KR102535611B1 - Electronic device and a method fabricating the same - Google Patents

Abstract

Disclosed in the present specification is the provision of an electronic element device whose volume is reduced through a shape change in the process of being implanted into the body and whose shape is automatically restored inside the body.
According to one embodiment of the disclosure disclosed in the present specification, an electronic device device includes a deformable part and electronic elements made of a shape memory material that is formed to be restored according to temperature, and includes an element part attached to the deformable part, The deformable part unfolds when exposed to a temperature above body temperature in a folded or rolled state.

Description

Electronic element device and manufacturing method for manufacturing it {ELECTRONIC DEVICE AND A METHOD FABRICATING THE SAME}

The content disclosed herein relates to an electronic device and a method for manufacturing the same, and relates to an electronic device used for medical purposes and a manufacturing method for manufacturing the same.

Unless otherwise indicated herein, material described in this section is not prior art to the claims in this application, and it is not admitted that the material described in this section is prior art.

In general, since electronic device devices used for medical purposes are implanted inside the body through surgery, they are exposed to various side effects in the process of incising and recovering the skin.

Therefore, there is a need for a technique capable of reducing the volume of the electronic device during the implantation process so that the electronic device can be transplanted through minimally invasive surgery in the process of incising the skin and implanting the electronic device.

In this regard, Korean Patent Registration No. 10-1864033 discloses an invasive bioelectronic device, and Korean Patent Registration No. 10-1744395 discloses a method for manufacturing a transparent substrate for a biodegradable flexible electronic device containing starch. are doing

However, the existing inventions do not disclose a technique capable of minimizing body incision by reducing the volume through shape deformation during the transplantation process.

It is an object of the present invention to provide an electronic element device whose volume is reduced through a shape change in the process of being implanted into the body and whose shape is automatically restored inside the body.

In addition, it is not limited to the technical problems as described above, and it is obvious that other technical problems may be derived from the following description.

According to one embodiment of the disclosed subject matter, an electronic element device includes a deformable part and electronic elements made of a shape memory material that is formed to be restored according to temperature, and includes an element part attached to the deformable part, and the deformable part is folded. Or, when exposed to temperatures above body temperature in a curled state, it unfolds.

In addition, the electronic device may further include a buffer formed between the deformable part and the element part to adhere the deformable part and the element part to each other.

In addition, the deformable part may include a folding part formed to be deformed according to temperature change and an unfolding part formed to maintain the shape according to temperature change.

Also, the element unit may be formed in the unfolding unit.

In addition, the electronic device may further include an anchor part having one end coupled to the deformable part and the other end extending sharply while contracting.

In addition, the electronic device may further include a coating portion made of a biodegradable material and coated on surfaces of the element portion and the deformable portion.

In addition, the electronic device manufacturing method includes a deformable part fabrication step of manufacturing a deformable part using a shape memory polymer material, a coating step of coating a buffer part composed of an adhesive on the surface of the deformable part, and attaching an element part composed of a functional element to the buffer part. It may include a device attachment step to.

In the coating step, the buffer unit may be coated on the deformable unit in a semi-cured or fully cured state.

In addition, in the element attaching step, the element part may be transplanted to the buffer part in a state in which the deformable part is completely cured.

In addition, the deformable part may include a central member disposed in the center, connecting members disposed radially outside the central member, and support members configured to connect the connecting members.

In addition, the support member may be formed in a circular or polygonal shape.

In addition, the element unit may be formed at a position where any one of the center member or the support member and the connection member cross each other.

In addition, the deformable part may further include an internal support member formed to connect the connection members between the support member and the center member.

In addition, the element part may be formed in a rectangular shape, and an element part coupled to the deformable part may be additionally attached at a position spaced apart from one side by a predetermined distance.

In addition, the element part may be formed in a triangular shape and coupled to an upper corner surface of the deformable part.

In addition, the element part may include close contact parts formed in a plate shape and in close contact with the deformable part, and a semi-cylindrical buffer member protruding in a direction spaced apart from the deformable part between the close contact parts.

In addition, a manufacturing method for manufacturing an electronic device including a deformable portion that expands when exposed to a temperature higher than body temperature in a folded or rolled state and an element portion attached to the deformed portion is to manufacture a deformable portion made of a shape memory polymer material. and an element attaching step of attaching the element part to the deformation part.

In addition, the deformable part may include a central member disposed in the center, connecting members disposed radially outside the central member, and support members configured to connect the connecting members.

In addition, the element unit may be formed at a position where any one of the center member or the support member and the connection member cross each other.

In addition, in the device attaching step, the deformed portion may be laser-cut, and an electrode layer, a dielectric layer, a connection electrode, and an LED may be sequentially deposited.

In addition, the element part may be formed in a rectangular shape, and an element part coupled to the deformable part may be additionally attached at a position spaced apart from one side by a predetermined distance.

Also, the device unit may be an electronic device formed by stacking one or more layers.

According to one embodiment disclosed in the present specification, the electronic element device is formed to be folded or rolled in a relatively low temperature environment, and is unfolded in a relatively high temperature environment similar to the temperature inside the body ( It has the advantage of being able to be implanted inside the body through minimal skin incisions because it is designed to be unfolded or unfolded.

In addition, the electronic device device applies a shape-restoring material only to a specific part, and the parts to which the electronic elements are attached are folded by the shape deformation of the parts except for the parts to which the electronic elements are attached inside the body, thereby reducing the shape deformation. There is an advantage in preventing damage to electronic devices by the.

In addition, the electronic element device is formed in the form of a mesh, and the connecting member radially connected to the center member located in the center is bent toward the bottom and can be deformed so that it is folded vertically, so that it can be conveniently inserted into the minimally invasive tube.

In addition, since the effects of the present invention described as described above are naturally exhibited by the configuration of the described contents regardless of whether the inventor recognizes them, the above-described effects are only a few effects according to the described contents, and all the effects that the inventor grasps or realizes should not be accepted as written.

In addition, the effect of the present invention should be additionally grasped by the overall description of the specification, and even if it is not described in an explicit sentence, those skilled in the art to which the described contents belong will have such an effect through this specification. If the effect can be recognized as such, it should be regarded as the effect described in this specification.

1 is state diagrams of an electronic element device according to an embodiment of the present specification;
2 is a perspective view and a cross-sectional view of the electronic device of FIG. 1;
FIG. 3 is experimental photographs showing the operation of the deformable part of the electronic device of FIG. 1;
FIG. 4 is experimental photographs showing another state of use of the electronic device of FIG. 1;
5 is perspective views of the electronic device of FIG. 1 according to another embodiment;
6 is a flowchart illustrating a manufacturing method of the electronic device of FIG. 1;
7 and 8 are schematic and perspective views of an electronic device according to another embodiment.
9 and 10 are plan views of the electronic device of FIG. 1 according to another embodiment;
11 is a schematic diagram showing a state of use of the electronic element device of FIG. 9;

Hereinafter, with reference to the accompanying drawings, look at the configuration, operation and effect of the electronic device according to the preferred embodiment. For reference, in the following drawings, each component is omitted or schematically illustrated for convenience and clarity, the size of each component does not reflect the actual size, and the same reference numerals refer to the same components throughout the specification. , and reference numerals for the same components in the individual drawings will be omitted.

In general, since electronic device devices used for medical purposes are implanted inside the body through surgery, they are exposed to various side effects in the process of incising and recovering the skin.

Therefore, there is a need for a technique capable of reducing the volume of the electronic device during the implantation process so that the electronic device can be transplanted through minimally invasive surgery in the process of incising the skin and implanting the electronic device.

The electronic device 100 is formed to be folded or rolled in a relatively low temperature environment, and is manufactured to be unfolded or unfolded in a relatively high temperature environment similar to the temperature inside the body. It has the advantage of being able to be transplanted inside the body through minimal skin incision.

In addition, the electronic device device 100 applies a shape restoration material only to a specific part, and the parts to which the electronic elements are attached are folded by the deformation of the shape of the parts except for the parts to which the electronic elements are attached inside the body. There is an advantage in that damage to electronic elements due to shape deformation is prevented.

In the step of inserting the electronic element device 100 into the body, the circular, relatively face-to-face element shape is deformed into a relatively small folded or rolled state and inserted into the body, and in the step of operating inside the body, the electronic element device 100 is relatively small. The deformed electronic device 100 is restored to its original shape by temperature.

The electronic device 100 is biodegraded by a biological solution after a predetermined period of time inside the body, and since the biodegraded electronic device 100 is non-toxic, there is no side effect acting on the body.

The electronic device 100 has the advantage of being implanted inside the body to accurately measure bio-signals, maximizing treatment effects through medical treatment or drug administration based on the measured bio-signals, and reducing side effects due to skin incision.

The electronic device 100 is divided into a region where the electronic elements are installed and a region that is deformed by temperature to prevent damage to the electronic elements to be installed, thereby preventing damage or failure of the electronic elements due to deformation.

The electronic device 100 is made of a biodegradable polymer material that restores its shape by the temperature inside the body when inserted into the body, and the user uses self-folding that applies partial shape restoration of the shape-recovery polymer to the electronic device ( 100) can be adjusted.

After the electronic element device 100 is inserted into a target part inside the body, an anchor device connecting the body part and the electronic element device 100 is formed to fix the position, and the electronic element fixed inside the body through the anchor device Since the device 100 is continuously exposed to body heat, the speed of restoring the shape of the electronic device 100 is improved.

A coating layer is formed on the surface of the electronic device 100 to prevent the electronic device 100 from being biodegraded for a predetermined period of time set by a user, and the coating layer is made of a non-toxic material that is biodegradable by a biological solution.

When the electronic device 100 is placed inside the body for a predetermined period of time, the coating layer blocks the biodegradation of the electronic device 100 during the operating time of the electronic device 100, thereby improving the quality of the electronic device 100. increase the period of use.

The electronic device 100 restores the shape of only the region to be deformed with partial stimulation (heat) in the shape-restoring (shape-memory) polymer to which tensile strain has been applied in advance for self-folding, and induces the generation of contraction force in the restored region .

The electronic device 100 can control the degree of restoration of its shape through heat, can be folded through heat control to a desired degree, and is transformed into a rolling form as well as a folding form by restoring its form by appropriately adjusting the partial heating time. this is possible

Since the shape restoration function of the electronic device 100 operates at a temperature similar to or lower than body temperature, it is stored in an environment lower than body temperature before being inserted into the body.

1 shows usage state diagrams of an electronic element device according to an embodiment of the present specification. FIG. 2 shows a perspective view and cross-sectional views of the electronic device of FIG. 1 . FIG. 3 shows experimental photos showing the operation of the deformable part of the electronic device of FIG. 1 . FIG. 4 shows experimental photographs showing other use states of the electronic device of FIG. 1 .

As shown in FIGS. 1 to 4 , the electronic device 100 includes a deformation unit 200 , a buffer unit 300 , element units 400 , 410 , and 420 and an anchor unit 500 .

The electronic device 100 is manufactured in the form of a sheet as shown in No. 1 in FIG. 1 or in a structure that can be easily implanted into the body, and is stored in a low temperature state in a folded or rolled state before being implanted into the body.

The electronic device 100 is inserted into the body in a folded or rolled state, and when fixed inside the body, it is stably attached to the body while being unfolded or unfolded by body temperature, and the function of the electronic device 100 is activated. do.

The deformable part 200 is made of a biodegradable shape-memory polymer material, can be made in the form of a thin sheet or can be made in various shapes so as to be easily attached to a specific body part, and in an environment where the body temperature and temperature are the same in a folded or rolled state. When exposed to it, it returns to its original state.

In addition, the deformable part 200 can be made of a material capable of restoring its shape by stimulation of either surface tension or light in addition to heat. Alternatively, when artificially inducing deformation of the deformable portion 200 at a desired time and position, an operator may directly irradiate light to the deformable portion 200 to deform the deformable portion 200 .

The buffer unit 300 is made of a biodegradable adhesive material in the form of a thin sheet, is attached to the surface of the deformable unit 200, and is coupled to any one of the element units 400, 410, and 420 to be described later, so that the element unit ( Any one of 400, 410 and 420 is attached to the deformable part 200.

Referring to FIG. 1, the element unit 400 is made of a biodegradable metal material, is formed in a form in which a plurality of medical elements are connected to each other in a lattice shape, is coupled to the inside of the upper surface of the buffer unit 300, and is used for medical purposes. It can be inserted into the body in a folded state by the electrodes connected between the elements and the deformation of the deformable unit 200 .

Referring to FIG. 2 , the element unit 410 is formed in the form of a square flat coil, attached to the upper surface of the buffer unit 300, and manufactured through a biodegradable metal, and after a predetermined time passes inside the body, the deformable unit 200 ) and is biodegradable together with the buffer 300.

One end of the anchor unit 500 is coupled to the lower end of the deformable unit 200, and the other end contracts downward and extends sharply by a predetermined distance. It is combined with part of the site.

The electronic device device 100 in close contact with the body part through the anchor part 500 effectively receives body temperature, and the deformable part 200 is deformed into a circular sheet form by the heat effectively received, and the body part adheres stably to

When the deformation unit 200 is restored to a sheet form and adheres to a body part, the function of the element unit 410 is activated, and bio signals of various body parts can be measured through the element unit 410 .

Referring to FIG. 3(a), when heat generated by the hot wire 10 is applied to a portion of the deformable portion 200, the portion of the deformable portion 200 in close contact with the hot wire 10 causes deformation, and the heat wire ( A part of the deformable part 200 located on one side of 10) is folded.

Specifically, a tensile strain is applied to a portion of the deformable portion 200 in close contact with the hot wire 10 before receiving the heat of the hot wire 10, and in the deformed state, the heat of the hot wire 10 is applied to the deformed portion 200 When transmitted to the hot wire 10, contraction force is generated in the process of restoring the shape only to the part in contact.

Therefore, when the electronic element device 100 receives heat as a whole from inside the body, the degree of deformation of the part where the contraction force is enhanced by the hot wire 10 is relatively improved compared to other parts not in contact with the hot wire 10. The shape restoration shape of the deformable part 200 by the heat of the hot wire 10 can be controlled.

The deformable part 200 has a characteristic of being deformed by heat, as shown in the corresponding experimental photograph, and may be manufactured to be deformed into a flat sheet shape or unfolded when heat is applied according to the shape to be initially manufactured.

Referring to FIG. 3(b), the deformable portion 200 may be manufactured in the form of a sheet elongated toward one side or the other side, and when heat is applied to the entire surface of the deformable portion 200, the deformable portion 200 It can be made to be rolled in a roll form.

Therefore, since the restored form of the electronic device 100 changes when the contact area or area is changed according to the fixed body part, the deformable part 200 that the element part 410 comes into contact with through the buffer part 300 ) When only parts other than a part of ) are brought into contact with a body part and fixed, only the remaining part except for a part of the deformable part 200 corresponding to the part in contact with the element part 410 is deformed and unfolded, and the element part 410 It unfolds without breakage and works.

In addition, when a part of the deformable part 200 is subjected to tensile strain and then locally heated through the hot wire 10, only the locally heated part is deformed when the deformable part 200 receives heat from body temperature inside the body. Since the degree of deformation is relatively increased compared to the rest of the portion 200 that is not locally heated, the folding portion according to the shape restoration of the deformable portion 200 is controlled.

Referring to FIG. 4(a), an element unit 420 installed on the deformable unit 200 is formed on the surface of the deformable unit 200 made of a transparent material through an integration technology, and the element unit 420 is attached to an electrode. When connected, it works as a heating element that dissipates heat.

The deformation unit 200 is maintained in a roll-like form at a temperature lower than the body temperature, and is restored to a sheet form while unfolding when a temperature corresponding to the body temperature is received.

Referring to FIG. 4(b) , when power is supplied to the element unit 420 while the electrode is connected to the element unit 420, the temperature around the element unit 420 rises from 29 degrees Celsius to 38 degrees Celsius after 30 seconds. rise

At this time, since the deformable unit 200 is restored to its original shape by temperature, it effectively transfers the heat emitted by the element unit 420 to the surroundings without being deformed by the heat of the element unit 420 .

FIG. 5 illustrates perspective views of the electronic device of FIG. 1 according to another embodiment.

As shown in FIG. 5, each of the electronic device devices 120 and 140 has a different shape and arrangement of the device part, and the electronic device devices 120 and 140 are formed in a sheet form inside the body through control of the deformed part. It can be controlled to unfold.

Specifically, the electronic element device 120 includes the element unit 430 .

The element unit 430 is formed in a sheet shape elongated toward one side or the other side, and coupled to the upper surface of the deformable unit 200 while being spaced apart in order along the extension direction of one side of the deformable unit 200 .

Each of the element parts 430 is coupled to the upper portion of the deformable part 200 through the buffer part 300 so as to be parallel to each other, and the portion corresponding to each of the element parts 430 is tensioned through the hot wire 10. After being deformed, it is locally heated so that the degree of deformation is stronger than that of the portion corresponding to the deformable portion 200 to which the element portion 430 is in contact.

Before the electronic device 120 is inserted into the body, by physically folding the corresponding parts between each of the element parts 430 at a temperature lower than the body temperature, each of the front and rear parts of the deformable part 200 is formed. It is folded to the inside of the deformable part 200 .

When the electronic device 120, which is arbitrarily folded at a temperature lower than body temperature and reduced in volume, is implanted inside the body, a portion of the deformable portion 200 corresponding to each of the element portions 430 is deformed by body temperature. As a result, each of the front and rear parts of the deformable part 200 is unfolded, and the deformable part 200 is unfolded in a sheet form.

Referring to FIG. 5( b ), each of the element parts 440 is formed in a right triangle shape, and the edge of each of the element parts 440 is deformed at the top of each corner of the rectangular shape deformable part 200 . It is combined with the deformable part 200 to match the rim of the part 200.

Each of the element parts 440 is coupled to the deformable part 200, and each of the folding parts 442 of the deformable part 200 locally heated by the hot wire 10 is inside each of the element parts 440. It is formed on a part of the deformable part 200 corresponding to the adjacent position.

Each of the folding parts 442 is connected to each other to form a diamond shape, and when each of the folding parts 442 is physically folded before the electronic device 140 is inserted into the body, each of the element parts 440 Corner portions of the deformable portion 200 that are in close contact with each other move toward each other to form a quadrangular pyramid shape.

The electronic element device 140 is inserted into the body in the form of a quadrangular pyramid, and when the folding parts 442 are unfolded by body temperature, the deformable part 200 is unfolded in the form of a rectangular sheet, and each of the element parts 440 is normally operated. .

FIG. 6 is a flowchart illustrating a manufacturing method of the electronic device of FIG. 1 .

As shown in FIG. 6 , the method of manufacturing an electronic device includes a deformable part manufacturing step (S100), a coating step (S120), and an element attachment step (S140).

In the deformable part manufacturing step (S100), a deformable part 200 corresponding to the surface of a sheet or a body part to be transplanted is manufactured using a shape memory polymer material, and a specific folding part is deformed through local heating through a hot wire 10. By improving the degree, only the desired part is controlled to be folded by body temperature (S100).

In the coating step (S120), the surface of the deformable portion 200 is coated with the buffer portion 300 composed of an adhesive, and the buffer portion 300 is the deformable portion 200 in a semi-cured or fully cured state ( 200) is coated on the surface (S120).

In the element attachment step (S140), any one of the element parts 400, 410, 420, 430, 440 composed of functional elements is attached to the buffer part 300, and the element part 400, 410, 420, 430, 440) are combined (S140).

At this time, when the folding portion 442 is formed in the deformable portion 200 by the hot wire 10, any one of the element parts 400, 410, 420, 430, and 440 is at the portion except for the folding portion 442. It is coupled to the corresponding buffer unit 300 (S140).

7 and 8 show schematic and perspective views of an electronic device according to another embodiment.

Since the electronic element device 140 according to the present embodiment is substantially the same as the electronic element device 100 of FIG. 1 except for the element unit 450, the same reference numbers and names are used and redundant descriptions will be omitted. .

As shown in FIG. 7 , the electronic element device 140 includes an element unit 450 , and the element unit 450 includes a contact portion 451 and a buffer member 452 .

The element part 450 is formed so that a part of the element part 450 adjacent to the part where the deformable part 200 is bent is separated from the deformable part 200 and surrounds the deformable part 200, so that the deformable part 200 The strain according to the deformation of the is reduced and the durability is improved.

Specifically, the close contact parts 451 are in close contact with the deformable part 200 at positions adjacent to the buffer member 452, and the buffer member 452 is located at a position directly above the portion where the deformable part 200 is bent. is formed

One end of the buffer member 452 is formed in a semicircular frame shape, and the other end extends from one end along the bent portion of the deformable portion 200 to surround the bent portion of the deformable portion 200 in a semi-cylindrical shape.

The buffer member 452 may be formed in a bent semi-cylindrical shape or a straight semi-cylindrical shape according to the shape of the bent portion of the deformable portion 200, and a portion of the deformable portion 200 in close contact with the contact portion 451 may be formed. When unfolded, the shock absorbing member 452 is deformed to maintain adhesion between the contact parts 451 and the deformable part 200 .

In a state where the deformable portion 200 is folded, the surface of the deformable portion 200, the contact portion 451, and the buffer member 452 maintain close contact with each other due to the expansion of the deformable portion 200, and the deformable portion ( 200 is unfolded by a predetermined angle, the inner surface of the buffer member 452 and the surface of the deformable portion 200 are separated.

When the deformable part 200 is unfolded in a plane shape, the buffer member 452 is deformed, the bent portion of the deformable part 200 separated from the buffer member 452 is contracted, and the deformable part 451 is in close contact with the deformable part 200. Part 200 maintains a planar state.

Therefore, since the buffer member 452 provides a space in which the bent portion expands according to the folding of the deformable portion 200, it has the advantage of maintaining a stable contact state between the remaining close contact portions 451 and the deformable portion 200. there is.

As shown in FIG. 8 , the electronic device 160 includes an element unit 460 .

Since the electronic element device 160 according to the present embodiment is substantially the same as the electronic element device 100 of FIG. 1 except for the element unit 460, the same reference numbers and names are used and redundant descriptions will be omitted. .

The element unit 460 is formed of an ultra-thin film structure with a relatively thin thickness compared to the element unit 400 of FIG. It maintains the bonded state and improves durability.

In addition, since the amount of material used for the device unit 460 is reduced, the manufacturing cost is reduced, and the device unit 460 has a relatively reduced volume compared to the device unit 400 of FIG. It has the advantage of convenient portability.

As shown in FIGS. 9 to 11, the thin-film type electronic device devices 170, 171, 172, 173, and 174 overcome the limitations of deep insertion and rapidly regenerate tissues cut for surgery through a minimally invasive tube (182). ) and injected into the body.

Specifically, as shown in FIG. 9 , the electronic device 170 includes element parts 610, 611, and 612, a deformable part 810, and an electrode 700, and the deformable part 810 is the center. It includes a member 811, a connecting member 812, an internal support member 813 and a support member 814.

The deformable part 810 is composed of extension members that extend radially from the circular central axis and are made of a flexible material and support members connecting the extension members, and the extension members are folded toward the lower portion of the central axis. It is inserted into the minimally invasive tube 182 in this state.

The central member 811 is formed in the shape of a circular plate made of a shape memory polymer material, is manufactured to maintain the circular plate shape even inside the body, and is coupled with the element unit 610 formed in the shape of a circular flat coil.

One end of the plurality of connecting members 812 is connected to the central member 811 so as to be radially disposed toward the outside of the central member 811, and one end of the plurality of connecting members 812 is connected to the lower portion of the central member 811. It is connected to the outside of the center member 811 so that it can be flexibly folded toward the center member 811 .

The supporting member 814 is formed in a circular ring shape connecting the other ends of the connecting members 812, and the internal supporting member 813 is connected between the supporting member 814 and the center member 811 by connecting the connecting member 812. It is formed in the form of a circular ring connecting them.

Each of the element parts 611 and 612 is attached to either a position where the connecting members 812 and the internal supporting member 813 cross each other or a position where the connecting member 812 and the supporting member 814 cross each other. It can be.

As shown in FIG. 10, the electronic element device 170 has various types of electronic element devices according to the number of connecting members 812, whether or not the internal support member 813 is attached, or the shape of the support member 814 is changed ( 171, 172, 173, 174).

The electronic element device 171 includes a deformable portion 820, and the deformable portion 820 includes a center member 811, both sides of the center member 811, and connecting members 812 extending perpendicularly to each other toward the front and rear. and a circular support member 814 connecting the other ends of the connecting members 812 .

The electronic element device 172 includes a deformable portion 830, and the deformable portion 830 includes a central member 811 and a connecting member 812 connected to the central member 811 so as to be radially disposed from the central member 811. ) and a circular support member 814 connecting the other ends of the connecting members 812.

The electronic element device 173 includes a deformable portion 840, and the deformable portion 840 includes a center member 811, both sides of the center member 811, and connecting members 812 extending perpendicularly to each other toward the front and rear. , A circular support member 814 connecting the other ends of the connecting members 812 and a circular internal support member 813 connecting the connecting members 812 between the support member 814 and the center member 811 do.

The electronic element device 174 includes a deformable portion 850, and the deformable portion 850 includes a central member 811, both sides of the central member 811, and connecting members 812 extending perpendicularly to each other toward the front and rear. and a support member 815 connecting the other ends of the connecting members 812 in a rectangular shape.

On the other hand, the anchor part 500 shown in FIG. 5 is attached to the bottom of each of the deformable parts 810, 820, 830, 840, and 850 of the electronic device 170, 171, 172, 173, and 174. can

As shown in FIG. 11, a slider coupled to the push rod of the syringe 181 and sliding along the moving direction of the push rod is formed on the top of the device for finely adjusting the injection amount 180.

The tip of the syringe 181 is inserted into one end of the minimally invasive tube 182 and coupled with the minimally invasive tube 182, and the other end of the minimally invasive tube 182 is bent vertically downward at one end to form a stage 184. It is placed inside the body with a solution harmless to the body.

The upper part of the other end of the minimally invasive tube 182 is fixed in position by the clamp 183, and when the push rod of the syringe 181 is moved in a direction away from the tip according to the operation of the injection amount fine adjustment device 180, A suction force is generated at the other end of the invasion tube 182 .

The electronic element device 170, on which the connection members 812 are placed in an unfolded state on the stage 184 into which liquid at a temperature similar to body temperature is injected, is inserted into the other end of the minimally invasive tube 182 by the suction force of the syringe 181. As one end of the connection member 812 is folded toward the bottom.

In the electronic device 170 that is sucked into the minimally invasive tube 182, the center member 811 is firstly inserted into the minimally invasive tube 182 along with the solution by the suction force, and secondarily the internal support member 813 is inserted, and a third support member 814 is inserted.

One end of the connection members 812 inserted into the minimally invasive tube 182 is bent downward so that the center member 811, the internal support member 813, and the support member 814 are each connected to the center member 811. , The internal support member 813 and the support member 814 are disposed toward the bottom in order.

When the electronic device device 170 inserted into the other end of the minimally invasive tube 182 passes through the skin and is inserted into the body, the electronic device 170 moves into the body together with a solution harmless to the body. , One end of the connecting members 812 is spread by body temperature.

Therefore, the electronic device 170 is inserted into the minimally invasive tube 182 in a folded state, and when introduced into the body by the minimally invasive tube 182 in a state where the skin of the body is minimally incised, the electronic device 170 is warmed by body temperature. As it unfolds, the recovery of the surgical site is improved and side effects are prevented.

Meanwhile, when the electronic device 170 is discharged from the minimally invasive tube 182 and injected into the body, the electronic device 170 is used to stably attach the electronic device 170 to a target position inside the body. It is preferable to improve hydrophilicity by coating or plasma-treating 50 nm thick SiO ₂ on the surface.

On the other hand, the electronic device 170 coats the device unit 610 with a hydrophilic thin film (SiO2) or plasma-treats the device unit 610 to carry out surface modification for attachment to the injection target surface, so that the device unit 610 By increasing the binding affinity between the surface and the solution, the immersion rate to the lower part of the injected solution is increased.

In addition, the deformable parts 810, 820, 830, 840, and 850 can be made of a material capable of restoring their shape by stimulation of either surface tension or light in addition to heat. For example, they can be attached to the skin or internal organs of the body. When it is deformed by the changed surface tension, or to induce deformation of the deformable part 200 artificially at a desired time and position, the operator directly irradiates light to the deformable part 200 to deform the deformable part 200. can

Although preferred embodiments of the present invention have been described with reference to the accompanying drawings, the embodiments described in this specification and the configurations shown in the drawings are only the most preferred embodiments of the present invention and represent all the technical ideas of the present invention. Since it is not, it should be understood that there may be various equivalents and modifications that can replace them at the time of this application. Therefore, the embodiments described above should be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the claims to be described later rather than the detailed description, and the meaning and scope of the claims and their All changes or modified forms derived from equivalent concepts should be construed as being included in the scope of the present invention.

100, 120, 140, 160, 170, 171, 172, 173, 174: electronic element device
200, 810, 820, 830, 840, 850: deformation part
300: buffer part
400, 410, 420, 430, 440, 450, 460, 610: element part
500: anchor part

Claims (14)

A deformable part made of a shape memory material that is formed to be restored according to temperature; and
An element unit having electronic elements and attached to the deformation unit;
The deformable portion unfolds when exposed to a temperature higher than body temperature in a folded or rolled state,
The transforming part,
An electronic element device comprising a center member disposed at the center, connecting members radially disposed outside the center member, and a support member formed to connect the connecting members.
delete A deformable part made of a shape memory material that is formed to be restored according to temperature; and
An element unit having electronic elements and attached to the deformation unit;
The deformable portion unfolds when exposed to a temperature higher than body temperature in a folded or rolled state,
The transforming part,
It includes a center member disposed in the center, connecting members connected to be radially disposed outside the center member, and a support member formed to connect the connecting members,
The support member is
An electronic element device characterized in that it is formed in a circular or polygonal shape.
A deformable part made of a shape memory material that is formed to be restored according to temperature; and
An element unit having electronic elements and attached to the deformation unit;
The deformable portion unfolds when exposed to a temperature higher than body temperature in a folded or rolled state,
The transforming part,
It includes a center member disposed in the center, connecting members connected to be radially disposed outside the center member, and a support member formed to connect the connecting members,
The element part,
An electronic element device, characterized in that formed at a position where any one of the center member or the support member and the connection member cross each other.
A deformable part made of a shape memory material that is formed to be restored according to temperature; and
An element unit having electronic elements and attached to the deformation unit;
The deformable portion unfolds when exposed to a temperature higher than body temperature in a folded or rolled state,
The transforming part,
It includes a center member disposed in the center, connecting members connected to be radially disposed outside the center member, and a support member formed to connect the connecting members,
The transforming part,
The electronic device device further comprising an internal support member formed to connect the connection members between the support member and the center member.
A deformable part made of a shape memory material that is formed to be restored according to temperature; and
An element unit having electronic elements and attached to the deformation unit;
The deformable portion unfolds when exposed to a temperature higher than body temperature in a folded or rolled state,
The element part,
An electronic element device characterized in that it is formed in a rectangular shape and an element part coupled to the deformable part is additionally attached at a position spaced apart from one side by a predetermined distance.
A deformable part made of a shape memory material that is formed to be restored according to temperature; and
An element unit having electronic elements and attached to the deformation unit;
The deformable portion unfolds when exposed to a temperature higher than body temperature in a folded or rolled state,
The element part,
An electronic element device characterized in that it is formed in a triangular shape and coupled to an upper surface of a corner of the deformable portion formed in a quadrangular shape.
A deformable part made of a shape memory material that is formed to be restored according to temperature; and
An element unit having electronic elements and attached to the deformation unit;
The deformable portion unfolds when exposed to a temperature higher than body temperature in a folded or rolled state,
The element part,
An electronic element device comprising: contact parts in contact with the deformable part formed in a plate shape, and a semi-cylindrical buffer member protruding between the contact parts in a direction spaced apart from the deformable part.
In the manufacturing method of manufacturing an electronic element device including a deformable portion and an element portion attached to the deformable portion,
Manufacturing the deformable part with a shape memory polymer material that unfolds when exposed to a temperature higher than body temperature in a folded or rolled state; and
Including; an element attaching step of attaching the element part to the deformable part,
The transforming part,
A manufacturing method for manufacturing an electronic device comprising: a center member disposed at the center, connecting members radially disposed outside the center member, and a support member formed to connect the connecting members.
delete In the manufacturing method of manufacturing an electronic element device including a deformable portion and an element portion attached to the deformable portion,
Manufacturing the deformable part with a shape memory polymer material that unfolds when exposed to a temperature higher than body temperature in a folded or rolled state; and
Including; an element attaching step of attaching the element part to the deformable part,
The transforming part,
It includes a central member disposed in the center, connecting members disposed radially outside the central member, and a support member formed to connect the connecting members,
The element part,
A manufacturing method of manufacturing an electronic element device, characterized in that formed at a position where any one of the center member or the support member and the connection member cross each other.
In the manufacturing method of manufacturing an electronic element device including a deformable portion and an element portion attached to the deformable portion,
Manufacturing the deformable part with a shape memory polymer material that unfolds when exposed to a temperature higher than body temperature in a folded or rolled state; and
Including; an element attaching step of attaching the element part to the deformable part,
The element attaching step,
A manufacturing method for manufacturing an electronic device device, characterized in that the deformed portion is laser-cut, and an electrode layer, a dielectric layer, a connection electrode, and an LED are sequentially deposited.
In the manufacturing method of manufacturing an electronic element device including a deformable portion and an element portion attached to the deformable portion,
Manufacturing the deformable part with a shape memory polymer material that unfolds when exposed to a temperature higher than body temperature in a folded or rolled state; and
Including; an element attaching step of attaching the element part to the deformable part,
The element part,
A manufacturing method for manufacturing an electronic element device, characterized in that an element part formed in a rectangular shape and coupled to the deformable part is additionally attached at a position spaced apart from one side by a predetermined distance.
In the manufacturing method of manufacturing an electronic element device including a deformable portion and an element portion attached to the deformable portion,
Manufacturing the deformable part with a shape memory polymer material that unfolds when exposed to a temperature higher than body temperature in a folded or rolled state; and
Including; an element attaching step of attaching the element part to the deformable part,
The element part,
A manufacturing method for manufacturing an electronic device, characterized in that it is an electronic device formed by stacking one or more layers.

Images