KR20220032415A - Stamp for removing defective device and apparatus for removing defective device including the same - Google Patents

Abstract

One embodiment of the present invention provides a stamp for removing a defective element that can stably remove a defective element on a substrate and a device for removing the defective element comprising the same. Here, the stamp for removing the defective element comprises a stamp body part, an adhesive layer, and a heating part. The stamp body part has an insertion groove at a lower part so that the defective element of the substrate is inserted. The adhesive layer is provided in the insertion groove to be in contact with the defective element when inserted into the insertion groove. The heating part is provided in the stamp body part, and heats the adhesive layer so that the defective element adheres to the adhesive layer.

Description

A stamp for removing a bad device and a device for removing a bad device including the same

The present invention relates to a stamp for removing defective elements and an apparatus for removing defective elements including the same, and more particularly, to a stamp for removing defective elements capable of stably removing defective elements on a substrate, and an apparatus for removing defective elements including the same is about

In general, a device module in which a plurality of devices are mounted on a substrate undergoes a test process for inspecting a defective device, and a process of removing the defective device and replacing it with a new device is referred to as a repair process.

Repair devices used in the device repair process include a device for melting solder of a defective device or a device for mounting a new device on a substrate so that the defective device can be separated from the substrate.

On the other hand, in the conventional device repair process, the force to remove the bad device from the substrate is insufficient in the process of removing the bad device from the substrate, or the defective device is separated from the bad device in the middle process of removing the bad device and the removal of the bad device fails. There is a problem that the phenomenon occurs.

Recently, with the development of nanotechnology, the size of the device is getting smaller, and the conventional device repair device is difficult to apply to the micro device due to the physical size of the vacuum suction device. Accordingly, there is a demand for a defective device removal technology capable of effectively removing the defective devices included in a plurality of micro devices arranged on a substrate.

Republic of Korea Patent Publication No. 1228306 (2013. 01. 31. Announcement)

In order to solve the above problems, an object of the present invention is to provide a stamp for removing defective elements capable of stably removing defective elements on a substrate and an apparatus for removing defective elements including the same.

The technical problems to be achieved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those of ordinary skill in the art to which the present invention belongs from the description below. There will be.

In order to achieve the above technical object, one embodiment of the present invention is a stamp body having an insertion groove at the bottom so that the bad element of the substrate is inserted; an adhesive layer provided in the insertion groove to be in contact with the defective element when it is inserted into the insertion groove; And it is provided in the stamp body portion, it provides a defective element removal stamp comprising a heating unit for heating the adhesive layer so that the defective element is adhered to the adhesive layer.

In an embodiment of the present invention, the insertion groove may be recessed in the lower portion of the stamp body.

In an embodiment of the present invention, the heating unit may be provided in the insertion groove, and the adhesive layer may be provided to cover the heating unit.

In an embodiment of the present invention, the heating unit may be provided on the periphery of the insertion groove in the lower portion of the stamp body.

In an embodiment of the present invention, it has a through hole formed through the center, and includes a supplementary layer provided under the stamp body portion, and the insertion groove may be formed by the through hole.

In an embodiment of the present invention, the heating unit may be provided in the insertion groove, and the adhesive layer may be provided to cover the heating unit.

In an embodiment of the present invention, the heating unit may be provided inside the complementary layer.

On the other hand, in order to achieve the above technical problem, an embodiment of the present invention is a stamp body portion; an adhesive layer provided under the stamp body and having an insertion groove in the center of which a defective element of the substrate is inserted; And provided under the adhesive layer, it provides a defective element removal stamp, characterized in that it comprises a heating unit for heating the adhesive layer so that the defective element inserted into the insertion groove is adhered to the adhesive layer.

On the other hand, in order to achieve the above technical problem, an embodiment of the present invention is a stamp body having a protrusion at the lower portion; an adhesive layer provided under the protrusion and in contact with the defective element of the substrate; And it is provided in the stamp body portion, it provides a defective element removal stamp comprising a heating unit for heating the adhesive layer so that the defective element is adhered to the adhesive layer.

In an embodiment of the present invention, the protrusion may be integrally formed with the stamp body.

In an embodiment of the present invention, the heating unit may be provided under the protrusion, and the adhesive layer may be provided to cover the heating unit under the protrusion.

In an embodiment of the present invention, the heating unit may be provided on the periphery of the protrusion in the lower portion of the stamp body.

In an embodiment of the present invention, a complementary layer is provided under the stamp body to form the protrusion.

In an embodiment of the present invention, the heating unit may be provided inside the supplementary layer, and the adhesive layer may be provided under the supplementary layer.

In an embodiment of the present invention, the heating unit may be provided under the complementary layer, and the adhesive layer may be provided to cover the heating unit under the complementary layer.

In an embodiment of the present invention, the heating unit may be provided on the periphery of the supplementary layer in the lower portion of the stamp body, and the adhesive layer may be provided on the lower portion of the supplementary layer.

In an embodiment of the present invention, the heating unit may be a Joule heating heater formed in the form of a metal wire.

In an embodiment of the present invention, the heating unit may be an induction heating heater.

In an embodiment of the present invention, the heating unit may be formed in a heating pattern, and may be heated by light irradiated from the irradiation unit.

In an embodiment of the present invention, the adhesive layer may be formed of a thermosetting polymer.

In an embodiment of the present invention, the adhesive layer may be formed of a UV curable polymer.

In an embodiment of the present invention, a rotary rod coupled to the stamp body, extending vertically upward and having a thread formed on an outer circumferential surface, and selectively screwed with the rotary rod to guide the rotary rod to rise while being rotated And a guide to lower or rotate the rotary rod, and includes a rotary elevating part having a driving part for selectively screwing the guide to the rotary rod, and the stamp body part is rotated together with the rotary rod and raised while being adhered. The defective element may also be separated from the substrate while being rotated together with the stamp body.

On the other hand, in order to achieve the above technical problem, an embodiment of the present invention includes a plurality of defective element removal stamps, and one of the plurality of defective element removal stamps is selected by selecting one of the defective element removal stamps. It provides a device for removing defective elements, characterized in that the adhesive.

In an embodiment of the present invention, a tape is connected to a pair of spaced apart rollers and supplied, and the plurality of stamps for removing defective elements are attached to the lower surface in a line, and the tape is installed to be lifted and lowered on the upper side of the tape, and the and a pressing head for pressing one of the plurality of stamps for removing defective elements attached in a line to the defective element by pressing the tape downward.

In an embodiment of the present invention, the plurality of stamps for removing defective elements are installed in an array form on the lower surface of the attachment film, and horizontally and vertically from the upper side of the attachment film, and the attachment film is pressed downward. to have a pressing rod for pressing one of the plurality of stamps for removing defective elements attached in an array form to the defective element.

According to an embodiment of the present invention, an adhesive layer is provided in the insertion groove formed in the stamp body portion so that the defective element of the substrate is inserted so that the defective element is inserted into the insertion groove to be in contact with the adhesive layer heated by the heating unit. By allowing the defective element to adhere, the defective element can be effectively separated from the substrate.

In addition, according to an embodiment of the present invention, the protrusion formed on the stamp body is provided with an adhesive layer so that the defective element is in contact, and the defective element is removed from the substrate by making the defective element adhere to the adhesive layer heated by the heating unit. can be effectively separated.

It should be understood that the effects of the present invention are not limited to the above-described effects, and include all effects that can be inferred from the configuration of the invention described in the detailed description or claims of the present invention.

1 is an exemplary view showing a stamp for removing a defective element according to a first embodiment of the present invention.
Figure 2 is a cross-sectional view of the stamp for removing the defective element of Figure 1.
3 is an exemplary view showing another example of the stamp for removing the defective element of FIG. 1 .
Figure 4 is an operation example of the stamp for removing the defective element of Figure 1.
5 is an exemplary view showing another example of the stamp for removing the defective element according to the first embodiment of the present invention.
Figure 6 is an operation example of the stamp for removing the defective element of Figure 5.
7 is a cross-sectional view showing another example of the stamp for removing the defective element according to the first embodiment of the present invention.
8 is a cross-sectional view showing another example of the stamp for removing defective elements according to the first embodiment of the present invention.
9 is a cross-sectional view illustrating a stamp for removing defective elements according to a second embodiment of the present invention.
Figure 10 is an operation example of the stamp for removing the element of Figure 9.
11 is an exemplary view showing a stamp for removing a defective element according to a third embodiment of the present invention.
12 is a cross-sectional view of the stamp for removing the defective element of FIG. 11 .
13 is a view illustrating an operation of the stamp for removing the defective element of FIG. 11 .
14 is a cross-sectional view showing another example of a stamp for removing defective elements according to a third embodiment of the present invention.
15 is a cross-sectional view showing another example of a stamp for removing defective elements according to a third embodiment of the present invention.
16 is a cross-sectional view showing another example of a stamp for removing defective elements according to a third embodiment of the present invention.
17 is a cross-sectional view showing another example of a stamp for removing defective elements according to a third embodiment of the present invention.
18 is an exemplary view illustrating an apparatus for removing a defective element according to a first embodiment of the present invention.
19 is an operational view of the device for removing defective elements of FIG. 18 .
20 is an exemplary view illustrating an apparatus for removing a defective element according to a second embodiment of the present invention.
FIG. 21 is an operation exemplary view of the apparatus for removing defective elements of FIG. 20 .

Hereinafter, the present invention will be described with reference to the accompanying drawings. However, the present invention may be embodied in several different forms, and thus is not limited to the embodiments described herein. And in order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification.

Throughout the specification, when it is said that a part is “connected (connected, contacted, coupled)” with another part, it is not only “directly connected” but also “indirectly connected” with another member in between. “Including cases where it is In addition, when a part "includes" a certain component, this means that other components may be further provided without excluding other components unless otherwise stated.

The terminology used herein is used only to describe specific embodiments, and is not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In this specification, terms such as “comprise” or “have” are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification exist, and one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exemplary view illustrating a stamp for removing a defective element according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the stamp for removing a defective element of FIG. 1 .

1 and 2 , the stamp 100 for removing defective elements may include a stamp body 110 , a heating unit 120 , and an adhesive layer 130 .

The stamp body 110 may form a body of the stamp 100 for removing defective elements. In this embodiment, the stamp body 110 may have an insertion groove 115 in the lower portion 111 . The insertion groove 115 may be formed to be recessed in the stamp body 110 , and may be formed to be slightly larger than the defective element to correspond to the shape of the defective element, so that the defective element can be inserted. The insertion groove 115 may be formed through an etching process or the like.

The adhesive layer 130 may be provided in the insertion groove 115 , and when a defective element is inserted into the insertion groove 115 , the defective element may contact the adhesive layer 130 .

The heating unit 120 may be provided in the stamp body unit 110 , and in this embodiment, the heating unit 120 may be provided in the insertion groove 115 . In addition, for convenience of installation, the heating unit 120 may be disposed on the bottom of the insertion groove 115 .

The adhesive layer 130 may be provided to cover the heating unit 120 inside the insertion groove 115 . When a defective element is inserted into the insertion groove 115 , the defective element may come into contact with the adhesive layer 130 . The thickness of the adhesive layer 130 may be formed to be smaller than the depth of the insertion groove 115 .

The adhesive layer 130 may be heated by the heating unit 120 so that the contacted defective element is adhered while the state changes. To implement this function, preferably, the adhesive layer 130 may be formed of a thermosetting polymer.

In addition, the heating unit 120 may heat a connecting material that electrically connects the defective element and the substrate. The heated connection material may be melted, and thus the bonding force between the defective element and the substrate may be weakened. In this state, when the stamp body part 110 is raised, the defective element may be lifted together with the stamp body part 110 and removed from the substrate.

The heating unit 120 may be in the form of a metal wire, and may be a Joule heating heater. Alternatively, the heating unit 120 may be an induction heating heater heated by an induction heating method.

In addition, the adhesive layer 130 may be formed of a UV curable polymer. In this case, by irradiating UV to the adhesive layer 130 to cure the adhesive layer 130 , the defective device may be adhered to the adhesive layer 130 . Also, in this case, the heating unit 120 may melt the connecting material so that the bonding force between the defective element and the connecting material is removed.

3 is an exemplary view showing another example of the stamp for removing the defective element of FIG. 1 , as shown in FIG. 3 , the heating unit 120 may be formed in a fine heating pattern. In addition, the stamp 100 for removing defective elements may include an irradiation unit 140 . The irradiation unit 140 may irradiate the light 141 to the heating unit 120 formed in a fine heating pattern, whereby heat is generated locally in the groove of the fine heating pattern, so that the heating unit 120 is heated. can The light 141 irradiated from the irradiator 140 may be ultraviolet, visible, near-infrared, mid-infrared (MIR), or far-infrared (Far-IR). The adhesive layer 130 and the connection material may be simultaneously heated by the heating unit 120 .

Hereinafter, an operation example of the stamp for removing defective elements will be described.

Figure 4 is an operation example of the stamp for removing the defective element of Figure 1.

As shown in (a) of FIG. 4 , the stamp for removing the defective element may be provided such that the insertion groove 115 is aligned and positioned on the upper side of the defective element 11 on the substrate 10 . The stamp for removing defective elements may include a lifting rod 150 , and the lifting rod 150 may be connected to the stamp body 110 . The lifting rod 150 may be moved straight in the vertical direction, and through this, the stamp body 110 may be vertically raised and lowered.

When the stamp body part 110 is vertically lowered by the lifting rod 150 , the defective element 11 may be inserted into the insertion groove 115 . The upper surface of the defective element 11 inserted into the insertion groove 115 may be in contact with the adhesive layer 130 . The insertion groove 115 corresponds to the shape of the defective element 11 , but is formed to be slightly larger than the defective element 11 , so that the defective element 11 can be stably inserted into the insertion groove 115 ( FIG. 4 ). of (b)).

Thereafter, when the heating unit 120 is heated, the adhesive layer 130 may be melted and the upper portion of the defective element 11 may be buried in the adhesive layer 130 . In addition, when the heating unit 120 is heated to a first temperature at which the adhesive layer 130 is cured, the defective element 11 may be firmly adhered to the adhesive layer 130 while the polymer is cured.

In addition, the heating unit 120 may be heated to a second temperature higher than the first temperature. Then, the connection material 12 connecting the substrate 10 and the defective element 11 may be melted, and through this, the bonding force between the connection material 12 and the substrate 10 may be reduced, and the adhesive layer ( The adhesive force between 130 ) and the defective element 11 may be greater than the adhesion between the defective element 11 and the substrate 10 (see FIG. 4(c) ).

Then, when the lifting rod 150 rises and the stamp body 110 rises accordingly, the defective element 11 adhered to the adhesive layer 130 may be separated from the substrate 10 and removed.

Meanwhile, the heating unit 120 may be positioned differently. Figure 5 is an exemplary view showing another example of the stamp for removing the defective element according to the first embodiment of the present invention, Figure 6 is an operation example of the stamp for removing the defective element of Figure 5. In this embodiment, only the position of the heating unit is different, and other configurations may be the same as in the above-described embodiment.

That is, as shown in FIGS. 5 and 6 , the heating unit 120 may be provided around the insertion groove 115 in the lower portion of the stamp body 110 . According to this embodiment, as shown in (c) of FIG. 6 , when the defective element 11 is inserted into the insertion groove 115 and the heating unit 120 is heated while in contact with the adhesive layer 130 , Since the distance between the heating unit 120 and the connection material 12 can be relatively closer than the distance between the heating unit 120 and the connection material 12 in FIG. 4(c), the connection material 12 is melted. The time required to do it can be further shortened. In addition, it is possible to observe a change in the position of the defective element 11 inserted into the insertion groove 115 during the curing of the adhesive layer 130 and the melting of the connection material 12 .

Of course, in this embodiment as well, the heating unit 120 may be formed in a metal wiring form, induction heating form, or a fine heating pattern and may be implemented in a form heated by irradiated light.

On the other hand, the insertion groove may not be directly formed in the stamp body (110). That is, FIG. 7 is a cross-sectional view showing another example of the stamp for removing the defective element according to the first embodiment of the present invention. As shown in FIG. 7 , the stamp for removing the defective element 100b is a complementary layer 160 ) may be included.

The supplementary layer 160 may be provided under the stamp body 110 . A through hole may be formed in the center of the supplementary layer 160 , and this through hole may become an insertion groove 161 . The complementary layer 160 may be formed of a polymer material, but is not limited thereto.

In addition, the heating unit 120 may be provided in the insertion groove 161 , and the adhesive layer 130 may be provided in the insertion groove 161 to cover the heating unit 120 .

In addition, a position at which the heating unit 120 is provided may be applied in various ways.

That is, FIG. 8 is a cross-sectional view showing another example of the stamp for removing the defective element according to the first embodiment of the present invention. As shown in FIG. 8, in the stamp 100c for removing the defective element, the heating unit 120 ) may be provided in the supplementary layer 160 . In this case, the heating part 120 is first disposed on the lower surface of the stamp body part 110 , and then the supplementary layer 160 may be provided to cover the heating part 120 . In addition, the adhesive layer 130 may be provided in the insertion groove 161 .

It goes without saying that the above-described lifting rod is provided in the stamp for removing defective elements described in FIGS. 5 to 8 to elevate the stamp body.

Meanwhile, the stamp for removing defective elements may include an adhesive layer of another type.

9 is a cross-sectional view illustrating a stamp for removing a defective element according to a second embodiment of the present invention, and FIG. 10 is an operational view of the stamp for removing the element of FIG. 9 .

9 and 10, in the stamp 100d for removing the defective element according to the present embodiment, the adhesive layer 130 may have an insertion groove 131 in the center into which the defective element of the substrate is inserted, the stamp It may be provided under the body portion 110 .

In addition, the heating unit 120 may be provided under the adhesive layer 130 . Alternatively, the heating unit 120 may be provided between the adhesive layer 130 and the stamp body unit 110 .

In addition, in the present embodiment, the stamp 100d for removing the defective element may include a rotating lifting unit 170 . In addition, the rotating lifting unit 170 may have a rotating rod 171 , a guide 172 , and a driving unit 173 .

The rotary rod 171 may have a lower end coupled to the upper portion of the stamp body 110, and may be vertically extended upwardly. A screw thread may be formed on the outer peripheral surface of the rotating rod 171 .

A pair of guides 172 may be provided on both sides of the rotating rod 171 , and may be coupled to the rotating rod 171 or separated from the rotating rod 171 . A screw thread capable of being screwed with the screw thread of the rotating rod 171 may be formed on the inner circumferential surface of the guide 172 .

The driving unit 173 may lower or rotate the rotating rod 171 . In addition, the driving unit 173 is a guide 172 so that the guide 172 is screwed to, or not screwed to, the rotary rod 171, that is, the guide 172 and the rotary rod 171 are selectively screwed together. can be moved

As shown in (a) and (b) of Figure 10, in a state in which the stamp body part 110 is located on the upper side of the defective element 11, the driving part 173 is the guide 172 is the rotating rod 171 to be separated from and the rotating rod 171 may be lowered. At this time, the rotating rod 171 may be moved straight down without being rotated, and through this, the defective element 11 may be inserted into the insertion groove 131 .

Then, as shown in (c) and (d) of Figure 10, after the heating unit 120 heats the adhesive layer 130 and heats and melts the connection material 12, the driving unit 173 is a guide By moving (172), it can be screwed to the rotating rod (171). In addition, the driving unit 173 may rotate (R) the rotating rod 171 so that the rotating rod 171 moves upward. When the rotating rod 171 is rotated, the adhesive layer 130 together with the stamp body 110 is rotated (R), and the defective element 11 inserted into the insertion groove 131 is a side surface of the adhesive layer 130 . It can be fixed while being inserted into the Thereafter, the defective element 11 may be separated from the substrate 10 while rotating (R) together with the adhesive layer 130 , and may be separated from the substrate 10 while moving upward.

Of course, even in the stamp for removing defective elements described in FIGS. 7 to 9 , the heating unit 120 may be formed in a metal wiring form, induction heating form, or a fine heating pattern, and may be implemented in a form heated by irradiated light.

11 is an exemplary view showing a stamp for removing defective elements according to a third embodiment of the present invention, FIG. 12 is a cross-sectional view of the stamp for removing defective elements of FIG. 11, and FIG. 13 is for removing defective elements of FIG. This is an example of the operation of the stamp. In the following embodiments, the stamp for removing defective elements may have a protrusion rather than an insertion groove, and accordingly, the positions of the heating unit and the adhesive layer may vary, but the heating unit and the adhesive layer are the same as in the above-described embodiment, so the repeated Descriptions are omitted as much as possible.

11 to 13 , in the stamp 100e for removing defective elements according to the present embodiment, the stamp body 110 may have a protrusion 116 formed at a lower portion thereof. The protrusion 116 may be formed to be smaller than the size of the defective element 11 .

In addition, the heating unit 120 may be provided under the protrusion 116 , and the adhesive layer 130 may be provided under the protrusion 116 to cover the heating unit 120 .

As shown in (a) to (d) of Figure 13, the stamp body portion 110 is lowered by the lifting rod 150 is heated in a state in which the adhesive layer 130 is in contact with the upper surface of the defective element (11). When the part 120 is heated, the defective element 11 may be adhered to the adhesive layer 130 , and the connection material 12 may be melted. Thereafter, when the elevating rod 150 rises while the adhesive layer 130 is hardened and the defective element 11 is firmly adhered to the adhesive layer 130 , the defective element 11 may be separated from the substrate 10 . there is.

Meanwhile, the heating unit 120 may be positioned differently. 14 is a cross-sectional view showing another example of a stamp for removing defective elements according to a third embodiment of the present invention. In this embodiment, only the position of the heating unit is different, and other configurations may be the same as in the embodiment described above. That is, as shown in FIG. 14 , the heating unit 120 may be provided around the protrusion 116 in the lower portion of the stamp body 110 .

On the other hand, the protrusion may not be formed integrally with the stamp body portion (110). That is, Figure 15 is a cross-sectional view showing another example of the stamp for removing the defective element according to the third embodiment of the present invention, as shown in Fig. 15, the stamp for removing the defective element (100g) is a complementary layer (160a) ) may be included.

The supplementary layer 160a may be provided in the lower center of the stamp body 110, and the supplementary layer 160a may function as a protrusion. The complementary layer 160a may be a polymer.

In addition, the heating unit 120 may be provided inside the supplementary layer 160a, and the adhesive layer 130 may be provided under the supplementary layer 160a.

In addition, a position at which the heating unit 120 is provided may be applied in various ways.

That is, Figure 16 is a cross-sectional view showing another example of the stamp for removing the defective element according to the third embodiment of the present invention, as shown in Fig. 16, the stamp for removing the defective element according to the present embodiment (100h) In this case, the heating unit 120 may be provided under the complementary layer 160a. In addition, the adhesive layer 130 may be provided to cover the heating unit 120 under the complementary layer 160a.

And, Figure 17 is a cross-sectional view showing another example of the stamp for removing the defective element according to the third embodiment of the present invention, as shown in Fig. 17, the stamp for removing the defective element according to the present embodiment (100i) In the heating unit 120 may be provided on the periphery of the complementary layer (160a) in the lower portion of the stamp body (110). In addition, the adhesive layer 130 may be provided under the complementary layer 160a to be in contact with a defective device.

Of course, even in the stamp for removing defective elements described in FIGS. 11 to 17 , the heating unit 120 may be formed in the form of a metal wire, induction heating, or a fine heating pattern, and may be implemented in a form that is heated by irradiated light.

In addition, the lifting rod 150 (refer to FIG. 4) has been described in the first and third embodiments, and the rotary lifting unit 170 (refer to FIG. 10) has been described in the second embodiment, but the lifting rod and rotation The lifting unit may be applied to all of the first to third embodiments.

Hereinafter, an apparatus for removing defective elements including the above-described stamp for removing defective elements will be described.

18 is an exemplary view illustrating an apparatus for removing a defective element according to a first embodiment of the present invention, and FIG. 19 is an operational view of the apparatus for removing a defective element of FIG. 18 .

18 and 19 , the apparatus for removing a defective element may include a stamp 100 for removing a defective element, a tape 200 and a pressure head 300 .

Since the stamp 100 for removing the defective element has been described above, a description thereof will be omitted.

The tape 200 may be connected to a pair of rollers 210 and 220 spaced apart from each other. The tape 200 may be wound around the second roller 220 while being unwound while being wound around the first roller 210 .

The tape 200 may be in a state in which a plurality of stamps 100 for removing defective elements are attached in a line. A plurality of stamps 100 for removing defective elements may be attached to the lower surface of the tape 200 unwound from the first roller 210 to protrude downward.

The pressure head 300 may be installed so as to move up and down on the upper side of the tape 200 . To this end, the lifting block 310 may be provided on the upper portion of the pressing head 300 , and the pressing head 300 and the lifting block 310 may be raised and lowered integrally.

The stamp 100 for removing one defective element may be used for one defective element. Therefore, since the bad element removal stamp used to remove any one defective element cannot be reused, a new bad element removal stamp for removing the new defective element is selected and located in the lower center of the pressing head 300 . need to be In this embodiment, as shown in FIG. 19 (a), after the stamp 100a for removing defective elements is used to remove any one defective element, the first roller 210 and the second roller 220 By rotating the tape 200 to supply the new defective element removal stamp (100b) can be located in the center of the lower portion of the pressure head (300). And, after removing other defective elements using the defective element removal stamp 100b, the tape 200 may be supplied again to use a new defective element removal stamp 100c.

20 is an exemplary view illustrating an apparatus for removing a defective element according to a second exemplary embodiment of the present invention, and FIG. 21 is an exemplary operation view of the apparatus for removing a defective element of FIG. 20 .

As shown in FIGS. 20 and 21 , the device for removing a defective element may include a stamp 100 for removing a defective element, an attachment film 400 , and a pressure rod 500 .

The attachment film 400 may be provided in a horizontal state, and a stamp 100 for removing defective elements may be attached to the lower surface of the attachment film 400 in the form of an array. The stamp 100 for removing defective elements attached to the lower surface of the attachment film 400 may protrude downward.

The pressure rod 500 may be installed to be horizontally movable on the upper side of the attachment film 400 . Specifically, the device for removing defective elements may have a horizontal guide 510 extending in the XY direction on a horizontal surface, and a slider 520 coupled to slide on the horizontal guide 510 and coupled to the pressing rod 500 . there is. Accordingly, the pressure rod 500 may be horizontally movable.

In addition, the pressure rod 500 may be installed to be liftable from the upper side of the attachment film 400 .

After the defective element removal stamp 100a is used to remove any one defective element, the pressure rod 500 may be horizontally moved to be positioned above the new defective element removal stamp 100b. And after lowering the pressure rod 500 and using the stamp 100b for removing the defective element to remove other defective elements, the pressure rod 500 is moved horizontally again to use a new stamp for removing the defective element (100c) is used. can make it happen

The description of the present invention described above is for illustration, and those of ordinary skill in the art to which the present invention pertains can understand that it can be easily modified into other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. For example, each component described as a single type may be implemented in a dispersed form, and likewise components described as distributed may also be implemented in a combined form.

The scope of the present invention is indicated by the following claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention.

11: Bad element 12: Connection material
100: stamp for removing defective elements 110: stamp body part
115, 161: insertion groove 116: protrusion
120: heating unit 130: adhesive layer
141: light 150: elevating rod
160, 160a: complementary layer 170: rotary elevator
171: rotating rod 172: guide
173: driving unit 200: tape
300: pressure head 400: attaching film
500: pressure rod

Claims (25)

a stamp body portion having an insertion groove at the bottom so that a defective element of the substrate is inserted;
an adhesive layer provided in the insertion groove to be in contact with the defective element when it is inserted into the insertion groove; And
The stamp for removal of a defective element is provided in the stamp body portion, characterized in that it comprises a heating unit for heating the adhesive layer so that the defective element is adhered to the adhesive layer. According to claim 1,
The insertion groove is a stamp for removing a defective element, characterized in that the depression is formed in the lower portion of the stamp body. 3. The method of claim 2,
The heating unit is provided in the insertion groove,
The adhesive layer is a stamp for removing defective elements, characterized in that provided to cover the heating unit. 3. The method of claim 2,
The heating part is a stamp for removing a defective element, characterized in that provided on the periphery of the insertion groove in the lower part of the stamp body. According to claim 1,
It has a through hole formed through the center, and includes a supplementary layer provided under the stamp body part,
The insertion groove is a stamp for removing a defective element, characterized in that formed by the through hole. 6. The method of claim 5,
The heating unit is provided in the insertion groove,
The adhesive layer is a stamp for removing defective elements, characterized in that provided to cover the heating unit. 6. The method of claim 5,
The stamp for removing defective elements, characterized in that the heating unit is provided inside the supplementary layer. stamp body;
an adhesive layer provided under the stamp body and having an insertion groove in the center of which a defective element of the substrate is inserted; And
A defective element removal stamp provided under the adhesive layer and comprising a heating unit for heating the adhesive layer so that the defective element inserted into the insertion groove is adhered to the adhesive layer. a stamp body having a protrusion at the lower portion;
an adhesive layer provided under the protrusion and in contact with the defective element of the substrate; And
The stamp for removal of a defective element is provided in the stamp body portion, characterized in that it comprises a heating unit for heating the adhesive layer so that the defective element is adhered to the adhesive layer. 10. The method of claim 9,
The stamp for removing defective elements, characterized in that the protrusion is integrally formed with the stamp body. 11. The method of claim 10,
The heating unit is provided under the protrusion,
The adhesive layer is a stamp for removing a defective element, characterized in that provided to cover the heating unit under the protrusion. 11. The method of claim 10,
The heating part is a stamp for removing defective elements, characterized in that provided on the periphery of the protrusion in the lower portion of the stamp body. 11. The method of claim 10,
The stamp for removing defective elements, characterized in that it comprises a complementary layer provided under the stamp body portion to form the protrusion. 14. The method of claim 13,
The heating unit is provided inside the complementary layer,
The adhesive layer is a stamp for removing defective elements, characterized in that provided under the complementary layer. 14. The method of claim 13,
The heating unit is provided under the complementary layer,
The adhesive layer is a stamp for removing defective elements, characterized in that provided to cover the heating unit under the complementary layer. 14. The method of claim 13,
The heating unit is provided on the periphery of the supplementary layer in the lower part of the stamp body,
The adhesive layer is a stamp for removing defective elements, characterized in that provided under the complementary layer. 10. The method of any one of claims 1, 8 and 9,
The heating part is a Joule heating (Joule Heating) heater formed in the form of a metal wire, a stamp for removing a defective element, characterized in that. 10. The method of any one of claims 1, 8 and 9,
The stamp for removing defective elements, characterized in that the heating unit is an induction heating heater. 10. The method of any one of claims 1, 8 and 9,
The heating part is formed in a heating pattern, and the stamp for removing defective elements, characterized in that heated by the light irradiated from the irradiation part. 10. The method of any one of claims 1, 8 and 9,
The adhesive layer is a stamp for removing defective elements, characterized in that formed of a thermosetting polymer. 10. The method of any one of claims 1, 8 and 9,
The adhesive layer is a stamp for removing defective elements, characterized in that formed of a UV curable polymer. 10. The method of any one of claims 1, 8 and 9,
a rotating rod coupled to the stamp body, extending vertically upward and having a thread formed on an outer circumferential surface;
a guide selectively screwed with the rotating rod to guide the rotating rod to rise while rotating;
It lowers or rotates the rotary rod, and includes a rotary elevating unit having a driving unit for selectively screwing the guide to the rotary rod,
When the stamp body part is rotated and raised while rotating with the rotating rod, the defective element attached to the stamp is also rotated together with the stamp body part and separated from the substrate. It includes a plurality of stamps for removing defective elements according to any one of claims 1, 8 and 9,
Defective element removal apparatus, characterized in that one of the plurality of defective element removal stamps are selected and adhered to the defective element removal stamp. 24. The method of claim 23,
A tape connected to a pair of spaced apart rollers and supplied, to which the plurality of defective element removal stamps are attached in a line to a lower surface thereof;
It is installed on the upper side of the tape so as to be lifted and lowered, and includes a pressure head for pressing one of the plurality of defective element removal stamps attached in a line to the defective element by pressing the tape downward. A device for removing defective elements, characterized in that. 24. The method of claim 23,
An adhesive film to which the plurality of defective element removal stamps are attached to the lower surface in the form of an array;
One of the plurality of defective element removal stamps installed in the upper side of the attachment film to be horizontally movable and elevating, and which is attached in the form of an array by pressing the attachment film downward, is pressed to the defective element A device for removing defective elements, characterized in that it has a pressing rod.

Images