KR20220056359A - Metal stencil mask for fine pattern printing with stencil protection bridge and method for manufacturing the same - Google Patents

Abstract

The present invention relates to a metal stencil mask for printing a fine pattern with a stencil protection bridge and a manufacturing method thereof, in which the metal stencil mask for printing the fine pattern with the stencil protection bridge includes: a stencil hole corresponding to a fine printed pattern; and a bridge configured to traverse the stencil hole from an upper side of the stencil hole, having a height that is smaller than a height of the stencil hole, and configured to support a shape of the stencil hole. The present invention provides a metal stencil mask for printing a fine pattern with a stencil protection bridge and a manufacturing method thereof, in which a stencil is prevented from being damaged in a printing process even when a length of the stencil is increased, and a pattern density is increased, a closed curve-shaped pattern stencil is manufactured, and adhesion between the stencil formed of a nickel material and a printing substrate is removed so as to improve printing quality.

Description

Metal stencil mask for fine pattern printing with stencil protection bridge and method for manufacturing the same

The present invention relates to a metal stencil mask for fine pattern printing provided with a stencil protection bridge, and a method for manufacturing the same, and more particularly, to a bridge supporting and protecting the stencil hole, which can expand the size of the stencil hole and extend the lifespan. It's about technology.

Recently, in the electronic product production market, various attempts are being made to reduce production costs, improve material consumption efficiency, and establish a clean production environment through the introduction of a new production process. A typical example is printed electronic technology, which refers to a next-generation printing technology that uses a printing process to print electronic circuits, sensors, devices, and various electronic products.

Printed electronic technology includes various printing processes such as inkjet printing, screen printing, roll-to-roll printing, and imprinting.

Among them, a method of printing metal ink by a screen printing method or a spray printing method is mainly used for printing a conductive circuit of a fine pattern.

However, the conventional screen printing method using a stencil combined with a screen mesh generally uses a screen mesh having a diameter of about 40 μm.

In this case, when a pattern having a size smaller than the diameter of the screen mesh is printed, the printed pattern formed on the stencil is covered by the screen mesh, and a printing defect portion is generated depending on the position, thereby causing a problem of non-uniformity of the pattern.

In addition, in the conventional spray printing method, when the stencil is manufactured, the stencil is manufactured to a certain height or higher in order to maintain the minimum rigidity. Therefore, the finer the pattern to be printed, the greater the height compared to the line width of the pattern, and the printing material printed through the stencil is caught between the print patterns of the stencil and is removed together in the process of removing the stencil, resulting in printing defects. there was.

In order to solve this problem, in 'micro stencil and its manufacturing method (Publication No. 10-2020-0043796)', a through-hole having a shape corresponding to a printed pattern is formed and protruding from one surface of the mask unit, Disclosed is a micro stencil including a reinforcing part provided in a portion where a through hole is not formed.

However, according to the above method, since the mask part is supported by the reinforcing part and spaced apart from the substrate, the mask part does not come into contact with the printed metal ink, thereby preventing the metal ink from being caught in the through hole. Since there is a limit to print clearly, it is time to develop a new technology for this.

On the other hand, if the length of the stencil is lengthened and the pattern density is increased in order to solve the problem of the size of the stencil for fine patterns in the prior art method, there is a problem of damage such as the stencil spreading during the printing process. It was impossible, and there was a problem in that the print quality was deteriorated due to the adhesive force between the stencil made of nickel and the printing substrate.

KR 10-2020-0043796 A

The present invention is to solve the above problems, and even when the length of the stencil is lengthened and the pattern density is increased, damage to the stencil is prevented in the printing process, a closed curved pattern stencil can be manufactured, and a stencil made of nickel and a printing board An object of the present invention is to provide a metal stencil mask for fine pattern printing having a stencil protection bridge that improves print quality by removing the adhesive force therebetween, and a method for manufacturing the same.

In order to achieve the above object, the present invention provides a stencil hole corresponding to a fine print pattern; a bridge traversing the stencil hole from an upper side and having a height smaller than a height of the stencil hole to support a shape of the stencil hole; A technical gist is a metal stencil mask for fine pattern printing provided with a stencil protection bridge, characterized in that it is formed.

In addition, it is preferable that the fine metal mask for fine pattern printing be a metal stencil mask for fine pattern printing with a stencil protection bridge, characterized in that a fine pattern for reducing adhesion to the substrate is formed on the bottom surface.

The present invention also includes the steps of applying a photosensitizer to a nickel substrate for an exposure process; disposing a second chrome mask having a chrome pattern of a stencil hole corresponding to the fine print pattern on the top of the photosensitive material, irradiating an amount of UV light to be developed up to the nickel substrate, and then removing the second chrome mask; disposing a third chrome mask having a chrome pattern of a bridge crossing the stencil hole on the photosensitive material and irradiating an amount of ultraviolet light that is not developed to the nickel substrate; developing a photoresist to form a stencil hole photoresist pattern having a bridge pattern groove formed thereon; performing nickel or nickel alloy plating so as not to exceed the stencil hole photoresist pattern while the bridge pattern groove is filled with nickel or nickel alloy; and manufacturing a metal stencil mask for fine pattern printing with a stencil protection bridge by removing the nickel substrate and the photoresist pattern; A technical gist of the present invention is to provide a method for manufacturing a metal stencil mask for fine pattern printing with a stencil protection bridge, characterized in that made.

In addition, the present invention preferably provides a method for manufacturing a metal stencil mask for fine pattern printing, characterized in that the rigidity of the bridge is formed by adjusting the line width and height of the bridge pattern groove and the height of nickel or nickel alloy plating.

In addition, the nickel substrate for the exposure process comprises: arranging a 1-1 chrome mask having a basic pattern for reducing adhesion on a substrate coated with a photosensitive agent, and then forming a photosensitive agent pattern for a phase mask through ultraviolet irradiation and developing process; manufacturing a phase mask for nano exposure process by pouring and curing the transparent polymer material for nano exposure on the upper side of the photosensitive agent pattern for the phase mask, and separating it from the photosensitive agent pattern for the phase mask; depositing a metal thin film for electroplating on a substrate, applying a photosensitive agent, placing the phase mask on the upper side of the photosensitive agent, irradiating ultraviolet rays, and then forming a fine photosensitive agent pattern for reducing adhesion through a developing process; A step of manufacturing a nickel substrate for the exposure process in which the fine pattern for reducing the adhesive force is engraved by performing an electroplating process on the fine photosensitive agent pattern for reducing the adhesive force; A method of manufacturing a metal stencil mask for fine pattern printing with a stencil protection bridge, characterized in that a fine pattern for reducing adhesion is formed on the bottom surface of the metal stencil mask for fine pattern printing provided with the stencil protection bridge formed in step 6 It is preferable to be

According to the present invention, even when the length of the stencil is lengthened and the pattern density is increased, damage to the stencil is prevented in the printing process, a closed curved pattern stencil can be manufactured, and the adhesive force between the stencil made of nickel and the printing substrate is removed. A metal stencil mask for fine pattern printing provided with a stencil protection bridge for improving print quality and a method for manufacturing the same are provided.

Figure 1 (a) is a bottom side perspective view of a metal stencil mask for fine pattern printing provided with the stencil protection bridge of the present invention, Figure 1 (b) is a metal stencil for fine pattern printing provided with the stencil protection bridge of the present invention Top-side perspective view of the mask
2 and 3 are flowcharts showing an embodiment of manufacturing a nickel substrate for an exposure process of the present invention
4 and 5 are flowcharts showing an embodiment of manufacturing a metal stencil mask for fine pattern printing provided with a stencil protection bridge of the present invention
6 (a) is a perspective view of a stencil hole photosensitizer pattern before plating nickel or nickel alloy 5 as an embodiment of the fifth step of the present invention, and FIG. 6 (b) is a fifth step of the present invention A perspective view of a stencil hole photoresist pattern after plating nickel or nickel alloy 5 as an example for

Hereinafter, the present invention will be described with reference to the drawings, and in the description of the present invention, if it is determined that a detailed description of a related known technology or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. will be.

And the terms described below are terms defined in consideration of functions in the present invention, which may vary depending on the intention or custom of the user or operator, and the definition should be made based on the content throughout this specification describing the present invention.

On the other hand, in the drawings and detailed description, the illustration and description of the configuration and action that can be easily recognized by those skilled in the art from the general photomask, photosensitizer, transparent electrode, exposure process, photolithography process, etc. are simplified or omitted.

In particular, in the drawings and detailed description, detailed descriptions and illustrations of specific technical configurations and actions of elements not directly related to the technical features of the present invention are omitted, and only the technical configurations related to the present invention are briefly illustrated or described. did.

1 (a) is a bottom side perspective view of a metal stencil mask for fine pattern printing provided with a stencil protection bridge of the present invention, and FIG. 1 (b) is a fine pattern printing with a stencil protection bridge of the present invention It is a top side perspective view of a metal stencil mask, FIGS. 2 and 3 are flowcharts showing an embodiment of manufacturing a nickel substrate for an exposure process of the present invention, and FIGS. 4 and 5 are a stencil protection bridge of the present invention It is a flowchart showing an embodiment of manufacturing a metal stencil mask for fine pattern printing.

As shown in FIG. 1 , the present invention relates to a metal stencil mask for fine pattern printing provided with a stencil protection bridge, and includes a stencil hole 10 and a bridge 20 .

The metal stencil mask is a metal plate in which stencil holes 10 corresponding to fine print patterns are formed, and in the present invention, bridges 20 are formed in a direction crossing the upper side of the stencil holes 10.

The bridge 20 is connected to the upper side of the stencil hole 10 like a bridge and is formed lower than the height of the stencil hole.

If the bridge 20 is formed to have the same height as the stencil hole 10, it will be just a general grid screen, but the bridge 20 of the present invention is formed to have a height lower than the stencil hole 10 and the stencil hole. (10) It is different from a grid screen because it is connected only from the top side.

This difference causes a difference in print quality. In the case of a grid screen, a print limit is formed by the grid size and height, but in the present invention, the print quality in the stencil hole 10 can be varied according to the adjustment of the bridge height. There are advantages that can be

The bridge 20 is connected across the stencil hole 10 to prevent deformation of the stencil hole 10 , and the shape of the bridge 20 is freely formed in a vertical or diagonal direction with respect to the stencil hole 10 . can do it

On the other hand, the fine metal stencil mask for printing a fine pattern of the present invention is formed with a fine pattern 30 for reducing adhesion to the substrate and reducing the adhesion on the bottom surface.

According to the present invention configured as described above, since the bridge 20 is connected to the upper side of the stencil hole 10 to prevent deformation such as the stencil hole 10 being widened, the length and arrangement density of the stencil hole 10 are increased. There is an advantage in that it is possible to make a closed curved pattern stencil.

Hereinafter, a method of manufacturing a metal stencil mask for fine pattern printing provided with the stencil protection bridge will be described.

For the present invention, first, as shown in FIG. 4 , a first photosensitizer 1 is coated on the nickel substrate 1-4a for the exposure process.

(In the following description, the order numbers attached to the first photosensitizer, the 1-1 photosensitizer, and the 1-1 substrate are described to distinguish the same material repeatedly described in a specific process, and do not indicate priority or quality. )

A flat plate may be used as the nickel substrate 1-4a for the exposure process. However, when a metal stencil mask is used, there is a problem in that it adheres to the printed circuit board.

Accordingly, it is preferable to use the nickel substrate 1-4a for the exposure process of the present invention in which the fine pattern 30 for reducing the adhesive force is engraved as shown in FIG. 4 .

Hereinafter, a method of manufacturing the nickel substrate 1-4a for the exposure process in which the fine pattern 30 for reducing the adhesive force is engraved will be described.

In the step of manufacturing the nickel substrate 1-4a for the exposure process, first, as shown in FIG. 2, chromium is used on the 1-1 substrate 1-1b coated with the 1-1 photosensitizer 1-1a. After disposing the 1-1 chrome mask 1-1c on which the base pattern 1-1d for reducing the adhesive force is formed, the photoresist pattern 1-1(A1) for the phase mask is formed through ultraviolet irradiation and developing process. make it

The base pattern 1-1d for reducing the adhesive force is a pattern designed to form the final fine pattern 30 for reducing the adhesive force, and since the pattern is formed with chromium on the glass 1-1 substrate 1-1b, the present invention is defined as the 1-1 chrome mask (1-1c).

After disposing the 1-1 chrome mask 1-1c on the 1-1 substrate 1-1b coated with the 1-1 photosensitizer 1-1a, irradiating ultraviolet rays and performing the development process, Since ultraviolet rays do not pass through the place where the base pattern 1-1d for reducing the adhesive force is formed, the 1-1 photosensitizer 1-1a is developed leaving only the place where the base pattern 1-1d for reducing the adhesive force is formed. It is formed with the photoresist pattern 1-1 (A1) for a mask.

Next, as shown in FIG. 3 (a), the transparent polymer material for nano exposure is poured on the upper side of the photosensitive agent pattern for a phase mask (1-1 (A1)) and cured, and then the photosensitive agent pattern for a phase mask (1-(A1)) Separate from step 1(A1)) to prepare a phase mask 1-2(A) for the nano-exposure process.

The transparent polymer material for nano-exposure refers to a known material used as a phase mask, such as polydimethylsiloxane (PDMS), transparent silicone, or polyurethane.

In this step, the phase mask 1-2(A) for the nano-exposure process is made of a transparent plate on which the photoresist pattern 1-1(A1) for the phase mask is engraved.

Next, as shown in FIG. 3B , after depositing a metal thin film 1-3b for an electroplating process on the 1-3 substrate 1-3c, the 1-3 photosensitizer 1-3a ), put the phase mask 1-2(A) for the nano-exposure process on the upper side of the 1-3 photosensitizer 1-3a, and irradiate UV rays, and then develop as shown in FIG. 3(c). Through the process, a fine photosensitive agent pattern 1-3 (A) for reducing adhesive force is formed.

In FIG. 3(b), the phase mask for the nano-exposure process (1-2(A)) is formed of a transparent plate, and when irradiated with ultraviolet light, the photoresist pattern 1-1 (A1) for the phase mask is positioned in the ultraviolet irradiation direction. The transmitted UV light is refracted along the boundary between the vertical plane and the horizontal plane, that is, along the boundary line of the photosensitive agent pattern for the phase mask, thereby forming a difference in the amount of UV transmission.

Therefore, when the 1-3 photosensitizers 1-3a are developed, as shown in FIG. 3(c), all regions except for the boundary line of the photoresist pattern for a phase mask are dissolved, thereby reducing the adhesive force in the shape of the boundary line of the photoresist pattern. A fine photoresist pattern 1-3 (A) is formed.

Next, as shown in FIG. 3(d), an electroplating process is performed on the fine photosensitizer patterns 1-3 (A) for reducing the adhesive force, and the nickel for the exposure process in which the fine pattern 30 for reducing the adhesive force is engraved. A substrate 1-4a is fabricated.

As shown in FIG. 4(a), when using the nickel substrate 1-4a for the exposure process in which the fine pattern 30 for reducing the adhesive force is engraved in the first step of the present invention, the first photosensitizer ( 1) pays attention to the point that the fine pattern 30 for reducing the adhesive force is applied to the engraved surface.

Next, as shown in FIG. 4(b), a second chrome mask 10A having a chrome pattern of the stencil hole 10 corresponding to the fine print pattern is disposed on the first photosensitive material 1, and the After irradiating the developed amount of UV light to the nickel substrate 1-4a for the exposure process, the second chrome mask 10A is removed.

Next, as shown in FIG. 4C , a third chrome mask 20A having a chrome pattern of the bridge 20 crossing the stencil hole 10 is disposed on top of the first photoresist 1 . and irradiating an amount of ultraviolet light that is not developed to the nickel substrate 1-4a for the exposure process.

Looking back at this process, in the present invention, UV exposure is performed twice with a chrome mask having different patterns formed on the upper side of the first photosensitizer 1 applied to the nickel substrate 1-4a for the exposure process, and the amount of UV exposure There is a feature to adjust the development height by making a difference.

Next, when the exposed first photoresist is developed, as shown in FIG. 5A , a stencil hole photoresist pattern 10b having a bridge pattern groove 20b formed thereon is formed.

Looking at the formation of the stencil hole photosensitizer pattern 10b in detail, in FIG. 4(b), the chromium pattern of the stencil hole is developed up to the nickel substrate 1-4a by the UV exposure amount for the second chrome mask 10A. The stencil hole photosensitizer pattern 10b is formed, and the upper side of the stencil hole photosensitizer pattern 10b is developed by the UV exposure amount for the third chrome mask 20A on which the chrome pattern of the bridge 20 is formed in FIG. 4(c). Thus, a bridge pattern groove 20b is formed.

Next, as shown in FIG. 5B, nickel or nickel alloy plating 5 is performed on the stencil hole photoresist pattern 10b.

In the present invention, the nickel or nickel alloy plating 5 adjusts the height of the nickel or nickel alloy plating 5 so that the height in the bridge pattern groove 20b is determined according to the line width of the bridge pattern groove 20b, Let the height be adjusted according to the line width in (10).

FIG. 5(b) is an example of this. When nickel or nickel alloy 5 is plated, the bridge pattern groove 20b of the stencil hole photosensitizer pattern 10b is filled with nickel or nickel alloy 5, Nickel or nickel alloy 5 is plated so as not to exceed the stencil hole photoresist pattern 10b.

Next, as shown in FIG. 5(c), the stencil hole ( 10) A metal stencil mask for printing fine patterns having a bridge 20 inside is manufactured.

In this step, when the photoresist pattern is removed, a stencil hole 10 formed by crossing the bridge 20 is formed on the upper side, and when the nickel substrate 1-4a for the exposure process is removed, a fine pattern for reducing adhesive force ( 30) is formed.

Accordingly, the metal stencil mask for fine pattern printing manufactured according to the present invention is characterized in that the bridge 20 is formed on the upper side of the stencil hole 10 , and the fine pattern 30 for reducing adhesive force is formed on the bottom surface.

Meanwhile, in the present invention, the rigidity of the bridge 20 can be adjusted by adjusting the line width and height of the bridge pattern groove 20b and the height of the nickel or nickel alloy plating 5 .

Hereinafter, looking at the bridge 20 formed by the present invention in detail, when the chrome pattern of the bridge is formed on the third chrome mask 20A in FIG. 4(c), the line width of the bridge 20 can be determined. , it is possible to determine the formation height of the bridge 20 by the irradiation amount of ultraviolet rays.

In addition, the actual height of the bridge 20 may be determined according to the height of the nickel or nickel alloy plating 5 performed in (b) of FIG. 5 .

Therefore, according to the present invention, the line width and height of the bridge 20 can be adjusted according to a desired design level, whereby the rigidity of the bridge 20 is determined.

Since the line width and height of the bridge 20 ultimately affect the print quality, it means that the optimal line width and height of the bridge 20 having optimal print quality and rigidity can be determined according to the present invention.

Looking at another embodiment of the formation of the bridge 20, as shown in FIG. 6(b), when plating nickel or nickel alloy 5, the bridge pattern groove ( If nickel or nickel alloy 5 is plated to slightly overflow 20b), a bridge 20 having a wide line width is formed thinly on the upper side of the narrow bridge 20 to ensure rigidity.

When plating nickel or nickel alloy 5 in FIG. 6(b) until the width S1 of the stencil hole photoresist pattern 10b remains about S2, by the plating height of nickel or nickel alloy 5, the bridge pattern With respect to the line width B1 of the groove 20b, the bridge 20 with a wide line width B2 slightly overflowing from the upper side of the bridge pattern groove 20b is formed thinly? It can be seen that the rigidity can be secured accordingly.

According to this method, it means that a thinner bridge can be formed, which has the effect of improving the print quality.

According to the present invention configured as described above, even when the length of the stencil is lengthened and the pattern density is increased, the stencil hole 10 is supported by the bridge 20 formed between the stencil holes 10 so that the There is an advantage in that deformation or damage such as opening is prevented, and a closed curved pattern stencil can be manufactured.

In addition, since the line width and height of the bridge 20 to be formed can be freely determined, an optimal bridge 20 can be formed that does not interfere with print quality, and by the fine pattern for reducing adhesion formed on the bottom surface, the stencil made of nickel and There is an advantage in that the printing quality can be improved by removing the adhesive force between the printing substrates.

The drawings shown above for the purpose of explanation of the present invention are one embodiment in which the present invention is embodied, and as shown in the drawings, it can be seen that various types of combinations are possible in order to realize the gist of the present invention.

Therefore, the present invention is not limited to the above-described embodiments, and as claimed in the following claims, anyone with ordinary skill in the art to which the invention pertains can implement various modifications without departing from the gist of the present invention. It will be said that there is the technical spirit of the present invention to the extent possible.

5: Nickel or nickel alloy plating
10: stencil hole
10b : stencil hole photoresist pattern
20: Bridge
20b: bridge pattern groove
30: fine pattern for reducing adhesive force
1: first photosensitizer
1-1a: 1-1 photosensitizer
1-1b: 1-1 substrate
1-1c: 1-1 chrome mask
1-1d: Basic pattern for reducing adhesive force
1-1 (A1): photoresist pattern for phase mask
1-2a: Transparent polymer material for nano exposure
1-2(A): Phase mask for nano exposure process
1-3a: 1-3 photosensitizer
1-3b: metal thin film for electroplating process
1-3c: substrate 1-3
1-3(A): Fine photoresist pattern for reducing adhesive force
1-4a: Nickel substrate for exposure process

Claims (5)

a stencil hole corresponding to a fine print pattern;
a bridge crossing the stencil hole and formed to have a height smaller than a height of the stencil hole to support a shape of the stencil hole;
Metal stencil mask for fine pattern printing with a stencil protection bridge, characterized in that it comprises a. The method of claim 1, wherein the fine metal stencil mask for printing the fine pattern is
A metal stencil mask for fine pattern printing with a stencil protection bridge, characterized in that a fine pattern that reduces adhesion is formed on the bottom surface. applying a first photosensitizer to a nickel substrate for an exposure process;
disposing a second chrome mask having a chrome pattern of a stencil hole corresponding to the fine print pattern on top of the first photoresist, irradiating an amount of UV light to be developed up to the nickel substrate, and then removing the second chrome mask;
disposing a third chrome mask having a chrome pattern of a bridge crossing the stencil hole formed thereon on top of the first photoresist and irradiating an amount of ultraviolet light that is not developed to the nickel substrate;
developing a first photoresist to form a stencil hole photoresist pattern having a bridge pattern groove formed thereon;
performing nickel or nickel alloy plating on the bridge pattern groove and the stencil hole photoresist pattern; and
manufacturing a metal stencil mask for fine pattern printing with a stencil protection bridge by removing the nickel substrate and the photoresist pattern;
A method of manufacturing a metal stencil mask for fine pattern printing with a stencil protection bridge, characterized in that it is made. [4] The method of claim 3, wherein the method for manufacturing a metal stencil mask for fine pattern printing provided with the stencil protection bridge comprises:
A method of manufacturing a metal stencil mask for fine pattern printing, characterized in that by adjusting the width and height of the bridge pattern groove and the height of nickel or nickel alloy plating, the rigidity of the bridge is formed. The method of claim 3, wherein the nickel substrate for the exposure process is
disposing a 1-1 chrome mask having a basic pattern for reducing adhesion on a 1-1 substrate coated with a 1-1 photosensitive agent, and then forming a photosensitive agent pattern for a phase mask through ultraviolet irradiation and developing process;
manufacturing a phase mask for nano exposure process by pouring and curing the transparent polymer material for nano exposure on the upper side of the photosensitive agent pattern for the phase mask, and separating it from the photosensitive agent pattern for the phase mask;
After depositing the metal thin film for the electro-pole plating process on the 1-3 substrate, the 1-3 photoresist is applied, the phase mask for the nano-exposure process is placed on the upper side of the 1-3 photosensitive agent, irradiated with ultraviolet rays, and then the developing process is performed. forming a fine photosensitive agent pattern for reducing adhesion through the process;
performing an electroplating process on the fine photoresist pattern for reducing adhesion to prepare a nickel substrate for exposure process in which a fine pattern for reducing adhesion is engraved;
made up of
A method of manufacturing a metal stencil mask for fine pattern printing with a stencil protection bridge, characterized in that a fine pattern for reducing adhesion is formed on the bottom surface of a metal stencil mask for fine pattern printing provided with a stencil protection bridge.

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