KR20220061807A - Electronic device including heat dissipation member - Google Patents

Abstract

According to various embodiments of the present disclosure, an electronic device includes a first housing; a second housing for receiving at least a portion of the first housing and guiding sliding movement of the first housing; a display including a first display area disposed on the first housing, and a second display area extending from the first display area; a printed circuit board disposed in the housing and receiving at least one electronic component; a support member for supporting the printed circuit board; a lateral wall member connected to the support member and facing at least a portion of the first housing; a heat dissipation sheet configured to receive heat from the at least one electronic component and disposed on the support member and the lateral wall member; and a heat dissipation member disposed on the lateral wall member and facing the heat dissipation sheet.

Description

Electronic device including a heat dissipation member {ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION MEMBER}

Various embodiments of the present disclosure relate to an electronic device including a heat dissipation member.

Due to the development of information and communication technology and semiconductor technology, various functions are being integrated into one portable electronic device. For example, the electronic device may implement not only a communication function, but also an entertainment function such as a game, a multimedia function such as music/video playback, a communication and security function for mobile banking, schedule management, and an electronic wallet function. Such electronic devices are being miniaturized so that users can conveniently carry them.

As the mobile communication service expands to the multimedia service area, there is a need to increase the size of the display of the electronic device in order for the user to fully use the multimedia service as well as the voice call or short message. However, the size of the display of the electronic device has a trade-off relationship with the miniaturization of the electronic device.

An electronic device (eg, a portable terminal) includes a flat display or a display having a flat surface and a curved surface. An electronic device including a display may have a limitation in realizing a screen larger than the size of the electronic device due to the fixed display structure. Accordingly, an electronic device including a rollable display is being researched.

Electronic devices are being reduced in size and weight in order to maximize user's portability and convenience, and integrated components are being mounted in increasingly small spaces for high performance. Accordingly, the components used in the electronic device may have a higher heat generation temperature due to high performance, and the heat generated by the components of the electronic device may affect the adjacent components, thereby degrading the overall performance of the electronic device.

In implementing a rollable electronic device, it may be difficult to secure a heat dissipation structure while enabling structures of the electronic device to move (eg, slide) relative to each other. For example, in a rollable electronic device, a space in which a display slides or a mechanism for a slide movement of the display is required. It may be difficult to secure a heat dissipation structure in

According to various embodiments of the present disclosure, an electronic device including a heat dissipation structure capable of transferring heat generated by an electronic component in a width direction of the electronic device may be provided.

However, the problems to be solved in the present disclosure are not limited to the above-mentioned problems, and may be variously expanded without departing from the spirit and scope of the present disclosure.

According to various embodiments of the present disclosure, an electronic device includes a housing including a first housing and a second housing accommodating at least a portion of the first housing and guiding a sliding movement of the first housing; A display including a first display area disposed on a first housing and a second display area extending from the first display area, a printed circuit board disposed in the housing and accommodating at least one electronic component, the housing A heat dissipation sheet disposed in and configured to receive heat from a support member for supporting the printed circuit board, a sidewall member connected to the support member and facing at least a portion of the first housing, and the at least one electronic component, and a heat dissipation sheet disposed on the support member and the side wall member, and a heat dissipation member disposed on the side wall member and facing the heat dissipation sheet.

According to various embodiments of the present disclosure, an electronic device includes a first housing and a second housing accommodating at least a portion of the first housing and guiding a sliding movement of the first housing a display comprising a housing, a first display area disposed on the first housing, and a second display area extending from the first display area, a print disposed within the second housing and accommodating at least one electronic component A circuit board, a support structure disposed in the housing and supporting the printed circuit board, the support structure comprising a support member facing the at least one electronic component and a sidewall member extending from the support member, the support member and and a heat dissipation sheet disposed on the sidewall member, and at least one hinge module connected to the first housing and the sidewall member.

The electronic device according to various embodiments of the present disclosure may use a heat dissipation member disposed on the sidewall member to disperse heat generated in the electronic component in the width direction of the electronic device.

The electronic device according to various embodiments of the present disclosure may transfer heat generated by the electronic component to the outside of the hinge module or the electronic device.

In addition, various effects directly or indirectly identified through this document may be provided.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;
2 is a diagram illustrating a state in which a second display area of a flexible display is accommodated in a second housing, according to various embodiments of the present disclosure;
3 is a view illustrating a state in which a second display area of a flexible display is exposed to the outside of a second housing, according to various embodiments of the present disclosure;
4 is a cross-sectional perspective view taken along the AA′ of FIG. 2 .
5 is a cross-sectional perspective view of a plane BB′ of FIG. 3 .
6 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.
7 is a cross-sectional perspective view of an electronic device, according to an embodiment of the present disclosure;
8 is a cross-sectional view of an electronic device according to another embodiment of the present disclosure.
9 is a cross-sectional view of an electronic device according to another embodiment of the present disclosure.
10 is a perspective view of an electronic device including a heat dissipation member facing a battery, according to various embodiments of the present disclosure;
11 is a rear view of an electronic device including a fin structure, according to various embodiments of the present disclosure;
12 is a perspective view of an electronic device in which a rear plate is excluded, according to various embodiments of the present disclosure;
13 is a graph for explaining a temperature of an electronic component according to an operation time of the component, according to various embodiments of the present disclosure;
14 is a perspective view of a hinge module of an electronic device, according to various embodiments of the present disclosure;
15 is a cross-sectional view of an electronic device, according to various embodiments of the present disclosure;
16 is a perspective view of an electronic device including a hinge module including a second heat dissipation adhesive member;
17 is a perspective view of an electronic device including a hinge module including a protruding structure;
18 is a rear view of an electronic device according to various embodiments of the present disclosure;
19 is a perspective view of an electronic device in which a rear plate is omitted, according to various embodiments of the present disclosure;

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included. In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, the program 140 ) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) capable of operating independently or together with the main processor 121 . (NPU: neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can be The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the co-processor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( eg commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations performed by the electronic device 101 may be executed by one or more external devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the element from other elements in question, and may refer to elements in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

2 is a diagram illustrating a state in which a second display area of a flexible display is accommodated in a second housing, according to various embodiments of the present disclosure; 3 is a view illustrating a state in which a second display area of a flexible display is exposed to the outside of a second housing, according to various embodiments of the present disclosure;

The state shown in FIG. 2 may be defined as that the first housing 201 is closed with respect to the second housing 202 , and the state shown in FIG. 3 is the first housing 202 with respect to the second housing 202 . The housing 201 may be defined as being open. According to an embodiment, a “closed state” or an “open state” may be defined as a state in which the electronic device is closed or opened.

2 and 3 , the electronic device 200 may include housings 201 and 202 . The housings 201 and 202 may include a second housing 202 and a first housing 201 movably disposed with respect to the second housing 202 . In some embodiments, it may be interpreted as a structure in which the second housing 202 is slidably disposed on the first housing 201 in the electronic device 200 . According to an embodiment, the first housing 201 may be disposed to be reciprocally movable by a predetermined distance in a direction shown with respect to the second housing 202 , for example, a direction indicated by an arrow ①. The configuration of the electronic device 200 of FIGS. 2 and 3 may be all or partly the same as the configuration of the electronic device 101 of FIG. 1 .

According to various embodiments, the first housing 201 may be referred to as, for example, a first structure, a slide unit, or a slide housing, and may be reciprocally disposed on the second housing 202 . According to an embodiment, the first housing 201 may accommodate various electrical and electronic components such as a circuit board or a battery. According to one embodiment, the second housing 202 may be referred to as, for example, a second structure, a main part, or a main housing. A portion of the display 203 (eg, the first display area A1 ) may be disposed on the first housing 201 .

According to an embodiment, at least a portion of the other portion of the display 203 (eg, the second display area A2 ) may cause the first housing 201 to move (eg, slide movement) with respect to the second housing 202 . ), received into the inside of the second housing 202 (eg, a slide-in operation) or visually exposed to the outside of the second housing 202 (eg, slide-out) out) can be operated.

According to various embodiments, the first housing 201 may include a first support member 211 (eg, a slide plate). The first support member 211 may include a first surface F1 forming at least a portion of the first support member 211 and a second surface F2 facing in a direction opposite to the first surface F1. there is. According to an embodiment, the first support member 211 may support at least a portion of the display 203 (eg, the first display area A1 ).

According to various embodiments, the second housing 202 may include a second support member 221 (eg, a main case). The second support member 221 may accommodate the first support member 211 of the first housing 201 . For example, the second support member 221 may include a second side member 221b, a third side member 221c substantially parallel to the second side member 221b, and the second side member 221b. and a first side member 221a perpendicular to the third side member 221c. According to an embodiment, the second support member 221 may be formed in an open shape at one side (eg, a front face) to accommodate (or surround) at least a portion of the first housing 201 . . For example, the first housing 201 is accommodated in the second housing 202 in an at least partially wrapped state, and while being guided by the second housing 202 , the first surface F1 or the second surface F2 ) and can slide in a direction parallel to, for example, the arrow ①. According to an embodiment, the second support member 221 , the first side member 221a , the second side member 221b , and/or the third side member 221c may be integrally formed. According to another embodiment, the second plate 221 , the first side member 221a , the second side member 221b , and/or the third side member 221c may be formed as separate housings and combined or assembled. there is.

According to various embodiments, the second housing 202 may include a back plate 223 . According to an exemplary embodiment, the rear plate 223 may substantially form at least a portion of the exterior of the second housing 202 or the electronic device 200 . For example, the rear plate 223 may be coupled to the outer surface of the second support member 221 . According to an embodiment, the rear plate 223 may be integrally formed with the second support member 221 . According to an embodiment, the back plate 223 may provide a decorative effect on the exterior of the electronic device 200 . The second support member 221 may be manufactured using at least one of metal or polymer, and the rear plate 223 may be manufactured using at least one of metal, glass, synthetic resin, or ceramic. According to an embodiment, the second support member 221 and/or the rear plate 223 may be made of a material that transmits light at least partially (eg, the auxiliary display area). For example, in a state in which a portion of the display 203 (eg, the second display area A2 ) is accommodated in the electronic device 200 , the electronic device 200 displays the second display area A2 . can be used to output visual information. The auxiliary display area may be a portion of the second support member 221 and/or the rear plate 223 in which the display 203 accommodated in the second housing 202 is positioned.

According to various embodiments, the second housing 202 may cover at least a portion of the display 203 . For example, at least a portion of the display 203 may be accommodated in the second housing 202 , and a portion of the second support member 221 (eg, the first side member 221a) may be disposed in the second housing. A portion of the display 203 accommodated inside the 202 may be covered.

According to various embodiments, the electronic device 200 may include a display 203 , a key input device 241 , a connector hole 243 , audio modules 247a , 247b , 247c , or camera modules 249a and 249b . can Although not shown, the electronic device 200 may further include an indicator (eg, an LED device) or various sensor modules. The display 203, audio module 247a, 247b, 247c, and camera module 249a, 249b configuration of FIGS. 2 and 3 are the display module 160, the audio module 170, and the camera module ( 180), all or part of the configuration may be the same.

According to various embodiments, the display 203 may include a first display area A1 and a second display area A2 . According to an embodiment, the first display area A1 may be disposed on the first housing 201 . For example, the first display area A1 may extend substantially across at least a portion of the first surface F1 to be disposed on the first surface F1 . The second display area A2 extends from the first display area A1 and is inserted or accommodated in the second housing 202 according to the sliding movement of the first housing 201 or the second housing 202 . ) can be visually exposed to the outside of

According to various embodiments, at least a portion of the second display area A2 is substantially moved while being guided by a display support member (eg, the display support member 307 of FIG. 5 ) to move the second housing 202 . It may be accommodated inside or a space formed between the first housing 201 and the second housing 202 or may be visually exposed to the outside. According to an embodiment, the second display area A2 may move based on the sliding movement of the first housing 201 in the first direction (eg, the direction indicated by the arrow ①). For example, a portion of the second display area A2 may be deformed into a curved shape while the first housing 201 slides.

According to various embodiments, when the first housing 201 moves from the closed state to the open state when viewed from the top of the first support member 211 (eg, the slide plate), the second display area A2 is While being gradually visually exposed to the outside of the second housing 202 , a substantially flat surface may be formed together with the first display area A1 . The display 203 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. In one embodiment, the second display area A2 may be at least partially accommodated inside the second housing 202 , and even in the state shown in FIG. 2 (eg, a closed state), the second display area A2 . A part of the can be visually exposed to the outside.

According to various embodiments, the key input device 241 may be located in one area of the first housing 201 . Depending on the appearance and usage state, the illustrated key input device 241 may be omitted or the electronic device 200 may be designed to include additional key input device(s). According to an embodiment, the electronic device 200 may include a key input device (not shown), for example, a home key button or a touch pad disposed around the home key button. According to another embodiment, at least a portion of the key input device 241 is on the first side member 221a, the second side member 221b and/or the third side member 221c of the second housing 202 . can be placed.

According to various embodiments, the connector hole 243 may be omitted, and may accommodate a connector (eg, a USB connector) for transmitting/receiving power and/or data to and from an external electronic device. Although not shown, the electronic device 200 may include a plurality of connector holes 243, and some of the plurality of connector holes 243 may function as connector holes for transmitting and receiving audio signals to and from an external electronic device. there is. In the illustrated embodiment, the connector hole 243 is disposed on the third side member 221c, but the present invention is not limited thereto, and the connector hole 243 or a connector hole not shown is formed in the first side member 221a ) or the second side member 221b.

According to various embodiments, the audio modules 247a , 247b , and 247c may include at least one speaker hole 247a , at least one microphone hole 247b , or at least one duct 247c . One of the speaker holes 247a may be provided as a receiver hole for a voice call, and the other may be provided as an external speaker hole. The electronic device 200 may include a microphone for acquiring a sound, and the microphone may acquire a sound external to the electronic device 200 through the microphone hole 247b. The electronic device 200 may guide a part of the low-pitched energy generated by the speaker (eg, the sound output module 155 of FIG. 1 ) to the outside of the electronic device 200 using the duct 247c. According to an embodiment, the electronic device 200 may include a plurality of microphones to detect the direction of sound. According to an embodiment, the electronic device 200 may include an audio module in which the speaker hole 247a and the microphone hole 247b are implemented as one hole or include a speaker in which the speaker hole 247a is excluded (eg, : piezo speaker).

According to various embodiments, the camera modules 249a and 249b may include a first camera module 249a and a second camera module 249b. The second camera module 249b is located in the first housing 201 , and may photograph a subject in a direction opposite to the first display area A1 of the display 203 . The electronic device 200 may include a plurality of camera modules. For example, the electronic device 200 may include at least one of a wide-angle camera, a telephoto camera, and a close-up camera. According to an embodiment, the electronic device 200 may include an infrared projector and/or an infrared receiver to measure the distance to the subject. can The camera modules 249a and 249b may include one or more lenses, an image sensor, and/or an image signal processor. The electronic device 200 may further include another camera module (a first camera module 249a, eg, a front camera) for photographing a subject in a different direction from the second camera module 249b. For example, the first camera module 249a may be disposed around the first display area A1 or in an area overlapping the display 203 , and when disposed in the area overlapping the display 203 , the display ( 203), and the subject can be photographed.

According to various embodiments, an indicator (not shown) of the electronic device 200 may be disposed in the first housing 201 or the second housing 202 , and includes a light emitting diode to provide state information of the electronic device 200 . can be provided as a visual signal. A sensor module (not shown) of the electronic device 200 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state. The sensor module may include, for example, a proximity sensor, a fingerprint sensor, or a biometric sensor (eg, an iris/face recognition sensor or an HRM sensor). In another embodiment, a sensor module, eg, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a temperature sensor, a humidity sensor, or an illuminance sensor It may include one more.

4 is a cross-sectional perspective view taken along a plane A-A' of FIG. 2 . FIG. 5 is a cross-sectional perspective view of a plane B-B′ of FIG. 3 .

4 and 5 , the electronic device 300 includes a first housing 301 , a second housing 302 , and a display 303 (eg, a flexible display, a foldable display, or a rollable display). may include The configuration of the electronic device 300, the first housing 301, the second housing 302, and the display 303 of FIGS. 4 and 5 is the electronic device 200 and the first housing ( 201 ), the second housing 202 , and the display 203 may all or partly be the same.

According to various embodiments, the electronic device 300 may change to a closed state (eg, FIG. 4 ) or an open state (eg, FIG. 5 ) based on the sliding movement of the first housing 301 . .

According to various embodiments, the electronic device 300 may include a first back plate 305 . According to an embodiment, the first back plate 305 may form at least a portion of an outer surface of the electronic device 300 . For example, the first back plate 305 may form a second surface (eg, the second surface F2 of FIG. 3 ). According to an embodiment, the first rear plate 305 is connected to the first housing 301 , and can slide with respect to the second housing 302 together with the first housing 301 . The configuration of the first back plate 305 may be the same in whole or in part as the configuration of the first support member 211 of FIG. 3 .

According to various embodiments, the electronic device 300 may include a second back plate 306 . According to an embodiment, the second back plate 306 may be connected to the second housing 302 . The configuration of the second rear plate 306 may be all or partly the same as that of the rear plate 223 of FIGS. 2 and 3 .

According to various embodiments, the electronic device 300 may include a display support member 307 . According to an embodiment, at least a portion of the display support member 307 may be a multi-joint hinge structure or a multi-bar assembly. For example, at least a portion of the display supporting member 307 may be bent corresponding to the display 303 according to the sliding movement of the first housing 301 . According to an embodiment, the display supporting member 307 may be connected to the display 303 and/or the first housing 301 . For example, as the first housing 301 slides, the display support member 307 may move with respect to the second housing 302 . The display support member 307 may be substantially accommodated in the second housing 302 in a closed state (eg, FIG. 2 ). According to an embodiment, the display support member 307 may be disposed under the display 303 .

According to various embodiments, the electronic device 300 may include a printed circuit board 310 on which at least one electronic component 312 is mounted. According to an embodiment, the printed circuit board 310 may be disposed in the housings 301 and 302 . For example, the printed circuit board 310 may be disposed on the support structure 308 located within the second housing 302 . The configuration of the electronic component 312 may be the same in whole or in part as the configuration of the processor 120 or the memory 130 of FIG. 1 .

According to various embodiments, the electronic device 300 may include a support structure 308 . According to one embodiment, the support structure 308 may be disposed within the housings 301 , 302 . For example, the support structure 308 may be located within and coupled to the second housing 302 . When the first housing 301 slides with respect to the second housing 302 , the distance between the first housing 301 and the support structure 308 may increase. According to an embodiment, the support structure 308 may support a component (eg, the printed circuit board 310 ) of the electronic device 300 . According to an exemplary embodiment, the configuration of the support structure 308 may be all or partly the same as that of the first support member 211 of FIG. 3 and/or the configuration of the second support member 221 of FIG. 2 .

According to various embodiments, the support structure 308 may include a support member 320 . According to an embodiment, the support member 320 may accommodate or support the printed circuit board 310 .

According to various embodiments, the support structure 308 may include a sidewall member 330 . According to an embodiment, the sidewall member 330 may be disposed between at least a portion of the first housing 301 and at least a portion of the second housing 302 . For example, the sidewall member 330 may not be exposed to the outside of the electronic device 300 and may not directly contact the user. According to an embodiment, the first housing 301 is connected to the hinge module 360 connected to the side wall member 330 , and may slide with respect to the side wall member 330 . The side wall member 330 may face at least a portion of the first housing 301 and at least a portion of the second housing 302 . According to an embodiment, the sidewall member 330 may be connected to the support member 320 . For example, the sidewall member 330 may be a separate component disposed on the support member 320 . According to an embodiment, the sidewall member 330 may be integrally formed with the support member 320 . For example, it may be interpreted as a portion extending from the support member 320 of the support structure 308 toward the second back plate 306 . According to one embodiment, the support structure 308 may be formed of a metal. For example, the support structure 308 may include at least one of aluminum or stainless steel.

According to various embodiments, the electronic device 300 may include at least one hinge module 360 . According to an embodiment, the hinge module 360 may connect the first housing 310 and the second housing 302 . For example, the hinge module 360 may be connected to the first housing 310 and the sidewall member 330 . The sidewall member 330 may be at least a portion of a support structure 308 disposed within the second housing 302 . According to an embodiment, the hinge module 360 may guide the sliding movement of the first housing 301 . For example, the hinge module 360 rotates about a rotation axis in the second direction (eg, the Z-axis direction), thereby sliding the first housing 301 in the first direction (eg, the X-axis direction). can guide The configuration for guiding the sliding movement of the first housing 301 is not limited to the hinge module 360 . For example, the electronic device 300 may include a link structure (not shown) connected to the first housing 301 and/or the second housing 302 , a gear structure (eg, a rack gear) and/or a spur gear. (spur gear)), a pulley structure, and/or a motor (not shown) may be included. The link structure and/or the gear may guide the sliding movement of the first housing 301 . The motor generates a driving force for sliding movement of the first housing 301 and/or the second housing 302, and the first housing 301 and/or the second housing 302 uses a gear structure or a pulley structure. You can use it to move the slide.

6 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure. 7 is a cross-sectional perspective view of an electronic device, according to an embodiment of the present disclosure;

6 and 7, the electronic device 300 includes a printed circuit board 310, a support member 320, a side wall member 330, a heat dissipation sheet 340, a heat dissipation member 350, a hinge module ( 360 ), a shielding member 370 , and/or a first heat dissipating adhesive member 380 .

The configuration of the electronic device 300 , the printed circuit board 310 , the electronic component 312 , the support member 320 , the sidewall member 330 , and/or the hinge module 360 of FIGS. 6 and 7 is shown in FIG. 4 . And the configuration and all or a part of the electronic device 300, the printed circuit board 310, the electronic component 312, the support member 320, the side wall member 330, and/or the hinge module 360 of FIG. can be the same.

According to various embodiments, at least a portion of the support member 320 may face the printed circuit board 310 and/or the electronic component 312 . For example, the support member 320 may include a second support member face 320b that faces at least a portion of a display (eg, the display 303 in FIG. 4 ), and opposite the second support member face 320b , and , the printed circuit board 310 and/or the first support member surface 320a facing at least a portion of the electronic component 312 may be included.

According to various embodiments, the sidewall member 330 may face at least a portion of the printed circuit board 310 and/or the electronic component 312 . For example, the sidewall member 330 may include a first sidewall member surface 330a facing at least a portion of the printed circuit board 310 and/or the electronic component 312 , and a first sidewall member surface 330a of the first sidewall member surface 330a. Conversely, it may include a second sidewall member surface 330b facing at least a portion of the hinge module 360 . According to an embodiment, the sidewall member 330 may transfer at least a portion of heat to the heat dissipation sheet 340 . For example, at least a portion of the sidewall member 330 may face at least a portion of the heat dissipation sheet 340 . According to an embodiment, the sidewall member 330 may be integrally formed with the support member 320 . For example, the side wall member 330 and the support member 320 may be interpreted as one component.

According to various embodiments, the heat dissipation sheet 340 may disperse heat generated by the electronic component 312 to other components of the electronic device 300 . According to an embodiment, at least a portion of the heat dissipation sheet 340 may be connected to the electronic component 312 . For example, the heat dissipation sheet 340 receives at least a portion of the heat generated by the electronic component 312 through the shielding member 370 and/or the first heat dissipation adhesive member 380, and at least a portion of the received heat Heat may be transferred to other components (eg, support member 320 and/or sidewall member 330 ). According to an embodiment, the heat dissipation sheet 340 may include a material having high thermal conductivity (eg, copper (Cu) and/or graphite).

According to various embodiments, the heat dissipation sheet 340 faces the printed circuit board 310 and/or the electronic component 312 , and at least a portion of the heat transferred from the electronic component 312 is transferred to the sidewall member 330 . can transmit According to an embodiment, the heat dissipation sheet 340 may be disposed on the support member 320 and the sidewall member 330 . For example, the heat dissipation sheet 340 may extend from the first support member surface 320a of the support member 320 to the first sidewall member surface 330a of the sidewall member 330 . According to another example (not shown), the heat dissipation sheet 340 includes a plurality of first support member surfaces 320a of the support member 320 , and a plurality of first sidewall member surfaces 330a of the sidewall member 330 . of heat dissipation sheets.

According to various embodiments, the heat dissipation member 350 may receive heat from the heat dissipation sheet 340 . According to an embodiment, the heat dissipation member 350 may face at least a portion of the heat dissipation sheet 340 . For example, the heat dissipation member 350 may contact the heat dissipation sheet 340 , and at least a portion of heat generated by the electronic component 312 may be transferred to the heat dissipation member 350 through the heat dissipation sheet 340 . At least a portion of the heat dissipation member 350 may be disposed substantially parallel to the first sidewall member surface 330a of the sidewall member 330 . According to an embodiment, the heat dissipation member 350 may be disposed on the sidewall member 330 . For example, the sidewall member 330 may include a receiving groove 333 , and the heat dissipation member 350 may be disposed in the receiving groove 333 . According to an embodiment, the heat dissipation member 350 may be a heat pipe. For example, the heat dissipation member 350 may include a volatile fluid (eg, water, methanol, or acetone) and a case (eg, copper, stainless steel, ceramic, tungsten) accommodating the volatile fluid. According to an embodiment, the heat dissipation member 350 may include copper. According to an embodiment, the heat dissipation member 350 may be omitted. For example, at least a portion of heat generated by the electronic component 312 may be transferred to the sidewall member 330 through the heat dissipation sheet 340 .

According to various embodiments, the shielding member 370 may reduce electromagnetic waves generated by the electronic component 312 transmitted to the outside of the electronic device 300 . According to an embodiment, the shielding member 370 may be disposed on the heat dissipation sheet 340 . For example, the shielding member 370 may be disposed between the electronic component 312 and the heat dissipation sheet 340 . According to an embodiment, the shielding member 370 may include at least one shielding structure 372 surrounding at least a portion of the electronic component 312 . According to an embodiment, the shielding member 370 may cover an upper portion of the electronic component 312 , and the shielding structure 372 may cover a side surface of the electronic component 312 .

According to various embodiments, the first heat dissipation adhesive member 380 may increase the rate at which heat generated by the electronic component 312 is transferred to the heat dissipation sheet 340 and/or the heat dissipation member 350 . According to an embodiment, the first heat dissipation adhesive member 380 may be an adhesive member including a thermal interface material (TIM). For example, the first heat dissipation adhesive member 380 may be formed of a thermally conductive material having an adhesive property (eg, a thermal paste, a thermal gap filler, a thermal adhesive, or a thermal tape). thermal tape)). According to an embodiment, the first heat dissipation adhesive member 380 may be disposed on the shielding member 370 (eg, in the Z direction of FIG. 6 ). For example, the first heat dissipation adhesive member 380 may be disposed between the electronic component 312 and the shielding member 370 .

8 is a cross-sectional view of an electronic device according to another embodiment of the present disclosure. 9 is a cross-sectional view of an electronic device according to another embodiment of the present disclosure.

8 and 9 , the heat dissipation member 350 may include at least one heat dissipation member 350 connected to the sidewall member 330 . The electronic device 300 of FIGS. 8 and 9 , the printed circuit board 310 , the electronic component 312 , the support member 320 , the side wall member 330 , the heat dissipation sheet 340 , the heat dissipation member 350 , and the shield The member 370 and the first heat dissipation adhesive member 380 include the electronic device 300 of FIGS. 6 and 7 , the printed circuit board 310 , the electronic component 312 , the support member 320 , and the sidewall member of FIGS. 6 and 7 . All or part of the configuration of the 330 , the heat dissipation sheet 340 , the heat dissipation member 350 , the shielding member 370 , and the first heat dissipation adhesive member 380 may be the same.

According to various embodiments (eg, FIG. 8 ), the sidewall member 330 may include a plurality of receiving grooves 333 and 334 . According to an embodiment, at least one first accommodating groove 333 facing the heat dissipation sheet 340 and a second accommodating groove 334 facing the hinge module (eg, the hinge module 360 of FIG. 7 ) are provided. may include The first accommodating groove 333 and the second accommodating groove 334 may receive the heat dissipation member 350 .

According to various embodiments, the heat dissipation member 350 may include a plurality of heat dissipation members 352 and 354 . According to an exemplary embodiment, the heat dissipation member 350 includes a first heat dissipation sheet 352 facing the heat dissipation sheet 340 and a second heat dissipation sheet 352 spaced apart from the first heat dissipation sheet 352 and facing the hinge module 360 . A heat dissipation sheet 354 may be included. For example, the heat dissipation member 350 may include a first heat dissipation member 352 disposed in the first accommodating groove 333 and a second heat dissipation member 354 disposed in the second accommodating groove 334 . there is. According to an embodiment, the first heat dissipation member 352 may be disposed substantially parallel to the second heat dissipation member 354 .

According to various embodiments (eg, FIG. 9 ), the sidewall member 330 may include at least one through hole 335 (eg, the through hole 337 of FIG. 17 ). According to an embodiment, the through hole 335 may be a hole penetrating between the first sidewall member surface 330a and the second sidewall member surface 330b of the sidewall member 330 . According to an embodiment, the sidewall member 330 may include a plurality of through holes 335 spaced apart from each other in a longitudinal direction (eg, a Y-axis direction) of the electronic device 300 . For example, the through-holes 335 may be provided as a plurality of through-holes (eg, the through-holes 337 of FIG. 17 ). According to an embodiment, the sidewall member 330 may include a plurality of through holes 335 spaced apart from each other in a thickness direction (eg, a Z-axis direction) of the electronic device 300 . For example, the through hole 335 may be arranged to have at least one row and at least one column.

According to various embodiments, the heat dissipation member 350 may be disposed in the through hole 335 . According to an embodiment, the heat dissipation member 350 may face the printed circuit board 310 and the hinge module (eg, the hinge module 360 of FIG. 7 ). For example, the heat dissipation member 350 includes a first heat dissipation member surface 350a facing the printed circuit board 310 and/or the electronic component 312 and opposite to the first heat dissipation member surface 350a, and a hinge A second heat dissipation member surface 350b facing the module (eg, the hinge module 360 of FIG. 7 ) may be included. According to an embodiment, the heat dissipation member 350 may include a plurality of heat dissipation members 350 spaced apart from each other in the longitudinal direction (Y-axis direction) of the electronic device 300 . According to an embodiment, the heat dissipation member 350 may receive at least a portion of the heat generated by the electronic component 312 through the heat dissipation sheet 340 . For example, at least a portion of the first heat dissipation member surface 350a of the heat dissipation member 350 faces at least a portion of the heat dissipation sheet 340 , and at least a portion of the heat generated by the electronic component 312 is disposed on the heat dissipation sheet ( 340), and the first heat dissipation member surface 350a may be transmitted to the second heat dissipation member surface 350b.

10 is a perspective view of an electronic device including a heat dissipation member facing a battery, according to various embodiments of the present disclosure;

Referring to FIG. 10 , the electronic device 300 may include a heat dissipation member 350 that at least partially faces the printed circuit board 310 and the battery 304 . The configuration of the electronic device 300 , the printed circuit board 310 , the electronic component 312 , the support member 320 , the side member 330 , and the heat dissipation member 350 of FIG. 10 is the electronic device of FIGS. 6 to 9 . All or part of the configuration of the device 300 , the printed circuit board 310 , the electronic component 312 , the support member 320 , the side member 330 , and the heat dissipation member 350 may be the same.

According to various embodiments, the electronic device 300 may include a battery 304 disposed on the support member 320 . According to one embodiment, at least a portion of the battery 304 may face the side member 330 . According to one embodiment, the battery 304 may be disposed within a housing (eg, the second housing 202 of FIG. 3 ). The configuration of the battery 304 may be the same in whole or in part as the configuration of the battery 189 of FIG. 1 .

According to various embodiments, the support member 320 may support at least some of the components of the electronic device 300 . For example, the support member 320 may include a camera module 309 (eg, the second camera module 249b of FIG. 3 ), a printed circuit board 310 on which the electronic component 312 is mounted, and a battery 304 . can support According to an embodiment, a portion of heat generated by the electronic component 312 mounted on the printed circuit board 310 may be transferred to the battery 304 through the support member 320 .

According to various embodiments, the sidewall member 330 may face the printed circuit board 310 and the battery 304 . For example, the sidewall member 330 may include a first sidewall region 332 facing at least a portion of the printed circuit board 310 , and extending from the first sidewall region 332 and facing the battery 304 . A second sidewall region 333 may be included. According to an embodiment, at least a portion of heat generated by the electronic component 312 may be transferred to the second sidewall area 333 through the first sidewall area 332 .

According to various embodiments, the heat dissipation member 350 may diffuse at least a portion of heat generated by the electronic component 312 . According to an embodiment, the heat dissipation member 350 may be disposed on the first sidewall area 332 and the second sidewall area 333 . For example, at least a portion of the heat generated by the electronic component 312 is transferred to the second sidewall region 333 through the heat dissipation sheet (eg, the heat dissipation sheet 340 of FIG. 6 ) and the heat dissipation member 350 . , an area through which heat is diffused may be increased.

11 is a rear view of an electronic device including a fin structure, according to various embodiments of the present disclosure; 12 is a perspective view of an electronic device in which a rear plate is excluded, according to various embodiments of the present disclosure; 13 is a graph for explaining a temperature of an electronic component according to an operation time of the component, according to various embodiments of the present disclosure;

11 to 13 , at least a portion of heat generated by the electronic component 312 may be dispersed using the sidewall member 330 . 11 and/or 12 , the first housing 301 , the second housing 302 , the battery 304 , the display support member 307 , the printed circuit board 310 , the electronic component 312 , the support member ( 320 , the side wall member 330 , the heat dissipation member 350 , and the hinge module 360 have the configuration of the first housing 301 and the second housing 302 of FIGS. 4 , 5 , 6 and/or 10 . ), a battery 304 , a display support member 307 , a printed circuit board 310 , an electronic component 312 , a support member 320 , a side wall member 330 , a heat dissipation member 350 , and a hinge module 360 ). All or part of the configuration may be the same.

According to various embodiments, the sidewall member 330 may include at least one fin structure 331 . According to an embodiment, the fin structure 331 may be a heat sink through which heat received by the sidewall member 330 is radiated. For example, the fin structure 331 is configured to increase the cross-sectional area of the side wall member 330 , and at least a portion of heat transferred from the heat dissipation member 350 to the side wall member 330 passes through the fin structure 331 . , may be transferred to the outside of the sidewall member 330 . According to an embodiment, the pin structure 331 may face or contact the hinge module 360 . For example, in a state in which the electronic device 300 is closed (eg, FIG. 11 ), the fin structure 331 is disposed adjacent to the hinge module 360 , and at least a portion of heat generated by the electronic component 312 is disposed on the sidewall It may be transmitted to the hinge module 360 through the pin structure 331 of the member 330 .

According to various embodiments, the fin structure 331 may dissipate at least a portion of heat generated by the electronic component 312 . According to an embodiment, the temperature G2 of the electronic device 300 including the fin structure 331 may be lower than the temperature G1 of the electronic device not including the fin structure 331 . The temperature of the electronic device 300 may be interpreted as a temperature of a region in which the electronic component 312 is located. For example, when the electronic component 312 is operated, the electronic component 312 generates heat, and the generated heat is a heat dissipation sheet (eg, the heat dissipation sheet 340 in FIG. 6 ), and/or a heat dissipation member ( Example: The heat dissipation member 350 of FIG. 6 may be passed through to the side wall member 330 . The heat transferred to the sidewall member 330 is transferred to another component of the electronic device 300 (eg, the hinge module 360 ) or to the outside of the electronic device 300 through the fin structure 331 , and the electronic component 312 . ) can be reduced.

According to various embodiments, the sidewall member 330 may be positioned between the printed circuit board 310 and the hinge module 360 . For example, the sidewall member 330 may be a first sidewall member face 330a facing at least a portion of the printed circuit board 310 and/or at least a portion of a heat dissipation sheet (eg, the heat dissipation sheet 340 of FIG. 7 ). and a second sidewall member face 330b opposite to the first sidewall member face 330a and facing at least a portion of the hinge module 360 . According to an embodiment, the sidewall member 330 may include a third sidewall member surface 330c forming at least a portion of a groove formed in the second sidewall member surface 330b. The fin structure 331 may be formed to protrude from the third sidewall member surface 330c.

According to various embodiments, the side wall member 330 may be connected to the hinge module 360 . For example, the sidewall member 330 may include a connection structure 336 for receiving the hinge module 360 . According to one embodiment, the connection structure 336 may extend from the second sidewall member face 330b.

According to various embodiments, the hinge module 360 may be connected to the first housing 301 and the sidewall member 330 . According to an exemplary embodiment, the hinge module 360 rotates about the first rotation structure 361 of the hinge module 360 while being connected to the first housing 301 and the sidewall member 330 while rotating the first housing. Based on the sliding movement of the 301, it can be folded or unfolded. For example, the first rotation structure 361 may be a pin. According to an embodiment, the hinge module 360 may be rotatably mounted to the connection structure 336 of the side wall member 330 .

14 is a perspective view of a hinge module of an electronic device, according to various embodiments of the present disclosure; 15 is a cross-sectional view of an electronic device, according to various embodiments of the present disclosure; 16 is a perspective view of an electronic device including a hinge module including a heat dissipation adhesive member;

14 to 16 , the electronic device 300 includes a battery 304 , a printed circuit board 310 , an electronic component 312 , a support member 320 , a side wall member 330 , and a heat dissipation sheet 340 . , a heat dissipation member 350 , a hinge module 360 , and a first heat dissipation adhesive member 380 .

14 to 16 , the electronic device 300 , the battery 304 , the printed circuit board 310 , the electronic component 312 , the support member 320 , the sidewall member 330 , the heat dissipation sheet 340 , and the heat dissipation member The configuration of the 350 , the hinge module 360 , and the first heat-dissipating adhesive member 380 is the electronic device 300 , the battery 304 , the printed circuit board 310 , and the electronic component of FIGS. 6 and/or 10 . 312 , the support member 320 , the side wall member 330 , the heat dissipation sheet 340 , the heat dissipation member 350 , the hinge module 360 , and the configuration of the first heat dissipation adhesive member 380 and all or part of the can be the same.

According to various embodiments, the hinge module 360 may be unfolded or folded based on one rotation axis. For example, the hinge module 360 is rotatable with respect to the first rotation structure 361 , the first bracket 362 configured to be rotatable with respect to the first rotation structure 361 , and the first rotation structure 361 . It may include a second bracket 363 configured to do so. The first bracket 362 may include a second rotation structure 362-1 to be connected to a portion of the sidewall member 330 (eg, the connection structure 336 of FIG. 11 ). The second bracket 363 may include a third rotation structure 363 - 1 to be connected to the first housing 301 .

According to various embodiments, the hinge module 360 of the electronic device 300 may include a second heat dissipation adhesive member 382 . According to an embodiment, the second heat dissipation adhesive member 382 may increase the rate at which heat generated by the electronic component 312 is transferred to the hinge module 360 . According to an embodiment, the second heat dissipation adhesive member 382 may be an adhesive member including a thermal interface material (TIM). For example, the second heat dissipation adhesive member 382 may be formed of a thermally conductive material having an adhesive property (eg, a thermal paste, a thermal gap filler, a thermal adhesive, or a thermal tape). thermal tape)). According to an embodiment, the second heat dissipation adhesive member 382 may be disposed on the first bracket 362 of the hinge module 360 and may at least partially face the sidewall member 330 . For example, at least a portion of heat generated by the electronic component 312 may pass through the heat dissipation member 350 and/or the sidewall member 330 and may be transferred to the second heat dissipation adhesive member 382 . At least a portion of the heat transferred to the second heat dissipation adhesive member 382 may be transferred to the hinge module 360 . According to an embodiment, the second heat dissipation adhesive member 382 may be attached on the first hinge module surface 360a of the hinge module 360 facing the sidewall member 330 .

17 is a perspective view of an electronic device including a hinge module including a protruding structure;

Referring to FIG. 17 , the electronic device 300 is a hinge module including a side wall member 330 having at least one through hole 337 formed therein, and a protruding structure 364 that can be inserted into the through hole 337 . (360). The configuration of the battery 304 , the printed circuit board 310 , the electronic component 312 , the side wall member 330 , and the hinge module 360 of FIG. 17 is the battery 304 of FIGS. 6 and/or 10 , the printed circuit All or a part of the configuration of the substrate 310 , the electronic component 312 , the sidewall member 330 , and the hinge module 360 may be the same.

According to various embodiments, the sidewall member 330 may include at least one through hole 337 . According to one embodiment, the through hole 337 may be formed on a first sidewall member face (eg, the first sidewall member face 330a of FIG. 6 ) and a second sidewall member face (eg, the second sidewall member face ( 330a) of FIG. 6 ). 330b)) may be a hole penetrating between them. According to an embodiment, the heat dissipation member (eg, the heat dissipation member 350 of FIG. 6 ) may be disposed on the side member 330 in which the through hole 337 is formed.

According to various embodiments, the hinge module 360 may include at least one protrusion structure 364 . According to an embodiment, the protrusion structure 374 may be inserted into the through hole 337 . For example, in the closed state (eg, FIG. 2 ) of the electronic device 300 , at least a portion of the protrusion structure 374 may be located in the through hole 337 . According to an embodiment, the protruding structure 364 may be disposed on the first bracket of the hinge module 360 (eg, the first bracket 362 of FIG. 14 ) or may extend from the first bracket 362 . there is.

According to an embodiment, heat generated by the electronic component 312 may be dispersed due to convection by air passing through the through hole 337 . For example, the hinge module 360 may be folded or unfolded based on the sliding movement of the first housing (eg, the first housing 201 of FIG. 2 ). The protrusion structure 364 may be inserted into the through hole 337 when the hinge module 360 is folded, and may be spaced apart from the through hole 337 when the hinge module 360 is unfolded. When the hinge module 360 moves, a flow of air inside the electronic device 300 may be generated. Heat generated by the electronic component 312 may be transferred (eg, convection) to the internal space of the electronic device 300 by air passing through the through hole 337 .

18 is a rear view of an electronic device according to various embodiments of the present disclosure; 19 is a perspective view of an electronic device in which a rear plate is omitted, according to various embodiments of the present disclosure;

18 and 19 , the electronic device 300 includes a first housing 301 and a second housing configured to accommodate the first housing 301 and guide the sliding movement of the first housing 301 . (302). The configuration of the first housing 301 , the second housing 302 , the display 303 , the display support member 307 , and the hinge module 360 of FIGS. 18 and 19 is the first housing of FIGS. 4 and 5 . All or part of the configuration of the 301 , the second housing 302 , the display 303 , the display support member 307 , and the hinge module 360 may be the same.

According to various embodiments, the first housing 301 may include at least one side member 301-1. According to an embodiment, the side member 301-1 may form at least a portion of an outer surface (eg, a side surface) of the first housing 301 . According to an embodiment, the area of the side member 301-1 exposed to the outside of the electronic device 300 in the state in which the electronic device 300 is opened (eg, FIG. 3 ) is, the electronic device 300 is closed. It may be larger than the area of the side member 301-1 exposed to the outside of the electronic device 300 in a closed state (eg, FIG. 2 ).

According to various embodiments, the first housing 301 may include at least one vent hole 301 - 2 configured to be exposed to the outside of the electronic device 300 . According to an embodiment, the vent hole 301 - 2 may be formed in the side member 301-1. According to an embodiment, at least a portion of the at least one vent hole 301 - 2 is exposed to the outside of the electronic device 300 while the electronic device 300 is open, and is closed when the electronic device 300 is closed. In this state, it is disposed inside the second housing 302 and may face the second housing 302 . According to an embodiment, the outside and the inside of the electronic device 300 may be connected through the vent hole 301 - 2 . For example, air inside the electronic device 300 may be delivered to the outside of the electronic device 300 . According to an embodiment, the air inside the electronic device 300 heated by the heat generated by the electronic component (eg, the processor 120 of FIG. 1 ) passes through the vent hole 301 - 2 in the electronic device 300 . moves to the outside of the , and the temperature of the electronic device 300 may decrease. According to an embodiment, when the electronic device 300 is changed from a closed state (eg, FIG. 2 ) to an open state (eg, FIG. 3 ), the hinge module 360 is changed from a folded state to an unfolded state, , a flow of air located inside the electronic device 300 is generated based on the operation of the hinge module 360 , and the flowed air moves to the outside of the electronic device 300 through the vent hole 301 - 2 . can According to an embodiment, heat generated in the electronic component (eg, the electronic component 312 of FIG. 4 ) due to the flow of air may be dispersed due to convection by the air passing through the vent hole 301 - 2 . .

According to various embodiments, the first housing 301 may include a protective cover 301-3. According to an embodiment, the protective cover 301-3 may reduce moisture or foreign substances introduced into the electronic device 300 through the vent hole 301-2. For example, the protective cover 301-3 may cover the vent hole 301-2. According to an embodiment, at least a portion of the protective cover 301-3 may include a plurality of holes for blocking or reducing the flow of liquid or foreign substances. For example, at least a portion of the protective cover 301-3 may be formed in a mesh shape.

According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 200 of FIG. 2 ) includes a first housing (eg, the first housing 201 of FIG. 2 ), and at least the first housing. a housing (eg, housings 201 and 202 of FIG. 2 ) that receives a portion and includes a second housing (eg, second housing 202 of FIG. 2 ) for guiding sliding movement of the first housing; A first display area (eg, the first display area A1 of FIG. 3 ) disposed on the first housing, and a second display area extending from the first display area (eg, the second display area of FIG. 3 ) (A2)) including a display (eg, display 203 in FIG. 3 ), a printed circuit board disposed within the housing and accommodating at least one electronic component (eg, electronic component 312 in FIG. 6 ); For example: the printed circuit board 310 of FIG. 6 ), a support member disposed in the housing and supporting the printed circuit board (eg, the support member 320 of FIG. 6 ), connected to the support member, and the second 1 A side wall member (eg, the side wall member 330 in FIG. 6 ) facing at least a portion of a housing, a heat dissipation sheet configured to receive heat from the at least one electronic component, the support member and the side wall member disposed on the side wall member It may include a heat dissipation sheet (eg, the heat dissipation sheet 340 of FIG. 6 ), and a heat dissipation member disposed on the sidewall member and facing the heat dissipation sheet (eg, the heat dissipation member 350 of FIG. 6 ).

According to various embodiments, the support member may include a first support member surface facing the printed circuit board (eg, the first support member surface 320a of FIG. 6 ), and a second support member facing the display. a surface (eg, the second support member surface 320b of FIG. 6 ), wherein the sidewall member includes a first sidewall member surface (eg, the first sidewall member surface 330a of FIG. 6 ) facing the printed circuit board )), and a second sidewall member face opposite the first sidewall member face (eg, a second sidewall member face 330b in FIG. 6 ), wherein the heat dissipation sheet comprises: It may extend to a surface of the first sidewall member.

According to various embodiments, the electronic device may further include at least one hinge module (eg, the hinge module 360 of FIG. 5 ) connected to the first housing and the sidewall member.

According to various embodiments, the sidewall member may include a plurality of fin structures (eg, the fin structures 331 of FIG. 11 ) configured to face the at least one hinge module.

According to various embodiments, the side wall member includes a first accommodating groove (eg, the first accommodating groove 333 of FIG. 8 ) facing the heat dissipation sheet, and a second accommodating groove (eg, a first accommodating groove 333 of FIG. 8 ) facing the hinge module : a second accommodating groove 334 of FIG. 8 ), wherein the heat dissipation member includes a first heat dissipation member (eg, the first heat dissipation member 352 of FIG. 8 ) disposed in the first accommodating groove, and the A second heat dissipation member (eg, the second heat dissipation member 354 of FIG. 8 ) disposed in the second accommodation groove may be included.

According to various embodiments, the at least one hinge module is connected to a first bracket (eg, the first bracket 362 of FIG. 14 ) connected to the side wall member, and the first housing, and the first bracket a second bracket (eg, the second bracket 363 of FIG. 14 ) rotatably connected to the The second heat dissipation adhesive member 382 of FIG. 14 ) may be included.

According to various embodiments, the electronic device further includes a battery (eg, the battery 304 of FIG. 10 ) disposed in the housing and configured to supply power to the at least one electronic component, and the side wall member is a first sidewall region facing at least a portion of the printed circuit board (eg, the first sidewall region 332 of FIG. 10 ) and a second extending from the first sidewall region and facing at least a portion of the battery It may include a sidewall region (eg, the second sidewall region 333 of FIG. 10 ), and the heat dissipation member may be disposed on the first sidewall region and the second sidewall region.

According to various embodiments, the printed circuit board and the support member may be disposed in the second housing.

According to various embodiments, the side wall member may be integrally formed with the support member.

According to various embodiments, the electronic device includes a shielding member (eg, the shielding member 370 of FIG. 6 ) disposed on the heat dissipation sheet, disposed on the shielding member, and facing the at least one electronic component A first heat-dissipating adhesive member (eg, the first heat-dissipating adhesive member 380 of FIG. 6 ) may be further included.

According to various embodiments, the side wall member may include at least one through hole (eg, the through hole 337 of FIG. 17 ) facing the heat dissipation sheet.

According to various embodiments, the heat dissipation member may be disposed in the at least one through hole and face the printed circuit board.

According to various embodiments, the at least one through hole may include at least one protruding structure (eg, the protruding structure of FIG. 17 ) protruding from at least one hinge module (eg, the hinge module 360 of FIG. 5 )) can be configured to accommodate

According to various embodiments, the first housing includes at least one vent hole (eg, the vent hole 301 - 2 of FIG. 18 ) configured to be exposed to the outside of the electronic device, and the at least one vent hole It may include a protective cover that covers it (eg, the protective cover 301-3 of FIG. 19 ).

According to various embodiments, the heat dissipation sheet may include copper or graphite, and the heat dissipation member may include a heat pipe.

According to various embodiments, the first housing is configured to slide in a first direction with respect to the second housing, and the at least one hinge module is configured to be unfolded or folded in the first direction. and may be configured to rotate about a second direction substantially perpendicular to the direction.

According to various embodiments of the present disclosure, in an electronic device (eg, the electronic device 200 of FIG. 2 ), a first housing (eg, the first housing 201 of FIG. 2 ), and the first 1 A housing (eg, housing 201 in FIG. 2 ) including a second housing (eg, second housing 202 in FIG. 2 ) for accommodating at least a portion of the housing and guiding sliding movement of the first housing 202)), a first display area (eg, the first display A1 of FIG. 3 ) disposed on the first housing, and a second display area extending from the first display area (eg, the second display area of FIG. 3 ) A display (eg, the display 203 of FIG. 3 ) including two displays A2), a printed circuit board (eg, the printed circuit board of FIG. 6 ) disposed in the second housing and accommodating at least one electronic component 310), a support structure (eg, support structure 308 of FIG. 6 ) disposed in the housing and supporting the printed circuit board, a support member facing the at least one electronic component (eg, FIG. 6 ) a support structure (eg, support structure 308 in FIG. 6) comprising a support member 320 of A heat dissipation sheet (eg, the heat dissipation sheet 340 of FIG. 6 ) disposed on the side wall member, and at least one hinge module (eg, the hinge module 360 of FIG. 5 ) connected to the first housing and the side wall member may include

According to various embodiments, the sidewall member may include a plurality of fin structures (eg, the fin structures 331 of FIG. 11 ) configured to face the at least one hinge module.

According to various embodiments, the electronic device is disposed within the housing, a battery (eg, battery 304 in FIG. 10 ) for supplying power to the at least one electronic component, and disposed on the sidewall member and a heat dissipation member (eg, the heat dissipation member 350 of FIG. 6 ) facing at least a portion of the heat dissipation sheet, wherein the side wall member includes a first sidewall region facing at least a portion of the printed circuit board ( Example: first sidewall region 332 of FIG. 10 ) and a second sidewall region extending from the first sidewall region and facing at least a portion of the battery (eg, second sidewall region 333 of FIG. 10 ) The heat dissipation member may be disposed on the first sidewall region and the second sidewall region.

According to various embodiments, the side wall member includes a first accommodating groove (eg, the first accommodating groove 333 of FIG. 8 ) facing the heat dissipation sheet, and a second accommodating groove (eg, a first accommodating groove 333 of FIG. 8 ) facing the hinge module : a second accommodating groove 334 of FIG. 8 ), wherein the heat dissipation member includes a first heat dissipation member (eg, the first heat dissipation member 352 of FIG. 8 ) disposed in the first accommodating groove, and the A second heat dissipation member (eg, the second heat dissipation member 354 of FIG. 8 ) disposed in the second accommodation groove may be included.

According to various embodiments, the electronic device is disposed on a shielding member (eg, the shielding member 370 of FIG. 6 ) disposed on the heat dissipation sheet and the shielding member, and faces the at least one electronic component A first heat-dissipating adhesive member (eg, the first heat-dissipating adhesive member 380 of FIG. 6 ) may be further included.

According to various embodiments, the at least one hinge module is connected to a first bracket (eg, the first bracket 362 of FIG. 14 ) connected to the side wall member, and the first housing, and the first bracket a second bracket (eg, the second bracket 363 of FIG. 14 ) rotatably connected to the The second heat dissipation adhesive member 382 of FIG. 14 ) may be included.

The electronic device including the heat dissipation member of the present disclosure described above is not limited by the above-described embodiments and drawings, and various substitutions, modifications and changes are possible within the technical scope of the present disclosure. It will be clear to those of ordinary skill in the art.

101, 200, 300: electronic device
201, 301: first housing
202, 302: second housing
203, 303: display
304: battery
310: printed circuit board
312: electronic component
320: support member
330: side wall member
331: pin structure
340: heat dissipation sheet
350: heat dissipation member
360: hinge module

Claims (20)

In an electronic device,
a housing comprising a first housing and a second housing accommodating at least a portion of the first housing and guiding a sliding movement of the first housing;
a display including a first display area disposed on the first housing and a second display area extending from the first display area;
a printed circuit board disposed in the housing and accommodating at least one electronic component;
a support member disposed in the housing and supporting the printed circuit board;
a side wall member connected to the support member and facing at least a portion of the first housing;
a heat dissipation sheet configured to receive heat from the at least one electronic component, the heat dissipation sheet disposed on the support member and the sidewall member; and
and a heat dissipation member disposed on the sidewall member and facing the heat dissipation sheet.
According to claim 1,
The support member includes a first support member surface facing the printed circuit board, and a second support member surface facing the display,
The side wall member includes a first side wall member face facing the printed circuit board, and a second side wall member face opposite the first side wall member face;
The heat dissipation sheet may extend from a surface of the first support member to a surface of the first sidewall member.
According to claim 1,
The electronic device further comprising at least one hinge module connected to the first housing and the sidewall member.
4. The method of claim 3,
and the sidewall member includes a plurality of fin structures configured to face the at least one hinge module.
4. The method of claim 3,
The side wall member includes a first accommodating groove facing the heat dissipation sheet, and a second accommodating groove facing the hinge module,
The heat dissipation member includes a first heat dissipation member disposed in the first accommodating groove, and a second heat dissipation member disposed in the second accommodating groove.
4. The method of claim 3,
The at least one hinge module is disposed on a first bracket connected to the side wall member, a second bracket connected to the first housing and rotatably connected with respect to the first bracket, and the first bracket; and a second heat dissipation adhesive member configured to receive heat from the sidewall member.
According to claim 1,
a battery disposed within the housing and further comprising a battery for supplying power to the at least one electronic component;
The sidewall member includes a first sidewall region facing at least a portion of the printed circuit board and a second sidewall region extending from the first sidewall region and facing at least a portion of the battery;
The heat dissipation member is disposed on the first sidewall region and the second sidewall region.
According to claim 1,
The printed circuit board and the support member are disposed in the second housing.
According to claim 1,
The side wall member is integrally formed with the support member.
According to claim 1,
a shielding member disposed on the heat dissipation sheet; and
and a first heat dissipation adhesive member disposed on the shielding member and facing the at least one electronic component.
According to claim 1,
The side wall member includes at least one through hole facing the heat dissipation sheet.
12. The method of claim 11,
The heat dissipation member is disposed in the at least one through hole and faces the printed circuit board.
12. The method of claim 11,
The at least one through hole is configured to receive at least one protruding structure protruding from the at least one hinge module.
According to claim 1,
The first housing includes at least one vent hole configured to be exposed to the outside of the electronic device, and a protective cover covering the at least one vent hole.
According to claim 1,
The heat dissipation sheet includes copper or graphite, and the heat dissipation member includes a heat pipe.
In an electronic device,
a housing including a first housing and a second housing accommodating at least a portion of the first housing and guiding a sliding movement of the first housing;
a display including a first display area disposed on the first housing and a second display area extending from the first display area;
a printed circuit board disposed in the second housing and accommodating at least one electronic component;
a support structure disposed in the housing and supporting the printed circuit board, the support structure including a support member facing the at least one electronic component and a sidewall member extending from the support member;
a heat dissipation sheet disposed on the support member and the sidewall member; and
and at least one hinge module connected to the first housing and the sidewall member.
17. The method of claim 16,
and the sidewall member includes a plurality of fin structures configured to face the at least one hinge module.
17. The method of claim 16,
a battery disposed within the housing for supplying power to the at least one electronic component; and
It is disposed on the side wall member, further comprising a heat dissipation member facing the heat dissipation sheet,
The sidewall member includes a first sidewall region facing at least a portion of the printed circuit board and a second sidewall region extending from the first sidewall region and facing at least a portion of the battery;
The heat dissipation member is disposed on the first sidewall region and the second sidewall region.
17. The method of claim 16,
a shielding member disposed on the heat dissipation sheet; and
and a first heat dissipation adhesive member disposed on the shielding member and facing the at least one electronic component.
17. The method of claim 16,
The at least one hinge module is disposed on a first bracket connected to the side wall member, a second bracket connected to the first housing and rotatably connected with respect to the first bracket, and the first bracket; and a second heat dissipation adhesive member configured to receive heat from the sidewall member.

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