, curtain coating, etc. there is The solder resist ink may include a solvent, a photopolymerization initiator, an acrylate-based resin, an epoxy-based resin, and a filler. Here, the photopolymerization initiator can be radicalized by ultraviolet rays to induce polymerization of acrylate-based resins, epoxy-based resins can be cured by heat, and fillers can lower the thermal expansion coefficient of solder resist ink. there is.

Meanwhile, the pressing surface 110a of the pressing plate 110 has a plate shape, and the pressing surface 110a presses the solder resist layer S disposed on the surface of the substrate P in the substrate planarization process.

The pressure plate 110 includes an upper pressure plate 111 and a lower pressure plate 112 , and the lower pressure plate 112 is disposed below the upper pressure plate 111 .

The upper pressure plate 111 and the lower pressure plate 112 may move closer to each other or move away from each other by the pressure plate driver 130 .

According to the present embodiment, when the pressure plate 110 is driven, both the upper pressure plate 111 and the lower pressure plate 112 are moved by the pressure plate driver 130, but move closer to each other or move away from each other. , the present invention is not limited thereto. That is, according to the present invention, only one of the upper pressure plate 111 and the lower pressure plate 112 of the pressure plate 110 may be configured to be movable.

Meanwhile, the outer plate 120 is disposed outside the press plate 110 to fix the substrate P, and may move independently of the movement of the press plate 110 .

The outer plate 120 includes an upper outer plate 121 and a lower outer plate 122 . The lower outer plate 122 is disposed under the upper outer plate 121 .

The upper outer plate 121 and the lower outer plate 122 may move closer to each other or move farther from each other by the outer plate driving unit 140 .

According to the present embodiment, when the outer plate 120 is driven, both the upper outer plate 121 and the lower outer plate 122 are moved by the outer plate driver 140, but move closer to each other or move away from each other. , the present invention is not limited thereto. That is, according to the present invention, only one of the upper outer plate 121 and the lower outer plate 122 of the outer plate 120 may be configured to be movable.

As shown in FIGS. 3 and 4 , a portion 120a of the upper outer plate 121 in contact with the substrate P has a square ring shape, and a portion of the lower outer plate 122 The shape of the portion 120a contacting the middle substrate P is also a square ring shape.

According to the present embodiment, the shape of the portion 120a of the upper outer plate 121 that contacts the substrate P and the shape of the portion 120a of the lower outer plate 122 that makes contact with the substrate P The shape of the portion 120a has a shape of a square ring, but the present invention is not limited thereto. That is, the shapes of the parts of the upper outer plate 121 contacting the substrate P and the parts of the lower outer plate 122 contacting the substrate P according to the present invention are It may be formed in a shape other than a square ring.

Meanwhile, the pressure plate driving unit 130 moves by driving the pressure plate 110 . To this end, a driving device such as a motor (not shown) and an operating rod 131 are included.

The outer plate driver 140 moves by driving the outer plate 120 . To this end, a driving device such as a motor (not shown) and an operating rod 141 are included.

The heater unit 150 is composed of at least one, and is disposed on the upper press plate 111 and the lower press plate 112, respectively, to heat the upper press plate 111 and the lower press plate 112. To this end, the heater unit 150 includes a heating element, and is driven by receiving instructions from the control unit 160 .

The heat generated by the heater unit 150 is transferred to the solder resist layer S during the planarization process and imparts fluidity to the solder resist layer S to some extent, thereby allowing the planarization process to be performed.

In addition, the substrate flattening apparatus 100 according to the present embodiment includes the heater unit 150, but the present invention is not limited thereto. That is, according to the present invention, the substrate flattening apparatus 100 may not include the heater unit 150 .

Meanwhile, the control unit 160 controls various parts of the substrate flattening apparatus 100, such as the pressing plate driving unit 130 and the outer plate driving unit 140, according to a predetermined program.

The controller 160 receives signals from sensors (not shown) and performs various control actions according to a preset program. It may include hardware, software, firmware, and the like, and may be driven under the control of a user or a control algorithm.

The control unit 160 may be configured exclusively for the substrate flattening apparatus 100, but may be integrated with a control unit of various devices related to the substrate flattening apparatus 100, that is, a substrate manufacturing apparatus, a solder resist printing apparatus, and the like.

In addition, the substrate flattening apparatus 100 according to the present embodiment includes the controller 160, but the present invention is not limited thereto. That is, according to the present invention, the substrate flattening apparatus 100 may not include the controller 160 . In this case, it may be driven manually or driven by instructions from a control unit of an adjacent device.

Hereinafter, a substrate flattening process according to the present embodiment will be described with reference to FIGS. 4 to 10 . 5 to 9 are schematic diagrams sequentially showing a planarization process using a substrate flattening device according to an embodiment of the present invention, and FIG. 10 is a schematic diagram showing a substrate planarization method according to an embodiment of the present invention. It is a flow chart.

First, by moving the substrate P, as shown in FIGS. 4 and 5, a portion T to be flattened (hatched portion in FIG. 4) on which the solder resist layer S is disposed among the portions of the substrate P is moved. It is disposed between the upper press plate 111 and the lower press plate 112, and among the parts of the substrate P, the part W located outside the part T to be flattened is the upper outer plate 121 and the lower outer plate (122) (step S1).

Then, as shown in FIG. 6 , the control unit 160 operates the outer plate driving unit 140 to move the upper outer plate 121 and the lower outer plate 122 in a direction to get closer to each other, and the part to be flattened ( The portion W located outside the portion T to be flattened is fixed by contacting the portion W located outside the portion T to be flattened (Step S2).

Then, as shown in FIG. 7 , the control unit 160 operates the heater unit 150 to generate heat. In addition, the control unit 160 operates the pressure plate driving unit 130 to move the upper pressure plate 111 and the lower pressure plate 112 in a direction to come closer to each other and bring them into contact with the flattening target portion T, A planarization process of the solder resist layer (S) is performed by pressing the portion (T) to be planarized while applying heat to the portion (T) (Step S3). At this time, since the press plate 110 presses the substrate P while the outer plate 120 is fixing the substrate P, shaking of the substrate P during press is prevented, thereby improving the quality of the planarization process. there is. In addition, since the upper outer plate 121 and the lower outer plate 122 block the outer edges of the planarization target portion T during the planarization process, the surface of the solder resist layer S is planarized in the heating and pressing process. it will be done easily That is, the shape of the solder resist layer (S) in the limited space formed by the inner surface of the upper outer plate 121 and the lower outer plate 122, the lower surface of the upper pressure plate 111, and the upper surface of the lower pressure plate 112 Since it is made, the surface of the solder resist layer (S) is flattened, and a phenomenon in which a part of the solder resist layer (S) is pushed and agglomerated or a pressing force is concentrated is effectively prevented.

Then, as shown in FIG. 8 , the control unit 160 operates the pressure plate driving unit 130 to move the upper pressure plate 111 and the lower pressure plate 112 away from each other to move the flattening target portion. Contact with (T) is released (step S4).

Then, as shown in FIG. 9 , the control unit 160 operates the outer plate driving unit 140 to move the upper outer plate 121 and the lower outer plate 122 in a direction away from each other to be flattened. The planarization process of the portion T to be planarized is completed by releasing the fixation of the portion W positioned outside the portion T (step S5).

By repeating the above method, the planarization process can be performed on the remaining portion of the substrate P as well. That is, the substrate P is moved to the right, the next planarization target portion T is placed between the upper pressure plate 111 and the lower pressure plate 112, and the portion located outside the next planarization target portion T ( W) is disposed between the upper outer plate 121 and the lower outer plate 122, and then steps S2, S3, S4, and S5 are sequentially performed, so that the remaining portion of the substrate P is formed. A planarization process may be performed.

As described above, the substrate flattening apparatus 100 and the substrate flattening method according to the present embodiment are disposed outside the press plate 110 and the press plate 110 and can move independently of the movement of the press plate 110. Since the outer plate 120 includes the outer plate 120 and the pressure plate 110 presses the substrate P in a state in which the outer plate 120 fixes the substrate P to perform a planarization process, the substrate P is shaken. This can be prevented to improve the quality of the planarization process. In addition, since the upper outer plate 121 and the lower outer plate 122 block the outer edges of the planarization target portion T during the planarization process, the surface of the solder resist layer S is planarized in the heating and pressing process. it will be done easily In particular, according to the present embodiment, since the shape of the portion of the outer plate 120 that contacts the substrate P is formed in an annular shape, the inner surface of the annular portion of the outer plate 120 Movement of the solder resist layer (S) is prevented, so that the planarization process of the solder resist layer (S) is more effective.

One aspect of the present invention has been described with reference to the embodiments shown in the accompanying drawings, but this is only exemplary, and those skilled in the art can make various modifications and equivalent other embodiments therefrom. you will understand the point. Therefore, the true protection scope of the present invention should be defined only by the appended claims.

The substrate flattening device according to the present embodiment can be applied to industries that manufacture substrates.

100: substrate flattening device 110: pressing plate
120: outer plate 130: pressing plate driving unit
140: outer plate driving unit 150: heater unit
160: control unit

Claims (8)

a pressure plate for pressing the solder resist layer disposed on the surface of the substrate;
an outer plate disposed outside the press plate to fix the substrate and movable independently of the movement of the press plate;
a pressure plate driver driving the pressure plate; and
An outer plate driving unit for driving the outer plate;
The substrate flattening apparatus of claim 1 , wherein the pressing plate may press the substrate while the outer plate fixes the substrate. According to claim 1,
The substrate flattening apparatus of claim 1 , wherein the pressing plate includes an upper pressing plate and a lower pressing plate disposed below the upper pressing plate. According to claim 1,
The substrate flattening apparatus of claim 1 , wherein the outer plate includes an upper outer plate and a lower outer plate disposed below the upper outer plate. According to claim 1,
The substrate flattening apparatus of claim 1 , wherein a shape of a portion of the outer plate that makes contact with the substrate has an annular shape. According to claim 1,
The substrate flattening apparatus of claim 1, wherein the pressure plate includes at least one heater part. According to claim 1,
The substrate flattening apparatus further includes a control unit controlling the pressing plate driving unit and the outer plate driving unit. Among the portions of the substrate, a portion to be flattened on which the solder resist layer is disposed is disposed between the upper press plate and the lower press plate, and among the portions of the substrate, a portion located outside the portion to be flattened is between the upper outer plate and the lower outer plate. placing;
moving the upper outer plate and the lower outer plate in a direction to be closer to each other and contacting the outer portion of the planarization target portion to fix the outer portion of the planarization target portion;
flattening the planarization target portion by moving the upper pressure plate and the lower pressure plate in a direction to be closer to each other, bringing them into contact with the planarization target portion, and pressing the planarization target portion while applying heat to the planarization target portion;
moving the upper pressure plate and the lower pressure plate in a direction away from each other to release contact with the portion to be flattened; and
and moving the upper outer plate and the lower outer plate in a direction away from each other to release fixation of a portion located outside the portion to be planarized. According to claim 7,
A shape of a portion of the upper outer plate and the lower outer plate contacting the substrate is an annular shape.

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