KR20210084990A - Display device - Google Patents

Abstract

A display device according to an embodiment of the present invention includes: a substrate; a light emitting element disposed on the substrate; a bank layer disposed on the substrate and defining a light emitting region and a non-light emitting region; an encapsulation part arranged to cover the light emitting element and the bank layer, and including a flat part and an inclined part surrounding the flat part; a step difference compensation layer disposed on the inclined part to compensate for the step difference of the encapsulation part; and a touch part disposed to be in contact with the upper surface of the encapsulation part and the upper surface of the step difference compensation layer. In the outer part of the substrate, the distance between a touch electrode and a touch line and a conductive component disposed below them can be separated to a certain level.

Description

display device {DISPLAY DEVICE}

The present invention relates to a display device, and more particularly, to a touch screen-integrated display device capable of improving touch performance in an outer portion of a substrate.

The electroluminescent display device is a self-luminous display device, and unlike a liquid crystal display device, it does not require a separate light source, so it can be manufactured in a lightweight and thin form. In addition, the electroluminescent display device is not only advantageous in terms of power consumption due to low voltage driving, but also has excellent color realization, response speed, viewing angle, and contrast ratio (CR), and is being studied as a next-generation display.

Among the electroluminescent display devices, there is a touch screen-integrated display device including a touch unit capable of recognizing a user's touch. The touch screen integrated display device can directly input information using a finger or a pen, and thus is widely applied to navigation, portable terminals, and home appliances.

Accordingly, the problem to be solved by the present invention is to arrange a step difference compensation layer on the inclined portion of the encapsulation part, so that the distance between the touch electrode and the touch line and the conductive component disposed below them at the outer part of the substrate can be spaced apart to a certain level. It is to provide a display device with

Another object of the present invention is to provide a display device capable of improving touch performance of a touch unit by minimizing parasitic capacitance that may occur in the touch unit.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

A display device according to an embodiment of the present invention includes a substrate, a light emitting device disposed on the substrate, a bank layer disposed on the substrate, and a bank layer defining a light emitting region and a non-emitting region, the light emitting device and the bank layer are disposed, , an encapsulation portion including a flat portion and an inclined portion surrounding the flat portion, a step compensation layer disposed on the inclined portion to compensate for the step difference of the encapsulation portion, and an upper surface of the encapsulation portion and a touch portion disposed in contact with the upper surface of the step compensation layer .

A display device according to another embodiment of the present invention includes a substrate including a plurality of sub-pixels, a plurality of light-emitting elements disposed on the plurality of sub-pixels, and including an anode, a light emitting layer, and a cathode, and covers the ends of the anode, and emits light An encapsulation comprising a bank layer defining regions and non-emissive regions, at least one inorganic encapsulation layer and an organic encapsulation layer, the encapsulation having a first planar surface and a second surface extending from the first surface and inclined relative to the first surface. , a step difference mitigating layer and an encapsulation part for alleviating the step difference due to the second surface, and a touch part disposed in contact with the step difference mitigating layer.

The specific details of the embodiment are included in the detailed description and drawings.

According to the present invention, a step difference generating section of the touch unit can be reduced by disposing a step difference compensation layer on the encapsulation part.

According to the present invention, the performance of the touch unit may be improved by securing a separation distance between the touch unit disposed on the encapsulation unit and the conductive component disposed under the encapsulation unit.

The effect according to the present invention is not limited by the contents exemplified above, and more various effects are included in the present invention.

1 is a schematic plan view of a display device according to an exemplary embodiment.
FIG. 2 is a cross-sectional view taken along II-II′ of FIG. 1 .
3 is a schematic plan view of a display device according to another exemplary embodiment.
4 is a cross-sectional view taken along line IV-IV' of FIG. 3 .

Advantages and features of the present invention, and a method of achieving them, will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different shapes, only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention pertains It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, areas, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are illustrative and the present invention is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted. When 'include', 'have', 'consists of', etc. mentioned in the present invention are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the case in which the plural is included is included unless otherwise explicitly stated.

In interpreting the components, it is interpreted as including an error range even if there is no separate explicit description.

In the case of a description of the positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'beside', etc., 'right' Alternatively, one or more other parts may be positioned between the two parts unless 'directly' is used.

Reference to a device or layer “on” another device or layer includes any intervening layer or other device directly on or in the middle of another device.

Also, although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

Like reference numerals refer to like elements throughout.

The area and thickness of each component shown in the drawings are shown for convenience of description, and the present invention is not necessarily limited to the area and thickness of the illustrated component.

Each feature of the various embodiments of the present invention may be partially or wholly combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments may be implemented independently of each other or may be implemented together in a related relationship. may be

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a display device according to an exemplary embodiment. FIG. 2 is a cross-sectional view taken along II-II′ of FIG. 1 . In FIG. 1 for convenience of explanation, among various components of the display device 100 , a substrate 101 , a bank layer 110 , an organic encapsulation layer 152 , a touch unit 160 , a routing wire 113 , and a pad (PAD) , only the touch pad (T-PAD) and the step compensation layer 170 are shown.

1 and 2 , a substrate 101 is a support member for supporting other components of the display device 100 , and may be made of an insulating material. For example, the substrate 101 may be made of glass or resin. In addition, the substrate 101 may include a polymer or plastic such as polyimide (PI), or may be made of a material having flexibility.

The substrate 101 includes a display area AA and a non-display area NA.

The display area AA is an area for displaying an image. A plurality of sub-pixels for displaying an image and a circuit unit for driving the plurality of sub-pixels may be disposed in the display area AA. The circuit unit may include various thin film transistors, capacitors, and wires for driving the sub-pixels. For example, the circuit unit may include various components such as a driving thin film transistor, a switching thin film transistor, a storage capacitor, a gate line, and a data line, but is not limited thereto.

The non-display area NA is an area in which an image is not displayed. The non-display area NA surrounds the periphery of the display area AA. Various wirings and circuits for driving the light emitting device 130 of the display area AA are disposed in the non-display area NA. For example, a link wire for transmitting a signal to the plurality of sub-pixels and circuits of the display area AA or a driving IC such as a gate driver or a data driver may be disposed in the non-display area NA, but this is not limited thereto. doesn't happen

More specifically, a driver such as a gate driver for driving the display area AA and various signal lines connected to the driver may be disposed in the non-display area NA. The gate driver may be embedded in the non-display area NA on at least one of both sides of the display area AA in a gate-in-panel (GIP) manner. That is, the gate driver may be disposed on both sides of the display area AA, or may be disposed on at least one of both sides of the display area AA.

A pad PAD is disposed in the non-display area NA. The pad PAD may supply a signal to a plurality of sub-pixels and circuits of the display area AA. The pad PAD may be disposed in the non-display area NA to supply a power voltage, a data voltage, etc. to the plurality of sub-pixels and circuits of the display area AA. The number of pads PAD shown in FIG. 1 is exemplary, and the number of pads PAD may be variously changed according to a design, but is not limited thereto.

As described above, in order for the pad PAD to supply various signals, a flexible film may be bonded to the pad PAD. For example, a flexible film on which a driving IC such as a gate driver IC and a data driver IC is disposed is bonded to the pad PAD, and various signals are supplied to a plurality of sub-pixels and circuits through the flexible film and the pad PAD. can

A touch pad T-PAD is disposed in the non-display area NA. The touch pad T-PAD may supply a driving signal for driving the touch unit 160 to the touch unit 160 , or may transmit a touch signal sensed by the touch unit 160 to the outside. Accordingly, a flexible film for driving the touch unit 160 may be bonded to the touch pad T-PAD.

1 illustrates that the non-display area NA surrounds the display area AA, the non-display area NA may be an area extending from one side of the display area AA, but is not limited thereto.

A plurality of sub-pixels are disposed in the display area AA of the substrate 101 . Each of the plurality of sub-pixels is an individual unit emitting light, and a light emitting device 130 and a driving circuit are formed in each of the plurality of sub-pixels. For example, the plurality of sub-pixels may include a red sub-pixel, a green sub-pixel, and a blue sub-pixel, but is not limited thereto, and the plurality of sub-pixels may further include a white sub-pixel.

1 and 2 , a display device 100 according to an exemplary embodiment includes a substrate 101 , a thin film transistor 120 , a planarization layer 107 , a light emitting device 130 , and a bank layer 110 . ), a dam 190 , an encapsulation unit 150 , a routing wire 113 , a touch unit 160 , and a step difference compensation layer 170 .

Referring to FIG. 2 , a substrate 101 is a substrate for supporting and protecting various components of the display device 100 . The substrate 101 may be made of glass or a plastic material having flexibility. When the substrate 101 is made of a plastic material, it may be made of, for example, polyimide (PI). However, it is not limited thereto.

A buffer layer 103 is disposed on the substrate 101 . The buffer layer 103 may improve adhesion between the layers formed on the buffer layer 103 and the substrate 101 , and may block alkali components leaking from the substrate 101 . The buffer layer 103 may be formed of a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or a multi-layer of silicon nitride (SiNx) or silicon oxide (SiOx), but is not limited thereto. The buffer layer 103 may be omitted based on the type and material of the substrate 101 , the structure and type of the thin film transistor 120 , and the like.

The thin film transistor 120 is disposed on the substrate 101 and the buffer layer 103 . The thin film transistor 120 may be used as a driving element of the display device 100 . The thin film transistor 120 includes a gate electrode 121 , an active layer 122 , a source electrode 123 , and a drain electrode 124 . In the display device 100 according to an embodiment of the present invention, in the thin film transistor 120 , an active layer 122 is disposed on a gate electrode 121 , and a source electrode 123 and a drain are disposed on the active layer 122 . As a structure in which the electrode 124 is disposed, the thin film transistor having a bottom gate structure in which the gate electrode 121 is disposed at the bottom, but is not limited thereto.

The gate electrode 121 of the thin film transistor 120 is disposed on the substrate 101 and the buffer layer 103 . The gate electrode 121 may be formed of various metal materials, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and It may be any one of copper (Cu), an alloy of two or more, or a multilayer thereof, but is not limited thereto.

A gate insulating layer 105 is disposed on the gate electrode 121 . The gate insulating layer 105 is a layer for electrically insulating the gate electrode 121 and the active layer 122 and may be made of an insulating material. For example, the gate insulating layer 105 may be formed of a single layer of inorganic silicon nitride (SiNx) or silicon oxide (SiOx) or a multilayer of silicon nitride (SiNx) or silicon oxide (SiOx), but is limited thereto. it is not going to be

An active layer 122 is disposed on the gate insulating layer 105 . The active layer 122 is disposed to overlap the gate electrode 121 . For example, the active layer 122 may be formed of an oxide semiconductor, amorphous silicon (a-Si), polycrystalline silicon (poly-Si), or an organic semiconductor. can

A source electrode 123 and a drain electrode 124 are disposed on the active layer 122 . The source electrode 123 and the drain electrode 124 are spaced apart from each other on the same layer. The source electrode 123 and the drain electrode 124 may be electrically connected to the active layer 122 in a manner in contact with the active layer 122 . The source electrode 123 and the drain electrode 124 may be formed of various metal materials, for example, molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), It may be any one of neodymium (Nd) and copper (Cu), an alloy of two or more thereof, or a multilayer thereof, but is not limited thereto.

A passivation layer 109 is disposed on the thin film transistor 120 . The passivation layer 109 may be formed of a single layer of inorganic silicon nitride (SiNx) or silicon oxide (SiOx) or a multilayer of silicon nitride (SiNx) or silicon oxide (SiOx), but is not limited thereto. The passivation layer 109 may extend to the non-display area NA to cover various wirings disposed in the non-display area NA. However, the passivation layer 109 may be omitted based on the structure and type of the thin film transistor 120 .

A planarization layer 107 is disposed on the thin film transistor 120 . The planarization layer 107 planarizes an upper portion of a partial region of the substrate 101 . For example, the planarization layer 107 may be disposed in the display area AA, and the planarization layer 107 may not be disposed in all or part of the non-display area NA.

The planarization layer 107 may be composed of a single layer or a multilayer, and may be made of an organic material. For example, the planarization layer 107 may be formed of an acryl-based organic material, but is not limited thereto. The planarization layer 107 includes a contact hole for electrically connecting the thin film transistor 120 and the light emitting device 130 .

The light emitting device 130 is disposed on the planarization layer 107 . The light emitting device 130 is a self-emitting device that emits light, and may be driven by receiving a voltage from the thin film transistor 120 or the like. The light emitting device 130 includes an anode 131 , a light emitting layer 132 , and a cathode 133 .

The anode 131 is disposed separately for each sub-pixel on the planarization layer 107 . The anode 131 is electrically connected to the thin film transistor 120 through a contact hole formed in the planarization layer 107 . The anode 131 is made of a conductive material capable of supplying holes to the emission layer 132 . For example, the anode 131 may include tin oxide (TO), indium tin oxide (ITO), indium zinc oxide (IZO), or indium tin oxide (Indium Zinc Tin Oxide; ITO); ITZO) and the like, and a reflective layer made of a material having excellent reflectivity such as silver (Ag) or a silver alloy (Ag alloy), but is not limited thereto.

A bank layer 110 is disposed on the anode 131 and the planarization layer 107 . The bank layer 110 is an insulating layer for separating adjacent sub-pixels. The bank layer 110 may be disposed to open a portion of the anode 131 , and the bank layer 110 may be formed of an organic insulating material disposed to cover an edge of the anode 131 .

A light emitting layer 132 is disposed on the anode 131 . The light emitting layer 132 may be composed of one light emitting layer 132 , or may have a structure in which a plurality of light emitting layers 132 emitting light of different colors are stacked. The emission layer 132 may further include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. Referring to FIG. 2 , the emission layer 132 is illustrated as being separately disposed in each sub-pixel, but the present invention is not limited thereto, and may be disposed as one layer over the entire sub-pixel. In addition, the emission layer 132 may be an organic emission layer made of an organic material, but is not limited thereto.

A cathode 133 is disposed on the emission layer 132 . The cathode 133 is made of a conductive material capable of supplying electrons to the emission layer 132 . For example, the cathode 133 may be formed of a metal material such as copper (Cu), aluminum (Al), silver (Ag), magnesium-silver alloy (MgAg), or the like. In addition, the cathode 133 is indium tin oxide (Indium Tin Oxide, ITO), indium zinc oxide (Indium Zin Oxide, IZO), indium tin zinc oxide (Indium Tin Zinc Oxide, ITZO), zinc oxide (Zinc Oxide, ZnO) and a tin oxide (TO)-based transparent conductive oxide or a ytterbium (Yb) alloy, but is not limited thereto. Referring to FIG. 2 , the cathode 133 disposed in each sub-pixel is illustrated as being connected to each other, but may be disposed separately for each sub-pixel like the anode 131 , but is not limited thereto.

When the cathode 133 is disposed to be connected in each sub-pixel, the cathode 133 may be disposed outside the non-display area NA. At this time, the cathode 133 is a power wiring 114 disposed on the substrate 101 through the connection electrode 112 disposed to cover the top and side surfaces of the planarization layer 107 disposed on the outer portion of the substrate 101 . can be contacted with

The display area AA may include a plurality of light emitting areas EA and a non-emission area NEA between the plurality of light emitting areas EA.

An area in which each of the plurality of light emitting devices 130 is disposed may be a plurality of light emitting areas EA. Each of the plurality of light emitting areas EA may independently emit light of one color, and may correspond to a plurality of sub-pixels or may be an area in which the bank layer 110 is not disposed. For example, the plurality of light emitting areas EA may include a red light emitting area, a green light emitting area, and a blue light emitting area, but is not limited thereto. The plurality of light emitting areas EA may be disposed to be spaced apart from each other, for example, may be disposed in a grid shape arranged in a row direction and a column direction, but is not limited thereto.

An area in which the plurality of light emitting devices 130 is not disposed may be a non-emission area NEA. The non-emission area NEA is an area disposed between the plurality of light emitting areas EA, and may be an area in which the bank layer 110 is disposed. Since the non-emission area NEA is disposed to surround the plurality of light emitting areas EA, it may have a mesh shape.

The encapsulation unit 150 is disposed on the light emitting device 130 . The encapsulation unit 150 is a sealing member that protects the light emitting device 130 from external moisture, oxygen, impact, and the like. The encapsulation unit 150 may be disposed to cover the entire display area AA in which the light emitting device 130 is disposed, and the encapsulation unit 150 may be a portion of the non-display area NA extending from the display area AA. It can be arranged to cover up to Accordingly, the encapsulation unit 150 may be disposed to cover the light emitting device 130 and the bank layer 110 disposed in the display area AA.

The encapsulation unit 150 includes a flat portion 150b having a flat shape and an inclined portion 150a surrounding the flat portion 150b. For example, the encapsulation part 150 includes a flat part 150b having a first surface that is a flat surface in a portion of the display area AA and the non-display area NA, and extends from the first surface and extends from the first surface. It may have an inclined portion 150a having a second surface inclined with respect to . In this case, the inclined portion 150a may be inclined in an outer direction of the substrate 101 . For example, as shown in FIG. 2 , a step may occur in the inclined portion 150a that is an outer region of the encapsulation portion 150 . At this time, a step difference may occur in the encapsulation unit 150 from a region where the end of the bank layer 110 is disposed, which is a region where the relatively thick bank layer 110 is not disposed. Accordingly, since the boundary between the first surface and the second surface may overlap the end of the bank layer 110 , the flat portion 150b may be defined as a portion of the encapsulation portion 150 overlapping the bank layer 110 . Also, the inclined portion 150a may be defined as a portion of the encapsulation portion 150 that does not overlap the bank layer.

The encapsulation unit 150 is disposed on the first inorganic encapsulation layer 151 and the first inorganic encapsulation layer 151 made of an inorganic material, and is disposed on the organic encapsulation layer 152 and the organic encapsulation layer 152 made of an organic material. A second inorganic encapsulation layer 153 may be included.

The first inorganic encapsulation layer 151 is disposed along the bank layer 110 and the light emitting device 130 disposed below. Accordingly, the first inorganic encapsulation layer 151 seals the display area AA to protect the light emitting device 130 from oxygen and moisture penetrating into the display area AA. The first inorganic encapsulation layer 151 may be disposed not only in the display area AA but also in the non-display area NA extending from the display area AA. The first inorganic encapsulation layer 151 may be formed of an inorganic material, for example, may be formed of an inorganic material such as silicon nitride (SiNx) or silicon oxynitride (SiON), but is not limited thereto.

An organic encapsulation layer 152 is disposed on the first inorganic encapsulation layer 151 . The organic encapsulation layer 152 is a layer for planarizing the upper portion of the first inorganic encapsulation layer 151 , and fills cracks that may occur in the first inorganic encapsulation layer 151 , and is formed on the first inorganic encapsulation layer 151 . When a foreign material is disposed, the upper portion of the foreign material may be planarized.

The organic encapsulation layer 152 may be disposed up to a portion of the display area AA and the non-display area NA extending from the display area AA.

The organic encapsulation layer 152 may be disposed on a portion of the display area AA and the non-display area NA to planarize a surface thereof. Meanwhile, an end of the organic encapsulation layer 152 may be inclined toward the substrate 101 . For example, the organic encapsulation layer 152 may be disposed to cover the bank layer 110 , and may have a surface inclined toward the substrate 101 due to a step difference occurring at the end of the bank layer 110 . . That is, a step difference in the encapsulation unit 150 may occur due to a step difference in the organic encapsulation layer 152 . In this case, the flat surface of the organic encapsulation layer 152 may be positioned on the flat portion 150b of the encapsulation unit 150 , and the inclined surface of the organic encapsulation layer 152 is the inclined portion 150a of the encapsulation unit 150 . ) can be located.

The organic encapsulation layer 152 may be an epoxy-based or acrylic-based polymer, but is not limited thereto. The organic encapsulation layer 152 may be made of a material having a viscosity of about 10 cP.

A second inorganic encapsulation layer 153 is disposed on the organic encapsulation layer 152 . The second inorganic encapsulation layer 153 is disposed in contact with the organic encapsulation layer 152 , and thus, the second inorganic encapsulation layer 153 may be disposed in a flat shape or an inclined shape along the surface of the organic encapsulation layer 152 . can

The second inorganic encapsulation layer 153 may encapsulate the organic encapsulation layer 152 together with the first inorganic encapsulation layer 151 in a manner in which the second inorganic encapsulation layer 153 contacts the first inorganic encapsulation layer 151 at the outer portion of the substrate 101 . That is, the ends of the first inorganic encapsulation layer 151 and the second inorganic encapsulation layer 153 may be disposed outside the substrate 101 than the ends of the organic encapsulation layer 152 .

The second inorganic encapsulation layer 153 may be formed of an inorganic material, for example, may be formed of an inorganic material such as silicon nitride (SiNx) or silicon oxynitride (SiON), but is not limited thereto.

In FIG. 2 , the encapsulation unit 150 includes the first inorganic encapsulation layer 151 , the organic encapsulation layer 152 , and the second inorganic encapsulation layer 153 , but the inorganic encapsulation unit included in the encapsulation unit 150 . The number of layers and the number of organic encapsulation layers are not limited thereto.

A step compensation layer 170 is disposed on the encapsulation unit 150 . The step compensation layer 170 is disposed on the outer portion of the substrate 101 .

The step compensation layer 170 may have a flat top surface extending from the flat part 150b of the encapsulation part 150 . In this case, the step compensation layer 170 may be disposed to overlap the inclined portion 150a of the encapsulation unit 150 . Accordingly, the step difference compensation layer 170 may compensate for the step difference occurring in the inclined portion 150a of the encapsulation unit 150 . That is, the step difference compensating layer 170 may relieve a step difference due to the second surface, and thus may be referred to as a step difference alleviating layer. In this case, the end of the step compensation layer 170 may be disposed to overlap the end of the bank layer 110 . That is, a region where the top surface of the step compensation layer 170 and the top surface of the encapsulation unit 150 meet may overlap the end of the bank layer 110 .

The step compensation layer 170 may be disposed on the outer portion of the substrate 101 to form an inclination with the substrate 101 . In this case, the angle between the surface of the step compensation layer 170 and the substrate 101 in the outer portion of the substrate 101 may be greater than the angle between the surface of the inclined portion 150a of the encapsulation unit 150 and the substrate 101 . have.

The step compensation layer 170 may be made of an organic material. The step compensation layer 170 may be made of, for example, silicon oxycarbon (SiOxCz), acrylic, or epoxy-based resin, but is not limited thereto.

The viscosity of the step compensation layer 170 may be higher than that of the organic encapsulation layer 152 . The step compensation layer 170 may be made of a material having a higher viscosity than that of the organic encapsulation layer 152 that generates the step in order to compensate for the step generated by the inclined portion 150a of the encapsulation unit 150 . For example, if the organic encapsulation layer 152 is made of a material having a viscosity of about 10 cP, the step compensation layer 170 may be made of a material having a viscosity of about 1,000 cP to 10,000 cP.

A dam 190 is disposed on the substrate 101 in the non-display area NA. The dam 190 is disposed to control the spread of the organic material disposed to cover the display area AA. For example, the dam 190 may be disposed between the outer portion of the substrate 101 and the display area AA to control the shape of the material made of the organic material to suppress the overflow of the material made of the organic material. One or more dams 190 may be configured, and the number of dams to be disposed is not limited.

The dam 190 may be made of an organic material. The dam 190 may be made of, for example, an acryl-based organic material, but is not limited thereto. In addition, the dam 190 may be formed of the same material in the same process as the planarization layer 107 and/or the bank layer 110 , but is not limited thereto. In addition, the dam 190 may be composed of a single layer or may be composed of a plurality of layers.

Referring to FIG. 2 , the dam 190 includes a first dam 191 and a second dam 192 .

The first dam 191 is disposed in an area adjacent to the display area AA. The first dam 191 is disposed outside the substrate 101 with respect to the end of the organic encapsulation layer 152 . Accordingly, the first dam 191 may prevent the organic encapsulation layer 152 from overflowing. Although it is illustrated that there are two first dams 191 in FIG. 2 , the number of first dams 191 is not limited thereto.

The first dam 191 may be disposed under the first inorganic encapsulation layer 151 and the second inorganic encapsulation layer 153 disposed in the non-display area NA. Specifically, the first inorganic encapsulation layer 151 may be disposed to contact the top and side surfaces of the first dam 191 , and the second inorganic encapsulation layer 153 is formed on the first inorganic encapsulation layer 151 . 1 It may be disposed to be in contact with the inorganic encapsulation layer 151 .

The second dam 192 is disposed outside the first dam 191 on the uppermost layer of the encapsulation unit 150 . The second dam 192 is disposed outside the substrate 101 with respect to the end of the step compensation layer 170 . In this case, the second dam 192 may be disposed outside the substrate 101 than the first dam 191 . That is, the second dam 192 may be disposed outside the first dam 191 on the second inorganic encapsulation layer 153 . Accordingly, the second dam 192 may prevent the step difference compensation layer 170 from overflowing.

The height of the second dam 192 may be higher than the height of the first dam 191 . Accordingly, the second dam 192 may easily prevent overflow of the step compensation layer 170 disposed to form a large inclination angle with the substrate 101 .

The touch unit 160 is disposed on the encapsulation unit 150 and the step difference compensation layer 170 . The touch unit 160 may be disposed in the display area AA including the light emitting device 130 to sense a touch input. The touch unit 160 may sense external touch information using a user's finger or a touch pen. The touch unit 160 includes a first inorganic insulating layer 161 , a second inorganic insulating layer 162 , an organic insulating layer 163 , a touch line 164 , and a touch electrode 165 .

A first inorganic insulating layer 161 is disposed on the encapsulation unit 150 and the step difference compensation layer 170 . The first inorganic insulating layer 161 is in contact with the encapsulation part 150 and the step difference compensation layer 170 . Accordingly, the first inorganic insulating layer 161 may be disposed in a flat shape along the first surface of the flat portion 150b of the encapsulation unit 150 and the upper surface of the step compensation layer 170 . The first inorganic insulating layer 161 may be formed of an inorganic material. For example, it may be made of an inorganic material such as silicon nitride (SiNx) or silicon oxynitride (SiON), but is not limited thereto.

A touch line 164 is disposed on the first inorganic insulating layer 161 . Accordingly, the touch line 164 may be disposed in a flat shape along the first surface of the flat portion 150b of the encapsulation unit 150 and the upper surface of the step compensation layer 170 . The touch line 164 is disposed in the non-emission area NEA on the first inorganic insulating layer 161 . The touch line 164 may be disposed in a row direction or a column direction. The touch line 164 may supply a touch driving signal for driving the touch unit 160 . Also, the touch line 164 may transmit touch information sensed by the touch unit 160 to the driving IC.

A second inorganic insulating layer 162 is disposed on the touch line 164 and the first inorganic insulating layer 161 . The second inorganic insulating layer 162 may prevent short-circuiting of the adjacent touch lines 164 . The second inorganic insulating layer 162 may be formed of an inorganic material. For example, it may be made of an inorganic material such as silicon nitride (SiNx) or silicon oxynitride (SiON), but is not limited thereto.

A touch electrode 165 is disposed on the touch line 164 and the second inorganic insulating layer 162 . Accordingly, the touch electrode 165 may be disposed in a flat shape along the first surface of the flat portion 150b of the encapsulation unit 150 and the upper surface of the step compensation layer 170 . The touch electrodes 165 may be disposed in a row direction and a column direction. For example, the thin film transistor 120 and the touch electrode 165 disposed in any one of the row direction or the column direction may be disposed on the touch line 164 , and may be disposed on the other one of the row direction or the column direction. The disposed touch electrode 165 may be disposed on the second inorganic insulating layer 162 . The touch electrodes 165 disposed in the column direction and the touch electrodes 165 disposed in the row direction may be connected to each other through a bridge electrode to have a mesh-like structure. A mutual capacitance (Cm) may be formed at the intersection of the touch line 164 and the touch electrode 165 . Accordingly, a touch input may be sensed by a change in the mutual capacitance Cm.

A routing wire 113 is disposed in the non-display area NA. The routing wire 113 extends the touch electrode 165 disposed at the outermost portion of the display area AA to the touch pad T-PAD disposed in the non-display area NA to form a touch pad (T-PAD) and The touch line 164 and the touch electrode 165 may be electrically connected. Accordingly, the routing wiring 113 may be arranged in a flat shape along the first surface of the flat portion 150b of the encapsulation unit 150 and the upper surface of the step compensation layer 370 .

An organic insulating layer 163 is disposed on the touch electrode 165 and the second inorganic insulating layer 162 . The organic insulating layer 163 may planarize an upper portion of the touch electrode 165 and may protect components under the organic insulating layer 163 . The organic insulating layer 163 may be an epoxy-based or acrylic-based polymer, but is not limited thereto.

The circuit units 104 and 108 are disposed in the non-display area NA. The circuit units 104 and 108 may include various devices such as a switching thin film transistor for driving the light emitting device 130, a thin film transistor for compensation, a capacitor, and the like, and include a gate in panel (GIP) type device and various wirings. may include

The circuit parts 104 and 108 may be formed of the same material in the same process as that of the thin film transistor 120 . For example, the circuit parts 104 and 108 may be formed of the same material in the same process as the source electrode 123 and the drain electrode 124 or the gate electrode 121 of the thin film transistor 120 , but are not limited thereto. .

A power supply wiring 114 is disposed outside the circuit portions 104 and 108 . The power wiring 114 may be a low level power VSS and may be disposed on the gate insulating layer 105 .

The power wiring 114 may be formed of the same material in the same process as that of the thin film transistor 120 . For example, the power wiring 114 may be formed of the same material as the source electrode 123 and the drain electrode 124 or the gate electrode 121 of the thin film transistor 120 , but is not limited thereto.

The power wiring 114 may be connected to the cathode 133 by a connection electrode 112 disposed between the power wiring 114 and the cathode 133 . In this case, the connection electrode 112 may be formed of the same material as the anode 131 of the light emitting device 130 in the same process, but is not limited thereto. In addition, the power wiring 114 may be directly connected to the cathode 133 of the light emitting device 130 that descends along the side of the bank layer 110 and the planarization layer 107 .

Recently, in order to reduce the thickness of the display device and improve visibility, a touch screen-integrated display device in which a touch part is disposed directly on an encapsulation part of the display device has been developed. However, in the display device having the above-described structure, as the end of the encapsulation portion is disposed to form an inclination with respect to the substrate, there is a problem that the touch performance is deteriorated at the outer portion of the substrate. In a display device including a plurality of conductive components, a certain level of separation distance is required between the conductive components in order to minimize a parasitic capacitance formed between the conductive components. For example, in the case of a touch screen-integrated display device, a certain level of separation distance may be required between the routing wiring, the touch electrode, and the touch line disposed on the encapsulation unit and the light emitting device and the wiring disposed under the encapsulation unit. However, since routing wires, touch electrodes, and touch lines of the touch screen integrated display device are disposed along the shape of the encapsulation part on the encapsulation part, they are disposed on the flat surface of the encapsulation part in the central portion of the display device, but the encapsulation is inclined with respect to the substrate in the outer part. It may be disposed on the surface of the part to be adjacent to the light emitting element and the wiring. Accordingly, the parasitic capacitance between the routing wiring, the touch electrode, and the touch line in the outer portion and the electrode and the wiring of the light emitting device disposed under the encapsulation unit may increase, and thus an RC delay phenomenon may occur. In this case, touch sensing may be delayed by the touch unit, and a touch performance degradation problem such as occurrence of a touch or an erroneous sensing of a touch position may occur in the touch unit.

Accordingly, in the display device 100 according to an embodiment of the present invention, a problem in which the touch performance deteriorates in the outer portion of the substrate 101 may be improved by disposing the step compensation layer 170 on the encapsulation unit 150 . . In the display device 100 according to an embodiment of the present invention, a step compensation layer 170 having a flat shape is disposed on the inclined part 150a of the encapsulation part 150 which is disposed to be inclined with respect to the substrate 101 . do. Accordingly, the routing wiring 113 , the touch electrode 165 , and the touch line 164 of the display device 100 are disposed along the flat portion 150b of the encapsulation unit 150 and the upper surface of the step compensation layer 170 . , various conductive components in which the touch electrode 165 and the touch line 164 are disposed under the encapsulation unit 150 even outside the substrate 101 , for example, the cathode 133 of the light emitting device 130 and the circuit unit (104, 108) and the like may be spaced apart by a certain level of distance. Accordingly, parasitic capacitance between the touch electrode 165 and the touch line 164 at the outer portion of the substrate 101 and various conductive components disposed under the encapsulation unit 150 may be minimized. Accordingly, the RC delay phenomenon may be prevented from occurring, and the touch performance of the touch unit 160 may be improved.

3 is a schematic plan view of a display device according to another exemplary embodiment. 4 is a cross-sectional view taken along line IV-IV' of FIG. 3 . In FIG. 3 , for convenience of explanation, among various components of the display device 100 , the substrate 101 , the bank layer 110 , the organic encapsulation layer 152 , the touch unit 360 , the routing wiring 313 , and the pad (PAD) , only the touch pad (T-PAD) and the step compensation layer 370 are illustrated. The display device 300 shown in FIGS. 3 and 4 has only the routing wiring 313 , the touch unit 360 and the step compensation layer 370 compared to the display device 100 described with reference to FIGS. 1 and 2 . different, and since other configurations are substantially the same, redundant descriptions are omitted.

3 and 4 , a step compensation layer 370 is disposed on the encapsulation unit 150 .

The step compensation layer 370 may be disposed on the outer portion of the substrate 101 to overlap the inclined portion 150a of the encapsulation unit 150 . Accordingly, the step difference compensation layer 370 may compensate for the step difference occurring in the inclined portion 150a of the encapsulation unit 150 . In addition, the step compensation layer 370 may be disposed to overlap the end of the bank layer 110 , and a region where the top surface of the step compensation layer 370 and the top surface of the encapsulation unit 150 meet is the bank layer 110 . It can be nested with some. For example, the step compensation layer 370 may be disposed to overlap a portion of the flat part 150b of the encapsulation part 150 . However, the present invention is not limited thereto, and when a portion of the bank layer 110 of the encapsulation unit 150 and a portion of the inclined portion 150a overlap each other, the step compensation layer 370 is formed on the flat portion of the encapsulation unit 150 . It may be arranged so as not to overlap with 150b.

The step compensation layer 370 may be disposed to form an inclination with the substrate 101 at the outer portion of the substrate 101 , and in this case, the surface of the step compensation layer 370 at the outer portion of the substrate 101 is opposite to the substrate 101 . The angle formed by the surface of the inclined portion 150a of the encapsulation unit 150 may be greater than the angle formed with the substrate 101 .

The step compensation layer 370 may be formed of an organic material. The step compensation layer 370 may be made of, for example, silicon oxycarbon (SiOxCz), acrylic or epoxy-based resin, but is not limited thereto.

The step compensation layer 370 may be made of a material having a higher viscosity than that of the organic encapsulation layer 152 that generates the step in order to compensate for the step generated by the inclined portion 150a of the encapsulation unit 150 .

The touch unit 360 is disposed on the encapsulation unit 150 and the step difference compensation layer 370 . The touch unit 360 includes a first inorganic insulating layer 361 , a second inorganic insulating layer 362 , an organic insulating layer 363 , a touch line 364 , and a touch electrode 365 .

A first inorganic insulating layer 361 is disposed on the encapsulation unit 150 and the step difference compensation layer 370 . The first inorganic insulating layer 361 is in contact with the encapsulation part 150 and the step difference compensation layer 370 . Accordingly, the first inorganic insulating layer 361 is disposed along the flat portion 150b of the encapsulation unit 150 and the upper surface of the step compensation layer 370 to overlap the inclined portion 150a of the encapsulation unit 150 . It can also be arranged without a practical step difference.

The first inorganic insulating layer 361 may be formed of an inorganic material. For example, it may be made of an inorganic material such as silicon nitride (SiNx) or silicon oxynitride (SiON), but is not limited thereto.

A touch line 364 is disposed on the first inorganic insulating layer 361 . Accordingly, the touch line 364 is disposed along the flat portion 150b of the encapsulation unit 150 and the upper surface of the step compensation layer 370 to overlap the inclined portion 150a of the encapsulation unit 150, and is It can be arranged without a step. The touch line 364 is disposed in the non-emission area NEA on the first inorganic insulating layer 361 . The touch line 364 may be disposed in a row direction or a column direction. The touch line 364 may supply a touch driving signal for driving the touch unit 360 . Also, the touch line 364 may transmit touch information sensed by the touch unit 360 to the driving IC.

A second inorganic insulating layer 362 is disposed on the touch line 364 and the first inorganic insulating layer 361 . The second inorganic insulating layer 362 may prevent short-circuiting of the adjacently disposed touch lines 364 . The second inorganic insulating layer 362 may be formed of an inorganic material. For example, it may be made of an inorganic material such as silicon nitride (SiNx) or silicon oxynitride (SiON), but is not limited thereto.

A touch electrode 365 is disposed on the touch line 364 and the second inorganic insulating layer 362 . Accordingly, the touch electrode 365 is disposed along the flat portion 150b of the encapsulation unit 150 and the upper surface of the step compensation layer 370 to be practical even in a region overlapping the inclined portion 150a of the encapsulation unit 150 . It can be arranged without a step. The touch electrodes 365 may be disposed in a row direction and a column direction. For example, the touch electrodes 365 disposed in the column direction and the touch electrodes 365 disposed in the row direction may be connected to each other through a bridge electrode to have a mesh-like structure. A mutual capacitance (Cm) may be formed at the intersection of the touch line 364 and the touch electrode 365 . Accordingly, a touch input may be sensed by a change in the mutual capacitance Cm.

A routing line 313 is disposed in the non-display area NA. The routing wire 313 extends the touch electrode 365 disposed at the outermost portion of the display area AA to the touch pad T-PAD disposed in the non-display area NA, thereby forming the touch pad T-PAD and The touch line 364 and the touch electrode 365 may be electrically connected. Accordingly, the routing wiring 313 is disposed along the upper surface of the flat portion 150b and the step compensation layer 370 of the encapsulation unit 150 and is also practical in the area overlapping the inclined portion 150a of the encapsulation unit 150 . It can be arranged without a step.

An organic insulating layer 363 is disposed on the touch electrode 365 and the second inorganic insulating layer 362 . The organic insulating layer 363 may planarize an upper portion of the touch electrode 365 and may protect components under the organic insulating layer 363 . For the organic insulating layer 363, an epoxy-based or acrylic-based polymer may be used, but is not limited thereto. Accordingly, in the display device 300 according to another embodiment of the present invention, the step compensation layer 370 having a flat shape on the inclined portion 150a of the encapsulation portion 150 is disposed to be inclined with respect to the substrate 101 . place the Accordingly, parasitic capacitance between the touch electrode 365 and the touch line 364 in the outer portion of the substrate 101 and various conductive components disposed under the encapsulation unit 150 may be minimized, and the RC delay phenomenon may occur. By preventing this, the touch performance of the touch unit 360 may be improved.

In addition, in the display device 300 according to another embodiment of the present invention, the step compensation layer 370 is disposed to have an extra margin, so that it can respond flexibly according to the step generation period of the encapsulation unit 150 . For example, according to the design and manufacturing process of the encapsulation unit 150 and the components disposed under the encapsulation unit 150 , the step generating section may move. For example, the step generation section formed in the inclined portion 150a of the encapsulation unit 150 may occur in a region overlapping with the end of the bank layer 110 , but may also occur on the bank layer 110 . Accordingly, in the display device 300 according to another embodiment of the present invention, the step difference compensation layer 370 is disposed in an area overlapping a part of the bank layer 110 to reduce the step generation interval generated by the encapsulation unit 150 . Even if you move, you can compensate for the step difference. Accordingly, in the display device 300 according to another embodiment of the present invention, the step compensation capability of the step compensation layer 370 may be improved.

Display devices according to embodiments of the present invention may be described as follows.

A display device according to an embodiment of the present invention includes a substrate, a light emitting device disposed on the substrate, a bank layer disposed on the substrate, and a bank layer defining a light emitting region and a non-emitting region, the light emitting device and the bank layer are disposed, , an encapsulation portion including a flat portion and an inclined portion surrounding the flat portion, a step compensation layer disposed on the inclined portion to compensate for the step difference of the encapsulation portion, and an upper surface of the encapsulation portion and a touch portion disposed in contact with the upper surface of the step compensation layer .

According to another feature of the present invention, the step compensation layer may be disposed to overlap the end of the bank layer.

According to another feature of the present invention, the end of the step compensation layer and the end of the bank layer may overlap.

According to another feature of the present invention, the step compensation layer may be an acrylic resin or an epoxy resin.

According to another feature of the present invention, the encapsulation unit includes a first inorganic encapsulation layer, an organic encapsulation layer on the first inorganic encapsulation layer, and a second inorganic encapsulation layer on the organic layer, and the step of the encapsulation may be caused by the organic encapsulation layer. .

According to another feature of the present invention, the viscosity of the step compensation layer may be higher than that of the organic encapsulation layer.

According to another feature of the present invention, the viscosity of the organic encapsulation layer may be 10 cP, and the viscosity of the step compensation layer may be 1,000 to 10,000 cP.

According to another feature of the present invention, a first dam for controlling the spreading of the organic encapsulation layer and a second dam for controlling the spreading of the step compensation layer from the outside of the first dam may be further included.

According to another feature of the present invention, the second dam may be disposed on the second inorganic encapsulation layer.

According to another feature of the present invention, the height of the second dam may be higher than the height of the first dam.

According to another feature of the present invention, the angle between the surface of the step compensation layer disposed on the inclined portion and the substrate may be greater than the angle between the surface of the inclined portion and the substrate.

A display device according to another embodiment of the present invention includes a substrate including a plurality of sub-pixels, a plurality of light-emitting elements disposed on the plurality of sub-pixels, and including an anode, a light emitting layer, and a cathode, and covers the ends of the anode, and emits light An encapsulation comprising a bank layer defining regions and non-emissive regions, at least one inorganic encapsulation layer and an organic encapsulation layer, the encapsulation having a first planar surface and a second surface extending from the first surface and inclined relative to the first surface. , a step difference mitigating layer and an encapsulation part for alleviating the step difference due to the second surface, and a touch part disposed in contact with the step difference mitigating layer.

According to another feature of the present invention, a boundary between the first surface and the second surface may overlap an end of the bank layer.

According to another feature of the present invention, the encapsulation unit includes a first inorganic encapsulation layer, an organic encapsulation layer on the first inorganic encapsulation layer, and a second inorganic encapsulation layer on the organic layer, and a step mitigating layer to control the shape of the step mitigating layer. The viscosity of may be higher than the viscosity of the organic encapsulation layer.

According to another feature of the present invention, it may further include a first dam for controlling the shape of the second surface and a second dam for controlling the shape of the step alleviation layer from the outside of the first dam.

According to another feature of the present invention, the second dam may be disposed on the uppermost layer of the encapsulation unit.

According to another feature of the present invention, the touch unit may include an inorganic layer and a touch line and a touch electrode on the inorganic layer, and the inorganic layer may be in contact with the surface of the step difference alleviating layer and the first surface of the encapsulation unit.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made within the scope without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to illustrate, and the scope of the technical spirit of the present invention is not limited by these embodiments. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100, 300: display device
101: substrate
103: buffer layer
104: circuit part
105: gate insulating layer
107: planarization layer
108: circuit part
109: passivation layer
110: bank layer
112: connecting electrode
114: power wiring
120: thin film transistor
121: gate electrode
122: active layer
123: source electrode
124: drain electrode
130: light emitting element
131: anode
132: light emitting layer
133: cathode
150, 350: encapsulation unit
150a, 350a: inclined portion
150b, 350b: flat part
151: first inorganic encapsulation layer
152: organic encapsulation layer
153: second inorganic encapsulation layer
160, 360: touch unit
161, 361: first inorganic insulating layer
162, 362: second inorganic insulating layer
163, 363: organic insulating layer
164, 364: touch line
165, 365: touch electrode
170 370: step compensation layer
190: dam
191: first dam
192: second dam
AA: display area
NA: non-display area
EA: light emitting area
NEA: non-emissive area
PAD: pad
T-PAD: Touchpad

Claims (18)

Board;
a light emitting device disposed on the substrate;
a bank layer disposed on the substrate and defining a light emitting area and a non-emission area;
an encapsulation unit disposed to cover the light emitting device and the bank layer and including a flat portion and an inclined portion surrounding the flat portion;
a step compensation layer disposed on the inclined portion to compensate for the step difference of the encapsulation portion; and
and a touch unit disposed to contact an upper surface of the encapsulation unit and an upper surface of the step compensation layer. According to claim 1,
and the step difference compensating layer is disposed to overlap an end of the bank layer. 3. The method of claim 2,
and an end of the step compensation layer and an end of the bank layer overlap. According to claim 1,
The step difference compensating layer is an acrylic resin or an epoxy resin. According to claim 1,
The encapsulation unit includes a first inorganic encapsulation layer, an organic encapsulation layer on the first inorganic encapsulation layer, and a second inorganic encapsulation layer on the organic encapsulation layer,
The step of the encapsulation portion is generated by the organic encapsulation layer. 6. The method of claim 5,
and a viscosity of the step compensation layer is higher than a viscosity of the organic encapsulation layer. 7. The method of claim 6,
The organic encapsulation layer has a viscosity of 10 cP, and the step difference compensating layer has a viscosity of 1,000 to 10,000 cP. 6. The method of claim 5,
a first dam for controlling the spreading of the organic encapsulation layer; and
The display device of claim 1 , further comprising a second dam configured to control the spreading of the step compensation layer outside the first dam. 9. The method of claim 8,
and the second dam is disposed on the second inorganic encapsulation layer. 9. The method of claim 8,
a height of the second dam is higher than a height of the first dam. According to claim 1,
An angle formed by a surface of the step difference compensating layer disposed on the inclined portion with the substrate is greater than an angle formed by a surface of the inclined portion with the substrate. According to claim 1,
The touch unit includes an inorganic layer disposed at the bottom and a touch line and a touch electrode on the inorganic layer,
A lower surface of the inorganic layer is in contact with an upper surface of the encapsulation part and an upper surface of the step difference compensating layer. a substrate including a plurality of sub-pixels;
a plurality of light emitting devices disposed on the plurality of sub-pixels and including an anode, a light emitting layer, and a cathode;
a bank layer covering an end of the anode and defining a light-emitting area and a non-emission area;
an encapsulation portion comprising at least one inorganic encapsulation layer and an organic encapsulation layer, the encapsulation portion having a first planar surface and a second surface extending from the first surface and inclined with respect to the first surface;
a step difference alleviating layer for alleviating the step difference by the second surface; and
and a touch unit disposed in contact with the encapsulation unit and the step difference alleviating layer. 14. The method of claim 13,
and a boundary between the first surface and the second surface overlaps with an end of the bank layer. 14. The method of claim 13,
The encapsulation unit includes a first inorganic encapsulation layer, an organic encapsulation layer on the first inorganic encapsulation layer, and a second inorganic encapsulation layer on the organic encapsulation layer,
and a viscosity of the step alleviating layer is higher than a viscosity of the organic encapsulation layer in order to control a shape of the step alleviating layer. 14. The method of claim 13,
a first dam for controlling the shape of the second surface; and
and a second dam configured to control a shape of the step difference alleviating layer outside the first dam. 14. The method of claim 13,
and the second dam is disposed on an uppermost layer of the encapsulation part. 14. The method of claim 13,
The touch unit includes an inorganic layer and a touch line and a touch electrode on the inorganic layer,
The inorganic layer is in contact with a surface of the step difference alleviating layer and the first surface of the encapsulation part.

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