KR20220037315A - Steel material laser processing device - Google Patents

Steel material laser processing device Download PDF

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Publication number
KR20220037315A
KR20220037315A KR1020200120129A KR20200120129A KR20220037315A KR 20220037315 A KR20220037315 A KR 20220037315A KR 1020200120129 A KR1020200120129 A KR 1020200120129A KR 20200120129 A KR20200120129 A KR 20200120129A KR 20220037315 A KR20220037315 A KR 20220037315A
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KR
South Korea
Prior art keywords
laser
sapphire substrate
laser beam
light source
unit
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Application number
KR1020200120129A
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Korean (ko)
Inventor
김종배
Original Assignee
김종배
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Priority to KR1020200120129A priority Critical patent/KR20220037315A/en
Publication of KR20220037315A publication Critical patent/KR20220037315A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The present invention relates to a laser processing device and, more particularly, to a laser processing device for emitting a pulse laser to an object to process the object. According to the present invention, the laser processing device for processing a sapphire substrate in which a plurality of stacking units spaced apart from each other are formed on a surface thereof comprises: a laser light source for emitting a laser beam; a light concentrating unit for concentrating the laser beam from the laser light source into the sapphire substrate; a driving unit which moves the light concentrating unit or the sapphire substrate so that the position of a concentrating point at which the laser beam is condensed within the sapphire substrate is adjusted; and a control unit for controlling the driving unit so that a phase change region is formed inside the sapphire substrate by guiding the laser beam to the inside of the sapphire substrate while avoiding the region in which the stacking units are formed. The laser light source oscillates an ultrashort pulse laser beam. According to the present invention, the decrease in luminance is suppressed.

Description

철강재 레이저 가공장치 {Steel material laser processing device}Steel material laser processing device

본 발명은 레이저 가공장치에 관한 것으로, 특히 펄스 레이저(pulse laser)를 대상물에 조사하여 가공하는 레이저 가공장치에 관한 것이다.The present invention relates to a laser processing apparatus, and more particularly, to a laser processing apparatus for processing by irradiating a pulse laser on an object.

레이저 가공장치는 대상물(피가공물)에 레이저 빔을 조사하여 대상물을 가공하는 장치이다. 레이저는 광의 강도가 높고 직진성이 우수하며 비접촉 가공이 가능하기 때문에, 고경도의 대상물 또는 취성재료의 절단이나 스크라이빙 공정에 유용하다. 또한, 레이저는 자유곡선 등의 복잡한 형상도 가공할 수 있으며, 재료의 가공변위도작고 열영향부도 작기 때문에 최근 산업계에서 널리 사용되고 있다. 레이저 가공장치에 이용되는 레이저는 발진되는 레이저 빔의 파형에 따라 펄스 레이저와 연속발진 레이저로 분류할 수 있다. 펄스 레이저는 나노 세컨드(nano second), 피코 세컨드(pico second), 펨토 세컨드(femto second) 급의 짧은 조사 시간을 갖는 레이저로서, 피크 파워가 수십 킬로와트 이상으로 높다. 펄스 레이저를 이용한 레이저 가공 공정의 일례로 엘이디의 스크라이빙 공정을 들 수 있다. 엘이디(LED, LightEmitting Diode)는 전류를 받아 빛을 방출하는 반도체를 이용한 발광소자의 일종이다. 최근 반도체 기술의 발전에 따라 엘이디 소자의 고품질화가 급격히 진행되고 있다. 그 일례로, 사파이어 기판 상에 금속 유기 화학증착(MOCVD)법으로 III-IV족 질화물층을 형성함으로써, 고휘도의 청색 엘이디를 구현하는 기술이 점차 일반화되고 있다.A laser processing apparatus is an apparatus for processing an object by irradiating a laser beam on an object (object to be processed). The laser has high light intensity, excellent straightness, and non-contact processing, so it is useful for cutting or scribing high-hardness objects or brittle materials. In addition, the laser can process complex shapes such as free curves, and has been widely used in industry recently because the processing displacement of the material is small and the heat-affected zone is small. The laser used in the laser processing apparatus can be classified into a pulse laser and a continuous oscillation laser according to the waveform of the oscillated laser beam. A pulse laser is a laser having a short irradiation time of nano second, pico second, and femto second grades, and has a high peak power of several tens of kilowatts or more. As an example of a laser processing process using a pulse laser, an LED scribing process may be cited. An LED (Light Emitting Diode) is a type of light emitting device using a semiconductor that receives current and emits light. Recently, with the development of semiconductor technology, the quality of LED devices is rapidly progressing. For example, by forming a III-IV nitride layer on a sapphire substrate by a metal-organic chemical vapor deposition (MOCVD) method, a technique for realizing a high-brightness blue LED is gradually becoming common.

본 발명은 전술한 종래 기술의 문제점을 해결하기 위한 것으로, 그 목적은 적층부가 표면에 형성된 대상물의 스크라이빙이나 절단 공정에 적합한 레이저 가공장치를 제공하는 것이다.The present invention is to solve the problems of the prior art described above, and an object of the present invention is to provide a laser processing apparatus suitable for the scribing or cutting process of the object formed on the surface of the laminate.

상기 목적을 달성하기 위한 본 발명의 제1 측면에 의하면, 서로 이격된 복수개의 적층부가 표면에 형성되어 있는 사파이어 기판을 가공하는 레이저 가공장치로서, 레이저 빔을 출사하는 레이저 광원과, 상기 레이저 광원으로부터의 레이저 빔을 상기 사파이어 기판의 내부에 집광시키는 집광부와, 상기 사파이어 기판 내에서 상기 레이저 빔이 집광되는 집광점의 위치가 조정되도록 상기 집광부 또는 상기 사파이어 기판을 이동시키는 구동부와,상기 적층부가 형성된 영역을 회피하여 상기 레이저 빔을 상기 사파이어 기판의 내부로 유도하여 상기 사파이어기판 내부에 상변이 영역이 형성되도록 상기 구동부를 제어하는 제어부를 포함하며, 상기 레이저 광원은 초단펄스 레이저 빔을 발진하는 것을 특징으로 하는 레이저 가공장치를 제공한다.According to a first aspect of the present invention for achieving the above object, as a laser processing apparatus for processing a sapphire substrate in which a plurality of stacked parts spaced apart from each other are formed on the surface, a laser light source emitting a laser beam, and from the laser light source A light condensing unit for condensing the laser beam of the sapphire into the sapphire substrate, and a driving unit for moving the condensing unit or the sapphire substrate so that a position of a condensing point on which the laser beam is condensed within the sapphire substrate is adjusted; and a control unit for controlling the driving unit so that a phase change region is formed inside the sapphire substrate by guiding the laser beam into the inside of the sapphire substrate by avoiding the formed region, wherein the laser light source oscillates the ultra-short pulse laser beam It provides a laser processing apparatus characterized in that.

본 발명은 적층부가 표면에 형성된 대상물의 스크라이빙이나 절단 공정에 적합한 레이저 가공장치를 제공할 수있다. 특히, 본 발명은 광휘도의 감소가 억제되고, 미세분진의 발생이 적으며, 고밀도 집적이 가능하고, 기판과 질화물층 사이의 열발생이나 크랙/박리 등이 억제된 레이저 가공장치를 제공할 수 있다.The present invention can provide a laser processing apparatus suitable for a scribing or cutting process of an object on which a laminate is formed on the surface. In particular, the present invention can provide a laser processing apparatus in which a decrease in luminance is suppressed, the generation of fine dust is small, high-density integration is possible, and heat generation between a substrate and a nitride layer, cracks / peeling, etc. are suppressed. there is.

이하에서는 첨부한 도면을 참조하여 본 발명을 설명하기로 한다. 그러나 본 발명은 여러 가지 상이한 형태로구현될 수 있으며, 따라서 여기에서 설명하는 실시예로 한정되는 것은 아니다. 그리고 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 유사한 부분에 대해서는유사한 도면 부호를 붙였다. 명세서 전체에서, 어떤 부분이 다른 부분과 "연결"되어 있다고 할 때, 이는 "직접적으로 연결"되어 있는 경우뿐 아니라, 그 중간에 다른 부재를 사이에 두고 "간접적으로 연결"되어 있는 경우도 포함한다. 또한 어떤 부분이어떤 구성요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 구비할 수 있다는 것을 의미한다.Hereinafter, the present invention will be described with reference to the accompanying drawings. However, the present invention may be embodied in several different forms, and thus is not limited to the embodiments described herein. And in order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification. Throughout the specification, when a part is "connected" with another part, this includes not only the case where it is "directly connected" but also the case where it is "indirectly connected" with another member interposed therebetween. . In addition, when a part "includes" a certain component, this means that other components may be further provided without excluding other components unless otherwise stated.

Claims (1)

서로 이격된 복수개의 적층부가 표면에 형성되어 있는 사파이어 기판을 가공하는 레이저 가공장치로서,레이저 빔을 출사하는 레이저 광원과,상기 레이저 광원으로부터의 레이저 빔을 상기 사파이어 기판의 내부에 집광시키는 집광부와,
상기 사파이어 기판 내에서 상기 레이저 빔이 집광되는 집광점의 위치가 조정되도록 상기 집광부 또는 상기 사파이어 기판을 이동시키는 구동부와,상기 적층부가 형성된 영역을 회피하여 상기 레이저 빔을 상기 사파이어 기판의 내부로 유도하여 상기 사파이어기판 내부에 상변이 영역이 형성되도록 상기 구동부를 제어하는 제어부를 포함하며,상기 레이저 광원은 초단 펄스 레이저 빔을 발진하고,상기 레이저 광원과 상기 집광부 사이에 빔정형모듈을 더 포함하는 것을 특징으로 하는 레이저 가공장치.A laser processing apparatus for processing a sapphire substrate in which a plurality of stacked portions spaced apart from each other are formed on the surface, A laser light source emitting a laser beam, A light condensing unit for condensing the laser beam from the laser light source into the interior of the sapphire substrate; ,
A driving unit for moving the light collecting unit or the sapphire substrate so that the position of the light collecting point on which the laser beam is focused in the sapphire substrate is adjusted; and a control unit for controlling the driving unit to form a phase change region inside the sapphire substrate, wherein the laser light source oscillates an ultra-short pulse laser beam, and a beam shaping module between the laser light source and the light collecting unit. Laser processing apparatus, characterized in that.
KR1020200120129A 2020-09-17 2020-09-17 Steel material laser processing device KR20220037315A (en)

Priority Applications (1)

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KR1020200120129A KR20220037315A (en) 2020-09-17 2020-09-17 Steel material laser processing device

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KR1020200120129A KR20220037315A (en) 2020-09-17 2020-09-17 Steel material laser processing device

Publications (1)

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KR20220037315A true KR20220037315A (en) 2022-03-24

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