KR20210112806A - Lighting module and lighting apparatus having thereof - Google Patents

Abstract

A lighting module disclosed in the embodiment includes: a circuit board; a plurality of light emitting elements disposed on the circuit board; an air layer disposed on the plurality of light emitting elements; a light transmitting plate disposed on the air layer and transmitting light emitted from the air layer; a wavelength conversion layer disposed on the inner surface of the light transmitting plate; an adhesive layer adhered to at least one of an edge portion of the light transmitting plate and an end portion of the wavelength conversion layer; and a lens unit sealing each of the plurality of light emitting elements. The light transmitting plate and the wavelength conversion layer may be spaced apart from the light emitting elements by the air layer. By arranging the air layer inside the lighting module, it is possible to improve the light uniformity of the surface light.

Description

A lighting module and a lighting device having the same

An embodiment of the present invention relates to a lighting module in which an air gap and a light emitting device are disposed on a circuit board and covered with a light-transmitting plate.

An embodiment of the invention relates to a lighting module that provides a light-transmitting plate having a wavelength conversion layer.

An embodiment of the invention relates to a lighting device for a moving object having a lighting module.

Light emitting diodes (LEDs) have advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps. Such light emitting diodes are being applied to various lighting devices such as various display devices, indoor lights or outdoor lights.

Recently, as a light source for a vehicle, a lamp employing a light emitting diode has been proposed. Since the light emitting diode is small in size, it can increase the design freedom of the lamp, and it is also economical due to its semi-permanent lifespan.

An embodiment of the present invention may provide a lighting module and a lighting device that provide an air layer between a circuit board on which a light emitting element is disposed and a light-transmitting plate.

An embodiment of the present invention may provide a lighting module and a lighting device for providing an air layer between a circuit board on which a light emitting element is disposed and a light-transmitting plate having a wavelength conversion layer.

An embodiment of the present invention may provide a lighting module and a lighting device capable of bonding a lower end of a wavelength conversion layer and/or a light-transmitting plate to an outer upper surface of a circuit board on which a light emitting device is disposed.

An embodiment of the present invention may provide a lighting module and a lighting device capable of diffusing light emitted from a light emitting device by providing an air layer on a circuit board.

An embodiment of the present invention may provide a lighting module in which a light-transmitting red plate or a light-transmitting transparent plate is disposed on the light emitting element and the air layer.

An embodiment of the present invention may provide a lighting module in which a light-transmitting red plate or a light-transmitting transparent plate having a red ink layer is disposed on the light emitting element and the air layer.

An embodiment of the present invention provides a lighting module having improved light extraction efficiency and light distribution characteristics.

An embodiment of the present invention provides a lighting module for irradiating surface light and a lighting device having the same.

An embodiment of the present invention may provide a light unit having a lighting module, a liquid crystal display device, or a vehicle lamp.

A lighting module according to an embodiment of the present invention includes a circuit board; a plurality of light emitting devices disposed on the circuit board; an air layer disposed on the plurality of light emitting devices; a light-transmitting plate disposed on the air layer and transmitting light emitted from the air layer; a wavelength conversion layer disposed on the inner surface of the light-transmitting plate; an adhesive layer adhered to at least one of an edge portion of the light-transmitting plate and an end portion of the wavelength conversion layer; and a lens unit sealing each of the plurality of light emitting devices, wherein the transmissive plate and the wavelength conversion layer may be spaced apart from the light emitting devices by the air layer.

According to an embodiment of the invention, a reflective member may be included between the circuit board and the air layer, and the adhesive layer may be disposed between the circuit board and at least one of an edge portion of the light-transmitting plate and an end of the wavelength conversion layer. have.

According to an embodiment of the invention, a reflective member is included between the circuit board and the air layer, the reflective member extends under the adhesive layer, and the reflective member includes an edge portion of the light-transmitting plate and an end of the wavelength conversion layer. can be overlapped in the vertical direction.

According to an embodiment of the present invention, the light emitting device may emit blue light, the wavelength conversion layer may include at least one of red and yellow phosphors, and the light transmitting plate may be made of a red material.

According to an embodiment of the invention, the light emitting device emits blue light and includes an ink layer including red ink particles disposed between the light transmitting plate and the wavelength conversion layer, and the light transmitting plate may be made of a transparent material. .

According to an embodiment of the invention, the lens unit includes a first lens unit for sealing the light emitting device of the first group, and a second lens unit for sealing the light emitting device of the second group, wherein the first lens unit has a bottom diameter of a height It may have a larger convex lens shape, and the second lens unit may have a convex lens shape with a height greater than a bottom diameter.

According to an embodiment of the present invention, the light-transmitting plate includes a plurality of lenses on an upper surface, and includes a plurality of diffusion units between the light-transmitting plate and the wavelength conversion layer, and each of the diffusion portions is an area between the plurality of lenses. may be opposed to each other.

According to an embodiment of the present invention, an edge portion of the light-transmitting plate may extend outwardly of the circuit board for adhesion with the adhesive layer.

A lighting apparatus according to an embodiment of the present invention includes: a plurality of circuit boards; a plurality of light emitting devices disposed on the plurality of circuit boards; an air layer disposed on the plurality of circuit boards; a light-transmitting plate disposed on the air layer and transmitting light emitted from the air layer; a wavelength conversion layer disposed on the inner surface of the light-transmitting plate; an adhesive layer adhered to at least one of an edge portion of the light-transmitting plate and an end portion of the wavelength conversion layer; a lens unit sealing each of the plurality of light emitting devices; and a housing in which the plurality of circuit boards are accommodated, wherein the light-transmitting plate and the wavelength conversion layer may be spaced apart from the light emitting devices by the air layer.

According to an embodiment of the present invention, an edge portion of the light-transmitting plate may extend outwardly of the circuit board, and an outer portion of the housing may face the edge portion and may be adhered to the adhesive layer.

According to an embodiment of the present invention, an edge portion of the light-transmitting plate may extend outwardly of the circuit board, and an outer portion of the housing may protrude outwardly of the edge portion.

According to an embodiment of the present invention, it is possible to improve the light uniformity of the surface light by arranging an air layer inside the lighting module.

According to an embodiment of the present invention, the edge of the light-transmitting plate may be adhered to the circuit board, and light may be diffused through the surrounding air layer of the light emitting device.

According to an embodiment of the invention, it is possible to improve the uniformity of the wavelength-converted light in the lighting module.

According to an embodiment of the present invention, by adhering the light-transmitting plate to the lighting module, the height of the air layer for light diffusion can be reduced.

According to an embodiment of the present invention, it is possible to reduce a hot spot on a light emitting device in a lighting module.

Embodiments of the invention can improve the light efficiency and light distribution characteristics of the lighting module.

An embodiment of the present invention can reduce the difference in chromaticity between an exterior image of a lighting module and a light emitting image.

An embodiment of the invention can improve the color of non-illumination of the lighting module.

It is possible to improve the optical reliability of the lighting module and the lighting device having the same according to an embodiment of the present invention.

It is possible to improve the reliability of a vehicle lighting device having a lighting module according to an embodiment of the present invention.

Embodiments of the present invention may be applied to a backlight unit having a lighting module, various types of display devices, a surface light source lighting device, or a vehicle lamp.

1 is a plan view showing a lighting module according to a first embodiment of the present invention.
FIG. 2 is an example of a cross-sectional side view taken along line AA of the lighting module of FIG. 1 .
3 to 6 are modified examples of the lighting module of FIG. 2 .
7 is an example of a cross-sectional side view of a lighting device according to a second embodiment of the present invention.
FIG. 8 is a modified example of the lighting device of FIG. 7 .
9 is an example of a cross-sectional side view of a lighting module according to a third embodiment.
10 and 11 are modified examples of the lighting module of FIG. 9 .
12 is an example of a cross-sectional side view of a lighting module according to the fourth embodiment.
13 to 15 are modified examples of the lighting module of FIG. 12 .
16 is a view for explaining a manufacturing process of a light-transmitting plate according to an embodiment of the present invention.
17 is a plan view of a vehicle to which a lamp having a lighting module according to an embodiment of the present invention is applied.
18 is a view showing a detailed example of the rear light of FIG.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical spirit of the present invention is not limited to some embodiments described, but may be implemented in various different forms, and within the scope of the technical spirit of the present invention, one or more of the components may be selected among the embodiments. It can be combined and substituted for use. In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be generally understood by those of ordinary skill in the art to which the present invention pertains, unless specifically defined and described. It may be interpreted as a meaning, and generally used terms such as terms defined in advance may be interpreted in consideration of the contextual meaning of the related art. In addition, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In this specification, the singular form may also include the plural form unless otherwise specified in the phrase, and when it is described as "at least one (or more than one) of A and (and) B, C", it is combined as A, B, C It can contain one or more of all possible combinations. In addition, in describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only used to distinguish the component from other components, and the essence, order, or order of the component is not determined by the term. And, when it is described that a component is 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also with the component It may also include a case of 'connected', 'coupled' or 'connected' due to another element between the other elements. In addition, when it is described as being formed or disposed on "above (above) or below (below)" of each component, the top (above) or bottom (below) is one as well as when two components are in direct contact with each other. Also includes a case in which another component as described above is formed or disposed between two components. In addition, when expressed as “upper (upper) or lower (lower)”, a meaning of not only an upper direction but also a lower direction based on one component may be included.

The lighting device according to the present invention can be applied to various lamp devices that require lighting, for example, a vehicle lamp, a home lighting device, or an industrial lighting device. For example, when applied to a vehicle lamp, a head lamp, a side lamp, a side mirror lamp, a fog lamp, a tail lamp, a brake lamp, a daytime running lamp, a vehicle interior lighting, a door scar, a rear combination lamp, a backup lamp etc. can be applied. The lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, and various fields of electric vehicles. will say that

<First embodiment>

1 is a side cross-sectional view showing a lighting module according to a first embodiment, and FIG. 2 is an example of a plan view of the lighting module of FIG. 1 .

1 and 2 , the lighting module 100 includes a circuit board 11 , a light emitting device 21 disposed on the circuit board 11 , and an air layer 60 around the light emitting device 21 . ), a wavelength conversion layer 41 on the air layer 60 and a light-transmitting plate 51 on the wavelength conversion layer 41 may be included.

The lighting module 100 may function as a surface lighting lamp emitting the light emitted from the light emitting device 21 as surface light. The thickness of the lighting module 100 may be less than or equal to 20 mm from the bottom of the circuit board 11 , or in the range of 5 mm to 20 mm, or in the range of 5 mm to 15 mm. The thickness of the lighting module 100 may be a linear distance between the lower surface and the uppermost surface of the circuit board 11 . Since the lighting module 100 has a thickness of 20 mm or less, it can be provided as a flexible and slim surface light source module. When the thickness of the lighting module 100 is thinner than the above range, the light diffusion space is reduced and a hot spot may be generated. Since the thickness of the lighting module 100 is provided as 20 mm or less or 15 mm or less, the lighting module can be provided as a module capable of a curved structure, thereby reducing design freedom and spatial restrictions. A part of the circuit board 11 may include a connector (not shown) to supply power to the light emitting devices 21 . The lighting module 100 can be applied to various lamp devices required for lighting, for example, a vehicle lamp, a home lighting device, and an industrial lighting device. For example, in the case of a lighting module applied to a vehicle lamp, a head lamp, a side lamp, a side mirror lamp, a fog lamp, a tail lamp, a turn signal lamp, a back up lamp, a stop lamp ), daytime running right, vehicle interior lighting, door scarf, rear combination lamp, backup lamp, etc.

In the lighting module 100 , the circuit board 11 may function as a base member or a support member for supporting the light emitting device 21 , the edge of the wavelength conversion layer 41 , and the edge of the light-transmitting plate 51 . The circuit board 11 includes a printed circuit board (PCB). The circuit board 11 may include, for example, at least one of a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or an FR-4 board. have. The circuit board 11 may include, for example, a flexible PCB or a rigid PCB.

The circuit board 11 may include a wiring layer (not shown) thereon, and the wiring layer may be electrically connected to the light emitting device 21 . A reflective layer or a protective layer disposed on the circuit board 11 may protect the wiring layer. Each of the plurality of light emitting devices 21 may be connected in series, parallel, or series-parallel by a wiring layer of the circuit board 11 . Each of the plurality of light emitting devices 21 may have two or more groups connected in series or in parallel, or between the groups may be connected in series or in parallel. The protective layer may include a member having a solder resist material, and the solder resist material is a white material and may reflect incident light.

The thickness of the circuit board 11 may be 0.5 mm or less, for example, in the range of 0.3 mm to 0.5 mm. Since the thickness of the circuit board 11 is provided thin, the thickness of the lighting module may not be increased. Since the circuit board 11 has a thickness of 0.5 mm or less, it can support a flexible module.

The lighting module 100 may include a reflective member 15 disposed on the upper surface of the circuit board 11 . The reflective member 15 may reflect the light traveling toward the upper surface of the circuit board 11 to the air layer 60 . The light emitting devices 21 may be arranged in N columns (N is an integer greater than or equal to 1) and/or M rows (M is an integer greater than or equal to 1) on the circuit board 11 .

As another example, the circuit board 11 may include a transparent material. Since the circuit board 11 made of the transparent material is provided, the light emitted from the light emitting device 21 may be emitted in an upper surface direction and a lower surface direction of the circuit board 11 .

The light emitting device 21 is disposed on the circuit board 11 and may be sealed by the air layer 60 . The plurality of light emitting devices 21 may be in contact with the air layer 60 . The air layer 60 may be disposed on a side surface and an upper surface of the light emitting device 21 . The air layer 60 may provide a space between the light emitting devices 21 and the light-transmitting plate 51 , and may be in contact with the upper surface of the circuit board 11 . The light emitted from the light emitting device 21 may be diffused in the air layer 60 and emitted to the outside. The air layer 60 may include a material having a refractive index of 1.2 or less, at least one element of a compound of air, or at least one of a mixed gas, a metal gas, and a non-metal gas. Since the air layer 60 is provided with a refractive index lower than that of the semiconductor material constituting a part of the light emitting device 21 and the material of the light-transmitting plate 51 , it can diffuse light and emit it to the outside.

The refractive index of the air layer 60 may be lower than that of the resin material, and light diffusion efficiency may be higher than that of the resin material. Accordingly, the height T1 of the space filled with the air layer 60 is the distance between the reflective member 15 and the lower surface of the wavelength conversion layer 41, which is the inner layer of the translucent plate 51, and is less than 20 mm or less than 15 mm. can be provided as Conventionally, when resin is sealed on a circuit board, hot spots may occur due to low diffusion efficiency, and there is also a problem of providing a separate inner lens to implement an externally unlit image. In addition, since the light emitting device is sealed with resin in the related art, there is a problem in that a diffusing agent must be added in the resin for surface light or a pitch interval between the light emitting devices must be narrowly arranged. In the embodiment of the present invention, by removing the resin on the circuit board 11 , the distance between the light emitting devices 21 can be increased, and light diffusion efficiency can be increased.

The light emitting device 21 may be implemented as an LED, and may be provided as an LED chip or a package. For example, the light emitting device 21 may be provided as an LED chip emitting light through an upper surface and a plurality of side surfaces, and the LED chip may be mounted on the circuit board 11 in the form of a flip chip. As another example, the LED chip may be provided in a horizontal type or a vertical type, and may be connected to a circuit board using at least one wire. The light emitting device 21 may be formed to a thickness of 0.3 mm or less. Since the light emitting device 21 emits light on at least five surfaces, the luminance distribution and the directional angle distribution can be improved.

The light emitting device 21 may emit at least one of blue, red, green, ultraviolet (UV), and infrared. The light emitting device 21 may emit blue light, for example. When a wavelength conversion layer having a phosphor is provided on the surface of the light emitting device 21 , white light may be emitted through the light emitting device 21 . A ceramic support member or a support member having a metal plate may be disposed at a lower portion of the light emitting device 21 , and the support member may be used as an electrically conductive and heat conductive member.

The light-transmitting plate 51 may be coupled to the circuit board 11 by disposing a pre-formed structure on the air layer 60 . The light-transmitting plate 51 may be injected using a thermoform method or may be injected using an in-mold method.

The light-transmitting plate 51 may provide a recess concave in the direction from the lower surface to the upper surface, thereby providing the air layer 60 . The light-transmitting plate 51 may maintain the space of the air layer 60 and protect the light emitting device 21 . The recess may have a polygonal shape, a hemispherical shape, or a semi-elliptical shape when viewed from a side cross-section. The recess or air layer 60 may function as a spacer of the light-transmitting plate 51 .

The light-transmitting plate 51 may function as an inner lens of the lamp. The light-transmitting plate 51 may have a colored surface color, for example, may be provided as a red plate. The light-transmitting plate 51 may include diffusion particles such as UV ink or beads inside a resin material, for example, UV (ultra violet) resin, silicone, or epoxy. The light-transmitting plate 51 may be formed of at least one of white polyethylene terephthalate (PET), polycarbonate (PC), and polyimide (PI). The diffusion particles may include at least one of a poly methyl meth acrylate (PMMA) series, TiO ₂ , SiO ₂ , Al ₂ O _{3 , and silicon series.} The diffusing particles may diffuse incident light. The diffusing particles may have red particles, or the UV resin may include red particles, so that the light-transmitting plate 51 may be provided as a red plate.

Since the light-transmitting plate 51 is provided in red color, when blue light is incident, the incident blue light may be absorbed or blocked by the light-transmitting plate 51 , and when light having a wavelength higher than that of blue light is incident. It may pass through the light-transmitting plate 51 . Light transmitted through the light-transmitting plate 51 may be emitted in at least one of red, yellow, and white.

The light-transmitting plate 51 may have a thickness of 1 mm or more, or a thickness capable of maintaining the shape of the recess after injection molding. The transmissive plate 51 may include a transmissive part 53 , a side part 55 , and an edge part 57 . The transmission part 53 may be a region facing the light emitting devices 21 or a region disposed on the air layer 60 . The side part 55 may extend or be bent downward from both ends of the transmission part 53 . The edge portion 57 may be a region facing or fixed to the circuit board 11 at a position adjacent to the circuit board 11 . The edge portion 57 may be bent outwardly from the lower end of the side portion 55 .

The light-transmitting plate 51 may include the wavelength conversion layer 41 integrally with the inner layer or may be disposed separately. The wavelength conversion layer 41 may include an upper portion 43 , a side portion 45 , and an end portion 47 along an inner surface of the light-transmitting plate 51 . The upper part 43 is formed on the inner surface of the transmissive part 53 of the light-transmitting plate 51 , the side part 45 is formed on the inner surface of the side part 55 of the light-transmitting plate 51 , and the end 47 is It may be disposed below the edge portion 57 of the light-transmitting plate 51 , or may be disposed at an inner lower end of the side portion 55 . The end portion 47 of the wavelength conversion layer 41 may be disposed between the circuit board 11 and the edge portion 51 of the light-transmitting plate 51 . An end portion 47 of the wavelength conversion layer 41 may extend outwardly from the side portion 45 .

The wavelength conversion layer 41 may include a phosphor made of a resin material, and the phosphor may include at least one of a red phosphor, a yellow phosphor, or a green phosphor. The wavelength conversion layer 41 may include a red and/or yellow phosphor. The wavelength conversion layer 41 may be added in a phosphor content of 10 wt% or more, or in a range of 10 wt% to 60 wt%, or in a range of 30 wt% to 50 wt%. These phosphors may be emitted by converting the incident light to a wavelength. In this case, when the wavelength-converted red light is emitted from the phosphor, or when the red light and the light emitted from the light emitting device 21 are mixed, white light may be emitted.

As another example, when the light-transmitting plate 51 is a transparent plate, the color shown through the light-transmitting plate 51 may be changed to a phosphor color by the content of the phosphor in the wavelength conversion layer 41 . That is, when the phosphor is red, when viewed from the outside of the light-transmitting plate 51 , it may be seen as red. Here, the phosphor content in the wavelength conversion layer 41 may be higher than the phosphor content in the light-transmitting plate 51 .

The end portion 47 of the wavelength conversion layer 41 may be adhered to the upper surface of the circuit board 11 through the adhesive layer 31 . Since the wavelength conversion layer 41 is formed on the inner surface of the light-transmitting plate 51 , the light-transmitting plate 51 is a circuit board together with the end portion 47 of the wavelength conversion layer 41 by the adhesive layer 31 . (11) can be attached. The adhesive layer 31 is a transparent or opaque material, and may be an adhesive such as UV adhesive, silicone, or epoxy. The adhesive layer 31 has a thickness smaller than that of the reflective member 15 , and may extend to the periphery of the reflective member 15 or may be adhered to the reflective member 15 .

Here, the light-transmitting plate 51 may be pre-injection-molded, then laminated or molded with the wavelength conversion layer 41 on the inner layer, and then attached to the circuit board 11 .

As shown in FIG. 3 , the outer portion 15A of the reflective member 15 may extend outside the upper surface of the circuit board 11 . The outer portion 15A of the reflective member 15 may vertically overlap the side portion 45 of the wavelength conversion layer 41 and the side portion 55 of the light-transmitting plate 51 . The outer portion 15A of the reflective member 15 may be adhered to at least one or both of the light-transmitting plate 51 and the wavelength conversion layer 41 through an adhesive layer 31 . The wavelength conversion layer 41 may include an upper portion 43 and a side portion 45 . The lower end of the side portion 45 of the wavelength conversion layer 41 may be adhered to the outer portion 15A of the reflective member 15 . The edge portion 57 of the light-transmitting plate 51 is adhered to the outer portion 15A of the reflective member 15 , so that the side portion 45 of the wavelength conversion layer 41 is formed of the light-transmitting plate 51 . Exposure to the outside of the edge portion 57 may be blocked.

As shown in FIG. 4 , the light-transmitting plate 51 may be formed integrally with the inner surface of the transmissive part 53 , or a plurality of layers of a resin material may be disposed between the transmissive part 53 and the air layer 60 . The ink layer 71 may be disposed on the lower surface of the transmissive part 53 of the light-transmitting plate 51 , and the upper part 43 of the wavelength conversion layer 41 may be disposed on the lower surface of the ink layer 71 .

The ink layer 71 includes ink particles, and the ink particles may include at least one of metal ink, UV ink, and curing ink. The size of the ink particles may be smaller than the size of the phosphor. The surface color of the ink particles may be any one of green, red, yellow, and blue. The type of ink is PVC (Poly vinyl chloride) ink, PC (Polycarbonate) ink, ABS (acrylonitrile butadiene styrene copolymer) ink, UV resin ink, epoxy ink, silicone ink, PP ( polypropylene) ink, water-based ink, plastic ink, PMMA (poly methyl methacrylate) ink and PS ( polystyrene) ink can be selectively applied. Here, the width or diameter of the ink particles may be 5 μm or less, or in the range of 0.05 μm to 1 μm. At least one of the ink particles may be smaller than a wavelength of light.

The color of the ink particles may include at least one of red, green, yellow, and blue. For example, the phosphor of the wavelength conversion layer 41 may emit a red wavelength, and the ink particles may include a red color. For example, the red color of the ink particles may be darker than the color of the wavelength of the phosphor or light. The ink particles may have a color different from that of the light emitted from the light emitting device 21 . The ink particles may have an effect of blocking or blocking incident light. In addition, the ink layer 71 may provide an outer surface color of the particle particle color when the light-transmitting plate 51 is transparent. That is, when the ink particles are red, when viewed from the outside of the light-transmitting plate 51, it can be seen as red.

The ink layer 71 may be disposed on a lower surface of the transmissive part 53 of the translucent plate 51 , and may be disposed between the transmissive part 53 and the upper part 43 of the wavelength conversion layer 41 . When the ink layer 71 is not formed on the side portion 55 of the light transmitting plate 51 , the side portion 45 of the wavelength conversion layer 41 may contact the inner surface of the side portion 55 . As another example, the ink layer 71 may extend to the inner surface of the side portion 55 of the light-transmitting plate 51 , and an end of the ink layer 71 may be in contact with the adhesive layer 31 . The ink layer 71 may prevent hot spots.

The outer portion 15A of the reflective member 15 may be directly attached to the adhesive layer 31 . The outer portion 15A of the reflective member 15 and the outer side of the adhesive layer 31 may be exposed to the outside of the light-transmitting plate 51 .

Here, the light-transmitting plate 51 is pre-injection-molded, and then the ink layer 71 and the wavelength conversion layer 41 are sequentially laminated or molded on the inner layer, and then attached to the circuit board 11. have.

As shown in FIG. 5 , a curved portion C1 may be included between the transmissive portion 53 and the side portion 55 of the light-transmitting plate 51 . A connection portion between the upper portion 43 and the side portion 45 of the wavelength conversion layer 41 may also be connected along the curved shape of the curved portion C1 of the light-transmitting plate 51 . The curved portion C1 may more stably support the bent portion of the light-transmitting plate 51 , and may reduce dark portions generated in corners rather than angled areas when light is extracted.

6, the light-transmitting plate 51A includes a curved transmissive part 53A and an edge part 57, and the wavelength conversion layer 41A is the transmissive part 53A along the curved transmissive part 53A. It may include an upper portion 43A and an end portion 47 extending to the inner surface of the . The transmission portion 53A may be provided as a curved surface having a gradually higher height from the edge portion 57 toward the center of the transmission portion 53A, and the edge portion 57 is horizontal at the end of the transmission portion 53A. It may extend outwardly in one direction. The edge portion 57 of the light-transmitting plate 51A may be adhered to the adhesive layer 31 or fixed through the end portion 47 of the wavelength conversion layer 41A. In this case, the air layer 60 may be provided in a semi-spherical shape or a semi-elliptical shape. In addition, since the light-transmitting plate 51A of the curved shape is provided in the shape of a convex lens, it can function as a lens.

7 and 8 are examples of side cross-sectional views of a lighting device according to a second embodiment of the present invention. In the configuration of FIGS. 7 and 8 , the same configuration as that of the first embodiment may be selectively applied to the second embodiment with reference to the description of the first embodiment.

Referring to FIG. 7 , the lighting device may include a housing 91 supporting the lighting module 100A. The lighting module 100A is a light-transmitting plate 51A having a circuit board 11A, 11B, a light emitting element 21, an air layer 60, and a wavelength conversion layer 41A on the circuit boards 11A and 11B. may include. The light-transmitting plate 51A may be adhered or fixed to the circuit boards 11A and 11B with an adhesive layer 31 . The light transmitting plate 51A and the wavelength conversion layer 41A may be bonded to the circuit boards 11A and 11B and the housing 91 through the adhesive layer 31 . The transmissive plate 51A includes a curved transmissive part 53A and an edge part 57, and the wavelength conversion layer 41A includes an upper portion 43A on the inner surface of the curved transmissive part 53A. can

The housing 91 provides a concave housing 93 therein, and the circuit boards 11A and 11B may be disposed in the housing 93 . The outer portion 97 of the housing 91 may protrude in the upper surface direction and may face the edge portion 57 of the light-transmitting plate 51A. The outer portion 97 of the housing 91 may face the outer side surfaces of the circuit boards 11A and 11B, and the upper surface of the outer portion 97 is on the same plane as the upper surface of the circuit boards 11A and 11B. Or, it may be the same plane as the upper surface of the reflective member 15 . The outer portion 97 of the housing 91 and the edge portion 57 of the light-transmitting plate 51A may be bonded by an adhesive layer 31 .

A plurality of circuit boards 11A and 11B are disposed in the housing portion 93 of the housing 91 , and the plurality of circuit boards 11A and 11B may be spaced apart from each other by a predetermined gap 13 . The reflective member 15 may extend over the gap 13 , thereby reducing light loss in the gap 13 . The housing 91 may be formed of a reflective material of a metal or resin material, or a material with high heat dissipation efficiency.

As shown in FIG. 8 , the outer portion 97 of the housing 91 may protrude to the outside of the light-transmitting plate 51A. The outer portion 97 may face the outer side of the edge portion 57 of the light-transmitting plate 51A, thereby blocking light leaking to the outside.

The outer portion 97 may contact the adhesive layer 31 and the edge portion 57 of the light-transmitting plate 51A. As another example, when the wavelength conversion layer 41A has an end portion extending outward, the end portion may be adhered to the outer portion 97 .

9 to 11 are examples of cross-sectional side views of the lighting module according to the third embodiment and modified examples thereof. 9 to 11 , the same configuration as that of the first embodiment may be selectively applied to the third embodiment with reference to the description of the first embodiment.

Referring to FIG. 9 , the lighting module 100B may include a lens unit 25 in each of the light emitting elements 21 . The lens unit 25 is disposed between the air layer 60 and the circuit board 11 , and seals each light emitting device 21 . The lens unit 25 may be formed of a resin material such as transparent silicone or epoxy. The lens unit 25 may cover an upper surface and side surfaces of the light emitting device 21 . The lens unit 25 may seal the light emitting device 21 and may be adhered to the upper surface of the circuit board 11 and/or the reflective member (15 of FIG. 2 ). Accordingly, the lens unit 25 may block moisture penetrating into the light emitting element 21 .

The lens unit 25 may be formed in a convex lens shape to refract incident light, and the air layer 60 may diffuse light emitted through the lens unit 25 . The lens unit 25 may be spaced apart from the wavelength conversion layer 41 , and may improve a beam angle of light, and may increase an interval between the light emitting devices 21 .

Since the distance between the outermost light emitting element 21 and the wavelength conversion layer 41 or the light-transmitting plate 51 is narrowed, a hot spot may be generated on the side surface. According to an embodiment of the present invention, it is possible to suppress the occurrence of a hot spot on the side surface by the lens unit 25 covering the light emitting element 21 . That is, by applying the lens unit 25 to the light emitting elements 21 located at the edges, it is possible to suppress hot spots.

10 , the first light emitting element 21 of the first group is sealed with the first lens unit 25 , and the second light emitting element 21A of the second group is sealed with the second lens unit 25A. can be The first light emitting device 21 of the first group and the second light emitting device 21A of the second group may be alternately disposed with each other. Alternatively, it may be arranged to have a certain rule. For example, when it is necessary to focus the emitted light of the light source module 100B to the center, the first light emitting element 21 and the first lens unit 25 of the first group are arranged in the center, and the second group of the second group is arranged in the center. The light emitting element 21A and the second lens unit 25A may be disposed at the edges to surround the first light emitting element 21 .

The first lens unit 25 may have a convex lens shape having a bottom diameter higher than a height, and may diffuse and emit light incident from the first light emitting device 21 in a lateral direction. The second resin part 25A may have a convex lens shape having a height greater than a bottom diameter, and may condense light incident from the second light emitting device 21A in an upward direction.

The first light emitting device 21 of the first group and the second light emitting device 21A of the second group may be driven separately. For example, for the tail lamp, the first light emitting element 21 may be turned on and the second light emitting element 21A may be in an off state. Accordingly, the wavelength of the light emitted from the first light emitting device 21 may be converted and then provided through the transmissive plate 51 as uniform surface light distribution. For example, for the stop lamp, the second light emitting device 21A may be turned on and the first light emitting device 21 may be in an off state. Accordingly, the wavelength-converted light emitted from the second light emitting device 21A may be provided through the light-transmitting plate 51 as a light distribution focused in a specific direction. Such a lighting module provides light emitting elements 21 and 21A and an air layer 60 on the circuit board 11 and uses different lens units 25 and 25A for light passing through the translucent plate 51 . It can function as at least two types of lamps.

Referring to FIG. 11 , the illumination module 100C may include a plurality of lenses R1 arranged on the upper surface of the transmissive part 53B of the light-transmitting plate 51B. The plurality of lenses R1 may be formed of a material of the light-transmitting plate 51B. That is, during injection molding of the light transmitting plate 51B, the lenses R1 may be formed together. The lens R1 may be provided in a convex lens shape, and may be arranged in a matrix form or a stripe form on the transmission part 53B. The lens R1 may have a hemispherical or semi-elliptical side cross-section, and may refract incident light. For example, the lenses R1 may condense incident light in a specific direction.

A plurality of diffusion portions R2 may be formed between the transmission portion 53B of the light-transmitting plate 51B and the upper portion 43 of the wavelength conversion layer 41B. The diffusion parts R2 may vertically overlap the area between the lenses R1 . The diffusion units R2 block, diffuse, or reflect light that is out of the center area of the lens R1 among the incident light, thereby improving the directivity of the light traveling through the lens R1, and It can reduce optical interference.

The diffusion part R2 may be provided in the form of being buried in the upper part 43 of the wavelength conversion layer 41B. The upper surface of the diffusion part R2 may be disposed on the same plane as the upper surface of the wavelength conversion layer 41B. The diffusion portion R2 has a uniform pattern shape, and may be printed in a single layer or in multiple layers. The diffusion portion R2 may include at least one of poly methyl meth acrylate (PMMA)-based, TiO ₂ , SiO ₂ , Al ₂ O ₃ , silicon-based, and metallic ink in a resin material. The diameter of the diffusion part R2 is provided to be smaller than the diameter of the lens R1 , so that it is possible to adjust the incidence efficiency of light from the lower part of the lens R1 .

12 , the ink layer 71 may be disposed between the light-transmitting plate 51B and the wavelength conversion layer 41B. The ink layer 71 may be disposed between the transmissive portion 53B of the light-transmitting plate 51B and the upper portion 43 of the wavelength conversion layer 41B. The ink layer 71 may provide an external color of the lighting module and may prevent a hot spot from being generated.

As shown in FIG. 13 , the lenses R1 of the light transmitting plate 51B may be spaced apart from each other by a predetermined interval, and a flat portion R13 between the lenses R1 may be provided as a flat image surface, and the lens R1 may be provided as a flat surface. ) may be formed on the outside of each. The diffusion portion R3 may be disposed between the transmission portion 53B of the light-transmitting plate 51B and the upper portion 43 of the wavelength conversion layer 41B.

Here, the diffusion portion R3 may be disposed between the light-transmitting plate 51B and the wavelength conversion layer 41B. For example, the diffusion portion R3 is disposed between the transmission portion 53B of the light-transmitting plate 51B and the upper portion 43 of the wavelength conversion layer 41B, or disposed in a concave region from the upper surface of the upper portion 43 , respectively. can be The diffusion portion R3 may be provided in the form of being buried in the upper portion 43 of the wavelength conversion layer 41B. The upper surface of the diffusion part R3 may be disposed on the same plane as the upper surface of the wavelength conversion layer 41B, and may be formed of the above-described material. The diffusion portion R3 may be disposed under a region corresponding to the flat portion R13 . When the lens R1 has a circular shape, the flat part R13 and the diffusion part R3 may be provided in a ring shape. When the lens R1 has a long length in a stripe shape, the flat portion R13 and the diffusion portion R3 may be formed in a stripe or bar shape.

14 , the upper portion 43 of the wavelength conversion layer 41B may be formed along the concave-convex structure of the lower surface of the transmissive portion 53B of the light-transmitting plate 51B. A plurality of protrusions R12 may protrude from a lower surface of the transmissive portion 53B of the light-transmitting plate 51B and extend below the upper surface of the upper portion 43 of the wavelength conversion layer 41B. The plurality of protrusions R12 may be formed at positions corresponding to the flat portions R13 of the light-transmitting plate 51B.

15 , the transmissive part 53B of the light-transmitting plate 51B may include a plurality of lens arrays R5 as an upper surface thereof. The lens array R5 may be provided in the shape of a micro lens array MLA or a prism shape. The lens array R5 may condense the incident light with a uniform light distribution. The lens array R5 may be integrally formed with the light-transmitting plate 51B or may be attached as a separate lens sheet.

The lens array R5 may have a size to cover the light emitting device 21 . The height/diameter ratio of the lens array R5 may be 0.4 or more, for example, in the range of 0.4 to 0.8. The diameter may be 30 micrometers or more, for example, in the range of 30 to 80 micrometers.

16 is a view showing an injection process of the light-transmitting plate (51, 51A, 51B) according to an embodiment of the present invention. 16 , the inner groove 123 of the lower frame 121 disposed on the support plate 120 may be formed in a shape corresponding to the protrusion 113 of the upper frame 111 of the pressing plate 110 . have. Thereafter, after disposing the liquid material 130 constituting the translucent plates 51 , 51A and 51B in the inner groove 123 , the upper frame 111 is pressed and cured by applying heat, and then the The upper frame 111 may be separated. At this time, the shape and thickness of the inner groove between the upper frame 111 and the lower frame 121 may be set in advance, and the liquid material 130 prepared in advance is dispensed and then pressed to harden by compression molding. can do.

After the light-transmitting plates 51, 51A, and 51B are formed, the wavelength conversion layers 41, 41A, and 41B may be formed, or the ink layer 71 may be additionally printed or formed by transfer molding. As another example, the light-transmitting plate may be formed by a vacuum and/or compression molding method, but is not limited thereto.

17 is a plan view of a vehicle to which a vehicle lamp to which a lighting module is applied according to an embodiment of the present invention is applied, and FIG. 18 is a view showing a tail light of the vehicle lamp of FIG. 17 .

Referring to FIGS. 17 and 18 , the front lamp 850 in the vehicle 900 may include one or more lighting modules, and the driving timing of these lighting modules is individually controlled to function not only as a typical headlamp, but also to the driver. When the vehicle door is opened, additional functions such as a welcome light or a celebration effect can be provided. The lamp may be applied to a daytime running lamp, a high beam, a low beam, a fog lamp or a turn signal lamp.

18 , the tail light 800 of the vehicle 900 may include a first lamp unit 812 , a second lamp unit 814 , a third lamp unit 816 , and a housing 810 . Here, the first lamp unit 812 may be a lighting module serving as a turn indicator, the second lamp unit 814 may be a lighting module serving as a sidelight, and the third lamp unit 816 may be a brake light. It may be a lighting module for a role, but is not limited thereto. At least one or all of the first to third lamp units 812 , 814 , and 816 may include the lighting module disclosed in the embodiment. The housing 810 accommodates the first to third lamp units 812 , 814 , and 816 , and may be made of a light-transmitting material. At this time, the housing 810 may have a curve according to the design of the vehicle body, and the first to third lamp units 812 , 814 , and 816 implement a surface light source that may have a curved surface according to the shape of the housing 810 . can Such a vehicle lamp may be applied to a turn signal lamp of a vehicle when the lamp unit is applied to a tail lamp, a brake lamp, or a turn signal lamp of a vehicle.

Features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, features, structures, effects, etc. illustrated in each embodiment can be combined or modified for other embodiments by those of ordinary skill in the art to which the embodiments belong. Accordingly, the contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

In addition, although the embodiment has been described above, it is only an example and does not limit the present invention, and those of ordinary skill in the art to which the present invention pertains are exemplified above in the range that does not depart from the essential characteristics of the present embodiment. It can be seen that various modifications and applications that have not been made are possible. For example, each component specifically shown in the embodiment can be implemented by modification. And differences related to such modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

Claims (11)

circuit board;
a plurality of light emitting devices disposed on the circuit board;
an air layer disposed on the plurality of light emitting devices;
a light-transmitting plate disposed on the air layer and transmitting light emitted from the air layer;
a wavelength conversion layer disposed on the inner surface of the light-transmitting plate;
an adhesive layer adhered to at least one of an edge portion of the light-transmitting plate and an end portion of the wavelength conversion layer; and
and a lens unit sealing each of the plurality of light emitting devices,
The light-transmitting plate and the wavelength conversion layer are spaced apart from the light emitting elements by the air layer, the lighting module. According to claim 1,
A reflective member is included between the circuit board and the air layer,
The adhesive layer is disposed between the circuit board and at least one of an edge portion of the light-transmitting plate and an end of the wavelength conversion layer. According to claim 1,
A reflective member is included between the circuit board and the air layer,
The reflective member extends under the adhesive layer,
The reflective member is vertically overlapped with an edge portion of the light-transmitting plate and an end portion of the wavelength conversion layer. 4. The method according to any one of claims 1 to 3,
The light emitting device emits blue light,
The wavelength conversion layer includes at least one of red and yellow phosphors,
The light-transmitting plate is made of a red material, the lighting module. 4. The method according to any one of claims 1 to 3,
The light emitting device emits blue light,
An ink layer comprising red ink particles disposed between the light-transmitting plate and the wavelength conversion layer,
The light-transmitting plate is a transparent material, the lighting module. 4. The method according to any one of claims 1 to 3,
The lens unit includes a first lens unit for sealing the light emitting device of the first group, and a second lens unit for sealing the light emitting device of the second group,
The first lens unit has a convex lens shape with a bottom diameter greater than a height,
The second lens unit has a convex lens shape with a height greater than a bottom diameter, a lighting module. 4. The method according to any one of claims 1 to 3,
The light-transmitting plate includes a plurality of lenses on the upper surface,
A plurality of diffusion parts are included between the light-transmitting plate and the wavelength conversion layer,
Each of the diffusions is opposed to a region between the plurality of lenses, respectively, a lighting module. 4. The method according to any one of claims 1 to 3,
An edge portion of the light-transmitting plate extends outwardly of the circuit board for bonding with the adhesive layer. a plurality of circuit boards;
a plurality of light emitting devices disposed on the plurality of circuit boards;
an air layer disposed on the plurality of circuit boards;
a light-transmitting plate disposed on the air layer and transmitting light emitted from the air layer;
a wavelength conversion layer disposed on the inner surface of the light-transmitting plate;
an adhesive layer adhered to at least one of an edge portion of the light-transmitting plate and an end portion of the wavelength conversion layer;
a lens unit sealing each of the plurality of light emitting devices; and
and a housing in which the plurality of circuit boards are accommodated,
The light-transmitting plate and the wavelength conversion layer are spaced apart from the light emitting elements by the air layer, the lighting device. 10. The method of claim 9,
The edge portion of the light-transmitting plate extends outwardly of the circuit board,
An outer portion of the housing faces the edge portion and is adhered to the adhesive layer. 10. The method of claim 9,
The edge portion of the light-transmitting plate extends outwardly of the circuit board,
An outer portion of the housing protrudes to the outside of the edge portion, the lighting device.

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