KR20220051304A - Composition, method for manufacturing antenna and molded article - Google Patents

Abstract

A composition capable of injection molding or compression molding into a substrate having excellent dielectric properties and adhesion, a method for manufacturing a high-performance antenna comprising a substrate molded from the composition, and a molded article molded from the molded product.
The composition of the present invention is used in order to form a gas having a dielectric loss tangent of 0.05 or less by injection molding or compression molding containing a heat-meltable polymer containing units based on tetrafluoroethylene. Further, in the method for manufacturing an antenna of the present invention, the method for manufacturing an antenna having a molding part having an antenna pattern by injection molding using the above composition or manufacturing an antenna with a matching layer covering the antenna pattern by compression molding way.

Description

Composition, method for manufacturing antenna and molded article

The present invention relates to a composition comprising a polymer having a predetermined heat melting property, and to a method for manufacturing an antenna using such a composition and a molded article.

With miniaturization of portable communication devices, such as mobile phones and smart phones, the miniaturization of the antenna (chip antenna) mounted in it is progressing.

Such a small antenna usually has an antenna pattern made of a conductor, and a base (dielectric base) having the antenna pattern and made of a dielectric material such as resin (refer to Patent Document 1).

In Patent Document 1, an antenna pattern is used as an insert part, a dielectric is injection molded to form a base, and a small antenna in which the antenna pattern and the base are integrated is manufactured.

International Publication No. 2013/137404

From the viewpoint of further increasing the performance of the antenna (improving the antenna gain), a dielectric excellent in dielectric properties is required. However, according to the examination of the present inventors, the dielectric material (dielectric base) of patent document 1 was still not enough. Further, in Patent Document 1, although the antenna pattern and the dielectric substrate are integrated, the adhesiveness between them is not sufficient.

MEANS TO SOLVE THE PROBLEM The present inventors earnestly examined in order to improve these points. As a result, it was found that, when a predetermined heat-melting polymer was included, it was excellent in electrical properties and adhesiveness, and a composition suitable for injection molding or compression molding could be prepared.

The present invention provides a composition capable of forming a gas having a low dielectric loss tangent excellent in adhesiveness by injection molding or compression molding, a method for manufacturing a high-performance antenna having a gas formed from the composition, and a molded article molded from the molded product is intended for

The present invention has the following aspects.

<1> A composition comprising a heat-fusible polymer containing units based on tetrafluoroethylene and used for forming a gas having a dielectric loss tangent of 0.05 or less by injection molding or compression molding.

<2> The composition according to <1>, wherein the base is a molding part or matching layer of an antenna.

<3> The composition according to <1> or <2>, wherein the base is a molded part or matching layer of the antenna, and the thickness of the molded part or the matching layer is 1 cm or less.

<4> The composition according to any one of <1> to <3>, further comprising a dielectric filler having a dielectric constant of 1.5 or more, and wherein the dielectric constant of the substrate is greater than 1.5.

<5> The composition according to <4>, wherein the dielectric filler is a spherical filler having an average particle diameter of 2 µm or less, or a fibrous filler having a length of 30 µm or less and a diameter of 2 µm or less.

<6> The composition according to <4> or <5>, wherein the ratio to the mass of the ratio of the dielectric filler to the ratio of the heat-meltable polymer in the composition is 1/10 to 1/1.

<7> The composition according to any one of <1> to <6>, wherein the heat-fusible polymer contains a unit based on perfluoro(alkylvinyl ether), hexafluoropropylene, or fluoroalkylethylene.

<8> The composition according to any one of <1> to <7>, further comprising polytetrafluoroethylene.

<9> Further, it contains polytetrafluoroethylene, and the ratio of the mass of the polytetrafluoroethylene to the ratio of the heat-fusible polymer in the composition is 1 or less, and the gas is injected by injection molding. The composition in any one of said <1>-<8> used in order to form.

<10> Further, it contains polytetrafluoroethylene, and the ratio of the mass of the polytetrafluoroethylene to the ratio of the heat-fusible polymer in the composition is 1 or more, and the gas is subjected to compression molding by compression molding. The composition in any one of said <1>-<9> used in order to form.

<11> A method for manufacturing an antenna comprising an antenna pattern and a molded part having a dielectric loss tangent of 0.05 or less, the antenna pattern comprising the composition according to any one of <1> to <10> corresponding to the molded part When the molding part is formed by injection into a mold having a shape of Way.

<12> A method for manufacturing an antenna comprising an antenna pattern and a matching layer having a dielectric loss tangent of 0.05 or less and covering the antenna pattern, comprising the composition according to any one of <1> to <8> and <10>, A method of manufacturing an antenna, comprising: forming a matching layer by supplying and compressing it into a mold having a shape corresponding to the matching layer, and then assembling the matching layer and the antenna pattern.

<13> The manufacturing method according to <12>, wherein a metal layer is further formed on a surface of the matching layer opposite to the antenna pattern.

<14> A molded article formed from the composition in any one of <1> to <10> by injection molding or compression molding.

<15> The molded article according to <14>, wherein the molded article is an antenna.

ADVANTAGE OF THE INVENTION According to this invention, the composition for injection molding or compression molding suitable for shaping|molding of the base|substrate with low dielectric loss tangent excellent in adhesiveness, and a high-performance antenna are obtained.

The following terms have the following meanings.

"Heat meltable polymer" means a polymer exhibiting melt fluidity, and under a load of 49 N, a temperature at which the melt flow rate is 0.1 to 1000 g/10 min at a temperature 20° C. or more higher than the melting temperature of the polymer. means the polymer in which it exists.

The "melt flow rate (MFR)" means the melt mass flow rate of a polymer as stipulated in JIS K 7210: 1999 (ISO 1133: 1997).

The "melting temperature (melting point) of a polymer" is a temperature corresponding to the maximum value of the melting peak of a polymer measured by the differential scanning calorimetry (DSC) method.

The "melt viscosity of the composition" is a value at a shear rate of 1000/sec measured in accordance with JIS K 7199:1999 (ISO1 1443: 1995).

"Average particle diameter" is a laser diffraction/scattering method by dispersing target particles (powder, filler, etc.) in water, and using a laser diffraction/scattering type particle size distribution measuring device (LA-920 measuring instrument, manufactured by Horiba, Ltd.) is analyzed and obtained by That is, the particle size distribution of the particles is measured by the laser diffraction/scattering method, a cumulative curve is obtained with the total volume of the particle population being 100%, and the point where the cumulative volume is 50% on the cumulative curve is the average particle diameter (D50) am. Further, a cumulative curve is obtained with the total volume of the particle population being 100%, and the point at which the cumulative volume is 10% on the cumulative curve is defined as D10.

"10-point average roughness (Rzjis)" is a value prescribed by Annex JA of JIS B 0601:2013.

The "permittivity" in this invention means the relative permittivity with respect to the permittivity of vacuum, also called relative permittivity.

The "unit" in the polymer may be an atomic group formed directly from a monomer by a polymerization reaction, or an atomic group in which a part of the structure is converted by treating the polymer obtained by the polymerization reaction by a predetermined method. A unit based on the monomer A contained in the polymer is also simply described as a “monomer A unit”.

The composition of the present invention contains a heat-fusible polymer (hereinafter also referred to as "F polymer") containing units based on tetrafluoroethylene (TFE), and a gas having a dielectric loss tangent of 0.05 or less (dielectric base) It is used to form by injection molding or compression molding.

Since the F polymer in the present invention exhibits good thermal meltability and its melt viscosity converges within a predetermined range, it is easily filled and molded at a high density in injection molding or compression molding. As a result, it is thought that it is difficult to form a bubble (air layer) in the base|substrate to be formed, and the fall of the dielectric characteristic by presence of a bubble was suppressed. In addition, when the composition contains a filler such as a dielectric filler, the filler tends to be uniformly and stably dispersed. As a result, it is presumed that a gas exhibiting a low dielectric loss tangent could be formed.

The dielectric loss tangent of the substrate in the present invention is 0.05 or less. The dielectric loss tangent of the substrate is preferably 0.04 or less, and more preferably 0.03 or less. The lower limit is usually 0.001.

Moreover, as a dielectric constant of the base|substrate in this invention, more than 1.5 is preferable and 2 or more are more preferable. Moreover, 3 or more are preferable and 4 or more are especially preferable. The upper limit is usually 10. The substrate in the present invention preferably has a dielectric constant greater than 1.5 and a dielectric loss tangent of 0.05 or less, more preferably a dielectric constant of 2 or more, and a dielectric loss tangent of 0.05 or less. In addition, the dielectric constant and dielectric loss tangent in this specification are values measured at 20 GHz, respectively.

The substrate in the present invention can be preferably used in order to improve antenna performance, particularly by using it as a molding part or matching layer of an antenna. Such an antenna tends to exhibit high performance (antenna gain).

Here, it is preferable that the shaping|molding part of an antenna is a member (holding member) which holds the antenna pattern comprised from a conductor. The matching layer of the antenna is a layer formed so as to cover the antenna pattern in order to suppress attenuation of the current flowing through the antenna pattern.

Each of the thicknesses of the shaping portion of the antenna and the matching layer is preferably 1 cm or less, more preferably 0.5 mm or less, and still more preferably 0.01 mm or less. The composition of the present invention is excellent in moldability and can form a molded part or matching layer having such thin dielectric properties.

The F polymer in the present invention is a heat-meltable polymer containing a TFE-based unit (TFE unit). The F polymer may be a homopolymer of TFE, or a copolymer of TFE and another monomer (comonomer) copolymerizable with TFE. In other words, the polymer F may be polytetrafluoroethylene (PTFE) as long as it exhibits thermal meltability.

The F polymer preferably has 90 to 100 mol% of TFE units with respect to all units constituting the polymer.

The fluorine content of the F polymer is preferably 70 to 76 mass%, more preferably 72 to 76 mass%. When the F polymer having a fluorine content in the above range is used, the dielectric properties of the substrate are improved (particularly, the dielectric loss tangent is reduced).

As F polymer, TFE and ethylene copolymer (ETFE), TFE and propylene copolymer, TFE and perfluoro(alkylvinyl ether) (PAVE) copolymer (PFA), TFE and hexafluoropropylene (HFP) a copolymer of (FEP), a copolymer of TFE and fluoroalkylethylene (FAE), and a copolymer of TFE and chlorotrifluoroethylene (CTFE). Moreover, these copolymers may contain the unit based on another comonomer further.

The F polymer preferably contains TFE units and PAVE units, HFP units or FAE units.

As PAVE, CF ₂ =CFOCF ₃ , CF ₂ =CFOCF ₂ CF ₃ , CF ₂ =CFOCF ₂ CF ₂ CF ₃ (PPVE), CF ₂ =CFOCF ₂ CF ₂ CF ₂ CF ₃ , CF ₂ =CFO(CF ₂ ) ₈ F is mentioned.

As FAE, CH ₂ =CH(CF ₂ ) ₂ F, CH ₂ =CH(CF ₂ ) ₃ F, CH ₂ =CH(CF ₂ ) ₄ F, CH ₂ =CF(CF ₂ ) ₃ H, CH ₂ = CF(CF ₂ ) ₄ H .

The melt viscosity of the F polymer is preferably 1×10 ² to 1×10 ⁶ Pa·s at 380°C, and more preferably 1×10 ² to 1×10 ⁶ Pa·s at 300°C. In this case, it becomes easier to injection-form the gas at a lower temperature.

260-320 degreeC is preferable and, as for the melting temperature of F polymer, 285-320 degreeC is more preferable. In this case, deterioration and deterioration of the dielectric filler can be preferably prevented.

20 g/10 min or less is preferable and, as for MFR of F polymer, 10 g/10 min or less is more preferable. In this case, it becomes easy to form the base|substrate of a more complicated shape.

The melt viscosity of the composition is preferably 50 to 1000 Pa·s and preferably 75 to 750 Pa·s at a shear rate of 1000/sec. Also in this case, it becomes easy to form the base|substrate of a more complicated shape.

Preferred specific examples of the F polymer include modified PTFE, FEP, and PFA. In addition, the modified PTFE is a copolymer of TFE and a trace amount of a comonomer (HFP, PAVE, FAE, etc.), etc., It is PTFE which shows heat meltability.

As the F polymer, an F polymer having a polar functional group is preferable. The polar functional group may be contained in the monomer unit in the F polymer, or may be contained in the terminal group of the main chain of the polymer. Examples of the latter polymer include polymers having a polar functional group as a terminal group derived from a polymerization initiator, a chain transfer agent, and the like. Moreover, the F polymer which has a polar functional group obtained by plasma-treating or ionizing F-polymer is also mentioned.

The F polymer having a polar functional group is preferably an F polymer having a monomer unit having a polar functional group (hereinafter, also referred to as a “polar unit”). The monomer which has a polar functional group used as a polar unit by polymerization is also described hereafter as "polar monomer".

As the polar functional group, a hydroxyl group-containing group, a carbonyl group-containing group, an acetal group and a phosphono group (-OP(O)OH ₂ ) are preferable. more preferably.

As the hydroxyl group-containing group, a group containing an alcoholic hydroxyl group is preferable, and -CF ₂ CH ₂ OH, -C(CF ₃ ) ₂ OH and a 1,2-glycol group (-CH(OH)CH ₂ OH) are more preferable. .

The carbonyl group-containing group is a group containing a carbonyl group (>C(O)), and examples of the carbonyl group-containing group include a carboxyl group, an alkoxycarbonyl group, an amide group, an isocyanate group, a carbamate group (-OC(O)NH ₂ ), and an acid anhydride. Preference is given to residues (-C(O)OC(O)-), imide residues (-C(O)NHC(O)-, etc.) and carbonate groups (-OC(O)O-).

Examples of the monomer having a carbonyl group-containing group include itaconic anhydride, citraconic anhydride, 5-norbornene-2,3-dicarboxylic acid anhydride (alias: hymic anhydride; hereinafter also referred to as “NAH”) and anhydride Maleic acid is more preferred.

Preferred specific examples of the F polymer having a polar functional group include F polymers having a TFE unit, an HFP unit, a PAVE unit or a FAE unit, and a unit having a polar functional group.

F polymer contains 90 to 99 mol% of TFE units, 0.5 to 9.97 mol% of units or FAE units in HFP units, PAVE units, 0.01 to 3 mol% of polar units, respectively, with respect to all units constituting the polymer it is preferable As a specific example of such F polymer, the polymer described in International Publication No. 2018/16644 is mentioned.

When the F polymer has a polar functional group (especially a carbonyl group-containing group), the adhesiveness of the substrate to other members (antenna pattern, etc.) is further improved.

It is preferable that the composition of the present invention further contains polytetrafluoroethylene (PTFE) other than the F polymer. As PTFE other than F polymer, non-heat-melting PTFE is preferable. As for this PTFE, low molecular-weight PTFE, electron-beam-treated PTFE, and gamma-ray-treated PTFE are preferable.

1 or less is preferable, 0.5 or less are more preferable, and, as for the ratio to the mass of PTFE with respect to F polymer which occupies in the composition used for forming a base|substrate by injection molding, 0.25 or less are still more preferable. The said ratio is 0.1 or more normally. In this case, the F polymer is contained in a sufficient amount with respect to PTFE, and it is easy to form a gas highly filled with the F polymer by injection molding.

1 or more is preferable, and, as for the ratio to the mass of PTFE with respect to F polymer which occupies in the composition used for forming a base|substrate by compression molding, 1.5 or more are more preferable, and 2 or more are still more preferable. The upper limit of the said ratio is 5 normally. In this case, PTFE is contained in a sufficient amount with respect to the F polymer, and not only the physical properties of PTFE excellent in compression moldability are easily expressed, but also a base material excellent in adhesiveness is easily formed.

It is preferable that the shape of F polymer in the composition of this invention is granular.

It is preferable that the shape of the F polymer in the composition used in order to form a base|substrate by injection molding is pellet shape, and it is more preferable that it is a 3-5 mm block shape. In this case, it is difficult to impair the injection moldability, and it is easy to form a base in which the F polymer is highly filled.

It is preferable that the shape of the F polymer in the composition used in order to form a base|substrate by compression molding is powdery. In the case of powder, it is preferable that the cumulative 10% diameter by volume is 0.1 to 10 μm, and the cumulative 50% diameter by volume is 0.3 to 50 μm, respectively. In this case, it is easy to form the base|substrate excellent in adhesiveness.

It is preferable that the composition of the present invention further contains a dielectric filler.

As a dielectric constant at 25 degreeC of a dielectric filler, 1.5 or more are preferable and 6 or more are more preferable. Moreover, 18 or more are preferable and 25 or more are especially preferable. The upper limit of the dielectric constant is usually 1000. When a dielectric filler having a dielectric constant in the above range is used, excellent dielectric properties (high dielectric constant and low dielectric loss tangent) can be easily imparted to the substrate. It is preferable that the composition of the present invention contains a dielectric filler having a dielectric constant of 1.5 or more, and is preferably used for forming a gas having a dielectric constant of more than 1.5 and a dielectric loss tangent of 0.05 or less by injection molding or compression molding. In addition, it is more preferable that the composition of the present invention is used to form a gas having a dielectric constant of 6 or more and a dielectric constant of 2 or more and a dielectric loss tangent of 0.05 or less by injection molding or compression molding including a dielectric filler of 6 or more.

As such a dielectric filler, either an organic dielectric filler or an inorganic dielectric filler can be used.

Examples of the organic dielectric filler include a cured product of a curable resin and a filler made of a non-curable resin. Examples of curable resins and non-curable resins include epoxy resins, polyimide resins, polyamic acids that are polyimide precursors, acrylic resins, phenol resins, liquid crystalline polyester resins, polyolefin resins, modified polyphenylene ether resins, and polyfunctional cyanate ester resins. , polyfunctional maleimide-cyanoic acid ester resin, polyfunctional maleimide resin, vinyl ester resin, urea resin, diallyl phthalate resin, melanin resin, guanamine resin, melamine-urea cocondensation resin, styrene resin, polycarbonate resin, Polyarylate resin, polysulfone, polyallyl sulfone, aromatic polyamide resin, aromatic polyetheramide, polyphenylene sulfide, polyallyl ether ketone, polyamideimide, polyphenylene ether, polybenzazole, aramid, polyethylene can

As the inorganic dielectric, a metal containing at least one metal element selected from the group consisting of magnesium, silicon, titanium, zinc, calcium, strontium, zirconium, barium, tin, neodymium, samarium, bismuth, lead, lanthanum, lithium and tantalum Oxides and glass are preferred.

Specific examples of the inorganic dielectric include barium titanate, lead zirconate titanate, lead titanate, zirconium oxide, titanium oxide, bismuth strontium tantalate, bismuth strontium niobate, and bismuth titanate.

Further, the dielectric filler may be a composite filler formed by covering the inorganic dielectric filler with a coating layer of an organic dielectric, or may be a composite filler in which inorganic dielectric particles are dispersed in the organic dielectric filler.

Further, the dielectric filler may be an inorganic dielectric ceramic (sintered body).

Examples of the low dielectric constant ceramic filler having a dielectric constant of 1.5 to 18 include powders of a sintered body of alumina, calcium carbonate and forsterite.

As a high dielectric constant ceramic filler with a dielectric constant of 100-200, the powder of the sintered compact of a rutile type titanium oxide and a calcium titanate is mentioned.

When using a ceramic filler, it is preferable to use together the powder of a low dielectric constant ceramic and the powder of a high dielectric constant ceramic from a viewpoint of suppressing the dielectric anisotropy of the base|substrate obtained by the injection molding obtained. In this case, the ratio of the latter powder to the ceramic powder is preferably 50% by volume or less. Further, from the viewpoint of arrangement of ceramic fillers in the obtained substrate, it is preferable that the particle diameter of the former powder is 1 to 7 µm, the particle diameter of the latter powder is 0.1 to 2 µm, and the particle size of the former powder is the particle size of the latter powder A larger one is preferred.

The shape of the dielectric filler may be granular, non-granular (scaly, layered), or fibrous.

Examples of the granular dielectric filler include spherical inorganic oxide fillers, and specific examples thereof include silica fillers having an average particle diameter of 1 µm or less, surface-treated with a silane coupling agent (“Admapine” series manufactured by Admatex, etc.) , zinc oxide with an average particle diameter of 0.1 μm or less (“FINEX” series manufactured by Sakai Chemical Industries, Ltd., etc.) surface-treated with an ester such as propylene glycol dicaprate, spherical fused silica with an average particle diameter of 0.5 μm or less and a maximum particle diameter of less than 1 μm (SFP grade manufactured by Denka Corporation, etc.), rutile titanium oxide with an average particle diameter of 0.5 μm or less coated with a polyhydric alcohol and inorganic material (“Taipeik” series manufactured by Ishihara Industrial Co., Ltd., etc.), surface-treated with an average particle diameter of 0.1 and rutile-type titanium oxide ("JMT" series manufactured by Teika Corporation, etc.) of micrometers or less.

As a specific example of a flaky dielectric filler, a flaky boron nitride filler is mentioned. The particle diameter is preferably 30 to 100 µm, and the aspect ratio is preferably 10 to 100.

When the fibrous filler is an organic dielectric, the fiber length is 0.5 to 10 mm, and the fiber diameter is preferably 5 to 20 µm, respectively.

Specific examples of such a fibrous filler include polybenzazole fibers, para-aramid fibers, polyarylate fibers, and high molecular weight polyethylene.

When the fibrous filler is glass fiber, the fiber length is preferably 10 µm to 5 mm. Further, the cross-sectional shape may be any of a perfect circle, a cocoon, an ellipse, a semicircle, a polygon, and a star, and a perfect circle is preferable. Further, the aspect ratio (ratio of the fiber length to the diameter of the cross section perpendicular to the longitudinal direction of the fiber) is preferably 10 to 600.

It is preferable to use a dielectric filler having a microstructure as the dielectric filler from the viewpoint of densely and uniformly dispersing the dielectric filler to obtain a substrate having superior dielectric properties.

As a preferable aspect of the inorganic filler which has such a microstructure, a spherical filler with an average particle diameter of 2 micrometers or less, and 30 micrometers or less in length, and a fibrous filler with a diameter of 2 micrometers or less are mentioned.

0.05-5 micrometers is preferable and, as for the average particle diameter of the former dielectric filler, 0.1-3 micrometers is more preferable. In this case, the dielectric filler tends to be more uniformly dispersed in the molten injection molding material and the substrate.

In the latter dielectric filler, the length is the fiber length and the diameter is the fiber diameter. 1-30 micrometers is preferable and, as for the fiber length, 10-20 micrometers is more preferable. 0.1-1 micrometer is preferable and, as for a fiber diameter, 0.3-0.6 micrometer is more preferable.

The ratio of the mass of the dielectric filler to the F polymer in the composition is preferably 1/10 to 1/1, more preferably 1/8 to 1/2, and still more preferably 1/6 to 1/3. . In this case, the dielectric properties of the substrate are more likely to be improved.

The specific proportion of the F polymer in the composition is preferably 10 to 80 mass%, more preferably 25 to 75 mass%, still more preferably 50 to 70 mass%.

Further, the specific proportion of the dielectric filler in the composition is preferably 20 to 90% by mass, more preferably 25 to 75% by mass, and still more preferably 30 to 50% by mass.

In addition, the composition of the present invention is a thixotropic agent, an antifoaming agent, a silane coupling agent, a dehydrating agent, a plasticizer, a weathering agent, an antioxidant, a heat stabilizer, a lubricant, an antistatic agent, It may contain a whitening agent, a coloring agent, a electrically conductive agent, a mold release agent, a surface treatment agent, a viscosity modifier, and a flame retardant.

Examples of uses for the substrate produced from the composition of the present invention include electrical/electronic components such as antennas, connectors, sockets, relay components, coil bobbins, optical pickups, oscillators, printed wiring boards, computer-related components, and semiconductors such as IC trays and wafer carriers. Manufacturing process-related parts, parts for household appliances such as VTRs, televisions, irons, air conditioners, stereos, vacuum cleaners, refrigerators, cookers, and lighting fixtures, parts for lighting fixtures such as lamp reflectors and lamp holders, compact discs, laser discs ( (registered trademark), parts for sound products such as speakers, ferrules for optical cables, parts for communication devices such as telephones, facsimiles, and modems, parts related to copiers such as separation tanks and heater holders, impellers, fan gears, gears, bearings, motors Mechanical parts such as parts and cases, automobile instrument parts, engine parts, engine room parts, electronic parts, automobile parts such as interior parts, microwave cooking pots, cooking utensils such as heat-resistant tableware, floor materials, wall materials, etc. of insulation and soundproofing members, support members such as beams and columns, building materials such as roofing materials or civil construction materials, aircraft, space aircraft, space equipment components, radiation facility members such as nuclear reactors, marine facility members, cleaning jigs, Optical device parts, valves, pipes, nozzles, filters, membranes, medical device parts, sensor parts, sanitary equipment, etc. are mentioned.

Among them, an antenna (especially a small antenna) is preferable for the use of the base in the present invention. Specific examples of such an antenna include: I: an antenna pattern, an antenna having a dielectric constant of 2 or more and a dielectric loss tangent of 0.05 or less, and a molded part having an antenna pattern (the former antenna), and II: an antenna pattern and a dielectric constant 2 or more and an antenna having a dielectric loss tangent of 0.05 or less and including a matching layer covering the antenna pattern (the latter antenna).

The former antenna is preferably manufactured by injecting the composition of the present invention into a mold having a shape corresponding to the molded part to form the molded part.

At this time, the antenna may be manufactured by outer molding in which the body and the antenna pattern are separately produced and then assembled (inserted), or in a state in which the antenna pattern is arranged in the molding die, the molding material is injected into the molding die. You may manufacture by insert molding, and it is preferable to manufacture by the latter insert molding.

According to the insert molding, an antenna in which the antenna pattern and the base are highly adhered is obtained. Such an antenna is excellent in performance and also has good durability.

What is necessary is just to set the heating temperature at the time of injection molding to the temperature more than melting|fusing point of F polymer, Specifically, 300-400 degreeC is preferable and 320-380 degreeC is more preferable.

Moreover, an antenna may have only one antenna pattern, and may have it two or more.

The latter antenna is manufactured by supplying and compressing the composition of the present invention into a mold having a shape corresponding to the matching layer to form a matching layer, and then assembling (inserting) the matching layer and the antenna pattern. it is preferable

As described above, the molded article formed by injection molding or compression molding from the composition of the present invention has excellent dielectric properties and is useful as an antenna.

A metal layer may be further formed on the surface of the antenna obtained by the present invention (the surface on the opposite side to the antenna pattern of the base body (hereinafter also referred to as "antenna surface")). A metal layer may be formed by the vapor-phase film-forming method, and may be formed by the metal plating method.

Examples of the metal constituting the metal layer include copper, copper alloy, stainless steel, nickel, nickel alloy (including alloy 42), aluminum, and aluminum alloy.

1-50 micrometers is preferable and, as for the thickness of a metal layer, 10-25 micrometers is more preferable. If it is a metal layer of such a thickness, it is easy to use for various uses, suppressing the curvature of the whole antenna.

Moreover, according to the former method, it is easy to form the metal layer which is uniform and excellent in adhesiveness with the antenna surface. As a vapor-phase film-forming method, a sputtering method, a vacuum vapor deposition method, the ion plating method, and the laser ablation method are mentioned, A sputtering method is preferable.

The metal layer may form the polymer layer side part (1st part) by the vapor-phase film-forming method, and may form the remaining part (2nd part) by electroplating etc.

In particular, as for the metal layer, it is preferable to form a 1st part by the vapor-phase film-forming method (especially sputtering method), and to form a 2nd part by the electrolytic plating method.

Specifically, it is preferable to form the metal layer by forming a first portion of the nm order by sputtering, using this first portion as a seed layer, and growing it to the micrometer order by electrolytic plating.

Moreover, in a 1st part, it is preferable that the metal crystal structure forms the columnar structure.

0.1 micrometer or more is preferable and, as for the 10-point surface roughness of the antenna surface, 1 micrometer or more is more preferable. As for said 10-point surface roughness, 20 micrometers or less are preferable. If the surface of the antenna has such a surface roughness, it is easy to firmly adhere and laminate the metal layer to the surface of the antenna. Since the base forming the antenna surface in the present invention is formed from the composition of the present invention by an injection molding method or a compression molding method, the surface roughness thereof can be easily controlled within such a desired range.

In addition, when the composition of the present invention contains a dielectric filler, particularly a dielectric filler containing a metal oxide, the metal layer is easily adhered and laminated to the antenna surface.

An antenna in which a metal layer is formed on the surface of the antenna may be further subjected to etching to form a transmission circuit in the metal layer, or may be subjected to soldering to be processed. Since the metal layer on the surface of the antenna is firmly adhered and laminated and is excellent in heat resistance (solder reflow property) and chemical resistance, in these treatments, the metal layer and the antenna are hardly peeled off.

3 N/cm or more is preferable, as for the peeling strength with respect to the antenna surface of a metal layer, 5 N/cm or more is more preferable, 10 N/cm or more is still more preferable. In addition, the upper limit of peeling strength is 25 N/cm normally.

In addition, the peeling strength means that the surface of the antenna on which the metal layer is formed is cut into a rectangular shape (length 100 mm, width 10 mm), a position of 50 mm from one end in the longitudinal direction is fixed, a tensile speed of 50 mm/min, This is the maximum load (N/cm) applied when the surface of the antenna and the metal layer are peeled off at 90° with respect to the piece cut from one end.

As mentioned above, although the composition of this invention, the manufacturing method of an antenna, and a molded article were demonstrated, this invention is not limited to the structure of the above-mentioned embodiment.

For example, in the structure of the said embodiment, the composition and molded article of this invention may further have another arbitrary structure, and may be substituted with arbitrary structures which exhibit the same function.

Moreover, in the structure of the said embodiment, the manufacturing method of the antenna of this invention may further have other arbitrary processes, and may substitute arbitrary processes which generate|occur|produce the same effect|action.

Example

Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to these.

1. F polymer

F Polymer 1: TFE unit, PPVE unit and NAH unit, in this order, containing 98.0 mol%, 1.9 mol%, 0.1 mol%, a polymer having a polar functional group (melting point: 300 ° C, melt viscosity: 1 × 10 ³ Pa s, MFR: 8 g/10 min)

2. Dielectric Filler

Filler 1: barium titanate fiber (fiber length: 20 μm, fiber diameter 1.5 μm)

Filler 2: Glass fiber (Cross-sectional shape: circular shape, fiber length: 3 mm, fiber diameter 11 µm, "CS-3J-256" manufactured by Nitto Spinning Co., Ltd.)

Filler 3: boron nitride filler (scaly, particle diameter: 35 mm, aspect ratio: 30, "XGP" manufactured by Denka Corporation)

Filler 4: polybenzazole fiber (fiber length: 1 mm, fiber diameter: 12 µm, “Xylon” manufactured by Toyobo Corporation)

Filler 5: spherical silica filler (surface-treated product with an aminosilane coupling agent, average particle diameter: 0.5 µm, "Admapine SO-C2" manufactured by Admatex Co., Ltd.)

3. Composition

Composition 1: 66 parts by mass of F polymer 1 and 34 parts by mass of filler 1 were melt-kneaded using a twin-screw extruder set at a cylinder temperature of 340° C. Then, the pellet obtained by cutting to about φ2 × 5 mm

Composition 2: Powder obtained by dry blending 66 parts by mass of F polymer 1 powder (average particle diameter: 20 µm) and 34 parts by mass of filler 1

Composition 3: Pellets obtained in the same manner as in Composition 1 except that 70 parts by mass of F polymer 1 powder (average particle diameter: 50 µm), 10 parts by mass of filler 2 and 20 parts by mass of filler 3 were used.

Composition 4: Pellets obtained by melt-kneading 90 parts by mass of F polymer 1 powder (average particle diameter: 50 µm) and 10 parts by mass of filler 4 using a Labo plastomer apparatus.

Composition 5: Pellets obtained by melt-kneading 60 parts by mass of F polymer 1 powder (average particle diameter: 50 µm) and 40 parts by mass of filler 5 using a Labo plastomer apparatus.

Composition 6: Pellets obtained in the same manner as in Composition 1 except that 90 parts by mass of F polymer 1 powder (average particle diameter: 50 µm) and 10 parts by mass of filler 3 were used.

4. Molding example of composition

Hereinafter, the dielectric constant and dielectric loss tangent of the substrate were measured by the cavity resonator perturbation method (measurement frequency: 20 GHz) using a network analyzer as a measuring instrument.

4-1. injection molding example

After injecting|throwing-in the composition 3 and melting|fusing at 320 degreeC, it injection-molded in the side gate of (phi)3mm of the metal molding die, and the base|substrate (dielectric base|substrate) which has a sheet|seat part was obtained. The substrate having this metal layer had a dielectric constant of 3.0 and a dielectric loss tangent of 0.0019.

A base was obtained in the same manner as above except that the composition 4 was used instead of the composition 3. The dielectric constant was 2.3, the dielectric loss tangent was 0.0016, and the coefficient of linear expansion was 79 ppm/°C.

A base was obtained in the same manner as above except that composition 5 was used instead of composition 3. The permittivity was 2.6, the dielectric loss tangent was 0.0010, and the coefficient of linear expansion was 134 ppm/°C.

A base was obtained in the same manner as above except that the composition 6 was used instead of the composition 3. The dielectric constant was 2.3, the dielectric loss tangent was 0.0010, and the coefficient of linear expansion was 200 ppm/°C or less.

5. Antenna manufacturing example

5-1. An example of manufacturing an antenna by injection molding

The composition 1 is put into an injection molding machine, melted at 320° C., and then injection molded into a φ3 mm side gate of a metal molding mold into which an antenna pattern made of copper foil is inserted, and an antenna pattern and a base having it (dielectric gas) ) to obtain an antenna having

The dielectric constant of the substrate was 4.0, and the dielectric loss tangent was 0.03. Further, in the antenna, the interface between the antenna pattern and the base had high adhesiveness and was strongly adhered.

5-2. An example of manufacturing an antenna by compression molding

The composition 2 is put into a compression molding machine, and is compression molded under the conditions of a temperature of 380° C. and a compression pressure of 17 MPa, and a matching layer having a shape covering the antenna pattern (tablet shape with a thickness of 0.03 cm, dielectric constant: 4.0, dielectric loss tangent: 0.03) has formed This matching layer was sandwiched in the antenna pattern to obtain an antenna including the matching layer.

5-3. Formation example of metal layer

A nickel-chromium alloy layer (thickness: 20 nm, nickel content 80%, chromium content) on the surface (surface opposite to the antenna pattern) of the base of the antenna obtained in "5-1" above using a vacuum sputtering device 20%) and a copper layer (thickness: 100 nm) were formed in this order. Further, a copper layer (thickness: 16 µm) was formed on the seed copper layer by copper sulfate plating, and a metal layer was formed on the surface of the antenna. This metal layer was firmly adhered to the surface of the antenna, and was excellent in heat resistance (solder reflow property) when a transmission circuit was formed thereon.

Industrial Applicability

The composition of the present invention is excellent in injection moldability or compression moldability, and can be suitably used for production of various parts (members) including electric and electronic parts, especially antenna bases.

In addition, the entire contents of the specification, claims, and abstract of Japanese Patent Application No. 2019-157041 filed on August 29, 2019 and Japanese Patent Application No. 2019-187947 filed on October 11, 2019 are incorporated herein by reference, , is to be taken as a disclosure of the specification of the present invention.

Claims (15)

A composition comprising a heat-fusible polymer containing units based on tetrafluoroethylene and used for forming a gas having a dielectric loss tangent of 0.05 or less by injection molding or compression molding. The method of claim 1,
The composition, wherein the base is a molded part or matching layer of the antenna. 3. The method of claim 1 or 2,
The composition, wherein the base is a molding part or a matching layer of the antenna, and the thickness of the molding part or the matching layer is 1 cm or less. 4. The method according to any one of claims 1 to 3,
further comprising a dielectric filler having a dielectric constant of 1.5 or greater, wherein the dielectric constant of the substrate is greater than 1.5. 5. The method of claim 4,
The composition wherein the dielectric filler is a spherical filler having an average particle diameter of 2 µm or less, or a fibrous filler having a length of 30 µm or less and a diameter of 2 µm or less. 6. The method according to claim 4 or 5,
The composition, wherein the ratio of the ratio of the dielectric filler to the ratio of the heat-meltable polymer in the composition to the mass is 1/10 to 1/1. 7. The method according to any one of claims 1 to 6,
The composition wherein the heat-meltable polymer contains units based on perfluoro(alkylvinylether), hexafluoropropylene or fluoroalkylethylene. 8. The method according to any one of claims 1 to 7,
Further comprising polytetrafluoroethylene. 9. The method according to any one of claims 1 to 8,
Further, it contains polytetrafluoroethylene, and the ratio of the mass of the polytetrafluoroethylene to the ratio of the heat-fusible polymer in the composition is 1 or less, in order to form the base by injection molding used, the composition. 10. The method according to any one of claims 1 to 9,
Further, it contains polytetrafluoroethylene, and the ratio of the mass of the polytetrafluoroethylene to the ratio of the heat-fusible polymer occupied in the composition is 1 or more, and in order to form the gas by compression molding used, the composition. 10. A method of manufacturing an antenna comprising an antenna pattern and a molded part having a dielectric loss tangent of 0.05 or less, wherein the composition according to any one of claims 1 to 9 is applied to a shape corresponding to the molded part. When the molding part is formed by injection into a mold having 11. A method for manufacturing an antenna comprising an antenna pattern and a matching layer having a dielectric loss tangent of 0.05 or less and covering the antenna pattern, wherein the composition according to any one of claims 1 to 8 and 10 is added to the matching layer. A method of manufacturing an antenna, comprising: forming a matching layer by supplying and compressing it into a mold having a shape corresponding to , and then assembling the matching layer and the antenna pattern. 13. The method of claim 12,
A method of manufacturing an antenna, further comprising forming a metal layer on a surface of the matching layer opposite to the antenna pattern. A molded article formed from the composition according to any one of claims 1 to 10 by injection molding or compression molding. 15. The method of claim 14,
The molded article is an antenna.