KR20220037800A - Self Heat Dissipation Type Light Source Module - Google Patents

Abstract

According to the present invention, an optical module (1) includes: an electromagnet device (20) in which a light source (10) irradiating light is mounted or separated, and a magnetic force (b) is generated by electromagnetic induction generated by current flow by the application of power; and a heat dissipation device (30) which forms an air flow in a space around the light source (10) and the electromagnet device (20) by movement by the magnetic force (b). The efficiency of a heat dissipation effect is greatly improved by discharging or dissipating the heat of the light source to the outside by converting the magnetic force caused by an electromagnetic induction phenomenon of a PCB to flow energy or rotational energy, and in particular, the electromagnetic induction phenomenon can be applied without changing an internal structure of a lamp by generating the current flowing through a PCB pattern.

Description

Self Heat Dissipation Type Light Source Module

The present invention relates to heat dissipation of an optical module, and in particular, a self-heat dissipation type optical module that disperses and radiates heat around a light source with flow energy or rotational energy due to magnetic force of electromagnetic induction with an electromagnet configuration of a printed circuit board (PCB) will be.

In general, an optical module used in a lamp for a vehicle, etc. generates heat according to the light emission of an LED (Light Emitting Diode) or a bulb, so that heat dissipation is required to protect the internal components of the light source module from heat.

For example, a natural convection method that uses air convection as the heat dissipation method and introduces an external air flow into the lamp interior space or a forced circulation method that introduces external air into the lamp interior space with a fan is applied. can do.

Domestic Patent Publication 10-2010-0063852 (2010.06.14)

However, the heat dissipation structure using the natural convection method requires a change in the internal structure of the lamp, but the heat dissipation efficiency is not large, and the heat dissipation structure using the forced circulation method complicates the structure with the change of the internal structure of the lamp and additional parts This inevitably leads to an increase in costs.

Therefore, in consideration of the above points, the present invention converts the magnetic force caused by the electromagnetic induction of the PCB into flow energy or rotational energy to discharge or dissipate the heat of the light source to the outside, thereby greatly increasing the efficiency of the heat dissipation effect, in particular, the electromagnetic induction phenomenon The purpose is to provide a self-heat dissipation type optical module that can be applied without changing the internal structure of the lamp by generating a PCB pattern with a flowing current.

The optical module of the present invention for achieving the above object is provided with a light source irradiating light, a coil in a coil-shaped PCB pattern, signal transmission and reception is made in the coil shape, and the coil by the current flow by applying power It is characterized in that it includes an electromagnet device that generates a magnetic force by generating electromagnetic induction in the shape, and a heat dissipation device that generates movement with the magnetic force (b) and forms an air flow in the surrounding space with the movement.

In a preferred embodiment, when the power is applied, a magnetic force variation is induced in the PCB pattern by PWM control.

In a preferred embodiment, the PCB pattern is formed by winding an electromagnetic force coil around the PCB in the coil shape.

In a preferred embodiment, the PCB pattern generates the magnetic force in the direction of the PCB surface, and a double PCB structure or a multi-PCB structure is applied to the PCB.

In a preferred embodiment, the electromagnetic force coil has one coil shape or two or more coil shapes in the entire space of the PCB, and a -pole terminal and a +pole terminal are provided on the coil body constituting the coil shape.

In a preferred embodiment, the heat dissipation device generates any one of a rotational motion, a vertical positioning motion, and a pulling/pushing motion as the motion.

In a preferred embodiment, the heat dissipation device is composed of a rotating plate that generates movement by the magnetic force as the rotational motion, and a rotating shaft serving as a rotation center of the rotating plate.

As a preferred embodiment, the heat dissipation device is composed of any one of a moving plate that generates movement with the magnetic force as the vertical positional motion, an elastic plate that generates vertical and elastic motion, and a weight that generates a free fall motion. .

In a preferred embodiment, the moving plate uses compression and tension by a spring for the up-and-down positional movement.

In a preferred embodiment, the heat dissipation device is composed of a shutter plate that generates movement by the magnetic force as the pulling/pushing motion.

In a preferred embodiment, the light source is any one of a light bulb, an LED, and a LAM.

In a preferred embodiment, the electromagnet device is positioned in front of the heat dissipation device with the PCB pattern on which the light source is mounted.

In a preferred embodiment, the electromagnet device is configured as a box-type electronic device that surrounds the heat dissipation device with the PCB pattern on which the light source is mounted.

In a preferred embodiment, the electromagnet device is configured as a box-type electronic device that surrounds the heat dissipation device with the PCB pattern separated from the light source.

In a preferred embodiment, the application of power is controlled by a current controller.

In a preferred embodiment, the heat dissipation device flows the induced current generated by the magnetic force as a current.

The self-heat dissipation type optical module of the present invention implements the following actions and effects.

First, it is possible to obtain a lamp heat dissipation structure with significantly improved heat dissipation efficiency while being differentiated from natural convection or forced circulation methods with the PCB electromagnetic induced flow or rotational heat dissipation method. Second, the improved heat dissipation structure of the lamp is possible without changing the internal structure of the lamp because the electromagnetic induction phenomenon generates the current flowing through the PCB pattern. Third, by forming the coil with the pattern of the PCB, the simple structure, low cost, and the structure of coil life extension due to the reliability of the PCB become complicated, and the disadvantages of the separate coil/electromagnet method that require expensive coils are all resolved. Fourth, by forming a forced flow of air with rotational energy using magnetic force, it is possible to solve the limitation of heat dissipation efficiency, which is a disadvantage of a fixed heat sink in which heat is discharged through natural convection and heat conduction. Fifth, by adjusting the frequency of PWM (Pulse Width Modulation), the magnetic force strength of the PCB, which increases the rotational energy, is increased, so that it is easy to control the heat dissipation performance and it is possible to increase the heat dissipation performance while remarkably reducing the space. Sixth, by applying the electromagnetic induction PCB pattern to the light source module, it is possible to reduce the resistance element and improve the heat resistance performance of RCL, which is an electric circuit consisting of a resistor/coil/capacitor, so that the lamp life can be extended. Seventh, since it is possible to manufacture an electromagnet using a PCB pattern, it is possible to develop horizontally for use in the control field.

1 is an example in which the self-heat dissipation type optical module according to the present invention is configured as a system together with a current controller, FIG. 2 is an example of the configuration of an electromagnet device applied to the self-heat dissipation optical module according to the present invention, and FIG. 3 is an electromagnet according to the present invention It is an example of the magnetic force induction phenomenon through the electromagnetic force coil of the device, Figure 4 is the magnetic force generation state of the electromagnet device through the electromagnetic force coil according to the present invention, Figure 5 is a heat dissipation device applied to the self-heat dissipation type optical module according to the present invention is a rotating type , is an example of various configurations with a flexible, shield-type structure, and FIG. 6 is a state in which the self-heat-dissipating optical module according to the present invention is composed of one light source-attached electromagnet device and a rotating heat-dissipating device, and FIG. 7 is the present invention The self-heat-dissipating optical module according to the present invention is in a state in which a plurality of light source-attached electromagnet devices and a rotating heat-dissipating device are configured and operated, and FIG. It is configured and operating.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying illustrative drawings, and since these embodiments are examples, those of ordinary skill in the art to which the present invention pertains may be implemented in various different forms. It is not limited to the embodiment.

Referring to FIG. 1 , the optical module 1 includes a light source 10 , an electromagnet device 20 , and a heat dissipation device 30 . In this case, the optical module 1 forms an assembled state with respect to the light source 10 , the electromagnet device 20 , and the heat dissipation device 30 using the module housing 1-1.

For example, the light source 10 emits light by emitting light by supplying power, and may be formed of a bulb or a Light Emitting Diode (LED), and may be configured as an LED ASSY MODULE (LAM) if necessary.

For example, the electromagnet device 20 is configured of an electromagnet that induces magnetic force fluctuations rather than continuous operation by controlling the applied power by PWM (pulse width modulation).

In particular, the electromagnet device 20 is provided with a coil in a coil-shaped PCB pattern, and signals are transmitted and received in the coil-shaped form, and electromagnetic induction is generated in the coil-shaped by the current flow by the application of power to the PCB pattern to generate magnetic force. (b) is created. This is explained in detail later.

For example, the heat dissipation device 30 generates movement by magnetic force fluctuations generated by the electromagnet of the electromagnet device 20, and heat generated from the light source 10 by the flow generated in the inner space or the surrounding space of the optical module 1 The heat dissipation efficiency is increased by dispersing, and the position is restored when there is no magnetic force of the electromagnet, thereby forming a position different from when the magnetic force is generated in the electromagnet in the initial state. In this case, the heat dissipation device 30 may be a thin plate made of a metal material.

In particular, the heat dissipation device 30 generates an induced current with a magnetic force (b) generated as electromagnetic induction is generated in a coil shape due to the current flow by the application of power to the PCB pattern of the electromagnet device 20, and the induced current is It can act as an induction device through which current flows by flowing it as a current. In this case, the heat dissipation device 30 may connect an electric wire to supply current to the light source 10 or other components of the optical module 1 .

Therefore, the optical module 1 converts the magnetic force change of the electromagnet into a flow, thereby dispersing the heat of the light source 10 into the air circulation flow formed in the inner space or the surrounding space of the optical module 1, thereby increasing the heat dissipation efficiency. It is characterized by a heat dissipating optical module.

Furthermore, the optical module 1 is configured as an optical module system 100 for controlling power to the electromagnet device 20 in connection with the current controller 40 . In particular, the current controller 40 controls the output of pulse width modulation (PWM) for the electromagnet device 20 to change the magnetic force of the electromagnet while supplying power of the batch process to the light source 10 and the electromagnet device 20 . give.

Therefore, the current controller 40 may operate as a central processing unit for changing the PWM output value, and for this purpose, a conventional lamp lighting controller may be applied.

Meanwhile, FIGS. 2 to 4 show various configurations of the electromagnet device 20 .

Referring to FIG. 2 , the electromagnet device 20 may be composed of an integrated printed circuit board (PCB) 21 and an electromagnetic force coil 23 or an integrated PCB 21 and a double type electromagnetic force coil 24. there is.

For example, the integrated PCB 21 mounts an electric circuit and a signal processing circuit in which components of various elements are connected as a substrate circuit, forms an electromagnet and a power circuit of the electromagnet device 20 , and a power wiring leading to the light source 10 . this is formed

In particular, the integrated PCB 21 applies a double PCB structure or a multi-PCB structure to form the electromagnetic force coil 23 and the double electromagnetic force coil 24 .

For example, the electromagnetic force coil 23 is formed as one in the entire space of the integrated PCB 21, whereas the double type electromagnetic force coil 24 divides the entire space of the integrated PCB 21 into two sections and is located in each It is formed by two Therefore, the double-type electromagnetic force coil 24 is divided into a first electromagnetic force coil 24-1 and a second electromagnetic force coil 24-2. However, the double-type electromagnetic force coil 24 may be formed in two or more by dividing the entire space of the integrated PCB 21 into two or more sections and placing them in each.

Referring to FIG. 3 , it can be seen that each of the electromagnetic force coil 23 , the first electromagnetic force coil 24-1, and the second electromagnetic force coil 24-2 is formed in the same structure as a coil.

For example, the coil shape includes a coil body 26 , a negative terminal 27 , and a positive terminal 28 . In this case, the coil body 26 is coupled to cover the PCB board by making one coil strand in a row in a continuous manner in a rectangular frame, and the -pole terminal 27 is bent at one end of the coil body 26 to The + electrode terminal 28 is formed by bending the other end of the coil body 26 .

Therefore, electromagnetic induction is generated by the current flowing in the coil body 26 by connecting the power line to the -pole terminal 27 and the +pole terminal 28 in the coil shape.

Therefore, the coil shape applied to each of the first and second electromagnetic force coils 24-1 and 24-2 of the electromagnetic force coil 23 and the double-type electromagnetic force coil 24 uses a PCB pattern to generate a magnetic force, so a coil-shaped pattern is used. By enabling voltage drop through this power consumption, the quantity of resistor (R)/coil (L)/capacitor (C), which are resistance elements of the LDM, can be reduced. Since it replaces heat dissipation, LDM calorific value can be effectively reduced.

Referring to FIG. 4 , each of the electromagnetic force coil 23 and the double-type electromagnetic force coil 24 is a magnetic force direction in the device mounting direction (eg, plane direction) of the integrated PCB 21 due to electromagnetic induction by current flow. , and the direction of the magnetic force acts on the heat dissipating device 30 facing the electromagnet device 20 , so that the heat dissipating device 30 can generate movement.

In particular, the magnetic force direction causes a flow in the inner space or the surrounding space of the optical module 1 by generating a repetitive movement in the heat dissipating device 30 with magnetic force fluctuation by controlling the current strength by PWM control, thereby causing a flow in the light source 10 . It is possible to increase the heat dissipation efficiency by dispersing the generated heat.

Meanwhile, FIG. 5 shows various configurations of the heat dissipation device 30 . As shown, the heat dissipation device 30 is applied with any one of a rotary type heat dissipation device 30-1, a fluid type heat dissipation device 30-2, and a shield type heat dissipation device 30-3 to turn on/off the power. It receives the changing magnetic force (b) of the electromagnet device 20 by OFF and PWM control to generate repetitive motion.

Specifically, the rotary heat dissipation device 30 - 1 includes a rotary plate 31 and a rotary shaft 32 .

As an example, the rotating plate 31 causes repeated movement due to a change in the magnetic force b of the electromagnet device 20 as a rotational movement, thereby allowing the air around the light source 10 to flow. The rotation shaft 32 acts as a rotation center of the rotation plate 31 , and is axially supported using the module housing 1-1 of the optical module 1 .

In particular, the rotating plate 31 can generate repetitive motion by changing the magnetic force (b) by applying a thin metal plate of a predetermined thickness that reacts with the magnetic force (b) or by applying a thin plate made of a metal material. The rotating shaft 32 acts as a position restoring unit for restoring the position so that the rotating plate 31 moves to a different position (ie, an initial position) when the magnetic force b occurs when there is no magnetic force b.

Specifically, the fluid heat dissipation device 30 - 2 may be composed of a moving plate 33 and a spring 34 , or may be composed of an elastic plate 35 or a weight 36 .

For example, the moving plate 33 causes the air around the light source 10 to flow through repeated movement due to a change in the magnetic force b of the electromagnet device 20 as an up-and-down positional movement. The spring 34 is fixed to the moving plate 33 and compressed and tensioned by the vertical movement of the moving plate 33 , and is fixed using the module housing 1-1 of the optical module 1 .

In particular, the moving plate 33 may generate a repeated movement by a change in the magnetic force (b) by applying a thin metal plate of a predetermined thickness that reacts with the magnetic force (b) or by applying a thin plate made of a metal material. The spring 34 applies a coil spring.

As an example, the elastic plate 35 causes repeated movement due to a change in the magnetic force b of the electromagnet device 20 as an up-and-down elastic movement to flow the air around the light source 10 , and One end is fixed using the module housing (1-1). The weight 36 causes the air around the light source 10 to flow because of the change in the magnetic force (b) of the electromagnet device 20, and repeated movement is generated by up-and-down free-fall motion, and the module of the optical module 1 One end is fixed using the housing (1-1).

In particular, the elastic plate 35 and the weight 36 are made of a metal material that reacts with the magnetic force b, and use gravity to generate repetitive movements, so the rotation shaft 32 or the spring 34 is not applied. It may be of a non-structural structure.

Specifically, the shield-type heat dissipation device 30 - 3 is formed of a shutter plate 37 .

For example, the shutter plate 37 has a “U” cross-sectional shape, so that the light source 10 and the electromagnet device 20 are accommodated using the internal space thereof, and the magnetic force b of the electromagnet device 20 is changed. As a result, repeated movement is generated as a pulling/pushing movement, thereby exposing the light source 10 to ambient air, thereby generating heat dissipation and heat dissipation efficiency.

In particular, when the shutter plate 37 is made of a metal material that reacts with the magnetic force b, a transparent material through which the light of the light source 10 is transmitted is applied to some sections.

On the other hand, FIG. 6 shows that the self-heat dissipation type optical module 1 consists of a light source 10, an electromagnet device 20, and a heat dissipation device 30 as a single light source attachment type electromagnet device type rotational heat dissipation device, through which the optical module ( 1) indicates the operating state in which air flow is generated in the internal space. In this case, the heat dissipation device 30 is described by applying the rotation type heat dissipation device 30-1, but a flow type heat dissipation device 30-2 or a shield type heat dissipation device 30-3 operating in the same principle may be applied. there is.

As shown, the current controller 40 supplies power with the electromagnet ON or cuts the power with the electromagnet OFF.

Then, the electromagnet device 20 maintains the generation of the magnetic force (b) through the electromagnetic induction phenomenon by the current flow by the electromagnet ON, while releasing the generation of the magnetic force (b) by blocking the current by the magnet OFF. In this case, the current controller 40 may change the strength of the magnetic force b by using pulse width modulation (PWM) control (a) for the current.

From this, the magnetic force (b) of the electromagnet device 20 generates a magnetic force at the electromagnet ON (1st step) -> Releases the magnetic force generation at the electromagnet OFF (2nd step) -> Generates a magnetic force at the electromagnet ON (3rd step) - > Change from electromagnet OFF to release of magnetic force generation (4th step), which is continuously repeated during control.

As a result, the rotary heat dissipation device 30-1 receives the magnetic force b of the electromagnet device 20, so that the rotary plate 31 with the rotation shaft 32 as the center is affected by the magnetic force b in the first step. It is pulled toward the electromagnet device 20, and in the second stage, one end part (K) of the rotating plate (31) goes down by gravity in a state where there is no influence of the magnetic force (b), and in the third stage, the magnetic force (b) ) is pulled back toward the electromagnet device 20 under the influence of, and in the fourth step, one end portion K of the rotating plate 31 rises upward by rotational inertia in a state where there is no influence of the magnetic force b.

As such, the rotational heat dissipation device 30-1 is rotated by the rotating plate 31 so that the surrounding air flows. .

Therefore, the moving plate 33, the elastic plate 35, the weight 36, and the shutter plate 37 of the shield-type heat dissipation device 30-3 of the fluid heat dissipation device 30-2 are also of the first stage. Magnetic force generation -> release of magnetic force generation in the second stage -> generation of magnetic force in the third stage -> Generates a flow of ambient air through release of generation of magnetic force in the fourth stage, and this ambient air flow brings air flow to the light source (10) By dispersing the heat generated in the heat dissipation efficiency can be increased equally.

On the other hand, FIGS. 7 and 8 show that the self-heat dissipation type optical module 1 transforms the electromagnet device 20 into a box-type electronic device, and the air flow in the inner space of the optical module 1 through the box-type electronic device is generated more strongly It indicates the state of the operation. In this case, the heat dissipation device 30 is described by applying the rotation type heat dissipation device 30-1, but a flow type heat dissipation device 30-2 or a shield type heat dissipation device 30-3 operating in the same principle may be applied. there is.

Referring to FIG. 7 , the box-type electromagnetic device includes a front electromagnet device 20-1, a rear electromagnet device 20-2, an upper electromagnet device 20-3, and a lower electromagnet device 20 surrounding the heat dissipation device 30. -4) is configured so that the light source 10 is not applied to any one. In this case, the rear electromagnet device 20-2 does not apply the light source 10, which is the front electromagnet device 20-1, the top electromagnet device 20-3, and the bottom electromagnet device 20-4. ) is because each of the light source 10 is directed toward the front to which the light is irradiated.

On the other hand, referring to FIG. 8, the box-type electromagnetic device includes a front electromagnet device 20-1 surrounding the heat dissipation device 30, a rear electromagnet device 20-2, an upper electromagnet device 20-3, and a lower electromagnet device ( 20-4) does not apply the light source 10, but instead the front electromagnet device 20-1, the rear electromagnet device 20-2, the top electromagnet device 20-3, and the bottom electromagnet device 20-4) It is configured to connect the integrated PCB 21 to which the light source 10 is applied to any one. In this case, the upper electromagnet device 20-3 is exemplified as connecting the integrated PCB 21, but the size of the integrated PCB 21 is different from the front electromagnet device 20-1 and the rear electromagnet device ( 20-2), the upper electromagnet device 20-3, and the lower electromagnet device 20-4 are all covered, so the connection target is not limited.

In particular, in FIGS. 7 and 8 , the front electromagnet device 20-1 has a negative terminal 27 and a positive terminal of the electromagnetic force coil 23 with respect to the front/rear electromagnet devices 20-1 and 20-2. By reversing the direction of (28) and reversing the directions of the -pole terminal 27 and the +pole terminal 28 with respect to the upper/lower electromagnet devices 20-3 and 20-4, the direction of generation of the magnetic force b By matching with each other, the direction of magnetic force generation in the electromagnet ON allows the heat dissipation device 30-2 to move in one direction.

Therefore, the box-type electronic device of FIGS. 7 and 8 forms a current flow in the front/rear electromagnet devices 20-1 and 20-2 with one electromagnet ON, and upper/lower electromagnet device 20 with one electromagnet OFF -3,20-4) can block the current flow.

That is, the magnetic force (b) of the box-type electromagnetic device is generated by the electromagnet ON of the front/rear electromagnet devices 20-1 and 20-2 (first step) -> upper/lower electromagnet devices 20-3, 20 -4) Magnetic force is generated when the electromagnet is ON (2nd stage) -> Magnetic force is generated when the electromagnet is ON of the front/rear electromagnet devices (20-1, 20-2) (3rd stage) -> Upper/lower electromagnet device (20) -3,20-4) changes from ON to magnetic force generation (fourth stage), which is continuously repeated during control.

From this, the intensity of the magnetic force (b) of the box-type electronic device is doubled compared to the magnetic force (b) of the basic electronic device of FIG. ), it can dissipate the heat generated more quickly to further increase the heat dissipation efficiency.

As described above, in the self-heat dissipation optical module 1 according to this embodiment, the light source 10 irradiating light is mounted or separated, and the magnetic force b is generated by electromagnetic induction generated by the current flow by the application of power. The electromagnetic device 20, and the heat dissipation device 30 that forms an air flow in the space around the light source 10 and the electromagnet device 20 by movement by the magnetic force (b) is included, so that the magnetic force caused by the electromagnetic induction phenomenon of the PCB The efficiency of the heat dissipation effect is greatly increased by discharging or dissipating the heat of the light source to the outside by converting flow energy or rotational energy.

1: optical module 1-1: module housing
10: light source 20: electromagnet device
20-1: front electromagnet device 20-2: rear electromagnet device
20-3: top electromagnet device 20-4: bottom electromagnet device
21: Integrated PCB (Printed Circuit Board)
21-1: Detachable PCB
23: electromagnetic force coil 24: double-type electromagnetic force coil
24-1,24-2: first and second electromagnetic force coils
26: coil body 27: -pole terminal
28: + terminal 30: heat dissipation device
30-1: rotary heat dissipation device 30-2: fluid heat dissipation device
30-3: Shield type heat dissipation device
31: rotating plate 32: rotating shaft
33: moving plate 34: spring
35: elastic plate 36: weight weight
37: shutter plate 40: current controller
100: optical module system

Claims (19)

a light source irradiating light, and
An electromagnet device in which a coil is provided in a coil-shaped printed circuit board (PCB) pattern, and a signal is transmitted and received in the coil shape.
An optical module, characterized in that it is included.
The method according to claim 1, wherein the electromagnet device is associated with a heat dissipation device,
In the electromagnet device, electromagnetic induction is generated in the coil shape with a current flow by the application of power to the PCB pattern to generate a magnetic force,
The heat dissipation device generates a movement by the magnetic force, and the optical module, characterized in that the movement forms an air flow in the surrounding space.
The optical module according to claim 2, wherein the application of the power induces magnetic force fluctuations in the PCB pattern by PWM (pulse width modulation) control.
The optical module according to claim 2, wherein the PCB pattern is formed by winding an electromagnetic force coil on a printed circuit board (PCB) in the coil shape.
The optical module according to claim 4, wherein the PCB pattern generates the magnetic force in the direction of the PCB surface.
The optical module according to claim 4, wherein the PCB has a double PCB structure or a multi-PCB structure.
The optical module according to claim 6, wherein the electromagnetic coil has one coil shape or two or more coil shapes in the entire space of the PCB.
The optical module according to claim 7, wherein the electromagnetic force coil has a -pole terminal and a +pole terminal on the coil body forming the coil shape.
The optical module according to claim 2, wherein the heat dissipating device generates any one of a rotational motion, a vertical positioning motion, and a pulling/pushing motion by the motion.
The optical module according to claim 9, wherein the heat dissipation device is composed of a rotating plate that generates movement with the magnetic force as the rotational motion, and a rotating shaft serving as a rotation center of the rotating plate.
The method according to claim 9, wherein the heat dissipation device is composed of any one of a moving plate that generates movement by the magnetic force as the vertical positional movement, an elastic plate that generates a vertical elastic movement, and a weight that generates a free fall motion. Optical module, characterized in that.
The optical module according to claim 11, wherein the moving plate uses compression and tension by a spring for the vertical positional movement.
The optical module according to claim 11, wherein the heat dissipation device comprises a shutter plate that generates movement by the magnetic force as the pulling/pushing motion.
The optical module according to claim 2, wherein the electromagnet device is positioned in front of the heat dissipation device with the PCB pattern on which the light source is mounted.
The optical module according to claim 2, wherein the electromagnet device is a box-type electronic device that surrounds the heat dissipation device with the PCB pattern on which the light source is mounted.
The optical module according to claim 2, wherein the electromagnet device is a box-type electronic device that surrounds the heat dissipation device with the PCB pattern separated from the light source.
The optical module according to claim 2, wherein the power application is controlled by a current controller.
The optical module according to claim 2, wherein the heat dissipation device generates an induced current with the magnetic force and flows the induced current as a current.
The optical module according to claim 1, wherein the light source is any one of a bulb, a light emitting diode (LED), and an LED ASSY MODULE (LAM).

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