KR20220073218A - Detergent composition for electronic parts with good insulation properties and manufacturing method the same - Google Patents

Abstract

The present invention consists of at least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffinic hydrocarbons and mixtures thereof, 1,1-dichloroethane and dichloromethane, and hydrotreated heavy naphtha, isoparaffinic hydrocarbons and A raw material input step of adding one or more selected from the group consisting of a mixture thereof, a first stirring step of adding 1,1-dichloroethane to the stirrer that has undergone the raw material input step and stirring, and the first stirring step It is a technology related to a cleaning composition for electronic components having insulating properties and a method for manufacturing the same, characterized in that it consists of a second stirring step of putting dichloromethane in a stirrer and stirring, and may have been applied to electronic components such as PCB (Printed Circuit Board) Insulation is provided, and it shows excellent cleaning power against the fat components remaining in electronic parts, prevents malfunctions by removing fine dust remaining in electronic parts, and exhibits appropriate volatility so that it does not cause whitening or tracking in electronic parts. In addition, there is an effect of not emitting harmful substances such as ozone-depleting components.

Description

DETERGENT COMPOSITION FOR ELECTRONIC PARTS WITH GOOD INSULATION PROPERTIES AND MANUFACTURING METHOD THE SAME

The present invention relates to a cleaning composition for electronic components having insulation and a method for manufacturing the same, and more particularly, provides insulation when applied to electronic components such as printed circuit boards (PCBs), and prevents fat components remaining in electronic components. It exhibits excellent cleaning power and prevents malfunctions by removing fine dust remaining in electronic parts, and exhibits appropriate volatility so that it does not cause whitening or trekking in electronic parts, and does not emit harmful substances such as ozone layer depleting components. It relates to a cleaning composition for electronic components having insulation and a method for manufacturing the same.

Conventionally, the cleaning of electronic components such as semiconductor PCBs, silicon substrates, glass substrates for liquid crystals, and quartz substrates for photomasks is mainly a mixture of hydrogen peroxide and sulfuric acid, a mixture of hydrogen peroxide and hydrochloric acid and water, a mixture of hydrogen peroxide and ammonia and water, etc. , the RCA cleaning method was performed using a concentrated chemical solution based on hydrogen peroxide and rinsed with ultrapure water after washing at a high temperature.

The RCA cleaning method is an effective method to remove metal powder from the surface of electronic components such as semiconductors, and at the same time can also remove fine particles attached to the surface of electronic components.

However, the RCA cleaning method is high in manufacturing cost because it uses a large amount of hydrogen peroxide, high concentration of acid and alkali, etc. There was a problem in that high costs were consumed in the processing process due to the cost of air conditioning and the like.

In order to solve the above problems, in the process of removing the native oxide film on the surface of electronic parts, room temperature treatment with a chemical solution of hydrofluoric acid is employed. So-called 'hydrofluoric acid last' cleaning, which is finished by cleaning with hydrochloric acid, is widely used.

The main purpose of hydrofluoric acid cleaning is to remove the natural oxide film on the surface of electronic parts generated during the oxidizing chemical treatment process or rinsing process, or generated during stationary, but at the same time, it can also remove the metal impurities introduced into the natural oxide film. There are advantages that can be

However, since the hydrofluoric acid cleaning method as described above cannot remove the fine particles adhering to the surface of electronic components, other cleaning steps such as APM cleaning with cleaning water containing ammonia and hydrogen peroxide are necessarily added. There is a problem in that it has to proceed with the process, and there is a problem in that components that cause environmental pollution are generated after washing.

Laid-open Patent Publication No. 10-2019-0083527 (2019.07.12)

The present invention is intended to solve the above problems, and when applied to electronic components such as PCBs, provides insulation, exhibits excellent cleaning power against fat components remaining in electronic components, and removes fine dust remaining in electronic components. To provide a cleaning composition for electronic components having insulation to prevent malfunction and a method for manufacturing the same.

In addition, it is an object of the present invention to provide a cleaning composition for electronic components and a method for manufacturing the same, which exhibit adequate volatility and thus do not cause whitening or tracking in electronic components, and have insulating properties that do not emit harmful substances such as ozone layer depleting components.

The cleaning composition for electronic components having insulation according to the present invention comprises at least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffin hydrocarbons, and mixtures thereof, 1,1-dichloroethane and dichloromethane do it with

In addition, preferably, the cleaning composition for electronic components having insulation is 1,1-dichloroethane 25 based on 100 parts by weight of at least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffin hydrocarbons, and mixtures thereof. to 40 parts by weight and 25 to 40 parts by weight of dichloromethane.

In addition, the manufacturing method of the cleaning composition for electronic components according to the present invention is a raw material input step of adding at least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffin hydrocarbons, and mixtures thereof to a stirrer, the raw material input step It is characterized in that it consists of a first stirring step of adding 1,1-dichloroethane to a coarse stirrer and stirring, and a second stirring step of adding dichloromethane to the stirrer that has undergone the first stirring step and stirring.

Also, preferably, in the first stirring step, 25 to 40 parts by weight of 1,1-dichloroethane based on 100 parts by weight of at least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffinic hydrocarbons, and mixtures thereof. It is characterized by mixing wealth.

Also, preferably, in the second stirring step, 25 to 40 parts by weight of dichloromethane is mixed with respect to 100 parts by weight of at least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffinic hydrocarbons, and mixtures thereof. characterized in that

In addition, preferably, the first stirring step and the second stirring step, characterized in that the stirring for 5 to 15 minutes at a temperature of 20 to 40 ℃.

Also, preferably, the first stirring step and the second stirring step are characterized in that the stirring is performed at a rotation speed of 700 to 900 rpm.

The present invention provides a cleaning composition for electronic parts comprising at least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffinic hydrocarbons, and mixtures thereof, 1,1-dichloroethane and dichloromethane, and a method for manufacturing the same, When applied to electronic components such as PCBs, it provides insulation, exhibits excellent cleaning power against fat components remaining in electronic components, and removes fine dust remaining in electronic components to prevent malfunction.

In addition, in the case of hydrotreated heavy naphtha and isoparaffin hydrocarbons, since they exhibit adequate volatility, they do not cause whitening or tracking in electronic parts, and have the effect of not emitting harmful substances such as ozone-depleting components.

1 is a flowchart showing a method of manufacturing a cleaning composition for electronic components having insulation according to the present invention.
2 is a photograph showing the surface of the PCB cleaned using the cleaning agent composition according to Example 1 of the present invention taken with an electron microscope.
3 is a photograph taken with an infrared thermal imaging camera after leaving the PCB washed with the cleaning agent composition of the present invention in an oven at 50° C. for 5 to 15 minutes.

Hereinafter, a preferred embodiment of the present invention and the physical properties of each component will be described in detail, which is intended to describe in detail enough that a person of ordinary skill in the art to which the present invention pertains can easily carry out the invention, This does not mean that the technical spirit and scope of the present invention is limited.

The cleaning composition for electronic components having insulation according to the present invention consists of at least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffin hydrocarbons and mixtures thereof, 1,1-dichloroethane and dichloromethane, and hydrogenated By hydrotreated heavy naphtha, it is meant catalytically hydrogenated naphtha in a pressurized hydrogen stream.

The hydrotreated heavy naphtha and isoparaffin hydrocarbons are components that serve as a base of the cleaning composition for electronic components having insulation according to the present invention, and serve to impart insulation to the cleaning composition. Electronic parts cleaned with a cleaning composition containing

In addition, since the hydrotreated heavy naphtha and isoparaffin hydrocarbons exhibit volatility, the cleaning agent according to the present invention serves to reduce the residue of the cleaning agent on the surface of the electronic component after washing the electronic component such as a PCB.

In addition, the hydrotreated heavy naphtha and isoparaffin hydrocarbons increase the non-conductivity of the detergent composition according to the present invention, and the detergent composition according to the present invention remains on the surface of the electronic component through reaction with the 1,1-dichloroethane. It plays a role in dissolving fats well.

In addition, more specifically, the cleaning composition having the insulating properties is 1,1-dichloroethane 25 to 40 parts by weight based on 100 parts by weight of at least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffin hydrocarbons, and mixtures thereof. It is preferable that it consists of 25-40 weight part of dichloromethane and a part.

In the case of 1,1-dichloroethane, it is a colorless liquid with a melting point of -96.7° C. and a boiling point of 57.3° C., and serves to dissolve fat components remaining on the surface of electronic components, thereby providing insulation according to the present invention. It serves to impart cleaning power to the cleaning composition for parts.

In addition, the 1,1-dichloroethane is preferably contained in 25 to 40 parts by weight as it serves to reduce the amount of residues remaining on the surface of the electronic component after washing the electronic component with the cleaning agent composition according to the present invention. .

At this time, if the content of 1,1-dichloroethane is less than 25 parts by weight, the cleaning efficiency of the cleaning composition may decrease, whereas if the content of 1,1-dichloroethane exceeds 40 parts by weight, the cleaning power is improved However, it is not preferable because corrosion may occur on the surface of the electronic component.

In addition, in more detail, the cleaning composition is a range showing the most excellent effect in the above-described cleaning power and corrosion inhibitory effect, wherein the 1,1-dichloroethane is hydrotreated heavy naphtha, isoparaffinic hydrocarbons, and mixtures thereof. It may be most preferable to mix 33.3 parts by weight of 1,1-dichloroethane with respect to 100 parts by weight of at least one selected from the group.

In addition, in the case of the dichloromethane, as a kind of refrigerant, it serves to reduce the temperature rise due to contaminants contained in electronic components by 2 to 5° C., thereby inhibiting deformation or corrosion of electronic components by heat.

In addition, the dichloromethane exhibits non-corrosive properties, and because it dissolves complex scale components or fat components well, it serves to remove fatty contaminants remaining on the surface of electronic components, and exhibits volatility, so that it can be used as a cleaning agent composition for electronic components. After cleaning, it does not leave any residue on the surface of electronic components.

In addition, since the dichloromethane is well soluble in the 1,1-dichloroethane, it serves to prepare the cleaning composition according to the present invention in a stable form.

In addition, the dichloromethane is preferably contained in 25 to 40 parts by weight based on 100 parts by weight of at least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffinic hydrocarbons, and mixtures thereof.

At this time, if the content of dichloromethane is less than 25 parts by weight, the effects listed above are insignificant, and if the content of dichloromethane exceeds 40 parts by weight, it is outside the limit of use of ozone-depleting substances and destroys the ozone layer It is not preferable because a large amount of the component is emitted, and the effect of deformation due to heat of the electronic component is increased, so that a layer separation phenomenon may occur in an electronic component such as a PCB.

In addition, in more detail, in the case of the cleaning agent composition, as a range showing the most excellent effect in the temperature reduction, cleaning power, and electronic component deformation suppression of the above-described electronic components, hydrotreated heavy naphtha, isoparaffinic hydrocarbons, and mixtures thereof It may be most preferable to mix 33.3 parts by weight of dichloromethane with respect to 100 parts by weight of at least one selected from the group.

Next, as shown in FIG. 1 , the method for manufacturing a cleaning composition for electronic components having insulation according to the present invention includes a raw material input step (S101), a first stirring step (S103), and a second stirring step (S105). made including

Specifically, a raw material input step (S101) of adding at least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffinic hydrocarbons, and mixtures thereof to the stirrer (S101), 1, It consists of a first stirring step (S103) of adding 1-dichloroethane and stirring, and a second stirring step (S105) of adding dichloromethane to the stirrer that has undergone the first stirring step (S103) and stirring.

The raw material input step (S101) is a step of adding one or more selected from the group consisting of hydrotreated heavy naphtha, isoparaffinic hydrocarbons, and mixtures thereof to the stirrer, and more specifically, hydrotreated heavy naphtha and/or iso Paraffin hydrocarbons are put into a stirrer heated to a temperature of 20 to 40° C., and the stirrer is rotated at a speed of 700 to 900 rpm for 5 to 15, so that the hydrotreated heavy naphtha and/or isoparaffinic hydrocarbons are produced in a first stirring step to be described later. It is a step of treating so that it can efficiently react with 1,1-dichloroethane input through the

The first stirring step (S103) is a step of adding 1,1-dichloroethane to the stirrer that has undergone the raw material input step (S101) and stirring. It is preferable to stir at a rotation speed of from 900 rpm.

This is an optimal condition for sufficiently mixing the reactants. When the mixture is stirred for less than 5 minutes at a temperature of less than 20° C., the hydrotreated heavy naphtha and/or isoparaffin hydrocarbons and the 1,1-dichloroethane are not mixed evenly. Therefore, it is not preferable because sufficient reaction efficiency cannot be obtained. On the other hand, when the reaction is carried out for more than 15 minutes at a temperature of more than 40 ° C., it is not preferable as there is a problem that the reaction efficiency is rather low due to the high temperature, which is not economical.

In addition, if the stirrer rotation speed is 700 rpm or less, the stirring process does not proceed properly and the stirring time is prolonged. When the stirring speed exceeds 900 rpm, the hydrotreated heavy naphtha and/or isoparaffin hydrocarbons and the 1,1- It is not preferable because the problem that the friction coefficient of dichloroethane exceeds the limit value occurs.

In addition, in the first stirring step (S103), 1,1-dichloroethane is mixed with 25 to 40 parts by weight based on 100 parts by weight of at least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffinic hydrocarbons, and mixtures thereof. It is preferable to be

At this time, if the content of 1,1-dichloroethane is less than 25 parts by weight, the cleaning efficiency of the cleaning composition may decrease, whereas if the content of 1,1-dichloroethane exceeds 40 parts by weight, the cleaning power is improved However, it is not preferable because corrosion may occur on the surface of the electronic component.

In addition, in the first stirring step (S103), when 1,1-dichloroethane and dichloromethane are mixed at one time with at least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffinic hydrocarbons, and mixtures thereof, each Since the components are not mixed evenly, the 1,1-dichloroethane is preferentially mixed with the hydrotreated heavy naphtha and/or isoparaffin hydrocarbons, and dichloromethane is additionally added through the second stirring step (S105) to be described later. Stirring is preferred.

The second stirring step (S105) is a step of adding dichloromethane to the stirrer that has undergone the first stirring step (S103) and stirring, in detail, the hydrotreated heavy naphtha, isoparaffinic hydrocarbons, and mixtures thereof. It is preferable to add 25 to 40 parts by weight of dichloromethane based on 100 parts by weight of at least one selected from the group consisting of.

If the content of dichloromethane is less than 25 parts by weight, the effects listed above are insignificant, and when the content of dichloromethane exceeds 40 parts by weight, it is outside the limit of use of ozone-depleting substances, and the component that destroys the ozone layer It is undesirable because it is emitted in a large amount and increases the deformation effect by heat of the electronic component, which may cause layer separation in electronic components such as PCB.

In addition, the second stirring step (S105) is preferably stirred at a temperature of 20 to 40 ℃ for 5 to 15 minutes at a rotation speed of 700 to 900rpm.

This is the optimum condition for sufficient mixing of the reactants, and when stirred for less than 5 minutes at a temperature of less than 20° C., hydrotreated heavy naphtha and/or isoparaffinic hydrocarbons with the 1,1-dichloroethane and dichloromethane This is not uniformly mixed, so it is not possible to obtain sufficient reaction efficiency, and on the other hand, when the reaction is carried out at a temperature of more than 40 ° C. for more than 15 minutes, the reaction efficiency is rather low due to the high temperature, which is not economical don't

In addition, when the stirrer rotation speed is 700 rpm or less, the stirring process does not proceed properly and the stirring time is prolonged. When the stirring speed exceeds 900 rpm, the hydrotreated heavy naphtha and/or isoparaffinic hydrocarbons and the 1,1- It is not preferable because there is a problem that the friction coefficient of dichloroethane and the dichloromethane exceeds a limit value.

This concludes the description of the method for manufacturing the cleaning composition for electronic components having insulation according to the present invention.

Hereinafter, a method for manufacturing a cleaning agent composition for electronic components according to the present invention and a cleaning effect of the cleaning agent composition prepared through the production method will be described with reference to Examples.

<Example 1>

100 parts by weight of hydrotreated heavy naphtha and isoparaffinic hydrocarbons were put into a stirrer, stirred at a temperature of 30° C. at a speed of 800 rpm for 10 minutes to proceed with the raw material input step, and 1,1-dichloro 33.3 parts by weight of ethane was added, and the first stirring step was performed by stirring at a temperature of 30° C. at a speed of 800 rpm, and 33.3 parts by weight of dichloromethane was added to the stirrer that had undergone the first stirring step, and the temperature of 30° C. By finally performing the second stirring step for 10 minutes at a speed of 800 rpm, a cleaning composition for electronic components having insulation properties was prepared.

<Comparative Example 1>

A detergent composition was prepared by mixing 76 parts by weight of 1,1-dichloroethane and 24 parts by weight of dichloromethane with respect to 100 parts by weight of hydrotreated heavy naphtha and isoparaffinic hydrocarbons.

<Comparative Example 2>

The same procedure as in Example 1 was performed, except that 24 parts by weight of 1,1-dichloroethane and 76 parts by weight of dichloromethane were mixed with respect to 100 parts by weight of hydrotreated heavy naphtha and isoparaffin hydrocarbons to prepare a detergent composition.

The PCB having a width of 150 mm x a height of 150 mm was washed with the cleaning agent composition prepared in Example 1 and Comparative Examples 1 and 2, and the insulation breakdown voltage of the cleaned PCB, whether ODS regulated substances (ozone layer destructive components) were released, flash point and Copper plate corrosion was measured, and the results are shown in Table 1.

As shown in Table 1 above, the cleaning composition prepared in Example 1 according to the present invention not only exhibited an excellent dielectric breakdown voltage of 23 kV or more, compared to Comparative Examples 1 and 2, but also contained environmental pollutants such as ODS regulated substances. Since it does not emit, it is not harmful to the human body, so it was confirmed that it shows eco-friendliness.

In addition, in the case of Example 1, it was confirmed that the flash point was higher than 40° C., which not only improved stability, but also exhibited non-corrosiveness to the copper plate.

In addition, the surface of the PCB (width 150mm × length 150mm) was washed with the cleaning agent composition prepared in Example 1, but changes in the detection amount of each component detected on the PCB surface before and after washing are shown in Table 2 below.

(However, if the reduction of each component after washing exceeds 60%, indicate ○, if the decrease is 20 to 60%, △, and if the decrease is less than 20%, indicate ×.)

As shown in Table 2 above, the cleaning composition prepared in Example 1 of the present invention removes the detected amount of each component, which is a contaminant attached to the PCB surface, by at least 20% or more, as well as as shown in FIG. Likewise, it has been proven that it has an excellent cleaning effect as it effectively removes contaminants from the surface of the PCB.

In addition, 1) a PCB free from contaminants, 2) a PCB contaminated with iron powder, and 3) a PCB contaminated with iron powder, each of which was washed with the cleaning composition prepared in Example 1 of the present invention at 50 ° C. After standing in the oven for 5 to 15 minutes, the temperature change of the PCB surface was measured, and it is shown in Table 3 below.

However, as shown in FIG. 3, the temperature change of the PCB surface was measured by randomly selecting points 1 to 5.

As shown in Table 3, in the case of the PCB contaminated with iron powder, but washed with the cleaning agent composition prepared in Example 1 of the present invention, the efficiency of removing foreign substances such as dust from the PCB surface is excellent, as well as being contaminated with iron powder It was confirmed that the effect of lowering the surface temperature of the PCB by 2 to 5°C was excellent compared to the printed PCB.

That is, in the case of the cleaning composition according to the present invention, it can be confirmed that the electronic components are prevented from being deformed and corroded by heat and have the effect of protecting the electronic products.

The above is the end of the description of the cleaning composition for electronic components having insulation and the manufacturing method thereof according to the present invention, the present invention is not limited to the above-described embodiment, the scope of application is varied, as well as claimed in the claims It goes without saying that various modifications may be made without departing from the gist of the present invention.

S101: Raw material input step
S103: first stirring step
S105: second stirring step

Claims (7)

At least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffinic hydrocarbons, and mixtures thereof, 1,1-dichloroethane and dichloromethane.
The method of claim 1,
The cleaning composition for electronic components having the insulation,
25 to 40 parts by weight of 1,1-dichloroethane and 25 to 40 parts by weight of dichloromethane based on 100 parts by weight of at least one selected from the group consisting of the hydrotreated heavy naphtha, isoparaffinic hydrocarbons, and mixtures thereof A cleaning composition for electronic components having insulating properties.
A raw material input step of adding at least one selected from the group consisting of hydrotreated heavy naphtha, isoparaffinic hydrocarbons, and mixtures thereof to the stirrer;
A first stirring step of adding 1,1-dichloroethane to the stirrer that has undergone the raw material input step and stirring; and
A method of manufacturing a cleaning composition for electronic components having insulation, comprising: a second stirring step of adding dichloromethane to the stirrer that has undergone the first stirring step and stirring.
4. The method of claim 3,
The first stirring step is,
For electronic components having insulation, characterized in that 25 to 40 parts by weight of 1,1-dichloroethane are mixed with respect to 100 parts by weight of at least one selected from the group consisting of the hydrotreated heavy naphtha, isoparaffin hydrocarbons, and mixtures thereof A method for preparing a cleaning composition.
4. The method of claim 3,
The second stirring step is,
The hydrotreated heavy naphtha, isoparaffinic hydrocarbon, and at least one selected from the group consisting of isoparaffinic hydrocarbons and mixtures thereof with 25 to 40 parts by weight of dichloromethane with respect to 100 parts by weight of a cleaning composition for electronic components having insulation properties manufacturing method.
4. The method of claim 3,
The first stirring step and the second stirring step,
Method for producing a cleaning composition for electronic components having insulation, characterized in that the stirring for 5 to 15 minutes at a temperature of 20 to 40 ℃.
4. The method of claim 3,
The first stirring step and the second stirring step,
A method of manufacturing a cleaning composition for electronic components having insulation, characterized in that the stirring is performed at a rotation speed of 700 to 900 rpm.

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