KR20220049043A - Reconfigurable mainframe with replaceable interface plate - Google Patents

Abstract

A mainframe of a device fabrication system includes a base, a plurality of facets on the base, and a cover over the plurality of facets. A first facet of the plurality of facets includes a frame. The base, the lid and the plurality of facets together define an interior volume containing the robotic arm. A first replaceable interface plate is attached to the first frame of the first facet. The first replaceable interface plate includes a plurality of substrate access ports. A first one of the plurality of substrate access ports is configured to provide access to the robot arm to the first process chamber. A second one of the plurality of substrate access ports is configured to provide access to the robot arm to a second process chamber.

Description

RECONFIGURABLE MAINFRAME WITH REPLACEABLE INTERFACE PLATE

[0001] BACKGROUND Embodiments of the present disclosure relate generally to electronic device manufacturing systems, and more particularly to a reconfigurable mainframe of an electronic device manufacturing system that includes a replaceable interface plate. Embodiments also relate to replaceable interface plates for mainframes.

[0002] Conventional electronic device manufacturing systems (also referred to as device manufacturing systems) may include a mainframe around which a number of process chambers and load lock chambers are arranged. A mainframe may have multiple sidewalls (generally referred to as “facets”) to which process chambers and/or load lock chambers are coupled. The facets of conventional mainframes are machined to have a pre-arranged configuration with substrate access ports having predetermined sizes, positions, and the like. Once a conventional mainframe is manufactured, the type, size, arrangement and location of the substrate access ports are fixed to that mainframe. If the owner of the mainframe wants a new configuration, a new mainframe with the new configuration is purchased.

[0003] According to a first aspect of the present disclosure, a mainframe of a device fabrication system includes a base, a plurality of facets on the base, and a cover over the plurality of facets. A first facet of the plurality of facets includes a first frame. The base, the lid and the plurality of facets together define an interior volume containing the robotic arm. A first replaceable interface plate is attached to the first frame of the first facet. The first replaceable interface plate includes a plurality of substrate access ports. A first one of the plurality of substrate access ports is configured to provide access to the robot arm to the first process chamber. A second one of the plurality of substrate access ports is configured to provide access to the robot arm to a second process chamber. In one embodiment, the first replaceable interface plate supports a load and the frame does not support a load.

[0004] According to a second aspect of the present disclosure, the replaceable interface plate is configured to be attached to a facet of a mainframe. The replaceable interface plate includes a plurality of substrate access ports. A first one of the plurality of substrate access ports is configured to provide access from the mainframe to the first process chamber. A second one of the plurality of substrate access ports is configured to provide access from the mainframe to the second process chamber. Replaceable interface plates support the load on the mainframe. Accordingly, the replaceable interface plate is configured to withstand vertical forces to the mainframe caused by pressure differences between the interior volume of the mainframe and the exterior of the mainframe.

[0005] According to a third aspect of the present disclosure, a method of configuring a mainframe includes determining a first plurality of process chambers to be coupled to a first facet of the mainframe, on a facet to receive the first plurality of process chambers. determining positions of the plurality of substrate access ports; determining a configuration of a first replaceable interface plate having one of the plurality of substrate access ports at each of the positions; and manufacturing the first replaceable interface plate. includes The method further includes attaching a first replaceable interface plate to a first facet of the mainframe, and attaching a plurality of process chambers to the first replaceable interface plate, each of the plurality of process chambers comprising a plurality of accessible from the mainframe through one of the substrate access ports of This method may be performed after the mainframe has already been manufactured (eg, to change the configuration of the mainframe).

This disclosure is illustrated by way of example and not limitation in the illustrations of the accompanying drawings in which like references indicate like elements. It should be noted that different references to “a” or “an” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
1A illustrates a schematic top view of an electronic device manufacturing system having a reconfigurable mainframe having a first configuration, in accordance with an embodiment of the present disclosure;
1B illustrates a schematic top view of an electronic device manufacturing system having a reconfigurable mainframe having a second configuration, in accordance with an embodiment of the present disclosure;
1C illustrates a schematic top view of an electronic device manufacturing system having a reconfigurable mainframe having a third configuration, in accordance with an embodiment of the present disclosure;
2A illustrates a perspective view of a reconfigurable mainframe in accordance with an embodiment of the present disclosure;
2B illustrates a side view of a first exemplary replaceable interface plate in accordance with an embodiment of the present disclosure;
2C illustrates a side view of a second exemplary replaceable interface plate in accordance with an embodiment of the present disclosure;
2D illustrates a side view of a third exemplary replaceable interface plate in accordance with an embodiment of the present disclosure;
3 shows a cross-sectional side view of a mainframe and an attached replaceable interface plate, taken at the location of a substrate access port, in accordance with an embodiment of the present disclosure;
4 shows a cross-sectional side view of the mainframe and an attached replaceable interface plate, taken at the position of a post of the frame of the mainframe, in accordance with an embodiment of the present disclosure;
5 illustrates a process for assembling a reconfigurable mainframe of an electronic device manufacturing system, in accordance with an embodiment of the present disclosure;

[0017] Embodiments relate to a reconfigurable mainframe (also referred to as a transfer chamber) having one or more replaceable interface plates. The reconfigurable mainframe includes a plurality of facets, wherein at least one of the facets includes a frame configured to receive a replaceable interface plate. In one embodiment, the reconfigurable mainframe includes a frame for each facet of the reconfigurable mainframe. A replaceable interface plate may be attached to each of the frames. A cover may be positioned over the frames of facets and secured to the replaceable interface plates. In embodiments, the replaceable interface plates support a load and the frames do not support a load. Thus, when the internal volume of the mainframe is pumped down to vacuum, vertical forces (and horizontal forces) are maintained by the replaceable interface plates, but little or no forces are applied to the frames.

[0018] In some embodiments, the mainframe may have a square or rectangular shape. One or more load lock chambers may be coupled to one facet of the mainframe. In one embodiment, one or more load lock chambers are coupled to a replaceable interface plate on one facet of the mainframe. In one embodiment, additional replaceable interface plates are coupled to one or more additional facets of the mainframe, and one or more process chambers are coupled to some or all of the additional replaceable interface plates. The process chambers may perform a variety of substrate processes, and the process chambers coupled to different replaceable interface plates on the facets may be of different sizes, may have different sized substrate access ports, and may have different connection types. and can have different heights, and so on. For example, some substrate access ports may include heights to accommodate two end effectors at different pitches. Additionally, each replaceable interface plate may be configured to couple to the same or a different number of process and/or load lock chambers. For example, one replaceable interface plate may be configured to be coupled to a single process chamber of a first size, and a second replaceable interface plate may be configured to be coupled to each of two process chambers of a second size different from the first size. It is an expression that can be configured to be combined. One or more substrate access ports on each replaceable interfacial plate may interfaceally couple each of the load lock and process chambers with the transfer chamber to allow substrates to be transferred therebetween. The substrate access ports may be sized and positioned on each replaceable interface plate to accommodate a number and size of chambers that may be coupled to each facet. Electronic device manufacturing systems having such a mainframe may allow a broader and more diverse sequence of substrate processes to be performed in a single system, improving the versatility, performance, and/or efficiency of such electronic device manufacturing systems. In other aspects, methods of assembling an electronic device manufacturing system are provided.

[0019] The reconfigurable mainframe and replaceable interface plates disclosed in the embodiments provide a number of advantages over conventional mainframes. Conventional mainframes have a single design that is determined at manufacturing time. The single design has a fixed number of substrate access ports with a fixed size and a fixed position. If at any time it is advantageous to change the configuration of this conventional mainframe, the available option is to purchase a new mainframe with the new configuration. In contrast, a reconfigurable mainframe can be reconfigured at any time by making new interchangeable interface plates. If the new configuration is advantageous, one or more new replaceable interface plates with the new configuration can be manufactured. The existing replaceable interface plates can then be removed from the mainframe and new replaceable interface plates can be attached to the mainframe. Accordingly, the flexibility of mainframes in embodiments is significantly improved. In addition, new process chambers become available, new slit valve technologies are developed (eg, light emitting diodes (LEDs), lasers and As new local center finding (LCF) techniques are developed (using other scanning methods), the useful life of the mainframes is reduced because the mainframes can be updated with new replaceable interface plates. can be increased. Old replaceable interface plates with outdated slit valve technologies, outdated local center finding techniques, etc. can be exchanged for, for example, new replaceable interface plates with new slit valve technologies and/or new local centroid finding techniques. there is.

[0020] As used herein, singular forms include plural references unless the context clearly dictates otherwise. Thus, for example, reference to “a substrate” includes a single substrate (eg, a single wafer) as well as a mixture of two or more substrates; Reference to “a process chamber” includes a process chamber as well as a mixture of two or more process chambers, and the like.

[0021] As used herein, the term "about" in the context of a measured quantity refers to the normal variation in the measured quantity as expected by one of ordinary skill in the art in the performance and exercise of a certain level of interest and precision of the measuring instrument. means to hear In certain embodiments, the term “about” will include the recited number ±10%, and “about 10” will include 9-11.

[0022] Unless otherwise indicated herein, recitation of ranges of values herein are merely intended to serve as a shorthand method of individually referencing each individual value falling within the range, and each individual value falling within the range is intended to serve only as a shorthand method. Values are incorporated into the specification as if they were individually recited herein. All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. Use of any and all examples or illustrative language (eg, “such as”) provided herein is intended merely to clarify particular materials and methods, and is not intended to be limiting in scope. No language in the specification should be construed as indicating any non-claimed element essential to the practice of the disclosed materials and methods.

[0023] 1A-1C illustrate schematic top views of an electronic device manufacturing system having a reconfigurable mainframe. 1A illustrates a schematic top view of a first configuration 100A of an electronic device manufacturing system, in accordance with an embodiment of the present disclosure. 1B illustrates a schematic top view of a second configuration 100B of an electronic device manufacturing system, in accordance with an embodiment of the present disclosure. 1C illustrates a schematic top view of a third configuration 100C of an electronic device manufacturing system, in accordance with an embodiment of the present disclosure.

[0024] An electronic device manufacturing system is configured to process substrates and may include a mainframe 104 (also referred to as a transfer chamber) having four facets 101A-D. Although four facets 101A-D are illustrated in a rectangular configuration, mainframe 104 may have a different number of (eg, 5 facets, 6 facets, 7 facets, 8 facets, etc.) It may alternatively have facets and/or other shapes. The facets may have the same sizes (eg, the same widths) or different widths in embodiments. In one embodiment, mainframe 104 has a rectangular shape, facets 101A, 101C are approximately parallel to each other, facets 101B, 101D are approximately parallel to each other, and facets 101A, 101C are approximately perpendicular to facets 101B and 101D. In one embodiment, facets 101B, 101D have a first length that is at least twice the second length of facets 101A, 101C. In one embodiment, facets 101B, 101D have a length of about 100-150 inches, and facets 101A, 101C have a length of about 40-60 inches. In one embodiment, the mainframe 104 has a pentagonal shape. In one embodiment, the mainframe comprises a first facet having a first length, second facets on opposite sides of the first facet and a third facet, each of the second facet and the third facet having a second length greater than the first length having—a fourth facet and a fifth facet connected to the second facet and the third facet, respectively, each having a third length that is greater than or equal to the first length and less than the second length.

[0025] Mainframe 104 may include an interior volume 134 , and facets 101A-D may define sidewalls of interior volume 134 . Mainframe 104 may further include a base (not shown) and a cover (not shown). Facets 101A-D, base and lid together may define an interior volume 134 . A robotic arm 136 (also referred to as a robotic assembly) may be disposed within the interior volume 134 of the mainframe 104 . The interior volume 134 may typically be under vacuum during operation of the mainframe 104 .

[0026] Each of the facets 101A-D may include a frame and may attach a replaceable interface plate to the frame. Alternatively, the subset of facets 101A-D may include frames to which interchangeable interface plates are attached. Other facets may be manufactured in a conventional manner with embedded sidewalls having a fixed configuration. For each facet having a frame rather than a fixed configuration, a replaceable interface plate may be attached to the frame of the facet and form the sidewalls of the facet. The existing replaceable interface plate attached to the facet can be removed at any time, and a new replaceable interface plate with a different design can be attached to the facet. The mainframe 104 is thus a reconfigurable mainframe with a flexible design.

[0027] 1A , replaceable interface plate 128A is attached to facet 101B, replaceable interface plate 129 is attached to facet 101C, and replaceable interface plate 130A is attached to facet 101D and replaceable interface plate 131 is attached to facet 101A. Replaceable interface plate 128A has three substrate access ports 132 . Each substrate access port 132 may be configured to allow a horizontally oriented substrate 140 to pass therethrough. Substrate 140 may be a wafer (eg, a semiconductor wafer or non-semiconductor device substrate), a glass plate or panel, and/or other workpiece used to manufacture electronic devices or circuit components. Each substrate access port 132 can be, for example, an elongate slot or slit formed in the sidewall of the mainframe 104 or in the replaceable interface plates 128A, 130A, each having, for example, a substrate access port 132 in it. It may include a slit valve or other suitable device for opening and closing and/or a local center finder (LCF) suitable for determining the position of the substrate 140 being transferred through the substrate access port 132 . . The slit valves may be of any suitable conventional configuration, such as, for example, L-motion slit valves. Other suitable devices may also be used to open and close the substrate access ports 132 . Substrate access ports 132 may in embodiments be single gates or (eg, a first gate on the inside of the replaceable interface plate at the substrate access port and a second gate on the outside of the replaceable interface plate at the substrate access port) with) double gates.

[0028] Three process chambers 106 , 108 , 110 are attached to replaceable interface plate 128A. Each of the process chambers 106-110 has a chamber port aligned with a substrate access port 132 in the replaceable interface plate 128A.

[0029] Replaceable interface plate 130A has three substrate access ports 132 . Three process chambers 112 , 114 , 116 are attached to replaceable interface plate 130A. Each of the process chambers 112 - 116 has a chamber port aligned in line with a substrate access port 132 in the replaceable interface plate 130A.

[0030] Replaceable interface plate 129 is a solid plate without substrate access ports. Replaceable interface plate 131 includes two substrate access ports 132 . Replaceable interface plate 131 is coupled to one or more load lock chambers 126 (which may include, for example, two side-by-side load lock chambers). The load lock chambers 126 each have a chamber port aligned with one of the substrate access ports in the replaceable interface plate 129 .

[0031] Each of the load lock chambers 126 may be a single substrate type or a batch type of load lock chamber. In some embodiments, the load lock chamber 126 may be a stacked load lock chamber. For example, the load lock chamber 126 may be a double stacked load lock chamber, a triple stacked load lock chamber, a load lock chamber having four or more stacked load locks (eg, a quadruple load lock chamber), or the like. Alternatively, the load lock chamber 126 may be a single volume load lock chamber. Each of the load lock chambers 126 may have one or more chamber ports corresponding to a respective substrate access port 132 . For example, a stacked load lock chamber 126 , which may have two separate substrate volumes, may have two vertically aligned chamber ports, each corresponding to the vertically aligned substrate access ports 132 . A triple stacked load lock chamber, which may have three separate substrate volumes, may have three vertically aligned chamber ports corresponding to the vertically aligned substrate access ports. Single volume load lock chambers may have a single chamber port corresponding to a single substrate access port 132 . Any one or more of the load lock chambers 126 may be a stacked load lock chamber, a triple stacked load lock chamber, and/or a single volume load lock chamber. Also, in some embodiments, any one or more of the load lock chambers 126 may be a processable chamber. That is, any one or more of the load lock chambers 126 , or any of the volumes located therein, may be capable of performing a substrate preheat process, abatement process, cooling process, and/or other processing process.

[0032] Mainframe 104 , process chambers 106-116 and/or load lock chambers 126 may each operate at vacuum pressure. Each of the process chambers 106-116 may perform the same or a different process on the substrate 140 including, for example, deposition, oxidation, nitridation, etching, polishing, cleaning, lithography, inspection, and the like. Other processes may also be performed therein.

[0033] The mainframe 104 may also include a robotic assembly 136 in an interior volume 134 . The robotic assembly 136 transfers one or more substrates 140 to and from each process chamber 106-116 and load lock chamber 126 , respectively. can be configured to The robot assembly 136 may be configured to transfer substrates 140 directly from any one chamber to any other chamber attached to the mainframe 104 . In some embodiments, substrates 140 may be transported by robot assembly 136 in any sequence or orientation. In some embodiments, the robot assembly 136 includes dual transport blades (or more transport blades, also referred to as end effectors) each independently protruding into and retractable from any chamber attached to the mainframe 104 . ), thereby increasing system throughput by enabling simultaneous substrate transfers. In some embodiments, the robotic assembly 136 may have a single transport blade and/or may be a selective compliance articulated robot arm (SCARA) robot. Alternatively, the robot assembly 136 may be any suitable mechanism for transferring substrates between chambers attached to the mainframe 104 , such as a linear robot or a non-linear robot.

[0034] The load lock chambers 126 may be coupled to a factory interface 102 , which may be coupled to one or more front opening unified pods (FOUPs) 118 . The one or more load lock chambers 126 may provide a first vacuum interface between the factory interface 102 and the transfer chamber 126 . In some embodiments, each of the load lock chambers 126 may increase substrate throughput by alternately communicating with the mainframe (transfer chamber) 104 and the factory interface 102 . That is, one load lock chamber 126 , or any one volume of the stacked or triple stacked load lock chamber, communicates with the transfer chamber 104 , while other load lock chambers 126 , or stacked or triple stacked stacked volumes, are in communication with the transfer chamber 104 . Other volumes of the load lock chamber may communicate with the factory interface 102 . Substrate transfers between the factory interface 102 and the load lock chambers 126 and the transfer chamber 104 may occur in any other suitable manner.

[0035] Each of the FOUPs 118 may be a container having a holding cassette therein for holding multiple substrates. The FOUPs 118 may each have a front open interface configured for use with the factory interface 102 . Factory interface 102 may be configured to transport substrates 140 via a buffer chamber (not shown) and linear, rotational and/or vertical movement between FOUPs 118 and load lock chambers 126 . may have robot assemblies 138 . Substrates may be transferred between the FOUPs 118 and the load lock chambers 126 in any sequence or orientation. Each of the load lock chambers 126 may be a single substrate type or a batch type of load lock chamber.

[0036] A controller 171 may control operation of the robotic assembly 138 , the robotic assembly 136 , and/or the electronic device manufacturing system. The controller 171 may control the processing and transfer of substrates 140 within and through the electronic device manufacturing system. The controller 171 may be, for example, a general purpose computer and/or a microprocessor or other suitable central processing unit (CPU), memory for storing software routines for controlling the electronic device manufacturing system, input/output peripherals, and ( support circuits (such as, for example, power supplies, clock circuits, circuits for driving the robot assembly 138 , 136 , cache, etc.). The controller 171 may be programmed to sequentially process one or more substrates, eg, through each of the process chambers attached to the mainframe 104 . In other embodiments, the controller 171 may be programmed to process the substrate in any order through the process chambers. In still other embodiments, the controller 171 may be programmed to skip and/or repeat processing of one or more substrates in one or more process chambers. Alternatively, controller 171 may be programmed to process one or more substrates in an electronic device manufacturing system in any suitable manner.

[0037] The electronic device manufacturing system may have any suitable number of FOUPs 118 and/or load lock chambers 126 other than those shown. In some embodiments, the number of load lock chambers coupled to facet 101A may be independent of the number of process chambers coupled to any of facets 101B-D. For example, the number of load lock chambers may differ from the greatest number of process chambers coupled to the facet. Also, in some embodiments, depending on the size of the mainframe 104 relative to the size(s) of the four process chambers, up to four process chambers may be combined in a single facet, or more than four process chambers It can be coupled to a single facet.

[0038] 1B illustrates the same FOUPs 118 , factory interface 102 , loadlocks 126 and mainframe 104 as shown in FIG. 1A . However, in FIG. 1B , replaceable interface plate 128A has been removed from facet 101B, and replaceable interface plate 128B has been attached to facet 101B. Similarly, replaceable interface plate 130A was removed from facet 101D, and replaceable interface plate 130B was attached to facet 101D. Replaceable interface plate 128B has two substrate access ports 132 as opposed to three substrate access ports 132 of replaceable interface plate 128A. Similarly, replaceable interface plate 130B has two substrate access ports 132 as opposed to three substrate access ports 132 of replaceable interface plate 130A. Accordingly, in the second configuration 100B, the process chambers 106 , 108 , 112 , 114 have been repositioned and the process chambers 110 , 116 have been removed.

[0039] 1C illustrates the same FOUPs 118 , factory interface 102 , loadlocks 126 and mainframe 104 as shown in FIGS. 1A - 1B . However, in FIG. 1C , replaceable interface plate 128A has been removed from facet 101B, and replaceable interface plate 128C has been attached to facet 101B. Similarly, replaceable interface plate 130A was removed from facet 101D, and replaceable interface plate 130C was attached to facet 101D. Replaceable interface plate 128C has four substrate access ports 132 , as opposed to three substrate access ports 132 of replaceable interface plate 128A. Replaceable interface plate 130C has three substrate access ports 132 , but they are in different positions than the three substrate access ports 132 of replaceable interface plate 130A. In a third configuration 100C, process chamber 112 is in the same position, but process chambers 106 , 108 , 110 , 114 , 116 have been removed and replaced with process chambers 122 , 124 , 125 , 127 . became

[0040] As shown, any type of process chamber may be coupled to the facets of the mainframe 104 via a replaceable interface plate. Some examples of process chambers include quadruple process chambers (eg, including process chambers 106-116), single process chambers (eg, including process chambers 125, 127) and (eg, process chambers 125, 127). twin process chambers (including process chambers 122 and 124).

[0041] Each of the substrate access ports 132 may share a size or be a different size. Each replaceable interface plate 128A-C, 130A-C, 129, 131 may include the same or a different number of substrate access ports 132, which may be of similar or different sizes. For example, some substrate access ports may have a first width (eg, to receive 200 mm wafers) and some substrate access ports may have a second width (eg, to receive 300 mm wafers), Some substrate access ports may have a third width. The width of each substrate access port 132 is at least wide enough to allow the substrate 140 to pass therethrough. Substrate access ports of different sizes may allow the robotic assembly 136 to reach different areas within the chamber coupled to one of the facets 101A-D. In some embodiments where the replaceable interface plate has two or more substrate access ports, the substrate access ports may not be laterally centered and/or equidistant from each other in the substrate interface plate. In some embodiments where the replaceable interface plate has a single substrate access port, that substrate access port may be laterally centered or offset in the facet.

[0042] In one example, replaceable interface plate 128A has a) a different number of substrate access ports than replaceable interface plate 128A, b) a different location compared to a plurality of substrate access ports of replaceable interface plate 128A c) one or more substrate access ports of different sizes compared to the plurality of substrate access ports of replaceable interface plate 128A, d) of a different type than replaceable interface plate 128A slit valves, and/or e) interchangeable with a plurality of additional replaceable interface plates having a different type of local center finder than the replaceable interface plate 128A.

[0043] Each of the interchangeable interface plates may have such numbers, sizes, and/or combinations of substrate access ports, provided that the width of the facet is suitable to accommodate various numbers, sizes, and/or combinations of substrate access ports. For example, in some embodiments, the replaceable interface plate may have one substrate access port 132 instead of three substrate access ports 132 . In other embodiments, one replaceable interface plate may have one substrate access port 132 of a first width and one substrate access port 132 of a second width, while the other replaceable interface plate may have It may have one substrate access port of a first width and one substrate access port of a third width. Various combinations of substrate access ports may be possible, provided the facet has an appropriate width. This allows the mainframe 104 to be customized to couple to specific types and numbers of process and load lock chambers. As an example, the first width may be about 1.2 meters, the second width may be about 2.4 meters, and the third width may be about 800 mm.

[0044] In some embodiments, two electronic device manufacturing systems may be clustered. That is, for example, one facet of each mainframe 104 , such as a facet 101C of a first mainframe and a facet of a second mainframe, respectively, has two mainframes (eg, between two mainframes). replaceable interface plates that allow for engagement with one or more load locks interposed therein. Mainframes may be coupled in a manner to provide a pass-through chamber for transferring substrates between the two mainframes. This may further enhance the versatility, capability and/or efficiency of such electronic device manufacturing systems.

[0045] 2A illustrates a perspective view of a reconfigurable mainframe 200 , in accordance with an embodiment of the present disclosure. The reconfigurable mainframe 200 may correspond to the mainframe 104 of FIGS. 1A-1C in one embodiment.

[0046] The reconfigurable mainframe 200 includes a base 206 to which a set of frames is mounted. Each frame may correspond to and frame the side or facet of the main frame 200 . A set of frames may conceptually be a single three-dimensional frame 201 having multiple frame faces, where each of the frame faces frames a facet of the mainframe 200 . Frame 201 may include posts 204A-D, and may further include beams 208A-D connecting posts 204A-D. Each of the frames (or frame faces) may include a portion of the base, a pair of columns and a corresponding beam connecting the pair of columns. For example, base 206 , columns 204B-C and beam 208A may constitute a first frame (or frame face) for a first facet, base 206 , columns 204A-B ) and beam 208B may constitute a second frame (or frame face) for a second facet, and base 206, columns 204A, 204D and beam 208C may constitute a third frame (or frame face) for a third facet. may constitute a frame (or frame face), and base 206, columns 204C-D, and beam 208D may constitute a fourth frame (or frame face) for the fourth facet.

[0047] Each of the frames (or frame faces) may include a lip 210A, 210B on the base 206 . The lip 210A-B may be configured to support forces transmitted to the lip 210A-B by a replaceable interface plate attached to the facet. Additionally, each of the frames (or frame faces) may include a groove or other feature to receive an o-ring 215 , 220 . The o-ring can seal the replaceable interface plate to the frame (or frame face).

[0048] As illustrated, the replaceable interface plate 230 is attached to the frame (or frame face) of the facets of the mainframe 200 . Replaceable interface plate 230 may be attached to the frame via bolts, screws, and/or other attachment mechanisms. Replaceable interface plate 230 may include a configured number, size, and location of substrate access ports 234 , 236 , each of which may be configured to provide access for a robotic arm to a process chamber. Replaceable interface plate 230 may also have slit valves (not shown), LCFs (not shown) and/or other components attached to or incorporated therein.

[0049] Replaceable interface plate 230 may be a metal plate. For example, the interchangeable interface plate may be formed of aluminum, an aluminum alloy, steel, or other metal. In some embodiments, the replaceable interfacial plate includes a surface treatment such as a coating or anodizing layer (eg, Al ₂ O ₃ anodizing layer). Examples of coatings include coatings deposited by chemical vapor deposition (CVD), atomic layer deposition (ALD), electroplating, or the like. Some example coatings include dielectric coatings, Al ₂ O ₃ coatings, nickel plating, Y ₂ O ₃ coatings, and the like. Replaceable interface plate 230 may be coated prior to attachment to mainframe 200 . Alternatively, the mainframe 200 may be coated after the replaceable interface plates are attached. Accordingly, in some embodiments, portions of replaceable interface plate 230 are subjected to a surface treatment.

[0050] Replaceable interface plate 230 further includes a step 232 on the inner bottom surface of replaceable interface plate 230 . The step may mate with a lip on the sidewall of the base 206 forming a frame (or frame face) to which the replaceable interface plate 230 is mounted.

[0051] The mainframe is configured to operate under vacuum, in which large vertical and horizontal forces can be applied to the mainframe 200 based on a pressure difference between the interior volume of the mainframe and the exterior of the mainframe (which may be at atmospheric pressure, for example). let there be Frame 201 may bend and/or buckle if exposed to forces. Accordingly, in embodiments, the replaceable interface plates (eg, replaceable interface plate 230 ) are designed to support a load on the mainframe 200 , and the frame of the first facet does not support a load. . The replaceable interface plate 230 thus withstands normal forces relative to the mainframe 200 caused by pressure differences between the interior volume of the mainframe and the exterior of the mainframe. These normal forces may be transmitted from the replaceable interface plate 230 to the base at the interface of the step 232 and the lip of the base mating with the step 232 .

[0052] In one embodiment, a normal force of approximately 95,000 pounds of pressure is applied to the mainframe 200 when the mainframe 200 is under vacuum. In an embodiment where two facets have lengths of about 100-150 inches and two facets have lengths of about 40-60 inches, about 30-40% of the normal force is the replaceable interface plates attached to the long facets About 10-15% of the force is supported by each of the interchangeable interface plates attached to the short facets. Accordingly, a single replaceable interfacial plate may be configured to withstand a force of about 28,500 to 38,000 pounds of pressure without bending.

[0053] In an alternative embodiment, no step and lip are used to transmit normal forces from one or more of the replaceable interface plates to the base 206 . Replaceable interface plate 230 may include pins on the inner bottom surface of the replaceable interface plate, rather than mated steps and ribs. The fins may be, for example, square or circular fins, and may be periodically spaced apart. A plurality of fins may mate with one or more features in a sidewall of the base, and normal forces may be transmitted from the replaceable interface plate to the base at the interface of the plurality of fins and the one or more features. The features may be, for example, holes, lip or other features that mate with pins.

[0054] In an alternative embodiment, the base extends below the replaceable interface plates and normal forces are applied from the replaceable interface plates to the base without the use of any steps, lips, pins or other features in the base or replaceable interface plates. can be transmitted to

[0055] Although not shown, additional replaceable interface plates may be attached to the remaining facets of the mainframe 200 . Additionally, the cover may be secured to the top of the mainframe over the frame 201 and over the replaceable interface plates. In embodiments, the lid contacts the replaceable interface plates but not the frame 201 . This ensures that the frame will not bear any load, even if there is some misalignment in the vertical space of the top of the frame 201 and/or the top of the lip, steps, replaceable interface plate.

[0056] 2B illustrates a side view of a first exemplary replaceable interface plate 250 in accordance with an embodiment of the present disclosure. The first replaceable interface plate 250 includes a step 232 , and three substrate access ports 252 , 254 , 256 all having the same width, height and vertical position.

[0057] 2C illustrates a side view of a second exemplary replaceable interface plate 260 in accordance with an embodiment of the present disclosure. The second replaceable interface plate 260 includes a step 232 , and three substrate access ports 262 , 264 , 266 having various widths and heights.

[0058] 2D illustrates a side view of a third exemplary replaceable interface plate 270 in accordance with an embodiment of the present disclosure. The third replaceable interface plate 270 includes a step 232 and two substrate access ports 272 , 274 having the same widths and heights but different vertical positions.

[0059] In embodiments, the replaceable interface plate of any of the first exemplary replaceable interface plate 250 , the second exemplary replaceable interface plate 260 , or the third exemplary replaceable interface plate 270 is a mainframe 200 may be attached.

[0060] 3 shows a view of a mainframe 300 and an attached replaceable interface plate 330 , taken at the location of a substrate access port 335 machined into a replaceable interface plate 330 , in accordance with an embodiment of the present disclosure. A side cross-sectional view is shown. The mainframe 300 includes a base 315 , a frame face (including beams 320 , a number of posts (not shown) and a portion of the base) and a cover 325 . Beam 320 , base 315 and posts (not shown) define a frame (or frame face) for facets 310 of mainframe 300 . The replaceable interface plate 330 is attached to the frame framing the facets 310 of the mainframe 300 .

[0061] The base 315 includes a lip 340 on the sidewall of the base 315 . The replaceable interface plate 330 includes a step 342 on the inner bottom surface of the replaceable interface plate 330 , the step 342 mating with a lip 340 on the sidewall of the base 315 . As previously described, when the internal volume 305 of the mainframe 300 is pumped down to a vacuum, forces 350 may be applied to the mainframe 300 . These forces may be a concentrated force 352 that the replaceable interface plate 330 withstands. As shown, the cover 325 may be in contact with the replaceable interface plate 330 , but not the beam 320 . For example, there may be a small gap 354 between the bottom of the sheath 325 and the top of the beam 320 . Accordingly, force is transmitted from the lid 325 through the replaceable interface plate 330 to the lip 352 of the base 315 .

[0062] The sheath 325 is provided with a notch or groove into which an o-ring may be inserted to ensure a seal between the sheath 325 and the beam 320 (eg, between the sheath and the top of the frame comprising the beam 320). 346) may be included. Additionally, the frame for the facet to which the replaceable interface plate 330 is attached (e.g., comprising beam 320, posts (not shown), and the sidewall of the base) is, respectively, the replaceable interface plate 330 . It may include a notch or groove 344 into which an o-ring may be inserted to ensure a seal between the frame and the frame.

[0063] In one embodiment, replaceable interface plate 330 includes a lip 390 on top of the inner surface of replaceable interface plate 330 . Beam 320 may include a corresponding step 392 that may mate with lip 390 . In particular, the top of the step 392 does not contact the bottom of the lip 390 . In other embodiments, replaceable interface plate 330 does not include a lip and beam 320 does not include a step.

[0064] 4 shows a cross-sectional side view of the mainframe and attached replaceable interface plate 430, taken from the location of the frame's post 420 of the mainframe 400, in accordance with an embodiment of the present disclosure. The mainframe 400 includes a base 415 , a frame (including a number of beams 421 , a number of posts 420 , and portions of the base) and a cover 325 . A first portion of a first beam (not shown), post 420 and base 415 defines a first frame face for facet 410 of mainframe 400 . A second beam 421 , a post 420 , a second post (not shown), and a second portion of the base 415 define a second face frame for the second facet. The replaceable interface plate 430 is attached to the frame framing the facets 410 of the mainframe 400 .

[0065] The base 415 includes a lip 440 on the sidewall of the base 415 . The replaceable interface plate 430 includes a step 442 on the inner bottom surface of the replaceable interface plate 430 , the step 442 mating with a lip 440 on the sidewall of the base 415 . As previously described, forces 450 may be applied to the mainframe 400 when the internal volume of the mainframe 400 is pumped down to a vacuum. These forces may be a concentrated force 452 that the replaceable interface plate 430 withstands. As shown, the cover 425 may be in contact with the replaceable interface plate 430 , but not the frame. For example, there may be a small gap 454 between the bottom of the lid 425 and the top of the frame. Accordingly, a force is transmitted from the lid 425 through the replaceable interface plate 430 to the lip 442 of the base 415 .

[0066] The lid 425 may include a pair of notches or grooves 446, 448 into which o-rings are inserted to ensure a seal between the lid 425 and the frame. can do. In one embodiment, notch 446 is approximately concentric with notch 448 . Additionally, the frame for the facet to which the replaceable interface plate 430 is attached (e.g., comprising a beam (not shown), a post 420, an additional post (not shown), and a sidewall of the base) each comprises: It may include a pair of notches or grooves 444 , 445 into which o-rings may be inserted to ensure a seal between the replaceable interface plate 430 and the frame. Notch 444 and notch 445 may be approximately concentric in some embodiments.

[0067] The region between the notches 446 and 448 may be an intermediate vacuum region. Similarly, the region between the notches 444 and 445 may be another intermediate vacuum region. Post 420 may include one or more channels (ie, holes) that fluidly couple intermediate vacuum regions to vacuum port 490 . For example, the post 420 can include a vertical channel 452 that fluidly couples the intermediate vacuum region between the notches 446 and 448 to the vacuum port 490 , between the notches 444 and 445 . It can further include a horizontal channel (450) that fluidly couples the intermediate vacuum region of the vertical channel (452).

[0068] Differential pumping may be performed to pump intermediate vacuum regions to a pressure between atmospheric pressure and the pressure of the internal volume of mainframe 400 . A first o-ring may be disposed in the notch 445 of the frame, wherein the outer surface of the first o-ring is exposed to the external environment and the inner surface of the first o-ring is exposed to the intermediate vacuum region. A second o-ring may be disposed in the notch 444 of the frame, wherein the outer surface of the second o-ring is exposed to the intermediate vacuum region and the inner surface of the second o-ring is disposed in the notch 444 of the mainframe 400 . exposed to the internal volume. The external environment has a first pressure, the intermediate vacuum region is for maintaining a second pressure lower than the first pressure, and the inner volume is for maintaining a third pressure lower than the second pressure.

[0069] A second frame face for a second facet perpendicular to facet 410 is also shown. The second frame face includes a beam 421 , a post 420 and a base 415 . A large opening 405 is framed by the second frame face. As shown, notches or grooves 460 , 462 are machined into beam 421 , base 415 and post 420 , where notches 460 , 462 are each, mainframe 400 . to accommodate an o-ring for sealing an additional replaceable interfacial plate (not shown) on the second facet of the The frame (or frame face) of the facet 410 may further include one or more additional channels of the post 420 that are fluidly coupled to the channel 452 . These one or more additional channels may fluidly couple the intermediate vacuum region between the notches 460 , 462 to the vacuum port 490 .

[0070] Additional frames (or frame faces) of the mainframe may also include channels drilled or otherwise formed therein. These channels may connect to additional intermediate vacuum regions between other pairs of notches/o-rings. These channels may be fluidly coupled to the channel 452 in the post 420 and thus to the vacuum port 490 . The frame (or frame face) of the facet 410 may further include one or more additional channels within the beam 421 , and/or an additional beam (not shown), and/or a base 415 , which may include a post 415 . fluidly coupled to one or more channels of 420 . These channels may further be fluidly coupled to one or more additional channels of the additional columns, which fluidly connect additional intermediate vacuum regions to the vacuum port 490 .

[0071] In one example, the first frame (or first frame surface) may include a first post on a first side of the first facet, a second post on a second side of the first facet, and a second post connecting the first post to the second post. Includes 1 beam. The second frame (or second frame face) comprises a first post on the first side of the second facet, a third post on the second side of the second facet, and a second beam connecting the first post to the third post. include The third frame (or third frame face) comprises a second post on the first side of the third facet, a fourth post on the second side of the third facet, and a third beam connecting the second post to the fourth post. include The fourth frame (or fourth frame face) comprises a third post on the first side of the fourth facet, a fourth post on the second side of the fourth facet, and a fourth beam connecting the third post to the fourth post. include

[0072] The first frame may include one or more first channels in the first post, the one or more first channels fluidly coupling the first intermediate vacuum region to the vacuum port. The first frame may further include one or more second channels of the first beam, fluidly coupled to the one or more channels of the first post.

[0073] The first frame may further include one or more third channels of the second post, fluidly coupled to the one or more second channels of the beam. The one or more third channels may fluidly couple the vacuum port to an additional intermediate vacuum region between a pair of o-rings disposed on the outer surface of the second frame.

[0074] Alternatively or additionally, the third frame may include one or more additional channels in a third beam of the third frame. Additionally, the third frame can include one or more additional channels of the fourth post that fluidly couple the one or more intermediate vacuum regions between the additional pairs of o-rings to the vacuum port.

[0075] The vacuum port 490 may be coupled to a vacuum pump (not shown). Differential pumping may be performed to reduce the pressure differential across the o-rings. The o-rings may have a large linear surface (eg, in embodiments where the facet may have a length of up to about 130 inches or 150 inches and a height of about 20-50 inches). This can increase leakage across the o-ring and reduce sealing ability. By using differential pumping, the leakage rate can be drastically reduced. In embodiments, a single vacuum port 490 may be fluidly coupled to all pairs of o-rings between the mainframe and the shroud and intermediate vacuum regions between the replaceable interface plates. These connections may be made by drilling channels (ie, holes) in one or more of the frames of mainframe 400 or beams and/or posts of the frame, and may be made by plugging, cross drilling or welding (eg, connections to the vacuum port 490 without the use of plug welds). This may improve the operation of differential pumping by minimizing possible additional points of leakage.

[0076] In further embodiments, differential pumping of multiple stages is used, which may include sets of three concentric notches or grooves, each having its own o-ring, and two adjacent intermediate vacuum regions.

[0077] 5 illustrates a method 500 for assembling a reconfigurable mainframe of an electronic device manufacturing system, in accordance with an embodiment of the present disclosure. Some operations of method 500 may be performed by processing logic that may be executed on a computing device, such as a general purpose computer. For example, some operations may be performed using computer aided drafting and/or computer aided manufacturing (CAM) software installed on a computer.

[0078] At block 502 of the method 500 , a mainframe configuration is determined, including determining a first plurality of process chambers to be coupled to a first facet of the mainframe. Additionally, determinations of loadlocks and/or process chambers to be connected to one or more other facets of the mainframe may be made.

[0079] At block 504 , a determination of locations of substrate access ports appropriate for the determined mainframe configuration (eg, that will accommodate access to each of the process chambers and/or loadlocks) may be made. At block 506 , the configurations of one or more replaceable interfacial plates are determined. The replaceable interface plates may be configured to have substrate access ports at each of the determined positions. At block 508 , replaceable interface plates may be fabricated. This may include machining a metal (eg, aluminum) and/or applying a surface treatment to at least some of the replaceable interface plates.

[0080] At block 510 , replaceable interface plates are attached to the mainframe (transfer chamber). This may include bolting or screwing the replaceable interface plates to frames of appropriate facets of the mainframe. At block 512 , the determined process chambers and/or loadlocks may then be attached to appropriate interfacial plates according to the determined configuration.

[0081] Engineers can decide on a new configuration for the mainframe at any time. At this point, method 500 may be repeated. For example, a determination may be made of a second plurality of process chambers to be coupled to a first facet of the mainframe, and new locations of a second plurality of substrate access ports on the facet to receive the second plurality of process chambers may be determined. can be, the configuration of the second replaceable interface plate can be determined having one of the second plurality of substrate access ports at each of the new locations, and the second replaceable interface plate can be manufactured. The second replaceable interface plate has a) a different number of substrate access ports than the first replaceable interface plate, b) one or more substrate access ports at different locations as compared to the plurality of substrate access ports of the first replaceable interface plate. c) one or more substrate access ports of different sizes as compared to the plurality of substrate access ports of the first replaceable interface plate, d) slit valves of a different type than the first replaceable interface plate, or e) a first 1 may have at least one of a replaceable interface plate and a different type of local center finder.

[0082] Prior to block 510 , the existing process chambers may be removed from the first replaceable interface plate, and then the first replaceable interface plate may be removed from the mainframe. Subsequently, the operations of blocks 510 and 512 are performed so that the mainframe operates (eg, different numbers of substrate access ports, different positions of substrate access ports, different numbers and/or types of process chambers, etc.) ) can have a completely new configuration.

[0083] In the foregoing description, numerous specific details are set forth, such as specific materials, dimensions, process parameters, etc., in order to provide a thorough understanding of the present disclosure. The particular features, structures, materials, or properties may be combined in any suitable manner in one or more embodiments. The words “example” or “exemplary” are used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects or designs. Rather, use of the words “example” or “exemplary” is intended to merely present concepts in a concrete manner. As used herein, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” That is, unless otherwise specified or clear from context, "X comprises A or B" is intended to mean any of the pertinent inclusive permutations. That is, X comprises A; X comprises B; If X includes both A and B, then "X includes A or B" is satisfied under any of the foregoing instances. Reference throughout this specification to “an embodiment,” “specific embodiments,” or “one embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. do. Thus, the appearances of the phrases "an embodiment," "specific embodiments," or "one embodiment," in various places throughout this specification are not necessarily all referring to the same embodiment.

[0084] The present disclosure has been described with reference to specific exemplary embodiments of the present disclosure. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense. Various modifications of the disclosure in addition to those shown and described herein will be apparent to those skilled in the art, and are intended to fall within the scope of the appended claims.

Claims (20)

Base;
a plurality of facets on the base, a first one of the plurality of facets comprising a first frame;
a lid over the plurality of facets, the base, the lid and the plurality of facets together defining an interior volume;
a robotic arm within the interior volume; and
a first replaceable interface plate attached to a first frame of the first facet;
the first replaceable interface plate comprises a plurality of substrate access ports;
a first one of the plurality of substrate access ports is configured to provide access to the robot arm to a first process chamber; And
a second one of the plurality of substrate access ports is configured to provide access to the robot arm to a second process chamber;
The mainframe of the device fabrication system. According to claim 1,
wherein the first facet has a first length that is at least twice a second length of a second one of the plurality of facets;
The mainframe of the device fabrication system. 3. The method of claim 2,
The main frame has a rectangular shape,
The plurality of facets includes four facets,
the second facet is perpendicular to the first facet;
wherein the robot arm is an off-axis robot arm;
The mainframe of the device fabrication system. 4. The method of claim 3,
The second facet includes a second frame,
the third facet comprises a third frame;
The fourth facet includes a fourth frame,
The mainframe is:
a second interface plate sealed to a second frame of the second facet;
a third interface plate sealed to a third frame of the third facet; and
a fourth interface plate sealed to a fourth frame of the fourth facet;
The mainframe of the device fabrication system. According to claim 1,
wherein the mainframe is configured to operate under vacuum;
The first frame of the first facet does not support a load,
the first replaceable interfacial plate bears a load;
wherein the first replaceable interface plate withstands vertical forces on the mainframe caused by pressure differences between the interior volume of the mainframe and the exterior of the mainframe;
The mainframe of the device fabrication system. 6. The method of claim 5,
wherein the first replaceable interface plate comprises a step on an inner lowermost surface of the first replaceable interface plate;
the step matches a lip on the sidewall of the base;
wherein the normal forces are transferred from the first replaceable interface plate to the base and the lip at the interface of the step;
The mainframe of the device fabrication system. 6. The method of claim 5,
wherein the cover is in contact with the first replaceable interface plate;
the cover does not contact the first frame;
The mainframe of the device fabrication system. 6. The method of claim 5,
the first replaceable interface plate comprises a plurality of pins on an inner bottom surface of the first replaceable interface plate;
the plurality of pins mate with one or more features of a sidewall of the base;
wherein the normal forces are transmitted from the first replaceable interface plate to the base at the interface of the one or more features and the plurality of pins;
The mainframe of the device fabrication system. According to claim 1,
a first o-ring disposed on an outer surface of the first frame, an outer surface of the first o-ring exposed to an external environment, and an inner surface of the first o-ring exposed to an intermediate vacuum region; and
a second o-ring disposed on the outer surface of the first frame;
the second o-ring is approximately concentric with the first o-ring;
an outer surface of the second o-ring is exposed to the intermediate vacuum region;
an inner surface of the second o-ring is exposed to the inner volume;
the external environment has a first pressure;
The intermediate vacuum region is for maintaining a second pressure lower than the first pressure,
wherein the internal volume is for maintaining a third pressure lower than the second pressure;
The mainframe of the device fabrication system. 10. The method of claim 9,
The first frame includes:
a first post on a first side of the first facet;
a second post on a second side of the first facet;
a beam connecting the first post to the second post; and
one or more channels of the first post;
wherein the one or more channels fluidly couple the intermediate vacuum region to a vacuum port.
The mainframe of the device fabrication system. 11. The method of claim 10,
said first frame further comprising one or more second channels of said beam fluidly coupled to one or more channels of said first post;
said first frame further comprising one or more third channels of said second post fluidly coupled to one or more second channels of said beam;
A second facet of the plurality of facets may include a second pillar on the first side of the second facet, a third pillar on the second side of the second facet, and connecting the second pillar to the third pillar. a second frame including a second beam;
a second replaceable interface plate is sealed to the second frame of the second facet; And
wherein the one or more third channels fluidly couple the vacuum port to an additional intermediate vacuum region between a pair of o-rings disposed on an outer surface of the second frame.
The mainframe of the device fabrication system. According to claim 1,
The first replaceable interface plate has a) a different number of substrate access ports than the first replaceable interface plate, b) one or more substrate access ports in different positions compared to a plurality of substrate access ports of the first replaceable interface plate. substrate access ports, c) one or more substrate access ports of different sizes as compared to the plurality of substrate access ports of the first replaceable interface plate, d) slit valves of a different type than the first replaceable interface plate , or e) interchangeable with a plurality of additional replaceable interface plates having at least one of a local center finder of a different type than the first replaceable interface plate;
The mainframe of the device fabrication system. A replaceable interface plate for attachment to a facet of a mainframe, comprising:
a plurality of substrate access ports;
a first one of the plurality of substrate access ports is configured to provide access from the mainframe to a first process chamber; And
a second one of the plurality of substrate access ports is configured to provide access from the mainframe to a second process chamber;
the replaceable interface plate supports a load on the mainframe;
wherein the replaceable interface plate is configured to withstand normal forces relative to the mainframe caused by pressure differences between the interior volume of the mainframe and the exterior of the mainframe;
Replaceable interfacial plate. 14. The method of claim 13,
a step on an inner bottom surface of the replaceable interface plate, wherein the step is configured to mate with a lip on a sidewall of the base of the mainframe;
wherein the replaceable interface plate is configured to cause the normal forces to be transmitted from the replaceable interface plate to the base and the lip at the interface of the step;
Replaceable interfacial plate. 14. The method of claim 13,
a plurality of local center finders attached to the replaceable interface plate;
each of the plurality of local center finders is configured to detect wafers transferred through a substrate access port of the plurality of substrate access ports;
Replaceable interfacial plate. 14. The method of claim 13,
a plurality of pins on the inner bottom surface of the first replaceable interface plate;
the plurality of pins mate with one or more features of a sidewall of the base of the mainframe;
wherein the replaceable interface plate is configured to cause the normal forces to be transmitted from the replaceable interface plate to the base at the interface of the one or more features and the plurality of pins;
Replaceable interfacial plate. A method of constructing a mainframe, comprising:
determining a first plurality of process chambers to be coupled to a first facet of the mainframe;
determining locations of a plurality of substrate access ports on the first facet that will receive the first plurality of process chambers;
determining a configuration of a first replaceable interface plate having one of the plurality of substrate access ports at each of the locations;
manufacturing the first replaceable interface plate;
attaching the first replaceable interface plate to a first facet of the mainframe; and
attaching the first plurality of process chambers to the first replaceable interface plate;
each of the first plurality of process chambers accessible from the mainframe through a substrate access port of the plurality of substrate access ports;
How to configure the mainframe. 18. The method of claim 17,
determining a second plurality of process chambers to be coupled to a first facet of the mainframe;
determining new locations of a second plurality of substrate access ports on the first facet that will accommodate the second plurality of process chambers;
determining a configuration of a second replaceable interface plate having one of the second plurality of substrate access ports at each of the new locations;
manufacturing the second replaceable interface plate;
separating the first plurality of process chambers from the first replaceable interface plate;
separating the first replaceable interface plate from the first facet of the mainframe;
attaching the second replaceable interface plate to a first facet of the mainframe; and
attaching the second plurality of process chambers to the second replaceable interface plate;
each of the second plurality of process chambers accessible from the mainframe through a substrate access port of one of the second plurality of substrate access ports;
How to configure the mainframe. 19. The method of claim 18,
The second replaceable interface plate has a) a different number of substrate access ports than the first replaceable interface plate, b) one or more of the one or more substrate access ports in different positions compared to the plurality of substrate access ports of the first replaceable interface plate. substrate access ports, c) one or more substrate access ports of different sizes as compared to the plurality of substrate access ports of the first replaceable interface plate, d) slit valves of a different type than the first replaceable interface plate , or e) having at least one of a local center finder of a different type than the first replaceable interface plate;
How to configure the mainframe. 18. The method of claim 17,
The main frame has a rectangular shape,
and the first facet, the second facet, the third facet, and the fourth facet,
The first facet and the second facet are parallel to each other,
each having a first length that is at least twice a second length of the third facet and the fourth facet;
The method is:
manufacturing a second replaceable interface plate for the second facet;
attaching the second replaceable interface plate to a second facet of the mainframe; and
attaching a second plurality of process chambers to the second replaceable interface plate;
How to configure the mainframe.

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