KR20210066983A - A metal card having both contactless and contact card functions and the method thereof - Google Patents

Abstract

The present invention relates to a metal card and a manufacturing method thereof, having a contactless type card function and a contact type card function, such as an RF function or an NFC function, while having a beautiful appearance without being easily bent since a card body is metal. The metal card according to the present invention is for increasing a response distance by forming a slit from a mini inlay mounting hole of the metal card body to an outer edge unit while increasing the rigidity by attaching an insert unit to the slit. The metal card comprises: a slit formed from the inlay mounting hole to the outer periphery of the metal card body (MCB); an insert unit receiving groove formed in a portion of the slit to have a larger width than the slit; and an insert unit seated in the insert unit receiving groove and adhered to the body of the metal card body, wherein the insert unit is configured such that at least a portion of a surface thereof is non-conductive, so that the conductive breaking function formed by the slit is maintained while strengthening the mechanical strength interrupted by the slit at the same time.

Description

A contactless metal card and its manufacturing method {A METAL CARD HAVING BOTH CONTACTLESS AND CONTACT CARD FUNCTIONS AND THE METHOD THEREOF}

The present invention relates to a contactless metal card and a method for manufacturing the same, and more particularly, a metal card having a contactless card function such as an RF or NFC function, which is not easily bent because the card body is metal, has a long response distance and has robustness, and its It relates to a manufacturing method.

In particular, the present invention is to provide a novel and unique technical idea for a metal card body used in such a contactless metal card and a method for manufacturing the same.

In general, a card is classified into a magnetic card using a magnetic strip, a smart card using an IC chip, and a hybrid card combining them according to a recording method, and a smart card is classified into a contact type and a contactless type and a combination card using them according to a reading method. , again, the contactless type is classified into a proximity communication (NFC) card that can be read only from a distance within a few to several tens of cm and an RF card that can be read from a longer distance. In general, these methods are often provided with overlap. Hereinafter, in the present specification, the NFC for short distance and RF for long distance are not largely distinguished, and in some cases, they are collectively referred to as 'RF' or 'contactless', and all contactless cards including NFC chips for short distances or RF chips for long distances are referred to as 'RFID'. referred to as '.

On the other hand, in general, plastic cards are issued to specific members to defer collection of goods and services for a certain period of time, and are mainly used for cash such as credit cards, cash cards, and transportation cards. As a substitute for or widely used as various medical cards and membership cards, various types of plastic cards differentiated according to customers' credit ratings are being provided to customers in modern times.

Among them, special cards such as gold and platinum cards, which are produced for VIP customers with high credit ratings, are painted in gold or silver color so that they can feel higher quality.

However, in the above-mentioned special cards, gold powder or silver powder is mixed with the pigment so that gold and silver light are expressed by the printing method, so pure gold or silver powder mixed with the pigment is not used. Not only that, but also because other pigments and adhesives were mixed, it was not possible to obtain the high-gloss texture emitted from pure metal.

In addition, gold and silver powder, unlike pure metals that never change their luster or texture, have properties such as deterioration due to humidity or temperature conditions. Because of the disadvantages, it was not possible to provide high-quality cards in the end.

Furthermore, in recent years, there is a movement to replace the plastic card with a thick metal plate for VVIP customers, which is the highest level of customer base.

1 is for a plastic card having a metal thin film proposed to solve the above problems of the plastic card, and relates to the registered utility model No. 0382725. That is, in the first prior art, a metal thin film 12 is attached to the upper surface of the core sheet 13 made of a synthetic resin such as PVC, and the metal thin film 12 is smaller in size than the core sheet 13 . A blank 13a is formed around the upper surface of the core sheet 13 to form a corresponding shape.

An antenna coil 21 is installed along the periphery of the upper blank 13a of the core sheet 13, and the antenna coil 21 is installed in a continuously wound state.

Both ends of the antenna coil 21 are connected to the IC chip 20 fixed inside the core sheet 13, and the reader reads various information stored in the IC chip 20 while communicating with a reader (not shown). is made to be understood.

A transparent upper coated paper 11 is attached to the upper surface of the core sheet 13 , and a printed layer 11a is formed on the lower surface of the upper coated paper 11 . Various pictures or characters related to the card company are printed on the printing layer 11a.

A transparent lower coated paper 14 is attached to the lower surface of the core sheet 13 , and a printed layer 14a is formed on the upper surface of the lower coated paper 14 . Various pictures or characters related to the card company are also printed on the printing layer 14a.

On the other hand, the metal thin film 12 attached to the upper and lower surfaces of the core sheet 13 is formed of a thin foil, that is, about 0.02 to 0.1 mm by using a conventional rolling mill after melting and alchemizing the metal material. A thin film having a thickness of , was used, and the metal material is a noble metal such as pure gold (Au), platinum (Pt), silver (Ag), and nickel (Ni) that emits high gloss while having good ductility and malleability. was used. Of course, in some cases, two or more of the metal materials may be alloyed and used.

In the first prior art having the above configuration, the metal thin films 12 thermally bonded to the upper and lower surfaces of the core sheet 13 are protected by the transparent upper and lower coated papers 11 and 14, and the high As the luster is emitted, it is possible to realize a plastic card with a more elegant and high-quality feel, and the metal thin film 12 made of pure metal material prevents discoloration and deterioration even after long-term use, so that high gloss can be maintained at all times. There are certain advantages such as being able to maximize the external competitiveness of plastic cards.

In addition, the antenna coil 21 is installed in the blank 13a of the core sheet 13 formed around the metal thin film 12 so that the antenna coil 21 can communicate with the reader without being disturbed by the metal thin film 12 . Therefore, it is possible to apply the high-gloss metal thin film 12 not only to the plastic card 1 to which the magnetic tape 30 is attached but also to the plastic card 1 having the IC chip 20 embedded therein.

However, in the first prior art, for RF communication, a blank 13a must be formed around the upper surface of the core sheet 13 while the metal thin film 12 has a smaller size than the core sheet 13, and the It is a structure that has no choice but to wind the antenna coil 21 on the upper blank 13a, and thus the metallic aesthetic feeling due to the blank is halved, and the binding force between the core sheet and the upper coated paper due to the antenna coil in the blank part is also It is lowered, and above all, there is not enough consideration for the bonding between the metal thin film, the core sheet, and the coated paper, so it is only an idea and has not been mass-produced.

For reference, even in the first prior art, in recognizing the above problem, the upper and lower coated papers 11 and 14 are printed with ink mixed with metal powder, and the edge of the color corresponding to the metal thin film 12 is printed. When the printed layers 11b and 14b are formed, the antenna coil 21 fixed around the core sheet 13 is prevented from being exposed to the outside through the upper and lower coated papers 11 and 14, so that the entire plastic card 1 ), although additional proposals are being made to maintain a beautiful appearance, the metal powder content should be 30% or less in order for the antenna coil 21 to communicate with the reader. It can never match the beautiful texture and durability of the card.

On the other hand, as a kind of such a metal card, Korean Patent No. 0516106 (a credit card having a gold foil layer formed thereon and a manufacturing method thereof) is disclosed, in which the size of the gold foil is the same as that of the card, but in the case of the above technology, It is also known from the first prior art that the flux generated from the antenna on the core generates an induced flux in the opposite direction by the gold foil, and consequently the RF function cannot be actually exhibited by the cancellation of the flux.

On the other hand, Korean Patent Laid-Open No. 2013-0006358 (metal card and manufacturing method thereof) discloses that an actual metal layer is formed without forming a transparent plastic coating layer on the outermost side, but maximizes the visual effect of the appearance by anodizing technique, and also Although anodizing is performed to insulate even a stepped etched area accommodating an IC chip, this is a technology related to a contact type card accommodating a contact type IC chip to the last.

And even then, there is a problem that static electricity is generated between the metal part of the card and the terminal by using the metal card in the terminal many times, and thus an error may occur according to the use of the card, and anodizing is performed for the etched area. When performing the anodizing process, there is a problem in that the anodizing process can only be made thin at the corners of the etching area, so that the insulation from the metal card sheet material may not be good due to the attachment of the contact type IC chip.

Above all, in the case of the subsequent prior art including the first prior art, there was a fatal disadvantage that a contactless card function such as an RF or NFC function cannot be exhibited when manufactured as a metal card forming a metal layer on the entire size of the card.

On the other hand, as a second prior art, Japanese Patent Laid-Open No. 2006-270681 (portable device) discloses, a portable device capable of suppressing variations in communication characteristics between an antenna module and a reader/writer in close confrontation with each other. 2, the metal layer 30 is formed on the incident side of the electromagnetic wave radiated from the reader/writer rather than the communication surface CS of the antenna module 10 built into the terminal body 22. By providing, a technique for securing a communication state for inducing a communication magnetic field to the antenna coil 15 of the antenna module 10 in the metal layer 30 is disclosed. At this time, the metal layer 30 is pasted at predetermined positions inside and outside the terminal to be composed of copper foil or the like. Accordingly, when the reader/writer and the terminal body 22 are close to each other, there is an advantage in that a communication defect due to the positional relationship between the reader/writer can be suppressed.

That is, FIG. 2 is a diagram showing the state of communication between the portable information terminal 21 and the reader/writer in proximity of the second prior art. In FIG. 2 , some magnetic field H among the electromagnetic waves emitted from the transmitting/receiving antenna 26 of the reader/writer is affected by a metal object such as a battery pack 25 in the terminal body 22 and acts as an attenuation by reflection, absorption, etc. receive Since the metal layer 30 is disposed on the incident side of the electromagnetic wave rather than the communication surface CS of the antenna module 10, an induced current (eddy current) is generated by the application of an external magnetic field to the surface of the metal layer 30, and due to this The generated magnetic field H1 generates an induced current in the antenna coil 15 of the antenna module 10 .

In the second prior art, by disposing the metal layer 30 close to the antenna module 10 so as to cover a part of the antenna coil 15, the reader/writer through the magnetic field component H1 generated in the metal layer 30 An inductive coupling between the transmitting/receiving antenna 26 and the antenna coil 15 of the antenna module 10 is performed.

Thus, the second prior art antenna device shown in FIG. 2 is an attempt to solve a problem in which communication characteristics fluctuate greatly depending on the magnitude of the position difference between the centers of the antennas when the distance from the antenna of the communication counterpart is very close. will be.

However, the magnetic flux that is about to link with the antenna coil 15 of the antenna module 10 on the portable information terminal 21 side and the transmission/reception antenna 26 on the reader/writer side is caused by a metal object such as the battery pack 25 inside the case. In order to solve the blocking of the magnetic flux, it cannot be said that a large effect can be obtained depending on the position of the metal layer 30 for inducing magnetic flux or the positional relation of the obstacles such as the battery pack 25 . In addition, there is a limitation that the metal layer 30 does not effectively act to expand the communication distance when the antenna device and the antenna of the communication counterpart are separated from each other.

On the other hand, in order to solve the problems of the second prior art, as a third prior art, a technique such as Japanese Patent No. 4947217 (Antenna Device and Mobile Phone) is disclosed.

The third prior art is an antenna device installed inside or outside the mobile phone case 1, which enables stable communication with a relatively small size compared to the antenna of the communication counterpart, and increases the maximum communication distance. As 101, as shown in FIG. 3A, a conductor having a loop-shaped or spiral coil conductor having a winding center as a coil opening, a conductor opening CA, and a slit SL connecting the conductor opening and the outer edge. layer (2), wherein when the coil conductor is viewed in plan view, the coil opening and the conductor opening are overlapped, the area of the conductor layer being larger than the area of the forming region of the coil conductor, in plan view, the The distance from the outside of the conductor opening to the outer edge of the coil conductor is greater than the distance from the inner edge of the conductor opening to the inner edge of the coil conductor, and the slit is disposed close to the end so that the slit faces toward the end of the case, and , connecting between the outer edges of the conductor layer closest to the outside of the conductor opening, wherein the conductor layer is formed of a metal film or metal foil or metal formed on the inner or outer surface of the case.

Thus, according to the third prior art, current flows in the conductor layer to block the magnetic field generated by the flow of current in the coil conductor, and the current flowing around the opening of the conductor layer passes through the periphery of the slit portion, and the edge Due to the effect, current flows around the conductor layer, and thus a magnetic field is generated in the conductor layer to increase the communication distance. In addition, since the conductor layer greatly rotates the magnetic flux, the maximum distance between the antenna device and the communication counterpart antenna through which the magnetic flux arrives from the antenna device to the antenna of the communication partner or from the antenna of the communication partner to the antenna equipment is increased.

However, as shown in FIG. 3B , conductor openings CA and slits 2S are formed in the planar conductor 2 of the third prior art, and in the coil-shaped conductor 31, the coil opening is the conductor opening. It is arranged so as to overlap with (CA), and when a current indicated by a solid arrow flows through the coil-shaped conductor 31, a current indicated by a broken-line arrow is induced in the planar conductor 2, in regions A1, A2, A3. , A4, the direction of the current flowing through the coil-shaped conductor 31 and the current flowing through the planar conductor 2 coincide, but in the region B, the current flowing through the coil-shaped conductor 31 and the current flowing through the planar conductor 2 Since the direction of the current is reversed, there is a problem in that the inductance of the antenna (coil) decreases and communication characteristics deteriorate due to the existence of a region in which the direction of the current is opposite as described above. In addition, since the amount of induced current generated varies depending on the attachment position of the coil-shaped conductor 31 and the planar conductor 2 or the distance difference between the coil-shaped conductor 31 and the planar conductor 2 at the time of attachment, There is a problem that the inductance values are easily different.

In order to solve the problems of the third prior art, as a fourth prior art, Korean Patent No. 1470341 (Antenna device and wireless communication device) solves the problem of the decrease and deviation of the inductance of the antenna device in the power supply circuit. In order to provide an antenna device, as shown in FIG. 4 , a feeding coil 3 and a planar conductor 2 are provided.

At this time, the power feeding coil 3 includes a magnetic core 32 and a coil-shaped conductor 31 wound around the magnetic core 32 . The coil-shaped conductor 31 may be a conducting wire (wound conductor) wound around a magnetic core 32, a laminate formed by laminating a plurality of dielectric layers, a laminate formed by laminating a plurality of magnetic material layers, or one or more A conductor pattern formed in a laminate formed by laminating a dielectric layer and one or a plurality of magnetic layers may be used. In particular, since a small size and surface-mountable power supply coil can be configured, a coil-shaped conductor 31 with an in-plane conductor pattern and an interlayer conductor pattern in a laminate formed by laminating a plurality of magnetic layers (for example, ferrite ceramic layers) ), which is preferably a chip-type power supply coil.

An RFIC 13 serving as a power feeding circuit is connected to the power feeding coil 3 . That is, one end and the other end of the coil-shaped conductor 31 are respectively connected to two input/output terminals of the RFIC 13 . The RFIC 13 is an RFIC chip for NFC, and is a semiconductor IC chip that processes high-frequency signals for NFC.

The planar conductor 2 has a larger area than the power supply coil 3 . That is, when viewed from the normal direction of the planar conductor 2, the outer dimension of the planar conductor is larger than the outer dimension of the power supply coil. The planar conductor 2 is formed with a slit 2S extending inward from a part of the outer edge. In the fourth prior art, the slit 2S has a predetermined width from one end to the other end, but the width is not necessarily constant.

In the fourth prior art, the planar conductor 2 is a metal housing part (metal cover part) of the communication terminal housing, on the lower surface of the planar conductor 2 in the state shown in FIG. 4, that is, inside the communication terminal housing. A power supply coil 3 is disposed. In the power feeding coil 3 , the winding axis direction of the coil-shaped conductor 31 is arranged different from the normal direction of the planar conductor 2 . More specifically, it is arrange|positioned so that the winding axis of the coil-shaped conductor 31 may become parallel with respect to the planar conductor 2 .

Moreover, the power feeding coil 3 is arrange|positioned so that the coil opening of the power feeding coil 3 may face the slit 2S side while the coil opening approaches the slit 2S. That is, the power supply coil 3 is arranged so that the magnetic flux passing through the slit 2S of the planar conductor 2 can pass through the coil opening, in other words, the coil opening is visible from the slit 2S.

The planar conductor 2 is not limited to the metal housing portion, and may be a conductor film formed on an insulating substrate or a conductor layer formed on the insulating substrate. That is, the planar conductor 2 may be various metal plates such as a ground conductor mounted on a communication terminal, a metal chassis or shield case, and a metal cover of a battery pack, or may be a flat pattern made of a thin metal film provided on a flexible sheet. When the planar conductor 2 is a metal thin film pattern provided on a flexible sheet, it may be attached to the inside of a back cover of the communication terminal through an adhesive or the like. It is to be noted that the planar conductor 2 may be a conductor having a planarly wide surface, and it is not necessarily necessary to be flat (a curved surface may be sufficient).

As shown in Fig. 4, the RFIC 14 is connected to the antenna coil 4 of the communication counterpart of the fourth prior art. When the planar conductor 2 approaches the antenna coil 4 of the communication partner, an induced current is generated in the planar conductor 2, and this current moves mainly along the edge of the planar conductor 2 according to the edge effect. flows along That is, a current (overcurrent) flows in a direction that prevents passage of the magnetic flux generated by the antenna coil 4 . The magnetic flux ?1 in FIG. 1 represents the magnetic flux passing through the antenna coil 4 .

The slit 2S is also a part of the edge, and the current density of the part along the edge of the slit 2S becomes high. And the smaller the gap between the slits 2S, the higher the magnetic field strength in the vicinity of the slits 2S. The magnetic flux ?2 in FIG. 4 represents the magnetic flux passing through the slit 2S. A part of the magnetic flux ?2 is linked to the power supply coil 3 . In addition, although a magnetic field due to a current flowing along the outer peripheral edge of the planar conductor 2 is also generated, the power supply coil 3 is sufficiently far from the outer peripheral edge of the planar conductor 2, so mainly the slit 2S It is strongly coupled with the magnetic field in the vicinity. (The coupling is not canceled by coupling with the magnetic field near the edge of the outer periphery.)

In this way, the planar conductor 2 acts as a magnetic field trapping element (radiator), and the power supply coil 3 is magnetically coupled to the communication partner antenna coil 4 via the planar conductor 2 . Further, since the coil opening surface of the coil-shaped conductor constituting the feeding coil does not face the planar conductor, and only a part of the coil-shaped conductor is close to the planar conductor, in other words, when viewed from the winding axis direction of the coil-shaped conductor , since the coil-shaped conductor has a part that is close to the plane conductor and a part that is farther away from the planar conductor, even if the relative positional relationship between the feeding coil 3 and the planar conductor 2 changes slightly, the inductance value of the feeding coil 3 is doesn't change much Therefore, it is possible to realize an antenna device having a small manufacturing variation.

The coil opening of the power feeding coil 3 may be disposed so as to face the slit 2S side, but as shown in FIG. 4, the coil winding axis of the power feeding coil 3 extends in the extending direction (extending) of the slit 2S. direction), the coupling efficiency with the magnetic flux .phi.2 generated in the slit 2S is maximized.

Indeed, according to the fourth prior art, it can be said that an effective device for an antenna device having a metal layer is provided.

However, nevertheless, the fourth prior art provides a solution in a communication device having a relatively large size, such as a mobile terminal, and is difficult to apply when the thickness is less than 1 mm like a conventional credit card. It is difficult.

Furthermore, in recent years, as shown in FIGS. 24 (a) and (b), various mini SIM chips are used as a substitute for various contactless cards, and furthermore, in FIG. 24 (c) As you can see, a smaller size Micro SIM chip is also used. Of course, as shown in (d) of FIG. 24 , a smaller-sized nano-SIM chip is also used, but it is unreasonable to apply it to the nano-SIM chip in the present invention, but a mini-SIM chip and a micro-SIM chip. Applicable in the case of chips.

In other words, the modular inlay with a built-in antenna in the USIM size form had a good response distance only when the booster coil was made on the outside. In particular, since the surface of the IC chip is made of metal, the back side of the metal is shielded with ferrite, etc. to realize a certain response distance, but the distance is reduced with the metal side, which limits its use in wireless communication. To improve this, there was not much room (about 1-2mm) to implement the coil antenna on the outside of the metal surface, so it was difficult to make the antenna pattern.

Registered Utility Model No. 0382725 (metal thin film plastic card) Japanese Patent Laid-Open No. 2006-270681 (mobile device) Japanese Patent No. 4947217 (Antenna Device and Mobile Phone) Korean Patent No. 1470341 (Antenna Device and Wireless Communication Device)

The present invention is to solve the above problems, and its purpose is for VVIP customers, who are the highest-class customers, because the card body is metal, so it is not easily bent and has a beautiful appearance. A metal card having a card function and a manufacturing method thereof are provided, but the problem in the third prior art is solved by forming a slit from the mini inlay mounting hole of the metal card body to the outer edge, and at the same time, by attaching an insert to the slit It is also intended to solve the problems of the fourth prior art as well.

The above and other additional objects will be apparent to those skilled in the art without departing from the spirit of the present invention by the appended claims.

In order to achieve the above object, the metal card body used for the contactless metal card having a mounting hole in which the inlay is mounted according to the first aspect of the present invention is formed from the inlay mounting hole of the metal card body (MCB) to the outer periphery. slit; an insert seating groove formed in a portion of the slit to have a larger width than the slit; and an insert seated in the insert receiving groove and adhered to the body of the metal card body; Including, wherein at least a portion of the surface of the insert is non-conductive, so that the conductive breaking function formed by the slit is maintained while at the same time strengthening the mechanical strength interrupted by the slit.

Preferably, in the insert, a portion of the metal card body bonded to the body is surface-treated to be non-conductive, so that the conductive breaking function formed by the slit is maintained while at the same time strengthening the mechanical strength disconnected by the slit. characterized.

Also preferably, the insert is aluminum, and the surface is anodized.

Also preferably, the insert is characterized in that it is adhered to the insert seating groove by a hot melt adhesive.

Also preferably, the adhesive is an epoxy-based adhesive.

On the other hand, a contactless metal card according to a second aspect of the present invention for achieving the above object, the contactless metal card body for the metal card; first and second printed layers 30 and 30' respectively formed on upper and lower sides of the metal card body (MCB); and first and second print protection layers 40 and 40' provided on the outside of the first and second print layers 30 and 30'; It is characterized in that it includes.

On the other hand, in the method for manufacturing a metal card body for a non-contact type metal card according to the third aspect of the present invention for achieving the above object, (a) preparing the metal card body 10 (S12), and substantially conductive forming a slit (10b) having a width sufficient to be weakened or cut off, and forming an insert seating groove (10a) (S14); (b) preparing a metal insert 60 having at least a portion of the surface of which is non-conductive (S22); (c) inserting the metal insert 60 together with the adhesive 16 into the insert seating groove 10a and performing pre-lamination (S24); It is characterized in that it includes.

On the other hand, in order to achieve the above object, a method for manufacturing a contactless metal card according to a fourth aspect of the present invention is a method for manufacturing a contactless metal card having a metal card body for a contactless metal card, (a) a metal card body Preparing (10) (S12), forming a slit (10b) having a width sufficient to substantially weaken or cut off conductivity, and forming an insert seating groove (10a) (S14); (b) preparing a metal insert 60 having at least a portion of the surface of which is non-conductive (S22); (c) inserting the metal insert 60 together with the adhesive 16 into the insert seating groove 10a and performing pre-lamination (S24); (d) forming an inlay mounting hole (10a) through a portion connected to the slit (S26); (e) inserting the inlay into the inlay mounting hole (10a) (S31), and applying the hot melt films (15, 15') to the upper and lower layers, followed by performing a third pre-lamination (S33); (f) After the inlay is inserted and the top and bottom printing layers 30 and 30' and the printing protection layer on the top and bottom layers are applied again to the upper and lower sides of the metal card body 10 to which the hot melt film is glued on the upper and lower sides , performing a final lamination step (S43); It is characterized in that it includes.

Also preferably, the lamination in step (f) is characterized in that the lamination is performed while using a higher temperature and pressure conditions of several steps for a longer time than the lamination in step (c).

Also preferably, in the lamination of step (f), (f1) in the first section, while gradually increasing the temperature from room temperature to the temperature of the first step, the pressure is the first step, (f2) the second step In the section, the pressure of the first step is maintained while maintaining the temperature of the first step as it is, and (f3) in the third section, the temperature is raised to the second step temperature higher than the first step temperature, and the pressure is also the first step pressure The second step pressure is higher than that, and (f4) the temperature is gradually lowered to room temperature in the finishing section, but rather the pressure is maintained at the third step pressure higher than the second step pressure.

According to the non-contact metal card according to the present invention, a non-contact metal card such as RF or NFC function is possible while having a beautiful appearance without being easily bent because the entire surface is metal, and while the recognition distance is increased by the slit, the As the insert is padded, it is also possible to prevent bending easily.

On the other hand, additional features and advantages of the present invention will become clearer through the following description.

1 is an exploded perspective view of a metal thin film plastic card of the first prior art.
Fig. 2 is a cross-sectional view showing a state of communication between a second prior art portable information terminal and a reader/writer in proximity;
Figure 3a is a mobile phone having an antenna device according to the third prior art, (A) is the back of the mobile phone, (B) is an inner plan view of the rear lower case.
3B is a plan view of an antenna device according to a third prior art;
4 is a perspective view of an antenna device and an antenna coil of a communication counterpart according to a fourth prior art;
5 is a cross-sectional view of a contactless metal card according to the first prior application.
Figure 6 is a plan view of the separated state of the contactless metal card according to the first prior application invention.
7 is a cross-sectional view of the mini-combi PCB used in the contactless metal card according to the first prior application.
8 is a plan view and a bottom view of a mini-combi PCB used in a contactless metal card according to the first prior application.
9 is a cross-sectional view of the mini-combi inlay used in the contactless metal card according to the first prior application.
10 is a plan view and a bottom view of a mini-combi inlay used in a contactless metal card according to the first prior application;
11 is a cross-sectional view after the third lamination of the mini-combi inlay used in the contactless metal card according to the first prior application.
12 is a plan view and a bottom view of the mini-combi inlay used for the contactless metal card according to the first prior application after the third lamination.
13 is a flowchart of a manufacturing process of a contactless metal card according to the first prior application.
14 is a plan view of a mini-combi PCB used for a contactless metal card according to the first prior application.
15 is a bottom photo of the mini-combi PCB used in the contactless metal card according to the first prior application.
16 is a plan view of a mini-combi inlay used for a contactless metal card according to the first prior application.
17 is a plan view of a state in which the combi chip is connected on the terminals of the mini combi inlay of the contactless metal card according to the first prior application invention;
18 is a temperature and pressure condition of the first pre-lamination in the manufacturing process of the first prior application.
19 is a temperature and pressure condition of the secondary pre-lamination in the manufacturing process of the first prior application.
20 is a temperature and pressure condition of the tertiary pre-lamination in the manufacturing process of the first prior application.
21 is a temperature and pressure condition of the fourth final lamination in the manufacturing process of the first prior application.
22 is a schematic diagram for explaining the function of a mini-inlay for a metal card that can be used on both sides of the second prior application and a combination metal card including the same.
23 is a cross-sectional view of a mini-combi PCB according to an embodiment of the second prior application.
24 is an example of various mini-SIMs and micro-SIMs to which the second prior application invention is applicable.
25 is a plan view and a side view for explaining the dimensions of a mini-combi PCB and applicable SIM (USIM) according to a modified example of the second prior application.
26 is a front and rear layout view of a USIM to which the second prior application invention is applicable, just before attaching the chip terminal.
27 is a cross-sectional view and a plan view of a mini-inlay according to the second prior application.
28 is an equivalent circuit diagram for explaining the resonance frequency of the mini-inlay according to the second prior application invention.
29 is a diagram for calculating the inductance value of the antenna of the mini-inlay according to the second prior application.
30 is an output graph of the spectrum analyzer measuring the transfer coefficient of the mini-inlay according to the second prior application.
31 is a graph of the result of measuring the voltage induced in the antenna coil of the mini-inlay according to the second prior application by using the dual-eye terminal.
Figure 32 is an LRC meter inductance and Q-Factor output value display window of the antenna coil of the mini-inlay according to the second prior application invention.
33 is a Smith chart showing R, L, C of the antenna coil of the mini-inlay according to the second prior application as a circuit network analyzer.
34 is a photograph of a scene measuring the RF sensitivity of the mini-inlay according to the second prior application using a dual-eye terminal.
35 is a photograph of a scene of measuring the RF sensitivity of the mini-inlay according to the second prior application invention using an actual bus terminal.
Figure 36 is a detailed photograph of the contactless metal card body before pre-lamination of the present invention.
37 is a detailed photograph of the contactless metal card body after pre-lamination of the present invention.
Figure 38 is a partial enlarged cross-sectional view of the non-contact metal card body before pre-lamination of the present invention.
Figure 39 is a partial enlarged cross-sectional view just before laminating the non-contact metal card body and the printed layer and the printed protective layer after pre-lamination of the present invention.
40 is a cross-sectional view of a state in which the contactless metal card of the present invention is completed.
41 is a plan view of a state in which the contactless metal card of the present invention is completed.
42 is a flowchart of a manufacturing process of a contactless metal card of the present invention.
43 is a temperature and pressure condition of the final lamination in the manufacturing process of the non-contact metal card of the present invention.

Hereinafter, a contactless metal card and a manufacturing method thereof according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In this specification, the examples and embodiments set forth below are to be considered as illustrative and not restrictive, and the invention is not limited to the details given herein, but to other implementations with substitutions and equivalents within the scope and equivalents of the appended claims. For example, it can be changed.

On the other hand, the present inventor, as an invention related to the present invention, as of June 17, 2019, the title of the invention is "a method for manufacturing an inlay for a non-contact metal card using ferrite and a method for manufacturing a card" Patent application No. 10-2019-0071621 No. (first earlier application) and as of June 19, 2019, patent application No. 10-2019-0072752 (2nd earlier application) with the title of "contactless metal card and its manufacturing method" has been applied for However, the first and second prior application inventions are not prior art of the present invention.

(First Prior Application Invention)

First, the first prior application of the present inventors (a method for manufacturing an inlay for a non-contact metal card using ferrite and a method for manufacturing a card) will be described with reference to FIGS. 5 to 21 .

5 is a cross-sectional view of the contactless metal card according to the first prior application invention, and FIG. 6 is a plan view of the separated state of the contactless metal card according to the first prior application invention.

7 is a cross-sectional view of a mini-combi PCB used for a contactless metal card according to the first prior application, and FIG. 8 is a plan view and a bottom view of a mini-combi PCB used for a contactless metal card according to the first prior application. A cross-sectional view of a mini-combi inlay used in a contactless metal card according to the first prior application, FIG. 10 is a plan view and a bottom view of a mini combi inlay used in a contactless metal card according to the first prior application, and FIG. It is a cross-sectional view after the third lamination of the mini combination inlay used in the contactless metal card according to the present invention, and FIG. 12 is a plan view and a bottom view after the third lamination of the mini combination inlay used in the contactless metal card according to the first prior application.

13 is a flowchart of a manufacturing process of a contactless metal card according to the first prior application.

14 is a plan view of the mini-combi PCB used in the contactless metal card according to the first prior application, and FIG. 15 is a bottom photo of the mini combi PCB used in the contactless metal card according to the first prior application. 1 is a plan view of a mini combi inlay used in a contactless metal card according to the first prior application, and FIG. 17 is a plan view of a state in which the combi chip is connected on the terminal of the mini combi inlay of the contactless metal card according to the first prior application.

18 is a temperature and pressure condition of the first pre-lamination in the manufacturing process of the first prior application, FIG. 19 is a temperature and pressure condition of the secondary pre-lamination in the manufacturing process of the first prior application, and FIG. 20 is the first prior application. The temperature and pressure conditions of the tertiary pre-lamination in the manufacturing process of the present invention, and FIG. 21 is the temperature and pressure conditions of the fourth final lamination in the manufacturing process of the first prior application.

The contactless metal card using ferrite according to the first prior application of the present inventors, as shown in FIGS. 5 and 6 , the upper and lower portions of the metal card body 10, the printed layers 30 and 30' of PVC are padded. This is achieved by forming the print protective layers 40 and 40' on the upper and lower portions of the printed layers 30 and 30' again, and the printed layer is not necessarily limited to PVC and other synthetic resin layers or even synthetic resins have similar characteristics. It may be a layer of another non-conductive material having In addition, the synthetic resin layer such as the printing layer may be directly heat-compressed and laminated on the metal card body, or may be laminated through a separate adhesive between them.

On the other hand, in the metal card body 10, as shown in FIGS. 5 and 6, a through hole into which the mini-combi inlay 20 can be inserted is perforated on one side, and the outer circumference of the through hole is ' The 'inlay boundary imaginary line' is shown, of course, the 'inlay boundary imaginary line' is not visually visible after the final card is made.

For reference, the thickness of each part is variable depending on the situation, but for example, when the overall thickness of the card is 0.81±0.05 mm, the thickness of the metal card body 10 is 0.45 to 0.52 mm, and the printed layer 30 , 30') is 0.10 to 0.15 mm, respectively, and the print protective layers 40 and 40' are suitable if it is 0.04 to 0.08.

Now, the mini-combi inlay 20, which is the most essential part of the first prior application, will be described in detail with reference to FIGS. 7 to 10 .

First, as shown in FIGS. 7 and 8 , a mini-combi PCB 20a must be prepared (for example, an F-PCB of a size of 14×24×0.08 mm made of PET), on one side of the PCB substrate 21 . (In Fig. 7, on the upper side) Combi chip (Combi IC Chip) contact terminal 23, and on the other side of the PCB board 21 (on the lower side in Fig. 7) Etched pattern antenna 22 and capacitor terminal 24 is formed, and a capacitor 25 for resonant frequency matching (for example, RF 13.56Mhz) is electrically coupled to the capacitor terminal 24 . For example, the resonant frequency matching capacitor 25 is a multi-layer ceramic capacitor (MLCC).

8 (a) is a front view of the mini-combi PCB 20a in which the combi chip contact terminals 23 are formed on the front side (upper side in FIG. 7), and FIG. 8 (b) is an antenna 22 on the rear side and After the capacitor terminal 21 is formed, it is a rear (lower side in FIG. 7) view of the mini-combi PCB 20a to which the capacitor 25 is attached.

Now, as shown in FIGS. 9 and 10, the upper and lower sides of the mini-combi PCB 20a, the filler 27 of PVC or glue (epoxy, UV solution, etc.) After cutting (with a size of 11 × 20 × 0.47 mm), ferrite (26: see FIG. 9) is formed on the side of the four-sided edge again, and the PVC layer 27' is finished on the upper and lower sides again. However, the PVC layer 27 ′ is not necessarily required, and is formed according to the need for a process, and may be omitted depending on the process, or may be integrally made of the same material as the filler 27 . For example, the width of the ferrite 26 is 1 to 5 mm, preferably 2 to 4 mm is sufficient, but is not necessarily limited thereto, and the PVC layer 27' is also preferably about 0.02 mm thick, but must be The present invention is not limited thereto. As a result, as shown in FIGS. 9 and 10 , as an example, a mini combi inlay 20 having a size of 14×24×0.51 mm is obtained, and it is characterized in that the bar is finished with ferrite on all four edges.

FIG. 10 (a) is a front (upper side of FIG. 9) view of the mini-combi inlay 20 in a state where the ferrite 26 is attached to the four-way rim, and FIG. 10 (b) is the ferrite 26 in all four directions. This is the back (lower side in FIG. 9) view of the completed mini-combi inlay 20 in a state where it is attached to the rim and forms the PVC layer 27' again, as shown in FIG. 10 (a), the mini-combi PCB In the gap between the 20a and the ferrite 26, a filler 27 or PVC 27' is pushed in the laminating process to fill the gap.

Now, the completed mini-combi inlay 20 is mounted in the mounting hole of the metal card body (MCB) 10. First, preliminary, as shown in FIGS. 11 and 12, the metal card body (MCB) ) After inserting the mini-combi inlay 20 into the mounting hole of the 10, pre-lamination is performed in a state in which a card-sized hot melt film (HMF) 15 is loaded on the upper and lower layers.

12 (a) is a state in which the mini-combi inlay 20 is inserted into the mounting hole of the metal card body (MCB) 10 and the first hot melt film 15 is formed on the front side (upper side in FIG. 11 ) again. It is a front view, and (b) of FIG. 2 is a second hot melt film 15' on the back (lower side in FIG. 11) after inserting the mini-combi inlay 20 into the mounting hole of the metal card body (MCB) 10 . ) is a rear (lower side in FIG. 11) view of the formed state.

Pictures of the actual mini-combi PCB (20a) are shown in FIGS. 14 to 16, and FIG. 14 is a front photo in which the combi-chip contact terminals 23 are formed on the front (upper side of FIG. 7) of the mini-combi PCB (20a). , FIG. 15 is a rear photograph of the antenna 22 formed on the rear side (lower side of FIG. 7) of the mini-combi PCB 20a, and FIG. 16 is a ferrite on the front side (upper side of FIG. 9) of the mini-combi PCB 20a. It is a front photo of the completed mini-combi inlay (20) formed up to (26).

Now, with reference to FIG. 13, a method for manufacturing an inlay for a non-contact metal card using ferrite according to the first prior application and a method for manufacturing the card will be described in detail.

First, on the PCB board 21 of the mini-combi PCB 20a of FIGS. 7 and 8 (for example, the size of 14 × 24 × 0.08 mm of PET material), the necessary elements 23 and 24 are mounted on the mini-combi PCB ( 20a) is prepared (S1).

Thereafter, the RF antenna tuning of the L, R, and C resonant frequencies is performed (S2), and a capacitor (MLCC) is attached by the SMT (Surface Mounting Technology) process (S3).

In some cases, the combi-chip terminal 23 (eg, TIN with a thickness of 0.06 mm) is made by using a mask process (S5).

Thereafter, the primary pre-lamination is performed at a low temperature (see FIG. 18 ) using a filler 27 such as PVC as shown in FIG. 9 ( S7 ).

After that, it is cut by punching (for example, 11 × 20 × 0.47 mm in size) to the required size using a mold (S11),

Now, a ferrite 26 (refer to FIG. 9) is formed on the side of the four-sided rim. More specifically, a hole corresponding to the cut inlay of an appropriate size is drilled in a ferrite substrate (not shown) and the cut inlay is cut. Then, the second pre-lamination (for example, 0.02 mm thick) is performed with PVC above and below (S13). The secondary pre-lamination conditions are the same as in FIG. 19 . Therefore, according to the second pre-lamination process, the PVC layer 27' is formed on the upper and lower sides. However, as described above, the PVC layer 27' is not necessarily required.

Again, after punching and cutting to an appropriate size (eg, 14 × 24 mm size) (S21), the first resonance frequency (L, R, C values) is inspected (S23).

After that, insert the cut inlay 20 into the mounting hole (eg, slightly larger than 14×24×0.51mm) of the metal card body 10 prepared in advance (S31), and the upper and lower layers of the metal card body of the card size A third lamination is performed with the hot-melt films 15 and 15' of the hot-melt tape (S33). The third pre-lamination conditions are the same as in FIG. 20 .

Again, the secondary resonance frequency (L, R, C values) is inspected (S41), and the first and second printed layers 30 and 30' and the first and second printed protective layers 40 and 40' are removed. After the temporary welding, the final lamination is performed (S43). The fourth final lamination conditions are the same as in FIG. 21 .

Thereafter, a pocket for a combi-chip is formed using an end milling device (S51), and the combi-chip 50 and the combi-chip terminal 23 of the PCB are connected (S55). A partially enlarged photograph of the final finished product is shown in FIG. 17 . In some cases, when the antenna length on the lower side is not suitable, some antennas may be formed on the upper side as well.

Thereafter, the final inspection (RF test, total appearance inspection, etc.) is passed (S55), and is packaged and delivered (S57).

As mentioned above, according to the first prior application of the present inventor, a metal card capable of a non-contact function was possible by applying ferrite to the edge of the inlay, but it takes a lot of process to form a ferrite film, and also the reflection characteristic is one side due to the characteristics of ferrite Inevitably, it was found that only one direction communication prevails due to the metallic properties of the combi-chip terminal, and communication in the other direction is recessive, so it is inconvenient to use only one side.

That is, since the surface of the IC chip is made of metal, the back side of the metal can be shielded with ferrite, etc. to realize a certain response distance, but the distance is reduced with the metal surface, which limits its use in wireless communication. To improve this, it was attempted to implement a coil antenna on the outside of the metal surface, but there was not much room (about 1-2 mm) to implement the coil antenna on the outside of the metal surface, so it was difficult to make an antenna pattern. 2 The earlier application invention is intended to solve these problems.

(Example of the second prior application)

Hereinafter, an embodiment of the second prior application will be described in detail with reference to FIGS. 22 to 35 .

22 is a schematic diagram for explaining the function of a mini inlay for a metal card that can be used on both sides of the second prior application and a combination metal card including the same, and FIG. 23 is a cross-sectional view of a mini combi PCB according to an embodiment of the second prior application to be.

24 is an example of various mini-SIMs and micro-SIMs to which the second prior application invention is applicable, and FIG. 25 is a plan view for explaining the dimensions of a mini-combi PCB and applicable USIMs according to a modified example of the second prior application invention; It is a side view, and FIG. 26 is a front and rear layout view of a USIM to which the second earlier application is applicable, just before attaching the chip terminal, and FIG. 27 is a cross-sectional view and a plan view of the mini inlay according to the second earlier application.

28 is an equivalent circuit diagram for explaining the resonance frequency of the mini-inlay according to the second prior application invention, FIG. 29 is a diagram for calculating the inductance value of the antenna of the mini-inlay according to the second earlier application invention, and FIG. 30 is the second earlier application It is an output graph of the spectrum analyzer measuring the transmission coefficient of the mini-inlay according to the invention, and FIG. 31 is a graph of the result of measuring the voltage induced in the antenna coil of the mini-inlay according to the second prior application using a dual-eye terminal, 32 is an LRC meter showing the inductance and Q-Factor output value display window of the antenna coil of the mini inlay according to the second prior application with an LRC meter, and FIG. 33 is a circuit network analyzer R, L, C of the antenna coil of the mini inlay according to the second prior application. It is a Smith chart showing .

34 is a photograph of a scene measuring the RF sensitivity of the mini-inlay according to the second prior application invention using a dual-eye terminal, and FIG. 35 is a photo of a scene measuring the RF sensitivity of the mini inlay according to the second prior application invention using an actual bus terminal It's a picture of the scene.

As described above, the coil antenna is implemented on the outside of the metal surface, but there is not much room (about 1-2 mm) to implement the coil antenna on the outside of the metal surface. , forming 5~10 turns within 1mm with an interval of 0.03mm) between patterns, and using 2 or more layers available in Multi-PCB, make it possible to embed a patterned antenna with good sensitivity of about 5~10 turns even within 1~2mm within 1~2mm. could

Thus, in the mini micro SIM and micro SIM, a distance of about 20 mm or more was secured from a standard terminal, and a high-sensitivity antenna of 25 mm or more was realized in bus terminals and subway terminals mainly used in daily life.

In addition, as shown in FIGS. 23 and 25 to 27, by implementing an antenna on both sides of the PCB board and adding a capacitor for resonant frequency matching, as shown in FIG. 22, so that the RF sensitivity of both sides of the card does not change. , that is, both sides can be recognized.

First, the double-sided usable metal card according to the first embodiment of the second earlier application is also, as in the first earlier application (see FIG. 5), the upper and lower portions of the metal card body 10, the printed layers of PVC (30). , 30') is added, and again the printing protection layers 40 and 40' are formed on the upper and lower portions of the printed layers 30 and 30'.

Also, in the metal card body 10, as shown in FIG. 5, a through hole into which the mini-combi inlay 20 can be inserted is perforated on one side, and the metal card body 10 is seated in the through hole. do.

Subsequently, the mini-combi inlay 20, which is the most essential part of the second prior application, will be described in detail with reference to FIGS. 23 to 29 .

First, the mini-combi PCB 20a must be prepared (for example, an F-PCB with a size of 14×19×0.08 mm made of PET), on one side of the PCB substrate 21 (on the upper side in FIG. 23 ) Combi The chip (Combi IC Chip) contact terminal 23 and the first antenna unit 22a, and on the other side of the PCB board 21 (on the lower side in FIG. 23), the second antenna unit 22b and the capacitor terminal ( 24) is formed, and at this time, the first antenna unit 22a and the second antenna unit 22b together constitute the etched pattern antenna 22 . The first antenna unit 22a and the second antenna unit 22b are preferably formed of an etched pattern having a height of about 0.02 mm. Since the overall height of the mini-inlay is limited to about 0.5 mm, it is formed as thin as possible. because it has to be In addition, the free space on the outside of the metal card body (metal surface) of the PCB board 21 is only about 1 to 2 mm, the width of the antenna pattern is about 0.02 to 0.03 mm, and the spacing between the patterns is also limited to about 0.02 to 0.03 mm. By doing this, 2-3 turns can be formed in a free space of about 1 to 2 mm, and eventually 5 to 15 turns (preferably 5 to 10 turns) can be formed as the entire upper and lower sides. .

Furthermore, in the modified example of FIG. 25 to further increase the number of turns, the PCB substrate is formed in two upper and lower parts, and the first antenna unit 22a is placed on the upper surface of the first substrate 21a and the lower surface of the second substrate 21b. By forming a second antenna unit 22b in the , forming a third antenna unit 22c between the first substrate 21a and the second substrate 21b, and connecting them through a through hole (not shown), By increasing the number of turns (9 turns in Fig. 25), it is also possible to further improve the sensitivity distance.

That is, in FIG. 25, the free space in the width (vertical in the drawing) direction is only about 1 mm of margin when the size of the COB chip (12mm) is subtracted from the maximum size (13mm) of the USIM chip, and the length (in the drawing) In the horizontal) direction, if the size of the COB chip (13mm) is subtracted from the maximum size (18mm) of the USIM chip, the margin is only about 5mm. In the above-mentioned free space, the conventional coil method ( With a coil diameter of 0.12mm) and a spacing of 0.25mm with the coil, the desired antenna in the second prior application cannot be implemented even with about 15 Turns (inductance value: 5.3uH). That is, using the conventional enamel coil, it is impossible to implement a 13.56 MHz RFID tag antenna pattern with 5 to 10 turns or more in a space of about 1 mm.

Therefore, in the second prior application, in order to solve this problem, a fine pattern (pattern line width 0.03 mm, line-to-line gap: 0.03 mm, Lead thickness: 0.02mm), and 5~10 turns of antenna were made even in an insufficient space (width: about 1mm). These characteristics will be described later with reference to FIG. 28 .

On the other hand, a capacitor 25 for resonance frequency matching (for example, RF 13.56Mhz) is electrically coupled to the capacitor terminal 24 of the PCB board 21 . For example, the resonant frequency matching capacitor 25 is a multi-layer ceramic capacitor (MLCC).

Fig. 26 (a) is a front view of the mini-combi PCB 20a in which the combi chip contact terminal 23 and the first antenna unit 22a are formed on the front side (the upper side in Figs. 23 and 25), (b) is a rear view (lower side in FIGS. 23 and 25) of the mini-combi PCB 20a to which the capacitor 25 is attached after the second antenna unit 22b and the capacitor terminal 21 are formed on the rear surface.

Now, as shown in FIG. 27, on the upper and lower sides of the mini-combi PCB 20a, a filler 27 of PVC or glue (epoxy, UV liquid, etc.) is filled, and this is an appropriate size (for example, 11 × 20×0.47mm size), the combi chip 50 is connected to complete the mini-inlay 20 for metal cards that can be used on both sides of the second prior application. As a result, as shown in 27, for example, a mini combi inlay 20 having a size of 14×24×0.51 mm is obtained.

In some cases, as shown in FIG. 24 , it may be manufactured in the form of a mini-SIM or a micro-SIM.

After that, the completed mini-combi inlay 20 is mounted in the mounting hole of the metal card body (MCB) 10 , and the mini-combi inlay 20 is inserted into the mounting hole of the metal card body (MCB) 10 . , pre-lamination is performed in a state in which a card-sized hot melt film (HMF) 15 is loaded on the upper and lower layers, and the final lamination process of forming a printed layer and a print protective layer on the upper and lower sides is the same as that of the first prior application. Therefore, a detailed description will be omitted.

Now, with reference to FIG. 28 or less, the frequency characteristics of the mini-inlay for metal cards that can be used on both sides of the second prior application will be described in detail. 28 is an equivalent circuit diagram for explaining the resonant frequency of the mini-inlay according to the second prior application, wherein the capacitor 25 is connected to both terminals 23 of the combi chip 50 in parallel with the combi chip, and the antenna coil (22) is connected in series.

In this experimental example, the size of the F-PCB was 13mm X 18mm, the inner and outer sizes of the antenna pattern were 11mm X 16mm and 12.5mm X 17.5mm, respectively, and the number of antenna turns was set to 9 turns, at this time the inductance value was 2.2uH, the capacitor value was 260pF.

At this time, the resonant frequency f is the following <Equation 1>.

where f is the resonant frequency of the card,

C is the value of the capacitor formed inside the card

L is the inductance value made by the coil

On the other hand, as shown in FIG. 29, the calculation formula of the inductance value of the fine pattern antenna is as follows <Equation 2>.

From here,

Thus, even in mini micro SIM and micro SIM, in standard terminals

A distance of about 20mm or more was secured, and a high-sensitivity antenna of 25mm or more could be implemented in bus terminals and subway terminals mainly used in daily life.

30 is an output graph of a spectrum analyzer measuring the transmission coefficient of the mini-inlay according to the second prior application. As a result of measuring the transmission coefficient by the spectrum analyzer, the curve falling from about -20dB to 32dB is seen at 13.56MHz. It was found that a frequency resonance was created.

31 is a graph of the result of measuring the voltage induced in the antenna coil of the mini-inlay according to the second prior application using the dual-eye terminal, using the dual-eye terminal.

I measured the voltage induced in the antenna coil while increasing the sensitivity distance, and it was confirmed that the IC chip works at about 1.5 Volts.

Three samples were produced and tested, and all of them output more than 1.0V even at a distance of 40mm apart, and the sensitivity distance at which sufficient reception sensitivity of 1.5V was obtained was about 30mm, confirming that short-distance wireless communication was sufficiently possible. .

32 and 33, as a second experimental example, the F-PCB size is 12mm X 15mm, the inner and outer sizes of the antenna pattern are 11mm X 14mm and 11.5mm X 14.5mm, respectively, the number of antenna turns is 15 turns, When the inductance value is 2.212783uH and the capacitor value is 260pF, as shown in FIG. 32, it was confirmed with the LRC meter that the Q-Factor value of the antenna coil of the mini-inlay according to the second prior application was 2.44, and the network analyzer As in the Smith chart showing R, L, and C of the antenna coil of the mini-inlay according to the second prior application (see FIG. 33 ), it was found that the directivity was also good.

34 is a photograph of a scene measuring the RF sensitivity of the mini inlay 20 according to the second prior application using the dual eye terminal 200, as seen from the distance measurer 220 of both, 35.34 mm It was confirmed that the signal was detected at the separation distance.

In addition, FIG. 35 is a photograph of a scene measuring the RF sensitivity of the mini-inlay 20 according to the second prior application using the actual bus terminal 200, in this case, the distance measured from the distance meter 220 of both. As shown, it was confirmed that the signal was detected in the sensitivity display window 210 even at a separation distance of 56.59 mm.

In the end, according to the mini-inlay for metal card that can be used on both sides of the second prior application, it can be seen that a sufficient contactless metal card is possible by the combination of two or more layers of fine pattern formation and matching capacitors formed on the edge of the mini-combi PCB. .

As mentioned above, according to the second prior application of the present inventor, a sufficient contactless metal card was possible by the combination of two or more layers of fine pattern formation and matching capacitors formed on the edge of the mini-combi PCB, but nevertheless, the size of the mini-inlay Due to this, the recognition distance is inevitably limited, and there is another problem. As the electromagnetic wave as described in FIG. 3b changes to a current, it flows along the edge of the mini-inlay mounting hole of the metal card body 10, which is a metal conductor. Since the electromagnetic wave attenuation problem caused by this still remains, there is inevitably a limit to the recognition distance. And, this is a problem that appears in both the first prior application invention.

On the other hand, as described in FIG. 4 , when a slit is formed from the mini-inlay mounting hole of the metal card body 10 to the outer edge to block the phenomenon of continuous conductivity, such a problem of electromagnetic wave attenuation does not occur. Therefore, it is known that the RF recognition distance can be further increased. However, when the slit is formed as in the fourth prior art, one of the biggest advantages of the metal card, which is the robustness, is damaged. Since the metal card is easily bent when the metal card is bent with the slit as the center side, Several components, including the antenna of the chip or mini-inlay, could be damaged.

The present invention solves the problems of the third prior art and the first and second prior applications by forming a slit from the mini inlay mounting hole to the outer edge of the metal card body 10, and at the same time attaching an insert to the slit. It is also intended to solve the problems of the fourth prior art as well.

(Example of the present invention)

Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. 36 to 43 .

36 is a detailed photograph of the non-contact metal card body before pre-lamination of the present invention, FIG. 37 is a detailed photograph of the non-contact metal card body after pre-lamination of the present invention, and FIG. 38 is a non-contact metal card body before pre-lamination of the present invention A partially enlarged cross-sectional view of the card body, Figure 39 is a partially enlarged cross-sectional view just before laminating the non-contact metal card body, the printed layer and the printed protective layer after pre-lamination of the present invention, Figure 40 is the non-contact metal card of the present invention is completed It is a cross-sectional view of the state, and FIG. 41 is a plan view of the completed state of the contactless metal card of the present invention.

42 is a flow chart of the manufacturing process of the non-contact metal card of the present invention, and FIG. 43 is the temperature and pressure conditions of final lamination in the manufacturing process of the non-contact metal card of the present invention.

The biggest difference between the present invention and the inventor's earlier invention is that, as shown in FIGS. 36 to 41, the mini inlay 100 is inserted into the metal card body 10 (for example, 0.5 mm thick) in the present invention. A slit (10b) (for example, 0.7 mm wide) is formed from the mounting hole 10a (for example, a rounded square with a size of 23 mm * 18.5 mm) to the outer edge of the metal card body 10, and metallic electricity is applied in this area The path is cut off, and the slit 10b is formed on one side of the insert 60 made of a rigid material with a non-conductive surface treatment (for example, a round gin with a size of 4 mm * 7 mm * 0.35 mm). The point is that the seating groove 10c into which the rectangular plate is inserted is cut. The insert 60 may be, for example, any metal having a non-conductive surface treatment on the surface thereof, but preferably aluminum with an anodized surface treatment. In this case, the horizontal and vertical size of the mounting hole 10a should be slightly larger than the horizontal and vertical size of the insert 60 .

Thus, an adhesive is administered to the insert mounting hole 10a, and the insert 60 is adhered by an adhesive while the insert 60 is inserted into the insert mounting hole 10a (see FIGS. 37 and 38). , Electrically, both ends of the slit are insulated, but mechanically, both ends of the slit are connected to each other, thereby achieving the object of the present invention.

As the adhesive, it may be an epoxy-based adhesive, for example, 3M's 'Scotch-Weld ^TM ', a two-component epoxy adhesive with a 'DP 420' or 'DP 460' model name, or often as a 'stone bond'. A so-called adhesive may be used.

Thus, as shown in FIG. 39, both are adhered while the mini-inlay 20 is inserted into the mounting hole 10a, and at this time, the adhesive is in the narrow space between the mini-inlay and the mounting hole, as well as in the slit ( 10b) is also filled, and the hot melt filling material 16 is also filled in the slits.

Subsequently, as shown in FIG. 39 , the upper and lower print layers 30 and 30 ′ and the upper and lower print layers are printed through the upper and lower hot melt films 15 and 15 ′ on the upper and lower sides of the metal card body 10 . The protective layers 40 and 40' are temporarily bonded, and finally, the contactless metal card according to the present invention as shown in FIGS. 40 and 41 is completed by being firmly heat-compressed.

Now, the metal card manufacturing bar method of the present invention will be described in detail with reference mainly to FIGS. 42 and 43 and with auxiliary reference to FIGS. 18 to 21 .

First, as shown in steps S1 to S9 of FIG. 42, a mini-combi inlay (or mini-inlay) 20 or 100 in the previous application is manufactured, for example, an F- of 280mm * 280mm size and 0.05mm thickness. The PCB is prepared (S1), the element mounting work such as the antenna coil pattern formation and the capacitor mounting process by SMT work is performed (S3), and then the combi-chip terminal creation work such as attaching the lead for the terminal to the COB terminal is performed and (S3), the first pre-laminating operation of attaching the hot melt and PC is performed (S7), which is performed under relatively low temperature and pressure conditions as in FIG. 18 . Thereafter, the mini inlay is finished by cutting it to an appropriate size (eg 23mm * 18.5mm) by CNC milling. In some cases, ferrite paper is placed on one side and additional lamination and additional cutting and inspection processes may be performed with PVC. Since this has been sufficiently described in the first and second prior application inventions, further detailed description will be omitted.

Now, the mini inlay 20; 100 is mounted on the metal card body 10. Prior to that, in the present invention, the slit 10b is formed in the metal card body 10, and one side of the slit forming portion is The metal insert 60 is inserted into the insert seating groove 10a formed in the , and a mini-inlay mounting hole 10a must be formed. In this regard, referring to S12 to S26 of FIG. 42 , for example, a metal card body 10 is prepared with aluminum (AL6016) having a size of 300 mm * 500 mm and a thickness of 0.5 mm (S12), and here a method such as CNC machining By forming a slit (10b) of 0.7mm width as an example, and forming an insert seating groove (10a) with a size of 7.0mm * 5.5mm and a depth of 0.35mm as an example (S14), on the other hand, as an example, 7.0mm * Prepare the metal insert 60 with aluminum (AL6016) having a size of 5.5 mm and a thickness of 0.35 mm (S22). In this case, the surface of the metal insert should be surface-treated to be non-conductive, and for example, it may be immersed in sulfuric acid solution and anodized to form a thin aluminum oxide layer on the surface.

Subsequently, the metal insert 60 is inserted together with the adhesive 16 into the insert seating groove 10a, and secondary pre-lamination is performed (S24). At this time, since the second pre-lamination process is also a kind of temporary welding process, the temperature and pressure conditions may be the same as those of the first pre-lamination process S7 (see FIG. 18 ).

Now, in the portion connected to the slit, for example, a mini-inlay mounting hole 10a having a size of 23mm*18.5mm is formed through a CNC process or the like (S26), in which case the mini-inlay mounting hole 10a is the mini-inlay mounting hole 10a. It should be slightly larger than the inlay (20; 100), and the insert seating groove (10a) in step S22 should also be formed slightly larger than the metal insert (60).

Now, the mini-inlay is inserted into the mini-inlay mounting hole 10a (S31), and the hot melt films 15 and 15' are applied to the upper and lower layers, and then the third pre-lamination is performed (S33). In some cases, additional lamination may be performed between steps S31 and S33 so that the mini-inlays 20 and 100 are more securely fixed to the mini-inlay mounting hole 10a. In addition, the reason that the tertiary pre-lamination process (S33) is necessary is, in order to make the adhesion between the metallic metal card body 10 and the synthetic resin printed layer more reliable, once the upper and lower layers of the metal card body 10 By adding hot melt films 15 and 15' to the surface and performing temporary bonding, the printed layers 30 and 30' can be better attached to the metallic metal card body 10 in the final lamination process later. .

Now, the upper and lower print layers 30 and 30' again on the upper and lower sides of the metal card body 10 in which the mini inlay is inserted and the hot melt film is glued on the upper and lower sides, and a print protection layer (overlay layer) on the upper and lower layers again. After adding, the final lamination is performed (S43). At this time, the final lamination process conditions may use the high temperature (about 100 ℃) and pressure (about 80 bar) conditions of FIG. 21, but in the present invention, for more reliable lamination, as shown in FIG. 43, a higher temperature ( It is preferable to perform lamination at a temperature of about 150° C.) for a long time (about 60 minutes), while using several stages of pressure conditions.

That is, for the first 10 minutes, the temperature is gradually raised from room temperature to the first stage temperature (about 100° C.) (at this time the pressure is about 30 bar, which is the first stage), and for the next 10 minutes, the first stage temperature is maintained as it is. While maintaining the first stage pressure, the third 10 minutes raise the temperature to the second stage (about 150° C.) and the pressure is also performed at the second stage pressure (about 50 bar), and the fourth 10 minutes is the same or the same at the same temperature condition. It is preferable to further pressurize (about 60 bar), and gradually lower the temperature to room temperature for the last 20 minutes, but rather keep the pressure at the highest (about 80 bar).

In the above, the present invention has been described according to an embodiment of the present invention, but changes and modifications made by those of ordinary skill in the art to which the present invention pertains without departing from the technical spirit of the present invention also belong to the present invention. Of course.

That is, in the above embodiment, a contactless metal card having a mini-inlay was described as an example, but the metal card manufacturing of the present invention is applicable to a general metal card in which an antenna coil is mounted on a metal card body, not a mini-inlay, and a slit It is applicable to all metal cards to improve the strength of contactless metal cards with

Therefore, the technical idea of the present invention should be considered to be limited only by the following claims, and it should be construed that the scope of rights extends to the slit and the non-contact metal card, which is joined with an insert padded at the overlapping portion of the slit.

(First Prior Application: FIGS. 5 to 21)
10: Metal card body (MCB)
15,15': first and second hot melt films (HMF)
20 : Mini Combi Inlay
20a: Mini Combi PCB 21: PCB Board
22: antenna 23: combi chip contact terminal
24: capacitor terminal 25: capacitor
26: ferrite 27: filler
27': PVC layer
30, 30': first and second printed layers
40, 40': first and second printed protective layers
50: Combi Chip
(Invention: FIGS. 22 to 35)
100: mini inlay of the present invention 200: terminal
10: Metal card body (MCB)
20 : Mini Combi Inlay
20a: Mini Combi PCB 21: PCB Board
22: antenna 23: combi chip contact terminal
24: capacitor terminal 25: capacitor
27: filler
30, 30': first and second printed layers
40, 40': first and second printed protective layers
50: Combi Chip
(Invention: FIGS. 36 to 43)
10: Metal card body (MCB) 10a: Inlay mounting hole
10b: slit 10c: insert seating groove
16: hot melt filling
60: insert

Claims (10)

As a metal card body used for a contactless metal card having a mounting hole to which an inlay is mounted,
a slit formed from the inlay mounting hole to the outer periphery of the metal card body (MCB);
an insert seating groove formed in a portion of the slit to have a larger width than the slit; and
an insert seated in the insert receiving groove and adhered to the body of the metal card body;
includes,
The insert has at least a portion of the surface of which is non-conductive, so that the conductive breaking function formed by the slit is maintained while at the same time strengthening the mechanical strength interrupted by the slit. The method of claim 1,
The insert is non-contact type, characterized in that the portion bonded to the main body of the metal card body is surface-treated to be non-conductive, so that the conductive breaking function formed by the slit is maintained while at the same time strengthening the mechanical strength disconnected by the slit. Metal card body for metal cards. The method of claim 1,
The insert is aluminum, and the surface is anodized for a non-contact metal card body. The method of claim 1,
The insert is a metal card body for a non-contact type metal card, characterized in that it is adhered to the insert seating groove by a hot melt adhesive. The method of claim 1,
The adhesive is a non-contact metal card body for a metal card, characterized in that the epoxy-based adhesive. The metal card body for the contactless metal card of any one of claims 1 to 5;
first and second printed layers 30 and 30' respectively formed on upper and lower sides of the metal card body (MCB); and
first and second print protection layers 40 and 40' provided on the outside of the first and second print layers 30 and 30';
A contactless metal card comprising a. A method for manufacturing a metal card body for a contactless metal card according to any one of claims 1 to 5, comprising:
(a) preparing a metal card body 10 (S12), forming a slit 10b having a width sufficient to substantially weaken or break conductivity, and forming an insert seating groove 10a (S14);
(b) preparing a metal insert 60 having at least a portion of the surface of which is non-conductive (S22);
(c) inserting the metal insert 60 together with the adhesive 16 into the insert seating groove 10a and performing pre-lamination (S24);
A method of manufacturing a metal card body for a contactless metal card, comprising: A method of manufacturing a contactless metal card having the metal card body for a contactless metal card according to any one of claims 1 to 5,
(a) preparing a metal card body 10 (S12), forming a slit 10b having a width sufficient to substantially weaken or break conductivity, and forming an insert seating groove 10a (S14);
(b) preparing a metal insert 60 having at least a portion of the surface of which is non-conductive (S22);
(c) inserting the metal insert 60 together with the adhesive 16 into the insert seating groove 10a and performing pre-lamination (S24);
(d) forming an inlay mounting hole (10a) through a portion connected to the slit (S26);
(e) inserting the inlay into the inlay mounting hole (10a) (S31), and applying the hot melt films (15, 15') to the upper and lower layers, followed by performing a third pre-lamination (S33);
(f) After the inlay is inserted and the top and bottom printing layers 30 and 30' and the printing protection layer on the top and bottom layers are applied again to the upper and lower sides of the metal card body 10 to which the hot melt film is glued on the upper and lower sides , performing a final lamination step (S43);
A method of manufacturing a contactless metal card comprising a. 9. The method of claim 8,
The lamination in step (f) is a method of manufacturing a non-contact metal card, characterized in that lamination is performed while using a higher temperature and pressure conditions of several steps for a longer period of time than the lamination in step (c). 9. The method of claim 8,
The lamination of step (f) is,
(f1) In the first section, the pressure is set to the first step while gradually increasing the temperature from the room temperature to the first step temperature,
(f2) in the second section, maintaining the first stage pressure while maintaining the temperature as it is at the first stage temperature,
(f3) in the third section, raising the temperature to the second step temperature higher than the first step temperature, the pressure is also performed at a second step pressure higher than the first step pressure,
(f4) In the finishing section, the temperature is gradually lowered to room temperature, but rather the pressure is maintained at the third stage pressure higher than the second stage pressure.

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