KR20210113957A - Electronic device and a method fabricating the same - Google Patents

Abstract

A content disclosed in the present specification relates to provision of an electronic element device whose volume is reduced through a shape change in a process of being implanted inside the body and whose shape is automatically restored inside the body. According to one embodiment of the disclosed content in the present specification, the electronic element device comprises: a deformation part made of a shape memory material that is formed to be restored according to a temperature; and an element part having the electronic elements and attached to the deformation part, wherein the deformation part is unfolded when exposed to a temperature higher than that of a body temperature in a folded or rolled state.

Description

Electronic device and manufacturing method thereof

The present specification relates to an electronic device and a method for manufacturing the same, and to an electronic device used for medical purposes and a manufacturing method for manufacturing the same.

Unless otherwise indicated herein, the contents described in this identification are not prior art to the claims of this application, and the description in this identification is not admitted to be prior art.

In general, since electronic device used for medical purposes is implanted inside the body through surgery, there is a disadvantage of being exposed to various side effects in the process of incision and recovery of the skin.

Accordingly, there is a need for a technology capable of reducing the volume of the electronic device in the implantation process so that the electronic device can be implanted through minimally invasive surgery in the process of incision of the skin and implanting the electronic device.

In this regard, Korean Patent Publication No. 10-1864033 discloses an invasive bioelectronic device, and Korean Patent Publication No. 10-1744395 discloses a method for manufacturing a transparent substrate for a biodegradable flexible electronic device containing starch. are doing

However, the existing inventions do not disclose a technique capable of minimizing the incision of the body by reducing the volume through shape deformation during the transplantation process.

An object of the present invention is to provide an electronic device whose volume is reduced through shape change in the process of being implanted inside the body and whose shape is automatically restored inside the body.

In addition, it is not limited to the technical problems as described above, and it is obvious that another technical problem may be derived from the following description.

According to an embodiment of the disclosure, the electronic device includes a deformable part and electronic elements made of a shape memory material that are formed to be restored according to temperature, and includes an element part attached to the deformable part, and the deformable part is folded. Or when exposed to a temperature higher than body temperature in a dried state, it unfolds.

In addition, the electronic device may further include a buffer formed between the deformable part and the element part to adhere the deformable part and the element part to each other.

In addition, the deformable part may include a folding part formed to deform according to a change in temperature and an unfolding part formed to maintain a shape according to a change in temperature.

In addition, the device part may be formed in the unfolding part.

In addition, the electronic device may further include an anchor part having one end coupled to the deformable part and the other end formed to be sharply extended while being reduced.

In addition, the electronic device may be made of a biodegradable material, and further include a coating portion formed to be coated on the surface of the element portion and the deformable portion.

In addition, the electronic device manufacturing method includes a deformable part manufacturing step of manufacturing a deformable part using a shape memory polymer material, a coating step of coating a buffer part composed of an adhesive on the surface of the deformable part, and attaching an element part composed of a functional element to the buffer part It may include a device attachment step.

In addition, in the coating step, the buffer part may be coated on the deformable part in a state in which the deformable part is semi-cured or fully cured.

In addition, in the device attachment step, the device part may be transplanted into the buffer part in a state in which the deformable part is fully cured.

In addition, the deformable portion may include a central member disposed in the center, connecting members radially disposed outside the center member, and a support member formed to connect the connecting members.

In addition, the support member may be formed in a circular or polygonal shape.

In addition, the element part may be formed at a position where any one of the central member or the supporting member and the connecting member cross each other.

In addition, the deformable portion may further include an inner support member formed to connect the connecting members between the support member and the central member.

In addition, the element part may be formed in a rectangular shape, and an element part coupled to the deformable part may be additionally attached to one side at a position spaced apart by a predetermined distance.

In addition, the element part may be formed in a triangular shape and coupled to an upper surface of a corner of the deformable part.

In addition, the element unit may include contact parts in close contact with the deformable part formed in the form of a plate, and a semi-cylindrical buffer member protruding in a direction spaced apart from the deformable part between the contact parts.

In addition, the manufacturing method for manufacturing an electronic device including a deformable part that unfolds when exposed to a temperature higher than body temperature in a folded or rolled state and an element part attached to the deformable part is a deformable part manufacturing a deformable part made of a shape memory polymer material and an element attachment step of attaching the element part to the deformable part.

In addition, the deformable portion may include a central member disposed in the center, connecting members radially disposed outside the center member, and a support member formed to connect the connecting members.

In addition, the element part may be formed at a position where any one of the central member or the supporting member and the connecting member cross each other.

In addition, in the device attachment step, the deformable part may be laser cut, and an electrode layer, a dielectric layer, a connection electrode, and an LED may be sequentially deposited.

In addition, the element part may be formed in a rectangular shape, and an element part coupled to the deformable part may be additionally attached to one side at a position spaced apart by a predetermined distance.

In addition, the device unit may be an electronic device formed by stacking one or more layers.

According to one embodiment disclosed herein, the electronic device is formed to be rolled in a folding or roll shape in a relatively low temperature environment, and unfolded (folding) in a relatively high temperature environment similar to the internal temperature of the body. Unfolding) or unfolding, it has the advantage that it can be transplanted inside the body through minimal skin incision.

In addition, in the electronic device device, the shape restoration material is applied only to the position corresponding to a specific part, and the parts to which the electronic devices are attached are folded by the shape transformation of the parts except for the parts to which the electronic devices are attached inside the body. There is an advantage in that damage to the electronic elements is prevented.

In addition, the electronic device is formed in the form of a mesh, and the connecting member radially connected to the central member located in the center is bent downward and can be deformed so that it can be folded up and down, so that it can be conveniently inserted into the minimal acupuncture habit.

In addition, since the effects of the present invention described as described above are naturally exhibited by the configuration of the described contents regardless of whether the inventor recognizes them, the above-described effects are only a few effects according to the described contents, and all effects recognized or actual by the inventor should not be accepted as having been described.

In addition, the effect of the present invention should be further grasped by the overall description of the specification, and even if it is not described in an explicit sentence, a person of ordinary skill in the art to which the described content belongs through this specification has such an effect. If it is an effect that can be recognized as the effect, it should be viewed as the effect described in the present specification.

1 is a use state diagram of an electronic device according to an embodiment of the present disclosure;
2 is a perspective view and a cross-sectional view of the electronic device of FIG. 1 ;
3 is an experimental photograph showing the operation of the deformation part of the electronic device of FIG.
4 is an experimental photograph showing another use state of the electronic device of FIG. 1 .
5 is a perspective view of the electronic device of FIG. 1 according to another embodiment;
6 is a flowchart illustrating a method of manufacturing the electronic device of FIG. 1 .
7 and 8 are a schematic diagram and a perspective view of an electronic device according to another embodiment.
9 and 10 are plan views of the electronic device of FIG. 1 according to another embodiment;
Fig. 11 is a schematic diagram showing a state of use of the electronic device of Fig. 9;

Hereinafter, the configuration, operation, and effect of an electronic device according to a preferred embodiment will be described with reference to the accompanying drawings. For reference, in the following drawings, each component is omitted or schematically illustrated for convenience and clarity, and the size of each component does not reflect the actual size. Also, the same reference numerals refer to the same components throughout the specification. and reference numerals for the same components in individual drawings will be omitted.

In general, since electronic device used for medical purposes is implanted inside the body through surgery, there is a disadvantage of being exposed to various side effects in the process of incision and recovery of the skin.

Accordingly, there is a need for a technology capable of reducing the volume of the electronic device in the implantation process so that the electronic device can be implanted through minimally invasive surgery in the process of incision of the skin and implanting the electronic device.

The electronic device 100 is formed to be rolled in a folding or roll shape in an environment of a relatively low temperature, and is manufactured to be unfolded or unfolded in an environment of a relatively high temperature similar to the temperature inside the body. It has the advantage that it can be transplanted inside the body through minimal skin incision.

In addition, the electronic device 100 applies a shape restoration material only to a position corresponding to a specific part, and the parts to which the electronic devices are attached are folded by shape transformation of the parts except for the parts to which the electronic devices are attached inside the body. There is an advantage in that damage to electronic elements due to shape deformation is prevented.

In the step of inserting the electronic device 100 into the body, the circular, relatively large-area device shape is transformed into a relatively small folded or rolled state and inserted into the body, and is relatively small in the step of operating inside the body. The deformed electronic device 100 is restored to its original shape by the temperature.

The electronic device 100 is biodegraded by a biological solution after a predetermined period of time in the body, and since the biodegradable electronic device 100 is non-toxic, there is an advantage that there is no side effect acting on the body.

The electronic device 100 is implanted inside the body to enable accurate measurement of bio-signals, maximizes the therapeutic effect through treatment or drug administration based on the measured bio-signals, and reduces side effects due to skin incision.

The electronic device 100 is divided into a region in which an electronic device is installed and a region deformed by temperature in order to prevent damage to the installed electronic devices, thereby preventing damage or failure of the electronic device due to deformation.

The electronic device 100 is made of a biodegradable polymer material that restores its shape by the temperature inside the body when it is inserted into the body, and the user uses the self-folding application of the partial shape restoration of the shape restoring polymer to use the electronic device ( 100) can be adjusted.

After the electronic device 100 is inserted into a target part inside the body, an anchor device connecting the body part and the electronic device 100 is formed to fix the position, and the electronic device is fixed inside the body through the anchor device. Since the device 100 is continuously exposed to body heat, the shape restoration speed of the electronic device 100 is improved.

A coating layer is formed on the surface of the electronic device 100 to prevent biodegradation of the electronic device 100 for a predetermined period set by a user, and the coating layer is made of a non-toxic material that is biodegradable by a biological solution.

When the electronic device 100 is placed inside the body for a predetermined time, the coating layer blocks the biodegradation of the electronic device 100 during the operating time of the electronic device 100 to prevent increase the period of use.

The electronic device 100 restores only the region to be deformed by partial stimulation (heat) in the shape restoration (shape memory) polymer to which tensile deformation has been previously applied for self-folding to induce contractile force to occur in the region to be restored. .

The electronic device 100 can adjust the degree of restoration of the shape through heat, can be folded through heat control to a desired degree, and can be transformed into a rolling shape as well as a folding shape by appropriately adjusting the partial heating time to restore the shape. This is possible.

Since the shape restoration function operates at a temperature similar to or lower than body temperature, the electronic device 100 is stored in an environment that is relatively lower than body temperature before being inserted into the body.

1 is a diagram showing a state of use of an electronic device according to an embodiment of the present disclosure. FIG. 2 is a perspective view and cross-sectional views of the electronic device of FIG. 1 . FIG. 3 shows experimental photos showing the operation of the deformable part of the electronic device of FIG. 1 . FIG. 4 shows experimental photos showing another use state of the electronic device of FIG. 1 .

1 to 4 , the electronic device 100 includes a deformable unit 200 , a buffer unit 300 , element units 400 , 410 , 420 , and an anchor unit 500 .

The electronic device 100 is manufactured in a sheet form as shown in No. 1 of FIG. 1 or a structure that is easy to implant in the body, and is stored in a low temperature state in a folded or rolled state before being implanted in the body.

When the electronic device 100 is inserted into the body in a folded or rolled state, and is fixed inside the body, it is unfolded or unfolded by body temperature and is stably attached to the inside of the body and the function of the electronic device 100 is activated. do.

The deformable part 200 is made of a biodegradable shape memory polymer material, can be made in a thin sheet form or can be manufactured in various forms for easy attachment to a specific body part, and the body temperature and temperature are the same in the folded or rolled state. When exposed to , it returns to its original state.

In addition, the deformable part 200 can be made of a material capable of restoring its shape by stimulation of any one of surface tension or light other than heat. Alternatively, if it is desired to artificially induce deformation of the deformable unit 200 at a desired time and location, the operator may directly irradiate the deformable unit 200 with light to deform the deformable unit 200 .

The buffer unit 300 is made of a biodegradable adhesive material in the form of a thin sheet, is attached to the surface of the deformable unit 200, and is coupled with any one of the device parts 400, 410, 420 to be described later to the device part ( Any one of 400 , 410 , and 420 is attached to the deformable part 200 .

Referring to FIG. 1 , the device unit 400 is made of a biodegradable metal material, a plurality of medical devices are connected to each other in a lattice form, and are coupled to the inside of the upper surface of the buffer unit 300 , for medical use. It is possible to insert the electrodes into the body in a folded state by the deformation of the deformable unit 200 and the electrodes connected between the elements.

Referring to FIG. 2 , the element part 410 is formed in the form of a square flat coil, is attached to the upper surface of the buffer part 300 , and is made of biodegradable metal, and when a predetermined time elapses inside the body, the deformable part 200 ) and is biodegradable together with the buffer unit 300 .

One end of the anchor unit 500 is coupled to one end of the lower portion of the deformable unit 200 , and the other end is sharply extended by a predetermined distance while being reduced toward the lower portion, and the electronic device 100 is inserted into the body. bound to a part of the site.

The electronic device 100, which is in close contact with the body part through the anchor part 500, receives the body temperature effectively, and the deformable part 200 is transformed into a circular sheet shape by the heat effectively transferred to the body part. is stably attached to the

When the deformable part 200 is in close contact with a body part while being restored to a sheet form, the function of the element part 410 is activated, and biosignals of various body parts can be measured through the element part 410 .

Referring to FIG. 3A , when heat generated from the heating wire 10 is applied to a part of the deformable part 200, a portion of the deformable part 200 in close contact with the hot wire 10 is deformed, and the hot wire ( A part of the deformable part 200 located on one side of 10) is folded.

Specifically, a portion of the deformable portion 200 in close contact with the hot wire 10 is subjected to tensile deformation before receiving the heat of the hot wire 10, and in the deformed state, the heat of the hot wire 10 is transformed into the deformable portion 200. When transmitted to, only the portion in contact with the heating wire 10 generates a contractile force in the shape restoration process.

Therefore, when the electronic device 100 receives heat as a whole from the inside of the body, the degree of deformation of the portion in which the contractile force is strengthened by the heating wire 10 is relatively improved compared to other portions that are not in contact with the heating wire 10, It is possible to control the shape restoration shape of the deformable part 200 by the heat of the heating wire 10 .

The deformable unit 200 has a characteristic of being deformed by heat as shown in the corresponding experimental photo, and may be manufactured to be deformed into an unfolded or flat sheet form when heat is applied depending on a form initially manufactured.

Referring to FIG. 3(b), the deformable part 200 may be manufactured in the form of a sheet elongated toward one side or the other side, and when heat is applied to the entire surface of the deformable part 200, the deformable part 200 is It may be manufactured to be rolled in a roll form.

Accordingly, since the electronic device 100 has a different shape to be restored when the contact area or part is changed according to the fixed body part, the deformable part 200 in which the element part 410 is in contact through the buffer part 300 . ), when only the other parts are brought into contact with the body part and fixed, only the remaining parts except for a part of the deformable part 200 corresponding to the contacted part of the element part 410 are deformed and unfolded, and the element part 410 is It unfolds and works without breakage.

In addition, when a portion of the deformable portion 200 is tensilely deformed and then the deformed portion is locally heated through the heating wire 10 , only the locally heated portion is deformed when the deformable portion 200 receives body heat from inside the body. Since the degree of deformation is relatively increased compared to the rest of the portion 200 that is not locally heated, the folding portion according to the restoration of the shape of the deformable portion 200 is controlled.

Referring to FIG. 4( a ), the element part 420 installed in the deformable part 200 is formed on the surface of the deformable part 200 made of a transparent material through integration technology, and the element part 420 is attached to the electrode. When connected, it works as a heating element that dissipates heat.

At a temperature lower than body temperature, the deformable unit 200 is maintained in a rolled-up shape like a roll, and when the temperature corresponding to the body temperature is transmitted, the deformable unit 200 is unfolded and restored to the sheet shape.

Referring to FIG. 4( b ), when electric power is supplied to the element unit 420 while the electrode is connected to the element unit 420 , the temperature around the element unit 420 increases from 29 degrees Celsius to 38 degrees Celsius after 30 seconds. rises

At this time, since the deformable part 200 is in a state restored to its original shape by the temperature, the heat emitted by the element part 420 is effectively transferred to the surroundings without being deformed by the heat of the element part 420 .

5 is a perspective view of the electronic device of FIG. 1 according to another embodiment;

As shown in FIG. 5 , each of the electronic device devices 120 and 140 has a different shape and arrangement of the device part, and the electronic device devices 120 and 140 are formed in a sheet form inside the body through control of the deformed portion. It can be controlled to unfold.

Specifically, the electronic device 120 includes a device unit 430 .

The element part 430 is formed in the form of a sheet extending long toward one side or the other side, and is coupled to the upper surface of the deformable part 200 in a state in which they are sequentially spaced apart in the extending direction of one side of the deformable part 200 .

Each of the element parts 430 is coupled to the upper portion of the deformable part 200 through the buffer part 300 to be parallel to each other, and a portion corresponding to each of the element parts 430 is pulled through the hot wire 10 . After being deformed, the deformation degree is strengthened compared to the portion corresponding to the deformable portion 200 to which the element portion 430 is in contact by being locally heated.

Before the electronic device 120 is inserted into the body, if the parts corresponding to each of the device parts 430 are physically folded at a temperature lower than body temperature, each of the front and rear parts of the deformable part 200 is formed. It is folded inward of the deformable part 200 .

When the electronic device 120, which is arbitrarily folded and reduced in volume at a temperature lower than body temperature, is implanted inside the body, a portion of the deformable part 200 corresponding to each of the device parts 430 is deformed by body temperature. Each of the front and rear portions of the deformable unit 200 is unfolded by the , and the deformable unit 200 is unfolded in the form of a sheet.

Referring to FIG. 5B , each of the element parts 440 is formed in a right-angled triangle shape, and the edge of each of the element parts 440 is deformed at the top of each of the corners of the rectangular deformable part 200 . It is coupled with the deformable part 200 to match the edge of the part 200 .

Each of the element parts 440 is coupled to the deformable part 200 , and each of the folding parts 442 of the deformable part 200 that is locally heated by the heating wire 10 is inside each of the element parts 440 . It is formed in a portion of the deformable portion 200 corresponding to an adjacent position.

Each of the folding parts 442 is connected to each other to form a diamond shape, and when each of the folding parts 442 is physically folded before the electronic device 140 is inserted into the body, each of the device parts 440 is The corner portions of the close-fitting deformable portion 200 move toward each other to form a quadrangular pyramid shape.

The electronic device 140 is inserted into the body in the form of a quadrangular pyramid, and when the folding parts 442 are unfolded by body temperature, the deformable part 200 is unfolded in the form of a rectangular sheet, and each of the element parts 440 is operated normally. .

6 is a flowchart illustrating a method of manufacturing the electronic device of FIG. 1 .

As shown in FIG. 6 , the method of manufacturing an electronic device includes a deformable part manufacturing step ( S100 ), a coating step ( S120 ), and a device attachment step ( S140 ).

In the deformable part manufacturing step (S100), a deformable part 200 corresponding to the surface of a sheet or a body part to be transplanted is manufactured using a shape memory polymer material, and a specific folding part is deformed through local heating through a heating wire 10 . By improving the degree, only a desired part is controlled to be folded by body temperature (S100).

In the coating step (S120), the buffer part 300 composed of an adhesive is coated on the surface of the deformable part 200, and the buffer part 300 is the deformable part ( 200) is coated on the surface (S120).

In the device attachment step (S140), by attaching any one of the device parts 400, 410, 420, 430, 440 composed of functional elements to the buffer unit 300, the device part 400, Any one of 410, 420, 430, and 440 is combined (S140).

At this time, when the folding portion 442 is formed in the deformable portion 200 by the heating wire 10 , any one of the device portions 400 , 410 , 420 , 430 , 440 is located on the portion other than the folding portion 442 . It is coupled to the corresponding buffer unit 300 (S140).

7 and 8 are a schematic diagram and a perspective view of an electronic device according to another embodiment.

Since the electronic device 140 according to the present embodiment is substantially the same as the electronic device 100 of FIG. 1 except for the device unit 450 , the same reference numerals and names are used, and repeated descriptions are omitted. .

As shown in FIG. 7 , the electronic device 140 includes an element part 450 , and the element part 450 includes a contact part 451 and a buffer member 452 .

The element part 450 is formed to surround the deformable part 200 in a state in which a portion of the element part 450 adjacent to the portion where the deformable part 200 is bent is separated from the deformable part 200 . The strain rate due to the deformation of the body is reduced and the durability is improved.

Specifically, the contact portions 451 are in close contact with the deformable portion 200 at a position adjacent to the buffer member 452, and the buffer member 452 is located directly above the portion where the deformable portion 200 is bent. is formed

One end of the buffer member 452 is formed in a semicircular frame shape, and the other end extends along the bent portion of the deformable portion 200 from one end to surround the bent portion of the deformable portion 200 in a semi-cylindrical shape.

The buffer member 452 may be formed in a bent semi-cylindrical or straight semi-cylindrical shape depending on the shape of the bent portion of the deformable portion 200, and a portion of the deformable portion 200 in close contact with the close contact 451 is formed. When unfolded, the buffer member 452 is deformed to maintain the adhesion between the contact portions 451 and the deformable portion 200 .

In a state in which the deformable part 200 is folded, the surface of the deformable part 200 and the contact part 451 and the buffer member 452 maintain a state in close contact with each other due to the expansion of the deformable part 200, and the deformable part ( When the 200 is unfolded by a predetermined angle, the inner surface of the buffer member 452 and the surface of the deformable part 200 are separated.

When the deformable portion 200 is unfolded in a planar shape, the buffer member 452 is deformed, the bent portion of the deformable portion 200 separated from the buffer member 452 is contracted, and the deformation close to the contact portion 451 is deformed. The unit 200 maintains a planar state.

Therefore, since the buffer member 452 provides a space in which the bent portion is expanded according to the folding of the deformable portion 200, the advantage of maintaining a stable adhesion state between the remaining contact portions 451 and the deformable portion 200 is advantageous. have.

As shown in FIG. 8 , the electronic device 160 includes a device unit 460 .

Since the electronic device 160 according to the present embodiment is substantially the same as the electronic device 100 of FIG. 1 except for the device unit 460, the same reference numerals and names are used, and repeated descriptions are omitted. .

The element part 460 is formed in an ultra-thin film structure having a relatively thin thickness compared to the element part 400 of FIG. 1 , and the deformation rate according to the deformation of the deformable part 200 is relatively reduced to stably the deformable part 200 . It maintains the bonding state and the durability is improved.

In addition, since the amount of material used for the element unit 460 is reduced, the manufacturing cost of the element unit 460 is reduced, and since the volume is relatively reduced compared to the element unit 400 of FIG. 1 , it can be placed inside the body. It has the advantage of being convenient for porting.

As shown in FIGS. 9 to 11, the thin-film electronic device devices 170, 171, 172, 173, and 174 overcome the deep insertion limit and minimize the acupuncture habit 182 for rapid regeneration of tissue incised for surgery. ) and injected into the body.

Specifically, as shown in FIG. 9 , the electronic device 170 includes element parts 610 , 611 , and 612 , a deformable part 810 , and an electrode 700 , and the deformable part 810 is a center It includes a member 811 , a connecting member 812 , an internal support member 813 , and a support member 814 .

The deformable part 810 is composed of extension members extending radially from the central axis of a circle and made of a flexible material and supporting members connecting the extension members, and the extension members are folded toward the lower part of the central axis. It is inserted into the minimal acupuncture habit 182 in the state.

The center material 811 is formed in a circular plate shape made of a shape memory polymer material, is manufactured to maintain a circular plate shape inside the body, and the element part 610 formed in a circular flat coil shape is coupled.

One end of the plurality of connecting members 812 is connected to the center material 811 so as to be radially disposed toward the outside of the center material 811 , and one end of the plurality of connecting members 812 is the lower portion of the center material 811 . It is connected to the outside of the center member 811 so as to be flexibly folded toward.

The support member 814 is formed in a circular ring shape connecting the other ends of the connecting members 812 , and the inner support member 813 is a connecting member 812 between the support member 814 and the center member 811 . It is formed in the form of a circular ring connecting them.

Each of the element parts 611 and 612 is attached to any one of a position where the connection members 812 and the internal support member 813 cross each other or a position where the connection member 812 and the support member 814 cross each other. can be

As shown in FIG. 10 , the electronic device 170 includes various types of electronic device ( 171, 172, 173, 174).

The electronic device 171 includes a deformable part 820 , and the deformable part 820 includes a central member 811 and connecting members 812 extending perpendicularly to both sides and front and rear of the central member 811 . and a circular support member 814 connecting the other ends of the connecting members 812 .

The electronic device 172 includes a deformable part 830 , and the deformable part 830 includes a central member 811 and a connecting member 812 connected to the central member 811 to be radially disposed from the central member 811 . ) and a circular support member 814 connecting the other ends of the connecting members 812.

The electronic device 173 includes a deformable part 840 , and the deformable part 840 includes a central member 811 and connecting members 812 extending perpendicularly to both sides and front and rear of the central member 811 . , A circular support member 814 connecting the other ends of the connecting members 812 and a circular inner support member 813 connecting the connecting members 812 between the support member 814 and the center member 811 are provided. do.

The electronic device 174 includes a deformable part 850 , and the deformable part 850 includes a central member 811 and connecting members 812 extending perpendicularly to both sides and front and rear of the central member 811 . and a support member 815 connecting the other ends of the connecting members 812 in a rectangular shape.

On the other hand, the anchor part 500 shown in FIG. 5 is attached to the lower portion of each of the deformable parts 810 , 820 , 830 , 840 and 850 of each of the electronic device devices 170 , 171 , 172 , 173 , 174 . can

As shown in FIG. 11 , a slider coupled to the push bar of the syringe 181 and sliding along the moving direction of the push bar is formed on the upper portion of the injection amount fine adjustment device 180 .

The tip of the syringe 181 is inserted into one end of the minimally invasive habit 182 and is coupled to the minimally invasive habit 182, and the other end of the minimally invasive habit 182 is vertically bent from one end to the lower end of the stage 184. It is placed with a solution harmless to the body inside of it.

The upper part of the other end of the minimal acupuncture habit 182 is fixed in position by the clamp 183, and when the push bar of the syringe 181 is moved in a direction spaced apart from the tip according to the driving of the injection amount fine adjustment device 180, the minimum A suction force is generated at the other end of the acupuncture habit 182 .

The electronic device 170, in which the connecting members 812 are arranged in an unfolded state on the stage 184 in which a liquid having a temperature similar to body temperature is injected, is inserted into the other end of the minimally invasive habit 182 by the suction force of the syringe 181 One end of the connecting members 812 is folded downward.

In the electronic device 170 sucked into the minimally invasive habit 182, the central member 811 is firstly inserted into the minimally invasive habit 182 together with the solution by the suction force, and secondly the internal support member 813. is inserted, and the third support member 814 is inserted.

One end of the connecting member 812 inserted into the minimally invasive habit 182 is bent downward so that each of the center member 811, the inner support member 813 and the support member 814 is a center member 811 , the inner support member 813 and the support member 814 are arranged toward the bottom in that order.

When the electronic device 170 inserted into the other end of the minimally invasive habit 182 moves into the body with a solution harmless to the body in a state where the other end of the minimally invasive habit 182 penetrates the skin and is inserted into the body. , one end of the connecting members 812 is spread by body temperature.

Therefore, the electronic device 170 is inserted into the minimal acupuncture habit 182 in a folded state, and when it is introduced into the body by the minimal acupuncture habit 182 in a state in which the skin of the body is minimally incised, it is caused by body temperature. As it unfolds, the recovery of the surgical site is improved and side effects are prevented.

On the other hand, when the electronic device 170 is discharged from the minimally invasive habit 182 and injected into the body, the electronic device 170 is stably attached to a target position inside the body of the electronic device 170 . It is preferable to improve the hydrophilicity by coating the surface of SiO _{2 with a thickness of 50 nm or under plasma treatment.}

On the other hand, since the electronic device 170 performs surface modification for attachment to the injection target surface of the device section 610 by coating or plasma processing a hydrophilic thin film (SiO2) on the device section 610, By increasing the bonding affinity between the surface and the solution, the rate of immersion into the bottom of the injected solution is increased.

In addition, the deformable parts (810, 820, 830, 840, 850) can be made of a material that can restore shape by stimulation of any one of surface tension or light in addition to heat, for example, attached to the skin or internal organs. If it is deformed by the changed surface tension, or if it is desired to artificially induce deformation of the deformable part 200 at a desired time and location, the operator directly irradiates light to the deformable part 200 to deform the deformable part 200. can

Although the preferred embodiment of the present invention has been described with reference to the accompanying drawings, the embodiments described in the present specification and the configuration shown in the drawings are only the most preferred embodiment of the present invention and represent all of the technical spirit of the present invention. Therefore, it should be understood that there may be various equivalents and modifications that can be substituted for them at the time of filing the present application. Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the following claims rather than the detailed description, and the meaning and scope of the claims and their All changes or modifications derived from the concept of equivalents should be construed as being included in the scope of the present invention.

100, 120, 140, 160, 170, 171, 172, 173, 174: electronic device
200, 810, 820, 830, 840, 850: deformation part
300: buffer
400, 410, 420, 430, 440, 450, 460, 610: element part
500: anchor unit

Claims (14)

a deformable part made of a shape memory material that is formed to be restored according to temperature; and
and an element unit having electronic elements and attached to the deformable unit;
The electronic device, characterized in that the deformable portion unfolds when exposed to a temperature higher than body temperature in a folded or rolled state.
According to claim 1, wherein the deformable portion,
An electronic device comprising a central member disposed in the center, connecting members connected to be radially disposed outside the central member, and a support member formed to connect the connecting members.
According to claim 2, wherein the support member,
An electronic device, characterized in that formed in a circular or polygonal shape.
According to claim 2, wherein the element unit,
An electronic device, characterized in that formed at a position where any one of the central member or the supporting member and the connecting member cross each other.
According to claim 2, wherein the deformable portion,
The electronic device device according to claim 1, further comprising an internal support member formed to connect the connecting members between the support member and the central member.
According to claim 1, wherein the element unit,
Formed in a rectangular shape, the electronic device characterized in that the element portion coupled to the deformable portion at a position spaced apart by a predetermined distance to one side is additionally attached.
According to claim 1, wherein the element unit,
An electronic device characterized in that it is formed in a triangular shape and coupled to an upper surface of a corner of the deformable part formed in a quadrangular shape.
According to claim 1, wherein the element unit,
An electronic device comprising: contact parts in close contact with the deformable part formed in a plate shape; and a semi-cylindrical buffer member protruding in a direction spaced apart from the deformable part between the contact parts.
In the manufacturing method of manufacturing an electronic device including a deformable part and an element part attached to the deformable part,
A deformable part manufacturing step of manufacturing the deformable part with a shape memory polymer material that unfolds when exposed to a temperature higher than body temperature in a folded or rolled state; and
and an element attachment step of attaching the element part to the deformable part.
10. The method of claim 9, wherein the deformable portion,
A method of manufacturing an electronic device device comprising: a central member disposed in the center; connecting members radially disposed outside the central member; and a support member formed to connect the connecting members.
11. The method of claim 10, wherein the element unit,
A manufacturing method of manufacturing an electronic device device, characterized in that formed at a position where any one of the central member or the supporting member and the connecting member cross each other.
10. The method of claim 9, wherein the device attachment step,
A manufacturing method for manufacturing an electronic device, characterized in that by laser cutting the deformable portion, and depositing an electrode layer, a dielectric layer, a connecting electrode, and an LED in order.
10. The method of claim 9, wherein the element unit,
A method of manufacturing an electronic device, characterized in that the element part is formed in a rectangular shape and is further attached to one side of the element part coupled to the deformable part at a position spaced apart by a predetermined distance.
10. The method of claim 9, wherein the element unit,
A manufacturing method for manufacturing an electronic device, characterized in that the electronic device is formed by stacking one or more layers.

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