KR20220086397A - Insertable electronic device and method for thereof - Google Patents

Abstract

According to various embodiments, as a communication device insertable into an external electronic device, a converter circuit, a power line, a first conductor connected to the power line, and at least one second electrically separated from the first conductor and connected to a ground conductors, wherein the first conductor and the at least one second conductor are electrically connected in accordance with the fastening of the communication device and the external electronic device, to a signal line, and to the power line, the first conductor, and the signal line a control circuit, wherein the control circuit receives a first signal from a processor of the external electronic device through the signal line, and flows through the power line when the first conductor and the at least one second conductor are electrically connected receiving a second signal generated as power is discharged to the ground through the at least one second conductor, and controlling the converter circuit with the converter circuit based on the first signal and the second signal A communication device may be provided, implemented to output a control signal. Various other embodiments are possible.

Description

INSERTABLE ELECTRONIC DEVICE AND METHOD FOR THEREOF

Various embodiments of the present disclosure relate to an insertable electronic device and an operating method thereof.

Various types of electronic devices are being distributed to consumers living in modern times.

In the electronic device, insertable devices (or modules) supporting a specific function (eg, communication function) (eg, communication module) are inserted into a physical device such as a slot, socket, or connector. A structure may be formed. When the implantable device is inserted, the electronic device is electrically connected to the implantable device and may use a specific function supported by the implantable device.

Recently, as the demand for insertable devices providing various functions for electronic devices has rapidly increased, it is necessary to implement a technology for securing the stability of the insertable device inserted into the electronic device.

An insertable electronic device (eg, an M.2 standard communication module) may be inserted into a slot of another electronic device (eg, note PC) (hereinafter, a host device). In a state in which the insertable electronic device is inserted into the slot of the host device, the insertable electronic device may be fastened to a substrate (eg, a main board) of the host device by a fastening member (eg, a screw). According to the fastening, the ground pad implemented on the board of the insertable electronic device is in contact with the ground pad formed on the board of the host device, and a specific function supported by the insertable electronic device (eg, Electrical stability of operation for 5G communication) can be secured. However, when the insert-type electronic device is abnormally fastened by the fastening member and the ground pad of the insert-type electronic device does not contact the ground pad of the substrate of the host device, electrical stability of the insert-type electronic device cannot be ensured. degradation (eg, degradation of signal quality) may occur.

According to various embodiments of the present disclosure, an electronic device and an operating method thereof use a control circuit implemented to detect whether the insertable electronic device is fastened to the host device and control the insertable electronic device to perform an operation according to the detected fastening or not Accordingly, electrical stability of the insertable electronic device may be secured. According to various embodiments of the present disclosure, an electronic device and an operating method thereof include an embedded electronic device according to whether the contact is detected using a control circuit implemented to detect whether a ground pad of an embedded electronic device and a ground pad of a host device are in contact. By controlling to perform the operation, electrical stability of the insertable electronic device may be secured.

According to various embodiments, as a communication device insertable into an external electronic device, a converter circuit, a power line, a first conductor connected to the power line, and at least one second electrically separated from the first conductor and connected to a ground conductors, wherein the first conductor and the at least one second conductor are electrically connected in accordance with the fastening of the communication device and the external electronic device, to a signal line, and to the power line, the first conductor, and the signal line a control circuit, wherein the control circuit receives a first signal from a processor of the external electronic device through the signal line, and flows through the power line when the first conductor and the at least one second conductor are electrically connected receiving a second signal generated as power is discharged to the ground through the at least one second conductor, and controlling the converter circuit with the converter circuit based on the first signal and the second signal A communication device may be provided, implemented to output a control signal.

According to various embodiments, there is provided a method of operating a communication device insertable into an external electronic device, the method comprising: receiving a first signal from a processor of the external electronic device through a signal line; a first conductor connected to a power line; and the first conductor Receiving a second signal generated as power flowing through a power line is discharged to the ground through the at least one second conductor when at least one second conductor electrically separated from and connected to the ground is electrically connected - upon engagement of the communication device and the external electronic device, the first conductor and the at least one second conductor are electrically connected; and, based on the first signal and the second signal, the converter circuit A method of operation may be provided, comprising outputting a control signal for controlling the converter circuit.

a first conductor connected to the power line, and at least one second conductor electrically isolated from the first conductor and connected to a ground-according to the connection between the communication device and the external electronic device, the first conductor and the at least one second conductor electrically coupled - a logic circuit comprising a signal line, and a first input coupled to the power line and the first conductor, and a second input coupled to the signal line, the logic circuit comprising: receiving a first signal from the processor of the external electronic device through the first input end, receiving a second signal through the second input end, and based on the signal level of the second signal being a specified level, the converter A communication device may be provided, configured to output a control signal for controlling the converter circuit to the circuit.

According to various embodiments, as a communication device insertable into an external electronic device, a first substrate, a converter circuit, a power line, a first conductor disposed on an upper surface of the first substrate and connected to the power line, and the first conductor; at least one second conductor electrically isolated and connected to a ground, wherein upon engagement of the communication device and the external electronic device, the first conductor and the at least one second conductor are electrically connected; the first substrate a third conductor disposed on a lower surface of the device and connected to the power line, and at least one fourth conductor electrically separated from the third conductor and connected to a ground-the lower surface of the first substrate of the communication device and the external electrons according to the contact of the upper surface of the second substrate of the device, the third conductor and the at least one fourth conductor are electrically connected, a signal line, and the power line, the first conductor, the third conductor and the signal line a control circuit configured to receive a first signal from a processor of the external electronic device through the signal line, and to the power line when the first conductor and the at least one second conductor are electrically connected Receives a second signal generated as flowing power is discharged to the ground through the at least one second conductor, and power flowing through the power line when the third conductor and the at least one fourth conductor are electrically connected Control for receiving a third signal generated by being discharged to the ground through the at least one fourth conductor, and controlling the converter circuit with the converter circuit based on the first signal and the second signal A communication device, implemented to output a signal, may be provided.

According to various embodiments, the means of solving the problem are not limited to the above-mentioned solutions, and the not mentioned solutions are to those of ordinary skill in the art to which the present invention belongs from the present specification and the accompanying drawings. can be clearly understood.

According to various embodiments, by controlling the insertable electronic device to perform an operation according to the detected fastening using a control circuit implemented to detect whether the insertable electronic device is fastened to the host device, the electricity of the insertable electronic device is controlled An electronic device and an operating method therefor that secures the stability of the electronic device may be provided.

According to various embodiments of the present disclosure, by using a control circuit implemented to detect whether the ground pad of the insertable electronic device and the ground pad of the host device are in contact, the insertable electronic device is controlled to perform an operation according to the detected contact. , an electronic device that secures electrical stability of an insertable electronic device, and an operating method thereof may be provided.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;
2 is a diagram for describing an example of an electronic device and a communication device insertable into the electronic device according to various embodiments of the present disclosure;
3 is a diagram illustrating an example of a physical configuration and/or a physical structure of an electronic device according to various embodiments of the present disclosure;
4A is a diagram illustrating an example of a physical configuration and/or a physical structure of a communication device according to various embodiments of the present disclosure;
4B is a side view of a portion of a substrate on which a ground pad of a communication device is disposed in accordance with various embodiments;
5 is a view for explaining an example of coupling an electronic device and a communication device according to various embodiments of the present disclosure;
6 is a diagram for describing an example of a circuit configuration of an electronic device and a circuit configuration of a communication device according to various embodiments of the present disclosure;
7A is a diagram for describing an example of a control circuit included in a communication device according to various embodiments of the present disclosure;
7B is a diagram for describing another example of a control circuit included in a communication device according to various embodiments of the present disclosure;
7C is a diagram for explaining another example of a control circuit included in a communication device according to various embodiments of the present disclosure;
7D is a diagram for explaining another example of a control circuit included in a communication device according to various embodiments of the present disclosure;
8 is a flowchart illustrating an example of an operation of a communication device according to various embodiments of the present disclosure;
9 is a diagram illustrating a signal received from an electronic device according to whether the communication device is normally fastened by a fastening member of the communication device according to various embodiments of the present disclosure and/or whether the electronic device is in contact with a ground pad of a first substrate; / or a diagram for explaining an example of an operation to cut off power.
10A is a view for explaining an example of electrical connection by a fastening member of upper surface ground pads of a communication device according to various embodiments of the present disclosure;
FIG. 10B is a diagram for explaining an example of electrical connection of lower surface ground pads of a communication device by a ground pad of a first substrate of an electronic device according to various embodiments of the present disclosure;
11 is a flowchart illustrating an example of an operation of a communication device according to various embodiments of the present disclosure;
12 is an example of an operation of transmitting a feedback signal and receiving a control signal from an electronic device according to whether the communication device is fastened and/or whether the electronic device is in contact with a ground pad of a first substrate according to various embodiments of the present disclosure; It is a drawing for explaining.
13 is a flowchart illustrating an example of an operation of an apparatus according to various embodiments of the present disclosure;
14 illustrates an example of an operation of transmitting a feedback signal and receiving a control signal from the device according to whether the device is fastened and/or whether the electronic device is in contact with the ground pad of the first substrate, according to various embodiments; It is a drawing for
15 is a flowchart illustrating an example of an operation of an apparatus according to various embodiments of the present disclosure;
16A is a diagram for describing an example of an operation of transmitting a control signal and/or power to a communication device according to whether a ground pad of the electronic device of the electronic device and the communication device are in contact, according to various embodiments of the present disclosure;
16B is a diagram for describing an example of electrical connection of electrically separated ground pads of an electronic device according to various embodiments of the present disclosure;

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments. Referring to FIG. 1 , in a network environment 100 , the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included. In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, the program 140) to execute at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . Sound may be output through the electronic device 102 (eg, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 includes various technologies for securing performance in a high frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. Technologies such as full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be chosen. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( eg commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C" each may include any one of, or all possible combinations of, items listed together in the corresponding one of the phrases. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments of the present document, one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101) may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one command among one or more commands stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term refers to the case where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store™) or on two user devices ( It can be distributed online (eg download or upload), directly between smartphones (eg smartphones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

Hereinafter, an example of an electronic device and a communication device insertable into the electronic device according to various embodiments will be described. Since the description of the electronic device 101 provided in the network environment 100 described in FIG. 1 can be applied mutatis mutandis to the electronic device and the communication device of FIG. 2 , a redundant description will be omitted.

2 is a view for explaining an example of an electronic device and a communication device insertable into the electronic device according to various embodiments of the present disclosure;

According to various embodiments, as shown in FIG. 2 , an electronic device 202 and a communication device 201 insertable into the electronic device 202 may be provided. Hereinafter, each of the electronic device 202 and the communication device 201 will be described.

First, the electronic device 202 will be described.

According to various embodiments, the electronic device 202 may include a physical structure in which an insertable device (eg, the communication device 201) can be inserted. For example, the electronic device 202 may include an area in which a physical structure such as a slot into which the communication device 201 can be inserted or a socket is formed. The physical structure may be implemented to correspond to a standard (eg, M.2) of the communication device 201 inserted into the electronic device 202 . The communication device 201 inserted into the electronic device 202 may be electrically and/or operatively connected to the electronic device 202 . Also, for example, the electronic device 202 may include a physical structure or a connection device (eg, a connector) that is electrically and/or operatively connectable to the communication device 201 . The electrically connected means that the electronic device 202 and the communication device 201 are connected such that power, signals (eg, control signals of the processor of the electronic device 202), information, and data are transmitted and/or received with each other. can mean In addition, the operatively connected means that the operation (eg, communication connection) of the electronic device 202 is based on the communication device 201 (eg, the communication device 201 controls the antenna) or the communication This may mean that the device 201 is connected such that an operation (eg, controlling an antenna) is performed based on the electronic device 202 (eg, the electronic device 202 provides power). 5 and 6 to the insertion of the communication device 201 into the electronic device 202 and the electrical and/or operational connection of the electronic device 202 and the communication device 201 by the insertion. 7 will be described later.

According to various embodiments, the electronic device 202 may include various types of computers. For example, the electronic device 202 may include notebook computers, laptop computers, tablet computers, and desktop computers, including standard notebooks, ultrabooks, netbooks, and tabbooks. desktop computer) may be included. Also, without being limited thereto, the electronic device 202 may include a slot into which the communication device 201 can be inserted, a socket, or a communication device 201 and a connection device (eg, a connector). It may be various types of devices in which physical structures such as For example, the electronic device 202 may be a portable terminal provided with a slot into which the communication device 201 can be inserted.

Hereinafter, the communication device 201 will be described.

According to various embodiments, the communication device 201 may support various types of communication. For example, the communication device 201 may perform a control operation for various types of communication. For example, the communication device 201 is a cellular communication (or mobile communication) such as 3G, 4G LTE, LTE-Adv, or 5G, NFC, RFID, Bluetooth, BLE, or short-range wireless communication such as Wi-Fi Direct , wireless communication using an access point (AP) such as Wi-Fi, and a control operation for wired communication such as USB or Ethernet. When the communication device 201 is inserted into the electronic device 202 and electrically or operatively connected to the electronic device 202 , the communication device 201 transmits data and/or information to the outside ( eg, a network) and transmit and/or receive. Based on the operation of the communication device 201 , the electronic device 202 may transmit and/or receive communication signals, data and/or information based on various types of communication supported by the communication device 201 . do. Meanwhile, without being limited thereto, the matters described below also apply to devices (eg, memory cards, graphic cards) supporting various functions that can be inserted into the electronic device 202 other than the communication device 201 supporting the communication function. may be applied mutatis mutandis.

According to various embodiments, the communication device 201 may be a device implemented with a specific interface standard (or a specific physical standard). For example, the communication device 201 may be an M.2 standard device. Also, without being limited thereto, the communication device 201 may be a communication device 201 of various standards that can be inserted into the electronic device 202 .

On the other hand, without being limited thereto, the matters described below may be applied mutatis mutandis to various types of devices (eg, memory cards and graphic cards) that can be inserted into the electronic device 202 other than the communication device 201 . For example, electrically connectable or detachable ground pads (eg, upper surface ground pads and lower surface ground pads) described below may be implemented on a substrate of various types of insertable devices, and a control circuit may be provided. .

Hereinafter, examples of the electronic device 202 and the communication device according to various embodiments will be further described. Hereinafter, an example of the physical configuration and/or physical structure of the electronic device 202 and the communication device 201 described above with reference to FIGS. 3 and 4A to 4B will be further described.

3 is a diagram illustrating an example of a physical configuration and/or a physical structure of an electronic device according to various embodiments of the present disclosure; 4A is a diagram illustrating an example of a physical configuration and/or a physical structure of a communication device according to various embodiments of the present disclosure; 4B is a side view of a portion of a substrate on which a ground pad of a communication device is disposed in accordance with various embodiments;

First, a physical configuration and/or an example of a physical structure of the electronic device 202 will be described.

According to various embodiments of the present disclosure, referring to FIG. 3 , the electronic device 202 includes a first substrate 310 , a processor 320 , a battery 330 , a plurality of antennas 340 , and a fan (FAN) ( 350 , memory 355 , and communication device 201 may include an insertable slot (or socket, or connector) 360 . Without being limited to what is shown, the electronic device 202 may be implemented to include more components than those illustrated in FIG. 3 or to include fewer components than those illustrated in FIG. 3 . For example, the configuration of the electronic device 202 described above in FIG. 1 may be further implemented in the substrate of FIG. 3 .

According to various embodiments, components of the electronic device 202 may be disposed on the first substrate 310 . For example, a processor 320 , a battery 330 , a plurality of antennas 340 , a fan (FAN) 350 , a memory 355 , and a communication device 201 are disposed on the first substrate 310 . An insertable slot (or socket, or connector) 360 may be disposed (or implemented). Although not shown in FIG. 3 , the processor 320 , the battery 330 , the plurality of antennas 340 , the fan (FAN) 350 , the memory 355 , and the communication device 201 can be inserted into a slot (or In addition to the socket or connector) 360 , a circuit and input/output ports for integrating and connecting various cables or wires may be installed. The board may include a main board, a motherboard or mobo, a main circuit board, a base board, a planar board, or a system board. can In addition, since the substrate may be implemented as in a known technique, a detailed description thereof will be omitted.

According to various embodiments, the processor 320 may control the overall operation of the electronic device 202 . When the communication device 201 is inserted and electrically connected, the processor 320 may output a control signal for controlling a configuration (eg, a converter circuit) of the communication device 201 . It may be an application processor (AP) including various types of processors such as a computer processing unit (CPU) and a graphic processing unit (GPU). In addition, since the processor 320 may be implemented as a known technology, a detailed description thereof will be omitted.

According to various embodiments, the battery 330 accumulates power and uses the accumulated power for the operation of the electronic device 202 and/or components of the communication device 201 (eg, the processor 320 ). can provide The power of the battery 330 may be converted into power of a size required by the components of the electronic device 202 and/or the communication device 201 by a first converter circuit ( 634 of FIG. 6 ), which will be described later, and may be provided. In addition, since the battery 330 may be implemented as in a known technology, a detailed description thereof will be omitted.

According to various embodiments, the plurality of antennas 340 may transmit a communication signal to the outside (eg, a network) or receive a communication signal. For example, the plurality of antennas 340 transmit and/or transmit a communication signal based on a communication scheme (eg, 5G) supported by the communication device 201 under the control of the inserted communication device 201 . can receive In addition, since the plurality of antennas 340 may be implemented as in a known technology, a detailed description thereof will be omitted.

According to various embodiments, the fan (FAN) 350 may rotate to dissipate heat generated according to the operation of the electronic device 202 . Without being limited thereto, a cooler for dissipating waste heat of the electronic device 202 other than the fan 350 may be provided in the electronic device 202 . In addition, since the fan 350 may be implemented as in a known technique, a detailed description thereof will be omitted.

According to various embodiments, the memory 355 may temporarily or semi-permanently store information related to the electronic device 202 . The memory 355 is stored in a read-only memory (ROM) that stores an operating system (OS) for driving, data or programs or applications (eg, web applications) for hosting a web site. It may include a random access memory (RAM) that stores data related to the data. In addition, since the memory 355 may be implemented as in a known technology, a detailed description thereof will be omitted.

According to various embodiments, a slot (or socket, or connector) 360 into which the communication device 201 can be inserted is provided on the board corresponding to a physical standard (eg, M.2) of the communication device 201 . It can be formed in a structure of a physical standard. For example, as will be described later, a structure 501 in which a connector 503 for electrically connecting to the communication device 201 is formed may be implemented in the slot 360 . Also, for example, as shown in FIG. 3 , a fastening structure to which the communication device 201 can be fastened may be formed in the insertable slot. The fastening structure may include a hole 372 in which a screw line is formed in an inner surface so that a fastening member (eg, a screw) to be described later is inserted and fastened. A ground pad 371 made of a conductive material may be disposed in an area adjacent to the substrate on which the fastening structure (eg, a hole) is formed (eg, an area around the entrance of the hole). The ground pad 371 may be electrically connected to a ground (eg, 641 of FIG. 6 to be described later) of the electronic device 202 . The ground serves as a common ground of devices (eg, the communication device 201 or the electronic device 202 ), and may be a reference point for signal lines connected to the ground. Also, charges (or power) may be discharged from signal lines connected through the ground. When fastened to the electronic device 202 of the communication device 201, the lower surface ground pad disposed on the lower surface of the substrate of the communication device 201 is in contact with the ground pad 371 of the slot and is electrically connected. The ground of the communication device 201 may be secured (or electrical stability may be secured), which will be described later.

Hereinafter, a physical configuration and/or an example of the physical configuration of the communication device 201 will be described.

According to various embodiments, in the communication device 201 , referring to FIG. 4A , a second substrate 410 on which a fastening structure is formed, a ground pad 420 , at least one circuit 430 , and an antenna connection unit 440 . ), and a contact portion 450 . In addition, referring to FIG. 4B, the communication device 201 includes a ground 470, an insulating layer (eg, PCB core 481, PREPEG 482), and the communication device 201 inside the second substrate 410. It may include metal lines 490 connected to the components (eg, at least one circuit).

According to various embodiments, components of the communication device 201 (eg, a ground pad 420 , at least one circuit 430 , an antenna connection part 440 , and a contact part 450 ) are disposed on the second substrate 410 . )) may be deployed (or implemented). As described above, the second substrate 410 may be implemented in an M.2 standard form factor. Although not shown in FIG. 4A, in addition to the components of the communication device 201 (eg, the ground pad 420, at least one circuit 430, the antenna connection part 440, the contact part 450), various cables or wiring Circuits and input/output ports for integrating and connecting may be installed. For example, the second substrate 410 may include metal lines 490 connected to components of the communication device 201 as shown in FIG. 4B . The metal lines 490 may be electrically connected to the ground 470 through a via hole. In addition, since the second substrate 410 may be implemented as in a known technique, a detailed description thereof will be omitted.

According to various embodiments, a fastening structure for fastening with the electronic device 202 may be formed on the second substrate 410 . For example, the fastening structure of the communication device 201 may include a recessed region 411 recessed into the side surface of the second substrate 410 of the communication device 201 as shown in FIG. 4A . . When the second substrate 410 of the communication device 201 is disposed on the substrate of the electronic device 202 as the communication device 201 is inserted into the slot 360 of the electronic device 202, A fastening structure (eg, a hole 372 ) of the slot 360 of the electronic device 202 may be exposed through the recessed region 411 . According to the insertion of a fastening member (eg, a screw) 510 through the recessed region 411 of the fastening structure, the second substrate 410 of the communication device 201 and the second substrate 410 of the electronic device 202 are inserted. An example in which one substrate 310 is fastened to each other will be described later with reference to FIG. 5 .

According to various embodiments, as shown in FIG. 4A , in the upper surface area of the second substrate 410 on which the fastening structure is formed, and in the lower surface area of the second substrate 410 , ground pads (eg, 421 and 425 ) are provided. This can be arranged. For example, the ground pads may include a plurality of conductors (eg, 422 , 423 , 426 , 427 ). The conductors (eg, 422 , 423 , 426 , 427 ) are formed along the region 410 recessed into the side surface of the second substrate 410 of the fastening structure with a predetermined curvature on the upper surface of the second substrate 410 . and a lower surface of the second substrate 410 . Among the conductors (eg, 422 , 423 , 426 , and 427 ), the conductors (eg, 422 , 423 ) disposed on the upper surface area of the second substrate 410 are defined as upper surface ground pads 421 , and the second Conductors (eg, 426 and 427 ) disposed on the lower surface of the substrate 410 may be defined as lower surface ground pads 425 . The conductors (eg, 422, 423, 426, 427) disposed on each of the upper and lower surfaces are the floating conductors 422 and 426 and at least one ground conductor 423, which are electrically separated from each other as shown in FIG. 4B. 427) may be included. As the floating conductors 422 and 426 and the at least one ground conductor 423 and 427 are spaced apart from each other, they may be electrically separated from each other. The floating conductors 422 and 426 are connected to a power line and a control circuit (or logic circuit) to be described later, and at least one ground conductor 423 , 427 is provided inside the second substrate 420 as shown in FIG. 4B . It may be connected to the formed ground 470 . Unlike the at least one ground conductor 423 and 427 , the floating conductors 422 and 426 may not be electrically connected to the ground 470 like the conductor 422 of FIG. 4B . The floating conductor 422 disposed on the upper surface and the at least one ground conductor 423 can be electrically connected by a fastening member (eg, screw) 510 inserted through the fastening structure as described below, and , the floating conductor 426 and at least one ground conductor 427 disposed on the lower surface can be electrically connected according to contact with the ground pad 371 of the first substrate 310 of the electronic device 202, as will be described later. This will be described later with reference to FIGS. 8 to 10 .

According to various embodiments, the ground pads (eg, 421 and 425 ) disposed on the upper surface or the lower surface of the second substrate 410 are not limited to those illustrated in FIG. 4A and may be implemented in various forms. For example, the ground pad may be implemented in various forms in which conductors are electrically separated from each other, but some conductors are connected to the ground 470 and the other conductors are not connected to the ground 470 .

According to various embodiments, the at least one circuit 430 may include components such as a second processor 650 and memories 671 and 672 to be described later. At least one circuit provided in the communication device 201 may be implemented as in a known technology, and thus a detailed description thereof will be omitted.

According to various embodiments, the antenna connector 440 may be electrically and/or operatively connected to each of the plurality of antennas of the electronic device 202 . Since the antenna connection unit 440 provided in the communication device 201 may be implemented as in a known technology, a detailed description thereof will be omitted.

According to various embodiments, the contact part 450 may include a configuration (eg, a plurality of pins) to be electrically connected to the connector 503 of the slot 360 of the electronic device 202 . As will be described later, in a state in which the communication device 201 is inserted into the slot 360 of the electronic device 202 , the contact part 450 is in contact with and/or connected to the connector 503 of the slot 360 . As the electrical configuration (eg, power line, signal line) of the communication device 201 and the electrical configuration (eg, power line, signal line) of the electronic device 202 are connected, each component (eg, electronic device 202 ) is connected. Power, signals, data, and/or information may be exchanged with the processor (eg, 610 in FIG. 6 to be described later) and the second converter circuit (eg, 680 in FIG. 6 to be described later) of the communication device 201 of the have. Since the contact unit 450 provided in the communication device 201 may be implemented as in a known technology, a detailed description thereof will be omitted.

Meanwhile, without being limited thereto, the matters described below may be applied mutatis mutandis to various types of devices (eg, memory cards and graphic cards) that can be inserted into the electronic device 202 other than the communication device 201 .

Hereinafter, an example of coupling between the electronic device 202 and the communication device 201 according to various embodiments will be described.

5 is a diagram for explaining an example of coupling an electronic device and a communication device according to various embodiments of the present disclosure;

According to various embodiments, the slot 360 of the electronic device 202 is configured to be electrically connected to the contact portion 450 of the communication device 201 as shown in FIG. 5 as described above. structure 501 including 503 . The connector 503 includes a plurality of pins for electrically connecting to the communication device 201 according to contact and/or connection with a plurality of pins included in the contact portion 450 of the communication device 201 . may be electrically connected.

According to various embodiments, a part (eg, the contact part 450 ) of the communication device 201 is inserted into the slot 360 (eg, the structure 501 of the slot 360 ) of the electronic device 202 . In this state, the first substrate 310 of the electronic device 202 and the second substrate 410 of the communication device 201 may be coupled to each other. In a state in which the second substrate 410 of the communication device 201 is inserted into the structure 501 of the slot 360 , as shown in FIG. 5 , the second substrate 410 of the communication device 201 is ) of the first substrate 310 of the electronic device 202 through the recessed region 411 of the fastening structure of the fastening member 510 (eg, a screw, or members for fastening without being limited thereto). ), it may be fastened to the second substrate 410 of the communication device 201 and the first substrate 310 of the electronic device 202 . The fastening member 510 includes a head 511 and a body 513 having a screw thread formed on an outer circumferential surface thereof, and each of the head 511 and the body 513 is implemented with a conductive material to have conductivity. . When the fastening member 510 is inserted into the fastening structure (eg, hole 372 in FIG. 3 ) of the electronic device 202 , the screw line formed on the outer circumferential surface of the body of the fastening member 510 and the electronic device 202 . ) in a fastening structure (eg, a hole 372 in FIG. 3 ) of the first substrate 310 may be engaged with each other. According to the engagement, a force is generated from the upper surface of the second substrate 410 of the communication device 201 by the head 511 of the fastening member 510 in the direction of the upper surface of the first substrate 310 of the electronic device 202 . This is applied, and the second substrate 410 of the communication device 201 and the first substrate 310 of the electronic device 202 may be firmly coupled.

According to various embodiments, when the second substrate 410 of the communication device 201 and the first substrate 310 of the electronic device 202 are completely fastened by the fastening member 510, the communication device ( Electrically separated conductors disposed on at least one of an upper surface or a lower surface of the second substrate 410 of the 201 may be electrically connected to each other. For example, the upper surface ground pads 421 of the second substrate 410 of the communication device 201 described above are at least a portion of the head 511 of the fastening member 510 (eg, the lower surface of the head 511 ). ), and the upper ground pads 421 may be electrically connected through the head 511 of the fastening member 510 . Also, for example, the lower surface ground pads 425 of the second substrate 410 of the communication device 201 are ground pads formed in the fastening structure of the upper surface of the first substrate 310 of the electronic device 202 ( 371 , the lower ground pads 425 may be electrically connected to each other through the ground pad 371 of the first substrate 310 of the electronic device 202 . Accordingly, the ground of the electronic device 202 (eg, 641 of FIG. 6 to be described later) is the ground pad 371 of the first substrate 310 and the ground pads 425 of the lower surface of the second substrate 410 . ) is electrically connected to the ground 470 of the communication device 201, and thus the ground of the communication device 201 can be secured. For example, the ground of the electronic device 101 may be used as a ground when an operation of the communication device 201 is performed. The control circuit 690, which will be described later, may detect at least one of whether the upper ground pads 421 are electrically connected or not or the lower ground pads 425 are electrically connected. For this, FIGS. 7A to 7D and 8 to 10 will be described later.

Hereinafter, examples of circuit configurations of the electronic device 202 and the communication device 201 that are electrically and/or operatively connected according to the above-described insertion and fastening will be described.

6 is a diagram for describing an example of a circuit configuration of an electronic device and a circuit configuration of a communication device according to various embodiments of the present disclosure; Hereinafter, the control circuit of FIG. 6 will be described with reference to FIGS. 7A to 7D .

7A is a diagram for describing an example of a control circuit included in a communication device according to various embodiments of the present disclosure; 7B is a diagram for explaining another example of a control circuit included in a communication device according to various embodiments of the present disclosure; 7C is a diagram for explaining another example of a control circuit included in a communication device according to various embodiments of the present disclosure; 7D is a diagram for explaining another example of a control circuit included in a communication device according to various embodiments of the present disclosure;

Hereinafter, an example of electrical connection and/or operational connection between the electronic device 202 and the communication device 201 according to the insertion and/or fastening of the communication device 201 will be described.

According to various embodiments, insertion of the communication device 201 into the electronic device 202 (eg, the contact portion 450 of the communication device 201 is in contact with the connector 530 of the electronic device 202 ); According to the connection between the electronic device 202 and the electronic device 202 , at least some circuit components of the electronic device 202 and the communication device 201 may be electrically connected to each other as shown in FIG. 6 .

For example, lines (or lanes) (eg, power lines) for exchanging power, signals, information, and/or data between the electronic device 202 and the communication device 201 . (power lane, power rail, power line), a bus signal line (bus line), and a control signal line (control signal line) may be connected to each other. For example, the first converter circuit 634 of the electronic device 202 and the second converter circuit 680 of the communication device 201 may be connected by a power line. A first power line connected to an output terminal of the first converter circuit 634 and a second power line connected to an input terminal of the second converter circuit 680 may be electrically connected. As another example, a signal line for transmitting and/or receiving a control signal and a bus line for transmitting and/or receiving data may be connected. A signal line connected to the first processor 610 of the electronic device 202 and a signal line connected to the second second processor 650 of the communication device 201 may be electrically connected to each other. Also, the signal line of the first processor 610 of the electronic device 202 and the signal line of other components of the communication device 201 (eg, the second converter circuit 680 ) may be electrically connected to each other.

Also, for example, the ground 641 of the electronic device 202 and the ground 642 of the communication device 201 (eg, the ground 470 formed inside the second substrate 410 of FIG. 4B ) are mutually exclusive. can be connected As described above, as the ground pad 371 of the fastening structure of the first substrate 310 of the electronic device 202 and the lower surface ground pads 425 of the second substrate 410 of the communication device 201 are connected, , the ground 641 of the electronic device 202 and the ground 642 of the communication device 201 may be electrically connected to each other as shown in FIG. 6 . As the grounds (eg, 641 ) of the electronic device 202 and the grounds 642 of the communication device 201 are electrically connected to each other, the ground of the components of the communication device 201 may be secured.

Hereinafter, an example of a circuit configuration of the electronic device 202 and an example of a circuit configuration of the communication device 201 will be described.

First, an example of a circuit configuration of the electronic device 202 will be described.

According to various embodiments of the present disclosure, referring to FIG. 6 , the electronic device 202 includes a first processor 610 , a communication module 620 , and a plurality of devices (eg, a speaker, a display, an input device such as a mouse and a keyboard). and interface circuits 621 , 622 , and 623 , a plurality of memories 631 , 632 , and 633 , a first converter circuit 634 , and a ground 641 for connection with the ?

According to various embodiments, the first processor 610 of the electronic device 202 may transmit a control signal to components (eg, the second converter circuit 680 ) of the electrically connected communication device 201 . The first processor 610 is not limited to that shown in FIG. 6 , and other components than the second converter circuit 680 of the communication device 201 (eg, the second second processor 650 of the communication device 201 ) )), so that the first processor 610 below transmits the control signal to the second converter circuit 680 of the communication device 201 is performed by the first processor 610 in the communication device. The operation of transmitting the control signal to other components of 201 (eg, the second second processor 650 of the communication device 201) may be applied mutatis mutandis. Since the first processor 610 may be implemented like the processor 320 of FIG. 3 , a redundant description will be omitted.

According to various embodiments, the communication module 620 establishes a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 202 and the external electronic device 202, and performs communication through the established communication channel. can support The communication module 620 may support a communication scheme different from that of the communication device 201 . For example, when the communication device 201 supports 5G communication, the communication module of the electronic device 202 may support network communication such as PAN or WAN. Since the communication module 620 may be implemented like the communication module 190 of FIG. 1 , a redundant description will be omitted.

According to various embodiments, the interface circuits 621 , 622 , and 623 may include a connection structure such as a connector for connecting to input devices such as a speaker, a display, and a mouse and a keyboard.

According to various embodiments, the plurality of memories 631 , 632 , and 633 are a read-only memory (ROM) (ROM #1) that stores an operating system (OS) for driving the electronic device 202 . , 631), a ROM (ROM #2,632) including an additional information storage area, and data for hosting a web site or data or programs or applications (eg, web applications), full code, and / or may include a random access memory (RAM) 633 for storing state/context information. In addition, since the memories 631 , 632 , and 633 may be implemented as well-known techniques, a detailed description thereof will be omitted.

According to various embodiments, the first converter circuit 634 may be a converter circuit that converts (eg, step-down or boosts) DC power and transfers the DC power to other components of the electronic device 202 . For example, the first converter circuit 634 may convert and transmit power obtained from a battery (eg, 330 in FIG. 3 ) to other components (eg, the first processor 610 ) of the electronic device 202 . have. Also, for example, the first converter circuit 634 may convert and transmit power to components of the electrically connected communication device 201 (eg, the second converter circuit 680 ). Without being limited to the above description, the first converter circuit 634 may be configured in other configurations than the second converter circuit 680 of the communication device 201 (eg, the second second processor 650 of the communication device 201 ). ) converted to power. The first converter circuit 634 is a step-down converter, a Buck converter, a Step-down converter, a step-up converter, a Boost converter, a Step-up converter, a step-up converter, a Buck-Boost converter, a negative voltage converter, an inverting converter, or an Inverting converter. It may be a DC/DC converter circuit including Alternatively, without being limited thereto, the first converter circuit 634 may be a DC/AC converter circuit or an AC/DC converter circuit.

According to various embodiments, the ground 641 may be electrically connected to at least some of circuit components of the electronic device 202 to become a common ground when electrical operations of the circuit components are performed. Referring to FIG. 6 , the ground may be electrically connected to the ground pad 371 of the slot 360 disposed in the first substrate 310 as described above.

Hereinafter, an example of the circuit configuration of the communication device 201 will be described.

According to various embodiments, the communication device 201 includes a second processor 650 , a transceiver 660 , a plurality of memories 671 and 672 , a second converter circuit 680 , and a control circuit ( ) with reference to FIG. 6A . 690) and a ground 642 (eg, 740 in FIG. 4B).

According to various embodiments, the second processor 650 of the communication device 201 may control overall configurations of the communication device 201 . Since the second processor 650 of the communication device 201 may be implemented as the first processor 610 of the electronic device 202 described above, a redundant description thereof will be omitted. The second processor 650 of the communication device 201 may be a modem processor.

According to various embodiments, the transceiver 660 may transmit and/or receive a communication signal based on a communication scheme supported by the communication device 201 . The transceiver 660 may include a plurality of antennas. Since the descriptions of the plurality of antennas are the same as those described above, overlapping descriptions will be omitted.

According to various embodiments, the plurality of memories 671 and 672 is a read-only memory (ROM) (ROM #1, 671 ) that stores an operating system (OS) for driving the communication device 201 . ), data for hosting a web site or data about a program or application (eg, web application), full code, and/or RAM (Random Access Memory: RAM) for storing state/context information (672). In addition, since the memories 671 and 672 may be implemented as well-known techniques, a detailed description thereof will be omitted.

According to various embodiments, the second converter circuit 680 may convert DC power (eg, step-down or step-up) to transmit it to other components of the communication device 201 . For example, the input terminal of the second converter circuit 680 is electrically connected to the first converter circuit 634 of the electronic device 202 , and converts power transmitted from the first converter circuit 634 to the communication device ( 201) may be transferred to other components (eg, the second processor 650). The second converter circuit 680 may be a DC/DC converter circuit like the first converter circuit 634 . Alternatively, without being limited thereto, the second converter circuit 680 may also be a DC/AC converter circuit or an AC/DC converter circuit.

According to various embodiments, the control circuit 690 may be implemented to output a control signal for controlling some components (eg, the second converter circuit 680 ) of the communication device 201 . For example, the control signal converts the second converter circuit 680 into power provided from the electronic device 202 (eg, power transmitted from the first converter circuit 634 ) to obtain the communication device 201 . It may be a signal causing an operation of transferring power to each component of . As shown in FIG. 6 , the control circuit 690 includes a power line (eg, a power line input to the second converter circuit 680 ), a signal line (eg, a control signal line input to the second processor 650 ), and a ground pad. Some (eg, floating ground pads (eg, 422, 426)) of (eg, the upper surface ground pads 421 or the lower surface ground pads 425 described above in FIGS. 4A to 4B ), and It may be electrically connected to some components of the communication device 201 (eg, the second converter circuit 680 ). Meanwhile, although the control circuit 690 is illustrated as being connected only to the second converter circuit 680, it is not limited thereto and may be connected to various components of the communication device 201 to transmit control signals for controlling the various components. .

According to various embodiments, the control circuit 690 is a second converter based on a signal (eg, a high-level signal or a low-level signal) generated by at least one of a power line, a signal line, or some of ground pads. A control signal for controlling the circuit 680 may be output. The signal received by the control circuit 690 may include a high level signal and a low level signal. The high level signal may be defined as a signal having a high value (eg, +5V, Vcc) and may be defined as a signal having a low value (eg, 0V, gnd). The high value and the low value are not limited thereto, and may be set to various sizes and may be adjusted. For example, the control circuit 690 is generated according to whether electrical connection is made between the ground pads (eg, the upper ground pads 421 or the lower ground pads 425 described above in FIGS. 4A to 4B ). The high-level signal or the low-level signal may be received, and a control signal for controlling the converter circuit may be output based on the received signal. For example, the control circuit 690 receives a signal (eg, a signal having a high value) generated when the upper surface ground pads 421 (or the lower surface ground pads 425 ) are electrically connected, and , may output the control signal based on the received signal. As another example, the control circuit 690 receives a signal (eg, a signal having a low value) generated when the top ground pads 421 (or the bottom ground pads 425 ) are not electrically connected to each other. and outputting the control signal based on the received signal. Specific examples of the control circuit 690 and examples of operations will be described below.

Hereinafter, specific examples of the control circuit 690 and examples of operation will be described with reference to FIGS. 7A to 7D . On the other hand, the control circuit 690 is not limited to the bar shown in FIGS. 7A to 7D, and includes more configurations (eg, electrical elements such as inductors, capacitors, and resistors) than those shown in FIGS. 7A to 7D. It may be implemented to include more or fewer components. Meanwhile, although the output terminal of the control circuit 690 (eg, a logic circuit, a switch) is illustrated as being connected to the second converter circuit 680 , the present invention is not limited thereto and may be connected to various components of the communication device 201 .

According to various embodiments, the control circuit 690 includes an AND logic circuit 710 including two input terminals (eg, a first input terminal and a second input terminal) and an output terminal, an inverter (inverter), as shown in FIG. 7A . 714 ), and a resistor (eg, a pull-up resistor) 713 . A first input terminal of the AND logic circuit 710 may be connected to a signal line. The second input terminal 710 of the AND logic circuit is connected to the output terminal of the inverter 714 , and the input terminal of the inverter includes ground pads (eg, the upper surface ground pads 421 described above in FIGS. 4A to 4B or the lower surface ground pad). Among them 425 ), it may be connected to a floating ground pad (eg, the first conductor 422 ), and may be connected to the power line 712 through a resistor 713 . The first input terminal of the AND logic circuit 710 is a high-level signal output from the first processor 610 of the electronic device 202 through the signal line 711 of a first signal (eg, a converter turn-on), and the second input terminal of the AND logic circuit 710 receives the floating ground pad (eg, the first conductor 422) and the remaining ground pads from the output terminal of the inverter 714 . A second signal that is a high level signal or a third signal that is a low level signal may be received depending on whether the at least one second conductor 423 is electrically connected. An operation of receiving signals of different levels (eg, high level or low level) depending on whether the ground pad is electrically connected will be described later with reference to FIGS. 8 to 10 . The AND logic circuit 710 may output a control signal for controlling the second converter circuit 680 through an output terminal when a high level signal is received through both the first input terminal and the second input terminal.

According to various embodiments, the control circuit 690 includes an AND logic circuit 720 including three input terminals (eg, a first input terminal, a second input terminal, and a third input terminal) and an output terminal as shown in FIG. 7B ; It may include inverters (eg, the first inverter 725 and the second inverter 726 ) and resistors (eg, the first resistor 723 and the second resistor 724 ). A first input terminal of the AND logic circuit 720 may be connected to the signal line 722 . The first input terminal of the AND logic circuit 720 turns the first signal (eg, the second converter circuit 680 ) which is a high level signal output from the first processor 610 of the electronic device 202 through the signal line. - A signal to turn on) can be received. A second input terminal of the AND logic circuit 720 is connected to an output terminal of the first inverter 725 , and an input terminal of the first inverter is connected to a floating ground pad (eg, the first conductor 422 ) among the upper surface ground pads. and may be connected to the power line 721 through the first resistor 723 . The second input terminal of the AND logic circuit 720 is connected to the floating ground pad (eg, first conductor 422) and the other ground pad (eg, at least one second conductor (eg, at least one second conductor) from the output terminal of the first inverter 725 . 423)), a second signal that is a high level signal or a third signal that is a low level signal may be received depending on whether the signal is electrically connected. A third input terminal of the AND logic circuit 720 is connected to an output terminal of the second inverter 726 , and an input terminal of the second inverter 726 is a floating ground pad (eg, a third conductor 426 ) among the lower ground pads. ) and may be connected to the power line 721 through the second resistor 724 . The third input terminal of the AND logic circuit 720 is connected from the output terminal of the second inverter 726 to the floating ground pad (eg, third conductor 426) and the remaining ground pad (eg, at least one fourth conductor (eg, at least one fourth conductor) 427)), a second signal that is a high level signal or a third signal that is a low level signal may be received depending on whether the signal is electrically connected. An operation of receiving signals of different levels (eg, high level or low level) depending on whether the ground pad is electrically connected will be described later with reference to FIGS. 8 to 10 . The AND logic circuit 720 outputs a control signal for controlling the second converter circuit 680 through an output terminal when all high-level signals are received through the first input terminal, the second input terminal, and the third input terminal. can

According to various embodiments, the control circuit 690 includes a NOR logic circuit 730 including three input terminals (eg, a first input terminal, a second input terminal, and a third input terminal) and an output terminal as shown in FIG. 7C ; and resistors (eg, a first resistor 733 and a second resistor 734 ). A first input terminal of the NOR logic circuit 730 may be connected to the signal line 732 . The first input terminal of the NOR logic circuit 730 is a first signal (eg, a second converter circuit 680 ) that is a high level signal output from the first processor 610 of the electronic device 202 through the signal line 732 . ) can receive a signal for turning on (turn-on). The second input terminal of the NOR logic circuit 730 may be connected to a floating ground pad (eg, a first conductor 422 ) among top ground pads, and may be connected to a power line 731 through a first resistor 733 . . The second input terminal of the NOR logic circuit 730 is high depending on whether the floating ground pad (eg, the first conductor 422) is electrically connected to the remaining ground pad (eg, at least one second conductor 423). A second signal that is a level signal or a third signal that is a low level signal may be received. The third input terminal of the NOR logic circuit 730 may be connected to a floating ground pad (eg, the third conductor 426) among the bottom ground pads, and may be connected to the power line 731 through a second resistor 734. . The third input terminal of the NOR logic circuit 730 is high depending on whether the floating ground pad (eg, the third conductor 426) and the other ground pad (eg, the at least one second conductor 427) are electrically connected. A second signal that is a level signal or a third signal that is a low level signal may be received. An operation of receiving signals of different levels (eg, high level or low level) depending on whether the ground pad is electrically connected will be described later with reference to FIGS. 8 to 10 . The NOR logic circuit 730 receives a low-level signal through a first input terminal, and when all low-level signals are received through at least one of a second input terminal and a third input terminal, the second converter circuit 680 through an output terminal ) can output a control signal for controlling the

According to various embodiments, the control circuit 690 may include a switch circuit 740 and resistors (eg, a first resistor 743 and a second resistor 744 ) as shown in FIG. 7D . . The input terminal of the switch circuit 740 is connected to the output terminal of the first converter circuit 634 of the electronic device 202 and the output terminal of the switch circuit is connected to the input terminal of the second converter circuit 680 of the communication device 201, Whether to transmit power from the first converter circuit 634 to the second converter circuit 680 may be determined according to the open/close state of the switch circuit 740 . For example, the open/close state of the switch circuit may be changed according to whether the upper ground pads 422 and 423 are electrically connected and whether the lower ground pads 426 and 427 are electrically connected. For example, the first signal input terminal of the switch circuit 740 is connected to a floating ground pad (eg, the first conductor 422 ) among the top ground pads, and is connected to the power line 741 through the first resistor 743 . can be connected The first signal input terminal of the switch circuit 740 is high depending on whether the floating ground pad (eg, the first conductor 422) and the other ground pad (eg, at least one second conductor 423) are electrically connected. A level signal or a low level signal may be received. The second signal input terminal of the switch circuit 740 may be connected to a floating ground pad (eg, the third conductor 426) among the bottom ground pads, and may be connected to the power line 741 through a second resistor 744. . The first signal input terminal of the switch circuit 740 is high depending on whether the floating ground pad (eg, the third conductor 426) and the other ground pad (eg, at least one fourth conductor 427) are electrically connected. A level signal or a low level signal may be received. When the switch circuit 740 receives a high level signal from two signal input terminals (eg, a first signal input terminal and a second signal input terminal), the switch circuit 740 enters a closed state and receives the second converter circuit from the first converter circuit 634 . Power may be transferred to 680 . Also, when the switch circuit 740 receives a high level signal from at least one of the two signal input terminals, it may be implemented to be in a closed state. Also, when the switch circuit 740 receives a low-level signal from both signal input terminals, it may be implemented to be in an open state. The second converter circuit 680 is turned on by receiving a control signal from the first processor 610 through a signal line 742 , and converts the received power while the switch circuit 740 is closed and outputs it can do.

Hereinafter, examples of operations of the communication device 201 according to various embodiments will be described.

According to various embodiments, the communication device 201 (eg, the control circuit 690 ) determines whether the communication device 201 is normally fastened by a fastening member and/or the first substrate ( Depending on whether the ground pad 371 of the 310 is in contact with the ground pad 371 , an operation of blocking a signal and/or power received from the electronic device 202 may be performed.

8 is a flowchart 800 for explaining an example of an operation of a communication device according to various embodiments. According to various embodiments, the operations illustrated in FIG. 8 are not limited to the illustrated order and may be performed in various orders. In addition, according to various embodiments, more operations than those illustrated in FIG. 8 or at least one fewer operations may be performed. Hereinafter, FIG. 8 will be described with reference to FIGS. 9 to 10A to 10B.

9 is a diagram illustrating a signal received from an electronic device and a signal received from an electronic device according to whether the communication device is normally fastened by a fastening member of the communication device according to various embodiments of the present disclosure and/or whether the electronic device contacts a ground pad of a first substrate; / or a diagram for explaining an example of an operation to cut off power. 10A is a view for explaining an example of electrical connection by a fastening member of upper surface ground pads of a communication device according to various embodiments of the present disclosure; FIG. 10B is a diagram for explaining an example of electrical connection of lower surface ground pads of a communication device by a ground pad of a first substrate of an electronic device according to various embodiments of the present disclosure;

According to various embodiments, the communication device 201 (eg, a control circuit (eg, 690 of FIG. 6 )) may receive a first signal from the processor of the external electronic device 202 in operation 801 . For example, a control circuit (eg, 690 of FIG. 6 ) (eg, an AND logic circuit) is electrically connected from the first processor 610 of the electronic device 202 through a first input terminal as shown in FIG. 9 . A high-level signal (eg, a first signal (eg, a signal for turning on the second converter circuit 680)) or a low-level signal may be received through the signal lines 912 and 922 . have. As described above in FIG. 5 , the communication device 201 is fully inserted into the slot 360 of the electronic device 202 (eg, the contact portion of the communication device 201 is in contact with the connector of the electronic device 202 ). In this case, the second signal line 922 connected to the first input terminal of the control circuit (eg, 690 of FIG. 6 ) of the communication device 201 may be connected to the first signal line 912 of the electronic device 202 . In the control circuit (eg, 690 of FIG. 6 ), the first processor 610 of the electronic device 202 turns on a first signal (eg, the second converter circuit 680 ) through a first input terminal. -on), the first signal that is a high level signal may be received, and when the first processor 610 does not output the first signal, a low level signal may be received (or, may not receive a signal).

According to various embodiments, the first processor 610 of the electronic device 202 turns on the first signal (eg, the second converter circuit 680) according to satisfaction of a specified event. signal) can be output. For example, the satisfaction of the specified event is an event in which the electronic device 202 is turned on, or a program for controlling the electronic device 202 to output the first signal is executed and / or may include a triggered event. Without being limited to the above description, the first processor 610 of the electronic device 202 is a signal fed back from the communication device 201 (eg, whether the communication device 201 is engaged and/or the communication device 201 ) It may be configured to output the first signal in response to receiving a signal indicating whether the first substrate of the electronic device 202 is in contact with the ground pad). This will be described later with reference to FIGS. 12 to 13 .

According to various embodiments, when the first conductor and at least one second conductor are electrically connected to each other in operation 802 , the communication device 201 may receive the second signal through the first conductor. For example, the control circuit (eg, 690 in FIG. 6 ) (eg, AND logic circuit 720 ) may be configured to connect to the second substrate 410 of the communication device 201 through a second input terminal as shown in FIG. 9 . A high-level signal (eg, a second signal) or a low-level signal depending on whether the top ground pads (eg, the first conductor 422 and the at least one second conductor 423) are electrically connected to each other can receive The second input terminal of the AND logic circuit 720 is connected to a floating (or not connected to the ground) ground pad (eg, the first conductor 422 ) among the upper ground pads through the inverter 725 . connected and may be connected to a power line (eg, a second power line 921 connected to an input terminal of the second converter circuit 680) through a first resistor 723 . The electrical connection state of the upper surface ground pads 422 and 423 is changed according to whether the communication device 201 is fastened to the electronic device 202 by a fastening member (eg, screw) (eg, 510), A high level signal or a low level signal may be generated based on the change in the connection state. The second input terminal of the AND logic circuit 720 may receive a high level signal or a low level signal generated based on a change in the connection state. Hereinafter, an example of an operation in which the AND logic circuit 720 receives a high-level signal or a low-level signal according to a change in the electrical connection state of the upper surface ground pads 422 and 423 and a change in the electrical connection state will be described. explain more.

According to various embodiments, the AND logic circuit 720 may receive a low-level signal (eg, a signal having a specified low value) when the top ground pads are electrically separated. For example, as shown in 1001 of FIG. 10A , upper surface ground pads (eg, the first conductor 422 and the first At least one second conductor 423 electrically separated from the conductor 422 may be electrically isolated from each other. When the first converter circuit 634 outputs power, the power flowing through the second power line 921 according to the electrical connection is transmitted through the first resistor 723 to a high level signal (eg, a specified high value ( A first inverter 725 through a first conductor 422 connected to the first resistor 723 by a voltage drop (eg, a voltage and/or a current drop by a resistor)). ) can be transmitted to the input terminal. The first inverter 725 may invert the high-level signal to a low-level signal and output the low-level signal through an output terminal. The AND logic circuit 720 may receive the low level signal output from the first inverter 725 through the second input terminal.

According to various embodiments, the AND logic circuit 720 may receive a high level signal (eg, a signal having a specified high value) when the upper ground pads 422 and 423 are electrically connected. For example, as shown in 1002 of FIG. 10A , in a state in which the second substrate 410 of the above-described communication device 201 is fully inserted into the slot 360 of the electronic device 202 , the fastening member 510 ) may be inserted into the fastening structure of the electronic device 202 through a recessed region (eg, 411 ) of the fastening structure of the second substrate 410 of the communication device 201 . When the fastening member 510 is fully fastened, the head 511 of the fastening member 510 is electrically separated from the upper ground pads (eg, the first conductor 422 and the first conductor 422 ). and at least one second conductor 423 that is electrically separated from each other. The upper ground pads may be electrically connected to each other through the head 511 of the fastening member 510 in contact. As described above, when the communication device 201 and the electronic device 202 are electrically connected (eg, the contact portion 450 of the communication device 201 is in contact with the connector 503 of the electronic device 202 ) When the first converter circuit 634 outputs power in this state, the power flowing through the second power line 921 according to the electrical connection is transmitted through the first resistor 723 to a high level signal (eg, a designated high level signal). It may drop to a value (eg, a signal having Vcc, +5V) (eg, a voltage and/or current drop by a resistor) and may be transmitted to the first conductor 422 . The lowered high level signal transmitted to the first conductor 422 is electrically connected to the first conductor 422 through the head 511 of the fastening member 510 and the at least one second conductor It can be discharged to ground through (423). As the high level signal is emitted, a low level signal may be transmitted from the first conductor 422 to the input terminal of the first inverter 725 . The first inverter 725 may invert the received low-level signal to a high-level signal and output a high-level signal through an output terminal. The AND logic circuit 720 may receive the high level signal output from the first inverter 726 through the second input terminal.

On the other hand, when the communication device 201 and the electronic device 202 are not electrically connected, the first conductor 422 is in a floating state because power (or a high level signal) is not applied. can be In this case, since there is no signal applied to the input terminal of the first inverter, there may also be no signal output from the output terminal of the first inverter 725 . In other words, when the communication device 201 and the electronic device 202 are not electrically connected, there may be no signal applied to the second input terminal of the AND logic circuit 720 .

According to various embodiments, the communication device 201 receives a third signal through the third conductor 426 when the third conductor 426 and the at least one fourth conductor 427 are electrically connected in operation 803 . can do. For example, the control circuit (eg, 690 of FIG. 6 ) (eg, AND logic circuit 720 ) may be connected to the second substrate 410 of the communication device 201 through a third input terminal as shown in FIG. 9 . A high-level signal (eg, a third signal) or a low-level signal depending on whether the bottom ground pads (eg, the third conductor 426 and the at least one fourth conductor 427) are electrically connected to each other can receive The third input terminal of the AND logic circuit 720 is connected to a floating (or not connected to the ground) ground pad (eg, a third conductor 426) among ground pads through an inverter 726. connected, and may be connected to a power line (eg, a second power line connected to an input terminal of the second converter circuit 680) through a second resistor. According to whether the lower surface ground pads 426 and 427 of the second substrate 410 of the communication device 201 are in contact with the ground pad on the first substrate of the electronic device 202, the lower surface ground pad 426, 427) is changed, and a high-level signal or a low-level signal may be generated based on the change in the connection state. The third input terminal of the AND logic circuit 720 may receive a high level signal or a low level signal generated based on a change in the electrical connection state. Hereinafter, an example of an operation in which the AND logic circuit 720 receives a high-level signal or a low-level signal according to a change in the electrical connection state of the lower ground pads 426 and 427 and a change in the electrical connection state will be described. explain more.

According to various embodiments, the AND logic circuit 720 may receive a low-level signal (eg, a signal having a specified low value) when the lower ground pads are electrically separated. For example, as shown in 1011 of FIG. 10B , the lower surface ground pads (eg, the third conductor 426 and the third At least one fourth conductor 427 electrically separated from the conductor 426 may be electrically isolated from each other. When the communication device 201 is fully inserted into the electronic device 202 , the first converter circuit 634 of the electronic device 202 and the second converter circuit 680 of the communication device 201 are electrically connected to each other. can be connected to When the first converter circuit 634 outputs power, the power flowing through the second power line 921 according to the electrical connection is transmitted through the second resistor 724 to a high level signal (eg, a specified high value (eg, : Vcc, a signal having +5V)) is dropped (eg, voltage and/or current is dropped by a resistor), and is connected to the input terminal of the second inverter through the third conductor 426 connected to the second resistor 724. can be transmitted. The second inverter 726 may invert the high-level signal to a low-level signal and output the low-level signal through an output terminal. The AND logic circuit 720 may receive the low level signal output from the second inverter 726 through the third input terminal.

According to various embodiments, the AND logic circuit 720 may receive a high level signal (eg, a signal having a specified high value) when the lower ground pads 426 and 427 are electrically connected. For example, as shown in 1012 of FIG. 10B , in a state in which the second substrate 410 of the communication device 201 is fully inserted into the slot 360 of the electronic device 202 , the fastening member 510 ) may be inserted into the fastening structure of the electronic device 202 through a recessed region of the fastening structure of the second substrate 410 of the communication device 201 . As a force is applied from the upper surface of the first substrate 310 of the communication device 201 toward the second substrate 410 of the electronic device 202 by the inserted fastening member 510 , the second The lower surface of the second substrate 410 may be in close contact with the upper surface of the first substrate 310 . When the ground pad 371 of the first substrate 310 is in close contact with each other, the ground pads (eg, the first conductor 422 and the first conductor) of the second substrate 410 are electrically separated from each other. Both of the at least one second conductor 423 electrically separated from the 422 may be in contact. The lower ground pads may be electrically connected to each other through the ground pad 371 of the contacted first substrate 310 . As described above, when the communication device 201 and the electronic device 202 are electrically connected (eg, the contact portion 450 of the communication device 201 is in contact with the connector 503 of the electronic device 202 ) In this state, when the first converter circuit 634 outputs power, the power flowing through the second power line 921 according to the electrical connection is transmitted through the second resistor 724 to a high level signal (eg, a designated high level signal). It is dropped to a value (eg, a signal having Vcc, +5V) (eg, a voltage and/or current is dropped by a resistor) and may be transmitted to the third conductor 426 . The lowered high-level signal transmitted to the second conductor 423 causes the at least one fourth conductor 427 electrically connected to the third conductor 426 through the ground pad of the first substrate. can be released to the ground through As the high level signal is emitted, a low level signal may be transmitted from the third conductor 426 to the input terminal of the second inverter 726 . The second inverter 726 may invert the received low-level signal to a high-level signal and output a high-level signal through an output terminal. The AND logic circuit 720 may receive the high level signal output from the second inverter 726 through the third input terminal.

Meanwhile, when the communication device 201 and the electronic device 202 are not electrically connected, power (or a high level signal) is applied to the third conductor 426 like the first conductor 422 . Because it does not, it may be in a floating state. In other words, when the communication device 201 and the electronic device 202 are not electrically connected, there may be no signal applied to the third input terminal of the AND logic circuit 720 .

According to various embodiments, the communication device 201 may output a control signal for controlling the converter based on the first signal, the second signal, and the third signal in operation 804 . For example, the AND logic circuit 720 may respond to receiving a high level signal through all input terminals (eg, a first input terminal, a second input terminal, and a third input terminal) as shown in FIG. 9 . , a high level signal (or a control signal) may be output. The high level signal output from the AND logic circuit 720 may be set to cause the second converter circuit 680 of the communication device 201 to perform an operation. A second converter circuit 680 is driven in response to receiving the control signal, and the driven second converter circuit 680 is connected to the first converter circuit 634 through the second power line 921 . Power received from the power line 911 connected to the output terminal may be converted to provide the converted power to other devices (eg, the second processor 650 ) of the communication device 201 . Other devices of the communication device 201 may operate in response to receiving the power.

Meanwhile, the present invention is not limited thereto, and various types of devices may be provided in the communication device 201 to provide power to the remaining components of the communication device 201 by distributing other power instead of the second converter circuit 680 . Like the second converter circuit 680, the device is driven based on a control signal received from a control circuit (eg, 690 in FIG. 6 (eg, AND logic circuit 720)), and according to the driving, the electronic device The power received from the 202 may be distributed as it is or by converting the power to the remaining components of the communication device 201 .

Hereinafter, examples of operations of the communication device 201 according to various embodiments will be described.

According to various embodiments, the communication device 201 (eg, the control circuit 690 ) determines whether the communication device 201 is fastened by a fastening member and/or the second substrate 410 of the communication device 201 . may transmit a feedback signal indicating whether the lower surface of the electronic device 202 is in contact with the ground pad 371 of the first substrate 310 to the electronic device 202 . The electronic device 202 may transmit a control signal or power to the communication device 201 based on the received feedback signal.

11 is a flowchart 1100 for explaining an example of an operation of a communication device according to various embodiments of the present disclosure. According to various embodiments, the operations illustrated in FIG. 11 are not limited to the illustrated order and may be performed in various orders. Also, according to various embodiments, more operations than the operations illustrated in FIG. 11 may be performed, or at least one fewer operations may be performed. Hereinafter, FIG. 11 will be described with reference to FIG. 12 .

12 is an example of an operation of transmitting a feedback signal and receiving a control signal from an electronic device according to whether a communication device is fastened and/or contacts a ground pad of a first substrate of the electronic device according to various embodiments of the present disclosure; It is a drawing for explaining.

According to various embodiments, the communication device 201 is electrically connected to the first conductor 422 and the at least one second conductor 423 in operation 1101 , and the third conductor 426 and the at least one fourth conductor When 427 is electrically connected, a fastening detection signal may be transmitted to the external electronic device 202 . For example, as shown in FIG. 12 , in the communication device 201 , whether the communication device 201 is fastened by a fastening member and the lower surface of the second board 410 of the communication device 201 is the first board 310 of the electronic device 202 . . One input terminal (eg, a fourth input terminal) of two input terminals (eg, a fourth input terminal and a fifth input terminal) of the first control circuit (eg, 1200 ) is a ground pad (eg, a ground pad not connected to the ground) among the top ground pads. : A ground pad (eg, a third conductor 426) connected to the inverter 1201 connected to the first conductor 422), and the other input terminal (eg, a fifth input terminal) is not connected to the ground among the lower ground pads. ) may be connected to the inverter 1202 connected to the .

According to various embodiments of the present disclosure, the first control circuit 1200 has two input terminals when the upper ground pads 422 and 423 are electrically connected and the lower surface ground pads 426 and 427 are electrically connected to each other. A high-level signal may be received through , and a control signal may be transmitted to the first processor 610 of the electronic device 202 based on the reception of the high-level signal. The first control circuit 1200 is based on the communication device 201 being electrically connected to the electronic device 202 (eg, a contact portion of the communication device 201 is in contact with a connector of the electronic device 202 ). ) and the first processor 610 of the electronic device 202 may be electrically connected. For example, a signal line connected to an output terminal of the first control circuit 1200 may be electrically connected to a signal line connected to an input terminal of the first processor 610 of the electronic device 202 . As described above, as the respective upper and lower ground pads are electrically connected, a low-level signal may be generated from the floating ground pads (eg, the first conductor 422 and the third conductor 426). have. Each of the inverters (eg, 1201 and 1202) may convert the low level signal and transmit it to input terminals (eg, a fourth input terminal and a fifth input terminal) of the first control circuit 1200 as a high level signal. The first control circuit 1200 may output a control signal in response to receiving a high level signal through input terminals. For example, the control signal is fastened by the fastening member 510 of the communication device 201 and the lower surface of the second substrate 410 of the communication device 201 is the first substrate ( It may indicate contact with the ground pad 371 of the 310 .

According to various embodiments, the communication device 201 (eg, a control circuit) receives a first signal from the first processor 610 of the external electronic device 202 in response to transmitting the signal in operation 1102 . can do. For example, the first processor 610 of the electronic device 202 turns on the second converter circuit 680 in response to receiving the control signal from the first control circuit 1200 . -on) can output a control signal. As described above with reference to FIGS. 8 to 10 , the control circuit 720 may receive the control signal through a first input terminal. Since the operation of the control circuit 720 to receive the signal through the first input terminal may be performed in the same manner as the operation 801 of the communication device 201 described above, a redundant description will be omitted. Also for example, the first processor 610 may generate a control signal for controlling the first converter circuit 634 to transmit power to the second converter circuit 680 based on the reception of the first signal. It may be transmitted to the first converter circuit 634 .

According to various embodiments, the communication device 201 (eg, a control circuit) receives a second signal through the first conductor 422 , receives a third signal through the third conductor 426 in operation 1103 , and , in operation 1104 , a control signal for controlling the converter may be output based on the first signal, the second signal, and the third signal. For example, when the top ground pads (eg, the first conductor 422 and the at least one second conductor 423) are electrically connected through the second input terminal, the control circuit 720 provides a high level signal (eg, : When receiving the second signal) and ground pads (eg, the third conductor 426 and the at least one fourth conductor 427) are electrically connected through the third input terminal, a high-level signal (eg: a third signal) can be received. The operation of receiving a signal through the second input terminal and the third input terminal of the control circuit 720 may be performed in the same manner as operations 802 to 803 of the communication device 201, and thus redundant description will be omitted. The control circuit 720 controls the second converter circuit 680 in response to receiving a high level signal through all of the input terminals (eg, a first input terminal, a second input terminal, and a third input terminal). and/or may output a control signal for driving). The operation of outputting the control signal of the control circuit 720 may be performed in the same manner as operation 804 of the communication device 201 described above, and thus a redundant description will be omitted.

Hereinafter, examples of operations of various types of electronic devices according to various embodiments will be described.

According to various embodiments, as described above, various types of devices (eg, memory card, graphic card) that can be inserted into the electronic device 202 other than the communication device 201 are described above (eg, ground). Electrical separation of the pads and the control circuit 690 (eg, AND logic circuit 720) may be applied mutatis mutandis.

Also, according to various embodiments, a plurality of fastening structures may be formed on a substrate of devices (eg, a memory card, a graphic card), and ground pads electrically separated from each other may be disposed in adjacent regions of the plurality of fastening structures. . Some of the separated ground pads may not be connected to the ground as described above, and other parts may be connected to the ground. A control circuit of the device is connected to some of the ground pads to receive signals and perform operations depending on whether the substrate is fastened and/or in contact with the ground pad 371 on the first substrate 310 of the electronic device 202 . can be done

13 is a flowchart 1300 for explaining an example of an operation of an apparatus according to various embodiments. According to various embodiments, the operations illustrated in FIG. 13 are not limited to the illustrated order and may be performed in various orders. In addition, according to various embodiments, more operations than those illustrated in FIG. 13 or at least one fewer operations may be performed. Hereinafter, FIG. 13 will be described with reference to FIG. 14 .

14 illustrates an example of an operation of transmitting a feedback signal and receiving a control signal from the device according to whether the device is fastened and/or whether the electronic device is in contact with the ground pad of the first substrate, according to various embodiments; It is a drawing for

According to various embodiments, the first device (eg, a memory card or a graphic card) may receive a first signal from the processor of the external electronic device in operation 1301 . For example, when a first device (eg, a memory card or a graphic card) is inserted into the electronic device 202 (eg, a Note PC), the first device may be electrically connected to the electronic device 202 . For example, one input terminal (eg, a first input terminal) among a plurality of input terminals of the control circuit of the first device may be electrically connected to the first processor 610 of the electronic device 202 as shown in FIG. 14 . can A first input terminal of the control circuit 1410 (eg, an AND logic circuit) may receive a control signal output from the first processor 610 . The operation of receiving the first signal may be performed in the same manner as operations 801 and 1101 to 1102 of the communication device 201 described above, and thus a redundant description will be omitted.

According to various embodiments, the device (eg, a memory card or a graphic card) may receive a plurality of signals from the plurality of conductors according to the fastening of the fastening member in operation 1302 . For example, the remaining input terminals among the plurality of input terminals of the control circuit 1410 of the first device are ground pads 1401 , 1402 , and 1403 disposed in areas adjacent to the plurality of fastening structures of the substrate 1400 of the first device. , 1404) may be electrically connected to some of which are not connected to the ground. As described above with reference to FIGS. 8 to 10 , the electrical connection is performed by the head of the fastening member in the case of upper ground pads, and by the ground pad of the first substrate of the electronic device 202 in the case of lower ground pads. Therefore, redundant descriptions are omitted. A portion not connected to the ground is connected to a power line and may receive a high-level signal dropped by a resistor. When the ground pads 1401 , 1402 , 1403 , and 1404 are electrically connected, a high level signal is emitted through some remaining ground pads connected to the ground, and each of the inverters connected to the remaining input terminals of the control circuit 1410 . may convert a low-level signal generated based on the emission of the high-level signal into a high-level signal. Each of the input terminals of the control circuit 1410 may receive a high level signal converted by each of the inverters. The operation of the control circuit receiving a high level signal or a low level signal depending on whether the ground pads 1401 , 1402 , 1403 , and 1404 are electrically connected is described above in operations 802 to 803 of the communication device 201 . Since they are the same as described above, overlapping descriptions will be omitted.

According to various embodiments, the device (eg, a memory card or a graphic card) may output a control signal for controlling the converter based on the first signal and the plurality of signals in operation 1303 . For example, the aforementioned control circuit 1410 may output a control signal for controlling the converter circuit 1420 in response to receiving a high level through a plurality of input terminals. The operation of outputting the control signal of the control circuit 1410 may be performed in the same manner as operation 804 of the communication device 201 described above, and thus a redundant description thereof will be omitted.

Hereinafter, examples of operations of various types of electronic devices according to various embodiments will be described.

According to various embodiments, the electronic device 202 is configured to identify whether the above-described communication device 201 is coupled and/or whether the electronic device 202 is coupled to the ground pad 371 of the first substrate 310 . It may include a circuit for When it is identified by the circuit whether the communication device 201 is engaged and/or whether the electronic device 202 is coupled to the ground pad 371 of the first substrate 310, the electronic device 202 sends the communication device ( 201) to transmit a control signal (eg a converter circuit turn-on signal) and/or power.

15 is a flowchart 1500 for explaining an example of an operation of an apparatus according to various embodiments. According to various embodiments, the operations illustrated in FIG. 15 are not limited to the illustrated order and may be performed in various orders. In addition, according to various embodiments, more operations than those illustrated in FIG. 15 or at least one fewer operations may be performed. Hereinafter, FIG. 15 will be described with reference to FIGS. 16A and 16B.

16A is a diagram for describing an example of an operation of transmitting a control signal and/or power to a communication device according to whether a ground pad of the electronic device of the electronic device and the communication device are in contact, according to various embodiments of the present disclosure; 16B is a diagram for describing an example of electrical connection of electrically separated ground pads of an electronic device according to various embodiments of the present disclosure;

According to various embodiments, the electronic device 202 may receive the first signal based on the insertion of the communication device 201 in operation 1501 . For example, referring to FIG. 16A , the first processor 610 of the electronic device 202 is disposed to be spaced apart from each other on the first substrate 310 and electrically connected to the electrically separated ground pads 1601 and 1602 . A high-level signal may be received depending on whether the connection is made or not. A portion 1601 of the ground pads 1601 and 1602 that is not connected to the ground may be connected to a power line through a resistor 1611 , and the remaining portion 1602 may be connected to the ground 641 . As shown in FIG. 16B , the ground pads 1601 and 1602 electrically separated from each other are in contact with the lower surface ground pad 1630 formed on the lower surface of the second substrate 410 of the communication device 201 . Accordingly, the lower surface may be electrically connected through the ground pad. In this case, the resistor 1611 is applied to a part of the ground pads 1601 and 1602 that is not connected to the ground 1601 through the power line (eg, the power line output from the first converter circuit 634 ). The high-level signal dropped by ? may be emitted through the remaining part 1602 of the ground pads 1601 and 1602 connected to the ground according to the electrical connection. A low level signal may be generated based on the emission of the high level signal, and the generated low level signal may be converted into a high level signal by the inverter 1612 and transmitted to the first processor 610 .

Meanwhile, in this case, the lower surface ground pad 1630 of the second substrate 410 of the communication device 201 may be integrally formed as shown in FIG. 16B (or not electrically separated). have). Alternatively, the lower surface ground pads (not shown) are arranged to be electrically separated, and the lower surface ground pads are spaced apart from the ground pads 1601 and 1602 formed in the first substrate 310 at positions corresponding to the spaced apart spaces. It can be implemented to be larger than the size of the designated space. Accordingly, the ground pads 1601 and 1602 on the first substrate 310 of the electronic device 202 may be electrically connected to each other by the spaced apart lower surface ground pads. Also in this case, although not shown, the above-described control circuit (eg, the control circuit of FIG. 9 ) is implemented in the communication device 201 , so that the first processor 610 is electrically connected to the ground pad of the first substrate 310 . A signal may be received depending on whether or not the ground pads (eg, lower surface ground pads and upper surface ground pads) of the second substrate 410 of the communication device 201 are electrically connected. For example, the first processor 610 includes two input terminals, and each of the two input terminals is for electrical connection of ground pads disposed on the upper and lower surfaces of the first substrate 310 and the second substrate 410 . Therefore, it can be implemented to receive a high level signal.

According to various embodiments, the electronic device 202 may transmit a control signal to the communication device 201 based on receiving the first signal in operation 1502 . For example, the first processor 610 may transmit a control signal for turning on the second converter circuit 680 based on the reception of the first signal. Also for example, the first processor 610 may generate a control signal for controlling the first converter circuit 634 to transmit power to the second converter circuit 680 based on the reception of the first signal. may be transmitted to the first converter circuit 634 .

According to various embodiments, as a communication device (eg, 201 of FIG. 2 ) insertable into an external electronic device (eg, 202 of FIG. 2 ), a converter circuit (eg, 680 of FIG. 6 ), a power line, and connection with the power line a first conductor (eg, 422 in FIG. 7B ), and at least one second conductor (eg, 423 in FIG. 7B ) electrically isolated from the first conductor (eg 422 in FIG. 7B ) and connected to the ground - According to the connection between the communication device (eg, 201 in FIG. 2 ) and the external electronic device (eg, 202 in FIG. 2 ), the first conductor (eg, 422 in FIG. 7B ) and the at least one second conductor ( Example: 423 in FIG. 7B is electrically connected - including a signal line, and the power line, the first conductor (eg 422 in FIG. 7B ), and a control circuit coupled to the signal line (eg 720 in FIG. 7B ) and the control circuit (eg, 720 in FIG. 7B ) receives a first signal from the processor of the external electronic device (eg, 202 in FIG. 2 ) through the signal line, and the first conductor (eg, in FIG. 7B ) 422) and the at least one second conductor (eg, 423 in FIG. 7B ) are electrically connected, the power flowing in the power line is transferred to the ground through the at least one second conductor (eg, 423 in FIG. 7B ). A communication device (eg, FIG. 2 of 201) may be provided.

According to various embodiments, the control circuit (eg, 720 of FIG. 7B ) may include the first conductor (eg, 422 of FIG. 7B ) and the at least one second signal while receiving the first signal through the signal line. a communication device (e.g., 423 in Fig. 7b) implemented to refrain from outputting the control signal to control the converter circuit based on receiving a third signal generated while the two conductors (e.g. 423 in Fig. 7b) are electrically disconnected; 201 of FIG. 2 may be provided.

According to various embodiments, when the communication device (eg, 201 in FIG. 2 ) is inserted into a slot of a substrate of the external electronic device (eg, 202 in FIG. 2 ), the signal line is connected to the external electronic device (eg, 202 in FIG. 2 ). A communication device (eg, 201 of FIG. 2 ) electrically connected to the processor of 202 of FIG. 2 , and the power line is electrically connected with a first converter circuit of the external electronic device (eg, 202 of FIG. 2 ) may be provided.

According to various embodiments, based on the signal line being electrically connected to the processor of the external electronic device (eg, 202 of FIG. 2 ), the control circuit (eg, 720 of FIG. 7B ) is configured to receive the second signal from the processor. 1 based on the power line being electrically connected to a first converter circuit of the external electronic device (eg, 202 in FIG. 2 ), the converter circuit being configured to receive power, the communication device (eg, : 201) in FIG. 2 may be provided.

According to various embodiments, the converter circuit converts the power received through the power line based on the reception of the control signal to convert the power converted to other components of the communication device (eg, 201 in FIG. 2 ). A communication device (eg, 201 in FIG. 2 ) configured to supply may be provided.

According to various embodiments, the communication device (eg, 201 in FIG. 2 ) may be an M.2 standard communication device (eg, 201 in FIG. 2 ), a communication device (eg, 201 in FIG. 2 ). have.

According to various embodiments, it further includes a first substrate, wherein the first conductor (eg, 422 of FIG. 7B ) and the at least one second conductor (eg, 423 of FIG. 7B ) of the first substrate It is disposed spaced apart from each other on the upper surface, and is adjacent to the first conductor (eg, 422 in FIG. 7B ) and the at least one second conductor (eg, 423 in FIG. 7B ) with a predetermined curvature in the inner direction of the side surface of the substrate A communication device (eg, 201 in FIG. 2 ) may be provided in which a recessed region is formed.

According to various embodiments, in a state in which the communication device (eg, 201 of FIG. 2 ) is inserted into the slot of the second substrate of the external electronic device (eg, 202 of FIG. 2 ) is vertically inserted through the recessed area As both the first conductor (eg, 422 in FIG. 7B ) and the at least one second conductor (eg, 423 in FIG. 7B ) come into contact with the fastening member to be used, the first conductor (eg, 422 in FIG. 7B ) and the at least one second conductor (eg, 423 of FIG. 7B ) may be electrically connected to each other, and a communication device (eg, 201 of FIG. 2 ) may be provided.

According to various embodiments, a first resistor connected to the power line and a first inverter are further included, wherein the control circuit (eg, 720 of FIG. 7B ) is AND logic including a first input terminal and a second input terminal circuit, wherein the first input terminal of the control circuit (eg 720 in FIG. 7B ) is connected to the signal line, and the second input terminal of the control circuit (eg 720 in FIG. 7B ) connects the first inverter connected to the first resistor connected to the power line through Receives the first signal from the processor of the external electronic device (eg, 202 in FIG. 2 ) through an input terminal, and receives the first signal (eg, 422 in FIG. 7B ) and the at least one second conductor (eg, 422 in FIG. 7B ) : When 423 of FIG. 7B is electrically connected, the power flowing through the power line is the first resistor, the first conductor (eg, 422 of FIG. 7B ), and the at least one second conductor (eg, FIG. 7B ) 423) of a communication device (eg, 201 in FIG. 2 ) implemented to receive the second signal of high level generated from the first inverter through the second input terminal as it is discharged to the ground can be provided.

According to various embodiments, it is disposed on the lower surface of the first substrate and is electrically separated from a third conductor (eg, 426 in FIG. 7B ) and the third conductor (eg, 426 in FIG. 7B ) connected to the power line, at least one fourth conductor (eg, 427 in FIG. 7B ) connected to the ground, wherein the control circuit (eg 720 in FIG. 7B ) is connected to the third conductor (eg, 426 in FIG. 7B ) and the control circuit (eg, 720 in FIG. 7B ) receives the first signal from the processor of the external electronic device (eg, 202 in FIG. 2 ), and the first conductor (eg, 422 in FIG. 7B ) and the at least one second conductor (eg, 423 of FIG. 7B ) are electrically connected, the second signal is received, and the third conductor (eg, 426 of FIG. 7B ) and the at least one fourth When a conductor (eg, 427 in FIG. 7B ) is electrically connected, a third signal generated as power flowing through the power line is discharged to the ground through the at least one fourth conductor (eg, 427 in FIG. 7B ) a communication device (eg, FIG. 2 ) configured to receive and output the control signal for controlling the converter circuit to the converter circuit based on the first signal, the second signal, and the third signal 201) may be provided.

According to various embodiments, the communication device (eg, 201 of FIG. 2 ) is disposed on the lower surface of the substrate in a state in which the communication device (eg, 201 of FIG. 2 ) is inserted into the slot of the second substrate of the external electronic device (eg, 202 of FIG. 2 ) A third conductor (eg, 426 in FIG. 7B ) and the at least one fourth conductor (eg 427 in FIG. 7B ) are formed based on the conductor of the second substrate of the external electronic device (eg, 202 in FIG. 2 ) , a communication device (eg, 201 in FIG. 2 ) in which the third conductor (eg, 426 in FIG. 7B ) and the at least one fourth conductor (eg, 427 in FIG. 7B ) are electrically connected may be provided. .

According to various embodiments, it further includes a first resistor and a second resistor connected to the power line, and a first inverter and a second inverter, wherein the control circuit (eg, 720 in FIG. 7B ) includes a first input terminal; an AND logic circuit including a second input terminal and a third input terminal, wherein the first input terminal of the control circuit (eg, 720 in FIG. 7B ) is connected to the signal line, and the control circuit (eg, FIG. 7B ) is connected to the signal line 720) is connected to the first resistor connected to the power line through the first inverter, and connected to the first conductor (eg, 422 in FIG. 7B ) through the first inverter, The second input terminal of the control circuit (eg 720 in FIG. 7B ) is connected to the second resistor connected to the power line via the second inverter, and via the second inverter to the third conductor (eg in FIG. 7B ). connected to 426 of 7b, and the control circuit (eg, 720 of FIG. 7b ) receives the first signal from the processor of the external electronic device (eg, 202 of FIG. 2 ) through the first input terminal, and , when the first conductor (eg, 422 of FIG. 7B ) and the at least one second conductor (eg, 423 of FIG. 7B ) are electrically connected, the power flowing through the power line is the first resistor, the first As it is discharged to the ground through a conductor (eg, 422 in FIG. 7B ) and the at least one second conductor (eg, 423 in FIG. 7B ), the high level second signal generated from the first inverter is The power received through the second input terminal and flowing into the power line when the third conductor (eg, 426 in FIG. 7B ) and the at least one fourth conductor (eg, 427 in FIG. 7B ) are electrically connected generated from the second inverter as it exits to the ground through the second resistor, the third conductor (eg 426 in FIG. 7B ), and the at least one fourth conductor (eg 427 in FIG. 7B ) A communication device (eg, 201 of FIG. 2 ) may be provided, configured to receive the third signal of a high level through the second input terminal.

According to various embodiments, in the control circuit (eg, 720 of FIG. 7B ), the first conductor (eg, 422 of FIG. 7B ) and the at least one second conductor (eg, 423 of FIG. 7B ) are electrically connected In response to a signal transmitted to the external electronic device (eg, 202 in FIG. 2 ) based on a connection, a communication device (eg, 201 in FIG. 2 ) is provided, implemented to receive the first signal from the processor can be

According to various embodiments, as a method of operating a communication device (eg, 201 of FIG. 2 ) insertable into an external electronic device (eg, 202 of FIG. 2 ), the external electronic device (eg, 202 of FIG. 2 ) through a signal line ) receiving a first signal from the processor of a first conductor (eg, 422 in FIG. 7B ) connected to the power line and at least electrically separated from the first conductor (eg, 422 in FIG. 7B ) and connected to the ground When one second conductor (eg, 423 in FIG. 7B ) is electrically connected, power flowing through the power line is discharged to the ground through the at least one second conductor (eg, 423 in FIG. 7B ). 2 Receiving a signal - according to the connection between the communication device (eg, 201 in FIG. 2 ) and the external electronic device (eg, 202 in FIG. 2 ), the first conductor (eg, 422 in FIG. 7B ) and the at least one second conductor (eg 423 in FIG. 7b ) is electrically connected - and outputting a control signal for controlling the converter circuit to a converter circuit based on the first signal and the second signal A method of operation comprising: may be provided.

According to various embodiments, while receiving the first signal through the signal line, the first conductor (eg, 422 in FIG. 7B ) and the at least one second conductor (eg, 423 in FIG. 7B ) are electrically connected The method of operation may be provided, further comprising refraining from outputting the control signal for controlling the converter circuit based on receiving a third signal generated during separation.

According to various embodiments, when the communication device (eg, 201 in FIG. 2 ) is inserted into a slot of a substrate of the external electronic device (eg, 202 in FIG. 2 ), the signal line is connected to the external electronic device (eg, 202 in FIG. 2 ). An operating method may be provided that is electrically connected to the processor of 202 of FIG. 2 , and the power line is electrically connected with a first converter circuit of the external electronic device (eg, 202 of FIG. 2 ).

According to various embodiments, the method further includes receiving the first signal from the processor based on the signal line being electrically connected to the processor of the external electronic device (eg, 202 in FIG. 2 ), Based on the power line being electrically connected to the first converter circuit of the external electronic device (eg, 202 of FIG. 2 ), the converter circuit is implemented to receive power.

According to various embodiments, the converter circuit converts the power received through the power line based on the reception of the control signal to convert the power converted to other components of the communication device (eg, 201 in FIG. 2 ). A method of operation, configured to supply, may be provided.

According to various embodiments, the converter circuit, the power line, a first conductor connected to the power line (eg, 422 of FIG. 7B ), and the first conductor (eg, 422 of FIG. 7B ) are electrically isolated from and connected to the ground At least one second conductor (eg, 423 in FIG. 7B ) that becomes Example: 422 in FIG. 7B ) and the at least one second conductor (eg 423 in FIG. 7B ) are electrically connected - to a signal line, and to the power line and to the first conductor (eg 422 in FIG. 7B ) a logic circuit including a first input terminal and a second input terminal connected to the signal line, wherein the logic circuit receives a first signal from a processor of the external electronic device (eg, 202 in FIG. 2 ) through the first input terminal configured to receive, receive a second signal through the second input terminal, and output a control signal for controlling the converter circuit to the converter circuit based on the signal level of the second signal being a specified level, A communication device (eg, 201 in FIG. 2 ) may be provided.

According to various embodiments, as a communication device (eg, 201 of FIG. 2 ) insertable into an external electronic device (eg, 202 of FIG. 2 ), a first substrate, a converter circuit, a power line, and an upper surface of the first substrate and a first conductor (eg, 422 in FIG. 7B ) connected to the power line, and at least one second conductor (eg, 422 in FIG. 7B ) electrically isolated from the first conductor (eg, 422 in FIG. 7B ) and connected to the ground 423 of 7b) - According to the connection between the communication device (eg, 201 of FIG. 2 ) and the external electronic device (eg, 202 of FIG. 2 ), the first conductor (eg, 422 of FIG. 7b ) and the at least one A second conductor (eg, 423 in FIG. 7B ) is electrically connected-, a third conductor (eg, 426 in FIG. 7B ) disposed on the lower surface of the first substrate and connected to the power line (eg, 426 in FIG. 7B ), and the third conductor ( Example: at least one fourth conductor (eg, 427 in FIG. 7B ) electrically isolated from 426 in FIG. 7B and connected to the ground - the lower surface of the first substrate of the communication device (eg, 201 in FIG. 2 ) and the third conductor (eg, 426 in FIG. 7B ) and the at least one fourth conductor (eg, in FIG. 7B ) according to contact of the upper surface of the second substrate of the external electronic device (eg, 202 in FIG. 2 ) 427) is electrically connected - a signal line, and a control circuit connected to the power line, the first conductor (eg 422 in FIG. 7b), the third conductor (eg 426 in FIG. 7b) and the signal line (eg: 720 of FIG. 7B , wherein the control circuit (eg, 720 of FIG. 7B ) receives a first signal from a processor of the external electronic device (eg, 202 of FIG. 2 ) through the signal line, and When a conductor (eg, 422 in FIG. 7B ) and the at least one second conductor (eg, 423 in FIG. 7B ) are electrically connected, power flowing in the power line is transferred to the at least one second conductor (eg, 423 in FIG. 7B ). 423) through the second signal generated as it is discharged to the ground. and when the third conductor (eg, 426 in FIG. 7B ) and the at least one fourth conductor (eg, 427 in FIG. 7B ) are electrically connected, the power flowing in the power line is transferred to the at least one fourth conductor Control for receiving a third signal generated by being discharged to the ground through (eg, 427 in FIG. 7B ) and controlling the converter circuit with the converter circuit based on the first signal and the second signal A communication device (eg, 201 in FIG. 2 ) implemented to output a signal may be provided.

Claims (20)

A communication device insertable into an external electronic device, comprising:
converter circuit;
power line;
a first conductor connected to the power line, and at least one second conductor electrically isolated from the first conductor and connected to a ground-according to the connection between the communication device and the external electronic device, the first conductor and the at least one second conductor is electrically connected;
signal line; and
a control circuit coupled to the power line, the first conductor, and the signal line, the control circuit comprising:
receiving a first signal from the processor of the external electronic device through the signal line;
When the first conductor and the at least one second conductor are electrically connected, receiving a second signal generated as power flowing through the power line is discharged to the ground through the at least one second conductor,
and output a control signal for controlling the converter circuit to the converter circuit based on the first signal and the second signal.
The method of claim 1,
The control circuit is
the control for controlling the converter circuit based on receiving a third signal generated while the first conductor and the at least one second conductor are electrically separated while receiving the first signal via the signal line A communications device implemented to refrain from outputting a signal.
The method of claim 1,
When the communication device is inserted into the slot of the substrate of the external electronic device, the signal line is electrically connected to the processor of the external electronic device, and the power line is electrically connected to the first converter circuit of the external electronic device , communication devices.
4. The method of claim 3,
Based on the signal line being electrically connected to the processor of the external electronic device, the control circuit is configured to receive the first signal from the processor,
and the converter circuit is configured to receive power based on the power line being electrically connected to the first converter circuit of the external electronic device.
5. The method of claim 4,
and the converter circuit is configured to convert power received through the power line to supply the converted power to other components of the communication device based on the reception of the control signal.
The method of claim 1,
The communication device is an M.2 standard communication device.
The method of claim 1, further comprising a first substrate;
The first conductor and the at least one second conductor are disposed to be spaced apart from each other on the upper surface of the first substrate,
and a region recessed with a predetermined curvature in an inward direction of a side surface of the substrate is formed adjacent to the first conductor and the at least one second conductor.
8. The method of claim 7,
As both the first conductor and the at least one second conductor come into contact with the fastening member vertically inserted through the recessed region while the communication device is inserted into the slot of the second substrate of the external electronic device, the wherein the first conductor and the at least one second conductor are electrically connected.
9. The apparatus of claim 8, further comprising: a first resistor coupled to the power line; and a first inverter; further comprising
wherein the control circuit is an AND logic circuit comprising a first input end and a second input end;
the first input end of the control circuit is connected to the signal line;
the second input end of the control circuit is connected to the first resistor connected to the power line through the first inverter and connected to the first conductor through the first inverter;
The control circuit is:
receiving the first signal from the processor of the external electronic device through the first input terminal;
When the first conductor and the at least one second conductor are electrically connected, the power flowing in the power line is discharged to the ground through the first resistor, the first conductor, and the at least one second conductor. Accordingly, the communication device is implemented to receive the second signal of the high level generated from the first inverter through the second input terminal.
8. The method of claim 7, further comprising: a third conductor disposed on a lower surface of the first substrate and connected to the power line; and at least one fourth conductor electrically separated from the third conductor and connected to the ground;
the control circuit is connected to the third conductor;
The control circuit is:
receiving the first signal from the processor of the external electronic device;
receiving the second signal when the first conductor and the at least one second conductor are electrically connected;
When the third conductor and the at least one fourth conductor are electrically connected, a third signal generated as power flowing through the power line is discharged to the ground through the at least one fourth conductor is received;
configured to output the control signal for controlling the converter circuit to the converter circuit based on the first signal, the second signal, and the third signal;
communication device.
11. The method of claim 10,
The third conductor and the at least one fourth conductor disposed on the lower surface of the substrate in a state in which the communication device is inserted into the slot of the second substrate of the external electronic device is a conductor of the second substrate of the external electronic device based on which the third conductor and the at least one fourth conductor are electrically connected.
12. The apparatus of claim 11, further comprising: a first resistor and a second resistor coupled to the power line; and a first inverter and a second inverter; further comprising,
wherein the control circuit is an AND logic circuit comprising a first input stage, a second input stage, and a third input stage;
the first input end of the control circuit is connected to the signal line;
the second input end of the control circuit is connected to the first resistor connected to the power line through the first inverter and connected to the first conductor through the first inverter;
the second input end of the control circuit is connected to the second resistor connected to the power line through the second inverter and connected to the third conductor through the second inverter;
The control circuit is:
receiving the first signal from the processor of the external electronic device through the first input terminal;
When the first conductor and the at least one second conductor are electrically connected, the power flowing in the power line is discharged to the ground through the first resistor, the first conductor, and the at least one second conductor. Accordingly, receiving the high level second signal generated from the first inverter through the second input terminal,
When the third conductor and the at least one fourth conductor are electrically connected, the power flowing in the power line is discharged to the ground through the second resistor, the third conductor, and the at least one fourth conductor. and thus receiving the third signal of high level generated from the second inverter through the second input terminal.
The method of claim 1,
The control circuit is:
and receive the first signal from the processor in response to a signal transmitted to the external electronic device based on the electrical connection between the first conductor and the at least one second conductor.
A method of operating a communication device that can be inserted into an external electronic device, comprising:
receiving a first signal from a processor of the external electronic device through a signal line;
When the first conductor connected to the power line and at least one second conductor electrically separated from the first conductor and connected to the ground are electrically connected, the power flowing through the power line is transferred to the ground through the at least one second conductor. receiving a second signal generated as it is emitted, wherein the first conductor and the at least one second conductor are electrically connected according to the fastening of the communication device and the external electronic device; and
outputting a control signal for controlling the converter circuit to a converter circuit based on the first signal and the second signal.
15. The method of claim 14,
the control for controlling the converter circuit based on receiving a third signal generated while the first conductor and the at least one second conductor are electrically separated while receiving the first signal via the signal line refraining from outputting the signal; further comprising a method of operation.
15. The method of claim 14,
When the communication device is inserted into the slot of the substrate of the external electronic device, the signal line is electrically connected to the processor of the external electronic device, and the power line is electrically connected to the first converter circuit of the external electronic device , how it works.
17. The method of claim 16,
The method further comprising: receiving the first signal from the processor based on the signal line being electrically connected to the processor of the external electronic device, wherein the power line is electrically connected to the first converter circuit of the external electronic device based on being coupled, the converter circuit is configured to receive power.
18. The method of claim 17,
and the converter circuit is configured to convert power received through the power line to supply the converted power to other components of the communication device based on the reception of the control signal.
A communication device insertable into an external electronic device, comprising:
converter circuit;
power line;
a first conductor connected to the power line, and at least one second conductor electrically isolated from the first conductor and connected to a ground-according to the connection between the communication device and the external electronic device, the first conductor and the at least one second conductor is electrically connected;
signal line; and
a logic circuit including a first input terminal connected to the power line and the first conductor, and a second input terminal connected to the signal line, wherein the logic circuit comprises:
receiving a first signal from the processor of the external electronic device through the first input terminal;
receiving a second signal through the second input terminal;
and output a control signal for controlling the converter circuit to the converter circuit based on the signal level of the second signal being a specified level.
A communication device insertable into an external electronic device, comprising:
a first substrate;
converter circuit;
power line;
A first conductor disposed on the upper surface of the first substrate and connected to the power line, and at least one second conductor electrically separated from the first conductor and connected to the ground-For fastening the communication device and the external electronic device thus, the first conductor and the at least one second conductor are electrically connected;
A third conductor disposed on a lower surface of the first substrate and connected to the power line, and at least one fourth conductor electrically separated from the third conductor and connected to a ground-The lower surface of the first substrate of the communication device and the third conductor and the at least one fourth conductor are electrically connected according to the contact of the upper surface of the second substrate of the external electronic device;
signal line; and
a control circuit coupled to the power line, the first conductor, the third conductor, and the signal line, the control circuit comprising:
receiving a first signal from the processor of the external electronic device through the signal line;
When the first conductor and the at least one second conductor are electrically connected, receiving a second signal generated as power flowing through the power line is discharged to the ground through the at least one second conductor,
When the third conductor and the at least one fourth conductor are electrically connected, a third signal generated as power flowing through the power line is discharged to the ground through the at least one fourth conductor is received;
and output a control signal for controlling the converter circuit to the converter circuit based on the first signal and the second signal.

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