KR20210080519A - Method for manufacturing a substrate for forming a transparent conductive layer, a transparent conductive film, a touch panel, and a substrate for forming a transparent conductive layer - Google Patents

Abstract

Provided are a substrate for forming a transparent conductive layer having excellent adhesion and scratch resistance and a method for manufacturing the same, and a transparent conductive film and a touch panel using the same.
The base material 10 for transparent conductive layer formation has the base film 12 and the 1st resin layer 14 formed on the surface of the base film 12, The 1st resin layer 14 is a silsesqui The hardened|cured material of the curable composition containing the ultraviolet curable resin which has an oxane skeleton is included. The transparent conductive film 80 has the transparent conductive layer 26 on the surface of the 1st resin layer 14 of the base material 10 for transparent conductive layer formation. As for the touch panel, the transparent conductive layer 26 of the transparent conductive film 80 is used for an electrode.

Description

Method for manufacturing a substrate for forming a transparent conductive layer, a transparent conductive film, a touch panel, and a substrate for forming a transparent conductive layer

The present invention relates to a substrate for forming a transparent conductive layer, a transparent conductive film, a touch panel, and a method for manufacturing a substrate for forming a transparent conductive layer.

As an input device capable of operating an apparatus by touching a display on a screen such as a smart phone or a tablet terminal, a capacitive touch panel is known. A transparent conductive film is used for this type of touch panel. The transparent conductive film includes, for example, a transparent conductive layer containing a metal oxide such as indium tin oxide (ITO) formed on the surface of a plastic substrate (resin substrate) (Patent Document 1).

When a transparent conductive layer containing a metal oxide is formed directly on the surface of the plastic substrate, the adhesion between the plastic substrate and the transparent conductive layer is low. Then, in patent document 2, for example, the transparent conductive layer containing a metal oxide is formed on the surface of the primer layer of the plastic base material which laminated|stacked the primer layer.

Patent Document 1: Japanese Patent Application Laid-Open No. Hei07-068690 Patent Document 2: Japanese Patent Laid-Open No. 2012-007065

The primer layer of Patent Document 2 is obtained by thermosetting a composition containing a thiol group-containing silsesquioxane, a hydroxyl group-containing polyester resin, and polyisocyanates, and has low scratch resistance and a transparent conductive layer containing a metal oxide. At the time of handling at the time of formation, there exists a possibility that the surface of a primer layer may be damaged. When the surface of the primer layer is scratched, poor appearance of the transparent conductive film occurs.

The problem to be solved by the present invention is to provide a base material for forming a transparent conductive layer having excellent adhesion of the laminated transparent conductive layer and excellent scratch resistance, a method for manufacturing the same, and a transparent conductive film and a touch panel using the same.

In order to solve the above problems, the substrate for forming a transparent conductive layer according to the present invention is a substrate for forming a transparent conductive layer serving as a substrate for forming a transparent conductive layer, a substrate film and a first formed on the surface of the substrate film It has a resin layer and makes it a summary that the said 1st resin layer contains the hardened|cured material of the curable composition containing the ultraviolet curable resin which has silsesquioxane skeleton.

It is preferable that ultraviolet curable resin which has silsesquioxane frame|skeleton is (meth)acrylate which has silsesquioxane frame|skeleton. It is preferable that content of the ultraviolet curable resin which has silsesquioxane frame|skeleton is 1 mass % or more on the basis of solid content whole quantity of a curable composition. Between a base film and a 1st resin layer, it is preferable to have the 2nd resin layer containing the hardened|cured material of the curable composition containing the ultraviolet curable resin which does not have silsesquioxane frame|skeleton. A 1st resin layer has only on one surface of a base film, and on the other surface of a base film, the 3rd which contains the hardened|cured material of the curable composition containing the ultraviolet curable resin which does not have a silsesquioxane frame|skeleton. You may have a resin layer. A 1st resin layer may have only on one surface of a base film, and may have a protective film on the other surface of a base film through an adhesive layer. You may have a 1st resin layer on both surfaces of a base film.

And the transparent conductive film which concerns on this invention makes it a summary to have a transparent conductive layer on the surface of the 1st resin layer of the base material for transparent conductive layer formation which concerns on this invention.

What is necessary is just to use a transparent conductive layer for the electrode of a touchscreen.

And the transparent conductive film which concerns on this invention makes the summary that the transparent conductive layer of the transparent conductive film which concerns on this invention is used for an electrode.

And the manufacturing method of the base material for transparent conductive layer formation which concerns on this invention is a manufacturing method of the base material for transparent conductive layer formation used as a base material for forming a transparent conductive layer, On the surface of a base film, a silsesquioxane skeleton It makes it a summary to form the 1st resin layer containing the hardened|cured material of the curable composition containing the ultraviolet curable resin which has.

In the manufacturing method of the base material for transparent conductive layer formation which concerns on this invention, the 2nd resin layer containing the hardened|cured material of the curable composition containing the ultraviolet curable resin which does not have a silsesquioxane skeleton on the surface of a base film After forming, you may form a 1st resin layer on the surface of a 2nd resin layer.

According to the base material for forming a transparent conductive layer according to the present invention, since the first resin layer formed on the surface of the base film contains a cured product of a curable composition comprising an ultraviolet curable resin having a silsesquioxane skeleton, the laminated The transparent conductive layer has excellent adhesion and excellent scratch resistance.

And between a base film and a 1st resin layer, when it has the 2nd resin layer containing the hardened|cured material of the curable composition containing the ultraviolet curable resin which does not have a silsesquioxane frame|skeleton, the design of an optical adjustment function and a blocking prevention function becomes easier

And the 1st resin layer has only on one surface of a base film, and contains the hardened|cured material of the curable composition containing the ultraviolet curable resin which does not have a silsesquioxane skeleton on the other surface of a base film. When it has a 3rd resin layer, the other surface side of a base film is also excellent in abrasion resistance.

And if a 1st resin layer has only on one surface of a base film, and has a protective film on the other surface of a base film through an adhesive layer, at the time of handling, the other surface of a base film Injuries can be suppressed.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing of the base material for transparent conductive layer formation which concerns on 1st Embodiment of this invention.
It is sectional drawing of the base material for transparent conductive layer formation which concerns on 2nd Embodiment of this invention.
It is sectional drawing of the base material for transparent conductive layer formation which concerns on 3rd Embodiment of this invention.
It is sectional drawing of the base material for transparent conductive layer formation which concerns on 4th Embodiment of this invention.
It is sectional drawing of the base material for transparent conductive layer formation which concerns on 5th Embodiment of this invention.
It is sectional drawing of the base material for transparent conductive layer formation which concerns on 6th Embodiment of this invention.
It is sectional drawing of the base material for transparent conductive layer formation which concerns on 7th Embodiment of this invention.
8 is a cross-sectional view of a transparent conductive film according to an embodiment of the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing of the base material for transparent conductive layer formation which concerns on 1st Embodiment of this invention.

As shown in FIG. 1, the base material 10 for transparent conductive layer formation which concerns on 1st Embodiment of this invention is the base film 12, and the 1st resin layer 14 formed on the surface of the base film 12. ) has The first resin layer 14 is in contact with the base film 12 . The 1st resin layer 14 has only on one surface of the base film 12.

The base film 12 will not be specifically limited, if it has transparency. As the base film 12, a transparent polymer film, a glass film, etc. are mentioned. Transparency means that the total light transmittance in a visible light wavelength range is 50 % or more, More preferably, the total light transmittance is 85 % or more. The said total light transmittance can be measured based on JISK7361-1 (1997). Although the thickness of the base film 12 is not specifically limited, From a viewpoint of being excellent in handleability, it is preferable to exist in the range of 2-500 micrometers. More preferably, it exists in the range of 2-200 micrometers. In addition, although "film" generally refers to a thing having a thickness of less than 0.25 mm, even if it is a thing of 0.25 mm or more in thickness, as long as it can be wound into a roll shape, it shall be included in "film" even if it is 0.25 mm or more in thickness.

Examples of the polymer material of the base film 12 include polyester resins such as polyethylene terephthalate resin and polyethylene naphthalate resin, polycarbonate resin, poly(meth)acrylate resin, polystyrene resin, polyamide resin, polyimide resin, and polyacrylic resin. polyolefin resins such as ronitrile resin, polypropylene resin, polyethylene resin, polycycloolefin resin, cycloolefin copolymer resin, polyphenylene sulfide resin, polyvinyl chloride resin, polyvinylidene chloride resin, polyvinyl alcohol resin, etc. can The polymer material of the base film 12 may be comprised only by 1 type among these, and may be comprised in 2 or more types of combinations. Among these, polyethylene terephthalate resins, polyimide resins, polycarbonate resins, poly(meth)acrylate resins, polycycloolefin resins, and cycloolefin copolymer resins are more preferable from the viewpoints of optical properties and durability.

The base film 12 may be composed of a single layer including a layer containing one or two or more of the above-mentioned polymeric materials, and a layer containing one or two or more of the above-mentioned polymeric materials; may be composed of two or more layers, such as a layer containing one or two or more of different polymer materials.

The 1st resin layer 14 contains the hardened|cured material of the curable composition containing the ultraviolet curable resin which has a silsesquioxane skeleton. The 1st resin layer 14 is excellent in the adhesiveness of the transparent conductive layer laminated|stacked by including the compound which has a silsesquioxane skeleton. Moreover, when the compound which has a silsesquioxane skeleton is ultraviolet curable resin, it is excellent in the abrasion resistance of the 1st resin layer 14. Ultraviolet-curable resin which has silsesquioxane frame|skeleton has a structure represented by following formula (1).

(Formula 1)

(R-SiO _1.5 )n (1)

In formula (1), n is an integer of 2 or more. As n, the integer of 2-200 is preferable, the integer of 2-150 is more preferable, The integer of 2-100 is still more preferable. In Formula (1), R is an organic group, and at least one part of some R is an ultraviolet-reactive reactive group. Examples of the UV-reactive reactive group include a radical polymerization type reactive group having an ethylenically unsaturated bond such as an acryloyl group, a methacryloyl group, an allyl group, and a vinyl group, and a cationic polymerization type reactive group such as an oxetanyl group. have. Among these, an acryloyl group, a methacryloyl group, and an oxetanyl group are more preferable, and since an acryloyl group and a methacryloyl group are excellent in weather resistance and optical transparency, they are especially preferable. That is, the (meth)acrylate which has silsesquioxane skeleton is especially preferable. In addition, in this specification, "(meth)acrylate" means "at least one of an acrylate and a methacrylate." "(meth)acryloyl" means "at least one of acryloyl and methacryloyl." "(meth)acryl" means "at least one of an acryl and methacryl".

It is preferable that the functional group equivalent of the ultraviolet curable resin which has a silsesquioxane skeleton exists in the range of 80-10000 g/eq. More preferably, it exists in the range of 100-1000 g/eq, More preferably, it exists in the range of 150-300 g/eq. When the functional group equivalent is within this range, the ultraviolet curability is excellent. In the present invention, the functional group equivalent refers to the mass (g) per equivalent of the functional group. In addition, the functional group refers to a reactive group having UV reactivity.

It is preferable that ultraviolet curable resin which has silsesquioxane skeleton contains a hydroxyl group and an alkoxy group in the silsesquioxane skeleton before hardening or after hardening. By including a hydroxyl group or an alkoxy group, the adhesiveness of the transparent conductive layer to laminate|stack improves. Silsesquioxane includes a complete cage structure, a ladder structure, a random structure, and an incomplete cage structure. A hydroxyl group or an alkoxy group is not contained in a complete cage structure or a ladder structure, but a hydroxyl group and an alkoxy group are contained in a random structure and an incomplete cage structure. Therefore, it is preferable that a part or all of a silsesquioxane skeleton has a random structure or an incomplete cage structure.

As ultraviolet curable resin which has a silsesquioxane skeleton, Toagosei Co., Ltd. AC-SQ TA-100, MAC-SQ TM-100, AC-SQ SI-20, MAC-SQ SI-20, MAC-SQ HDM, OX -SQ TX-100, OX-SQ SI-20, OX-SQ HDX, etc. are mentioned.

In addition to the ultraviolet curable resin which has a silsesquioxane skeleton, the ultraviolet curable resin which does not have a silsesquioxane skeleton may be contained in the curable composition which forms the 1st resin layer 14, and it does not need to be contained. In addition, non-ultraviolet-ray-curable resin may or may not be contained. Moreover, the photoinitiator may be contained in the curable composition which forms the 1st resin layer 14. Moreover, the additive etc. which are added to a curable composition may be contained as needed. Examples of such additives include a dispersant, a leveling agent, an antifoaming agent, a thixotropic agent, an antifouling agent, an antibacterial agent, a flame retardant, a slip agent, inorganic particles, and resin particles. Moreover, a solvent may be contained as needed.

The curable composition which forms the 1st resin layer 14 WHEREIN: It is preferable that content of the ultraviolet curable resin which has a silsesquioxane skeleton is 0.5 mass % or more on the basis of solid content whole quantity of a curable composition. More preferably, it is 2 mass % or more, More preferably, it is 4 mass % or more. The solid content of the curable composition is a component excluding the solvent. The adhesiveness of the transparent conductive layer to laminate|stack that the said content is 1 mass % or more is more excellent. In addition, 100 mass % may be sufficient as content of the ultraviolet curable resin which has silsesquioxane frame|skeleton on the basis of solid content whole quantity of a curable composition. Preferably it is 98 mass % or less. By making content into the said range, it can be made into the thing excellent in the adhesiveness of a transparent conductive layer and excellent in abrasion resistance.

As ultraviolet curable resin which does not have a silsesquioxane frame|skeleton, the monomer, oligomer, prepolymer etc. which have an ultraviolet-reactive reactive group and do not have a silsesquioxane frame|skeleton are mentioned. Examples of the UV-reactive reactive group include a radical polymerization type reactive group having an ethylenically unsaturated bond such as an acryloyl group, a methacryloyl group, an allyl group, and a vinyl group, and a cationic polymerization type reactive group such as an oxetanyl group. have. Among these, an acryloyl group, a methacryloyl group, and an oxetanyl group are more preferable, and an acryloyl group and a methacryloyl group are especially preferable. That is, the (meth)acrylate which does not have silsesquioxane skeleton is especially preferable.

Examples of (meth)acrylates not having a silsesquioxane skeleton include urethane (meth)acrylates, silicone (meth)acrylates, alkyl (meth)acrylates, and aryl (meth)acrylics that do not have silsesquioxane skeletons. rate etc. are mentioned. Among these, urethane (meth)acrylate is especially preferable from a viewpoint of being excellent in a softness|flexibility etc.

As non-ultraviolet-curable resin, a thermoplastic resin, a thermosetting resin, etc. are mentioned. As a thermoplastic resin, a polyester resin, polyether resin, polyolefin resin, polyamide resin, etc. are mentioned. As a thermosetting resin, an unsaturated polyester resin, an epoxy resin, an alkyd resin, a phenol resin, etc. are mentioned.

As a photoinitiator, photoinitiators, such as an alkylphenone type, an acyl phosphine oxide type, and an oxime ester type, are mentioned. Examples of the alkylphenone-based photopolymerization initiator include 2,2'-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, and 2-hydroxy-2-methyl-1-one. Phenyl-propan-1-one, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1-{ 4-[4-(2-Hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methyl-propan-1-one, 2-methyl-1-[4-(methylthio)phenyl]- 2-morpholinopropan-1-one, 2-benzylmethyl-2-(dimethylamino)-1-(4-morpholinophenyl)-1-butanone, 2-(dimethylamino)-2-[( 4-Methylphenyl)methyl]-1-(4-morpholinophenyl)-1-butanone, 2-(4-methylbenzyl)-2-(dimethylamino)-1-(4-morpholinophenyl)- 1-butanone, N,N-dimethylaminoacetophenone, etc. are mentioned. Examples of the acylphosphine oxide-based photopolymerization initiator include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, and bis(2,6-dimethoxybenzoyl). -2,4,4-trimethyl-pentylphosphine oxide etc. are mentioned. Examples of the oxime ester photopolymerization initiator include 1,2-octanedione, 1-[4-(phenylthio)phenyl]-2-(O-benzoyloxime), ethanone-1-[9-ethyl-6-(2-) methylbenzoyl)-9H-carbazol 3-yl]-1-(O-acetyloxime); and the like. A photoinitiator may be used individually by these 1 type, and may be used in combination of 2 or more types.

It is preferable to make content of a photoinitiator into the range of 0.1-10 mass % on the basis of solid content whole quantity of a curable composition. More preferably, it is the range of 1-5 mass %.

An inorganic particle is added for the purpose of forming surface unevenness|corrugation in the 1st resin layer 14, or adjusting the 1st resin layer 14 to a high refractive index, for example. In addition, the resin particle is added for the purpose of forming surface unevenness|corrugation in the 1st resin layer 14, for example. When the base material for transparent conductive layer formation is wound in roll shape by forming the surface unevenness|corrugation in the 1st resin layer 14, it is easy to suppress the blocking which the surface and the back surface adhere|attach. By adjusting the 1st resin layer 14 to a high refractive index, it can make it difficult to visually recognize the conductive pattern of the transparent conductive layer laminated|stacked. A high refractive index means that the refractive index in measurement wavelength 589.3nm is 1.50 or more, Preferably it exists in the range of 1.55-1.80, More preferably, it exists in the range of 1.60-1.70.

Examples of inorganic particles capable of optically adjusting the first resin layer 14 to a high refractive index include oxides of metals such as titanium, zirconium, tin, zinc, silicon, niobium, aluminum, chromium, magnesium, germanium, gallium, antimony, and platinum. and metal oxide particles. These may be used individually by 1 type as inorganic particle which can be optically adjusted, and may be used in combination of 2 or more type. In these, a titanium oxide and a zirconium oxide are especially preferable from a viewpoint of being excellent in coexistence of a high refractive index and transparency, etc.

The kind of inorganic particle and resin particle which form the surface unevenness|corrugation in the 1st resin layer 14 is not specifically limited. Examples of such inorganic particles include metal oxide particles containing oxides of metals such as titanium, zirconium, silicon, aluminum, and calcium. In addition, as such resin particles, for example, a resin such as (meth)acrylic resin, styrene resin, styrene-(meth)acrylic resin, urethane resin, polyamide resin, silicone resin, epoxy resin, phenol resin, polyethylene resin, cellulose, etc. The resin particle contained is mentioned.

In order to form the surface unevenness|corrugation in the 1st resin layer 14, it is preferable to make the average particle diameter of an inorganic particle or resin particle into the thickness of the 1st resin layer 14 or more. More preferably, it is 1.1 times or more and 20 times or less the thickness of the 1st resin layer 14, More preferably, it is 1.5 times or more and 10 times or less the thickness of the 1st resin layer 14, Especially preferably, it is 1st resin layer. It is 1.5 times or more and 5 times or less of the thickness of (14). The average particle diameter is an average arithmetic value on a volume basis obtained by a laser diffraction/scattering method according to JIS Z8825.

Although the thickness of the 1st resin layer 14 is not specifically limited, From a viewpoint of being excellent in continuity of a film|membrane, it is preferable that it is 0.005 micrometer or more. More preferably, it is 0.010 micrometer or more, More preferably, it is 0.020 micrometer or more. On the other hand, it is preferable that the thickness of the 1st resin layer 14 is 10 micrometers or less from a viewpoint of being easy to suppress the curl resulting from the difference of thermal contraction with the base film 12. More preferably, it is 5 micrometers or less, More preferably, it is 1 micrometer or less. The thickness of the 1st resin layer 14 is the thickness of the comparatively smooth part in the part in which an inorganic particle or a resin particle does not exist in the thickness direction.

The arithmetic mean roughness Ra of the surface on which the surface irregularities of the first resin layer 14 are formed is 0.1 to 130 from the viewpoint of easily suppressing the adhesion between the surface and the back surface of the base material for forming a transparent conductive layer. It is preferable to exist in the range of nm. More preferably, it exists in the range of 0.5-50 nm, More preferably, it exists in the range of 2-20 nm.

And, from the viewpoint of suppressing the rise of haze while suppressing blocking and more excellent transparency, within the range of the average particle diameter and within the range of the average arithmetic roughness, the distribution density of inorganic particles or resin particles is, It is preferable to set it in the range of 100-2000 pieces/mm<2>. More preferably, it exists in the range of 100-1000 pieces/mm<2>.

Examples of the solvent used in the curable composition include alcohol solvents such as ethylene glycol monomethyl ether (EGM), propylene glycol monomethyl ether (PGM), and diethylene glycol monobutyl ether, methyl ethyl ketone (MEK), and methyl isobutyl Ketone solvents, such as ketone (MIBK), cyclohexanone, and acetone, aromatic solvents, such as toluene and xylene, amide solvents, such as N-methylpyrrolidone, acetamide, dimethylformamide, etc. are mentioned. These may be used individually by 1 type as a solvent, and may be used in combination of 2 or more type.

The solid content concentration (concentration of components other than the solvent) of the curable composition may be appropriately determined in consideration of coatability, film thickness, and the like. For example, it is good to set it as 1-90 mass %, 1.5-80 mass %, 2-70 mass %, etc.

The base material 10 for forming a transparent conductive layer is prepared by coating the curable composition forming the first resin layer 14 on the surface of the base film 12, drying it if necessary, and curing it by UV irradiation. can At this time, in order to improve the adhesiveness of the base film 12 and the 1st resin layer 14, the surface of the base film 12 may be surface-treated before coating. Examples of the surface treatment include corona treatment, plasma treatment, hot air treatment, ozone treatment, and ultraviolet treatment.

For coating, for example, a reverse gravure coating method, a direct gravure coating method, a die coating method, a bar coating method, a wire bar coating method, a roll coating method, a spin coating method, a dip coating method, a spray coating method, a knife coating method, a kiss coating method It can carry out using various coating methods, such as a method, and various printing methods, such as an inkjet method, an offset printing, screen printing, flexographic printing.

Although a drying process will not be specifically limited if the solvent etc. used for the coating liquid can be removed, It is preferable to perform for about 10 second - 180 second at the temperature of 50-150 degreeC. In particular, as for the drying temperature, 50-120 degreeC is preferable.

A high pressure mercury lamp, an electrodeless (microwave system) lamp, a xenon lamp, a metal halide lamp, other arbitrary ultraviolet irradiation apparatuses can be used for ultraviolet irradiation. Ultraviolet irradiation may be performed in an inert gas atmosphere, such as nitrogen, as needed. Although the ultraviolet irradiation amount is not specifically limited, 50-800 mJ/cm<2> is preferable and 100-300 mJ/cm<2> is more preferable.

According to the substrate 10 for forming a transparent conductive layer having the above configuration, the first resin layer 14 formed on the surface of the substrate film 12 is a curable composition containing an ultraviolet curable resin having a silsesquioxane skeleton. By including the cargo, the adhesiveness of the transparent conductive layer to be laminated is excellent and the scratch resistance is excellent.

The base material for transparent conductive layer formation which concerns on this invention is not limited to the structure of the base material 10 for transparent conductive layer formation which concerns on 1st Embodiment. Below, another embodiment of the base material for transparent conductive layer formation which concerns on this invention is demonstrated.

In FIG. 2, the base material 20 for transparent conductive layer formation which concerns on 2nd Embodiment is shown. The base material 20 for transparent conductive layer formation which concerns on 2nd Embodiment is the base film 12, the 2nd resin layer 16 formed on the surface of the base film 12, and the 2nd resin layer 16 It has a 1st resin layer 14 formed on the surface of The second resin layer 16 is in contact with the base film 12 , and the first resin layer 14 is in contact with the second resin layer 16 . The 1st resin layer 14 has only on one side of the base film 12. The base material 20 for transparent conductive layer formation has the base film 12, the 2nd resin layer 16, and the 1st resin layer 14 in order from the base film 12 side.

The base material 20 for transparent conductive layer formation which concerns on 2nd Embodiment is compared with the base material 10 for transparent conductive layer formation which concerns on 1st Embodiment, Between the base film 12 and the 1st resin layer 14 It is different from the point which has the 2nd resin layer 16, and about this is the same as that of the base material 10 for transparent conductive layer formation which concerns on 1st Embodiment, About the same structure, the description is abbreviate|omitted.

The 2nd resin layer 16 is arrange|positioned between the base film 12 and the 1st resin layer 14, and contains the hardened|cured material of the curable composition containing the ultraviolet curable resin which does not have a silsesquioxane skeleton. . The curable composition for forming the 2nd resin layer 16 does not contain the ultraviolet curable resin which has a silsesquioxane skeleton.

As ultraviolet curable resin which does not have a silsesquioxane skeleton, the monomer, oligomer, prepolymer etc. which have an ultraviolet-reactive reactive group and do not have a silsesquioxane skeleton are mentioned. Examples of the UV-reactive reactive group include a radical polymerization type reactive group having an ethylenically unsaturated bond such as an acryloyl group, a methacryloyl group, an allyl group, and a vinyl group, and a cationic polymerization type reactive group such as an oxetanyl group. have. Among these, an acryloyl group, a methacryloyl group, and an oxetanyl group are more preferable, and an acryloyl group and a methacryloyl group are especially preferable. That is, the (meth)acrylate which does not have silsesquioxane skeleton is especially preferable.

Examples of (meth)acrylates not having a silsesquioxane skeleton include urethane (meth)acrylates, silicone (meth)acrylates, alkyl (meth)acrylates, and aryl (meth)acrylics that do not have silsesquioxane skeletons. rate etc. are mentioned. Among these, urethane (meth)acrylate is especially preferable from a viewpoint of being excellent in a softness|flexibility etc. When the curable composition for forming the second resin layer 16 contains urethane (meth)acrylate as an ultraviolet curable resin, for example, the base film 12 is formed of polycycloolefin or cycloolefin copolymer, etc. Even if it is a comparatively fragile thing, it is easy to suppress the crack of the base film 12.

It is preferable that the 2nd resin layer 16 is a hard-coat layer. It is preferable that pencil hardness exists in the range of 2B-6H from this viewpoint. Pencil hardness can be measured based on JISK5600-5-4. The 2nd resin layer 16 is easy to satisfy|fill the said pencil hardness by forming with the composition containing an ultraviolet curable resin.

In addition to the ultraviolet curable resin which does not have a silsesquioxane skeleton, the non-ultraviolet-curable resin may be contained in the curable composition which forms the 2nd resin layer 16, and may not be contained. Moreover, the photoinitiator may be contained in the curable composition which forms the 2nd resin layer 16. As shown in FIG. Moreover, the additive etc. which are added to a curable composition may be contained as needed. Examples of such additives include a dispersant, a leveling agent, an antifoaming agent, a thixotropic agent, an antifouling agent, an antibacterial agent, a flame retardant, a slip agent, an inorganic particle, and a resin particle. Moreover, a solvent may be contained as needed. Non-ultraviolet-ray-curable resin, a photoinitiator, and a solvent can be suitably selected from what was described in the curable composition which forms the 1st resin layer 14.

An inorganic particle is added for the purpose of forming surface unevenness|corrugation in the 1st resin layer 14, or adjusting the 2nd resin layer 16 to high refractive index, for example. In addition, the resin particle is added for the purpose of forming surface unevenness|corrugation in the 1st resin layer 14, for example. When the base material for transparent conductive layer formation is wound in roll shape by forming the surface unevenness|corrugation in the 1st resin layer 14, it is easy to suppress the blocking which adhere|attaches the surface and the back surface. By adjusting the 2nd resin layer 16 to a high refractive index and adjusting the 1st resin layer 14 to a low refractive index, it can make it difficult to visually recognize the electrically conductive pattern of the transparent conductive layer laminated|stacked. A high refractive index means that the refractive index in measurement wavelength 589.3nm is 1.50 or more, Preferably it exists in the range of 1.55-1.80, More preferably, it exists in the range of 1.60-1.70. A low refractive index means that the refractive index in 589.3 nm of measurement wavelengths is less than 1.50, Preferably it exists in the range of 1.30-1.50, More preferably, it exists in the range of 1.40-1.50.

Examples of inorganic particles capable of optically adjusting the second resin layer 16 to a high refractive index include oxides of metals such as titanium, zirconium, tin, zinc, silicon, niobium, aluminum, chromium, magnesium, germanium, gallium, antimony, and platinum. and metal oxide particles. These may be used individually by 1 type as inorganic particle which can be optically adjusted, and may be used in combination of 2 or more type. In these, a titanium oxide and a zirconium oxide are especially preferable from a viewpoint of being excellent in coexistence of a high refractive index and transparency, etc.

On the other hand, as an inorganic particle which can optically adjust the 1st resin layer 14 with a low refractive index, particle|grains, such as magnesium fluoride, a silica, a silsesquioxane, a calcium fluoride, are mentioned. It is more preferable that these particle|grains have a hollow structure from a viewpoint, such as being easy to set it as a low refractive index.

As particles added to the curable composition for forming the second resin layer 16 , the types of inorganic particles and resin particles that form surface asperities in the first resin layer 14 are selected from those that form the first resin layer 14 . It can select suitably from what was described in the curable composition. In addition, the solid content concentration of a curable composition can be adjusted similarly to the curable composition which forms the 1st resin layer 14.

In order to form the surface unevenness|corrugation in the 1st resin layer 14, it is preferable that the average particle diameter of an inorganic particle or a resin particle sets it as the thickness of the sum total of the 1st resin layer 14 and the 2nd resin layer 16 or more. Do. More preferably, it is 1.1 times or more and 20 times or less of the total thickness of the 1st resin layer 14 and the 2nd resin layer 16, More preferably, the 1st resin layer 14 and the 2nd resin layer 16 are more preferable. 1.5 times or more and 10 times or less of the total thickness of , particularly preferably 1.5 times or more and 5 times or less of the total thickness of the first resin layer 14 and the second resin layer 16 .

Although the thickness of the 2nd resin layer 16 is not specifically limited, From a viewpoint of being excellent in the continuity of a film|membrane, it is preferable that it is 0.005 micrometer or more. More preferably, it is 0.010 micrometer or more, More preferably, it is 0.10 micrometer or more. On the other hand, it is preferable that the thickness of the 2nd resin layer 16 is 10 micrometers or less from a viewpoint of being easy to suppress the curl resulting from the difference of thermal contraction with the base film 12. More preferably, it is 5 micrometers or less, More preferably, it is 1 micrometer or less. Moreover, it is preferable that the total thickness of the 1st resin layer 14 and the 2nd resin layer 16 is 10 micrometers or less from a viewpoint of being easy to suppress the curl resulting from the difference of thermal contraction with the base film 12. Do. The thickness of the 2nd resin layer 16 is the thickness of the comparatively smooth part in the part in which an inorganic particle or a resin particle does not exist in the thickness direction.

It is preferable that arithmetic mean roughness Ra of the surface in which the surface unevenness|corrugation of the 1st resin layer 14 is formed exists in the range of 0.1-130 nm from a viewpoint of a blocking etc. More preferably, it exists in the range of 0.5-50 nm, More preferably, it exists in the range of 2-20 nm.

And, from the viewpoint of suppressing the rise of haze while maintaining the blocking property and improving the transparency, etc., within the range of the average particle diameter and within the range of the average arithmetic roughness, the distribution density of inorganic particles or resin particles is , it is preferable to set it in the range of 100-2000 pieces/mm<2>. More preferably, it exists in the range of 100-1000 pieces/mm<2>.

The base material 20 for transparent conductive layer formation coats the curable composition which forms the 2nd resin layer 16 on the surface of the base film 12, and after drying as needed, it is made to harden|cure by ultraviolet irradiation, After forming the 2nd resin layer 16 on the surface of the film 12, the curable composition which forms the 1st resin layer 14 on the surface of the 2nd resin layer 16 is coated, and if necessary It can manufacture by hardening|curing by ultraviolet irradiation after drying and forming the 1st resin layer 14 on the surface of the 2nd resin layer 16. At this time, in order to improve the adhesiveness of the base film 12 and the 2nd resin layer 16, the surface of the base film 12 may be surface-treated before coating. Examples of the surface treatment include corona treatment, plasma treatment, hot air treatment, ozone treatment, and ultraviolet treatment.

According to the base material 20 for forming a transparent conductive layer having the above configuration, the first resin layer 14 formed on the surface of the base film 12 is a curable composition containing an ultraviolet curable resin having a silsesquioxane skeleton. By including the cargo, the adhesiveness of the transparent conductive layer to be laminated is excellent and the scratch resistance is excellent. Moreover, by having the 2nd resin layer 16 containing the hardened|cured material of the curable composition containing the ultraviolet curable resin which does not have a silsesquioxane skeleton between the base film 12 and the 1st resin layer 14, , the design of the optical adjustment function and the anti-blocking function becomes easy.

In FIG. 3, the base material 30 for transparent conductive layer formation which concerns on 3rd Embodiment is shown. The base material 30 for transparent conductive layer formation which concerns on 3rd Embodiment is the base film 12, the 2nd resin layer 16 formed on one side of the base film 12, and the 2nd resin layer ( It has the 1st resin layer 14 formed on the surface of 16), and the 3rd resin layer 18 formed on the other surface of the base film 12. The second resin layer 16 is in contact with one surface of the base film 12 , and the first resin layer 14 is in contact with the second resin layer 16 . Moreover, the 3rd resin layer 18 is in contact with the other surface of the base film 12. As shown in FIG. The 1st resin layer 14 has only on one side of the base film 12. The base material for transparent conductive layer formation is the 3rd resin layer 18, the base film 12, the 2nd resin layer 16, and the 1st resin layer 14 in order from the 3rd resin layer 18 side. Have.

The base material 30 for transparent conductive layer formation which concerns on 3rd Embodiment is 3rd on the other surface of the base film 12 compared with the base material 20 for transparent conductive layer formation which concerns on 2nd Embodiment. It is different from the point which has the resin layer 18, About this, it is the same as that of the base material 20 for transparent conductive layer formation which concerns on 2nd Embodiment, About the same structure, the description is abbreviate|omitted.

The 3rd resin layer 18 contains the hardened|cured material of the curable composition containing the ultraviolet curable resin which does not have silsesquioxane frame|skeleton. The curable composition which forms the 3rd resin layer 18 can be made into the same composition as the curable composition which forms the 2nd resin layer 16. As shown in FIG.

It is preferable that the 3rd resin layer 18 is a hard-coat layer. It is preferable that pencil hardness exists in the range of 2B-6H from this viewpoint. Pencil hardness can be measured based on JISK5600-5-4. The 3rd resin layer 18 is easy to satisfy|fill the said pencil hardness by forming with the composition containing an ultraviolet curable resin.

The thickness of the 3rd resin layer 18 is not specifically limited, It can be set as the thickness same as the thickness of the 2nd resin layer 16. As shown in FIG. And the thickness of the 3rd resin layer 18 is close to the thickness of the 2nd resin layer 16 or the thickness of the sum total of the 2nd resin layer 16 and the 1st resin layer 14 (for example, within ±10%) By setting it as ), it is easy to suppress the curl accompanying shrinkage|contraction at the time of hardening.

The base material 30 for forming a transparent conductive layer is coated with a curable composition for forming the second resin layer 16 on one surface of the base film 12, dried if necessary, and then cured by UV irradiation. After forming the 2nd resin layer 16 on one side of the base film 12, apply the curable composition which forms the 1st resin layer 14 on the surface of the 2nd resin layer 16, , After drying as needed, it is hardened by ultraviolet irradiation to form the 1st resin layer 14 on the surface of the 2nd resin layer 16, Furthermore, on the other surface of the base film 12 The curable composition which forms the 3rd resin layer 18 is coated, it is made to harden by ultraviolet irradiation after drying as needed, and the 3rd resin layer 18 is formed on the other surface of the base film 12. It can be manufactured by At this time, in order to improve the adhesiveness of the base film 12 and the 2nd resin layer 16, and the adhesiveness of the base film 12 and the 3rd resin layer 18, on the surface of the base film 12, the surface before coating. A treatment may be performed. Examples of the surface treatment include corona treatment, plasma treatment, hot air treatment, ozone treatment, and ultraviolet treatment.

According to the base material 30 for transparent conductive layer formation of the above structure, the 1st resin layer 14 formed on one side of the base film 12 contains the ultraviolet curable resin which has a silsesquioxane skeleton. By including the cured product of , the adhesiveness of the transparent conductive layer to be laminated is excellent and the scratch resistance is excellent. Moreover, by having the 2nd resin layer 16 containing the hardened|cured material of the curable composition containing the ultraviolet curable resin which does not have a silsesquioxane skeleton between the base film 12 and the 1st resin layer 14, , the design of the optical adjustment function and the anti-blocking function becomes easy. Moreover, since the 3rd resin layer 18 containing the hardened|cured material of the curable composition containing the ultraviolet curable resin which does not have a silsesquioxane skeleton on the other surface of the base film 12 is formed, The other surface side of the film 12 is also excellent in scratch resistance.

4, the base material 40 for transparent conductive layer formation which concerns on 4th Embodiment is shown. The base material 40 for transparent conductive layer formation which concerns on 4th Embodiment is the base film 12, the 2nd resin layer 16 formed on one side of the base film 12, and the 2nd resin layer ( It has the 1st resin layer 14 formed on the surface of 16, and the protective film 24 arrange|positioned through the adhesive layer 22 on the other surface of the base film 12. The second resin layer 16 is in contact with one surface of the base film 12 , and the first resin layer 14 is in contact with the second resin layer 16 . Moreover, the protective film 24 is in contact with the other surface of the base film 12 via the adhesive layer 22. As shown in FIG. The 1st resin layer 14 has only on one side of the base film 12. The base material 40 for transparent conductive layer formation is the protective film 24, the adhesive layer 22, the base film 12, the 2nd resin layer 16, and the 1st water in order from the protective film 24 side. It has a strata (14).

The base material 40 for transparent conductive layer formation which concerns on 4th Embodiment is an adhesive layer on the other surface of the base film 12 compared with the base material 20 for transparent conductive layer formation which concerns on 2nd Embodiment. The point of having the protective film 24 through (22) is different, except for this, it is the same as that of the base material 20 for transparent conductive layer formation which concerns on 2nd Embodiment, and the description is abbreviate|omitted about the same structure.

The protective film 24 can suppress damage to the other surface of the base film 12 at the time of handling, such as continuous processing by a roll process etc., for example. The protective film 24 is adhere|attached to the other surface of the base film 12 via the adhesive layer 22. As shown in FIG. The protective film 24 peels from the other surface of the base film 12 together with the adhesive layer 22 after a process etc. For this reason, in the adhesive layer 22, the adhesive force between the protective film 24 and the adhesive layer 22 is stronger than the adhesive force between the base film 12 and the adhesive layer 22, and the base film 12 and the adhesive The interfacial peelable adhesion between the layers 22 is adjusted.

As the material constituting the protective film 24 , those exemplified as the material constituting the base film 12 , etc. can be appropriately selected. Although the material which forms the protective film 24 is not specifically limited, From a viewpoint of being excellent in suppression of the curl by heat processing, etc., the material with heat shrinkage rate and linear expansion coefficient close to the base film 12 is preferable. For example, it is preferable that it is the same as or the same kind of material as the base film 12. The same type can represent, for example, polyesters, poly(meth)acrylates, polyamides, and the like.

Although the thickness of the protective film 24 is not specifically limited, For example, what is necessary is just the thickness similar to the base film 12 so that the heat shrinkage rate and a coefficient of linear expansion may become close to the base film 12. Specifically, it can be set in the range of 2-500 micrometers, for example, in the range of 2-200 micrometers.

The adhesive which forms the adhesive layer 22 is not specifically limited, An acrylic adhesive, a silicone adhesive, a urethane adhesive, etc. can be used suitably. In particular, since it is excellent in transparency and heat resistance, an acrylic adhesive is suitable. It is preferable that the acrylic adhesive is formed from the adhesive composition containing a (meth)acrylic polymer and a crosslinking agent.

A (meth)acrylic polymer is a homopolymer or copolymer of a (meth)acryl monomer. As a (meth)acryl monomer, an alkyl group containing (meth)acryl monomer, a carboxyl group containing (meth)acryl monomer, a hydroxyl group containing (meth)acryl monomer, etc. are mentioned.

As an alkyl-group containing (meth)acryl monomer, the (meth)acryl monomer which has a C2-C30 alkyl group is mentioned. The alkyl group having 2 to 30 carbon atoms may be linear, branched, or cyclic. As the alkyl group-containing (meth)acrylic monomer, more specifically, for example, isostearyl (meth)acrylate, stearyl (meth)acrylate, lauryl (meth)acrylate, dodecyl (meth)acrylate, decyl (meth)acrylate , (meth) acrylate isononyl, (meth) acrylate nonyl, (meth) acrylate isooctyl, (meth) acrylate octyl, (meth) acrylate isobutyl, (meth) acrylate n-butyl, (meth) acrylate pentyl, ( Hexyl meth)acrylate, cyclohexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, propyl (meth)acrylate, ethyl (meth)acrylate, methyl (meth)acrylate, etc. are mentioned.

Examples of the carboxyl group-containing (meth)acrylic monomer include (meth)acrylic acid, carboxyethyl (meth)acrylate, and carboxypentyl (meth)acrylic acid. A carboxyl group may be located at the terminal of an alkyl chain, and may be located in the middle of an alkyl chain.

Examples of the hydroxyl group-containing (meth)acrylic monomer include (meth)acrylic acid hydroxylauryl, (meth)acrylic acid hydroxydecyl, (meth)acrylic acid hydroxyoctyl, (meth)acrylic acid hydroxyhexyl, (meth)acrylic acid hydroxybutyl; (meth)acrylic-acid hydroxypropyl, (meth)acrylic-acid hydroxyethyl, etc. are mentioned. The hydroxyl group may be located at the terminal of an alkyl chain, and may be located in the middle of an alkyl chain.

Any one of the above types may be sufficient as the (meth)acryl monomer which forms a (meth)acrylic polymer, and 2 or more types of combination may be sufficient as it.

Examples of the crosslinking agent include isocyanate crosslinking agents, epoxy crosslinking agents, metal chelate crosslinking agents, metal alkoxide crosslinking agents, carbodiimide crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, and melamine crosslinking agents. A crosslinking agent may be used individually by these 1 type, and may be used in combination of 2 or more type.

The adhesive composition may contain other additives other than a (meth)acrylic polymer and a crosslinking agent. As other additives, crosslinking accelerator, crosslinking retarder, tackifying resin (tackifier), antistatic agent, silane coupling agent, plasticizer, peeling aid, pigment, dye, wetting agent, thickener, ultraviolet absorber, preservative, antioxidant, metal inert agents, alkylating agents, flame retardants, and the like. These are appropriately selected and used according to the purpose or purpose of use of the pressure-sensitive adhesive.

Although the thickness of the adhesive layer 22 is not specifically limited, It is preferable to exist in the range of 1-10 micrometers. More preferably, it exists in the range of 2-7 micrometers.

5, the base material 50 for transparent conductive layer formation which concerns on 5th Embodiment is shown. As for the base material 50 for transparent conductive layer formation which concerns on 5th Embodiment, the 2nd resin layer 16 is formed on both surfaces of the base film 12, The surface of the 2nd resin layer 16 of both sides. A first resin layer 14 is formed thereon, respectively. The second resin layer 16 is in contact with the base film 12 , and the first resin layer 14 is in contact with the second resin layer 16 . The base material 50 for transparent conductive layer formation is, in order from the 1st resin layer 14 side, the 1st resin layer 14, the 2nd resin layer 16, the base film 12, the 2nd resin layer ( 16) and the first resin layer 14.

The base material 50 for transparent conductive layer formation which concerns on 5th Embodiment is compared with the base material 20 for transparent conductive layer formation which concerns on 2nd Embodiment, The 2nd resin layer 16 and the 1st resin layer 14 ) is different from the point formed on both sides of the base film 12, and it is the same as that of the base material 20 for transparent conductive layer formation which concerns on 2nd Embodiment about this other than this, and the description is abbreviate|omitted.

The base material 50 for transparent conductive layer formation forms the transparent conductive film of the structure which has a transparent conductive layer on both sides of the base film 12 by having the 1st resin layer 14 on both sides of the base film 12. It is suitable as a base material for

6, the base material 60 for transparent conductive layer formation which concerns on 6th Embodiment is shown. The base material 60 for transparent conductive layer formation which concerns on 6th Embodiment uses 2 sheets of the base material 10 for transparent conductive layer formation shown in FIG. 1, through the adhesive layer 28, the mutual base film 12 ) side is joined. The base material 60 for transparent conductive layer formation has the 1st resin layer 14, the base film 12, the adhesive layer 28, the base film 12, and the 1st resin layer 14 in order. .

The base material 60 for transparent conductive layer formation forms the transparent conductive film of the structure which has a transparent conductive layer on both sides similarly to the base material 50 for transparent conductive layer formation by having the 1st resin layer 14 on both sides. It is suitable as a base material for The base material 60 for transparent conductive layer formation uses 2 sheets of the base material 10 for transparent conductive layer formation shown in FIG. 1, By having two base film 12 sheets, it is broken in a transparent conductive layer formation process. It is difficult and has excellent handling properties.

The adhesive layer 28 is for adhere|attaching two base films 12 comrades with good adhesiveness. The adhesive layer 22 of the base material 40 for transparent conductive layer formation shown in FIG. 4 differs in the point which peels hard. As the pressure-sensitive adhesive (adhesive composition) for forming the pressure-sensitive adhesive layer 28 , the pressure-sensitive adhesive (adhesive composition) in the substrate 70 for forming a transparent conductive layer according to the seventh embodiment to be described later can be suitably used.

Although the thickness of the adhesive layer 28 is not specifically limited, It is preferable to exist in the range of 5-100 micrometers. More preferably, it exists in the range of 10-50 micrometers.

The pressure-sensitive adhesive layer 28 is formed by directly coating the pressure-sensitive adhesive composition on the other side of the base film 12, and after forming by applying the pressure-sensitive adhesive composition on the surface of the release film, the base film 12 A method of transferring on the other side, after forming by coating a pressure-sensitive adhesive composition on the side of the first release film, bonding the second release film, peeling one of the release films to the other side of the base film 12 It can be formed according to the method of transferring on the side surface, etc.

In FIG. 7, the base material 70 for transparent conductive layer formation which concerns on 7th Embodiment is shown. The base material 70 for transparent conductive layer formation which concerns on 7th Embodiment is the base film 12, the 1st resin layer 14 formed on one surface of the base film 12, and the base film 12 It has a pressure-sensitive adhesive layer 32 formed on the other side of the pressure-sensitive adhesive layer 32, and a release film 34 formed on the surface of the pressure-sensitive adhesive layer (32). The first resin layer 14 is in contact with one surface of the base film 12 , and the pressure-sensitive adhesive layer 32 is in contact with the other surface of the base film 12 . The 1st resin layer 14 has only on one side of the base film 12. The base material 70 for transparent conductive layer formation has the release film 34, the adhesive layer 32, the base film 12, and the 1st resin layer 14 in order from the release film 34 side.

The base material 70 for transparent conductive layer formation which concerns on 7th Embodiment is an adhesive layer on the other surface of the base film 12 compared with the base material 10 for transparent conductive layer formation which concerns on 1st Embodiment. It is different from the point which has (32) and the release film 34, and about that it is the same as that of the base material 10 for transparent conductive layer formation which concerns on 1st Embodiment, and abbreviate|omits the description about the same structure.

The adhesive layer 32 is for adhering the base material 70 for transparent conductive layer formation to board|substrates, such as a polymer film and glass, with good adhesiveness.

The adhesive composition which forms the adhesive layer 32 can contain well-known adhesive resins, such as an acrylic adhesive, a silicone adhesive, and a urethane adhesive. Especially, an acrylic adhesive is preferable from a viewpoint of optical transparency and heat resistance. The pressure-sensitive adhesive composition preferably contains a crosslinking agent in order to increase the cohesive force of the pressure-sensitive adhesive layer 32 . As a crosslinking agent, an isocyanate type crosslinking agent, an epoxy type crosslinking agent, an aziridine type crosslinking agent, a chelate type crosslinking agent, etc. are mentioned.

The adhesive composition may contain an additive as needed. As an additive, well-known additives, such as a plasticizer, a silane coupling agent, surfactant, antioxidant, a filler, a hardening accelerator, and a hardening retarder, are mentioned. Moreover, you may dilute using an organic solvent from a viewpoint of productivity etc.

Although the thickness of the adhesive layer 32 is not specifically limited, It is preferable to exist in the range of 5-100 micrometers. More preferably, it exists in the range of 10-50 micrometers.

The pressure-sensitive adhesive layer 32 is formed by directly coating the pressure-sensitive adhesive composition on the other side of the base film 12, and after forming by applying the pressure-sensitive adhesive composition on the surface of the release film 34, the base film ( After the method of transferring on the other side of 12), the pressure-sensitive adhesive composition is applied and formed on the side of the first release film, the second release film is bonded, and either release film is peeled off to form the base film 12 ) can be formed according to a method of transferring onto the other side of the .

It is preferable that the adhesive force to glass of the adhesive layer 32 from a favorable adhesive viewpoint is 4 N/25 mm or more. More preferably, it is 6 N/25 mm or more, More preferably, it is 10 N/25 mm or more.

The release film 34 functions as a protective layer of the adhesive layer 32 before use, and peels from the adhesive layer 32 at the time of use. It does not specifically limit as the release film 34, The same material as the material used for the base film 12 can be used.

A release treatment may be performed on the surface of the release film 34 in contact with the pressure-sensitive adhesive layer 32 . As a mold release agent used for a mold release process, mold release agents, such as a silicone type, a fluorine type, an alkyd type, an unsaturated polyester type, a polyolefin type, a wax type, are mentioned, for example.

Next, the transparent conductive film which concerns on this invention is demonstrated.

8 shows a transparent conductive film 80 according to an embodiment of the present invention. As shown in FIG. 8, the transparent conductive film 80 which concerns on one Embodiment of this invention is the transparent conductive layer 26 on the surface of the 1st resin layer 14 of the base material 10 for transparent conductive layer formation. has The base material 10 for transparent conductive layer formation is the base material for transparent conductive layer formation which concerns on this invention. The transparent conductive film 80 has the base film 12, the 1st resin layer 14, and the transparent conductive layer 26 in order from the base film 12 side.

The transparent conductive layer 26 contains a conductive substance. The conductive material is not particularly limited, and metal oxides such as zinc oxide, barium oxide, indium tin oxide, indium zinc oxide, zirconium oxide, ytterbium oxide, yttrium oxide, tantalum oxide, aluminum oxide, cerium oxide, and titanium oxide are exemplified. have. Among these, indium tin oxide and indium zinc oxide are especially preferable from a viewpoint of being highly compatible with transparency and electroconductivity, etc.

Although the thickness of the transparent conductive layer 26 is not specifically limited, The inside of the range of 10-40 nm is preferable. More preferably, it exists in the range of 15-30 nm.

Examples of the transparent conductive layer 26 include a sputtering method, a vacuum vapor deposition method, a CVD method, and an ion plating method. Among these, the sputtering method is preferable from a viewpoint of being able to manufacture a low-resistance, homogeneous film stably.

The transparent conductive layer 26 preferably has a step of firing the conductive material after film formation in order to promote crystallization of the conductive material. Although the baking method is not specifically limited, For example, what is necessary is just to perform using drum heating at the time of sputtering, a hot-air heating furnace, a far-infrared heating furnace, etc. What is necessary is just to select the heating temperature at the time of baking suitably according to the kind of electroconductive substance. For example, it can be set as 50-200 degreeC, 80-180 degreeC, 100-160 degreeC, etc. Although the heating time at the time of baking is not specifically limited, 3-180 minutes, 5-120 minutes, 10-90 minutes, etc. can be made.

According to the transparent conductive film 80 having the above configuration, by having the transparent conductive layer 26 on the surface of the first resin layer 14 of the substrate 10 for forming a transparent conductive layer according to the present invention, the first number The adhesion between the base layer 14 and the transparent conductive layer 26 is excellent. Moreover, since the 1st resin layer 14 is excellent in abrasion resistance, it can suppress that the surface of the 1st resin layer 14 is damaged at the time of handling.

In the transparent conductive film 80 according to the present invention, the transparent conductive layer 26 can be used as an electrode of a touch panel. The electrodes of the touch panel include those in which the transparent conductive layer 26 is formed in a desired electrode pattern. The electrode pattern can be formed by etching the transparent conductive layer 26 or the like.

Next, a touch panel according to the present invention will be described.

The touch panel according to the present invention is constituted by using the transparent conductive film 80 according to the present invention, and the transparent conductive layer 26 of the transparent conductive film 80 is used as an electrode of the touch panel. A touch panel is a touch panel, such as a capacitive type and a resistive film type. As a touch panel which concerns on this invention, the thing of a GFF system and a GF2 system is mentioned. The GFF-type touch panel is transparent in which the base film 12 side of each other of the base material 10 for transparent conductive layer formation of 2 sheets as shown in FIG. 6 is bonded through the adhesive layer 28, for example. The transparent conductive film in which the transparent conductive layer 26 was formed on the surface of each 1st resin layer 12 of the base material 60 for conductive layer formation, as shown in FIG. 8, the base film 12 of The transparent conductive film 80 having the configuration having the first resin layer 14 and the transparent conductive layer 26 only on one side side was bonded to each other on the base film 12 side of two sheets with a transparent adhesive, which is more transparent It includes what bonded the surface of one transparent conductive layer 26 to transparent base materials, such as glass or a resin film, using an adhesive. In addition, the touch panel of the GF2 system is a base material for transparent conductive layer formation of the structure which has the 1st resin layer 14 and the transparent conductive layer 26 on both surfaces of the base film 12 as shown in FIG. 5, for example. Includes those in which the transparent conductive film formed in (50) is bonded to a transparent substrate such as glass or a resin film with a transparent adhesive.

The image display method of the touch panel which concerns on this invention is not specifically limited, It can use for arbitrary display apparatuses, such as a liquid crystal display device and an organic electroluminescent display.

As mentioned above, although embodiment of this invention was described, this invention is not limited at all to the said embodiment, Various changes are possible within the range which does not deviate from the meaning of this invention.

For example, in the said embodiment, in order to improve the adhesiveness of the base film 12 and the 1st resin layer 14, the 2nd resin layer 16, or the 3rd resin layer 18, the base film 12 Although the base material which may surface-treat to the surface is performed, the structure which provides an easily bonding layer in the surface of the base film 12 instead of surface treatment may be sufficient.

In addition, in the said embodiment, the surface unevenness|corrugation of the 1st resin layer 14 is supposed to add the particle|grains of the average particle diameter larger than the thickness of the layer to which the particle|grains are added, However, As a formation method of unevenness|corrugation, it is not limited to this. . For example, surface unevenness may be formed in a layer that forms surface unevenness, such as the first resin layer 14 by die transfer. In addition, even when adding particles to form surface irregularities, the surface free energy of the particles is reduced by surface-treating the particles or using a surfactant together, and the particles are localized on the surface of the layer to which the particles are added. A method of forming surface irregularities by In this case, the average particle diameter of the particles may be smaller than the thickness of the layer to which the particles are added. For example, when adding such particles to the first resin layer 14, the average particle diameter of the particles is preferably in the range of 50 to 500 nm. More preferably, it exists in the range of 80-400 nm, More preferably, it exists in the range of 120-400 nm. Moreover, it is preferable that the average particle diameter is 1/2 or less of the thickness of the layer which adds particle|grains.

In addition, although the said protective film 24 is shown in the form added to the base material 20 for transparent conductive layer formation of 2nd Embodiment shown in FIG. 2 as shown in FIG. 4, 1st Embodiment shown in FIG. The form added to the base material 10 for transparent conductive layer formation of a form may be sufficient. Moreover, the form added to transparent conductive films, such as the transparent conductive film 80 shown in FIG. 8, may be sufficient.

In addition, although the said adhesive layer 32 is shown in the form added to the base material 10 for transparent conductive layer formation of 1st Embodiment shown in FIG. 1 as shown in FIG. 7, it is transparent as shown in FIGS. 2-3. The form added to the base materials 20-30 for conductive layer formation may be sufficient. Moreover, the form added to transparent conductive films, such as the transparent conductive film 80 shown in FIG. 8, may be sufficient.

Moreover, in the base material 60 for transparent conductive layer formation shown in FIG. 6, the mutual base film 12 side of the base material 10 for transparent conductive layer formation of 2 sheets is joined through the adhesive layer 28. Although shown in the form, one or both of the base materials 10 for transparent conductive layer formation of 2 sheets may be the base materials 20-30 for transparent conductive layer formation shown in FIGS. Moreover, a transparent conductive film, such as the transparent conductive film 80 shown in FIG. 8, may be sufficient.

In addition, as shown in FIG. 8, the transparent conductive film 80 has shown the example which uses the base material 10 for transparent conductive layer formation of 1st Embodiment shown in FIG. 1 as a base material for transparent conductive layer formation. The substrates 20 to 70 for forming the transparent conductive layer shown in 2 to 7 may be used as the substrate for forming the transparent conductive layer.

And before forming each layer on the surface of the base film 12, you may provide in advance various functional layers, such as a gas barrier property improvement layer, an antistatic layer, and an oligomer block layer.

Example

Hereinafter, the present invention will be described in detail using Examples and Comparative Examples.

(Preparation of curable composition for 1st resin layer formation)

By mix|blending each component with the compounding composition (mass %) of Table 1, the curable composition for 1st resin layer formation was prepared.

(Preparation of curable composition for 2nd resin layer formation)

By mix|blending each component with the compounding composition (mass %) of Table 1, the curable composition for 2nd resin layer formation was prepared.

(Preparation of curable composition for 3rd resin layer formation)

The curable composition for 3rd resin layer formation was prepared by mix|blending each component with the compounding composition (mass %) of description in Table 1.

(Preparation of a base material for forming a transparent conductive layer)

(Examples 1-3)

On one side of the base film (PET film "Lumira UH1H" made by Toray, 50 µm thick), the curable composition for forming the second resin layer is coated using a #5 wire bar, and dried at 80° C. for 1 minute, Using a high-pressure mercury lamp, the coating film was UV-cured by irradiating the coating film with ultraviolet rays at a light quantity of 200 mJ/cm 2 , thereby forming a second resin layer.

Then, on the surface of the second resin layer, the curable composition for forming the first resin layer is coated using a wire bar of #4, dried at 80° C. for 1 minute, and then using a high-pressure mercury lamp under a nitrogen atmosphere. , The first resin layer was formed by UV curing the coating film by irradiating the coating film with ultraviolet rays at a light amount of 200 mJ/cm 2 .

Then, on the other side of the base film, the curable composition for forming the third resin layer was coated using the wire bar of #4, dried at 80° C. for 1 minute, and then using a high-pressure mercury lamp, the amount of light 200 mJ/cm 2 The 3rd resin layer was formed by irradiating an ultraviolet-ray to the furnace coating film and making the coating film ultraviolet-curing.

As mentioned above, the base material for transparent conductive layer formation which concerns on Examples 1-3 was produced.

(Example 4)

The base film was changed to a Nippon Zeon COP film “Zeonor Film ZF16-55” (thickness 55 μm), and corona treatment was performed on one side thereof, without forming a second resin layer, using a #5 wire bar A base material for forming a transparent conductive layer according to Example 4 was prepared in the same manner as in Example 1 except that the first resin layer was formed. On the other surface of the base film, the 3rd resin layer was not formed.

(Examples 5 to 8)

The base film was changed to a Nippon Zeon COP film "Zeonor Film ZF16-55" (thickness 55 µm), and corona treatment was performed on one side thereof, then a second resin layer was formed, and on the surface of the second resin layer A base material for forming a transparent conductive layer according to Examples 5 to 8 was prepared in the same manner as in Example 1 except that the first resin layer was formed using the wire bar #5. On the other surface of the base film, the 3rd resin layer was not formed.

(Comparative Example 1)

A base material for forming a transparent conductive layer according to Comparative Example 1 was prepared in the same manner as in Example 1 except that the curable composition for forming the first resin layer was different. The ultraviolet curable resin which has a silsesquioxane skeleton is not contained in the curable composition for 1st resin layer formation of Comparative Example 1.

(Comparative Example 2)

A base material for forming a transparent conductive layer according to Comparative Example 2 was prepared in the same manner as in Example 3 except that the curable composition for forming the first resin layer was different. The curable composition for 1st resin layer formation of the comparative example 2 does not contain the ultraviolet curable resin which has a silsesquioxane skeleton.

(Comparative Example 3)

A base material for forming a transparent conductive layer according to Comparative Example 3 was prepared in the same manner as in Example 3 except that the curable composition for forming the first resin layer was different. The ultraviolet curable resin which has silsesquioxane skeleton is not contained in the curable composition for 1st resin layer formation of the comparative example 3, but the thermosetting epoxy resin which has silsesquioxane skeleton is contained.

The material used as a material of a 1st resin layer, a 2nd resin layer, and a 3rd resin layer is as follows.

-SQ-containing UV resin <1>: UV-curable resin having a silsesquioxane skeleton ("MAC-SQ HDM" manufactured by Toagosei, methacrylic resin, solvent (PGB) solid content concentration of 50% by mass, functional group; methacryloyl group) , functional group equivalent 239 g / eq)

·SQ-containing UV resin <2>: UV-curable resin having a silsesquioxane skeleton (“MAC-SQ SI-20” manufactured by Toagosei, methacrylic resin, solid content concentration of 100% by mass, functional group; methacryloyl group, functional group equivalent 224 g/eq)

UV resin <1>: UV-curable resin having no silsesquioxane skeleton (Toyochem "Riodurus TYZ59-10-S", zirconium particle-containing (meth)acrylic resin, solvent (PGM, MIBK, aliphatic) solvent and cyclohexanone), solid content concentration of 40 mass%, high refractive index hard coat agent)

UV resin <2>: UV-curable resin having no silsesquioxane skeleton (Arakawa Chemical Co., Ltd. “Opstar Z7527”, silica particle-containing (meth)acrylic resin, solvent (MEK), solid content concentration of 50% by mass)

UV resin <3>: UV-curable resin having no silsesquioxane skeleton (“Riodurus TYZ65-01” manufactured by Toyochem, (meth)acrylic resin containing zirconium particles, solvents (PGM, MIBK, aliphatic solvents and cyclohexanone), solid content concentration of 40 mass%, high refractive index hard coat agent)

UV resin <4>: UV-curable resin having no silsesquioxane skeleton ("Aika Aitron Z-735-35L" manufactured by Aika Kogyo Co., Ltd., (meth)acrylic resin, solvent (ethyl acetate, butyl acetate and MEK); Solid content concentration 50% by mass)

UV resin <5>: UV-curable resin having no silsesquioxane skeleton (DIC manufactured "GRANDIC PC16-2291", (meth)acrylic resin, solvent (MEK, BuAc and MIBK), solid content concentration of 40% by mass)

-Resin particle: polymethyl methacrylate particle (1 mass % MEK dispersion of "Chemiso MX-80H3wT" manufactured by Soken Chemical, average particle diameter of 800 nm)

-Photoinitiator: BASF Japan "IRGACURE127"

·SQ-containing EP resin: thermosetting epoxy resin having a silsesquioxane skeleton (“Composeran SQ506” manufactured by Arakawa Chemical Industry Co., Ltd.)

·EP curing agent: 1-benzyl-2-methylimidazole

Solvent <1>: methyl ethyl ketone (MEK)

Solvent <2>: butyl acetate (BuAc)

Solvent <3>: propylene glycol n-butyl ether (PGB)

Solvent <4>: propylene glycol monomethyl ether (PGM)

Solvent <5>: methyl isobutyl ketone (MIBK)

The thickness of the 1st resin layer, 2nd resin layer, and 3rd resin layer of the produced base material for transparent conductive layer formation was measured according to the spectral interference method using the "Filmetrics F20 film thickness measurement system" manufactured by Filmmetrics. In addition, the thickness of the layer containing a resin particle was made into the thickness of the part in which a resin particle does not exist in the thickness direction.

Using each prepared base material for forming a transparent conductive layer, on the surface of the first resin layer, indium tin oxide was sputtered to a thickness of 20 nm to form an ITO layer, and on the surface of the ITO layer, copper was coated with 200 nm After forming a copper layer by sputtering to a thickness of , the ITO layer was crystallized by standing at 150° C. × 1 hour in a constant temperature bath. As described above, a transparent conductive film was produced.

(ITO adhesion)

From the copper surface side of the produced transparent conductive film to the interface of the ITO layer and the 1st resin layer, the cut|disconnection was put in grid|lattice form, and the adhesion test based on JISK5400-8.5 (JIS D0202) was implemented. The thing in which peeling was not seen in all 100 masses was made into "good|favorableness (circle)", and the thing in which peeling was seen even in 1 mass was made into defectiveness "x". Among the good things, the thing in which peeling was not seen also in the cut periphery of the outer side of 100 pieces was made into especially favorable "double-circle".

(scratch resistance)

Using each prepared base material for forming a transparent conductive layer, it was set in a Hakjin type friction solidity tester manufactured by Tester Sangyo, and the surface of the first resin layer was tested with "Steel Wool #0000" manufactured by Nippon Steel Wool under a load of 200 g. rubbed 20 times. Thereafter, the surface of the first resin layer was visually observed under a fluorescent lamp from directly above, and the thing in which abrasion was not observed was made into good "(circle)" and the thing in which abrasion was seen was made into bad "x".

From Examples and Comparative Examples, since the first resin layer contains a cured product of a curable composition containing an ultraviolet curable resin having a silsesquioxane skeleton, the adhesiveness of the transparent conductive layer is excellent, and the scratch resistance of the first resin layer is excellent. I found this excellent. In Comparative Examples 1 and 2, since the curable composition for forming the first resin layer does not contain the ultraviolet curable resin having a silsesquioxane skeleton, the adhesiveness of the transparent conductive layer is inferior. In Comparative Example 3, since the curable composition for forming the first resin layer has a silsesquioxane skeleton but only contains a thermosetting epoxy resin instead of an ultraviolet curable resin, despite the thick film thickness, the first number The scratch resistance of the strata is inferior. And it turned out that adhesiveness with ITO was especially excellent as content of SQ containing UV resin of a 1st resin layer was 5 mass % or more from a comparison between Examples.

As mentioned above, although the embodiment of this invention was described, this invention is not limited in any way to the said embodiment, and various changes are possible within the range which does not deviate from the meaning of this invention.

10, 20, 30, 40, 50, 60, 70 Substrate for forming a transparent conductive layer
12 base film
14 first resin layer
16 second resin layer
18 third resin layer
22 adhesive layer
24 protective film
26 transparent conductive layer
28 adhesive layer
32 adhesive layer
34 release film
80 Transparent Conductive Layer Film

Claims (12)

A base material for forming a transparent conductive layer serving as a base material for forming a transparent conductive layer, comprising:
Having a base film and a first resin layer formed on the surface of the base film,
The said 1st resin layer contains the hardened|cured material of the curable composition containing the ultraviolet curable resin which has a silsesquioxane skeleton, The base material for transparent conductive layer formation characterized by the above-mentioned. The substrate for forming a transparent conductive layer according to claim 1, wherein the ultraviolet curable resin having a silsesquioxane skeleton is (meth)acrylate having a silsesquioxane skeleton. The substrate for forming a transparent conductive layer according to claim 1 or 2, wherein the content of the ultraviolet curable resin having a silsesquioxane skeleton is 1 mass% or more based on the total solid content of the curable composition. 2nd containing the hardened|cured material of the curable composition containing the ultraviolet curable resin which does not have a silsesquioxane skeleton between the said base film and the said 1st resin layer in any one of Claims 1-3 It has a resin layer, The base material for transparent conductive layer formation characterized by the above-mentioned. The said 1st resin layer has only on one side of the said base film, On the other side of the said base film, it does not have a silsesquioxane skeleton in any one of Claims 1-4. A base material for forming a transparent conductive layer, comprising a third resin layer comprising a cured product of a curable composition comprising a non-UV curable resin. The said 1st resin layer has only on one side of the said base film, On the other side of the said base film, a protective film through an adhesive layer in any one of Claims 1-5. A base material for forming a transparent conductive layer, characterized in that it has. The said 1st resin layer has on both surfaces of the said base film, The base material for transparent conductive layer formation in any one of Claims 1-4 characterized by the above-mentioned. It has a transparent conductive layer on the surface of the 1st resin layer of the base material for transparent conductive layer formation in any one of Claims 1-7, The transparent conductive film characterized by the above-mentioned. The transparent conductive film according to claim 8, wherein the transparent conductive layer is used for an electrode of a touch panel. The transparent conductive layer of Claim 8 is used for an electrode, The touch panel characterized by the above-mentioned. A method for manufacturing a substrate for forming a transparent conductive layer, which becomes a substrate for forming a transparent conductive layer, comprising:
The manufacturing method of the base material for transparent conductive layer formation characterized by forming on the surface of a base film the 1st resin layer containing the hardened|cured material of the curable composition containing the ultraviolet curable resin which has silsesquioxane skeleton. The method according to claim 11, after forming a second resin layer containing a cured product of a curable composition containing an ultraviolet curable resin having no silsesquioxane skeleton on the surface of the base film, the second resin layer A method of manufacturing a base material for forming a transparent conductive layer, characterized in that the first resin layer is formed on a surface thereof.

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