KR20210128612A - Mold for punching semiconductor leadframes for easy scrap removal - Google Patents

Abstract

The present invention relates to a mold for punching a semiconductor lead frame in which scrap is easily removed. More specifically, in the process of punching the continuously supplied raw material, scrap is clogged in the scrap groove. The mold for punching a semiconductor lead frame prevents the scrap from being clogged in the scrap groove or separated from the scrap groove when punched. In a mold for punching a semiconductor lead frame in which raw materials are continuously supplied and punched from an inlet on one side to an outlet on the other side, the present invention which is detachably installed on the lower surface of the upper mold, consists of an upper mold and a lower mold. And the mold for punching the semiconductor lead frame comprises: a hole punch with an air hole formed therein; and a scrap groove formed to be opened on a upper surface of a lower mold and formed to correspond to shape and position of the hole punch.

Description

Mold for punching semiconductor leadframes for easy scrap removal

The present invention relates to a mold for punching a semiconductor lead frame in which scrap is easily removed, and more particularly, it prevents scrap from being clogged in a scrap groove in the process of punching continuously supplied raw materials or from being separated from the scrap groove when punched. It relates to a mold for punching out a semiconductor lead frame with which scrap can be easily removed.

In general, a semiconductor leadframe refers to a semiconductor chip that is supported and serves to protect it from impact and a conductor that is connected to an external substrate to transmit an electrical signal.

The semiconductor lead frame is made of a thin metal material with high electrical conductivity, but it is very important to precisely make a large number of leads in a narrow area.

In order to satisfy this performance, the manufacturing of the semiconductor lead frame supplies raw materials to the inside of the mold divided into upper and lower parts, and the process of being punched by the lowering or rising one side of the mold is sequentially performed step by step. can be made and produced.

The punching process is generally made in a form in which a punch descending from the upper part presses the raw material to remove the processed shape from the raw material. form can be made.

However, when the machining shape is a simple shape such as a rectangle, a triangle, or an ellipse, a so-called jamming phenomenon, in which the scrap is deflected and rotated and caught inside the scrap groove, frequently occurs.

Due to this jamming phenomenon, as scrap to be placed in the scrap groove or to be discharged downward is abnormally deposited in the scrap groove, additionally generated scrap is separated from the scrap groove or collides with the punch and is damaged.

In addition, due to the temporary vacuum state that occurs when the punch is inserted into the scrap groove and then released, the scrap is pulled up when the punch is released, so that the scrap is not deposited or discharged in the scrap groove and escapes to the upper part of the scrap groove, so-called jumping (Jumping). ) phenomenon also occurred frequently, resulting in a problem in that the processing quality was significantly lowered by being entangled in the raw material or the punch during punching.

In particular, the semiconductor, which is a super integrated circuit, consists of a set of very many unit processing shapes, and the raw material is sequentially punched while being supplied little by little from the inlet to the outlet of the mold, so a very large number of punches and scrap grooves are formed. In that there is, the above problem is a problem that must be solved, which causes deterioration of the quality of the entire semiconductor lead frame punching process and damage to the mold.

US 10-0403312 B1 US 10-1036354 B1

The present invention was invented to solve the above problems, and the continuous punching process performed quickly and precisely by allowing the scrap to be effectively placed in or discharged from the scrap groove and artificially relieving the vacuum state that may be generated when the punch enters and exits. An object of the present invention is to provide a mold for punching out a semiconductor lead frame that is easy to remove scrap to be made stably.

Objects of the present invention are not limited to the objects mentioned above, and other objects not mentioned will be clearly understood from the description below.

The semiconductor lead frame punching mold for easy scrap removal according to the present invention for achieving the above object consists of an upper mold and a lower mold, and raw materials are continuously supplied from one entrance to the other exit. In the mold, a hole punch that is detachably installed on the lower surface of the upper mold and has an air hole therein; is formed to be opened on the upper surface of the lower mold, and is formed to correspond to the shape and position of the hole punch It is characterized in that it consists of a scrap groove;

In addition, the hole punch is divided into a fixed portion having a relatively large outer diameter and an insertion portion having a relatively small outer diameter, the inlet of the air hole is formed in the fixing portion so as to be perpendicular to the central axis of the hole punch, and the outlet is the hole punch It is characterized in that it is formed in the insertion portion so as to be coaxial with the center of the.

In addition, the inner diameter of the air hole is technically characterized in that it is determined in proportion to the size of the outer diameter of the insertion part.

In addition, the cross-section of the hole punch and the edge of the scrap groove, the center of curvature is a technical feature that is formed in a curve that exists inside the shape.

In addition, the cross-section of the hole punch and the inflection point of the scrap groove are technically characterized in that the radius of curvature is formed to be larger.

The present invention according to the above configuration can expect the following effects.

Since the scrap is prevented from being separated from the scrap groove when the punch enters and exits, the quality of the punching process and the damage of the punch, which are caused by the scrap being trapped in the raw material or the punch, can be prevented.

It can be prevented from remarkably reducing the amount of scrap that can be accommodated and stacked in the scrap groove by being vertically or obliquely stacked instead of being stacked normally due to the deflection rotation of the scrap in the scrap groove or the vacuum generated by the punch. .

In particular, when the acceptable limit is exceeded in the scrap groove, the scrap may escape to the outside of the scrap groove, and as described above, the quality of the punching process may be deteriorated and the punch may be damaged. As this should be done frequently, it is possible to ensure continuity of the punching process and increase production efficiency by remarkably reducing the number of cleaning times of such scrap grooves.

Ultimately, stably guaranteeing the quality of the punching process and reducing the possibility of punch breakage will maximize production efficiency and reduce production costs, as well as additional cost savings such as prevention of consumed raw materials and reduction of the amount of punch replacement. can be obtained

Since the scrap groove is formed in the mold, an unsafe working environment in which the operator must be located between the upper mold and the lower mold can be created in order to organize them. By minimizing this, a safe working environment can be created.

1 is an overall configuration diagram of a hole punch according to a preferred embodiment of the present invention.
2 is a plan view of a hole punch according to another preferred embodiment of the present invention.
3 is a conceptual diagram illustrating a jamming phenomenon of a conventional scrap groove.
4 is a plan view of a scrap groove according to a preferred embodiment of the present invention.
5 is a conceptual diagram illustrating an embodiment to which a deformation of a processing shape is applied.
6 is a conceptual diagram illustrating a state in which the scrap does not rotate inside the scrap groove.

Hereinafter, with reference to the accompanying drawings, a mold for punching out a semiconductor lead frame with which scrap can be easily removed according to a preferred embodiment of the present invention will be described in detail.

1 is an overall configuration diagram of a hole punch according to a preferred embodiment of the present invention, FIG. 2 is a plan view of a hole punch according to another preferred embodiment of the present invention, and FIG. 3 is a conceptual diagram showing a jamming phenomenon of a conventional scrap groove; FIG. 4 is a plan view of a scrap groove according to a preferred embodiment of the present invention, FIG. 5 is a conceptual diagram illustrating an embodiment to which a deformation of a processing shape is applied, and FIG. 6 is a conceptual diagram illustrating a state in which the scrap does not rotate inside the scrap groove.

A mold for punching out a semiconductor lead frame that is easy to remove scrap according to a preferred embodiment of the present invention is a hole punch 100 and a scrap groove 200 having the general configuration and technical characteristics of the upper mold 10 and the lower mold 20. ), so we will focus on the configuration equipped with technical features.

In the semiconductor lead frame punching process, the raw material is supplied from one side of the mold, continuously punched, and discharged to the other side. ) to be explained.

First, look at the hole punch 100.

The hole punch 100 protrudes from the lowest surface of one side of the mold to the other side when each mold is in contact, thereby forming a processing shape on the raw material.

By this role, the shape of the hole punch 100 may be made according to the shape to be processed, and may be formed in a cylindrical shape, a rectangular parallelepiped, or a polygonal pillar.

The thickness of the hole punch 100, assuming the case of a cylinder, uses an outer diameter or an inner diameter, in the case of a rectangular parallelepiped, the outer diameter or inner diameter is the shortest width, and in the case of an oval, the shortest radius can be understood as representing

The hole punch 100 can be installed anywhere in the upper mold 10 or the lower mold 20, but in order for the scrap (S) generated after punching by the hole punch 100 to be stacked or discharged downward, the upper part is It may be desirable to be installed in the mold 10 .

The hole punch 100 is installed so as to be detachably attached to the lower surface of the upper mold 10, and can respond to various types of processing shapes through replacement of the hole punch 100, and the processing quality of some hole punches 100 is lowered. It may be possible to replace them individually.

An air hole 110 may be formed in the hole punch 100 , and serves to resolve a vacuum state generated between the hole punch 100 and the scrap groove 200 by the air supplied through the air hole 110 . By doing so, it may be formed to communicate with the insertion part 150 from the fixing part 130 to be described later.

The hole punch 100 may be divided into a fixing part 130 and an insertion part 150 .

The hole punch 100 transfers the pressing force caused by the lowering of the upper mold 10 to the surface of the raw material during the punching process to separate the part that becomes the scrap (S) from the raw material. By forming the same shape, buckling by pressing force may occur.

In order to prevent such buckling, the hole punch 100 may have an outer diameter differentially applied to the fixing part 130 and the inserting part 150. can not be adjusted, the outer diameter of the fixing part 130 fixed to the upper mold 10 may be formed large.

The shape of the fixing part 130 may be variously made such as a cylinder, a rectangular parallelepiped, or a polygonal pillar, but if there is a directionality of the processing shape, it may be possible to prevent an installation error by configuring it in a polygonal shape.

An inlet 111 of the air hole 110 may be formed in the fixing part 130 , and may be formed to be perpendicular to the central axis of the hole punch 100 .

In detail, the air hole 110 is formed in the horizontal direction perpendicular to the descending direction of the upper mold 10 so that the inlet 111 of the air hole 110 is formed outside the upper mold 10 to form the air hole ( 110) can facilitate the inflow of external air, and the air hole 110 is formed to penetrate the fixing part 130 and the external air is introduced by the inlets 111 formed on both sides of the fixing part 130. You can make this go smoothly.

Additionally, by forming the air hole 110 in a circular shape, it may be desirable to minimize the effect on the tensile strength and shear strength of the fixing part 130 or the insertion part 150 .

The insertion part 150 is formed according to the processing shape, and by pressing the raw material, the scrap S corresponding to the processed shape is separated from the raw material and may serve to push it downward.

As described above, the insertion part 150 is configured to have a relatively small inner diameter compared to the fixing part 130, and the connecting part ( 170) may be formed.

The outlet 113 of the air hole 110 may be formed on the contact surface where the insertion part 150 comes into contact with the raw material, and as described above, the air hole 110 may have a circular shape.

The air hole 110 is formed horizontally from the inlet 111 formed in the fixing part 130 to the center of the hole punch 100 , and is provided on the contact surface of the insertion part 150 from the center of the hole punch 100 again. It may be formed in vertical communication with the outlet 113 .

The inner diameter of the air hole 110 may be proportional to the size of the outer diameter of the insertion part 150 .

The air hole 110 is communicated from the inlet 111 to the outlet 113 as described above, and it may be desirable to form to have the same inner diameter, but since it is formed through the entire insertion portion 150 . The size of the air hole 110 may be determined according to the outer diameter of the insertion part 150 so that buckling or shearing does not occur in the insertion part 150 .

In detail, as follows, the inner diameter of the air hole 110 may be determined to a predetermined size according to the range of the outer diameter of the insertion part 150 .

Insert OD x (mm) Air hole inner diameter (mm) 1.0 ≤ x < 1.5 0.5 1.5 ≤ x < 2.0 0.8 x ≥ 2.0 1.0

The size of the outer diameter of the insertion part 150 corresponds to the size of the scrap S, and the larger the scrap S, the larger the space in which the vacuum is generated. can be formed large.

The inner diameter of the air hole 110 may be formed in proportion to the various outer diameters of the inserting part 150, but considering the convenience of operation when machining the outer diameter formed in the inserting part 150, it is defined according to the range of the outer diameter. It may be desirable to use an inner diameter.

The shape of the insertion part 150 may be determined according to the processing shape, but a characteristic shape may be added to prevent jamming or jumping in the scrap groove 200 . For details about this shape, refer to the scrap groove 200 . ) is explained in

Next, look at the scrap groove 200 .

The scrap groove 200 is formed to be opened on the upper surface of the lower mold 20 , and is formed to correspond to the shape and position of the hole punch 100 , so that the hole punch 100 is inserted when the upper mold 10 is lowered. A portion 150 may be accommodated.

The scrap S of the raw material dropped by the hole punch 100 may be sequentially stacked in the scrap groove 200 or discharged downward.

In detail, when the scrap groove 200 is vertically recessed into the lower mold 20 , the scrap S is placed there, and when the scrap groove 200 penetrates the lower mold 20 , the scrap S is lower It may be discharged to the lower part of the mold 20 by its own weight, but hereinafter, the scrap groove 200 will be described on the assumption that it is formed in a vertically recessed form.

In general, in the case of a semiconductor lead frame, many thin leads are complexly formed. However, if the complex machining shape is punched out at once, the lead may be damaged, and in particular, it is very difficult to process the hole punch 100 having a complicated shape. Therefore, a method of punching to overlap a simple shape in a certain area is used.

Therefore, the machining shape is formed as simple as possible, and this simple machining shape reduces the risk of damage when the hole punch 100 is processed or punched, but the scrap groove 200 jamming due to the simple scrap (S) shape may occur. can

In detail, since the scrap S and the scrap groove 200 have the same shape, the scrap S should be placed in a parallel direction according to the shape of the scrap groove 200 , but a simple shape as shown in FIG. 3 . Thus, the scrap S may rotate in the scrap groove 200 .

Due to this rotation, a jamming phenomenon in which the scrap S is vertically or obliquely caught in the scrap groove 200 may occur, and the scrap S after jamming is placed in the same shape, so the scrap groove 200 functions may not be able to

In the case of a simple machining shape, the shape of the hole punch 100 and the scrap groove 200 may be modified and applied within the tolerance required to prevent such a jamming phenomenon.

As shown in FIG. 5 , when the processed shape is a simple polygonal shape having an angle, the corner formed with the angle is formed as a curve, and the center of curvature may exist inside the processed shape.

Due to this shape, in the case of a simple polygonal shape, an angled corner portion may be formed in a convex shape to the outside of the processed shape.

When the machining shape is a simple curved shape having a curve, a curve may be formed such that a radius of curvature larger than the radius of curvature of the preformed curve is formed at the inflection point at which it is deformed from the curve in a straight line or the curvature of the curve is deformed.

Due to this shape, even in the case of a short curved shape, it may be formed in a convex shape outside the processed shape.

Due to this additionally formed outwardly convex shape, the scrap S macroscopically corresponds to a simple shape, but microscopically it is formed in a complex shape, so that rotation inside the scrap groove 200 can be blocked.

That is, due to the microscopic complex shape, the scrap S can only move in parallel when stacked down or discharged according to the shape formed in the scrap groove 200 as shown in FIG. 6 and is limited not to rotate. Jamming of 200 can be prevented.

This shape may be applied to both the hole punch 100 and the scrap groove 200, and the size of the radius of curvature may be within the tolerance required for the semiconductor lead frame.

The above-described embodiments are merely exemplary, and those of ordinary skill in the art can variously modified other embodiments therefrom.

Accordingly, the true technical protection scope of the present invention should include not only the above embodiments but also other variously modified embodiments by the technical spirit of the invention described in the following claims.

10: upper mold
20: lower mold
100: hole punch
110: air hole
111: entrance
113: exit
130: fixed part
150: insert
170: connection part
200: scrap home
S: scrap

Claims (5)

In the semiconductor lead frame punching mold consisting of an upper mold and a lower mold, the raw material is continuously supplied from one entrance to the other exit, and punched out,
A hole punch that is detachably installed on the lower surface of the upper mold and has an air hole therein; And
A mold for punching out a semiconductor lead frame, which is formed to be opened on the upper surface of the lower mold, and includes a scrap groove formed to correspond to the shape and position of the hole punch. According to claim 1,
The hole punch is divided into a fixed part having a relatively large outer diameter and an insertion part having a relatively small outer diameter,
An inlet of the air hole is formed in the fixing part so as to be perpendicular to the central axis of the hole punch, and an outlet is formed in the insertion part so as to be coaxial with the center of the hole punch. Mold for punching. 3. The method of claim 2,
The inner diameter of the air hole is a mold for punching out a semiconductor lead frame that is easy to remove scrap, characterized in that determined in proportion to the size of the outer diameter of the insertion part. 4. The method according to any one of claims 1 to 3,
The cross section of the hole punch and the edge of the scrap groove are formed in a curved shape having a center of curvature present inside the shape. 4. The method according to any one of claims 1 to 3,
The cross section of the hole punch and the inflection point of the scrap groove are formed to have a larger radius of curvature.

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