JP2008053408A - Mounting method of led module array - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a simple mounting method which does not require cost increase and also makes the thickness of each die bond paste constant, when mounting two or more LED chips by using die bond paste to a substrate. <P>SOLUTION: Two or more LED chips are mounted to a substrate by using a mount jig shown below. This mount jig comprises a substrate for holding the substrate and a mask holding substrate. The one end of the substrate for holding the substrate and the one end of the mask holding substrate are connected with a rotation stick. Each of this substrate holding substrate and this mask holding substrate can rotate 180° degrees to a major axis direction of this rotation stick. As opposed to a major axis direction of this axis-of-rotation stick, when this substrate holding substrate and this mask holding substrate are 0°, the upper surface of this substrate holding substrate and the upper surface of this mask holding substrate come into contact. It is carried out such that a substrate is set to this substrate holding substrate, and to this mask holding substrate, a mask for screen-stencil and a LED chip positioning mask are attached. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to an LED module array mounting method for mounting an LED chip using a die bond paste on a substrate. More specifically, a plurality of LED chips are mounted on a substrate using a die bond paste.

Conventionally, when mounting a plurality of components (LED chip 16 or the like) on a substrate 4 or the like with a die bond paste 7, first, as shown in FIG. 21 (a), a die bond paste 7 that is a thermosetting resin is attached to a plurality of LED chips. 16 is supplied in advance to a predetermined position of the substrate 4 on which the tower 16 is mounted by screen printing or the like. The LED chip 16 is vacuum-adsorbed by the die collet 26 and aligned with the substrate 4 using image recognition or the like. Next, as shown in FIG. 21B, a predetermined load is applied by the die collet 26, and the LED chip 16 is mounted on the substrate 4. The LED chips 16 are sequentially mounted on the substrate, and all the LED chips 16 are mounted as shown in FIG. Thereafter, as shown in FIG. 21D, the die bond paste is heated and cured using an oven or a reflow furnace 27.
(See JP-A-11-251335.)

JP-A-11-251335 ([0003], [0004] and FIGS. 6 (a) to (d))

However, in the above prior art, the means for aligning the LED chip to the die bond paste applied to the substrate uses an image technology, which results in a large-scale device, increasing the device cost. Since mounting on the substrate is performed individually, it is difficult to make the thickness of each die bond paste constant.

Therefore, in view of the above-described points, the present invention can mount a large number of LED chips on a substrate by using a die bond paste in a simple method that does not increase the cost of the apparatus, and the thickness of each die bond paste is constant. It is an object to provide a mounting method.

In order to solve the above-described problems, a mounting method of an LED module array according to the present invention is a mounting method of an LED module array in which a plurality of LED chips are mounted on a substrate via a die bond paste. The jig is composed of a substrate holding substrate and a mask holding substrate, and one end of the substrate holding substrate and one end of the mask holding substrate are connected by a rotating rod, and the substrate holding substrate with respect to the major axis direction of the rotating rod And the mask holding substrate can rotate 180 degrees, and when the substrate holding substrate and the mask holding substrate are 0 degrees with respect to the longitudinal direction of the rotary shaft, the upper surface of the substrate holding substrate and the mask holding substrate The top surface is in contact with the mounting jig, using the steps shown below,
(1) Open the substrate holding substrate and the mask holding substrate of the mounting jig at 180 degrees.
(2) Next, the substrate is placed at a predetermined position on the upper surface of the substrate holding substrate of the mounting jig.
(3) Next, a screen printing mask for printing a die bond paste for mounting a plurality of LED chips on the substrate is set on the back surface of the mask holding substrate.
(4) Next, the mask holding substrate on which the screen printing mask is set is rotated, the upper surface of the mask holding substrate is the upper surface of the substrate holding substrate, and the upper surface of the substrate is the screen printing mask. To touch the top surface,
(5) Next, using the screen printing mask, a die bond paste for mounting a plurality of LED chips is screen-printed, and a plurality of die bond pastes are formed at locations where the plurality of LED chips are mounted. Open the holding substrate at 180 degrees, and remove the screen printing mask from the mask holding substrate.
(6) Next, an LED chip positioning mask is attached to the mask holding substrate, and a plurality of LED chips are placed in a plurality of LED chip positioning openings formed in the LED chip positioning mask.
(7) Next, the substrate holding substrate on which the screen-printed substrate is mounted is rotated 180 degrees with respect to the major axis direction of the rotating rod, and a plurality of die bond pastes formed on the substrate are converted into the LED chip. And the upper surface of the substrate holding substrate is in contact with the upper surface of the mask holding substrate.
(8) Next, after rotating the mounting jig by 180 degrees, using the leveling jig in which a plurality of protrusions are formed, the plurality of protrusions of the leveling plate are moved to the openings of the LED chip tower. And the upper surface of the LED chip is pressed by the protrusions of the leveling plate, and the thickness of the plurality of die bond pastes is made uniform.
(9) Next, in a state where a plurality of the LED chips are pressed with the leveling plate, the die bond paste is cured.
(10) Rotate the mask holding substrate by 180 degrees, and remove the substrate on which a plurality of LED chips are mounted from the substrate holding substrate via the die bond paste.
Thus, a plurality of LED chips are mounted on the substrate.

In the mounting method of the LED module array of the present invention, the mounting jig used in the mounting method of the present invention is such that one end of the substrate holding substrate and one end of the mask holding substrate are connected by the rotating rod, Each of the holding substrate and the mask holding substrate can be manually rotated 180 degrees with respect to the long axis direction of the rotating rod, and the mounting jig can be easily turned over. It is a jig, and the attachment / detachment of the substrate holding substrate 2 to / from the substrate, and the attachment / detachment of the screen printing mask 5, the LED chip positioning mask, and the leveling plate to / from the mask holding substrate are easy and manual. Therefore, the apparatus cost can be greatly reduced as compared with the conventional large-scale apparatus.
Further, the setting of the substrate to the substrate holding substrate and the setting of the plurality of LED chips to the LED chip positioning mask are performed individually, but the mounting of the plurality of LED chips on the substrate and the leveling plate are performed. Since the pressing of the plurality of LED chips at the same time is performed at the same time, there is no variation among the plurality of LED chips, and the mount has excellent reliability (the positional deviation between the die bond paste applied to the substrate and the plurality of LED chips). Is not possible).
Further, the leveling plate can apply a uniform force to the plurality of LED chips, and the die bonding paste can be cured in a state where the LED chip is pressed with a uniform force by the leveling plate. The thickness of the die bond paste between the LED chips becomes uniform, and it is possible to provide an LED chip array that allows light irradiation without variation among a plurality of LEDs.

Embodiments of the present invention will be described below with reference to the drawings.

(Example 1)
FIG. 1 shows a mounting jig used in the LED module array mounting method of the present invention.
The mounting jig 1 includes a mask holding substrate 3, a substrate holding substrate, and a rotating rod 6, and one end of the mask holding substrate 3 and one end of the substrate holding substrate 2 are connected by the rotating rod 6. The mask holding substrate 3 and the substrate holding substrate 2 are rotated 180 degrees with respect to the major axis direction of the rotating rod 6.

The mounting method of the LED module of this invention using said mounting jig 1 is demonstrated below using FIGS.

2 to 18 are process cross-sectional views for explaining the process of the LED module array mounting method of the present invention.
FIG. 2 is a cross-sectional view of the mounting jig 1 shown in FIG.
Using the mounting jig 1 shown in FIG. 2, the mask holding substrate 3 is rotated 180 degrees with respect to the major axis direction of the rotating rod 6 (see FIG. 3).
Next, the screen printing mask 5 is set on the back surface 18 of the mask holding substrate 3.
The screen printing mask 5 is attached to the mask holding substrate 3 by a mask fixing nut 9 through positioning holes (not shown) that fit into four mask positioning pins 8 arranged at predetermined predetermined positions ( See FIG.
Next, the substrate 4 is attached to the substrate holding substrate 2 (see FIG. 5). In FIG. 5, the method of attaching the substrate holding substrate 2 to the substrate 4 is performed by using a non-adhesive (not shown) attached to the substrate holding substrate 2 or by providing a hole or the like in the substrate holding substrate 2. , By suction by vacuum suction. The non-adhesive material has appropriate adhesiveness to the substrate 4, and can easily be removed, the adhesive component does not remain on the substrate 4 even if it is removed, and can be attached and removed many times. A material that can withstand the curing temperature of the die bond paste 7 is desirable.
Further, the attachment position of the substrate 4 to the substrate holding substrate 2 is made to coincide with the position of the opening 24 of the screen printing mask. As a method of matching, the substrate 4 is temporarily placed on the substrate holding substrate 2, the mask holding substrate 3 is rotated 180 degrees, and the substrate 4 is aligned with the screen printing mask to reach a desired position. Thus, a very simple method of adjusting the position by moving the substrate 4 up and down and right and left is also possible.
Next, in FIG. 5 described above, the screen printing mask 5 is rotated 180 degrees with respect to the major axis direction of the rotating rod (see FIG. 6). In FIG. 6, the upper surface 10 of the substrate 4 and the upper surface 14 of the screen printing mask 5 may be in contact with each other or there may be a slight gap. Of course, the opening 24 of the screen printing mask 5 and the position of the substrate 4 coincide.
Further, when the thickness of the substrate 4 is smaller than the thickness of the screen printing mask 5, the substrate 4 is placed on the substrate height adjusting plate 23 as shown in FIGS. 19 (a) and 19 (b). The thickness of the substrate + the thickness of the substrate height adjusting plate = the thickness of the screen printing substrate.
Next, the die bond paste 7 is applied to a predetermined place of the screen printing mask 5, and the die bond paste 7 is filled into the opening 24 of the screen printing mask 5 using a squeegee (not shown). (See FIG. 7.)
Next, the screen printing mask 5 is rotated 180 degrees with respect to the major axis direction of the rotating rod 6 (see FIG. 8).
Next, the screen printing mask 5 is removed from the mask holding substrate 3 (see FIG. 9).
Next, the LED positioning mask 15 is set on the back surface 18 of the mask holding substrate 3.
The LED chip positioning mask 15 is fixed to the mask holding substrate 9 by the mask fixing nut 9 through positioning holes (not shown) that fit into four of the mask positioning pins 8 arranged at predetermined positions. 3 (see FIG. 10).
Next, the LED chip is set in the LED positioning opening 19 of the LED chip positioning mask 15 (see FIG. 11).
Next, the substrate holding substrate 2 is rotated 180 degrees with respect to the major axis direction of the rotating rod 6, and the die bonding paste 7 applied to the substrate 4 and the LED positioning openings of the LED chip positioning mask 15. The LED chip 16 set to 19 is brought into contact (see FIG. 12). In FIG. 12, the LED chip positioning mask 15 coincides with the position of the opening 19 of the LED chip positioning mask and the position of the die bond paste 7 applied to the substrate 4 as shown in FIG. It is attached to the mask holding substrate 3 as described above.
Next, the mounting jig is turned over (see FIG. 13).
Next, the protruding portion 22 of the leveling plate 21 is directed downward, and the protruding portion 22 is lowered toward the opening 20 of the LED chip mounting portion (see FIG. 14). The protrusion 22 is fitted into the opening 20 of the LED chip mounting portion, and a load is applied to the leveling plate 21 to pressurize the plurality of LED chips 16 so as to apply a uniform force (see FIG. 15). ). As a method for applying a load to the leveling plate 21 and applying a uniform force to each of the plurality of LED chips 16, as shown in FIG. This can be achieved by a simple method of applying pressure by the gravity of the leveling plate 21 vertically.
Further, in a pressurized state shown in FIG. 15, the die bond paste 7 is cured by heating in the reflow furnace 27. Of course, as described above, without applying pressure with the leveling plate 21, the substrate 4 on which the LED chip 16 is mounted can be taken out after the process shown in FIG.
Next, the mask holding substrate 3 is rotated 180 degrees with respect to the major axis direction of the rotating rod 6 (see FIG. 17), and the die bonding paste 7 is placed on the substrate 4 from the substrate holding substrate 2. Thus, the LED module array in which the plurality of LED chips 16 are mounted is completed (see FIG. 18).

In the above description, the single substrate 4 has been described. However, even when a plurality of substrates are used, a plurality of LED chips can be mounted on each substrate in the same process.

As described above, the mounting method of the LED chip array of the present invention is as follows.
(1) In the mounting jig 1 used in the present invention, one end of the substrate holding substrate 2 and one end of the mask holding substrate 3 are connected by the rotating rod 6, and the substrate holding substrate 2 and the mask holding substrate are connected. 2 can be manually rotated 180 degrees with respect to the major axis direction of the rotating rod 6, and the mounting jig 1 can be easily turned over. In addition, the attachment / detachment of the substrate holding substrate 2 to / from the substrate 4 and the attachment / detachment of the screen printing mask 5, the LED chip positioning mask 15 and the leveling plate 21 to / from the mask holding substrate 3 are also performed manually. It can be simplified, and the apparatus cost can be greatly reduced as compared with a conventional large-scale apparatus.
(2) Although the setting of the substrate 4 to the substrate holding substrate 2 and the setting of the plurality of LED chips 16 to the LED chip positioning mask 15 are performed individually, the substrate 4 of the plurality of LED chips 16 is performed. Since the mounting of the LED chip 16 and the pressing of the plurality of LED chips 16 on the leveling plate 21 are performed at the same time, there is no variation among the plurality of LED chips and an excellent mount (which is applied to the substrate 4). There is no misalignment between the die bond paste 7 and the plurality of LED chips 16).
(3) Further, the leveling plate 21 can apply a uniform force to the plurality of LED chips 16, and the die bond paste 7 is hardened by pressing the LED chip with a uniform force by the leveling plate 21. Thus, the thickness of the die bond paste 7 between the substrate 4 and the LED chip 16 becomes uniform, and it is possible to provide an LED chip array that can irradiate light without variation among a plurality of LEDs.

  In the LED module array mounting method of the present invention, as described above, the apparatus cost can be remarkably reduced as compared with the prior art, and the method is reliable (the thickness of the die bond paste between the plurality of LED chips is reduced). The mounting is uniform (no misalignment between the die bond paste 7 and the LED chip 16) and contributes greatly to the mounting method of the LED module array with high reliability and excellent mass productivity.

These show the perspective view of the mounting jig used with the mounting method of the LED module array of this invention. These are sectional drawings of the mounting jig showing the mounting process of the LED module array of the present invention. FIG. 3 is a cross-sectional view of the mask holding substrate 3 opened by rotating 180 degrees in FIG. FIG. 4 is a sectional view in which the screen printing mask 5 is set in FIG. 3. These are sectional drawings which attached the board | substrate 4 in FIG. FIG. 6 is a cross-sectional view of the screen printing mask 5 shown in FIG. FIG. 7 is a cross-sectional view in which the opening 24 is filled with the die bond paste 7 in FIG. 6. FIG. 8 is a cross-sectional view of the screen printing mask 5 in FIG. FIG. 9 is a cross-sectional view of FIG. 8 with the screen printing mask 5 removed. These are sectional drawings which set LED positioning mask 15 in FIG. These are sectional drawings which set this LED chip in LED positioning opening part 19 in FIG. FIG. 12 is a cross-sectional view showing the substrate holding substrate 2 rotated 180 degrees in FIG. 11 and closed. FIG. 13 is a cross-sectional view of the mounting jig turned over in FIG. 12. FIG. 14 is a cross-sectional view showing a step of lowering the protrusion 22 of the leveling plate 21 in FIG. 13. FIG. 15 is a cross-sectional view showing a leveling step in FIG. 14. FIG. 15 shows a cross-sectional view after leveling in FIG. FIG. 17 is a sectional view of the mask holding substrate 3 opened by rotating 180 degrees in FIG. Shows a cross-sectional view of the completed LED module array. 5 and 6, when the thickness of the substrate 4 is smaller than the thickness of the mask holding substrate 3, a substrate height adjustment plate is used, (substrate thickness + substrate height adjustment plate thickness) = (mask (Thickness of holding substrate) is shown, and (a) shows a state where the substrate is set. 5 and 6, when the thickness of the substrate 4 is smaller than the thickness of the mask holding substrate 3, a substrate height adjustment plate is used, (substrate thickness + substrate height adjustment plate thickness) = (mask (Thickness of holding substrate) is shown, and (b) shows the state during paste application. These show an example which applies a uniform force to a plurality of LED chips using a leveling plate. These show the mounting method of the conventional LED module array, (a) is sectional drawing which shows the process which picks up an LED chip. These show the mounting method of the conventional LED module array, (b) is sectional drawing which shows the mounting process of the first LED chip. These show the mounting method of the conventional LED module array, (c) is sectional drawing which shows the mounting process of the last LED chip. These show the mounting method of the conventional LED module array, (d) is sectional drawing which shows a reflow process.

Explanation of symbols

1 Mounting jig
2 Board holding board
3 Mask holding substrate
4 Board
5 Mask for screen printing
6 Rotating rod
7 Die bond paste
8 Mask positioning pin
9 Mask fixing nut
10 Top surface of the board
11 Upper surface of substrate holding substrate
12 Top surface of mask holding substrate
13 Back side of mask holding substrate
14 Top of mask for screen printing
15 LED positioning mask
16 LED chip
17 LED chip top surface
18 Back side of LED chip
19 LED chip positioning opening
20 Opening of LED chip tower
21 Leveling plate
22 Projection on leveling plate
23 Board height adjustment plate
24 Screen printing mask opening
25 Guide pin
26 Daicolette
27 Reflow furnace

Claims (1)

In a mounting method of an LED module array in which a plurality of LED chips are mounted on a substrate via a die bond paste, a mounting jig is prepared, and the mounting jig includes a substrate holding substrate and a mask holding substrate. One end and one end of the mask holding substrate are connected by a rotating rod, and each of the substrate holding substrate and the mask holding substrate can be rotated 180 degrees with respect to the major axis direction of the rotating rod. When the substrate holding substrate and the mask holding substrate are 0 degrees with respect to the axial direction, the upper surface of the substrate holding substrate and the upper surface of the mask holding substrate are in contact with each other. By the process shown in
(1) Open the substrate holding substrate and the mask holding substrate of the mounting jig at 180 degrees.
(2) Next, the substrate is placed at a predetermined position on the upper surface of the substrate holding substrate of the mounting jig.
(3) Next, a screen printing mask for printing a die bond paste for mounting a plurality of LED chips on the substrate is set on the back surface of the mask holding substrate.
(4) Next, the mask holding substrate on which the screen printing mask is set is rotated, the upper surface of the mask holding substrate is the upper surface of the substrate holding substrate, and the upper surface of the substrate is the screen printing mask. To touch the top surface,
(5) Next, using the screen printing mask, a die bond paste for mounting a plurality of LED chips is screen-printed, and a plurality of die bond pastes are formed at locations where the plurality of LED chips are mounted. Open the holding substrate at 180 degrees, and remove the screen printing mask from the mask holding substrate.
(6) Next, an LED chip positioning mask is attached to the mask holding substrate, and a plurality of LED chips are placed in a plurality of LED chip positioning openings formed in the LED chip positioning mask.
(7) Next, the substrate holding substrate on which the screen-printed substrate is mounted is rotated 180 degrees with respect to the major axis direction of the rotating rod, and a plurality of die bond pastes formed on the substrate are converted into the LED chip. And the upper surface of the substrate holding substrate is in contact with the upper surface of the mask holding substrate.
(8) Next, after rotating the mounting jig by 180 degrees, using the leveling jig in which a plurality of protrusions are formed, the plurality of protrusions of the leveling plate are moved to the openings of the LED chip tower. And the upper surface of the LED chip is pressed by the protrusions of the leveling plate, and the thickness of the plurality of die bond pastes is made uniform.
(9) Next, in a state where a plurality of the LED chips are pressed with the leveling plate, the die bond paste is cured.
(10) Rotate the mask holding substrate by 180 degrees, and remove the substrate on which a plurality of LED chips are mounted from the substrate holding substrate via the die bond paste.
A method for mounting an LED module array, comprising mounting a plurality of LED chips on the substrate.

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