KR20210084346A - Prefabricated Boards and Printed Circuit Boards - Google Patents

Abstract

The present application relates to the field of manufacturing technology of a printed circuit board, and provides a pre-fabricated board and a printed circuit board. the prefabricated substrate comprises a substrate body, at least one group of electro gold plating units and at least one second metal lead; The substrate body includes a product area and a scrap area surrounding the periphery of the product area; An electro gold plating unit is installed on the product area, wherein each group of electro gold plating units includes a plurality of electro gold plating positions and one first metal lead, and the first metal lead is disposed between the plurality of electro gold plating positions. installed to connect a plurality of electro-gold plating positions; the number of second metal leads is equal to the number of electro gold plating units, and the second metal leads correspond one-to-one with the electro gold plating units, of which the second metal leads are installed between the electro gold plating units and the scrap area; Electrically connect the gold plating unit and the scrap area. Through the above method, the present application can obtain a high yield printed circuit board and electronic device without burrs in subsequent processing.

Description

Prefabricated Boards and Printed Circuit Boards

This application relates to the field of manufacturing technology of printed circuit boards, and in particular to prefabricated boards and printed circuit boards.

A PCB board, also called a printed circuit board, printed circuit board, or simply printed board, uses an insulated substrate as a base material, cut to size, attaching one or more conductive patterns thereon, and arranging holes (e.g., component holes, fixing hole, metallization hole, etc.) to realize interconnection between electronic components. Currently, there are generally two methods of milling a PCB board: milling cutter machining or punch mold machining.

In the long-term research and development process, the inventor of the present application found that the electro-gold-plated lead of the pre-fabricated substrate is thin and has excellent ductility, but during the processing process, the thickness of the solder resist ink layer is small, the bonding force between the ink covered on the lead and the electro-gold-plated lead is small , also found that the large pulling force generated during the machining process easily causes problems such as burrs and warping of the leads, seriously affecting the quality of the products.

The main technical problems to be solved in this application are to realize the integration of the touch and the display, to reduce the overall thickness, to facilitate the light and thin, to facilitate the detection of the touch signal, to reduce the manufacturing process, to reduce the production cost An object of the present invention is to provide a method for manufacturing an organic light emitting display screen.

In order to solve the above technical problem, the present application provides a prefabricated substrate, wherein the prefabricated substrate includes a substrate body, at least one group of electro gold plating units and at least one second metal lead; The substrate body includes a product area and a scrap area surrounding the periphery of the product area; An electro gold plating unit is installed on the product area, wherein each group of electro gold plating units includes a plurality of electro gold plating positions and one first metal lead, and the first metal lead is disposed between the plurality of electro gold plating positions. installed to connect a plurality of electro-gold plating positions; The number of the second metal leads is equal to the number of the electro gold plating units, and the second metal leads correspond one-to-one with the electro gold plating units, of which the second metal leads are provided on the substrate body, and the electro gold plating units and the scrap area electrically.

In order to solve the above technical problem, the present application uses another technical solution: the present application provides a printed circuit board, the printed circuit board is obtained by secondary processing a prefabricated board, and the prefabricated board is There is one prefabricated substrate; A printed circuit board comprising: a board body having a product area; at least one group of electro gold plating units installed on the product area; at least one second metal lead, wherein each group of electro gold plating units includes a plurality of electro gold plating positions and one first metal lead, wherein the first metal lead is installed between the plurality of electro gold plating positions to connect the plurality of electro gold plating positions; A second metal lead is installed between the electro gold plating unit and the outer edge of the product area, wherein the number of second metal leads is equal to the number of the electro gold plating units, and the second metal lead is one-to-one with the electro gold plating unit Correspondingly, the electro gold plating unit and the outer edge of the product area are connected.

To solve the above technical problem, the present application uses another technical solution: The present application provides an electronic device, the electronic device including a printed circuit board and an electronic component installed on the printed circuit board, , Among them, the printed circuit board includes: a substrate body having a product area; at least one group of electro gold plating units installed on the product area; at least one second metal lead, wherein each group of electro gold plating units includes a plurality of electro gold plating positions and one first metal lead, wherein the first metal lead is installed between the plurality of electro gold plating positions to connect the plurality of electro gold plating positions; A second metal lead is installed between the electro gold plating unit and the outer edge of the product area, wherein the number of second metal leads is equal to the number of the electro gold plating units, and the second metal lead is one-to-one with the electro gold plating unit corresponding, connecting the electro gold plating unit and the outer edge of the product area; The electronic component is electrically connected to an electro-gold position on the printed circuit board.

Unlike the prior art, the organic light emitting display screen of the present invention integrates a self-capacitive touch sensitive electrode unit independent of the touch electrode layer on top of the organic light emitting display screen to realize the integration of touch and display, thereby reducing the overall thickness and reducing the overall thickness. It facilitates the conversion, reduces the manufacturing process, reduces the production cost, and helps to realize the flexibility of the touch.

1 is a structural schematic diagram of a pre-fabricated substrate according to an embodiment of the present application.
2 is a structural schematic diagram of a pre-fabricated substrate according to another embodiment of the present application.
3 is a structural schematic diagram of a pre-fabricated substrate according to another embodiment of the present application.
4 is a structural schematic diagram of a pre-fabricated substrate according to another embodiment of the present application.
5 is a cross-sectional structural schematic diagram of an embodiment of the printed circuit board of the present application.

The following clearly and completely describes the technical solutions of the embodiments of the present application with reference to the drawings of the embodiments of the present application, and the described embodiments are not all embodiments but only a part of the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

As shown in FIG. 1 , the prefabricated substrate 10 of the embodiment of the present application includes a substrate body 11 , at least one group of electro gold plating units 12 , and at least one second metal lead 13 . . The number of the second metal leads 13 is equal to the number of the electro gold plating units 12 , and the second metal leads 13 correspond to the electro gold plating units 12 one-to-one.

Among them, the substrate body 11 may be a core substrate or a coreless substrate, among which the core substrate may include a core substrate medium and metal layers located on both sides of the core substrate medium.

The metal layer may be a copper layer. In practical applications, the metal layer may also be an aluminum layer or another metal layer, but is not particularly limited here. The material of the core substrate medium can be selected according to the functional design of each layer of the core substrate. It may be a ceramic-based high-frequency material or a material having a small damping factor (DF) suitable for a radio frequency circuit, such as polytetrafluoroethylene. It may also be a material with a large loss factor suitable for conventional circuits such as FR-4 (including epoxy resin). In this embodiment, the core substrate medium is made of a material through which a radio frequency signal of a specific frequency can pass, but the material may be a thermosetting material. In addition, the core substrate medium is previously hardened by heat treatment to fix its shape, and the core substrate medium is not deformed again in the subsequent heating process. The core substrate medium may also be a thermoplastic material that softens after heating.

Among them, the thermosetting material can be softened and flowed upon initial heating, and when heated to a certain temperature, a chemical reaction occurs to harden and harden the cross-linkage; This change is irreversible, indicating that the material will soften again and cannot flow even after heating again. Typical thermosetting materials include, but are not limited to, allyl resins, epoxy resins, thermosetting polyurethanes, silicones or polysiloxanes, and the like. These resins may be formed from the reaction product of a polymerizable composition comprising one or more oligomeric polyurethane (meth) acrylates. In general, oligomeric polyurethane (meth)acrylates are poly(meth)acrylates. The term “(meth)acrylate” is used to refer to esters of acrylic acid and methacrylic acid, and as opposed to “poly(meth)acrylate” which also generally refers to (meth)acrylate polymers, multi) (meth) acrylate" means a molecule comprising one or more (meth) acrylate groups. Most commonly, poly(meth)acrylates are di(meth)acrylates, but tri(meth)acrylates, tetra(meth)acrylates and the like are also contemplated.

The substrate body 11 includes a product area 111 and a scrap area 112 surrounding the periphery of the product area 111 . The electro gold plating unit 12 is installed in the product area 111 , and each group of the electro gold plating unit 12 includes a plurality of electro gold plating positions 121 and one first metal lead 122 , the first The metal lead 122 is installed between the plurality of electro gold plating positions 121 , and the first metal lead 122 connects the plurality of electro gold plating positions 121 . The second metal lead 13 is installed on the substrate body 11 , and also electrically connects the electro gold plating unit 12 and the scrap region 112 . Specifically, one end of the second metal lead 13 is connected to the gold plating position 121 or the first metal lead 122 of the electro gold plating unit 12 , and the other end of the second metal lead 13 is It extends to the scrap area 112 to implement electrical connection between the electro gold plating unit 12 and the scrap area 112 .

Among them, in order to prevent oil explosion or peeling on the side of the substrate during punching, when designing, the distance between the punching die outline of the substrate and the substrate product area 111 is 150 to 400 microns (eg, 150 microns, 200 microns). , 300 microns, 400 microns) (eg, 150 microns, 200 microns, 300 microns, 400 microns) and a distance between one side of the groove in the substrate punching die and the substrate product region 111 is 150-400 A region larger than microns (eg, 150 microns, 200 microns, 300 microns, 400 microns) is divided into a second scrap region, and the distance between the outline of the substrate punching die and the substrate product region 111 is greater than 150-400 microns. A large area and an area in which the distance between one side of the groove in the substrate punching die and the substrate product area 111 is less than 150-400 microns is divided into a first scrap area. A substrate is punched using a mold designed according to the process parameters of general punching. In this process, each substrate undergoes punching processes several times to flush the first scrap area. The flushed substrate is finished with a milling cutter to remove the second scrap area. This method is the same as the substrate finishing method of the existing CNC routing technology, and the second scrap area is a scrap area 112 that is removed during finishing in the CNC routing technology. In this way, a substrate product of the desired size is obtained.

The electro gold plating unit 12 is installed on the product area 111 and is used to connect electronic components (not shown). The second metal lead 13 is installed between the electro gold plating unit 12 and the scrap area 112 , and also connects the electro gold plating unit 12 and the scrap area 112 . The number of the second metal leads 13 corresponds one-to-one with the number of the electro gold plating units 12, and each electro gold plating unit 12 is installed at intervals, and each second metal lead 13 is installed at intervals.

Among them, the electro gold plating position 121 is the circuit pattern after gold electroplating operation, and the second metal lead 13 is the lead after the electro gold plating operation. The lead may be a transparent and conductive thin film containing nano-dimensional metal. For example, a thin film including a single nano-dimensional metal, an alloy, a metal compound, or any combination of the above, for example, a thin film including a nano metal wire, a thin film including nano metal particles, a nano metal lattice It may be a thin film comprising a. Of course, it may be a graphene thin film, a carbon nanotube thin film, an organic conductive polymer thin film, an indium tin oxide (ITO) thin film, or any combination thereof. Preferably, the lead is a transparent conductive nano silver wire thin film, which is a thin film comprising a polymer matrix with nano silver wires, and the nano silver wires are uniformly distributed in the thin film to make the thin film transparent and conductive. The nano silver wire thin film can be attached to the substrate by coating, screen printing or spraying.

Unlike the prior art, in this application, each group of electro gold plating units includes a plurality of electro gold plating positions and one first metal lead, and the number of second metal leads is equal to the number of electro gold plating units, and the second The metal lead and the electro gold plating unit correspond one-to-one, and the electro gold plating unit and the scrap area are connected through the second metal lead. If a plurality of electro gold plating positions within a product area can be connected in series to ensure an electro gold plating position specification, it is possible to connect the electro gold plating position and the scrap area using fewer second metal leads, thereby eliminating problems such as burrs and warping. The number of leads generated can be reduced, resulting in burr-free, high-yield printed circuit boards and electronic devices in subsequent processing.

1, the second metal lead 13 of the embodiment of the present application is installed between the first metal lead 122 and the scrap area 112, and the first metal lead 122 and the scrap area ( 112) is connected.

As shown in FIG. 2 , the second metal lead 13 of the embodiment of the present application is installed between one of the electro gold plating positions 121 and the scrap area 112 , so that one of the electro gold plating positions 121 and the scrap Connect the regions 112 .

In the above-described embodiment, each group of electro gold plating units 12 includes 4 to 9 electro gold plating positions 121, for example 4, 6, 7, 9 positions.

As shown in FIG. 3 , the outer diameter of the second metal lead 13 along the self-extending direction D2 of the embodiment of the present application is larger than the outer diameter of the first metal lead 122 along the self-extending direction D1. it's like By thickening the second metal lead 13 connecting the electro gold plating unit 12 and the scrap region 112 to increase the bonding area between the second metal lead 13 at the edge of the substrate and the solder resist ink, the second metal lead ( 13) and the solder resist ink are increased to reduce metal burrs generated by pulling the second metal lead 13 from the solder resist ink during processing, thereby improving the burr problem during substrate molding.

As shown in FIG. 4 , the second metal lead 13 of the embodiment of the present application includes at least a lead body portion 131 and a lead reinforcement portion 132 . The lead reinforcing unit 132 is installed on one side of the scrap area 112 close to the product area 111 , and the lead body 131 connects the electro gold plating unit 12 and the lead reinforcing unit 132 to electro gold plating. The unit 12 is connected to the scrap area 112 through the lead reinforcement 132 . Here, the outer diameter of the lead reinforcing part 132 along the self-extension direction D2 of the second metal lead 13 is greater than the outer diameter of the lead body part 131 .

By thickening the lead reinforcement part 132 on one side of the scrap region 112 close to the product region 111 to increase the bonding area between the lead reinforcement part 132 at the edge of the substrate and the solder resist ink, the lead reinforcement part 132 and the solder By increasing the bonding force between the resist inks, it is possible to reduce the metal burrs generated by the lead reinforcing part 132 being pulled from the solder resist ink during processing, thereby improving the burr problem during substrate molding.

In addition, along the self-extension direction D2 of the second metal lead 13, the outer diameter of the lead reinforcement part 132 is 5 to 20 times (5 times, 10 times, 15 times, 5 times, 10 times, 15 times, the outer diameter of the lead body part 131) 20 times).

In addition, the outer diameter of the lead reinforcing part 132 along the self-extension direction D2 of the second metal lead 13 is 150 μm or more.

Further, the metal burr generated by the second metal lead 13 being pulled from the solder resist ink during processing is further reduced.

5 , the prefabricated substrate of the embodiment of the present application further includes a milling region 113 . The milling area 113 is installed between the product area 111 and the scrap area 112 , and the milling area 113 surrounds the periphery of the product area 111 , the product area 111 and the scrap area 112 . and the milling region 113 has an integral structure. One milling path 114 is installed in the milling area 113 , and when the printed circuit board 20 is produced, the second metal lead 13 may be cut along the milling path 114 .

As shown in FIG. 5 , the printed circuit board 20 of the embodiment of the present application is obtained by secondary processing the prefabricated board 10 , and the prefabricated board 10 is the prefabricated board 10 of the above-described embodiment. )to be.

The printed circuit board 20 is obtained by secondary processing the prefabricated board 10, the prefabricated board 10 being the prefabricated board 10 described above;

The printed circuit board 20 includes a substrate body 11 having a product area 111 ; at least one group of electro gold plating units 12 installed in the product area 111; at least one second metal lead 13 . Among them, the electro gold plating unit 12 of each group includes a plurality of electro gold plating positions 121 and one first metal lead 122 , and the first metal lead 122 includes a plurality of electro gold plating positions 121 . ) is installed between, and connects a plurality of electro gold plating positions 121; At least one second metal lead 13 is provided between the electro gold plating unit 12 and the outer edge of the product area 111 , among which the number of second metal leads 13 is equal to the number of the electro gold plating unit 12 . equal to the number of , and the second metal lead 13 corresponds to the electro gold plating unit 12 one-to-one, and is used to connect the electro gold plating unit 12 and the outer edge of the product area 111 .

Among them, the second metal lead 13 is installed between the first metal lead 122 and the outer edge of the product area 111 to connect the first metal lead 122 and the outer edge of the product area 111 . is used to; or the second metal lead 13 is installed between one of the electro gold plating positions 121 and the outer edge of the product area 111 to connect one of the electro gold plating positions 121 and the outer edge of the product area 111 . do.

Among them, the printed circuit board 20 further includes a first solder resist ink layer 21 and a second solder resist ink layer 22 . The first solder resist ink layer 21 and the second solder resist ink layer 22 are respectively provided on both sides of the substrate body 11 and cover the second metal lead 13 .

The printed circuit board 20 further includes a cover plate 23 and a backing plate 24 . the cover plate 23 is provided on one side of the first solder resist ink layer 21 away from the substrate body 11; The backing plate 24 is provided on one side of the second solder resist ink layer 22 away from the substrate body 11 .

Among them, the first solder resist ink layer 21 and the second solder resist ink layer 22 are green ink, black ink, red ink, blue ink, white ink or yellow ink; The first solder resist ink layer 21 and the second solder resist ink layer 22 are used to prevent circuits from interfering with each other during soldering or short circuit caused by different circuit networks during soldering. The first solder resist ink layer 21 and the second solder resist ink layer 22 are provided on both sides of the substrate body 11, respectively, and the first solder resist ink layer 21 and the second solder resist ink layer 22 ) covers the second metal lead 13 , and the first solder resist ink layer 21 and the second solder resist ink layer 22 have strong adsorption force with the second metal lead 13 .

The cover plate 23 is provided on one side of the first solder resist ink layer 21 separated from the substrate body 11 , and the backing plate 24 is a second solder resist ink layer 22 separated from the substrate body 11 . installed on one side of

Among them, the cover plate 23 may be an upper copper foil layer 23 installed on the first solder resist ink layer 21 , and the backing plate 24 is a lower portion installed under the second solder resist ink layer 22 . It may be a copper foil layer 24 , and the substrate body 11 , the upper copper foil layer 23 , and the lower copper foil layer 24 communicate with each other through a metal through hole or a second metal lead 13 . At this time, the printed circuit board 20 is a double-sided copper clad laminate.

Among them, copper is the most used circuit material for the printed circuit board 20 because of its excellent electrical conductivity. By patterning each substrate body 11, a necessary circuit pattern can be obtained, and the upper copper foil layer 23 and the lower copper foil layer 24 can be divided into a signal layer and a ground layer according to functional design; The pattern of the signal layer is more complex than that of the ground layer. In general, a signal layer is a layer in which various metal circuits used to form electrical connections between electronic devices are located. The ground layer is used to connect to the ground and is usually a layer of large area continuous metal areas.

Optionally, the lower copper foil layer 24 connected to a heat dissipation device (not shown) on the substrate body 11 via a conductive bonding layer is a grounding layer. That is, the heat dissipation device is indirectly electrically connected to the ground layer on the substrate body 11 . In this way, the grounding layer can be directly grounded by directly electrically connecting to the heat dissipation device through the sandwich laminate structure, thereby shortening the grounding path, thereby improving the grounding effect and grounding stability of the electronic device to be grounded on the printed circuit board 20 . can be improved

In another embodiment, one of the backing plate 24 or cover plate 23 is a copper foil layer and the other is an insulating layer. At this time, the printed circuit board 20 is a single-sided copper clad laminate.

Unlike the prior art, in this application, each group of electro gold plating units includes a plurality of electro gold plating positions and one first metal lead, and the number of second metal leads is equal to the number of electro gold plating units, and the second The metal lead corresponds to the electro gold plating unit one-to-one, and connects the electro gold plating unit and the scrap area through the second metal lead. If a plurality of electro gold plating positions within a product area can be connected in series to ensure an electro gold plating position specification, it is possible to connect the electro gold plating position and the scrap area using fewer second metal leads, thereby eliminating problems such as burrs and warping. The number of leads generated can be reduced, resulting in burr-free, high-yield printed circuit boards and electronic devices in subsequent processing.

The present application also provides an electronic device. An electronic device includes a printed circuit board and electronic components installed on the printed circuit board. The electronic component is electrically connected to an electro-gold position on the printed circuit board. The printed circuit board is the printed circuit board 20 of the above-described embodiment, for details, refer to the description of the above-described embodiment, which is not repeated here.

Unlike the prior art, in this application, each group of electro gold plating units includes a plurality of electro gold plating positions and one first metal lead, and the number of second metal leads is equal to the number of electro gold plating units, and the second The metal lead corresponds to the electro gold plating unit one-to-one, and connects the electro gold plating unit and the scrap area through the second metal lead. If a plurality of electro gold plating positions within a product area can be connected in series to ensure an electro gold plating position specification, it is possible to connect the electro gold plating position and the scrap area using fewer second metal leads, thereby eliminating problems such as burrs and warping. The number of leads generated can be reduced, resulting in burr-free, high-yield printed circuit boards and electronic devices in subsequent processing.

The foregoing is only an implementation manner of the present application, and does not limit the scope of the present application. Direct or indirect application to any equivalent structure or equivalent process transformation or other related technology made using the description and drawings of this application is likewise included within the scope of patent protection of this application.

DESCRIPTION OF SYMBOLS 10: prefabricated board|substrate, 11: board|substrate body, 12: electro gold plating unit, 13: second metal lead, 20: printed circuit board, 21: first solder resist ink layer, 22: second solder resist ink layer, 23: Cover plate, 24 backing plate, 111 product area, 112 scrap area, 113 milling area, 114 milling path, 121 electro gold plating position, 122 first metal lead, 131 lead body portion, 132 lead reinforcement.

Claims (20)

a substrate body, at least one group of electro gold plating units, and at least one second metal lead;
the substrate body includes a product area and a scrap area surrounding the periphery of the product area;
The electro gold plating unit is installed on the product area, wherein the electro gold plating unit of each group includes a plurality of electro gold plating positions and one first metal lead, and the first metal lead includes a plurality of the installed between the electro gold plating positions to connect a plurality of the electro gold plating positions;
The number of the second metal leads is the same as the number of the electro gold plating units, and the second metal leads correspond one-to-one with the electro gold plating units, wherein the second metal leads are installed on the substrate body. and a prefabricated substrate electrically connecting the electro gold plating unit and the scrap area. The method according to claim 1,
The second metal lead is installed between the first metal lead and the scrap area to connect the first metal lead and the scrap area. The method according to claim 1,
and the second metal lead is provided between one of the electro gold plating positions and the scrap area to connect one of the electro gold plating positions to the scrap area. The method according to claim 1,
wherein each group of said electro gold plating units comprises 4 to 9 said electro gold plating positions. 5. The method according to claim 4,
wherein each group of said electro gold plating units comprises 4-6 said electro gold plating positions. The method according to claim 1,
A prefabricated substrate wherein an outer diameter of the second metal lead along a self-extending direction is greater than or equal to an outer diameter of the first metal lead along a self-extending direction. The method according to claim 1,
The second metal lead includes a lead body part and a lead reinforcement part, and the lead reinforcement part is installed on one side of the scrap area close to the product area, and the lead body part connects the electro gold plating unit and the lead reinforcement part to make the A pre-fabricated substrate such that an electro gold plating unit is connected to the scrap region through the lead reinforcement, wherein, along an extension direction of the second metal lead, an outer diameter of the lead reinforcement is greater than an outer diameter of the lead body. 8. The method of claim 7,
In the extending direction of the second metal lead, an outer diameter of the lead reinforcing part is 5 to 20 times the outer diameter of the lead body part. 9. The method of claim 8,
In the extending direction of the second metal lead, an outer diameter of the lead reinforcing part is 5 to 10 times the outer diameter of the lead body part. 8. The method of claim 7,
A pre-fabricated substrate having an outer diameter of the lead reinforcing portion of 150 μm or more along the extending direction of the second metal lead. The method according to claim 1,
The pre-fabricated substrate further includes a milling area installed between the product area and the scrap area, wherein the milling area surrounds the periphery of the product area, and the product area, the scrap area and the milling area are integrally structured is,
One milling path is provided on the milling area, and among them, a pre-fabricated board capable of cutting the second metal lead along the milling path when producing a printed circuit board. A printed circuit board, wherein the printed circuit board is obtained by secondary processing a prefabricated board, wherein the prefabricated board is the prefabricated board according to any one of claims 1 to 11;
The printed circuit board may include: a board body having a product area; at least one group of electro gold plating units installed on the product area; at least one second metal lead;
Wherein, the electro gold plating unit of each group includes a plurality of electro gold plating positions and one first metal lead, wherein the first metal lead is installed between the plurality of the electro gold plating positions, the plurality of the electro gold plating positions to connect;
The second metal leads are installed between the electro gold plating unit and the outer edge of the product area, wherein the number of the second metal leads is equal to the number of the electro gold plating units, and the second metal leads are A printed circuit board for connecting the gold plating unit and the outer edge of the product area in a one-to-one correspondence with the gold plating unit. 13. The method of claim 12,
the second metal lead is installed between the first metal lead and an outer edge of the product area to connect the first metal lead and an outer edge of the product area; or
and the second metal lead is provided between one of the electro gold plating positions and an outer edge of the product area to connect one of the electro gold plating positions to an outer edge of the product area. 13. The method of claim 12,
The printed circuit board further includes a first solder resist ink layer and a second solder resist ink layer, a cover plate, and a backing plate,
the first solder resist ink layer and the second solder resist ink layer are respectively provided on both sides of the substrate body and cover the first metal lead and the second metal lead;
the cover plate is provided on one side of the first solder resist ink layer away from the substrate body;
The backing plate is a printed circuit board installed on one side of the second solder resist ink layer away from the substrate body. 15. The method of claim 14,
The printed circuit board further comprises that the first solder resist ink layer and the second solder resist ink layer are green ink, black ink, red ink, blue ink, white ink or yellow ink. 15. The method of claim 14,
wherein the cover plate and the backing plate are copper foils. 15. The method of claim 14,
One of the cover plate and the backing plate is a copper foil layer, and the other is an insulating layer. A printed circuit board and an electronic component installed on the printed circuit board,
Among them, the printed circuit board includes: a substrate body having a product area; at least one group of electro gold plating units installed on the product area; at least one second metal lead;
Wherein, the electro gold plating unit of each group includes a plurality of electro gold plating positions and one first metal lead, wherein the first metal lead is installed between the plurality of the electro gold plating positions, the plurality of the electro gold plating positions to connect;
The second metal leads are installed between the electro gold plating unit and the outer edge of the product area, wherein the number of the second metal leads is equal to the number of the electro gold plating units, and the second metal leads are one-to-one correspondence with the electro gold plating unit, connecting the electro gold plating unit and the outer edge of the product area;
and the electronic component is electrically connected to the electro-gold position on the printed circuit board. 19. The method of claim 18,
the second metal lead is installed between the first metal lead and an outer edge of the product area to connect the first metal lead and an outer edge of the product area; or
and the second metal lead is provided between one of the electro gold plating positions and an outer edge of the product area to connect one of the electro gold plating positions to an outer edge of the product area. 19. The method of claim 18,
The printed circuit board further includes a first solder resist ink layer and a second solder resist ink layer, a cover plate, and a backing plate,
the first solder resist ink layer and the second solder resist ink layer are respectively provided on both sides of the substrate body and cover the first metal lead and the second metal lead;
the cover plate is provided on one side of the first solder resist ink layer away from the substrate body;
The backing plate is installed on one side of the second solder resist ink layer away from the substrate body.

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