JP2020125499A - Adhesion method - Google Patents

Abstract

To provide an adhesion method capable of adhering a first adherend with a second adherend easily and strongly, an adhesion structure to be adhered by the adhesion method, and an adhesive kit to be used for the adhesion method.SOLUTION: An adhesion method includes: a step (1) of disposing a tackifying adhesive layer 1 on a first adherend 2; a step (2) of disposing, on a second adherend 4, a curative layer 3 capable of curing the tackifying adhesive layer 1 through contacting and reacting with the tackifying adhesive layer 1; and a step (3) of making the tackifying adhesive layer 1 contact with the curative layer 3 so that they are held between the first adherend 2 and the second adherend 4.SELECTED DRAWING: Figure 1

Description

The present invention relates to a bonding method, a bonding structure, and a bonding kit, and more particularly to a bonding method, a bonding structure bonded by the bonding method, and a bonding kit used for the bonding method.

Conventionally, as a bonding method, a method of using a two-component adhesive in which two liquid agents including a main agent (A liquid) and a curing agent (B liquid) are mixed and used is known (for example, Patent Document 1 below). reference.).

In the bonding method described in Patent Document 1, immediately before use, the main agent and the curing agent are each weighed and mixed to prepare a mixed solution. The mixed liquid is applied to one resin plate to form a coating film, and the one resin plate and another resin plate are bonded together via the coating film.

After that, in the coating film, the base material and the curing agent react with each other, and the base material is cured to firmly bond the two resin plates.

JP, 2000-336333, A

However, in the bonding method using the two-component adhesive described in Patent Document 1, it is necessary to measure and mix the main component and the curing agent immediately before use. Therefore, there is a problem that the process becomes complicated.

An object of the present invention is to provide an adhesion method capable of simply and firmly adhering a first adherend and a second adherend, and by the adhesion method, the first adherend and the second adherend are adhered to each other. Another object of the present invention is to provide an adhesive structure and an adhesive kit used for the adhesive method.

[1] In the present invention, the step (1) of disposing an adhesive/adhesive layer on a first adherend, curing the adhesive/adhesive layer by contacting and reacting with the adhesive/adhesive layer. (2) arranging a curing agent layer capable of forming on the second adherend, and the adhesive layer and the curing agent layer, which are the first adherend and the second adherend. It is a bonding method characterized by comprising a step (3) of contacting so as to be sandwiched by the body.

According to this bonding method, in the step (1), the adhesive layer is arranged on the first adherend, and in the step (2), the curing agent layer is arranged on the second adherend. ), the adhesive layer and the curing agent layer are brought into contact with each other so as to be sandwiched between the first adherend and the second adherend. The first adherend and the second adherend can be easily and firmly adhered to each other without weighing and mixing the curing agent.

[2] The present invention provides the pressure-sensitive adhesive when the pressure-sensitive adhesive layer is peeled from the aluminum plate at 90 degrees at a speed of 300 mm/min after the pressure-sensitive adhesive layer is attached to the aluminum plate. The peeling adhesive force of the agent layer includes the adhesion method according to the above [1], which is 1.0 N/20 mm or more.

According to this bonding method, since the peeling adhesive strength of the tacky-adhesive layer is at least the above lower limit, the tacky-adhesive layer is excellent in tackiness.

[3] The present invention provides the above-mentioned [1] or [1], wherein the shear adhesive force of the cured layer formed by the reaction between the adhesive layer and the curing agent layer measured by the following test is 1.0 MPa or more. 2] is included.

Test: The adhesive layer is sandwiched between two release-treated polyethylene terephthalate films and left at room temperature for 1 day. Thereafter, one of the polyethylene terephthalate films is peeled from the adhesive/adhesive layer, the peeled adhesive/adhesive layer is arranged on a first slate plate, and then the other polyethylene terephthalate film is adhered/adhered. Peel from the agent layer. Separately, the curing agent layer is arranged on the second slate plate. Then, the adhesive layer and the curing agent layer are brought into contact with each other so that they are sandwiched between the first slate plate and the second slate plate, and allowed to stand for 24 hours to form a curing layer, and thereafter. , The first slate plate and the second slate plate are pulled in the shearing direction at a speed of 5 mm/min, and the strength when the two slate plates are peeled off is defined as the shear adhesive force.

According to this bonding method, since the shear adhesive strength of the hardened layer is equal to or more than the above lower limit, the first adherend and the second adherend can be bonded more firmly.

[4] The present invention includes the bonding method according to any one of the above [1] to [3], wherein the curing agent layer contains 10% by mass or more of a curing agent.

According to this bonding method, since the curing agent layer contains the curing agent in the above-mentioned lower limit or more, the first adherend and the second adherend can be more firmly adhered.

[5] The present invention includes the bonding method according to any one of the above [1] to [4], wherein the adhesive/adhesive layer contains an epoxy resin as a main component.

According to this bonding method, since the adhesive layer contains the epoxy resin as a main component, it is possible to firmly bond the first adherend and the second adherend.

[6] The present invention includes the bonding method according to any one of the above [1] to [5], wherein in the step (3), the adhesive layer is cured at room temperature.

According to this bonding method, in the step (3), since the adhesive layer is cured at room temperature, heating for curing the adhesive layer is not required, and the first adherend and the second adherend are not required. The adhered body can be more easily adhered.

[7] The present invention is characterized by comprising a tacky-adhesive layer and a curing agent layer capable of curing the tacky-adhesive layer by contacting and reacting with the tacky-adhesive layer. It is an adhesive kit.

According to this adhesive kit, if the tacky adhesive layer and the curing agent layer are brought into contact with each other so as to be sandwiched between the first adherend and the second adherend, the first adherend and the first adherend are contacted with each other. (2) The adherend can be easily and firmly adhered.

[8] The present invention provides a first adherend, a second adherend arranged to face the first adherend, and a cured layer sandwiched between the first adherend and the second adherend. And the cured layer is a cured layer formed by a reaction between the adhesive layer and the curing agent layer.

According to this adhesive structure, the first adherend and the second adherend are firmly adhered by the cured layer.

According to the bonding method of the present invention, the first adherend and the second adherend can be firmly bonded by a simple method of bringing the adhesive layer and the curing agent layer into contact with each other.

According to the adhesive kit of the present invention, the first adherend and the second adherend can be easily and firmly adhered.

According to the adhesive structure of the present invention, since the adhesive layer provided so as to be sandwiched between the first adherend and the second adherend and the curing layer by the reaction between the adhesive layer and the curing agent layer are provided, It is possible to firmly adhere the adherend and the second adherent.

FIG. 1A and FIG. 1B are process diagrams illustrating an embodiment of the bonding method of the present invention. FIG. 1A shows a process (1) of arranging an adhesive layer on a first adherend and curing. The process (2) which arrange|positions an agent layer to a 2nd to-be-adhered body is shown, and FIG. As shown in FIG. 2A to 2D are process diagrams for more specifically explaining the embodiment shown in FIGS. 1A and 1B, and FIG. 2A shows a process for preparing an adhesive layer and a curing agent component, FIG. 2B shows the step of transferring the adhesive layer to the first adherend, FIG. 2C shows the step of applying the curing agent component to the second adherend, and FIG. 2D shows the first adherend. The process of superposing the body and the second adherend is shown. 3A to 3C are process diagrams illustrating a modified example of the embodiment of FIGS. 1A and 1B, and FIG. 3A shows a process (1) of arranging an adhesive layer on a first adherend, FIG. 3B shows a step of disposing the curing agent layer on the adhesive layer, and FIG. 3C shows a step (3) of disposing the second adherend on the curing agent layer.

1. One Embodiment of Bonding Method One embodiment of the bonding method of the present invention will be described with reference to FIGS. 1A and 1B.

This adhesion method includes a step (1) of arranging the adhesive layer 1 on the first adherend 2 (see FIG. 1A), in which the adhesive layer 1 is contacted with and reacted with the adhesive layer 1. The step (2) of disposing the curing agent layer 3 capable of curing 1 on the second adherend 4 (see FIG. 1A), and the adhesive layer 1 and the curing agent layer 3, The step (3) (see FIG. 1B) of bringing the first and second adherends 2 and 4 into contact with each other is provided.

Each step will be described below.

1-1. Process (1)
In step (1), as shown in FIG. 1A, the adhesive layer 1 is arranged on the first adherend 2.

The pressure-sensitive adhesive layer 1 is a layer (sheet) that is cured by coming into contact with the curing agent layer 3 and reacting with the curing agent layer 3. The adhesive layer 1 extends in the plane direction (direction orthogonal to the thickness direction) and has a flat front surface and a back surface. And has a substantially flat plate shape.

In order to arrange the pressure-sensitive adhesive layer 1 on the first adherend 2, for example, first, the pressure-sensitive adhesive layer 1 is formed on the surface of the release film 10.

In order to form the pressure-sensitive adhesive layer 1 on the surface of the release film 10, first, a pressure-sensitive adhesive composition is prepared.

The tacky-adhesive composition is not particularly limited as long as it is a main component of a two-pack type adhesive capable of forming a layer, and for example, a silicone compound, for example, a polyol compound such as polypropylene glycol, for example, a urethane resin. Examples include epoxy resins. The adhesive composition preferably contains an epoxy resin as a main component. Thereby, the 1st to-be-adhered body 2 and the 2nd to-be-adhered body 4 can be adhere|attached easily and firmly.

Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol A type epoxy resin, and other bisphenol type epoxy resins, such as naphthalene type epoxy resin, for example, biphenyl type. Epoxy resin, for example, dicyclo type epoxy resin, for example, alicyclic epoxy resin, for example, triglycidyl isocyanurate epoxy resin, for example, hydantoin epoxy resin, for example, glycidyl ether type epoxy resin, for example, glycidyl amino type epoxy resin, etc. Is mentioned.

The epoxy resin is preferably a bisphenol epoxy resin, more preferably a bisphenol A type epoxy resin.

The epoxy resins can be used alone or in combination of two or more.

The epoxy resin may be in a liquid form, a semi-solid form, or a solid form at room temperature, but preferably, the semi-solid epoxy resin is used alone, or the liquid epoxy resin and the solid epoxy are used. It may be used in combination with a resin. Thereby, the tacky layered tacky adhesive layer 1 can be reliably formed from the tacky adhesive composition.

The epoxy resin which is liquid at room temperature is specifically liquid at 25°C. The viscosity of the liquid epoxy resin at 25° C. is, for example, 30 Pa·s or more, preferably 80 Pa·s or more, and for example, 500 Pa·s or less, preferably 300 Pa·s or less.

The epoxy resin that is solid at room temperature is specifically solid at 25°C. The softening point of the solid epoxy resin is, for example, 70° C. or higher, preferably 75° C. or higher.

The mixing ratio of the liquid epoxy resin to the solid epoxy resin (liquid epoxy resin/solid epoxy resin) is, for example, 1.0 or more, preferably 1.5 or more, and, for example, 4. It is 0 or less, preferably 3.0 or less.

When the mixing ratio of the liquid epoxy resin to the solid epoxy resin is at least the above lower limit, the viscosity of the tacky-adhesive composition is reduced to prevent the occurrence of unevenness of the coating film, and to obtain a uniform viscosity. The adhesive layer 1 can be obtained. When the mixing ratio of the liquid epoxy resin to the solid epoxy resin is at most the above upper limit, a tacky layered tacky adhesive layer can be obtained.

The mixing ratio of the epoxy resin is set to a ratio of the epoxy resin as a main component in the adhesive composition, and specifically, for example, 80% by mass or more based on the adhesive composition. , Preferably 90% by mass or more, and for example, 100% by mass or less.

Preferably, the adhesive composition comprises only an epoxy resin, that is, the mixing ratio of the epoxy resin to the adhesive composition is 100% by mass.

If necessary, an acrylic polymer may be added to the adhesive composition.

This can improve the cohesive force of the adhesive composition.

The acrylic polymer is obtained by reacting a monomer component containing (meth)acrylate.

The (meth)acrylate is an alkylmethacrylate and/or an alkylacrylate, and specifically, methyl(meth)acrylate, ethyl(meth)acrylate, propyl(meth)acrylate, isopropyl(meth)acrylate, butyl(meth)acrylate. ) Acrylate, isobutyl(meth)acrylate, s-butyl(meth)acrylate, t-butyl(meth)acrylate, n-butyl(meth)acrylate, pentyl(meth)acrylate, isopentyl(meth)acrylate, hexyl(meth)acrylate. , Heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate Undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, octadecyl (meth)acrylate, nonadecyl Examples thereof include alkyl (meth)acrylates having 1 to 20 carbon atoms such as (meth)acrylate and eicosyl (meth)acrylate.

The (meth)acrylate is preferably an alkyl(meth)acrylate having 2 to 14 carbon atoms, and more preferably an alkyl(meth)acrylate having 4 to 9 carbon atoms.

The (meth)acrylate can be used alone or in combination of two or more kinds.

The blending ratio of the (meth)acrylate is, for example, 70% by mass or more, preferably 80% by mass or more, and for example, 99% by mass or less, preferably 98% by mass or less with respect to the monomer component. ..

The monomer component may further contain a copolymerizable monomer copolymerizable with (meth)acrylate.

Examples of the copolymerizable monomer include carboxyl group-containing monomers such as (meth)acrylic acid, itaconic acid, maleic acid, crotonic acid, and maleic anhydride, or acid anhydrides thereof, such as 2-hydroxyethyl (meth)acrylate. Hydroxyl group-containing (meth)acrylate such as 3-hydroxypropyl (meth)acrylate, for example, (meth)acrylamide, N,N-dimethyl (meth)acrylamide, N-methylol (meth)acrylamide, N-methoxymethyl (meth) Amide group-containing monomers such as acrylamide and N-butoxymethyl (meth)acrylamide, vinyl esters such as vinyl acetate, aromatic vinyl compounds such as styrene and vinyltoluene, such as (meth)acrylonitrile, such as N. -(Meth)acryloylmorpholine, such as N-vinyl-2-pyrrolidone.

The copolymerizable monomer is preferably a carboxyl group-containing monomer, a hydroxyl group-containing (meth)acrylate, more preferably (meth)acrylic acid or 2-hydroxyethyl (meth)acrylate.

These copolymerizable monomers can be used alone or in combination of two or more kinds. Preferably, a combination of a carboxyl group-containing monomer and a hydroxyl group-containing (meth)acrylate is used, more preferably a combination of (meth)acrylic acid and 2-hydroxyethyl (meth)acrylate is used.

The blending ratio of the copolymerizable monomer is, for example, 0.1 parts by mass or more, preferably 0.3 parts by mass or more, and for example, 15 parts by mass or less, relative to 100 parts by mass of (meth)acrylate. It is preferably 10 parts by mass or less.

In order to react the monomer component, for example, (meth)acrylate and, if necessary, a copolymerizable monomer are mixed to prepare a monomer component, which is subjected to, for example, solution polymerization, bulk polymerization, emulsion polymerization, various radicals. It is prepared by a known polymerization method such as polymerization.

The polymerization method is preferably solution polymerization.

In solution polymerization, for example, a solvent is mixed with a monomer component and a polymerization initiator to prepare a monomer solution, and then the monomer solution is heated.

Examples of the solvent include organic solvents. Examples of the organic solvent include aromatic solvents such as toluene, benzene and xylene, ether solvents such as ethyl acetate, ketone solvents such as acetone and methyl ethyl ketone, and ester solvents such as ethyl acetate. And amide solvents such as N,N-dimethylformamide. The solvent may be used alone or in combination of two or more kinds, and preferably, an aromatic solvent and an ether solvent are used in combination. The mixing ratio of the solvent is, for example, 10 parts by mass or more, preferably 50 parts by mass or more, and for example, 1000 parts by mass or less, preferably 500 parts by mass or less, relative to 100 parts by mass of the monomer component. ..

Examples of the polymerization initiator include peroxide-based polymerization initiators and azo-based polymerization initiators.

Examples of peroxide-based polymerization initiators include organic peroxides such as peroxycarbonates, ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, diacyl peroxides, and peroxyesters.

Examples of the azo-based polymerization initiator include 2,2′-azobisisobutyronitrile, 2,2′-azobis(2-methylbutyronitrile) and 2,2′-azobis(2,4-dimethylvalero). Nitriles) and azo compounds such as dimethyl 2,2′-azobisisobutyrate.

As the polymerization initiator, an azo-based polymerization initiator is preferable.

The mixing ratio of the polymerization initiator is, for example, 0.01 parts by mass or more, preferably 0.05 parts by mass or more, and for example, 5 parts by mass or less, preferably 100 parts by mass with respect to 100 parts by mass of the monomer component. It is 3 parts by mass or less.

The heating temperature is, for example, 50° C. or more and 80° C. or less, and the heating time is, for example, 1 hour or more and 24 hours or less.

Thereby, the monomer component is polymerized to obtain an acrylic polymer solution containing an acrylic polymer.

In the acrylic polymer solution, the blending ratio of the acrylic polymer is, for example, 20 parts by mass or more, preferably 30 parts by mass or more, and for example, 90 parts by mass or less with respect to 100 parts by mass of the adhesive composition. It is preferably mixed with the epoxy resin so that the amount is 80 parts by mass or less. The mixing ratio of the acrylic polymer is, for example, 50 parts by mass or more, preferably 150 parts by mass or more, more preferably 200 parts by mass or more, and, for example, 300 parts by mass with respect to 100 parts by mass of the epoxy resin. It is less than or equal to parts by mass, preferably less than or equal to 250 parts by mass.

When the blending ratio of the acrylic polymer is at least the above lower limit, it is possible to improve the cohesive force of the pressure-sensitive adhesive composition, and thus the adhesive force, and improve the peeling adhesive force of the pressure-sensitive adhesive layer 1. it can.

If the blending ratio of the acrylic polymer is not more than the above upper limit, it can be cured.

A small amount of a curing agent can be added to the adhesive composition.

Thereby, the cohesive force of the adhesive layer 1 can be improved.

Examples of the curing agent will be described later.

The mixing ratio of the curing agent is adjusted so as to improve the peeling adhesive strength of the tacky-adhesive layer 1, while slightly hardening (not completely curing) the tacky-adhesive composition. The mixing ratio of the curing agent is specifically, for example, 0.05 parts by mass or more, preferably 0.15 parts by mass or more, and for example, 5 parts by mass or less, relative to 100 parts by mass of the epoxy resin. , And preferably 3 parts by mass or less. Further, when the curing agent is an imidazole compound described below, the mixing ratio thereof is specifically, for example, 0.05 parts by mass or more, and preferably 0.15 parts by mass with respect to 100 parts by mass of the epoxy resin. It is at least 5 parts by mass, and is, for example, at most 5 parts by mass, preferably at most 3 parts by mass. In addition, when the curing agent is an amine compound described later, the mixing ratio thereof is specifically 30 parts by mass or less, preferably 15 parts by mass or less, relative to 100 parts by mass of the epoxy resin. More preferably, it is 10 parts by mass or less.

When the mixing ratio of the curing agent is at least the above lower limit, the peeling adhesive strength of the adhesive layer 1 can be improved. When the compounding ratio of the curing agent is not more than the above upper limit, it is possible to prevent the pressure-sensitive adhesive layer 1 from being completely cured, and to suppress a decrease in reactivity between the pressure-sensitive adhesive layer 1 and the curing agent layer 3. The cured layer 5 described later can be reliably formed.

To obtain the adhesive composition, for example, an epoxy resin and, if necessary, an acrylic polymer (acrylic polymer solution) and/or a curing agent are mixed, and if necessary, diluted with a solvent to prepare a varnish. To do.

Any solvent may be used as long as it can dissolve the adhesive composition, and examples thereof include the above-mentioned solvents. As the solvent, preferably, a ketone solvent is used.

The concentration of the adhesive composition in the varnish is, for example, 20 mass% or more, preferably 40 mass% or more, and for example, 80 mass% or less, preferably 70 mass% or less.

When an acrylic polymer is added to the adhesive composition, a cross-linking agent may be added when the adhesive composition is prepared.

Examples of the cross-linking agent include an isocyanate cross-linking agent, an aziridine cross-linking agent, an epoxy cross-linking agent, and a metal chelate cross-linking agent, and an isocyanate cross-linking agent is preferable.

Examples of the isocyanate-based crosslinking agent include aromatic diisocyanates such as tolylene diisocyanate and xylene diisocyanate, for example, alicyclic diisocyanates such as isophorone diisocyanate, and aliphatic diisocyanates such as hexamethylene diisocyanate, for example, modified products of these isocyanates. (Specifically, tolylene diisocyanate adduct of trimethylolpropane, etc.) and the like.

The cross-linking agent preferably includes a modified product of isocyanate.

The mixing ratio of the crosslinking agent is, for example, 1 part by mass or more, preferably 5 parts by mass or more, and for example, 20 parts by mass or less, preferably 15 parts by mass or less, relative to 100 parts by mass of the acrylic polymer. Is.

Thereby, the adhesive composition is prepared.

Then, the adhesive composition is applied to the surface of the release film 10 and then dried.

The release film 10 is, for example, a release sheet having a substantially rectangular flat plate shape, and has an upper surface and a lower surface formed to be flat.

The release film 10 is, for example, a vinyl polymer such as a polyolefin (specifically, polyethylene or polypropylene) or an ethylene/vinyl acetate copolymer (EVA), for example, a polyester such as polyethylene terephthalate or a polycarbonate, for example, polytetrafluoro. The film is formed of a resin material such as a fluororesin such as ethylene. The release film 10 can also be formed of, for example, a metal material such as iron, aluminum, or stainless.

The release film 10 is preferably a polyester film, more preferably a polyethylene terephthalate film.

The surface of the release film 10 may be subjected to an appropriate release treatment, if necessary.

The thickness of the release film 10 is, for example, 10 μm or more and 1000 μm or less.

Examples of the coating method include a doctor blade method, a roll method, a screen method, and a gravure method.

As heating conditions, the heating temperature is, for example, 70° C. or higher and 130° C. or lower, and the heating time is, for example, 1 minute or longer and 5 minutes or shorter.

When the adhesive composition contains a cross-linking agent, it is further heated after the above-mentioned heating to cross-link the acrylic polymer with the cross-linking agent. The temperature in the further heating is 30° C. or higher and 60° C. or lower, and the time is, for example, 1 hour or longer, preferably 1 day or longer.

When the adhesive composition contains a curing agent, the heating temperature is 70° C. or higher and 160° C. or lower, and the heating time is 5 minutes or longer and 5 hours or shorter. This causes all of the curing agent to react with some of the epoxy resin.

Thereby, the adhesive layer 1 is formed on the surface of the release film 10 from the adhesive composition.

The thickness of the adhesive layer 1 is, for example, 1 μm or more, preferably 5 μm or more, more preferably 10 μm or more, and for example, 1000 μm or less, preferably 500 μm or less, more preferably 100 μm or less. is there.

Further, if necessary, another release film (not shown) may be arranged (contacted) on the surface of the adhesive layer 1 (the surface opposite to the contact surface that contacts the release film 10).

That is, the adhesive layer 1 can be sandwiched between two release films.

And this adhesive layer 1 has pressure sensitive adhesiveness (adhesiveness or initial adhesive force).

Specifically, the peeling adhesive force of the adhesive layer 1 to the aluminum plate is, for example, 1.0 N/20 mm or more, preferably 2.4 N/20 mm or more, and more preferably 3.0 N/20 mm or more. Yes, and is, for example, 10 N/20 mm or less.

When the peel adhesion strength of the adhesive/bonding agent layer 1 to the aluminum plate is equal to or more than the above lower limit, the adhesive/bonding agent layer 1 is excellent in pressure-sensitive adhesiveness.

The peeling adhesive strength of the tacky-adhesive layer 1 was obtained by sticking the tacky-adhesive layer 1 to an aluminum plate and then peeling the tacky-adhesive layer 1 from the aluminum plate at a speed of 300 mm/min at 90 degrees. At that time, it is obtained as the peeling adhesive force of the adhesive layer.

Further, with respect to the adhesive layer 1, the time (peeling time) until the polyethylene terephthalate film is peeled off in a constant load test for 24 hours is, for example, 1 hour or longer, preferably 5 hours or longer, and, for example, , 24 hours or less.

When the peeling time is at least the above lower limit, the pressure-sensitive adhesive layer 1 has excellent pressure-sensitive adhesiveness.

The constant load test will be described in a later example.

Then, the adhesive layer 1 is transferred from the release film 10 to the surface of the first adherend 2. Specifically, first, the pressure-sensitive adhesive layer 1 is brought into contact with the first adherend 2, and subsequently, as shown by the arrow in FIG. 1A, the release film 10 is peeled off from the pressure-sensitive adhesive layer 1.

Further, after the step (2) and immediately before the step (3), the release film 10 can be peeled off from the adhesive layer 1.

When the adhesive layer 1 is sandwiched between two release films, for example, one release film is first released. Next, the exposed surface of the adhesive/adhesive layer 1 exposed is brought into contact with the first adherend 2, and subsequently, the release film 10 is peeled off from the adhesive/adhesive layer 1 as indicated by an arrow in FIG. 1A.

The first adherend 2 is not particularly limited, and examples thereof include metal, glass, plastic, slate, mortar, concrete, rubber, wood, leather, cloth, paper and the like.

Preferable examples of the first adherend 2 include slate, mortar and concrete.

Thereby, as shown in FIG. 1A, the adhesive layer 1 is arranged on the first adherend 2.

1-2. Process (2)
The curing agent layer 3 is a layer (sheet) capable of curing the adhesive layer 1 by contacting and reacting with the adhesive layer 1, and in the plane direction (direction orthogonal to the thickness direction). It has a substantially flat plate shape extending along and having a flat front surface and a back surface.

In the step (2), as shown in FIG. 1A, the curing agent layer 3 is arranged on the second adherend 4.

In order to arrange the curing agent layer 3 on the second adherend 4, for example, first, the curing agent component is prepared.

The curing agent component contains a curing agent.

The curing agent is not particularly limited as long as it is a curing agent for a two-component adhesive capable of forming a layer, and when the adhesive composition is a silicone compound, a silicone compound and the like can be mentioned. When the adhesive composition is a polyol compound, examples thereof include isocyanate, and when it is a urethane resin, examples thereof include a urethane resin curing agent, and when it is an epoxy resin, for example, imidazole compound, amine compound. Examples include epoxy resin curing agents.

Examples of the imidazole compound include methyl imidazole, 2-ethyl-4-methyl imidazole, 1-isobutyl-2-methyl imidazole, 1-benzyl-2-methyl imidazole, 2-ethyl-4-methyl imidazole, ethyl imidazole and isopropyl. Imidazole, 2,4-dimethylimidazole, phenylimidazole, undecylimidazole, heptadecylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5. -Hydroxymethyl imidazole and the like, and preferably 1-isobutyl-2-methyl imidazole, 1-benzyl-2-methyl imidazole, 2-ethyl-4-methyl imidazole, more preferably 1-isobutyl-2-methyl. Examples thereof include imidazole and 1-benzyl-2-methylimidazole, and more preferably 1-isobutyl-2-methylimidazole.

Examples of the amine compound include ethylenediamine, propylenediamine, diethylenetriamine, triethylenetetramine, amine adducts thereof, metaphenylenediamine, diaminodiphenylmethane, and diaminodiphenylsulfone.

The curing agent preferably includes an imidazole compound.

The curing agents can be used alone or in combination of two or more.

The mixing ratio of the curing agent is, for example, 10% by mass or more, preferably 30% by mass or more, more preferably 50% by mass or more, further preferably 80% by mass or more, and particularly preferably, based on the curing agent component. , 90 mass% or more, and for example, 100 mass% or less. When the compounding ratio of the curing agent is at least the above lower limit, the adhesive layer 1 has excellent adhesiveness.

Preferably, the curing agent component consists only of the curing agent, that is, the proportion of the curing agent is 100% by weight with respect to the curing agent component.

The curing agent component may be blended with the above epoxy resin, if necessary.

The mixing ratio of the epoxy resin is 30 parts by mass or more, preferably 40 parts by mass or more, and for example, 70 parts by mass or less, preferably 60 parts by mass or less, relative to 100 parts by mass of the curing agent.

When the mixing ratio of the epoxy resin is not more than the above upper limit, in the step (2), almost all of the curing agent in the curing agent layer 3 is prevented from reacting with the epoxy resin, and the curing is performed in the step (3). It is possible to prevent the reactivity of the agent layer 3 (curing agent thereof) with respect to the adhesive layer 1 (epoxy resin thereof) from decreasing.

To prepare the curing agent component, a curing agent and, if necessary, an epoxy resin are mixed to prepare a varnish.

If the curing agent is solid, the curing agent is dissolved with a solvent to prepare a varnish, if necessary.

Any solvent may be used as long as it can dissolve the adhesive composition, and examples thereof include the above-mentioned solvents.

The concentration of the curing agent component in the varnish is, for example, 10% by mass or more, preferably 20% by mass or more, and for example, 90% by mass or less, preferably 50% by mass or less.

Thereby, the curing agent component is prepared.

Then, the curing agent component is applied to the second adherend 4. Specifically, the varnish of the curing agent component is applied to the second adherend 4.

The second adherend 4 is not particularly limited, and examples thereof include the adherends described above.

Examples of the coating method include the methods described above.

Thereafter, if necessary, the excess varnish of the curing agent component on the surface of the second adherend 4 is removed. For example, the excess varnish of the curing agent component on the surface of the second adherend 4 is wiped off.

Then, when the varnish contains a solvent, the varnish is dried to remove the solvent.

As a result, the curing agent layer 3 is formed on the surface of the second adherend 4, and the curing agent layer 3 is arranged on the second adherend 4.

The thickness of the curing agent layer 3 is, for example, 1 μm or more, preferably 5 μm or more, more preferably 10 μm or more, and for example, 1000 μm or less, preferably 800 μm or less, more preferably 500 μm or less.

As a result, an adhesive kit 7 including the tacky adhesive layer 1 arranged on the first adherend 2 and the curing agent layer 3 arranged on the second adherend 4 is configured.

1-3. Process (3)
In step (3), as shown in FIG. 1B, the adhesive layer 1 and the curing agent layer 3 are brought into contact with each other so that they are sandwiched between the first adherend 2 and the second adherend 4. ..

That is, the 1st to-be-adhered body 2 and the 2nd to-be-adhered body 4 are piled up so that the adhesive layer 1 and the hardening agent layer 3 may mutually contact.

Then, the adhesive layer 1 and the curing agent layer 3 contact and react with each other.

The reaction temperature is, for example, normal temperature.

If necessary, the adhesive layer 1 and the curing agent layer 3 may be heated, and the heating temperature is, for example, 50° C. or higher, preferably 70° C. or higher, and, for example, 130° C. or lower. , And preferably 110° C. or lower.

The reaction temperature is preferably room temperature. The normal temperature is a temperature at which the above-mentioned heating (for example, heating at 50° C. or more) for reacting the adhesive layer 1 and the curing agent layer 3 is not performed, and for example, less than 50° C., preferably 40° C. or less. And is, for example, 10° C. or higher, preferably 20° C. or higher.

If the reaction temperature is room temperature, the heating for reacting the adhesive layer 1 and the curing agent layer 3 is not required, and the first adherend 2 and the second adherend 4 can be more easily manufactured. Can be glued.

The reaction time is, for example, 1 hour or more, preferably 12 hours or more, and for example, 96 hours or less, preferably 48 hours or less.

As a result, the adhesive layer 1 is cured and becomes the cured layer 5. Preferably, the adhesive layer 1 cures at room temperature.

In FIG. 1B, the boundary between the adhesive layer 1 and the curing agent layer 3 is formed, but in the curing layer 5, the adhesive layer 1 and the curing agent layer 3 are integrated and reacted. It is a layer, and the above boundaries do not exist.

The hardened layer 5 bonds the first adherend 2 and the second adherend 4.

The shear adhesive force of the hardened layer 5 is, for example, 0.1 MPa or more, preferably 0.4 MPa or more, more preferably 0.6 MPa or more, further preferably 0.7 MPa or more, and particularly preferably 1.0 MPa or more. Most preferably, it is 2.3 MPa or more, further 2.5 MPa or more, further 3.5 MPa or more.

When the shear adhesive strength of the hardened layer 5 is at least the above lower limit, the adhesive layer has excellent adhesiveness and can reliably adhere the first adherend 2 and the second adherend 4. it can.

The shear adhesive force of the hardened layer 5 is measured by the following method. That is, the adhesive layer 1 is sandwiched between two release-treated polyethylene terephthalate films and left at room temperature for 1 day. Thereafter, one of the polyethylene terephthalate films is peeled from the adhesive/adhesive layer 1, the peeled adhesive/adhesive layer 1 is arranged on the first slate plate, and then the other polyethylene terephthalate film is/are attached to the adhesive/adhesive layer 1. Peel off from. Separately, the curing agent layer 3 is arranged on the second slate plate. Next, the adhesive layer 1 and the curing agent layer 3 are brought into contact with each other so that they are sandwiched between the first slate plate and the second slate plate, and left for 24 hours to form the curing layer 5, and then, The strength when the first slate plate and the second slate plate are pulled in the shearing direction at a speed of 5 mm/min and the two slate plates are peeled off is obtained as the shear adhesive force.

As a result, the adhesive structure 6 is manufactured.

That is, the adhesive structure 6 includes the first adherend 2, the second adherend 4 arranged to face the first adherend 2, and the cured layer 5 sandwiched between them.

In the adhesive structure 6, the first adherend and the second adherend are firmly adhered by the cured layer 5.
2. Advantageous Effects of One Embodiment According to this bonding method, as shown in FIG. 1A, the adhesive layer 1 is arranged on the first adherend 2 in the step (1), and the adhesive layer 1 is cured in the step (2). The agent layer 3 is disposed on the second adherend 4, and in the step (3), the adhesive layer 1 and the curing agent layer 3 are disposed on the second adherend 1 as shown in FIG. 1B. Further, the first adherend 2 and the second adherend 4 can be easily and firmly adhered to each other because they are brought into contact with each other so as to be sandwiched by the second adherend 4.

That is, in this method, as shown in FIG. 2A, the adhesive layer 1 sandwiched between the two release films 10 is prepared by the method described above.

Separately, a varnish of the curing agent component is prepared, and the varnish of the curing agent component is placed in the container 8 as shown in FIG. 2A.

Thereby, as shown in FIG. 2A, the adhesive layer 1 and the curing agent component are prepared.

Then, the adhesive layer 1 and the curing agent component are transported to the construction site.

After that, one release film 10 is released, and then the adhesive layer 1 is transferred from the other release film 10 to the first adherend 2 as shown in FIG. 2B.

Separately, as shown in FIG. 2C, the varnish of the curing agent component is applied to the second adherend 4. Specifically, the curing agent component is taken out from the container 8 and the varnish of the curing agent component is applied to the second adherend 4 by, for example, spraying or brushing. Then, the varnish of the curing agent component permeates the upper end of the second adherend 4. Then, if necessary, the excess hardener component remaining on the surface of the second adherend 4 is wiped off.

As a result, as shown in FIG. 2C, the hardener layer 3 including the hardener component is formed on the upper end portion of the second adherend 4.

When the hardener component is present on the surface of the second adherend 4, this and the hardener component soaked in the upper end portion of the second adherend 4 form the hardener layer 3 (not shown). No).

Next, as shown in FIG. 2D, the first adherend 2 and the second adherend 4 are superposed so that the adhesive layer 1 and the curing agent layer 3 are in contact with each other.

Further, according to this bonding method, if the peeling adhesive strength of the tacky-adhesive layer 1 is at least the above lower limit, the tacky-adhesive layer 1 is excellent in tackiness (initial adhesion).

Further, according to this bonding method, when the shear adhesive force of the hardened layer 5 is equal to or more than the above lower limit, the first adherend 2 and the second adherend 4 can be further strongly adhered. ..

Further, according to this bonding method, if the curing agent layer 3 contains the curing agent in the above lower limit or more, the first adherend 2 and the second adherend 4 can be further firmly bonded. ..

Further, according to this bonding method, if the adhesive layer 1 contains the epoxy resin as a main component, the first adherend 2 and the second adherend 4 can be firmly adhered.

Further, according to this bonding method, in step (3), if the adhesive layer 1 is cured at room temperature, heating for curing the adhesive layer 1 is not required, and the first adherend is obtained. 2 and the second adherend 4 can be more easily bonded.

According to this adhesive kit 7, if the adhesive layer 1 and the curing agent layer 3 are brought into contact with each other so that they are sandwiched between the first adherend 2 and the second adherend 4, the The adherend 2 and the second adherend 4 can be easily and firmly adhered to each other.

According to this adhesive structure 6, the first adherend 2 and the second adherend 4 are firmly adhered by the cured layer 5.
3. Modifications Modifications of the embodiment will be described with reference to FIGS. 3A to 3C.

In addition, in the following modified examples, members corresponding to the respective units described above are denoted by the same reference numerals, and detailed description thereof will be omitted.

In one embodiment, as shown in FIG. 1A, the adhesive layer 1 and the curing agent layer 3 are arranged on the first adherend 2 and the second adherend 4, respectively. As shown in, the adhesive layer 1 and the curing agent layer 3 are sequentially arranged on the surface of the first adherend 2.

In this modified example, first, as shown in FIG. 3A, the adhesive layer 1 is arranged on the surface of the first adherend 2.

Then, as shown in FIG. 3B, the curing agent layer 3 is disposed on the surface of the adhesive/bonding agent layer 1.

In order to arrange the hardener layer 3 on the surface of the tacky adhesive layer 1, for example, a varnish of the hardener component is applied to the surface of the tacky adhesive layer 1. Alternatively, a varnish as a curing agent component is applied to the surface of a release sheet (not shown) and dried if necessary. Thereby, the curing agent layer 3 is formed on the surface of the release sheet. Then, the curing agent layer 3 is transferred from the release sheet to the surface of the adhesive/bonding agent layer 1.

Then, as shown in FIG. 3C, the second adherend 4 is arranged on the surface of the curing agent layer 3. As a result, the adhesive layer 1 and the curing agent layer 3 are sandwiched between the first adherend 2 and the second adherend 4. Then, the hardened layer 5 is formed, and thereby the bonded structure 6 to which the first adherend 2 and the second adherend 4 are adhered is manufactured.

In the above description, as shown in FIG. 3B, the adhesive layer 1 and the curing agent layer 3 are sequentially arranged on the surface of the first adherend 2. For example, although not shown, the curing agent layer 3 and the adhesive layer 1 may be sequentially arranged on the surface of the first adherend 2.

In one embodiment, as shown in FIG. 1A, the adhesive kit 7 is arranged (supported) on the adhesive layer 1 arranged (supported) on the first adherend 2 and on the second adherend 4. However, the present invention is not limited to this. That is, in the adhesive kit 7, the respective supports of the adhesive layer 1 and the curing agent layer 3 are not particularly limited.

That is, in the adhesive kit 7, both the adhesive layer 1 and the curing agent layer 3 may be formed in layers, and for example, the adhesive layer 1 and/or the curing agent layer 3 may be a release film ( It may be formed (supported) on the surface (not shown).

In addition, a plurality of adhesive/adhesive layers 1 may be laminated to form the adhesive/adhesive layer 1 as a multilayer.

Further, a plurality of curing agent layers 3 may be laminated to form the curing agent layer 3 as a multilayer.

Hereinafter, the present invention will be described more specifically with reference to Examples and Comparative Examples. The present invention is not limited to the examples and comparative examples. Further, the compounding ratios (content ratios) used in the following description, specific numerical values such as physical property values, parameters, etc. are described in the above “Modes for carrying out the invention”, and the corresponding compounding ratios ( Substitute the upper limit (value defined as "below" or "less than") or the lower limit (value defined as "greater than or equal to" "excess") such as content ratio), physical property value, parameter etc. be able to.

In addition, "part" and "%" are based on mass unless otherwise specified.
1. Production of Adhesive Layer and Preparation of Curing Agent Component Preparation Example 1
70 parts of liquid bisphenol A type epoxy resin (trade name "jER828", manufactured by Mitsubishi Chemical) and 30 parts of solid bisphenol A type epoxy resin (trade name "jER1256", manufactured by Mitsubishi Chemical) are mixed, and the concentration ( A varnish was prepared by adding and diluting methyl ethyl ketone so that the concentration of the liquid bisphenol A type epoxy resin and the solid bisphenol A type epoxy resin was 60%. This was applied to the release-treated surface of a release-treated polyethylene terephthalate film (trade name “Diafoil MRF#38”, manufactured by Mitsubishi Plastics Co., Ltd.) so that the thickness after drying was 20 μm, and the temperature was 100° C. for 1 minute. The adhesive layer was obtained by heating and drying. Then, the adhesive layer was brought into contact with another polyethylene terephthalate film so that the adhesive layer was sandwiched between two polyethylene terephthalate films.

Separately, the curing agent component was prepared as described in Table 1.

Preparation Examples 2 to 8 and Comparative Preparation Examples 3 and 4
A tacky adhesive layer and a curing agent layer were produced in the same manner as in Example 1 except that the formulation was changed as described in Table 1.

Comparative Preparation Example 1
A two-component mixed type epoxy adhesive was prepared as the adhesive composition and the curing agent component.

Comparative Preparation Example 2
An adhesive tape was prepared as the adhesive layer.
2. Evaluation 1) Sheet Formability Regarding the adhesive layers of Preparation Examples 1 to 8 and Comparative Preparation Examples 1 to 4, those that could be formed into a sheet were evaluated as ◯, and those that could not be formed into a sheet were evaluated as x. ..

The results are shown in Table 1.
2) Peel adhesion Adhesive layer was left at room temperature for 1 day.

Then, one polyethylene terephthalate film of the adhesive layer was peeled off, and a polyethylene terephthalate film having a thickness of 25 μm (trade name “Lumirror 25S10”, manufactured by Panac) was placed on the exposed adhesive layer. .. Next, this was cut into a width of 20 mm, the other polyethylene terephthalate film was peeled off, and the exposed adhesive layer was placed on an aluminum plate having a thickness of 2 mm. After the bonding, a 2 kg roller was reciprocated once to perform pressure bonding. After 30 minutes from the bonding, the peeling adhesive force was measured with a tensile compression tester (device name "TG-1kN", manufactured by Minebea) at a peeling angle of 90° and a peeling speed of 300 mm/min.

In Comparative Preparation Example 1, the prepared adhesive/adhesive layer was subjected to the above-mentioned peeling test using the liquid A of the two-component mixed type epoxy adhesive.

Comparative Preparation Example 2 was subjected to the above peeling test using an adhesive tape.

The results are shown in Table 1.
3) Constant load test The adhesive layers of Preparation Examples 1 to 8 and Comparative Preparation Examples 3 and 4 were left at room temperature for 1 day.

Then, one polyethylene terephthalate film of the adhesive layer is peeled off, and another polyethylene terephthalate film having a thickness of 25 μm (trade name “Lumirror 25S10”, manufactured by Panac Co., Ltd.) is removed on the exposed adhesive layer. I placed it. Then, this was cut into a width of 20 mm and a length of 50 mm, and the other polyethylene terephthalate film (trade name "Diafoil MRF#38" manufactured by Mitsubishi Plastics Co., Ltd.) was peeled off to expose the exposed adhesive layer. It was placed on a concrete plate (non-combustible board (Mitsubishi flexible board N, thickness 5 mm)). Then, this was pressure-bonded with a 2 kg hand roller. After pressure bonding, a constant load (12 g) was fixed to the end of the polyethylene terephthalate film. The peeling of the polyethylene terephthalate film was started at room temperature (25° C.) under a constant load so that the peeling angle was 90°. The length of 20 mm was taken as the extra length, and the time (up to 24 hours) until all the remaining 30 mm portion was peeled off was measured.

In Comparative Preparation Example 1, the adhesive solution layer prepared by using the solution A of the two-component mixed type epoxy adhesive was subjected to the above constant load test.

Comparative Preparation Example 2 was subjected to the above constant load test using an adhesive tape.

The results are shown in Table 1.
4) Shear adhesion Example 1
The adhesive layer of Preparation Example 1 was left at room temperature for 1 day.

The pressure-sensitive adhesive layer is laminated in two layers and the thickness of the pressure-sensitive adhesive layer is 40 μm, and the pressure-sensitive adhesive layer is cut into a size of width 30 mm×length 10 mm, and then one polyethylene terephthalate film is peeled off. The tip of a slate plate (JIS A 5430) having a width of 30 mm, a length of 130 mm and a thickness of 3 mm was placed on the exposed adhesive layer. Then, the other polyethylene terephthalate film was peeled off.

Separately, the curing agent component was applied to the width of 30 mm×length 10 mm at the tip of another slate plate, and then excess liquid on the surface was wiped off to form a curing agent layer on the surface of the other slate plate. After that, the two slate plates were bonded so that the adhesive layer and the curing agent layer were in contact with each other, and then the two slate plates were fixed with clips and left for 24 hours. Then, using a tensile compression tester (device name "TG-5kN", manufactured by Minebea Co., Ltd.), two slate plates were pulled in the shearing direction (length direction) at a peeling speed of 5 mm/min. The test force when one of them peeled off was measured. The shear adhesive force was calculated by the following formula.

Shear adhesive strength (MPa) = test force (N) / 300 mm ² (1)
The results are shown in Table 1.

Examples 2-8
Shear adhesive strength was measured in the same manner as in Example 1 except that the adhesive layer and the curing agent layer were changed as shown in Table 1.

The results are shown in Table 1.

Comparative Example 1
Mix the two liquids according to the method of using the adhesive and apply it to the tip of one slate plate so that the width is 30 mm and the length is 10 mm, and then attach the tip of one slate plate to the tip of another slate plate. Then, it was fixed with a clip and left for 24 hours.

The results are shown in Table 1.

Comparative example 2
The double-sided tape was cut into a piece having a width of 30 mm and a length of 10 mm, attached to the tip of one slate plate, attached to the tip of the slate plate and the tip of another slate plate, fixed with clips, and left for 24 hours.

The results are shown in Table 1.

Comparative Example 3
The shear adhesive strength was measured in the same manner as in Example 1 except that the pressure-sensitive adhesive layer was laminated in two layers to have a thickness of 40 μm.

The results are shown in Table 1.

Comparative Example 4
The shear adhesive strength was measured in the same manner as in Example 1 except that the two slate plates fixed with clips were left for 24 hours and heated at 150° C. for 20 minutes.

The results are shown in Table 1.

In Table 1, the numerical value in the compounding/prescription column indicates the number of parts by mass.

Further, in Table 1, the abbreviations of the respective components are described below in detail.
jER828: Bisphenol A type epoxy resin, normal temperature (25° C.) liquid, viscosity (25° C.) 120 Pa·s to 150 Pa·s, Mitsubishi Chemical Corporation jER1256: High molecular weight bisphenol A type epoxy resin, normal temperature (25° C.) solid, softening 85° C., Mitsubishi Chemical acrylic polymer:
The acrylic polymer was prepared by the following procedure.

In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, and a condenser, 100 parts of n-butyl acrylate, 0.1 part of 2-hydroxyethyl acrylate, 3 parts of acrylic acid, and 2 as a polymerization initiator. 0.1 parts of 2'-azobisisobutyronitrile was added together with 100 parts of ethyl acetate and 100 parts of toluene, nitrogen gas was introduced with gentle stirring to replace nitrogen for 1 hour, and then the liquid temperature in the flask was adjusted to 55. Polymerization reaction was carried out for 15 hours while keeping the temperature at around 0° C. to prepare an acrylic polymer solution having a weight average molecular weight of 600,000.
Coronate L: Isocyanate-based cross-linking agent IBMI12:1-isobutyl-2-methylimidazole, normal temperature liquid, Mitsubishi Chemical BMI12:1-benzyl-2-methylimidazole, normal temperature liquid, Mitsubishi Chemical EMI24:2-ethyl-4 -Methylimidazole, solid at room temperature, ST12 manufactured by Mitsubishi Chemical Co., Ltd.: amine curing agent, MEK manufactured by Mitsubishi Chemical Co., Ltd.: MEK: two-component mixed epoxy adhesive of methyl ethyl ketone: trade name "High Super 5", adhesive tape manufactured by Cemedine Co.: trade name "No.5000NS", manufactured by Nitto Denko Corporation

DESCRIPTION OF SYMBOLS 1 Adhesive adhesive layer 2 1st adherend 3 Curing agent layer 4 2nd adherend 5 Curing layer 6 Adhesive structure 7 Adhesion kit

Hereinafter, the present invention will be described more specifically by showing Examples , Reference Comparative Examples and Comparative Examples. The present invention is not limited to the examples , reference comparative examples and comparative examples. Further, the compounding ratios (content ratios) used in the following description, specific numerical values such as physical property values, parameters, etc. are described in the above “Modes for carrying out the invention”, and the corresponding compounding ratios ( Substitute the upper limit (value defined as "below" or "less than") or the lower limit (value defined as "greater than or equal to""excess") such as content ratio), physical property value, parameter etc. be able to.

Example 2 , Example 3, Reference Comparative Example 4, and Examples 5-8
Shear adhesive strength was measured in the same manner as in Example 1 except that the adhesive layer and the curing agent layer were changed as shown in Table 1.

Claims (8)

A step (1) of disposing the adhesive layer on the first adherend,
A step (2) of disposing a curing agent layer capable of curing the adhesive/adhesive layer by contacting and reacting with the adhesive/adhesive layer on the second adherend; and
Step (3) of bringing the adhesive layer and the curing agent layer into contact with each other so that they are sandwiched between the first adherend and the second adherend.
An adhesive method comprising: After the pressure-sensitive adhesive layer is adhered to the aluminum plate, the peeling adhesive strength of the pressure-sensitive adhesive layer when the pressure-sensitive adhesive layer is peeled from the aluminum plate at 90 degrees at a speed of 300 mm/min. , 1.0 N/20 mm or more, The bonding method according to claim 1, wherein The shear adhesive force of the cured layer formed by the reaction between the adhesive layer and the curing agent layer measured by the following test has a shear adhesive strength of 1.0 MPa or more. Adhesion method described.
Test: The adhesive layer is sandwiched between two release-treated polyethylene terephthalate films and left at room temperature for 1 day. Thereafter, one of the polyethylene terephthalate films is peeled from the adhesive/adhesive layer, the peeled adhesive/adhesive layer is arranged on a first slate plate, and then the other polyethylene terephthalate film is adhered/adhered. Peel from the agent layer. Separately, the curing agent layer is arranged on the second slate plate. Then, the adhesive layer and the curing agent layer are brought into contact with each other so that they are sandwiched between the first slate plate and the second slate plate, and allowed to stand for 24 hours to form a curing layer, and thereafter. , The first slate plate and the second slate plate are pulled in the shearing direction at a speed of 5 mm/min, and the strength when the two slate plates are peeled off is defined as the shear adhesive force. The said hardening agent layer contains 10 mass% or more of hardening agents, The adhesion method as described in any one of Claims 1-3 characterized by the above-mentioned. The adhesive method according to any one of claims 1 to 4, wherein the adhesive/adhesive layer contains an epoxy resin as a main component. In the said process (3), the said adhesive layer cures at normal temperature, The adhesion method as described in any one of Claims 1-5 characterized by the above-mentioned. An adhesive layer,
An adhesive kit, comprising: a curing agent layer capable of curing the adhesive layer by contacting and reacting with the adhesive layer. A first adherend,
A second adherend arranged to face the first adherend;
A cured layer sandwiched between the first adherend and the second adherend,
The adhesive structure, wherein the cured layer is a cured layer formed by a reaction between the adhesive layer and the curing agent layer.

Images