JP2020155770A - Thermoelectric module - Google Patents

Abstract

To provide a coupling structure of a thermoelectric module.SOLUTION: A thermoelectric module includes: a first metal substrate 110 including a first through-hole; a first insulating layer disposed on the first metal substrate; a first electrode part disposed on the first insulating layer and including a plurality of first electrodes 130; a plurality of P-type thermoelectric legs 140 and a plurality of N-type thermoelectric legs disposed on the first electrode part; a second electrode part disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and including a plurality of second electrodes 160; a second insulating layer disposed on the second electrode part; and a second metal substrate 180 disposed on the second insulating layer and including a second through-hole. The first metal substrate includes an effective region A1 in which the first electrode part is disposed and a peripheral region A2 formed outside the effective region. The second metal substrate includes an effective region B1 in which the second electrode part is disposed and a peripheral region B2 formed outside the effective region.SELECTED DRAWING: Figure 1

Description

The present invention relates to a thermoelectric module, and more particularly to a fastening structure of the thermoelectric module.

The thermoelectric phenomenon is a phenomenon generated by the movement of electrons (electrons) and holes (holes) inside a material, and means a direct energy conversion between heat and electricity.

A thermoelectric element is a general term for an element that utilizes a thermoelectric phenomenon, and has a structure in which a P-type thermoelectric material and an N-type thermoelectric material are bonded between metal electrodes to form a PN junction pair.

Thermoelectric elements include elements that utilize temperature changes in electrical resistance, elements that utilize the Seebeck effect, which is a phenomenon in which electromotive force is generated due to temperature differences, and elements that utilize the Peltier effect, which is a phenomenon in which heat absorption or heat generation is generated by electric current. Can be divided into.

Thermoelectric elements are widely applied to home appliances, electronic parts, communication parts, and the like. For example, a thermoelectric element can be applied to a cooling device, a heating device, a power generation device, and the like. Along with this, the demand for thermoelectric performance of thermoelectric elements is becoming higher and higher.

The thermoelectric element includes a substrate, electrodes and thermoelectric legs, with a plurality of thermoelectric legs arranged in an array form between the upper substrate and the lower substrate, and a plurality of upper electrodes arranged between the plurality of thermoelectric legs and the upper substrate. A plurality of lower electrodes are arranged between the thermoelectric leg and the lower substrate.

One of the upper substrate and the lower substrate of the thermoelectric element is a high temperature part, and the other one is a low temperature part. At this time, a temperature difference occurs between the substrate in the high temperature portion and the substrate in the low temperature portion, so that thermal deformation may occur in the substrate in the high temperature portion and stress may be concentrated at the bonding interface of the substrates. As a result, peeling and cracking may occur at the joint interface portion, which may reduce the quality of the product.

In particular, the edge of the substrate in the high temperature portion is a portion where the amount of thermal deformation is higher than that in the central portion, and when the edge of the substrate in the high temperature portion and the substrate in the low temperature portion are fastened, stress is concentrated on the bonding interface portion due to thermal deformation. Can be weighted.

The technical problem to be achieved by the present invention is to provide a fastening structure for a thermoelectric module.

The thermoelectric module according to an embodiment of the present invention includes a first metal substrate including a first through hole; a first insulating layer arranged on the first metal substrate; a plurality of first insulating layers arranged on the first insulating layer. A first electrode portion including one electrode; a plurality of P-type and N-type thermoelectric legs arranged on the first electrode portion; a plurality of second electrodes arranged on the plurality of P-type and N-type thermoelectric legs. The first metal substrate includes a second electrode portion; a second insulating layer arranged on the second electrode portion; and a second metal substrate arranged on the second insulating layer and including a second through hole; The second metal substrate is formed in the effective region in which the second electrode portion is arranged and the outer shell of the effective region, including the effective region in which the first electrode portion is arranged and the outer shell region formed in the outer shell of the effective region. The first through hole is formed in the effective region of the first metal substrate, the second through hole is formed in the effective region of the second metal substrate, and the first through hole is formed. The hole and the second through hole are formed at positions corresponding to each other.

Further, a fastening member that passes through the first through hole and the second through hole to fix the first metal substrate and the second metal substrate can be included.

The second metal substrate includes a plurality of second metal substrates separated from each other, and each second metal substrate can include at least one second through hole.

Insulating members may be arranged between a plurality of second metal substrates separated from each other.

The thickness of the insulating member may be smaller than the thickness of the plurality of second metal substrates.

The length direction of a part of the plurality of first electrodes arranged on the first metal substrate is different from the length direction of the remaining part, and a part of the plurality of second electrodes arranged on the second metal substrate. The length direction of is different from the length direction of the remaining part, and the length direction may be the length direction of each electrode.

At least two of the plurality of first electrodes of the first electrode portion excluding the edge region are arranged in a second direction whose length direction is perpendicular to the first direction, and the remaining electrodes are said to have a length direction. At least two of the plurality of second electrodes arranged in the first direction and excluding the edge region of the second electrode portion are arranged in the second direction whose length direction is perpendicular to the first direction, and the rest. The electrodes may be arranged in the first direction in length.

Of the plurality of first electrodes excluding the edge region, the number of the first electrodes arranged in the second direction in the length direction is a multiple of 2, and of the plurality of second electrodes excluding the edge region. The number of the second electrodes whose length direction is arranged in the second direction can be a multiple of 2.

Of the plurality of second electrodes, at least a part of the second electrodes arranged in two columns or two rows facing each other in the edge region may be arranged in the second direction in the length direction.

The first metal substrate includes a first hole arrangement region which is a space formed by virtual lines connecting the surfaces of the first electrodes arranged so as to be adjacent to each other most adjacent to the first through hole, and includes the second metal. The substrate includes a second hole arrangement area, which is a space formed by virtual lines connecting the surfaces of the second electrodes arranged so as to be adjacent to each other most adjacent to the second through hole, and is adjacent to the first hole arrangement area. The at least one first electrode may be arranged in the second direction in the length direction, and the at least one second electrode adjacent to the second hole arrangement region may be arranged in the second direction in the length direction.

The at least one first electrode is arranged so as to overlap at least a part of the virtual space formed by the extension line extending from the virtual line defining the first hole arrangement region, and the at least one second electrode is said. It may be arranged so as to overlap at least a part of the virtual space formed by the extension line extending from the virtual line defining the second hole arrangement area.

The first through hole includes a plurality of the first through holes, the first hole arrangement area is formed around the plurality of the first through holes, and the second through hole includes a plurality of the first through holes. Can be formed around the plurality of second through holes, respectively.

The plurality of the first through holes and the plurality of the second through holes may be formed at positions corresponding to each other.

A third through hole arranged in the outer region of the first metal substrate can be further included.

The ratio of the area of the second metal substrate to the area of the first metal substrate can be 0.5 to 0.95.

Insulation insertion members arranged adjacent to the fastening member may be further included.

The diameter of the first through hole and the diameter of the second through hole can be different from each other.

The diameter of the second through hole can be 1.1 to 2.0 times the diameter of the first through hole.

A part of the insulating insertion member may be arranged in the second through hole.

A third insulating layer arranged between the first metal substrate and the first insulating layer can be further included.

According to the embodiment of the present invention, by fastening the substrate in the high temperature portion and the substrate in the low temperature portion so as to occupy a part of the effective region, the thermal deformation of the substrate in the high temperature portion is reduced and the stress is concentrated on the joint portion. This can be prevented and the reliability and durability of the thermoelectric module at high temperatures can be improved.

According to the embodiment of the present invention, the thermoelectric module enables the optimum arrangement of a plurality of P-type and N-type thermoelectric legs in a limited space in which each hole arrangement area is formed without wasting space. Power generation performance can be maintained.

The side view of the thermoelectric module which concerns on 1st Example of this invention. The perspective view of the thermoelectric module which concerns on 1st Example of this invention. An exploded perspective view of the thermoelectric module according to the first embodiment of the present invention. The side view which illustrated the state which the thermoelectric module which concerns on 1st Embodiment of this invention is installed in a cooling part. The perspective view of the thermoelectric module which concerns on 2nd Embodiment of this invention. A side view illustrating a state in which the thermoelectric module according to the second embodiment of the present invention is installed in the cooling unit. The drawing which illustrated the first example with respect to the method of arranging the 1st electrode and the 2nd electrode on a plurality of 1st metal substrate and 2nd metal substrate. A drawing illustrating a state in which a plurality of first electrodes and a plurality of second electrodes shown in FIG. 7 are overlapped. The drawing which illustrated the Example for the method of arranging the 1st electrode and the 2nd electrode on the 1st metal substrate and the 2nd metal substrate. The drawing which illustrated the Example for the method of arranging the 1st electrode and the 2nd electrode on the 1st metal substrate and the 2nd metal substrate. The drawing which illustrated the Example for the method of arranging the 1st electrode and the 2nd electrode on the 1st metal substrate and the 2nd metal substrate. The drawing which illustrated the Example for the method of arranging the 1st electrode and the 2nd electrode on the 1st metal substrate and the 2nd metal substrate. The drawing which illustrates the fastening structure of the power generation module which concerns on embodiment of this invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical idea of the present invention is not limited to a part of the examples to be explained, and can be embodied in various forms different from each other. One or more of can be selectively combined and replaced.

In addition, the terms used in the examples of the present invention (including technical and scientific terms) have meanings that can be generally understood by a person having ordinary knowledge in the technical field to which the present invention belongs, unless explicitly defined in particular. Commonly used terms, such as those defined in the dictionary, could be interpreted in light of the contextual meaning of the relevant technology.

In addition, the terms used in the examples of the present invention are for explaining the examples, and are not intended to limit the invention.

In the present specification, the singular type may also include the plural type unless otherwise specified in the text, and when it is described as "at least one (or one or more) of A and (and) B, C", A. , B, C can include one or more of all combinations.

In addition, terms such as first, second, A, B, (a), and (b) can be used in the description of the components of the examples of the present invention.

Such terms are merely for distinguishing a component from other components, and the term is not limited to the essence, order, or order of the component.

And when one component is described as being "connected," "joined," or "connected" to another component, that component is directly connected, combined, or connected to another component. It may also include cases where it is "connected," "joined," or "connected" by yet another component between that component and the other component.

Also, if it is stated that it is formed or placed "above" or "below" each component, then above or below is only when the two components are in direct contact with each other. It also includes the case where one or more other components are formed or arranged between two components. Further, when the expression "upper" or "lower" is used, it may include not only the upper direction but also the lower direction with respect to one component.

FIG. 1 is a side view of the thermoelectric module according to the first embodiment of the present invention, FIG. 2 is a perspective view of the thermoelectric module according to the first embodiment of the present invention, and FIG. 3 is a perspective view of the thermoelectric module according to the first embodiment of the present invention. FIG. 4 is an exploded perspective view of the thermoelectric module according to the present invention, and FIG. 4 is a side view illustrating a state in which the thermoelectric module according to the first embodiment of the present invention is installed in a cooling unit.

Referring to FIGS. 1 to 4, the thermoelectric module includes one first metal substrate 110, a first resin layer 120, a plurality of first electrodes 130, a plurality of P-type thermoelectric legs 140, a plurality of N-type thermoelectric legs 150, and a plurality of thermoelectric modules. The second electrode 160, the second resin layer 170, one second metal substrate 180, the fastening member 190, and the heat insulating material 200 are included, and the first metal substrate 110 and the second metal substrate 180 are for penetrating the fastening member 190. It can include at least one through hole.

According to another embodiment of the present invention, one thermoelectric module is arranged between one first metal substrate 110, a plurality of second metal substrates 180, and one first metal substrate 110 and a plurality of second metal substrates 180. A first metal substrate including a first resin layer 120, a plurality of first electrodes 130, a plurality of P-type thermoelectric legs 140, a plurality of N-type thermoelectric legs 150, a plurality of second electrodes 160, and a second resin layer 170. The 110 and the second metal substrate 180 may include at least one through hole for penetrating the fastening member 190.

The first metal substrate 110 is formed in a plate shape. Further, the first metal substrate 110 may be fixed on the cooling portion C or the heat generating portion (not shown). Examples of the present invention described later will be described with an example in which the first metal substrate 110 is fixed to the cooling unit C. At this time, a hole 20h is formed in the cooling unit C at a position corresponding to the first through hole 111 formed in the first metal substrate 110, and the fastening member 190 described later passes through the first through hole 111 and the hole 20h. Can be inserted into. As in the embodiment of FIGS. 9 to 11, the first metal substrate 110 also penetrates the outer region, that is, the region where the plurality of P-type thermoelectric legs 140 and the plurality of N-type thermoelectric legs 150 are not arranged. A hole 113 may be further formed, at which time the fastening member 190 may be inserted into the third through hole 113 and the hole 20h of the cooling portion C formed at a position corresponding to the third through hole 113. Then, the heat dissipation pad H may be further arranged between the first metal substrate 110 and the cooling unit C.

The first metal substrate 110 can include at least one of aluminum, an aluminum alloy, copper and a copper alloy. At this time, when a voltage is applied to the thermoelectric module, the first metal substrate 110 absorbs heat by the Peltier effect and acts as a low temperature portion, and the second metal substrate 180 releases heat and acts as a high temperature portion. can do. On the other hand, when different temperatures are applied to the first metal substrate 110 and the second metal substrate 180, the electrons in the high temperature region move to the low temperature region due to the temperature difference, and thermoelectromotive force is generated. This is called the Seebeck effect, and electricity is generated in the circuit of the thermoelectric element by the thermoelectromotive force caused by the Seebeck effect.

The first metal substrate 110 includes at least one first through hole 111. The first through hole 111 is formed at a position corresponding to the second through hole 181 formed in the second metal substrate 180, which will be described later. Then, the first through hole 111 may be formed at a predetermined interval from the outer shell of the first metal substrate 110. At this time, the first metal substrate 110 and the second metal substrate 180 can be fixed by the fastening member 190 while the fastening member 190 passes through the first through hole 111 and the second through hole 181. At this time, on the diameter of the first through hole 111 formed on the first surface of the first metal substrate 110 in contact with the plurality of first electrodes 130 and on the first surface of the second metal substrate 180 in contact with the plurality of second electrodes 160. The diameters of the formed second through holes 181 may be the same as each other, but they are formed on the first surface of the first metal substrate 110 in contact with the plurality of first electrodes 130 depending on the arrangement form and position of the insulating insertion member described later. The diameter of the first through hole 111 and the diameter of the second through hole 181 formed on the first surface of the second metal substrate 180 in contact with the plurality of second electrodes 160 may be different from each other.

A first resin layer 120 is applied on the first metal substrate 110, and a plurality of first electrodes 130 are arranged.

Here, the first metal substrate 110 can come into direct contact with the first resin layer 120. For this reason, the surface roughness of the first metal substrate 110 is formed on the entire or portion of both sides of the surface on which the first resin layer 120 is arranged, that is, the surface of the first metal substrate 110 facing the first resin layer 120. obtain. According to this, it is possible to prevent the problem that the first resin layer 120 floats during thermocompression bonding between the first metal substrate 110 and the first resin layer 120. In the present specification, the surface roughness means unevenness, and may be mixed with the surface roughness.

The first resin layer 120 and the second resin layer 170 may consist of a resin composition containing a resin and an inorganic filler, and the resin may be an epoxy resin or a silicone resin. Here, the inorganic filler can be contained in 68-88 vol% of the resin composition. If the inorganic filler is contained in an amount of less than 68 vol%, the heat conduction effect can be lowered, and if the inorganic filler is contained in an amount of more than 88 vol%, the adhesive force between the resin layer and the metal substrate can be lowered, and the resin layer becomes Can easily break.

Epoxy resins can include epoxy compounds and hardeners. At this time, the curing agent may be contained in a ratio of 1 to 10 by volume with respect to 10 by volume of the epoxy compound. Here, the epoxy compound can include at least one of a crystalline epoxy compound, a non-crystalline epoxy compound and a silicone epoxy compound. The crystalline epoxy compound can include a mesogen structure. A mesogen is a basic unit of a liquid crystal and includes a rigid structure. The non-crystalline epoxy compound can be a normal non-crystalline epoxy compound having two or more epoxy groups in the molecule, and can be, for example, a glycidyl etherified product derived from bisphenol A or bisphenol F. Here, the curing agent is at least one of an amine-based curing agent, a phenol-based curing agent, an acid anhydride-based curing agent, a polymercaptan-based curing agent, a polyaminoamide-based curing agent, an isocyanate-based curing agent, and a blocked isocyanate-based curing agent. Can be included, and two or more kinds of curing agents may be mixed and used.

The inorganic filler can include aluminum oxide and nitrides, and the nitride can be contained in 55-95 wt% of the inorganic filler, more preferably 60-80 wt%. When the nitride is contained in such a numerical range, the thermal conductivity and the bonding strength can be increased. Here, the nitride can contain at least one of boron nitride and aluminum nitride. Here, the boron nitride can be a boron nitride agglomerate in which plate-shaped boron nitride is aggregated.

At this time, the particle size D50 of the boron nitride aggregate can be 250 to 350 μm, and the particle size D50 of the aluminum oxide can be 10 to 30 μm. When the particle size D50 of the boron nitride agglomerates and the particle size D50 of the aluminum oxide satisfy such a numerical range, the boron nitride agglomerates and the aluminum oxide can be uniformly dispersed in the epoxy resin composition. Along with this, the resin layer can have a uniform heat conduction effect and adhesive performance as a whole.

According to the embodiment of the present invention, at least one of the first metal substrate 110 side and the second metal substrate 180 side may include a plurality of resin layers. For example, a third resin layer (not shown) may be further arranged between the first resin layer 120 and the plurality of first electrodes 130. Alternatively, a fourth resin layer (not shown) may be further arranged between the plurality of second electrodes 160 and the second resin layer 170. At this time, at least one of the composition, Young's modulus, coefficient of thermal expansion, and thickness of the first resin layer 120 and the third resin layer (not shown) may differ from each other. At least one of the composition, Young's modulus, coefficient of thermal expansion and thickness of the second resin layer 170 and the fourth resin layer (not shown) may differ from each other. For example, if one of the first resin layer 120 and the third resin layer (not shown) is a resin composition, the other one differs in at least one of composition, Young's modulus, coefficient of thermal expansion and thickness. It can be a resin composition, an aluminum oxide layer, or a composite containing silicon and aluminum. Here, the composite can be at least one of oxides, carbides and nitrides containing silicon and aluminum. For example, the complex can include at least one of Al—Si bond, Al—O—Si bond, Si—O bond, Al—Si—O bond and Al—O bond. As described above, the composite containing at least one of Al—Si bond, Al—O—Si bond, Si—O bond, Al—Si—O bond and Al—O bond has excellent insulation performance. As a result, high withstand voltage performance can be obtained. Alternatively, the composite is also an oxide, carbide or nitride containing titanium, zirconium, boron, zinc and the like as well as silicon and aluminum. For this purpose, the composite can be obtained through the process of mixing aluminum with at least one of an inorganic binder and a mixed binder with or without an inorganic binder and then heat-treating it. The inorganic binder can contain, for example, at least one of silica (SiO ₂ ), metal alkoxide, boron oxide (B ₂ O ₃ ) and zinc oxide (Zn O ₂ ). Although inorganic binders are inorganic particles, they can sol or gel when exposed to water and act as bindings. At this time, at least one of silica (SiO ₂ ), metal alkoxide and boron oxide (B ₂ O ₃ ) plays a role of enhancing the adhesion with the metal, and zinc oxide (ZnO ₂ ) enhances the strength of the resin layer. , Can play a role in increasing thermal conductivity. As used herein, withstand voltage performance can mean a property that is maintained under a given voltage and a given current for a given period of time without dielectric breakdown. For example, when maintained without dielectric breakdown for 10 seconds under a voltage of AC2.5 kV and a current of 1 mA, the withstand voltage can be said to be 2.5 kV. Alternatively, when one of the second resin layer 170 and the fourth resin layer (not shown) is a resin composition, the other one is a resin having at least one difference in composition, Young's modulus, coefficient of thermal expansion and thickness. It can be a composition, an aluminum oxide layer, or a composite containing silicon and aluminum. Here, each resin layer can be mixed with the insulating layer.

The plurality of first electrodes 130 are arranged on the first resin layer 120. A plurality of P-type thermoelectric legs 140 and a plurality of N-type thermoelectric legs 150 are arranged on the first electrode 130. At this time, the first electrode 130 is electrically connected to the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150. Here, the first electrode 130 can contain at least one of copper (Cu), aluminum (Al), silver (Ag) and nickel (Ni).

The plurality of P-type thermoelectric legs 140 and the plurality of N-type thermoelectric legs 150 are arranged on the first electrode 130. At this time, the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 can be joined to the first electrode 130 by soldering.

At this time, the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 may be bismuth telluride (Bi-Te) -based thermoelectric legs containing bismuth (Bi) and tellurium (Te) as main raw materials. The P-type thermoelectric leg 140 has antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium ( Ga), tellurium (Te), bismuth (Bi) and indium (In) containing at least one of bismuth telluride (Bi-Te) -based main raw material 99 to 99.999 wt% and a mixture containing Bi or Te 0. It can be a thermoelectric leg containing 001 to 1 wt%. For example, the main raw material is Bi-Se-Te, and Bi or Te can be further contained in an amount of 0.001 to 1 wt% of the total weight. The N-type thermoelectric leg 150 has selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), and gallium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), and gallium ( Ga), tellurium (Te), bismuth (Bi) and indium (In) containing at least one of bismuth telluride (Bi-Te) -based main raw material 99 to 99.999 wt% and a mixture containing Bi or Te 0. It can be a thermoelectric leg containing 001 to 1 wt%. For example, the main raw material is Bi-Sb-Te, and Bi or Te can be further contained in an amount of 0.001 to 1 wt% of the total weight.

The P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 can be formed in a bulk type or a laminated type. Generally, in the bulk type P-type thermoelectric leg 140 or the bulk type N-type thermoelectric leg 150, the thermoelectric material is heat-treated to produce an ingot, and the ingot is crushed and sieved to obtain a powder for the thermoelectric leg. This can be obtained through the process of sintering and cutting the sintered body. The laminated P-type thermoelectric leg 140 or the laminated N-type thermoelectric leg 150 is obtained through a process of laminating and cutting a unit member after applying a paste containing a thermoelectric material on a sheet-shaped base material to form a unit member. obtain.

At this time, the pair of P-type thermoelectric legs 140 and N-type thermoelectric legs 150 may have the same shape and volume, or may have different shapes and volumes from each other. For example, since the electrical conduction characteristics of the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 are different, the height or cross-sectional area of the N-type thermoelectric leg 150 is formed to be different from the height or cross-sectional area of the P-type thermoelectric leg 140. You may.

The performance of the thermoelectric element according to the embodiment of the present invention can be indicated by the thermoelectric figure of merit. The thermoelectric figure of merit (ZT) can be expressed as Equation 1.

Here, α is a Seebeck coefficient [V / K], σ is an electric conductivity [S / m], and α ² σ is a power factor (Power Factor, [W / mK ² ]). Then, T is the temperature and k is the thermal conductivity [W / mK]. k can be represented by a · cp · ρ, where a is the thermal diffusivity [cm ² / S], cp is the specific heat [J / gK], and ρ is the density [g / cm ³ ].

In order to obtain the thermoelectric figure of merit of the thermoelectric element, the Z value (V / K) can be measured using a Z meter, and the Seebeck index (ZT) can be calculated using the measured Z value.

The P-type thermoelectric leg 140 or the N-type thermoelectric leg 150 can have a cylindrical shape, a polygonal columnar shape, an elliptical columnar shape, or the like. Alternatively, the P-type thermoelectric leg 140 or the N-type thermoelectric leg 150 may have a laminated structure. For example, a P-type thermoelectric leg or an N-type thermoelectric leg can be formed by laminating a plurality of structures coated with a semiconductor substance on a sheet-like base material and then cutting the structures. Along with this, it is possible to prevent material loss and improve electrical conduction characteristics.

The plurality of second electrodes 160 are arranged on the plurality of P-type thermoelectric legs 140 and the plurality of N-type thermoelectric legs 150. At this time, the P-type thermoelectric leg 140 and the N-type thermoelectric leg 150 can be joined to the second electrode 160 by soldering. Here, the second electrode 160 can contain at least one of copper (Cu), aluminum (Al), silver (Ag) and nickel (Ni).

The second resin layer 170 is arranged on the plurality of second electrodes 160. Then, a plurality of second metal substrates 180 are arranged on the second resin layer 170.

The second metal substrate 180 is arranged on the second resin layer 170 so as to face one first metal substrate 110. The second metal substrate 180 may be made of aluminum, an aluminum alloy, copper, or a copper alloy.

The area of the first metal substrate 110 and the area of the second metal substrate 180 can be the same, and as described above, when the third through hole 113 is formed in the first metal substrate 110, the area of the first metal substrate 110 is It may be larger than the area of the second metal substrate 180. At this time, the area ratio of the second metal substrate 180 to the area of the first metal substrate 110 is 0.50 to 0.95, preferably 0.60 to 0.90, and more preferably 0.70 to 0.85. obtain.

As another embodiment, the second metal substrate 180 is divided into a plurality of parts for one first metal substrate 110 when a relatively large area is required in an application field or when the influence of thermal deformation must be further minimized. Can be prepared. At this time, the area ratio of each second metal substrate 180 to the area of the first metal substrate 110 is 0.10 to 0.50, preferably 0.15 to 0.45, and more preferably 0.2 to 0.40. possible. For example, two second metal substrates 180 may be arranged on one first metal substrate 110. At this time, the second metal substrate 180 may be arranged so as to be separated from each other. For example, the first metal substrate 110 has an area of 100 mm × 100 mm, the second metal substrate 180 has an area of 45 mm × 100 mm, respectively, and the distance between the second metal substrates 180 separated from each other can be about 10 mm.

As another example, four second metal substrates 180 may be arranged on one first metal substrate 110. At this time, the second metal substrate 180 may be arranged so as to be separated from each other. For example, the first metal substrate 110 has an area of 100 mm × 100 mm, the second metal substrate 180 has an area of 45 mm × 45 mm, respectively, and the distance between the second metal substrates 180 separated from each other can be about 10 mm.

As another example, the spacing between the plurality of second metal substrates 180 can be less than 5 mm. For example, the first metal substrate 110 has an area of 100 mm × 100 mm, the second metal substrate 180 has an area of 49.5 mm × 49.5 mm, and the distance between the plurality of second metal substrates 180 is 2 mm. The connecting member 230 connecting between the second metal substrates 180 may be formed to have a width of 2 mm.

At this time, the thickness of the first metal substrate 110 can be 0.1 mm to 2 mm. Further, the thickness of the second metal substrate 180 may be the same as or larger than the thickness of the first metal substrate 110. When the thickness of the second metal substrate 180 is larger than the thickness of the first metal substrate 110, the thickness of the second metal substrate 180 can be 1.1 to 2.0 times the thickness of the first metal substrate 110. Here, since the second metal substrate 180 can be bent by the fastening member 190, the thickness of the second metal substrate 180 can be formed to be larger than that of the first metal substrate 110.

At least one second through hole 181 is formed in the second metal substrate 180. At this time, the second through hole 181 may be formed so as to occupy a part of the effective region B1 which is an inner region of the outer region B2 of each second metal substrate 180. Here, the effective region can be defined as a region in which a plurality of P-type thermoelectric legs 140 and N-type thermoelectric legs 150 capable of substantially embodying the Peltier effect or the Seebeck effect are arranged, and the terminal electrode is arranged in this effective region. obtain. The terminal electrode can be extended from the effective region so as to be connected to an external terminal or wire, and at least one or more of the first or more first electrodes 130 and a plurality of first electrodes 130 of the plurality of P-type thermoelectric legs 140 and N-type thermoelectric legs 150. It can be electrically connected to at least one of the two electrodes 160. In this region, each of the plurality of first electrodes 130 and the plurality of second electrodes 160 may overlap vertically with each other. The second through hole 181 formed in the second metal substrate 180 can be formed at a predetermined interval from the outer shell of the second metal substrate 180, and when there are a plurality of second through holes 181, the second through hole 181 can be formed from the outer shell of the second metal substrate 180. They can be spaced apart at equal intervals. The second through hole 181 is arranged so as to overlap the first through hole 111, and the fastening member 190 can pass through the first through hole 111 and the second through hole 181 corresponding to each other. In this way, the fastening member 190 fixes the first metal substrate 110 and the second metal substrate 180 to each other so as to occupy a part of the effective regions A1 and B1 of the first metal substrate 110 and the second metal substrate 180. As a result, thermal deformation can be reduced and stress can be prevented from concentrating on the joint portion.

Although not shown, a part of A2 and B2 of the outer region of each substrate, that is, the edge region of the substrate is provided so as not to affect the effective regions A1 and B1 of the first metal substrate 110 and the second metal substrate 180. When fastening, the fixing force between the substrates can be relatively high, but the thermoelectric module can be exposed to a high temperature environment of 100 ° C or higher to utilize the Seebeck effect, or the Peltier effect to generate heat of 100 ° C or higher can be achieved. In the field of application to be used, damage to the thermoelectric module can be caused by the relative difference in the amount of heat received between the low temperature region and the high temperature region. For example, in the case of a thermoelectric module utilizing the Seebeck effect, the high temperature metal substrate expands due to heat, the low temperature metal substrate contracts due to a separate cooling member, and thermal stress concentrates on the edge region of the substrate. The thermal stress generated at this time is also transmitted to the electrodes, thermoelectric legs, and resin layer arranged between the substrates, and peeling and cracking may occur from the fragile interface, and as a result, thermoelectricity is caused by damage to the thermoelectric module. Efficiency can drop sharply. Although not shown, a sealing member may be further arranged between the first metal substrate 110 and the second metal substrate 180. The sealing member may be arranged between the first metal substrate 110 and the plurality of second metal substrates 180 on the side surfaces of the first electrode 130, the P-type thermoelectric leg 140, the N-type thermoelectric leg 150, and the second electrode 160. Along with this, the first electrode 130, the P-type thermoelectric leg 140, the N-type thermoelectric leg 150 and the second electrode 160 can be sealed from external moisture, heat, contamination and the like. Here, the sealing member is separated from the outermost outer shells of the plurality of first electrodes 130, the outermost outer shells of the plurality of P-type thermoelectric legs 140 and the plurality of N-type thermoelectric legs 150, and the outermost outer shells of the plurality of upper electrodes 160 by a predetermined distance. The sealing material arranged between the sealing case and the first metal substrate 110 and the sealing material arranged between the sealing case and the second metal substrate 180 can be included. In this way, the sealing case can come into contact with the first metal substrate 110 and the second metal substrate 180 via the sealing material. Along with this, when the sealing case comes into direct contact with the first metal substrate 110 and the second metal substrate 180, heat conduction occurs through the sealing case, and as a result, between the first metal substrate 110 and the second metal substrate 180. It is possible to prevent the problem that the temperature difference between the two is low. Here, the sealing material may contain at least one of an epoxy resin and a silicone resin, or may include a tape having at least one of the epoxy resin and the silicone resin coated on both sides. The sealing material serves to make the space between the sealing case and the first metal substrate 110 and the space between the sealing case and the second metal substrate 180 airtight, and the first electrode 130, the P-type thermoelectric leg 140, the N-type thermoelectric leg 150 and the first. The sealing effect of the two electrodes 160 can be enhanced, and it can be mixed with a finishing material, a finishing layer, a waterproof material, a waterproof layer, and the like. Here, the sealing material that seals between the sealing case and the first metal substrate 110 is arranged on the upper surface of the first metal substrate 110, and the sealing material that seals between the sealing case and the second metal substrate 180 is the second metal substrate. It can be placed on the side of 180. For this reason, the area of the first metal substrate 110 may be larger than the total area of the second metal substrate 180. On the other hand, the sealing case may be formed with a guide groove for pulling out the lead wire connected to the electrode. For this reason, the sealing case can be an injection molded product made of plastic or the like, and can be mixed with the sealing cover. However, the above description of the sealing member is merely an example, and the sealing member can be deformed into various forms. Although not shown, additional insulation may be included to surround the sealing member. Alternatively, the sealing member may contain a heat insulating component.

Referring to FIG. 7, a first hole arrangement region 112 is formed on the first metal substrate 110 adjacent to the first through hole 111. Although the first hole arrangement region 112 is closest to the first through hole 111, it can be defined as a space formed by virtual lines 201, 202, 203, and 204 connecting the surfaces of the electrodes adjacent to each other. The first hole arrangement region 112 may be formed in the form of a polygon, preferably in the form of a quadrangle. At this time, the plurality of first electrodes 130 may not be arranged in the first hole arrangement region 112. Further, in the second metal substrate 180, a second hole arrangement region 182 is formed adjacent to the second through hole 181 on the surface facing the first metal substrate 110. The second hole arrangement region 182 can be defined as a space formed by virtual lines 211, 212, 213, and 214 that are closest to the second through hole 181 but connect the surfaces of the electrodes adjacent to each other. The second hole arrangement region 182 can be formed in the form of a polygon, preferably in the form of a quadrangle. At this time, the plurality of second electrodes 160 may not be arranged in the second hole arrangement area 182.

The fastening member 190 fixes the first metal substrate 110 and at least one second metal substrate 180. At this time, a part of the fastening member 190 passes through the second through hole 181 and the first through hole 111, and the end portion is inserted and connected to the hole 20h of the cooling portion C.

With reference to FIG. 4, the fastening member 190 can include a first member 191 and a second member 192. The first member 191 penetrates the second through hole 181 and the first through hole 111, and is embedded and fixed in the cooling portion C at one end. At this time, a thread may be formed on the outer circumference of the first member 191. The diameter of the first member 191 may be the same as the diameter of the second through hole 181 and the first through hole 111, or may be formed smaller than the diameter of the second through hole 181 and the first through hole 111.

The second member 192 extends from the other end of the first member 191 and is formed with a diameter larger than the diameter of the second through hole 181. The second member 192 prevents the second metal substrate 180 from spreading from the first metal substrate 110.

When there are a plurality of second metal substrates 180, the heat insulating material 200 may be arranged in a separated space between the plurality of second metal substrates 180. Here, the heat insulating material 200 can contain at least one of epoxy resin, silicone resin and ceramic wool, and the heat insulating material 200 can be mixed with the sealing member described above and the connecting member 230 described later.

The heat sink 220 may be placed on the second metal substrate 180. For example, the heat sink 220 may be arranged on both sides of the second metal substrate 180, opposite to the surface on which the second resin layer 170 is arranged. At this time, the second metal substrate 180 and the heat sink 220 may be integrally formed. Although not shown, a heat sink may also be formed on the first metal substrate 110. The heat sink 220 can have a structure in which a plurality of flat plate-shaped base materials 221 are arranged in parallel, and the space between the flat base materials 221 forms an air flow path. At this time, the distance between the flat base materials 221 can be less than 10 mm.

In the following, the thermoelectric module 20 according to another embodiment of the thermoelectric module will be described with reference to FIGS. 5 and 6.

FIG. 5 is a perspective view of the thermoelectric module according to the second embodiment of the present invention, and FIG. 6 is a side view illustrating a state in which the thermoelectric module according to the second embodiment of the present invention is installed in the cooling unit.

With reference to FIGS. 5 and 6, the thermoelectric module 20 may further include a connecting member 230 that connects between the plurality of second metal substrates 180.

The connecting member 230 can be a glue that joins between the plurality of second metal substrates 180. At this time, the thermoelectric module 20 can omit the heat insulating treatment in the separated space of the plurality of second metal substrates 180, but as described above, the heat insulating material 200 is arranged between the first metal substrate 110 and the second metal substrate 180. Can be done.

Although not shown, the thermoelectric modules may omit the connecting member 230 and may be connected to each other by extension members extending from a part of the plurality of second metal substrates 180.

At this time, the extension member may be formed smaller than the thickness of the second metal substrate 180. For example, the thickness of the second metal substrate 180 can be 0.2 mm to 4 mm, and the thickness of the extension member can be 0.1 mm to 2 mm. Here, the thickness ratio of the plurality of second metal substrates to the thickness of the extension member can be 1 to 2 or less.

A groove 241 can be formed on one surface of the connecting member 230 while being depressed as compared with one surface of the second metal substrate 180. At this time, the connecting member 230 may be formed in a cross shape. For example, when the area of the first metal substrate 110 is 100 mm × 100 mm, the area of the second metal substrate 180 is 45 mm × 45 mm, and the thickness is 0.2 mm to 4 mm, the width of the connecting member 230 is 10 mm. Yes, the thickness is 0.1 mm to 2 mm, and the groove formed by the connecting member 230 can be 0.1 mm to 2 mm or less in depth. In this way, the groove is formed by the difference in thickness between the connecting member 230 and the second metal substrate 180, the thickness of the central portion of the second metal substrate 180 is reduced, and the thermal deformation of the second metal substrate 180 is alleviated. Can have an effect.

In the present specification, the heat insulating material 200, the connecting member 230, and the extension member, which are arranged between the plurality of second metal substrates 180 separated from each other and connect the plurality of second metal substrates 180, can be referred to as a connecting member. The connecting member can be an insulating member containing an insulating material.

In the following, various examples for the arrangement method of the plurality of first electrodes 130 and the plurality of second electrodes 160 will be described with reference to FIGS. 7 to 11.

FIG. 7 is a drawing illustrating a first embodiment for a method of arranging the first electrode and the second electrode on the first metal substrate 110 and the second metal substrate 180, and FIG. 8 is a drawing showing a plurality of second electrodes shown in FIG. It is a drawing which illustrated the state in which one electrode and a plurality of 2nd electrodes were overlapped | FIG. It is a drawing which illustrated various examples.

Referring to FIGS. 7 to 11, the plurality of first electrodes 130 are arranged on one surface where the first metal substrate 110 faces the second metal substrate 180, and the plurality of second electrodes 160 have the second metal substrate 180 as the first metal. It is arranged on one side facing the substrate 110. At this time, the plurality of first electrodes 130 may be arranged with the first hole arrangement area 112 open, and the plurality of second electrodes may be arranged with the second hole arrangement area 182 open, and the position of the first hole arrangement area 112 The positions of the second hole arrangement area 182 correspond to each other.

Here, each of the plurality of first electrodes 130 and the plurality of second electrodes 160 is formed in a rectangular shape, and the long width W1 and the short width W2 are classified. At this time, the ratio of the long width W1 to the short width W2 of the first electrode 130 and the second electrode 160 can be variable depending on the shape of the arranged leg, and preferably the short width of the first electrode 130 and the second electrode 160. The ratio of the long width W1 to W2 can be 2.05 to 4.50. As used herein, the direction of length can be referred to as the direction of length.

Although not shown, when the through holes 111 and 181 are not formed in the effective regions of the first metal substrate 110 and the second metal substrate 180, the length directions of the plurality of first electrodes 130 are all in the first direction Y. Can be placed in. At this time, of the plurality of second electrodes 160, at least a part of the electrodes arranged in two columns or two rows facing each other in the edge region of the effective region is arranged in the second direction X perpendicular to the first direction Y. The remaining electrodes may move from the plurality of first electrodes 130 by the short width W2 of the electrodes and at least partially overlap. Through this, a plurality of P-type and N-type thermoelectric legs between the first metal substrate 110 and the second metal substrate 180 can all be connected in series.

When at least one through hole 111, 181 is formed in the effective region of the first metal substrate 110 and the second metal substrate 180 according to the embodiment of the present invention, the edge of the first electrode 130 and the plurality of second electrodes 160 In the length direction of the electrodes excluding the electrodes in the region, the first direction Y and the second direction X perpendicular to the first direction Y can be arranged in a mixed manner.

At this time, of the plurality of first electrodes 130 or the plurality of second electrodes 160, at least two electrodes excluding the edge region are arranged in the second direction X perpendicular to the first direction Y, and the remaining electrodes are second. It may be arranged in the first direction Y perpendicular to the direction X.

At least one electrode adjacent to the first hole arrangement region 112 or the second hole arrangement region 182 is arranged so that the length direction is directed to the second direction X, and the other one adjacent to the at least one is also in the length direction. Can be arranged so as to face the second direction X. At this time, the at least two first electrodes 130 and the at least two second electrodes 160 may not overlap each other or may partially overlap each other.

Specifically, at least two of the first electrodes 130 adjacent to the first hole arrangement region 112, the first electrodes 130a and 130b, may be arranged so that the length direction faces the second direction X. Then, the remaining first electrode 130 may be arranged so that the length direction is directed to the first direction Y.

At this time, at least two second electrodes 160a and 160b of the plurality of second electrodes 160 adjacent to the second hole arrangement region 182 can be arranged in the second direction X. Further, two rows of the plurality of second electrodes 160c arranged on the edge of the effective region facing each other may also be arranged in the second direction X in the length direction. Then, the remaining second electrode 160 may be arranged so that the length direction is directed to the first direction Y. At this time, the first electrodes 130a and 130b arranged in the second direction X and the second electrodes 160a and 160b arranged in the second direction may not overlap each other or may be arranged so as to partially overlap each other. Here, the arrangement form of the plurality of first electrodes 130 and the plurality of second electrodes 160 can be applied differently from each other.

More specifically, as shown in FIG. 8, at least two of the plurality of first electrodes 130 excluding the edge region are the virtual lines 201, 202, 203 that define the first hole arrangement region 112. , At least a part of the virtual space (H1 or H2) formed by the extension line extending from 204 may be arranged in the second direction X, and at least two of the plurality of second electrodes 160 excluding the edge region may be arranged. , At least partly overlaps with the virtual space (H3 or H4) formed by the extension lines extending from the virtual lines 211, 212, 213, and 214 that define the second hole arrangement area 182, and is arranged in the second direction X. obtain. Through this, a plurality of P-type and N-type thermoelectric legs can be optimally arranged in the limited space in which each hole arrangement area is formed. Here, the number of electrodes arranged in the second direction X can be increased depending on the number, position, shape, and the like of the first hole arrangement area 112 and the second hole arrangement area 182. At this time, the number of electrodes arranged in the second direction X can be a multiple of 2, and at least two of the electrodes arranged in the second direction X are arranged so that at least a part of them overlap with H1 to H4. Can be done.

In the present specification, the respective electrode arrangement forms of the plurality of first electrodes 130 and the plurality of second electrodes 160 may be applied differently from each other, and the first direction Y and the second direction X are not limited thereto.

Referring to FIG. 9, the two first electrodes 130d and 130f adjacent to the first hole arrangement region 112 among the plurality of first electrodes 130 can be arranged so that the length direction faces the second direction X. The two first electrodes 130c and 130e adjacent to the first electrodes 130d and 130f may also be arranged in the second direction X in the same length direction. Then, the remaining first electrode 130 may be arranged so that the length direction is directed to the first direction Y.

At this time, of the plurality of second electrodes 160, the two second electrodes 160d and 160e adjacent to the second hole arrangement region 182 can be arranged so that the length direction faces the second hole arrangement region X, and the second hole arrangement region The other two second electrodes 160f, 160g adjacent to the 182 may also be arranged in the second direction X in the same length direction. Further, the second electrodes 160h arranged in two rows facing each other in the edge region may also be arranged so that the length direction faces the second direction. Then, the remaining second electrode 160 may be arranged so that the length direction is directed to the first direction Y.

Referring to FIG. 10, a plurality of first through holes 111 and second through holes 181 may be formed on the first metal substrate 110 and the second metal substrate 180, and accordingly, the first hole arrangement region 112 and the second through hole 181 may be formed. A plurality of 2-hole arrangement regions 182 may also be formed. At this time, of the plurality of first electrodes 130, the two first electrodes 130g and 130h adjacent to each first hole arrangement region 112 can be arranged so that the length direction faces the second direction X, and the two second electrodes The two first electrodes 130i and 130j adjacent to the one electrode 130g and 130h may also be arranged in the second direction X in the same length direction. At this time, a plurality of first hole arrangement regions 112 are formed, and multiples of 2 of the plurality of first electrodes 130 may be arranged so as to face the second direction X. More specifically, at least eight of the plurality of first electrodes 130, 130 g, ..., 130 n can be arranged so as to face the second direction X. Further, the remaining first electrode 130 may be arranged so that the length direction is directed to the first direction Y.

At this time, of the second electrodes 160, the two second hole arrangement regions 182 and the two second electrodes 160i and 160j adjacent to the first direction Y can be arranged so that the length direction faces the second direction X, and the second electrode 160 can be arranged. The other two second electrodes 160k and 160l adjacent to the two-hole arrangement region 182 can also be arranged in the second direction X in the same length direction.

At this time, a plurality of second hole arrangement regions 182 are formed, and multiples of 2 of the plurality of second electrodes 160 may be arranged so that the length direction is directed to the second direction X. More specifically, at least eight of the plurality of second electrodes 160, the second electrodes 160i, ..., 160p can be arranged so that the length direction faces the second direction X. Further, the second electrodes 160q arranged in two rows facing each other in the edge region may also be arranged so that the length direction faces the second direction X. Further, the remaining second electrode 160 may be arranged so that the length direction is directed to the first direction Y.

Referring to FIG. 11, the first hole arrangement region 112 is formed by a plurality of the four first electrode 130o, ..., 130r, which are separated from the first hole arrangement region 112 of one of the plurality of first electrodes 130. Can be arranged so that the length direction is toward the second direction X. Here, a plurality of electrodes may be arranged between the first hole arrangement region 112 and the first electrodes 130o, ..., 130r. However, the first electrodes 130o, ..., 130r are arranged in the second direction X by overlapping at least a part with the virtual space formed by the extension lines extending from the virtual lines defining the first hole arrangement region 112. Can be done. Further, among the plurality of first electrodes 130, the four first electrodes 130s, ..., 130v adjacent to the other one first hole arrangement region 112 in the first direction may be arranged in the second direction X.

At this time, of the second electrodes 160, the four second electrodes 160r, ..., 160u and the four second electrodes 160v, ..., Which are adjacent to each second hole arrangement region 182 and the first direction Y, ... The 160y can be arranged so that the length direction is toward the second direction X.

Referring to FIG. 12, a plurality of first through holes 111 and second through holes 181 may be formed on the first metal substrate 110 and the second metal substrate 180, and accordingly, the first hole arrangement region 112 and the second through hole 181 may be formed. A plurality of 2-hole arrangement regions 182 may also be formed. For example, the first metal substrate 110 can include four first through holes 111 and four first hole placement regions 112, and the second metal substrate 180 can include four second through holes 181 and four. The second hole arrangement area 182 can be included.

At this time, of the plurality of first electrodes 130, the two first electrodes 130-1 and 130-2 adjacent to each first hole arrangement region 112 may be arranged so that the length direction faces the second direction X. The other two first electrodes 130-3 and 130-4 adjacent to each first hole arrangement region 112 may also be arranged so that the length direction is directed to the second direction X. Along with this, multiples of 2 of the plurality of first electrodes 130 may be arranged so as to face the second direction X. More specifically, at least 16 of the plurality of first electrodes 130, the first electrodes 130-1, ..., 130-4 may be arranged so as to face the second direction X. Further, the remaining first electrode 130 may be arranged so that the length direction is directed to the first direction Y.

Further, at least one of four first electrodes 130-1, ..., 130-4 arranged adjacent to any one of the first hole arrangement regions 112 so as to face the second direction X. 2n (n is an integer of 1 or more) first electrodes 130-2n adjacent to the first electrode 130-2n may also be arranged so that the length direction is directed to the second direction X. Here, the position where the 2n first electrodes 130-2n are arranged can be variously deformed by the arrangement structure of the plurality of second electrodes 180.

Further, here, a plurality of electrodes may be arranged between the first hole arrangement region 112 and the 2n first electrodes 130-2n. However, the 2n first electrodes 130-2n may be arranged in the second direction X by overlapping at least a part of the virtual space formed by the extension lines extending from the virtual lines defining the first hole arrangement region 112. ..

In FIG. 12, 2n first electrodes 130-2n are illustrated in the second direction X, but the present invention is not limited to this, and 2n second electrodes are arranged in the first direction Y. May be good.

FIG. 12 shows a first resin layer 120 arranged between the first metal substrate 110 and the plurality of first electrodes 130, and a second resin layer 170 arranged between the second metal substrate 180 and the plurality of second electrodes 160. The first resin layer 120 and the second resin layer 180 having the same or similar structure are omitted for convenience of explanation in the embodiments shown in FIGS. 7 to 11, but are not limited thereto. Can also be applied in the examples of FIGS. 7-11.

Similarly, the terminal electrode 500 is shown only in FIG. 12, but is not limited thereto, and the terminal electrode 500 having the same or similar structure may be applied in the examples of FIGS. 7 to 11.

As illustrated in FIGS. 7-12, the two rows arranged in the second direction X so as to face each other in the edge region are included in the first electrode 130 arranged on the first metal substrate 110. Alternatively, it may be included in the second electrode 160 arranged on the second metal substrate 180.

At this time, the diameter d1 of the first through hole 111 formed on the first surface of the first metal substrate 110 in contact with the plurality of first electrodes 130 and the first surface of the second metal substrate 180 in contact with the plurality of second electrodes 160. The diameter d2 of the second through hole 181 formed in the above may be the same as each other, but it is formed on the first surface of the first metal substrate 110 in contact with the plurality of first electrodes 130 depending on the arrangement form and position of the insulating insertion member described later. The diameter d1 of the first through hole 111 and the diameter d2 of the second through hole 181 formed on the first surface of the second metal substrate 180 in contact with the plurality of second electrodes 160 may be different from each other.

On the other hand, as shown in FIGS. 7 to 12, the area of the first hole arrangement region 112 may be 4 times or more, preferably 6 times or more, and more preferably 8 times or more the area of one first electrode 130. .. When the area of the first hole arrangement region 112 is less than four times the area of one first electrode 130, the current moves to the first metal substrate 110 through the first through hole 111 under a high voltage of AC 1 kV or more, and is thermoelectric. Electrical destruction of the module can be caused. Therefore, in the field of application under high voltage, it is important to secure a sufficient insulation distance to prevent electrical destruction of the thermoelectric module. When the area of the first hole arrangement region 112 is 8 times or more the area of one first electrode 130, no electrical destruction occurs even under a high voltage of AC 2.5 kV or more. Similarly, the area of the second hole arrangement region 182 formed on the second metal substrate 180 is also 4 times or more, preferably 6 times or more, more preferably 8 times or more the area of one second electrode 160. obtain.

Further, as shown in FIGS. 7 to 12, all of the electrodes arranged closest to the first edge (not shown) of the first metal substrate 110 among the plurality of first electrodes 130 are periodic. It can be arranged so that the path between the start point and the end point of the virtual line connecting the electrode surfaces arranged closest to the first edge of the first metal substrate 110 is a straight line without a bending region. That is, in all the first electrodes 130 closest to the first edge of the first metal substrate 110, the electrodes closest to the first edge of the first metal substrate 110 among the four electrode surfaces of each first electrode 130. It can mean that the surfaces are arranged along one direction with the same spacing as the first edge of the first metal substrate 110 without any removed regions. For example, when the path between the start point and the end point of the virtual line connecting the first edge of the first metal substrate 110 and the electrode surface arranged most adjacent to the first edge is a straight line, the first row of the plurality of first electrodes 130 It can mean that all electrodes (not shown) are arranged periodically. According to this, the complexity of the process can be reduced when a plurality of first electrodes 130 are arranged on the first metal substrate 110, and the second electrode 160 and the first electrode 130 arranged on the second metal substrate 180 can be combined with each other. The arrangement structure of the thermoelectric legs arranged between the second electrodes 160 can be simplified. Further, since the shortest distance between the edge of the first metal substrate 110 and the first electrode 130 arranged most adjacent to the edge of the first metal substrate 110 is maintained constant, the edge of the first metal substrate 110 and the most. The first electrodes 130 arranged adjacent to each other can have uniform electrical characteristics.

If the path between the start point and the end point of the virtual line connecting the electrode surfaces arranged closest to the first edge of the first metal substrate 110 includes a bending region, the first of the plurality of first electrodes 130 It can mean that some of the electrodes in the row are removed or the depressed areas are included and the periodicity of the arrangement is lost. The electrode surface most adjacent to the first edge of the first metal substrate 110 in the bent region may be the electrode surface arranged in the second row (not shown), which is the next row after the first row. .. Here, the second row is a row arranged farther from the first edge of the first metal substrate 110 than the first row, and does not have to be the outermost row. Although the first electrode 130 can be arranged to include the bent region in order to additionally arrange the through hole, it provides a sufficient insulation distance in the application field under high voltage as described above. Since it is not secured, the thermoelectric module is electrically destroyed, and the effective region of the first electrode portion is reduced, and as a result, the efficiency of the thermoelectric module can be reduced.

Similarly, of the plurality of first electrodes 130, the electrode (Nth row) closest to the second edge (not shown) facing the first edge of the first metal substrate 110, and the plurality of first electrodes 130. Of the electrodes (first row) closest to the third edge (not shown) between the first edge and the second edge of the first metal substrate 110, and the first metal substrate 110 among the plurality of first electrodes 130. The electrodes (row M) closest to the fourth edge (not shown) facing the third edge are the start points and end points of the virtual lines connecting each edge of the first metal substrate 110 and the electrode surface most adjacent to each other. The path between them can be arranged so that it is a straight line with no bending region, but depending on the design such as the arrangement of the terminal electrodes, either one of the outermost columns or the outermost rows, for example, the first column and the Nth Only one of the columns, the first row and the Mth row can have an exceptional route. For example, the terminal electrode may be connected to the first electrode 130 arranged in any one of the first column, the Nth column, the first row, and the Mth row, which is the outermost column or the outermost row. , 1st column, Nth column, 1st row and Mth row can be extended from the first electrode 130 arranged in any one of the rows. Along with this, the remaining columns or rows of the outermost column and the outermost row except for one column or row in which the terminal electrode is arranged are at regular intervals from the corresponding edges of the first metal substrate 110. Can be arranged to have.

FIG. 13 shows a junction structure of a thermoelectric element according to an embodiment of the present invention.

With reference to FIG. 13, the thermoelectric element 100 can be fastened by a plurality of fastening members 400. The plurality of fastening members 400 may fasten the heat sink 220 and the second metal substrate 180, fasten the heat sink 220, the second metal substrate 180 and the first metal substrate (not shown), or fasten the heat sink 220 and the second metal substrate 180. , The first metal substrate (not shown) and the cooling part (not shown) are fastened, or the second metal substrate 180, the first metal substrate (not shown) and the cooling part (not shown) are fastened. , The second metal substrate 180 and the first metal substrate (not shown) can be fastened.

For this reason, through holes S through which the fastening member 400 penetrates may be formed in the heat sink 220, the second metal substrate 180, the first metal substrate (not shown), and the cooling portion (not shown). Here, the through hole S can include the above-mentioned second through hole 181 and the first through hole 111. Here, a separate insulating insertion member 410 may be further arranged between the second through hole 181 and the fastening member 400. The separate insulation insertion member 410 may be an insulation insertion member surrounding the outer peripheral surface of the fastening member 400 or an insulation insertion member surrounding the wall surface of the through hole S. According to this, it is possible to increase the insulation distance of the thermoelectric element.

On the other hand, the shape of the insulating insertion member 410 may be as illustrated in FIGS. 13 (a) and 13 (b). For example, as illustrated in FIG. 13A, the insulating insertion member 410 is arranged so as to form a step in the through hole S region formed in the second metal substrate 180 and surround a part of the wall surface of the through hole S. Can be done. Alternatively, the insulating insertion member 410 forms a step in the through hole S region formed in the second metal substrate 180 and extends along the wall surface of the through hole S to the first surface on which the second electrode (not shown) is arranged. It may be arranged as follows.

Referring to FIG. 13A, the diameter d2'of the through hole S on the first surface in contact with the second electrode of the second metal substrate 180 is the through hole on the first surface in contact with the first electrode of the first metal substrate. Can be the same as the diameter. At this time, due to the shape of the insulating insertion member 410, the diameter d2'of the through hole S formed on the first surface of the second metal substrate 180 is a through hole formed on the second surface opposite to the first surface. It can be different from the diameter d2 of S. Although not shown, the insulating insertion member 410 is arranged only on a part of the upper surface of the second metal substrate 180 without forming a step in the through hole S region, or the through hole S is arranged from the upper surface of the second metal substrate 180. When the insulating insertion member 410 is arranged so as to extend to a part or all of the wall surface of the second metal substrate 180, the diameter d2'of the through hole S formed on the first surface of the second metal substrate 180 is on the opposite surface of the first surface. It may be the same as the diameter d2 of the through hole S formed on a second surface.

Referring to FIG. 13B, due to the shape of the insulating insertion member 410, the diameter d2'of the through hole S on the first surface in contact with the second electrode of the second metal substrate 180 is different from that of the first electrode of the first metal substrate. It may be larger than the diameter of the through hole on the first surface in contact. At this time, the diameter d2'of the through hole S on the first surface of the second metal substrate 180 may be 1.1 to 2.0 times the diameter of the through hole on the first surface of the first metal substrate. When the diameter d2'of the through hole S on the first surface of the second metal substrate 180 is less than 1.1 times the diameter of the through hole on the first surface of the first metal substrate, the insulating effect of the insulating insertion member 410 is small. Therefore, insulation destruction of the thermoelectric element may be caused, and if the diameter d2'of the through hole S on the first surface of the second metal substrate 180 exceeds 2.0 times the diameter of the through hole on the first surface of the first metal substrate. Since the size of the region occupied by the through hole S is relatively increased, the effective area of the second metal substrate 180 is reduced, and the efficiency of the thermoelectric element may be reduced.

Then, depending on the shape of the insulating insertion member 410, the diameter d2'of the through hole S formed on the first surface of the second metal substrate 180 is the through hole S formed on the second surface opposite to the first surface. It can be different from the diameter d2. As described above, when a step is not formed in the through hole S region of the second metal substrate 180, the diameter d2'of the through hole S formed on the first surface of the second metal substrate 180 is the opposite surface of the first surface. It may be the same as the diameter d2 of the through hole S formed on the second surface.

In the embodiment of the present invention, each virtual line of the first electrode 130 or the second electrode 160 defines each hole arrangement area even if it is separated from the first hole arrangement area 112 or the second hole arrangement area 182. In the virtual space formed by the extension line extending from, at least a part of at least two electrodes overlaps and is arranged in the second direction X, so that each hole arrangement area is formed in the limited space. It is possible to optimally arrange a plurality of P-type and N-type thermoelectric legs without wasting space.

The thermoelectric element according to the embodiment of the present invention can act on a power generation device, a cooling device, a heating device, and the like. Specifically, the thermoelectric element according to the embodiment of the present invention mainly includes an optical communication module, a sensor, a medical device, a measuring device, an aerospace industry, a refrigerator, a chiller, an automobile ventilation sheet, a cup holder, a washing machine, and the like. It can be applied to a dryer, a wine cellar, a water purifier, a power supply device for a sensor, a thermopile, and the like.

Here, as an example in which the thermoelectric element according to the embodiment of the present invention is applied to a medical device, there is a PCR (Polymerase Chain Reaction) device. A PCR device is a device for amplifying DNA and determining the base sequence of DNA, and is a device that requires precise temperature control and a thermal cycle. For this purpose, a Peltier-based thermoelectric element can be applied.

Another example in which the thermoelectric element according to the embodiment of the present invention is applied to a medical device is a photodetector. Here, the photodetector includes an infrared / ultraviolet detector, a CCD (Charge Coupled Device) sensor, an X-ray detector, a TTRS (Thermoelectric Thermal Reference Source), and the like. Pertier thermoelectric elements may be applied for cooling the photodetector. Along with this, it is possible to prevent a wavelength change, a decrease in output, a decrease in resolution, and the like due to an increase in the temperature inside the photodetector.

Yet another example of application of the thermoelectric element according to the embodiment of the present invention to a medical device is in the field of immunoassay, in vitro diagnostics, temperature control and cooling system (general temperature control and cooling systems). ), Physical therapy field, liquid chiller system, blood / plasma temperature control field, etc. Along with this, precise temperature control is possible.

Yet another example in which the thermoelectric element according to the embodiment of the present invention is applied to a medical device is an artificial heart. Along with this, power can be supplied to the artificial heart.

Examples of applications of the thermoelectric element according to the embodiment of the present invention to the aerospace industry include a star tracking system, a thermal imaging camera, an infrared / ultraviolet detector, a CCD sensor, a Hubble Space Telescope, and TTRS. Along with this, the temperature of the image sensor can be maintained.

Other examples in which the thermoelectric element according to the embodiment of the present invention is applied to the aerospace industry include a cooling device, a heater, a power generation device, and the like.

In addition to this, the thermoelectric element according to the embodiment of the present invention can be applied to other industrial fields for power generation, cooling and heating.

Although the above description has been made with reference to preferred embodiments of the present invention, skilled artisans in the art will appreciate the invention within the scope of the invention and areas described in the claims below. It will be appreciated that the invention can be modified and modified in various ways.

C: Cooling unit 10: Thermoelectric module 110: First metal substrate 111: First through hole 112: First hole arrangement area 120: First resin layer 130: Multiple first electrodes 140: Multiple P-type thermoelectric legs 150: Multiple N-type thermoelectric legs 160: Multiple second electrodes 170: Second resin layer 180: Second metal substrate 181: Second through hole 182: Second hole arrangement area 190: Fastening member 200: Insulation material 220: Heat sink 230 : Connecting member

Claims (20)

First metal substrate including first through hole;
The first insulating layer arranged on the first metal substrate;
A first electrode portion arranged on the first insulating layer and including a plurality of first electrodes;
A plurality of P-type and N-type thermoelectric legs arranged on the first electrode portion;
A second electrode portion arranged on the plurality of P-type and N-type thermoelectric legs and including a plurality of second electrodes;
A second insulating layer arranged on the second electrode portion; and a second metal substrate arranged on the second insulating layer and including a second through hole;
The first metal substrate includes an effective region in which the first electrode portion is arranged and an outer shell region formed in the outer shell of the effective region.
The second metal substrate includes an effective region in which a second electrode portion is arranged and an outer shell region formed in the outer shell of the effective region.
The first through hole is formed in the effective region of the first metal substrate.
The second through hole is formed in the effective region of the second metal substrate.
A thermoelectric module in which the first through hole and the second through hole are formed at positions corresponding to each other. The thermoelectric module according to claim 1, further comprising a fastening member that passes through the first through hole and the second through hole to fix the first metal substrate and the second metal substrate. The length direction of a part of the plurality of first electrodes arranged on the first metal substrate is different from the length direction of the remaining part.
The length direction of a part of the plurality of second electrodes arranged on the second metal substrate is different from the length direction of the remaining part.
The thermoelectric module according to claim 1, wherein the length direction is the length direction of each electrode. At least two of the plurality of first electrodes of the first electrode portion excluding the edge region are arranged in a second direction whose length direction is perpendicular to the first direction, and the remaining electrodes are said to have a length direction. Arranged in the first direction,
At least two of the plurality of second electrodes of the second electrode portion excluding the edge region are arranged in the second direction whose length direction is perpendicular to the first direction, and the remaining electrodes have the length direction. The thermoelectric module according to claim 3, which is arranged in the first direction. Of the plurality of first electrodes excluding the edge region, the number of the first electrodes arranged in the second direction in the length direction is a multiple of 2.
The thermoelectric module according to claim 4, wherein the number of the second electrodes arranged in the second direction in the length direction among the plurality of second electrodes excluding the edge region is a multiple of 2. 5. Of the plurality of second electrodes, at least a part of the second electrodes arranged in two columns or two rows facing each other in the edge region is arranged in the second direction in the length direction. The thermoelectric module described in. The first metal substrate includes a first hole arrangement region which is a space formed by a virtual line connecting the surfaces of the first electrodes arranged so as to be adjacent to each other most adjacent to the first through hole.
The second metal substrate includes a second hole arrangement region which is a space formed by a virtual line connecting the surfaces of the second electrodes arranged so as to be adjacent to each other most adjacent to the second through hole.
At least one first electrode adjacent to the first hole arrangement region is arranged in the second direction in the length direction.
The thermoelectric module according to claim 6, wherein at least one second electrode adjacent to the second hole arrangement region is arranged in the second direction in the length direction. The first metal substrate includes a first hole arrangement region which is a space formed by a virtual line connecting the surfaces of the first electrodes arranged so as to be adjacent to each other most adjacent to the first through hole.
The second metal substrate includes a second hole arrangement region which is a space formed by a virtual line connecting the surfaces of the second electrodes arranged so as to be adjacent to each other most adjacent to the second through hole.
The at least one first electrode is arranged so as to at least partially overlap the virtual space formed by the extension line extending from the virtual line defining the first hole arrangement area.
The thermoelectric module according to claim 7, wherein the at least one second electrode is arranged so as to overlap at least a part of a virtual space formed by an extension line extending from the virtual line defining the second hole arrangement region. .. The first through hole includes a plurality of holes.
The first hole arrangement region is formed around the plurality of first through holes, respectively.
The second through hole includes a plurality of holes.
The thermoelectric module according to claim 8, wherein the second hole arrangement region is formed around the plurality of second through holes. The thermoelectric module according to claim 9, wherein the plurality of the first through holes and the plurality of the second through holes are formed at positions corresponding to each other. The thermoelectric module according to claim 10, further comprising a third through hole arranged in an outer region of the first metal substrate. The thermoelectric module according to claim 11, wherein the ratio of the area of the second metal substrate to the area of the first metal substrate is 0.5 to 0.95. The thermoelectric module according to claim 12, further comprising an insulating insertion member arranged adjacent to the fastening member. The thermoelectric module according to claim 13, wherein the diameter of the first through hole and the diameter of the second through hole are different from each other. The thermoelectric module according to claim 14, wherein the diameter of the second through hole is 1.1 to 2.0 times the diameter of the first through hole. The thermoelectric module according to claim 15, wherein a part of the insulating insertion member is arranged in the second through hole. The thermoelectric module according to claim 16, further comprising a third insulating layer arranged between the first metal substrate and the first insulating layer. The thermoelectric module according to claim 17, wherein the second metal substrate includes a plurality of second metal substrates separated from each other, and each second metal substrate includes at least one second through hole. The thermoelectric module according to claim 18, wherein an insulating member is arranged between a plurality of second metal substrates separated from each other. The thermoelectric module according to any one of claims 1 to 19, and a cooling unit coupled to the first metal substrate.
A power generation device in which a part of the fastening member is arranged in the cooling unit.

Images