KR20220003959A - Ejector, processing apparatus and cleaning apparatus - Google Patents

Abstract

An object of the present invention is to provide an ejector that suppresses a decrease in suction force when a liquid enters the ejector and enables processing or cleaning of an object to be processed at low cost. An ejector that generates a suction force, comprising: an inlet pipe having a plurality of openings formed at the front end and from which the driving fluid is injected; an outlet pipe having a receiving port for receiving the driving fluid injected from the opening at a position opposite to a tip of the inlet pipe; and a body part surrounding the opening and the receiving port and having a suction path for sucking external fluid to the inside.

Description

EJECTOR, PROCESSING APPARATUS AND CLEANING APPARATUS

The present invention relates to an ejector for generating a suction force, and a processing apparatus and a cleaning apparatus having the ejector.

BACKGROUND ART Electronic devices such as personal computers and smartphones have chips of semiconductor devices such as ICs (integrated circuits) and LSIs (large-scale integrated circuits). The chip is manufactured by dividing a wafer having a functional layer formed on the surface of a semiconductor substrate such as silicon and silicon carbide.

The wafer is divided by, for example, grinding the back surface and processing it to a desired thickness, and then cutting along a line to be divided. Further, since processing debris generated during processing may adhere to the surface of the wafer and individual chips manufactured from the wafer, the wafer and the chips are often cleaned at an appropriate timing.

Each of the processing apparatus for grinding or cutting a wafer and the cleaning apparatus for cleaning the wafer and individual chips manufactured from the wafer include a chuck table having a holding surface for holding the wafer.

When processing, such as processing, cleaning, etc. are performed on the wafer and the chip, an external force is applied to the object to be processed, such as the wafer and the chip. Even in such a case, the chuck table generally sucks and holds the to-be-processed object so that the to-be-processed object does not move (for example, refer patent documents 1 and 2).

[Patent Document 1] Japanese Patent Laid-Open No. 2009-246098 [Patent Document 2] Japanese Patent Laid-Open No. 2010-36275

On the surface side of the chuck table, a porous portion held at a negative pressure when the object to be treated is sucked is formed, and the surface of the porous portion serves as a holding surface for sucking and holding the object to be treated. Then, the porous portion communicates with the ejector, and the porous portion is maintained at a negative pressure by the suction force generated by the ejector.

Ejectors are broadly classified into those in which the driving fluid used for generating the suction force is a gas and a liquid. The electron ejector mainly uses Bernoulli's theorem, which states that the energy (momentum) of a non-viscous fluid is conserved. In addition, the latter ejector mainly utilizes Newton's law of viscosity, which states that frictional force is generated according to the velocity gradient between the viscous fluid and the fluid around it.

However, although the viscosity of a gas is lower than that of a liquid, in reality, there is no gas that does not have viscosity. Therefore, even in an ejector whose driving fluid is a gas, friction occurs with the surrounding fluid as the gas moves. Accordingly, an ejector in which the driving fluid is a gas generates a suction force using Bernoulli's theorem and Newton's law of viscosity.

By the way, processing and washing of the above-mentioned to-be-processed object are generally performed while supplying a liquid. In addition, in many cases, the size of the porous portion on the holding surface for holding the object is designed to be slightly larger than the size of the object in order to securely hold the object.

Therefore, the region near the outer edge of the holding surface of the porous portion may be exposed to the liquid without being covered by the to-be-processed object when processing or washing the to-be-processed object. As a result, the liquid supplied to the to-be-processed object may be sucked into the inside of the said porous part through the said area|region by the action of the suction force generated by the said ejector.

Also, the liquid sucked into the porous portion may reach the inside of the ejector through the communication path. In this case, friction may occur between the driving fluid and the liquid that has invaded the inside of the ejector, and the flow of the driving fluid may be inhibited. As a result, the suction power of the ejector is lowered, and there is a possibility that a problem may occur in processing or cleaning of the object to be processed.

There are also ejectors that reduce the adverse effects caused by the liquid entering the interior, but such ejectors are large devices with complicated mechanisms and require a large amount of driving fluid. Therefore, when a chip is manufactured using such an ejector, there exists a possibility that the problem that the manufacturing cost of the said chip|tip increases may arise.

In view of the above, one object of the present invention is to provide an ejector that suppresses a decrease in suction force when a liquid enters the inside of the ejector and enables processing or cleaning of an object to be processed at low cost will do

Another object of the present invention is to provide a processing apparatus and a cleaning apparatus having such an ejector.

According to one aspect of the present invention, there is provided an ejector that generates a suction force, an inlet pipe having a plurality of openings formed at its front end, through which a driving fluid is injected from the opening of the inflow pipe, and receiving the driving fluid injected from the opening An ejector is provided, comprising: an outlet pipe having a receiving port at a position opposite to the tip of the inlet pipe;

Preferably, the drive fluid is a liquid.

According to another aspect of the present invention, there is provided a processing apparatus for processing a workpiece having a device formed on the surface thereof, a chuck table having a holding surface for holding the workpiece, and the workpiece held by the chuck table at the tip of a spindle. A processing apparatus is provided, comprising: a processing unit for processing with an attached processing grindstone; the above-mentioned ejector;

According to another aspect of the present invention, there is provided a cleaning apparatus for cleaning an object to be cleaned having a device formed on the surface thereof, comprising: a chuck table having a holding surface for holding the object to be cleaned; and the object to be cleaned held by the chuck table; A cleaning apparatus is provided, comprising: a cleaning unit for cleaning; the ejector described above;

According to one aspect of the present invention, there is provided an ejector for ejecting a driving fluid from a plurality of openings of the inlet pipe to the inside of the body portion. In the ejector, as compared with an ejector that ejects the driving fluid from one opening, the surface area of the flow path through which the driving fluid is supposed to pass inside the body portion increases. That is, in the ejector, the contact area between the driving fluid and the surrounding fluid increases.

Therefore, according to one aspect of the present invention, it is possible to efficiently increase the frictional force generated between the driving fluid and the surrounding fluid. As a result, even in the case where liquid enters the inside of the main body and the flow of the driving fluid is obstructed, adverse effects due to the intruding liquid are reduced. That is, even in such a case, a decrease in the suction force of the ejector is suppressed.

Further, according to one aspect of the present invention, it is possible to realize a desired suction force without complicating and increasing the size of the apparatus and without significantly increasing the amount of the required driving fluid. As a result, it becomes possible to process or wash the to-be-processed object inexpensively.

Further, according to another aspect of the present invention, a processing apparatus or a cleaning apparatus including such an ejector is provided. In these apparatuses, as described above, a decrease in the suction force of the ejector is suppressed, and the processing or cleaning of the object to be processed is performed inexpensively.

1 is a perspective view schematically showing an ejector according to an embodiment.
FIG. 2 is a cross-sectional view schematically illustrating a part of the ejector shown in FIG. 1 .
3 is a perspective view schematically illustrating a table base and a chuck table connected to the ejector shown in FIGS. 1 and 2 .
4 is a cross-sectional view schematically illustrating a table base and a chuck table connected to the ejector shown in FIGS. 1 and 2 .
Fig. 5 is a cross-sectional view schematically showing a processing apparatus for processing a workpiece that is sucked and held on the holding surface of the chuck table.
Fig. 6 is a perspective view schematically showing a cleaning device for cleaning an object to be cleaned that is sucked and held on the holding surface of the chuck table (or spinner table).

An embodiment of the ejector will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing an ejector 2 according to an embodiment, and FIG. 2 is a cross-sectional view schematically showing a part of the ejector 2 illustrated in FIG. 1 .

The ejector 2 generates a suction force by flowing a driving fluid inside the body portion 4 isolated from the outside. The driving fluid may be either liquid or gas. The driving fluid is, for example, a liquid such as water or a gas such as air or an inert gas such as argon gas or nitrogen gas.

The body part 4 has walls 4a and 4b which oppose each other, and the suction path 4c formed in the wall of the body part 4 other than the walls 4a and 4b. Then, one end of the inlet pipe 6 is inserted into the wall 4a, and one end of the outlet pipe 8 is inserted into the wall 4b.

The inlet pipe 6 provides a path for introducing the driving fluid into the body portion 4 . The outlet pipe 8 provides a path for discharging the fluid existing inside the body part 4 . The suction path 4c provides a path for sucking the external fluid into the body portion 4 .

The other end of the inlet pipe 6 is connected to a driving fluid supply source (not shown) to which the driving fluid is supplied. In addition, one end of the inflow pipe 6 located inside the body 4 decreases in diameter as it approaches the center of the body 4 from the wall 4a of the body 4 , and then It includes an increasing portion (a portion that functions as a venturi tube) 6a.

One end of the inflow pipe 6 has a wall 6c in which a plurality of openings (holes) 6b are formed. The wall 6c has a predetermined thickness from one end (tip) of the inflow pipe 6 toward the portion 6a. The shape of the tip of the inflow pipe 6 is approximately circular, and the diameter thereof is approximately equal to the maximum diameter of the portion 6a. That is, the shape of the wall 6c is substantially cylindrical.

The shape of the some opening 6b is not limited to a specific shape. In addition, all may be the same or similar shape may be sufficient as the shape of the some opening 6b in the front-end|tip of the inflow pipe 6, and each may differ. However, from the viewpoint of uniformly jetting the driving fluid, the shape of the plurality of openings 6b at the tip of the inflow pipe 6 is preferably a circular shape having substantially the same diameter.

In addition, from the viewpoint of uniformly jetting the driving fluid, it is preferable that the plurality of openings 6b pass through the wall 6c while maintaining the shape at the tip of the inflow pipe 6 . For example, the thickness of the wall 6c is longer than the diameter of the distal end of the inflow pipe 6, and the plurality of openings 6b maintain the shape at the distal end of the inflow pipe 6 to form the wall 6c. It is preferable to penetrate.

The receiving port 8a of the outlet pipe 8 is formed in the position opposite to the front-end|tip of the inflow pipe|tube 6 . The receiving tool 8a has a shape like a bowl with an open bottom. Moreover, the diameter of the receiving port 8a on the side opposite to the front-end|tip of the inflow pipe 6 is longer than the diameter of the front-end|tip of the inflow pipe 6 .

Therefore, the flow path through which the driving fluid is supposed to pass inside the main body 4 extends from each of the plurality of openings 6b to the receiving port 8a. In addition, the outlet pipe 8 located inside the main body 4 is a portion 8b whose diameter increases as it approaches the wall 4b of the main body 4 from the center of the main body 4 . ) is included.

The main body 4 has a plurality of openings 6b and an outlet pipe of the inlet pipe 6 so that the fluid does not enter and exit from anything other than the suction path 4c, the inlet pipe 6 and the outlet pipe 8 . It surrounds the periphery of the accommodation port 8a of (8). That is, the body part 4 is sealed except for the suction path 4c, the inflow pipe|tube 6, and the outflow pipe|tube 8. As shown in FIG.

The ejector 2 shown in FIGS. 1 and 2 may further include a recovery unit for circulating the driving fluid discharged from the tip 8c of the outlet pipe 8 to a driving fluid supply source (not shown). The ejector 2 having the recovery unit is preferable in that the driving fluid can be reused.

In the ejector 2 shown in FIGS. 1 and 2 , the driving fluid is supplied to the inlet pipe 6 from a driving fluid supply source (not shown). The driving fluid supplied to the inlet pipe 6 is accelerated by the venturi effect, and is injected into the body portion 4 from each of the plurality of openings 6b formed at the tip. The driving fluid injected into the body portion 4 flows into the outlet pipe 8 from the receiving port 8a.

At this time, the pressure of the driving fluid is lowered to offset the increased energy by the acceleration of the driving fluid (Bernoulli's theorem), and friction occurs between the driving fluid and the surrounding fluid (Newton's law of viscosity) . Thereby, the external fluid flows into the inside of the main body part 4 through the suction path 4c, and also the said surrounding fluid flows into the outlet pipe 8 together with the said driving fluid. In short, the ejector 2 makes the inside of the main body 4 a negative pressure, and generates a suction force through the suction path 4c.

Here, the ejector 2 ejects the driving fluid from the plurality of openings 6b of the inflow pipe 6 into the body portion 4 . As a result, in the ejector 2 , the surface area of the flow path through which the driving fluid is supposed to pass inside the main body 4 increases as compared with an ejector that ejects the driving fluid from one opening. That is, in the ejector 2, the contact area between the driving fluid and the surrounding fluid increases.

Therefore, in the ejector 2, the frictional force generated between the driving fluid and the surrounding fluid can be effectively increased. As a result, even in the case where the liquid enters the inside of the main body 4 and the flow of the driving fluid is inhibited, the adverse effect due to the infiltrating liquid is reduced. Specific examples will be described later]. That is, even in such a case, a decrease in the suction force of the ejector 2 is suppressed.

In addition, the ejector 2 can realize a desired suction force without complicating or increasing the size of the device, and without significantly increasing the amount of the required driving fluid. As a result, it becomes possible to process or clean the to-be-processed object at low cost (specific examples of processing or cleaning of the to-be-processed object will be described later).

3 is a perspective view schematically showing the table base 18 and the chuck table 20 connected to the ejector 2 shown in FIGS. 1 and 2 , and FIG. 4 is a cross-sectional view thereof. In addition, the chuck table 20 is fixed to the table base 18 in a detachable manner.

An annular convex portion 18b protruding upward is formed on the upper surface 18a of the table base 18 . In a region inside the convex part 18b of the upper surface 18a, an annular convex part 18c protruding upward and having a smaller diameter than the convex part 18b is formed concentrically with the convex part 18b. . Further, in the region between the convex portion 18b and the convex portion 18c of the upper surface 18a, a cylindrical positioning convex portion 18d protruding upward is formed.

An annular groove 18e having a diameter smaller than that of the convex portion 18c is formed concentrically with the convex portion 18c in a region inside the convex portion 18c of the upper surface 18a. Moreover, one end of the communication path 18f formed inside the table base 18 is opened in the area|region inside the groove|channel 18e of the upper surface 18a. Further, the other end of the communication path 18f communicates with the suction path 4c of the main body portion 4 of the ejector 2 shown in Figs. 1 and 2 .

The chuck table 20 includes a frame 22 having a concave portion 22a on the upper surface side thereof, and a porous plate 24 fixed to the concave portion 22a of the frame 22 with an adhesive. The porous plate 24 functions as a porous part for attracting and holding the to-be-processed object, and the upper surface 24a becomes a holding surface which attracts and holds the to-be-processed object. For example, the frame 22 is comprised using a metal etc., and the porous plate 24 is comprised using porous ceramics etc.

An annular recessed portion 22c corresponding to the convex portion 18b of the table base 18 is formed in the lower surface 22b of the frame 22 . Annular recessed part 22d corresponding to the convex part 18c of the table base 18 is formed in the area|region inside the recessed part 22c of the lower surface 22b. That is, the recessed part 22c and the recessed part 22d are comprised concentrically.

The positioning recessed part 22e is formed in the area|region corresponding to the positioning convex part 18d of the table base 18 (namely, the area|region between the recessed part 22c and the recessed part 22d). Further, in the region corresponding to the annular groove 18e (that is, the region inside the concave portion 22d), a circular concave portion 22f is formed. One end of the communication path 22g formed inside the frame 22 is opened at the bottom of the recess 22f. The other end of the communication path 22g opens to the bottom of the recess 22a and communicates with the porous plate 24 .

When fixing the chuck table 20 to the table base 18 , for example, the annular groove 18e of the table base 18 is provided with a ring member 26 having a shape corresponding to the groove 18e. insert The ring member 26 is made of, for example, resin or the like, and is made less slippery with respect to the table base 18 and the chuck table 20 . In addition, this ring member 26 is formed with the thickness (height) which protrudes from the upper surface 18a in the state inserted in the groove|channel 18e.

After inserting the ring member 26 into the groove 18e, the chuck table ( 20) is loaded. At this time, with respect to the recessed part 22c, the recessed part 22d, and the positioning recessed part 22e, the table|surface so that the convex part 18b, the convex part 18c, and the positioning convex part 18d may be inserted, respectively. The positions of the base 18 and the chuck table 20 are adjusted.

As described above, the shape of the concave portion 22f corresponds to the shape of the groove 18e into which the ring member 26 is inserted. Therefore, when the chuck table 20 is mounted on the table base 18, a part of the ring member 26 protruding from the upper surface 18a is inserted into the recess 22f. By inserting the ring member 26 into the groove 18e and the concave portion 22f, it is possible to suppress a position shift of the table base 18 with respect to the chuck table 20 .

After the chuck table 20 is mounted on the table base 18, the communication path 18f and the communication path 22g communicate. Therefore, the suction path 4c of the main body portion 4 of the ejector 2 shown in Figs. 1 and 2 holds the chuck table 20 through the communication path 18f and the communication path 22g. It communicates with the surface (upper surface 24a of the porous plate 24).

In this state, when the driving fluid is supplied to the inlet pipe 6 of the ejector 2 shown in FIGS. 1 and 2 , the ejector 2 has a suction path 4c and a communication path 18f and a communication path ( 22g), the porous plate 24 is sucked with a negative pressure inside. Thereby, it becomes possible to hold a to-be-processed object in the holding surface of the chuck table 20 (upper surface 24a of the porous plate 24).

5 is a cross-sectional view schematically showing a processing apparatus for processing the workpiece 11 sucked and held by the holding surface of the chuck table 20 . Specifically, FIG. 5 shows the cutting device 50 for cutting the workpiece 11 to form a groove (half-cut) using the cutting unit 52 .

The cutting device 50 shown in FIG. 5 has the table base 18 and the chuck table 20 shown in FIGS. 3 and 4 , and sucks the workpiece 11 from the holding surface of the chuck table 20 . , keep

The workpiece 11 is, for example, a disk-shaped wafer containing a semiconductor such as silicon, and the surface (upper surface) side thereof is divided into a central device region and an outer peripheral surplus region surrounding the device region. The device region is divided into a plurality of regions by division scheduled lines (streets) arranged in a grid pattern, and semiconductor devices such as ICs and LSIs are formed in each region.

The cutting device 50 shown in FIG. 5 further has a chuck table moving mechanism (not shown) and a cutting unit moving mechanism (not shown). The chuck table moving mechanism can move the table base 18 and the chuck table 20 in the machining feed direction (front-rear direction in FIG. 5 ), for example. Moreover, the said cutting unit moving mechanism can move the cutting unit 52 in the indexing feed direction (left-right direction in FIG. 5) and the cutting feed direction (the up-down direction in FIG. 5), for example.

The cutting unit 52 has a spindle 56 which rotates about an axial center substantially parallel to the planar direction of the holding surface of the chuck table 20 as a center. An annular cutting blade 58 is mounted on one end of the spindle 56, and a rotational driving source (not shown) such as a motor is connected to the other end. For that reason, the cutting blade 58 is rotated by the torque of the rotation driving source transmitted through the spindle 56 .

The cutting blade 58 is a machining tool which cuts the to-be-processed object 11 with a machining grindstone. Therefore, the cutting unit 52 can also be expressed as cutting the to-be-processed object 11 with the processing grindstone attached to the front-end|tip of the spindle 56. As shown in FIG.

As the cutting blade 58, for example, a hub-type cutting blade in which an annular base made of metal or the like and an annular cutting edge formed along the outer peripheral edge of the base are integrally formed is used. The cutting edge of the hub type cutting blade is formed by an electroforming grindstone in which abrasive grains (processed grindstone) containing diamond and cubic boron nitride (cBN), etc. are fixed with a binder such as nickel plating. is composed

Further, as the cutting blade 58, a washer-type cutting blade in which abrasive grains (processed grindstone) are formed by an annular cutting edge fixed by a binder containing metal, ceramics, resin, or the like may be used.

A cutting fluid supply nozzle 60 is provided in the vicinity of the cutting blade 58 . The cutting fluid supply nozzle 60 supplies the cutting fluid 17 to the workpiece 11 and the cutting blade 58 when cutting the workpiece 11 by the cutting blade 58 . The cutting fluid 17 is, for example, water.

When cutting the to-be-processed object 11 using the cutting unit 52, first, the to-be-processed object 11 is made to contact the upper surface 24a of the porous plate 24. As shown in FIG. Alternatively, after attaching the to-be-processed object 11 to the dicing tape which has the same size as the to-be-processed object 11, you may make the to-be-processed object 11 contact with the upper surface of the porous plate 24 via the said dicing tape. Then, the driving fluid is supplied to the inlet pipe 6 of the ejector 2 shown in FIGS. 1 and 2 .

Thereby, the negative pressure generated in the ejector 2 passes through the suction path 4c, the communication path 18f, and the communication path 22g to the holding surface of the chuck table 20 (upper surface 24a of the porous plate 24). )]. As a result, it becomes possible to attract and hold the workpiece 11 to the chuck table 20 .

Subsequently, while rotating the cutting blade 58 by the spindle 56, the table base 18 and the chuck table 20 move in the machining feed direction (FIG. 5) so that the workpiece 11 comes into contact with the cutting blade 58. in the front-rear direction). Thereby, the to-be-processed object 11 is cut, and a groove|channel is formed.

As shown in FIG. 5 , when cutting the workpiece 11 sucked and held by the chuck table 20 , the cutting fluid supply nozzle 60 to the workpiece 11 and the cutting blade 58 , etc. Cutting fluid 17 is supplied.

Here, the cutting fluid 17 may penetrate into the communication path 18f and the communication path 22g through the porous plate 24 etc., as shown in FIG. And, since the communication path 18f and the communication path 22g are connected to the suction path 4c of the main body part 4 of the ejector 2 shown in FIGS. 1 and 2, the ejector 2 The cutting fluid 17 may intrude into the inside of the main body 4 .

In contrast, the ejector 2 ejects the driving fluid from the plurality of openings 6b of the inflow pipe 6 into the body portion 4 . Accordingly, in the ejector 2 , the surface area of the flow path through which the driving fluid is supposed to pass inside the main body 4 increases as compared with an ejector that ejects the driving fluid from one opening. Therefore, in the ejector 2, the frictional force generated between the driving fluid and the surrounding fluid can be effectively increased.

As a result, in the case of the cutting device 50 having the ejector 2 , even when liquid enters the inside of the main body 4 and the flow of the driving fluid is inhibited, adverse effects caused by the intruding liquid are reduced. . That is, even in such a case, the fall of the suction force of the ejector 2 is suppressed, and the probability that a problem arises at the time of cutting in the cutting device 50 can be reduced.

In addition, the ejector 2 is not a large-scale device having a complicated mechanism, nor does it require a large amount of driving fluid. Therefore, by using the cutting device 50 having the ejector 2 , it is possible to cut the workpiece 11 at low cost.

In addition, the processing apparatus which has the processing unit which can mount the ejector 2 is not limited to the cutting apparatus which has a cutting unit which performs cutting as shown in FIG. The ejector 2 may be mounted, for example, on a grinding device having a grinding unit that grinds the surface of the workpiece with a processing grindstone mounted on the tip of the spindle.

In a grinding apparatus, grinding is generally performed while a liquid is supplied to the surface of a to-be-processed object. Therefore, the ejector 2 is suitable also as an ejector mounted on such a grinding device.

6 is a perspective view schematically showing a cleaning device 70 for cleaning the object to be cleaned 21 that is sucked and held on the holding surface of the chuck table (or spinner table) 88 . However, in FIG. 6 , for convenience, a part of the component is removed, and a cross section of the component is shown.

In addition, in FIG. 6 , a disk-shaped wafer with grid-shaped grooves is shown as the object to be cleaned 21 , but the object to be cleaned by the cleaning device 70 is the object to be cleaned 21 . is not limited to Examples of the object to be cleaned by the cleaning device 70 include a disk-shaped wafer before such grooves are formed, or a plurality of chips manufactured by dividing the wafer.

The cleaning apparatus 70 includes a table rotation unit 84 that rotates the chuck table 88 . The table rotation unit 84 has, for example, a shaft 94 which rotates about an axial center substantially parallel to the vertical direction. Connected to the side of the shaft 94 is a cover member 126 that surrounds a portion of the side of the shaft 94 .

A chuck table 88 is connected to one end of the shaft 94 . A porous plate 88a is provided on the surface side of the chuck table 88 . And the axial center of the shaft 94 is substantially orthogonal to the planar direction of the surface of the porous plate 88a.

In addition, a communication path (not shown) having one end connected to the back surface of the porous plate 88a is formed inside the shaft 94 . The other end of the communication path communicates with the suction path 4c of the main body 4 of the ejector 2 shown in FIGS. 1 and 2 . That is, the communication path communicates the suction path 4c and the porous plate 88a. Therefore, the ejector 2 communicates with the holding surface (upper surface of the porous plate 88a) of the chuck table 88 via the suction path 4c and the communication path.

To the other end of the shaft 94, a rotational driving source (not shown) such as a motor and a lifting/lowering driving source (not shown) such as an air cylinder are connected. Therefore, the chuck table 88 is rotated by the power of the rotation drive source transmitted through the shaft 94 . In addition, the chuck table 88 is raised/lowered between the upper carry-in/out position where the object to be cleaned 21 is carried in or out and the lower cleaning position by the power of the raising/lowering drive source.

A cleaning liquid receiving unit 86 is disposed at a position surrounding the shaft 94 . The cleaning liquid receiving unit 86 includes a cylindrical outer peripheral wall 100a, an annular bottom wall 100b protruding radially inward from the lower portion of the outer peripheral wall 100a, and an inner peripheral side of the bottom wall 100b. It has a cylindrical inner peripheral wall (100c) erected upwardly. The shaft 94 passes through the inner side of the inner peripheral wall 100c. The outer diameter of the inner peripheral wall 100c is smaller than the inner diameter of the cover member 126, and when the chuck table 88 is lowered to the cleaning position, the cover member 126 moves the inner peripheral wall 100c from the outer peripheral side. surround

A drain 104 is formed in the bottom wall 100b, and the drain 104 is connected to a drain (not shown) extending downward. When the cleaning liquid falls on the cleaning liquid receiving unit 86 , the cleaning liquid is discharged from the drain 104 through the drain passage to the outside. When the chuck table 88 is lowered to the cleaning position, since the inner peripheral wall 100c is surrounded by the cover member 126, the scattering of the cleaning liquid downward through the through hole through which the shaft 94 passes is suppressed.

A drying unit 108 is disposed inside the outer peripheral wall 100a. The drying unit 108 has a pipe-shaped shaft 114 inserted into the bottom wall 100b. The shaft portion 114 is a pipe-shaped member extending from the outside of the chuck table 88 in a direction substantially perpendicular to the surface of the chuck table 88 . The upper end of the shaft portion 114 reaches a position higher than the surface of the chuck table 88 and is connected to the arm portion 112 . A rotation driving source (not shown) such as a motor for rotating the shaft portion 114 is connected to the lower end side of the shaft portion 114 .

The arm part 112 is a pipe-shaped member extending with a length corresponding to the distance from the upper end of the shaft part 114 to the center of the chuck table 88 . The extending direction of the arm part 112 is substantially orthogonal to the extending direction of the shaft part 114 . A drying nozzle 110 facing downward is provided at the tip of the arm portion 112 (the end of the arm portion 112 not connected to the shaft portion 114 ). An air supply source (not shown) is connected to the shaft portion 114 , and air can be blown from the drying nozzle 110 to the surface side of the chuck table 88 via the shaft portion 114 and the arm portion 112 .

A cleaning unit 116 is disposed inside the outer peripheral wall 100a so as to sandwich the inner peripheral wall 100c between the drying unit 108 and the drying unit 108 . The cleaning unit 116 has a pipe-shaped shaft 122 inserted into the bottom wall 100b. The shaft portion 122 is a pipe-shaped member extending from the outside of the chuck table 88 along a direction substantially perpendicular to the surface of the chuck table 88 . The upper end of the shaft portion 114 reaches a position higher than the height of the upper surface of the chuck table 88 , and the arm portion 120 is connected thereto. A rotational drive source, such as a motor which rotates the shaft part 122, is connected to the lower end side of the shaft part 122. As shown in FIG.

The arm part 120 is a pipe-shaped member extending with a length corresponding to the distance from the shaft part 122 to the center of the chuck table 88 . The extending direction of the arm part 120 is substantially orthogonal to the extending direction of the shaft part 122 . At the tip of the arm portion 120 (the end of the arm portion 120 not connected to the shaft portion 122 ), a downward cleaning nozzle 118 is provided. A cleaning liquid supply source (not shown) is connected to the shaft portion 122 , and the cleaning liquid can be ejected from the cleaning nozzle 118 to the surface side of the chuck table 88 via the shaft portion 122 and the arm portion 120 .

When the cleaning device 70 cleans the object 21 to be cleaned, the cleaning liquid (typically water and air) flows from the cleaning nozzle 118 toward the object 21 while rotating the chuck table 88 at high speed. mixed fluid) is sprayed. Thereafter, dry air is sprayed from the drying nozzle 110 to the object to be cleaned 21 to remove the cleaning liquid.

Here, the cleaning liquid may enter the communication path formed inside the shaft 94 through the porous plate 88a of the chuck table 88 or the like. And, since the communication path is connected to the suction path 4c of the main body 4 of the ejector 2 shown in FIGS. 1 and 2 , it is located inside the main body 4 of the ejector 2 . The cleaning liquid may intrude.

In contrast, the ejector 2 ejects the driving fluid from the plurality of openings 6b of the inflow pipe 6 into the body portion 4 . Accordingly, in the ejector 2 , the surface area of the flow path through which the driving fluid is supposed to pass inside the main body 4 increases as compared with an ejector that ejects the driving fluid from one opening. Therefore, in the ejector 2, the frictional force generated between the driving fluid and the surrounding fluid can be effectively increased.

As a result, in the cleaning device 70 having the ejector 2 , even in the case where the liquid enters the inside of the main body 4 and the flow of the driving fluid is inhibited, the adverse effect caused by the infiltrating liquid is reduced. . That is, even in such a case, a decrease in the suction force of the ejector 2 is suppressed, and the probability that a problem occurs during cutting in the cleaning device 70 can be reduced.

In addition, the ejector 2 is not a large-scale device having a complicated mechanism, nor does it require a large amount of driving fluid. Therefore, by using the cleaning device 70 having the ejector 2 , it is possible to perform the cleaning of the object to be cleaned 21 inexpensively.

11: Workpiece 17: Cutting fluid
21: object to be cleaned 2: ejector
4: body part 4a: wall
4b: wall 4c: suction path
6: inlet pipe 6a: part
6b: opening (hole) 6c: wall
8: outlet pipe 8a: receiving port
8b: part 8c: tip
20: chuck table 22: frame
22a: recess 22b: lower surface
22c: recessed part 22d: recessed part
22e: positioning concave portion 22f: concave portion
24: porous plate 24a: upper surface (holding surface)
26: ring member 50: cutting device
52: cutting unit 56: spindle
58: cutting blade 60: coolant supply nozzle
70: cleaning device 84: table rotation unit
86: cleaning liquid receiving unit 88: chuck table (or spinner table)
88a: porous plate 94: shaft
100a: outer peripheral wall 100b: bottom wall
100c: inner peripheral wall 104: drain hole
108: drying unit 110: drying nozzle
112: arm part 114: shaft part
116: cleaning unit 118: cleaning nozzle
120: arm portion 122: shaft portion
126: cover member

Claims (4)

An ejector that generates a suction force,
an inlet pipe having a plurality of openings formed at the front end and from which the driving fluid is injected;
an outlet pipe having a receiving port for receiving the driving fluid injected from the opening of the inlet pipe at a position opposite to the tip of the inlet pipe;
A body portion surrounding the opening and the receiving port and having a suction path for sucking an external fluid
An ejector comprising a. According to claim 1,
The ejector, characterized in that the driving fluid is a liquid. A processing apparatus for processing a workpiece having a device formed on its surface, the processing apparatus comprising:
a chuck table having a holding surface for holding the workpiece;
a processing unit for processing the workpiece held on the chuck table with a processing grindstone mounted on a tip of a spindle;
The ejector according to claim 1 or 2,
A communication path for communicating the suction path and the holding surface of the ejector
A processing apparatus comprising a. A cleaning apparatus for cleaning an object to be cleaned with a device formed on its surface, comprising:
a chuck table having a holding surface for holding the object to be cleaned;
a cleaning unit for cleaning the object to be cleaned held on the chuck table;
The ejector according to claim 1 or 2,
A communication path for communicating the suction path and the holding surface of the ejector
A cleaning device comprising a.

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