KR20210081947A - Organic light emitting display device - Google Patents

Abstract

The present invention provides an organic light emitting display device. It includes a red sub-pixel area and a white sub-pixel area disposed adjacent to each other, a red color filter disposed on the red sub-pixel area, and a first line-type color filter disposed at an edge of the red color filter adjacent to the white sub-pixel region and having a color different from red. The first line-type color filter has a width that is narrower than that of the red color filter. Accordingly, an organic light emitting display device according to the present invention can reduce a color difference according to a viewing angle.

Description

Organic light emitting display device {ORGANIC LIGHT EMITTING DISPLAY DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting diode display, and more particularly, to an organic light emitting display having improved color difference according to a viewing angle.

A display device that displays various information as an image is a plasma display panel (PDP), a liquid crystal display device (LCD), and organic light emitting diodes (OLED) in various ways. Implementing video.

Among them, the organic light emitting display device is a self-emission type display device, which has superior viewing angle and contrast ratio compared to a liquid crystal display device (LCD), does not require a separate backlight, can be lightweight and thin, and has advantageous power consumption.

In the organic light emitting display device, formation of an organic light emitting layer is essential. Conventionally, red, green, and blue organic light emitting layers are respectively deposited for each sub-pixel using a fine metal mask (FMM) to form the organic light emitting layer.

However, as the size of the organic light emitting diode display increases or the resolution increases, sagging of the substrate and the fine metal mask occurs, so it is difficult to form red, green, and blue organic light emitting layers using the fine metal mask.

As one of the methods for replacing the method of using such a fine metal mask, a structure in which a white organic light emitting layer is equally formed on all sub-pixels and different color filters are employed for each sub-pixel has been proposed.

On the other hand, in an organic light emitting diode display having red, white, blue, and green sub-pixels using a white organic light emitting layer and having color filters disposed on an encapsulation layer without a black matrix, as the line width of the bank becomes thinner for high resolution, At a viewing angle of 60°, a color difference due to color mixing occurred. In particular, when the red sub-pixel is disposed adjacent to the white sub-pixel, a color difference of red due to color mixing occurs at a viewing angle of 60°. For example, as confirmed through simulation, when a red sub-pixel emits light, white light leaks through an adjacent white sub-pixel and mixes only 0.5% of the red light with a Δu'v' value of 0.021.

The thicker the encapsulation layer, the better in order to secure the reliability of the penetration of moisture and moisture. However, as the thickness of the encapsulation layer increases, the distance between the color filter and the organic emission layer increases, so that light leakage between adjacent sub-pixels increases and color mixing increases.

As the thickness of the encapsulation layer increases, the difference in the color of red due to color mixing increases, so that the thickness of the encapsulation layer is limited to a specific thickness or less. For example, if the line width of the bank is 17 µm, the thickness of the encapsulation layer that does not cause a difference in the color of red due to color mixing is 12.5 µm. The thickness of the encapsulation layer, where no difference occurs, is limited to 7.5 μm.

Accordingly, the inventors of the present invention have invented a new structure of an organic light emitting diode display capable of reducing a color difference according to a viewing angle.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an organic light emitting diode display with improved reliability with respect to moisture and permeation of moisture, while reducing a color difference according to a viewing angle.

The objects of the present invention are not limited to the above-mentioned objects, and other objects and advantages of the present invention not mentioned may be understood by the following description, and will be more clearly understood by the examples of the present invention. Moreover, it will be readily apparent that the objects and advantages of the present invention may be realized by the means and combinations thereof indicated in the claims.

The organic light emitting diode display according to an embodiment of the present invention provides a red sub-pixel area and a white sub-pixel area disposed adjacent to each other, a red color filter disposed on the red sub-pixel area, and the white sub-pixel area adjacent to each other. A first line-type color filter disposed at an edge of the red color filter and having a color different from red may be included, wherein the first line-type color filter may have a width smaller than a width of the red color filter.

In an organic light emitting diode display according to an exemplary embodiment of the present invention, a plurality of red sub-pixel areas and a plurality of white sub-pixel areas are alternately disposed in one direction, and a plurality of red sub-pixel areas are disposed on the plurality of red sub-pixel areas. red color filters and a plurality of first line-type color filters disposed at edges of the red color filters adjacent to the white sub-pixel areas and having a color different from red; width is It may have a width narrower than the width of the red color filter.

Accordingly, the organic light emitting diode display according to the present invention can reduce a color difference according to a viewing angle and increase the thickness of the encapsulation layer.

In the organic light emitting diode display according to the present invention, by disposing a blue or green line-type color filter adjacent to an edge of a red color filter adjacent to a white sub-pixel, a difference in color of red according to a viewing angle may be reduced.

Also, in the organic light emitting diode display according to the present invention, the thickness of the encapsulation layer may be increased and reliability may be improved by disposing the blue or green line-type color filter adjacent to the edge of the red color filter adjacent to the white sub-pixel.

In addition to the above-described effects, the specific effects of the present invention will be described together while describing specific details for carrying out the invention below.

1 is a block diagram schematically illustrating an organic light emitting display device.
FIG. 2 is a plan view schematically illustrating a connection and arrangement relationship of components constituting an organic light emitting diode display.
3 is a schematic plan view illustrating one pixel of an organic light emitting diode display according to an exemplary embodiment.
4 is a schematic cross-sectional view illustrating one pixel of an organic light emitting diode display according to an exemplary embodiment, and is a cross-sectional view taken along the cutting line I-I′ of FIG. 3 .
5A and 5B are enlarged views of a partial area of FIG. 4 .
6 is a schematic cross-sectional view illustrating one pixel of an organic light emitting diode display according to an exemplary embodiment.
7A and 7B are enlarged views of a partial area of FIG. 6 .
8 to 17 are schematic plan views illustrating one pixel of an organic light emitting diode display according to example embodiments.
18 is a cross-sectional view illustrating an organic light emitting diode display according to an exemplary embodiment.

The above-described objects, features and advantages will be described below in detail with reference to the accompanying drawings, and accordingly, those of ordinary skill in the art to which the present invention pertains will be able to easily implement the technical idea of the present invention. In describing the present invention, if it is determined that a detailed description of a known technology related to the present invention may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

In the following, that an arbitrary component is disposed on the "upper (or lower)" of a component or "upper (or below)" of a component means that any component is disposed in contact with the upper surface (or lower surface) of the component. Furthermore, it may mean that other components may be interposed between the component and any component disposed on (or under) the component.

Also, when it is described that a component is "connected", "coupled" or "connected" to another component, the components may be directly connected or connected to each other, but other components are "interposed" between each component. It is to be understood that “or, each component may be “connected,” “coupled,” or “connected” through another component.

Hereinafter, an organic light emitting diode display according to some embodiments of the present invention will be described.

1 is a block diagram schematically illustrating an organic light emitting display device. FIG. 2 is a plan view schematically illustrating a connection and arrangement relationship of components constituting an organic light emitting diode display.

However, in the case of FIGS. 1 and 2 , as an exemplary embodiment of the present invention, the connection and arrangement relationship of each component of the organic light emitting display device 100 according to the present invention is not limited thereto.

The organic light emitting diode display 100 may include a display panel 110 , a timing controller 140 , a data driver 120 , and a gate driver 130 .

The display panel 110 may include a display unit DA that displays an image including a pixel (P) array and a non-display unit NDA that does not display an image.

The non-display area NDA may be disposed to surround the periphery of the display area DA. The gate driver 130 , the data drive IC pad part DPA, and various wirings may be disposed in the non-display area NDA, and the non-display area NDA may correspond to the bezel part.

The display panel 110 is formed by a plurality of gate lines GL arranged in one direction and a plurality of data lines DL arranged in one direction to be orthogonal to the gate lines GL. It may include a plurality of formed pixel regions.

The pixel areas may be arranged in a matrix form, and a pixel P including a plurality of sub-pixels SP may be disposed in each pixel area.

The gate driver 130 controls on/off of the driving thin film transistors 210 of the pixels in response to a gate control signal applied from the timing controller 140 , and data applied from the data driver 120 . It allows the voltage Vdata to be provided to a suitable pixel circuit. To this end, the gate driver 130 sequentially outputs gate signals such as a scan signal or an emission signal, and sequentially supplies the gate signals to the gate lines GL.

When the gate signals are supplied to the gate line GL, the data voltage may be applied to sub-pixels of the pixel circuits connected to the specific gate line GL.

The gate driver 130 may include one or more gate driver integrated circuits (Gate Driver ICs), one or both sides of the display panel 110 depending on a driving method or a design method of the display panel 110 . can be located in

As shown in FIG. 2 , in the gate driver 130 , a gate driver integrated circuit may be directly formed on the display panel 110 using a gate-driver in panel (GIP) method. The gate driver 130 formed by the gate-driver in-panel method may be disposed in the non-display area NDA, which is the left and right outer portions of the display area DA, respectively. In addition, the gate driver integrated circuit is connected to a bonding pad of the display panel 110 by a tape automated bonding (TAB) method or a chip-on-glass (COG) method, or a chip-on-film (COF) method. : Chip On Film) method can be implemented.

When the specific gate line GL is opened, the data driver 120 converts the image data received from the timing controller 140 into an analog data voltage, and supplies the data voltage to the data line DL in synchronization with the gate control signal. do.

The data driver 120 may include at least one source driver integrated circuit 121 (Source Driver Integrated Circuit: Source Driver IC). Each of the source driver integrated circuits 121 is connected to a bonding pad of the display panel 110 by a tape automated bonding (TAB) method or a chip-on-glass (COG) method, or the display panel It may be disposed directly or integrated in 110 . In addition, each of the source driver integrated circuits 121 may be implemented in a Chip On Film (COF) method. For example, as shown in FIG. 2 , each source driver integrated circuit 121 is mounted on a flexible film 123 , and one end of the flexible film 123 is at least one control printed circuit board 150 , Control printed circuit board), and the other end is bonded to the data drive IC pad part DPA of the display panel 110 .

Accordingly, the flexible film 123 includes wires connecting the data drive IC pad part DPA of the display panel 110 and the source driver integrated circuit 121 , and the data drive IC pad part DPA and the control printed circuit board. Wires connecting the wires of 150 may be formed.

A plurality of circuits implemented with driving chips may be mounted on the control printed circuit board 150 , and for example, a timing controller 140 may be disposed as shown in FIG. 2 . In addition, a power controller for supplying various voltages or currents to the display panel 110 , the data driver 120 , the gate driver 130 , or controlling various voltages or currents to be supplied is further disposed on the control printed circuit board 150 . can

The timing controller 140 controls the data driver 120 and the gate driver 130 by providing the gate control signal to the gate driver 130 and providing the data control signal to the data driver 120 .

In addition, the timing controller 140 starts scanning according to the timing implemented in each frame, and converts input image data input from the outside to match the data signal format used by the data driver 120 to output the converted image data. and control the data operation at an appropriate time according to the scan.

3 is a schematic cross-sectional view of one pixel of an organic light emitting diode display according to an exemplary embodiment.

Referring to FIG. 3 , the organic light emitting diode display according to the present exemplary embodiment includes thin film transistors 210 , organic light emitting diodes 250 , a bank 240 , and first to third formed on a first substrate 201 . It may include color filters 271 , 272 , 273 , and the like.

The first substrate 201 includes the display unit DA on which the pixels P are disposed, the gate driver 130 , the data drive IC pad part DPA, and various wirings, which are described above with reference to FIGS. 1 and 2 . It is a base substrate of the display panel 110 on which the non-display area NDA is formed. The first substrate 201 may be a plastic substrate or a glass substrate.

Thin film transistors 210 and organic light emitting devices 250 connected to the thin film transistors 201 are disposed on the first substrate 201 .

A buffer layer 205 may be formed on the first substrate 201 before the thin film transistors 210 are formed. The buffer layer 205 serves to protect the thin film transistors 210 and the organic light emitting devices 250 from moisture penetrating through the first substrate 201 which is vulnerable to moisture permeation. The buffer layer 205 may be formed of an insulating material such as silicon oxide, silicon nitride, or silicon oxynitride (SiON). The buffer layer 205 may be formed of multiple insulating materials.

A thin film transistor 210 may be formed on the buffer layer 205 . The thin film transistor 210 includes an active layer 211 , a gate electrode 212 , a gate insulating layer 213 , a drain electrode 214 , and a source electrode 215 . In FIG. 3 , the thin film transistor 210 exemplarily has a coplanar structure, but is not limited thereto, and may be formed in various forms such as an inverted staggered structure.

An active layer 211 formed of a semiconductor film is formed on the buffer layer 205 , and may be formed of an oxide semiconductor material or polycrystalline silicon. Alternatively, the active layer 211 may be made of single crystal silicon. Both edges of the active layer 211 may be doped with impurities.

A gate insulating layer 213 may be formed on the active layer 211 . The gate insulating layer 213 may be formed on the entire upper surface of the first substrate 201 . The gate insulating layer 213 may be formed of, for example, silicon oxide.

A gate electrode 212 corresponding to at least a partial region of the active layer 211 is formed on the gate insulating layer 213 . The gate electrode 212 may include any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or these It may be formed as a single layer or multiple layers made of an alloy of The gate electrode 212 may be formed of, for example, a double metal layer of an alloy of copper (Cu) and MoTi.

An interlayer insulating layer 222 may be formed on the gate electrode 212 . The interlayer insulating layer 222 may cover the gate electrode 212 and the gate insulating layer 213 .

The interlayer insulating layer 222 may be formed of an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride (SiON), or an organic insulating material such as benzocyclobutene or photo-acryl. have.

A drain electrode 214 and a source electrode 215 made of a conductive material such as metal are formed on the interlayer insulating layer 222 , and are exposed by contact holes formed in the gate insulating layer 213 and the interlayer insulating layer 222 . are electrically connected to both ends of the active layer 212, respectively.

A protective layer 224 for insulating the thin film transistor 210 may be formed on the drain electrode 214 , the source electrode 215 , and the interlayer insulating layer 222 . The protective layer 224 may be formed of an inorganic insulating material, for example, silicon oxide, silicon nitride, silicon oxynitride, or a multilayer thereof.

A planarization layer 226 for flattening a step caused by the thin film transistor 210 may be formed on the passivation layer 224 . The planarization layer 226 may be formed of an organic insulating material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin. can

Organic light emitting devices 250 and a bank 240 may be formed on the planarization layer 226 .

The organic light emitting devices 250 include lower electrodes 251 respectively formed in the first sub-pixel region SP1 , the second sub-pixel region SP2 , and the third sub-pixel region SP3 of the first substrate 201 . , an organic emission layer 253 , and an upper electrode 255 . The lower electrodes 251 may be anode electrodes, and the upper electrode 255 may be a cathode electrode. The first sub-pixel area SP1 may be a red sub-pixel area, the second sub-pixel area SP2 may be a green sub-pixel area, and the third sub-pixel area SP3 may be a blue sub-pixel area.

The lower electrodes 251 may be formed on the planarization layer 226 . The lower electrodes 251 may be connected to the drain electrodes 214 of the thin film transistors 210 through a contact hole penetrating the passivation layer 224 and the planarization layer 226 .

The bank 240 may be formed to cover edges of the lower electrodes 251 on the planarization layer 226 to partition the first to third sub-pixel regions SP1 , SP2 , and SP3 . A region in which the bank 240 is formed does not emit light and thus may be defined as a non-emission part, and a region in which the bank 240 is not formed may be defined as a light emitting part.

The bank 240 may be formed of an organic material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin. .

An organic emission layer 253 may be formed on the lower electrodes 251 and the bank 240 . Specifically, the organic emission layer 253 may cover the bank 240 and the lower electrodes 251 not covered by the bank 240 . The organic emission layer 253 may be commonly formed in the first to third pixel regions SP1 , SP2 , and SP3 and may be a white emission layer emitting white light.

In this case, the organic emission layer 253 may be formed in a tandem structure in which two or more stacks are stacked. Each of the stacks may include a hole transporting layer, at least one light emitting layer, and an electron transporting layer. Also, a charge generation layer may be formed between the stacks. The organic light emitting layer 253 may include, for example, a blue light emitting layer having a peak at a wavelength of 420 nm to 460 nm and a green or yellow green light emitting layer having a peak at a wavelength of 520 nm to 560 nm. The organic emission layer 253 may further include a red emission layer in contact with the green or yellow-green emission layer. The red light emitting layer may have a peak at a wavelength of 620 nm to 640 nm.

The organic light emitting devices 250 may be implemented in a top emission method in which light is emitted in an upper direction. In this case, the lower electrodes 251 may be reflective electrodes. The lower electrodes 251 are, for example, a stacked structure of aluminum and titanium (Ti/Al/Ti), a stacked structure of aluminum and indium tin oxide (ITO) (ITO/Al/ITO), an APC alloy, and an APC alloy. It can be formed of a metal material having high reflectance, such as a laminate structure of ITO and ITO (ITO/APC/ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

An upper electrode 255 may be formed on the organic emission layer 253 . The upper electrode 255 is commonly formed in the first to third pixel areas SP1 , SP2 , and SP3 . The upper electrode 255 may be a transparent electrode. The upper electrode 255 may be formed of a transparent conductive material such as indium tin oxide (ITO), antimony tin oxide (ATO), or indium zinc oxide (IZO). Also, the upper electrode 255 may be a transflective electrode. The upper electrode 255 may be formed of a thin metal film having light transmissivity. The metal layer may be formed of magnesium (Mg), an alloy of silver (Ag) and magnesium (Mg), or a multilayer thereof. In this case, the luminance of the organic light emitting diodes 250 may be increased due to a strong cavity effect.

An encapsulation layer 260 may be formed on the upper electrode 255 to prevent oxygen or moisture from penetrating into the organic light emitting devices 250 from the outside. The encapsulation layer 260 may be formed as a multi-layer in which inorganic layers and organic layers are alternately stacked, but is not limited thereto.

For example, the encapsulation layer 260 may include a first inorganic layer, a first organic layer, a second inorganic layer, and a second organic layer sequentially stacked. Each of the first and second inorganic layers may be formed of an inorganic material such as silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. The first and second organic layers are formed of acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, and photoacryl. It may be formed of an organic insulating material such as The second organic layer may be made of a photosensitive organic material, for example, photoacrylic.

Grooves formed in the upper region of the encapsulation layer 260 , that is, the second organic layer of the encapsulation layer 260 may be formed. The grooves may be formed to correspond to the organic light emitting devices 250 . First to third color filters 271 , 272 , and 273 may be formed in the grooves formed in the second organic layer of the encapsulation layer 260 . The first to third color filters 271 , 272 , and 273 may be disposed to correspond to the organic light emitting diodes 250 , and at least some of them may be inserted into the grooves. Lower surfaces of the first to third color filters 271 , 272 , and 273 include curved surfaces. For example, the first color filter 271 may be a red color filter, the second color filter 272 may be a green color filter, and the third color filter 273 may be a blue color filter.

A passivation layer 280 may be disposed on the first to third color filters 271,272 and 273 . The protective layer 280 may be a protective film, a glass substrate, or a plastic substrate.

In the present embodiment, each of the first to third color filters 271 , 272 , and 273 includes an upper region convexly protruding above the top surface of the encapsulation layer 260 and a lower region inserted into the grooves of the encapsulation layer 260 , respectively. can have In addition, lower surfaces of the first to third color filters 271 , 272 , and 273 may be curved downwardly convex toward the organic light emitting diodes 250 . The thickness of the first to third color filters 271 , 272 , and 273 may increase toward the center.

Meanwhile, FIG. 17 is a cross-sectional view illustrating an organic light emitting diode display according to a comparative example. The organic light emitting diode display according to the comparative example shown in FIG. 17 is the same as the organic light emitting diode display according to the exemplary embodiment shown in FIG. 3 except for the arrangement of color filters. According to the comparative example, the first to third color filters 171 , 172 , and 173 are formed on the upper surface of the encapsulation layer 260 . In this case, as the resolution increases, the contact area between the first to third color filters 171 , 172 , and 173 and the encapsulation layer 260 decreases, so that the first to third color filters 171 , 172 and 173 . may be peeled off from the encapsulation layer 260 .

According to the present embodiment, the first to third color filters 271 , 272 , and 273 are formed to be inserted into the grooves formed in the upper region of the encapsulation layer 260 , and the first to third color filters are also formed. By forming the lower surfaces of 271 , 272 , and 273 to have a convex downwardly curved surface, an area in which the first to third color filters 271 , 272 , and 273 come into contact with the encapsulation layer 260 may be increased. As a result, adhesion of the first to third color filters 271 , 272 , and 273 to the encapsulation layer 260 may be improved, and the first to third color filters 271 , 272 and 273 may be peeled off or It can prevent tearing. According to the present exemplary embodiment, an organic light emitting diode display having a structurally stable color filter on encapsulation (COE) may be obtained.

According to the present embodiment, the first to third color filters 271 , 272 , and 273 are formed to be inserted into the grooves formed in the upper region of the encapsulation layer 260 , and the first to third color filters are also formed. By forming the lower surfaces of (271, 272, and 273) as a curved surface convex downward, the light extraction characteristic in which the viewing angle is extended can be improved. FIG. 11 shows the light extraction characteristics for the present example, and FIG. 18 shows the light extraction characteristics for the comparative example. Comparing FIGS. 11 and 18 , it can be seen that the viewing angle is extended in the case of the present embodiment. In the case of FIG. 18, the light emission is concentrated toward the front, but in the case of FIG. 11, it can be seen that the light emission is widely spread over 30 degrees.

The first to third color filters 271 , 272 , and 273 may include inorganic or organic color conversion materials. The first color filter 271 may include red quantum dots or red nano organic phosphors, the second color filter 272 may include green quantum dots or green nano organic phosphors, and the third color filter 273 may include green quantum dots or green nano organic phosphors. ) may include blue quantum dots or blue nano organic phosphors. In this case, according to the present exemplary embodiment, light extraction efficiency of the organic light emitting diode display may be improved, and color gamut may be improved.

4 is a schematic cross-sectional view of one pixel of an organic light emitting diode display according to an exemplary embodiment.

In describing the present embodiment, descriptions of the same or corresponding components as in the embodiment of FIG. 3 will be omitted. Hereinafter, an organic light emitting diode display according to the present exemplary embodiment will be described with reference to FIG. 4 .

The organic light emitting diode display according to the present exemplary embodiment includes thin film transistors 210 , organic light emitting elements 250 connected to the thin film transistors 201 , first to third color filters 271a , 272a , 273a , and the like. includes

In the present embodiment, the first to third color filters 271a , 272a , and 273a have an upper region convexly protruding above the top surface of the encapsulation layer 260 and a lower region inserted into the grooves of the encapsulation layer 260 , respectively. can have Edges of upper regions of the first to third color filters 271a , 272a , and 273a may be positioned outside the edges of the grooves of the encapsulation layer 260 . Edges of upper regions of the first to third color filters 271a , 272a , and 273a may cover the upper surface of the encapsulation layer 260 beyond the edges of the grooves. In addition, lower surfaces of the first to third color filters 271a , 272a , and 273a may be curved downwardly convex toward the organic light emitting diodes 250 . The thickness of the first to third color filters 271a , 272a , and 273a may become thinner toward the center.

According to the present embodiment, the first to third color filters 271a , 272a , and 273a are formed to be inserted into the grooves formed in the upper region of the encapsulation layer 260 , and the first to third color filters 271a , 272a and 273a are formed to cover the upper surface of the encapsulation layer 260 , and lower surfaces of the first to third color filters 271a , 272a and 273a are formed to be convex downwardly. Accordingly, an area in which the first to third color filters 271a , 272a , and 273a contact the encapsulation layer 260 may be increased. As a result, adhesion of the first to third color filters 271a , 272a and 273a to the encapsulation layer 260 may be improved, and the first to third color filters 271a , 272a and 273a may be peeled off or It can prevent tearing. According to the present exemplary embodiment, an organic light emitting diode display having a structurally stable color filter on encapsulation (COE) structure may be obtained.

According to the present embodiment, the first to third color filters 271a , 272a , and 273a are formed to be inserted into the grooves formed in the upper region of the encapsulation layer 260 , and the first to third color filters are also formed. By forming the lower surfaces of (271a, 272a, 273a) into a curved downwardly convex surface, it is possible to obtain light extraction characteristics with an extended viewing angle.

5 is a schematic cross-sectional view of one pixel of an organic light emitting diode display according to an exemplary embodiment.

In describing the present embodiment, descriptions of the same or corresponding components as in the embodiment of FIG. 3 will be omitted. Hereinafter, an organic light emitting diode display according to the present exemplary embodiment will be described with reference to FIG. 5 .

The organic light emitting diode display according to the present exemplary embodiment includes thin film transistors 210 , organic light emitting elements 250 connected to the thin film transistors 201 , first to third color filters 271b , 272b , 273b , and the like. includes

In the present embodiment, the first to third color filters 271b , 272b and 273b are inserted into the grooves of the encapsulation layer 260 , and upper surfaces of the first to third color filters 271b , 272b and 273b Each of these may form the same plane as the top surface of the encapsulation layer 260 . In addition, lower surfaces of the first to third color filters 271b , 272b , and 273b may be curved downwardly convex toward the organic light emitting diodes 250 . In contrast, top surfaces of the first to third color filters 271b , 272b , and 273b may be lower than the top surfaces of the encapsulation layer 260 , respectively.

According to the present embodiment, the first to third color filters 271b , 272b , and 273b are formed to be inserted into the grooves formed in the upper region of the encapsulation layer 260 , and the first to third color filters are also formed. By forming the lower surfaces of 271b, 272b, and 273b to have a convex downwardly curved surface, an area in which the first to third color filters 271b, 272b, and 273b contact the encapsulation layer 260 may be increased. As a result, the adhesion of the first to third color filters 271b, 272b, and 273b to the encapsulation layer 260 may be improved, and the first to third color filters 271b, 272b, and 273b may be peeled off or It can prevent tearing. According to the present exemplary embodiment, an organic light emitting diode display having a structurally stable color filter on encapsulation (COE) structure may be obtained.

According to the present embodiment, the first to third color filters 271b , 272b , and 273b are formed to be inserted into the grooves formed in the upper region of the encapsulation layer 260 , and the first to third color filters are also formed. By forming the lower surfaces of (271b, 272b, 273b) into a convex downwardly curved surface, it is possible to obtain light extraction characteristics with an extended viewing angle.

6 is a schematic cross-sectional view of one pixel of an organic light emitting diode display according to an exemplary embodiment.

In describing the present embodiment, descriptions of the same or corresponding components as in the embodiment of FIG. 3 will be omitted. Hereinafter, an organic light emitting diode display according to the present exemplary embodiment will be described with reference to FIG. 6 .

The organic light emitting diode display according to the present exemplary embodiment includes thin film transistors 210 , organic light emitting elements 250 connected to the thin film transistors 201 , first to third color filters 271c , 272c , 273c , and the like. includes

In the present embodiment, the first to third color filters 271c , 272c , and 273c have an upper region convexly protruding above the top surface of the encapsulation layer 260 and a lower region inserted into the grooves of the encapsulation layer 260 , respectively. can have In addition, lower surfaces of the first to third color filters 271c, 272c, and 273c may be curved upwardly concave. The lower surfaces of the grooves of the encapsulation layer 260 may be curved upwardly convex.

According to the present exemplary embodiment, the first to third color filters 271c , 272c , and 273c are formed to be inserted into the grooves formed in the upper region of the encapsulation layer 260 , and the first to third color filters are also formed. By forming the lower surfaces of 271c , 272c , and 273c to have upwardly concave curved surfaces, a contact area between the first to third color filters 271c , 272c , and 273c with the encapsulation layer 260 may be increased. As a result, adhesion of the first to third color filters 271c, 272c, and 273c to the encapsulation layer 260 may be improved, and the first to third color filters 271c, 272c, and 273c may be peeled off or It can prevent tearing. According to the present exemplary embodiment, an organic light emitting diode display having a structurally stable color filter on encapsulation (COE) may be obtained.

According to the present exemplary embodiment, the first to third color filters 271c , 272c , and 273c are formed to be inserted into the grooves formed in the upper region of the encapsulation layer 260 , and the first to third color filters are also formed. By forming the lower surfaces of (271a, 272a, 273a) into a curved upward concave surface, it is possible to obtain light extraction characteristics with an extended viewing angle. Fig. 12 shows the light extraction characteristics for the present example, and Fig. 18 shows the light extraction characteristics for the comparative example. Comparing FIGS. 12 and 18 , it can be seen that the viewing angle is extended in the case of the present embodiment. In the case of FIG. 18, the light emission is concentrated toward the front, but in the case of FIG. 12, it can be seen that the light emission is widely spread over 30 degrees.

7 is a schematic cross-sectional view of one pixel of an organic light emitting diode display according to an exemplary embodiment.

In describing the present embodiment, descriptions of the same or corresponding components as in the embodiment of FIG. 3 will be omitted. Hereinafter, an organic light emitting diode display according to the present embodiment will be described with reference to FIG. 7 .

The organic light emitting diode display according to the present exemplary embodiment includes thin film transistors 210 , organic light emitting elements 250 connected to the thin film transistors 201 , first to third color filters 271d , 272d , 273d , and the like. includes

In the present embodiment, the first to third color filters 271d, 272d, and 273d have an upper region convexly protruding above the top surface of the encapsulation layer 260 and a lower region inserted into the grooves of the encapsulation layer 260 , respectively. can have In addition, lower surfaces of the first to third color filters 271d, 272d, and 273d may include a downwardly convex central portion and an upwardly concave outer portion surrounding the central portion. The thickness of the first to third color filters 271d, 272d, and 273d may become thinner toward the center and then become thicker again.

According to the present exemplary embodiment, the first to third color filters 271d, 272d, and 273d are formed to be inserted into the grooves formed in the upper region of the encapsulation layer 260 , and the first to third color filters are also formed. By forming the lower surfaces of (271d, 272d, and 273d) to include a convex central portion and an upwardly concave outer portion surrounding the central portion, the first to third color filters 271d, 272d, and 273d are formed in the encapsulation layer 260 and the area in contact with it may be increased. As a result, adhesion of the first to third color filters 271d, 272d, and 273d to the encapsulation layer 260 may be improved, and the first to third color filters 271c, 272c, and 273c may be peeled off or It can prevent tearing. According to the present exemplary embodiment, an organic light emitting diode display having a structurally stable color filter on encapsulation (COE) may be obtained.

According to the present exemplary embodiment, the first to third color filters 271c , 272c , and 273c are formed to be inserted into the grooves formed in the upper region of the encapsulation layer 260 , and the first to third color filters are also formed. By forming the lower surfaces of (271d, 272d, and 273d) to include a convex central portion and an upwardly concave outer portion surrounding the central portion, it is possible to obtain light extraction characteristics with improved light output in the front direction. FIG. 13 shows the light extraction characteristics for the present example, and FIG. 18 shows the light extraction characteristics for the comparative example. Comparing FIGS. 13 and 18 , it can be seen that the light output in the front direction is increased in the case of the present embodiment.

8 is a schematic cross-sectional view of one pixel of an organic light emitting diode display according to an exemplary embodiment.

The embodiment of FIG. 8 has a structure in which a black matrix for preventing color mixing is added to the embodiment of FIG. 3 . A description of the same or corresponding components as in the embodiment of FIG. 3 will be omitted.

The organic light emitting diode display according to the present embodiment includes thin film transistors 210 , organic light emitting elements 250 connected to the thin film transistors 201 , first to third color filters 271 , 272 , 273 , and a black matrix 278 and the like.

The black matrix 278 may surround edges of the first to third color filters 271 , 272 , and 273 . The black matrix 278 may be disposed between the first to third color filters 271 , 272 , and 273 . In FIG. 8 , the black matrix 278 is illustrated as being disposed on the upper surface of the encapsulation layer 260 , but is not limited thereto.

9 is a schematic cross-sectional view of one pixel of an organic light emitting diode display according to an exemplary embodiment.

The embodiment of FIG. 9 has a structure in which a black matrix for preventing color mixing is added to the embodiment of FIG. 4 . A description of the same or corresponding components as in the embodiment of FIG. 4 will be omitted.

The organic light emitting diode display according to the present embodiment includes thin film transistors 210 , organic light emitting elements 250 connected to the thin film transistors 201 , first to third color filters 271a , 272a , and 273a , and a black matrix 278 and the like.

The black matrix 278 may surround edges of the first to third color filters 271a , 272a , and 273a . The black matrix 278 may be disposed between the first to third color filters 271a, 272a, and 273a. 9 illustrates that the black matrix 278 is disposed on the upper surface of the encapsulation layer 260 , but is not limited thereto.

10 is a schematic cross-sectional view of one pixel of an organic light emitting diode display according to an exemplary embodiment.

The embodiment of FIG. 10 has a structure in which a black matrix for preventing color mixing is added to the embodiment of FIG. 5 . A description of the same or corresponding components as in the embodiment of FIG. 5 will be omitted.

The organic light emitting diode display according to the present exemplary embodiment includes thin film transistors 210 , organic light emitting elements 250 connected to the thin film transistors 201 , first to third color filters 271b , 272b , and 273b , and a black matrix 278 and the like.

The black matrix 278 may surround edges of the first to third color filters 271b, 272b, and 273b. The black matrix 278 may be disposed between the first to third color filters 271b, 272b, and 273b. In FIG. 10 , the black matrix 278 is illustrated as being disposed on the upper surface of the encapsulation layer 260 , but is not limited thereto.

14 to 16 are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to an exemplary embodiment.

A manufacturing method of the embodiment of FIG. 3 will be briefly described with reference to FIGS. 14 to 16 .

Referring to FIG. 14 , a buffer layer 205 , thin film transistors 210 , organic light emitting devices 250 , a bank 240 , and an encapsulation layer 260 may be formed on a substrate 201 . The encapsulation layer 260 may include a first inorganic layer, a first organic layer, a second inorganic layer, and a second organic layer sequentially stacked. The second organic layer may be made of a photosensitive organic material, for example, photoacrylic.

Thereafter, a photo process using a halftone mask HTM may be performed to form grooves in the second organic layer of the encapsulation layer 260 . The lower surfaces of the grooves may have a concave curved surface.

Referring to FIG. 15 , after applying the first color filter organic material, a photo process may be performed to form the first color filter 271 in some of the grooves.

Referring to FIG. 16 , after applying the second color filter organic material, a photo process may be performed to form the second color filter 272 in a portion of the grooves adjacent to the first color filter 271 . Subsequently, after coating the third color filter organic material, a photo process may be performed to form the third color filter 273 in the remaining portions of the grooves.

As described above, the present invention has been described with reference to the illustrated drawings, but the present invention is not limited by the embodiments and drawings disclosed in this specification, and various methods can be obtained by those skilled in the art within the scope of the technical spirit of the present invention. It is obvious that variations can be made. In addition, although the effects according to the configuration of the present invention are not explicitly described and described while describing the embodiments of the present invention, it is natural that the effects predictable by the configuration should also be recognized.

100: organic light emitting display device 110: display panel
120: data driver 121: source driver integrated circuit
123: flexible film 130: gate driver
140: timing controller 150: control printed circuit board
201: first substrate 205: buffer layer
210: thin film transistor 211: active layer
212: gate electrode 213: gate insulating layer
214: drain electrode 215: source electrode
222: interlayer insulating layer 224: protective layer
226: planarization layer 240: bank
250: organic light emitting device 251: lower electrode
253: organic light emitting layer 255: upper electrode
260: encapsulation layer 271, 272, 273: first, second, third color filter
272s, 273s: Line type color filter
275: overcoat layer 280: second substrate
SP1, SP2, SP3, SP4: first, second, third, and fourth sub-pixel regions
GL: gate wiring DL: data wiring
DA: display unit NDA: non-display unit
DPA: data drive IC pad part

Claims (17)

a red sub-pixel area and a white sub-pixel area disposed adjacent to each other;
a red color filter disposed on the red sub-pixel area; and
a first line-type color filter disposed at an edge of the red color filter adjacent to the white sub-pixel region and having a color different from red;
The first line-type color filter has a width that is narrower than a width of the red color filter. According to claim 1,
a bank dividing the red sub-pixel area and the white sub-pixel area;
The first line-type color filter is disposed on the bank to overlap the bank. 3. The method of claim 2,
The first line-type color filter has a width that is smaller than a width of the bank or the same as a width of the bank. According to claim 1,
a blue sub-pixel area adjacent to the white sub-pixel area;
a green sub-pixel area adjacent to the blue sub-pixel area;
a blue color filter disposed on the blue sub-pixel area; and
a green color filter disposed on the green sub-pixel area;
The red sub-pixel area, the white sub-pixel area, the blue sub-pixel area, and the green sub-pixel area are sequentially arranged in a first direction. 5. The method of claim 4,
The first line-type color filter has a blue color. 6. The method of claim 5,
a plurality of white sub-pixel regions arranged in a second direction perpendicular to the first direction;
and second line-type color filters extending from both ends of the first line-type color filter between the white sub-pixel areas and connected to the blue color filter, the second line-type color filters having a blue color. 5. The method of claim 4,
The first line-type color filter has a green color. 8. The method of claim 7,
a second line-type color filter disposed at an edge of the blue color filter adjacent to the white sub-pixel area and having a green color; An organic light emitting diode display comprising: 9. The method of claim 8,
a plurality of white sub-pixel areas arranged in a second direction perpendicular to the first direction; and
a plurality of blue sub-pixel regions arranged in the second direction;
and third line-type color filters extending from both ends of the first line-type color filter between the white sub-pixel areas and between the blue sub-pixel areas and connected to the green color filter. According to claim 1,
a green sub-pixel area adjacent to the white sub-pixel area;
a blue sub-pixel area adjacent to the green sub-pixel area;
a green color filter disposed on the green sub-pixel area; and
a blue color filter disposed on the blue sub-pixel area;
The red sub-pixel area, the white sub-pixel area, the green sub-pixel area, and the blue sub-pixel area are sequentially arranged in a first direction. 11. The method of claim 10,
a second line-type color filter disposed at an edge of the green color filter adjacent to the white sub-pixel area;
The first line-type color filter and the second line-type color filter have a blue color. 12. The method of claim 11,
a plurality of white sub-pixel areas arranged in a second direction perpendicular to the first direction; and
a plurality of green sub-pixel regions arranged in the second direction;
and third line-type color filters extending from both ends of the first line-type color filter between the white sub-pixel areas and between the green sub-pixel areas and connected to the blue color filter. a plurality of red sub-pixel areas and a plurality of white sub-pixel areas alternately arranged in one direction;
a plurality of red color filters disposed on the plurality of red sub-pixel areas; and
a plurality of first line-type color filters disposed at edges of the red color filters adjacent to the white sub-pixel areas and having a color different from red;
A width of the first line-type color filters is narrower than a width of the red color filter. 14. The method of claim 13,
a plurality of green sub-pixel areas and a plurality of blue sub-pixel areas alternately arranged in the one direction; a plurality of green color filters disposed on the plurality of green sub-pixel areas;
a plurality of blue color filters disposed on the plurality of blue sub-pixel areas;
the green sub-pixel regions are adjacent to the red sub-pixel regions;
the blue sub-pixel regions are adjacent to the white sub-pixel regions;
The first line-type color filters have a blue color and are connected to the blue color filters. 15. The method of claim 14,
a plurality of green sub-pixel areas and a plurality of blue sub-pixel areas alternately arranged in the one direction; a plurality of green color filters disposed on the plurality of green sub-pixel areas; and
a plurality of blue color filters disposed on the plurality of blue sub-pixel areas;
the green sub-pixel regions are adjacent to the red sub-pixel regions;
the blue sub-pixel regions are adjacent to the white sub-pixel regions;
The first line-type color filters have a green color, and are connected to the green color filters. 14. The method of claim 13,
a plurality of blue sub-pixel regions and a plurality of green sub-pixel regions alternately arranged in the one direction; a plurality of blue color filters disposed on the plurality of blue sub-pixel areas; and
a plurality of green color filters disposed on the plurality of green sub-pixel areas;
the blue sub-pixel regions are adjacent to the red sub-pixel regions;
the green sub-pixel regions are adjacent to the white sub-pixel regions;
The first line-type color filters have a blue color and are connected to the blue color filters. 17. The method of claim 16,
a plurality of second line-type color filters disposed at edges of the green color filters adjacent to the white sub-pixel areas and having a color different from that of green;
The organic light-emitting display device in which the white sub-pixel areas are surrounded by the first and second line-type color filters.

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