JP2022074468A - Transparent conductive layer formation substrate with protective layer and manufacturing method of transparent conductive layer formation substrate with protective layer - Google Patents

Abstract

To provide a transparent conductive layer formation substrate with a protective layer that can suppress a curl after heat treatment and is excellent in slipperiness and detachability and a manufacturing method of the transparent conductive layer formation substrate with a protective layer.SOLUTION: A transparent conductive layer forming substrate with a protective layer 10 comprises a transparent conductive layer forming substrate 11 for forming a transparent conductive layer, and a protective layer 18 formed on a surface opposite to a side forming a transparent conductive layer of the transparent conductive layer forming substrate 11, in which the protective layer 18 is formed from a plastisol composition containing resin particles and a plasticizer, and the young's modulus of the protective layer 18 is 12 MPa or larger and 100 MPa or smaller.SELECTED DRAWING: Figure 1

Description

The present invention relates to a base material for forming a transparent conductive layer with a protective layer and a method for producing a base material for forming a transparent conductive layer with a protective layer.

Capacitive touch panels are known as input devices such as smart phones and tablet terminals that can operate devices by touching the display on the screen. A transparent conductive film is used for this type of touch panel. The transparent conductive film is made of, for example, a transparent conductive layer made of a metal oxide such as indium tin oxide (ITO) formed on the surface of a plastic base material (resin base material).

In the transparent conductive film, the plastic base material (resin base material) may be scratched in the process of forming the transparent conductive layer and the subsequent steps. Therefore, a protective layer may be provided on the plastic base material (resin base material) before the transparent conductive layer is formed.

For example, in Patent Document 1, a release sheet is used to protect the surface of a base material in a manufacturing process of an electronic material or the like. This release sheet is produced by curing a composition containing a thioether-containing (meth) acrylate derivative, a polyfunctional (meth) acrylate having a predetermined weight average molecular weight, and a polyether-modified polydimethylsiloxane in a predetermined ratio. Ru.

Further, in Patent Document 2, a protective film is provided on the main surface of the film substrate on the side opposite to the transparent conductive layer of the transparent conductive film having the optical adjustment layer and the transparent conductive layer on one main surface of the film substrate. A transparent conductive film with a bonded protective film is disclosed.

Japanese Unexamined Patent Publication No. 2018-145415 Japanese Unexamined Patent Publication No. 2016-105392

In the transparent conductive film, heat treatment such as for crystallizing the transparent conductive layer is performed. However, the protective sheet of Patent Document 1 has a problem that the transparent conductive film having the protective sheet is greatly curled after the heat treatment. If the curl of the transparent conductive film having the protective sheet is large, it becomes difficult to handle it when crystallizing the transparent conductive layer and when laminating the transparent conductive film in the manufacturing process of the touch panel device.

On the other hand, in Patent Document 2, the transparent conductive layer is crystallized by reducing the difference between the maximum heat shrinkage in the main surface of the protective film and the maximum heat shrinkage in the main surface of the transparent conductive film. It is described that the curl after the heat treatment of the above is suppressed. However, the transparent conductive film with a protective film of Patent Document 2 also does not have a sufficient effect of suppressing curl. Further, the protective film described in Patent Document 2 is made of a cycloolefin polymer in relation to the heat shrinkage of the base film, and is expensive.

The problem to be solved by the present invention is a method for manufacturing a base material for forming a transparent conductive layer with a protective layer and a base material for forming a transparent conductive layer with a protective layer, which suppresses curl after heat treatment and has excellent slipperiness and peelability. Is to provide.

In order to solve the above problems, the base material for forming a transparent conductive layer with a protective layer according to the present invention includes a base material for forming a transparent conductive layer, which is a base material for forming a transparent conductive layer, and a base for forming the transparent conductive layer. It has a protective layer formed on a surface opposite to the side on which the transparent conductive layer of the material is formed, and the protective layer is formed from a plastisol composition containing resin particles and a plasticizer. The young ratio of the protective layer is 12 MPa or more and 100 MPa or less.

The resin particles may be composed of a (meth) acrylic polymer. The plasticizer may be a phosphoric acid ester-based plasticizer. The film thickness of the protective layer is preferably 20 μm or more and 250 μm or less. The peeling force between the transparent conductive layer forming substrate and the protective layer before and after heating at 150 ° C. for 1 hour is preferably 5 mN / 25 mm or more and 1100 mN / 25 mm or less.

The base material for forming the transparent conductive layer includes a base film, a hard coat layer formed on one surface of the base film, and an optical adjustment layer formed on the surface of the hard coat layer. , And the protective layer may be formed on the other surface of the substrate film. Further, the transparent conductive layer forming base material includes a base film, a hard coat layer formed on both surfaces of the base film, and optics formed on the surfaces of each layer of the hard coat layer. It has an adjusting layer, and the protective layer may be formed on one surface of the optical adjusting layer.

The base film may be made of a cycloolefin polymer.

The method for producing a transparent conductive layer-forming base material with a protective layer according to the present invention is the side on which the transparent conductive layer-forming base material for forming the transparent conductive layer, which is the base material for forming the transparent conductive layer, is formed. A composition for forming a protective layer is applied to the opposite surface to form a protective layer.

According to the base material for forming a transparent conductive layer with a protective layer according to the present invention, the protective layer formed on the surface of the base material for forming a transparent conductive layer opposite to the side on which the transparent conductive layer is formed is plastic with resin particles. It is formed from a plasticizer composition containing an agent, and since the Young's modulus of the protective layer is 12 MPa or more and 100 MPa or less, curl after heat treatment is suppressed, and slipperiness and peelability are excellent.

When the resin particles are composed of a (meth) acrylic polymer, the load on the environment is small, the affinity with the plasticizer is good, and the heat resistance is excellent. When the plasticizer is a phosphoric acid ester-based plasticizer, the affinity with the resin particles is good. When the film thickness of the protective layer is 20 μm or more and 250 μm or less, the protective effect of the protective layer is excellent. When the peeling force between the transparent conductive layer forming substrate and the protective layer before and after heating at 150 ° C. for 1 hour is 5 mN / 25 mm or more and 1100 mN / 25 mm or less, the peelability is excellent.

It is sectional drawing of the base material for forming a transparent conductive layer with a protective layer which concerns on 1st Embodiment of this invention. It is sectional drawing of the base material for forming a transparent conductive layer with a protective layer which concerns on 2nd Embodiment of this invention.

Hereinafter, the present invention will be described in detail.

The base material for forming a transparent conductive layer with a protective layer according to the present invention forms a base material for forming a transparent conductive layer, which is a base material for forming a transparent conductive layer, and a base material for forming a transparent conductive layer. It has a protective layer formed on the surface opposite to the side to be used. The base material for forming a transparent conductive layer may have a structure having only a base film, or may have a structure having a base film and a hard coat layer formed on the surface of the base film. Alternatively, the structure may include a base film and an optical adjustment layer formed on the surface of the base film, or the base film and a hard coat formed on the surface of the base film. It may be configured to have a layer and an optical adjustment layer formed on the surface of the hard coat layer.

FIG. 1 is a cross-sectional view of a base material for forming a transparent conductive layer with a protective layer according to the first embodiment of the present invention. As shown in FIG. 1, the base material 10 for forming a transparent conductive layer with a protective layer according to the first embodiment of the present invention is a hard coat formed on one surface of the base film 12 and the base film 12. It has a layer 14, an optical adjustment layer 16 formed on the surface of the hard coat layer 14, and a protective layer 18 formed on the other surface of the base film 12. In the transparent conductive layer forming base material 10 with a protective layer, the transparent conductive layer forming base material 11 serving as a base material for forming the transparent conductive layer is on one surface of the base material film 12 and the base material film 12. It is composed of a hard coat layer 14 formed on the surface of the hard coat layer 14 and an optical adjustment layer 16 formed on the surface of the hard coat layer 14. In the base material 10 for forming a transparent conductive layer with a protective layer, the transparent conductive layer is formed on the surface of the optical adjustment layer 16. Therefore, the protective layer 18 is formed on the surface of the base material 10 for forming a transparent conductive layer with a protective layer, which is opposite to the side on which the transparent conductive layer is formed.

[Base film]
The base film 12 is not particularly limited as long as it has transparency. Examples of the base film 12 include a transparent polymer film and a glass film. Transparency means that the total light transmittance in the visible light wavelength region is 50% or more, and the total light transmittance is more preferably 85% or more. The total light transmittance can be measured according to JIS K7361-1 (1997). The thickness of the base film 12 is not particularly limited, but is preferably in the range of 2 to 500 μm from the viewpoint of excellent handleability and the like. More preferably, it is in the range of 2 to 200 μm. The term "film" generally means a film having a thickness of less than 0.25 mm, but even if the film has a thickness of 0.25 mm or more, the thickness is 0 if it can be rolled into a roll. Even if it is .25 mm or more, it shall be included in the "film".

Examples of the polymer material of the base film 12 include polyester resins such as polyethylene terephthalate resin and polyethylene naphthalate resin, polycarbonate resins, poly (meth) acrylate resins, polystyrene resins, polyamide resins, polyimide resins, polyacrylonitrile resins, and polypropylene resins. Examples thereof include polyolefin resins such as polyethylene resins, cycloolefin polymers and cycloolefin copolymers, polyphenylene sulfide resins, polyvinyl chloride resins, polyvinylidene chloride resins, and polyvinyl alcohol resins. The polymer material of the base film 12 may be composed of only one of these, or may be composed of a combination of two or more. Of these, polyethylene terephthalate resin, polyimide resin, polycarbonate resin, poly (meth) acrylate resin, cycloolefin polymer, and cycloolefin copolymer are more preferable from the viewpoint of optical properties and durability. Further, a cycloolefin polymer having a low relative permittivity and low water absorption is particularly preferable.

The base film 12 may be composed of a single layer composed of a layer containing one or more of the above-mentioned polymer materials, or a layer containing one or more of the above-mentioned polymer materials and the layer. It may be composed of two or more layers, such as a layer containing one kind or two or more kinds of polymer materials different from the layer.

[Hard coat layer]
The hard coat layer 14 contributes to improving the scratch resistance of the transparent conductive layer forming base material 10 with a protective layer. The hard coat layer 14 preferably has a pencil hardness of H or higher. Pencil hardness can be measured according to JIS K5600-5-4. As the hard coat layer 14, a known material used as a material for the hard coat layer of a film such as a base material for forming a transparent conductive layer provided on a touch panel can be used. The hard coat layer 14 may be composed of a cured product of a curable composition containing an ultraviolet curable resin from the viewpoint of scratch resistance, productivity and the like.

Examples of the ultraviolet curable resin include monomers, oligomers, prepolymers and the like having an ultraviolet reactive reactive group. Examples of the UV-reactive reactive group include a radically polymerized reactive group having an ethylenically unsaturated bond such as an acryloyl group, a methacryloyl group, an allyl group and a vinyl group, and a cationically polymerizable reactive group such as an oxetanyl group. Can be mentioned. Of these, an acryloyl group, a methacryloyl group, and an oxetanyl group are more preferable, and an acryloyl group and a methacryloyl group are particularly preferable. That is, (meth) acrylate is particularly preferable. In addition, in this specification, "(meth) acrylate" means "at least one of acrylate and methacrylate". "(Meta) acryloyl" means "at least one of acryloyl and methacryloyl". "(Meta) acrylic" means "at least one of acrylic and methacrylic".

Examples of the (meth) acrylate include urethane (meth) acrylate, silicone (meth) acrylate, alkyl (meth) acrylate, and aryl (meth) acrylate. Of these, urethane (meth) acrylate is particularly preferable from the viewpoint of excellent flexibility. When the curable composition for forming the hard coat layer 14 contains urethane (meth) acrylate as an ultraviolet curable resin, for example, the base film 12 is formed from a cycloolefin polymer, a cycloolefin copolymer, or the like, and is relatively Even if it is easily broken, it is easy to suppress the cracking of the base film 12.

The curable composition forming the hard coat layer 14 may or may not contain a non-ultraviolet curable resin in addition to the ultraviolet curable resin. Further, the curable composition forming the hard coat layer 14 contains a photopolymerization initiator. Further, if necessary, an additive or the like to be added to the curable composition may be contained. Examples of such an additive include a dispersant, a leveling agent, a defoaming agent, a stiffening agent, an antifouling agent, an antibacterial agent, a flame retardant, a slip agent, an inorganic particle, and a resin particle. Further, if necessary, a solvent may be contained.

Examples of the non-ultraviolet curable resin include thermoplastic resins and thermosetting resins. Examples of the thermoplastic resin include polyester resin, polyether resin, polyolefin resin, and polyamide resin. Examples of the thermosetting resin include unsaturated polyester resin, epoxy resin, alkyd resin, and phenol resin.

Examples of the photopolymerization initiator include alkylphenone-based, acylphosphine oxide-based, and oxime ester-based photopolymerization initiators. Examples of the alkylphenone-based photopolymerization initiator include 2,2'-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, and 2-hydroxy-2-methyl-1-phenyl-. Propane-1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propane-1-one, 2-hirodoxy-1- {4- [4- ( 2-Hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propane-1-one, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one, 2-benzylmethyl-2- (dimethylamino) -1- (4-morpholinophenyl) -1-butanone, 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- (4-morpholino) Phenyl) -1-butanone, 2- (4-methylbenzyl) -2- (dimethylamino) -1- (4-morpholinophenyl) -1-butanone, N, N-dimethylaminoacetophenone and the like can be mentioned. Examples of the acylphosphine oxide-based photopolymerization initiator include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, and bis (2,6-dimethoxybenzoyl) -2. , 4,4-trimethyl-pentylphosphine oxide and the like. Examples of the oxime ester-based photopolymerization initiator include 1,2-octanedione, 1- [4- (phenylthio) phenyl] -2- (O-benzoyloxime), and etanone-1- [9-ethyl-6- (2). -Methylbenzoyl) -9H-carbazole-3-yl] -1- (O-acetyloxime) and the like can be mentioned. The photopolymerization initiator may be used alone or in combination of two or more.

The content of the photopolymerization initiator is preferably in the range of 0.1 to 10% by mass based on the total solid content of the curable composition. More preferably, it is in the range of 1 to 5% by mass.

Inorganic particles are added, for example, for the purpose of forming surface irregularities on the hard coat layer 14 and adjusting the refractive index to a high level. Further, the resin particles are added for the purpose of forming surface irregularities on the hard coat layer 14, for example. By forming surface irregularities on the hard coat layer 14, it is easy to suppress blocking in which the front surface and the back surface adhere to each other when the transparent conductive layer forming base material 10 with a protective layer is wound in a roll shape. By adjusting the hard coat layer 14 to a high refractive index, it is possible to make it difficult to visually recognize the conductive pattern of the transparent conductive layer to be laminated. The high refractive index means that the refractive index at the measurement wavelength of 589.3 nm is 1.50 or more, preferably in the range of 1.55 to 1.80, and more preferably in the range of 1.60 to 1.70. ..

The types of inorganic particles and resin particles that form surface irregularities on the hard coat layer 14 are not particularly limited. Examples of such inorganic particles include metal oxide particles made of metal oxides such as titanium, zirconium, silicon, aluminum, and calcium. Examples of such resin particles include (meth) acrylic resin, styrene resin, styrene- (meth) acrylic resin, urethane resin, polyamide resin, silicone resin, epoxy resin, phenol resin, polyethylene resin, cellulose and the like. Examples thereof include resin particles made of resin.

In order to form surface irregularities on the hard coat layer 14, the average particle diameter of the inorganic particles and resin particles is preferably equal to or larger than the thickness of the optical adjustment layer 16. More preferably, the thickness of the optical adjustment layer 16 is 1.1 times or more and 20 times or less, more preferably 1.5 times or more and 10 times or less the thickness of the optical adjustment layer 16, and particularly preferably 1. It is 5 times or more and 5 times or less. The average particle size is a volume-based average arithmetic value obtained by a laser diffraction / scattering method according to JIS Z8825.

The thickness of the hard coat layer 14 is not particularly limited, but is preferably 0.5 μm or more from the viewpoint of having sufficient hardness and the like. More preferably, it is 0.75 μm or more. Further, it is preferably 10 μm or less from the viewpoint that curl due to the difference in heat shrinkage with the base film 12 can be easily suppressed. It is more preferably 5 μm or less. The thickness of the hardcourt layer 14 can be measured by spectroscopic interferometry using, for example, a “Filmetics F20 film thickness measuring system” manufactured by Filmometrics. Further, the thickness of the hard coat layer 14 is the thickness of a relatively smooth portion in a portion having no unevenness caused by inorganic particles or resin particles in the thickness direction.

The arithmetic average roughness Ra of the surface on which the surface irregularities of the hard coat layer 14 are formed is preferably in the range of 0.3 to 20 nm from the viewpoint of blocking and the like. More preferably, it is in the range of 0.5 to 10 nm.

Examples of the solvent used in the curable composition forming the hard coat layer 14 include ethanol, isopropyl alcohol (IPA), n-butyl alcohol (NBA), ethylene glycol monomethyl ether (EGM), and ethylene glycol monoisopropyl ether (IPG). , Alcohol-based solvents such as propylene glycol monomethyl ether (PGM) and diethylene glycol monobutyl ether, ketone solvents such as methyl ethyl ketone (MEK), methyl isobutyl ketone (MIBK), cyclohexanone and acetone, aromatic solvents such as toluene and xylene, Examples thereof include ester solvents such as ethyl acetate (EtAc), propyl acetate, isopropyl acetate and butyl acetate (BuAc), and amide solvents such as N-methylpyrrolidone, acetamide and dimethylformamide. These may be used alone as a solvent, or may be used in combination of two or more.

The solid content concentration (concentration of components other than the solvent) of the curable composition may be appropriately determined in consideration of coatability, film thickness and the like. For example, it may be 1 to 90% by mass, 1.5 to 80% by mass, 2 to 70% by mass, and the like.

[Optical adjustment layer]
The optical adjustment layer 16 is adjusted to have a high refractive index, for example, or the hard coat layer 16 is adjusted to a high refractive index and the optical adjustment layer 16 is adjusted to a low refractive index, whereby the conductivity of the transparent conductive layer to be laminated is adjusted. The pattern can be made difficult to see. The high refractive index means that the refractive index at the measurement wavelength of 589.3 nm is 1.50 or more, preferably in the range of 1.55 to 1.80, and more preferably in the range of 1.60 to 1.70. .. The low refractive index means that the refractive index at the measurement wavelength of 589.3 nm is less than 1.50, preferably in the range of 1.30 to 1.50, and more preferably in the range of 1.40 to 1.50. ..

As the optical adjustment layer 16, a known material used as a material for the optical adjustment layer of a film such as a base material for forming a transparent conductive layer provided on a touch panel can be used. The optical adjustment layer 16 may be made of a cured product of a curable composition containing an ultraviolet curable resin from the viewpoint of scratch resistance, productivity and the like.

The curable composition forming the optical adjustment layer 16 may or may not contain a non-ultraviolet curable resin in addition to the ultraviolet curable resin. Further, the curable composition forming the optical adjustment layer 16 contains a photopolymerization initiator. Further, if necessary, an additive or the like to be added to the curable composition may be contained. Examples of such an additive include a dispersant, a leveling agent, a defoaming agent, a stiffening agent, an antifouling agent, an antibacterial agent, a flame retardant, a slip agent, an inorganic particle, and a resin particle. Further, if necessary, a solvent may be contained. The non-ultraviolet curable resin, the photopolymerization initiator, and the solvent can be appropriately selected from those described in the curable composition forming the hard coat layer 14.

Inorganic particles whose optical adjustment layer 16 can be optically adjusted to a high refractive index include oxides of metals such as titanium, zirconium, tin, zinc, silicon, niobium, aluminum, chromium, magnesium, germanium, gallium, antimony, and platinum. Metal oxide particles can be mentioned. These may be used alone as the optically adjustable inorganic particles, or may be used in combination of two or more. Of these, titanium oxide and zirconium oxide are particularly preferable from the viewpoint of excellent compatibility between high refractive index and transparency.

On the other hand, examples of the inorganic particles whose optical adjustment layer 16 can be optically adjusted to have a low refractive index include particles such as magnesium fluoride, silica, silsesquioxane, and calcium fluoride. It is more preferable that these particles have a hollow structure from the viewpoint that they can easily have a low refractive index.

The thickness of the optical adjustment layer 16 is not particularly limited, but is preferably 0.005 μm or more from the viewpoint of excellent film continuity and the like. More preferably, it is 0.010 μm or more. On the other hand, the thickness of the optical adjustment layer 16 is preferably 10 μm or less from the viewpoint that curl due to the difference in heat shrinkage with the base film 12 can be easily suppressed. It is more preferably 5 μm or less. Further, from the viewpoint that curl due to the difference in heat shrinkage with the base film 12 can be easily suppressed, the total thickness of the hard coat layer 14 and the optical adjustment layer 16 is preferably 10 μm or less. The thickness of the optical adjustment layer 16 is the thickness of a relatively smooth portion in the portion where the inorganic particles and the resin particles do not exist in the thickness direction.

The types of the inorganic particles and the resin particles that form the surface irregularities on the optical adjustment layer 16 can be appropriately selected from those described in the curable composition that forms the hard coat layer 14. Further, the solid content concentration of the curable composition forming the optical adjustment layer 16 can be adjusted in the same manner as the curable composition forming the hard coat layer 14.

In order to form surface irregularities on the optical adjustment layer 16, the average particle diameter of the inorganic particles and resin particles is preferably equal to or larger than the total thickness of the optical adjustment layer 16 and the hard coat layer 14. More preferably, the total thickness of the optical adjustment layer 16 and the hard coat layer 14 is 1.1 times or more and 20 times or less, and more preferably 1.5 times or more and 10 times the total thickness of the optical adjustment layer 16 and the hard coat layer 14. Hereinafter, it is particularly preferable that the thickness is 1.5 times or more and 5 times or less the total thickness of the optical adjustment layer and the hard coat layer 14.

[Formation of Hardcourt Layer 14 and Optical Adjustment Layer 16]
The hard coat layer 14 can be formed by applying a composition for forming the hard coat layer 14 on the surface of the base film 12 and drying and curing the hard coat layer 14 as necessary. The optical adjustment layer 16 can be formed by applying a composition for forming the optical adjustment layer 16 on the surface of the hard coat layer 14 and drying and curing the optical adjustment layer 16 as necessary. At this time, in order to improve the adhesion between the base film 12 and the hard coat layer 14, the base film 12 may be surface-treated before the composition forming the hard coat layer 14 is applied. .. Examples of the surface treatment include corona treatment, plasma treatment, hot air treatment, ozone treatment, and ultraviolet treatment.

For the application of the composition forming the hard coat layer 14 and the composition forming the optical adjustment layer 16, for example, a reverse gravure coating method, a direct gravure coating method, a die coating method, a bar coating method, a wire bar coating method, and a roll coating method can be applied. It can be performed by using various coating methods such as a method, a spin coating method, a dip coating method, a spray coating method, a knife coating method, and a kiss coating method, and various printing methods such as an inkjet method, offset printing, screen printing, and flexographic printing. ..

The drying step is not particularly limited as long as the solvent used in the coating liquid can be removed, but it is preferably performed at a temperature of 50 to 150 ° C. for about 10 seconds to 180 seconds. In particular, the drying temperature is preferably 50 to 120 ° C.

Examples of the curing treatment include ultraviolet irradiation. For ultraviolet irradiation, a high-pressure mercury lamp, a non-electrode (microwave method) lamp, a xenon lamp, a metal halide lamp, or any other ultraviolet irradiation device can be used. Irradiation with ultraviolet rays may be carried out in an atmosphere of an inert gas such as nitrogen, if necessary. The amount of ultraviolet irradiation is not particularly limited, but is preferably 50 to 800 mJ / cm ² , and more preferably 100 to 300 mJ / cm ² .

[Protective layer 18]
The protective layer 18 is provided to protect the transparent conductive layer forming base material 11 from damage such as scratches in the process of forming the transparent conductive layer and subsequent steps. In order to prevent damage such as scratches, it is preferable to provide a relatively hard layer on the protected part. However, if a relatively hard layer is provided with respect to the transparent conductive layer forming base material 11, the transparent conductive layer can be formed due to the difference in heat shrinkage between the transparent conductive layer forming base material 11 and the relatively hard layer. In heat treatment such as for crystallization, the base material for forming a transparent conductive layer having a protective layer may be significantly curled. Therefore, in the present invention, by using a material having a small Young's modulus as the protective layer, it is attempted to suppress curling of the base material for forming a transparent conductive layer having the protective layer. That is, the Young's modulus of the protective layer 18 is 12 MPa or more and 100 MPa or less. When the Young's modulus of the protective layer 18 is 100 MPa or less, curling of the transparent conductive layer forming base material 10 with a protective layer can be suppressed. From this viewpoint, the Young's modulus of the protective layer 18 is preferably 95 MPa or less, more preferably 90 MPa or less, still more preferably 80 MPa or less. Further, when the Young's modulus of the protective layer 18 is 12 MPa or more, the strength of the protective layer 18 is ensured, and the protective layer 18 can be prevented from coagulating and breaking and leaving no adhesive residue at the time of peeling. From this point of view, the Young's modulus of the protective layer 18 is preferably 15 MPa or more, more preferably 18 MPa or more.

The protective layer 18 is not particularly limited as long as it is a material having a specific Young's modulus, but the Young's modulus of the protective layer 18 is easily contained within the above-mentioned specific range, tackiness is suppressed, and transparent conductivity is obtained. From the viewpoint that the adhesion between the layer-forming base material 11 and the protective layer 18 can be easily secured, it is preferable to form the plastisol composition containing resin particles and a plasticizer. The plastisol composition is a paste-like composition in which resin particles are dispersed in a plasticizer and is fluid at room temperature. By heat treatment, the resin particles swell with the plasticizer and gel, resulting in a flexible film. It changes to.

Examples of the plasticizer include dimethylphthalate, diethylphthalate, di-n-butylphthalate, diisobutylphthalate, di-n-hexylphthalate, di-n-heptylphthalate, di-2-ethylhexylphthalate, and di-n-octylphthalate. , Phthalate-based plasticizers such as diisononylphthalate, dinonylphthalate, diisodecylphthalate, butylbenzylphthalate, dimethyladipate, di-n-butyladipate, diisobutyladipate, di-n-hexyladipate, di-2-ethylhexyladipate, Adipinate-based plasticizers such as diisononyl adipate and diisodecyl adipate, tri-2-ethylhexyl trimertate, tri-n-octyl lymericate, tridecyl trimellitate, triisodecyl trimellitate, di-n-octyl -Trimerit acid ester plasticizers such as n-decyl trimerilate, polyester plasticizers such as phthalates, trimethyl phosphate, triethyl phosphate, tributyl phosphate, trihexyl phosphate, tributoxyethyl phosphate, trioctyl phosphate, Phthalate-based plastics such as tri-2-ethylhexyl phosphate, triphenyl phosphate, tricresyl phosphate, cresylphenyl phosphate, trixysilyl phosphate, butyldixylenyl phosphate, octyldiphenyl phosphate, tributoxyethyl phosphate, trichloroethyl phosphate, etc. Phthalate-based plasticizers such as acetyltributylcitrate, epoxidized vegetable oil-based plasticizers such as epoxidized soybean oil and epoxidized flaxseed oil, and sevacinate-based plasticizers such as di-2-ethylhexyl sebacate. Be done. As the plasticizer, a phosphoric acid ester-based plasticizer having a high affinity with resin particles is particularly preferable.

The content of the plasticizer is preferably 30 to 42% by mass with respect to 100% by mass of the total amount of the composition forming the protective layer 18. When the content of the plasticizer is 30% by mass or more, it is easy to adjust the viscosity to be suitable for coating. Further, from this viewpoint, the content of the plasticizer is more preferably 38% by mass or more. On the other hand, when the content of the plasticizer is 42% by mass or less, the tackiness of the protective layer 18 is suppressed and the slipperiness is improved. Further, when the base material 10 for forming a transparent conductive layer with a protective layer is stored, blocking of the base material 10 for forming a transparent conductive layer with a protective layer to be overlapped can be suppressed. Further, it is easy to suppress the breakage of the protective layer 18 in the peeling step of the protective layer 18. Further, it is easy to increase the Young's modulus of the protective layer 18 to adjust it within a desired range.

The resin particles are not particularly limited, and examples thereof include particles such as polyvinyl chloride particles, (meth) acrylic resin, and polystyrene resin. Of these, (meth) acrylic resin particles are particularly preferable from the viewpoints of having a small load on the environment, having a good affinity with a plasticizer, and heat resistance. The average particle size of the resin particles is preferably 300 nm to 100 μm, more preferably 500 nm to 50 μm. When the average particle size is 300 nm or more, the storage stability in the plastisol composition is good, and when it is 100 μm or less, the gelation of the resin particles is sufficient and excessive unevenness in the protective layer 18 is suppressed. be able to. The average particle size is a volume-based average arithmetic value obtained by a laser diffraction / scattering method according to JIS Z8825.

The composition forming the protective layer 18 may contain additives, if necessary. Examples of the additive include a dispersant, a leveling agent, a defoaming agent, a stirrer, an antifouling agent, an antibacterial agent, a flame retardant, a slip agent, an inorganic particle and the like. Further, if necessary, a solvent may be contained.

Examples of the inorganic particles that may be contained in the composition forming the protective layer 18 include metal oxide particles made of metal oxides such as titanium, zirconium, silicon, aluminum, and calcium.

The solvent that may be contained in the composition forming the protective layer 18 is not particularly limited as long as it is compatible with the plasticizing agent, but for example, acetophenone, benzyl alcohol, diethylene glycol, diethylene glycol monobutyl ether, diethylene glycol butylmethyl ether, and diethylene glycol monobutyl ether. Acetate, diethylene glycol monoethyl ether, diethylene glycol diethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dimethyl sulfoxide, tripropylene glycol dimethyl ether, triethylene glycol dimethyl ether, ethyl benzoate, ethylene glycol , Ethylene glycol monobutyl ether acetate, 2-ethylhexanol, ethyl acetoacetate, formamide and the like, and solvents having a relatively high boiling point are preferable.

The solid content concentration (concentration of components other than the solvent) of the composition forming the protective layer 18 may be appropriately determined in consideration of coatability, film thickness and the like. For example, it may be 1 to 90% by mass, 1.5 to 80% by mass, 2 to 70% by mass, and the like.

The protective layer 18 may be formed by directly applying the composition forming the protective layer 18 on the other surface of the base film 12, drying and gelling as necessary, or a transfer group. The composition forming the protective layer 18 is applied on the surface of the material, dried and gelled as necessary, and then the formed film is transferred (replaced) onto the other surface of the base film 12. May be formed by. Examples of the transfer substrate include a polymer film, a substrate film such as a glass film, a metal sheet, and a casting roll. It is more preferable to apply the composition forming the protective layer 18 directly on the other surface of the base film 12 because it is advantageous in terms of cost such as omission of the reattachment step.

The protective layer 18 may be formed on the other surface of the base film 12 after the hard coat layer 14 and the optical adjustment layer 16 are formed on one surface of the base film 12. The hard coat layer 14 and the optical adjustment layer 16 may be formed on the other surface of the base film 12 before being formed on one surface.

Examples of the method for applying the composition forming the protective layer 18 include a reverse gravure coating method, a direct gravure coating method, a die coating method, a bar coating method, a wire bar coating method, a roll coating method, a spin coating method, and a dip coating method. , Various coating methods such as spray coating method, knife coating method, and kiss coating method, and various printing methods such as inkjet method, offset printing, screen printing, and flexographic printing.

The heat treatment of the composition forming the protective layer 18 is performed to remove the solvent or the like used in the composition forming the protective layer 18 and gel the plastisol to form a coating film. The heat treatment is preferably performed at a temperature of 80 to 160 ° C. for 10 seconds to 20 minutes. It is more preferably 120 to 160 ° C. for 1 to 15 minutes, and particularly preferably 135 to 150 ° C. for 2 to 12 minutes. When the temperature is 80 ° C. or higher, the resin particles are sufficiently gelled and a protective layer can be formed. Further, when the temperature is 160 ° C. or lower, thermal deterioration of the base film 12 can be suppressed.

The film thickness of the protective layer 18 is preferably 20 to 250 μm. When the film thickness of the protective layer is 20 μm or more, the protective effect of the protective layer 18 is excellent. Further, the breakage of the protective layer 18 is suppressed in the peeling step of the protective layer 18. Further, it is easy to increase the Young's modulus of the protective layer 18 to adjust it within a desired range. From this viewpoint, the film thickness of the protective layer 18 is more preferably 25 μm or more, still more preferably 30 μm or more. Further, when the film thickness of the protective layer 18 is 250 μm or less, the uniformity of the coating film is likely to be ensured and the appearance is likely to be good. In addition, the drying time of the solvent can be shortened. In addition, it is easy to keep the peeling force of the protective layer 18 small in the peeling step of the protective layer 18. From this viewpoint, the film thickness of the protective layer 18 is more preferably 230 μm or less, still more preferably 200 μm or less.

The transparent conductive layer forming base material 10 with a protective layer has a peeling force of 5 mN / 25 mm or more and 1100 mN between the transparent conductive layer forming base material 11 and the protective layer 18 before and after heating at 150 ° C. for 1 hour. It is preferably / 25 mm or less. When the peeling force is 5 mN / 25 mm or more, the protective layer 18 can be suppressed from floating or peeling when the transparent conductive layer is formed, when the transparent conductive layer is crystallized, or when the transparent conductive layer is stored. When the peeling force is 1100 mN / 25 mm or less, the protective layer 18 and the base film 12 are separated in the peeling step of the protective layer 18 even after undergoing a step involving heating such as during the formation of the transparent conductive layer and the subsequent crystallization. It can be easily peeled off without breaking.

According to the transparent conductive layer forming base material 10 with a protective layer having the above configuration, the protective layer 18 formed on the surface of the transparent conductive layer forming base material 11 on the side opposite to the side on which the transparent conductive layer is formed is Young's modulus. Since the ratio is 12 MPa or more and 100 MPa or less, curl after heat treatment is suppressed, and slipperiness and peelability are excellent.

The base material for forming a transparent conductive layer with a protective layer according to the present invention is not limited to the configuration of the base material 10 for forming a transparent conductive layer with a protective layer according to the first embodiment. Hereinafter, other embodiments of the base material for forming a transparent conductive layer with a protective layer according to the present invention will be described.

FIG. 2 shows the base material 20 for forming a transparent conductive layer with a protective layer according to the second embodiment. As shown in FIG. 2, the transparent conductive layer forming base material 20 according to the second embodiment includes a base film 12, a hard coat layer 14 formed on both surfaces of the base film 12, and a hard coat. It has an optical adjustment layer 16 formed on the surface of each layer of the layer 14, and a protective layer 18 formed on one surface of the optical adjustment layer 16. In the transparent conductive layer forming base material 20 with a protective layer, the transparent conductive layer forming base material 21 includes a base film 12, a hard coat layer 14 formed on both surfaces of the base film 12, and a hard coat. It is composed of an optical adjustment layer 16 formed on the surface of each layer of the layer 14. In the transparent conductive layer forming base material 20 with a protective layer, the transparent conductive layer is formed on any one of the other surfaces of the optical adjustment layer 16. Therefore, the protective layer 18 is formed on the surface of the base material 10 for forming the transparent conductive layer, which is opposite to the side on which the transparent conductive layer is formed.

The base material 20 for forming a transparent conductive layer with a protective layer according to the second embodiment has a hard coat layer 14 and an optical adjustment layer 16 as compared with the base material 10 for forming a transparent conductive layer with a protective layer according to the first embodiment. Is different in that is formed on both sides of the base film 12.

Since the base material 20 for forming a transparent conductive layer with a protective layer has a hard coat layer 14 and an optical adjustment layer 16 on both sides of the base film 12, the transparent conductive layer has a transparent conductive layer on both sides of the base film 12. It is suitable as a base material for forming a sex film.

The base material for forming a transparent conductive layer with a protective layer according to the present invention can form a transparent conductive layer to form a transparent conductive film. The transparent conductive layer contains a conductive substance. The conductive substance is not particularly limited, but includes zinc oxide, barium oxide, tin oxide, indium zinc oxide, zinc oxide, ytterbium oxide, yttrium oxide, tantalum oxide, aluminum oxide, cerium oxide, titanium oxide and the like. Metal oxides can be mentioned. Of these, indium tin oxide and zinc indium oxide are particularly preferable from the viewpoint of achieving both transparency and conductivity at a high level.

The thickness of the transparent conductive layer is not particularly limited, but is preferably in the range of 10 to 40 nm. More preferably, it is in the range of 15 to 30 nm.

Examples of the transparent conductive layer include a sputtering method, a vacuum vapor deposition method, a CVD method, and an ion plating method. Of these, the sputtering method is preferable from the viewpoint of stably producing a uniform film with low resistance.

The transparent conductive layer preferably has a step of firing the conductive substance after the film formation in order to promote the crystallization of the conductive substance. The firing method is not particularly limited, but for example, it may be performed by using drum heating for sputtering, a hot air heating furnace, a far infrared heating furnace, or the like. The heating temperature at the time of firing may be appropriately selected according to the type of the conductive substance. For example, the temperature may be 50 to 200 ° C, 80 to 180 ° C, 100 to 160 ° C, or the like. The heating time at the time of firing is not particularly limited, but may be 3 to 180 minutes, 5 to 120 minutes, 10 to 90 minutes, or the like.

In the transparent conductive film, the transparent conductive layer can be used as an electrode of a touch panel. The electrodes of the touch panel are formed by forming a transparent conductive layer into a desired electrode pattern. The electrode pattern can be formed by etching the transparent conductive layer or the like.

The touch panel is configured by using a transparent conductive film, and the transparent conductive layer of the transparent conductive film is used as an electrode of the touch panel. The touch panel is a touch panel such as a capacitance type or a resistance film type. Examples of the touch panel include a GF method and a GF2 method. In the GFF type touch panel, two transparent conductive films having a transparent conductive layer only on one surface side of the base film 12 are bonded to each other with a transparent adhesive, and further transparent. The surface of one of the transparent conductive layers is bonded to a transparent base material such as glass or a resin film by using a suitable pressure-sensitive adhesive. Further, in the GF2 type touch panel, a transparent conductive film formed from a transparent conductive layer forming base material having a transparent conductive layer on both sides of the base film is used as a transparent adhesive to make a transparent group such as glass or a resin film. It consists of glued to the material.

The image display method of the touch panel according to the present invention is not particularly limited, and can be used for any display device such as a liquid crystal display device and an organic EL display device.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

For example, various functional layers such as a gas barrier property improving layer, an antistatic layer, and an oligomer block layer may be provided in advance on the surface of the base film 12 before forming each layer.

Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples.

<Preparation of composition for forming protective layer>
(Composition for Forming Protective Layer 1)
Plastizol composition "NSMF-6580B-2" (manufactured by Noda Screen, (polymethylmethacrylate particles (average particle diameter 3.0 μm) (meth) acrylic resin particles 50% by mass, plasticizer (reaction of phosphorus phenol oxychloride and resorcinol) Dipropylene glycol monomethyl ether (DPM) was added to 40% by mass of the product), titanium oxide particles, thickener, defoaming agent, and solid content concentration of 100% by mass so as to have a solid content concentration of 90% by mass. The composition 1 for forming a protective layer was prepared.

<Manufacturing a base material for forming a transparent conductive layer with a protective layer>
(Examples 1 to 5)
The composition 1 for forming a protective layer is formed on one surface of a cycloolefin polymer film (COP) "Zeonor Film ZF16-50" (manufactured by ZEON Corporation, thickness 50 μm) using a baker-type film applicator, and the film thickness is as shown in the table. After coating so as to be, heat treatment was performed using an oven to form a protective layer. As described above, the base materials for forming the transparent conductive layer with the protective layer of Examples 1 to 5 were produced.

(Examples 6 to 11)
(Resin composition for forming a hard coat layer)
Ultraviolet curable resin composition (“Z-735-35L” manufactured by Aika Industries, (meth) acrylic resin, solvent (ethyl acetate, butyl acetate, and MEK), solid content concentration 50% by mass)) is propylene glycol monomethyl ether. A resin composition for forming a hard coat layer was prepared by diluting with (PGM) so as to have a solid content concentration of 25% by mass.

(Resin composition for forming an optical adjustment layer)
UV curable resin composition ("TYZ-A15-S" manufactured by Toyochem, zirconium particle-containing (meth) acrylic resin, solvent (PGM, MIBK, aliphatic solvent, and cyclohexanone), solid content concentration 40% by mass, high refraction A mixture of 15 g of a hard coat agent and 1 g of polymethyl methacrylate particles (1% by mass MEK dispersion of "Chemisnow MX-80H3wT" manufactured by Soken Kagaku, average particle size 800 nm), and using propylene glycol monomethyl ether (PGM). The resin composition for forming an optical adjustment layer was prepared by diluting the mixture so as to have a solid content concentration of 7% by mass.

(Formation of hard coat layer)
A hard coat layer UV curable resin composition was applied on both surfaces of the base film (cycloolefin polymer film, "Zeonor Film ZF16-100" manufactured by Nippon ZEON, thickness 100 μm), and the thickness after curing was 1.0 μm. After coating with a wire bar so as to be, and drying at 80 ° C. for 1 minute, the coating film is irradiated with ultraviolet rays at a light amount of 200 mJ / cm ² using a high-pressure mercury lamp to cure the coating film with ultraviolet rays. , Formed a hard coat layer.

(Formation of optical adjustment layer)
A resin composition for forming an optical adjustment layer is applied onto the surface of each layer of the hard coat layer using a wire bar so that the thickness after curing is 80 nm, dried at 80 ° C. for 1 minute, and then a nitrogen atmosphere. Below, an optical adjustment layer was formed by irradiating the coating film with ultraviolet rays at a light intensity of 200 mJ / cm ² using a high-pressure mercury lamp to cure the coating film with ultraviolet rays. The amount of curl when the base material for forming the transparent conductive layer was cut into a size of 100 mm × 100 mm and placed on the glass plate so that the transparent conductive layer was in contact with the glass plate was 0 mm.

(Formation of protective layer)
Then, the composition 1 for forming a protective layer is applied onto the surface of one of the optical adjustment layers using a baker-type film applicator so as to have the film thickness shown in the table, and then heat-treated using an oven to obtain the protective layer. Formed. As described above, the base materials for forming the transparent conductive layer with the protective layer of Examples 6 to 11 were produced.

(Comparative Example 1)
Instead of forming the protective layer of Example 6, a polyethylene terephthalate film with an adhesive layer (“MU masking” manufactured by Higashiyama Film Co., Ltd., adhesive layer thickness) on the surface of one of the optical adjustment layers of the substrate for forming a transparent conductive layer. A base material for forming a transparent conductive layer with a protective layer of Comparative Example 1 was prepared in the same manner as in Example 6 except that the pressure-sensitive adhesive layer (10 μm, film thickness 50 μm) was bonded by reciprocating a 2 kg hand roller once. bottom.

(Comparative Example 2)
On one side of the cycloolefin polymer film "Zeonor Film ZF16-50" (manufactured by ZEON Corporation, thickness 50 μm), a polyethylene film having self-adhesiveness ("Tretec 7332" manufactured by Toray Film Processing, thickness 10 μm) is placed in a hand of 2 kg. The rollers were reciprocated once and bonded to prepare a base material for forming a transparent conductive layer with a protective layer of Comparative Example 2.

(Comparative Example 3)
(Composition for Forming Protective Layer 2)
Acrylic adhesive (“BPS6298” manufactured by Toyo Ink, acrylic copolymer, solvent, solid content concentration 43% by mass) with respect to 100 parts by mass of solid content, cross-linking agent (“BXX6105” manufactured by Toyo Ink, isocyanate-based cross-linking agent). , Solid content concentration 37.5% by mass) 5.0 parts by mass, Crosslink retarder (“BXX5638” manufactured by Toyo Ink, acetylacetone) 9.0 parts by mass, Tin catalyst (“BXX3778-10” manufactured by Toyo Ink, Organic tin compound) , Solvent, solid content concentration 2.5% by mass) 1.75 parts by mass was added to prepare a protective layer forming composition 2.

(Formation of protective layer)
The composition 2 for forming a protective layer is shown in the table on the release surface of the first silicone-based PET release film "Clean Sepa HY-PS11" (manufactured by Higashiyama Film, thickness 25 μm) using a baker type film applicator. After coating to the film thickness of, the protective layer is formed by heat treatment using an oven, and then the second silicone-based PET release film "Clean Sepa" is placed on the surface of the protective layer opposite to the PET release film. The release surface of "HY-PS11" (manufactured by Higashiyama Film, thickness 25 μm) was bonded. Next, the second release film is peeled off from the protective layer, and a 2 kg hand roller is placed on one surface of the cycloolefin polymer film (COP) "Zeonor Film ZF16-50" (manufactured by ZEON Corporation, thickness 50 μm). The protective layer was reciprocated and bonded, and the first release film was peeled off from the protective layer to prepare a base material for forming a transparent conductive layer with a protective layer of Comparative Example 3.

(Film thickness of protective layer)
The film thickness of the protective layer was determined using a thickness measuring machine "TH-104" manufactured by Tester Sangyo.

<Heat treatment of the base material for forming a transparent conductive layer with a protective layer>
The substrate for forming a transparent conductive layer with a protective layer of Examples 1 to 11 and Comparative Examples 1 to 3 is cut into a size of 100 mm × 100 mm and placed on the glass plate so that the protective layer is in contact with the glass plate. , Heated at 150 ° C. for 1 hour using an oven. After that, it was taken out from the oven and cooled to room temperature while being placed on a glass plate.

(Young's modulus of the protective layer)
Immediately after the protective layer is formed and after the heat treatment, the Young's modulus of the protective layer is determined by peeling the protective layer from the base material for forming the transparent conductive layer with the protective layer and cutting it into a size of 2 cm × 10 cm. Using the testing machine "Autograph AG-IS", the protective layer was pulled from 0 point at a distance of 5 cm between chucks in an environment of 23 ° C. and 50%, with a peeling speed of 300 mm / min until the elongation of the protective layer reached 200%. The slope of the tangent line was calculated and used as Young's modulus.

(Peeling force between the protective layer and the base material for forming the transparent conductive layer)
Immediately after the protective layer is formed and after the heat treatment, the peeling force between the protective layer and the transparent conductive layer forming base material is such that the base material side of the transparent conductive layer forming base material with the protective layer cut to 25 mm × 100 mm. Attach it to a stainless steel support plate using double-sided tape, and use Shimadzu's precision universal testing machine "Autograph AG-IS" in an environment of 23 ° C and 50%, peeling speed 0.3 m / min, peeling angle 180. The peeling force was measured at °.

(Amount of curl during heat treatment)
The amount of curl during the heat treatment is the distance between the glass plate and the part farthest from the glass plate of the transparent conductive layer forming base material in the oven at 150 ° C. after heating at 150 ° C. for 1 hour in the above heat treatment. It was obtained by measuring with a ruler.

(Amount of curl after heat treatment)
For the amount of curl after the heat treatment, the transparent conductive layer forming base material with the protective layer after the heat treatment is placed on the glass plate so that the protective layer is in contact with the glass plate, and the glass of the transparent conductive layer forming base material is placed. The distance between the farthest part from the plate and the glass plate was determined by measuring with a ruler.

(Appearance of application)
As for the appearance of the protective layer, the base material for forming the transparent conductive layer with the protective layer is visually evaluated, and the one in which a uniform film without unevenness is formed is marked with "○", and the uneven pattern is generated. The thing was set as "x".

(Slippery)
The slipperiness of the base material for forming a transparent conductive layer with a protective layer is such that the protective layer of the base material for forming a transparent conductive layer with a protective layer cut to 70 mm × 100 mm and 100 mm × 200 mm and the opposite surface of the protective layer are combined. A 200 g weight was placed on top of each other, and the transparent conductive layer forming substrate with a protective layer on the side in contact with the weight was pulled at a speed of 150 mm / min using Shimadzu's "Autograph AG-IS", and the required force was applied. When is less than 1N / 25mm, it is evaluated as “◯”, and when it is 1N / 25mm or more, it is evaluated as “x”.

From Examples and Comparative Examples, the substrate for forming a transparent conductive layer, which is a substrate for forming a transparent conductive layer, has a protective film on the surface opposite to the side on which the transparent conductive layer is formed, with a protective film. In the base material for forming a transparent conductive layer, the protective layer is formed from a plastisol composition containing resin particles and a plasticizer, and the young ratio of the protective layer is 12 to 100 MPa, so that the curl after heat treatment is achieved. It can be seen that is excellent in slipperiness and peelability.

In Comparative Example 1, since the Young's modulus of the protective layer (PET film) was large, it was greatly curled after heating due to the difference in the linear expansion coefficient and the thermal shrinkage rate between the protective layer and the substrate for forming the transparent conductive layer. In Comparative Example 2, since the Young's modulus of the protective layer (PE film) was large, it was greatly curled after heating due to the difference in the linear expansion coefficient and the thermal shrinkage rate of the protective layer and the substrate for forming the transparent conductive layer. In addition, the peeling force after the heat treatment increased, and when the protective layer (PE film) was peeled off from the transparent conductive layer forming base material, the transparent conductive layer forming base material broke. Therefore, the Young's modulus after heating could not be measured. In Comparative Example 3, since the protective layer was not formed from a plastisol composition containing resin particles and a plasticizer, Young's modulus was as low as 9.8 MPa, and when the protective layer was peeled off from the transparent conductive layer forming substrate. The protective layer broke. In addition, the protective layer has a tacky feeling and is inferior in slipperiness.

Although the examples of the present invention have been described above, the present invention is not limited to the above examples, and various modifications can be made without departing from the spirit of the present invention.

10, 20 Base material for forming a transparent conductive layer with a protective layer 12 Base film 14 Hard coat layer 16 Optical adjustment layer 18 Protective layer 11,21 Base material for forming a transparent conductive layer

Claims (9)

A base material for forming a transparent conductive layer, which is a base material for forming a transparent conductive layer, and a protective layer formed on a surface opposite to the side on which the transparent conductive layer is formed. Have,
The protective layer is formed of a plastisol composition containing resin particles and a plasticizer.
A base material for forming a transparent conductive layer with a protective layer, wherein the Young's modulus of the protective layer is 12 MPa or more and 100 MPa or less. The base material for forming a transparent conductive layer with a protective layer according to claim 1, wherein the resin particles are composed of a (meth) acrylic polymer. The base material for forming a transparent conductive layer with a protective layer according to claim 1 or 2, wherein the plasticizer is a phosphoric acid ester-based plasticizer. The base material for forming a transparent conductive layer with a protective layer according to any one of claims 1 to 3, wherein the protective layer has a film thickness of 20 μm or more and 250 μm or less. Claims 1 to 4 have a peeling force between the transparent conductive layer forming substrate and the protective layer before and after heating at 150 ° C. for 1 hour, both of which are 5 mN / 25 mm or more and 1100 mN / 25 mm or less. The base material for forming a transparent conductive layer with a protective layer according to any one of the above items. The transparent conductive layer forming base material comprises a base film, a hard coat layer formed on one surface of the base film, and an optical adjustment layer formed on the surface of the hard coat layer. Have and
The base material for forming a transparent conductive layer with a protective layer according to any one of claims 1 to 5, wherein the protective layer is formed on the other surface of the base film. The base material for forming the transparent conductive layer is a base film, a hard coat layer formed on both surfaces of the base film, and an optical adjustment layer formed on the surfaces of each layer of the hard coat layer. And have
The base material for forming a transparent conductive layer with a protective layer according to any one of claims 1 to 5, wherein the protective layer is formed on one of the surfaces of the optical adjustment layer. The base material for forming a transparent conductive layer with a protective layer according to any one of claims 1 to 7, wherein the base film is made of a cycloolefin polymer. A protective layer forming composition is applied to form a protective layer on the surface of the transparent conductive layer forming base material which is a base material for forming the transparent conductive layer and which is opposite to the side opposite to the side where the transparent conductive layer is formed. , A method for manufacturing a base material for forming a transparent conductive layer with a protective layer.

Images