KR20220148282A - adhesive tape - Google Patents
adhesive tape Download PDFInfo
- Publication number
- KR20220148282A KR20220148282A KR1020227034717A KR20227034717A KR20220148282A KR 20220148282 A KR20220148282 A KR 20220148282A KR 1020227034717 A KR1020227034717 A KR 1020227034717A KR 20227034717 A KR20227034717 A KR 20227034717A KR 20220148282 A KR20220148282 A KR 20220148282A
- Authority
- KR
- South Korea
- Prior art keywords
- mass
- parts
- adhesive
- adhesive tape
- meth
- Prior art date
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 88
- 239000000853 adhesive Substances 0.000 claims abstract description 106
- 230000001070 adhesive effect Effects 0.000 claims abstract description 105
- 229920006243 acrylic copolymer Polymers 0.000 claims abstract description 42
- 239000000178 monomer Substances 0.000 claims abstract description 26
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 22
- -1 (meth)acrylic acid alkoxyalkyl ester Chemical class 0.000 claims abstract description 17
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 12
- 125000002843 carboxylic acid group Chemical group 0.000 claims abstract description 7
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 6
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims abstract description 3
- 229920005989 resin Polymers 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 28
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 23
- 239000012790 adhesive layer Substances 0.000 claims description 17
- 230000001588 bifunctional effect Effects 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 10
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 8
- 239000003963 antioxidant agent Substances 0.000 claims description 8
- 230000003078 antioxidant effect Effects 0.000 claims description 8
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 5
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 claims description 2
- 210000002374 sebum Anatomy 0.000 abstract description 11
- 235000014593 oils and fats Nutrition 0.000 abstract description 10
- 239000002537 cosmetic Substances 0.000 abstract description 9
- 235000013305 food Nutrition 0.000 abstract description 9
- 210000004243 sweat Anatomy 0.000 abstract description 9
- 239000012948 isocyanate Substances 0.000 abstract description 4
- 150000002513 isocyanates Chemical class 0.000 abstract description 4
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 39
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 21
- 239000000123 paper Substances 0.000 description 19
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 18
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 18
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 18
- 239000005642 Oleic acid Substances 0.000 description 18
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 18
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 18
- 239000000463 material Substances 0.000 description 18
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 18
- 238000000034 method Methods 0.000 description 14
- 229940048053 acrylate Drugs 0.000 description 13
- 238000007654 immersion Methods 0.000 description 12
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 10
- 239000010410 layer Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000003921 oil Substances 0.000 description 9
- 239000004698 Polyethylene Substances 0.000 description 8
- 239000012298 atmosphere Substances 0.000 description 8
- 239000003925 fat Substances 0.000 description 8
- 229920000573 polyethylene Polymers 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 230000007423 decrease Effects 0.000 description 6
- 239000006260 foam Substances 0.000 description 6
- 229920006267 polyester film Polymers 0.000 description 6
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical group CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 5
- 239000003208 petroleum Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 235000007586 terpenes Nutrition 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 229940114077 acrylic acid Drugs 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 150000003505 terpenes Chemical class 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical group OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000012986 chain transfer agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- HASUCEDGKYJBDC-UHFFFAOYSA-N 1-[3-[[bis(oxiran-2-ylmethyl)amino]methyl]cyclohexyl]-n,n-bis(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC1CC(CN(CC2OC2)CC2OC2)CCC1)CC1CO1 HASUCEDGKYJBDC-UHFFFAOYSA-N 0.000 description 1
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- DKJBREHOVWISMR-UHFFFAOYSA-N 1-chloro-2,3-diisocyanatobenzene Chemical compound ClC1=CC=CC(N=C=O)=C1N=C=O DKJBREHOVWISMR-UHFFFAOYSA-N 0.000 description 1
- KQSMCAVKSJWMSI-UHFFFAOYSA-N 2,4-dimethyl-1-n,1-n,3-n,3-n-tetrakis(oxiran-2-ylmethyl)benzene-1,3-diamine Chemical compound CC1=C(N(CC2OC2)CC2OC2)C(C)=CC=C1N(CC1OC1)CC1CO1 KQSMCAVKSJWMSI-UHFFFAOYSA-N 0.000 description 1
- IEQWWMKDFZUMMU-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethyl)butanedioic acid Chemical compound OC(=O)CC(C(O)=O)CCOC(=O)C=C IEQWWMKDFZUMMU-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- OVEUFHOBGCSKSH-UHFFFAOYSA-N 2-methyl-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound CC1=CC=CC=C1N(CC1OC1)CC1OC1 OVEUFHOBGCSKSH-UHFFFAOYSA-N 0.000 description 1
- UXTGJIIBLZIQPK-UHFFFAOYSA-N 3-(2-prop-2-enoyloxyethyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(CCOC(=O)C=C)=C1C(O)=O UXTGJIIBLZIQPK-UHFFFAOYSA-N 0.000 description 1
- VAGOJLCWTUPBKD-UHFFFAOYSA-N 3-(oxiran-2-ylmethoxy)-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1COC(C=1)=CC=CC=1N(CC1OC1)CC1CO1 VAGOJLCWTUPBKD-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- HLJDOURGTRAFHE-UHFFFAOYSA-N isocyanic acid;3,5,5-trimethylcyclohex-2-en-1-one Chemical compound N=C=O.N=C=O.CC1=CC(=O)CC(C)(C)C1 HLJDOURGTRAFHE-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
Abstract
(메트)아크릴산알콕시알킬에스테르 20질량부 이상 40질량부 미만, 카르복실산기 함유 (메트)아크릴 모노머를 10질량부 이상 25질량부 미만, 탄소 원자수가 1~3의 알킬기, 시클로헥실기 또는 이소보르닐기를 갖는 (메트)아크릴산 알킬에스테르를 5질량부 이상 20질량부 미만, 및 탄소 원자수가 4~12의 알킬기를 갖는 (메트)아크릴산 알킬에스테르 30질량부 이상 50질량부 미만 (이상의 각 단량체의 합계 100질량부)를 포함하고, 이소시아네이트계 가교제 및 에폭시계 가교제의 한쪽 또는 양쪽을 사용하여 가교 구조가 형성되고, 중량 평균 분자량이 20만 이상 45만 미만인 아크릴계 공중합체를 함유하는 점착제 조성물이 점착제로서 사용된 점착 테이프가 개시된다. 이 점착 테이프는 피지, 땀, 식품, 화장품 등의 유지 성분에 대하여 높은 내구성을 갖고, 또한 피착체에 부착할 때 적당한 점착력을 갖는다.20 parts by mass or more and less than 40 parts by mass of (meth)acrylic acid alkoxyalkyl ester, 10 parts by mass or more and less than 25 parts by mass of a carboxylic acid group-containing (meth)acrylic monomer, an alkyl group having 1 to 3 carbon atoms, a cyclohexyl group or isobor 5 parts by mass or more and less than 20 parts by mass of (meth)acrylic acid alkylester having a nyl group, and 30 parts by mass or more and less than 50 parts by mass of (meth)acrylic acid alkylester having an alkyl group having 4 to 12 carbon atoms (sum of each of the above monomers) 100 parts by mass), a crosslinked structure is formed using one or both of an isocyanate-based crosslinking agent and an epoxy-based crosslinking agent, and an acrylic copolymer having a weight average molecular weight of 200,000 or more and less than 450,000 is used as an adhesive Disclosed is an adhesive tape. This adhesive tape has high durability with respect to oils and fats components such as sebum, sweat, food, and cosmetics, and has moderate adhesive strength when attached to an adherend.
Description
본 발명은 피지, 땀, 식품, 화장품 등의 유지 성분에 대하여 높은 내구성을 갖고, 또한 피착체에 부착할 때 적당한 점착력을 갖는 점착 테이프에 관한 것이다.The present invention relates to an adhesive tape having high durability against oils and fats components such as sebum, sweat, food, and cosmetics, and having adequate adhesive strength when attached to an adherend.
최근 스마트폰이나 태블릿 PC로 대표되는 소형 휴대전자기기가 급격히 보급되고 있다. 이들 중 다수는, 표시 패널과 하우징을 아크릴계의 접착제나 양면 점착 테이프에 의해 접합하고 있다. 그리고, 모바일 전자기기의 대부분은 터치 패널을 탑재하고 있어, 사람의 손가락으로 터치해 조작되거나, 전화를 걸 때에는 사람의 얼굴에 닿거나 한다.Recently, small portable electronic devices, such as smartphones and tablet PCs, are rapidly spreading. In many of these, the display panel and the housing are joined by an acrylic adhesive or a double-sided adhesive tape. In addition, most mobile electronic devices are equipped with a touch panel, so that they are operated by touching them with a human finger or touching a person's face when making a call.
사람의 손이나 얼굴에 터치 패널이 닿으면 피지나 지지 등의 유지가 터치 패널에 부착된다. 이 유지에는 올레산 등의 성분이 포함되어 있고, 유지의 SP값(용해도 파라미터)은 공업용 유기 용제에 가깝기 때문에, 일반적인 아크릴 수지를 용해한다.When the touch panel comes into contact with a person's hand or face, oils such as sebum and support are attached to the touch panel. Since this fat and oil contains components, such as oleic acid, and the SP value (solubility parameter) of fats and oils is close to an industrial organic solvent, a general acrylic resin is melt|dissolved.
일반적인 산업용 유기 용제는 끓는점이 낮고 단시간에 기화하기 때문에 접착제나 점착제에 손상을 입히기 어렵다. 한편, 올레산 등의 유지 성분은 비등점이 높고, 생활 환경하에서는 기화하지 않고 전자 기기 내에 남기 때문에, 접착제나 점착 테이프에 데미지를 주고, 전자 기기 내의 부품에 부유나 박리를 발생시켜 전자 기기의 수명을 단축한다.Since general industrial organic solvents have a low boiling point and vaporize in a short time, it is difficult to damage the adhesive or adhesive. On the other hand, oils and fats such as oleic acid have a high boiling point and do not vaporize under living conditions and remain in electronic devices. do.
스마트폰 등의 소형 휴대전자 기기는 손으로 들고 사용하는 시간이 길고, 통화 시에는 얼굴에 닿을 수도 있다. 그 때문에, 소형 휴대 전자 기기에는, 피지나 땀, 식품, 화장품 등의 유지가 부착되기 쉽고, 이들 유지가 접착제나 점착 테이프에 도달하면, 점착력이 저하될 우려가 있다. 또한, 점착 테이프의 점착제층이 유지를 원인으로 하여 연화한 경우, 점착 테이프의 측면으로부터 점착제가 벗겨져 기기 내부의 디자인이나 기능이 손상되는 경우가 있다. 또한, 점착제층의 팽윤에 의해 외부 방향으로의 압력이 가해져, 전자 기기의 화면 표시가 정상적으로 행해지지 않는 경우도 있다.Small mobile electronic devices such as smartphones take a long time to hold and use by hand, and may touch your face during a call. Therefore, oils and fats such as sebum, sweat, food, and cosmetics tend to adhere to small portable electronic devices, and when these oils and fats reach an adhesive or an adhesive tape, there is a fear that the adhesive force may decrease. In addition, when the adhesive layer of an adhesive tape is softened due to holding|maintenance, the adhesive may peel off from the side surface of an adhesive tape, and the design and function inside an apparatus may be impaired. Moreover, the pressure to the outside may be applied by swelling of an adhesive layer, and the screen display of an electronic device may not be performed normally.
또한, 스마트폰 등의 소형 휴대 전자 기기의 화면 확대에 수반하는 내부 부품의 협액 연화나 박형화, 소형 웨어러블 기기의 실용화에 수반하여, 이러한 전자 기기의 내부에 사용되는 점착 테이프도 세폭화 E미세화되어 있어, 상기와 같은 문제는 더욱 발생하기 쉬워지고 있다고 생각된다.In addition, with the narrowing and thinning of internal components accompanying the screen enlargement of small portable electronic devices such as smartphones, and the practical use of small wearable devices, the adhesive tape used inside these electronic devices has also become narrower and smaller. There exists, and it is thought that the above problems are becoming more easy to generate|occur|produce.
특허문헌 1에는, 휴대 전자 기기의 부품 고정에 사용하는 양면 점착 테이프로서, 피지 등의 유상 성분의 침투가 있었을 경우에도 점착제가 연화·팽윤되기 어렵고, 점착제가 튀어나오지 않는 양면 접착 테이프가 개시되어 있다. 그러나, 특허문헌 1의 발명은, 전자 기기 내부에서 발생하는 접착제나 점착 테이프의 부유나 박리에 직결하는 점착력의 저하에 관해서는 검토되어 있지 않다. 또한, 유지 성분의 내구성을 향상시킨 경우, 점착 테이프를 피착체에 부착할 때의 점착력이 저하되고, 내구성의 향상과 점착력의 유지가 양립하지 않는다는 과제가 있다.Patent Document 1 discloses a double-sided adhesive tape used for fixing parts of portable electronic devices, wherein the adhesive does not soften or swell even when an oily component such as sebum penetrates, and the adhesive does not protrude. . However, the invention of patent document 1 is not examined about the fall of the adhesive force directly connected with floatation and peeling of the adhesive agent or adhesive tape which generate|occur|produce inside an electronic device. Moreover, when the durability of an oil and fat component is improved, the adhesive force at the time of affixing an adhesive tape to a to-be-adhered body falls, and there exists a subject that the improvement of durability and maintenance of adhesive force are not compatible.
따라서, 본 발명은 피지, 땀, 식품, 화장품 등의 유지 성분에 대하여 높은 내구성을 갖고, 또한 피착체에 부착할 때 적당한 점착력을 갖는 점착 테이프를 제공하는 것을 목적으로 한다.Accordingly, an object of the present invention is to provide an adhesive tape having high durability against oils and fats components such as sebum, sweat, food, and cosmetics, and having adequate adhesive strength when attached to an adherend.
본 발명의 점착 테이프는, 단량체 조성으로서, (메트)아크릴산알콕시알킬에스테르를 20질량부 이상, 40질량부 미만,카르복실산기 함유 (메트)아크릴 단량체를 10질량부 이상, 25질량부 미만, 하기 식 1에 의해 나타나는 (메트)아크릴산알킬에스테르를 5질량부 이상, 20질량부 미만, 및, 하기 식 2에 의해 나타나는 (메트)아크릴산알킬에스테르를 30질량부 이상, 50질량부 미만(이상의 각 단량체의 합계를 100질량부로 한다) 포함하는 아크릴계 공중합체로서, 2관능 이상의 이소시아네이트기 함유 화합물 및 2관능 이상의 글리시딜기 함유 화합물의 한쪽 또는 양쪽을 가교제로서 사용함으로써 가교 구조가 형성되고, 중량 평균 분자량이 20만 이상, 45만 미만인 상기 아크릴계 공중합체를 함유하는 점착제 조성물이 점착제로서 사용된 점착 테이프이다.The adhesive tape of this invention, as a monomer composition, 20 mass parts or more and less than 40 mass parts of (meth)acrylic acid alkoxyalkyl ester, 10 mass parts or more and less than 25 mass parts of a carboxylic acid group containing (meth)acrylic monomer, following 5 parts by mass or more and less than 20 parts by mass of the (meth)acrylic acid alkylester represented by Formula 1, and 30 parts by mass or more and less than 50 parts by mass of the (meth)acrylic acid alkylester represented by the following Formula 2 (each of the above monomers) of 100 parts by mass), a crosslinked structure is formed by using one or both of a bifunctional or more isocyanate group-containing compound and a bifunctional or more functional glycidyl group-containing compound as a crosslinking agent, and the weight average molecular weight is It is an adhesive tape in which the adhesive composition containing the said acrylic copolymer of 200,000 or more and less than 450,000 was used as an adhesive.
(식 1 중, R1은 CH2=CH- 또는 CH2=C(CH3)-를 나타내고, R2는 탄소 원자수가 1~3의 알킬기, 시클로헥실기 또는 이소보르닐기를 나타낸다.)(In Formula 1, R 1 represents CH 2 =CH- or CH 2 =C(CH 3 )-, and R 2 represents an alkyl group having 1 to 3 carbon atoms, a cyclohexyl group, or an isobornyl group.)
(식 2 중, R3은 CH2=CH- 또는 CH2=C(CH3)-를 나타내고, R4는 탄소 원자수가 4~12의 알킬기를 나타낸다.)(In Formula 2, R 3 represents CH 2 =CH- or CH 2 =C(CH 3 )-, and R 4 represents an alkyl group having 4 to 12 carbon atoms.)
본 발명에 관한 점착 테이프는 점착제 조성물이 점착 부여 수지를 더 포함 할 수 있다.In the pressure-sensitive adhesive tape according to the present invention, the pressure-sensitive adhesive composition may further include a tackifying resin.
본 발명에 따른 점착 테이프는 점착제 조성물이 실란 커플 링제를 더 포함 할 수 있다.In the adhesive tape according to the present invention, the adhesive composition may further include a silane coupling agent.
본 발명에 따른 점착 테이프는 점착제 조성물이 산화 방지제를 더 포함 할 수 있다.In the adhesive tape according to the present invention, the pressure-sensitive adhesive composition may further include an antioxidant.
본 발명에 관한 점착 테이프는, 추가로 기재를 갖고, 점착제 조성물을 사용하여 상기 기재의 편면 또는 양면에 점착제층을 형성할 수 있다.The adhesive tape which concerns on this invention can further have a base material, and can form an adhesive layer on the single side|surface or both surfaces of the said base material using an adhesive composition.
본 발명에 따른 점착 테이프는 피지, 땀, 식품, 화장품 등의 유지 성분에 대하여 높은 내구성을 가지며, 구체적으로는 유지 성분이 부착한 경우에도 일정한 점착력을 유지하는 것이 가능한 내유성을 갖는다. 또한, 본 발명에 관한 점착 테이프는, 피착체에 부착할 때에 적당한 점착력을 갖고, 또한 유지 성분이 부착한 경우의 점착력 유지 성능이 우수하다. 따라서, 본 발명에 따른 점착 테이프는, 예를 들면, 스마트폰 등의 소형 휴대 전자 기기의 표시 패널과 하우징의 접합이나, 하우징 내부의 부품 고정 등의 용도에 적합하게 사용할 수 있다.The adhesive tape according to the present invention has high durability against oils and fats components such as sebum, sweat, food, and cosmetics, and specifically has oil resistance capable of maintaining a constant adhesive force even when oils and fats are attached. Moreover, the adhesive tape which concerns on this invention has moderate adhesive force when affixing to a to-be-adhered body, and is excellent in adhesive force holding|maintenance performance when an oil-fat component adheres. Accordingly, the adhesive tape according to the present invention can be suitably used for, for example, bonding of a display panel and a housing of a small portable electronic device such as a smartphone or fixing parts inside the housing.
<아크릴계 공중합체><Acrylic copolymer>
본 발명에 관한 아크릴계 공중합체는, 단량체 조성으로서, (메트)아크릴산알콕시알킬에스테르, 카르복실산기 함유 (메트)아크릴 단량체, 상기 화학식 1에 의해 나타나는 (메트)아크릴산알킬에스테르, 및 상기 식 2에 의해 나타나는 (메트)아크릴산알킬에스테르를 함유하고, 2관능 이상의 이소시아네이트기 함유 화합물 또는 2관능 이상의 글리시딜기 함유 화합물을 가교제에 사용함으로써 가교 구조가 형성되고, 또한 중량 평균 분자량이 20만 이상, 45만 미만이다.The acrylic copolymer according to the present invention has, as a monomer composition, a (meth)acrylic acid alkoxyalkyl ester, a carboxylic acid group-containing (meth)acrylic monomer, a (meth)acrylic acid alkylester represented by the formula (1), and the formula (2) A crosslinked structure is formed by containing the (meth)acrylic acid alkyl ester that appears, and using a bifunctional or higher isocyanate group-containing compound or a bifunctional or higher functional glycidyl group-containing compound as a crosslinking agent, and has a weight average molecular weight of 200,000 or more and less than 450,000 to be.
(메트)아크릴산알콕시알킬에스테르로서는, 예를 들면, (메트)아크릴산메톡시에틸, (메트)아크릴산메톡시프로필, (메트)아크릴산메톡시부틸, (메트)아크릴산에톡시에틸, (메트)아크릴산에톡시프로필, (메트)아크릴산에톡시부틸 등을 사용할 수 있다. 중합 반응의 안정성 및 입수의 용이성을 고려하여, (메트)아크릴산메톡시에틸을 사용하는 것이 바람직하다.As (meth)acrylic acid alkoxyalkyl ester, for example, (meth)acrylic acid methoxyethyl, (meth)acrylic acid methoxypropyl, (meth)acrylate methoxybutyl, (meth)acrylic acid ethoxyethyl, (meth)acrylic acid Toxypropyl, (meth)acrylic acid ethoxybutyl, etc. can be used. In consideration of the stability of the polymerization reaction and the ease of availability, it is preferable to use methoxyethyl (meth)acrylate.
(메트)아크릴산알콕시알킬에스테르, 카르복실산기 함유 (메트)아크릴모노머, 상기 화학식 1에 의해 나타나는 (메트)아크릴산알킬에스테르, 및 상기 화학식 2에 의해 나타나는 (메트)아크릴산알킬에스테르(이하, 「상기 4종의 단량체」라고 칭함)의 합계 100질량부에 대한 (메트)아크릴산알콕시알킬에스테르의 함유량은, 20질량부 이상, 40질량부 미만이다. 이 함유량이 20질량부 미만이면 본 발명의 아크릴계 공중합체 중에 SP값이 높은 단량체 단위가 적어지기 때문에, 유지 성분에 대한 내구성이 저하되어, 피지나 땀, 식품, 화장품 등의 유지 성분이 부착된 경우에 점착력이 현저하게 저하되어 전자 기기 내부의 부품 고정 등의 용도에 필요한 점착력을 유지할 수 없다. 또한, 이 함유량이 40질량부 이상이면 점착제의 초기 점착력이 저하되기 때문에, 전자 기기 내부의 부품 고정 작업 등 시에 작업성이 저하된다. 이 함유량은 25질량부 이상, 40질량부 미만인 것이 보다 바람직하다.(meth)acrylic acid alkoxyalkyl ester, carboxylic acid group-containing (meth)acrylic monomer, (meth)acrylic acid alkyl ester represented by the above formula (1), and (meth)acrylic acid alkyl ester represented by the above formula (2) (hereinafter, “4 above”) Content of (meth)acrylic-acid alkoxyalkyl ester with respect to a total of 100 mass parts of a kind of monomer" is 20 mass parts or more and less than 40 mass parts. When this content is less than 20 parts by mass, the amount of monomer units with high SP values in the acrylic copolymer of the present invention decreases, so that the durability to the oil and fat components decreases, and when oil and fat components such as sebum, sweat, food, and cosmetics adhere to it. Adhesive force is remarkably reduced, and it is not possible to maintain the adhesive force required for applications such as fixing parts inside electronic devices. Moreover, since the initial stage adhesive force of an adhesive falls that this content is 40 mass parts or more, workability|operativity falls at the time of a component fixing operation inside an electronic device, etc. It is more preferable that this content is 25 mass parts or more and less than 40 mass parts.
카르복실산기 함유 (메트)아크릴 단량체로서는, 예를 들면, (메트)아크릴산, (메트)아크릴산 β-카르복시에틸, 이타콘산, 크로톤산, 말레산, 푸마르산, 시트라콘산, 그라타콘산, 2-아크릴로일록시에틸숙신산, 2-아크릴로일록시에틸프탈산 등을 사용할 수 있다. 이 중, 얻어지는 점착제의 가교 밀도나 입수의 용이성을 고려하면, (메트)아크릴산을 사용하는 것이 바람직하다.Examples of the carboxylic acid group-containing (meth)acrylic monomer include (meth)acrylic acid, (meth)acrylic acid β-carboxyethyl, itaconic acid, crotonic acid, maleic acid, fumaric acid, citraconic acid, grataconic acid, 2- Acryloyloxyethyl succinic acid, 2-acryloyloxyethyl phthalic acid, etc. can be used. Among these, it is preferable to use (meth)acrylic acid when the crosslinking density of the adhesive obtained and the ease of acquisition are considered.
상기 4종의 모노머의 합계 100질량부에 대한 카르복실산기 함유 (메트)아크릴 모노머의 함유량은, 10질량부 이상, 25질량부 미만이다. 이 함유량이 10질량부 미만이면 점착제의 가교 밀도가 감소하고, 피지나 땀, 식품, 화장품 등의 유지 성분에 의해 점착제가 팽윤한다. 또한, 이 함유량이 25질량부 이상이면 점착제의 초기 점착력이 저하되기 때문에, 전자 기기 내부의 부품 고정 작업 등 시에 작업성이 저하된다. 이 함유량은 10질량부 이상, 23질량부 이하인 것이 보다 바람직하다.Content of the carboxylic acid group containing (meth)acryl monomer with respect to a total of 100 mass parts of said 4 types of monomers is 10 mass parts or more and less than 25 mass parts. When this content is less than 10 parts by mass, the crosslinking density of the pressure-sensitive adhesive decreases, and the pressure-sensitive adhesive swells with oils and fats such as sebum, sweat, food, and cosmetics. Moreover, since the initial stage adhesive force of an adhesive falls that this content is 25 mass parts or more, workability|operativity falls at the time of a component fixing operation inside an electronic device, etc. As for this content, it is more preferable that they are 10 mass parts or more and 23 mass parts or less.
상기 화학식 1에 의해 나타나는 (메트)아크릴산알킬에스테르로서는, 예를 들어 아크릴산메틸, 아크릴산에틸, 아크릴산프로필, 아크릴산이소프로필, (메트)아크릴산시클로헥실, (메트)아크릴산이소보르닐 등이 사용 할 수 있다. 입수의 용이성을 고려하면, 아크릴산메틸을 사용하는 것이 바람직하다.As the (meth)acrylic acid alkylester represented by the above formula (1), for example, methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, (meth)acrylic acid cyclohexyl, (meth)acrylic acid isobornyl, etc. can be used. . Considering availability, it is preferable to use methyl acrylate.
상기 4종의 단량체의 합계 100질량부에 대한 상기 화학식 1로 나타나는 (메트)아크릴산알킬에스테르의 함유량은, 5질량부 이상, 20질량부 미만이다. 이 함유량이 5질량부 미만이면, 점착제의 내반발성이 감소하여, 전자 기기 내부의 부품 고정 등의 용도에 필요한 점착력을 만족시킬 수 없다. 또한,이 함유량이 20 질량부 이상이면, 점착제의 초기 점착력이 저하되어 전자 기기 내부의 부품 고정 작업 등의 경우에 작업성이 저하된다. 이 함유량은 5질량부 이상, 15질량부 이하인 것이 보다 바람직하다.Content of the (meth)acrylic-acid alkylester represented by the said General formula (1) with respect to a total of 100 mass parts of said 4 types of monomers is 5 mass parts or more and less than 20 mass parts. If this content is less than 5 mass parts, the repulsion resistance of an adhesive will decrease, and the adhesive force required for uses, such as component fixation inside an electronic device, cannot be satisfied. Moreover, when this content is 20 mass parts or more, the initial stage adhesive force of an adhesive falls, and workability|operativity falls in the case of a component fixing operation inside an electronic device, etc. As for this content, it is more preferable that they are 5 mass parts or more and 15 mass parts or less.
상기 화학식 2로 표시되는 (메트)아크릴산알킬에스테르로서는, 예를 들면, (메트)아크릴산부틸, (메트)아크릴산이소부틸, (메트)아크릴산t-부틸, (메트)아크릴산헥실, (메트)아크릴산이소헥실, (메트)아크릴산옥틸, (메트)아크릴산이소옥틸, (메트)아크릴산-2-에틸헥실, (메트)아크릴산노닐, (메트)아크릴산이소노닐, (메트)아크릴산데실, (메트)아크릴산이소데실, (메트)아크릴산도데실, (메트)아크릴산이소도데실 등을 사용할 수 있다. 아크릴계 공중합체의 점착제로서의 택을 유지하기 위해서 Tg(유리 전이점)가 낮은 (메트)아크릴산-2-에틸헥실 등을 사용하는 것이 바람직하다.Examples of the (meth)acrylic acid alkyl ester represented by the above formula (2) include butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, hexyl (meth)acrylate, iso (meth)acrylate Hexyl, (meth) acrylate octyl, (meth) acrylate isooctyl, (meth) acrylic acid-2-ethylhexyl, (meth) acrylate nonyl, (meth) acrylate isononyl, (meth) acrylate decyl, (meth) acrylate iso Decyl, (meth)acrylic acid dodecyl, (meth)acrylic acid isododecyl, etc. can be used. In order to maintain the tack as an adhesive of the acrylic copolymer, it is preferable to use (meth)acrylic acid-2-ethylhexyl or the like having a low Tg (glass transition point).
상기 4종의 단량체의 합계 100질량부에 대한 상기 화학식 2로 나타나는 (메트)아크릴산알킬에스테르의 함유량은, 30질량부 이상, 50질량부 미만이다. 이 함유량이 30질량부 미만이면, 점착제의 초기 점착력이 저하되기 때문에, 전자 기기 내부의 부품 고정 작업 등의 경우에 작업성이 저하된다. 이 함유량이 50질량부 이상이면 유지 성분에 대한 내구성이 저하되고, 피지나 땀, 식품, 화장품 등의 유지 성분이 부착한 경우에 점착력이 현저하게 저하되어 전자 기기 내부의 부품 고정 등 의 용도에 필요한 점착력을 유지할 수 없다. 이 함유량은 30질량부 이상, 45질량부 이하인 것이 보다 바람직하다.Content of the (meth)acrylic-acid alkylester represented by the said Formula (2) with respect to a total of 100 mass parts of said 4 types of monomers is 30 mass parts or more and less than 50 mass parts. Since the initial stage adhesive force of an adhesive falls that this content is less than 30 mass parts, workability|operativity falls in the case of the component fixing operation|work inside an electronic device, etc. When this content is 50 parts by mass or more, the durability to the fat and oil components decreases, and when oil and fat components such as sebum, sweat, food, and cosmetics adhere to it, the adhesive force is significantly lowered, which is necessary for applications such as fixing parts inside electronic devices. Cannot maintain adhesion. As for this content, it is more preferable that they are 30 mass parts or more and 45 mass parts or less.
2관능 이상의 이소시아네이트기 함유 화합물(이하 「이소시아네이트계 가교제」라고도 한다.)로서는, 예를 들면, 톨릴렌디이소시아네이트, 크실렌디이소시아네이트, 클로르페닐렌디이소시아네이트, 헥사메틸렌디이소시아네이트, 테트라메틸렌디이소시아네이트, 이소포론디이소시아네이트, 디페닐메탄디이소시아네이트, 수소화된 디페닐메탄디이소시아네이트 등을 사용할 수 있다.As a compound containing a bifunctional or more functional isocyanate group (hereinafter also referred to as "isocyanate-based crosslinking agent"), for example, tolylene diisocyanate, xylene diisocyanate, chlorphenylene diisocyanate, hexamethylene diisocyanate, tetramethylene diisocyanate, isophorone di Isocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, etc. can be used.
2관능 이상의 글리시딜기 함유 화합물(이하 「에폭시계 가교제」라고도 한다.)로서는, 예를 들면, 1,3비스(N,N-디글리시딜아미노메틸)시클로헥산, N,N,N',N'-테트라글리시딜-m-크실렌디아민, N,N,N',N'-테트라글리시딜아미노페닐메탄, 트리글리시딜이소시아누레이트, m-N,N-디글리시딜아미노페닐글리시딜에테르, N,N-디글리시딜톨루이딘, N, N-디글리시딜아닐린, 펜타에리스리톨폴리글리시딜에테르, 1,6-헥산디올디글리시딜에테르 등을 사용할 수 있다.Examples of the bifunctional or higher glycidyl group-containing compound (hereinafter also referred to as "epoxy crosslinking agent") include 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, N,N,N' ,N'-tetraglycidyl-m-xylenediamine, N,N,N',N'-tetraglycidylaminophenylmethane, triglycidylisocyanurate, m-N,N-diglycidylaminophenyl Glycidyl ether, N,N-diglycidyltoluidine, N,N-diglycidylaniline, pentaerythritol polyglycidyl ether, 1,6-hexanediol diglycidyl ether, etc. can be used.
가교제로서 사용하는 2관능 이상의 이소시아네이트기 함유 화합물이나 2관능 이상의 글리시딜기 함유 화합물의 첨가량은 특별히 한정되지 않는다. 점착제 조성물의 팽윤도가 본 발명에 따른 점착 테이프의 사용 환경에 적합한 것이 되도록 가교제의 첨가량을 조절할 수 있다.The addition amount of the bifunctional or more than bifunctional isocyanate group containing compound and the bifunctional or more than bifunctional glycidyl group containing compound used as a crosslinking agent is not specifically limited. The amount of the crosslinking agent may be adjusted so that the degree of swelling of the pressure-sensitive adhesive composition is suitable for the environment of use of the pressure-sensitive adhesive tape according to the present invention.
본 발명에 관한 아크릴계 공중합체는, 이들 단량체를 용액 중합, 괴상 중합, 현탁 중합, 유화 중합 등의 각종 중합 방법에 중합하여 생성시킬 수 있다. 예를 들어, 반응 용기 내에서, 이들 단량체와 중합 개시제를 에틸 아세테이트 등의 용매에 용해시키고, 항온 하에서 일정 시간 교반함으로써 아크릴계 공중합체를 얻을 수 있다.The acrylic copolymer according to the present invention can be produced by polymerizing these monomers in various polymerization methods such as solution polymerization, bulk polymerization, suspension polymerization, and emulsion polymerization. For example, an acrylic copolymer can be obtained by dissolving these monomers and a polymerization initiator in a solvent such as ethyl acetate in a reaction vessel, and stirring at a constant temperature for a certain period of time.
또한, 상기의 아크릴계 공중합체에, 가교제를 단독 또는 중합 개시제와 함께 첨가하여 교반함으로써, 가교 구조를 갖는 아크릴계 공중합체를 생성할 수 있다.In addition, the acrylic copolymer having a crosslinked structure can be produced by adding a crosslinking agent alone or together with a polymerization initiator to the acrylic copolymer and stirring.
본 발명에 관한 아크릴계 공중합체의 중량 평균 분자량은 20만 이상, 45만 미만이다. 이 중량 평균 분자량이 20만 미만인 경우에는 점착제에 필요한 응집력이 얻어지지 않고, 점착 테이프를 피착체에 첩부했을 때의 점착제의 벌집이 생기는 원인이 된다. 또한, 이 중량 평균 분자량이 450,000 이상이면, 점착 테이프의 피착 체에 대한 추종성이 저하되어, 전자 기기 내부의 부품 고정 등에 필요한 점착력을 얻을 수 없다. 이 중량 평균 분자량은 25만 이상, 45만 미만인 것이 보다 바람직하다.The weight average molecular weight of the acrylic copolymer according to the present invention is 200,000 or more and less than 450,000. When this weight average molecular weight is less than 200,000, the cohesive force required for an adhesive is not acquired, but it becomes a cause which produces the honeycomb of an adhesive when an adhesive tape is affixed to a to-be-adhered body. In addition, when this weight average molecular weight is 450,000 or more, the followability|trackability with respect to the to-be-adhered body of an adhesive tape falls, and the adhesive force required for component fixing etc. inside an electronic device cannot be acquired. As for this weight average molecular weight, it is more preferable that they are 250,000 or more and less than 450,000.
본 발명에 관한 아크릴계 공중합체에는, 필요에 따라 점착 부여 수지, 실란 커플링제, 산화 방지제 등의 임의 성분을 첨가할 수 있다.Arbitrary components, such as tackifying resin, a silane coupling agent, and antioxidant, can be added to the acrylic copolymer which concerns on this invention as needed.
점착 부여 수지로서는, 예를 들면, 로진 에스테르계 수지(로진 에스테르, 불균화 로진 에스테르, 수소 첨가 로진 에스테르 등), 테르펜계 수지(테르펜 수지, 방향족 변성 테르펜 수지, 수소 첨가 테르펜 수지, 테르펜 페놀 등), 석유계 수지(지방족계 석유 수지, 방향족계 석유 수지, 공중합계 석유 수지, 지방족계 석유 수지 등), 퓨어·모노머계 수지(쿠마론·인덴 수지, 스티렌 수지 등), 축합계 수지(페놀계 수지, 크실렌 수지 등) 등을 사용할 수 있다. 점착 부여 수지를 첨가함으로써, 점착제의 경도가 저하되고, 피착체에 대한 초기 점착력이 향상된다.Examples of the tackifying resin include rosin ester resins (rosin esters, disproportionated rosin esters, hydrogenated rosin esters, etc.), terpene resins (terpene resins, aromatic modified terpene resins, hydrogenated terpene resins, terpene phenols, etc.) , petroleum resins (aliphatic petroleum resins, aromatic petroleum resins, copolymerized petroleum resins, aliphatic petroleum resins, etc.), pure monomer resins (coumarone indene resins, styrene resins, etc.), condensed resins (phenolic resins, etc.) resin, xylene resin, etc.) can be used. By adding tackifying resin, the hardness of an adhesive falls and the initial stage adhesive force with respect to a to-be-adhered body improves.
실란 커플링제로서는, 예를 들면, 2-(3,4-에폭시시클로헥실)에틸트리메톡시실란, 3-글리시독시프로필트리메톡시실란, 3-글리시독시프로필메틸디에톡시실란, 3-글리시독시프로필트리에톡시실란, 트리스-(트리메톡시실릴프로필)이소시아누레이트 등을 사용할 수 있다. 실란 커플링제는 2종류 이상을 병용해도 된다. 실란 커플링제를 사용함으로써, 점착제의 내반발성을 향상시키고, 점착 테이프의 세폭화·미세 가공화에 수반하여 저하되는 내습열 하중성을 향상시킬 수 있다.As the silane coupling agent, for example, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3- Glycidoxypropyltriethoxysilane, tris-(trimethoxysilylpropyl)isocyanurate, etc. can be used. A silane coupling agent may use 2 or more types together. By using a silane coupling agent, the repulsion resistance of an adhesive can be improved, and the heat-and-moisture load resistance which falls with narrowing and microprocessing of an adhesive tape can be improved.
산화 방지제로서는, 예를 들면, 힌더드 페놀계 산화 방지제 등을 사용할 수 있다. 산화 방지제를 첨가함으로써, 점착제의 내반발성을 향상시키고, 점착 테이프의 세폭화·미세 가공화에 수반하여 저하되는 내습열 하중성을 향상시킬 수 있다.As an antioxidant, a hindered phenol type antioxidant etc. can be used, for example. By adding antioxidant, the repulsion resistance of an adhesive can be improved, and the heat-and-moisture load resistance which falls with narrowing and microprocessing of an adhesive tape can be improved.
<점착 테이프><Adhesive tape>
본 발명에 관한 점착 테이프는, 전술한 아크릴계 공중합체(및 필요에 따라 임의 성분)를 함유하는 점착제 조성물이 점착제로서 사용된 점착 테이프이다. 「점착제 조성물이 점착제로서 사용된 점착 테이프」란, 예를 들면, 그 점착제 조성물을 시트상으로 형성한 점착 테이프(소위, 베이스리스 타입의 점착 테이프), 혹은 그 점착제 조성 물을 사용하여 기재의 한면 또는 양면에 점착제층을 형성한 점착 테이프이다.The adhesive tape which concerns on this invention is an adhesive tape in which the adhesive composition containing the above-mentioned acrylic copolymer (and optional component as needed) was used as an adhesive. "Adhesive tape in which an adhesive composition is used as an adhesive" means, for example, an adhesive tape (so-called baseless type adhesive tape) in which the adhesive composition is formed into a sheet, or one side of a substrate using the adhesive composition Or it is the adhesive tape which formed the adhesive layer on both surfaces.
베이스리스 타입의 점착 테이프는, 예를 들면, 이형지 등의 지지체 상에 아크릴계 공중합체를 도포하고, 그 후 건조시킴으로써 형성할 수 있다. 한편, 기재를 갖는 점착 테이프는, 기재 상에 아크릴계 공중합체를 도포하고, 그 후 건조시킴으로써 점착제층을 형성해도 되고, 이형지 등의 지지체 상에 아크릴계 공 중합체를 도포하여 점착제 층을 형성 한 후, 이 점착제 층을 기재의 한면 또는 양면에 접합 할 수 있다. 베이스리스 타입의 점착 테이프 및 기재를 갖는 점착 테이프의 점착제층은, 단층이어도 되고, 복수의 층의 적층된 적층체로 이루어지는 것이어도 된다.The baseless type adhesive tape can be formed, for example, by coating the acrylic copolymer on a support such as a release paper and drying it thereafter. On the other hand, in the adhesive tape having a substrate, the adhesive layer may be formed by coating the acrylic copolymer on the substrate and then drying, or after forming the adhesive layer by applying the acrylic copolymer on a support such as a release paper, this The adhesive layer can be bonded to one or both sides of the substrate. A single layer may be sufficient as the adhesive layer of a baseless type adhesive tape and the adhesive tape which has a base material, and what consists of a laminated body of several layers may be sufficient as it.
기재를 갖는 점착 테이프에 있어서의 점착제층의 두께는, 바람직하게는 1~200㎛, 보다 바람직하게는 5~100㎛이다. 베이스리스 타입의 점착 테이프의 두께는, 바람직하게는 1~200㎛, 보다 바람직하게는 5~100㎛이다.The thickness of the adhesive layer in the adhesive tape which has a base material becomes like this. Preferably it is 1-200 micrometers, More preferably, it is 5-100 micrometers. The thickness of the adhesive tape of a baseless type becomes like this. Preferably it is 1-200 micrometers, More preferably, it is 5-100 micrometers.
아크릴계 공중합체를 기재 또는 이형지 등의 지지체 상에 도포하는 방법은 특별히 한정되지 않고, 공지의 방법을 사용하면 된다. 그 구체예로서는, 롤 코터, 다이 코터, 립 코터, 딥 롤 코터, 바 코터, 나이프 코터, 스프레이 롤 코터 등을 사용한 방법을 들 수 있다.A method of applying the acrylic copolymer on a substrate or a support such as a release paper is not particularly limited, and a known method may be used. As the specific example, the method using a roll coater, a die coater, a lip coater, a dip roll coater, a bar coater, a knife coater, a spray roll coater, etc. is mentioned.
점착 테이프가 기재를 갖는 경우, 그 기재는 특별히 한정되지 않고, 공지의 기재를 사용하면 된다. 기재의 구체예로서는, 종이, 천, 부직포, 그물 등의 섬유계 기재, 올레핀계 수지, 폴리에스테르계 수지, 폴리염화비닐계 수지, 아세트산비닐계 수지, 폴리아미드계 수지, 폴리이미드계 수지, 폴리에테르에테르케톤(PEEK), 폴리페닐렌술피드(PPS) 등의 수지 기재(수지 필름 또는 수지 시트), 고무 시트, 발포 시트(발포 기재), 금속박, 금속판을 들 수 있다. 또한, 이들 적층체, 예를 들면, 수지 기재와 수지 이외의 기재의 적층체, 수지 기재끼리의 적층체여도 된다. 기재는 단층, 복층 중 어느 것이어도 좋다. 기재의 점착제층을 설치하는 면에는, 필요에 따라서, 배면 처리, 대전 방지 처리, 언더코팅 처리 등의 각종 처리가 실시되어 있어도 된다. 기재의 두께는 바람직하게는 5 내지 500㎛, 보다 바람직하게는 10 내지 200㎛이다.When an adhesive tape has a base material, the base material is not specifically limited, What is necessary is just to use a well-known base material. Specific examples of the substrate include fiber-based substrates such as paper, cloth, non-woven fabric, and nets, olefin-based resins, polyester-based resins, polyvinyl chloride-based resins, vinyl acetate-based resins, polyamide-based resins, polyimide-based resins, and polyethers Resin base materials (resin film or resin sheet), such as ether ketone (PEEK) and polyphenylene sulfide (PPS), a rubber sheet, foam seat|seet (foam base material), metal foil, and a metal plate are mentioned. Moreover, these laminates may be used, for example, a laminate of a resin substrate and a substrate other than a resin, or a laminate of resin substrates. The substrate may be either a single layer or a multilayer. Various treatments, such as a back surface treatment, an antistatic treatment, an undercoating process, may be given to the surface on which the adhesive layer of a base material is provided as needed. The thickness of the substrate is preferably 5 to 500 μm, more preferably 10 to 200 μm.
접착 테이프는 이형지 또는 다른 필름으로 보호 될 수 있습니다. 이형지 또는 다른 필름은 특별히 한정되지 않고, 공지된 것을 필요에 따라 사용할 수 있다.The adhesive tape can be protected with a release paper or other film. The release paper or other film is not particularly limited, and a known one may be used as needed.
실시예Example
이하, 실시 예 및 비교 예를 들어 본 발명을 더욱 상세하게 설명한다.Hereinafter, the present invention will be described in more detail by way of Examples and Comparative Examples.
(중량 평균 분자량)(weight average molecular weight)
아크릴계 공중합체의 중량 평균 분자량(Mw)은, GPC법에 의해, 아크릴계 공중합체의 표준 폴리스티렌 환산의 분자량을 이하의 측정 장치 및 조건으로 측정한 값이다.The weight average molecular weight (Mw) of the acrylic copolymer is a value obtained by measuring the molecular weight of the acrylic copolymer in terms of standard polystyrene by the GPC method with the following measuring apparatus and conditions.
·장치:LC-2000 시리즈(일본 분광 주식회사제)・Apparatus: LC-2000 series (manufactured by Nippon Spectroscopy Co., Ltd.)
·컬럼:Shodex KF-806M×2개, Shodex KF-802M×1개·Column: Shodex KF-806M×2ea, Shodex KF-802M×1ea
·용리액:테트라히드로푸란(THF)·Eluent: tetrahydrofuran (THF)
·유속:1.0mL/분・Flow rate: 1.0 mL/min
·컬럼 온도:40℃・Column temperature: 40℃
·주입량:100μL・Injection amount: 100 μL
·검출기:굴절률계(RI)・Detector: Refractometer (RI)
(초기 점착력)(Initial Adhesion)
기재 A를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 25㎛의 폴리에스테르 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 1왕복으로 가압 부착하고, 가압 첩부 후 20분 경과 후의 180°인하 벗겨 점착력(N/10mm폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.In case of using substrate A: A sample of 10 mm wide double-sided adhesive tape backed by a polyester film with a thickness of 25 μm is pressure-attached to a SUS304 plate polished with No. The adhesive force (N/10 mm width) after peeling off 180 degree|times was measured by the method of JIS Z0237:2000 described.
기재 B를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 50㎛의 폴리에스테르 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 1왕복으로 가압 부착하고, 가압 첩부 후 20분 경과 후의 180°인하 벗겨 점착력(N/10mm폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.In case of using base B: A sample of a 10 mm wide double-sided adhesive tape backed by a 50 μm thick polyester film on a SUS 304 plate polished with No. 280 water resistant abrasive paper was pressure-attached by a 2.0 kg roller in one reciprocation, and 20 minutes elapsed after the pressure was applied. The adhesive force (N/10 mm width) after peeling off 180 degree|times was measured by the method of JIS Z0237:2000 described.
(경시 점착력)(Adhesive strength over time)
기재 A를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 25㎛의 폴리에스테르 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 1왕복으로 가압 부착하고, 가압 첩부 후 72시간 후의 180°인발 벗겨 점착력(N/10mm 폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.In case of using substrate A: A sample of 10 mm wide double-sided adhesive tape backed by a 25 μm thick polyester film on a SUS 304 plate polished with No. 280 waterproof abrasive paper was pressure-attached with one reciprocating 2.0 kg roller, and 72 hours after pressure application 180° drawing and peeling adhesive force (N/10 mm width) was measured by the method described in JIS Z0237:2000.
기재 B를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 50㎛의 폴리에스테르 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 2.5왕복으로 가압 부착하고, 가압 부착 후 72시간 후의 180°인발 벗겨 점착력(N/10㎜ 폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.In case of using base B: A sample of 10 mm wide double-sided adhesive tape backed by a 50 μm thick polyester film on a SUS304 plate polished with No. 280 water-resistant abrasive paper was pressure-attached with a 2.0 kg roller 2.5 reciprocations, and 72 hours after pressure attachment. 180° drawing and peeling adhesive force (N/10 mm width) was measured by the method described in JIS Z0237:2000.
(촉진 후 점착력: Na)(Adhesiveness after promotion: Na)
기재 A를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 25㎛의 폴리에스테르 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 1왕복으로 가압 부착하고, 온도 65±5℃ 습도 90±10%의 분위기하에 72시간 방치했다. 그 후, 온도 23±5℃ 습도 50±5%의 분위기하에 2시간 방치했다. 이 샘플의 180°인출 박리 점착력(N/10mm 폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.In case of using substrate A: A sample of 10 mm wide double-sided adhesive tape backed by a 25 μm thick polyester film was applied to a SUS 304 plate polished with No. 280 water-resistant abrasive paper by pressure and attached with one reciprocation of a 2.0 kg roller, temperature 65±5°C and humidity It was left to stand in the atmosphere of 90±10% for 72 hours. Thereafter, it was left to stand for 2 hours in an atmosphere with a temperature of 23±5°C and a humidity of 50±5%. The 180° pull-out peel adhesive force (N/10 mm width) of this sample was measured by the method described in JIS Z0237:2000.
기재 B를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 50㎛의 SUS 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 2.5왕복으로 가압 부착하고, 온도 60±5℃ 습도 90±10%의 분위기하에 72시간 방치했다. 그 후, 온도 23±5℃ 습도 50±5%의 분위기하에 2시간 방치했다. 이 샘플의 180°인출 박리 점착력(N/10mm 폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.In case of using substrate B: A sample of 10 mm wide double-sided adhesive tape backed by a 50 μm thick SUS film was pressed and attached to a SUS 304 plate polished with No. It was left to stand in the atmosphere of +/-10% for 72 hours. Thereafter, it was left to stand for 2 hours in an atmosphere with a temperature of 23±5°C and a humidity of 50±5%. The 180° pull-out peel adhesive force (N/10 mm width) of this sample was measured by the method described in JIS Z0237:2000.
(올레산 침지 후 점착력: Nb)(Adhesiveness after oleic acid immersion: Nb)
기재 A를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 25㎛의 폴리에스테르 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 1왕복으로 가압 부착하였다. 이 샘플을 올레산에 침지하고, 온도 65±5℃, 습도 90±10%의 분위기하에 72시간 방치했다. 그 후, 샘플을 용기로부터 취출하고, 순수를 사용하여 올레산을 닦아내고, 물방울을 닦아낸 후, 온도 23±5℃, 습도 50±5%의 분위기하에 2시간 방치했다. 이 샘플의 180°인출 박리 점착력(N/10mm 폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.In case of using base A: A sample of double-sided adhesive tape with a width of 10 mm backed with a polyester film having a thickness of 25 μm was applied to a SUS 304 plate polished with No. This sample was immersed in oleic acid and left to stand for 72 hours in an atmosphere of a temperature of 65±5° C. and a humidity of 90±10%. After that, the sample was taken out from the container, the oleic acid was wiped off using pure water, and the water droplets were wiped off, and then left to stand for 2 hours in an atmosphere with a temperature of 23±5° C. and a humidity of 50±5%. The 180° pull-out peel adhesive force (N/10 mm width) of this sample was measured by the method described in JIS Z0237:2000.
기재 B를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 50㎛의 SUS 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 2.5왕복으로 가압 부착하였다. 이 샘플을 올레산에 침지하고, 온도 60±5℃, 습도 90±10%의 분위기하에 72시간 방치했다. 그 후, 샘플을 용기로부터 취출하고, 순수를 사용하여 올레산을 닦아내고, 물방울을 닦아낸 후, 온도 23±5℃, 습도 50±5%의 분위기하에 2시간 방치했다. 이 샘플의 180°인출 박리 점착력(N/10mm 폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.In case of using base B: A sample of double-sided adhesive tape with a width of 10 mm supported by a SUS film having a thickness of 50 μm was applied to a SUS 304 plate polished with No. This sample was immersed in oleic acid and left to stand for 72 hours in an atmosphere with a temperature of 60±5° C. and a humidity of 90±10%. After that, the sample was taken out from the container, the oleic acid was wiped off using pure water, and the water droplets were wiped off, and then left to stand for 2 hours in an atmosphere with a temperature of 23±5° C. and a humidity of 50±5%. The 180° pull-out peel adhesive force (N/10 mm width) of this sample was measured by the method described in JIS Z0237:2000.
(올레산 침지 후 점착력 유지율:X)(Adhesiveness retention rate after oleic acid immersion: X)
하기 식에 의해 구했다.It calculated|required by the following formula.
X=100×Nb/NaX=100×Nb/Na
(파괴 모드)(Destroy Mode)
촉진 후 점착력(Na)의 측정 후의 샘플 및 올레산 침지 후 점착력(Nb)의 측정 후의 샘플에 대해서, 각각 파괴가 발생하고 있는 부위를 관찰하였다. 점착제에 파괴가 발생하고 있는 경우를 응집 파괴(표 2~4의 「응집」), 점착제와 피착체 사이에 파괴가 발생하고 있는 경우를 계면 파괴, 기재에 파괴가 발생하고 있는 경우를 기재 파괴(표 2~4의 「기재」)로 하였다.For the sample after the measurement of the adhesive force (Na) after promotion and the sample after the measurement of the adhesive force (Nb) after immersion in oleic acid (Nb), the site in which the fracture occurred was observed. Cohesive failure (“agglomeration” in Tables 2 to 4) when the adhesive is fractured, interfacial fracture when fracture occurs between the pressure-sensitive adhesive and the adherend, and substrate destruction when fracture occurs in the substrate ( It was set as "remark" of Tables 2-4).
[실시예 1][Example 1]
(아크릴계 공중합체의 조제)(Preparation of acrylic copolymer)
교반기, 온도계, 환류 냉각기 및 질소 도입관을 구비한 반응 장치에, 표 1에 나타내는 질량부의 공중합체를 구성하는 모노머, 아세트산에틸, 연쇄 이동제인 n-도데칸티올 0.03질량부 및 라디칼 중합 개시제인 라우릴 퍼옥사이드 0.05질량부를 투입하고, 질소 가스를 봉입한 후, 교반하면서 질소 가스 기류 하에서 67℃ 3시간 반응시켰다. 그 후, 82℃ 3시간 반응시켰다. 반응 종료 후, 실온까지 냉각하고, 아세트산에틸을 첨가하였다. 이것에 의해 고형분 농도 30%의 공중합체를 얻었다. 실시예 1에서 제조한 아크릴계 공중합체의 중량 평균 분자량은 42만이었다.In a reaction apparatus equipped with a stirrer, a thermometer, a reflux condenser and a nitrogen introduction tube, the monomer constituting the copolymer in parts by mass shown in Table 1, ethyl acetate, 0.03 parts by mass of n-dodecanthiol as a chain transfer agent, and a radical polymerization initiator Ra After adding 0.05 mass parts of uryl peroxide and sealing nitrogen gas, it was made to react under nitrogen gas stream for 3 hours at 67 degreeC, stirring. Then, it was made to react at 82 degreeC for 3 hours. After completion of the reaction, the mixture was cooled to room temperature, and ethyl acetate was added. Thus, a copolymer having a solid content concentration of 30% was obtained. The weight average molecular weight of the acrylic copolymer prepared in Example 1 was 420,000.
(점착제의 조제)(Preparation of adhesive)
이 공중합체의 고형분 100질량부에 대하여, 가교제로서 이소시아네이트계 가교제(가교제 A)(도소사제, 상품명 L-45E)를 1.8질량부 첨가하여 점착제를 조제했다.With respect to 100 mass parts of solid content of this copolymer, 1.8 mass parts of isocyanate type crosslinking agents (crosslinking agent A) (The Tosoh Corporation make, brand name L-45E) were added as a crosslinking agent, and the adhesive was prepared.
(양면 점착 테이프의 제조)(Manufacture of double-sided adhesive tape)
양면 코로나 방전 처리된 두께 12㎛의 폴리에틸렌테레프탈레이트 필름(기재 A)의 양면에 별도 제작한 하도제를 도포하고 120℃에서 건조함으로써, 기재 A에 하도층을 형성했다. 기재 A의 제1 면측의 언더코트층 상에, 조제한 점착제를 전면 평활하게 도포하고, 100℃에서 가열 건조하여, 두께 19㎛의 점착제층을 형성했다. 또한, 이 점착제층 상에 실리콘 처리된 박리지를 접합하였다. 그 후, 제 2 면측의 하도제층 상에도 마찬가지로 하여 조제한 점착제를 도포·건조하고, 박리지를 첩합하고, 40℃에서 3일간 양생했다. 이것에 의해 총 두께 50㎛의 양면 점착 테이프를 얻었다.A separately prepared primer was applied to both surfaces of a 12 µm-thick polyethylene terephthalate film (base A) subjected to double-sided corona discharge treatment and dried at 120° C. to form an undercoat layer on the substrate A. On the undercoat layer on the 1st surface side of the base material A, the prepared adhesive was apply|coated to the whole surface, it heat-dried at 100 degreeC, and the 19-micrometer-thick adhesive layer was formed. Further, a silicone-treated release paper was bonded onto the pressure-sensitive adhesive layer. Then, on the primer layer on the 2nd surface side, the adhesive prepared similarly was apply|coated and dried, the release paper was bonded together, and it cured at 40 degreeC for 3 days. Thereby, the double-sided adhesive tape with a total thickness of 50 micrometers was obtained.
[실시예 2][Example 2]
점착제의 조제에 있어서, 가교제를 에폭시계 가교제(가교제 B)(綜硏化學社製, 상품명 E-5CM)로 변경한 것 이외는 실시예 1과 동일하게 하여, 양면 점착 테이프를 제작했다. Preparation of the adhesive WHEREIN: Except having changed the crosslinking agent into the epoxy-type crosslinking agent (crosslinking agent B) (trade name E-5CM), it carried out similarly to Example 1, and produced the double-sided adhesive tape.
[실시예 3][Example 3]
양면 점착 테이프의 제조에 있어서, 실시예 1과 마찬가지로 조제한 점착제를 실리콘 처리된 이형지 상에 전면 평활하게 도포하고, 90℃에서 가열 건조하여, 두께 50㎛의 점착제층을 형성했다. 그리고, 양면을 코로나 방전 처리한 폴리에틸렌(PE)계 발포체로 이루어지는 두께 100㎛의 기재(기재 B)의 양면에 이형지 상의 점착제를 접합하고, 40℃에서 3일간 양생한 후, 총 두께 200㎛의 양면 점착 테이프를 얻었다.Production of the double-sided adhesive tape WHEREIN: The adhesive prepared similarly to Example 1 was apply|coated smoothly on the silicone-treated release paper, and it heat-dried at 90 degreeC, and formed the 50-micrometer-thick adhesive layer. Then, the pressure-sensitive adhesive on the release paper is bonded to both sides of the base material (substrate B) having a thickness of 100 µm made of a polyethylene (PE)-based foam that has been corona-discharged on both sides, cured at 40 ° C for 3 days, and then both surfaces with a total thickness of 200 µm An adhesive tape was obtained.
[실시예 4][Example 4]
점착제의 조제에 있어서, 점착 부여 수지로서, 아세트산에틸에 의해 50% 희석액으로 한 아라카와 화학 공업 주식회사 제조 D-6011(상품명)을 8질량부, 실란 커플링제로서, 아세트산 에틸에 의해 5% 희석액으로 한 신에츠 화학 공업 주식회사제 KBM-403(상품명)을 2질량부, 산화 방지제로서, BASF 재팬 주식회사제 이르가녹스(등록 상표) 1010을 0.2질량부 첨가한 것 이외는 실시 실시예 3과 동일하게 하여 양면 점착 테이프를 제작하였다.Preparation of the adhesive WHEREIN: 8 mass parts of Arakawa Chemical Industry Co., Ltd. D-6011 (brand name) made into a 50% dilution liquid with ethyl acetate as a tackifying resin was made into a 5% dilution liquid with ethyl acetate as a silane coupling agent as 8 mass parts. 2 parts by mass of KBM-403 (trade name) manufactured by Shin-Etsu Chemical Industries, Ltd. and 0.2 parts by mass of Irganox (registered trademark) 1010 manufactured by BASF Japan Co., Ltd. as an antioxidant were added in the same manner as in Example 3, and both surfaces An adhesive tape was produced.
[비교예 1][Comparative Example 1]
(아크릴계 공중합체의 조제)(Preparation of acrylic copolymer)
아크릴산메틸을 사용하지 않고, 아크릴산메톡시에틸 50질량부, 아크릴산 10질량부, 아크릴산-2-에틸헥실 40질량부를 사용하여, 가교제의 첨가량을 1.2질량부로 변경한 것 이외에는 실시예 1과 동일하게 하여, 고형분 농도 30%의 공중합체를 얻었다. 비교예 1에서 제조한 아크릴계 공중합체의 중량 평균 분자량은 75만이었다.In the same manner as in Example 1, except that 50 parts by mass of methoxyethyl acrylate, 10 parts by mass of acrylic acid, and 40 parts by mass of 2-ethylhexyl acrylate without using methyl acrylate, and the addition amount of the crosslinking agent was changed to 1.2 parts by mass, , a copolymer having a solid content concentration of 30% was obtained. The weight average molecular weight of the acrylic copolymer prepared in Comparative Example 1 was 750,000.
(점착제의 조제)(Preparation of adhesive)
이 공중합체의 고형분 100질량부에 대하여, 가교제로서 이소시아네이트계 가교제(가교제 A)(도소사제, 상품명 L-45E)를 1.2질량부, 점착 부여 수지로서 아세트산 에틸에 의해 50% 희석액으로 한 아라카와 화학 공업 주식회사 제조 D-6011(상품명)을 8질량부, 실란 커플링제로서, 아세트산 에틸에 의해 5% 희석액으로 한 신에쓰 화학 공업 주식회사 제조 KBM-403 (상품명)을 2질량부, 산화 방지제로서, BASF 재팬 주식회사제 이르가녹스(등록상표) 1010을 0.2질량부 첨가하고, 점착제를 조제했다.With respect to 100 parts by mass of the solid content of the copolymer, 1.2 parts by mass of an isocyanate-based crosslinking agent (crosslinking agent A) (manufactured by Tosoh Corporation, trade name L-45E) as a crosslinking agent, and 50% dilution with ethyl acetate as a tackifying resin, Arakawa Chemical Industry Co., Ltd. 8 parts by mass of D-6011 (trade name) manufactured by K.K., 2 parts by mass of KBM-403 (trade name) manufactured by Shin-Etsu Chemical Co., Ltd. (trade name) obtained by diluting 5% with ethyl acetate as a silane coupling agent, as an antioxidant, BASF Japan 0.2 mass parts of Irganox (trademark) 1010 made by a corporation|Co., Ltd.|KK was added, and the adhesive was prepared.
(양면 점착 테이프의 제조)(Manufacture of double-sided adhesive tape)
이 점착제를 사용한 것 이외에는, 실시예 1과 동일하게 하여 양면 점착 테이프를 얻었다.Except having used this adhesive, it carried out similarly to Example 1, and obtained the double-sided adhesive tape.
[비교예 2][Comparative Example 2]
아크릴계 공중합체의 제조에 있어서, 아크릴산메틸을 사용하지 않고, 아크릴산메톡시에틸 86질량부, 아크릴산 10질량부, 아크릴산 2-에틸헥실 4질량부를 사용하고, 가교제의 첨가량을 1.2질량부로 변경한 것 이외에는 실시예 1과 동일하게 하여, 양면 점착 테이프를 제작하였다. 비교예 2에서 제조한 아크릴계 공중합체의 중량 평균 분자량은 105만이었다.In the production of the acrylic copolymer, without using methyl acrylate, 86 parts by mass of methoxyethyl acrylate, 10 parts by mass of acrylic acid, and 4 parts by mass of 2-ethylhexyl acrylate, except that the amount of the crosslinking agent was changed to 1.2 parts by mass. It carried out similarly to Example 1, and produced the double-sided adhesive tape. The weight average molecular weight of the acrylic copolymer prepared in Comparative Example 2 was 1.05 million.
[비교예 3][Comparative Example 3]
아크릴계 공중합체의 제조에 있어서, 연쇄 이동제로서의 n-도데칸티올의 첨가량을 0.06질량부, 가교제 A의 첨가량을 2.4질량부로 변경한 것 이외에는 비교예 2로 마찬가지로, 양면 점착 테이프를 제작하였다. 비교예 3에서 제조한 아크릴계 공중합체의 중량 평균 분자량은 34만이었다.In the production of the acrylic copolymer, a double-sided adhesive tape was prepared in the same manner as in Comparative Example 2, except that the amount of n-dodecanthiol as a chain transfer agent was changed to 0.06 parts by mass and the amount of the crosslinking agent A was changed to 2.4 parts by mass. The weight average molecular weight of the acrylic copolymer prepared in Comparative Example 3 was 340,000.
[비교예 4][Comparative Example 4]
아크릴계 공중합체의 제조에 있어서, 아크릴산메톡시에틸을 사용하지 않고, 아크릴산-2-(에톡시에톡시)에틸(EOEOEA) 86질량부를 사용한 것 이외는 비교예 2와 동일하게 하여, 양면 점착 테이프를 만들었다. 비교예 4에서 제조한 아크릴계 공중합체의 중량 평균 분자량은 측정할 수 없었다.In the production of the acrylic copolymer, the double-sided adhesive tape was prepared in the same manner as in Comparative Example 2, except that 86 parts by mass of acrylic acid-2-(ethoxyethoxy)ethyl (EOEOEA) was used without using methoxyethyl acrylate. made. The weight average molecular weight of the acrylic copolymer prepared in Comparative Example 4 could not be measured.
[비교예 5][Comparative Example 5]
양면 점착 테이프의 제조에 있어서, 비교예 1과 동일하게 조제한 점착제를 실리콘 처리된 이형지 상에 전면 평활하게 도포하고, 90℃에서 가열 건조하여, 두께 50㎛의 점착제층을 형성했다. 그리고, 양면을 코로나 방전 처리한 폴리에틸렌(PE)계 발포체로 이루어지는 두께 100㎛의 기재(기재 B)의 양면에 이형지 상의 점착제를 접합하고, 40℃에서 3일간 양생한 후, 총 두께 200㎛의 양면 점착 테이프를 얻었다.In the manufacture of a double-sided adhesive tape, the pressure-sensitive adhesive prepared in the same manner as in Comparative Example 1 was applied to a silicone-treated release paper in a smooth entire surface, and dried by heating at 90° C. to form an adhesive layer having a thickness of 50 µm. Then, the pressure-sensitive adhesive on the release paper is bonded to both sides of the base material (substrate B) having a thickness of 100 µm made of a polyethylene (PE)-based foam that has been corona-discharged on both sides, cured at 40 ° C for 3 days, and then both surfaces with a total thickness of 200 µm An adhesive tape was obtained.
[비교예 6][Comparative Example 6]
양면 점착 테이프의 제조에 있어서, 비교예 2와 마찬가지로 조제한 점착제를 실리콘 처리된 이형지 상에 전면 평활하게 도포하고, 90℃에서 가열 건조하여, 두께 50㎛의 점착제층을 형성했다. 그리고, 양면을 코로나 방전 처리한 폴리에틸렌(PE)계 발포체로 이루어지는 두께 100㎛의 기재(기재 B)의 양면에 이형지 상의 점착제를 접합하고, 40℃에서 3일간 양생한 후, 총 두께 200㎛의 양면 점착 테이프를 얻었다.In the production of the double-sided adhesive tape, the pressure-sensitive adhesive prepared in the same manner as in Comparative Example 2 was applied to the silicone-treated release paper in a smooth entire surface, and dried by heating at 90° C. to form an adhesive layer having a thickness of 50 µm. Then, the pressure-sensitive adhesive on the release paper is bonded to both sides of the base material (substrate B) having a thickness of 100 µm made of a polyethylene (PE)-based foam that has been corona-discharged on both sides, cured at 40 ° C for 3 days, and then both surfaces with a total thickness of 200 µm An adhesive tape was obtained.
[비교예 7][Comparative Example 7]
양면 점착 테이프의 제조에 있어서, 비교예 3과 마찬가지로 조제한 점착제를 실리콘 처리된 이형지 상에 전면 평활하게 도포하고, 90℃에서 가열 건조하여, 두께 50㎛의 점착제층을 형성했다. 그리고, 양면을 코로나 방전 처리한 폴리에틸렌(PE)계 발포체로 이루어지는 두께 100㎛의 기재(기재 B)의 양면에 이형지 상의 점착제를 접합하고, 40℃에서 3일간 양생한 후, 총 두께 200㎛의 양면 점착 테이프를 얻었다.Production of the double-sided adhesive tape WHEREIN: The adhesive prepared similarly to the comparative example 3 was apply|coated smoothly on the silicone-treated release paper, and it heat-dried at 90 degreeC, and formed the 50-micrometer-thick adhesive layer. Then, the pressure-sensitive adhesive on the release paper is bonded to both sides of the base material (substrate B) having a thickness of 100 µm made of a polyethylene (PE)-based foam that has been corona-discharged on both sides, cured at 40 ° C for 3 days, and then both surfaces with a total thickness of 200 µm An adhesive tape was obtained.
[비교예 8][Comparative Example 8]
아크릴계 공중합체의 조제에 있어서, 아크릴산 10질량부 대신에 아크릴산-4-히드록시부틸 10질량부를 사용한 것 이외는 비교예 2와 동일하게 하여, 양면 점착 테이프를 제작하였다. 비교예 8에서 제조한 아크릴계 공중합체의 중량 평균 분자량은 73만이었다.Preparation of the acrylic copolymer WHEREIN: Except having used 10 mass parts of acrylic acid 4-hydroxybutyl instead of 10 mass parts of acrylic acid, it carried out similarly to the comparative example 2, and produced the double-sided adhesive tape. The weight average molecular weight of the acrylic copolymer prepared in Comparative Example 8 was 730,000.
실시예 1~실시예 4 및 비교예 1~비교예 8의 배합, 아크릴계 공중합체의 중량 평균 분자량 및 양면 점착 테이프를 형성할 때에 사용한 기재를 표 1에 나타낸다. 또한, 각각의 양면 점착 테이프에 대해 측정한 초기 점착력, 경시 점착력, 촉진 후 점착력 Na, 올레산 침지 후 점착력 Nb, 올레산 침지 후 점착력 유지율 X 및 파괴 모드를 표 2~표 4에 나타내었다.Table 1 shows the base material used when forming the compounding of Examples 1 - Example 4 and Comparative Examples 1 - Comparative Example 8, the weight average molecular weight of an acrylic copolymer, and a double-sided adhesive tape. In addition, the initial adhesive force, the adhesive force over time, the adhesive force after promotion Na, the adhesive force Nb after immersion in oleic acid, the adhesive force retention X after immersion in oleic acid, and the failure mode measured for each double-sided adhesive tape are shown in Tables 2 to 4.
표 1에서 사용한 약칭은 이하와 같다.The abbreviations used in Table 1 are as follows.
AME=아크릴산메톡시에틸AME = methoxyethyl acrylate
EOEOEA=아크릴산-2-(2-에톡시에톡시)에틸EOEOEA = Acrylic acid-2-(2-ethoxyethoxy)ethyl
AA=아크릴산AA = acrylic acid
4-HBA=아크릴산-4-히드록시부틸4-HBA=acrylic acid-4-hydroxybutyl
MA=아크릴산메틸MA = methyl acrylate
2-EHA=아크릴산-2-에틸헥실2-EHA = Acrylic acid-2-ethylhexyl
표 2~4에 나타내는 바와 같이, 실시예 1~4의 양면 점착 테이프는, 높은 초기 점착력 및 경시 점착력을 갖고, 또한, 올레산에의 침지 후에도 적당한 점착력을 유지하고 있었다. 따라서, 이들 양면 점착 테이프는 피지, 땀, 식품, 화장품 등의 유지 성분에 대하여 높은 내구성을 가지며, 또한 피착체에 부착할 때 적당한 점착력을 갖는 점착 테이프인 것 알 수 있다. 또한, 실시예 3과 실시예 4를 비교하면, 점착 부여 수지를 첨가한 실시예 4 쪽이 초기 점착력의 수치가 작아지고 있지만, 실시예 3은 계면 파괴인 것에 비해, 실시예 4는 기재 파괴이었기 때문에, 점착력의 저하는 발생하고 있지 않다고 생각된다.As shown in Tables 2-4, the double-sided adhesive tape of Examples 1-4 had high initial stage adhesive force and aging adhesive force, and was maintaining moderate adhesive force also after immersion in oleic acid. Therefore, it can be seen that these double-sided adhesive tapes are adhesive tapes having high durability against oils and fats such as sebum, sweat, food, and cosmetics, and having adequate adhesive strength when attached to an adherend. In addition, comparing Example 3 and Example 4, the numerical value of the initial adhesive force was smaller in Example 4 to which the tackifying resin was added, but Example 3 was an interfacial failure, whereas Example 4 was a substrate failure. Therefore, it is thought that the fall of adhesive force has not generate|occur|produced.
한편, 비교예 1~4 및 8(각 점착제층의 두께 19㎛, 기재 A)에서 사용한 아크릴계 공중합체의 단량체 조성은, 실시예 1 및 2(각 점착제층의 두께 19㎛ , 기재 A)에서 사용한 아크릴계 공중합체의 단량체 조성과는 다르다. 또한, 비교예 1, 2, 4 및 8에서 사용한 아크릴계 공중합체의 중량 평균 분자량은 실시예 1 및 2에서 사용한 아크릴계 공중합체의 중량 평균 분자량보다 크다.On the other hand, the monomer composition of the acrylic copolymer used in Comparative Examples 1 to 4 and 8 (the thickness of each pressure-sensitive adhesive layer of 19 μm, the substrate A) was used in Examples 1 and 2 (the thickness of each pressure-sensitive adhesive layer of 19 μm, the substrate A). It is different from the monomer composition of the acrylic copolymer. In addition, the weight average molecular weight of the acrylic copolymer used in Comparative Examples 1, 2, 4 and 8 is larger than the weight average molecular weight of the acrylic copolymer used in Examples 1 and 2.
그 결과, 비교예 1 및 8의 양면 점착 테이프는, 실시예 1 및 2의 양면 점착 테이프와 비교하여, 초기 점착력, 경시 점착력, 촉진 후 점착력 Na, 올레산 침지 후 점착력 Nb 및 올레산 침지 후 점착력 유지율 X가 열등했다.As a result, the double-sided adhesive tapes of Comparative Examples 1 and 8 were compared with the double-sided adhesive tapes of Examples 1 and 2, the initial adhesive strength, the adhesive strength over time, the adhesive strength after promotion Na, the adhesive strength Nb after immersion in oleic acid, and the adhesive strength retention X after immersion in oleic acid was inferior
비교예 2의 양면 점착 테이프는, 실시예 1 및 2의 양면 점착 테이프와 비교하여, 초기 점착력, 경시 점착력 및 촉진 후 점착력 Na가 뒤떨어졌다.Compared with the double-sided adhesive tapes of Examples 1 and 2, the double-sided adhesive tape of Comparative Example 2 was inferior in initial adhesive force, adhesive force with time, and adhesive force Na after promotion.
비교예 3은, 비교예 2보다 아크릴계 중합체의 중량 평균 분자량을 저하시킨 예이다. 그 결과, 비교 예 3에서는 비교 예 2보다 몇 가지 항목이 향상되었다. 그러나, 실시예 1 및 2보다 초기 점착력, 경시 점착력 및 촉진 후 점착력 Na는 열등했다.Comparative Example 3 is an example in which the weight average molecular weight of the acrylic polymer is lowered than in Comparative Example 2. As a result, in Comparative Example 3, several items were improved compared to Comparative Example 2. However, compared with Examples 1 and 2, the initial adhesive force, the aging adhesive force, and the adhesive force Na after promotion were inferior.
비교예 4의 양면 점착 테이프는, 실시예 1 및 2의 양면 점착 테이프와 비교하여, 경시 점착력, 촉진 후 점착력 Na, 올레산 침지 후 점착력 Nb 및 올레산 침지 후 점착력 유지율 X 열등했다.Compared with the double-sided adhesive tapes of Examples 1 and 2, the double-sided adhesive tape of Comparative Example 4 was inferior to the adhesive strength over time, the adhesive strength Na after promotion, the adhesive strength Nb after oleic acid immersion, and the adhesive strength retention rate X after oleic acid immersion.
비교예 5~7(각 점착제층의 두께 50㎛, 기재 B)의 양면 점착 테이프는, 그 아크릴계 공중합체의 모노머 조성이 실시예 3 및 4(각 점착제층의 두께 50㎛, 기재 B)에 있어서의 아크릴계 공중합체의 단량체 조성과는 다르다. 또한, 비교예 5 및 6에서 사용한 아크릴계 공중합체의 중량 평균 분자량은 실시예 3 및 4에서 사용한 아크릴계 공중합체의 중량 평균 분자량보다 크다.The double-sided adhesive tapes of Comparative Examples 5 to 7 (the thickness of each pressure-sensitive adhesive layer of 50 µm, the base material B) have a monomer composition of the acrylic copolymer in Examples 3 and 4 (the thickness of each pressure-sensitive adhesive layer of 50 µm, the base material B). It is different from the monomer composition of the acrylic copolymer. In addition, the weight average molecular weight of the acrylic copolymer used in Comparative Examples 5 and 6 is larger than the weight average molecular weight of the acrylic copolymer used in Examples 3 and 4.
그 결과, 비교예 5의 양면 점착 테이프는, 실시예 3 및 4의 양면 점착 테이프와 비교하여, 초기 점착력, 올레산 침지 후 점착력 Nb 및 올레산 침지 후 점착력 유지율 X가 낮았다 . 또한, 파괴 모드 (Na) 및 (Nb)는 모두 응집 파괴이며, 점착제 층의 응집력이 열등했다.As a result, compared with the double-sided adhesive tapes of Examples 3 and 4, the double-sided adhesive tape of Comparative Example 5 had lower initial adhesive strength, adhesive strength Nb after immersion in oleic acid, and adhesive strength retention X after immersion in oleic acid. In addition, the failure modes (Na) and (Nb) were both cohesive failure, and the cohesive force of the adhesive layer was inferior.
비교예 6의 양면 점착 테이프는 실시예 3 및 4의 양면 점착 테이프와 비교하여 초기 점착력이 떨어졌다. 또한, 파괴 모드 (Na) 및 (Nb)는 모두 응집 파괴이며, 점착제 층의 응집력이 열등했다.The double-sided adhesive tape of Comparative Example 6 was inferior in initial adhesive strength compared to the double-sided adhesive tapes of Examples 3 and 4. In addition, the failure modes (Na) and (Nb) were both cohesive failure, and the cohesive force of the pressure-sensitive adhesive layer was inferior.
비교예 7은 비교예 3의 점착제를 기재 B에 적용한 예이다. 그 결과, 비교 예 7에서는 비교 예 6보다 몇 가지 항목이 향상되었다. 그러나, 실시예 3 및 4보다 초기 점착력은 뒤떨어졌다.Comparative Example 7 is an example of applying the adhesive of Comparative Example 3 to the base B. As a result, in Comparative Example 7, several items were improved compared to Comparative Example 6. However, the initial adhesive force was inferior to Examples 3 and 4.
본 발명에 관한 점착 테이프는, 예를 들면, 스마트 폰 등의 소형 휴대 전자 기기의 표시 패널과 케이싱의 접합이나, 케이싱 내부의 부품 고정 등의 용도에 적합하게 사용할 수 있다.The adhesive tape which concerns on this invention can be used suitably for uses, such as bonding of the display panel of small portable electronic devices, such as a smart phone, and a casing, and fixing of components inside a casing, for example.
Claims (5)
(메트)아크릴산알콕시알킬에스테르를 20질량부 이상, 40질량부 미만,
카르복실산기 함유 (메트)아크릴 단량체를 10질량부 이상, 25질량부 미만,
하기 식 1에 의해 나타나는 (메트)아크릴산알킬에스테르를 5질량부 이상, 20질량부 미만, 및,
하기 식 2에 의해 나타나는 (메트)아크릴산알킬에스테르를 30질량부 이상, 50질량부 미만(이상의 각 단량체의 합계를 100질량부로 한다) 포함하는 아크릴계 공중합체로서,
2관능 이상의 이소시아네이트기 함유 화합물 및 2관능 이상의 글리시딜기 함유 화합물의 한쪽 또는 양쪽을 가교제로서 사용함으로써 가교 구조가 형성되고,
중량 평균 분자량이 20만 이상, 45만 미만인 상기 아크릴계 공중합체를 함유하는 점착제 조성물이 점착제로서 사용된 점착 테이프.
(식 1 중, R1은 CH2=CH- 또는 CH2=C(CH3)-를 나타내고, R2는 탄소 원자수가 1~3의 알킬기, 시클로헥실기 또는 이소보르닐기를 나타낸다.)
(식 2 중, R3은 CH2=CH- 또는 CH2=C(CH3)-를 나타내고, R4는 탄소 원자수가 4~12의 알킬기를 나타낸다.)A monomer composition comprising:
(meth)acrylic acid alkoxyalkyl ester 20 parts by mass or more and less than 40 parts by mass;
10 parts by mass or more and less than 25 parts by mass of a carboxylic acid group-containing (meth)acrylic monomer;
5 mass parts or more and less than 20 mass parts of (meth)acrylic acid alkylester represented by following formula 1, and,
An acrylic copolymer containing 30 parts by mass or more and less than 50 parts by mass of (meth)acrylic acid alkylester represented by the following formula 2 (the sum of the above monomers is 100 parts by mass),
A crosslinked structure is formed by using one or both of a bifunctional or higher functional isocyanate group-containing compound and a bifunctional or higher functional glycidyl group-containing compound as a crosslinking agent,
An adhesive tape in which a pressure-sensitive adhesive composition containing the acrylic copolymer having a weight average molecular weight of 200,000 or more and less than 450,000 is used as the pressure-sensitive adhesive.
(In Formula 1, R 1 represents CH 2 =CH- or CH 2 =C(CH 3 )-, and R 2 represents an alkyl group having 1 to 3 carbon atoms, a cyclohexyl group, or an isobornyl group.)
(In Formula 2, R 3 represents CH 2 =CH- or CH 2 =C(CH 3 )-, and R 4 represents an alkyl group having 4 to 12 carbon atoms.)
상기 점착제 조성물이 점착 부여 수지를 더 포함하는 점착 테이프.According to claim 1,
The adhesive tape in which the said adhesive composition further contains a tackifying resin.
점착제 조성물이 실란 커플링제를 추가로 포함하는 점착 테이프.According to claim 1,
An adhesive tape wherein the pressure-sensitive adhesive composition further comprises a silane coupling agent.
점착제 조성물이 산화 방지제를 추가로 포함하는 점착 테이프.According to claim 1,
An adhesive tape wherein the pressure-sensitive adhesive composition further comprises an antioxidant.
상기 점착 테이프는 추가로 기재를 갖고, 상기 점착제 조성물을 사용하여 상기 기재의 한면 또는 양면에 점착제층이 형성되는 것을 특징으로 하는 점착 테이프.According to claim 1,
The adhesive tape further has a substrate, and an adhesive layer is formed on one or both sides of the substrate by using the pressure-sensitive adhesive composition.
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JP2009215355A (en) | 2008-03-07 | 2009-09-24 | Dic Corp | Oilproof double-sided adhesive tape |
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JPH11241053A (en) * | 1998-02-26 | 1999-09-07 | Oji Paper Co Ltd | Adhesive sheet and tape |
JPH11246828A (en) * | 1998-02-27 | 1999-09-14 | Oji Paper Co Ltd | Re-releasable tacky sheet |
JP2001172580A (en) * | 1999-12-22 | 2001-06-26 | Oji Paper Co Ltd | Pressure sensitive adhesive sheet or pressure sensitive adhesive tape |
JP3755364B2 (en) * | 1999-12-22 | 2006-03-15 | 王子製紙株式会社 | Adhesive sheet or adhesive tape |
JP2006036911A (en) * | 2004-07-27 | 2006-02-09 | Sekisui Chem Co Ltd | Adhesive tape |
JP2008001739A (en) | 2006-06-20 | 2008-01-10 | Bridgestone Corp | Adhesive composition for electronic display, adhesive layer for electronic display and adhesive filter for electronic display |
KR101552741B1 (en) * | 2010-04-05 | 2015-09-11 | (주)엘지하우시스 | Pressure-sensitive adhesive composition for touch panel, pressure-sensitive adhesive film and touch panel |
JP5337172B2 (en) * | 2011-01-04 | 2013-11-06 | リンテック株式会社 | Method for producing pressure-sensitive adhesive composition for adhesive bandage |
JP2017058422A (en) * | 2015-09-15 | 2017-03-23 | 綜研化学株式会社 | Polarizing plate with pressure-sensitive adhesive layer |
JP6724542B2 (en) * | 2016-05-16 | 2020-07-15 | 東洋インキScホールディングス株式会社 | Adhesive and adhesive tape |
JP6849533B2 (en) * | 2017-05-30 | 2021-03-24 | 日東電工株式会社 | Adhesive sheet |
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JP2009215355A (en) | 2008-03-07 | 2009-09-24 | Dic Corp | Oilproof double-sided adhesive tape |
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CN115244151B (en) | 2023-12-12 |
WO2021176641A1 (en) | 2021-09-10 |
JP7395709B2 (en) | 2023-12-11 |
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TW202140585A (en) | 2021-11-01 |
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