KR20210102132A - Thermoelectric module - Google Patents

Abstract

According to an embodiment of the present invention, a thermoelectric module comprises: a first metal substrate including a first through hole; a first insulating layer disposed on the first metal substrate; a first electrode unit disposed on the first insulating layer, and including a plurality of first electrodes; a plurality of P- and N-type thermoelectric legs disposed on the first electrode unit; a second electrode unit disposed on the plurality of P- and N-type thermoelectric legs, and including a plurality of second electrodes; a second insulating layer disposed on the second electrode unit; and a second metal substrate disposed on the second insulating layer, and including a second through hole. The first metal substrate includes an effective area in which the first electrode unit is disposed and an outer area which is formed outside the effective area. The second metal substrate includes an effective area in which the second electrode unit is disposed and an outer area which is formed outside the effective area. The first through hole occupies a part of the effective area of the first metal substrate. The second through hole occupies a part of the effective area of the second metal substrate. The first through hole and the second through hole are formed at positions corresponding to each other. Therefore, the reliability and durability of the thermoelectric module can be increased at high temperatures.

Description

Thermoelectric module {THERMOELECTRIC MODULE}

The present invention relates to a thermoelectric module, and more particularly, to a fastening structure of the thermoelectric module.

The thermoelectric phenomenon is a phenomenon that occurs by the movement of electrons and holes inside a material, and refers to direct energy conversion between heat and electricity.

A thermoelectric element is a generic term for a device using a thermoelectric phenomenon, and has a structure in which a P-type thermoelectric material and an N-type thermoelectric material are bonded between metal electrodes to form a PN junction pair.

Thermoelectric devices can be divided into devices using a temperature change in electrical resistance, devices using the Seebeck effect, which is a phenomenon in which electromotive force is generated by a temperature difference, and devices using the Peltier effect, which is a phenomenon in which heat absorption or heat is generated by current. .

Thermoelectric devices are widely applied to home appliances, electronic parts, and communication parts. For example, the thermoelectric element may be applied to an apparatus for cooling, an apparatus for heating, an apparatus for power generation, and the like. Accordingly, the demand for the thermoelectric performance of the thermoelectric element is increasing.

The thermoelectric element includes a substrate, an electrode, and a thermoelectric leg, a plurality of thermoelectric legs are disposed between the upper substrate and the lower substrate in an array form, a plurality of upper electrodes are disposed between the plurality of thermoelectric legs and the upper substrate, and a plurality of A plurality of lower electrodes are disposed between the thermoelectric leg and the lower substrate.

One of the upper and lower substrates of the thermoelectric element becomes a high-temperature portion, and the other becomes a low-temperature portion. In this case, as a temperature difference occurs between the substrate in the high temperature portion and the substrate in the low temperature portion, thermal deformation may occur in the substrate in the high temperature portion, and a phenomenon in which stress is concentrated to the bonding interface of the substrate may occur. Due to this, peeling and cracking may occur at the bonding interface, which may reduce the quality of the product.

In particular, the edge of the high-temperature part has a higher amount of thermal deformation than the central part. When the edges of the high-temperature part and the low-temperature part are fastened, the concentration of stress in the bonding interface part may be increased due to the thermal deformation.

An object of the present invention is to provide a fastening structure for a thermoelectric module.

A thermoelectric module according to an embodiment of the present invention includes: one first metal substrate including a first through hole and a second through hole; an upper substrate portion disposed on the one first metal substrate and including a second metal substrate including a third through hole and a third metal substrate including a fourth through hole; a first insulating layer and a plurality of second insulating layers disposed between the one first metal substrate and the upper substrate part; a first electrode part and a second electrode part disposed between the first insulating layer and the plurality of second insulating layers; a plurality of thermoelectric legs disposed between the first electrode part and the second electrode part; a first fastening member; and a second fastening member, wherein the first insulating layer is in direct contact with the one first metal substrate, and each of the plurality of second insulating layers is in direct contact with the second metal substrate and the third metal substrate and the one first metal substrate includes a first effective region on which the first electrode part is disposed and a first external region formed outside the first effective region, wherein the second metal substrate includes the second electrode part. a second effective area disposed on the second effective area and a second outer area formed outside the second effective area, wherein the third metal substrate is disposed outside the third effective area and the third effective area where the second electrode part is disposed a formed third outer region, wherein the first through-hole and the second through-hole are disposed in the first effective region, the third through-hole is disposed in the second effective region, and the fourth through-hole is disposed within the third effective area, the first through-hole is formed at a position corresponding to the third through-hole, and the second through-hole is formed at a position corresponding to the fourth through-hole, The first fastening member is disposed in the first through hole and the third through hole, and the second fastening member is disposed in the second through hole and the fourth through hole.

The first electrode part includes a plurality of first electrodes, and the one first metal substrate is the one of the surfaces of the first electrodes that are closest to the first through hole among the plurality of first electrodes and are adjacent to each other. Among the first hole arrangement region, which is a space formed by an imaginary line connecting the surfaces closest to the first through hole, and the surfaces of the first electrodes that are most adjacent to the second through hole and adjacent to each other among the plurality of first electrodes and a second hole arrangement area, which is a space formed by an imaginary line connecting the surfaces closest to the second through hole, and at least one of the first hole arrangement area and the second hole arrangement area has a size of the plurality of second holes. It may be 4 to 8 times the size of any one of the electrodes.

It may have a withstand voltage characteristic maintained without dielectric breakdown under a voltage of 1 kV to 2.5 kV of AC and a current of 1 mA for 10 seconds.

The second electrode part includes a plurality of second electrodes, and a shortest distance between any one of the plurality of first electrodes and the first through hole is between any one of the plurality of second electrodes and the third through hole. It can be greater than the shortest distance.

The second electrode part includes a plurality of second electrodes, and the second metal substrate is the second electrode among the surfaces of the second electrodes that are most adjacent to the third through hole among the plurality of second electrodes and are adjacent to each other. and a third hole arrangement area, which is a space formed by an imaginary line connecting the three through-holes and the closest surfaces, and the first hole arrangement area and the third hole arrangement area may be disposed at positions corresponding to each other.

It may further include an insulating insertion member disposed around at least one of the third through hole and the fourth through hole.

At least a portion of the insulating insertion member may be disposed between a wall surface of at least one of the third through hole and the fourth through hole and at least one of the first fastening member and the second fastening member.

The second metal substrate and the third metal substrate may be disposed to be spaced apart from each other.

The display device may further include a substrate contacting member that vertically overlaps with the spaced region between the second metal substrate and the third metal substrate and is disposed to contact at least a portion of the second metal substrate and the third metal substrate.

Further comprising a fourth metal substrate and a fifth metal substrate directly contacting the plurality of second insulating layers on the first metal substrate and arranged to be spaced apart from each other from the second metal substrate and the third metal substrate, and , the fourth metal substrate may include a fifth through hole, and the fifth metal substrate may include a sixth through hole.

The one first metal substrate further includes a seventh through-hole and an eighth through-hole, the fifth through-hole is formed at a position corresponding to the seventh through-hole, and the sixth through-hole is the 8 may be formed at positions corresponding to the through-holes.

It may further include a third fastening member disposed in the fifth through hole and the seventh through hole, and a fourth fastening member disposed in the sixth through hole and the eighth through hole.

It may further include an insulating insertion member disposed around at least one of the fifth through-hole and the sixth through-hole.

The second metal substrate to the fifth metal substrate vertically overlaps with a spaced region between the adjacent metal substrates, and the second metal substrate to the fifth metal substrate is disposed such that at least a portion of the adjacent metal substrates are in contact with each other. It may further include a substrate contact member.

The size of the first through hole and the size of the third through hole may be different from each other.

A size of the first through hole may be smaller than a size of the third through hole.

A diameter of the third through hole may be 1.1 times to 2 times a diameter of the first through hole.

A third insulating layer disposed between the first insulating layer and the first electrode part and in direct contact with the first insulating layer may be further included.

The plurality of second insulating layers may be disposed to be spaced apart from each other, and each of the plurality of second insulating layers may be in direct contact with the second electrode part.

The one first metal substrate may further include a ninth through hole disposed in the first outer region.

An area of the first insulating layer may be larger than an area of the first effective area and smaller than an area of the one first metal substrate.

A power generation module according to an embodiment of the present invention includes a thermoelectric module according to an embodiment of the present invention; and a cooling unit coupled to the one first metal substrate of the thermoelectric module and including a plurality of through-holes, wherein the first fastening member and the second fastening member include the plurality of through-holes of the cooling unit. are placed in each

According to an embodiment of the present invention, by fastening each other so as to occupy a part of the effective area of the high temperature part substrate and the low temperature part substrate, thermal deformation of the high temperature part substrate is reduced and stress is prevented from being concentrated in the bonding area, so that at a high temperature of the thermoelectric module can increase the reliability and durability of

According to an embodiment of the present invention, the power generation performance of the thermoelectric module can be maintained by enabling the optimal arrangement of a plurality of P-type and N-type thermoelectric legs without wasting space within a limited space in which each hole arrangement area is formed.

1 is a side view of a thermoelectric module according to a first embodiment of the present invention.
2 is a perspective view of a thermoelectric module according to a first embodiment of the present invention.
3 is an exploded perspective view of the thermoelectric module according to the first embodiment of the present invention.
4 is a side view illustrating a state in which the thermoelectric module according to the first embodiment of the present invention is installed in a cooling unit.
5 is a perspective view of a thermoelectric module according to a second embodiment of the present invention.
6 is a side view illustrating a state in which a thermoelectric module according to a second embodiment of the present invention is installed in a cooling unit.
7 is a diagram illustrating a first example of a method of disposing a first electrode and a second electrode on a plurality of first and second metal substrates.
FIG. 8 is a diagram illustrating a state in which a plurality of first electrodes and a plurality of second electrodes shown in FIG. 7 are overlapped.
9 to 12 are views illustrating various embodiments of a method of disposing the first electrode and the second electrode on the first metal substrate and the second metal substrate.
13 is a view showing a fastening structure of a power generation module according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical spirit of the present invention is not limited to some embodiments described, but may be implemented in various different forms, and within the scope of the technical spirit of the present invention, one or more of the components may be selected among the embodiments. It can be used by combining and substituted.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be generally understood by those of ordinary skill in the art to which the present invention pertains, unless specifically defined and described explicitly. It may be interpreted as a meaning, and generally used terms such as terms defined in advance may be interpreted in consideration of the contextual meaning of the related art.

In addition, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.

In the present specification, the singular form may also include the plural form unless otherwise specified in the phrase, and when it is described as "at least one (or one or more) of A and (and) B, C", it is combined with A, B, C It may include one or more of all possible combinations.

In addition, in describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used.

These terms are only used to distinguish the component from other components, and are not limited to the essence, order, or order of the component by the term.

And, when it is described that a component is 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also with the component It may also include a case of 'connected', 'coupled' or 'connected' due to another element between the other elements.

In addition, when it is described as being formed or disposed on "above (above) or under (below)" of each component, top (above) or under (below) is one as well as when two components are in direct contact with each other. Also includes a case in which another component as described above is formed or disposed between two components. In addition, when expressed as "upper (upper) or lower (lower)", the meaning of not only an upper direction but also a lower direction based on one component may be included.

1 is a side view of a thermoelectric module according to a first embodiment of the present invention, FIG. 2 is a perspective view of a thermoelectric module according to a first embodiment of the present invention, and FIG. 3 is a thermoelectric module according to a first embodiment of the present invention. is an exploded perspective view of the , and FIG. 4 is a side view illustrating a state in which the thermoelectric module according to the first embodiment of the present invention is installed in the cooling unit.

1 to 4 , the thermoelectric module includes one first metal substrate 110 , a first resin layer 120 , a plurality of first electrodes 130 , a plurality of P-type thermoelectric legs 140 , and a plurality of of N-type thermoelectric leg 150, a plurality of second electrodes 160, a second resin layer 170, one second metal substrate 180, a fastening member 190 and a heat insulating material 200, The first metal substrate 110 and the second metal substrate 180 may include at least one through hole through which the fastening member 190 passes.

According to another embodiment of the present invention, one thermoelectric module includes one first metal substrate 110 , a plurality of second metal substrates 180 , and one first metal substrate 110 and a plurality of second metal substrates. (180) disposed between the first resin layer 120, a plurality of first electrodes 130, a plurality of P-type thermoelectric legs 140, a plurality of N-type thermoelectric legs 150, a plurality of second electrodes ( 160 ) and a second resin layer 170 , and the first metal substrate 110 and the second metal substrate 180 may include at least one through hole for penetrating the fastening member 190 .

The first metal substrate 110 is formed in a plate shape. In addition, the first metal substrate 110 may be fixed on the cooling unit C or the heating unit (not shown). An embodiment according to the present invention to be described later will be described as an example in which the first metal substrate 110 is fixed to the cooling unit C. As shown in FIG. At this time, a hole 20h is formed in the cooling unit C at a position corresponding to the first through hole 111 formed in the first metal substrate 110 , and a fastening member 190 to be described later is provided through the first through hole ( 111) and may be inserted into the hole 20h. As in the embodiments of FIGS. 9 to 11 , the first metal substrate 110 has a third penetration even in the outer region, that is, in the region where the plurality of P-type thermoelectric legs 140 and the plurality of N-type thermoelectric legs 150 are not disposed. A hole 113 may be further formed, and in this case, the fastening member 190 has the third through hole 113 and a hole 20h of the cooling unit C formed at a position corresponding to the third through hole 113 . can be inserted into In addition, a heat dissipation pad (H) may be further disposed between the first metal substrate (110) and the cooling unit (C).

The first metal substrate 110 may include at least one of aluminum, an aluminum alloy, copper, and a copper alloy. At this time, when a voltage is applied to the thermoelectric module, the first metal substrate 110 absorbs heat according to the Peltier effect and acts as a low-temperature part, and the second metal substrate 180 emits heat to act as a high-temperature part. can On the other hand, when different temperatures are applied to the first metal substrate 110 and the second metal substrate 180 , electrons in the high temperature region move to the low temperature region due to the temperature difference, thereby generating thermoelectromotive force. This is called the Seebeck effect, and electricity is generated in the circuit of the thermoelectric element by the thermoelectromotive force.

The first metal substrate 110 includes at least one first through hole 111 . The first through hole 111 is formed at a position corresponding to the second through hole 181 formed in the second metal substrate 180 to be described later. In addition, the first through hole 111 may be formed at a predetermined distance from the outer portion of the first metal substrate 110 . At this time, while the fastening member 190 passes through the first through hole 111 and the second through hole 181 , the first metal substrate 1110 and the second metal substrate 180 are connected by the fastening member 190 . can be fixed. At this time, the diameter of the first through hole 111 formed on the first surface of the first metal substrate 110 in contact with the plurality of first electrodes 130 and the second metal substrate contacting the plurality of second electrodes 160 ( The diameters of the second through-holes 181 formed on the first surface of 180 may be the same, but the first metal substrate in contact with the plurality of first electrodes 130 according to the arrangement shape and position of the insulating insertion member, which will be described later. The diameter of the first through hole 111 formed on the first surface of 110 and the second through hole 181 formed on the first surface of the second metal substrate 180 in contact with the plurality of second electrodes 160 The diameters may be different from each other.

A first resin layer 120 is applied on the first metal substrate 110 , and a plurality of first electrodes 130 are disposed.

Here, the first metal substrate 110 may be in direct contact with the first resin layer 120 . To this end, the first metal substrate 110 is on the whole or part of the surface on which the first resin layer 120 is disposed, that is, the surface facing the first resin layer 120 of the first metal substrate 110 among both surfaces. Surface roughness may be formed. Accordingly, it is possible to prevent the problem that the first resin layer 120 is lifted during thermocompression bonding between the first metal substrate 110 and the first resin layer 120 . In this specification, surface roughness means unevenness, and may be used interchangeably with surface roughness.

The first resin layer 120 and the second resin layer 170 may be formed of a resin composition including a resin and an inorganic filler, and the resin may be an epoxy resin or a silicone resin. Here, the inorganic filler may be included in 68 to 88 vol% of the resin composition. When the inorganic filler is included in less than 68 vol%, the thermal conductivity effect may be low, and if the inorganic filler is included in more than 88 vol%, the adhesion between the resin layer and the metal substrate may be lowered, and the resin layer may be easily broken.

The epoxy resin may include an epoxy compound and a curing agent. In this case, the curing agent may be included in a volume ratio of 1 to 10 with respect to 10 volume ratio of the epoxy compound. Here, the epoxy compound may include at least one of a crystalline epoxy compound, an amorphous epoxy compound, and a silicone epoxy compound. The crystalline epoxy compound may include a mesogen structure. A mesogen is a basic unit of a liquid crystal and includes a rigid structure. And, the amorphous epoxy compound may be a conventional amorphous epoxy compound having two or more epoxy groups in the molecule, for example, may be a glycidyl ether product derived from bisphenol A or bisphenol F. Here, the curing agent may include at least one of an amine-based curing agent, a phenol-based curing agent, an acid anhydride-based curing agent, a polymercaptan-based curing agent, a polyaminoamide-based curing agent, an isocyanate-based curing agent, and a block isocyanate-based curing agent, and two or more types of curing agents may be used in combination.

The inorganic filler may include aluminum oxide and nitride, and the nitride may be included in 55 to 95 wt% of the inorganic filler, preferably 60 to 80 wt%. When nitride is included in this numerical range, thermal conductivity and bonding strength may be increased. Here, the nitride may include at least one of boron nitride and aluminum nitride. Here, the boron nitride may be a boron nitride agglomerate in which plate-shaped boron nitride is agglomerated.

In this case, the particle size D50 of the boron nitride agglomerates may be 250 to 350 μm, and the particle size D50 of the aluminum oxide may be 10 to 30 μm. When the particle size D50 of the boron nitride agglomerate and the particle size D50 of the aluminum oxide satisfy these numerical ranges, the boron nitride agglomerate and the aluminum oxide can be evenly dispersed in the epoxy resin composition, so that the entire resin layer has an even heat conduction effect and adhesive performance can have

According to an embodiment of the present invention, at least one of the first metal substrate 110 side and the second metal substrate 180 side may include a plurality of resin layers. For example, a third resin layer (not shown) may be further disposed between the first resin layer 120 and the plurality of first electrodes 130 . Alternatively, a fourth resin layer (not shown) may be further disposed between the plurality of second electrodes 160 and the second resin layer 170 . In this case, at least one of a composition, a Young's modulus, a coefficient of thermal expansion, and a thickness of the first resin layer 120 and the third resin layer (not shown) may be different from each other. At least one of a composition, a Young's modulus, a coefficient of thermal expansion, and a thickness of the second resin layer 170 and the fourth resin layer (not shown) may be different from each other. For example, when one of the first resin layer 120 and the third resin layer (not shown) is a resin composition, the other is a resin composition having at least one different composition, Young's modulus, coefficient of thermal expansion, and thickness, or aluminum oxide It may be a layer or include a composite including silicon and aluminum. Here, the composite may be at least one of an oxide, a carbide, and a nitride including silicon and aluminum. For example, the composite may include at least one of an Al-Si bond, an Al-O-Si bond, a Si-O bond, an Al-Si-O bond, and an Al-O bond. As such, the composite including at least one of an Al-Si bond, an Al-O-Si bond, a Si-O bond, an Al-Si-O bond, and an Al-O bond has excellent insulation performance, and thus high withstand voltage performance can get Alternatively, the composite may be an oxide, carbide, or nitride that further contains titanium, zirconium, boron, zinc, or the like along with silicon and aluminum. To this end, the composite may be obtained through a process of heat-treating after mixing aluminum with at least one of an inorganic binder and an organic/inorganic mixed binder. The inorganic binder may include, for example, at least one of _{silica (SiO 2} ), a metal alkoxide, boron oxide (B ₂ O ₃ ), and zinc oxide (ZnO _{2 ).} Inorganic binders are inorganic particles, but when they come into contact with water, they become sol or gel, which can serve as a binding agent. At this time, _{at least one of silica (SiO 2} ), metal alkoxide, and boron oxide (B ₂ O ₃ ) serves to increase adhesion to the metal, and zinc oxide (ZnO ₂ ) increases the strength of the resin layer and increases thermal conductivity. can play a role In the present specification, the withstand voltage performance may refer to a characteristic maintained without dielectric breakdown for a predetermined period under a predetermined voltage and a predetermined current. For example, if the voltage of AC 2.5kV and the current of 1mA are maintained without breakdown for 10 seconds, the withstand voltage can be said to be 2.5kV.

Alternatively, when one of the second resin layer 170 and the fourth resin layer (not shown) is a resin composition, the other is a resin composition having at least one different composition, Young's modulus, coefficient of thermal expansion, and thickness, or an aluminum oxide layer, or , may include a composite including silicon and aluminum. Here, each resin layer may be mixed with an insulating layer.

The plurality of first electrodes 130 is disposed on the first resin layer 120 . A plurality of P-type thermoelectric legs 140 and a plurality of N-type thermoelectric legs 150 are disposed on the first electrode 130 . In this case, the first electrode 130 is electrically connected to the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 . Here, the first electrode 130 may include at least one of copper (Cu), aluminum (Al), silver (Ag), and nickel (Ni).

The plurality of P-type thermoelectric legs 140 and the plurality of N-type thermoelectric legs 150 are disposed on the first electrode 130 . In this case, the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 may be joined to the first electrode 130 by soldering.

In this case, the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 may be bismuth telluride (Bi-Te)-based thermoelectric legs including bismuth (Bi) and tellurium (Te) as main raw materials. P-type thermoelectric leg 140 is antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium with respect to 100wt% of the total weight A mixture containing 99 to 99.999 wt% of a bismuth telluride (Bi-Te)-based main raw material containing at least one of (Ga), tellurium (Te), bismuth (Bi) and indium (In) and Bi or Te 0.001 It may be a thermoelectric leg comprising 1 wt% to 1 wt%. For example, the main raw material is Bi-Se-Te, and may further include Bi or Te in an amount of 0.001 to 1 wt% of the total weight. N-type thermoelectric leg 150 is selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium with respect to 100wt% of the total weight A mixture containing 99 to 99.999 wt% of a bismuth telluride (Bi-Te)-based main raw material containing at least one of (Ga), tellurium (Te), bismuth (Bi) and indium (In) and Bi or Te 0.001 It may be a thermoelectric leg comprising 1 wt% to 1 wt%. For example, the main raw material is Bi-Sb-Te, and may further include Bi or Te in an amount of 0.001 to 1 wt% of the total weight.

The P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 may be formed in a bulk type or a stack type. In general, the bulk-type P-type thermoelectric leg 140 or the bulk-type N-type thermoelectric leg 150 heat-treats a thermoelectric material to manufacture an ingot, pulverizes the ingot and sieves to obtain powder for the thermoelectric leg, and then It can be obtained through the process of sintering and cutting the sintered body. The laminated P-type thermoelectric leg 140 or the laminated N-type thermoelectric leg 150 is formed by applying a paste containing a thermoelectric material on a sheet-shaped substrate to form a unit member, and then stacking and cutting the unit member. can be obtained

In this case, the pair of P-type thermoelectric legs 140 and N-type thermoelectric legs 150 may have the same shape and volume or may have different shapes and volumes. For example, since the electrical conductivity characteristics of the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 are different, the height or cross-sectional area of the N-type thermoelectric leg 150 is determined by the height or cross-sectional area of the P-type thermoelectric leg 140 . may be formed differently.

The performance of the thermoelectric element according to an embodiment of the present invention may be expressed as a thermoelectric figure of merit. The thermoelectric figure of merit (ZT) may be expressed as in Equation (1).

Here, α is the Seebeck coefficient [V/K], σ is the electrical conductivity [S/m], and α ² σ is the power factor (Power Factor, [W/mK ² ]). And, T is the temperature, and k is the thermal conductivity [W/mK]. k can be expressed as a·cp·ρ, a is the thermal diffusivity [cm ² /S], cp is the specific heat [J/gK], ρ is the density [g/cm ³ ].

In order to obtain the thermoelectric performance index of the thermoelectric element, the Z value (V/K) is measured using a Z meter, and the Seebeck index (ZT) can be calculated using the measured Z value.

The P-type thermoelectric leg 140 or the N-type thermoelectric leg 150 may have a cylindrical shape, a polygonal column shape, an elliptical column shape, or the like. Alternatively, the P-type thermoelectric leg 140 or the N-type thermoelectric leg 150 may have a stacked structure. For example, the P-type thermoelectric leg or the N-type thermoelectric leg may be formed by stacking a plurality of structures coated with a semiconductor material on a sheet-shaped substrate and then cutting them. Accordingly, it is possible to prevent material loss and improve electrical conductivity properties.

The plurality of second electrodes 160 are disposed on the plurality of P-type thermoelectric legs 140 and the plurality of N-type thermoelectric legs 150 . In this case, the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 may be joined to the second electrode 160 by soldering. Here, the second electrode 160 may include at least one of copper (Cu), aluminum (Al), silver (Ag), and nickel (Ni).

The second resin layer 170 is disposed on the plurality of second electrodes 160 . In addition, a plurality of second metal substrates 180 are disposed on the second resin layer 170 .

The second metal substrate 180 is disposed on the second resin layer 170 to face one first metal substrate 110 . The second metal substrate 180 may be made of aluminum, an aluminum alloy, copper, or a copper alloy.

The area of the first metal substrate 110 and the area of the second metal substrate 180 may be the same. As described above, when the third through hole 113 is formed in the first metal substrate 110, the The area of the first metal substrate 110 may be larger than the area of the second metal substrate 180 . In this case, the ratio of the area of the second metal substrate 180 to the area of the first metal substrate 110 may be 0.50 to 0.95, preferably 0.60 to 0.90, and more preferably 0.70 to 0.85.

As another embodiment, in an application field requiring a relatively larger area or when it is necessary to further minimize the effect of thermal deformation, the second metal substrate 180 is divided into a plurality of parts for one first metal substrate 110 . can be provided. In this case, the ratio of the area of each second metal substrate 180 to the area of the first metal substrate 110 may be 0.10 to 0.50, preferably 0.15 to 0.45, more preferably 0.2 to 0.40. For example, two second metal substrates 180 may be disposed on one first metal substrate 110 . In this case, the second metal substrate 180 may be disposed to be spaced apart from each other. For example, the first metal substrate 110 has an area of 100 mm×100 mm, the second metal substrate 180 has an area of 45 mm×100 mm, respectively, and the distance between the second metal substrates 180 spaced apart from each other may be about 10 mm.

As another example, four second metal substrates 180 may be disposed on one first metal substrate 110 . In this case, the second metal substrate 180 may be disposed to be spaced apart from each other. For example, the first metal substrate 110 has an area of 100 mmx100 mm, the second metal substrate 180 has an area of 45 mmx45 mm, respectively, and the distance between the second metal substrates 180 spaced apart from each other may be about 10 mm.

As another example, an interval between the plurality of second metal substrates 180 may be less than 5 mm. For example, the first metal substrate 110 has an area of 100 mm×100 mm, the second metal substrate 180 has an area of 49.5 mm×49.5 mm, and the interval between the plurality of second metal substrates 180 is 2 mm, and a plurality of The connecting member 230 connecting between the second metal substrates 180 may be formed to have a width of 2 mm.

In this case, the thickness of the first metal substrate 110 may be 0.1 mm to 2 mm. In addition, the thickness of the second metal substrate 180 may be the same as or greater than the thickness of the first metal substrate 110 . When the thickness of the second metal substrate 180 is greater than the thickness of the first metal substrate 110 , the thickness of the second metal substrate 180 may be 1.1 to 2.0 times the thickness of the first metal substrate 110 . Here, since the second metal substrate 180 may be bent by the fastening member 190 , the thickness may be greater than that of the first metal substrate 110 .

At least one second through hole 181 is formed in the second metal substrate 180 . In this case, the second through-holes 181 may be formed to occupy a portion of the effective region B1 that is an inner region of the outer region B2 of each second metal substrate 180 . Here, the effective region may be defined as a region in which a plurality of P-type thermoelectric legs 140 and N-type thermoelectric legs 150 that can substantially implement the Peltier effect or the Seebeck effect are disposed, and the terminal electrode is disposed in the effective region. can be placed. The terminal electrode may extend from the effective area so as to be connected to an external terminal or electric wire, and includes at least one of the plurality of P-type thermoelectric legs 140 and N-type thermoelectric legs 150 or the plurality of first electrodes 130 and It may be electrically connected to at least one of the plurality of second electrodes 160 . In this region, each of the plurality of first electrodes 130 and the plurality of second electrodes 160 may vertically overlap each other. The second through-holes 181 formed in the second metal substrate 180 may be formed at a predetermined distance from the outer edge of the second metal substrate 180 , and when there are a plurality of second through-holes 181 , the second They may be spaced apart from each other at equal intervals from the outside of the metal substrate 180 . The second through-hole 181 is disposed to overlap the first through-hole 111 , and the fastening member 190 may pass through the corresponding first through-hole 111 and the second through-hole 181 . . As such, the fastening member 190 occupies a portion of the effective regions A1 and B1 of the first and second metal substrates 110 and 180 of the first and second metal substrates 110 and 180. By fixing them together, it is possible to reduce thermal deformation and prevent stress concentration in the joint area.

Although not shown, a portion of the outer regions A2 and B2 of each substrate, that is, the edge region of the substrate, so as not to affect the effective regions A1 and B1 of the first metal substrate 110 and the second metal substrate 180 . , the fixing force between each substrate can be relatively high, but in applications that use the Seebeck effect by exposing the thermoelectric module to a high temperature environment of 100°C or higher, or the Peltier effect that generates heat of 100°C or more, the low-temperature region The thermoelectric module may be damaged due to a difference in the relative amount of heat received by the high-temperature region and the high-temperature region. For example, in the case of a thermoelectric module using the Seebeck effect, the high-temperature metal substrate is expanded by heat, and the low-temperature metal substrate is contracted by a separate cooling member, so that thermal stress is concentrated in the edge region of the substrate. At this time, the generated thermal stress is also transferred to the electrode, thermoelectric leg, and resin layer disposed between each substrate, so that peeling and cracking may occur from a weak interface, and consequently, thermoelectric efficiency may be sharply reduced due to damage to the thermoelectric module. Although not shown, a sealing member may be further disposed between the first metal substrate 110 and the second metal substrate 180 . The sealing member is disposed between the first metal substrate 110 and the plurality of second metal substrates 180 , the first electrode 130 , the P-type thermoelectric leg 140 , the N-type thermoelectric leg 150 , and the second electrode 160 . ) can be placed on the side of the Accordingly, the first electrode 130 , the P-type thermoelectric leg 140 , the N-type thermoelectric leg 150 , and the second electrode 160 may be sealed from external moisture, heat, contamination, and the like. Here, the sealing member is the outermost of the plurality of first electrodes 130 , the outermost of the plurality of P-type thermoelectric legs 140 and the plurality of N-type thermoelectric legs 150 , and the outermost of the plurality of upper electrodes 160 . It may include a sealing case disposed to be spaced apart from the outer side by a predetermined distance, a sealing material disposed between the sealing case and the first metal substrate 110 , and a sealing material disposed between the sealing case and the second metal substrate 180 . In this way, the sealing case may be in contact with the first metal substrate 110 and the second metal substrate 180 through the sealing material. Accordingly, when the sealing case is in direct contact with the first metal substrate 110 and the second metal substrate 180, heat conduction occurs through the sealing case, and as a result, the first metal substrate 110 and the second metal substrate ( 180) can prevent the problem of lowering the temperature difference between them. Here, the sealing material may include at least one of an epoxy resin and a silicone resin, or a tape in which at least one of an epoxy resin and a silicone resin is applied to both surfaces. The sealing material serves to airtight between the sealing case and the first metal substrate 110 and between the sealing case and the second metal substrate 180, the first electrode 130, the P-type thermoelectric leg 140, the N-type thermoelectric The sealing effect of the leg 150 and the second electrode 160 may be increased, and may be mixed with a finishing material, a finishing layer, a waterproofing material, a waterproofing layer, and the like. Here, the sealing material for sealing between the sealing case and the first metal substrate 110 is disposed on the upper surface of the first metal substrate 110, and the sealing material for sealing between the sealing case and the second metal substrate 180 is the second metal It may be disposed on a side surface of the substrate 180 . To this end, the area of the first metal substrate 110 may be larger than the total area of the second metal substrate 180 . Meanwhile, a guide groove for drawing out a lead wire connected to the electrode may be formed in the sealing case. To this end, the sealing case may be an injection-molded product made of plastic or the like, and may be mixed with the sealing cover. However, the above description of the sealing member is merely an example, and the sealing member may be modified in various forms. Although not shown, an insulating material may be further included to surround the sealing member. Alternatively, the sealing member may include a heat insulating component.

Referring to FIG. 7 , a first hole arrangement region 112 is formed in the first metal substrate 110 adjacent to the first through hole 111 . The first hole arrangement region 112 may be defined as a space formed by virtual lines 201 , 202 , 203 , and 204 that are closest to the first through hole 111 and connect surfaces of adjacent electrodes. The first hole arrangement region 112 may be formed in a polygonal shape, preferably in a rectangular shape. In this case, the plurality of first electrodes 130 may not be disposed in the first hole arrangement region 112 . In addition, a second hole arrangement region 182 is formed in the second metal substrate 180 adjacent to the second through hole 181 on a surface facing the first metal substrate 110 . The second hole arrangement region 182 may be defined as a space formed by virtual lines 211 , 212 , 213 , and 214 that are closest to the second through hole 181 and connect surfaces of adjacent electrodes. The second hole arrangement area 182 may be formed in a polygonal shape, preferably in a rectangular shape. In this case, the plurality of second electrodes 160 may not be disposed in the second hole arrangement region 182 .

The fastening member 190 fixes the first metal substrate 110 and the at least one second metal substrate 180 . At this time, a portion of the fastening member 190 passes through the second through hole 181 and the first through hole 111 , and an end thereof is inserted and coupled to the hole 20h of the cooling unit C.

Referring to FIG. 4 , the fastening member 190 may include a first member 191 and a second member 192 . The first member 191 passes through the second through hole 181 and the first through hole 111 , and one end of the first member 191 is embedded and fixed in the cooling unit C . In this case, a screw thread may be formed on the outer periphery of the first member 191 . The diameter of the first member 191 may be the same as the diameter of the second through hole 181 and the first through hole 111 or be formed smaller than the diameter of the second through hole 181 and the first through hole 111 . can

The second member 192 extends from the other end of the first member 191 and is formed to have a larger diameter than the diameter of the second through hole 181 . The second member 192 prevents the second metal substrate 180 from being separated from the first metal substrate 110 .

When there are a plurality of second metal substrates 180 , the heat insulating material 200 may be disposed in a space between the plurality of second metal substrates 180 . Here, the heat insulating material 200 may include at least one of an epoxy resin, a silicone resin, and a ceramic wool, and the heat insulating material 200 may be mixed with the above-described sealing member and a connection member 230 to be described later.

The heat sink 220 may be disposed on the second metal substrate 180 . For example, the heat sink 220 may be disposed on a surface opposite to the surface on which the second resin layer 170 is disposed among both surfaces of the second metal substrate 180 . In this case, the second metal substrate 180 and the heat sink 220 may be integrally formed. Although not shown, a heat sink may also be formed on the first metal substrate 110 . The heat sink 220 may have a structure in which a plurality of flat substrates 221 each having a flat plate shape are disposed in parallel, and a space between the planar substrates 221 forms an air flow path. In this case, the distance between the planar substrates 221 may be less than 10 mm.

Hereinafter, the thermoelectric module 20 according to another embodiment of the thermoelectric module will be described with reference to FIGS. 5 and 6 .

5 is a perspective view of a thermoelectric module according to a second embodiment of the present invention, and FIG. 6 is a side view illustrating a state in which the thermoelectric module according to the second embodiment of the present invention is installed in a cooling unit.

5 and 6 , the thermoelectric module 20 may further include a connection member 230 connecting the plurality of second metal substrates 180 to each other.

The connecting member 230 may be a glue for bonding between the plurality of second metal substrates 180 . In this case, the thermoelectric module 20 may omit the thermal insulation treatment in the space between the plurality of second metal substrates 180 , but, as described above, between the first metal substrate 110 and the second metal substrate 180 . The insulator 200 may be disposed.

Although not shown, the thermoelectric module may be formed to be connected to each other by omitting the connecting member 230 and extending members respectively extending from a portion of the plurality of second metal substrates 180 .

In this case, the extension member may be formed to be smaller than the thickness of the second metal substrate 180 . For example, the thickness of the second metal substrate 180 may be 0.2 mm to 4 mm, and the thickness of the extension member may be 0.1 mm to 2 mm. Here, a ratio of the thickness of the plurality of second metal substrates to the thickness of the extension member may be 1 to 2 or less.

One surface of the connecting member 230 may be depressed with respect to one surface of the second metal substrate 180 to form a groove 241 . In this case, the connecting member 230 may be formed in a cross shape. For example, when the area of the first metal substrate 110 is 100mmx100mm, the area of the second metal substrate 180 is 45mmx45mm and the thickness is 0.2mm to 4mm, the connecting member 230 has a width of 10mm and a thickness is 0.1 mm to 2 mm, and the groove formed by the connecting member 230 may have a depth of 0.1 mm to 2 mm or less. As such, as the groove is formed due to the thickness difference between the connecting member 230 and the second metal substrate 180 , the thickness of the central portion of the second metal substrate 180 is reduced and the thermal deformation of the second metal substrate 180 is alleviated. can have

In the present specification, the insulating material 200, the connecting member 230, and the extension member are collectively referred to as a connecting member disposed between a plurality of second metal substrates 180 spaced apart from each other to connect the plurality of second metal substrates 180. , and the connecting member may be an insulating member including an insulating material.

Hereinafter, various embodiments of a method of disposing the plurality of first electrodes 130 and the plurality of second electrodes 160 will be described with reference to FIGS. 7 to 11 .

7 is a view showing an embodiment of a method of disposing a first electrode and a second electrode on the first metal substrate 110 and the second metal substrate 180, and FIG. 8 is a plurality of the plurality of electrodes shown in FIG. It is a view showing a state in which the first electrode and the plurality of second electrodes are superimposed on each other, and FIGS. 9 to 11 are the first electrode and the second electrode on the first metal substrate 110 and the second metal substrate 180 . It is a view showing various embodiments of a method of disposing.

7 to 11 , in the plurality of first electrodes 130 , the first metal substrate 110 is disposed on one surface facing the second metal substrate 180 , and the plurality of second electrodes 160 is The second metal substrate 180 is disposed on one surface facing the first metal substrate 110 . In this case, the plurality of first electrodes 130 may be disposed leaving the first hole arrangement area 112 empty, and the plurality of second electrodes may be disposed leaving the second hole arrangement area 182 empty. The position of the arrangement area 112 and the position of the second hole arrangement area 182 correspond to each other.

Here, each of the plurality of first electrodes 130 and the plurality of second electrodes 160 is formed in a rectangular shape, so that a long width W1 and a short width W2 are divided. At this time, the ratio of the long width W1 to the short width W2 of the first electrode 130 and the second electrode 160 may be variable depending on the shape of the legs to be arranged, and preferably the first electrode 130 and The ratio of the long width W1 to the short width W2 of the second electrode 160 may be 2.05 to 4.50. In this specification, the direction of the long width may be referred to as a longitudinal direction.

Although not shown, when the through-holes 111 and 181 are not formed in the effective regions of the first metal substrate 110 and the second metal substrate 180 , the lengthwise directions of the plurality of first electrodes 130 are all first. It may be arranged in one direction (Y). In this case, at least a portion of the electrodes disposed in two columns or two rows opposite to each other in the edge region of the effective region among the plurality of second electrodes 160 in the second direction (X) perpendicular to the first direction (Y) , and the remaining electrodes may move from the plurality of first electrodes 130 by the short width W2 of the electrodes so that at least some of them overlap. Through this, all of the plurality of P-type and N-type thermoelectric legs between the first metal substrate 110 and the second metal substrate 180 may be connected in series.

When at least one through-hole 111, 181 is formed in the effective region of the first metal substrate 110 and the second metal substrate 180 according to the embodiment of the present invention, the first electrode 130 and the plurality of Among the two electrodes 160 , the longitudinal direction of the electrodes excluding the electrode in the edge region may be arranged in a mixture of the first direction Y and the second direction X perpendicular to the first direction Y.

At this time, among the plurality of first electrodes 130 or the plurality of second electrodes 160 , at least two electrodes excluding the edge region are disposed in the second direction X perpendicular to the first direction Y, and the remaining The electrodes may be disposed in a first direction (Y) perpendicular to the second direction (X).

At least one electrode adjacent to the first hole arrangement area 112 or the second hole arrangement area 182 is disposed so that a longitudinal direction thereof faces the second direction X, and the other electrode adjacent to the at least one hole arrangement area 182 has a length direction as well. It may be disposed to face the second direction (X). In this case, the at least two first electrodes 130 and the at least two second electrodes 160 may not overlap each other or may partially overlap each other.

In detail, among the plurality of first electrodes 130 adjacent to the first hole arrangement region 112 , at least two ( 130a , 130b ) may be disposed so that the longitudinal direction faces the second direction (X). In addition, the remaining first electrodes 130 may be disposed so that the longitudinal direction faces the first direction (Y).

In this case, at least two of the plurality of second electrodes 160 adjacent to the second hole arrangement region 182 may be disposed in the second direction (X). Also, two rows facing each other among the plurality of second electrodes 160c disposed at the edge of the effective area may also be disposed in the second direction X in the longitudinal direction. In addition, the remaining second electrodes 160 may be disposed so that the longitudinal direction faces the first direction (Y). In this case, the first electrodes 130a and 130b disposed in the second direction X and the second electrodes 160a and 160b disposed in the second direction may not overlap or partially overlap each other. Here, the arrangement of the plurality of first electrodes 130 and the plurality of second electrodes 160 may be applied interchangeably.

In more detail, as shown in FIG. 8 , at least two of the plurality of first electrodes 130 except for the edge region are imaginary lines 201 and 202 defining the first hole arrangement region 112 . , 203 , 204 may be disposed in the second direction X by overlapping at least a portion of the virtual space H1 or H2 formed by the extension line, and excluding the edge region among the plurality of second electrodes 160 . At least two of them overlap the virtual space H3 or H4 formed by the extension lines extending from the respective virtual lines 211 , 212 , 213 and 214 defining the second hole arrangement area 182 and at least partially overlap with the second second hole arrangement area 182 . It may be disposed in the direction (X). Through this, it is possible to optimally arrange a plurality of P-type and N-type thermoelectric legs within a limited space in which each hole arrangement area is formed. Here, the number of electrodes disposed in the second direction X may increase according to the number, position, and shape of the first hole arrangement region 112 and the second hole arrangement area 182 . In this case, the number of electrodes disposed in the second direction (X) may be a multiple of two, and at least two of the electrodes disposed in the second direction (X) may be disposed to overlap at least a portion of the electrodes H1 to H4. have.

In the present specification, electrode arrangement shapes of the plurality of first electrodes 130 and the plurality of second electrodes 160 may be interchangeably applied, and the first direction Y and the second direction X are not limited thereto. .

Referring to FIG. 9 , two (130d, 130f) adjacent to the first hole arrangement region 112 among the plurality of first electrodes 130 may be arranged so that the longitudinal direction is directed to the second direction (X), The two pieces 130d and 130f and the two adjacent pieces 130c and 130e may also be arranged in the second direction (X) so that the longitudinal directions are the same. In addition, the remaining first electrodes 130 may be disposed so that the longitudinal direction faces the first direction (Y).

At this time, two (160d, 160e) adjacent to the second hole arrangement region 182 among the plurality of second electrodes 160 may be arranged so that the longitudinal direction is directed to the second direction (X), and the second hole arrangement area The other two regions 160f and 160g adjacent to the region 182 may also be arranged in the second direction X so that their lengthwise directions are the same. In addition, the second electrodes 160h disposed in two rows opposite to each other in the edge region may also be disposed so that the longitudinal direction thereof faces the second direction. In addition, the remaining second electrodes 160 may be disposed so that the longitudinal direction faces the first direction (Y).

Referring to FIG. 10 , a plurality of first through-holes 111 and a plurality of second through-holes 181 may be formed in the first metal substrate 110 and the second metal substrate 180 . Accordingly, the first hole The arrangement area 112 and the second hole arrangement area 182 may also be formed in plurality. In this case, two (130g, 130h) adjacent to each of the first hole arrangement regions 112 among the plurality of first electrodes 130 may be arranged so that the longitudinal direction faces the second direction X, and the two Two (130i, 130j) adjacent to (130g, 130h) may also be disposed in the second direction (X) so that the longitudinal direction is the same. In this case, a plurality of first hole arrangement regions 112 may be formed, and multiples of two of the plurality of first electrodes 130 may be arranged to face the second direction X. In more detail, at least eight (130g, ..., 130n) of the plurality of first electrodes 130 may be disposed to face the second direction (X). In addition, the rest of the first electrodes 130 may be arranged so that the longitudinal direction is directed to the first direction (Y).

At this time, two of the second electrodes 160 , 160i and 160j adjacent to each second hole arrangement region 182 in the first direction (Y) may be disposed so that the longitudinal direction is directed in the second direction (X). In addition, the other two pieces 160k and 160l adjacent to the second hole arrangement area 182 may also be arranged in the second direction X so that the longitudinal direction thereof is the same.

In this case, the second hole arrangement region 182 may be formed in plurality, and multiples of two of the plurality of second electrodes 160 may be arranged so that the longitudinal direction is directed in the second direction (X). In more detail, at least eight (160i, ..., 160p) of the plurality of second electrodes 160 may be disposed so that the longitudinal direction is directed to the second direction (X). In addition, the second electrodes 160q disposed in two rows opposite to each other in the edge region may also be disposed so that the longitudinal direction thereof is directed in the second direction X. In addition, the remaining second electrodes 160 may be disposed so that the longitudinal direction is directed to the first direction (Y).

Referring to FIG. 11 , a plurality of first hole arrangement regions 112 are formed, and four pieces 130o, ... ,130r) may be arranged so that the longitudinal direction is directed to the second direction (X). Here, a plurality of electrodes may be disposed between the first hole arrangement region 112 and the first electrodes 130o, ..., 130r. However, the first electrodes 130o, ..., 130r overlap at least a part of a virtual space formed by an extension line extending from each virtual line defining the first hole arrangement area 112 to form a second direction ( X) can be arranged. In addition, four (130s, ..., 130v) adjacent to the other first hole arrangement region 112 in the first direction among the plurality of first electrodes 130 may be arranged in the second direction (X). have.

At this time, among the second electrodes 160 , each of the second hole arrangement regions 182 and the four adjacent in the first direction Y ( 160r, ..., 160u ) ( 160v , .., 160y ) have a longitudinal direction. It may be disposed to face in the second direction (X).

Referring to FIG. 12 , a plurality of first through-holes 111 and a plurality of second through-holes 181 may be formed in the first metal substrate 110 and the second metal substrate 180 . Accordingly, the first hole The arrangement area 112 and the second hole arrangement area 182 may also be formed in plurality. For example, the first metal substrate 110 may include four first through holes 111 and four first hole arrangement regions 112 , and the second metal substrate 180 includes four second through holes 112 . It may include a through hole 181 and four second hole arrangement regions 182 .

At this time, two (130-1, 130-2) adjacent to each of the first hole arrangement region 112 among the plurality of first electrodes 130 may be arranged so that the longitudinal direction faces the second direction (X). , the other two ( 130 - 3 , 130 - 4 ) adjacent to each of the first hole arrangement regions 112 may also be arranged so that the longitudinal direction faces the second direction (X). Accordingly, multiples of 2 among the plurality of first electrodes 130 may be disposed to face the second direction X. In more detail, at least 16 of the plurality of first electrodes 130 ( 130 - 1 , ... , 130 - 4 ) may be disposed to face the second direction (X). In addition, the remaining first electrodes 130 may be disposed so that the longitudinal direction is directed to the first direction (Y).

Also, adjacent to at least one of the four first electrodes 130 - 1 , ..., 130 - 4 disposed to face the second direction X adjacent to any one of the first hole arrangement regions 112 . 2n first electrodes 130 - 2n (n is an integer greater than or equal to 1) may also be disposed so that the longitudinal direction is directed in the second direction (X). Here, the positions at which the 2n first electrodes 130 - 2n are arranged may be variously modified according to the arrangement structure of the plurality of second electrodes 160 .

Also, a plurality of electrodes may be disposed between the first hole arrangement region 112 and the 2n first electrodes 130 - 2n. However, the 2n first electrodes 130 - 2n overlap at least a portion of a virtual space formed by an extension line extending from each virtual line defining the first hole arrangement area 112 in the second direction (X). can be placed.

In FIG. 12 , 2n first electrodes 130 - 2n are exemplified to be disposed in the second direction (X), but the present invention is not limited thereto, and 2n second electrodes may be disposed in the first direction (Y). have.

The first resin layer 120 is disposed between the first metal substrate 110 and the plurality of first electrodes 130 , and the second resin layer 120 is disposed between the second metal substrate 180 and the plurality of second electrodes 160 . Although the resin layer 170 is shown only in FIG. 12 , it is not limited thereto, and is omitted for convenience of explanation in the embodiments of FIGS. 7 to 11 , and the first resin layer 120 having the same or similar structure. and the second resin layer 170 may also be applied to the embodiments of FIGS. 7 to 11 .

Similarly, although the terminal electrode 500 is illustrated only in FIG. 12 , the present invention is not limited thereto, and the terminal electrode 500 having the same or similar structure may also be applied to the embodiments of FIGS. 7 to 11 .

7 to 12 , two rows disposed in the second direction (X) to face each other in the edge region are included in the first electrode 130 disposed on the first metal substrate 110 or , or may be included in the second electrode 160 disposed on the second metal substrate 180 .

At this time, the diameter d1 of the first through hole 111 formed on the first surface of the first metal substrate 110 in contact with the plurality of first electrodes 130 and the second contact with the plurality of second electrodes 160 . The diameter d2 of the second through-holes 181 formed on the first surface of the metal substrate 180 may be the same, but the plurality of first electrodes 130 may vary depending on the arrangement shape and position of the insulating insertion member to be described later. The diameter d1 of the first through-hole 111 formed on the first surface of the first metal substrate 110 in contact with the first surface of the second metal substrate 180 in contact with the plurality of second electrodes 160 The diameter d2 of the formed second through-holes 181 may be different from each other.

Meanwhile, as shown in FIGS. 7 to 12 , the area of the first hole arrangement region 112 is 4 times or more, preferably 6 times or more, more preferably 8 times the area of one first electrode 130 . It can be more than double. When the area of the first hole arrangement region 112 is less than 4 times the area of one first electrode 130 , a current flows to the first metal substrate 110 through the first through hole 111 under a high voltage of 1 kV or more AC. The movement may cause electrical breakdown of the thermoelectric module. Therefore, it is important to secure a sufficient insulation distance in order to prevent electrical breakdown of the thermoelectric module in the field of application under high voltage. When the area of the first hole arrangement region 112 is 8 times or more of the area of one first electrode 130 , electrical breakdown does not occur even under a high voltage of 2.5 kV or more AC. Similarly, the area of the second hole arrangement region 182 formed in the second metal substrate 180 is also 4 times or more, preferably 6 times or more, more preferably 8 times the area of one second electrode 160 . It can be more than double.

In addition, as shown in FIGS. 7 to 12 , all of the electrodes disposed closest to the first edge (not shown) of the first metal substrate 110 among the plurality of first electrodes 130 may be periodically disposed. In addition, the path between the start point and the end point of an imaginary line connecting the first edge of the first metal substrate 110 and the electrode surfaces disposed closest to it may be disposed to be a straight line without a bending region. That is, in all the first electrodes 130 closest to the first edge of the first metal substrate 110 , the first edge of the first metal substrate 110 among the four electrode surfaces of each first electrode 130 and This may mean that the closest electrode surfaces are disposed at the same distance as the first edge of the first metal substrate 110 without a removed region along one direction. For example, when the path between the start point and the end point of an imaginary line connecting the first edge of the first metal substrate 110 and the electrode surfaces disposed closest to each other is a straight line, the first one of the plurality of first electrodes 130 is a straight line. It may mean that all electrodes in a column (not shown) are periodically arranged. Accordingly, it is possible to reduce the complexity of a process when disposing the plurality of first electrodes 130 on the first metal substrate 110 , and the second electrodes 160 and the second electrodes 160 disposed on the second metal substrate 180 , The arrangement structure of the thermoelectric legs disposed between the first electrodes 130 and the second electrodes 160 may be simplified. In addition, since the shortest distance between the edge of the first metal substrate 110 and the first electrodes 130 disposed closest to the edge of the first metal substrate 110 is constantly maintained, the first metal substrate 110 The first electrodes 130 disposed closest to the edge of may have uniform electrical characteristics.

If the path between the start point and the end point of the imaginary line connecting the first edge of the first metal substrate 110 and the electrode surfaces disposed closest to each other includes a bent region, Some of the electrodes in row 1 are removed or a recessed area is included, which may mean that the periodicity of the arrangement is lost. The electrode surface disposed closest to the first edge of the first metal substrate 110 in the bent region may be an electrode surface disposed in the second column (not shown), which is the next column of the first column. Here, the second row is a row disposed farther from the first edge of the first metal substrate 110 compared to the first row, and may not be the outermost row. Although it is possible to arrange the first electrodes 130 to include a bent region in order to additionally arrange the through-hole, according to this, as described above, in the application field under a high voltage, a sufficient insulation distance is not secured, so that the electrical Destruction may occur or an effective area of the first electrode may be reduced, and consequently, the efficiency of the thermoelectric module may be reduced.

Similarly, the electrodes (N-th column) closest to the second edge (not shown) facing the first edge of the first metal substrate 110 among the plurality of first electrodes 130 (the N-th column), the plurality of first electrodes Among the electrodes (first row) closest to the third edge (not shown) between the first edge and the second edge of the first metal substrate 110 of the first metal substrate 110 and the first of the plurality of first electrodes 130 The fourth edge (not shown) and the closest electrodes (M-th row) facing the third edge of the metal substrate 110 are all imaginary connecting each edge and the closest electrode surfaces of the first metal substrate 110 . The path between the start point and the end point of the line may be arranged to be a straight line without a bending region, but according to the design of the terminal electrode arrangement, any one of the outermost columns or the outermost rows, for example, the first column, the Nth column, Only one of the first row and the M-th row may have an exceptional path. For example, the terminal electrode is connected to the first electrode 130 disposed in any one of the first column, the N-th column, the first row, and the M-th row, which is the outermost column or the outermost row, or It may extend from the first electrode 130 disposed in any one of the N column, the first row, and the Mth row. Accordingly, among the outermost columns and outermost rows, except for one column or row in which the terminal electrode is disposed, the remaining columns or rows may be arranged to have a predetermined distance from each corresponding edge of the first metal substrate 110 . have.

13 illustrates a junction structure of a thermoelectric element according to an embodiment of the present invention.

Referring to FIG. 13 , the thermoelectric element 100 may be fastened by a plurality of fastening members 400 . The plurality of fastening members 400 fasten the heat sink 220 and the second metal substrate 180, or the heat sink 220, the second metal substrate 180 and the first metal substrate (not shown), or , the heat sink 220 , the second metal substrate 180 , or the first metal substrate (not shown) and the cooling unit (not shown), or the second metal substrate 180 , the first metal substrate (not shown) and the cooling unit (not shown), or the second metal substrate 180 and the first metal substrate (not shown).

To this end, the heat sink 220 , the second metal substrate 180 , the first metal substrate (not shown), and the cooling unit (not shown) may have a through hole S through which the fastening member 400 passes. have. Here, the through-hole S may include the above-described second through-hole 181 and the first through-hole 111 . Here, a separate insulating insertion member 410 may be further disposed between the second through hole 181 and the fastening member 400 . The separate insulating inserting member 410 may be an insulating inserting member surrounding the outer circumferential surface of the fastening member 400 or an insulating inserting member surrounding the wall surface of the through hole S. According to this, it is possible to increase the insulation distance of the thermoelectric element.

Meanwhile, the shape of the insulating inserting member 410 may be as illustrated in FIGS. 13(a) and 13(b). For example, as illustrated in FIG. 13( a ), the insulating inserting member 410 forms a step in the through-hole S region formed in the second metal substrate 180 to form a step on the wall surface of the through-hole S. It may be arranged to surround a part. Alternatively, the insulating insertion member 410 forms a step in the region of the through hole S formed in the second metal substrate 180 so that the second electrode (not shown) is disposed along the wall surface of the through hole S. It may be arranged to extend to the surface.

Referring to FIG. 13A , the diameter d2' of the through hole S of the first surface in contact with the second electrode of the second metal substrate 180 is the first electrode in contact with the first electrode of the first metal substrate. It may be the same as the diameter of the through-hole of the surface. At this time, according to the shape of the insulating insertion member 410 , the diameter d2 ′ of the through hole S formed on the first surface of the second metal substrate 180 is formed on the second surface opposite to the first surface. It may be different from the diameter d2 of the through hole S. Although not shown, the insulating insertion member 410 is disposed only on a portion of the upper surface of the second metal substrate 180 without forming a step in the through hole S region, or the through hole is formed from the upper surface of the second metal substrate 180 . When the insulating insertion member 410 is arranged to extend to a part or all of the wall surface of (S), the diameter (d2') of the through hole (S) formed in the first surface of the second metal substrate 180 is the first It may be the same as the diameter d2 of the through hole S formed in the second surface opposite to the surface.

Referring to FIG. 13(b), due to the shape of the insulating inserting member 410, the diameter d2' of the through hole S of the first surface in contact with the second electrode of the second metal substrate 180 is It may be larger than the diameter of the through hole of the first surface in contact with the first electrode of the first metal substrate. In this case, the diameter d2' of the through hole S of the first surface of the second metal substrate 180 may be 1.1 to 2.0 times the diameter of the through hole of the first surface of the first metal substrate. When the diameter d2' of the through hole S of the first surface of the second metal substrate 180 is less than 1.1 times the diameter of the through hole of the first surface of the first metal substrate, the insulation of the insulating inserting member 410 is Insulation breakdown of the thermoelectric element may be caused due to the insignificant effect, and the diameter d2' of the through hole S of the first surface of the second metal substrate 180 is the diameter of the through hole of the first surface of the first metal substrate. When it exceeds 2.0 times, the size of the region occupied by the through hole S is relatively increased, so that the effective area of the second metal substrate 180 is reduced, and the efficiency of the thermoelectric element may be reduced.

And, due to the shape of the insulating inserting member 410, the diameter d2' of the through hole S formed on the first surface of the second metal substrate 180 is formed on the second surface opposite to the first surface. It may be different from the diameter d2 of the through hole S. As described above, when the step is not formed in the region of the through hole S of the second metal substrate 180 , the diameter d2′ of the through hole S formed in the first surface of the second metal substrate 180 . ) may be the same as the diameter d2 of the through hole S formed in the second surface opposite to the first surface.

In the embodiment of the present invention, even if spaced apart from the first hole arrangement area 112 or the second hole arrangement area 182 among the first electrode 130 or the second electrode 160, each virtual space defining each hole arrangement area is In the virtual space formed by the extension line extending from the line of Optimal placement of P-type and N-type thermoelectric legs of

The thermoelectric element according to an embodiment of the present invention may be applied to a device for power generation, a device for cooling, a device for heating, and the like. Specifically, the thermoelectric element according to an embodiment of the present invention is mainly an optical communication module, a sensor, a medical device, a measuring device, aerospace industry, a refrigerator, a chiller, a car ventilation seat, a cup holder, a washing machine, a dryer, and a wine cellar. , water purifiers, power supplies for sensors, thermopiles, and the like.

Here, as an example in which the thermoelectric element according to an embodiment of the present invention is applied to a medical device, there is a PCR (Polymerase Chain Reaction) device. PCR equipment is equipment for determining the nucleotide sequence of DNA by amplifying DNA, and it requires precise temperature control and thermal cycle. To this end, a Peltier-based thermoelectric element may be applied.

As another example in which the thermoelectric element according to an embodiment of the present invention is applied to a medical device, there is a photodetector. Here, the photodetector includes an infrared/ultraviolet detector, a charge coupled device (CCD) sensor, an X-ray detector, and a Thermoelectric Thermal Reference Source (TTRS). A Peltier-based thermoelectric element may be applied for cooling the photodetector. Accordingly, it is possible to prevent a change in wavelength, a decrease in output, and a decrease in resolution due to an increase in the temperature inside the photodetector.

As another example in which the thermoelectric element according to an embodiment of the present invention is applied to a medical device, an immunoassay field, an in vitro diagnostics field, a general temperature control and cooling system, Physical therapy fields, liquid chiller systems, blood/plasma temperature control, etc. Accordingly, precise temperature control is possible.

Another example in which the thermoelectric element according to an embodiment of the present invention is applied to a medical device is an artificial heart. Accordingly, power can be supplied to the artificial heart.

Examples of the thermoelectric element according to an embodiment of the present invention applied to the aerospace industry include a star tracking system, a thermal imaging camera, an infrared/ultraviolet detector, a CCD sensor, the Hubble Space Telescope, and a TTRS. Accordingly, the temperature of the image sensor may be maintained.

As another example in which the thermoelectric element according to the embodiment of the present invention is applied to the aerospace industry, there are a cooling device, a heater, a power generation device, and the like.

In addition, the thermoelectric element according to the embodiment of the present invention may be applied to power generation, cooling, and heating in other industrial fields.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention within the scope without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that it can be done.

C: Cooling part
10: thermoelectric module
110: first metal substrate
111: first through hole
112: first hole arrangement area
120: first resin layer
130: a plurality of first electrodes
140: a plurality of P-type thermoelectric legs
150: plurality of N-type thermoelectric legs
160: a plurality of second electrodes
170: second resin layer
180: second metal substrate
181: second through hole
182: second hole arrangement area
190: fastening member
200: insulation
220: heat sink
230: connection member

Claims (22)

one first metal substrate including a first through hole and a second through hole;
an upper substrate portion disposed on the first metal substrate and including a second metal substrate including a third through hole and a third metal substrate including a fourth through hole;
a first insulating layer and a plurality of second insulating layers disposed between the one first metal substrate and the upper substrate part;
a first electrode part and a second electrode part disposed between the first insulating layer and the plurality of second insulating layers;
a plurality of thermoelectric legs disposed between the first electrode part and the second electrode part;
a first fastening member; and
a second fastening member;
The first insulating layer is in direct contact with the one first metal substrate,
Each of the plurality of second insulating layers is in direct contact with the second metal substrate and the third metal substrate,
The one first metal substrate includes a first effective area in which the first electrode part is disposed and a first outer area formed outside the first effective area,
The second metal substrate includes a second effective area in which the second electrode part is disposed and a second outer area formed outside the second effective area,
The third metal substrate includes a third effective area in which the second electrode part is disposed and a third outer area formed outside the third effective area,
The first through hole and the second through hole are disposed in the first effective area,
The third through hole is disposed in the second effective area,
the fourth through-hole is disposed in the third effective area;
The first through-hole is formed at a position corresponding to the third through-hole,
The second through-hole is formed at a position corresponding to the fourth through-hole,
The first fastening member is disposed in the first through hole and the third through hole,
The second fastening member is a thermoelectric module disposed in the second through hole and the fourth through hole. According to claim 1,
The first electrode unit includes a plurality of first electrodes,
The one first metal substrate has an imaginary line connecting the surfaces most adjacent to the first through hole among the surfaces of the first electrodes disposed to be adjacent to the first through hole among the plurality of first electrodes. An imaginary line connecting the first hole arrangement region, which is a space forming a space, and the surfaces closest to the second through hole among the surfaces of the first electrodes that are closest to the second through hole among the plurality of first electrodes and are adjacent to each other. and a second hole arrangement area, which is a space formed by the
The size of at least one of the first hole arrangement area and the second hole arrangement area is 4 to 8 times the size of any one of the plurality of first electrodes. 3. The method of claim 2,
A thermoelectric module having a withstand voltage characteristic that is maintained without dielectric breakdown under a voltage of 1 kV to 2.5 kV of AC and a current of 1 mA for 10 seconds. 3. The method of claim 2,
The second electrode unit includes a plurality of second electrodes,
The shortest distance between any one of the plurality of first electrodes and the first through hole is greater than the shortest distance between any one of the plurality of second electrodes and the third through hole. 3. The method of claim 2,
The second electrode unit includes a plurality of second electrodes,
The second metal substrate is formed by an imaginary line connecting the surfaces most adjacent to the third through hole among the surfaces of the second electrodes disposed to be adjacent to the third through hole among the plurality of second electrodes. Including a third hall arrangement area that is a space,
The thermoelectric module is disposed at positions corresponding to the first hole arrangement area and the third hole arrangement area. According to claim 1,
The thermoelectric module further comprising an insulating insertion member disposed around at least one of the third through hole and the fourth through hole. 7. The method of claim 6,
At least a portion of the insulating insertion member is disposed between a wall surface of at least one of the third and fourth through-holes and at least one of the first and second fastening members. According to claim 1,
The second metal substrate and the third metal substrate are disposed to be spaced apart from each other. 9. The method of claim 8,
The thermoelectric module further comprising: a substrate contact member vertically overlapping with a spaced region between the second metal substrate and the third metal substrate, the substrate contacting member being disposed to contact at least a portion of the second metal substrate and the third metal substrate. 9. The method of claim 8,
Further comprising a fourth metal substrate and a fifth metal substrate directly contacting the plurality of second insulating layers on the first metal substrate and arranged to be spaced apart from each other from the second metal substrate and the third metal substrate, and ,
The fourth metal substrate includes a fifth through hole,
A thermoelectric module including a sixth through hole through the fifth metal substrate. 11. The method of claim 10,
The one first metal substrate further includes a seventh through-hole and an eighth through-hole,
The fifth through-hole is formed at a position corresponding to the seventh through-hole,
The sixth through-hole is formed at a position corresponding to the eighth through-hole. 12. The method of claim 11,
The thermoelectric module further comprising: a third fastening member disposed in the fifth through hole and the seventh through hole; and a fourth fastening member disposed in the sixth through hole and the eighth through hole. 13. The method of claim 12,
The thermoelectric module further comprising an insulating insertion member disposed around at least one of the fifth through hole and the sixth through hole. 11. The method of claim 10,
The second metal substrate to the fifth metal substrate vertically overlaps with a spaced region between the adjacent metal substrates, and the second metal substrate to the fifth metal substrate is disposed such that at least a portion of the adjacent metal substrates are in contact with each other. The thermoelectric module further comprising a substrate contact member. According to claim 1,
The size of the first through hole and the size of the third through hole are different from each other. 16. The method of claim 15,
A size of the first through hole is smaller than a size of the third through hole. 17. The method of claim 16,
A diameter of the third through-hole is 1.1 to 2 times that of the first through-hole. According to claim 1,
The thermoelectric module further comprising a third insulating layer disposed between the first insulating layer and the first electrode part and in direct contact with the first insulating layer. According to claim 1,
The plurality of second insulating layers are disposed to be spaced apart from each other,
Each of the plurality of second insulating layers is in direct contact with the second electrode part. According to claim 1,
The first metal substrate may further include a ninth through hole disposed in the first outer region. According to claim 1,
An area of the first insulating layer is larger than an area of the first effective area and smaller than an area of the one first metal substrate. The thermoelectric module according to any one of claims 1 to 21; and
and a cooling unit coupled to the one first metal substrate of the thermoelectric module and including a plurality of through holes;
The first fastening member and the second fastening member are respectively disposed in the plurality of through-holes of the cooling unit.

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