KR20220008326A - A container containing a temporary adhesive composition filled with the temporary adhesive composition, a method for preserving the temporary adhesive composition, and a method for manufacturing a container containing the temporary adhesive composition - Google Patents

Abstract

It has a temporary adhesive composition and a container, wherein the temporary adhesive composition contains a solid content and an organic solvent containing a polystyrene-based elastomer, and a container containing the temporary adhesive composition filled with the temporary adhesive composition in a state that satisfies Formula (1); A method for preserving an adhesive composition, and a method for manufacturing a container containing a temporary adhesive composition;
X+|85-Y|≤100 ... (One)
X represents the fraction representing the ratio of Xa to Xb, Xa represents the blending concentration of the solid content in the temporary adhesive composition, Xb represents the saturated dissolution concentration of the solid content in the temporary adhesive composition at the storage temperature, Y is the storage temperature It is a filling rate which shows the ratio of the volume of the temporary adhesive composition with respect to the volume of the container in X and Y unit is %.

Description

A container containing a temporary adhesive composition filled with the temporary adhesive composition, a method for preserving the temporary adhesive composition, and a method for manufacturing a container containing the temporary adhesive composition

The present invention relates to a container containing a temporary adhesive composition filled with the temporary adhesive composition, a method for preserving the temporary adhesive composition, and a method for manufacturing a container containing the temporary adhesive composition.

A semiconductor device manufacturing process (semiconductor process) includes a processing process until, for example, a substrate such as a silicon wafer is formed into a chip or device, and is also called a wafer process (wafer process or wafer processing). In a wafer process, various processes are performed with respect to substrates, such as a silicon wafer. Specifically, lithography, implantation or diffusion of impurity atoms, oxide film removal and formation, dry etching, wet etching, etch-back, soldering, plating, sputtering, CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition) vapor deposition), CMP (Chemical Mechanical Polishing), cleaning, dicing, die bonding, mounting, annealing, packaging, etc. During such various processing, a substrate such as a silicon wafer is temporarily bonded to a processing apparatus or a support in some cases. That is, there are cases in which a member to be processed, such as a silicon wafer or a chip, is temporarily bonded, removed after necessary processing is performed, and an operation such as temporary bonding to a support of another processing apparatus is performed in some cases.

As such a temporary adhesive composition, for example, in patent document 1, it is a one-component bonding agent which consists of a curable composition which mix|blended predetermined amounts of a vinyl polymer, tackifying resin, and a curing catalyst, and curable composition is sealing. It is disclosed that the container is filled. It is described that by this technology, the adhesive, which does not require a solvent drying process, is formed directly at a construction site such as a building, thereby simplifying the handling of the adhesive and facilitating the peeling of the adherend in reforming after use or the like.

Moreover, patent document 2 contains a specific moisture hardening type resin composition, and is disclosing the adhesive agent in which interfacial peeling is possible without producing|generating a cohesive failure. Thereby, it is described that the peelability which can peel easily from a base|substrate can be achieved, ensuring required adhesiveness with respect to a base|substrate.

Moreover, Patent Document 3 discloses a specific hydrogenated block copolymer and an adhesive composition containing a predetermined amount of a polymer selected from polyisobutylene, butyl rubber, and polybutene. Thereby, it has high heat aging resistance at the time of manufacture, has high adhesive force and high holding power at room temperature and low temperature, high peelability after aging, low adhesion rise, low adhesion residue, high discoloration resistance It is described that it can be done by having.

Patent Document 1: International Publication No. 2006/134997 Patent Document 2: Japanese Patent Application Laid-Open No. 2012-241080 Patent Document 3: Japanese Patent Application Laid-Open No. 2016-035039

By the way, as a result of the present inventors studying, using a temporary adhesive composition (hereinafter, sometimes referred to as "temporary adhesive"), a carrier substrate etc. (hereinafter, sometimes referred to as "member to be processed") is temporarily adhered to thru. It turned out that particles (aggregates of solid content) may generate|occur|produce in the temporary adhesive composition at the time of setting. And, when particles are generated, the adhesion state becomes non-uniform, and there is a possibility that processing quality is affected. In addition, if the filter clogging occurs frequently during filtration of the temporary adhesive composition, the production efficiency may be lowered and the cost may be affected.

The present invention aims to solve the above problems, and can suppress particles generated when the temporary adhesive composition is applied to a member to be processed or the like to form a temporary adhesive film, a container containing a temporary adhesive composition, a method of preserving the temporary adhesive composition , and for the purpose of providing a method for manufacturing a container containing the temporary adhesive composition.

As a result of earnestly examining the said subject recognition, when filling a container with a temporary adhesive composition for suppression of the particle generation at the time of storage, it discovered that the said subject was solved by complying with predetermined conditions. Specifically, by the following means <1>, preferably by <2> to <17>, the said subject was solved.

<1>

Having a temporary adhesive composition and a container,

The temporary adhesive composition includes a solid content including a polystyrene-based elastomer and an organic solvent,

A container containing a temporary adhesive composition filled with the temporary adhesive composition in a state that satisfies the following formula (1);

[Equation 1]

X represents the fraction representing the ratio of Xa to Xb, Xa represents the blending concentration of the solid content in the temporary adhesive composition, Xb represents the saturated dissolution concentration of the solid content in the temporary adhesive composition at the storage temperature, Y is the storage temperature It is a filling rate which shows the ratio of the volume of the temporary adhesive composition with respect to the volume of the container in X and Y unit is %.

<2>

The container with the temporary adhesive composition as described in <1> in which the polystyrene-type elastomer contains the hydrogenated polystyrene-type elastomer.

<3>

Container containing the temporary adhesive composition according to <1> or <2>, wherein the organic solvent contains at least one compound selected from the group consisting of an aliphatic hydrocarbon compound, an aromatic hydrocarbon compound, a ketone compound, and an ester compound .

<4>

The container with the temporary adhesive composition in any one of <1>-<3> in which the temporary adhesive composition further contains antioxidant.

<5>

A container containing the temporary adhesive composition according to any one of <1> to <4>, wherein the temporary adhesive composition further contains a surfactant.

<6>

The container with the temporary adhesive composition in any one of <1>-<5> in which an organic solvent contains an aromatic hydrocarbon compound or an ester compound.

<7>

Container containing the temporary adhesive composition in any one of <1>-<6> whose fraction X of Formula (1) is 20% or more and 90% or less.

<8>

The container with the temporary adhesive composition in any one of <1>-<7> whose filling rate Y of Formula (1) is 60% or more and 99.9% or less.

<9>

Temporary adhesive composition is a container containing the temporary adhesive composition according to any one of <1> to <8>, which is used for a use in which a layer containing fluorocarbon is formed on the surface of the temporary adhesive film formed of the temporary adhesive composition.

<10>

Among <1> to <9>, wherein the container is a glass container including, on an inner surface of the container, at least one liquid contact surface of a liquid contact surface made of a layer containing fluorocarbon and a liquid contact surface subjected to de-alkali treatment A container containing the temporary adhesive composition as described in any one.

<11>

The container has a container body for accommodating the temporary adhesive composition, and a lid for closing the container body,

A container containing the temporary adhesive composition according to any one of <1> to <10>, wherein the lid has a liquid contact surface made of a layer containing fluorocarbon.

<12>

A method of preserving the temporary adhesive composition by filling a container, the method comprising:

The temporary adhesive composition includes a solid content including a polystyrene-based elastomer and an organic solvent,

A method for preserving a temporary adhesive composition, in which the container is filled with the temporary adhesive composition so as to satisfy the following formula (1);

[Equation 2]

X represents the fraction representing the ratio of Xa to Xb, Xa represents the blending concentration of the solid content in the temporary adhesive composition, Xb represents the saturated dissolution concentration of the solid content in the temporary adhesive composition at the storage temperature, Y is the storage temperature It is a filling rate which shows the ratio of the volume of the temporary adhesive composition with respect to the volume of the container in X and Y unit is %.

<13>

The preservation method of the temporary adhesive composition as described in <12> whose fraction X of Formula (1) is 20 % or more and 90 % or less.

<14>

The storage method of the temporary adhesive composition as described in <12> or <13> whose filling rate Y of Formula (1) is 60 % or more and 99.9 % or less.

<15>

A method of manufacturing a container with a temporary adhesive composition by filling a container with the temporary adhesive composition,

The temporary adhesive composition includes a solid content including a polystyrene-based elastomer and an organic solvent,

The manufacturing method of the container with a temporary adhesive composition which fills a container with a temporary adhesive composition so that following formula (1) may be satisfied;

[Equation 3]

X represents the fraction representing the ratio of Xa to Xb, Xa represents the blending concentration of the solid content in the temporary adhesive composition, Xb represents the saturated dissolution concentration of the solid content in the temporary adhesive composition at the storage temperature, Y is the storage temperature It is the ratio of the volume of the temporary adhesive composition with respect to the volume of the container in in, and the unit of X and Y is %.

<16>

The manufacturing method of the container with the temporary adhesive composition as described in <15> whose fraction X of Formula (1) is 20% or more and 90% or less.

<17>

The manufacturing method of the container with the temporary adhesive composition as described in <15> or <16> whose filling factor Y of Formula (1) is 60% or more and 99.9% or less.

The container containing the temporary adhesive composition of this invention can suppress the particle which generate|occur|produces when the temporary adhesive composition is applied to a to-be-processed member etc. Moreover, according to the said preservation|save method and the said manufacturing method of this invention, the container with which the temporary adhesive composition which shows such an effect was contained can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically the container with the temporary adhesive composition in one Embodiment of this invention.
It is sectional drawing which shows typically the container with the temporary adhesive composition in another embodiment of this invention.
3 is a cross-sectional view schematically showing a state in which particles are generated on the inner surface of the container.
4 is a schematic diagram of the first embodiment (1) showing a method for manufacturing a semiconductor device.
Fig. 5 is a schematic diagram of the first embodiment (2) showing a method for manufacturing a semiconductor device.
6 is a schematic diagram of the second embodiment (1) showing a method of manufacturing a semiconductor device.
7 is a schematic diagram of a second embodiment (2) showing a method of manufacturing a semiconductor device.

Hereinafter, the content of the present invention will be described in detail.

In addition, in this specification, the numerical range shown using "-" means the range which includes the numerical value described before and after "-" as a lower limit and an upper limit.

In the description of the group (atomic group) in the present specification, the description not describing substitution and unsubstitution includes a group having a substituent together with a group having no substituent. For example, "alkyl group" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).

In this specification, a weight average molecular weight (Mw) and a number average molecular weight (Mn) are defined as polystyrene conversion values according to a gel permeation chromatography (GPC) measurement, unless there is particular explanation. In the present specification, the weight average molecular weight (Mw) and the number average molecular weight (Mn) use, for example, HLC-8220GPC (manufactured by Tosoh Corporation), and as a column, a guard column HZ-L, TSKgel Super HZM- It can obtain|require by using any one or more of M, TSKgel Super HZ4000, TSKgel Super HZ3000, and TSKgel Super HZ2000 (made by Tosoh Corporation). Unless otherwise specified, the eluent is measured using THF (tetrahydrofuran). In addition, detection shall use the wavelength 254nm detector of UV ray (ultraviolet ray) unless it demonstrates in particular.

In the present invention, the temperature is 23°C unless otherwise specified.

In the present invention, the pressure is a value of 1013.25 hPa of atmospheric pressure unless otherwise specified.

In addition, in embodiment described below, description is simplified or abbreviate|omitted by attaching|subjecting the same code|symbol or an equivalent code|symbol in drawing about the member etc. which were already demonstrated in the referenced drawing.

The container containing the temporary adhesive composition of the present invention has a temporary adhesive composition and a container, and the temporary adhesive composition contains a solid content including a polystyrene-based elastomer and an organic solvent, and the container in a state that satisfies the following formula (1) It is characterized in that it is preserved in

[Equation 4]

In the formula (1), X represents the fraction representing the ratio of Xa to Xb, Xa represents the blending concentration of the solid content in the temporary adhesive composition, and Xb is the storage temperature of the solid content in the temporary adhesive composition (preferably at 23° C.) ), where Y is a filling rate indicating the ratio of the volume of the temporary adhesive composition to the volume of the container at the storage temperature (preferably 23° C.), and the units of X and Y are %. In the present invention, "storage temperature" means the temperature of the storage environment in which the container is stored. In addition, the "solid content" in a temporary adhesive composition means other components except a solvent.

Specifically, the fraction X is obtained by experimentally obtaining the saturated dissolution concentration Xb of the entire solid content in the organic solvent constituting the temporary adhesive composition under the storage temperature, and the concentration Xa of the total mass of the solid content actually blended in the temporary adhesive composition (mixture). concentration), and the value calculated as Xa/Xb is expressed as a percentage (unit: %). Also, the filling factor Y is, when the way, a in the container of the adhesive composition, and of the inner space of the container, a charged portion in the adhesive composition to V ^{1, the} blank portions shown to V ² shown in Figure 1, The value calculated as V ¹ /(V ¹ +V ² ) is expressed as a percentage (unit: %).

By setting it as such a structure, generation|occurrence|production of a particle can be suppressed effectively. If generation|occurrence|production of a particle can be suppressed, at the time of filtration of a temporary adhesive composition, clogging of a filter can be suppressed effectively. Moreover, the film surface of the temporary adhesive film formed from the temporary adhesive composition can be made uniform.

When the temporary adhesive composition is put in a container and stored, when the filling rate in the container is low, particles (aggregates of solid content) are easily generated on the wall surface of the unfilled area in the container (FIG. 3, particle 9). This is considered to be because an environment in which a minute portion of the temporary adhesive composition once adhered to the wall surface tends to remain on the wall surface and is easy to dry is formed in the unfilled region. Moreover, since an unfilled area|region is large, it is also considered as one of the factors that it is easy to entrap the foreign material etc. in the atmosphere at the time of filling a container with a temporary adhesive composition. On the other hand, when the filling rate in the container is high, particles are likely to be generated in the gap between the lid and the container body (particularly, in the region where the thread is formed), the inner surface of the lid, and the like. This is considered to be because the temporary adhesive composition remains in the gap between the lid and the container body or tends to adhere to the inner surface of the lid due to transportation of the container containing the temporary adhesive composition or shaking during transport. That is, it turned out that it is difficult to suppress the generation|occurrence|production of a particle effectively only by adjustment of the filling rate in a container by a temporary adhesive composition.

In the container containing the temporary adhesive composition of the present invention, not only the filling ratio Y in the container by the temporary adhesive composition but also the fraction X related to the solid content concentration in the temporary adhesive composition are considered, and the filling ratio Y and the fraction X are the formula In order to satisfy (1), generation|occurrence|production of a particle is suppressed by filling a container with a temporary adhesive agent composition. The formula (1) was found out from the relationship between the filling factor Y and the fraction X, and the frequency of occurrence of particles. From the above formula (1), it can be understood that although there may be cases where particles are generated even when the filling factor Y is high or low, the generation of particles can be easily suppressed by setting the fraction X within a predetermined range.

<About formula (1)>

The fraction X regarding the solid content concentration in the temporary adhesive composition is more than 0% and 100% or less, preferably 10% or more, more preferably 20% or more, still more preferably 30% or more, still more preferably 50% or more, , more preferably 70% or more, and may be 75% or more. The upper limit is preferably 99% or less, more preferably 96% or less, still more preferably 90% or less, still more preferably 89% or less, and still more preferably 87% or less.

The filling factor Y is the ratio of the volume of the temporary adhesive composition with respect to the volume of the container in storage temperature (preferably 23 degreeC). Y is more than 0% and 100% or less, preferably 60% or more, more preferably 61% or more, still more preferably 65% or more, still more preferably 70% or more, and still more preferably 80% or more. As an upper limit, it is preferable that it is 99.9 % or less, It is more preferable that it is 98 % or less, It is more preferable that it is 95 % or less, It is still more preferable that it is 90 % or less.

For example, the container with the temporary adhesive composition shown in FIG. 1 is an example in which the filling factor Y is about 90%. That is, in the internal space of a container ^{, with respect to the part (V 1} ) filled with the temporary adhesive composition, the empty part (V ² ) is an example where it is small. In this state, for example, when the fraction X with respect to the solid content concentration is 80%, it will be less than 100 by substituting this into the left side of the formula (1). Therefore, it can be said that this example is a state in which good storage is possible in which particles are less likely to be generated.

On the other hand, FIG. 3 which is an aspect for comparison is an example in which the filling factor Y is about 50%. That is, the portion of V ² is larger ^{than the portion of V 1 .} For example, when the fraction X is 80%, the left side of Equation (1) exceeds 100. Therefore, this example can be said to be a state in which the probability of generating particles is high.

In this invention, from a viewpoint of suppressing generation|occurrence|production of a particle, although the right side of said Formula (1) is 100, it is preferable that it is 98, It is more preferable that it is 95, It is still more preferable that it is 92.

<Preservation of Temporary Adhesive Composition>

In the present invention, the temporary adhesive composition is stored in a container. Preservation in a container means to preserve|save the temporary adhesive composition so as to be confined in a container, for example, the aspect etc. which inject|pour a temporary adhesive composition into a glass bottle and cover are illustrated. That is, during storage, the inside and the outside of the container are partitioned as spaces.

It is preferable to preserve|save the container with the temporary adhesive composition after being filled with the temporary adhesive composition in the environment of a predetermined|prescribed temperature range. It is preferable that they are 5 degreeC or more and 38 degrees C or less, and, as for the storage temperature at this time, it is more preferable that they are 15 degrees C or more and 28 degrees C or less. Moreover, it is preferable that they are 0.5 hour or more and 180 days or less, and, as for the storage period at this time, it is more preferable that they are 1 hour or more and 90 days or less. It is preferable to preserve|save the container with a temporary adhesive composition in air|atmosphere from a viewpoint of cost. It is preferable that they are 0.9 atm or more and 1.1 atm or less, and, as for the pressure of the storage environment outside a container, it is more preferable that they are 0.95 atm or more and 1.05 atm or less. It is preferable that they are 0.9 atm or more and 1.1 atm or less, and, as for the pressure in the container after covering, it is more preferable that they are 0.95 atm or more and 1.05 atm or less. 1 atm is 1013.25 hPa.

<Courage>

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows typically the container with the temporary adhesive composition in one Embodiment of this invention. The container 10 of this embodiment is comprised from the container main body 2 and the cover. The container body 2 has an injection port 7 in its head, and the screw part 8 is provided there. By means of the screw portion, the lid is fitted, whereby the container is sealed or hermetically sealed, and the temporary adhesive composition is filled and stored. The cover is composed of an outer cover 4 and an inner cover 3 . The container 10 is filled with the temporary adhesive composition 1 .

Although the container is not specifically limited, A glass container (so-called glass bottle), various plastic containers, metal containers, such as aluminum, a ceramic container, etc. can be used suitably. In this invention, since the easiness of an acquisition, handleability, and the effect of this invention appear more highly, it is preferable to use a glass container. The material of each of the container body and the lid may be the same as or different from each other. Therefore, for example, although a so-called glass bottle etc. are assumed with a glass container, the meaning also includes the container in which a part of a container is formed from materials other than glass.

The size (capacity) of the container exhibits the effect of the present invention, which is not particularly limited, and is preferably 0.2L (liter) or more, more preferably 0.95L or more, considering that it is usually applied to this kind of drug, It is more preferable that it is 3.0L or more. As an upper limit, it is preferable that it is 18 L or less, It is more preferable that it is 10 L or less, It is more preferable that it is 4 L or less.

The shape of the container is not particularly limited. For example, as shown in Fig. 1, the body part is based on a cylinder, and the shoulder part is formed by gently reducing the diameter, and a shape having an injection port 7 in the head having the shoulder part can be adopted. have. The diameter (inner diameter) of the cross section (the cross section perpendicular to the cylindrical axis) in the body of the container is, for example, preferably 4 cm or more, more preferably 6.5 cm or more, It is more preferable that it is 9.5 cm or more. Although there is no particular upper limit, it is practical that it is 17.0 cm or less. The diameter (inner diameter) of the cross section of the injection port 7 is, for example, preferably 1.0 cm or more, more preferably 2.0 cm or more, and still more preferably 2.5 cm or more. Although there is no particular upper limit, it is practical that it is 10 cm or less. The height of the body (the length from the bottom of the inner part to the lower part of the inlet) is, for example, preferably 11 cm or more, more preferably 13 cm or more, and still more preferably 20 cm or more. Although there is no particular upper limit, it is practical that it is 33 cm or less. The length of the inlet 7 is, for example, preferably 0.2 cm or more, more preferably 1.0 cm or more, and still more preferably 2.0 cm or more. Although there is no particular upper limit, it is practical that it is 5.0 cm or less. In the case of a large-capacity gallon bottle or the like, a handle may be provided in the body portion near the inlet port.

It is preferable that the container also has a light-shielding function so that the quality change of the temporary adhesive composition by light may be suppressed more effectively. In particular, it is preferable that the container can block ultraviolet rays, visible rays and infrared rays (for example, light having a wavelength of 290 to 1100 nm). Further, the container is preferably opaque, colorless translucent or colored transparent, more preferably colored transparent, and particularly preferably brown and transparent.

The head of the container usually has an inlet (7) and a thread (8). The length in the cylindrical axial direction of the area|region in which the screw part 8 is formed corresponds to the height of a cover part, and it is normal that they are 0.9 mm or more and 1.5 mm or less in the inner part. According to the present invention, it is possible to effectively suppress or prevent the generation of particles due to the liquid adhesion to the screw portion 8 and the drying thereof.

<<Surface treatment of the inner surface of the container>>

It is preferable that the inner surface 2a of the container 10 used for this invention is surface-treated. For example, it is preferable that the container 10 is a glass container including, on its inner surface, at least one liquid contact surface among a liquid contact surface made of a layer containing fluorocarbon and a liquid contact surface to which dealkalization has been applied. do. In this way, generation of particles can be more effectively suppressed by subjecting the inner surface of the container 2a to a predetermined surface treatment.

The fluorocarbon is preferably a fluororesin such as PTFE (polytetrafluoroethylene) and PFA (copolymer of tetrafluoroethylene and perfluoroalkyl vinyl ether).

A desired liquid contact surface can be formed by coating the inner wall surface of a glass container with a chemical-resistant sheet|seat or a coating material, for example for the liquid contact surface which consists of a layer containing a fluorocarbon. The chemical-resistant sheet|seat and coating material may contain at least 1 sort(s) of a polyamide resin and a silicone resin other than a fluorocarbon. When the inner wall surface of a container is coat|covered with the chemical-resistant sheet|seat or a coating material, it becomes possible to ensure favorable storage stability. In addition to the coated glass container, a container made of a fluororesin, a plastic container having an inner surface coated with a fluororesin, or the like can be used as the container having a liquid contact surface made of a layer containing fluorocarbon.

It is preferable that the contact surface to which the dealkalization treatment was performed is dried after washing the inside with ultrapure water having an electrical resistance of 15 MΩ·cm or more to remove the metal ion component on the surface before charging.

Fig. 2 shows an embodiment in which the inner surface 2a of the container 20 is surface-treated, and a fluorine-coated coating layer 22 is provided inside the base 21 of the container body 2 . In the form of FIG. 2 , the cover further includes an inner cover 3 and an outer cover 4 , and a fluorine-coated coating layer 32 is provided on the inner surface of the base 31 of the inner cover 3 . The thickness of the coating layers 22 and 32 of the fluorine coating is, for example, each independently preferably 5 to 1000 μm, more preferably 10 to 500 μm.

<<Cover>>

The size, shape, and material of the cover may be general. It is normal that the diameter of a cover is 15 mm or more and 45 mm or less, for example. Examples of the material of the cover include polyolefin (polyethylene or polypropylene (PP) such as HDPE (high-density polyethylene)).

It is not necessary for the lid to have an inner lid, but it is preferred that the lid has an inner lid. Examples of the material of the inner cover include polyethylene and polypropylene. It is preferable that the inner surface of an outer cover or an inner cover is surface-treated for improving chemical-resistance. As this process, the process similar to the content of the said surface treatment of the said container inner surface is mentioned, for example.

<Temporary adhesive composition>

The temporary adhesive composition can be used for temporarily holding a member to be processed or the like on a support or the like, and for temporarily adhering them. The temporary adhesive composition in this invention contains the solid content containing a polystyrene-type elastomer, and an organic solvent. Examples of the solid content include resins such as polystyrene-based elastomers, antioxidants, surfactants, mold release agents, and other additives. Hereinafter, each component is demonstrated in detail.

<<Polystyrene-based elastomer>>

The polystyrene-based elastomer is preferably a block copolymer of styrene and other monomers, and particularly preferably a styrene block copolymer in which one or both ends are styrene blocks. Moreover, it is preferable that it is a hydrogenated polystyrene-type elastomer, and, as for a polystyrene-type elastomer, it is more preferable that it is a hydrogenated substance of the block copolymer of polystyrene. When resin is a hydrogenated substance, thermal stability and storage stability will improve. Furthermore, peelability and the cleaning removability of the temporary adhesive film after peeling improve. In addition, a hydrogenated substance means the polymer of the hydrogenated structure. In addition, by using the polystyrene-based elastomer in the temporary adhesive composition, it is possible to form a temporary adhesive film excellent in adhesion by following the fine irregularities of the carrier substrate or the device wafer (member to be processed), and by an appropriate anchor effect. In addition, from the viewpoint of improving the rigidity of the layer after film formation and improving the film forming processability by introducing the styrene block copolymer unit, and improving the solvent resistance of the layer after film formation to resist, photosensitive polyimide solvent, cleaner solvent, etc., In the temporary adhesive composition containing a polystyrene-type elastomer, the high effect is exhibited especially by employ|adopting the structure of this invention.

In addition, in this specification, an elastomer shows the polymer which shows elastic deformation. That is, when an external force is applied, it is instantaneously deformed according to the external force, and when the external force is removed, it is defined as a polymer having a property of recovering its original shape in a short time.

In addition, in this specification, "adhesiveness" means not only the performance of "providing high adhesive force when simply bonding at high pressure" but also "adhesive force high enough for adhesion at low pressure (for example, low pressure adhesion at 0.4 MPa)" It is defined to include the performance of “giving

2,000-200,000 are preferable, as for the weight average molecular weight of a polystyrene-type elastomer, 10,000-200,000 are more preferable, 50,000-100,000 are still more preferable. Since the elastomer having a weight average molecular weight in this range has excellent solubility in a solvent, after peeling the carrier substrate from the device wafer, the solvent is used to remove the elastomer-derived residue remaining on the device wafer or carrier substrate. In this case, the residue is easily dissolved in the solvent and removed. For this reason, there exists an advantage that a residue does not remain on a device wafer, a carrier base material, etc. On the other hand, from the viewpoint of adhesiveness, it is preferable to have a high molecular weight. However, when the molecular weight is high, the elastomer is easily released from the solvent. Therefore, by employing the structure of the present invention, even a high molecular weight elastomer can be used while maintaining its quality, which is preferable because it is easy to achieve both high adhesiveness and high quality.

In the present invention, the elastomer has a 5% thermal mass decrease temperature when the temperature is raised from 23°C at a temperature increase rate of 20°C/min, preferably 250°C or higher, more preferably 300°C or higher, and 350°C or higher. It is more preferable, and it is still more preferable that it is 400 degreeC or more. Moreover, although there is no limitation in particular as for an upper limit, For example, 1000 degrees C or less is preferable and 800 degrees C or less is more preferable. According to this aspect, it is easy to form the temporary adhesive film excellent in heat resistance.

As the polystyrene-based elastomer, polystyrene-poly(ethylene/propylene) block copolymer, polystyrene-poly(isoprene-styrene) block copolymer, polystyrene-polybutadiene-polystyrene block copolymer, polystyrene-poly(butadiene) -butylene)-polystyrene block copolymer, polystyrene-poly(ethylene-propylene) block copolymer, polystyrene-poly(ethylene-butylene)-polystyrene block copolymer, polystyrene-poly(ethylene-propylene)-polystyrene block copolymer , polystyrene-polyisoprene-polystyrene block copolymer, polystyrene-poly(ethylene-ethylene-propylene)-polystyrene block copolymer, polystyrene-poly(ethylene-ethylene/propylene)-polystyrene block copolymer of at least one kind from the group consisting of It is preferable to include

In the polystyrene-based elastomer, the proportion of structural units derived from styrene is preferably 90 mass % or less, more preferably 55 mass % or less, still more preferably 48 mass % or less, and still more preferably 35 mass % or less, , 33 mass % or less is still more preferable. The lower limit of the ratio of the structural unit derived from styrene may be a value exceeding 0 mass %, and may be, for example, 10 mass % or more. By setting it as such a range, the curvature of a laminated body, for example, a laminated body which has a temporary adhesive film, such as a to-be-processed member, and a support body can be suppressed more effectively.

The calculation method of the ratio of the structural unit derived from styrene follows the method of paragraph 0121 of International Publication No. 2017/150320.

As one embodiment of the polystyrene-based elastomer in the present invention, the elastomer A containing styrene-derived structural units in a ratio of 10% by mass or more and 55% by mass or less in the total structural units, and styrene-derived structural units are all What is used combining the elastomer B contained in the ratio of more than 55 mass % and 95 mass % or less in a structural unit is mentioned. By using elastomer A and elastomer B together, generation|occurrence|production of curvature can be suppressed effectively. Since the said elastomer B is a comparatively hard material, the temporary adhesive film excellent in peelability can be manufactured by including the elastomer B. The mass ratio in the case of blending the elastomer A and the elastomer B is preferably elastomer A:elastomer B=1:99 to 99:1, more preferably 3:97 to 97:3, and 5:95 to 95:5. More preferably, 10:90-90:10 is still more preferable. If it is the said range, the above-mentioned effect is acquired more effectively.

The amount of unsaturated double bonds in the polystyrene-based elastomer is preferably less than 15 mmol, more preferably less than 5 mmol, and most preferably less than 0.5 mmol, per 1 g of the polystyrene-based elastomer from the viewpoint of releasability. In addition, the amount of unsaturated double bonds here does not include the amount of unsaturated double bonds in the benzene ring derived from styrene. The amount of unsaturated double bonds can be calculated by NMR (nuclear magnetic resonance) measurement. In addition, in this specification, the "structural unit derived from styrene" is a structural unit derived from styrene contained in a polymer when styrene or a styrene derivative is superposed|polymerized, and may have a substituent. As a styrene derivative, (alpha)-methylstyrene, 3-methylstyrene, 4-propyl styrene, 4-cyclohexyl styrene etc. are mentioned, for example. As a substituent, a C1-C5 alkyl group, a C1-C5 alkoxyl group, a C2-C5 alkoxyalkyl group, acetoxy group, a carboxy group, etc. are mentioned, for example.

Examples of commercially available polystyrene-based elastomers include Turprene A, Turprene 125, Turprene 126S, Asaprene T, Asaprene T-411, Asaprene T-432, Asaprene T-437, Asaprene T-438. , Asafren T-439, Turftech H1272, Turftech P1500, Turftech H1052, Turftech H1062, Turftech M1943, Turftech M1911, Turftech H1041, Turftech MP10, Turftech M1913, Turftech H1051, Turftech H1053 , Tuftec P2000, Tuftec H1043 (above, manufactured by Asahi Kasei Co., Ltd.), Elastomer AR-850C, Elastomer AR-815C, Elastomer AR-840C, Elastomer AR-830C, Elastomer AR-860C, Elastomer AR-875C, Elastomer AR-885C, Elastomer AR-SC-15, Elastomer ARSC-0, Elastomer AR-SC-5, Elastomer AR-710, Elastomer AR-SC-65, Elastomer AR-SC-30, Elastomer AR-SC-75, Elastomer AR-SC-45, Elastomer AR-720, Elastomer AR-741, Elastomer AR-731, Elastomer AR-750, Elastomer AR-760, Elastomer AR-770, Elastomer AR-781, Elastomer AR-791, Elastomer AR-FL -75N, elastomer AR-FL-85N, elastomer AR-FL-60N, elastomer AR-1050, elastomer AR-1060, elastomer AR-1040 (above, manufactured by Alon Gassei Co., Ltd.), KRATON D1111, KRATON D1113, Kraton D1114, Kraton D1117, Kraton D1119, Kraton D1124, Kraton D1126, Kraton D1161, Kraton D1162, Kraton D1163, Kraton D1164, Kraton D1165, Kraton D1183, Kraton D1193, Kraton DX406, Kraton D4141, Kraton D4150, Kraton D4153, Kraton D4158, Kraton D4270, Kraton D4271, Kraton D443 3, Kraton D1170, Kraton D1171, Kraton D1173, Cariflex IR0307, Cariflex IR0310, Cariflex IR0401, Kraton D0242, Kraton D1101, Kraton D1102, Kraton D1116, Kraton D1118, Kraton D1133, Kraton D1152, Kraton D1153, Kraton D1155, Kraton D1184, Kraton D1186, Kraton D1189, Kraton D1191, Kraton D1192, Kraton DX405, Kraton DX408, Kraton DX410, Kraton DX414, Kraton DX415, Kraton A1535, Kraton A1536, Kraton FG1901, Kraton FG1924, Kraton G1640, Kraton G1641, Kraton G1642, Kraton G1643, Kraton G1645, Kraton G1633, Kraton G1650, Kraton G1651, Kraton G1652 (G1652MU-1000), Kraton G1654, Kraton G1657, Kraton G1660, Kraton G1726, Kraton G1701, Kraton G1702, Kraton G1730, Kraton G1750, Kraton G1765, Kraton G4609, Kraton Layton G4610 (above, Kraton Polymer Japan Co., Ltd.), TR2000, TR2001, TR2003, TR2250, TR2500, TR2601, TR2630, TR2787, TR2827, TR1086, TR1600, SIS5002, SIS5200, SIS5250, SIS5405, SIS6100P Dynalon , Dynaron 4600P, Dynalon 6200P, Dynalon 4630P, Dynalon 8601P, Dynalon 8630P, Dynalon 8600P, Dynalon 8903P, Dynalon 6201B, Dynalon 1321P, Dynaron 1320P, Dynalon 2324P, Dynalon 9901P (or higher) , JSR Co., Ltd.), Denka STR series (made by Denka Co., Ltd.), Quintag 3520, Quintaek 3433N, Quintaek 3421, Quintaek 3620, Quintaek 3450 , Quintech 3460 (above, manufactured by Nippon Xeon), TPE-SB series (manufactured by Sumitomo Chemical Co., Ltd.), Laberron series (manufactured by Mitsubishi Chemical Co., Ltd.), Septon 1001, Septon 1020, Septon 2002, Septon 2004, Septon 2005, Septon 2006, Septon 2007, Septon 2063, Septon 2104, Septon 4033, Septon 4044, Septon 4055, Septon 4077, Septon 4099, Septon HG252, Septon 8004, Septon 8006, Septon 8007, Septon 8076, Septon 8104, Septon V9461 , Septon V9475, Septon V9827, Hybra 7311, Hybra 7125, Hybra 5127, Hybra 5125 (above, Kurare), Sumiflex (Sumitomo Bakelite Co., Ltd.), Leostomer, Actimer (above, Riken Technos Co., Ltd. product) etc. are mentioned.

<<Elastomer to combine>>

For the temporary adhesive composition used in the present invention, other elastomers and resins may be used in combination with the polystyrene-based elastomer.

As a polyester-type elastomer, Paragraph 0027 of International Publication No. 2017/150320 - description of 0030 can be considered into consideration, and these content is integrated in this specification.

As a polyolefin-type elastomer, Paragraph 0031 of International Publication No. 2017/150320 can be considered into consideration, and these content is integrated in this specification.

As a polyurethane-type elastomer, description of Paragraph 0032 of International Publication No. 2017/150320 can be considered into consideration, and these content is integrated in this specification.

As a polyamide-type elastomer, description of Paragraph 0033 of International Publication No. 2017/150320 can be considered into consideration, and these content is integrated in this specification.

As a polyacrylic elastomer, description of Paragraph 0034 of International Publication No. 2017/150320 can be considered into consideration, and these content is integrated in this specification.

As a silicone-type elastomer, description of Paragraph 0035 of International Publication No. 2017/150320 can be considered into consideration, and these content is integrated in this specification.

As another elastomer, description of Paragraph 0037 of International Publication No. 2017/150320 can be considered into consideration, and these content is integrated in this specification.

Further, in the present invention, it is preferable that the main component (50% by mass or more) of the resin (compound having a molecular weight of 2000 or more) contained in the temporary adhesive composition is a polystyrene-based elastomer, and the amount of the polystyrene-based elastomer in the resin is 75% by mass or more It is more preferable, it is more preferable that it is 90 mass % or more, It is still more preferable that it is 95 mass % or more, It is still more preferable that it is 100 mass %.

It is preferable that the temporary adhesive composition contains the elastomer in a ratio of 50.00-99.99 mass % in the total solid of a temporary adhesive composition, It is more preferable that it is 70.00-99.99 mass %, It is especially preferable that it is 88.00-99.99 mass %. . When content of an elastomer is the said range, it is excellent in adhesiveness and peelability. As an elastomer, 1 type may be used and several things may be used for it. When using a plurality of things, their total amount is in the above range.

<<Organic Solvent>>

Examples of the organic solvent include ethyl acetate, n-butyl acetate, isobutyl acetate, amyl formate, isoamyl acetate, butyl propionate, isopropyl butyrate, ethyl butyrate, butyl butyrate, methyl lactate, ethyl lactate, alkyl alkoxyacetate ( For example, methyl alkoxyacetate, ethyl alkoxyacetate, butyl alkoxyacetate (eg, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.), 3- Alkoxypropionic acid alkyl esters (eg, 3-alkoxypropionate methyl, 3-alkoxypropionate ethyl, etc. (eg 3-methoxypropionate methyl, 3-methoxypropionate ethyl, 3-ethoxypropionate methyl, 3- ethyl ethoxypropionate)), 2-alkoxypropionate alkyl esters (eg, methyl 2-alkoxypropionate, ethyl 2-alkoxypropionate, propyl 2-alkoxypropionate, etc. (eg, methyl 2-methoxypropionate, 2-methoxyethyl propionate, 2-methoxypropionate propyl, 2-ethoxypropionate methyl, 2-ethoxypropionate ethyl)), 2-alkoxy-2-methylpropionate methyl and 2-alkoxy-2-methylpropionate ethyl ( For example, 2-methoxy-2-methylpropionate, 2-ethoxy-2-methylpropionate ethyl, etc.), methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, 2-oxobutanoic acid ester compounds such as methyl, ethyl 2-oxobutanoate, 1-methoxy-2-propyl acetate, ethyl carbitol acetate, and butyl carbitol acetate; Diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether Methyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether compounds such as teracetate, propylene glycol monopropyl ether acetate, propylene glycol methyl ether, and propylene glycol methyl ether acetate; ketone compounds such as methyl ethyl ketone, cyclohexanone, cyclopentanone, 2-heptanone, 3-heptanone, N-methyl-2-pyrrolidone, and γ-butyrolactone; pyrrolidone compounds such as N-methyl-2-pyrrolidone and N-ethyl-2-pyrrolidone; Toluene, xylene, anisole, mesitylene, pseudocumene, ethylbenzene, propylbenzene, cumene, n-butylbenzene, sec-butylbenzene, isobutylbenzene, tert-butylbenzene, amylbenzene, isoamylbenzene , (2,2-dimethylpropyl) benzene, 1-phenylhexane, 1-phenylheptane, 1-phenyloctane, 1-phenylnonane, 1-phenyldecane, cyclopropylbenzene, cyclohexylbenzene, 2-ethyltoluene, 1,2-diethylbenzene, o-cymene, indenine, 1,2,3,4-tetrahydronaphthalene, 3-ethyltoluene, m-cymene, 1,3-diisopropyl Benzene, 4-ethyltoluene, 1,4-diethylbenzene, p-cymene, 1,4-diisopropylbenzene, 4-tert-butyltoluene, 1,4-di-tert-butylbenzene, 1,3 -diethylbenzene, 1,2,3-trimethylbenzene, 1,2,4-trimethylbenzene, 4-tert-butyl-o-xylene, 1,2,4-triethylbenzene, 1,3, 5-triethylbenzene, 1,3,5-triisopropylbenzene, 5-tert-butyl-m-xylene, 3,5-di-tert-butyltoluene, 1,2,3,5-tetramethylbenzene , 1,2,4,5-tetramethylbenzene, pentamethylbenzene, and aromatic hydrocarbon compounds such as decahydronaphthalene; Aliphatic hydrocarbon compounds, such as ethylcyclohexane, limonene, p-mentane, nonane, decane, dodecane, and decalin, etc. are mentioned suitably.

Among them, it is preferable to include at least one compound selected from the group consisting of aliphatic hydrocarbon compounds, aromatic hydrocarbon compounds, ketone compounds, and ester compounds, and more preferably selected from aromatic hydrocarbon compounds and ester compounds. .

Specifically, as the organic solvent, cyclohexane, decahydronaphthalene, tetrahydronaphthalene, mesitylene, tert-butylbenzene, pseudocumene, p-mentane, γ-butyrolactone, 2-heptanone, cyclohexanone , cyclopentanone, N-ethyl-2-pyrrolidone, anisole, 3-ethoxy methyl propionate, 3-ethoxy propionate ethyl, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether , butyl acetate, methyl 3-methoxypropionate, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol methyl ether, and at least one selected from the group consisting of propylene glycol methyl ether acetate is preferably used.

In this invention, using the mixed solvent of an aromatic hydrocarbon solvent and an ester solvent is illustrated as an organic solvent. Their mixing ratio (aromatic hydrocarbon solvent: ester solvent) is, in terms of mass ratio, preferably 100:1 to 100:70, more preferably 100:5 to 100:50, and 100:10 to 100:25. it is more preferable

<<Antioxidant >>

The temporary adhesive composition may contain antioxidant. As the antioxidant, a phenol-based antioxidant, a sulfur-based antioxidant, a phosphorus-based antioxidant, a quinone-based antioxidant, an amine-based antioxidant, or the like can be used.

Examples of the phenolic antioxidant include p-methoxyphenol, 2,6-di-tert-butyl-4-methylphenol, Irganox1010, Irganox1330, Irganox3114, Irganox1035 (above, manufactured by BASF Japan Co., Ltd.), Sumilizer MDP-S, Sumilizer GA-80 (above, Sumitomo Chemical Co., Ltd. product) etc. are mentioned.

As a sulfur-type antioxidant, 3,3'- thiodipropionate distearyl, Sumilizer TPM, Sumilizer TPS, Sumilizer TP-D (above, Sumitomo Chemical Co., Ltd. product) etc. are mentioned, for example.

Examples of the phosphorus antioxidant include tris(2,4-di-tert-butylphenyl)phosphite, bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, poly(dipropylene glycol). Lycol) phenyl phosphite, diphenyl isodecyl phosphite, 2-ethylhexyl diphenyl phosphite, triphenyl phosphite, Irgafos168, Irgafos38 (above, BASF Japan Co., Ltd. product) etc. are mentioned. Examples of the quinone-based antioxidant include p-benzoquinone and 2-tert-butyl-1,4-benzoquinone.

As an amine antioxidant, dimethylaniline, phenothiazine, etc. are mentioned, for example.

As for antioxidant, Irganox1010, Irganox1330, 3,3'- thiodipropionate distearyl, Sumilizer TP-D are preferable, Irganox1010, Irganox1330 are more preferable, Irganox1010 is especially preferable.

Moreover, it is preferable to use together a phenolic antioxidant, a sulfur-type antioxidant, or phosphorus antioxidant among the said antioxidant, and it is most preferable to use together a phenol-type antioxidant and a sulfur-type antioxidant. In particular, when a polystyrene-based elastomer is used as the resin, it is preferable to use a phenol-based antioxidant and a sulfur-based antioxidant together. By setting it as such a combination, the effect which can suppress efficiently the deterioration of resin by oxidation reaction can be anticipated. When using a phenolic antioxidant and a sulfur-type antioxidant together, as for mass ratio of a phenol-type antioxidant and a sulfur-type antioxidant, phenolic antioxidant:sulfuric antioxidant =95:5-5:95 is preferable, 25:75-75 :25 is more preferable.

As a combination of antioxidant, Irganox1010 and Sumilizer TP-D, Irganox1330 and Sumilizer TP-D, and Sumilizer GA-80 and Sumilizer TP-D are preferable, Irganox1010 and Sumilizer TP-D, Irganox1330 and Sumilizer TP-D are more Preference is given to Irganox1010 and Sumilizer TP-D being particularly preferred.

From a viewpoint of sublimation prevention during heating, 400 or more are preferable, as for the molecular weight of antioxidant, 600 or more are more preferable, and 750 or more are still more preferable.

When a temporary adhesive composition contains antioxidant, it is preferable that it is 0.001-20.0 mass % with respect to the total solid of a temporary adhesive composition, and, as for content of antioxidant, it is more preferable that it is 0.005-10.0 mass %. The number of antioxidants may be one, and 2 or more types may be sufficient as them. When 2 or more types of antioxidants, it is preferable that those total amounts exist in the said range.

<<Surfactant>>

It is preferable that a temporary adhesive composition contains surfactant. As surfactant, although any of anionic, cationic, nonionic, or amphoteric surfactant can be used, a preferable surfactant is a nonionic surfactant. Preferred examples of the nonionic surfactant include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkylphenyl ethers, and higher fatty acid diesters of polyoxyethylene glycol.

When the temporary adhesive composition contains a surfactant, the content of the surfactant in the temporary adhesive composition is preferably 0.001 to 5% by mass relative to the total solid content of the temporary adhesive composition from the viewpoint of applicability, and 0.005 to 1% by mass It is more preferable, and it is still more preferable that it is 0.01-0.5 mass %. One type may be sufficient as surfactant, and 2 or more types may be sufficient as it. When surfactant is 2 or more types, it is preferable that their total amount exists in the said range.

<<Release Agent>>

The temporary adhesive composition may contain mold release agents, such as the polyether modified silicone of Paragraph 0058 - 0070 of International Publication No. 2017/150320. As another mold release agent, a fluorine-type liquid compound and silicone compounds other than the above are illustrated. When it contains a mold release agent, as for the content, the range of 0.001-0.005 mass % of solid content of a temporary adhesive composition is preferable. The mold release agent may contain only 1 type, and may contain it 2 or more types. When 2 or more types are included, it is preferable that those total amounts become in the said range.

<<Other additives>>

Temporary adhesive composition, within the range that does not impair the effects of the present invention, various additives, for example, a plasticizer, a curing agent, a curing catalyst, a filler, an adhesion promoter, an ultraviolet absorber, an anti-aggregation agent, etc. can be blended as needed. . When mix|blending these additives, as for the total compounding quantity, 3 mass % or less of the total solid of a temporary adhesive composition is preferable.

It is preferable that the temporary adhesive composition does not contain impurities, such as a metal. 1 mass ppm (parts per million) or less is preferable with respect to the total mass of a temporary adhesive composition, as for content of an impurity, 100 mass ppt (parts per trillion) or less is more preferable, 10 mass ppt or less is more preferable, and substantially It is particularly preferable not to contain (below the detection limit of the measuring device).

As a method of removing impurities, such as a metal, from a temporary adhesive composition, the filtration using a filter is mentioned, for example. As a filter pore diameter, 10 nm or less is preferable, 5 nm or less is more preferable, 3 nm or less is still more preferable. As a material of a filter, polytetrafluoroethylene, polyethylene, and nylon are preferable. As a filter, you may use what wash|cleaned previously with the organic solvent. In a filter filtration process, you may connect and use several types of filters in series or parallel. When using multiple types of filters, you may use combining filters from which a pore diameter or a material differs. Moreover, various materials may be filtered multiple times, and the process of filtering multiple times may be a circulation filtration process. In addition, as a method of reducing impurities such as metals contained in the temporary adhesive composition, a raw material constituting the temporary adhesive composition that selects a raw material with a low metal content as a raw material constituting the temporary adhesive composition, filtering the raw material constituting the temporary adhesive composition, an apparatus Methods, such as carrying out distillation under the conditions which suppressed contamination as much as possible by lining the inside with Teflon (trademark), etc. are mentioned. Preferred conditions in the filter filtration performed with respect to the raw material which comprises a temporary adhesive composition are the same as the above-mentioned conditions.

In addition to filter filtration, the impurity removal by an adsorbent may be performed, and you may carry out combining filter filtration and the removal of the impurity by an adsorbent. As the adsorbent, a known adsorbent can be used, for example, an inorganic adsorbent such as silica gel and zeolite, and an organic adsorbent such as activated carbon can be used.

<Formation of temporary adhesive film>

A temporary adhesive film can be formed on the surface of a board|substrate or to-be-processed member using a temporary adhesive composition. A temporary adhesive film may be formed only on one side, such as a to-be-processed member, and may be bonded to the other to-be-processed member etc., You may provide a temporary adhesive film to both to-be-processed members etc., and may bond both. In the formation of the temporary adhesive film, in order to apply the temporary adhesive composition, a conventionally known spin coating method, a spraying method, a slit coating method, a roller coating method, a flow coating method, a doctor coating method, a dipping method, etc. can be used. Next, since a temporary adhesive composition contains a solvent normally, it heats and volatilizes a solvent. As this heating temperature, it is preferable that it is a temperature higher than the boiling point of a solvent, It is more preferable that it is 110 degreeC or more, 130 degreeC - 200 degreeC are still more preferable, and 160 degreeC - 190 degreeC are especially preferable.

As for the thickness of a temporary adhesive film, 10 micrometers or more and 1000 micrometers or less are practical in consideration of the request|requirement in manufacture of a semiconductor device. According to the present invention, since generation of particles is suppressed to a very low frequency, particularly high effects can be exhibited when a thin film as described above, which is preferable. From this point of view, in the temporary adhesive film, it is preferable that the ^{number of particles is suppressed to less than 0.015 particles/cm 2 .}

In the present invention, it is preferable that a fluorocarbon layer is formed as a release layer on the temporary adhesive film formed of the temporary adhesive composition. Thereby, the fluorocarbon layer changes quality by absorbing light, and as a result, the intensity|strength or adhesiveness before receiving light irradiation is lost. Accordingly, by applying a slight external force (eg, lifting the support body, etc.), the release layer is broken, and the support body and the wafer can be easily separated. Moreover, for example, the fluorocarbon layer can be suitably formed into a film by plasma CVD method. In addition, the fluorocarbon layer contains fluorocarbons represented by C _x F _y (perfluorocarbon) and C _x H _y F _z (x, y and z are integers). Fluorocarbons include, but are not limited to, CHF ₃ , CH ₂ F ₂ , C ₂ H ₂ F ₂ , C ₄ F ₈ , C ₂ F ₆ , C ₅ F _{8 ,} and the like. Moreover, you may add inert gases, such as nitrogen, helium, and argon, hydrocarbons, such as an alkane and an alkene, and oxygen, carbon dioxide, and hydrogen, to a fluorocarbon layer as needed. Moreover, you may mix and use two or more of these gases (a mixed gas of fluorocarbon, hydrogen, nitrogen, etc.). Moreover, the fluorocarbon layer may be comprised from a single type of fluorocarbon, and may be comprised from 2 or more types of fluorocarbons. Fluorocarbon absorbs light having a wavelength in an intrinsic range depending on the type. By irradiating the layer with light having a wavelength in the range that the fluorocarbon absorbs, the fluorocarbon can be suitably altered. Moreover, it is preferable that the light absorption in a peeling layer is 80 % or more. The light irradiated to the fluorocarbon layer is, for example, a solid laser such as a YAG laser, a Libby laser, a glass laser, a YVO ₄ laser, an LD laser, or a fiber laser, and a dye laser, depending on the wavelength at which the fluorocarbon can be absorbed. and the like may be suitably used in the liquid laser, CO ₂ laser, excimer laser, Ar laser, a laser light such as a gas laser, semiconductor laser, free electron lasers such as He-Ne laser, or a non-laser light. Although not limited to this as a wavelength which can change a fluorocarbon, For example, the thing of 600 nm or less can be used.

<Preparation of temporary adhesive composition>

The temporary adhesive composition can be prepared by mixing each component mentioned above. Mixing of each component is normally performed in the range of 0 degreeC - 100 degreeC. Moreover, after mixing each component, it is preferable to filter with a filter, for example. For filtration, the method described in the removal of said metal impurity is employable.

<Peel strength of temporary adhesive composition>

With respect to the temporary adhesive film formed from the temporary adhesive composition, it is preferable that it is 1.0 N/m or more, and, as for the lower limit of the peeling force, it is more preferable that it is 3.0 N/m or more. The upper limit of the peeling force is more preferably 25 N/m or less, still more preferably 20 N/m or less, still more preferably 10 N/m or less, and still more preferably 9 N/m or less. By setting it as such a range, the effect that peeling becomes possible without damaging the base material after a process is exhibited more effectively.

Here, the peeling force is a temporary adhesive film formed on the surface of a silicon wafer by using a temporary adhesive composition, and a temporary adhesive film having a thickness of 15 μm is molded at 23° C., at a speed of 300 mm/min. In a vertical direction, peeling is possible by pulling up the end of the temporary adhesive film, and the force applied when pulling up is measured using a force gauge. Specifically, the method described in paragraph 0136 of International Publication No. 2017/150320 is followed.

<Method for preserving temporary adhesive composition and manufacturing method for container containing temporary adhesive composition>

The method for preserving the temporary adhesive composition of the present invention is characterized in that the container is filled with the temporary adhesive composition and stored so as to satisfy the above formula (1). In addition, the manufacturing method of the container containing the temporary adhesive composition of the present invention is characterized in that the container is filled with the temporary adhesive composition so as to satisfy the above formula (1), and the container containing the temporary adhesive composition is manufactured. Details of storage conditions, such as a component composition of a temporary adhesive composition, and details, such as a material and form of a container, are the same as those demonstrated in the description above.

<Method for manufacturing semiconductor device>

<<First embodiment >>

EMBODIMENT OF THE INVENTION Hereinafter, a laminated body is manufactured using the temporary adhesive film formed from the temporary adhesive composition filled and stored in the container of this invention, and one Embodiment of the manufacturing method of the semiconductor device using this is demonstrated, referring drawings. Steps (A) to (E) of FIGS. 4 and 5 are schematic cross-sectional views (A, B) explaining the temporary adhesion between the carrier substrate and the device wafer (member to be processed), respectively, and the device wafer temporarily adhered to the carrier substrate is It is a schematic sectional drawing which shows the state (C) which was thinned, the state (D) in which the carrier substrate and the device wafer were peeled, and the state (E) after removing the temporary adhesive film from the device wafer. In this embodiment, as shown in a process (A), first, the adhesive carrier base material (laminated body) 100 by which the temporary adhesive film 11 is provided in the carrier base material 12 is prepared. In the device wafer 60 , a plurality of device chips 62 are provided on a surface 61a of a silicon substrate 61 . As for the thickness of the silicon substrate 61, 200-1200 micrometers is preferable, for example. It is preferable that the device chip 62 is, for example, a metal structure, and 10-100 micrometers in height is preferable.

Next, as shown in a process (B), the adhesive carrier base material and the device wafer 60 are crimped|bonded, and the carrier base material 12 and the device wafer 60 are temporarily adhered. The temporary adhesive film 11 preferably completely covers the device chip 62 . The fact that the temporary adhesive film 11 completely covers the device chip 62 is effective when it is desired to further reduce the TTV of the thinned device wafer (that is, to further improve the flatness of the thinned device wafer).

Subsequently, as shown in the step (C), the back surface 61b of the silicon substrate 61 is subjected to mechanical or chemical treatment (though not particularly limited, for example, thinning by grinding or chemical mechanical polishing (CMP), etc.) Treatment, treatment under high temperature and vacuum such as chemical vapor deposition (CVD) or physical vapor deposition (PVD), treatment with chemicals such as organic solvents, acid treatment solutions or basic treatment solutions, plating treatment, irradiation with actinic rays, heat treatment and cooling treatment, etc.). In FIG. 5 , the back surface of the substrate after processing is indicated as 61b1 (the same applies to FIG. 7 ).

In the step (C), the thickness of the silicon substrate 61 is reduced to obtain a thin device wafer 60a. After the device wafer is thinned, a step of cleaning the temporary adhesive film protruding outward from the area of the base surface of the device wafer with a solvent may be provided in a step before performing the treatment under high temperature and vacuum.

Next, as shown in a process (D), the carrier base material 12 is peeled from the thinning device wafer 60a. It is preferable that it is 40 degrees C or less, and, as for the temperature at the time of peeling, you can also set it as 30 degrees C or less. As a lower limit of the temperature at the time of peeling, it is 0 degreeC or more, for example, Preferably, it is 10 degreeC or more. Although the method of peeling is not specifically limited, It is preferable to fix the thinning device wafer 60a, and to pull up from the edge part of a carrier base material in the perpendicular direction with respect to the thinned device wafer 60a, and to peel. At this time, it is preferable that the peeling interface peels at the interface of the carrier base material 12 and the temporary adhesive film 11. As shown in FIG.

Then, as shown in the step (E), a thin device wafer can be obtained by removing the temporary adhesive film 11 from the thinning device wafer 60a.

The removal method of the temporary adhesive film 11 is, for example, a method of peeling and removing the temporary adhesive film as it is, a method of removing the temporary adhesive film using a peeling solution (after swelling the temporary adhesive film with a peeling solution, peeling off) removal method, method of destructive removal by spraying stripper on temporary adhesive film, method of dissolving and removing temporary adhesive film in stripper, etc.) how to do it, etc.

By using the temporary adhesive composition filled and stored in the container of the present invention, even if it is applied to the use of the temporary adhesive film after the corresponding storage period, for example, through the above steps (A) to (D), the silicon substrate 61 However, it becomes possible to manufacture a high-quality semiconductor device or a member thereof without defects or particles adhering to the surface of the device chip 62 . Moreover, according to this invention, since it can preserve|save without managing the storage period of a temporary adhesive composition excessively, it is easy to make a production plan, and it contributes to the improvement of productive efficiency also from that point.

<<Second embodiment >>

A second embodiment of a method for manufacturing a semiconductor that has undergone the step of manufacturing a laminate will be described. The same code|symbol is attached|subjected to 1st Embodiment mentioned above and the same part, and the description is abbreviate|omitted. 6 and 7 (A1) to (E) are schematic cross-sectional views (A1, B1) for explaining the temporary adhesion between the carrier substrate and the device wafer, respectively, and a state in which the device wafer temporarily adhered to the carrier substrate is thinned (C1). ), a state (D1) in which the carrier substrate and the device wafer are peeled, and a state (E) after removing the temporary adhesive film from the device wafer. In this embodiment, as shown in the step (A1), the provisional adhesive film is formed on the surface 61a of the device wafer from the first embodiment described above. When the temporary adhesive film 11a is provided on the surface 61a of the device wafer 60, the temporary adhesive composition is applied (preferably coated) to the surface of the surface 61a of the device wafer 60, , can be formed by drying (baking) next. Drying can be performed at 60-150 degreeC for 10 second - 2 minutes, for example.

Next, as shown in a process (B1), the carrier base material 12 and the device wafer 60 are press-bonded, and the carrier base material 12 and the device wafer 60 are temporarily adhered. Next, as shown in the step (C1), a mechanical or chemical treatment is performed on the back surface 61b of the silicon substrate 61 to reduce the thickness of the silicon substrate 61 to reduce the thickness of the device wafer 60a to get Next, as shown in a process (D1), the carrier base material 12 is peeled from the thinning device wafer 60a. Then, as shown in the step (E), the temporary adhesive film 11a is removed from the thinned device wafer 60a.

According to the present invention, even in the second embodiment, it is possible to manufacture a high-quality semiconductor device without defects or particles adhering to the surface of the silicon substrate 61 or the device chip 62 . Moreover, similarly to the above, it contributes to the improvement of production efficiency by increasing the degree of freedom of production planning.

In addition, regarding the manufacturing method of the semiconductor device using a temporary adhesive film, or its member, Paragraph 0090 of International Publication No. 2017/150320 - description of 0111 can be considered into consideration, and these content is integrated in this specification.

The present invention is not limited to the above-described embodiment, and appropriate modifications, improvements, and the like are possible. Moreover, although a silicon substrate is mentioned as a device wafer in the above-mentioned embodiment, it is not limited to this, In the manufacturing method of a semiconductor device, any to-be-processed member which can be subjected to mechanical or chemical processing may be used. Moreover, in the above-mentioned embodiment, although thin film processing of a device wafer was mentioned as a mechanical or chemical processing with respect to a device wafer (silicon substrate), it is not limited to these, Any processing required in the manufacturing method of a semiconductor device is carried out. can be heard In addition, the shape, dimension, number, arrangement location, etc. of the device chip in the device wafer illustrated in embodiment mentioned above are arbitrary, and are not limited. Moreover, as another embodiment, it is also possible to set it as the following structure. A temporary adhesive composition is applied to a glass, silicone, or metal carrier to form a temporary adhesive film, and a diced chip is adhered thereon. The adhesion temperature at this time becomes like this. Preferably it is the range of 10 degreeC - 250 degreeC. Further, the adhered chip is sealed with a molding resin, and the molding resin filled with the chip is peeled from the adhesive carrier base material in the same manner as in the above procedure to remove the temporary adhesive film.

Example

Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following examples unless the gist thereof is exceeded. In addition, unless otherwise specified, "part" and "%" are based on mass.

<Preparation of temporary adhesive composition>

As shown in Table 1 below, each component of the temporary adhesive composition was mixed to make a uniform solution, and then filtered using a polytetrafluoroethylene filter having a pore diameter of 5 μm to prepare a temporary adhesive composition. In Comparative Example 3, the elastomer did not dissolve in the solvent. In Table 1, the composition ratio of each solid content was shown in the relative mass part unit when content of an elastomer is 100 mass parts. Moreover, content of each solvent in a temporary adhesive composition was adjusted suitably so that the value of X in a table|surface might be satisfied for each Example and a comparative example.

<Preparation of courage>

For each Example and Comparative Example, as shown in the table, containers having any one or more of the following characteristics 1 to 4 were prepared. The content of each characteristic is as follows, respectively, and about the characteristic of each container, "adoption" was described in the column of the corresponding characteristic. The shape of the container is usually as shown in Fig. 1, and the container is composed of a container body and a cover (including an outer cover and an inner cover). The diameter (inner diameter) of the body is 16.8 cm, and the height of the body (the length from the bottom of the inside to the bottom of the inlet) is 31.2 cm. The diameter (inner diameter) of the inlet is 2.5 cm, and the length of the inlet is 4.9 cm. The length of the region in which the threaded portion is formed is 0.94 cm.

·Feature 1: The material of the container is glass.

·Feature 2: The material of the container is naphron (R) (registered trademark) PFA (manufactured by Nichias Corporation).

·Feature 3: The inner wall of the container is subjected to de-alkali treatment and ultrapure water washing.

·Feature 4: The inner wall surface of the inner cover is processed with Teflon (registered trademark).

<Measurement of Saturated Dissolution Concentration>

In calculating the fraction X, the saturated dissolution concentration of the temporary adhesive composition was previously measured as follows.

In 23 degreeC, after injecting|throwing-in an excess amount of solid content to a solvent and stirring, solid content was saturated-dissolved, and the dissolved residue solid content was removed by filtration using a 10 micron filter. Thereafter, a predetermined amount of the filtrate was dried in an oven, the dry weight of the solid content was measured, and the saturated dissolved concentration was calculated according to the formula of [dry weight]/[amount of filtrate before drying].

<Production of container with temporary adhesive composition>

The provisional adhesive composition was filled from the inlet of each container, and the container containing the temporary adhesive composition was produced. The filling rate Y of each container is shown in the table below. The filling into the container was performed under the atmosphere at a temperature of 23°C (external pressure of 1 atm). Moreover, after filling the temporary adhesive composition, the container was each preserve|saved for 90 days in the environment of the temperature of 23 degreeC.

<Evaluation of particle suppression>

After the said storage, the temporary adhesive composition was apply|coated to the silicon wafer of 12 inches (1 inch is 2.54 cm) using a spin coater. Next, the wafers after application were subjected to heat treatment at 100°C, 160°C, and 200°C for 3 minutes, respectively, to form a temporary adhesive film. The thickness of the temporary adhesive film is 20 μm. The number of particles on the surface of the temporary adhesive film was confirmed with a defect inspection apparatus SP-1 (manufactured by KLA). Here, it was judged that the foreign material which has a size of 1000 nm or more was a particle. The results were evaluated separately as follows.

A: Less than 0.015 pieces/cm ²

B: 0.015 pieces/cm ² or more and less than 0.15 pieces/cm ²

・C: 0.15 pieces/cm ² or more

[Table 1]

<Specification of raw materials>

<<Elastomer>>

· Septon 4033: Kurare Co., Ltd. (brand name), hydrogenated polystyrene-based elastomer

· Septon 2002: Gurarez Co., Ltd. (trade name), hydrogenated polystyrene-based elastomer

· Kraton G1652: Kurare Co., Ltd. (trade name), hydrogenated polystyrene-based elastomer

Septon V9827: Kurare Co., Ltd. (trade name), hydrogenated polystyrene-based elastomer

<<Antioxidant >>

・Irganox1010: BASF Japan Co., Ltd. (brand name)

<<Surfactant>>

・KF-6003: Shin-Etsu Chemical High School Co., Ltd. (brand name)

<<Solvent>>

S-1: decahydronaphthalene (85 wt%) and butyl acetate (15 wt%)

S-2: toluene (85 wt%) and butyl acetate (15 wt%)

S-3: mesitylene (85wt%) and butyl acetate (15wt%)

·S-4: isopropyl alcohol

As can be seen from the results shown in the table, when the temporary adhesive composition is filled and stored in a preferred embodiment of the present invention, it is found that when it is applied to a member to be processed as a temporary adhesive film, generation of particles can be suppressed. could

On the other hand, in Comparative Examples 1, 2, and 4 in which the left side of Formula (1) becomes 100 or more, when it used as a temporary adhesive film, a large amount of particles has generate|occur|produced.

<Example 100>

<<Production of laminate >>

Using each temporary adhesive composition after the preservation|save of Examples 1-10 and Comparative Examples 1, 2, and 4, the laminated body was produced as follows.

A fluorocarbon film was formed on a plate-shaped support having a thickness of 0.7 mm by plasma CVD using _{C 4} F _{8 gas (FC process 1).} Thereby, the support body in which the peeling layer of thickness 1 micrometer was formed was obtained. Next, each temporary adhesive composition was apply|coated on the semiconductor wafer board|substrate (unground silicon wafer of 150 mm in diameter) of 725 micrometers in thickness. Next, in each of 90 degreeC, 160 degreeC, and 220 degreeC, it baked for 10-20 minutes step by step, and formed the temporary adhesive layer which consists of a temporary adhesive film on the semiconductor wafer substrate. The thickness of the temporary adhesive layer after baking is 50 micrometers. Finally, the said peeling layer and the said temporary adhesive layer were made to mutually oppose and adhere|attached, and the laminated body was produced.

<<Evaluation of separability>>

About each laminated body obtained in Example 100, after giving the following processing to a laminated body, respectively, it was evaluated whether a support body is separated from a semiconductor wafer substrate.

The semiconductor wafer substrate in the laminate was thinned by polishing. Then, the green laser which has a wavelength of 532 nm was irradiated toward the peeling layer from the support body side of a laminated body. Specifically, a 532 nm laser having a beam shape of 60 µm, an irradiation pitch of 120 µm, an average output of 0.6 W, and a transmission speed of 3000 mm/sec was irradiated to two places on the laminate at pulse frequencies of 30 kHz and 50 kHz. The number of scans of the laser was 1 time.

As a result, when each temporary adhesive composition after the storage of Examples 1-10 is used, the peeling layer in a laminated body is changed in quality by receiving laser irradiation, and only lifting a support body, a support body is a semiconductor wafer substrate was easily separated from In addition, after the support was separated, the support and the corresponding surfaces of the semiconductor wafer substrate were visually observed. As a result, there was no residue except that a trace amount of black powder in which the fluorocarbon was altered was confirmed on the semiconductor wafer substrate.

On the other hand, when each temporary adhesive composition after storage of Comparative Examples 1, 2 and 4 was used, white or opaque particles were remarkably observed, and residues were clearly confirmed.

As described above, it was found that, by applying the preservation method of the present invention, high-quality substrate production became possible, leading to a very valuable improvement in terms of quality assurance.

1 Temporary adhesive composition (temporary adhesive)
2 container body
2a The inner surface of the container
21 Base of container body
22 Coating layer on the inner side of the container
3 inner cover
31 Base of inner cover
32 Coating layer on the inner surface side of the inner cover
4 outer cover
7 inlet
8 thread
9 Particles
10, 20 containers
11, 11a Temporary adhesive film
12 Carrier substrate (substrate)
100 Adhesive carrier substrate (laminate)
60 device wafer (member to be processed)
60a Thinning device wafer (processed member to be processed)
61 silicon substrate
61a substrate surface
61b substrate back side
61b1 Thinning Device Wafer Back Side
62 device chip

Claims (17)

Having a temporary adhesive composition and a container,
The temporary adhesive composition includes a solid content including a polystyrene-based elastomer and an organic solvent,
A container containing the temporary adhesive composition filled with the temporary adhesive composition in a state that satisfies the following formula (1);
[Equation 1]

X represents the fraction representing the ratio of Xa to Xb, Xa represents the blending concentration of the solid content in the temporary adhesive composition, Xb represents the saturated dissolution concentration of the solid content in the temporary adhesive composition at the storage temperature, Y is the storage temperature It is a filling rate which shows the ratio of the volume of the temporary adhesive composition with respect to the volume of the container in X and Y unit is %. The method according to claim 1,
A container containing a temporary adhesive composition, wherein the polystyrene-based elastomer includes a hydrogenated polystyrene-based elastomer. The method according to claim 1 or 2,
The container with the temporary adhesive composition in which the said organic solvent contains at least 1 sort(s) of compound selected from the group which consists of an aliphatic hydrocarbon compound, an aromatic hydrocarbon compound, a ketone compound, and an ester compound. 4. The method according to any one of claims 1 to 3,
A container containing the temporary adhesive composition, wherein the temporary adhesive composition further comprises an antioxidant. 5. The method according to any one of claims 1 to 4,
A container containing the temporary adhesive composition, wherein the temporary adhesive composition further comprises a surfactant. 6. The method according to any one of claims 1 to 5,
A container containing the temporary adhesive composition, wherein the organic solvent contains an aromatic hydrocarbon compound or an ester compound. 7. The method according to any one of claims 1 to 6,
A container containing a temporary adhesive composition, wherein the fraction X of the formula (1) is 20% or more and 90% or less. 8. The method according to any one of claims 1 to 7,
A container containing a temporary adhesive composition, wherein the filling factor Y of the formula (1) is 60% or more and 99.9% or less. 9. The method according to any one of claims 1 to 8,
The temporary adhesive composition is, on the surface of the temporary adhesive film formed of the temporary adhesive composition, a container containing a temporary adhesive composition used for a purpose in which a layer containing a fluorocarbon is formed. 10. The method according to any one of claims 1 to 9,
The container is a glass container comprising, on the inner surface of the container, at least one wetted surface of a wetted surface consisting of a layer containing fluorocarbon and a wetted surface subjected to de-alkali treatment, a container containing a temporary adhesive composition . 11. The method according to any one of claims 1 to 10,
The container has a container body for accommodating the temporary adhesive composition, and a cover for closing the container body,
A container containing a temporary adhesive composition, wherein the lid has a wetted surface comprising a layer containing fluorocarbon. A method of preserving the temporary adhesive composition by filling a container, the method comprising:
The temporary adhesive composition includes a solid content including a polystyrene-based elastomer and an organic solvent,
A method for preserving a temporary adhesive composition, wherein the container is filled with the temporary adhesive composition so as to satisfy the following formula (1);
[Equation 2]

X represents the fraction representing the ratio of Xa to Xb, Xa represents the blending concentration of the solid content in the temporary adhesive composition, Xb represents the saturated dissolution concentration of the solid content in the temporary adhesive composition at the storage temperature, Y is the storage temperature It is a filling rate which shows the ratio of the volume of the temporary adhesive composition with respect to the volume of the container in X and Y unit is %. 13. The method of claim 12,
The preservation method of the temporary adhesive composition whose fraction X of the said Formula (1) is 20% or more and 90% or less. 14. The method of claim 12 or 13,
The storage method of the temporary adhesive composition whose filling factor Y of said Formula (1) is 60 % or more and 99.9 % or less. A method of manufacturing a container with a temporary adhesive composition by filling a container with the temporary adhesive composition,
The temporary adhesive composition includes a solid content including a polystyrene-based elastomer and an organic solvent,
A method for producing a container with a temporary adhesive composition, in which the container is filled with the temporary adhesive composition so as to satisfy the following formula (1);
[Equation 3]

X represents the fraction representing the ratio of Xa to Xb, Xa represents the blending concentration of the solid content in the temporary adhesive composition, Xb represents the saturated dissolution concentration of the solid content in the temporary adhesive composition at the storage temperature, Y is the storage temperature It is the ratio of the volume of the temporary adhesive composition with respect to the volume of the container in in, and the unit of X and Y is %. 16. The method of claim 15,
Fraction X of the formula (1) is 20% or more and 90% or less, the manufacturing method of the container containing the temporary adhesive composition. 17. The method of claim 15 or 16,
The filling factor Y of the formula (1) is 60% or more and 99.9% or less, the manufacturing method of the container containing the temporary adhesive composition.

Images