KR102661822B1 - Electronic device and method for identifying connection state between connector and electrical path - Google Patents

Abstract

An electronic device according to various embodiments includes a housing, a first printed circuit board (PCB) located inside the housing and including a first connector and a grip sensor, and a second connector that is spaced apart from the first PCB. a second PCB, an electrical path electrically connected between the first connector and the second connector, at least one antenna forming part of the housing or located inside the housing, the grip sensor, and the antenna; It may include a processor operatively connected, a first conductive path electrically connected between the grip sensor and the antenna, and a second conductive path electrically connected between the grip sensor and the first connector.

Description

Electronic device and method for identifying the connection state between a connector and an electrical path {ELECTRONIC DEVICE AND METHOD FOR IDENTIFYING CONNECTION STATE BETWEEN CONNECTOR AND ELECTRICAL PATH}

Various embodiments described below relate to an electronic device and a method of operating the same for identifying a connection state between a connector and an electrical path.

An electronic device is, due to design requirements or performance requirements, at least one circuit (including an electrical path and connectors respectively connected to both terminals of the electrical path). circuitry).

An electronic device may, due to design requirements or performance requirements, include an electrical path (e.g., a coaxial cable) and connectors each connected to both terminals of the electrical path. Including an independent circuit for identifying the connection between each of the connectors and the electrical path in the electronic device may cause problems such as lack of mounting space in the electronic device and lack of processor ports. You can.

The technical problem to be achieved in this document is not limited to the technical problem mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the description below. There will be.

An electronic device according to various embodiments includes a housing, a first printed circuit board (PCB) located inside the housing and including a first connector and a grip sensor, and a second connector that is spaced apart from the first PCB. a second PCB, an electrical path electrically connected between the first connector and the second connector, at least one antenna forming part of the housing or located inside the housing, the grip sensor, and the antenna; It may include a processor operatively connected, a first conductive path electrically connected between the grip sensor and the antenna, and a second conductive path electrically connected between the grip sensor and the first connector.

An electronic device according to various embodiments includes a sensor circuit configured to measure the value of capacitance, a memory for storing commands, an antenna, a radio frequency integrated circuitry (RF IC), and an electronic device electrically coupled to the antenna ( coupled with) a first connector, a second connector electrically coupled to the RF IC, a first path electrically connecting the first node between the antenna and the first connector with the sensor circuit, and the antenna a second path that electrically connects a second node between the first connectors to the sensor circuit and is distinct from the first path, a third path that is electrically connected between the first connector and the second connector, and It may include a processor operatively coupled to a sensor circuit, wherein the sensor circuit measures a value of a first capacitance at the first node using the first path, and measures the value of the first capacitance at the first node using the second path. It may be configured to measure the value of the second capacitance at the second node and provide information about the value of the first capacitance and information about the value of the second capacitance to the processor, wherein the processor executes the instruction When executing them, the strength of the signal output through the antenna is controlled based on information about the value of the first capacitance, and the first connector and the second capacitance are controlled based on information about the value of the second capacitance. It may be configured to identify the state of the electrical connection between the three paths and the state of the electrical connection between the second connector and the third path.

An electronic device according to various embodiments includes a sensor circuit configured to obtain information about the value of capacitance, is electrically connected to the sensor circuit through a first path, and determines whether contact between an external object and the electronic device is detected. A first circuit that operates differently depending on whether a first circuit is used, a first connector electrically connected to the sensor circuit through a second path that is distinct from the first path, a second connector, and between the first connector and the second connector. It may include a coaxial cable electrically connected to the display, a memory for storing instructions, and a processor, and when executing the instructions, the processor uses the sensor circuit to detect the first path from the first circuit. Obtain information about the value of the first capacitance measured through, obtain information about the value of the second capacitance measured through the second path from the first connector using the sensor circuit, and obtain information about the value of the second capacitance measured through the second path through the first connector. It may be configured to display information about the value of the capacitance and information about the value of the second capacitance on the display.

An electronic device and a method thereof according to various embodiments identify the connection state between a connector and an electrical path using a sensor circuit configured to measure the value of capacitance, thereby improving the efficiency of resources used within the electronic device. can be improved.

The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description below. will be.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.
Figure 2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication, according to various embodiments.
3 shows an example of a functional configuration of an electronic device according to various embodiments.
FIG. 4 illustrates examples of printed circuit boards (PCBs) of electronic devices according to various embodiments.
FIGS. 5A and 5B show examples of electrical elements included to identify the connection state between each of the connectors and the electrical path in the electronic device 101 according to various embodiments.
FIG. 6 illustrates another example of the functional configuration of an electronic device according to various embodiments.
Figure 7 shows an example of operation of an electronic device according to various embodiments.
FIG. 8 illustrates an example of an operation of an electronic device that controls the strength of a signal output through an antenna based on information about the value of the first capacitance, according to various embodiments.
9 illustrates an electronic device that identifies a connection state between a first connector and a third path and a connection state between a second connector and the third path based on information about the value of a second capacitance, according to various embodiments. An example of operation is shown.
FIG. 10 illustrates another example of an operation of an electronic device according to various embodiments.
FIG. 11 illustrates an example of an operation of an electronic device that outputs information about the electrical connection state of a third path according to various embodiments.

1 is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments. Referring to FIG. 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, and a sensor module ( 176), interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 ) may include. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180) may be omitted, or one or more other components may be added to the electronic device 101. In some embodiments, some of these components may be implemented as a single integrated circuit. For example, the sensor module 176 (e.g., a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented while being embedded in the display device 160 (e.g., a display).

The processor 120, for example, executes software (e.g., program 140) to configure at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or an application processor), and an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, an image signal processor). , sensor hub processor, or communication processor). Additionally or alternatively, the auxiliary processor 123 may be set to use less power than the main processor 121 or to specialize in a designated function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.

The auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), along with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display device 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled. According to one embodiment, coprocessor 123 (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). there is.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto. Memory 130 may include volatile memory 132 or non-volatile memory 134.

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.

The input device 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input device 150 may include, for example, a microphone, mouse, keyboard, or digital pen (eg, stylus pen).

The sound output device 155 may output sound signals to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display device 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display device 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display device 160 may include touch circuitry configured to detect a touch, or a sensor circuit configured to measure the intensity of force generated by the touch (e.g., a pressure sensor). there is.

The audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input device 150, the sound output device 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through an electronic device 102 (e.g., speaker or headphone).

The sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 can capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 can manage power supplied to the electronic device 101. According to one embodiment, the power management module 388 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 190 provides a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, WiFi direct, or IrDA (infrared data association)) or a second network 199 (e.g., a cellular network, the Internet, or It can communicate with external electronic devices through a computer network (e.g., a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (e.g., a single chip) or may be implemented as a plurality of separate components (e.g., multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be confirmed and authenticated.

The antenna module 197 may transmit or receive signals or power to or from the outside (e.g., an external electronic device). According to one embodiment, the antenna module may include one antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, RFIC) in addition to the radiator may be additionally formed as part of the antenna module 197.

At least some of the components are connected to each other through a communication method between peripheral devices (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( (e.g. commands or data) can be exchanged with each other.

According to one embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the electronic devices 102 and 104 may be the same or different type of device from the electronic device 101. According to one embodiment, all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 must perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may perform the function or service instead of executing the function or service on its own. Alternatively, or additionally, one or more external electronic devices may be requested to perform at least part of the function or service. One or more external electronic devices that have received the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology. This can be used.

Figure 2 is a block diagram 200 of an electronic device 101 for supporting legacy network communication and 5G network communication, according to various embodiments. Referring to FIG. 2, the electronic device 101 includes a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, and a third RFIC 226, fourth RFIC 228, first radio frequency front end (RFFE) 232, second RFFE 234, first antenna module 242, second antenna module 244, and antenna It may include (248). The electronic device 101 may further include a processor 120 and a memory 130. Network 199 may include a first network 292 and a second network 294. According to another embodiment, the electronic device 101 may further include at least one of the components shown in FIG. 1, and the network 199 may further include at least one other network. According to one embodiment, the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, and second RFFE 234 may form at least a portion of wireless communication module 192. According to another embodiment, the fourth RFIC 228 may be omitted or may be included as part of the third RFIC 226.

The first communication processor 212 may support establishment of a communication channel in a band to be used for wireless communication with the first network 292, and legacy network communication through the established communication channel. According to various embodiments, the first network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor 214 establishes a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second network 294, and 5G network communication through the established communication channel. can support. According to various embodiments, the second network 294 may be a 5G network defined by 3GPP. Additionally, according to one embodiment, the first communication processor 212 or the second communication processor 214 corresponds to another designated band (e.g., about 6 GHz or less) among the bands to be used for wireless communication with the second network 294. It can support the establishment of a communication channel and 5G network communication through the established communication channel. According to one embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be formed within a single chip or single package with the processor 120, the auxiliary processor 123, or the communication module 190. there is. According to one embodiment, the first communication processor 212 and the second communication processor 214 are directly or indirectly connected to each other by an interface (not shown) to transmit data or control signals in one or both directions. can be provided or received.

When transmitting, the first RFIC 222 converts the baseband signal generated by the first communication processor 212 into a frequency range of about 700 MHz to about 3 GHz for use in the first network 292 (e.g., a legacy network). It can be converted into a radio frequency (RF) signal. Upon reception, the RF signal is obtained from a first network 292 (e.g., a legacy network) via an antenna (e.g., first antenna module 242) and via an RFFE (e.g., first RFFE 232). Can be preprocessed. The first RFIC 222 may convert the pre-processed RF signal into a baseband signal to be processed by the first communication processor 212.

The second RFIC 224, when transmitting, connects the baseband signal generated by the first communications processor 212 or the second communications processor 214 to the second network 294 (e.g., a 5G network). It can be converted to an RF signal (hereinafter referred to as a 5G Sub6 RF signal) in the Sub6 band (e.g., approximately 6 GHz or less). Upon reception, the 5G Sub6 RF signal is obtained from the second network 294 (e.g., 5G network) through an antenna (e.g., second antenna module 244) and an RFFE (e.g., second RFFE 234) It can be preprocessed through . The second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal so that it can be processed by a corresponding communication processor of the first communication processor 212 or the second communication processor 214.

The third RFIC 226 converts the baseband signal generated by the second communication processor 214 into an RF signal in the 5G Above6 band (e.g., about 6 GHz to about 60 GHz) to be used in the second network 294 (e.g., a 5G network). It can be converted into a signal (hereinafter referred to as 5G Above6 RF signal). Upon reception, the 5G Above6 RF signal may be obtained from a second network 294 (e.g., a 5G network) through an antenna (e.g., antenna 248) and preprocessed through a third RFFE 236. The third RFIC 226 may convert the preprocessed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 214. According to one embodiment, the third RFFE 236 may be formed as part of the third RFIC 226.

According to one embodiment, the electronic device 101 may include a fourth RFIC 228 separately from the third RFIC 226 or at least as part of it. In this case, the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter referred to as an IF signal) in an intermediate frequency band (e.g., about 9 GHz to about 11 GHz). After conversion, the IF signal can be transmitted to the third RFIC (226). The third RFIC 226 can convert the IF signal into a 5G Above6 RF signal. Upon reception, a 5G Above6 RF signal may be received from a second network 294 (e.g., a 5G network) via an antenna (e.g., antenna 248) and converted into an IF signal by a third RFIC 226. . The fourth RFIC 228 may convert the IF signal into a baseband signal so that the second communication processor 214 can process it.

According to one example, the first RFIC 222 and the second RFIC 224 may be implemented as a single chip or at least part of a single package. According to one embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as a single chip or at least part of a single package. According to one example, at least one antenna module of the first antenna module 242 or the second antenna module 244 may be omitted or may be combined with another antenna module to process RF signals of a plurality of corresponding bands.

According to one embodiment, the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246. For example, the wireless communication module 192 or the processor 120 may be placed on the first substrate (eg, main PCB). In this case, the third RFIC 226 is located in some area (e.g., bottom surface) of the second substrate (e.g., sub PCB) separate from the first substrate, and the antenna 248 is located in another part (e.g., top surface). is disposed, so that the third antenna module 246 can be formed. By placing the third RFIC 226 and the antenna 248 on the same substrate, it is possible to reduce the length of the transmission line therebetween. This, for example, can reduce the loss (e.g. attenuation) of signals in the high frequency band (e.g., about 6 GHz to about 60 GHz) used in 5G network communication by transmission lines. Because of this, the electronic device 101 can improve the quality or speed of communication with the second network 294 (eg, 5G network).

According to one example, the antenna 248 may be formed as an antenna array including a plurality of antenna elements that can be used for beamforming. In this case, the third RFIC 226, for example, as part of the third RFFE 236, may include a plurality of phase shifters 238 corresponding to a plurality of antenna elements. At the time of transmission, each of the plurality of phase converters 238 can convert the phase of the 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (e.g., a base station of a 5G network) through the corresponding antenna element. . Upon reception, each of the plurality of phase converters 238 may convert the phase of the 5G Above6 RF signal received from the outside through the corresponding antenna element into the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 101 and the outside.

The second network 294 (e.g., a 5G network) may operate independently (e.g., Stand-Alone (SA)) or connected to the first network 292 (e.g., a legacy network) (e.g., a legacy network). Non-Stand Alone (NSA)). For example, a 5G network may have only an access network (e.g., 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (e.g., next generation core (NGC)). In this case, the electronic device 101 may access the access network of the 5G network and then access an external network (eg, the Internet) under the control of the core network (eg, evolved packed core (EPC)) of the legacy network. Protocol information for communication with a legacy network (e.g., LTE protocol information) or protocol information for communication with a 5G network (e.g., New Radio (NR) protocol information) is stored in the memory 230 and stored in the memory 230, 120, first communication processor 212, or second communication processor 214).

Electronic devices according to various embodiments disclosed in this document may be of various types. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of this document are not limited to the above-described devices.

The various embodiments of this document and the terms used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various changes, equivalents, or replacements of the embodiments. In connection with the description of the drawings, similar reference numbers may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items, unless the relevant context clearly indicates otherwise. As used herein: “A or B,” “at least one of A and B,” “or at least one of B,” “A, B, or C,” “at least one of A, B, and C,” and “B,” or at least one of C" may each include any one of the items listed together in the corresponding phrase, or any possible combination thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish one component from another, and to refer to those components in other respects (e.g., importance or order) is not limited. One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.” When mentioned, it means that any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.

The term “module” used in this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document are one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these. For example, a processor (e.g., processor 120) of a device (e.g., electronic device 101) may call at least one command among one or more commands stored from a storage medium and execute it. This allows the device to be operated to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. Device-readable storage media may be provided in the form of non-transitory storage media. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves). This term refers to cases where data is stored semi-permanently in the storage medium. There is no distinction between temporary storage cases.

According to one embodiment, methods according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products are commodities and can be traded between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)) or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smartphones) or online. In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a single entity or a plurality of entities. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (eg, modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, or omitted. Alternatively, one or more other operations may be added.

3 shows an example of a functional configuration of an electronic device according to various embodiments. This functional configuration may be included in the electronic device 101 shown in FIG. 1 or FIG. 2 .

FIG. 4 illustrates examples of printed circuit boards (PCBs) of electronic devices according to various embodiments.

Referring to FIG. 3, the electronic device 101 includes an antenna 301, a matching circuit 305, a first connector 309, an electrical path 311, a second connector 313, and a radio frequency integrated circuitry (RF IC). ) 317, a processor 319, and a sensor circuit 321.

In various embodiments, antenna 301 may include at least one of a first antenna module 242, a second antenna module 244, or a third antenna module 246, and an RF IC 317. may include at least one of the first RF IC 222, the second RF IC 224, the third RF IC 226, or the fourth RF IC 228, and the processor 319 is a processor ( 120) may be included. In various embodiments, the RF IC 317 may include at least one of the first RFFE 232 or the second RFFE 234.

In various embodiments, the antenna 301 may form part of a housing that forms the exterior of the electronic device 101 or may be located inside the housing. In various embodiments, the antenna 301 may be used to transmit a signal to or receive a signal from an external electronic device (eg, the electronic device 102). In various embodiments, the signal transmitted to an external electronic device through the antenna 301 may be a signal generated by the processor 319 and processed by the RF IC 317. In various embodiments, the signal processed by the RF IC 317 is provided to the antenna 301 through the matching circuit 305 through the electrical path 311 and output to the outside through the antenna 301. You can. In various embodiments, the signal received through the antenna 301 from an external electronic device may be processed by the RF IC 317 and interpreted by the processor 319.

In various embodiments, matching circuit 305 may be a circuit used to match the impedance between RF IC 317 and antenna 301. In various embodiments, matching circuit 305 may include at least one of a resistor, capacitor, or inductor to match the impedance between RF IC 317 and antenna 301. In various embodiments, matching circuit 305 may be electrically connected to a ground member to match the impedance between RF IC 317 and antenna 301. In various embodiments, the first terminal of the matching circuit 305 may be electrically connected to the antenna 301. Depending on embodiments, the matching circuit 305 may not be included in the electronic device 101.

In various embodiments, the first connector 309 may be electrically connected to the antenna 301 or may be electrically connected to the matching circuit 305. For example, when the electronic device 101 includes the matching circuit 305, the first connector 309 may be electrically connected to the second terminal of the matching circuit 305, and the electronic device 101 may be connected to the matching circuit 305. When 305 is not included, the first connector 309 may be electrically connected to the antenna 301. In various embodiments, the first connector 309 may be used to electrically connect a first terminal of both terminals of the electrical path 311 to the antenna 301 or the matching circuit 305. In various embodiments, the first connector 309 may be physically connected to the first terminal of the electrical path 311.

In various embodiments, electrical path 311 may be used to provide a processed signal from RF IC 317 to antenna 301. In various embodiments, the electrical path 311 may be used to provide the RF IC 317 with a signal provided from the antenna 301 or a signal provided from the antenna 301 through the matching circuit 305. . In various embodiments, a first terminal of both terminals of the electrical path 311 may be connected to the first connector 309. In various embodiments, a second terminal of both terminals of the electrical path 311 may be connected to the second connector 313.

In various embodiments, a second connector 313 may be used to electrically connect the second terminal of the electrical path 311 and the RF IC 317. For example, the second connector 313 may be directly connected to the RF IC 317 to electrically connect the second terminal of the electrical path 311 to the RF IC 317. For another example, the second connector 313 connects the second terminal of the electrical path 311 to the RF IC 317 through at least one electrical element. 317). In various embodiments, the at least one electrical element may be electrically connected to the first connector 309 rather than the second connector 313. In various embodiments, examples of the at least one electrical element will be described later through the description of FIGS. 5A and 5B. In various embodiments, the second connector 313 may be physically connected to the second terminal of the electrical path 311.

In various embodiments, the RF IC 317 may be electrically connected to the second connector 313 or may be connected to the second connector 313 through the at least one electrical element. In various embodiments, the RF IC 317 may be electrically connected to the processor 319.

In various embodiments, RF IC 317 may receive a signal generated by processor 319 from processor 319 . In various embodiments, RF IC 317 may process signals received from processor 319. For example, the RF IC 317 may convert a signal on a first band received from the processor 319 into a signal on a second band that is higher than the first band. As another example, the RF IC 317 may modulate a signal received from the processor 319 based on a designated modulation technique. However, it is not limited to this. In various embodiments, RF IC 317 may provide the processed signal to antenna 301 via electrical path 311 for transmission.

In various embodiments, the processor 319 may be electrically connected to the RF IC 317. In various embodiments, the processor 319 may be electrically connected to the sensor circuit 321. In various embodiments, the processor 319 may generate or configure information to be included in a signal to be transmitted to an external electronic device through the antenna 301. In various embodiments, the processor 319 may identify or obtain information included in a signal received from an external electronic device through the antenna 301.

In various embodiments, sensor circuit 321 may be configured to measure the value of capacitance. For example, the sensor circuit 321 may include a grip sensor or a touch sensor configured to measure the value of capacitance or measure a change in the value of capacitance.

In various embodiments, sensor circuit 321 is configured at (at or by) a first node 322 coupled to antenna 301 to detect whether the housing of electronic device 101 is in contact with an external object. The value of the first capacitance seen in the first direction 323 can be measured. In various embodiments, sensor circuit 321 may measure the value of the first capacitance to detect whether a part of the user's body is in contact with the housing. In various embodiments, the sensor circuit 321 connects the antenna 301 and the first path 325 to measure the value of the first capacitance viewed from the first node 322 in the first direction 323. ) can be connected through. In various embodiments, the sensor circuit 321 may provide information about the value of the first capacitance to the processor 319. In various embodiments, the sensor circuit 321 adjusts the value of the first capacitance to change the intensity of the signal output from the antenna 301 depending on whether a part of the user's body is in contact with the housing. Information may be provided to the processor 319.

In various embodiments, the sensor circuit 321 is configured to identify the connection state between the first connector 309 and the electrical path 311 and the connection state between the second connector 313 and the electrical path 311. , the value of the second capacitance seen from the second node 327 connected to the first connector 309 (at or by) in the second direction 329 can be measured. In various embodiments, the sensor circuit 321 connects the first connector 309 and the second path to measure the value of the second capacitance viewed from the second node 327 in the second direction 329. You can connect through (331). In various embodiments, the sensor circuit 321 may provide information about the value of the second capacitance to the processor 319. In various embodiments, the sensor circuit 321 is configured to identify the connection state between the first connector 309 and the electrical path 311 and the connection state between the second connector 313 and the electrical path 311. , information about the value of the second capacitance may be provided to the processor 319.

In various embodiments, the processor 319 may receive information about the value of the first capacitance from the sensor circuit 321. In various embodiments, the information about the value of the first capacitance may include data indicating the value of the first capacitance. In various embodiments, information about the value of the first capacitance may include data indicating the degree of change in the first capacitance. For example, data representing the degree of change in the first capacitance may be comprised of a difference value between a previous value of the first capacitance and a current value of the first capacitance. For another example, data indicating the degree of change in the first capacitance may be composed of a difference value between the value of the first capacitance and a reference value. However, it is not limited to this.

In various embodiments, the processor 319 may receive information about the value of the second capacitance from the sensor circuit 321. In various embodiments, the information about the value of the second capacitance may include data indicating the value of the second capacitance. In various embodiments, information about the value of the second capacitance may include data indicating the degree of change in the second capacitance. For example, data indicating the degree of change in the second capacitance may be comprised of a difference value between a previous value of the second capacitance and a current value of the second capacitance. For another example, data indicating the degree of change in the second capacitance may be composed of a difference value between the value of the second capacitance and a reference value. However, it is not limited to this.

In various embodiments, the processor 319 may control the strength or power of a signal output through the antenna 301 based on information about the value of the first capacitance. For example, the processor 319 determines whether the value of the first capacitance is within a reference range to identify whether the electronic device 101 or the housing of the electronic device 101 is in contact with a part of the user's body. can be identified. For example, processor 319 may adjust the intensity of the signal below a reference intensity based on identifying that the value of the first capacitance is within the reference range. For example, processor 319 may, based on identifying that the value of the first capacitance is within the reference range, increase the strength of the signal such that the signal has a SAR that is lower than a reference specific absorption rate (SAR). You can control it. For example, the electronic device 101 may radiate a signal using the antenna 301 for communication with an external electronic device. The electronic device 101 that radiates the signal can measure the specific absorption rate (SAR), which is the rate at which the signal radiated from the electronic device 101 is absorbed into biological tissue. Several accredited organizations manage the degree of harm to the human body as a standard through the SAR measured above. To meet these standards, manufacturers can control the strength of signals emitted from electronic devices. In various embodiments, the processor 319 may control the power of the signal to a level that is not harmful to humans based on identifying that the value of the first capacitance is within the reference range.

As another example, processor 319 may maintain the strength of the signal based on identifying that the value of the first capacitance is outside the reference range. For example, processor 319 controls the strength (or SAR) of the signal independently of the reference strength or the reference SAR based on identifying that the value of the first capacitance is outside the reference range. can do.

In various embodiments, the processor 319 determines the connection state between the first connector 309 and the electrical path 311 and the electrical connection state between the second connector 313 and the second connector 313, based on information about the value of the second capacitance. The connection state between paths 311 can be identified. For example, the processor 319 may determine whether the connection state between the first connector 309 and the electrical path 311 is normal and determine the connection state between the second connector 313 and the electrical path 311. To determine whether is in a normal state, it may be identified whether the value of the second capacitance is within the first reference range. For example, the processor 319 determines that the connection between the first connector 309 and the electrical path 311 is in a normal state based on identifying that the value of the second capacitance is within the first reference range. It can be identified that the connection between the second connector 313 and the electrical path 311 is in a normal state. For another example, the processor 319 may configure the first connector 309 and the electrical path 311 based on identifying that the value of the second capacitance is outside the first reference range and within the second reference range. It can be identified that the connection state between them is in a normal state and the connection state between the second connector 313 and the electrical path 311 is in an abnormal state. As another example, the processor 319 may, based on identifying that the value of the second capacitance is outside the first reference range, be outside the second reference range, connect the first connector 309 and the electrical path. It can be identified that the connection state between (311) is in an abnormal state.

In various embodiments, the processor 319 displays at least one of the value of the first capacitance or the value of the second capacitance on the display device 160 (not shown in FIG. 3) of the electronic device 101. Information can be displayed. In various embodiments, the processor 319 may determine the connection state between the electrical path 311 and the first connector 309 or the connection state between the electrical path 311 and the second connector 313 on the display device 160. Information may be displayed to indicate that at least one of the connection states is abnormal. However, it is not limited to this.

In various embodiments, the antenna 301, matching circuit 305, first connector 309, and sensor circuit 321 are disposed within a first printed circuit board (PCB) 340, and a second connector ( 313) and the RF IC 317 may be disposed within the second PCB 345. In this case, the processor 319 may be placed within the first PCB 340 or the second PCB 345. For example, referring to FIG. 4, the first PCB 340 includes an antenna 301, a matching circuit 305, and a first connector 309, and the second PCB 345 includes a second connector. It may include (313). Within the first PCB 340, the antenna 301 is connected to the matching circuit 305 through a path 400, and the matching circuit 305 is formed on (or in) the first PCB 340. 1 It can be connected to the sensor circuit 321 through path 325. Within the first PCB 340, the first connector 309 may be connected to the sensor circuit 321 through a second path 331 formed on (or within) the first PCB 340. Depending on embodiments, a path between the matching circuit 305 and the first connector 309 may be formed on (or within) the first PCB 340. In various embodiments, the electrical path 311 includes a first connector 309 disposed on (or within) the first PCB 340 and a second connector disposed on (or within) the second PCB 345. (313) can be connected.

In various embodiments, antenna 301, matching circuit 305, first connector 309, second connector 313, RF IC 317, processor 319, and sensor circuit 321 are shown in FIG. Unlike the illustrations in Figures 3 and 4, they may be placed within one PCB.

3 and 4 show an example in which the electrical path 311 is configured for a signal output from or input through the antenna 301, but this is for convenience of explanation. For example, the antenna 301 may be an example of a first circuit that is electrically connected to the sensor circuit 321 and operates differently depending on whether contact between an external object and the electronic device 101 is detected. In this case, the RF IC 317 may be an example of a second circuit that provides information to the first circuit or obtains information from the first circuit.

As described above, the electronic device 101 according to various embodiments connects the first connector 309 and the electrical path using the sensor circuit 321 disposed within the electronic device 101 and configured to measure the value of the capacitance. The connection state between 311 and the connection state between the second connector 313 and the electrical path 311 can be identified. The electronic device 101 according to various embodiments may not require a separate circuit for the identification by using the sensor circuit 321 for the identification. Since the electronic device 101 according to various embodiments does not require a separate circuit for the identification, it can increase the number of available ports of the processor 319 and secure mounting space for the electronic device 101. You can. In other words, the electronic device 101 can enhance resource efficiency of the electronic device 101 by using the sensor circuit 321 for the identification.

FIGS. 5A and 5B show examples of electrical elements included to identify the connection state between each of the connectors and the electrical path in the electronic device 101 according to various embodiments.

In various embodiments, antenna 301, matching circuit 305, first connector 309, electrical path 311, second connector 313, RF IC 317, processor 319, sensor circuit. 321, the first path 325, and the second path 331 are the antenna 301, matching circuit 305, first connector 309, electrical path 311, and 2 may correspond to the connector 313, the RF IC 317, the processor 319, the sensor circuit 321, the first path 325, and the second path 331, respectively.

5A and 5B, the electrical element 505 (e.g., capacitor C1) is connected to the first connector 309 and the electrical path 311 and the second connector 313 and the electrical path. When the connection state between (311) is in a normal state and the connection state between the first connector 309 and the electrical path 311 and/or the connection state between the second connector 313 and the electrical path 311 In order to more clearly distinguish cases in an abnormal state, it may be included in the electronic device 101. For example, when the connection between the first connector 309 and the electrical path 311 is in an abnormal state, the value of the second capacitance viewed from the second node 327 in the second direction 329 is Assuming that it is the first value, the second capacitance viewed from the second node 327 in the second direction 329 when the connection state between the second connector 313 and the electrical path 311 is in an abnormal state. Assuming that the value of is the second value, both the connection state between the first connector 309 and the electrical path 311 and the connection state between the second connector 313 and the electrical path 311 are in a normal state. Let us assume that the value of the second capacitance viewed from the second node 327 in the second direction 329 is the third value. In various embodiments, an electrical element 505 is included in the electronic device 101 to increase the difference between the first value and the second value, or to increase the difference between the first value and the third value. It may be included in the electronic device 101 to increase , or it may be included in the electronic device 101 to increase the difference between the second value and the third value. However, it is not limited to this.

In various embodiments, electrical element 505 may be placed in various locations and in various ways.

For example, referring to FIG. 5A , the electrical element 505 may be disposed between the second connector 313 and the RF IC 317, as in state 510. In various embodiments, the electrical element 505 is not disposed between the second connector 313 and the RF IC 317, as in state 510, but in parallel with the RF IC 317, as in state 520. It may be connected to the second connector 313. When the electrical element 505 is arranged as in state 520, the first terminal of the electrical element 505 is connected to the second connector 313 and the second terminal of the electrical element 505 is connected to the ground terminal. You can.

For another example, referring to FIG. 5B , the electrical element 505 may be disposed between the first connector 309 and the second node 327, as in state 530. In various embodiments, the electrical element 505 is not disposed between the first connector 309 and the second node 327, such as in state 530, but is positioned between the second node 327, such as in state 540. It may also be connected to the first connector 309 in parallel. When the electrical element 505 is arranged as in state 540, the first terminal of the electrical element 505 will be connected to the first connector 309 and the second terminal of the electrical element 505 will be connected to the ground terminal. You can.

Figure 5a shows an example of connecting the electrical element 505 with the second connector 313, and Figure 5b shows an example of connecting the electrical element 505 with the first connector 309, but this is for convenience of explanation. It is for. For example, the electrical element 505 may be composed of a plurality of electrical elements, and each of the plurality of electrical elements may be connected to the first connector 309 and the second connector 313, respectively.

FIG. 6 illustrates another example of the functional configuration of an electronic device according to various embodiments. This functional configuration may be included in the electronic device 101 shown in FIG. 1 or FIG. 2 .

Each of the antennas 301-1 and 301-2 in FIG. 6 corresponds to the antenna 301 in FIG. 3, and each of the matching circuits 305-1 and 305-2 in FIG. 6 correspond to the antenna 301-2 in FIG. 3 corresponds to the matching circuit 305, and each of the first connector 309-1 and the first connector 309-2 in FIG. 6 corresponds to the first connector 309 in FIG. 3, and the electrical Each of the path 311-1 and the electrical path 311-2 corresponds to the electrical path 311 in FIG. 3, and each of the second connector 313-1 and the second connector 313-2 in FIG. 6 Corresponds to the second connector 313 in FIG. 3, each of the RF IC 317-1 and RF IC 317-2 in FIG. 6 corresponds to the RF IC 317 in FIG. 3, and the processor in FIG. 6 ( 319) corresponds to the processor 319 in FIG. 3, the sensor circuit 321 in FIG. 6 corresponds to the sensor circuit 321 in FIG. 3, and the path 325-1 and path 325- in FIG. 6 2) Each may correspond to the first path 325 in FIG. 3, and each of the paths 331-1 and 331-2 in FIG. 6 may correspond to the second path 331 in FIG. 3.

Referring to FIG. 6, in various embodiments, the sensor circuit 321 may obtain the value of the first capacitance of the circuit viewed in the first direction 605 from the node 600-1, and the node ( The value of the second capacitance of the circuit viewed in the first direction 605 can be obtained from 600-2). The sensor circuit 321 may transmit information about the value of the first capacitance and the value of the second capacitance to the processor 319.

In various embodiments, the sensor circuit 321 may obtain the value of the third capacitance of the circuit viewed in the second direction 620 from the node 610-1 and the third capacitance value from the node 610-2. The value of the fourth capacitance of the circuit viewed in two directions 620 can be obtained. The sensor circuit 321 may transmit information about the value of the third capacitance and the value of the fourth capacitance to the processor 319.

In various embodiments, the processor 319 receives information about the value of the first capacitance, and operates the antenna 301-1 or the antenna 301-1 based on the information about the value of the first capacitance. It is possible to determine whether a part of the body is in contact with the housing positioned adjacent to the and control the strength of the signal output from the antenna 301-1 according to the determination.

In various embodiments, the processor 319 receives information about the value of the second capacitance and operates the antenna 301-2 or the antenna 301-2 based on the information about the value of the second capacitance. It is possible to determine whether a part of the body is in contact with the housing positioned adjacent to the and control the strength of the signal output from the antenna 301-2 according to the determination.

In various embodiments, the processor 319 receives information about the value of the third capacitance and connects the first connector 309-1 and the electrical path 311 based on the information about the value of the third capacitance. -1) and the connection state between the second connector 313-1 and the electrical path 311-1 can be identified.

In various embodiments, the processor 319 receives information about the value of the fourth capacitance, and connects the first connector 309-2 and the electrical path 311 based on the information about the value of the fourth capacitance. -2) and the connection state between the second connector 313-2 and the electrical path 311-2 can be identified.

As described above, the electronic device 101 according to various embodiments uses the sensor circuit 321 to connect each of a plurality of electrical paths and the plurality of The connection status between connectors connected to each of the electrical paths can be identified. Since the electronic device 101 according to various embodiments performs the identification using the sensor circuit 321, the number of ports of the processor 319 can be maintained independently from the number of the plurality of electrical paths.

Figure 7 shows an example of operation of an electronic device according to various embodiments. This operation may be performed by the electronic device 101 shown in FIGS. 1, 2, 3, 4, 5A, 5B, or 6.

Referring to FIG. 7 , in operation 701, the sensor circuit 321 may measure the value of the first capacitance. For example, the sensor circuit 321 uses a first path 325 connecting the first node 322 between the antenna 301 and the first connector 309 with the sensor circuit 321, The value of the first capacitance at 1 node 322 can be measured. For example, the value of the first capacitance may mean the value of the equivalent capacitance of the circuit viewed from the first node 322 to the antenna 301. The value of the first capacitance may be changed by an external object (eg, a part of the user's body) close to the antenna 301. The value of the first capacitance may be changed depending on the impedance of the matching circuit 305.

In operation 703, the sensor circuit 321 may provide information about the value of the first capacitance to the processor 319. For example, the sensor circuit 321 may periodically acquire the value of the first capacitance and periodically provide the value of the first capacitance to the processor 319 in response to the acquisition. For another example, the sensor circuit 321 may periodically obtain the value of the first capacitance and provide information about the value of the first capacitance based on identifying that the value of the first capacitance is outside a reference range. and transmit information about the value of the first capacitance based on identifying that the value of the first capacitance is within the reference range. However, it is not limited to this. In various embodiments, the information about the value of the first capacitance may include data indicating the value of the first capacitance. In various embodiments, the information about the value of the first capacitance may include data indicating a difference value between the value of the first capacitance and a reference value. In various embodiments, the information about the value of the first capacitance may include data representing a difference value between a current value of the first capacitance and a previous value of the first capacitance. However, it is not limited to this. The processor 319 may receive information about the value of the first capacitance from the sensor circuit 321.

In operation 705, the processor 319 may control the strength of the signal output through the antenna 301 based on information about the value of the first capacitance. For example, processor 319 may, based on identifying that the value of the first capacitance is within the reference range, increase the strength of the signal such that the signal has a SAR that is lower than a reference specific absorption rate (SAR). You can control it. As another example, processor 319 may control the strength of the signal independently of the reference SAR based on identifying that the value of the first capacitance is outside the reference range. However, it is not limited to this.

In operation 707, the sensor circuit 321 may measure the value of the second capacitance. For example, the sensor circuit 321 connects the second node 327 between the antenna 301 and the first connector 309 with the sensor circuit 321 and connects the second node 327 distinct from the first path 325. Using the path 331, the value of the second capacitance at the second node 327 can be measured. For example, the value of the second capacitance may mean the value of the equivalent capacitance of the circuit viewed from the second node 327 toward the RF IC 317. The value of the second capacitance may be changed depending on the electrical connection state between the first connector 309 and the electrical path 311 or the electrical connection state between the second connector 313 and the electrical path 311.

In operation 709, the sensor circuit 321 may provide information about the value of the second capacitance to the processor 319. For example, the sensor circuit 321 may periodically acquire the value of the second capacitance and periodically provide the value of the second capacitance to the processor 319 in response to the acquisition. For another example, the sensor circuit 321 obtains the value of the second capacitance in response to executing a designated application (e.g., an application supporting a test mode), and in response to the acquisition, determines the value of the second capacitance. The value may be provided to the processor 319. As another example, sensor circuit 321 may periodically obtain the value of the second capacitance and determine the value of the second capacitance based on identifying that the value of the second capacitance is within a first reference range. Transmission of information about may be restricted, and information about the value of the second capacitance may be transmitted based on identifying that the value of the second capacitance is outside the first reference range. As another example, sensor circuit 321 may be configured to obtain a value of the second capacitance in response to executing the specified application and identify that the value of the second capacitance is within the first reference range. limit transmitting information about the value of the second capacitance based on and transmit information about the value of the second capacitance based on identifying that the value of the second capacitance is outside the first reference range. You can. However, it is not limited to this. In various embodiments, the information about the value of the second capacitance may include data indicating the value of the second capacitance. In various embodiments, the information about the value of the second capacitance may include data indicating a difference value between the value of the second capacitance and a reference value. In various embodiments, the information about the value of the second capacitance may include data representing a difference value between the current value of the second capacitance and the previous value of the second capacitance. However, it is not limited to this. The processor 319 may receive information about the value of the second capacitance from the sensor circuit 321.

In operation 711, the processor 319 determines the connection state between the electrical path 311 (e.g., the third path) and the first connector 309 and the electrical path 311 based on the information about the value of the second capacitance. ) and the second connector 313 can be identified. For example, the processor 319 may determine, based on identifying that the value of the second capacitance is within the first reference range, that the electrical path 311 and the first connector 309 are electrically connected and that the electrical path 311 is electrically connected to the first connector 309. It can be identified that the path 311 and the second connector 313 are electrically connected. For another example, the processor 319 may configure the electrical path 311 and the first connector 309 based on identifying that the value of the second capacitance is outside the first reference range and within the second reference range. It can be identified that is electrically connected and the electrical path 311 and the second connector 313 are electrically disconnected. For another example, the processor 319 may, based on identifying that the value of the second capacitance is outside the first reference range and outside the second reference range, connect the electrical path 311 and the first connector ( 309) can be identified as being electrically disconnected. However, it is not limited to this.

It should be noted that in FIG. 7, operations 707, 709, and 711 may be performed independently of operations 701, 703, and 705. For example, operations 707, 709, and 711 may be performed while performing operations 701, 703, and 705, or before or after performing operations 701, 703, and 705. there is. However, it is not limited to this.

As described above, the electronic device 101 according to various embodiments includes a sensor circuit configured to measure the value of capacitance to ensure that the strength of the signal output through the antenna 301 meets the standards defined in SAR. 321), a connection state between the first connector 309 and the electrical path 311 (hereinafter, may be referred to as a third path) and a connection between the second connector 313 and the electrical path 311. Status can be identified. The electronic device 101 according to various embodiments may improve resource efficiency of the electronic device 101 by performing the identification.

FIG. 8 illustrates an example of an operation of an electronic device that controls the strength of a signal output through an antenna based on information about the value of the first capacitance, according to various embodiments. This operation is performed using the electronic device 101 shown in FIGS. 1, 2, 3, 4, 5A, 5B, or 6, or a processor included in the electronic device 101 (e.g., processor 120). ) or may be performed by the processor 319).

Operations 801 to 807 of FIG. 8 may be related to operation 705 of FIG. 7 .

In operation 801, the processor 319 may obtain information about the value of the first capacitance from the sensor circuit 321. Information about the value of the first capacitance may mean information about the value of the first capacitance defined through the description of FIG. 7.

In operation 803, the processor 319 may determine whether the value of the first capacitance is within the reference range to determine whether the electronic device 101 is in contact with a part of the user's body. For example, when identifying that the value of the first capacitance is within the reference range, the processor 319 determines that the electronic device 101 is in contact with a part of the user's body or that the electronic device 101 is in contact with the user's body. It can be determined that it is located in close proximity to a part of the body. For another example, upon identifying that the value of the first capacitance is outside the reference range, the processor 319 determines that the electronic device 101 is not in contact with any part of the user's body or the electronic device 101 It may be determined that is separated from a part of the user's body. The processor 319 may perform operation 805 based on determining that the electronic device 101 is in contact with a part of the user's body. The processor 319 may perform operation 807 based on determining that the electronic device 101 is not in contact with any part of the user's body.

At operation 805, the processor 319 adjusts the strength of the signal output through the antenna 301 to have a SAR that is lower than the reference SAR based on determining that the electronic device 101 is in contact with a part of the user's body. You can control it. For example, the processor 319 may determine the strength of the signal output through the antenna 301 to have a SAR lower than the reference SAR, based on determining that the electronic device 101 is in contact with a part of the user's body. can be controlled.

At operation 807, the processor 319 controls the strength of the signal output through the antenna 301 independently of the reference SAR based on determining that the electronic device 101 is not in contact with any part of the user's body. can do. For example, the processor 319 may, independently of the reference SAR, determine the signal output through the antenna 301 based on the quality of the channel between the external electronic device (e.g., base station) and the electronic device 101. You can control the intensity.

9 illustrates an electronic device that identifies a connection state between a first connector and a third path and a connection state between a second connector and the third path based on information about the value of a second capacitance, according to various embodiments. An example of operation is shown. This operation is performed using the electronic device 101 shown in FIGS. 1, 2, 3, 4, 5A, 5B, or 6, or a processor included in the electronic device 101 (e.g., processor 120). ) or may be performed by the processor 319).

Operations 901 to 911 of FIG. 9 may be related to operation 711 of FIG. 7 .

In operation 901, the processor 319 may obtain information about the value of the second capacitance from the sensor circuit 321. Information about the value of the second capacitance may mean information about the value of the second capacitance defined through the description of FIG. 7.

In operation 903, the processor 319 determines that the value of the second capacitance is equal to the value of the first reference capacitance in order to identify the connection state between the third path (e.g., the electrical path 311) and the first connector 309. You can decide whether or not it corresponds to . In various embodiments, when the third path 311 and the first connector 309 are electrically disconnected, the value of the second capacitance measured at the second node 327 is the capacitance of the first connector 309. Since it is measured as a value, the value of the first reference capacitance may correspond to the value of the capacitance of the first connector 309. In various embodiments, the fact that the value of the second capacitance corresponds to the value of the first reference capacitance may mean that the value of the second capacitance is the same as the value of the first reference capacitance. In various embodiments, the value of the second capacitance corresponds to the value of the first reference capacitance may mean that the difference between the value of the second capacitance and the value of the first reference capacitance is within a reference range. there is. The processor 319 may perform operation 905 based on determining that the value of the second capacitance corresponds to the value of the first reference capacitance. The processor 319 may perform operation 907 based on determining that the value of the second capacitance does not correspond to the value of the second reference capacitance.

At operation 905, the processor 319 determines that the first connector 309 and the third path 311 are electrically connected to each other based on determining that the value of the second capacitance corresponds to the value of the first reference capacitance. Disconnection can be identified. For example, the processor 319 may determine the electrical connection between the first connector 309 and the third path 311 based on determining that the value of the second capacitance corresponds to the value of the first reference capacitance. It can be identified that the connection state is abnormal.

At operation 907, processor 319 determines that the value of the second capacitance corresponds to the value of the second reference capacitance, based on determining that the value of the second capacitance does not correspond to the value of the first reference capacitance. You can decide whether to do it or not. In various embodiments, when the third path 311 and the second connector 313 are electrically disconnected, the value of the second capacitance measured at the second node 327 is the capacitance of the first connector 309. Since it is determined based on the value of and the value of the capacitance of the third path 311, the value of the second reference capacitance is the value of the capacitance of the first connector 309 and the capacitance of the third path 311. It can be determined based on the value. In various embodiments, the value of the second capacitance corresponding to the value of the second reference capacitance may mean that the value of the second capacitance is the same as the value of the second reference capacitance. In various embodiments, the value of the second capacitance corresponds to the value of the second reference capacitance may mean that the difference between the value of the second capacitance and the value of the second reference capacitance is within a reference range. there is. The processor 319 may perform operation 909 based on determining that the value of the second capacitance corresponds to the value of the second reference capacitance. The processor 319 may perform operation 911 based on determining that the value of the second capacitance does not correspond to the value of the second reference capacitance.

At operation 909, the processor 319 determines that the second connector 313 and the third path 311 are electrically connected to each other based on determining that the value of the second capacitance corresponds to the value of the second reference capacitance. Disconnection can be identified. For example, the processor 319 may determine the electrical connection between the second connector 313 and the third path 311 based on determining that the value of the second capacitance corresponds to the value of the second reference capacitance. It can be identified that the connection status is abnormal.

At operation 911, the processor 319 determines that the value of the second capacitance does not correspond to the value of the second reference capacitance between the first connector 309 and the third path 311. It can be identified that the state of the electrical connection and the state of the electrical connection between the second connector 313 and the third path 311 are normal. For example, the fact that the value of the second capacitance does not correspond to the value of the first reference capacitance and the value of the second capacitance means that the third path 311 and the first connector 309 are electrically connected. Since this may mean that the third path 311 and the second connector 313 are electrically connected, the processor 319 establishes an electrical connection between the first connector 309 and the third path 311. It can be identified that the state of and the state of the electrical connection between the second connector 313 and the third path 311 are normal.

FIG. 10 illustrates another example of an operation of an electronic device according to various embodiments. This operation may be performed by the electronic device 101 shown in FIGS. 1, 2, 3, 4, 5A, 5B, or 6.

Referring to FIG. 10, in operation 1001, the processor 319 may obtain information about the value of the first capacitance. For example, the value of the first capacitance may mean a capacitance value measured at the first node 322. In various embodiments, the processor 319, in response to executing an application to support a test mode on the electronic device 101, requests the value of the first capacitance from the sensor circuit 321, and In response to , information about the value of the first capacitance provided from the sensor circuit 321 may be obtained.

In operation 1003, the processor 319 may obtain information about the value of the second capacitance. For example, the value of the second capacitance may mean the value of the capacitance measured at the second node 327. In various embodiments, the processor 319, in response to executing an application to support a test mode on the electronic device 101, requests the value of the second capacitance from the sensor circuit 321, and In response to , information about the value of the second capacitance provided from the sensor circuit 321 may be obtained.

In operation 1005, the processor 319 may display information about the value of the first capacitance and information about the value of the second capacitance on the display device 160 of the electronic device 101. For example, information about the value of the first capacitance and information about the value of the second capacitance may be displayed within the user interface of the application to support the test mode. In various embodiments, the processor 319, while obtaining information about the value of the first capacitance and information about the value of the second capacitance from the sensor circuit 321, Information about the value and information about the obtained value of the second capacitance may be displayed on the display device 160 of the electronic device 101. For example, when a part of the user's body is in contact with at least a part of the housing of the electronic device 101 or when a part of the user's body in contact with at least a part of the housing of the electronic device 101 is spaced apart, the display device Information about the value of the first capacitance displayed on 160 may be changed. For another example, the electrical connection between the first connector 309 and the third path (e.g., the electrical path 311) is disconnected or the electrical connection between the second connector 313 and the first path is disconnected. In this case, information about the value of the second capacitance displayed on the display device 160 may be changed.

FIG. 11 illustrates an example of an operation of an electronic device that outputs information about the electrical connection state of a third path according to various embodiments. This operation is performed using the electronic device 101 shown in FIGS. 1, 2, 3, 4, 5A, 5B, or 6, or a processor included in the electronic device 101 (e.g., processor 120). ) or may be performed by the processor 319).

Referring to FIG. 11 , in operation 1101, the processor 319 may obtain information about the value of the second capacitance from the sensor circuit 321. For example, operation 1101 may correspond to operation 709, operation 901, or operation 1003.

In operation 1103, the processor 319 may identify whether the degree of change in the value of the second capacitance is outside the reference range. In various embodiments, the reference range includes the electrical connection state between the third path (e.g., the electrical path 311) and the first connector 309 and the third path 311 and the second connector 313. The change between the value of the second capacitance measured while the electrical connection state is in a normal state and the value of the second capacitance obtained in operation 1101 is the third path (e.g., the electrical path 311) and the first connector ( 309 may be configured within the electronic device 101 to identify whether it indicates that the third path and the second connector 313 are electrically disconnected. Processor 319 may bypass operation 1105 based on identifying that the degree of change in the value of the second capacitance is within a reference range. The processor 319 may perform operation 1105 based on identifying that the degree of change in the value of the second capacitance is outside the reference range.

In operation 1105, the processor 319 may output information to indicate that the electrical connection state of the third path is abnormal, based on identifying that the degree of change in the value of the second capacitance is outside the reference range. there is. For example, the information may be displayed on the display device 160. For another example, the information may be output as an audio signal through the audio output device 155. For another example, the information may be output as vibration through the haptic module 179. However, it is not limited to this.

As described above, an electronic device (e.g., electronic device 101) according to various embodiments includes a housing, a first connector (e.g., first connector 309) located inside the housing, and a grip sensor (e.g., : a first printed circuit board (PCB) (e.g., first PCB 340) including a sensor circuit 321), spaced apart from the first PCB, and a second connector (e.g., second connector 313) ), a second PCB (e.g., second PCB 345) including a second PCB, an electrical path (e.g., electrical path 311) electrically connected between the first connector and the second connector, and a portion of the housing. At least one antenna (e.g., antenna 301) or located inside the housing, a processor (e.g., processor 319) operatively connected to the grip sensor and the antenna, and the grip sensor and A first conductive path (e.g., first path 325) electrically connected between the antennas, and a second conductive path (e.g., second path 331) electrically connected between the grip sensor and the first connector. may include.

In various embodiments, the electronic device includes a matching circuit (e.g., matching circuit 305) including a first terminal electrically connected to the antenna and a second terminal electrically connected to the first connector, and a ground member. It may further include, and the matching circuit may include at least one of a resistor, a capacitor, or an inductor, and a third conductive path electrically connected to the ground member. In various embodiments, the second conductive path may be electrically connected to the second terminal.

In various embodiments, the electrical path may include at least one of a coaxial cable or a flexible printed circuit board (FPCB).

In various embodiments, the grip sensor may be configured to measure a value of capacitance of the first connector through the second conductive path and provide information about the value of the capacitance to the processor, and the processor may be configured to identify a state of the electrical connection between the first connector and the electrical path and a state of the electrical connection between the second connector and the electrical path, based on the value of the capacitance. In various embodiments, the processor is configured to identify that the first connector and the electrical path are electrically disconnected based on identifying that the value of the capacitance corresponds to a value of the capacitance of the first connector. It can be configured. In various embodiments, the processor identifies that the second connector and the electrical path are electrically disconnected based on identifying that the value of the capacitance corresponds to a value of the capacitance of the first connector and the electrical path. It can be configured to do so.

In various embodiments, the electronic device connects the second connector to an electrical connection to identify a state of the electrical connection between the first connector and the electrical path and a state of the electrical connection between the second connector and the electrical path. It may further include a capacitance (e.g., capacitance 505) connected to .

As described above, according to various embodiments, an electronic device (e.g., electronic device 101) includes a sensor circuit (e.g., sensor circuit 321) configured to measure the value of capacitance, and storing instructions. A memory (e.g., memory 130), an antenna (e.g., antenna 301), a radio frequency integrated circuitry (RF IC) (e.g., RF IC 317), and electrically coupled to the antenna. with) a first connector (e.g., first connector 309), a second connector (e.g., second connector 313) electrically coupled to the RF IC, and a first connector between the antenna and the first connector. 1 A first path (e.g., first path 325) electrically connecting a node to the sensor circuit, a second node between the antenna and the first connector is electrically connected to the sensor circuit, and the first A second path (e.g., second path 331) distinct from the path, a third path (e.g., electrical path 311) electrically connected between the first connector and the second connector, and the sensor circuit. It may include a processor (e.g., processor 319) operatively coupled to, wherein the sensor circuit measures the value of the first capacitance at the first node using the first path, and It may be configured to measure the value of the second capacitance at the second node using two paths, and to provide information about the value of the first capacitance and information about the value of the second capacitance to the processor, When executing the instructions, the processor controls the strength of the signal output through the antenna based on information about the value of the first capacitance, and based on information about the value of the second capacitance, the It may be configured to identify a state of the electrical connection between the first connector and the third path and a state of the electrical connection between the second connector and the third path.

In various embodiments, the electronic device may further include a matching circuit including a first terminal connected to the antenna through the first node and a second terminal connected to the first connector through the second node. there is.

In various embodiments, when executing the instructions, the processor increases the strength of the signal so that the signal has a SAR lower than a reference specific absorption rate (SAR), based on information about the value of the first capacitance. It can be configured to control.

In various embodiments, the information about the value of the second capacitance may include data about a change in the value of the second capacitance, and the sensor circuit is configured to change the value of the second capacitance from the first value. In response to detecting a change to a second value, the processor may be configured to provide information about the value of the second capacitance, including data about the change in the value of the second capacitance, to the processor.

In various embodiments, the sensor circuit may include a grip sensor.

In various embodiments, the electronic device may further include a display and a touch sensor operatively coupled to the display, and the sensor circuit may include the touch sensor.

In various embodiments, the processor, when executing the instructions, determines that the first connector and the third path are electrically connected based on identifying that the value of the second capacitance corresponds to the value of the first reference capacitance. It may be configured to identify a disconnection. In various embodiments, the processor connects the second connector and the third path based on identifying that the value of the second capacitance corresponds to a value of the second reference capacitance that is higher than the value of the first reference capacitance. Can be configured to identify that is electrically disconnected.

In various embodiments, the electronic device is configured to identify the state of the electrical connection between the first connector and the third path and the state of the electrical connection between the second connector and the third path. 2 It may further include a capacitance electrically connected to the connector.

As described above, an electronic device (e.g., electronic device 101) according to various embodiments includes a sensor circuit (e.g., sensor circuit 321) configured to obtain information about the value of capacitance, and a first path. A first circuit (e.g., antenna 301) that is electrically connected to the sensor circuit and operates differently depending on whether contact between an external object and the electronic device is detected, and a first circuit that is distinct from the first path. A first connector (e.g., first connector 309) and a second connector (e.g., second connector 313) electrically connected to the sensor circuit through two paths, and the first connector and the second connector A coaxial cable (e.g., electrical path 311) electrically connected therebetween, a display (e.g., display device 160), a memory (e.g., memory 130) for storing instructions, and a processor (e.g., processor (319)), wherein the processor, when executing the instructions, obtains information about the value of the first capacitance measured through the first path from the first circuit using the sensor circuit, and , using the sensor circuit to obtain information about the value of the second capacitance measured from the first connector through the second path, and to obtain information about the value of the first capacitance and about the value of the second capacitance. It may be configured to display information on the display.

In various embodiments, information about the value of the first capacitance may be used to identify whether contact between the external object and the electronic device is detected, and information about the value of the second capacitance may be , can be used to identify the state of the electrical connection between the first connector and the coaxial cable and the state of the electrical connection between the second connector and the coaxial cable. In various embodiments, when executing the instructions, the processor connects the first connector and the coaxial cable based on identifying that the degree of change in the value of the second capacitance is outside a reference range. It may be further configured to output information for notifying that the state of the electrical connection or the state of the electrical connection between the second connector and the coaxial cable is abnormal.

Methods according to embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

When implemented as software, a computer-readable storage medium that stores one or more programs (software modules) may be provided. One or more programs stored in a computer-readable storage medium are configured to be executable by one or more processors in an electronic device (configured for execution). One or more programs include instructions that cause the electronic device to execute methods according to embodiments described in the claims or specification of the present disclosure.

These programs (software modules, software) include random access memory, non-volatile memory including flash memory, read only memory (ROM), and electrically erasable programmable ROM. (EEPROM: electrically erasable programmable read only memory), magnetic disc storage device, compact disc-ROM (CD-ROM), digital versatile discs (DVDs), or other types of disk storage. It can be stored in an optical storage device or magnetic cassette. Alternatively, it may be stored in a memory consisting of a combination of some or all of these. Additionally, multiple configuration memories may be included.

In addition, the program may be operated through a communication network such as the Internet, an intranet, a local area network (LAN), a wide LAN (WLAN), or a storage area network (SAN), or a combination thereof. It may be stored on an attachable storage device that is accessible. This storage device can be connected to a device performing an embodiment of the present disclosure through an external port. Additionally, a separate storage device on a communication network may be connected to the device performing an embodiment of the present disclosure.

In the specific embodiments of the present disclosure described above, elements included in the disclosure are expressed in singular or plural numbers depending on the specific embodiment presented. However, the singular or plural expressions are selected to suit the presented situation for convenience of explanation, and the present disclosure is not limited to singular or plural components, and even components expressed in plural may be composed of singular or singular. Even expressed components may be composed of plural elements.

Meanwhile, in the detailed description of the present disclosure, specific embodiments have been described, but of course, various modifications are possible without departing from the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments, but should be determined not only by the scope of the patent claims described later, but also by the scope of this patent claim and equivalents.

Claims (20)

In electronic devices,
housing;
a first printed circuit board (PCB) located inside the housing and including a first connector and a grip sensor;
a second PCB spaced apart from the first PCB and including a second connector;
an electrical path electrically connected between the first connector and the second connector;
at least one antenna forming part of the housing or located within the housing;
a processor operatively connected to the grip sensor and the antenna;
a first conductive path electrically connected between the grip sensor and the antenna; and
A second conductive path electrically connected between the grip sensor and the first connector,
The grip sensor measures the value of the capacitance of the second conductive path,
The grip sensor provides information about the value of the capacitance to the processor,
The processor is configured to identify an electrical connection state between the first connector and the electrical path and an electrical connection state between the second connector and the electrical path, based on information about the value of the capacitance.
◈Claim 2 was abandoned upon payment of the setup registration fee.◈ In claim 1,
a matching circuit including a first terminal electrically connected to the antenna and a second terminal electrically connected to the first connector; and
Further comprising a ground member,
The matching circuit is,
An electronic device comprising at least one of a resistor, a capacitor, or an inductor, and a third conductive path electrically connected to the ground member.
◈Claim 3 was abandoned upon payment of the setup registration fee.◈ The method of claim 2, wherein the second conductive path is:
An electronic device electrically connected to the second terminal.
◈Claim 4 was abandoned upon payment of the setup registration fee.◈ The method of claim 1, wherein the electrical path is:
An electronic device including at least one of a coaxial cable or a flexible printed circuit board (FPCB).
delete ◈Claim 6 was abandoned upon payment of the setup registration fee.◈ The method of claim 1, wherein the processor:
The electronic device is configured to identify that the first connector and the electrical path are electrically disconnected based on identifying that the value of the capacitance corresponds to the value of the capacitance of the first connector.
◈Claim 7 was abandoned upon payment of the setup registration fee.◈ The method of claim 6, wherein the processor:
The electronic device is configured to identify that the second connector and the electrical path are electrically disconnected based on identifying that the value of the capacitance corresponds to the value of the capacitance of the first connector and the electrical path.
◈Claim 8 was abandoned upon payment of the setup registration fee.◈ In claim 1,
The electronic device further includes a capacitance electrically connected to the second connector to identify a state of the electrical connection between the first connector and the electrical path and a state of the electrical connection between the second connector and the electrical path.
In electronic devices,
A sensor circuit configured to measure the value of capacitance;
Memory for storing instructions;
antenna;
RF IC (radio frequency integrated circuitry);
a first connector electrically coupled with the antenna;
a second connector electrically coupled to the RF IC;
a first path electrically connecting a first node between the antenna and the first connector with the sensor circuit;
a second path that electrically connects a second node between the antenna and the first connector with the sensor circuit and is distinct from the first path; and
a third path electrically connected between the first connector and the second connector;
comprising a processor operatively coupled to the sensor circuit;
The sensor circuit is,
Measure the value of the first capacitance at the first node using the first path,
Measure the value of the second capacitance at the second node using the second path,
Configured to provide information about the value of the first capacitance and information about the value of the second capacitance to the processor,
When the processor executes the instructions,
Based on information about the value of the first capacitance, control the strength of the signal output through the antenna,
An electronic device configured to identify, based on information about the value of the second capacitance, a state of the electrical connection between the first connector and the third path and a state of the electrical connection between the second connector and the third path. Device.
In claim 9,
The electronic device further includes a matching circuit including a first terminal connected to the antenna through the first node and a second terminal connected to the first connector through the second node.
The method of claim 9, wherein when the processor executes the instructions,
An electronic device configured to control the intensity of the signal so that the signal has a SAR lower than a reference specific absorption rate (SAR), based on information about the value of the first capacitance.
The method of claim 9, wherein the information about the value of the second capacitance is:
Contains data on changes in the value of the second capacitance,
The sensor circuit is,
In response to detecting that the value of the second capacitance changes from a first value to a second value, provide information about the value of the second capacitance, including data about the change in the value of the second capacitance, to the processor. An electronic device configured to provide.
The method of claim 9, wherein the sensor circuit,
An electronic device containing a grip sensor.
In claim 9,
display; and
further comprising a touch sensor operatively coupled to the display,
The sensor circuit is,
An electronic device including the touch sensor.
The method of claim 9, wherein when the processor executes the instructions,
The electronic device is configured to identify that the first connector and the third path are electrically disconnected based on identifying that the value of the second capacitance corresponds to the value of the first reference capacitance.
The method of claim 15, wherein when the processor executes the instructions,
Electronics configured to identify that the second connector and the third path are electrically disconnected based on identifying that the value of the second capacitance corresponds to a value of the second reference capacitance that is higher than the value of the first reference capacitance. Device.
In claim 9,
Further comprising a capacitance electrically connected to the second connector to identify the state of the electrical connection between the first connector and the third path and the state of the electrical connection between the second connector and the third path. electronic device that does.
◈Claim 18 was abandoned upon payment of the setup registration fee.◈ In electronic devices,
a sensor circuit configured to obtain information about the value of capacitance;
a first circuit electrically connected to the sensor circuit through a first path and operating differently depending on whether contact between an external object and the electronic device is detected;
a first connector electrically connected to the sensor circuit through a second path that is distinct from the first path;
second connector;
a coaxial cable electrically connected between the first connector and the second connector;
display;
Memory for storing instructions; and
Comprising a processor, when the processor executes the instructions,
Obtaining information about the value of the first capacitance measured through the first path from the first circuit using the sensor circuit,
Obtaining information about the value of a second capacitance measured from the first connector through the second path using the sensor circuit,
configured to display information about the value of the first capacitance and information about the value of the second capacitance on the display,
The information about the value of the second capacitance is used to identify the state of the electrical connection between the first connector and the coaxial cable and the state of the electrical connection between the second connector and the coaxial cable.
◈Claim 19 was abandoned upon payment of the setup registration fee.◈ The method of claim 18, wherein the information about the value of the first capacitance is:
An electronic device used to identify whether contact between the external object and the electronic device is detected.
◈Claim 20 was abandoned upon payment of the setup registration fee.◈ The method of claim 18, wherein when the processor executes the instructions,
Based on identifying that the degree of change in the value of the second capacitance is outside the reference range, the state of the electrical connection between the first connector and the coaxial cable or the electrical connection between the second connector and the coaxial cable An electronic device further configured to output information for notifying that the state of the connection is abnormal.

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