KR20200144186A - A fabricating method of metal card having a contactless card function and the inlay therefor - Google Patents

Abstract

The present invention relates to a method for manufacturing a metal card and an inlay having a non-contact card function such as RF or NFC function using ferrite while having a beautiful appearance without being easily bent since a card body is metal. According to one aspect of the present invention, the method for manufacturing an inlay for a non-contact metal card using ferrite comprises the steps of: preparing a mini-combi PCB (20a) on which necessary elements are mounted on a PCB substrate (21) of the mini-combi PCB (20a) (S1); performing primary pre-lamination using a filler (27) such as PVC and the like (S7); and cutting to a required size (S11), and forming ferrite on a rim side of all directions to complete a mini-combi inlay.

Description

Method of manufacturing inlay for non-contact metal card and card manufacturing method using ferrite {A FABRICATING METHOD OF METAL CARD HAVING A CONTACTLESS CARD FUNCTION AND THE INLAY THEREFOR}

The present invention relates to a method of manufacturing an inlay for a non-contact metal card and a method of manufacturing a card using ferrite, and more specifically, a non-contact type such as RF or NFC function using ferrite while having a beautiful appearance without being bent easily because the card body is metal. It relates to a method for manufacturing a metal card and an inlay having a card function.

In general, cards are classified into a magnetic card using a magnetic strip, a smart card using an IC chip, and a combination card combining them according to the recording method, and the smart card is classified into contact type and non-contact type according to the reading method. It is classified into a proximity communication (NFC) card that can be read only from a distance of ~ dozens of cm and an RF card that can be read from a longer distance, and these methods are usually provided in duplicate. Hereinafter, in the present specification, short-distance NFC or long-distance RF is not largely distinguished, and in some cases, it is collectively referred to as'RF' or'contactless', and chips for all contactless cards including short-range NFC chips and long-distance RF chips Is collectively referred to as'RFIC'.

On the other hand, in general, plastic cards are issued to defer the collection of goods and services to a specific member for a certain period of time, and are mainly used in cash such as credit cards, cash cards, and transportation cards. It is used in place of or widely used as various medical treatment cards, membership cards, etc. In modern times, various types of plastic cards differentiated according to the customer's credit rating are provided to customers.

Among them, special cards such as gold cards and platinum cards, which are made for VIP customers with high credit ratings, are painted in gold or silver, making them feel more sophisticated.

However, the above-mentioned special cards are made to express gold and silver by a printing method of mixing gold or silver powder with a pigment. Therefore, gold and silver powder mixed in the pigment do not use pure gold or pure silver. In addition, since other pigments and adhesives are mixed, the high-gloss texture emitted from pure metal could not be obtained.

In addition, unlike pure metals that never change gloss or texture, gold or silver powder has properties such as deterioration due to humidity or temperature conditions, so if a plastic card is used for a long time, the paint will be discolored and deteriorated, resulting in lower gloss. It was impossible to provide a high-quality card in the end, because the disruption occurred.

Moreover, in recent years, there is a movement to replace plastic cards with real thick metal plates for VVIP customers, the most advanced customer base.

1 is for a plastic card having a metal thin film proposed to solve the problem of the above plastic card, it is for the utility model registration No. 0382725. That is, in the first prior art, a metal thin film 12 is attached to the upper surface of the core sheet 13 made of a synthetic resin such as PVC, and the metal thin film 12 is smaller in size than the core sheet 13 A blank 13a is formed around the upper surface of the core sheet 13 by forming a corresponding shape.

In the upper margin 13a of the core sheet 13, an antenna coil 21 is installed along the periphery, and the antenna coil 21 is installed in a continuous wound state.

Both ends of the antenna coil 21 are connected to the IC chip 20 fixed inside the core sheet 13 to communicate with a reader (not shown) while reading various information stored in the IC chip 20 by the reader. It is supposed to be able to grasp.

A transparent upper coated paper 11 is attached to the upper surface of the core sheet 13, and a printing layer 11a is formed on the lower surface of the upper coated paper 11. Various pictures or characters related to the card company are printed on the printing layer 11a.

A transparent lower coated paper 14 is attached to the lower surface of the core sheet 13, and a printing layer 14a is formed on the upper surface of the lower coated paper 14. Various pictures and characters related to the card company are also printed on the printing layer 14a.

On the other hand, the metal thin film 12 attached to the upper and lower surfaces of the core sheet 13, respectively, is made of a thin foil form, that is, about 0.02 to 0.1 mm by using a conventional rolling mill after melting a metal material and performing an annuity. It was formed into a thin film having a thickness of, and the metal material is a noble metal that has good ductility and malleability, such as pure gold (Au), platinum (Pt), silver (Ag), and nickel (Ni), while emitting high gloss. Was used. Of course, in some cases, two or more of the above metal materials may be used by alloying them.

The present invention made of the above-described configuration emits high gloss while the metal thin films 12 heat bonded to the upper and lower surfaces of the core sheet 13 are protected by transparent upper and lower coated papers 11 and 14 As a result, it is possible to realize a plastic card with higher dignity and high quality, and the metal thin film 12 made of pure metal material prevents discoloration and deterioration even after a long period of use, so that it can always maintain high gloss. There are some advantages, such as being able to maximize the external competitiveness of the card.

In addition, the antenna coil 21 is installed in the margin 13a of the core sheet 13 formed around the thin metal film 12 so that the antenna coil 21 can communicate with the reader without being disturbed by the thin metal film 12. Because it is possible, not only the plastic card (1) with magnetic tape (30) attached

The high-gloss metal thin film 12 can be applied to the plastic card 1 in which the IC chip 20 is embedded.

However, in the first prior art, for RF communication, a blank 13a must be formed around the upper surface of the core sheet 13 while making the metal thin film 12 a smaller size than the core sheet 13. It is a structure in which the antenna coil 21 has to be wound around the upper margin 13a, and therefore, the metallic taste due to the margin is reduced by half, and the bonding strength between the core sheet and the upper coated paper is also due to the antenna coil at the margin. It was lowered, and above all, there was not enough consideration for the bonding between the metal thin film and the core sheet and the coated paper, so it was only an idea, and it was not actually mass produced.

For reference, even in the first prior art, by recognizing the above problem, printing with ink mixed with metal powder around the upper and lower coated papers 11 and 14 is performed, and the border of the color corresponding to the metal thin film 12 When the printed layers (11b) (14b) are formed, the antenna coil (21) fixed around the core sheet (13) is prevented from being exposed to the outside through the upper and lower coated papers (11, 14). ) To keep the appearance beautifully, but again, in order to allow the antenna coil 21 to communicate with the reader, the metal powder content should be 30% or less, so the actual metal The card's elegant texture and durability can never be followed.

On the other hand, as an additional type of such a metal card, Korean Patent No. 0516106 (a credit card with a gold foil layer formed thereon and a method of manufacturing the same) in which the size of the gold leaf is the same as the size of the card is disclosed. It can also be seen from the first prior art that the flux generated by the antenna on the core generates an induction flux in the opposite direction by the gold foil, and eventually the RF function cannot be actually exhibited by the flux cancellation.

On the other hand, Republic of Korea Patent Publication No. 2013-0006358 (metal card and its manufacturing method) forms an actual metal layer without forming a transparent plastic coating layer on the outermost side, but maximizes the visual effect on the appearance by an anodizing technique. Insulation is performed by anodizing a stepped etching region accommodating an IC chip, but this is a technology related to a contact card accommodating a contact IC chip.

And, even that, there is a problem that static electricity is generated between the metal part of the card and the terminal due to the use of a metal card in the terminal many times, thereby causing an error due to the use of the card, and anodizing the etched region When performing, there is a problem in that the anodizing treatment is inevitably made thin at the corners of the etched region, so that insulation from the metal card sheet material may not be good due to the attachment of the contact IC chip.

In addition, in order to solve the problem of the third prior art, the present inventor has also applied for Korean Patent Application No. 2015-0157255 (metal card and its manufacturing method), and the contents of the invention are also taken into account in this specification. (However, the content of the previous application is not a technology disclosed at the time of the filing date, and thus is not cited as a known technology for the present invention).

Above all, in the case of the prior art including the first prior art and the prior art of the present inventor, when fabricated as a metal card forming a metal layer on the entire size of the card, it can exhibit a contactless card function such as RF or NFC function. There was a fatal drawback of not being there.

On the other hand, as a second prior art, Japanese Patent Laid-Open No. 2006-270681 (portable device) is a portable device capable of suppressing fluctuations in communication characteristics between the antenna module and reader/writer when they are closely opposed to each other. As shown in FIG. 2, a metal layer 30 is formed on the incident side of the electromagnetic wave radiated from the reader/writer, rather than the communication surface CS of the antenna module 10 built into the terminal body 22. By providing, a technology for securing a communication state in which a communication magnetic field is guided to the antenna coil 15 of the antenna module 10 in this metal layer 30 is disclosed. In this case, the metal layer 30 is attached to predetermined positions inside and outside the terminal to be made of copper foil or the like. Accordingly, when the reader/writer and the terminal main body 22 are in close proximity, there is an advantage in that communication defects due to the mutual positional relationship can be suppressed.

That is, FIG. 2 is a diagram showing a state of close communication between the portable information terminal 21 of the second prior art and a reader/writer. In FIG. 2, some of the electromagnetic waves emitted from the transmitting/receiving antenna 26 of the reader/writer are affected by a metal object such as the battery pack 25 in the terminal body 22, and attenuating action due to reflection, absorption, etc. Receive. Since the metal layer 30 is disposed on the incidence side of the electromagnetic wave than the communication surface CS of the antenna module 10, an induced current (eddy current) is generated due to the application of an external magnetic field to the surface of the metal layer 30. The generated magnetic field H1 generates an induced current in the antenna coil 15 of the antenna module 10.

In the second prior art, by placing the metal layer 30 close to the antenna module 10 to cover a part of the antenna coil 15, the reader/writer through the magnetic field component H1 generated in the metal layer 30 The transmission/reception antenna 26 and the antenna coil 15 of the antenna module 10 are inductively coupled.

Thus, the second prior art antenna device shown in FIG. 2 attempts to solve a problem in which the communication characteristics greatly fluctuate according to the size of the positional difference between the centers of the antennas when the distance to the antenna of the communication counterpart is very close. will be.

However, the magnetic flux to be linked with the antenna coil 15 of the antenna module 10 on the side of the portable information terminal 21 and the transmit/receive antenna 26 on the reader/writer side is a metal object such as the battery pack 25 inside the case. In order to eliminate the blockage with the metal layer 30 for inducing magnetic flux, it cannot be said that a great effect can be obtained depending on the positional relationship of obstacles such as the battery pack 25. In addition, there is a limitation in that the metal layer 30 does not effectively act to increase the communication distance in a state where the antenna device and the communication counterpart antenna are separated.

On the other hand, in order to solve such a problem of the second prior art, a technology such as Japanese Patent No. 4947217 (antenna device and mobile phone) is disclosed as a third prior art.

The third prior art is an antenna device installed inside or outside the mobile phone case 1 that enables stable communication even though it is relatively smaller than the antenna of the communication counterpart, and allows the maximum communication distance to be increased. As 101, as shown in Fig. 3A, a conductor having a loop-shaped or helical coil conductor and a conductor opening CA having the center of the winding as a coil opening, and a slit portion SL connecting the conductor opening and the outer edge thereof. A layer (2) is provided, and when the coil conductor is viewed in a plan view, the coil opening and the conductor opening are overlapped, and the area of the conductor layer is larger than the area of the forming area of the coil conductor, and when viewed in a plan view, the The distance from the outside of the conductor opening to the outer edge of the coil conductor is greater than the distance from the inner edge of the conductor opening to the inner edge of the coil conductor, and the slit portion is disposed close to the end portion so as to face the end of the case, and , The conductor layer is connected between the outer edges of the conductor layer closest to the outside of the conductor opening, and the conductor layer is formed of a metal film or metal foil or metal formed on an inner or outer surface of the case.

Thus, according to the third prior art, current flows in the conductor layer so as to block the magnetic field generated by the flow of current in the coil conductor, and the current flowing around the opening of the conductor layer passes around the slit portion, Due to the effect, current flows around the conductor layer, and accordingly, a magnetic field is generated in the conductor layer, thereby increasing the communication distance. In addition, since the conductor layer rotates the magnetic flux largely, the maximum distance at which the magnetic flux arrives from the antenna device to the communication counterpart's antenna or from the communication counterpart's antenna to the antenna device and the communication counterpart antenna increases.

However, as shown in FIG. 3B, a conductor opening CA and a slit 2S are formed in the planar conductor 2 of the third prior art, and the coil opening of the coil-shaped conductor 31 is a conductor opening. It is arranged so as to overlap with (CA), and when a current indicated by a solid arrow flows through the coil-shaped conductor 31, a current indicated by a broken arrow is induced in the planar conductor 2, areas A1, A2, A3. , In A4, the direction of the current flowing through the coil-shaped conductor 31 and the current flowing through the planar conductor 2 coincide, but in region B, the current flowing through the coil-shaped conductor 31 and the plane-shaped conductor 2 Since the direction of the current is opposite, there is a problem in that the inductance of the antenna (coil) decreases and communication characteristics are deteriorated by the existence of a region in which the direction of the current is opposite. In addition, since the amount of induced current is changed due to the difference in distance between the coil-shaped conductor 31 and the planar conductor 2 or the distance between the coil-shaped conductor 31 and the planar conductor 2 when attached, There is a problem that the inductance value is easily different.

In order to solve the problem of the third prior art above, as a fourth prior art, Korean Patent No. 1470341 (antenna device and wireless communication device) solves the problem of deterioration and deviation of the inductance of the antenna device seen in the power supply circuit. In order to provide an antenna device, as shown in Fig. 4, a power supply coil 3 and a planar conductor 2 are provided.

At this time, the power supply coil 3 includes a magnetic core 32 and a coil-shaped conductor 31 wound around the magnetic core 32. The coil-shaped conductor 31 may be a conductor (winding conductor) wound around the magnetic core 32, a stack formed by stacking a plurality of dielectric layers, a stack formed by stacking a plurality of magnetic layers, or one or more A conductor pattern formed on a laminate formed by laminating a dielectric layer and one or a plurality of magnetic layers may be used. In particular, since it is possible to construct a power supply coil that can be surface mounted in a small size, a coil-shaped conductor 31 in a stacked body formed by stacking a plurality of magnetic layers (eg, ferrite ceramic layers) in an in-plane conductor pattern and an interlayer conductor pattern. It is preferable that it is a chip-shaped power supply coil comprising ).

The power supply coil 3 is connected to an RFIC 13 which is a power supply circuit. That is, one end and the other end of the coil-shaped conductor 31 are connected to two input/output terminals of the RFIC 13, respectively. The RFIC 13 is an RFIC chip for NFC, and a semiconductor IC chip that processes a high frequency signal for NFC.

The planar conductor 2 has a larger area than the power supply coil 3. That is, when viewed from the normal direction of the planar conductor 2, the outer dimension of the planar conductor is larger than that of the power supply coil. The planar conductor 2 is formed with a slit 2S extending inward from a part of the outer edge. In the fourth prior art, the slit 2S has a certain width from one end to the other end, but the width is not necessarily constant.

In the fourth prior art, the planar conductor 2 is a metal housing part (metal cover part) of the communication terminal housing, and in the state shown in Fig. 4, on the lower surface of the planar conductor 2, that is, the inside of the communication terminal housing. The power supply coil 3 is arranged in the. The power supply coil 3 is arranged in a different direction in the winding axis direction of the coil-shaped conductor 31 from the normal direction of the planar conductor 2. More specifically, it is arranged so that the winding axis of the coil-shaped conductor 31 may be parallel to the planar conductor 2.

Further, the power supply coil 3 is arranged so that the coil opening of the power supply coil 3 faces toward the slit 2S while the coil opening is close to the slit 2S. That is, the power supply coil 3 is arranged so that the magnetic flux passing through the slit 2S of the planar conductor 2 can pass through the coil opening, in other words, the coil opening is visible from the slit 2S.

The planar conductor 2 is not limited to the metal housing portion, but may be a conductor film formed on the insulating substrate or a conductor layer formed on the insulating substrate. That is, the planar conductor 2 may be various metal plates such as a ground conductor mounted on a communication terminal, a metal chassis or shield case, and a metal cover of a battery pack, or may be a flat pattern made of a metal thin film provided on a flexible sheet. In the case where the planar conductor 2 is a metal thin film pattern provided on a flexible sheet, it may be attached to the inside of the back cover of the communication terminal through an adhesive or the like. In addition, the planar conductor 2 may be a conductor having a surface that expands in a planar shape, and does not necessarily have to be a flat surface (it may be a curved surface).

* As shown in Fig. 4, the RFIC 14 is connected to the antenna coil 4 on the communication partner side of the fourth prior art. As the planar conductor 2 approaches the antenna coil 4 of the communication partner, an induced current is generated in the planar conductor 2, and this current mainly affects the edge of the planar conductor 2 according to the edge effect. Flows along That is, a current (overcurrent) flows in a direction that prevents the passage of the magnetic flux generated by the antenna coil 4. The magnetic flux Φ 1 in FIG. 1 represents the magnetic flux passing through the antenna coil 4.

The slit 2S is also a part of the edge, and the current density of the portion along the edge of the slit 2S increases. And, as the gap of the slit 2S is narrower, the magnetic field strength in the vicinity of the slit 2S increases. The magnetic flux Φ2 in FIG. 4 represents the magnetic flux passing through the slit 2S. Part of the magnetic flux Φ2 is linked to the power supply coil 3. In addition, a magnetic field is generated due to a current flowing along the outer peripheral edge end of the planar conductor 2, but the power supply coil 3 is sufficiently separated from the outer peripheral edge end of the planar conductor 2, so mainly slits 2S It strongly couples with nearby magnetic fields. (The coupling is not canceled by coupling with the magnetic field near the edge of the outer circumference.)

In this way, the planar conductor 2 acts as a magnetic field trapping element (radiation plate), and the power supply coil 3 is magnetically coupled to the communication counterpart antenna coil 4 via the planar conductor 2. In addition, since the coil opening surface of the coil-shaped conductor constituting the power supply coil does not face the planar conductor, and only a part of the coil-shaped conductor is close to the planar conductor, in other words, when viewed from the winding axis direction of the coil-shaped conductor. , Since the coil-shaped conductor has a portion that is close to and far from the planar conductor, even if the relative positional relationship between the feed coil 3 and the planar conductor 2 changes slightly, the inductance value of the feed coil 3 is Doesn't change much. Therefore, it is possible to realize an antenna device having a small manufacturing variation.

The coil opening of the power supply coil 3 may be arranged so as to face the slit 2S, but as shown in Fig. 4, the coil winding shaft of the power supply coil 3 extends in the direction of the slit 2S (extension). Direction), the coupling efficiency with the magnetic flux Φ2 generated in the slit 2S is maximized.

Indeed, according to the fourth prior art, it can be said that an effective device for an antenna device having a metal layer is provided.

However, nevertheless, the fourth prior art provides a solution in a communication device having a relatively large size such as a portable terminal, and is not applicable when the thickness is not as small as 1mm like a conventional credit card. It is difficult.

Registered Utility Model No. 0382725 (Metal thin film plastic card) Japanese Patent Publication No. 2006-270681 (Portable Device) Japanese Patent No. 4947217 (antenna device and mobile phone) Korean Patent No. 1470341 (antenna device and wireless communication device)

The present invention is to solve the above problems, and the object is for VVIP customers, which are the highest level of customers, because the card body is metal, so it is not easily bent and has a beautiful appearance, but using ferrite, such as RF or NFC functions. It relates to a method for manufacturing a metal card and an inlay having a non-contact card function.

The above objects and other additional objects will be clearly recognized by those skilled in the art without departing from the spirit of the present invention by the appended claims.

A method for manufacturing an inlay for a non-contact metal card using ferrite according to an aspect of the present invention for achieving the above object is a mini-combi PCB 20a having the necessary elements mounted on the PCB substrate 21 of the mini-combi PCB 20a. Step of preparing (S1); Performing the primary pre-lamination using a filler 27 such as PVC (S7); And cutting to the required size (S11), forming a ferrite on the rim side of the four sides to complete the mini-combi inlay. It characterized in that it comprises a.

A method of manufacturing a non-contact metal card using ferrite according to another aspect of the present invention for achieving the above object, insert the inlay 20 into the insertion hole of the metal card body 10 prepared in advance (S31), and the card size Performing a third lamination with a hot melt tape on the upper and lower layers of the metal card body (S33); Temporarily bonding the first and second printing layers 30 and 30 ′ and the first and second printing protection layers 40 and 40 ′ and performing final lamination (S43); And connecting the combination chip 50 (S55). It characterized in that it comprises a.

Additionally, according to the present invention, a non-contact metal card using ferrite and an inlay for a metal card are provided by the above method.

According to the non-contact metal card using ferrite according to the present invention, a non-contact metal card such as RF or NFC function is possible while having a beautiful appearance without being bent easily because the entire surface is metal.

In addition, according to the inlay for a non-contact metal card using ferrite according to the present invention, at least one side is metal, so it is not easily bent and has a beautiful appearance, while providing a stable manufacturing method of a non-contact metal card such as RF or NFC function.

On the other hand, additional features and advantages of the present invention will be more clarified through the following description.

1 is an exploded perspective view of a metal thin film plastic card of the first prior art.
2 is a cross-sectional view showing a state of close communication between a portable information terminal and a reader/writer of the second prior art.
3A is a mobile phone having an antenna device according to the third prior art, wherein (A) is a rear surface of the mobile phone, and (B) is an inner plan view of a rear lower case.
3B is a plan view of an antenna device according to a third prior art.
4 is a perspective view of an antenna device and an antenna coil of a communication counterpart according to a fourth prior art.
5 is a cross-sectional view of a non-contact metal card according to a first embodiment of the present invention.
6 is a plan view of the non-contact metal card in a separated state according to the first embodiment of the present invention.
7 is a cross-sectional view of a mini-combi PCB used in the non-contact metal card according to the first embodiment of the present invention.
8 is a plan view and a bottom view of a mini-combi PCB used in the non-contact metal card according to the first embodiment of the present invention.
9 is a cross-sectional view of a mini-combi inlay used in a non-contact metal card according to the first embodiment of the present invention.
10 is a plan view and a bottom view of a mini-combi inlay used in a non-contact metal card according to a first embodiment of the present invention.
Fig. 11 is a cross-sectional view of a mini-combi inlay used in the non-contact metal card according to the first embodiment of the present invention after 3rd lamination.
12 is a plan view and a bottom view of a mini-combi inlay used in the non-contact metal card according to the first embodiment of the present invention after the third lamination.
13 is a flowchart of a manufacturing process of a non-contact metal card according to the first embodiment of the present invention.
14 is a plan view of a mini-combi PCB used in a non-contact metal card according to the first embodiment of the present invention.
15 is a bottom photograph of a mini-combi PCB used in a non-contact metal card according to the first embodiment of the present invention.
Fig. 16 is a plan photograph of a mini-combi inlay used in a non-contact metal card according to the first embodiment of the present invention.
Fig. 17 is a plan view of a state in which a combination chip is connected to a terminal of a mini-combi inlay of a non-contact metal card according to a first embodiment of the present invention.
18 is a temperature and pressure condition of the first pre-lamination in the manufacturing process of the first embodiment of the present invention.
19 is a temperature and pressure condition of the secondary pre-lamination in the manufacturing process of the first embodiment of the present invention.
20 is a temperature and pressure condition of the third pre-lamination in the manufacturing process of the first embodiment of the present invention.
21 is a temperature and pressure condition of the fourth final lamination in the manufacturing process of the first embodiment of the present invention.

Hereinafter, a method of manufacturing an inlay for a non-contact metal card and a method of manufacturing a card using ferrite according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In this specification, the embodiments and embodiments described below should be considered as illustrative and not restrictive, and the present invention is not limited to the details given herein, but substitutions and equivalent other implementations within the scope and equivalents of the appended claims. It can be changed to yes.

(Example 1)

First, an inlay for a non-contact metal card and a method of manufacturing the same according to a first embodiment of the present invention will be described with reference to FIGS. 5 to 21.

5 is a cross-sectional view of a non-contact metal card according to a first embodiment of the present invention, and FIG. 6 is a plan view showing a separated state of the non-contact metal card according to the first embodiment of the present invention.

7 is a cross-sectional view of a mini-combi PCB used for a non-contact metal card according to a first embodiment of the present invention, and FIG. 8 is a plan view and a bottom view of a mini-combi PCB used for the non-contact metal card according to the first embodiment of the present invention. 9 is a cross-sectional view of a mini-combi inlay used for a non-contact metal card according to a first embodiment of the present invention, and FIG. 10 is a cross-sectional view of a mini-combi inlay used for a non-contact metal card according to the first embodiment of the present invention. A plan view and a bottom view, and FIG. 11 is a cross-sectional view of a mini-combi inlay used in the non-contact metal card according to the first embodiment of the present invention after the third lamination, and FIG. 12 is a non-contact metal card according to the first embodiment of the present invention. It is a top view and a bottom view after the 3rd lamination of the mini combination inlay used in

13 is a flowchart of a manufacturing process of a contactless metal card according to the first embodiment of the present invention.

14 is a plan view of a mini-combi PCB used for a non-contact metal card according to a first embodiment of the present invention, and FIG. 15 is a bottom photograph of a mini-combi PCB used for a non-contact metal card according to the first embodiment of the present invention. And FIG. 16 is a plan view of a mini-combi inlay used in a non-contact metal card according to a first embodiment of the present invention, and FIG. 17 is a terminal image of a mini-combi inlay of a non-contact metal card according to the first embodiment of the present invention. This is a plan view of the combination chip connected to.

FIG. 18 is a temperature and pressure condition of a first pre-lamination in the manufacturing process of the first embodiment of the present invention, FIG. 19 is a temperature and pressure condition of a secondary pre-lamination in the manufacturing process of the first embodiment of the present invention, and FIG. 20 Is the temperature and pressure conditions of the third pre-lamination in the manufacturing process of the first embodiment of the present invention, and FIG. 21 is the temperature and pressure conditions of the fourth final lamination in the manufacturing process of the first embodiment of the present invention.

In the non-contact metal card using ferrite according to the first embodiment of the present invention, as shown in FIGS. 5 and 6, printed layers 30 and 30 ′ of PVC are added to the upper and lower portions of the metal card body 10. It is made by forming the print protection layers 40 and 40 ′ on the upper and lower portions of the printing layers 30 and 30 ′ again, and the printing layer is not necessarily limited to PVC and has properties similar to other synthetic resin layers or even synthetic resins. It may be a layer of another non-conductive material. In addition, a synthetic resin layer such as the printing layer may be directly heat-compressed and laminated to the metal card body, or may be laminated between them through a separate adhesive.

Meanwhile, in the metal card body 10, as shown in FIGS. 5 and 6, a through hole into which the mini-combi inlay 20 can be inserted is perforated on one side, and the outer periphery of the through hole is' As shown as'inlay border virtual line', of course, the'inlay border virtual line' is not visible after the final card is produced.

For reference, the thickness of each part varies depending on the situation, but for example, when the total thickness of the card is 0.81±0.05mm, the thickness of the metal card body 10 is 0.45 to 0.52mm, and the printing layer 30 ,30') is 0.10 to 0.15mm, respectively, and the print protective layers 40 and 40' are suitable if they are 0.04 to 0.08.

Now, the mini-combi inlay 20, which is the core of the present invention, will be described in detail with reference to FIGS. 7 to 10.

First, as shown in FIGS. 7 and 8, a mini-combi PCB 20a should be prepared (for example, an F-PCB having a size of 14×24×0.08mm made of PET), and on one side of the PCB board 21 (In Fig. 7 on the upper side) a Combi IC Chip contact terminal 23, and on the other side of the PCB board 21 (on the lower side in Fig. 7) an etched pattern antenna 22 and a capacitor terminal 24 is formed, and a resonant frequency matching capacitor 25 (for example, RF 13.56Mhz) is electrically coupled to the capacitor terminal 24. For example, the resonant frequency matching capacitor 25 is a MLCC (Multi Layer Ceramic Condenser: L multilayer ceramic capacitor).

Figure 8 (a) is a front view of the mini-combi PCB (20a) in which the combination chip contact terminal 23 is formed on the front (top side in Figure 7), Figure 8 (b) is the antenna 22 and the rear surface It is a rear view (lower side in FIG. 7) of the mini-combi PCB 20a to which the condenser 25 is attached after the condenser terminal 21 is formed.

Now, as shown in Figs. 9 and 10, on the upper and lower sides of the mini-combi PCB 20a, a filler 27 of PVC or glue (epoxy, UV liquid, etc.) is filled, and it is filled with a suitable size (example After cutting into a size of 11×20×0.47mm), ferrite (26: see FIG. 9) is formed on the rim side of each side again, and the top and bottom sides are again finished with a PVC layer 27'. However, the PVC layer 27 ′ is not necessarily required, and is formed only according to a process necessity, and may be omitted depending on the process, or may be integrally made of the same material as the filler 27. For example, the width of the ferrite 26 is 1 ~ 5mm, preferably about 2 ~ 4mm, but is not necessarily limited to this, the PVC layer 27' is also preferably about 0.02mm thick, but must be It is not limited thereto. As a result, as shown in FIGS. 9 and 10, as an example, a mini-combi inlay 20 having a size of 14 × 24 × 0.51 mm is obtained, and is characterized in that it is finished with ferrite on all sides.

Fig. 10(a) is a front view (upper side of Fig. 9) of the mini-combi inlay 20 with ferrite 26 attached to the rim, and Fig. 10(b) shows the ferrite 26 in all directions. This is the rear view (lower side in Fig. 9) of the completed mini-combi inlay 20 in a state in which the PVC layer 27' is formed again after being attached to the rim, as shown in Fig. 10(a), the mini-combi PCB In the gap between (20a) and the ferrite 26, the filler 27 or the PVC 27' is pushed in the laminating process to fill the gap.

Now, the completed mini-combi inlay 20 is mounted in the mounting hole of the metal card body (MCB) 10. First, preliminarily, as shown in FIGS. 11 and 12, the metal card body (MCB) After inserting the mini-combi inlay 20 into the mounting hole of) (10), pre-lamination is performed in a state where the card-sized hot melt film (HMF) 15 is loaded on the upper and lower layers.

Figure 12 (a) is a state in which the first hot melt film 15 is formed on the front side (upper side in Fig. 11) again after inserting the mini combi inlay 20 into the mounting hole of the metal card body (MCB) 10 It is a front view, and (b) of FIG. 2 is a second hot melt film 15' inserted in the mini-combi inlay 20 into the mounting hole of the metal card body (MCB) 10 and back (lower side in FIG. 11). ) Is the rear view of the formed state (lower side in FIG. 11).

A photograph of the actual mini-combi PCB 20a is shown in Figs. 14 to 16, and Fig. 14 is a photograph of the front of the combination chip contact terminal 23 formed on the front surface (upper side of Fig. 7) of the mini-combi PCB 20a. , FIG. 15 is a picture of the rear side of the mini-combi PCB 20a (lower side of FIG. 7), and FIG. 16 is a ferrite on the front side (upper side of FIG. 9) of the mini-combi PCB 20a This is the front photograph of the completed mini-combi inlay (20) formed up to (26).

Now, referring to FIG. 13, a method of manufacturing an inlay for a non-contact metal card and a method of manufacturing a card using ferrite according to the present invention will be described in detail.

First, on the PCB board 21 of the mini-combi PCB 20a of FIGS. 7 and 8 (for example, a size of 14 × 24 × 0.08 mm of PET material), a mini-combi PCB having the necessary elements 23 and 24 mounted thereon ( 20a) is prepared (S1).

Thereafter, the RF antenna tuning of the L, R, and C resonance frequencies is performed (S2), and a capacitor (MLCC) is attached in the SMT (Surface Mounting Technology) process (S3).

In some cases, a combination chip terminal 23 (for example, a TIN of 0.06mm thickness) is made using a mask process (S5).

Thereafter, primary pre-lamination is performed at low temperature (see FIG. 18) using a filler 27 such as PVC as shown in FIG. 9 (S7).

Thereafter, it is cut by punching to the required size (for example, 11×20×0.47mm size) using a mold (S11),

Now, a ferrite (26: see FIG. 9) is formed on the rim side of all four sides. More specifically, a hole corresponding to the cut inlay of an appropriate size is kneeled in the ferrite substrate (not shown), and the cut inlay is Then, the second pre-lamination is performed with PVC on the top and bottom (for example, 0.02 mm thick) (S13). The secondary pre-lamination conditions are the same as in FIG. 19. Therefore, according to the second pre-lamination process, the PVC layers 27' are formed on the upper and lower sides. However, as described above, the PVC layer 27' is not necessarily required.

Again, after punching and cutting to an appropriate size (for example, 14×24mm size) (S21), the primary resonance frequencies (L, R, C values) are inspected (S23).

Thereafter, insert the cut inlay 20 into the insertion hole of the metal card body 10 prepared in advance (for example, slightly larger than 14×24×0.51mm) (S31), and the upper and lower layers of the card sized metal card body Third lamination is performed with the halmelt films 15 and 15' of the hot melt tape (S33). The third pre-lamination conditions are the same as in FIG. 20.

Again, the second resonance frequency (L, R, C values) is checked (S41), and the first and second printed layers 30 and 30' and the first and second printed protective layers 40 and 40' are After bonding, final lamination is performed (S43). The fourth final lamination conditions are the same as in FIG. 21.

Thereafter, a pocket for a combination chip is formed using an end milling device (S51), and the combination chip 50 and the combination chip terminal 23 of the PCB are connected (S55). A partial enlarged photograph of the final finished product is shown in FIG. 17. In some cases, if the length of the antenna on the lower side is not appropriate, a partial antenna may be formed on the upper side as well.

Thereafter, it undergoes a final inspection (RF test, total appearance inspection, etc.) (S55), and is packaged and delivered (S57).

In the above, the present invention has been described according to an embodiment of the present invention, but changes and modifications within the scope not departing from the technical spirit of the present invention by those of ordinary skill in the art belong to the present invention. Of course.

10: Metal card body (MCB)
15,15': first, second hot melt film (HMF)
20: Mini Combi Inlay
20a: Mini Combi PCB 21: PCB board
22: antenna 23: combination chip contact terminal
24: capacitor terminal 25: capacitor
26: ferrite 27: filler
27': PVC layer
30,30': first and second printed layers
40,40': first and second print protective layers
50: Combi chip

Claims (4)

Preparing a mini-combi PCB (20a) on which the necessary elements are mounted on the PCB board (21) of the mini-combi PCB (20a) (S1);
Performing primary pre-lamination using a filler 27 such as PVC (S7); And
Cutting to the required size (S11), forming a ferrite on the sides of the rim to complete the mini-combi inlay;
Method for producing a non-contact metal card inlay using ferrite, characterized in that it comprises a. Insert the inlay (20) of claim 1 into the insertion hole of the metal card body (10) prepared in advance (S31), and use the melt film (15, 15') of hot melt tape on the upper and lower layers of the card size metal card body. Performing a third lamena line (S33);
Temporarily bonding the first and second printing layers 30 and 30 ′ and the first and second printing protection layers 40 and 40 ′ and performing final lamination (S43); And
Connecting with the combi chip 50 (S55);
Method of manufacturing a non-contact metal card using ferrite, characterized in that it comprises a. Inlay for a non-contact metal card using ferrite, characterized in that manufactured according to claim 1. A non-contact metal card using ferrite, characterized in that manufactured according to claim 2.

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