KR20210082953A - Pressure sensitive adhesive protection film for electric devices and method for preparing the same - Google Patents

Abstract

Disclosed are an adhesive protection film and a manufacturing method thereof. The present invention provides an adhesive protection film for an electronic device in which a base film, a primer layer, an acryl-based adhesive layer formed of an acryl-based adhesive composition, and a release film are stacked, wherein the acryl-based adhesive composition includes 2.5 to 3.5 parts by weight of a crosslinking agent and 1.2 to 1.8 parts by weight of an antistatic agent based on 100 parts by weight of an acryl-based copolymer including 63 to 77 wt% of an acrylic acid, 13 to 22 wt% of a copolymerizable unsaturated monomer containing a hydroxyl group and a carboxyl group, and 8 to 15 wt% of a reactive emulsifier. Accordingly, a surface of a metal housing is protected during an assembly process of the electronic device, and a change in a capacitance of a grip sensor and transmission/reception of a signal in a frequency band of an antenna are not affected. In addition, an antistatic function for suppressing generation of static electricity is obtained, and an adhesive is prevented from being transferred even under conditions of a thermal impact, a high temperature, and high humidity.

Description

Electronic device adhesive protection film and manufacturing method therefor {Pressure sensitive adhesive protection film for electric devices and method for preparing the same}

The present specification relates to an adhesive protective film for an electronic device including a grip sensor and/or an antenna, and a method for manufacturing the same. More particularly, it relates to an adhesive protective film for protecting a surface of a metal housing of an electronic device including a grip sensor and/or an antenna, and a method for manufacturing the same.

Recently, the spread of electronic devices to which a metal housing is applied (eg, a smart phone, a tablet, a notebook computer, etc.) is increasing. Such an electronic device may include a grip sensor and/or an antenna, and a part of the metal housing may be used as a radiator of the antenna. For example, when the user approaches or touches the electronic device, the capacitance in the electronic device may change. Based on the change amount, the grip sensor may detect whether the user is in proximity or whether the user touches the grip sensor.

In this electronic device manufacturing process, an adhesive protective film is used to protect the surface of the electronic device. As the adhesive protective film, various types of adhesive protective films such as acrylic, urethane, and silicone are used to prevent scratches and surface contamination that may occur during the process.

In addition, in the case of an adhesive protective film used in the manufacturing process of an electronic device, the surface resistance of the adhesive protective film should be reduced to 10 in order to prevent the generation of static electricity, since static electricity may be generated during the removal process of the adhesive protective film to damage the electronic device. ^It is required to be less than 9 ohm, and high reliability that does not leave transitions or stains on the surface of electronic devices is required even under the reliability conditions of high temperature, high humidity, and thermal shock.

^{However, in the case of a silicone type, it is difficult to implement a surface resistance of less than 10 9} ohm among adhesive protective films that protect the surface of a metal housing of an electronic device including a conventional grip sensor and/or antenna, and stains remain on the surface of the metal housing due to siloxane oil transfer. There was a problem.

Also, in the case of the urethane type, there was a problem in that the surface of the metal housing was stained under the reliability conditions of high temperature, high humidity, and thermal shock due to unreacted polyols having a relatively low molecular weight compared to acrylic.

Therefore, conventionally, an acryl-type adhesive protective film has been used that has little transfer to the surface of the metal housing and is easy to realize surface resistance. However, there is a problem of a small transition still occurring on the surface of the metal housing under high temperature and high humidity conditions, and a change in capacitance connected to the grip sensor circuit applied to the rear housing of the electronic device. In addition, there is a problem in that it is not possible to check whether the sensor operates during the manufacturing process because it affects transmission/reception of signals in the frequency band of the antenna.

1 is a schematic diagram showing a punching position of a grip sensor in the prior art.

As shown in FIG. 1 , in the case of the prior art, the grip sensor location surface was punched out, removed, and used due to the above problems. However, in this case, since it is impossible to protect the entire surface of the housing surface during the manufacturing process, there is a risk of scratching and inflow of foreign substances, and as a result, it is difficult to function as a protective film.

Korean Patent Registration No. 1675051 Publication

In exemplary embodiments of the present invention, in one aspect, by solving the problem of the conventional acrylic type adhesive protective film described above, there is no transition on the surface of the metal housing even under the reliability conditions of high temperature, high humidity, and thermal shock, and it is connected to a grip sensor circuit An object of the present invention is to provide an electronic device adhesive protective film and a method for manufacturing the same, in which there is no problem of capacitance change, and there is no sensor error because it does not affect signal transmission/reception in the antenna frequency band.

In exemplary embodiments of the present invention, as an electronic device adhesive protective film in which a base film, a primer layer, an acrylic adhesive layer made of an acrylic adhesive composition and a release film are laminated, the acrylic adhesive composition comprises 63 to 77% by weight of acrylic acid, Based on 100 parts by weight of an acrylic copolymer comprising 13 to 22% by weight of a hydroxyl group and a carboxyl group-containing copolymerizable unsaturated monomer and 8 to 15% by weight of a reactive emulsifier, 2.5 to 3.5 parts by weight of a crosslinking agent and 1.2 to It provides an adhesive protective film comprising 1.8 parts by weight of an antistatic agent.

In exemplary embodiments of the present invention, further, forming a primer layer on the base film; forming an acrylic pressure-sensitive adhesive layer by coating the primer layer with the above-described acrylic pressure-sensitive adhesive composition; and forming a release film on the acrylic adhesive layer.

In exemplary embodiments of the present invention, there is also provided an electronic device to which the adhesive protection film from which the release film is removed is attached.

In exemplary embodiments of the present invention, there is also a method of removing the release film of the adhesive protective film and attaching it to an electronic device, wherein the electronic device includes a grip sensor and/or an antenna and has a metal housing, and the electronic device includes a grip sensor and/or an antenna. Provided is a method for attaching an electronic device of an adhesive protection film for attaching the adhesive protection film without punching the surface of the metal housing of the device.

According to exemplary embodiments of the present invention, the surface of the metal housing is protected during the assembly process of the electronic device. It may not affect the change in the capacitance of the grip sensor and the transmission/reception of signals in the frequency band of the antenna. In addition, it has an antistatic function to suppress the generation of static electricity, and can prevent the transfer of the adhesive even under conditions of thermal shock and high temperature and high humidity.

1 is a schematic view showing that the protective film at the position of the grip sensor is punched out in the prior art.
2 is a schematic diagram showing the structure of an adhesive protective film in an exemplary embodiment of the present invention.
3 is a schematic view showing that the protective film at the position of the grip sensor is used without punching in an exemplary embodiment of the present invention.

In the present specification, peeling charging characteristics or numerical values means measuring the generation of static electricity generated when the adhesive protective film is attached to the adherend and then removed. For reference, after attaching the adhesive protective film during the process and removing the adhesive protective film after the process is finished, the surface resistance and peeling electrification values are evaluated as properties required to prevent damage to the module and the inflow of foreign substances due to static electricity generated while removing the adhesive protective film.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a schematic diagram showing the structure of an adhesive protective film in an exemplary embodiment of the present invention.

As shown in FIG. 2 , in an exemplary embodiment of the present invention, the adhesive protective film is an adhesive protective film that can be used for an electronic device, in particular, a metal housing on the rear side of an electronic device including a grip sensor and/or an antenna, and includes PET and The same base film (1), a primer layer (2), an acrylic adhesive layer (3) made of an acrylic adhesive composition, and a release film (4) are laminated.

Here, the acrylic pressure-sensitive adhesive composition is an acrylic copolymer comprising 63 to 77% by weight of acrylic acid, 13 to 22% by weight of a hydroxyl group and a carboxyl group-containing copolymerizable unsaturated monomer, and 8 to 15% by weight of a reactive emulsifier Based on 100 parts by weight, 2.5 to 3.5 parts by weight of a crosslinking agent and 1.2 to 1.8 parts by weight of an antistatic agent.

This adhesive protective film has adhesive strength that can be attached to the surface of the metal housing, can exhibit ^{a surface resistance of less than 10 9} ohm, for example, 10 ⁸ , and leaves no residue on the surface of the metal housing under the reliability conditions of high temperature, high humidity and thermal shock (i.e., , there is no metastasis). In particular, there is an advantage that it does not affect the change in capacitance connected to the grip sensor circuit applicable to the metal housing and the transmission/reception of signals in the frequency band of the antenna. Each layer will be described below.

base film

In an exemplary embodiment of the present invention, for example, a polyethylene terephthalate (PET) film may be used as the base film 1 . As such a base film, it is preferable to use a material having a high elastic modulus, a small hygroscopic expansion coefficient, and a small linear expansion coefficient. In addition, as the base film, it is preferable to use a fabric having excellent optical properties and not using recycled chips.

In a non-limiting example, the thickness of the base film 1 may be stably secured as the thickness decreases in the portion having a curved surface according to the shape of the housing of the electronic device used. In this aspect, the thickness of the base film 1 such as PET may be used in a range of 25 to 100 µm, for example, 25 µm, 36 µm, 50 µm, 75 µm, or 100 µm. When the size is smaller than 25㎛, pressing or bending occurs, making handling difficult. In addition, there is a high possibility that the breakage of the base film occurs due to the tension applied in the roll-to-roll continuous process.

In a non-limiting example, the strength of the base film 1 is 20 kgf/mm ^{2 in the MD direction.} Above, use ^{30kgf/mm 2} or more in the TD direction. In addition, a film having an elongation of less than 250% in MD direction and less than 150% in TD direction is used. In addition, in the case of heat shrinkage (Heat Shrinkage), use a film of 1.5% or less at 150 ℃. If the strength is out of the above range, there is a risk of fracture during the continuous process, and if the elongation and heat shrinkage are higher than the above range, proper punching properties may not come out due to the external environment (process, etc.). Also, alignment may become out of order during the process.

primer layer

The primer layer coated on the surface of the base film is not particularly limited as long as it maintains the adhesion of the adhesive by strengthening the surface tension. The primer layer may be formed on both surfaces of the base film.

As such a primer layer, a primer layer may be formed using one selected from among acrylic, urethane, silicone, and epoxy.

Alternatively, the primer layer may be formed on the base film through corona treatment or plasma _{treatment such as CO 2 plasma treatment.}

acrylic adhesive layer

The main component of the pressure-sensitive adhesive composition used in the exemplary embodiment of the present invention is used as an acrylic copolymer. Preferably, an acryl-based copolymer having a high molecular weight and a narrow molecular weight distribution within the limits capable of realizing surface resistance and desired adhesion is used.

The acrylic copolymer has a suitable adhesive strength and re-peelability, as well as an antistatic action, and is a pressure-sensitive adhesive composition that does not leave stains even after re-peeling. In particular, when it has a high molecular weight and a narrow molecular weight distribution, no stains or residues remain.

This acrylic copolymer adhesive composition contains 63 to 77% by weight of acrylic acid, 13 to 22% by weight of a copolymerizable unsaturated monomer containing a hydroxyl group and a carboxyl group, and 8 to 15% by weight of an acrylic copolymer containing a reactive emulsifier 100 It can be obtained by adding 2.5-3.5 weight part of crosslinking agents with respect to weight part.

When acrylic acid is out of the above content range, it is difficult to obtain desired adhesive strength and reliability. In addition, even if the unsaturated monomer is out of the above content range, it is difficult to obtain the desired adhesive strength and reliability. If the reactive emulsifier is out of the above content range, the desired surface resistance value cannot be obtained.

When 1.2 to 1.8 parts by weight of an antistatic agent is additionally added, peeling electrification can be secured.

The acrylic acid may be, for example, at least one selected from the group consisting of methyl acrylate (METHYL ACRYLATE), ethyl acrylate (ETHYL ACRYLATE), butyl acrylate (BUTYL ACRYLATE) and octyl acrylate (OCTHYL ACRYLATE).

The unsaturated monomer containing a hydroxyl group and a carboxyl group is hydroxyl ethyl acrylate, hydroxyl ethyl methacrylate, hydroxyl propyl acrylate, and carboxyl ethyl acrylate. It may be one or more selected from the group consisting of ethyl acrylate).

The reactive emulsifier participates in radical polymerization as an anionic emulsifier containing an allyl group, such as acryloyl and metaacrylol, and serves to strengthen the binding force with the antistatic agent.

The molecular weight of the acrylic copolymer is preferably 1 to 1.5 million Mw level. When the molecular weight is too low, it is difficult to secure the desired reliability, and when the molecular weight is too high, a problem of processability may occur due to too high viscosity.

The crosslinking agent may be at least one selected from the group consisting of an isocyanate compound, an epoxy compound, and a metal compound. Examples of the isocyanate compound include an adduct with an aromatic diisocyanate such as torylene diisocyanate and xylene diisocyanate, hexamethylene diisocyanate, or a compound having a hydroxyl group.

If the amount of the crosslinking agent used is less than 2.5 parts by weight, crosslinking becomes insufficient, and it is difficult to secure reliability (high temperature, high humidity, thermal shock), and residues may remain on the surface of the metal housing, and desirable re-peelability may not be obtained due to increased adhesion. On the other hand, when the amount of the crosslinking agent used is more than 3.5 parts by weight, unreacted curing agents may rather be transferred to the adherend in a reliable environment, and cloudiness may occur during processing as in Comparative Example 1 to be described later. In this respect, a level of 2.5 to 3.5 parts by weight is preferable.

On the other hand, the additive-type antistatic agent lowers the electrical resistance of the acrylic copolymer, and the above-described adhesive composition is dried on a base film such as polyethylene terephthalate, and then applied to a thickness of, for example, 15 to 25 μm to prepare an adhesive protective film.

In a non-limiting example, the antistatic agent is not particularly limited, but may be one or more selected from the group consisting of a lithium anion, an ammonium-based cation, a polysiloxane-based cation, and a glycol ether anion.

If the blending amount of the antistatic agent is less than 1.2 parts by weight based on 100 parts by weight of the acrylic copolymer, the effect is insignificant and the above conditions cannot be satisfied, and when it exceeds 1.8 parts by weight, there is a risk of contamination on the housing surface. Accordingly, the antistatic agent is preferably added in an amount of 1.2 to 1.8 parts by weight based on 100 parts by weight of the acrylic copolymer.

For reference, the surface resistance of the adhesive protective film according to an exemplary embodiment of the present invention is set to be less than ^{10 9} ohms because static electricity may damage the electronic device due to the generation of static electricity in the manufacturing process of the electronic device.

In order to apply the grip sensor to the surface of the metal housing of an electronic device ^{, an appropriate level of surface resistance is required under the condition of less than 10 9} ohm. However, if the surface resistance is too high or too low, an error in capacitance change may occur. Therefore, 1.2 to 1.8 parts by weight is preferable so that a level of ^{10 8} ohm or more and ^{less than 10 9 ohm without error can be expressed.}

In an exemplary embodiment of the present invention, a plasticizer, a UV stabilizer, an antioxidant, and the like may be further added to the pressure-sensitive adhesive composition for a specific purpose.

On the other hand, the above-described pressure-sensitive adhesive composition can be prepared as a pressure-sensitive adhesive protective film by applying a thickness of, for example, 10 ~ 30㎛ or 15 ~ 25㎛ after drying on a base film such as polyethylene terephthalate. The coating method is not particularly limited as long as it is a known coating method, and coating may be performed using, for example, a die coater, a nip coater, a gravure roll coater, a comma coater, and the like. Moreover, 120 degreeC or more of drying temperature is preferable.

release film

The release agent used for manufacturing the release film 4 is not particularly limited, but a silicone-based release agent that exhibits release properties in an acrylic adhesive is preferable, and other wax-based release agents can be used.

Formation of the release film can be performed by a known coating method. Specifically, the release agent is applied to a base film such as polyethylene terephthalate by various methods such as gravure coating, Mayer bar coating, air knife coating and doctor knife coating. Then, it can be carried out by drying and curing by a method such as heat treatment or ultraviolet irradiation. Here, as for the drying temperature, 120 degreeC or more is preferable.

The thickness of the release film may be, for example, 80 µm or less, for example, 19 µm, 23 µm, 25 µm, 50 µm, 75 µm, etc. However, for a release film that is too thin, the film may break due to high tension during the punching process. Therefore, 50 μm or more is preferable from the viewpoint of securing stable fairness. On the other hand, there is a problem in that the thickness of 80㎛ or more may increase the manufacturing cost.

As described above, after forming the acrylic pressure-sensitive adhesive layer 3 by coating the acrylic pressure-sensitive adhesive composition on the primer layer 2 , the above-prepared release film 4 may be laminated to prepare an adhesive protective film.

Adhesive protection film properties

In an exemplary embodiment, the physical properties of the adhesive protective film of the present invention include an adhesive strength of 8.5±3 gf/25mm, an adhesive surface resistance of ^{less than 10 9} Ω, such as a ^{level of 10 8} Ω, a peeling charge of 1.0 kv or less, Haze 2 It can have ±1%, transmittance 90±2%, and it has reliability under thermal shock, high temperature and high humidity conditions, and there is no sensor error. This is an excellent property exceeding the target physical property.

Reliability in the thermal shock is, for example, attaching an adhesive protective film to the surface of a metal housing and performing 72 cycles (72 hours) of 1 hour at -40°C for 30 minutes and 85°C for 30 minutes as one cycle. Even when peeled off, it may be that a residue does not remain on the surface of the metal housing (Pass).

Reliability in the high temperature and high humidity conditions is, for example, when the adhesive protective film is attached to the surface of the metal housing and the adhesive protective film is peeled off after 72 hours of high temperature and high humidity test at 95% relative humidity and 50° C., no residue is left on the surface of the metal housing. It may be a pass.

For reference, the target properties of the adhesive protection film are summarized as follows.

Category (unit) target properties Adhesion (gf/25mm) 15 or less Release Peeling Force (gf/25mm) 3 or less Haze (%) over 89 Transmittance (T.T) (%) 3 or less Surface resistance (Ω) less than 10 ⁹ Thermal Shock (Pass/Fail) Pass High Temperature High Humidity (Pass/Fail) Pass Sensor error (Pass/Fail) Pass

Accordingly, the surface of the metal housing is protected during the assembly process of the electronic device, and there is no adhesive transfer or residue left on the surface of the metal housing even in external environments such as thermal shock, high temperature and high humidity. In particular, the capacitance change connected to the grip sensor circuit that can be applied to the rear housing And it serves as an adhesive protection film that does not affect transmission/reception of signals in the frequency band of the antenna, and can overcome the disadvantage of not protecting the front of the housing in the past.

Exemplary embodiments of the present invention are described in more detail through the following examples. The embodiments disclosed in this specification are illustrated for the purpose of explanation only, and the embodiments of the present invention may be embodied in various forms and should not be construed as being limited to the embodiments described herein.

[ Example and comparative example ]

[Table 2] shows the composition and adhesive thickness of the acrylic pressure-sensitive adhesive composition of Examples and Comparative Examples, based on 100 parts by weight of the acrylic copolymer, 1 to 4 parts by weight of a crosslinking agent (isocyanate), 1.5 to 2.0 parts by weight of an antistatic agent (glycol ether anion) The composition was varied in minor ranges. After the pressure-sensitive adhesive coating and release film formation, the drying temperature was set to 120°C.

In this Example and Comparative Examples 1 to 6, as shown in FIG. 2 , the urethane primer layer 2 was formed to be 1 μm or less in order to secure the adhesiveness of the adhesive on the upper portion of the polyethylene terephthalate film 1 . Formation and lamination of each acrylic pressure-sensitive adhesive (3) was laminated to each thickness, a silicone-based release treatment on the top acrylic pressure-sensitive adhesive layer 3, a polyethylene terephthalate film, i.e., release film 4 to the surface treatment (2) region An adhesive protective film was prepared.

For reference, in Comparative Example 7, an antistatic agent is coated on the primer layer 2 without adding an antistatic agent to the adhesive, and then the acrylic adhesive layer 3 is laminated (that is, the primer layer 2 and the acrylic adhesive layer 3) ) Formation of an antistatic agent layer between: PET film / primer layer / antistatic layer / acrylic adhesive layer / release film) was prepared in the same manner.

[Table 2] shows the composition according to each Example and Comparative Examples.

acetic acid
ethyl unsaturated
monomer
(hydroxyl ethyl acrylate) Reactivity
emulsifier
(Acrylic roll) crosslinking agent
(isocyanate) antistatic agent
(glycol
ether
anion) Adhesive thickness Example 1 65 15 10 3 1.5 20 Comparative Example 1 65 15 10 4 1.5 20 Comparative Example 2 65 15 10 2 1.5 20 Comparative Example 3 65 15 10 One 1.5 20 Comparative Example 4 65 15 10 3 1.0 20 Comparative Example 5 65 15 10 3 2.0 20 Comparative Example 6 65 15 10 3 1.5 10 Comparative Example 7 65 15 10 3 - 20

[Method of measuring physical properties]

Hereinafter, each physical property was measured as follows.

* Adhesion test test ( CKP -5000)

① Cut the adhesive tape in the machine direction to 25mm in width x 250mm in length.

② Measure the release peeling force while peeling at a peeling speed of 300m/min in the 180° Peel Test method using an adhesive force meter (CKP-5000).

③ Lay the specimens tested for release peeling on a glass or SUS plate that has been washed and dried using an automatic laminating machine (2 kg load) and stored at 25±2℃ for 30 minutes.

④ Measure the adhesive force while peeling at a peeling rate of 300mm/min using a 180° Peel Test method using an adhesive force meter (CKP-5000) (check the adhesive force for each glass part).

* peel force exam( CKP -5000)

① Lightly attach a standard tape (TESA7475) with a width of 25 mm x a length of 250 mm to the coated product in the machine direction.

② After reciprocating the prepared sample twice at a speed of 10mm/sec using a FINAT test roller (2kg load), place the sample between a flat metal plate or glass plate for sufficient compression of the coated product and the standard tape at 70g/cm2. Store under pressure at 23±2℃ for 20 hours.

③ After storage, remove the pressure and conduct the test after 4 hours at a temperature of 23±2℃.

④ The test is measured by fixing the test sample to the jig and peeling the standard tape in the 180° direction at a speed of 300mm/min.

* Optical characteristics ( NDH -2000)

① Cut the adhesive tape into 50mm×50mm horizontally left, middle, and right.

② Fix the sample to the measuring device in the same direction to measure transmittance and haze, which are optical properties.

③ Record the result.

* Surface resistance (TREK-152-1)

① Measure 3 points in the left, middle, and right direction of the full width of the adhesive tape.

② Place the prepared sample on the glass and measure the adhesive surface with a surface resistance meter.

③ The standard is 100V, Ω standard.

* thermal shock Test (TS500)

① Prepare the electronic device metal housing and adhesive tape suitable for its size.

② Lay the prepared adhesive tape on the metal housing and conduct a thermal shock test.

③ Test conditions are -40℃/30min ~ 85℃/30min for 1 cycle (ie, leave at -40°C for 30 minutes, leave at 85°C for 30 minutes for 1 cycle), and proceed to 72 cycles. After the cycle, peel the adhesive protective film from the surface of the metal housing and visually check whether the adhesive has transferred.

As a result of this thermal shock test, if there is no transition, it is Pass, and if there is transition, it is Fail.

* High-temperature, high-humidity test (JEIO TECH thermo-hygrostat)

① Prepare the electronic device metal housing and adhesive tape suitable for its size.

② Lay the prepared adhesive tape on the metal housing and proceed with the following test conditions.

③ Test conditions are 50℃, 95% relative humidity, 72 hours (hr). After the test, peel the adhesive protective film from the surface of the metal housing and visually check whether the adhesive has transferred.

As a result of this high-temperature, high-humidity test, if there is no transition, it is Pass, and if there is transition, it is Fail.

sensor error test

① Prepare the electronic device metal housing (including the grip sensor) and an adhesive tape suitable for its size.

② Lay the prepared adhesive tape on the metal housing and check whether the sensor works.

③ Test is performed by selecting 5 points randomly among 1sqm of adhesive tape.

As a result of these sensor error tests, if there is no error, it is Pass, and if there is an error, it is Fail.

[result]

Hereinafter, the measurement results of each physical property are described in [Table 3] and [Table 4].

Example 1 Comparative Example 1 Comparative Example 2 Comparative Example 3 Adhesion (gf/25mm) 8.5 8.2 15.4 48.2 Peel force (gf/25mm) 1.3 1.2 1.3 2.8 Haze (%) 2.5 4.8 2.3 2.1 Transmittance (%) 90.8 89.7 90.4 90.3 Surface resistance (Ω) 8.12*10 ⁸ 9.47*10 ⁸ 1.36*10 ⁸ 8.71*10 ⁸ Is there any sensor error? OK(Pass) OK
(Pass) OK
(Pass) OK
(Pass) Transition (thermal shock / high temperature and high humidity) OK(Pass) OK
(Pass) NG
(Fail) NG
(Fail) remark Great cloudiness metastasis high adhesion

Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 Adhesion (gf/25mm) 9.1 8.9 7.8 10.3 Peel force (gf/25mm) 1.3 1.3 11 1.4 Haze (%) 2.3 2.4 2.6 2.9 Transmittance (%) 90.1 90.2 89.9 89.8 Surface resistance (Ω) 8.71*10 ⁹ 8.04*10 ⁸ 9.12*10 ⁸ 8.74*10 ⁸ Is there any sensor error? OK(Pass) OK
(Pass) OK
(Pass) NG
(Fail) Transition (thermal shock / high temperature and high humidity) OK(Pass) OK
(Pass) OK
(Pass) OK
(Pass) remark High surface resistance cost increase Curved surface adhesion NG, insufficient adhesion sensor error

As can be seen from the above results, it was found that, unlike the comparative examples, the pressure-sensitive adhesive composition of Examples secured an appropriate level of adhesive strength without any trace of contamination of the pressure-sensitive adhesive even after being attached to the glass and then peeled again. In addition, the surface resistance of the pressure-sensitive adhesive was ^{less than 10 9} , which secured a level of surface resistance and peeling charging effect without any problem in touch recognition, and an adhesive protective film that secured the reliability required in high temperature, high humidity and thermal shock conditions.

For reference, when an antistatic layer was formed between the primer layer and the acrylic adhesive layer as in Comparative Example 7, a grip sensor error occurred.

Although non-limiting and exemplary embodiments of the present invention have been described above, the technical spirit of the present invention is not limited to the accompanying drawings or the above description. It will be apparent to those skilled in the art that various types of modifications are possible within the scope of the present invention without departing from the spirit of the present invention, and also, such modifications will fall within the scope of the claims of the present invention.

Claims (18)

As an electronic device adhesive protective film in which a base film, a primer layer, an acrylic adhesive layer made of an acrylic adhesive composition and a release film are laminated,
The acrylic pressure-sensitive adhesive composition is an acrylic copolymer containing 63 to 77% by weight of acrylic acid, 13 to 22% by weight of a copolymerizable unsaturated monomer containing hydroxyl and carboxyl groups, and 8 to 15% by weight of a reactive emulsifier. about wealth,
An adhesive protective film comprising 2.5 to 3.5 parts by weight of a crosslinking agent and 1.2 to 1.8 parts by weight of an antistatic agent.
The method of claim 1,
The adhesive protective film is an adhesive protective film, characterized in that it has an adhesive strength of 8.2 ~ 8.8 gf / 25mm.
The method of claim 1,
The adhesive protective film, characterized in that the adhesive surface resistance is ^{less than 10 9 Ω.}
The method of claim 1,
The adhesive protective film, characterized in that the peeling electrification value of the adhesive protective film is 1.0 kv or less.
The method of claim 1,
The adhesive protective film has a haze of 1 to 3%.
The method of claim 1,
The adhesive protective film has a transmittance of 88 to 92%.
The method of claim 1,
The adhesive protective film is an adhesive protective film, characterized in that no residue remains on the surface of the metal housing.
8. The method of claim 7,
After attaching the adhesive protective film to the surface of the metal housing, leaving it at -40°C for 30 minutes and leaving it at 85°C for 30 minutes as one cycle, a total of 72 cycles of thermal shock test. Even when the adhesive protective film is peeled off, residues on the surface of the metal housing Adhesive protective film, characterized in that it does not remain.
8. The method of claim 7,
Adhesive protective film, characterized in that no residue remains on the surface of the metal housing even when the adhesive protective film is peeled off after a high-temperature and high-humidity test in which the adhesive protective film is attached to the surface of the metal housing and 72 hours have elapsed under 95% relative humidity and 50°C conditions.
The method of claim 1,
The crosslinking agent is an adhesive protective film, characterized in that at least one selected from the group consisting of an isocyanate compound, an epoxy compound and a metal compound.
The method of claim 1,
The antistatic agent is an adhesive protective film, characterized in that at least one selected from the group consisting of lithium anions, ammonium-based cations, polysiloxane-based cations and glycol ether anions.
The method of claim 1,
The base film is a polyethylene terephthalate film of 25-100 μm,
The strength is 20kgf/mm ^{2 in the MD direction} Above and TD direction 30kgf/mm ² more than,
The elongation is less than 250% in the MD direction and less than 150% in the TD direction,
The adhesive protective film, characterized in that the heat shrinkage (Heat Shrinkage) is 1.5% or less at 150 ℃.
The method of claim 1,
Adhesive protective film, characterized in that the primer layer is further formed on the layer opposite to the acrylic adhesive layer of the base film.
14. The method according to any one of claims 1 to 13,
The adhesive protective film is an adhesive protective film, characterized in that for protecting the surface of a metal housing of an electronic device.
As a method for producing the adhesive protective film of any one of claims 1 to 13,
forming a primer layer on the base film;
forming an acrylic adhesive layer by coating the acrylic adhesive composition on the primer layer; and
Forming a release film on the acrylic adhesive layer; adhesive protective film manufacturing method comprising the.
The electronic device to which the release film of the adhesive protective film of any one of claims 1 to 13 is removed and attached.
17. The method of claim 16,
The electronic device includes at least one of a grip sensor and an antenna, has a metal housing, and the adhesive protection film is attached without punching a surface of the metal housing of the electronic device.
14. A method of removing the release film of the adhesive protective film of any one of claims 1 to 13 and attaching it to an electronic device, the method comprising:
The electronic device includes at least one of a grip sensor and an antenna, and has a metal housing,
An electronic device attachment method of an adhesive protective film, characterized in that the adhesive protective film is attached without punching the surface of the metal housing of the electronic device.

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