KR20220077629A - Anti-static and pollution-proof film - Google Patents

Abstract

The present invention can be used as a film capable of protecting or reinforcing devices by securing high hardness, excellent antistatic properties and antifouling properties at the same time, preventing defects due to static electricity and scratches due to external shocks during the manufacture of semiconductor devices and display devices. An antistatic antifouling film is provided.

Description

Antistatic antifouling film {ANTI-STATIC AND POLLUTION-PROOF FILM}

The present invention relates to an antistatic antifouling film that is stably attached to the surface of a display device or a semiconductor device and can be used as a protective film or stiffener for a process, and more particularly, mechanical properties such as high hardness and scratch resistance It relates to a functional film having excellent antistatic properties and antifouling properties as well as securing the film.

A display device, such as a flat panel display panel, is generally formed by forming a thin film transistor (TFT) circuit on a glass substrate or depositing an organic material layer to form a pixel, and then a color filter glass substrate or encapsulation glass substrate thereon. will be sealed with The display device manufactured in this way is subjected to a slimming process in order to reduce the overall thickness, cut and processed in units of cells of a predetermined standard, and necessary circuit wiring processes such as attaching a flexible printed circuit board (FPCB) and various other processes. A process of attaching a driving IC to perform a display function is performed. In addition, a number of incidental operations such as an inspection process are performed. When many processes are performed as described above, damage such as scratches may occur on the surface of the display device, and such surface damage increases the defect rate of the final product.

In order to solve the above problems, a protective film is used to protect the surface of the display device from being damaged during processing. Such a protective film should be stably attached to the surface of the display device and be easily peeled off after processing is completed. In particular, when the protective film is peeled off, it should be peeled off without damaging the surface of the display device or leaving any residue, and it is necessary to prevent the generation of static electricity in order to prevent adhesion of foreign substances such as dust due to static electricity or damage to electronic devices.

Conventionally, an antistatic layer coated with an antistatic agent was formed on one surface of a protective film to prevent static electricity from being generated. However, the antistatic layer of the conventional protective film was easily peeled off or cracked or scratched by an external impact during the manufacture of a display device, thereby deteriorating the antistatic property of the protective film. In addition, when a protective film with scratches, etc. is attached to the display device, it was recognized as a cell defect during vision inspection, resulting in a decrease in process yield.

The present invention has been devised to solve the above problems, and while securing improved high hardness characteristics, it exhibits excellent charging characteristics, antifouling properties, high transparency, flexibility, etc. together with a protective film or reinforcing material during the manufacturing process of a display device or a semiconductor device It is a technical task to provide a novel antistatic antifouling film that can be applied as

Other objects and advantages of the present invention may be more clearly explained by the following detailed description and claims.

In order to achieve the above technical problem, the present invention is a first substrate; and an organic/inorganic hybrid layer formed on one surface of the first substrate, wherein the organic/inorganic hybrid layer has a pencil hardness of 4H or more according to ASTM D3363 standard, a water contact angle of 100° or more, and a surface resistance of 1.0 E+06 Ω/□ or less, to provide an antistatic antifouling film.

For example, the organic/inorganic hybrid layer may have a light transmittance of 92% or more at a wavelength of 550 nm at a thickness of 1 to 5 μm, and a haze of 0.90% or less.

For example, the organic/inorganic hybrid layer has a flexibility of 2 mm or less according to ASTM D522 standard, a curl characteristic of 2 mm or less, and a cross-cut tape test (Cross) according to ASTM D3359 standard. -Cut Nichiban Tape Test) may have 5B adhesion.

In one embodiment of the present invention, the organic / inorganic hybrid layer, a conductive polymer; at least two organic/inorganic non-conductive resins; and a cured product of a composition containing a photoinitiator, wherein the at least two organic/inorganic non-conductive resins include: fluorine-containing siloxane (meth)acrylate; and urethane (meth)acrylate oligomers.

In one embodiment of the present invention, the content ratio of the fluorine-containing siloxane (meth)acrylate and the urethane (meth)acrylate oligomer is 20 to 80: 80 to 100 parts by weight of the non-conductive resin 20 weight ratio.

For an embodiment of the present invention, the fluorine-containing siloxane (meth)acrylate may have a weight average molecular weight (Mw) of 1,000 to 50,000 g/mol, and at least two polymerizable functional groups.

For example, the urethane (meth)acrylate oligomer may be an oligomer having a weight average molecular weight (Mw) of 2,000 to 20,000 g/mol and at least two or more polymerizable functional groups.

In one embodiment of the present invention, the organic / inorganic hybrid layer, 10 to 40 parts by weight of a conductive polymer; 30 to 55 parts by weight of at least two organic/inorganic non-conductive resins; and a remaining amount of a solvent satisfying the total weight of the composition, and may be formed from a composition comprising 0.1 to 10 phr of a photoinitiator based on the total weight of the composition.

In an embodiment of the present invention, the thickness of the organic/inorganic hybrid layer may be 1 to 50 μm.

In one embodiment of the present invention, the first substrate is a polyethylene terephthalate (PET) film, a polybutylene terephthalate film, a polyethylene naphthalate (PEN) film, a polyethylene film, a polypropylene film, a cellophane, a diacetyl cellulose film , triacetylcellulose film, acetylcellulose butyrate film, polyvinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene film, polycarbonate film, polymethylpentene film, polysulfone film , polyetheretherketone film, polyethersulfone film, polyetherimide film, polyimide (PI) film, fluororesin film, polyamide film, acrylic resin film, norbornene-based resin film, and cycloolefin resin film may be any one of

For an embodiment of the present invention, the antistatic antifouling film may further include a second substrate disposed on the other surface of the first substrate.

In one embodiment of the present invention, the second substrate may be any one of a release paper and a release polymer film.

In one embodiment of the present invention, the antistatic antifouling film is attached to one surface of an adherend after detaching the second substrate, and the adherend is a cover glass of a display device, a cover plastic film, an organic photosensitive material, and an encapsulation. It may be any one of a material and a polarizing film.

In one embodiment of the present invention, the antistatic antifouling film may be used in any one manufacturing process of a semiconductor device and a display device.

In one embodiment of the present invention, the antistatic antifouling film may be an upper protective film of an organic light emitting display (OLED) panel for mobile use.

According to one embodiment of the present invention, high hardness, excellent antistatic properties and antifouling properties are secured at the same time to significantly reduce the defect rate of the device due to scratch defects and static electricity due to external impact during the manufacturing process of semiconductor devices or display devices. can

Accordingly, the antistatic antifouling film of the present invention can be usefully applied to the manufacturing process of display devices in the art, including flat panel display panels, and can be usefully applied to other semiconductor devices and manufacturing processes thereof.

Effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a cross-sectional view showing the structure of an antistatic antifouling film according to an embodiment of the present invention.
Figure 2 is a cross-sectional view showing the structure of the antistatic antifouling film according to another embodiment of the present invention.
3 is a view showing the water contact angle evaluation results of the antistatic antifouling films prepared in Examples 1 to 3 and Comparative Examples 1 to 2;
4 is a diagram illustrating a grade standard of a crosscut test according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail. Examples of the present invention are provided to more completely explain the present invention to those of ordinary skill in the art, and the following examples may be modified in various other forms, and the scope of the present invention is not limited to the following examples Examples are not limited thereto. In this case, the same reference numerals refer to the same structures throughout this specification.

Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used with the meaning commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in a commonly used dictionary are not to be interpreted ideally or excessively unless clearly defined in particular.

In addition, since the size and thickness of each component shown in the drawings are arbitrarily indicated for convenience of description, the present invention is not necessarily limited to the illustrated bar. In order to clearly express various layers and regions in the drawings, the thicknesses are enlarged. And in the drawings, for convenience of description, the thickness of some layers and regions are exaggerated.

In addition, throughout the specification, when a part "includes" a certain component, it means that other components may be further included, rather than excluding other components, unless otherwise stated. In addition, throughout the specification, "on" or "on" means that it includes not only the case located above or below the target part, but also the case where there is another part in the middle, and the direction of gravity must be It does not mean that it is positioned above the reference. And, in the present specification, terms such as “first” and “second” do not indicate any order or importance, but are used to distinguish components from each other. And, when it is described that a component is 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also with the component It may also include a case of 'connected', 'coupled' or 'connected' due to another element between the other elements.

In addition, throughout the specification, when referred to as "planar", it means when the target part is viewed from above, and "in cross-section" means when viewed from the side when the cross-section of the target part is vertically cut.

In this specification, "(meth)acrylate" represents an acrylate and/or a methacrylate. Also, "polymerizable functional group" refers to an unsaturated group involved in polymerization, such as a (meth)acrylate group.

<Antistatic antifouling film>

According to an embodiment of the present invention, an antistatic antifouling film formed on at least one surface of a substrate and having predetermined physical properties, such as high hardness, and an organic/inorganic hybrid layer having excellent antistatic and antifouling properties, to provide. Such a film may be used as a protective film for a process that is attached to a corresponding device during a manufacturing process of a display device, a display device, a semiconductor device, etc. to protect the surface, or may be used as a reinforcement.

1 schematically shows a cross-sectional structure of an antistatic antifouling film 100 according to an embodiment of the present invention.

When described with reference to FIG. 1 , the antistatic antifouling film 100 includes a first substrate 120 ; and an organic/inorganic hybrid layer 110 formed on at least one surface of the first substrate. Here, the first substrate 120 may be a substrate for a protective film or a substrate for a release film.

Hereinafter, each configuration of the antistatic antifouling film 100 will be described in detail as follows.

Organic/inorganic hybrid layer

In the antistatic antifouling film 100 of the present invention, the organic/inorganic hybrid layer 110 is distinguished from the conventional antistatic antifouling film in that it exhibits excellent antistatic properties and antifouling properties and at the same time exhibits high hardness.

That is, the conventional antistatic antifouling film is composed of a mixture of a conductive polymer and at least one organic binder resin. Accordingly, when the conventional antistatic antifouling film is used as a protective film for the process of a display device, the defect rate due to foreign matter generated by surface contact or static electricity can be improved, while the scratch defect caused by external impact is fundamentally eliminated. It was difficult to do.

In contrast, the organic/inorganic hybrid layer 110 according to the present invention includes a conductive polymer and at least two types of non-conductive resin, but as the at least two types of non-conductive resin, a specific organic binder and an inorganic binder are mixed in a predetermined mixing ratio. Mix and optimize. These organic and inorganic binders form the organic/inorganic hybrid layer 110 having high hardness as well as antistatic and antifouling properties through three-dimensional crosslinking. Accordingly, when the antistatic antifouling film according to the present invention is used as a protective film for the process of a display device, the defect rate due to foreign matter generated by surface contact or static electricity and the scratch defect rate due to external impact can be improved at the same time. .

For example, the antistatic antifouling film 100 having the organic/inorganic hybrid layer 110 has a pencil hardness of 4H or more according to ASTM D3363 standard, a water contact angle of 100° or more, and a surface resistance It can be less than 1.0E+06 Ω/□. Specifically, the pencil hardness according to ASTM D3363 standard is 4H to F, the water contact angle is in the range of 100° to 120°, and the surface resistance may be in the range of 1.0E+04 Ω/□ to 1.0E+06 Ω/□. At this time, when the pencil hardness of the organic/inorganic hybrid layer 110 is less than 4H, the surface of the organic/inorganic hybrid layer 110 may be peeled off or scratched due to an external impact, thereby reducing antistatic properties and lifespan characteristics. , this may increase the defect rate of the display device and decrease the process yield. In addition, when the surface resistance exceeds 1.0E+06 Ω/□, static electricity is generated and accumulated when the antistatic antifouling film is attached and detached, which may cause mixing of foreign substances and damage to the display device.

The antistatic antifouling film 100 of the present invention having the aforementioned pencil hardness, water contact angle, surface resistance parameters and corresponding numerical values not only has excellent antifouling and antistatic properties, but also secures scratch resistance due to high surface hardness. It can show excellent productivity improvement effect.

For another example, the organic/inorganic hybrid layer 110 may have a flexibility of 2 mm or less according to ASTM D522 standard, specifically 0 to 2 mm. In addition, the curl (Curl) characteristic may be 2 mm or less, specifically 0 to 2 mm. In addition, the adhesion by the cross-cut tape test (Cross-cut Nichiban Tape Test) according to ASTM D3359 standard may be 5B.

For another example, the organic/inorganic hybrid layer 110 may have a light transmittance of 92% or more at a wavelength of 550 nm at a thickness of 1 to 5 μm, specifically 92% to 95%. In addition, the haze (Haze) is 0.90% or less, specifically, may be 0.7% to 0.9%.

In the present specification, the above-described physical properties of the antistatic antifouling film 100 are based on the thickness of the film 1 to 5 μm unless otherwise specified. However, it is not limited to the above-described thickness range, and may be appropriately adjusted within a typical thickness range known in the art.

The antistatic antifouling film 100 according to the present invention, if it satisfies the aforementioned pencil hardness, water contact angle and expression resistance characteristics, components constituting the organic/inorganic hybrid layer 110 and/or its composition, etc. are not particularly limited. does not

For example, the organic/inorganic hybrid layer 110 may include a conductive polymer; at least two organic/inorganic non-conductive resins; and a cured product of a composition containing a photoinitiator (eg, a composition for forming an organic/inorganic hybrid layer), wherein the at least two organic/inorganic non-conductive resins are inorganic binders, fluorine-containing siloxane (meth)acrylate and organic and a urethane (meth)acrylate oligomer as a binder.

Fluorine-containing siloxane (meth)acrylate is an inorganic binder resin constituting the organic/inorganic hybrid layer 110, and functions to improve antistatic properties and surface hardness.

The fluorine-containing siloxane (meth)acrylate may be used without particular limitation as long as it is a conventional siloxane compound known in the art that includes at least one each of a fluorine-containing group and a (meth)acrylate group in a molecule.

For example, the fluorine-containing siloxane (meth)acrylate may be represented by the following Chemical Formula 1.

[Formula 1]

In Formula 1,

) 또는 불소 함유기(예,

)일 수 있다. 다만 복수의 R 중에서 상기 (메타)아크릴레이트기와 상기 불소 함유기는 각각 적어도 하나 이상 포함되며, 구체적으로 복수의 R 중 대략 40 내지 70%는 중합 가능한 관능기, 예컨대 (메타)아크릴레이트기일 수 있으며, 나머지 R (예, 전체 R 100%를 기준으로 30 내지 60%)은 불소 함유기일 수 있다. R are the same as or different from each other, and each independently a (meth) acrylate group (eg,

) or a fluorine-containing group (eg,

) can be However, among the plurality of Rs, at least one of the (meth)acrylate group and the fluorine-containing group is included, and specifically, about 40 to 70% of the plurality of R may be a polymerizable functional group, for example, a (meth)acrylate group, and the remaining R (eg, 30 to 60% based on 100% of total R) may be a fluorine-containing group.

The siloxane (meth)acrylate represented by Formula 1 has a hexagonal structure in its molecular structure. This hexagonal siloxane (meth) acrylate has a three-dimensional network structure to give high hardness (hardness). In addition, since the shrinkage rate is relatively low due to the three-dimensional bulk structure, it is possible to minimize the change in the properties of the coating film due to the external environment.

For example, the fluorine-containing siloxane (meth)acrylate may have a molecular weight (Mw) of 1,000 to 50,000 g/mol, specifically 5,000 to 30,000 g/mol. In addition, the polymerizable functional group may be at least 2 or more, specifically 2 to 18, more specifically 5 to 15 in one molecule.

The fluorine-containing siloxane (meth)acrylate may be prepared according to a conventional method known in the art, and is not particularly limited. a first monomer having, for example, a siloxane; a second monomer having an unsaturated double bond with siloxane; And after mixing the fluorine-containing third monomer sol-gel (Sol-gel) method can be prepared through. At this time, as long as the first to third monomers contain the above-described specific functional group (eg, siloxane, unsaturated double bond, fluorine group, etc.), components constituting the other monomers and/or their content ratio are not particularly limited. does not In addition, the first to third monomers are only exemplified for the description of the invention, but are not limited thereto, and specific functional groups (eg, siloxane groups, unsaturated double bonds, fluorine groups, etc.) for forming fluorine-containing siloxane (meth)acrylates ) is included in a single compound or two types of compounds also fall within the scope of the present invention.

In the present invention, the content of fluorine-containing siloxane (meth)acrylate is not particularly limited, and may be, for example, 20 to 80 parts by weight based on the total weight (eg, 100 parts by weight) of the non-conductive resin, specifically 30 to 70 parts by weight. When the content of the fluorine-containing siloxane (meth)acrylate falls within the aforementioned numerical range, high hardness and antistatic properties may be exhibited.

In addition, the urethane (meth)acrylate oligomer is an organic binder resin constituting the organic/inorganic hybrid layer 110, and functions to improve flexibility, curl characteristics, adhesion to a substrate, and the like. In addition, it has excellent compatibility with the conductive polymer, and improves the surface resistance of the organic/inorganic hybrid layer 110 and the adhesion of the organic/inorganic hybrid layer 110 to the substrate, as well as mechanical properties (eg, hardness, resistance scratch resistance, abrasion resistance, etc.) can be secured.

The urethane (meth)acrylate-based oligomer may be used without any particular limitation as long as it is an ultraviolet (UV) curable urethane (meth)acrylate-based oligomer, and specifically may include one or more isocyanate groups and one or more (meth)acrylic groups. . The urethane (meth)acrylate-based oligomer may be one or more UV-curable urethane (meth)acrylate oligomers selected from the group consisting of aromatic, aliphatic and cyclic aliphatic urethane (meth)acrylates.

In one embodiment, the urethane (meth)acrylate oligomer may be represented by the following Chemical Formula 2.

[Formula 2]

In Formula 2,

R may be selected from the group consisting of C ₁ ~ C ₄₀ alkylene, C ₆ ~ C ₄₀ arylene group, and heteroarylene group having 5 to 40 nuclear atoms.

For example, the urethane (meth)acrylate oligomer may have a weight average molecular weight (Mw) of 2,000 to 20,000 g/mol, specifically 3,000 to 18,000 g/mol. In addition, the polymerizable functional group may include at least 2 or more, specifically 2 to 18, and more specifically 5 to 15 oligomers in one molecule.

The content of the urethane (meth)acrylate oligomer is not particularly limited, and may be, for example, 20 to 80 parts by weight, specifically 30 to 70 parts by weight, based on 100 parts by weight of the non-conductive resin. When the content of the urethane (meth)acrylate oligomer corresponds to the above-described content, excellent flexibility, curl properties and adhesion may be exhibited.

In the composition for forming an organic/inorganic hybrid layer according to the present invention, the content of at least two organic/inorganic non-conductive resins is not particularly limited, and may be appropriately adjusted within a content range known in the art. For example, it may be 30 to 55 parts by weight, specifically 30 to 50 parts by weight, based on the total weight (eg, 100 parts by weight) of the composition. Specifically, the content ratio of fluorine-containing siloxane (meth)acrylate and urethane (meth)acrylate oligomer constituting the organic/inorganic non-conductive resin is not particularly limited, and surface hardness, antistatic and/or antifouling effects It can be appropriately adjusted taking into account. For example, the content ratio of the fluorine-containing siloxane (meth)acrylate and the urethane (meth)acrylate oligomer may be 20 to 80: 80 to 20 parts by weight based on 100 parts by weight of the non-conductive resin. Specifically, it may be 30-70: 70-30 weight ratio.

The composition for forming an organic/inorganic hybrid layer according to the present invention includes a conventional conductive polymer known in the art.

Conductive polymer (CP) has a π-conjugation structure in which single bonds (C-C bonds) and double bonds (C=C bonds) alternate to form π-π bonds, so that pi ( As a polymer having electrical properties due to delocalization of π)-electron density, it is possible to impart electrical conductivity to the organic/inorganic hybrid layer.

Non-limiting examples of the conductive polymer that can be used include PEDOT-based polymer [poly(3,4-ethylenedioxythiophene)], polythiophene polymer, polyaniline-based polymer, polypyrrole -based polymer), polyacetylene-based polymer, polyphenylene-based polymer, polyphenylene vinylene-base polymer, polythiophene vinylene -based polymer), polyphenylene sulfide-based polymer (polyphenylene sulfide-base polymer), and copolymers thereof. These may be used alone or in combination of two or more. Specifically, the conductive polymer may be a PEDOT-based polymer. In this case, excellent electrical conductivity and transparency of the organic/inorganic hybrid layer 110 may be secured.

The conductive polymer may be doped with a dopant or undoped. The dopant is a component that imparts electrical conductivity to the composition together with the conductive polymer, and the amount of charge of the conductive polymer may be controlled depending on whether or not the doping is performed and the amount of doping thereof.

Usable dopants are not particularly limited as long as they are conventional known in the art. In one example, polystyrene sulfanate, dodecylbenzene sulfonate, toluene sulfonate, camphorsulfonate, di (2-ethylhexyl) sulfosuccinate [di (2-ethylhexyl) sulfosuccinate], and dioleyl sulfosuccinate. These may be used alone or in combination of two or more. Specifically, the dopant may be polystyrene sulfanate (PSS).

In addition, the content of the dopant is not particularly limited, and may be adjusted according to the type of the conductive polymer and the required amount of charge. According to one example, the mixing ratio of the conductive polymer and the dopant may be 1: 0.01 to 20 weight ratio. In this case, the dispersibility of the conductive polymer doped with a dopant may be improved without lowering the electrical conductivity.

In one embodiment, the conductive polymer may be a PEDOT: PSS composite. As such, when the PEDOT:PSS composite in which PEDOT, a conductive polymer, is doped with polystyrene sulfonate (PSS) is used, not only electrical conductivity is excellent, but also solubility in water is high, and excellent thermal and atmospheric stability can be exhibited.

In the composition for forming the organic/inorganic hybrid layer, the content of the conductive polymer is not particularly limited, for example, 10 to 40 parts by weight based on the total weight (eg, 100 parts by weight) of the composition for forming the organic/inorganic hybrid layer; Specifically, it may be 10 to 35 parts by weight.

The composition for forming an organic/inorganic hybrid layer of the present invention may include an initiator, specifically, a photoinitiator. The photoinitiator is a component that is excited by ultraviolet rays or the like to initiate photopolymerization, and any photoinitiator commonly known in the art may be used without limitation.

Non-limiting examples of usable photoinitiators, Irgacure 184, Irgacure 369, Irgacure 651, Irgacure 819, Irgacure 907, benzion alkyl ether (Benzionalkylether), benzophenone (Benzophenone), benzyl dimethyl catal (Benzyl dimethyl kata), hydride Hydroxycyclohexyl phenylacetone, Chloroacetophenone, 1,1-Dichloro acetophenone, Diethoxy acetophenone, Hydroxyacetophenone , hydroxydimethylacetophenone, 2-chlorothioxanthone (2-Choro thioxanthone), 2-ETAQ (2-EthylAnthraquinone), 1-hydroxy-cyclohexyl-phenyl-ketone (1-Hydroxy-cyclohexyl-phenyl-ketone) ), 2-hydroxy-2-methyl-1-phenyl-1-propanone (2-Hydroxy-2-methyl-1-phenyl-1-propanone), 2-hydroxy-1-[4- (2- Hydroxyethoxy)phenyl]-2-methyl-1-propanone (2-Hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone), methylbenzoylformate etc. These may be used alone or in combination of two or more. Specifically, it may be 1-hydroxycyclohexylphenyl ketone (Former Irgacure 184).

The content of the photoinitiator is not particularly limited, and for example, may be about 0.1 to 10 phr, specifically about 1 to 7 phr, based on the total weight of the composition for forming an organic/inorganic hybrid layer. When the content of the photoinitiator falls within the aforementioned content range, the photopolymerization reaction can be sufficiently performed without deterioration of physical properties, thereby improving the strength and adhesion of the coating film.

The composition for forming an organic/inorganic hybrid layer of the present invention may further include a crosslinking agent. The crosslinking agent can improve the solvent resistance, adhesiveness, and coating film performance by controlling the crosslinking density of the coating film.

Non-limiting examples of the cross-linking agent that can be used include an isocyanate-based cross-linking agent, an epoxy-based cross-linking agent, an aziridine-based cross-linking agent, a carbodiimide-based cross-linking agent, an oxazoline-based cross-linking agent, a melamine-based cross-linking agent, etc. More than one species may be mixed and used. The content of the crosslinking agent may be adjusted according to the content of the conductive polymer and the non-conductive resin, the molecular weight or the content of the functional group in the polymer. For example, the content of the crosslinking agent may be about 0.1 to 10 parts by weight, specifically, about 0.5 to 10 parts by weight, based on the total weight of the composition for forming an organic/inorganic hybrid layer.

For one embodiment of the present invention, the composition for forming the organic/inorganic hybrid layer 110 may include 10 to 40 parts by weight of a conductive polymer based on the total weight (eg, 100 parts by weight) of the composition; 30 to 55 parts by weight of at least two organic/inorganic non-conductive resins; and a residual amount of a solvent satisfying the total weight of the composition, and may be a composition comprising 0.1 to 10 phr of a photoinitiator relative to the total amount of the composition. Here, the solvent is not particularly limited as long as the remaining amount satisfies 100 parts by weight of the composition, and may be, for example, 30 to 60 parts by weight, specifically 30 to 50 parts by weight.

The solvent is not particularly limited as long as it has excellent compatibility with the conductive polymer and the non-conductive resin to uniformly disperse them or to stably dissolve them. Examples of such a solvent may be water, an organic solvent, or a mixed solvent thereof, and non-limiting examples thereof include alcohol-based solvents such as methyl alcohol, ethyl alcohol, isopropyl alcohol, butyl alcohol, and the like; ether-based solvents such as methyl cellosolve, ethyl cellosolve, butyl cellosolve, propylene glycol monomethyl ether, propylene glycol monoethyl ether, cellosolve acetate, and the like; methyl ethyl ketone, cyclohexanone, acetone, diacetone alcohol, and esters such as ketone solvents such as methyl acetate and ethyl acetate; ester solvents such as methyl acetate and ethyl acetate; halogenated hydrocarbon solvents such as chloroform, methylene chloride, tetrachloroethane, etc., and other solvents such as dimethyl sulfoxide, ethylene glycol, glycerin, sorbitol, formamide, N-methyl formamide, N,N-dimethylformamide, and acetamide. , N-methyl acetamide, N-dimethylacetamide, N,N-dimethylformamide, tetrahydrofuran, N-methyl-2-pyrrolidone, nitromethane, acetonitrile, and the like. These may be used alone or two or more of them may be used in combination.

As long as the composition for forming an organic/inorganic hybrid layer of the present invention does not impair the intrinsic properties of the organic/inorganic hybrid layer 110, if necessary, a surface leveling agent, a silane coupling agent, a slip agent, an antifoaming agent, It may further include conventional additives such as wetting agents, surfactants, thickeners, plasticizers, antioxidants, ultraviolet absorbers, dispersants, polymerization inhibitors, inorganic fillers, organic fillers, dyes, pigments, and the like. The content of these additives is not particularly limited, and for example, may be about 0.001 to 10 parts by weight, specifically about 0.01 to 7 parts by weight, based on the total amount of the composition for forming the organic/inorganic hybrid layer.

The organic/inorganic hybrid layer 110 of the present invention described above is prepared by preparing a composition in which at least two kinds of organic/inorganic hybrid non-conductive resin, a conductive polymer, and, if necessary, a solvent and an initiator are mixed in a predetermined mixing ratio, After coating the composition on one surface of the first substrate 120, it may be prepared by drying and photocuring.

The organic/inorganic hybrid layer 110 of the present invention formed through photocuring is formed by crosslinking not only conductive polymer but also fluorine-containing siloxane (meth)acrylate as an inorganic binder, and urethane (meth)acrylate oligomer as an organic binder. A dimensionally robust network structure is formed. Accordingly, high surface hardness and excellent antistatic and antifouling properties can be exhibited at the same time.

The thickness of the organic/inorganic hybrid layer 110 may be 1 to 50 μm, specifically, 1 to 30 μm. However, it is not particularly limited thereto, and may be appropriately adjusted within a range known in the art.

first substrate

In the antistatic antifouling film 100 of the present invention, the first substrate 120 is disposed on at least one surface, specifically, on one surface of the organic/inorganic hybrid layer 110 . The first substrate 120 may be a coating substrate for the organic/inorganic hybrid layer 110 and a substrate for a protective film.

The first substrate 120 is not particularly limited, and a flat plastic film having transparency known in the art may be used without limitation.

Non-limiting examples of the usable first substrate 120 include polyester films such as polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate, polyethylene films, polypropylene films, cellophane, and diacetyl cellulose. Film, triacetylcellulose film, acetylcellulose butyrate film, polyvinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene film, polycarbonate film, polymethylpentene film, polysulfone Film, polyetheretherketone film, polyethersulfone film, polyetherimide film, polyimide (PI) film, fluororesin film, polyamide film, acrylic resin film, norbornene-based resin film, cycloolefin resin film etc. Specifically, it may be at least one of a polyimide (PI) film, a polyethylene terephthalate (PET) film, a polyethylene naphthalate (PEN) film, a protective film, and a carrier film.

Here, as the protective film and the carrier film, conventional ones known in the art may be used, and for example, a polyimide film, a PET film, or a PEN film may have an adhesive layer formed on one surface thereof. The pressure-sensitive adhesive layer may be a component commonly used in the art, for example, an epoxy-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive, and mixtures thereof may be contained. The silicone-based pressure-sensitive adhesive may be a PSA in the form of a liquid resin using a siloxane polymer as a binder.

For example, the first substrate 120 may be a base film on which at least one surface is subjected to an antistatic treatment, a scratch-resistant treatment, or both an antistatic treatment and a scratch-resistant treatment. More specifically, it is preferable that an antistatic treatment and/or a scratch resistance treatment is performed on one surface on which the organic/inorganic hybrid layer 110 is formed among both surfaces of the first substrate 120 . These antistatic treatment and scratch resistance treatment may each exist as separate layers, or may be configured as a single layer. The antistatic treatment and the anti-scratch treatment can be applied without limitation to those known in the art, and the antistatic agent or scratch-resistant treatment agent used therein is not particularly limited. For example, the scratch-resistant surface of the first substrate 120 may have a pencil hardness of 1H to 3H. In addition, the first substrate 120 may have been subjected to surface treatment such as mat treatment or corona treatment.

The thickness of the first substrate 120 is not particularly limited, and may be, for example, 10 to 100 μm, preferably 25 to 80 μm.

2 schematically shows a cross-sectional structure of an antistatic antifouling film 200 according to a second embodiment of the present invention. In Fig. 2, the same reference numerals as in Fig. 1 denote the same members.

Hereinafter, in the description of FIG. 2 , content overlapping with FIG. 1 will not be described again, and only differences will be described.

The antistatic antifouling film 100 of FIG. 1 has a structure in which an organic/inorganic hybrid layer 110 is disposed on one surface of the first substrate 120 , whereas the antistatic antifouling film 200 according to FIG. 2 is the second It has a structure in which the organic/inorganic hybrid layer 110 and the second substrate 130 are respectively disposed on one surface and the other surface of the first substrate 120 as the center.

For example, the second substrate 130 may be used for a different purpose from the above-described first substrate 120 , for example, for a release purpose.

The second substrate 130 may be a conventional one known in the art without limitation, and may be, for example, any one of a release paper and a release polymer film (eg, a release PET film). The second substrate 130 may be formed by laminating.

The release polymer film can be applied without limitation in the configuration of a conventional plastic film known in the art. Non-limiting examples of plastic films that can be used include polyester films such as polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate, polyethylene films, polypropylene films, cellophane, diacetylcellulose films, triacetylcellulose films, and the like. , Acetylcellulose butyrate film, polyvinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene film, polycarbonate film, polymethylpentene film, polysulfone film, polyether There are turketone film, polyethersulfone film, polyetherimide film, polyimide film, fluororesin film, polyamide film, acrylic resin film, norbornene-based resin film, cycloolefin resin film, and the like. These plastic films may be either transparent or translucent, may be colored, or may be uncolored, and may be appropriately selected according to the use.

For example, the second substrate 130 may be a substrate on at least one surface on which a silicone release treatment, an antistatic treatment, or both a silicone release treatment and an antistatic treatment are performed. More specifically, it is preferable that one surface of the second substrate 130 in contact with the first substrate 120 has been subjected to silicone release treatment and/or antistatic treatment. The silicone release treatment and the antistatic treatment may each exist as separate layers, or may consist of a single layer. The silicone release treatment and antistatic treatment may be applied without limitation to those known in the art, and the silicone treatment agent or antistatic agent used therein is not particularly limited.

The thickness of the second substrate 130 is not particularly limited, and may be, for example, 10 to 100 μm.

The antistatic antifouling films 100 and 200 of the present invention described above may have a total thickness of 30 μm to 400 μm, and may have various thicknesses depending on the applied product.

Meanwhile, in the present invention, the embodiments shown in FIGS. 1 and 2 are exemplarily described. However, it is also within the scope of the present invention to freely select and configure the number of each layer constituting the antistatic antifouling films 100 and 200 and the order of their lamination according to the purpose. For example, by changing the order of each layer 110 , 120 , 130 , 140 or by additionally introducing another conventional layer known in the art, it may have a multi-layered structure rather than the exemplified structure.

<Method for producing antistatic antifouling film>

Hereinafter, a method for manufacturing an antistatic antifouling film according to an embodiment of the present invention will be described. Such a film may be manufactured without limitation according to a conventional method known in the art, and is not limited only by the following manufacturing method. If necessary, the steps of each process may be modified or may be selectively mixed and performed.

For an embodiment of preparing the antistatic antifouling film, (i) preparing a fluorine-containing siloxane (meth)acrylate; (ii) preparing a urethane (meth)acrylate oligomer; (iii) preparing a composition for forming an organic/inorganic hybrid layer comprising a fluorine-containing siloxane (meth)acrylate, a urethane (meth)acrylate oligomer, and a conductive polymer; and (iv) applying the composition for forming an organic/inorganic hybrid layer on a first substrate and curing the composition to form an organic/inorganic hybrid layer.

Here, the fluorine-containing siloxane (meth)acrylate as the inorganic binder and the urethane (meth)acrylate oligomer as the organic binder are omitted because they are the same as described in the organic/inorganic hybrid layer described above. In addition, the preparation step of the fluorine-containing siloxane (meth)acrylate and the preparation step of the urethane (meth)acrylate oligomer are not related to the temporal line or the later, and may be appropriately carried out if necessary.

For an example of the composition for forming the organic/inorganic hybrid layer, 10 to 40 parts by weight of a conductive polymer based on the total weight (eg, 100 parts by weight) of the composition; 30 to 55 parts by weight of at least two organic/inorganic non-conductive resins; and a residual amount of a solvent satisfying the total weight of the composition, and may be a composition comprising 0.1 to 10 phr of a photoinitiator relative to the total amount of the composition. Here, the solvent is not particularly limited as long as the remaining amount satisfies 100 parts by weight of the composition, and may be, for example, 30 to 60 parts by weight, specifically 30 to 50 parts by weight.

In addition, a method of applying the composition for forming an organic/inorganic hybrid layer on the first substrate 120 is not particularly limited, and a conventional coating method known in the art may be used without limitation. As an example, various methods such as a casting method, a dip coating, a die coating, a roll coating, a slot die, a comma coating, or a mixture thereof may be used. The drying process may be appropriately carried out within conventional conditions known in the art. For example, drying may be performed at 100 to 200° C. for 1 minute to 2 hours.

The curing conditions may be appropriately carried out within conventional conditions known in the art. For example, photocuring may be performed by irradiating light with a light energy of about 400 to 600 mJ/cm 2 at a line speed of about 10 to 20 mpm (meter per minute).

If necessary, the step of aging the organic/inorganic hybrid layer formed in the above step under predetermined conditions may be further included. For example, the aging conditions may be carried out at a temperature of 50 to 60 ℃ for 12 to 24 hours. However, it is not particularly limited to the above conditions, and may be appropriately carried out under aging conditions known in the art.

If necessary, the organic/inorganic hybrid layer 110 may be laminated to face the second substrate 130 on the other surface of the first substrate 120 formed thereon.

Here, the first substrate 120 and the second substrate 130 may each have a sheet shape, or may be continuously laminated according to a roll-to-roll method and then wound up in a roll shape. In addition, sheet-to-sheet (sheet to sheet) paper, roll-to-sheet (roll to sheet) paper, etc. may be used.

The above-described antistatic antifouling film of the present invention and its modifications are applicable to various fields requiring improved high hardness, excellent antistatic property and antifouling property as well as excellent transparency, flexibility, adhesion and peeling properties. For example, it may be applied without limitation to a manufacturing process of a display device or a semiconductor device, and may be specifically used as a protective film or a stiffener for a process.

In the present invention, a display device refers to a device that displays an image, and not only a flat panel display device (FPD), but also a curved display device, a foldable display device ( Foldable Display Device) and flexible display device (Flexible Display Device), and the like. Specifically, the display device includes a liquid crystal display, an electrophoretic display, an organic light emitting display, an inorganic EL display, and a field emission display. It may be a field emission display, a surface-conduction electron-emitter display, a plasma display, a cathode ray tube display, electronic paper, or the like. For example, it may be a flat panel display panel such as LCD, PDP, or OLED.

For example, the antistatic antifouling films 100 and 200 are adhered to one surface of an adherend, and the adherend may be a component of a display device or a semiconductor device. Specifically, the adherend may be any one of a cover glass of a semiconductor device or a display device, a cover plastic film, an organic photosensitive material, an encapsulation material, and a polarizing film. The glass may be a general glass substrate or tempered glass. A preferred example of the adherend may be an organic light emitting display (OLED) panel (eg, a display panel, a touch panel) for mobile use, and more specifically, an upper protective film of the OLED panel.

It is not limited to the use described above, and the protective film of the present invention is applicable to conventional semiconductor devices and manufacturing processes thereof known in the art. The semiconductor manufacturing process includes all conventional processes known in the art, and may be, for example, a semiconductor wafer process.

Hereinafter, the present invention will be described in detail with reference to Examples, but the following Examples and Experimental Examples are merely illustrative of one aspect of the present invention, and the scope of the present invention is not limited to the Examples and Experimental Examples below.

[Examples 1-3]

1-1. Inorganic binder manufacturing

Monomer 1 [3-(Trimethoxysilyl) propyl methacrylate (TMSPM), Sigma-Aldrich], Monomer 2 [Tetraethyl orthosilicate (TEOS), Sigma-Aldrich], Monomer 3 [Trimethoxy(3,3,3-trifluoropropyl)silane, Sigma- Aldrich] was added in a weight ratio of monomer 1: monomer 2: monomer 3 = 25: 20: 5 based on the total amount of monomer (100 parts by weight in total), and then ethanol in the same amount as the amount of the metal alkoxide was added. Distilled water (DI water) in the same molar amount as the alkoxy group of the metal alkoxide was added to the mixture, and HCl was added dropwise to adjust the pH to 1, followed by hydrolysis at 25° C. for 3 hours. After hydrolysis, a condensation reaction was performed at 65° C. for 15 hours to prepare a final product, fluorine-containing siloxane (meth)acrylate.

1-2. Preparation of a composition for forming an organic/inorganic hybrid

A composition for forming an organic/inorganic hybrid was prepared by mixing according to the ratio of the formulation examples in [Table 1] and [Table 2] below. In Table 2 below, the usage unit of each composition is based on 100 parts by weight of the composition including 40 parts by weight of the organic/inorganic hybrid non-conductive resin, 20 parts by weight of the conductive polymer, and 40 parts by weight of the solvent.

1-3. Preparation of antistatic antifouling film

After degassing the composition for forming the organic/inorganic hybrid of 1-2, the first substrate, PET film (thickness: 75 μm), coated to a thickness of 2 μm, and then dried at 65° C. for 3 minutes made it Then, the coating layer was irradiated with ultraviolet light with a light energy of 1,000 mJ/cm ² to prepare an organic/inorganic hybrid layer. Thereafter, a release paper having a thickness of 25 μm was disposed on the other surface of the first substrate to prepare an antistatic antifouling film having a thickness of 102 μm.

composition detailed configuration Organic/Inorganic Non-conductive
Suzy A-1 Inorganic binder: fluorine-containing siloxane (meth)acrylate of Example 1-1 A-2 Organic binder: urethane (meth)acrylate oligomer
[PU370, Miwon Corporation, Mw: 8,000 g/mol] conductivity
polymer B PEDOT: PSS
[CLEVIOS PH, Heraeus Clevios GmbH, Solids: 1.3%] initiator C Photoinitiator: Omnirad 184 menstruum D Ethanol [Samchun]

Example comparative example composition One 2 3 One 2 3 organic/inorganic
non-conductive resin A-1 70 50 30 - 100 - A-2 30 50 70 100 - - conductivity
polymer B 20 20 20 20 20 60 initiator C 3 phr 3 phr 3 phr 3 phr 3 phr 3 phr menstruum D 40 40 40 40 40 40 Properties Thickness (㎛) 1-5 1-5 1-5 1-5 1-5 1 or less pencil hardness 4H 4H 3H H 4H 4B Male contact angle (°) 105.5 104.5 100.15 90.6 108.3 - surface resistance
(Ω/□) 1.0E+05 1.0E+05 1.0E+05 1.0E+05 1.0E+08 1.0E+05 cross cut 5B 5B 5B 5B 1B - Transmittance (%) 92.3 92.4 92.7 92 88.5 92 Haze (%) 0.88 0.86 0.85 0.85 1.68 0.90 bend test
(mm) 2 2 or less 2 or less 2 16 - Curl (mm) 2 One One 2 5 -

[Comparative Examples 1 to 3]

Except for changing the composition as shown in Table 2, the antistatic antifouling films of Comparative Examples 1 to 3 were prepared in the same manner as in Example 1, respectively.

[Experimental Example 1]

The properties of the antistatic antifouling films prepared in Examples 1 to 3 and Comparative Examples 1 to 3 were measured according to the following measurement method, and the results are shown in Table 2 above.

(1) thickness

The thickness of the film was measured using a thickness meter (Mitutoyo, model name: 547-401).

(2) pencil hardness

In order to check the surface hardness of the hard-coated PMMA sheet, the surface hardness was measured using a pencil hardness tester (SB-196, SB) according to ASTM D3363 standard. The test method was carried out according to ASTM D3363 method. The pencil (Mistubishi, Japan) used for measurement was stood at 90° and the tip was abraded with sandpaper, and when a 1 kg load was applied in a certain direction, tilted at an angle of 45° and rubbed at a constant speed, The highest value at which scratch does not occur was measured. Each test piece was measured 5 times, and when no trace was generated more than 3 times, the hardness of the pencil used was measured as a surface hardness value. At this time, as the degree of scratching, (Soft) 9B~B→HB→F→H~9H (Hard), that is, indicated by the type of pencil at maximum strength.

(3) Water contact angle

After water was dropped on the organic/inorganic hybrid layer of the antistatic antifouling film of 3 cm × 3 cm (width × length) standard, the water contact angle was measured using a contact angle measuring device (SEO, Phonix-MT).

(4) surface resistance

The surface resistance (Ω/□) of the organic/inorganic hybrid layer of the antistatic antifouling film was measured under the test voltage of 100V using a surface resistance measuring instrument (ST-4, SIMCO).

(5) Cross-cut tape test (adhesion test)

According to ASTM D 3359 standard, 100 cross-cut grid scale tapes were adhered on the organic/inorganic hybrid layer of the antistatic antifouling film and then peeled to evaluate the grade according to the criteria of FIG. 4 below.

(6) transmittance and haze

Transmittance and haze of the prepared antistatic antifouling film were measured using a spectrophotometer (Nippon Denshoku, CU-2 model).

(7) Flexibility

After bending the coating specimen using a mandrel according to ASTM D522, the point at which the coating film of the material was separated from the specimen or destroyed was observed. At this time, it means that the smaller the mm value of the mandrel, the greater the flexibility.

(8) curl test

When each film was cut into 5 cm Ⅷ 5 cm and placed on a plane, the average value indicated by measuring the distance from the plane to the four corners of each corner was measured.

As a result of the experiment, in the case of Examples 1 to 3, in which a conductive polymer and at least two organic/inorganic hybrid non-conductive resins were mixed, excellent properties such as surface hardness, surface resistance, and water contact angle were exhibited, and high light transmittance, haze characteristics, It was found that good properties were also exhibited in terms of general physical properties such as flexural properties and curl properties.

In contrast, in Comparative Example 3 in which the conductive polymer was used alone, physical properties such as hardness and water contact angle excluding surface resistance were poor, and crosscut, flexibility, and curl properties were also impossible to measure. Also, in Comparative Example 2, in which a conductive polymer and one type of inorganic polymer binder were mixed, the hardness was good, but the other physical properties were poor. In addition, in the case of Comparative Example 1 in which a conductive polymer and one type of organic polymer binder were mixed, it was found that the surface resistance and flexibility were excellent, but other physical properties were poor.

Through the above-described results, the antistatic antifouling film according to the present invention has excellent surface hardness, antistatic property, and antifouling properties as well as other physical properties, so it can be usefully applied as a protective film on the display surface during the manufacturing process of a display device. could confirm that there was

100, 200: antistatic antifouling film
110: organic / inorganic hybrid layer
120: first substrate
130: second substrate
140: adhesive layer

Claims (15)

a first substrate; and
It includes an organic/inorganic hybrid layer formed on one surface of the first substrate,
The organic / inorganic hybrid layer,
Pencil hardness of 4H or more according to ASTM D3363 standard,
The water contact angle is more than 100°,
An antistatic antifouling film with a surface resistance of 1.0E+06 Ω/□ or less. According to claim 1,
The organic / inorganic hybrid layer,
At a thickness of 1 to 5 μm, the light transmittance at a wavelength of 550 nm is 92% or more,
Haze is 0.90% or less, antistatic antifouling film. According to claim 1,
The organic / inorganic hybrid layer,
Flexibility according to ASTM D522 standard is 2mm or less,
Curl characteristics of 2 mm or less,
An antistatic antifouling film with an adhesive strength of 5B by the Cross-cut Nichiban Tape Test according to ASTM D3359 standard. According to claim 1,
The organic / inorganic hybrid layer,
conductive polymers; at least two organic/inorganic non-conductive resins; and a cured product of a composition containing a photoinitiator,
The at least two organic / inorganic non-conductive resins,
fluorine-containing siloxane (meth)acrylate; and
An antistatic antifouling film comprising a urethane (meth)acrylate oligomer. 5. The method of claim 4,
The content ratio of the fluorine-containing siloxane (meth)acrylate and the urethane (meth)acrylate oligomer is 20 to 80: 80 to 20 parts by weight based on 100 parts by weight of the non-conductive resin. Antistatic antifouling film. 5. The method of claim 4,
The fluorine-containing siloxane (meth)acrylate has a weight average molecular weight (Mw) of 1,000 to 50,000 g/mol, and an antistatic antifouling film having at least two polymerizable functional groups. 5. The method of claim 4,
The urethane (meth) acrylate oligomer has a weight average molecular weight (Mw) of 2,000 to 20,000 g/mol, and an oligomer having at least two or more polymerizable functional groups, a polyurethane adhesive film. 5. The method of claim 4,
The organic / inorganic hybrid layer,
10 to 40 parts by weight of a conductive polymer;
30 to 55 parts by weight of at least two organic/inorganic non-conductive resins; and
Including; a residual amount of solvent that satisfies the total weight of the composition;
An antistatic antifouling film formed from a composition comprising 0.1 to 10 phr of a photoinitiator based on the total weight of the composition. According to claim 1,
The thickness of the organic / inorganic hybrid layer is 1 to 50㎛ antistatic antifouling film. According to claim 1,
The first substrate is a polyethylene terephthalate (PET) film, a polybutylene terephthalate film, a polyethylene naphthalate (PEN) film, a polyethylene film, a polypropylene film, cellophane, a diacetyl cellulose film, a triacetyl cellulose film, acetyl cellulose butyrate Film, polyvinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene film, polycarbonate film, polymethylpentene film, polysulfone film, polyetheretherketone film, Antistatic antifouling film which is any one of polyethersulfone film, polyetherimide film, polyimide (PI) film, fluororesin film, polyamide film, acrylic resin film, norbornene-based resin film, and cycloolefin resin film . According to claim 1,
The antistatic antifouling film,
Further comprising a second substrate disposed on the other surface of the first substrate, antistatic antifouling film. 12. The method of claim 11,
The second substrate is an antistatic antifouling film of any one of a release paper and a release polymer film. 12. The method of claim 11,
The antistatic antifouling film is attached to one side of the adherend after detaching the second substrate,
The adherend is an antistatic antifouling film of any one of a cover glass of a display device, a cover plastic film, an organic photosensitive material, an encapsulation material, and a polarizing film. The method of claim 1,
An antistatic antifouling film used in the manufacturing process of any one of a semiconductor device and a display device. According to claim 1,
An antistatic antifouling film that is an upper protective film for organic light emitting display (OLED) panels for mobile devices.

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