KR20220080467A - Assembly for supporting substrate and Apparatus for processing substrate - Google Patents

Abstract

The substrate support assembly of the present invention is a substrate support assembly for revolving and rotating a seated substrate. A plurality of grooves are formed so that a plurality of substrates are arranged in a circumferential direction, and a gas is formed in the grooves so that a gas is supplied to the grooves. a support body having a spray hole; a plurality of seating plates provided in the groove and on which the substrates are respectively seated; and a gas flow path formed in the groove portion and configured to rotate the seating plate through the gas supplied to the groove portion. Including, at least two or more first stopper members provided to face each other on the lower surface of the periphery of the seating plate to maintain rotation of the seating plate at a predetermined angle, and at least two first stopper members provided on the upper surface of the groove to catch the first stopper member and at least two or more second stopper members protruding to the surface.

Description

BACKGROUND ART Assembly for supporting substrate and Apparatus for processing substrate

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device for processing a substrate, and more particularly, to a substrate support assembly and a substrate processing apparatus.

In general, in order to manufacture a semiconductor device, a display device, or a solar cell, various processes are performed in a substrate processing apparatus including a process chamber in a vacuum atmosphere. For example, a process such as loading a substrate into the process chamber and depositing a thin film on the substrate or etching the thin film may be performed. The substrate is supported by a substrate support assembly installed in the process chamber, and a process gas may be injected to the substrate through a gas injection unit installed to face the substrate support assembly.

In such a substrate processing apparatus, it is necessary to process the substrate while rotating the substrate in order to uniformly process the substrate. For example, a uniform substrate treatment may be achieved by rotating the substrate during the process. In order to rotate the substrate, the substrate support assembly employs a technology of rotating the substrate in a floating state using a mounting plate (satellite).

In the case of such a substrate support assembly, in order to improve the thickness and dispersion of a specific region, rotation of the substrate may be required at an angle specified in a specific step in the process. However, since the rotation of the support body in which the seating plate is accommodated must be stopped when the substrate is rotated, there is a problem in that productivity is reduced.

An object of the present invention is to provide a substrate support assembly and a substrate processing apparatus capable of performing rotation of the substrate without stopping the rotation of the support body as to solve various problems including the above problems. However, these problems are exemplary, and the scope of the present invention is not limited thereto.

A substrate support assembly according to an embodiment of the present invention is a substrate support assembly for revolving and rotating a seated substrate, wherein a plurality of grooves are formed so that a plurality of substrates are arranged in a circumferential direction, and a gas is supplied to the grooves. a support body having a gas injection hole formed in the groove; a plurality of seating plates provided in the groove and on which the substrates are respectively seated; and a gas flow path formed in at least one of the seating plate and the groove portion to rotate the seating plate through the gas supplied to the groove portion. Including, at least two or more first stopper members provided to face each other on the lower surface of the periphery of the seating plate to maintain rotation of the seating plate at a predetermined angle, and at least two first stopper members provided on the upper surface of the groove to catch the first stopper member and at least two or more second stopper members protruding to the surface.

In the substrate support assembly, the at least two first stopper members include a 1-1 stopper member and a 1-2 stopper member spaced apart from the 1-1 stopper member in a circumferential direction, wherein the at least two The at least two second stopper members are arranged to be circumferentially spaced apart from the 2-1 stopper member corresponding to the 1-1 stopper member and the 2-1 stopper member, and second stopper members corresponding to the 1-2 stopper member. -2 may include a stopper member.

In the substrate support assembly, the 1-1 th stopper member, the 1-2 th stopper member, the 2-1 th stopper member, and the 2-2 th stopper member correspond to each other so that the seating plate is rotated at a predetermined angle. It may be detachably coupled to the position.

In the substrate support assembly, the gas passage may include: a first gas passage for supplying a rotating gas to rotate the seating plate in a clockwise direction; and a second gas flow path supplying a rotating gas to rotate the seating plate counterclockwise.

In the substrate support assembly, a distal end of the first gas flow path and a distal end of the second gas flow path may be disposed in opposite directions from a center of the groove portion.

In the substrate support assembly, the gas flow path may further include a third gas flow path for supplying a floating gas for floating the seating plate.

In the substrate support assembly, a power transmission pattern for receiving rotational force from the rotating gas may be formed on a rear surface of the seating plate.

In the substrate support assembly, the power transmission pattern may include a plurality of grooves disposed along an edge of a rear surface of the seating plate.

The substrate support assembly may include a rotatable shaft coupled to the support body so that the seating plate revolves, and a plurality of gas supply lines through which the floating gas and the rotating gas are moved may be formed on the shaft.

In the substrate support assembly, a gas distribution plate for distributing the floating gas and the rotation gas supplied from the groove portion and supplying the floating gas to the seating plate is coupled to the groove portion, and the gas distribution plate includes the floating gas for supplying the floating gas. It may include a hole and at least one rotating gas hole inclined to provide the rotating gas.

A substrate processing apparatus according to another embodiment of the present invention includes a process chamber; the above-described substrate support assembly installed in the process chamber; and a gas injection unit installed in the process chamber to face the substrate support assembly and configured to inject a processing gas toward the substrate support assembly.

According to the substrate support assembly and the substrate processing apparatus according to an embodiment of the present invention made as described above, the rotation of the substrate is possible without stopping the rotation of the support body, so that productivity can be increased.

Of course, the scope of the present invention is not limited by these effects.

1 is a perspective view schematically illustrating a substrate support assembly according to an embodiment of the present invention.
2 is a rear view illustrating a seating plate of a substrate support assembly according to an embodiment of the present invention.
3 is a schematic perspective view showing a shaft of a substrate support assembly according to an embodiment of the present invention;
4 is a cross-sectional view schematically illustrating a configuration of a flow path through which a rotating gas flows in a substrate support assembly according to an embodiment of the present invention.
5 is an enlarged cross-sectional view illustrating an enlarged area Z1 of FIG. 4 .
FIG. 6 is an enlarged cross-sectional view illustrating an enlarged area Z2 of FIG. 4 .
7 is a diagram schematically illustrating a positional relationship between a first stopper member and a second stopper member in a substrate support assembly according to an embodiment of the present invention.
8 is a perspective view schematically illustrating a substrate support assembly according to another embodiment of the present invention.
9 is a partial plan view showing one groove portion of the substrate support assembly of FIG. 8 ;
10 is a cross-sectional view illustrating a substrate processing apparatus according to an exemplary embodiment.
11 is a result showing the thickness and uniformity of a thin film deposited on a substrate using the substrate processing apparatus according to the first experimental example of the present invention.
12 is a flowchart of a process of rotating a substrate in a substrate processing apparatus according to a second experimental example of the present invention.

Hereinafter, several preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Examples of the present invention are provided to more completely explain the present invention to those of ordinary skill in the art, and the following examples may be modified in various other forms, and the scope of the present invention is as follows It is not limited to an Example. Rather, these embodiments are provided so as to more fully and complete the present disclosure, and to fully convey the spirit of the present invention to those skilled in the art. In addition, in the drawings, the thickness or size of each layer is exaggerated for convenience and clarity of description.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically illustrating ideal embodiments of the present invention. In the drawings, variations of the illustrated shape can be envisaged, for example depending on manufacturing technology and/or tolerances. Accordingly, embodiments of the spirit of the present invention should not be construed as limited to the specific shape of the region shown in the present specification, but should include, for example, changes in shape caused by manufacturing.

1 is a perspective view schematically showing a substrate support assembly according to an embodiment of the present invention, and FIG. 2 is a rear view showing a mounting plate of the substrate support assembly according to an embodiment of the present invention.

Referring to FIG. 1 , the substrate support assembly 100 may include a support body 110 and a seating plate 130 . The support body 110 may be referred to as a susceptor plate, and the seating plate 130 may be referred to as a satellite.

The support body 110 may include at least one groove portion 120 corresponding to a position at which the substrate S is seated. For example, the groove 120 may be provided in the support body 110 in the shape of a pocket groove. In order to process a plurality of substrates S at once, a plurality of groove portions 120 may be provided. For example, the plurality of grooves 120 may be formed to be spaced apart from each other by a predetermined distance along the circumferential direction on the upper surface of the support body 110 . More specifically, the grooves 120 may be radially conformal to the axis of rotation of the support body 110 .

A plurality of gas flow lines 112 , 114 , and 116 connected to the groove 120 may be formed in the support body 110 . For example, a predetermined working gas into the groove 120 through the gas flow lines 112 , 114 , and 116 , for example, a floating gas for floating the substrate S, and a rotating gas for rotating the substrate S. can supply The floating gas and the rotating gas may be separated from each other through the gas flow lines 112 , 114 , and 116 , and may be supplied to the seating plate 130 through the groove 120 .

For example, the gas flow lines 112 , 114 , 116 may include a plurality of floating gas flow lines 112 , and a plurality of rotating gas flow lines 114 , 116 . The floating gas flow lines 112 may supply the floating gas to the groove part 120 , and the rotating gas flow lines 114 and 116 may supply the rotation gas to the groove part 120 .

More specifically, the floating gas flow lines 112 may be respectively connected to the groove portions 120 , and the rotating gas flow lines 114 and 116 may be respectively connected to the groove portions 120 .

In each groove 120 , a rotation gas flow line 116 that is a first gas flow path for supplying a rotation gas to rotate the substrate S so as to rotate clockwise, and a first injection hole 126 connected to the rotation gas flow line 116 . , a second gas flow line 114 that is a second gas flow path for supplying a rotating gas to rotate the substrate S counterclockwise, and a second injection hole 124 connected to the rotating gas flow line 114, the substrate S ), a floating gas flow line 112 that is a third gas flow path for supplying the floating gas to float, and a third injection hole 122 connected to the floating gas flow line 112 may be formed.

The first injection hole 126 may be inclined to supply the rotating gas in the forward rotation direction, and the second injection hole 126 may be formed to be inclined to supply the rotation gas in the reverse rotation direction. Furthermore, the third injection hole 122 may be formed such that at least the discharge portion A extends in the vertical direction with respect to the groove portion 120 so that the floating gas is supplied vertically upward.

The seating plate 130 may be disposed in the groove part 120 . The substrate S may be seated on the upper surface of the mounting plate 130 . For example, the plurality of seating plates 130 may be respectively disposed in the plurality of groove portions 120 , and in this case, the number of the seating plates 130 may be the same as the number of the groove portions 120 .

The seating plate 130 may receive floating gas from the groove 120 and float from the groove 120 . Furthermore, the seating plate 130 can rotate relatively with respect to the support body 110 by the rotation gas supplied from the groove 120 in the forward or reverse rotation direction, whereby the substrate S is moved to the support body ( 110) can be rotated relatively. Since this rotation is relative to the support body 110 , it may be referred to as rotation.

For example, a forward rotation direction may refer to a direction in which the seating plate 130 is rotated clockwise, and a reverse rotation direction may indicate a direction in which the seating plate 130 is rotated counterclockwise. More specifically, the forward rotation direction and the rotation reverse direction may be opposite to each other along a tangent line of the circumference according to the position of the seating plate 130 .

In some embodiments, as shown in FIGS. 2, 5 and 6 , the seating plate 130 may include a power transmission pattern 134 on its lower surface to facilitate receiving rotational force from the supplied rotating gas. For example, the power transmission pattern 134 may be formed of a plurality of grooves disposed along the edge of the rear surface of the seating plate 130 . More specifically, the power transmission pattern 134 may be formed in a groove pattern having a symmetrical shape to receive rotational force from the rotational gas supplied from different directions, for example, may be formed in a circular groove pattern. The arrow AG indicates the discharge direction of the rotating gas.

Furthermore, the support body 110 has a position fixing protrusion 121 formed in the center of the groove 120, and the seating plate 130 has a projection groove portion (not shown) into which at least a portion of the position fixing projection 121 is inserted on its lower surface. city) can be formed. Accordingly, the position of the seating plate 130 may be guided by the position fixing protrusion 121 , and the rotational movement of the seating plate 130 may be stably performed.

Additionally, the shaft 160 may be coupled to the support body 110 . The shaft 160 may be rotatable so that the substrate S may revolve. For example, a driving device (not shown) may be coupled to the shaft 160 , and the shaft 160 may be rotated or moved up and down by the driving device. As the shaft 160 is rotated or moved up and down, the support body 110 may also be rotated or moved up and down.

Hereinafter, the structure of the shaft 160 will be described in more detail.

3 is a schematic perspective view showing a shaft 160 of substrate support assemblies in accordance with embodiments of the present invention.

1 and 3 , a plurality of gas supply lines 162 and 164 through which floating gas and rotating gas are moved may be formed on the shaft 160 . For example, the gas supply lines 162 and 164 may include a floating gas supply line 162 commonly connected to the floating gas flow lines 112 , and a plurality of rotating gas connected to the rotating gas flow lines 114 and 116 . Supply lines 164 may be included.

More specifically, the floating gas supply line 162 penetrates from the lower surface to the upper surface of the shaft 160 and is commonly connected to the floating gas flow lines 112 , and the rotating gas supply lines 164 are connected to the shaft 160 . Penetrates from the sidewall of the shaft to the upper surface of the shaft 160 and may be respectively connected to the rotating gas flow lines 114 and 116 .

For example, the floating gas supply line 162 for supplying the floating gas may be commonly connected to the plurality of grooves 120 as one line, and thus may be moved in one line along the axis of the shaft 160 . can

The rotating gas supply lines 164 for supplying the rotating gas may be respectively connected to the grooves 120 . Accordingly, the rotating gas supply lines 164 may be formed to extend to the upper surface of the shaft 160 at different positions on the sidewall of the shaft 160 .

More specifically, a plurality of ring groove portions 163 may be formed on the sidewall of the shaft 160 , and the rotating gas supply lines 164 may extend from the ring groove portions 163 to the upper surface of the shaft 160 . have. The rotating gas may be supplied from these ring grooves 163 and supplied to the rotating gas flow lines 114 and 116 through the rotating gas supply lines 164 . The ring grooves 163 may be sealed using a magnetic fluid, and thus, the rotating gas may be supplied to the rotating gas supply lines 164 while the sealing is maintained even when the shaft 160 is rotated.

Meanwhile, in a modified example of this embodiment, a plurality of floating gas supply lines 162 for supplying floating gas may be formed and modified to be respectively connected to the groove portions 120 . In another modified example of this embodiment, the rotating gas supply lines 164 may be formed to pass through the upper surface from the lower surface of the shaft 160 .

In the substrate support assembly 100 according to an embodiment of the present invention, while the substrate S is exposed to a process gas during a process such as depositing a thin film on the substrate S or etching the thin film, The mounting plate 130 on which the substrate S is seated may not rotate, but only the support body 110 may rotate. That is, while the substrate S is exposed to the process gas, the seating plate 130 on which the substrate S is seated may perform a rotational motion that only revolves by the rotation of the support body 110 without rotating.

In this case, since the thickness and distribution of a specific area on the substrate S may be deteriorated, the mounting plate 130 on which the substrate S is mounted is rotated (rotated) at an angle specified in a specific step in the process. After that, it may be necessary to perform subsequent processes. However, before rotating (rotating) the mounting plate 130 on which the substrate S is seated, the process of stopping the rotation (revolution) of the support body 110 and stopping the gas flow must be preceded first, and the substrate S After rotating (rotating) the seated seating plate 130, the process time is significantly increased and productivity is increased because the steps of restarting the rotation (revolution) of the support body 110 and resuming and stabilizing the gas flow must be followed. There is a problem with lowering.

In order to solve this problem, the substrate support assembly 100 according to an embodiment of the present invention does not stop the rotation (revolution) of the support body 110 while the substrate S is mounted on the seating plate 130 of the Provides a configuration that effectively and simply implements rotation (rotation).

Referring to FIG. 7 together with FIGS. 1 to 6 , in the substrate support assembly 100 according to an embodiment of the present invention, the periphery of the seating plate 130 is rotated and maintained at a predetermined angle. At least two or more first stopper members 135 provided to face each other and at least two or more second stopper members 125 provided on the upper surface of the groove 120 and protruding to engage the first stopper member 135 ) is included.

In order for the seating plate 130 to remain rotated along a predetermined angle, at least two first stopper members 135 must be included, and accordingly, the second stopper member 125 also corresponds to the first stopper member 135 , respectively. It should consist of a number of

For example, the pair of first stopper members 135 provided on the lower surface of the periphery of the seating plate 130 may be disposed in opposite directions with respect to the center of the seating plate 130 , and the groove portion 120 . ) A pair of second stopper members 125 provided on the upper surface of the periphery of the upper surface may be disposed in a direction facing each other based on the center of the groove portion 120 .

That is, the 1-1 stopper member 135_1 and the 1-1 stopper member 135_1 are provided on the lower surface of the periphery of the seating plate 130 and disposed to be spaced apart from each other in the circumferential direction. The 2-1 th stopper member 125_1 and the 2-1 th stopper member provided on the upper surface of the periphery of the upper surface of the first stopper member 135 and the groove portion 120 including the stopper member 135_2 are opposed to each other. A second stopper member 125 including a 2-2 second stopper member 125_2 disposed circumferentially spaced apart from (125_1) may be provided. In this case, the first-first stopper member 135_1 for holding the initial position and the 1-2-th stopper member 135_2 must be provided so that the seating plate rotates at a predetermined angle to be able to move to a desired angle. If the first stopper member 135 and the second stopper member 125 are provided in a single number, respectively, a problem of returning to the original position as a result of rotation may occur without being able to rotate at a desired angle.

Meanwhile, the 1-1 stopper member 135_1 , the 1-2 stopper member 135_2 , the 2-1 th stopper member 125_1 , and the 2-2 th stopper member 125_2 include the seating plate It may be detachably coupled to positions corresponding to each other so as to be rotated at a predetermined angle. Alternatively, the 1-1 stopper member 135_1 and the 1-2 stopper member 135_2 may be integrally formed with a seating plate at positions corresponding to each other so that the seating plate rotates at a predetermined angle. In addition, the 2-1 th stopper member 125_1 and the 2-2 th stopper member 125_2 may be integrally formed with the upper surface of the groove at positions corresponding to each other so that the seating plate is rotated at a predetermined angle.

Referring to FIG. 7A together with FIGS. 1 to 6 , the floating gas flow line 112 and the floating gas flow line 112 are seated by the floating gas supplied through the third injection hole 122 connected to the line 112 . In a state in which the plate 130 is floating, the seating plate 130 is rotated counterclockwise by the rotating gas supplied through the rotating gas flow line 114 and the second injection hole 124 connected to the rotating gas flow line 114 . rotate to

While the supply state of the floating gas and the rotating gas continues, the seating plate 130 continues to rotate counterclockwise, and at least one of a pair of first stopper members 135 provided on the lower surface of the periphery of the seating plate 130 . The counterclockwise rotation is stopped while any one is caught on at least one of the pair of second stopper members 125 provided on the upper surface of the periphery of the upper surface of the groove part 120 . The configuration shown in (a) of FIG. 7 shows a final state in which the counterclockwise rotation is stopped without further progressing. For example, the first stopper member 135 includes a 1-1 stopper member 135_1 and a 1-2 first stopper member 135_2 disposed to be spaced apart from the 1-1 stopper member 135_1 in the circumferential direction, , the second stopper member 125 is circumferentially spaced apart from the 2-1 th stopper member 125_1 and the 2-1 th stopper member 125_1 corresponding to the 1-1 stopper member 135_1, and the first- A 2-2 second stopper member 125_2 corresponding to the second stopper member 135_2 may be included.

Referring to FIG. 7B together with FIGS. 1 to 6 , the floating gas flow line 112 and the floating gas flow line 112 are seated by the floating gas supplied through the third injection hole 122 connected to the line 112 . In a state in which the plate 130 is floating, the seating plate 130 is moved by the rotating gas supplied through the rotating gas flow line 116 and the first injection hole 126 connected to the rotating gas flow line 116 in FIG. 7 . It rotates clockwise in the configuration shown in (a).

While the supply state of the floating gas and the rotating gas continues, the seating plate 130 continues to rotate in the clockwise direction, and at least any one of the pair of first stopper members 135 provided on the lower surface of the periphery of the seating plate 130 . The clockwise rotation is stopped while one is caught on at least one of the pair of second stopper members 125 provided on the upper surface of the periphery of the upper surface of the groove part 120 . The configuration shown in (b) of FIG. 7 shows a final state in which the clockwise rotation is stopped without further progressing. For example, the first stopper member 135 includes a 1-1 stopper member 135_1 and a 1-2 first stopper member 135_2 disposed to be spaced apart from the 1-1 stopper member 135_1 in the circumferential direction, , the second stopper member 125 is circumferentially spaced apart from the 2-1-th stopper member 125_1 and the 2-1-th stopper member 125_1 corresponding to the 1-2-th stopper member 135_2, and the first- A second-second stopper member 125_2 corresponding to the first stopper member 135_1 may be included.

The substrate support assembly according to an embodiment of the present invention having the above-described configuration may be applied to, for example, an atomic layer deposition process. The atomic layer deposition process includes the steps of supplying a source gas onto a substrate so that at least a portion of the source gas is adsorbed on the substrate; purging the source gas remaining on the substrate; forming a unit deposition film by supplying a reaction gas on the substrate on which the source gas is adsorbed; A unit cycle including purging the reaction gas remaining on the substrate may be repeated a plurality of times.

For example, when the deposition film is implemented by repeating the unit cycle 60 times, the position of the seating plate 130 on which the substrate is seated is implemented as the position shown in FIG. 7A, and then the unit cycle is repeated 30 times. to form a first unit deposition film. Subsequently, the phase of the substrate is changed by 180 degrees by moving the position of the mounting plate 130 on which the substrate is seated to the position shown in (b) of FIG. 7, and then the unit cycle is repeated 30 times to A second unit deposition layer is formed on the first unit deposition layer.

In the step of performing the unit cycle and the step of rotating the mounting plate 130 to change the phase of the substrate, the rotation of the support body 110 is continuously maintained without stopping. However, in the step of performing the unit cycle, the seating plate 130 may not rotate.

The step of supplying the floating gas through the floating gas flow line 112 and the third injection hole 122 connected to the floating gas flow line 112 includes rotating the mounting plate 130 to change the phase of the substrate. should be performed, but may or may not be performed in the step of performing the unit cycle.

The step of supplying the rotating gas through the rotating gas flow lines 114 and 116 and the injection holes 124 and 126 connected to the rotating gas flow lines 114 and 116 includes the seating plate ( 130), but may or may not be performed in the step of performing the unit cycle.

When the process is repeatedly performed while alternating the state of the seating plate 130 on which the substrate is seated to correspond to the state shown in FIGS. 7 (a) and 7 (b), the thickness of a specific region on the substrate and dispersion can be improved. To this end, rotation of the substrate is possible at an angle specified in a specific step in the process, and there is no need to stop the rotation of the support body during the rotation of the substrate, thereby ensuring high productivity.

8 is a perspective view schematically illustrating a substrate support assembly according to another embodiment of the present invention. 9 is a partial plan view showing one groove portion of the substrate support assembly of FIG. 8 ;

8 and 9 , the substrate support assembly 100a may include at least one gas distribution plate 140 . The gas distribution plate 140 may distribute the floating gas and the rotating gas and supply it to the seating plate 130 . For example, the gas distribution plate 140 may be coupled to the groove portion 120 , and may be fastened to the groove portion 120 using, for example, a fixing device such as a screw. More specifically, the plurality of gas distribution plates 140 may be respectively coupled to the groove portions 120 . The diameter of the gas distribution plate 140 is smaller than the diameter of the groove portion 120 , and a pair of first stopper members 135 and a pair of second stopper members 125 are formed in an area corresponding to the difference in diameter. can be placed.

Furthermore, the gas distribution plate 140 may be disposed between the groove part 120 and the seating plate 130 . For example, the gas distribution plate 140 may be fixed on the groove part 120 , and the seating plate 130 may be seated on the gas distribution plate 140 .

The gas distribution plate 140 may include at least one floating gas hole 142 for supplying the floating gas, and rotation gas holes 144 and 146 inclined in the forward or reverse direction to provide the rotation gas. A plurality of floating gas holes 142 may be disposed along the circumferential direction of the mounting plate 130 to balance the mounting plate 130 . The rotating gas holes 144 and 146 may be formed in plurality.

Distribution passages for distributing the floating gas and the rotating gas may be formed on the rear surface of the gas distribution plate 140 . One end of these distribution passages is connected to the gas flow lines 112 , 114 , and 116 of the groove 120 to receive the floating gas and the rotating gas, and the other end is the floating gas hole 142 and the rotating gas holes 144 and 146 . ) to discharge the floating gas and the rotating gas in the direction of the seating plate 130 .

According to the substrate support assembly 100a , the gas flow lines in the support body 110 can be formed while forming the floating gas holes 142 and the rotating gas holes 144 and 146 in the gas distribution plate 140 . The structure of (112, 114, 116) can be simplified.

10 is a cross-sectional view illustrating a substrate processing apparatus 200 according to an exemplary embodiment.

Referring to FIG. 10 , the substrate processing apparatus 200 may include a process chamber 210 , a substrate support assembly 100 , a gas injector 220 , and a controller 300 .

The process chamber 210 may define a processing space for processing the substrate S therein. For example, the process chamber 210 is configured to be airtight, and may be connected to a vacuum pump (not shown) through at least one exhaust port 212 to exhaust a process gas within the process space and to adjust a degree of vacuum in the process space. can

The process chamber 210 may be provided in various shapes, and may include, for example, a side wall portion defining a processing space and a cover portion positioned at an upper end of the side wall portion. Furthermore, the process chamber 210 may include an openable and openable gate (not shown) on the sidewall portion for the movement of the substrate S.

The substrate support assembly 100 described with reference to FIGS. 1 to 9 may be installed in the process chamber 210 to be elevating and/or rotatable. For example, the substrate support assembly 100 is attached to the process chamber 210 using a bellows structure (not shown) so that airtightness of the process chamber 210 can be maintained when the shaft 160 is raised, lowered, and/or rotated. can be combined.

The gas injector 220 may be installed in the process chamber 210 to supply the process gas supplied from the outside of the process chamber 210 to the process space in the process chamber 210 . For example, the gas injector 220 may be installed in the process chamber 210 to face the substrate support assembly 100 , and may inject a processing gas toward the substrate support assembly 100 . More specifically, the gas injection unit 220 may be installed opposite the support body 110 in the upper portion of the process chamber 210 to inject the processing gas to the substrate S seated on the substrate support assembly 100 . can

The gas ejection unit 220 includes at least one inlet hole formed at an upper side or a side portion to receive a process gas from the outside, and a plurality of downwardly facing the substrate S to inject the process gas onto the substrate S. may include injection holes of For example, the gas injection unit 220 may have various shapes, such as a shower head shape, a nozzle shape, and the like.

The control unit 300 controls the vertical movement and rotational movement of the support body 110 connected to the shaft 160 and the rotational movement of the seating plate 130 , and the gas supply type, flow rate and time of the gas injection unit 220 , etc. can be controlled. Furthermore, the control unit 300 controls various valves (not shown) to adjust the flow rate and time of the floating gas and/or the rotating gas supplied through the gas supply lines 112 , 114 , 116 , 162 , and 164 . can do.

In a modified example of this embodiment, in the substrate processing apparatus 200 , the substrate support assembly 100 may be replaced with the substrate support assembly 100a of FIG. 8 .

The substrate processing apparatus 200 may be used as a thin film etching apparatus for etching a thin film on the substrate S or a thin film deposition apparatus for forming a thin film on the substrate S. For example, the substrate processing apparatus 200 may be used in a thin film deposition apparatus using chemical vapor deposition (CVD) or atomic layer deposition (ALD).

11 is a result showing the thickness and uniformity of a thin film deposited on a substrate using the substrate processing apparatus according to the first experimental example of the present invention.

11, the embodiment of the present invention is a case in which the rotation of the substrate seated on the mounting plate is performed twice by 180 degrees in both directions without stopping the rotation of the support body in the thin film deposition process, and the comparative example of the present invention is This corresponds to the case where the rotation of the substrate seated on the plate is not performed.

While the uniformity of the thin film deposited in the substrate processing apparatus according to the comparative example of the present invention is 2.4%, it can be seen that the uniformity of the thin film deposited in the substrate processing apparatus according to the embodiment of the present invention is improved to 1.71%.

12 is a flowchart of a procedure for rotating a substrate in a substrate processing apparatus according to a second experimental example of the present invention.

Referring to Figure 12 (a), the substrate rotation process according to the comparative example of the present invention is the step of stopping the rotation of the support body, stopping the gas flow (gas flow), rotating the substrate, of the support body A subsequent process (a deposition process or an etching process) is resumed after sequentially performing the steps of resuming rotation, resuming gas flow, and stabilization.

12 (b), the substrate rotation process according to an embodiment of the present invention is a process performed using the apparatus described with reference to FIGS. 1 to 10 described above, and the support body rotates without stopping the rotation. In a state where the gas flow is not stopped and the purge gas flow is maintained, the substrate is rotated using the rotating gas and the substrate rotation is fixed by the stopper member, followed by a subsequent process (a deposition process or an etching process) ) is resumed.

When the seating plate on which the substrate is seated is rotated once while performing the process of FIG. 12 (a), it is confirmed that the increase is about 263 seconds compared to the case where the seating plate is not rotated. On the other hand, it was confirmed that when the seating plate on which the substrate is seated is rotated by one rotation while performing the process of FIG.

That is, a gas flow path for reverse rotation is added to the gas flow path for forward rotation of the seating plate, and a valve and gas line configuration capable of selectively supplying gas according to the rotation direction are introduced, and desired for the support body and the seating plate. It can be seen that the substrate processing apparatus equipped with a hard stopper to enable rotation and stop at an angle shortens the process time that increases when one rotation of the substrate is applied, thereby improving productivity.

Although the present invention has been described with reference to the embodiments shown in the drawings, which are merely exemplary, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

100, 100a: substrate support assembly
110: support body
120: home
130: seating plate
140: gas distribution plate
160: shaft
200: substrate processing device
210: process chamber
220: gas injection unit
300: control unit

Claims (11)

A substrate support assembly for orbiting and rotating a seated substrate, comprising:
a support body having a plurality of grooves formed so that a plurality of substrates are arranged in a circumferential direction and having a gas injection hole formed in the grooves so that gas is supplied to the grooves;
a plurality of seating plates provided in the groove and on which the substrates are respectively seated; and
a gas flow path formed in at least one of the seating plate and the groove portion to rotate the seating plate through the gas supplied to the groove portion; including,
At least two or more first stopper members provided to face each other on the lower surface of the periphery of the seating plate so that the seating plate is rotated at a predetermined angle and provided on the upper surface of the groove to protrude the first stopper member to be caught comprising at least two or more second stopper members,
substrate support assembly. The method of claim 1,
The at least two first stopper members include a 1-1 stopper member and a first 1-2 stopper member spaced apart from the 1-1 stopper member in a circumferential direction, and the at least two or more second stopper members includes a 2-1 stopper member corresponding to the 1-1 stopper member and a 2-2 stopper member disposed circumferentially apart from the 2-1 stopper member and corresponding to the 1-2 stopper member characterized in that
substrate support assembly. 3. The method of claim 2,
The 1-1 stopper member, the 1-2 stopper member, the 2-1 stopper member, and the 2-2 stopper member are detachably coupled at positions corresponding to each other so that the seating plate is rotated at a predetermined angle. characterized by being
substrate support assembly. The method of claim 1,
The gas passage may include: a first gas passage supplying a rotating gas to rotate the seating plate in a clockwise direction; and a second gas flow path supplying a rotating gas to rotate the seating plate counterclockwise.
substrate support assembly. 5. The method of claim 4,
A distal end of the first gas flow path and a distal end of the second gas flow path are disposed in opposite directions from the center of the groove portion,
substrate support assembly. 5. The method of claim 4,
The gas flow path further comprises a third gas flow path for supplying a floating gas for floating the seating plate,
substrate support assembly. 5. The method of claim 4,
The seating plate has a power transmission pattern for receiving rotational force from the rotating gas is formed on its rear surface,
substrate support assembly. 8. The method of claim 7,
The power transmission pattern includes a plurality of grooves disposed along the edge of the rear surface of the seating plate,
substrate support assembly. 7. The method of claim 6,
and a rotatable shaft coupled to the support body so that the seating plate can revolve,
A plurality of gas supply lines through which the floating gas and the rotating gas are moved are formed on the shaft,
substrate support assembly. 7. The method of claim 6,
A gas distribution plate for distributing the floating gas and the rotating gas supplied from the groove portion and supplying the floating gas to the seating plate is coupled to the groove portion,
The gas distribution plate includes a floating gas hole for supplying the floating gas, and a rotating gas hole inclined to provide the rotation gas,
substrate support assembly. process chamber;
The substrate support assembly according to any one of claims 1 to 10 installed in the process chamber; and
a gas injection unit installed in the process chamber to face the substrate support assembly and configured to inject a processing gas toward the substrate support assembly;
substrate processing equipment.

Images