KR20220080557A - Printed circuit board - Google Patents

Abstract

The present disclosure includes a core part having a through hole; a post disposed in the through hole and including a metal different from that of the core part; and an insulating layer disposed on one surface and the other surface of the core part and disposed between the through hole and the post.

Description

Printed Circuit Board {PRINTED CIRCUIT BOARD}

The present disclosure relates to a printed circuit board.

In order to respond to the recent trend of weight reduction and miniaturization of mobile devices, the need to implement thinning and circuit miniaturization also increases in printed circuit boards mounted thereon.

On the other hand, with the slimming of the printed circuit board, the bending phenomenon of the board is emerging as a serious problem. As the printed circuit board is made of various materials with different coefficients of thermal expansion, the warpage of the board is intensifying. Accordingly, research on new structures and new materials is continuing.

When a PPG material composed of epoxy and glass fiber is used as the core of a printed circuit board, there is a limitation in controlling the warpage of the board, and heat dissipation generated inside the semiconductor package is difficult because the thermal conductivity is not high. Accordingly, the bending phenomenon of the substrate was controlled, and a metal, which is a material with high thermal conductivity, was used as the core.

One of several objects of the present disclosure is to provide a printed circuit board including a micro circuit and/or a micro via.

One of several purposes of the present disclosure is to control a warpage phenomenon of a printed circuit board.

Another object of the present disclosure is to provide a printed circuit board having an improved heat dissipation effect.

A printed circuit board according to an example proposed by the present disclosure includes a core part having a through hole; a post disposed in the through hole and including a metal different from that of the core part; and an insulating layer disposed on one surface and the other surface of the core part and disposed between the through hole and the post.

As one effect among various effects of the present disclosure, it is possible to provide a printed circuit board including a micro circuit and/or a micro via.

As another effect among the various effects of the present disclosure, it is possible to provide a printed circuit board capable of controlling a warpage phenomenon.

As another effect among various effects of the present disclosure, it is possible to provide a printed circuit board having an improved heat dissipation effect.

1 is a diagram schematically illustrating an example of an electronic device system.
2 is a diagram schematically illustrating an example of an electronic device.
3 is a diagram schematically illustrating an example of a printed circuit board according to the present disclosure.
4 is a diagram schematically illustrating another example of a printed circuit board according to the present disclosure.
5 is a diagram schematically illustrating another example of a printed circuit board according to the present disclosure.
6 is a diagram schematically illustrating another example of a printed circuit board according to the present disclosure.
7 is a diagram schematically illustrating another example of a printed circuit board according to the present disclosure.
8 is a diagram schematically illustrating another example of a printed circuit board according to the present disclosure.
9A to 9B are views schematically illustrating an example of a manufacturing process of a printed circuit board according to the present disclosure.

Hereinafter, the present disclosure will be described with reference to the accompanying drawings. The shapes and sizes of elements in the drawings may be exaggerated or reduced for clearer description.

Electronics

1 is a block diagram schematically showing an example of an electronic device system.

Referring to the drawings, the electronic device 1000 accommodates the main board 1010 . A chip-related component 1020 , a network-related component 1030 , and other components 1040 are physically and/or electrically connected to the main board 1010 . These are also combined with other electronic components to be described later to form various signal lines 1090 .

The chip-related component 1020 includes a memory chip such as a volatile memory (eg, DRAM), a non-volatile memory (eg, ROM), and a flash memory; application processor chips such as a central processor (eg, CPU), a graphics processor (eg, GPU), a digital signal processor, an encryption processor, a microprocessor, and a microcontroller; Logic chips such as analog-to-digital converters and ASICs (application-specific ICs) are included, but are not limited thereto, and of course, other types of chip-related electronic components may be included. Also, it goes without saying that these electronic components 1020 may be combined with each other. The chip-related component 1020 may be in the form of a package including the above-described chip or electronic component.

*Network related parts 1030 include Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G and any other wireless and wired protocols designated thereafter include, but are not limited to, many other wireless or Any of wire standards or protocols may be included. Also, it goes without saying that the network-related component 1030 may be combined with the chip-related electronic component 1020 .

The other components 1040 include a high frequency inductor, a ferrite inductor, a power inductor, ferrite beads, low temperature co-firing ceramics (LTCC), an electro magnetic interference (EMI) filter, a multi-layer ceramic condenser (MLCC), and the like. . However, the present invention is not limited thereto, and in addition to this, a passive element in the form of a chip component used for various other purposes may be included. Also, it goes without saying that the other component 1040 may be combined with the chip-related electronic component 1020 and/or the network-related electronic component 1030 .

Depending on the type of the electronic device 1000 , the electronic device 1000 may include other electronic components that may or may not be physically and/or electrically connected to the main board 1010 . Examples of other electronic components include a camera module 1050 , an antenna module 1060 , a display 1070 , and a battery 1080 . However, the present invention is not limited thereto, and an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (eg, a hard disk drive), a compact disk (CD), a digital versatile disk (DVD), etc. may be In addition to this, it goes without saying that other electronic components used for various purposes may be included depending on the type of the electronic device 1000 .

The electronic device 1000 includes a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, and a computer ( computer), monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, and the like. However, the present invention is not limited thereto, and may be any other electronic device that processes data in addition to these.

2 is a perspective view schematically illustrating an example of an electronic device.

Referring to the drawings, the electronic device may be, for example, a smartphone 1100 . A main board 1110 is accommodated inside the smartphone 1100 , and various electronic components 1120 are physically and/or electrically connected to the main board 1110 . In addition, other electronic components that may or may not be physically and/or electrically connected to the main board 1110 such as the camera module 1130 and/or the speaker 1140 are accommodated therein. A part of the electronic component 1120 may be the aforementioned chip-related component, for example, the antenna module 1121, but is not limited thereto. The antenna module 1121 may be a form in which electronic components are surface mounted on a printed circuit board, but is not limited thereto. On the other hand, the electronic device is not necessarily limited to the smart phone 1100, and of course, it may be another electronic device as described above.

printed circuit board

3 is a diagram schematically illustrating an example of a printed circuit board according to the present disclosure.

Referring to the drawings, the printed circuit board 10A includes a core part 100 , a post 200 , and an insulating layer 300 . In addition, the core part 100 may include a through hole 110 , and the post 200 is disposed in the through hole 110 .

A non-insulating material may be used for both the core part 100 and the post 200 , and may include different materials. A nickel-iron alloy (Invar alloy) may be used as the material of the core part 100 , and a non-insulating material such as a combustible fiber may be used in addition to a metallic material. Materials of the post 200 include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or these A conductive material such as an alloy of

When a non-insulating material such as metal is used for the core portion and the post, an insulating layer must be formed inevitably because current may be possible between the core and the post due to the electrically conductive properties of the metal material.

Accordingly, the post 200 may be disposed in the through hole 110 of the core part 100 as in the present disclosure, and after the through hole 110 of the core part 100 is filled with an insulating material, the through hole 110 ), a hole connecting the upper layer and the lower layer may be formed again in the through hole 110 by processing a hole having a smaller diameter than the diameter of the insulating material.

The post 200 has one surface 220 in contact with the insulating layer 310 disposed on one surface 120 of the core part 100 , and an insulating layer 320 disposed on the other surface 130 of the core part 100 , and It may include a contacting other surface 230 .

The insulating layer 300 may include a first insulating layer 310 and a second insulating layer 320 , and the first insulating layer 310 is on one surface 120 of the core part 100 , and a second insulating layer 310 . The layer 320 may be disposed on the other surface 130 of the core part 100 . In addition, by disposing the first insulating layer 310 to extend between the through hole 110 and the post 200 , the post 200 may be embedded in the insulating material.

The material of the insulating layer 300 is a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a resin in which these resins are impregnated into a core material such as glass fiber (Glass Cloth, Glass Fabric) together with an inorganic filler, for example, , at least one of prepreg, Ajinomoto Build-up Film (ABF), FR-4, and BT (Bismaleimide Triazine) may be used.

Also, the first insulating layer 310 and the second insulating layer 320 may use the same insulating material or different materials.

4 is a cross-sectional view schematically illustrating another example of a printed circuit board according to the present disclosure.

Referring to the drawings, the printed circuit board 10B is a printed circuit board 10A in which the surface of the post 200 is coated with an insulating layer. By coating the post 200 with an insulating layer, it is possible to prevent conduction between the core part 100 and the post 200 .

By coating the side surface of the post 200 with the oxide film 210, insulating performance may be improved. The oxide film 210 may be disposed on one surface 220 and a side surface of the post 200 in contact with the insulating layer disposed on one surface 120 of the core part 100 . Also, the oxide film 210 may be formed by anodizing.

Descriptions of other components are substantially the same as those described above, and detailed descriptions thereof will be omitted.

5 and 6 are cross-sectional views schematically illustrating another example of a printed circuit board according to the present disclosure.

As can be seen in the process to be described later, after the first insulating layer 310 is laminated on one surface of the core part 100 , the carrier copper foil attached to the post 200 is removed by etching or the like. In this case, the carrier copper foil may be of a non-insulating material different from that of the post 200, or may be of the same non-insulating material.

Referring to FIG. 5 , the printed circuit board 10C is a printed circuit board 10A, by using different non-insulating materials for the carrier copper foil and the post 200 , the other surface 130 of the core part 100 and The other surface 230 of the post 200 is shown to be located at the same level.

6, the printed circuit board 10D is the printed circuit board 10A, by using the same non-insulating material for the carrier copper foil and the post 200, the other surface 130 of the core part 100 and The other surface 230 of the post 200 is shown to be located at different levels from each other.

Descriptions of other components are substantially the same as those described above, and detailed descriptions thereof will be omitted.

7 is a cross-sectional view schematically illustrating another example of a printed circuit board according to the present disclosure.

Referring to the drawings, the printed circuit board 10E further includes a wiring layer 400 and a via 500 in the printed circuit board 10A.

The wiring layer 400 may be disposed on the insulating layer 300 and may be buried in the insulating layer 300 . The via 500 may pass through the insulating layer 300 to connect the post 200 and the wiring layer 400 . In addition, since the via 500 is disposed on both surfaces of the post 200 , a build-up layer may be formed on one surface 120 and the other surface 130 of the core part 100 .

A metal material may be used as the material of the wiring layer 400 , and the metal material includes copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), and lead. (Pb), titanium (Ti), or an alloy thereof may be used. In addition, the same non-insulating material as the post 200 may be used as the material of the wiring layer 400 .

The method of forming the wiring layer 400 is not particularly limited, but may be formed by forming a first plating layer serving as a seed layer by electroless plating, etc., and forming a second plating layer on the first plating layer by electrolytic plating, etc. have. However, the wiring layer 400 disposed on the uppermost side of the plurality of wiring layers 400 may be formed by electrolytic plating using the metal foil of the carrier as a seed layer, as can be seen in the process to be described later, and thus may include only a single metal layer. may be

Each of the plurality of wiring layers 400 may perform various functions according to a design design. For example, it may include a ground pattern, a power pattern, a signal pattern, and the like. Each of these patterns may have a line, plane, or pad shape.

As shown in the drawing, the via 500 may be integrated with the wiring layer 400 and may not have a boundary with each other. However, the present invention is not limited thereto, and may be distinguished from each other while having a boundary with the wiring layer 400 according to a method of forming the via 500 .

The via 500 may be a filled-type having an inside completely filled with a conductive material, or a conductive material may be formed along an inner wall of the via. The via 500 may have a known shape such as a cylindrical shape or a tapered shape.

Descriptions of other components are substantially the same as those described above, and detailed descriptions thereof will be omitted.

8 is a cross-sectional view schematically illustrating another example of a printed circuit board according to the present disclosure.

Referring to the drawings, the printed circuit board 10F includes a plurality of first insulating layers 310a, 310b, 310c, and 310d and a plurality of wiring layers 400a, 400b, 400c, and 400d in the printed circuit board 10A. will include more The same non-insulating material as the post 200 may be used as a material of the plurality of wiring layers 400 .

The printed circuit board 10F may be a multilayer board formed by repeatedly stacking a plurality of insulating layers 310 and a plurality of wiring layers 400 . In addition, it may be a double-sided board in which wiring layers are disposed on both surfaces of one insulating layer.

Each of the plurality of wiring layers 400 may be disposed on each of the plurality of first insulating layers 310 . Also, at least one of the plurality of wiring layers 400 may be buried in the first insulating layer 310 to be exposed through one surface of the first insulating layer 310 .

The second insulating layer 320 may also include a plurality of insulating layers. In this case, the plurality of wiring layers 400 may be disposed on each of the plurality of second insulating layers 320 . Also, at least one of the plurality of wiring layers 400 may be buried in the second insulating layer 320 and exposed as one surface of the second insulating layer 320 .

The wiring layer 400 disposed on the uppermost of the plurality of wiring layers 400 may include a microcircuit, and the line width of the wiring layer 400 disposed on the uppermost of the plurality of wiring layers 400 is the same as that of the remaining wiring layers 400 . It may be narrower than the line width. The uppermost wiring layer 400 including the microcircuit may be connected to another wiring layer 400 or the post 200 through the via 500 .

Descriptions of other components are substantially the same as those described above, and detailed descriptions thereof will be omitted.

9A to 9B are cross-sectional views schematically illustrating an example of a structure in which the electronic component 20 is mounted on the printed circuit board 10 according to the present disclosure.

Referring to the drawings, at least one electronic component 20 may be mounted on the printed circuit board 10 . In this case, the electronic component 20 may be mounted through the connection conductor 21 .

The printed circuit board 10 according to the present disclosure may be used in a product having an asymmetric structure. In addition, the electronic component 20 may be an active component, specifically, a plurality of dies. A plurality of dies may be connected to each other to implement an application processor. However, the present invention is not limited thereto, and may be a passive component such as a capacitor or an inductor.

The connection conductor 21 may be formed of solder, but is not limited thereto, and a conductive material may be used without limitation.

In the case of a modular product in which passive components and chips are mounted inside a single printed circuit board 10, the generated heat can be efficiently dissipated, and the bending phenomenon occurring in the asymmetric structure can be controlled.

Descriptions of other components are substantially the same as those described above, and detailed descriptions thereof will be omitted.

Printed circuit board manufacturing method

A core having a through-hole is prepared. In this case, the through hole is formed through a circuit process, and a process such as etching may be performed.

The core layer is processed by a process such as carrier copper foil, and a post having a smaller diameter than the through hole formed in the core is formed on the core layer. In this case, the core and the post may include different non-insulating materials, and an oxide film may be formed on the upper surface and the side surface of the post by processing such as anodizing.

A core having a through-hole formed therein is inserted into a post on the core layer, and an insulating filler is laminated on the upper surface of the core. In this case, the insulating filler may be disposed to extend between the through hole and the post.

The core layer is detached, and the carrier copper foil is removed by a process such as etching. In this case, when the carrier copper foil and the post are of different non-insulating materials, the lower surface of the core part and the lower surface of the post may be located at the same level. When the carrier copper foil and the post are made of the same non-insulating material, the lower surface of the core part and the lower surface of the post may be located at different levels.

By forming an insulating layer on the lower surface of the core, it is possible to form a structure in which the metal cost is embedded in the insulating material.

A printed circuit board can be manufactured in a bidirectional or asymmetrical cross-sectional form by forming vias on the upper and lower surfaces of the post.

The expression of being disposed on any component in the present specification is not intended to establish a direction. Accordingly, the expression disposed on a certain component may mean disposed on an upper side of a certain component or may mean disposed on a lower side of a certain component.

In this specification, terms such as upper surface, lower surface, upper side, lower side, uppermost side, and lowermost side are directions set based on the drawings for convenience of description. Therefore, according to the setting direction, the upper surface, the lower surface, the upper side, the lower side, the uppermost side, the lowest side, etc. may be described with different terms.

The meaning of being connected in the present specification is a concept including not only directly connected, but also indirectly connected. In addition, the meaning of being electrically connected is a concept including both the case of being physically connected and the case of not being connected.

In this specification, expressions such as first, second, etc. are used to distinguish one component from another, and do not limit the order and/or importance of the corresponding components. According to the description, the first component may be referred to as a second component, and similarly, the second component may be referred to as a first component.

The expression “an example” used in this specification does not mean the same embodiment, and is used to emphasize and explain different unique characteristics. However, the examples presented above are not excluded from being implemented in combination with features of other examples. For example, even if a matter described in one specific example is not described in another example, it may be understood as a description related to another example unless a description contradicts or contradicts the matter in another example.

The terminology used herein is used to describe an example, and is not intended to limit the present disclosure. In this case, the singular expression includes the plural expression unless the context clearly indicates otherwise.

10, 10A, 10B, 10C, 10D, 10E, 10F: Printed circuit board
20: electronic component 21: connecting conductor
100: post 110: through hole
120: one surface of the core 130: the other surface of the core
200: post 210: oxide film
220: one side of the post 230: one side of the post
300, 310, 310a, 310b, 310c, 310d, 320: insulating layer
400, 400a, 400b, 400c, 400d: wiring layer
500: via
1000: electronic device 1010: main board
1020: chip related parts 1030: network related parts
1040: other parts 1050: camera module
1060: antenna module 1070: display
1080: battery 1090: signal line
1100: smartphone 1110: smartphone internal main board
1120: internal electronic components of a smartphone
1121: smartphone internal antenna module
1130: smartphone internal camera module
1140: Smartphone internal speaker

Claims (8)

a core part having a through hole formed therein;
a post disposed in the through hole and including a metal different from that of the core part; and
and an insulating layer disposed on one surface and the other surface of the core part and disposed between the through hole and the post.
According to claim 1,
The insulating layer is
a first insulating layer disposed on one surface of the core part and extending between the through hole and the post;
A printed circuit board comprising a second insulating layer disposed on the other surface of the core part.
According to claim 1,
an oxide film disposed on a side surface of the post;
Further comprising a, printed circuit board.
According to claim 1,
The post has one surface in contact with the insulating layer disposed on one surface of the core part and the other surface in contact with the insulating layer disposed on the other surface of the core part,
A printed circuit board having an oxide film disposed on one side and a side surface of the post.
According to claim 1,
The post has one surface in contact with the insulating layer disposed on one surface of the core part and the other surface in contact with the insulating layer disposed on the other surface of the core part,
The other surface of the core part and the other surface of the post are located on the same level.
According to claim 1,
The post has one surface in contact with the insulating layer disposed on one surface of the core part and the other surface in contact with the insulating layer disposed on the other surface of the core part,
The other surface of the core part and the other surface of the post are located at different levels from each other.

According to claim 1,
a wiring layer disposed on the insulating layer; and
a via passing through the insulating layer and connecting the post and the wiring layer;
Further comprising a, printed circuit board.
3. The method of claim 2,
The first insulating layer is formed in plurality,
a plurality of wiring layers disposed on each of the plurality of first insulating layers and including the same metal as that of the posts;
Further comprising a, printed circuit board.

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