KR20220056664A - lift pin assembly and bake unit with the assembly - Google Patents

Abstract

The present invention relates to a bake device which can maintain airtightness only while a process is in progress. According to one embodiment of the present invention, the bake unit comprises: a housing having an upper body and a lower body providing a processing space in which process processing is carried out on a substrate; a heating plate provided in the processing space, and having pinholes and an upper surface on which a substrate is placed; and a lift pin assembly to load/unload a substrate onto/from the heating plate. The lift pin assembly includes: lift pins positioned on the pinholes; and an airtight flange which protrudes from sides of the lift pins, does not come in contact with an O-ring on the pinholes when the lift pins are moved to the unloading position, and comes in contact with the O-ring when the lift pins are moved to the loading position.

Description

lift pin assembly and bake unit with the same

The present invention relates to a substrate processing apparatus, and more particularly, to a baking apparatus for heat-treating a substrate in a vacuum state.

In order to manufacture a semiconductor device, various processes such as photography, etching, deposition, ion implantation, and cleaning are performed. Among them, the photo process is a process for forming a pattern and plays an important role in achieving high integration of semiconductor devices.

The photographic process consists of a coating process, an exposure process, and a developing process, and a baking process is performed before and after the exposure process. The bake process is a process of heat-treating the substrate, and the substrate is placed on a heating plate and the substrate is heat-treated through a heater provided inside the heating plate.

1 is a view showing a general baking unit.

Referring to FIG. 1 , the bake unit includes an upper chamber and a lower chamber providing a space for performing a baking process therein, a heating plate installed inside the lower chamber to heat a substrate during the process, and a vacuum for the internal space. exhaust line, etc.

The above-described bake unit is provided with lift pins for loading and unloading the substrate, and an O-ring (sealing member) for maintaining airtightness of the internal space when the lift pins are raised and lowered is installed in the lift pin hole of the heating plate.

However, the O-ring has a problem in that it is difficult to maintain perfect airtightness as it is easily damaged due to a cracking phenomenon due to friction with the lift pins due to frequent up/down operations of the lift pins.

In particular, the heating plate is thermally deformed during the heating of the substrate, and the initial position of the lift pinhole formed in the heating plate is minutely moved due to the thermal deformation of the heating plate, thereby causing bending deformation of the lift pin.

Accordingly, bending deformation occurs in the lift pin due to misalignment between the lift pin hole and the lift pin. The bent lift pin locally presses the O-ring and causes the O-ring to deform, causing uneven wear and leakage.

An object of the present invention is to provide a lift pin assembly capable of maintaining airtightness only during a process and a baking apparatus having the same.

An object of the present invention is to provide a lift pin assembly capable of minimizing friction between a sealing member and a lift pin, and a baking device having the same.

An object of the present invention is to provide a lift pin assembly capable of improving the replacement life of a seal and a baking device having the same.

An object of the present invention is to provide a lift pin assembly in which centering is automatically aligned with a pinhole when the lift pin is lowered, and a baking device having the same.

The problems to be solved by the present invention are not limited thereto, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, lift pins positioned in the pinhole; a pin driving unit for elevating the lift pins to an up position and a down position; and a packing member installed on the lift pin, non-contacting with the O-ring member on the pinhole when the lift pin is moved to the up position, and automatically inserted into the pinhole and aligned with the O-ring member when moved to the down position A lift pin assembly comprising a may be provided.

In addition, the packing member has flexibility and is formed to surround the lift pin, and may have a funnel shape having a wide upper end and a relatively narrow lower end.

In addition, the lower end of the packing member may have a smaller diameter than a diameter of the pinhole in which the O-ring member is installed.

In addition, the upper end of the packing member may have a relatively larger diameter than a diameter of the pinhole in which the O-ring member is installed.

In addition, the lower end of the packing member may be fixed to the lift pin.

According to another aspect of the present invention, there is provided a housing comprising: a housing having an upper body and a lower body providing a processing space for processing a substrate; a heating plate provided in the processing space and having an upper surface on which a substrate is placed and pinholes; and a lift pin assembly for loading/unloading substrates to/from the heating plate; The lift pin assembly includes lift pins positioned in pinholes; a pin driving unit for elevating the lift pins to an up position and a down position; and a packing member installed on the lift pin, non-contacting with the O-ring member on the pinhole when the lift pin is moved to the up position, and automatically inserted into the pinhole and aligned with the O-ring member when moved to the down position A baking device comprising a may be provided.

In addition, the O-ring member may be provided to be spaced apart from the lift pin.

In addition, the O-ring member is a fixed end supported on the support block located in the pinhole; and a free end extending from the fixed end in an inner direction of the pinhole and forming a through hole through which the lift pin passes, wherein when the lift pin is moved to the down position, the free end is an outer circumferential surface of the packing member It may be formed in a circular ring shape to maintain airtightness in close contact with the .

In addition, the packing member has flexibility and is formed to surround the lift pin, and may have a funnel shape having a wide upper end and a relatively narrow lower end.

In addition, the lower end of the packing member may have a smaller diameter than a diameter of the pinhole in which the O-ring member is installed.

In addition, the upper end of the packing member may have a relatively larger diameter than a diameter of the pinhole in which the O-ring member is installed.

In addition, the lower end of the packing member may be fixed to the lift pin.

In addition, it is provided inside the housing and may further include a vacuum line for depressurizing the processing space.

In addition, the upper body may further include a lifting member for elevating the upper body to be spaced apart from the lower body or to be in close contact with the lower body.

In addition, the processing space may further include a supply unit that injects a processing fluid for changing the surface of the substrate to hydrophobic.

According to an embodiment of the present invention, it is possible to reduce the maintenance cost by minimizing the grinding phenomenon due to friction between the O-ring and the lift pin, and has a special effect of improving the airtightness.

According to an embodiment of the present invention, there is a special effect of automatically aligning the centering to the pinhole when the lift pin moves downward by mounting the packing on the lift pin.

Effects of the present invention are not limited to the above-described effects, and effects not mentioned will be clearly understood by those of ordinary skill in the art to which the present invention pertains from the present specification and accompanying drawings.

1 is a cross-sectional view showing a general baking unit.
2 is a view of the substrate processing facility as viewed from above.
3 is a view of the facility of FIG. 2 viewed from the direction AA.
4 is a view of the facility of FIG. 2 viewed from the BB direction.
5 is a view of the facility of FIG. 2 viewed from the CC direction.
6 is a plan view showing a baking unit according to an embodiment of the present invention.
FIG. 7 is a side view illustrating the bake unit illustrated in FIG. 6 .
8 is a cross-sectional view illustrating a heat treatment unit performing the heat treatment process of FIG. 6 .
9A is a perspective view showing the lift pin assembly;
9B is a cross-sectional perspective view showing a lift pin on which a padding member is installed;
10 is an enlarged cross-sectional view showing a state in which the lift pin is moved to an up position;
11A is an enlarged cross-sectional view of a main part showing a state in which a lift pin is moved to a down position;
11B is a view showing the contact between the packing member and the O-ring.

Since the present invention can apply various transformations and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the present invention, if it is determined that a detailed description of a related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings, and in the description with reference to the accompanying drawings, the same or corresponding components, regardless of reference numerals, are given the same reference numbers and overlapped therewith. A description will be omitted.

2 to 5 are diagrams schematically illustrating a substrate processing facility according to an embodiment of the present invention. 2 is a view of the substrate processing facility viewed from the top, FIG. 3 is a view of the facility of FIG. 2 viewed from the A-A direction, FIG. 4 is a view of the facility of FIG. 2 viewed from the B-B direction, and FIG. 5 is the facility of FIG. is a view viewed from the C-C direction.

2 to 5 , the substrate processing facility 1 includes a load port 100 , an index module 200 , a first buffer module 300 , a coating and developing module 400 , and a second buffer module 500 . ), a pre-exposure processing module 600 , and an interface module 700 .

Load port 100, index module 200, first buffer module 300, coating and developing module 400, second buffer module 500, pre-exposure processing module 600, and interface module 700 are sequentially arranged in a line in one direction.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module ( A direction in which 700 is arranged is referred to as a first direction 12 , a direction perpendicular to the first direction 12 when viewed from above is referred to as a second direction 14 , and the first direction 12 and the second direction A direction each perpendicular to the direction 14 is referred to as a third direction 16 .

The substrate W is moved while being accommodated in the cassette 20 . At this time, the cassette 20 has a structure that can be sealed from the outside. For example, as the cassette 20, a Front Open Unified Pod (FOUP) having a door at the front may be used.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module ( 700) will be described in detail.

The load port 100 has a mounting table 120 on which the cassette 20 in which the substrates W are accommodated is placed. A plurality of mounting tables 120 are provided, and the mounting tables 200 are arranged in a line along the second direction 14 . In FIG. 1, four mounting tables 120 were provided.

The index module 200 transfers the substrate W between the cassette 20 placed on the mounting table 120 of the load port 100 and the first buffer module 300 . The index module 200 includes a frame 210 , an index robot 220 , and a guide rail 230 . The frame 210 is provided in the shape of a substantially hollow rectangular parallelepiped, and is disposed between the load port 100 and the first buffer module 300 . The frame 210 of the index module 200 may be provided at a lower height than the frame 310 of the first buffer module 300 to be described later. The index robot 220 and the guide rail 230 are disposed in the frame 210 .

The index robot 220 is a 4-axis drive so that the hand 221 that directly handles the substrate W can be moved and rotated in the first direction 12 , the second direction 14 , and the third direction 16 . It has this possible structure. The index robot 220 has a hand 221 , an arm 222 , a support 223 , and a pedestal 224 . The hand 221 is fixedly installed on the arm 222 . The arm 222 is provided in a telescoping structure and a rotatable structure. The support 223 is disposed along the third direction 16 in its longitudinal direction. The arm 222 is coupled to the support 223 to be movable along the support 223 . The support 223 is fixedly coupled to the support 224 . The guide rail 230 is provided so that its longitudinal direction is disposed along the second direction 14 . The pedestal 224 is coupled to the guide rail 230 so as to be linearly movable along the guide rail 230 . Also, although not shown, a door opener for opening and closing the door of the cassette 20 is further provided in the frame 210 .

The first buffer module 300 includes a frame 310 , a first buffer 320 , a second buffer 330 , a cooling chamber 350 , and a first buffer robot 360 . The frame 310 is provided in the shape of a rectangular parallelepiped with an empty interior, and is disposed between the index module 200 and the application and development module 400 . The first buffer 320 , the second buffer 330 , the cooling chamber 350 , and the first buffer robot 360 are positioned in the frame 310 . The cooling chamber 350 , the second buffer 330 , and the first buffer 320 are sequentially disposed along the third direction 16 from the bottom. The first buffer 320 is positioned at a height corresponding to the application module 401 of the coating and developing module 400 to be described later, and the second buffer 330 and the cooling chamber 350 are provided in the coating and developing module (to be described later) ( It is located at a height corresponding to the developing module 402 of the 400). The first buffer robot 360 is positioned to be spaced apart from the second buffer 330 , the cooling chamber 350 , and the first buffer 320 by a predetermined distance in the second direction 14 .

The first buffer 320 and the second buffer 330 temporarily store the plurality of substrates W, respectively. The second buffer 330 has a housing 331 and a plurality of supports 332 . The supports 332 are disposed in the housing 331 and are provided to be spaced apart from each other along the third direction 16 . One substrate W is placed on each support 332 . In the housing 331 , the index robot 220 , the first buffer robot 360 , and the developing unit robot 482 of the developing module 402 to be described later apply the substrate W to the support 332 in the housing 331 . An opening (not shown) is provided in a direction in which the index robot 220 is provided, a direction in which the first buffer robot 360 is provided, and a direction in which the developing unit robot 482 is provided so as to be carried in or taken out. The first buffer 320 has a structure substantially similar to that of the second buffer 330 . However, the housing 321 of the first buffer 320 has an opening in the direction in which the first buffer robot 360 is provided and in the direction in which the applicator robot 432 positioned in the application module 401 is provided, which will be described later. The number of supports 322 provided in the first buffer 320 and the number of supports 332 provided in the second buffer 330 may be the same or different.

According to an example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320 .

The first buffer robot 360 transfers the substrate W between the first buffer 320 and the second buffer 330 . The first buffer robot 360 has a hand 361 , an arm 362 , and a support 363 . The hand 361 is fixedly installed on the arm 362 . The arm 362 is provided in a telescoping structure such that the hand 361 is movable along the second direction 14 . The arm 362 is coupled to the support 363 so as to be linearly movable in the third direction 16 along the support 363 . The support 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320 . The support 363 may be provided longer than this in the upward or downward direction. The first buffer robot 360 may simply be provided such that the hand 361 is only biaxially driven along the second direction 14 and the third direction 16 .

The cooling chamber 350 cools the substrate W, respectively. The cooling chamber 350 has a housing 351 and a cooling plate 352 . The cooling plate 352 has an upper surface on which the substrate W is placed and cooling means 353 for cooling the substrate W. As the cooling means 353, various methods such as cooling by cooling water or cooling using a thermoelectric element may be used. Also, a lift pin assembly (not shown) for positioning the substrate W on the cooling plate 352 may be provided in the cooling chamber 350 . The housing 351 includes the index robot 220 and the index robot 220 so that the developing unit robot 482 provided in the developing module 402 to be described later can load or unload the substrate W into or out of the cooling plate 352 . The provided direction and the developing unit robot 482 have an opening (not shown) in the provided direction. In addition, doors (not shown) for opening and closing the above-described opening may be provided in the cooling chamber 350 .

The coating and developing module 400 performs a process of applying a photoresist on the substrate W before the exposure process and a process of developing the substrate W after the exposure process. The application and development module 400 generally has a rectangular parallelepiped shape. The application and development module 400 includes an application module 401 and a development module 402 . The application module 401 and the developing module 402 are arranged to be partitioned between each other in layers. According to an example, the application module 401 is located above the developing module 402 .

The application module 401 includes a process of applying a photoresist such as a photoresist to the substrate W and a heat treatment process such as heating and cooling on the substrate W before and after the resist application process. The application module 401 has a resist application chamber 410 , a bake unit 420 , and a transfer chamber 430 . The resist application chamber 410 , the bake unit 420 , and the transfer chamber 430 are sequentially disposed along the second direction 14 . Accordingly, the resist coating chamber 410 and the baking unit 420 are positioned to be spaced apart from each other in the second direction 14 with the transfer chamber 430 interposed therebetween. A plurality of resist coating chambers 410 are provided, and a plurality of resist coating chambers are provided in each of the first direction 12 and the third direction 16 . In the drawing, an example in which six resist application chambers 410 are provided is shown. A plurality of bake units 420 are provided in each of the first direction 12 and the third direction 16 . In the drawing, an example in which six bake units 420 are provided is shown. However, alternatively, a larger number of bake units 420 may be provided.

The transfer chamber 430 is positioned in parallel with the first buffer 320 of the first buffer module 300 in the first direction 12 . An applicator robot 432 and a guide rail 433 are positioned in the transfer chamber 430 . The transfer chamber 430 has a generally rectangular shape. The applicator robot 432 includes the bake units 420 , the resist application chambers 400 , the first buffer 320 of the first buffer module 300 , and the first of the second buffer module 500 to be described later. The substrate W is transferred between the cooling chambers 520 . The guide rail 433 is disposed so that its longitudinal direction is parallel to the first direction 12 . The guide rail 433 guides the applicator robot 432 to move linearly in the first direction 12 . The applicator robot 432 has a hand 434 , an arm 435 , a support 436 , and a pedestal 437 . The hand 434 is fixedly installed on the arm 435 . The arm 435 is provided in a telescoping structure so that the hand 434 is movable in the horizontal direction. The support 436 is provided such that its longitudinal direction is disposed along the third direction 16 . Arm 435 is coupled to support 436 so as to be linearly movable in third direction 16 along support 436 . The support 436 is fixedly coupled to the pedestal 437 , and the pedestal 437 is coupled to the guide rail 433 to be movable along the guide rail 433 .

The resist application chambers 410 all have the same structure. However, the types of photoresists used in each resist application chamber 410 may be different from each other. As an example, a chemical amplification resist may be used as the photoresist. The resist coating chamber 410 applies photoresist on the substrate W. The resist application chamber 410 has a housing 411 , a support plate 412 , and a nozzle 413 . The housing 411 has a cup shape with an open top. The support plate 412 is positioned in the housing 411 and supports the substrate W. The support plate 412 is provided rotatably. The nozzle 413 supplies the photoresist onto the substrate W placed on the support plate 412 . The nozzle 413 may have a circular tubular shape, and may supply a photoresist to the center of the substrate W. Optionally, the nozzle 413 may have a length corresponding to the diameter of the substrate W, and the outlet of the nozzle 413 may be provided as a slit. In addition, a nozzle 414 for supplying a cleaning solution such as deionized water to clean the surface of the substrate W on which the photoresist is applied may be further provided in the resist coating chamber 410 .

The bake unit 420 heat-treats the substrate W. For example, the bake units 420 heat the substrate W to a predetermined temperature before applying the photoresist to remove organic matter or moisture from the surface of the substrate W or apply the photoresist to the substrate ( A soft bake process, etc. performed after coating on W) is performed, and a cooling process of cooling the substrate W is performed after each heating process.

6 is a plan view showing a bake unit according to an embodiment of the present invention, FIG. 7 is a side view showing the bake unit shown in FIG. 6, and FIG. 8 is a cross-sectional view showing a heat treatment unit performing the heat treatment process of FIG. am.

6 to 8 , the bake unit 420 may include a process chamber 423 , a cooling plate 422 , and a heat treatment unit 800 .

The process chamber 423 provides a heat treatment space 421 therein. The process chamber 423 may be provided to have a rectangular parallelepiped shape. A slot 424 for loading and unloading a substrate is provided on one side of the process chamber 423 , the slot 424 is opened and closed by a shutter 425 , and the shutter 425 is driven by a shutter driver 426 . .

The cooling plate 422 may cool the substrate heat-treated by the heat processing unit 800 . The cooling plate 422 may be located in the heat treatment space 421 . The cooling plate 422 may be provided in a circular plate shape. A cooling means such as cooling water or a thermoelectric element is provided inside the cooling plate 422 . For example, the cooling plate 422 may cool the heated substrate to room temperature.

The heat treatment unit 800 heats the substrate. The heat processing unit 800 may include a housing 860 , a heating plate 810 , a heating member 830 , a lift pin assembly 840 , and an exhaust member 870 .

The heat treatment unit 800 may include a supply unit 809 for supplying a treatment fluid for changing the substrate surface to hydrophobicity to the treatment space. For example, in the heat treatment unit 800 , an HDMS process of forming hexamethyldisilane (hereinafter, referred to as HDMS) as an adhesion enhancer may be performed to increase the adhesion of the photoresist on the substrate. The HDMS process is performed under reduced pressure in the processing space, and for this purpose, maintaining the airtightness of the processing space is an important factor in improving process quality.

The housing 860 provides a processing space 802 in which a heat treatment process of the substrate W is performed. The housing 860 includes a lower body 862 , an upper body 864 , and a driver 868 .

The lower body 862 may be provided in a cylindrical shape with an open upper side. A heating plate 810 and a heating member 830 are positioned on the lower body 862 . The lower body 862 may include heat insulating covers to prevent thermal deformation of devices located around the heating plate 810 .

The upper body 864 has a cylindrical shape with an open lower portion. The upper body 864 is combined with the lower body 862 to form a processing space 802 therein. The upper body 864 has a larger diameter than the lower body 862 . The upper body 864 is located on top of the lower body 862 .

The upper body 864 is movable in the vertical direction by the lifting member 868 . The upper body 864 is movable in an up-down direction to move to an ascending (UP) position and a descending (Down) position. Here, the upper body 864 in the lifting position is a position spaced apart from the lower body 862 , and the lowering position is a position in which the upper body 864 is brought into contact with the lower body 862 . The lifting member 868 is controlled by a controller con.

A heating plate 810 is located in the processing space 802 . The heating plate 810 is located on one side of the cooling plate 422 . The heating plate 810 is provided in a circular plate shape. The upper surface of the heating plate 810 serves as a support area on which the substrate W is placed.

The heating member 830 heats the substrate W placed on the heating plate 810 to a preset temperature. The heating member 830 may include a plurality of heating elements. The heating member 830 may be located inside the heating plate 810 . Each heating element may heat different regions of the heating plate 810 . Different regions of the heating plate 810 are provided as heating zones heated by respective heating elements. Each heat zone is provided in a one-to-one correspondence with the heating elements. For example, the heating member 830 may be a thermoelectric element, a hot wire, or a planar heating element.

The exhaust member 870 may include a guide member 872 and an exhaust pipe 874 .

The guide member 872 is disposed to face the heating plate 810 and is positioned to be spaced apart from the inner wall of the upper surface and the inner wall of the side of the upper body 864 . Accordingly, an upper space 804 above the guide member 872 and a lower space 806 below the guide member 872 may be formed in the processing space 802 of the housing 860 . The lower space 806 may be an exhaust area in which gas flowing into the upper portion of the substrate and fumes generated from the substrate are exhausted.

The guide member 872 may be provided as a circular plate having an exhaust hole 873 formed in the center, and the exhaust pipe 874 passes through the upper body 864 and is connected to the exhaust hole 873 . Also, the size of the guide member 872 may be larger than that of the substrate. The guide member may be formed to be inclined downward from the center toward the edge.

For reference, the processing space 802 may be decompressed by the exhaust member 870 .

Referring to FIG. 8 , a plurality of pinholes 812 are formed on the upper surface of the heating plate 810 .

For example, three pin holes 812 may be provided. Each of the pin holes 812 is spaced apart along the circumferential direction of the heating plate 810 . The pin holes 812 may be positioned to be spaced apart from each other at the same distance.

A sealing member may be installed in the pin hole 812 . The sealing member may include an O-ring 890 and a support block 898 .

The O-ring 890 may be provided to be spaced apart from the lift pins 842 . For example, the O-ring 890 may be formed in a circular ring shape having a fixed end 890a and a free end 890b. The fixed end 890a is supported by the support block 898 located in the pinhole 812 . The free end 890a is formed to extend in the inner direction of the pinhole 812 from the fixed end 890b and forms a through hole 891 through which the lift pin 842 passes. When the lift pin 842 is moved to the down position of the O-ring 890 , the free end 890b is in close contact with the outer circumferential surface of the packing member 846 to maintain airtightness.

9A is a perspective view showing the lift pin assembly, and FIG. 9B is a cross-sectional perspective view showing the lift pin in which a padting member is installed.

8 to 9B, the lift pin assembly 840 includes a pin driving unit 844 for elevating the lift pins 842 and the lift pins 842 positioned in the pinhole 812 to an up position and a down position; and A packing member 846 may be included.

The packing member 846 is not in contact with the O-ring 890 on the pinhole when the lift pin 842 is moved to the up position, and is automatically inserted into and aligned with the pinhole 812 when it is moved to the down position and is in contact with the O-ring 890 . may be provided.

For example, the packing member 846 has flexibility and is formed to surround the lift pins 842 , and has a funnel shape having a wide upper end and a relatively narrow lower end. The lower end of the packing member 846 has a relatively smaller diameter than the diameter of the through hole 891 of the O-ring 890 . The upper end of the packing member 846 has a relatively larger diameter than the diameter of the through hole 891 of the O-ring 890 . The lower end of the packing member 846 is fixed to a lift pin 842 .

10 is a view showing the lift pin moved to the up position, FIG. 11A is a view showing the lift pin moved to the down position, and FIG. 11B is a view showing the contact between the packing member and the O-ring.

10 to 11B , in a state in which the lift pin 842 is moved to the up position, the packing member 846 is in a state away from the O-ring 890 , so that the sealing of the processing space 802 is released. When the lift pin 842 is moved to the down position, the lower end of the packing member 846 is aligned while passing through the through hole 891 of the O-ring 890 , and is sealed while in contact with the O-ring 890 . In a state in which the lift pin 842 is moved to the down position (a process for processing the substrate is in progress), the packing member 846 is in contact with the O-ring 890 , so that the airtightness of the processing space is maintained.

In particular, the packing member 846 is inclined to widen from the bottom to the top, so that the lower end of the packing member 846 is inserted into the through hole 891 of the O-ring 890, and self-alignment is naturally possible. Accordingly, the tolerance effect between the lift pin 842 and the pinhole 812 becomes insensitive.

For example, the heating plate 810 is thermally deformed during the substrate heating process, and the initial position of the pinhole 812 formed in the heating plate 810 due to the thermal deformation of the heating plate 810 is slightly moved. When this occurs, the positions of the pinhole 812 and the lift pin 842 are shifted. Nevertheless, in the present invention, when the lift pin 842 moves up and down, the funnel-shaped packing member 846 is automatically aligned while being inserted into the through hole 891 of the O-ring 890, and the upper end of the packing member 846 and the O-ring The free ends 890a of the 890 are in contact with each other to maintain the airtightness of the processing space.

In addition, in the present invention, since the lift pin 842 minimizes direct contact with the O-ring 890 during the up-down process, frictional wear of the O-ring 890 is significantly reduced, thereby extending the service life of the O-ring 890. have an effect

The above detailed description is illustrative of the present invention. In addition, the above description shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed herein, the scope equivalent to the written disclosure, and/or within the scope of skill or knowledge in the art. The written embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in specific application fields and uses of the present invention are possible. Accordingly, the detailed description of the present invention is not intended to limit the present invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

10: substrate processing device
100: processing vessel
200: substrate support unit
260: insulation member
280: heating unit
300: processing liquid supply unit
600: elevating unit

Claims (15)

lift pins located in the pinholes;
a pin driving unit for elevating the lift pins to an up position and a down position; and
A packing member that is installed on the lift pin, is non-contact with the O-ring member on the pinhole when the lift pin is moved to the up position, and is automatically inserted into and aligned with the pinhole when moved to the down position and is in contact with the O-ring member Includes lift pin assembly. According to claim 1,
The packing member is
A lift pin assembly having a funnel shape having a flexible and formed to surround the lift pin, the upper end is wide and the lower end is relatively narrow. 3. The method of claim 2,
The packing member is
A lift pin assembly having a lower end having a relatively smaller diameter than a diameter of the pinhole in which the O-ring member is installed. 3. The method of claim 2,
The packing member is
A lift pin assembly having an upper end having a relatively larger diameter than a diameter of the pinhole in which the O-ring member is installed. 3. The method of claim 2,
The packing member is
A lift pin assembly in which the lower end is fixed to the lift pin. a housing having an upper body and a lower body providing a processing space for processing a substrate;
a heating plate provided in the processing space and having a top surface on which a substrate is placed and pinholes; and
a lift pin assembly for loading/unloading substrates to/from the heating plate;
The lift pin assembly is
lift pins located in the pinholes;
a pin driving unit for elevating the lift pins to an up position and a down position; and
A packing member that is installed on the lift pin, is non-contact with the O-ring member on the pinhole when the lift pin is moved to the up position, and is automatically inserted into and aligned with the pinhole when moved to the down position and is in contact with the O-ring member A baking device comprising. 7. The method of claim 6,
The O-ring member is
A baking device provided in a spaced apart state from the lift pins. 8. The method according to claim 6 or 7,
The O-ring member is
a fixed end supported by a support block located in the pinhole; and
and a free end extending from the fixed end in an inner direction of the pinhole and forming a through hole through which the lift pin passes. A baking device formed in a circular ring shape to closely adhere and maintain airtightness. 7. The method of claim 6,
The packing member is
A lift pin assembly having a funnel shape having a flexible and formed to surround the lift pin, the upper end is wide and the lower end is relatively narrow. 10. The method of claim 9,
The packing member is
A lift pin assembly having a lower end having a relatively smaller diameter than a diameter of the pinhole in which the O-ring member is installed. 10. The method of claim 9,
The packing member is
A lift pin assembly having an upper end having a relatively larger diameter than a diameter of the pinhole in which the O-ring member is installed. 10. The method of claim 9,
The packing member is
A lift pin assembly in which the lower end is fixed to the lift pin. 7. The method of claim 6,
A baking apparatus provided in the housing and further comprising a vacuum line for depressurizing the processing space. 7. The method of claim 6,
The baking apparatus further comprising a lifting member for elevating the upper body so that the upper body is spaced apart from the lower body or in close contact with the lower body. 7. The method of claim 6,
The baking apparatus further comprising a supply unit for injecting a processing fluid for changing the surface of the substrate into the processing space to be hydrophobic.

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