KR20220073291A - Connection pin for bga testing and test socket having the same - Google Patents

Abstract

Disclosed are a connection pin for connecting a spherical terminal and a test socket including the same. The connection pin for spherical terminal connection of the present invention includes: a tip portion having a spherical terminal coupled to a test socket for connecting surface mount components arranged in an array form to a tester, and forming a first contact tip in contact with the lower portion of the spherical terminal at the top; a first plunger extending downwardly from the tip portion; a cylinder provided under the first plunger; a second plunger having a second contact tip formed at the bottom to form a contact point with the inspector; and an elastic member provided inside the cylinder and pushing the second plunger downward, wherein the first contact tip is formed along the circumferential direction with respect to the central axis of the cylinder. According to the present invention, it is possible to provide a connection pin for spherical terminal connection and a test socket including the same, which are made to form good physical contact between the connection pin and the solder ball even when the diameter of the solder ball of the surface mount component is small.

Description

Connection pin for old terminal connection and test socket including the same

The present invention relates to a connection pin for spherical terminal connection and a test socket including the same, and more particularly, to a spherical terminal connection connection made so that a signal of a tester can be transmitted to a surface mount component having spherical terminals arranged in an array form. It relates to a pin and a test socket including the same.

Surface mount technology (SMT) is a method of attaching surface mounted components (SMC) that can be directly mounted on the surface of a printed circuit board (PCB) to an electronic circuit. Electronic devices made in this way are called surface-mount devices (SMD). In the electronics industry, surface mount technology has replaced through-hole technology attachment, which uses components that insert device pins into holes in printed circuit boards.

In general, surface mount components are smaller than identical through-hole components. This is because the pins of surface mount components may be shorter or none at all. Surface mount components have shorter pins, and there are different types of packages, such as planar contact, ball arrangement, and pins coming out of the component's package.

For surface mount components whose terminals form a ball array, spherical solder balls are arranged in an array on the bottom of the package. It is connected by wire bonding or flip chip connection between the bare chip and the interposer and encapsulated with resin. There are Ball Grid Array (BGA), Enhanced BGA (EBGA), Flex Tape BGA (FTBGA), and Thin & Fine-Pitch Ball Grid Array (TFBGA). Surface mount components in which terminals form a ball arrangement can realize multi-pin increase and high density.

After manufacturing is completed, electronic devices are subjected to quality inspection to check whether they operate normally by supplying the same operating signals and power as the electronic components to be actually mounted. The test socket is a device that connects the electronic device to the tester so that the signal of the tester can be transmitted to the electronic device.

In this regard, Korean Patent No. 1439194 (hereinafter referred to as 'prior literature') discloses a contactor for plate-type inspection of a socket for semiconductor inspection.

The contactor for plate-type test of the socket for semiconductor test of the prior literature includes an upper plunger, a lower plunger, and a compression coil spring. The upper plunger has a body portion extending in the horizontal direction from both sides, and the extended portion is provided with a guide portion formed by rotationally bending to face the inner circumferential surface of the housing hole.

The upper plunger is composed of a plate-shaped body portion provided with a plurality of contact protrusions forming contact points on the upper end, and a guide portion extending from both ends of the body portion along the inner circumferential surface of the housing hole to be bent in the same rotational direction. , the straight part by the body part and at least a part of the guide part bent and extended in the same rotational direction to both ends of the straight part are formed to contact the inner circumferential surface of the housing hole.

A plurality of contact projections are formed on the upper end of the upper plunger to form a plurality of contact points to which the bump electrode of the semiconductor device is in contact. And a plurality of contact protrusions are formed on the upper end of the guide part.

The contact protrusions of the guide part are provided so that the contact point is substantially the same as the curved surface of the bump electrode so that the bump electrode can easily come into contact with the contact protrusions of the body part. Therefore, since the contact protrusions of the body portion and the contact protrusions of the guide portion have the same cross-sectional area, the maximum distance forming the contact point can be formed, so that the contact with the bump electrode can be made stably.

When the physical contact between the contact protrusion and the bump electrode is good, the reliability of quality inspection is improved. However, the contactor for the plate-type inspection of the socket for semiconductor inspection of the prior literature has a disadvantage in that the physical contact between the contact protrusion and the bump electrode forms a point contact shape.

The miniaturization of surface mount components is accelerating day by day. Even if the diameter of the solder ball is reduced, there is a need for a method in which the pins of the test socket can form good physical contact with the solder ball.

Republic of Korea Patent Publication No. 1439194 (Registration date: 2014.09.02)

It is an object of the present invention to provide a connection pin for spherical terminal connection and a test socket including the same, in which the connection pin and the solder ball form good physical contact even when the diameter of the solder ball of the surface mount component becomes small.

According to the present invention, the spherical terminal is coupled to the test socket for connecting the surface mount components arranged in an array form to the tester, the tip portion having a first contact tip in contact with the lower portion of the spherical terminal formed at the top; a first plunger extending downward from the tip portion; a cylinder provided under the first plunger; a second plunger having a second contact tip forming a contact point with the inspector at the lower end; and an elastic member provided inside the cylinder and pushing the second plunger downward, wherein the first contact tip is formed along the circumferential direction with respect to the central axis of the cylinder. This is accomplished by means of a pin.

The side surfaces of the tip portion are spaced apart from each other in the radial direction of the cylinder, and a first plane and a second plane parallel to each other; and a first curved surface and a second curved surface that are spaced apart from each other in the radial direction of the cylinder and form a symmetrical shape with respect to the central axis of the cylinder, wherein the first contact tip includes an upper end of the first curved surface and the second curved surface. It may be formed so as to be respectively formed on the upper end of the two curved surfaces.

The first curved surface and the second curved surface may include a lower curved surface forming the same radius as a side surface of the first plunger with respect to the central axis of the cylinder; and an upper curved surface connecting the first contact tip and the lower curved surface, the radius of which decreases with respect to the central axis of the cylinder toward the first contact tip.

The tip portion forms a first stepped surface lower than the first contact tip between the first curved surface and the second curved surface, and the connection pin is disposed between the side surface of the cylinder and the first and second planes. A second stepped surface lower than the first stepped surface may be formed, respectively, and the first plane and the second plane may be configured to connect the first stepped surface to the second stepped surface.

The above object, according to the present invention, the connection pin of claim 1 is coupled to the base; and a seating member on which the surface mount component is placed, and a seating member movably installed on the base so that the spherical terminal approaches or moves away from the connection pin.

According to the present invention, the first contact tip is formed on the upper end of the first curved surface and the upper end of the second curved surface, respectively, and is formed along the circumferential direction with respect to the central axis of the cylinder, so that the diameter of the solder ball of the surface mount component is not small. Even so, it is possible to provide a connection pin for spherical terminal connection and a test socket including the same, which are made to form good physical contact between the connection pin and the solder ball.

1 is a perspective view illustrating a test socket according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view illustrating the test socket of FIG. 1 .
3 and 4 are cross-sectional views of the test socket of FIG. 1 .
FIG. 5 is a cross-sectional view illustrating a state of use of the test socket of FIG. 1 .
6 is a partial cross-sectional view illustrating the seating member of FIG. 2 .
7 is a perspective view illustrating the connection pin of FIG. 2 .
FIG. 8 is a cross-sectional view of the connection pin of FIG. 7 .
Fig. 9 is a partial cross-sectional view of the test socket of Fig. 4;
Fig. 10 is a partial cross-sectional view of the test socket of Fig. 5;

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, in describing the present invention, descriptions of already known functions or configurations will be omitted in order to clarify the gist of the present invention.

The connection pin for spherical terminal connection and the test socket including the same according to the present invention are made to form good physical contact between the connection pin and the solder ball even if the diameter of the solder ball of the surface mount component is small.

1 is a perspective view illustrating a test socket 10 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view illustrating the test socket 10 of FIG. 1 .

3 and 4 are cross-sectional views of the test socket 10 of FIG. 1 . FIG. 5 is a cross-sectional view illustrating a state of use of the test socket 10 of FIG. 1 .

6 is a partial cross-sectional view showing the seating member 300, the pin block 120, and the pin installation member 130 of FIG. 7 is a perspective view illustrating the connection pin 200 of FIG. 2 . FIG. 8 is a cross-sectional view of the connection pin 200 of FIG. 7 .

9 is a partial cross-sectional view of the test socket 10 of FIG. 4 . FIG. 10 is a partial cross-sectional view of the test socket 10 of FIG. 5 .

1 to 3 , the test socket 10 according to an embodiment of the present invention is configured to electrically connect the surface mount component 1 to the tester.

The test socket 10 according to an embodiment of the present invention is configured to include a base 100 , a connection pin 200 , and a seating member 300 .

Hereinafter, for easy understanding of the present invention, in the state shown in the drawings, the upper and lower parts will be separately described.

1 and 2, the base 100 is a configuration in which a connection pin 200 connected in the vertical direction to the spherical terminal 2 of the surface mounting component 1 is installed, and a rectangular parallelepiped block shape is formed as a whole. do.

The above-described surface mount component 1 may mean a Ball Grid Array (GA), an Enhanced BGA (EBGA), a Flex Tape BGA (FTBGA), or a Thin & Fine-Pitch Ball Grid Array (TFBGA).

2 and 3 , the base 100 includes a body 110 , a pin block 120 , and a pin installation member 130 .

A plurality of holes 111 into which the bolts B are inserted are formed in the body 110 . The body 110 may be fixed to the table 3 of the test equipment (not shown) by a bolt (B). A PCB 4 connected to the connection pins 200 is provided on the upper surface of the table 3 .

A plurality of alignment pins 114 are coupled to the body 110 in the longitudinal direction. And a plurality of alignment holes 3H are formed in the upper portion of the table 3 . When the body 110 is fixed to the upper surface of the table 3 , the alignment pin 114 is vertically inserted into the alignment hole 3H.

An installation space 112 in which the block-shaped seating member 300 moves in the vertical direction is formed in the body 110 . The pin block 120 is coupled to the lower portion of the body 110 . The pin block 120 is coupled to the lower portion of the body 110 by a bolt 124 . The upper surface of the pin block 120 forms the lower surface of the installation space 112 .

As shown in FIG. 3 , the connection pin 200 electrically connects the surface mounting component 1 seated on the mounting member 300 to the test equipment.

A plurality of coupling holes 121 are formed in the pin block 120 . The plurality of coupling holes 121 pass through the pin block 120 in the vertical direction. The plurality of connection pins 200 are inserted into the plurality of coupling holes 121 under the pin block 120 . A stepped surface 121A on which the upper surface of the coupling part 217 is caught is formed on the upper portion of the coupling hole 121 .

The pin installation member 130 is coupled to the lower portion of the pin block 120 . The pin installation member 130 is coupled to the lower portion of the pin block 120 by a bolt 132 . An installation hole 131 is formed in the pin installation member 130 . The lower portion of the connection pin 200 is inserted into the installation hole 131 .

A plurality of alignment pins 123 are coupled to the lower portion of the pin block 120 . A plurality of alignment holes 133 are formed in the pin installation member 130 . When the pin installation member 130 is fixed to the lower portion of the pin block 120 , the alignment pin 123 is inserted into the alignment hole 133 . A stepped surface 131A on which the lower end of the cylinder 230 is caught is formed in the lower portion of the installation hole 131 .

1 and 3, the seating member 300 is a configuration on which the surface mounting component 1 is placed, and the spherical terminal 2 of the surface mounting component 1 is close to the connection pin 200 or It is installed to be movable up and down on the body 110 so as to move away from it.

An installation space 112 in which the block-shaped seating member 300 moves in the vertical direction is formed in the body 110 . A compression spring 125 is interposed between the pin block 120 and the seating member 300 . A hole 122 into which the lower portion of the compression spring 125 is inserted is formed in the pin block 120 .

4 shows a state in which the seating member 300 is maximally raised by the recovery force of the compression spring 125 . As shown in FIG. 4 , the seating member 300 is pressed away from the connection pin 200 by the compression spring 125 , that is, upward.

A plurality of blockers 113 to which the upper portion of the seating member 300 is caught on the upper portion of the body 110 are fixed by the bolts 115 . The blockers 113 each form a ring shape. The blocker 113 forms the upper boundary of the section in which the seating member 300 rises by the recovery force of the compression spring 125 .

As shown in FIG. 4 , even if the push member 5 does not press the surface mounting component 1 down, the seating member 300 does not rise further due to the interference of the blocker 113 and maintains the state of FIG. 4 . do.

The push member 5 refers to a configuration that pushes the surface mount component 1 downward. The push member 5 is made of a rubber or silicone material having elasticity. The push member 5 may be coupled to a linear actuator (not shown). The push member 5 may be lowered by a linear actuator to press the surface mount component 1 downward.

Although not shown, a cover (not shown) may cover or open the upper portion of the base 100 . The push member 5 may be coupled to the lower portion of the cover. When the cover covers the top of the base 100 , the push member 5 may press the surface mount component 1 down.

5 shows a state in which the seating member 300 is lowered (as the compression spring 125 is compressed) by the push member 5 pressing the surface mounting component 1 .

As shown in FIG. 5 , by the force of the push member 5 pressing the surface mounting component 1 downward (the compression spring 125 is compressed), the seating member 300 descends downward. At this time, the spherical terminal 2 is in contact with the connection pin 200 , and the test of the surface mounting component 1 is performed.

When the push member 5 is removed in the state shown in FIG. 5 , the seating member 300 is raised to the state of FIG. 4 again by the recovery force of the compression spring 125 .

As shown in FIG. 1 , a boundary wall 302 surrounding the edge of the surface mounting component 1 is formed on the upper portion of the mounting member 300 . The surface mount component 1 is blocked from rotation and horizontal movement by the boundary wall 302 . A seating surface 303 on which the surface mount component 1 is mounted is formed inside the boundary wall 302 .

7 and 8 , the connection pin 200 includes a tip portion 210 , a first plunger 220 , a cylinder 230 , a second plunger 240 and an elastic member 250 . do.

The tip portion 210 is a configuration for forming the first contact tip 211, and is made of a conductive metal. The tip portion 210 forms a first contact tip 211 in contact with the bottom surface of the spherical terminal 2 at the upper end. The first contact tip 211 means an upper portion of the first plunger 220 in contact with the bottom surface of the spherical terminal 2 .

The first plunger 220 extends downward from the lower portion of the tip portion 210 . The first plunger 220 forms a long cylindrical shape in the longitudinal direction.

1 and 6 , a plurality of through holes 301 are formed in the seating member 300 . The plurality of through-holes 301 penetrate the seating member 300 in the longitudinal direction.

As shown in FIGS. 9 and 10 , the tip part 210 is inserted into the plurality of through holes 301 from the bottom of the seating member 300 . The tip portion 210 moves in the vertical direction within the through hole 301 . The upper portion 301A of the through hole 301 extends in the radial direction than the lower portion to prevent contact with the spherical terminal 2 .

As shown in FIG. 7 , the side surface of the tip part 210 forms an asymmetric shape with respect to the central axis of the cylinder 230 . The side surface of the tip portion 210 includes a first plane 212 , a second plane 213 , a first curved surface 214 , and a second curved surface 215 .

The first plane 212 and the second plane 213 are spaced apart from each other in the radial direction of the cylinder 230 . The first plane 212 and the second plane 213 form parallel surfaces.

The first curved surface 214 and the second curved surface 215 are spaced apart from each other in the radial direction of the cylinder 230 . The first curved surface 214 and the second curved surface 215 form a symmetrical shape with respect to the central axis of the cylinder 230 . The first curved surface 214 and the second curved surface 215 are formed along the circumferential direction with respect to the central axis of the cylinder 230 .

The first contact tip 211 is respectively formed on the upper end of the first curved surface 214 and the second curved surface 215 . Accordingly, the pair of first contact tips 211 form a curved shape in the circumferential direction with respect to the central axis of the cylinder 230 . That is, the tip portion 210 forms a curved contact point with the bottom surface of the spherical terminal 2 by the pair of first contact tips 211 .

7 and 8 , the first curved surface 214 and the second curved surface 215 include a lower curved surface LF and an upper curved surface UF, respectively.

The lower curved surface LF forms the same radius as the side surface of the first plunger 220 with respect to the central axis of the cylinder 230 . That is, the lower curved surface LF forms a continuous surface with the side surface of the first plunger 220 .

The first contact tip 211 is formed on the upper end of the upper curved surface (UF). That is, the upper curved surface UF forms a shape connecting the first contact tip 211 and the lower curved surface LF. The radius of the upper curved surface UF decreases with respect to the central axis of the cylinder 230 toward the first contact tip 211 .

7 , the tip portion 210 forms a first stepped surface 216 lower than the first contact tip 211 between the first curved surface 214 and the second curved surface 215 .

The connection pin 200 forms a second stepped surface 221 lower than the first stepped surface 216 between the side surface of the first plunger 220 and the first plane 212 and the second plane 213 , respectively. . The first plane 212 and the second plane 213 connect the first stepped surface 216 and the second stepped surface 221 .

When a foreign material attached to the surface mounting component 1 flows into the through hole 301 , the foreign material falls on the first stepped surface 216 located below the first contact tip 211 .

A dotted line in FIG. 8 indicates the shape of the first stepped surface 216 . As shown in FIG. 8 , the height of the first stepped surface 216 decreases as it approaches the central axis of the cylinder 230 .

Therefore, even if the foreign material adhered to the surface mounting component 1 flows into the through hole 301 , the foreign material moves to the middle portion of the first stepped surface 216 lower than the first contact tip 211 . As a result, the foreign substances introduced into the through hole 301 are spaced apart from the first contact tip 211 in the longitudinal and transverse directions.

Since the second stepped surface 221 is lower than the first stepped surface 216 , foreign substances falling on the first stepped surface 216 in the process of using the test socket 10 may fall to the second stepped surface 221 . have.

Therefore, even if a large amount of foreign matter deposited on the surface mounting part 1 flows into the through hole 301 , the foreign material introduced into the through hole 301 is lower than the first step surface 216 and the first contact tip 211 , It sequentially moves to the second stepped surface 221 . As a result, contact failure between the connecting pin 200 and the spherical terminal 2 due to foreign matter is prevented.

7 and 8 , the cylinder 230 is provided under the first plunger 220 . The cylinder 230 forms a cylindrical hollow tube shape long in the longitudinal direction. That is, the cylinder 230 has an upper end and an open lower end.

The first plunger 220 is coupled to the upper end of the cylinder 230 . More specifically, the coupling portion 217 is formed at the lower portion of the first plunger 220 . The first plunger 220 is inserted and coupled to the upper opening of the cylinder 230 through the coupling portion 217 .

The upper end of the cylinder 230 and the coupling portion 217 are coupled by plastic deformation by an external force. D in FIGS. 7 and 8 denotes a dimple formed by an external force applied to the side surface of the cylinder 230 .

The inner surface of the coupling hole 121 is spaced apart from the side surface of the cylinder 230 and the side surface of the first plunger 220 by a predetermined interval. The inner surface of the coupling hole 121 includes a surface on which the upper surface of the cylinder 230 hangs upward.

7 and 8 , the second plunger 240 is configured to form a second contact tip 244 . The second plunger 240 is made of a conductive metal. The second plunger 240 includes a first body 241 , a second body 242 , and a contact portion 243 .

The first body 241 is inserted into the cylinder 230 . The first body 241 has a larger radius than the lower opening of the cylinder 230 . Accordingly, the first body 241 maintains a state inserted into the cylinder 230 .

The contact portion 243 forms a second contact tip 244 at the lower end. The second contact tip 244 means a lower portion of the contact portion 243 in contact with the PCB 4 of the tester.

The second body 242 connects the first body 241 and the contact part 243 . The second body 242 has a smaller radius than the bottom opening of the cylinder 230 . Accordingly, the second body 242 may move vertically through the opening.

The elastic member 250 is configured to push the second plunger 240 downward. The elastic member 250 is provided inside the cylinder 230 . The elastic member 250 is made of a conductive metal.

The elastic member 250 is provided as a compression spring. The elastic member 250 is provided between the coupling portion 217 and the first body 241 in an elastically compressed state. As shown in FIG. 8( a ), the first body 241 maintains a state caught in the lower opening of the cylinder 230 by the restoring force of the elastic member 250 in a state in which an external force in the vertical direction is not applied.

4 , until the push member 5 presses the surface mounting component 1 , the seating member 300 is positioned in an elevated state by the recovery force of the compression spring 125 .

As shown in FIG. 9 , when the surface mount component 1 is seated on the seating surface 303 , the spherical terminal 2 is positioned within the upper opening of the through hole 301 . Until the push member 5 presses the surface mount component 1 , the first contact tip 211 is positioned below the spherical terminal 2 .

As shown in FIG. 5 , when the push member 5 presses down the upper surface of the surface mounting component 1 seated on the seating surface 303 , the push member 5 pushes the surface mounting component 1 downward. By the pressing force (the compression spring 125 is compressed), the seating member 300 is lowered.

As shown in FIG. 10 , when the seating member 300 descends, the first contact tip 211 rises within the through hole 301 to come into contact with the lower portion of the spherical terminal 2 . Thereafter, when the seating member 300 descends further, the elastic member 250 is compressed and the first plunger 220 and the cylinder 230 descend.

In the test socket 10 of the present invention, the tip portion 210 has a curved contact point (in the circumferential direction of the cylinder 230) with the lower portion of the spherical terminal 2 by a pair of first contact tips 211. By forming, the miniaturization of the surface mount component 1 is accelerated and the diameter of the spherical terminal 2 becomes smaller, or even if the diameters of the spherical solder balls arranged in an array on the bottom of the surface mount component 1 are different from each other, each The shape and length of the physical contact surface formed by the connecting pin 200 of the spherical terminal 2 can be maintained constant.

According to the present invention, the first contact tip is formed on the upper end of the first curved surface and the upper end of the second curved surface, respectively, and is formed along the circumferential direction with respect to the central axis of the cylinder, so that the diameter of the solder ball of the surface mount component is not small. Even so, it is possible to provide a connection pin for spherical terminal connection and a test socket including the same, which are made to form good physical contact between the connection pin and the solder ball.

In the foregoing, specific embodiments of the present invention have been described and illustrated, but it is common knowledge in the art that the present invention is not limited to the described embodiments, and that various modifications and variations can be made without departing from the spirit and scope of the present invention. It is self-evident to those who have Accordingly, such modifications or variations should not be individually understood from the technical spirit or point of view of the present invention, and the modified embodiments should belong to the claims of the present invention.

10: test socket
100: base 200: connection pin
110: body 210: tip part
111: hole 1 hole 211: first contact tip
112: installation space 212: first plane
113: blocker 213: second plane
114: alignment pin 214: first curved surface
B, 115: bolt 215: second curved surface
120: pin block LF: lower curved surface
121: coupling hole UF: upper curved surface
122: hole 216: first stepped surface
123: alignment pin 217: coupling part
124: bolt 220: first plunger
125: compression spring 221: second stepped surface
130: pin installation member 230: cylinder
131: installation hole 240: second plunger
132: bolt 241: first body
133: alignment hole 242: second body
300: seating member 243: contact part
301: through hole 244: second contact tip
302: boundary wall 250: elastic member
303: seating surface
1: surface mount parts
2: Old terminal
3: table
4: PCB
3H: alignment hole
5: push member

Claims (5)

A spherical terminal is coupled to a test socket that connects the surface mount components listed in an array to the tester,
a tip portion having a first contact tip in contact with the lower portion of the spherical terminal formed at an upper end thereof;
a first plunger extending downward from the tip portion;
a cylinder provided under the first plunger;
a second plunger having a second contact tip forming a contact point with the inspector at a lower end thereof; and
It is provided in the cylinder and includes an elastic member for pushing the second plunger downward,
The first contact tip is a connection pin for spherical terminal connection, characterized in that formed along the circumferential direction with respect to the central axis of the cylinder. According to claim 1,
The side of the tip part,
first and second planes spaced apart from each other in the radial direction of the cylinder and parallel to each other; and
A first curved surface and a second curved surface that are spaced apart from each other in the radial direction of the cylinder and form a symmetrical shape with respect to the central axis of the cylinder,
The first contact tip is a connecting pin for spherical terminal connection, characterized in that each formed on the upper end of the first curved surface and the second curved surface. 3. The method of claim 2,
The first curved surface and the second curved surface,
a lower curved surface forming the same radius as the side surface of the first plunger with respect to the central axis of the cylinder; and
Connecting the first contact tip and the lower curved surface, the connection pin for a spherical terminal connection characterized in that it comprises an upper curved surface whose radius is reduced with respect to the central axis of the cylinder toward the first contact tip. 3. The method of claim 2,
The tip portion forms a first stepped surface lower than the first contact tip between the first curved surface and the second curved surface,
The connecting pins form a second step surface lower than the first step surface between the side surface of the cylinder and the first plane and the second plane, respectively,
The first plane and the second plane are connecting pins for spherical terminal connection, characterized in that for connecting the first stepped surface to the second stepped surface. The base to which the connection pin of claim 1 is coupled; and
and a seating member on which the surface mount component is placed, and a seating member movably installed on the base so that the spherical terminal approaches or moves away from the connection pin.

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